WO2015076147A1 - ステップアンドリピート方式のインプリント技術を用いた構造体の製造方法 - Google Patents
ステップアンドリピート方式のインプリント技術を用いた構造体の製造方法 Download PDFInfo
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- WO2015076147A1 WO2015076147A1 PCT/JP2014/079804 JP2014079804W WO2015076147A1 WO 2015076147 A1 WO2015076147 A1 WO 2015076147A1 JP 2014079804 W JP2014079804 W JP 2014079804W WO 2015076147 A1 WO2015076147 A1 WO 2015076147A1
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- WIPO (PCT)
- Prior art keywords
- resin layer
- mold
- meth
- mass
- curing
- Prior art date
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- KHMYONNPZWOTKW-UHFFFAOYSA-N pent-1-enylbenzene Chemical compound CCCC=CC1=CC=CC=C1 KHMYONNPZWOTKW-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
- B29K2033/04—Polymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0002—Condition, form or state of moulded material or of the material to be shaped monomers or prepolymers
Definitions
- the present invention relates to a method of manufacturing a structure using a step-and-repeat type imprint technique.
- the imprint technique is a fine processing technique in which a mold having a fine pattern is pressed against a resin layer such as a liquid resin on a substrate, thereby transferring the pattern of the mold to the resin layer.
- the fine pattern exists from a nanoscale of 10 nm level to a size of about 100 ⁇ m, and is used in various fields such as semiconductor materials, optical materials, storage media, micromachines, biotechnology, and the environment.
- a mold having a nano-order fine pattern on the surface is very expensive because it takes time to form the pattern. For this reason, it is difficult to increase the size (increase in area) of a mold having a nano-order fine pattern on the surface.
- Patent Document 1 imprinting using a small mold is performed repeatedly while shifting the position of the mold so that the processing regions do not overlap (step-and-repeat method).
- the process of curing the resin layer where the mold is pressed in a state where a small mold having a fine pattern is pressed against a large-area resin layer is performed while changing the position of the mold.
- a fine pattern having a large area is obtained. Since a good fine pattern cannot be obtained when the resin layer in the region where the mold is not pressed is cured, in Patent Document 1, the resin layer in the region where the mold is not pressed is increased by increasing the oxygen concentration in the atmosphere. Curing is suppressed.
- Patent Document 1 the inventor presses a mold against a part of a resin layer made of a photocurable resin composition containing a photoinitiator, and the resin layer in the area around the mold is shielded with a light shielding mask. It tried to prevent hardening of the resin layer of the area
- the present inventor tried to suppress the curing erosion in the mask by reducing the irradiation amount of the curing light or reducing the addition amount of the photoinitiator.
- hardening erosion in the mask was suppressed, but instead, the resin layer at the part where the mold was pressed against the fine pattern became insufficiently cured, and the fine pattern transferred to the resin layer.
- a new problem has arisen in that the shape stability of the material deteriorates.
- the present invention has been made in view of such circumstances, and is a structure capable of suppressing hardening erosion in a mask while minimizing the influence on the shape stability of a fine pattern transferred to a resin layer.
- the manufacturing method of this is provided.
- a photopolymerizable monomer and a resin comprising a photocurable resin composition for imprints each containing 0.1 part by mass or more of a photoinitiator and a polymerization inhibitor with respect to 100 parts by mass of the monomer.
- a to repeat step method for producing a structure is provided.
- the present inventor tried to add a relatively large amount of a polymerization inhibitor to the photocurable resin composition constituting the resin layer as another means for suppressing curing erosion in the mask. In addition to the suppression of erosion, the inventors have found a phenomenon that the shape stability of the fine pattern is hardly lowered or not at all, and the present invention has been completed.
- a width of a portion of the resin layer covered with the light shielding mask is cured is 200 ⁇ m or less from an end of the light shielding mask.
- the light shielding mask is disposed on the transparent base material side to cover the laminate, and the curing light is applied to the resin layer from the transparent base material side.
- the content of the polymerization inhibitor in the photocurable resin composition is 20 parts by mass or less with respect to 100 parts by mass of the monomer.
- the mass of the polymerization inhibitor is 0.01 to 0.5 times the mass of the photoinitiator.
- the manufacturing method of the structure of 1st Embodiment of this invention is a method using the imprint technique of a step and repeat system, and is provided with a laminated body formation process, a coating process, a hardening process, and a repetition process. .
- a laminated body formation process a coating process, a hardening process, and a repetition process.
- Laminate Forming Step As shown in FIG. 1, the photopolymerizable monomer and the photoinitiator and the polymerization inhibitor are each 0.1 parts by mass or more with respect to 100 parts by mass of the monomer.
- the transparent substrate 7 is formed of a transparent material such as a resin substrate or a quartz substrate, and the material is not particularly limited, but is preferably a resin substrate. This is because by using the resin base material, a structure having a desired size (also capable of a large area) can be obtained by the imprinting method of the present invention.
- the resin constituting the resin base material include one selected from the group consisting of polyethylene terephthalate, polycarbonate, polyester, polyolefin, polyimide, polysulfone, polyethersulfone, cyclic polyolefin, and polyethylene naphthalate.
- the transparent base material 7 preferably has an appropriate flexibility. When a resin base material is used, the thickness of the resin base material is preferably in the range of 25 to 500 ⁇ m.
- the imprinting photocurable resin composition constituting the resin layer 9 contains 0.1 parts by mass or more of a photoinitiator and a polymerization inhibitor with respect to 100 parts by mass of the monomer and the monomer. It has the property of being cured by irradiation with energy rays that can cure the resin, such as light, visible light, and electron beam.
- (A) Monomer examples include photopolymerizable monomers for forming (meth) acrylic resins, styrene resins, olefin resins, polycarbonate resins, polyester resins, epoxy resins, silicone resins, and the like.
- (Meth) acrylic monomers are preferred.
- (meth) acryl means methacryl and / or acryl
- (meth) acrylate means methacrylate and / or acrylate.
- photopolymerizable (meth) acrylic monomer examples include polyfunctional (meth) acrylic acid esters, monofunctional (meth) acrylic acid esters, and functional group-containing monomers.
- polyfunctional (meth) acrylic acid ester used in the present invention ethylene oxide-modified trimethylolpropane tri (meth) acrylate, ethylene oxide-modified bisphenol A di (meth) acrylate, tripropylene glycol di (meth) acrylate, 1 , 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, ( Poly) propylene glycol di (meth) acrylate, neopentylglycol di (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, Trimethylolpropane di (meth) acrylate
- a monofunctional (meth) acrylic acid ester can be used together with the polyfunctional (meth) acrylic acid ester as described above.
- monofunctional (meth) acrylates that can be used here include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, n- Straighteners such as pentyl (meth) acrylate, n-hexyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate and stearyl (meth) acrylate (Meth) acrylate having a chain alkyl group; (Meth) acrylic acid having a branched alkyl group such as iso-propyl (meth) acrylate,
- Examples of the functional group-containing monomer include a hydroxyl group-containing monomer, an acid group-containing monomer, an amino group-containing monomer, an amide group-containing monomer, and a cyano group-containing monomer.
- Examples of the hydroxyl group-containing monomer are (meth) acrylic acid-2-hydroxyethyl, (meth) acrylic acid-2-hydroxypropyl, (meth) acrylic acid-4-hydroxybutyl, (meth) acrylic acid and polypropylene.
- Examples thereof include hydroxyl group-containing compounds such as hydroxyl group-containing (meth) acrylic monomers such as adducts of monoesters and lactones with glycol or polyethylene glycol and (meth) acrylic acid-2-hydroxyethyl.
- acid group-containing monomers examples include carboxyl group-containing (meth) acrylic monomers such as (meth) acrylic acid, acid anhydride group-containing (meth) acrylic monomers, phosphate group-containing (meth) acrylic monomers Mention may be made of monomers and sulfate group-containing (meth) acrylic monomers.
- amino group-containing monomers or amide group-containing monomers include amino group-containing (meth) acrylic monomers such as N, N-dimethylaminoethyl (meth) acrylate, (meth) acrylamide, and N-methyl (meth).
- amino group-containing (meth) acrylic monomers such as N, N-dimethylaminoethyl (meth) acrylate, (meth) acrylamide, and N-methyl (meth).
- examples include amide group-containing (meth) acrylic monomers such as acrylamide, N-ethyl (meth) acrylamide, N-propyl (meth) acrylamide, and N-hexyl (meth) acrylamide.
- examples of the cyano group-containing monomer include cyano (meth) acrylate.
- examples of the (meth) acrylic monomer in addition to the (meth) acrylic monomer as described above, other (meth) acrylic monomers copolymerizable with the (meth) acrylic monomer as described below. Monomer.
- Examples of other copolymerizable (meth) acrylic monomers include glycidyl (meth) acrylate, epoxy group-containing (meth) acrylates such as 4-hydroxybutyl (meth) acrylate glycidyl ether, alkoxy (meth) Mention may be made of acrylates and allyl (meth) acrylates.
- the polyfunctional (meth) acrylic acid ester is preferably 50 to 100 parts by weight, more preferably 70 to 100 parts by weight
- the monofunctional (meth) acrylic acid ester is Preferably 0 to 30 parts by weight, more preferably 0 to 20 parts by weight
- the functional group-containing monomer is preferably 0 to 30 parts by weight, more preferably 0 to 10 parts by weight.
- the acrylic monomer is preferably 0 to 30 parts by mass, more preferably 0 to 10 parts by mass.
- acrylic monomers monomers of ethylene oxide-modified trimethylolpropane triacrylate, ethylene oxide-modified bisphenol A diacrylate, and tripropylene glycol diacrylate are preferable.
- the photocurable resin composition for imprints of the present invention may contain other photopolymerizable monomers in addition to the (meth) acrylic monomer as long as the characteristics of the present invention are not impaired.
- photopolymerizable monomers include styrene monomers and vinyl monomers.
- styrene monomer examples include alkyl styrene such as styrene, methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, triethyl styrene, propyl styrene, butyl styrene, hexyl styrene, heptyl styrene and octyl styrene; Mention may be made of halogenated styrenes such as styrene, chlorostyrene, bromostyrene, dibromostyrene and iodostyrene; nitrostyrene, acetylstyrene and methoxystyrene.
- alkyl styrene such as styrene, methyl sty
- vinyl monomers include: vinyl pyridine, vinyl pyrrolidone, vinyl carbazole, divinyl benzene, vinyl acetate and acrylonitrile; conjugated diene monomers such as butadiene, isoprene and chloroprene; vinyl halides such as vinyl chloride and vinyl bromide; vinylidene chloride And vinylidene halides such as
- Photoinitiator is a component added in order to accelerate
- the upper limit of content of a photoinitiator is not prescribed
- the content of the photoinitiator is, for example, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, with respect to 100 parts by mass of the monomer. 15 and 20 parts by mass, and may be in a range between any two of the numerical values exemplified here.
- the kind of photoinitiator is not specifically limited, It is preferable to use combining an alkylphenone photoinitiator (B1) and an acyl phosphine oxide photoinitiator (B2).
- the polymerization rate becomes moderately low, and the resin and master mold that are polymerized and shrunk Since the unpolymerized resin composition enters and polymerizes between the two, the shrinkage of the cured structure obtained by photocuring the composition of the present invention can be reduced, and the resin polymerized later on the surface In order to sufficiently form a crosslinked structure, it is considered that the hardness is higher than that of the previously polymerized resin, and the surface hardness can be increased.
- the usage-amount of the both photoinitiators in the photocurable resin composition for imprints is the said alkylphenone series photoinitiator with respect to 100 mass parts of monomers in the photocurable resin composition for imprints.
- (B1) is preferably 0.1 to 15 parts by mass, more preferably 0.5 to 10 parts by mass
- the acylphosphine oxide photoinitiator (B2) is preferably 0.1 to 15 parts by mass, More preferably, 0.5 to 10 parts by mass are used.
- the weight ratio (B1: B2) of the alkylphenone photoinitiator (B1) to the acylphosphine oxide photoinitiator (B2) is 1:99 to 90:10, and 5:95 to 80:20 is preferable, 10:90 to 70:30 is more preferable, and 10:90 to 40:60 is most preferable.
- alkylphenone photoinitiator (B1) and the acylphosphine oxide photoinitiator (B2) are used in the above weight ratio, a relatively hard polymer can be formed at a moderately low polymerization rate, Yellowing of the resulting polymer can be suppressed.
- the alkylphenone photoinitiator is preferably a compound containing no nitrogen, such as 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2- Methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-propan-1-one and 2-hydroxy-1- ⁇ [4 More preferably, it is at least one selected from the group consisting of-(2-hydroxy-2-methyl-propionyl) -benzyl] phenyl ⁇ -2-methyl-propan-1-one, and 1-hydroxy-cyclohexyl-phenyl -Ketones are most preferred.
- alkylphenone photoinitiators examples include IRGACURE651, IRGACURE184, IRGACURE2959, IRGACURE127, IRGACURE907, IRGACURE369 (all manufactured by BASF), and IRGACURE1173 (manufactured by Ciba Japan Co., Ltd.).
- the acylphosphine oxide photoinitiator is at least one selected from the group consisting of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
- the seed is preferred, and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide is most preferred.
- acylphosphine oxide photoinitiators examples include LUCIRIN TPO and IRGACURE 819 (both manufactured by BASF).
- a polymerization inhibitor is a component added in order to suppress polymerization of a monomer, and is added in order to suppress hardening erosion in a mask.
- the polymerization inhibitor is contained in an amount of 0.1 part by mass or more with respect to 100 parts by mass of the monomer.
- the upper limit of content of a polymerization inhibitor is not prescribed
- the content of the photoinitiator is, for example, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, with respect to 100 parts by mass of the monomer. 15 and 20 parts by mass, and may be in a range between any two of the numerical values exemplified here.
- the mass ratio of the polymerization inhibitor / photoinitiator is 0.01 to 0.5 is preferable.
- This mass ratio is 0.01, 0.02, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, and between any two of the numerical values exemplified here It may be within the range.
- the type of the polymerization inhibitor is not particularly limited. Specifically, for example, phenothiazine, benzoquinone, hydroquinone, naphthoquinone, p-methoxyphenol, hydroquinone monomethyl ether, t-butylhydroquinone, t-butylcatechol, N-methyl- In addition to N-nitrosoaniline, N-phenylnaphthylamine, 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, Wako Jun Examples include Q-1300 and Q-1301 manufactured by Yakuhin Kogyo Co., Ltd., and Kinopower QS-W10 and Kinopower QS-30 manufactured by Kawasaki Kasei Kogyo Co., Ltd. Of these, benzoquinone or 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl is preferred.
- the photocurable resin composition for imprinting of the present invention is a photocurable resin composition for imprinting, such as a solvent, a chain transfer agent, an antioxidant, a photosensitizer, a filler, and a leveling agent. You may contain in the range which does not affect the property of a resin composition.
- the photocurable resin composition for imprinting of the present invention can be produced by mixing the above components by a known method.
- the resin layer 9 is formed by applying the photocurable resin composition for imprinting of the present invention to the transparent substrate 7 by a method such as spin coating, spray coating, bar coating, dip coating, die coating, or slit coating. Thereby, the laminated body 11 provided with the resin layer 9 on the transparent base material 7 is obtained.
- the mold 2 has a fine pattern 2a.
- a cured resin layer 10 having an inverted pattern 10a of the fine pattern 2a is obtained.
- the mold 2 is formed of a light-impermeable material such as metal (nickel) and irradiates the resin layer 9 with the curing light P from the transparent substrate 7 side. May be formed of a transparent material.
- the mold 2 made of a transparent material can be formed, for example, by forming a transparent resin layer on a transparent substrate and forming a fine pattern 2a on the transparent resin layer.
- the curing light P may be irradiated from the resin layer 9 side, and the curing light P may be irradiated to the resin layer 9 through the mold 2.
- the light shielding mask 5 is also arranged on the resin layer 9 side.
- the shape of the fine pattern 2a is not particularly limited, but is usually an uneven pattern that repeats at a constant cycle, with a cycle of 10 nm to 2 mm, a depth of 10 nm to 500 ⁇ m, and a transfer surface of 1.0 to 1.0 ⁇ 10.
- Those having a diameter of 6 mm 2 are preferable, those having a period of 20 nm to 20 ⁇ m, a depth of 50 nm to 1 ⁇ m, and a transfer surface of 1.0 to 0.25 ⁇ 10 6 mm 2 are more preferable.
- a sufficient fine pattern 2a can be transferred to the resin layer 9.
- Specific examples of the unevenness include moth eye, line, cylinder, monolith, cone, polygonal pyramid, and microlens.
- the surface of the fine pattern 2a may be subjected to a peeling treatment for preventing adhesion with the resin layer 9, and the peeling treatment may form a peeling layer (not shown).
- the release agent for forming the release layer (not shown) is preferably a group consisting of a fluorine-based silane coupling agent, a perfluoro compound having an amino group or a carboxyl group, and a perfluoroether compound having an amino group or a carboxyl group. More preferably selected from the group consisting of a fluorine-based silane coupling agent, a single-terminal aminated perfluoro (perfluoroether) compound and a single-terminal carboxylated perfluoro (perfluoroether) compound.
- the adhesion to the mold 2 is good and the releasability from the resin to be imprinted is good.
- the thickness of the release layer (not shown) is preferably in the range of 0.5 to 20 nm, more preferably 0.5 to 10 nm, and most preferably 0.5 to 5 nm.
- the transparent resin layer 6 may be added with an additive having a group capable of binding to a release agent as disclosed in WO2012 / 018045. Good.
- the light shielding mask 5 is made of a light shielding material, and is fixed to the laminated body 11 by being attached to the transparent base material 7 side of the laminated body 11, for example.
- the light shielding mask 5 is seen in plan view (when viewed from the direction of arrow V in FIG. 2), so that the end portion of the light shielding mask 5 substantially coincides with the end portion of the mold 2. 5 is arranged so as not to overlap the mold 2. For this reason, as for the resin layer 9, the whole area
- FIG. 6 the light shielding mask 5 may be arranged so that the light shielding mask 5 partially overlaps the mold 2 in plan view. In this case, a part of the resin layer 9 in the area where the mold 2 is pressed (the part not covered with the light shielding mask 5) becomes the exposed area E.
- the curing light P is a general term for energy rays that can cure the resin, such as UV light, visible light, and electron beam.
- the curing light P may be irradiated with an integrated light amount sufficient to sufficiently cure a portion of the resin layer 9 in the exposed region E.
- the integrated light amount is, for example, 100 to 10000 mJ / cm 2 , specifically, for example, , 100, 150, 200, 250, 300, 350, 400, 450, 500, 1000, 1500, 2000, 2500, 3000, 4000, 5000, 10000 mJ / cm 2 , and any two of the numerical values exemplified here It may be within the range between.
- the repeating step includes a repeating step of moving the mold 2 to the uncured portion 9a of the resin layer 9 and repeating the covering step and the curing step one or more times.
- the mold 2 in contact with the cured resin layer 10 is separated from the cured resin layer 10, and the mold 2 is moved to the uncured portion 9a of the resin layer 9, and shown in FIG. In this way, the mold 2 is pressed against the uncured portion 9a.
- the light shielding mask 5 is arranged so that at least a part of the region of the resin layer 9 where the mold 2 is pressed becomes the exposed region E, and in this state, the resin layer 9 Irradiation with curing light P forms a cured resin layer 10 having a reversal pattern 10a.
- the mold 2 crushes the resin layer 9 in the portion of the erosion width A.
- the erosion width A is very small, the resin layer 9 in that portion is easily crushed. Therefore, in the manufacture of the structure by the step-and-repeat method, Little or no adverse effect.
- the mold 2 may be pressed against the uncured portion 9a of the resin layer 9 so as to avoid the resin layer 9 in the portion of the erosion width A.
- the cured resin layer 10 is covered with the light shielding mask 5 to prevent the curing light P from being excessively irradiated after the resin layer 9 is cured.
- the cured resin layer 10 is not necessarily the light shielding mask 5. There is no need to cover.
- FIG. 5 shows a state where the light shielding mask 5 and the mold 2 are removed after the curing step shown in FIG. From this state, by using an organic solvent such as isopropyl alcohol to wash away the uncured portion 9a of the resin layer 9, a structure in which the cured resin layer 10 having the reversal pattern 10a is formed on the transparent substrate 7 is obtained. It is done.
- an organic solvent such as isopropyl alcohol
- This structure is used for applications such as imprint molds, antireflection films, diffusion films, and cell culture sheets.
- the pattern formed on the surface of the structure is preferably a nano- or micro-concave structure with various shapes according to the application.
- the structure surface The pattern formed in the shape of moth eye is preferably used, and for the diffusion film application, the pattern formed on the surface of the structure is preferably in the shape of a microlens array.
- Second Embodiment A second embodiment of the present invention will be described with reference to FIGS.
- the structure manufacturing method of this embodiment is similar to that of the first embodiment.
- the light shielding mask 5 is arranged so as to partially overlap the mold 2 in plan view. Since this is a feature, the following description will be focused on this point.
- the entire area of the resin layer 9 where the mold 2 is pressed is the exposed area E, but in this embodiment, the mold pressing area Only a part is the exposed region E. Therefore, even if the curing region P is irradiated to the exposed region E as shown in FIG. 6, a part of the mold pressing region (in this embodiment, the mold shown in FIGS. 6 to 7 is used). 2 right end portion) remains uncured.
- the mold 2 is moved next, as shown in FIG. 8, the mold 2 is moved so that there is no gap between the exposed areas E before and after the mold 2 is moved, and the light-shielding mask 5 is disposed.
- the uncured portion 9 a is not left between the adjacent cured resin layers 10.
- the ends of the adjacent exposed areas E coincide with each other, but the adjacent exposed areas E may partially overlap.
- a resin layer is formed by applying the photocurable resin composition blended in the parts by mass on a transparent substrate made of PET (polyethylene terephthalate) with a thickness of 10 ⁇ m in a range of 120 mm ⁇ 120 mm, and this resin layer On the other hand, the fine pattern of the master mold was pressed. Next, a light shielding mask for shielding UV light was attached to the transparent substrate side so as to overlap with a width of 10 mm in plan view from the end of each side of the master mold. As a result, in plan view, the end of the master mold was covered with a light shielding mask with a width of 10 mm, and an exposed area of 80 mm ⁇ 80 mm was formed in the center.
- PET polyethylene terephthalate
- UV light is irradiated with the integrated light amount shown in Table 1 with a UV irradiation apparatus (Technovision, model: UVC-408), the resin is cured, and then the PET / cured resin laminate is laminated.
- the body was released from the master mold to obtain a sample.
- the uncured portion of the resin layer around the exposed area was washed away with isopropyl alcohol.
- the sample thus obtained is hereinafter referred to as “structure”.
- the obtained structure was observed with an optical microscope, and the erosion width from the edge of the light shielding mask was measured. Moreover, the moth-eye pattern was observed with an electron microscope, and the shape stability was evaluated according to the following criteria.
- OH-TEMPO 4-hydroxy-2,2,6,6-tetramethylpiperidinyl-1-oxyl
- PBQ p-benzoquinone
- IRGACURE184 1-hydroxy-cyclohexyl phenyl ketone (manufactured by BASF)
- IRGACURE819 bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (manufactured by BASF)
- Comparative Example 5 when an attempt was made to reduce the erosion width by reducing the photoinitiator instead of adding the polymerization inhibitor, the erosion width was slightly improved, but the resin was not sufficiently cured. The shape collapsed.
- Examples 1 to 4 using a photocurable resin composition containing 0.1 parts by mass or more of a photoinitiator and a polymerization inhibitor with respect to 100 parts by mass of the monomer shape stability is adversely affected. Without this, the erosion width could be made sufficiently small.
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Abstract
Description
好ましくは、前記硬化工程において、前記樹脂層のうち前記遮光マスクで覆われた部分が硬化される幅は、前記遮光マスクの端から200μm以下である。 好ましくは、前記遮光マスクは、前記透明基材側に配置されて前記積層体を被覆し、前記硬化光は、前記透明基材側から前記樹脂層に対して照射される。 好ましくは、前記光硬化性樹脂組成物中の前記重合禁止剤の含有量は、前記モノマー100質量部に対して20質量部以下である。 好ましくは、前記重合禁止剤の質量は、前記光開始剤の質量に対して0.01~0.5倍である。
本発明の第1実施形態の構造体の製造方法は、ステップアンドリピート方式のインプリント技術を用いた方法であり、積層体形成工程、被覆工程、硬化工程、及び繰り返し工程を備える。
以下、図1~図5を用いて、各工程について詳細に説明する。
この工程では、図1に示すように、光重合性のモノマーと、前記モノマー100質量部に対して光開始剤及び重合禁止剤をそれぞれ0.1質量部以上含有するインプリント用光硬化性樹脂組成物からなる樹脂層9を透明基材7上に備える積層体11を形成する。
透明基材7は、樹脂基材、石英基材などの透明材料で形成され、その材質は、特に限定されないが、樹脂基材であることが好ましい。樹脂基材を用いることによって、本発明のインプリント方法によって所望するサイズの(大面積も可能な)構造体が得られるからである。樹脂基材を構成する樹脂としては、例えば、ポリエチレンテレフタレート、ポリカーボネート、ポリエステル、ポリオレフィン、ポリイミド、ポリサルフォン、ポリエーテルサルフォン、環状ポリオレフィンおよびポリエチレンナフタレートからなる群から選ばれる1種からなるものである。また、透明基材7は適度な柔軟性を有することが好ましく、樹脂基材を用いる場合には、樹脂基材の厚さは25~500μmの範囲であることが好ましい。
樹脂層9を構成するインプリント用光硬化性樹脂組成物は、モノマーと、前記モノマー100質量部に対して光開始剤及び重合禁止剤をそれぞれ0.1質量部以上含有し、硬化光(UV光、可視光、電子線などの、樹脂を硬化可能なエネルギー線の総称)の照射によって硬化する性質を有する。
モノマーとしては、(メタ)アクリル樹脂、スチレン樹脂、オレフィン樹脂、ポリカーボネート樹脂、ポリエステル樹脂、エポキシ樹脂、シリコーン樹脂等を形成するための光重合性のモノマーが挙げられ、光重合性の(メタ)アクリル系モノマーが好ましい。なお、本明細書において、(メタ)アクリルとは、メタクリルおよび/またはアクリルを意味し、(メタ)アクリレートはメタクリレートおよび/またはアクリレートを意味する。
iso-プロピル(メタ)アクリレート、iso-ブチル(メタ)アクリレート、tert-ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレートおよびイソオクチル(メタ)アクリレートなどの分岐状アルキル基を有する(メタ)アクリル酸アルキルエステル;
イソボルニル(メタ)アクリレートおよびシクロへキシル(メタ)アクリレートなどの環状アルキル基を有する(メタ)アクリル酸アルキルエステル;
ベンジル(メタ)アクリレートおよびフェノキシエチル(メタ)アクリレートなどの芳香環基を有する(メタ)アクリル酸エステルなどを挙げることができる。
ここで水酸基含有モノマーの例としては、(メタ)アクリル酸-2-ヒドロキシエチル、(メタ)アクリル酸-2-ヒドロキシプロピル、(メタ)アクリル酸-4-ヒドロキシブチル、(メタ)アクリル酸とポリプロピレングリコールまたはポリエチレングリコールとのモノエステルおよびラクトン類と(メタ)アクリル酸-2-ヒドロキシエチルとの付加物のようなヒドロキシル基含有(メタ)アクリル系モノマーなどの水酸基含有化合物を挙げることができる。
さらに、(メタ)アクリル系モノマーとしては、上記のような(メタ)アクリル系モノマーの他に、以下に記載するような上記(メタ)アクリル系モノマーと共重合可能な他の(メタ)アクリル系モノマーが挙げられる。
光開始剤は、モノマーの重合を促進するために添加される成分であり、前記モノマー100質量部に対して0.1質量部以上含有される。光開始剤の含有量の上限は、特に規定されないが、例えば前記モノマー100質量部に対して20質量部である。光開始剤の含有量は、具体的には例えば、前記モノマー100質量部に対して0.1、0.5、1、2、3、4、5、6、7、8、9、10、15、20質量部であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。光開始剤の種類は特に限定されないがアルキルフェノン系光開始剤(B1)およびアシルフォスフィンオキサイド系光開始剤(B2)を組み合わせて用いることが好ましい。
また、前記アルキルフェノン系光開始剤(B1)と前記アシルフォスフィンオキサイド系光開始剤(B2)との重量比(B1:B2)は、1:99~90:10であり、5:95~80:20が好ましく、10:90~70:30がより好ましく、10:90~40:60が最も好ましい。
重合禁止剤は、モノマーの重合を抑制するために添加される成分であり、マスク内硬化侵食の抑制のために添加される。重合禁止剤は、前記モノマー100質量部に対して0.1質量部以上含有される。重合禁止剤の含有量の上限は、特に規定されないが、例えば前記モノマー100質量部に対して20質量部である。光開始剤の含有量は、具体的には例えば、前記モノマー100質量部に対して0.1、0.5、1、2、3、4、5、6、7、8、9、10、15、20質量部であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。また、光開始剤の含有量に比べて重合禁止剤の含有量が多すぎると、モノマーの重合が開始されないか又は不十分となる場合があるので、重合禁止剤/光開始剤の質量比は、0.01~0.5であることが好ましい。この質量比は、0.01、0.02、0.05、0.1、0.2、0.3、0.4、0.5であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
本発明のインプリント用光硬化性樹脂組成物は、溶剤、連鎖移動剤、酸化防止剤、光増感剤、充填剤、レベリング剤等の成分をインプリント用光硬化性樹脂組成物の性質に影響を与えない範囲で含んでいてもよい。
この工程では、図2に示すように、樹脂層9よりも面積が小さく且つ微細パターン2aを有するモールド2の前記微細パターン2aを樹脂層9に押し当てると共に樹脂層9のうち前記モールド2が押し当てられている領域の少なくとも一部が露出領域Eとなるように前記積層体11を遮光マスク5で被覆する。
モールド2は、微細パターン2aを有しており、この微細パターン2aを樹脂層9に押し当てた状態で樹脂層9を硬化させることによって、微細パターン2aの反転パターン10aを有する硬化樹脂層10を形成する。
遮光マスク5は、遮光性材料からなり、例えば積層体11の透明基材7側に貼り付けることによって積層体11に固定する。本実施形態では、遮光マスク5は、平面視において(図2の矢印V方向から見たときに)、遮光マスク5の端部がモールド2の端部と略一致して、平面視において遮光マスク5がモールド2に重ならないように配置されている。このため、樹脂層9は、モールド2が押し当てられている領域の全体が露出領域Eとなっている。なお、遮光マスク5は、図6に示すように、平面視において、遮光マスク5がモールド2に部分的に重なるように配置してもよい。この場合、樹脂層9は、モールド2が押し当てられている領域のうち一部(遮光マスク5で覆われていない部分)が露出領域Eとなる。
硬化工程では、図2に示すように、樹脂層9に対して硬化光Pを照射することによって、樹脂層9のうち露出領域Eにある部分を硬化させる。これによって、モールド2の微細パターン2aが転写された状態で樹脂層9が硬化されて、図3~図4に示すように、微細パターン2aの反転パターン10aを有する硬化樹脂層10が形成される。
繰り返し工程では、モールド2を樹脂層9の未硬化部分9aに移動させて前記被覆工程と前記硬化工程を1回以上繰り返す繰り返し工程とを備える。
図6~図8を用いて、本発明の第2実施形態について説明する。本実施形態の構造体の製造方法は、第1実施形態と類似しているが、図6に示すように、平面視において、遮光マスク5がモールド2に部分的に重なるように配置されている点を特徴としているので、以下、この点を中心に説明を進める。
まず、ニッケル製のマスターモールド(100mm×100mmの正方形)の微細パターン(形状高さ339nm、周期350nmモスアイパターン)をフッ素系離型剤(ダイキン工業社製、オプツール HD-2100)で剥離処理を施した。
次に、トリプロピレングリコールジアクリレート75質量部、メチルメタクリレート20質量部、及びグリシジルメタクリレート5質量部からなるモノマー(合計100質量部)に対して表1に示す重合禁止剤及び光開始剤を表1に示す質量部で配合した光硬化性樹脂組成物を厚さ10μmでPET(ポリエチレンテレフタレート)からなる透明基材上に120mm×120mmの範囲で塗布することによって樹脂層を形成し、この樹脂層に対して、上記マスターモールドの微細パターンを押し付けた。
次に、UV光を遮蔽する遮光マスクを、上記マスターモールドの各辺の端から平面視で10mmの幅で重なるように、透明基材側に貼り付けた。これによって、平面視で、マスターモールドの端部が10mmの幅で遮光マスクによって覆われ、中央に80mm×80mmの露出領域が形成された。
次に、その後、UV照射装置(テクノビジョン社製、型式:UVC-408)にて表1に示す積算光量でUV光を照射し、樹脂を硬化させた後、PET/硬化させた樹脂の積層体をマスターモールドより離型して試料を得た。露出領域の周囲にある、樹脂層の未硬化部分は、イソプロピルアルコールを用いて洗い流した。このようにして得られた試料は、以下「構造体」という。
○:形状倒れが観察された
×:形状倒れが観察されなかった
表1中の略号の意味は、以下の通りである。
OH-TEMPO:4-ヒドロキシ-2,2,6,6-テトラメチルピペリジニル-1-オキシル
PBQ:p-ベンゾキノン
IRGACURE184:1-ヒドロキシ-シクロヘキシルフェニルケトン(BASF社製)
IRGACURE819:ビス(2,4,6-トリメチルベンゾイル)フェニルフォスフィンオキサイド(BASF社製)
比較例1に示すように、重合禁止剤を含有していない光硬化性樹脂組成物を用いた場合、構造体に形成される反転パターンの形状安定性は良好であったが、侵食幅が1600μmという非常に大きなものであった。
この状態を改善するために、比較例2~3では、モノマー100質量部に対して重合禁止剤を0.05質量部を添加したところ、侵食幅はいくらか減少したものの十分に小さくはならなかった。
また、比較例4では、重合禁止剤を添加する代わりにUV積算光量を減らすことによって、侵食幅を減少させることを試みたところ、侵食幅は若干改善されたものの、樹脂の硬化が不十分となって形状倒れが発生してしまった。
また、比較例5では、重合禁止剤を添加する代わりに光開始剤を減らすことによって、侵食幅を減少させることを試みたところ、侵食幅は若干改善されたものの、樹脂の硬化が不十分となって形状倒れが発生してしまった。
一方、モノマー100質量部に対して光開始剤と重合禁止剤をそれぞれ0.1質量部以上含有させた光硬化性樹脂組成物を用いて実施例1~4では、形状安定性に悪影響を与えることなく、侵食幅を十分に小さくすることができた。
Claims (5)
- 光重合性のモノマーと、前記モノマー100質量部に対して光開始剤及び重合禁止剤をそれぞれ0.1質量部以上含有するインプリント用光硬化性樹脂組成物からなる樹脂層を透明基材上に備える積層体を形成する積層体形成工程と、
前記樹脂層よりも面積が小さく且つ微細パターンを有するモールドの前記微細パターンを前記樹脂層に押し当てると共に前記樹脂層のうち前記モールドが押し当てられている領域の少なくとも一部が露出領域となるように前記積層体を遮光マスクで被覆する被覆工程と、
前記樹脂層に対して硬化光を照射することによって前記樹脂層のうち前記露出領域にある部分を硬化させる硬化工程と、
前記モールドを前記樹脂層の未硬化部分に移動させて前記被覆工程と前記硬化工程を1回以上繰り返す繰り返し工程とを備える、構造体の製造方法。 - 前記硬化工程において、前記樹脂層のうち前記遮光マスクで覆われた部分が硬化される幅は、前記遮光マスクの端から200μm以下である、請求項1に記載の構造体の製造方法。
- 前記遮光マスクは、前記透明基材側に配置されて前記積層体を被覆し、
前記硬化光は、前記透明基材側から前記樹脂層に対して照射される、請求項1又は請求項2に記載の構造体の製造方法。 - 前記光硬化性樹脂組成物中の前記重合禁止剤の含有量は、前記モノマー100質量部に対して20質量部以下である、請求項1~請求項3の何れか1つに記載の構造体の製造方法。
- 前記重合禁止剤の質量は、前記光開始剤の質量に対して0.01~0.5倍である、請求項1~請求項4の何れか1つに記載の構造体の製造方法。
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EP (1) | EP3073513B1 (ja) |
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CN (1) | CN105814663B (ja) |
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Cited By (3)
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WO2017078019A1 (ja) * | 2015-11-04 | 2017-05-11 | 綜研化学株式会社 | 微細構造体の製造方法 |
WO2017202096A1 (en) | 2016-05-27 | 2017-11-30 | Boe Technology Group Co., Ltd. | Method of fabricating a light extraction layer, light emitting diode display apparatus, and light emitting diode display substrate |
JP2020002231A (ja) * | 2018-06-27 | 2020-01-09 | Dic株式会社 | 光硬化性組成物及びその製造方法 |
Families Citing this family (2)
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US20210373217A1 (en) * | 2018-10-16 | 2021-12-02 | Scivax Corporation | Fine pattern forming method, imprint mold manufacturing method, imprint mold, and optical device |
CN109188863B (zh) * | 2018-11-05 | 2021-11-26 | 京东方科技集团股份有限公司 | 膜层图案化的方法 |
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JP2009023113A (ja) * | 2007-07-17 | 2009-02-05 | Dainippon Printing Co Ltd | インプリントモールド |
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- 2014-11-11 EP EP14864768.8A patent/EP3073513B1/en not_active Not-in-force
- 2014-11-11 CN CN201480062927.6A patent/CN105814663B/zh not_active Expired - Fee Related
- 2014-11-11 US US15/038,276 patent/US10203597B2/en not_active Expired - Fee Related
- 2014-11-11 WO PCT/JP2014/079804 patent/WO2015076147A1/ja active Application Filing
- 2014-11-11 DK DK14864768.8T patent/DK3073513T3/en active
- 2014-11-11 KR KR1020167015767A patent/KR101932419B1/ko active IP Right Grant
- 2014-11-11 JP JP2015549082A patent/JP6429792B2/ja not_active Expired - Fee Related
- 2014-11-18 TW TW103139855A patent/TWI644784B/zh not_active IP Right Cessation
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JP2009023113A (ja) * | 2007-07-17 | 2009-02-05 | Dainippon Printing Co Ltd | インプリントモールド |
WO2012018045A1 (ja) | 2010-08-06 | 2012-02-09 | 綜研化学株式会社 | 樹脂製モールド、その製造方法およびその使用方法 |
JP2013000944A (ja) | 2011-06-15 | 2013-01-07 | Panasonic Corp | 光学シート及びその製造方法 |
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WO2017078019A1 (ja) * | 2015-11-04 | 2017-05-11 | 綜研化学株式会社 | 微細構造体の製造方法 |
WO2017202096A1 (en) | 2016-05-27 | 2017-11-30 | Boe Technology Group Co., Ltd. | Method of fabricating a light extraction layer, light emitting diode display apparatus, and light emitting diode display substrate |
EP3465794A4 (en) * | 2016-05-27 | 2020-02-12 | BOE Technology Group Co., Ltd. | LIGHT EXTRACTION LAYER MANUFACTURING METHOD, LIGHT EMITTING DIODE DISPLAY APPARATUS, AND LIGHT EMITTING DIODE DISPLAY SUBSTRATE |
JP2020002231A (ja) * | 2018-06-27 | 2020-01-09 | Dic株式会社 | 光硬化性組成物及びその製造方法 |
JP7081337B2 (ja) | 2018-06-27 | 2022-06-07 | Dic株式会社 | 光硬化性組成物及びその製造方法 |
Also Published As
Publication number | Publication date |
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TWI644784B (zh) | 2018-12-21 |
TW201532785A (zh) | 2015-09-01 |
US10203597B2 (en) | 2019-02-12 |
CN105814663B (zh) | 2018-06-08 |
CN105814663A (zh) | 2016-07-27 |
JPWO2015076147A1 (ja) | 2017-03-16 |
KR101932419B1 (ko) | 2018-12-26 |
US20160299425A1 (en) | 2016-10-13 |
EP3073513A1 (en) | 2016-09-28 |
EP3073513B1 (en) | 2018-03-28 |
KR20160087838A (ko) | 2016-07-22 |
DK3073513T3 (en) | 2018-06-14 |
EP3073513A4 (en) | 2017-03-15 |
JP6429792B2 (ja) | 2018-11-28 |
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