WO2015074551A1 - Led module structure, and manufacturing process for led module - Google Patents

Led module structure, and manufacturing process for led module Download PDF

Info

Publication number
WO2015074551A1
WO2015074551A1 PCT/CN2014/091581 CN2014091581W WO2015074551A1 WO 2015074551 A1 WO2015074551 A1 WO 2015074551A1 CN 2014091581 W CN2014091581 W CN 2014091581W WO 2015074551 A1 WO2015074551 A1 WO 2015074551A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
led
led chip
led module
parallel
Prior art date
Application number
PCT/CN2014/091581
Other languages
French (fr)
Chinese (zh)
Inventor
何文铭
吴鼎鼎
Original Assignee
何文铭
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201320745974.3U external-priority patent/CN203596366U/en
Priority claimed from CN201320746062.8U external-priority patent/CN203596369U/en
Priority claimed from CN201310598109.5A external-priority patent/CN104659028B/en
Priority claimed from CN201320747138.9U external-priority patent/CN203617297U/en
Priority claimed from CN201320747043.7U external-priority patent/CN203596350U/en
Application filed by 何文铭 filed Critical 何文铭
Publication of WO2015074551A1 publication Critical patent/WO2015074551A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to an LED module structure in the field of LED illumination and a manufacturing process of the LED module.
  • LED has begun to popularize in the field of lighting. Its high luminous efficiency, mechanical reliability, safety spectrum and other excellent performances have enabled a large number of LED light source lamps to replace the lamps made by traditional incandescent lamps and fluorescent lamps. As a result, the demand for its products has also increased. From concentrating lamps to general lighting, including various floodlights, a variety of LED modules have emerged. The purpose is to replace traditional light sources such as incandescent lamps and fluorescent lamps. A large number of luminaire structures are used to achieve even better lighting performance.
  • the illuminating surface when a large area of the illuminant is required, a large number of LED chip particles are necessarily mounted on various forms of the substrate, such as a long strip of light, so that it has a uniform
  • the illuminating surface on the one hand, achieves a better heat dissipation effect, on the other hand, it has a suitable geometry to match the replacement luminaire.
  • one type of scheme uses the already packaged LED light source, and is fixed on the strip substrate by soldering to realize the array.
  • the LED module obtained by such a method is directly affected by the light emitting effect and the heat dissipating effect.
  • the LED light source that has been packaged and the substrate with the PCB layout, and the soldering process may cause electrical contact and poor heat dissipation due to the melting stress of the solder; another type of solution uses the chip to be directly soldered to the substrate, and likewise, the substrate is inevitably
  • a substrate with a PCB layout has a large thermal resistance and also has problems of heat dissipation and soldering.
  • the present invention provides an LED module structure and a manufacturing process of the LED modules.
  • An LED module structure comprising:
  • thermally conductive substrate having a reflective surface on an upper surface thereof
  • the LED chip is fixed on the reflective surface by an insulating layer; the LED chip has a width not greater than the reflective surface; the LED chip has an electrode facing upward;
  • a first fluorescent layer coupled to the reflective surface, and located at an outer periphery of the fixed position of the LED chip
  • a bonding wire connected between the electrodes of the LED chip and connected as a complete load path; being located above the first fluorescent layer;
  • a second phosphor layer covering all portions of the reflective surface includes the LED chip, a bonding line, and the first phosphor layer.
  • a portion of the bonding line spanning between the LED chips is suspended above the first phosphor layer.
  • the portion of the bonding wire that is bridged between the LED chips has at least one fixed point fixed to the upper surface of the first phosphor layer.
  • the substrate is a conductive material and has an electrical connection with the LED chip.
  • the substrate is a single layer.
  • the beneficial effects of the solution include: a high-efficiency LED module structure.
  • the light processing area is large, the efficiency is high, and the color consistency is good; on the other hand, the LED chip directly fixed on the substrate has a better heat dissipation path, so the temperature characteristics are good, and the high light efficiency is further maintained.
  • An LED module structure comprising:
  • a connector connected to the electrode of the LED chip to connect the LED chip to a complete load circuit
  • a fluorescent layer coupled to the upper surface of the substrate, covering the LED chip and the connecting body;
  • the upper surface of the substrate has a rounded edge with a rounded cross section.
  • the substrate is a single layer structure.
  • the connector is in the form of a bonding wire that is connected across the LED chip, and a portion between the LED chips is suspended from the upper surface.
  • the upper surface of the substrate has a long-edge edge structure that is a stamped and formed contracted edge structure.
  • the upper surface of the substrate further has a wall colloid that constrains the length of the phosphor layer at both ends in the longitudinal direction thereof, and the wall colloid penetrates the width direction of the upper surface to fit the upper surface.
  • the beneficial effects of the solution include: rapid prototyping, and the LED module has a complete illumination light output function.
  • the shape of the rounded corners allows the fluorescent layer to be restrained by the tension of the fluorescent layer in the edge of the upper surface during spraying, preventing the irregularity of the fluorescent layer due to overflow and the unevenness of the illuminating body, and is particularly suitable for the process of rapid painting.
  • the high efficiency of module molding The structure has few levels, the heat conduction path is short, high light efficiency and good heat dissipation effect can be obtained, the single package requirement of the LED chip is omitted, and the cost is saved.
  • An LED module structure comprising:
  • the substrate is a strip-shaped strip having a single-layer metal conductor at both ends thereof;
  • the LED chip is fixedly coupled to the upper surface of the substrate by an insulating glue with an electrode direction facing upward;
  • a phosphor layer coupled to the upper surface, covering the LED chip and the bonding wire;
  • the two ends of the substrate are correspondingly connected to the input end of the load circuit where the LED chip is located.
  • the portion of the bonding wire between the LED chips has a fixing segment fixed to the upper surface, and the fixing segment is fixed to the substrate by a fixing piece.
  • a portion of the bonding line between the LED chips is suspended from the upper surface.
  • the substrate body is a single-layer metal structure that communicates with one end of the load circuit where the LED chip is located.
  • the substrate has a plurality of sheets, which are connected in parallel in the width direction thereof and have a gap therebetween, and are fixed to the entire sheet by the connecting portion.
  • the beneficial effects brought by the solution include: a long strip LED module scheme which is convenient for cascading, and it is easy to realize the mechanical strength by connecting the substrates in series along the length direction by means of fusion welding (laser, bump welding, etc.). Compared with the traditional PCB board method, the connection speed is fast, and no additional consumables such as solder are needed, which saves cost.
  • the LED chip is fixed to the upper surface of the substrate by an insulating layer; the LED chips are formed in two groups to form an LED pair and arranged along the length direction of the substrate; the electrode of the LED chip faces upward;
  • the substrate electrode is fixed to the upper surface of the substrate by an insulating layer
  • the LED has a parallel portion at both ends, the bonding wire is drawn from the electrode of each LED chip of the LED pair, and then connected to the parallel portion
  • the LED pair is made into an electrically parallel parallel unit; the parallel portion and the substrate have an insulator;
  • a phosphor layer is disposed on the upper surface of the substrate to cover the LED chip, the bonding wire, the insulator and the insulating layer;
  • the parallel portion includes a transition chip
  • the insulator is an insulating glue fixedly fitted between the transition chip and the substrate.
  • the parallel portion is in the form of an intersection formed by the intersecting electrical contact of the bonding wires; the intersection is suspended on the surface of the substrate; the insulator is an insulating glue that is coupled to the surface of the substrate; The intersection is coated with a conductive paste.
  • the upper surface is a highly reflective surface.
  • the substrate is a good conductor, and the substrate electrode and the substrate are respectively connected in series at both ends of the LED string.
  • the module can be manufactured by the following process: a manufacturing process of an LED module, including:
  • each of the LED chips constitutes an LED pair, the LED pairs are arranged along the length direction of the substrate, and the electrodes of the LED chip Facing upward; the substrate electrode of the conductor material is further fixed to the upper surface of the substrate through an insulating adhesive layer;
  • step 1) or the step 2) is provided with an insulator on the surface of the substrate between the upper surface and the parallel portion.
  • an insulating paste is used as the insulator on the upper surface of the substrate, and a transition chip is pasted and bonded to the upper surface through the insulator.
  • the step 1) is sprayed with an insulating glue on the upper surface of the substrate as the insulator; the bonding line intersects between the pair of LEDs and electrically contacts to form the parallel portion.
  • the parallel portion is formed with a conductive paste after molding; and the parallel portion is in a suspended state above the upper surface and the insulator.
  • the substrate is a good conductor; in step 3), the substrate electrode and the substrate are respectively connected in series to the two ends of the LED string by the bonding wire.
  • the two LED chips of each of the pair of LEDs have an acute angle between the line and the length direction of the substrate, and the lines of each of the LED pairs are inclined in the same direction. .
  • the high reflectivity substrate ensures high light source efficiency. It omits all insulation layers and solder joints, avoids excessive thermal resistance and high cost, and avoids uneven heat conduction caused by PCB substrate soldering process/structure, and the hidden danger of high temperature damage to LED chips.
  • the process is simple, the structure is simple, and the processing speed is fast.
  • Bonding wire as the conductor of the LED chip topological connection fully utilizes the speed advantage of the wire bonding process, and also saves the metal material loss caused by these connections;
  • the parallel unit is constructed to make the whole LED string have good anti-failure performance. Even if the LED chip in any parallel unit is damaged, the whole LED string remains bright and uniform under the coverage of the phosphor layer;
  • the parallel portion is formed as an intersection formed by the mutual electrical contact of the bonding wires; the intersection is suspended on the upper surface of the substrate; the intersection is coated with a conductive paste.
  • the formation of the parallel portion is very fast, omitting the structure of the transition chip, so that the topological connection of the LED chip has the characteristics of rapid prototyping.
  • FIG. 1 is a top plan view of a first embodiment of the present invention
  • Figure 2 is a schematic cross-sectional view of the portion AA of Figure 1;
  • Figure 3 is a schematic cross-sectional view of the portion BB of Figure 1;
  • FIG. 4 is a top plan view of a second embodiment of the present invention.
  • Figure 5 is a schematic cross-sectional view of the CC portion of Figure 4.
  • Figure 6 is a schematic cross-sectional view of the portion DD of Figure 4.
  • Figure 7 is a top plan view of a third embodiment of the present invention.
  • Figure 8 is a cross-sectional view of the EE portion of Figure 7;
  • Figure 9 is a cross-sectional view of the FF portion of Figure 7.
  • Figure 10 is a top plan view of Embodiment 4 of the present invention.
  • Figure 11 is a cross-sectional view of the portion GG of Figure 10;
  • Figure 12 is a cross-sectional view of the HH portion of Figure 10;
  • Figure 13 is a partial plan view showing a fifth embodiment of the present invention.
  • Figure 14 is a cross-sectional view of the portion II of Figure 13;
  • Figure 15 is a top plan view, in full outline, of the embodiment of Figure 13.
  • Figure 16 is a plan view showing a sixth embodiment of the present invention.
  • Figure 17 is a cross-sectional view showing the portion JJ of Figure 16;
  • Figure 18 is a schematic cross-sectional view showing a portion KK of Figure 16;
  • Figure 19 is a plan view showing a seventh embodiment of the present invention.
  • Figure 20 is a cross-sectional view showing the LL portion of Figure 19;
  • Figure 21 is a schematic cross-sectional view of the SS portion of Figure 19.
  • Figure 22 is a block diagram showing the structure of a seventh embodiment of the present invention.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • a schematic diagram of a first embodiment of the present invention includes a thermally conductive substrate 10 having a reflective surface 11 on the upper surface thereof, and a plurality of LED chips 20 fixed to the reflective surface 11 via an insulating layer 21.
  • the width of the LED chip 20 is not greater than the reflective surface; and the electrode of the LED chip 20 faces upward.
  • the first phosphor layer 40 is provided on the reflective surface 11 and is located on the outer periphery of the fixed position of the LED chip 20. All the electrodes of the LED chip 20 are electrically connected through the bonding wire 30, so that all the LED chips 20 form a complete load path; the bonding wires 30 are all located above the first phosphor layer 40.
  • the first phosphor layer 40 may be a baked phosphor or a pre-processed phosphor flake.
  • a second phosphor layer 50 is covered over all of the above components, and the second phosphor layer 50 covers the light reflecting layer 11, the LED chip 20, the bonding wires 30, and the first phosphor layer 40.
  • This scheme constitutes a high-efficiency LED module structure.
  • a part of the excitation spectrum light from the LED chip such as blue light or near ultraviolet light, is directly incident on the first fluorescent layer 40 and the second fluorescent layer 50 for conversion and mixing; the other portion is reflected by the reflective surface 11 and is still incident on the first and second fluorescent colors.
  • the layer is converted and mixed, so that the light treatment area is large, the efficiency is high, and the color consistency is good; on the other hand, the LED chip 20 directly fixed on the substrate 10 has a better heat dissipation path, so the temperature characteristics are good, and further Maintained high light efficiency.
  • the bonding line 30 of the solution is used as an electrical connection part, instead of the metal trace of the PCB board, and the molding is fast, and does not affect the thermal resistance of the chip to the substrate.
  • the entire extraction electrode is realized by the substrate electrode 60 fixed on the substrate 10.
  • the portion of the bonding wire 30 that is connected between the LED chips 20 is suspended above the first fluorescent layer 40, and thus is properly separated from the substrate 10 by the first fluorescent layer 40, and has good insulation performance and simple structure.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the substrate 10 of the present embodiment is a single-layer aluminum material, and the reflective surface 11 is a polished high-reflectivity surface.
  • the LED chip 20, the first fluorescent layer 40, and the second fluorescent layer 50 are similar to the first embodiment.
  • the difference between the bonding wires 30 and the LED chips 20 respectively has a fixing point 31 fixed on the upper surface of the first fluorescent layer 40, and the fixing point fixes the floating portion of the bonding wire 30 to the first surface.
  • the substrate 10 of the present embodiment is a conductive material, it has electrical connection with the LED chip 20, which constitutes a part of the conductive path of the LED module, saves a polarity connection, and multiplexes the functions of the substrate 10.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • the structure of a strip LED module comprises an elongated substrate 10' which is a through-metal material and has good thermal and reflective effects. It has a flat upper surface 12'; an LED chip 20' is attached to the upper surface 12' with an insulating glue 21' therebetween.
  • the electrode portion of the LED chip 20' faces upward, and the connector 30' is connected to the electrodes of the respective LED chips 20'.
  • the LED chip 20' is connected as a complete load circuit in accordance with the string and parallel requirements.
  • a phosphor layer 50' is fitted over the upper surface 12' of the entire substrate 10', and the phosphor layer 50' covers the LED chip 20' and the connector 30'.
  • the long side edge cross section of the upper surface 12' of the substrate 10' is a rounded corner 11'.
  • the solution has the characteristics of rapid prototyping. Firstly, the LED chip 20' is directly mounted on the conductive and thermally conductive substrate 10' to complete its fixing and heat dissipating arrangement; then the connecting body 30' enables all the LED chips 20' to be electrically connected to form a complete The load circuit; the final fluorescent layer 50' covers the optical and spectral processing thereon, so that the LED module has a complete illumination light output function.
  • the shape of the rounded corner 11' is such that the fluorescent layer 50' is restrained in the edge of the upper surface 12' by its own tension during the spray molding, and the fluorescent layer 50' is prevented from being irregular in shape and uneven in the illuminant due to overflow, and is particularly suitable.
  • the high-efficiency process of the module is ensured in the process of rapid brushing.
  • the structure has few levels, the heat conduction path is short, high light efficiency and good heat dissipation effect can be obtained, and the single package requirement of the LED chip 20' is omitted, thereby saving cost.
  • This program also has other features:
  • the substrate 10' is a single-layer metal structure. Further, the cost and structure of the substrate 10' are further reduced, and the heat conduction effect, mechanical strength, and the like are secured.
  • the connector 30' is in the form of a bonding wire bridging the LED chip 20', and a portion between the LED chips 20' is suspended from the upper surface 12'. This structure further shortens the molding process time of the entire module because The electrical connection portion of the LED chip 20' can be quickly connected by a wire bonding device, and the overall coating process of the fluorescent layer 50' can be used to form a module in a large area in a short time, which has the advantage of mass production.
  • the long side edge structure of the upper surface 12' of the substrate 10' is a press-formed shrink-edged edge structure, that is, the stamping die of the substrate 10' is formed from top to bottom during molding,
  • the rounded corner 11' can be formed, and the shape does not need to be ground, and the shape of the upper surface 12' of the substrate 10' is contracted, and the consistency is good.
  • the upper surface 12' of the substrate 10' has a wall colloid 60' that constrains the length of the fluorescent layer 50' at both ends in the longitudinal direction, and the wall colloid 60' penetrates the width direction of the upper surface 12' to fit the
  • the upper surface in combination with the above-mentioned edges, has the effect that the entire upper surface 12' has a confinement effect on the fluorescent layer, and therefore, the uniformity of the formation of the fluorescent layer 50' is good in simultaneous mass production.
  • 10 to 12 are schematic views of Embodiment 4 of the present invention.
  • the present invention comprises a long strip-shaped, flat-type substrate 10", the ends 18" and 19" of which are in the form of a single-layer metal conductor.
  • the LED chip 20" is fixed on the substrate 10", and the LED chip 20” is insulated
  • the glue 21" is fixedly fitted to the upper surface 12" of the substrate 10" with its electrode direction facing upward.
  • the bonding wire 30 is connected between the LED chips 20" and above the upper surface 12", so that all the LED chips 20" constitute a complete load circuit (string, parallel and combinations thereof). Finally, a phosphor layer 50" is matched.
  • the upper surface 12" covers the LED chip 20" and the bonding wire 30".
  • the two ends 18", 19" of the substrate 10" are in communication with the load loop input end where the LED chip is located, that is, as the entire substrate 10" Both ends of the load formed by the LED chip 20".
  • the substrate 10" can be connected in series along its length by means of fusion welding (laser, bump welding, etc.). It forms a joint with mechanical strength, which is faster than the conventional PCB board type substrate 10′′, and does not require additional consumables such as solder, which saves cost.
  • the solution also has other features: a portion of the bonding wire 30" between the LED chips 20" is suspended from the upper surface 12", which helps the bonding wire 30" to quickly wire, and can utilize the phosphor layer 50. "As a fixed material, stabilize the hanging part of the bonding line.”
  • FIG. 13 to 15 are schematic views of Embodiment 5 of the present invention.
  • This embodiment is a multi-piece composite body. As shown in FIG. 15, a plurality of substrates 10" are connected in parallel in the width direction thereof, and have slits 14" between each other, and are fixed into a whole piece by the connecting portion 13", when a plurality of pieces are After the components on the unit are fixed, the connecting end section 13" is cut into a single body and then longitudinally connected. This shape facilitates multi-piece bonding and mass production of the LED chip 20".
  • the LED chip 20" of the present embodiment is similar to the first embodiment except that the portion of the bonding wire 30" between the LED chips 20" has a fixing portion fixed to the upper surface, and is fixed to the substrate 10 by the fixing piece 31""
  • the fixing piece 31" may be a conductor material, and the bonding wire 30" is directly fastened thereto. This structure makes the bonding wire 30" overall structure stronger.
  • the substrate 10" of the solution is a single-layer metal structure, and one end of the load circuit where the LED chip 20" is located is connected to the substrate 10"; the other end is led out through a transition chip 60".
  • the transition chip 60" is insulated from the substrate 10".
  • the structure of the substrate 10" of this form is simpler, and the mechanical strength of the longitudinal connection is higher.
  • 16 to 18 are views showing the configuration of a sixth embodiment of the present invention.
  • a mirrored substrate 10' which is made of a metal or ceramic material and which itself has a small thermal resistance.
  • a plurality of LED chips, including 21'", 22'" are fixed to the upper surface of the substrate 10'" by an insulating adhesive layer 60'"; the LED chips are formed in two groups to form an LED pair 20'", as shown in the figure.
  • the illustrated LED chips 21'" and 22'" constitute an LED pair, the LED pairs are units, arranged along the length direction of the substrate 10'", that is, from left to right in FIG. 16, and the LED chip
  • the electrodes of 21'" and 22'" face up.
  • the substrate electrode 51'" is also fixed on the upper surface of the substrate 10'" with an insulating layer 60'".
  • the bonding wire 30'" serves as a main connection for constructing the electrical topology of the LED chip, and is connected to the substrate electrode 51'" and the LED chip includes electrodes of 21'", 22'"; wherein the LED pair 20'" has parallel connections at both ends
  • the portion 40'" causes the pair of LEDs to be an electrically parallel parallel unit, for example, the LED chips 21'" and 22'" are connected in parallel with each other, and the insulator 70'" is provided between the parallel portion 40'" and the substrate 10'".
  • a phosphor layer 50'" is fitted on the upper surface of the substrate 10'", and the phosphor layer covers the LED chip, the bonding wire 30'", the insulator 70'" and the insulating layer 60'"; all the parallel cells pass
  • the parallel portion 40'" is connected in series to form an LED string; the substrate electrode 51'" and the parallel unit constitute a complete electrical circuit, that is, all the LED chips on the substrate 10'" are connected in parallel and then connected in series. Topology.
  • the LED chips 21'" and 22'" constitute an LED pair 20
  • the LED pair 20'" is arranged along the length direction of the substrate 10'", and the electrode of the LED chip faces upward; the substrate electrode 51'" of the conductor material is then fixed to the substrate by an insulating glue layer 60'" The upper surface of 10'";
  • step 2) is provided with an insulator 70'" on the surface of the substrate, the insulator 70'" being interposed between the upper surface and the parallel portion 40'".
  • the substrate 10' omits the multilayer structure and solder joints under the present configuration and process, such as a conventional PCB aluminum substrate, which avoids the excessive thermal resistance caused by the multilayer form of the aluminum substrate PCB form.
  • the cost is too high, and the uneven heat conduction caused by the PCB substrate welding process/structure is avoided, and the hidden trouble of the LED chip caused by the high temperature is avoided.
  • the fixing process of the LED chip is simple, the structure is simple, and the processing speed is fast.
  • the bonding wire is used as the conductor of the LED chip topological connection.
  • the speed advantage of the wire bonding process is fully utilized, and the metal material loss caused by these connections is also saved.
  • the parallel unit is constructed to make the whole LED The string has good resistance to failure. Even if the LED chips in any of the parallel units are damaged, the entire LED string remains bright and uniform under the coverage of the phosphor layer.
  • the parallel portion 40' includes a form of a transition chip, and the insulator 70'" is an insulating glue, and the transition chip is fixedly fitted between the substrates 10'" so that the two are closely matched.
  • the parallel portion 40' of the shape is relatively strong, so that the wire speed of the bonding wire 30 has a relatively fast guarantee.
  • the solution has a thermally conductive substrate 10'" which is made of a highly polished aluminum material having a high reflectivity and high thermal conductivity.
  • a plurality of LED chips, including 21'" and 22'", are fixed to the upper surface of the substrate 10'" by an insulating adhesive layer 60'"; the LED chips are formed in two groups to form an LED pair, such as the LED shown in the figure.
  • the chips 21'" and 22'" constitute an LED pair 20'", and the LED pair 20'" is a unit, arranged along the length direction of the substrate 10'", that is, from left to right in FIG.
  • the electrodes of the LED chips 21'" and 22'" face upward.
  • the substrate electrode 51'" is also fixed on the upper surface of the substrate 10'" with an insulating layer 60'".
  • the bonding wire 30'" serves as a main connection for constructing the electrical topology of the LED chip, and is connected to the substrate electrode 51'" and the LED chip includes electrodes of 21'", 22'"; wherein the LED pair 20'" has parallel connections at both ends
  • the portion 40'" the bonding wire 30'" is drawn from the electrodes of the LED chips in the pair of LEDs, and is connected to the parallel portion, so that the LED pair becomes an electrically parallel parallel unit, such as LED chips 21'" and 22' "In parallel with each other, the parallel portion 40'" and the substrate 10'” have an insulator 70'".
  • a phosphor layer 50'" is fitted on the upper surface of the substrate 10'", and the phosphor layer covers the LED chip, the bonding wire 30'", the insulator 70'" and the insulating layer 60'"; all the joint units pass
  • the parallel portion 40'" is connected in series to form an LED string; the substrate electrode 51'" and the parallel unit constitute a complete electrical circuit, that is, all the LED chips on the substrate 10'" are connected in parallel and then connected in series. Topology.
  • the parallel portion 40'" of the present embodiment is an intersection formed by the mutual contact of the bonding wires 30'"; the intersection is suspended on the upper surface of the substrate 10'"; the insulator 70'" is The insulating glue is matched on the surface of the substrate; the conductive paste 31'" is coated at the intersection.
  • This solution makes the formation of the parallel portion 40'" very fast, omitting the structure of the transition chip, and the topological connection of the LED chip has the characteristics of rapid prototyping.
  • the LED chip has a high reliability structure in which the LED chips are connected in series and then connected in series.
  • the angle between the line connecting the two LED chips in each LED pair and the length direction of the substrate is an acute angle, and the inclination direction of each LED pair is the same, as can be seen in Fig. 19, the structure on the one hand makes the state
  • the angle of the alignment 30'" at the intersection point tends to be a right angle, and the cross contact is relatively stable; on the other hand, the geometric arrangement of the LED chip is easy to be quickly mounted by the oscillating type placement machine, and the process speed is fast.
  • a conductive paste such as a high-quality conductive paste such as silver glue
  • the substrate 10'" of the present embodiment is a good conductor, and the substrate electrode 51 and the substrate are respectively connected in series at both ends of the LED string, so that the substrate is fully utilized as one end electrode of the entire LED topology, simplifying the electrode lead.
  • the LED chip is fixed to the upper surface of the substrate 10'" by an insulating glue layer 60'"; and the LED chips form an LED pair every two groups, for example, the LED chips 21'" and 22'" constitute an LED.
  • Pair 20'"; the LED pair 20'" is arranged along the length direction of the substrate 10'", and the electrode of the LED chip faces upward; and the substrate electrode 51'" of the conductor material is further fixed by an insulating glue layer 60'" On the upper surface of the substrate;
  • step 1) an insulating glue is sprayed on the upper surface of the substrate 10'" as an insulator 70'"; a bonding line 30'" crosses between the pair of LEDs and electrically contacts to form a parallel portion 40'";
  • the parallel portion is formed by applying a conductive paste 31'"; and the parallel portion 40'" is positioned above the upper surface and the insulator 70'" in a suspended state.
  • the bonding line 30' is pressed from the top to the bottom with a curvature smaller than the lower one, so that the lower one is forced to deform and thus has reliable electric power.
  • Contact, with the conductive adhesive 31'", rapid prototyping of the parallel portion is obtained.
  • the LED module of the invention uses the high reflectivity substrate to ensure high light source efficiency; the bonding wire is used as the conductor of the LED chip topological connection, fully utilizing the speed advantage of the wire bonding process, and also saving the connection of these connections. Metal material loss; the constructed parallel unit provides good resistance to failure for the entire LED string.
  • the topological connection of the LED chip has the characteristics of rapid prototyping, which makes the whole LED module have large light processing area, high efficiency, good color consistency and good industrial applicability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

An LED module structure, and a manufacturing process for an LED module. The LED module structure comprises a heat-conducting substrate (10), an LED chip (20), a first fluorescent layer (40), a bonding line (30), and a second fluorescent layer (20). The upper surface of the heat-conducting substrate (10) is provided with a reflective surface (11). The LED chip (20) is fixed above the reflective surface (11) by means of a first insulation layer (21), the width of the LED chip (20) is no greater than the width of the reflective surface (11), and electrodes of the LED chip (20) faces upwards. The first fluorescent layer (40) is fitted on the reflective surface (11) and is located on the periphery of the fixed position of the LED chip (20). The bonding line (30) is connected among the electrodes of the LED chip (20) so as to connect the electrodes to form a complete load channel, and the bonding line (30) is located above the first fluorescent layer (40). The second fluorescent layer (20) covers all parts on the reflective surface (11), comprising the LED chip (20), the bonding line (30) and first fluorescent layer (40). The LED module structure has a large light processing area, high efficiency and good color consistency; in another aspect, the LED chip directly fixed on the substrate has a good heat dissipation channel, and therefore, a temperature characteristic is good, thereby further maintaining the high luminous efficiency.

Description

一种LED模组结构及LED模组的制造工艺  LED module structure and manufacturing process of LED module 技术领域  Technical field
本发明涉及一种LED照明领域的LED模组结构及LED模组的制造工艺。  The invention relates to an LED module structure in the field of LED illumination and a manufacturing process of the LED module.
背景技术Background technique
LED已经开始普及于照明领域，其高发光效率、机械可靠性、安全光谱等等优良的性能使得大量LED光源的灯具开始替代传统白炽灯、荧光灯制造的灯具。因而其产品需求也不断加大，从聚光型灯具逐渐扩展到包括各种泛光照明的通用照明领域，多种LED模组也应运而生，其目的在于替代传统光源例如白炽灯、荧光灯已经大量使用的灯具结构，以获得现有甚至更优质的照明性能。LED has begun to popularize in the field of lighting. Its high luminous efficiency, mechanical reliability, safety spectrum and other excellent performances have enabled a large number of LED light source lamps to replace the lamps made by traditional incandescent lamps and fluorescent lamps. As a result, the demand for its products has also increased. From concentrating lamps to general lighting, including various floodlights, a variety of LED modules have emerged. The purpose is to replace traditional light sources such as incandescent lamps and fluorescent lamps. A large number of luminaire structures are used to achieve even better lighting performance.
考虑到LED光源的特点，当需要实现较大面积的发光体时，必然会将数量庞大的LED芯片颗粒贴装于各种形态的基板上，例如长条型的灯带，使之具有均匀的发光表面，一方面可获得较好的散热效果，另一方面要具有合适的几何结构以匹配替代灯具。Considering the characteristics of the LED light source, when a large area of the illuminant is required, a large number of LED chip particles are necessarily mounted on various forms of the substrate, such as a long strip of light, so that it has a uniform The illuminating surface, on the one hand, achieves a better heat dissipation effect, on the other hand, it has a suitable geometry to match the replacement luminaire.
现有的灯带，通常一类方案都采用已经封装好的LED光源，利用焊接的方式固定在带状基板上实现阵列，这类方式得到的LED模组其发光效果和散热效果都直接受制于已经封装好的LED光源以及具有PCB布局的基板，而且其焊接过程中会因为焊锡熔融应力的原因导致电接触、散热不良；另一类方案采用芯片直接焊接于基板上，同样地，其基板必然采用PCB布局的基板，热阻大，同样具有散热和焊接的问题。In the existing lamp strips, usually one type of scheme uses the already packaged LED light source, and is fixed on the strip substrate by soldering to realize the array. The LED module obtained by such a method is directly affected by the light emitting effect and the heat dissipating effect. The LED light source that has been packaged and the substrate with the PCB layout, and the soldering process may cause electrical contact and poor heat dissipation due to the melting stress of the solder; another type of solution uses the chip to be directly soldered to the substrate, and likewise, the substrate is inevitably A substrate with a PCB layout has a large thermal resistance and also has problems of heat dissipation and soldering.
发明内容Summary of the invention
针对现有LED模组其光学部件存在的技术问题，本发明提出一种LED模组结构及LED模组的制造工艺。In view of the technical problems existing in the optical components of the existing LED modules, the present invention provides an LED module structure and a manufacturing process of the LED modules.
本发明是通过以下技术方案之一实现：The invention is achieved by one of the following technical solutions:
一种LED模组结构，它包括：An LED module structure comprising:
一导热的基板，其上表面具有一反光面；a thermally conductive substrate having a reflective surface on an upper surface thereof;
LED芯片，通过一绝缘层固定于所述反光面之上；该LED芯片宽度不大于所述反光面；该LED芯片的电极朝上；The LED chip is fixed on the reflective surface by an insulating layer; the LED chip has a width not greater than the reflective surface; the LED chip has an electrode facing upward;
第一荧光层，配合于所述反光面，且位于所述LED芯片固定位置的外周；a first fluorescent layer, coupled to the reflective surface, and located at an outer periphery of the fixed position of the LED chip;
邦定线，连接于所述LED芯片的电极之间，将其连接为完整的负载通路；位于所述第一荧光层之上；a bonding wire connected between the electrodes of the LED chip and connected as a complete load path; being located above the first fluorescent layer;
第二荧光层，覆盖所述反光面上的所有部分包括该LED芯片、邦定线和所述第一荧光层。A second phosphor layer covering all portions of the reflective surface includes the LED chip, a bonding line, and the first phosphor layer.
一实施例之中：该邦定线跨接于所述LED芯片之间的部分悬空于所述第一荧光层上方。In one embodiment, a portion of the bonding line spanning between the LED chips is suspended above the first phosphor layer.
一实施例之中：该邦定线跨接于所述LED芯片之间的部分具有至少一个固定点固定于所述第一荧光层上表面。In one embodiment, the portion of the bonding wire that is bridged between the LED chips has at least one fixed point fixed to the upper surface of the first phosphor layer.
一实施例之中：所述基板为导电材料，与所述LED芯片具有电连接。In one embodiment, the substrate is a conductive material and has an electrical connection with the LED chip.
一实施例之中：所述基板为单层。In one embodiment, the substrate is a single layer.
本方案的有益效果有：构成了高光效的LED模组结构。其光线处理面积大，效率高，且颜色一致性好；另一方面，直接固定于基板上的LED芯片具有较好的散热通路，因此温度特性好，进一步维持了高光效。The beneficial effects of the solution include: a high-efficiency LED module structure. The light processing area is large, the efficiency is high, and the color consistency is good; on the other hand, the LED chip directly fixed on the substrate has a better heat dissipation path, so the temperature characteristics are good, and the high light efficiency is further maintained.
本发明是通过以下技术方案之二实现：The present invention is achieved by the following two technical solutions:
一种LED模组结构，包括：An LED module structure comprising:
基板，长条形，具有一平整的上表面；a substrate, elongated, having a flat upper surface;
LED芯片，固定于所述上表面；An LED chip fixed to the upper surface;
连接体，连接于所述LED芯片的电极，将该LED芯片连接为完整的负载回路；以及a connector connected to the electrode of the LED chip to connect the LED chip to a complete load circuit;
荧光层，配合于所述基板的上表面，覆盖所述LED芯片和连接体；a fluorescent layer, coupled to the upper surface of the substrate, covering the LED chip and the connecting body;
其中，所述基板的上表面其长边边缘横截面为圆角。Wherein, the upper surface of the substrate has a rounded edge with a rounded cross section.
一实施例之中：所述基板为单层结构。In one embodiment, the substrate is a single layer structure.
一实施例之中：所述连接体形态为跨接于该LED芯片的邦定线，其在所述LED芯片之间的部分悬空于所述上表面。In one embodiment, the connector is in the form of a bonding wire that is connected across the LED chip, and a portion between the LED chips is suspended from the upper surface.
一实施例之中：所述基板的上表面其长边边缘结构为冲压成型的收缩边缘结构。In one embodiment, the upper surface of the substrate has a long-edge edge structure that is a stamped and formed contracted edge structure.
一实施例之中：所述基板的上表面在其长度方向的两端位置还具有约束该荧光层长度的围墙胶体，该围墙胶体贯穿该上表面的宽度方向，配合于该上表面。In one embodiment, the upper surface of the substrate further has a wall colloid that constrains the length of the phosphor layer at both ends in the longitudinal direction thereof, and the wall colloid penetrates the width direction of the upper surface to fit the upper surface.
本方案的有益效果有：具有快速成型的特点，LED模组具有完整的照明光输出功能。圆角的形态使荧光层在喷涂成型时依靠自身张力限制在上表面的边缘内，防止荧光层因为溢出导致的形状不规则、发光体不均匀的情况，特别适合于快速涂刷的工艺，保障了模组成型的高效率。本结构层级少，导热路径短，可获得较高的光效和良好的散热效果，省略了LED芯片的单个封装要求，节省了成本。The beneficial effects of the solution include: rapid prototyping, and the LED module has a complete illumination light output function. The shape of the rounded corners allows the fluorescent layer to be restrained by the tension of the fluorescent layer in the edge of the upper surface during spraying, preventing the irregularity of the fluorescent layer due to overflow and the unevenness of the illuminating body, and is particularly suitable for the process of rapid painting. The high efficiency of module molding. The structure has few levels, the heat conduction path is short, high light efficiency and good heat dissipation effect can be obtained, the single package requirement of the LED chip is omitted, and the cost is saved.
本发明是通过以下技术方案之三实现：The invention is realized by the following three technical solutions:
一种LED模组结构，它包括：An LED module structure comprising:
基板，平板型长条状，其两端为单层金属导体；The substrate is a strip-shaped strip having a single-layer metal conductor at both ends thereof;
LED芯片，通过绝缘胶固定配合于所述基板的上表面，其电极方向朝上；The LED chip is fixedly coupled to the upper surface of the substrate by an insulating glue with an electrode direction facing upward;
邦定线，连接于所述LED芯片之间、所述上表面的上方；以及a bonding wire connected between the LED chips and above the upper surface;
荧光粉层，配合于所述上表面，覆盖所述LED芯片和绑定线；a phosphor layer, coupled to the upper surface, covering the LED chip and the bonding wire;
其中，所述基板的两端与该LED芯片所在的负载回路输入端对应连通。The two ends of the substrate are correspondingly connected to the input end of the load circuit where the LED chip is located.
一实施例之中：所述绑定线在所述LED芯片之间的部分具有固定于该上表面的固定段，该固定段通过固定片固定于基板。In one embodiment, the portion of the bonding wire between the LED chips has a fixing segment fixed to the upper surface, and the fixing segment is fixed to the substrate by a fixing piece.
一实施例之中：所述邦定线在所述LED芯片之间的部分悬空于所述上表面。In one embodiment, a portion of the bonding line between the LED chips is suspended from the upper surface.
一实施例之中：所述基板通体为单层金属结构，连通了该LED芯片所在负载回路的一端。In one embodiment, the substrate body is a single-layer metal structure that communicates with one end of the load circuit where the LED chip is located.
一实施例之中：该基板具有多片，沿其宽度方向并联，且彼此之间具有缝隙，通过连接段固接成整片。In one embodiment, the substrate has a plurality of sheets, which are connected in parallel in the width direction thereof and have a gap therebetween, and are fixed to the entire sheet by the connecting portion.
本方案带来的有益效果有：构成了便于级联的长条形LED模组方案，易于实现通过熔融焊接的方式（激光、碰焊等）将基板沿其长度方向串联起来构成具有机械强度的连接整体，较之传统PCB板方式的基板而言，其连接速度快，而且不需要焊锡等额外的耗材，节省了成本。The beneficial effects brought by the solution include: a long strip LED module scheme which is convenient for cascading, and it is easy to realize the mechanical strength by connecting the substrates in series along the length direction by means of fusion welding (laser, bump welding, etc.). Compared with the traditional PCB board method, the connection speed is fast, and no additional consumables such as solder are needed, which saves cost.
本发明是通过以下技术方案之四实现：The present invention is achieved by the following four technical solutions:
一种LED模组结构，其特征在于：它包括：An LED module structure is characterized in that it comprises:
基板；Substrate
LED芯片，通过一绝缘胶层配合固定于所述基板的上表面；该LED芯片两个一组构成一LED对，且沿该基板长度方向排列；该LED芯片的电极面向上；The LED chip is fixed to the upper surface of the substrate by an insulating layer; the LED chips are formed in two groups to form an LED pair and arranged along the length direction of the substrate; the electrode of the LED chip faces upward;
基板电极，通过一绝缘胶层配合固定于所述基板的上表面；The substrate electrode is fixed to the upper surface of the substrate by an insulating layer;
邦定线，连接于所述基板电极与所述LED芯片的电极；其中该LED对两端具有并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；该并联部与所述基板之间具有绝缘物；a bonding wire connected to the substrate electrode and the electrode of the LED chip; wherein the LED has a parallel portion at both ends, the bonding wire is drawn from the electrode of each LED chip of the LED pair, and then connected to the parallel portion The LED pair is made into an electrically parallel parallel unit; the parallel portion and the substrate have an insulator;
荧光粉层，配合于所述基板的上表面，覆盖所述LED芯片、邦定线、绝缘物和绝缘胶层；a phosphor layer is disposed on the upper surface of the substrate to cover the LED chip, the bonding wire, the insulator and the insulating layer;
其中，所有的所述并联单元通过该并联部相串联构成一LED串；所述基板电极、并联单元构成完整的电气回路。Wherein all the parallel units are connected in series through the parallel portion to form an LED string; the substrate electrode and the parallel unit constitute a complete electrical circuit.
一实施例之中：所述并联部包括一过渡芯片，所述绝缘物为固定配合于该过渡芯片与基板之间的绝缘胶。In one embodiment, the parallel portion includes a transition chip, and the insulator is an insulating glue fixedly fitted between the transition chip and the substrate.
一实施例之中：所述并联部形态为所述邦定线相互交叉电接触构成的交叉点；该交叉点悬空于所述基板表面；所述绝缘物为配合于该基板表面的绝缘胶；所述交叉点涂覆导电胶。In one embodiment, the parallel portion is in the form of an intersection formed by the intersecting electrical contact of the bonding wires; the intersection is suspended on the surface of the substrate; the insulator is an insulating glue that is coupled to the surface of the substrate; The intersection is coated with a conductive paste.
一实施例之中：所述上表面为高反射率的表面。In one embodiment: the upper surface is a highly reflective surface.
一实施例之中：所述基板为良导体，所述基板电极和该基板分别串联于该LED串的两端。In one embodiment, the substrate is a good conductor, and the substrate electrode and the substrate are respectively connected in series at both ends of the LED string.
该模组可通过如下工艺制造：一种LED模组的制造工艺，包括：The module can be manufactured by the following process: a manufacturing process of an LED module, including:
1）提供一具有良导热性能的基板；1) providing a substrate having good thermal conductivity;
2）将LED芯片通过一绝缘胶层配合固定于所述基板的上表面；且LED芯片每两个一组构成一LED对，该LED对沿该基板的长度方向排列，且该LED芯片的电极面向上；再将导体材料的基板电极通过一绝缘胶层配合固定于所述基板的上表面；2) fixing the LED chip to the upper surface of the substrate through an insulating adhesive layer; and each of the LED chips constitutes an LED pair, the LED pairs are arranged along the length direction of the substrate, and the electrodes of the LED chip Facing upward; the substrate electrode of the conductor material is further fixed to the upper surface of the substrate through an insulating adhesive layer;
3）采用打线设备将邦定线打线于基板电极与所述LED芯片的电极；每两个相邻的所述LED对之间设置一个并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；所有的所述并联单元通过该并联部相串联构成一LED串；同时使所述基板电极、并联单元构成完整的电气回路；3) using a wire bonding device to wire the bonding wire to the electrode of the substrate and the electrode of the LED chip; a parallel portion is disposed between each two adjacent pairs of the LEDs, and the bonding wire is aligned from the LED The electrodes of each LED chip are connected to the parallel portion, so that the LED pair becomes an electrically parallel parallel unit; all of the parallel units are connected in series through the parallel portion to form an LED string; and the substrate electrodes and the parallel are simultaneously The unit constitutes a complete electrical circuit;
4）在所述基板的上表面涂覆荧光粉层，该荧光粉层覆盖所述LED芯片、邦定线和绝缘胶层；4) coating a phosphor layer on the upper surface of the substrate, the phosphor layer covering the LED chip, the bonding wire and the insulating rubber layer;
其中，所述步骤1）或者步骤2）在该基板表面设置绝缘物，介于该上表面与所述并联部之间。Wherein the step 1) or the step 2) is provided with an insulator on the surface of the substrate between the upper surface and the parallel portion.
一实施例之中：在所述步骤2）之后在该基板上表面用绝缘胶作为所述绝缘物，再将一过渡芯片通过该绝缘物粘贴配合于该上表面。In one embodiment, after the step 2), an insulating paste is used as the insulator on the upper surface of the substrate, and a transition chip is pasted and bonded to the upper surface through the insulator.
一实施例之中：所述步骤1）之后即用绝缘胶喷涂于在该基板上表面作为所述绝缘物；所述邦定线在所述LED对之间交叉并电接触构成所述并联部；该并联部成型后涂覆导电胶；并且该并联部采用悬空的状态位于该上表面和绝缘物上方。In one embodiment, the step 1) is sprayed with an insulating glue on the upper surface of the substrate as the insulator; the bonding line intersects between the pair of LEDs and electrically contacts to form the parallel portion. The parallel portion is formed with a conductive paste after molding; and the parallel portion is in a suspended state above the upper surface and the insulator.
一实施例之中：所述基板为良导体；步骤3）中将所述基板电极和该基板分别用该邦定线串联于该LED串的两端。In one embodiment, the substrate is a good conductor; in step 3), the substrate electrode and the substrate are respectively connected in series to the two ends of the LED string by the bonding wire.
一实施例之中：每个所述LED对中的两个所述LED芯片其连线与所述基板的长度方向夹角为锐角，且每个所述LED对的所述连线倾斜方向一致。In one embodiment, the two LED chips of each of the pair of LEDs have an acute angle between the line and the length direction of the substrate, and the lines of each of the LED pairs are inclined in the same direction. .
本方案的有益效果有：The beneficial effects of this program are:
1.高反射率的基板保证了光源光效高。本身省略了所有的绝缘层和焊接点，避免了热阻过大和成本过高，也避免了PCB式基板焊接工艺/构造带来的导热不均、高温损坏LED芯片的隐患，其LED芯片的固定工艺简单，结构简单，加工速度快。1. The high reflectivity substrate ensures high light source efficiency. It omits all insulation layers and solder joints, avoids excessive thermal resistance and high cost, and avoids uneven heat conduction caused by PCB substrate soldering process/structure, and the hidden danger of high temperature damage to LED chips. The process is simple, the structure is simple, and the processing speed is fast.
2.邦定线作为LED芯片拓扑连接的导体，充分利用了打线工艺的速度优势，同时也节省了这些连接带来的金属材料损耗；2. Bonding wire as the conductor of the LED chip topological connection, fully utilizes the speed advantage of the wire bonding process, and also saves the metal material loss caused by these connections;
3.所构造的并联单元使整个LED串具有良好的抗失效性能，即使任何一个并联单元中的LED芯片损坏，整个LED串仍然保持发亮，而且在荧光粉层的覆盖下明暗均匀；3. The parallel unit is constructed to make the whole LED string have good anti-failure performance. Even if the LED chip in any parallel unit is damaged, the whole LED string remains bright and uniform under the coverage of the phosphor layer;
4.并联部形态为邦定线相互交叉电接触构成的交叉点；该交叉点悬空于基板上表面；交叉点涂覆导电胶。使得并联部的成型非常快速，省略了过渡芯片的结构，使LED芯片的拓扑连接具有快速成型的特点。4. The parallel portion is formed as an intersection formed by the mutual electrical contact of the bonding wires; the intersection is suspended on the upper surface of the substrate; the intersection is coated with a conductive paste. The formation of the parallel portion is very fast, omitting the structure of the transition chip, so that the topological connection of the LED chip has the characteristics of rapid prototyping.
5.实现近180°广角反射出光，芯片所发出的光不再受SMD杯状结构遮挡，极大提升出光效率。5. Achieve nearly 180° wide-angle reflection of light, the light emitted by the chip is no longer blocked by the SMD cup structure, greatly improving the light extraction efficiency.
附图说明DRAWINGS
以下结合附图实施例对本发明作进一步说明：The present invention is further described below in conjunction with the embodiments of the drawings:
图1是本发明实施例一的俯视示意图；1 is a top plan view of a first embodiment of the present invention;
图2是图1中AA部分的剖面示意图；Figure 2 is a schematic cross-sectional view of the portion AA of Figure 1;
图3是图1中BB部分的剖面示意图；Figure 3 is a schematic cross-sectional view of the portion BB of Figure 1;
图4是本发明实施例二的俯视示意图；4 is a top plan view of a second embodiment of the present invention;
图5是图4中CC部分的剖面示意图；Figure 5 is a schematic cross-sectional view of the CC portion of Figure 4;
图6是图4中DD部分的剖面示意图。Figure 6 is a schematic cross-sectional view of the portion DD of Figure 4.
图7是本发明实施例三的俯视示意图；Figure 7 is a top plan view of a third embodiment of the present invention;
图8是图7中EE部分的剖视示意图；Figure 8 is a cross-sectional view of the EE portion of Figure 7;
图9是图7中FF部分的剖视示意图。Figure 9 is a cross-sectional view of the FF portion of Figure 7.
图10是本发明实施例四的俯视示意图；Figure 10 is a top plan view of Embodiment 4 of the present invention;
图11是图10中GG部分的剖视示意图；Figure 11 is a cross-sectional view of the portion GG of Figure 10;
图12是图10中HH部分的剖视示意图；Figure 12 is a cross-sectional view of the HH portion of Figure 10;
图13是本发明实施例五的部分俯视示意图；Figure 13 is a partial plan view showing a fifth embodiment of the present invention;
图14是图13中II部分的剖视示意图；Figure 14 is a cross-sectional view of the portion II of Figure 13;
图15是图13所示实施例的完整轮廓俯视示意图。Figure 15 is a top plan view, in full outline, of the embodiment of Figure 13.
图16是本发明实施例六的俯视图；Figure 16 is a plan view showing a sixth embodiment of the present invention;
图17是图16中JJ部分的剖面示意图；Figure 17 is a cross-sectional view showing the portion JJ of Figure 16;
图18是图16中KK部分的剖面示意图；Figure 18 is a schematic cross-sectional view showing a portion KK of Figure 16;
图19是本发明实施例七的俯视图；Figure 19 is a plan view showing a seventh embodiment of the present invention;
图20是图19中LL部分的剖面示意图；Figure 20 is a cross-sectional view showing the LL portion of Figure 19;
图21是图19中SS部分的剖面示意图。Figure 21 is a schematic cross-sectional view of the SS portion of Figure 19.
图22是本发明实施例七的一结构示意图。Figure 22 is a block diagram showing the structure of a seventh embodiment of the present invention.
具体实施方式detailed description
实施例一：Embodiment 1:
如图1至图3所示，本发明实施例一的示意图，它包括一导热的基板10，其上表面具有一反光面11；若干LED芯片20，通过一绝缘层21固定于反光面11之上；该LED芯片20的宽度不大于反光面；且LED芯片20的电极朝上。As shown in FIG. 1 to FIG. 3, a schematic diagram of a first embodiment of the present invention includes a thermally conductive substrate 10 having a reflective surface 11 on the upper surface thereof, and a plurality of LED chips 20 fixed to the reflective surface 11 via an insulating layer 21. The width of the LED chip 20 is not greater than the reflective surface; and the electrode of the LED chip 20 faces upward.
在反光面11之上具有第一荧光层40，且位于LED芯片20固定位置的外周。所有的LED芯片20的电极都是通过邦定线30进行电连接，使所有LED芯片20构成完整的负载通路；邦定线30全部位于第一荧光层40之上.The first phosphor layer 40 is provided on the reflective surface 11 and is located on the outer periphery of the fixed position of the LED chip 20. All the electrodes of the LED chip 20 are electrically connected through the bonding wire 30, so that all the LED chips 20 form a complete load path; the bonding wires 30 are all located above the first phosphor layer 40.
此第一荧光层40可以是涂覆烘烤的荧光粉，也可以是预加工的荧光粉薄片。The first phosphor layer 40 may be a baked phosphor or a pre-processed phosphor flake.
在上述所有部件的上方覆盖第二荧光层50，该第二荧光层50覆盖了反光层11、LED芯片20、邦定线30和所述第一荧光层40。A second phosphor layer 50 is covered over all of the above components, and the second phosphor layer 50 covers the light reflecting layer 11, the LED chip 20, the bonding wires 30, and the first phosphor layer 40.
本方案构成了高光效的LED模组结构。来自LED芯片的蓝光或者近紫外等激发光谱光线一部分直接入射到第一荧光层40和第二荧光层50中进行转化并混合；另一部分经过反光面11反射后依然入射到第一和第二荧光层中进行转化、混合，因此其光线处理面积大，效率高，且颜色一致性好；另一方面，直接固定于基板10上的LED芯片20具有较好的散热通路，因此温度特性好，进一步维持了高光效。This scheme constitutes a high-efficiency LED module structure. A part of the excitation spectrum light from the LED chip, such as blue light or near ultraviolet light, is directly incident on the first fluorescent layer 40 and the second fluorescent layer 50 for conversion and mixing; the other portion is reflected by the reflective surface 11 and is still incident on the first and second fluorescent colors. The layer is converted and mixed, so that the light treatment area is large, the efficiency is high, and the color consistency is good; on the other hand, the LED chip 20 directly fixed on the substrate 10 has a better heat dissipation path, so the temperature characteristics are good, and further Maintained high light efficiency.
本方案的邦定线30作为电连接部分，替代了PCB板的金属走线，成型快速，不影响芯片到基板的热阻。其整体引出电极通过固定在基板10上的基板电极60实现。The bonding line 30 of the solution is used as an electrical connection part, instead of the metal trace of the PCB board, and the molding is fast, and does not affect the thermal resistance of the chip to the substrate. The entire extraction electrode is realized by the substrate electrode 60 fixed on the substrate 10.
本方案中，邦定线30跨接于LED芯片20之间的部分悬空于第一荧光层40上方，因此被第一荧光层40妥善隔离于基板10，绝缘性能良好，结构简单。In this solution, the portion of the bonding wire 30 that is connected between the LED chips 20 is suspended above the first fluorescent layer 40, and thus is properly separated from the substrate 10 by the first fluorescent layer 40, and has good insulation performance and simple structure.
实施例二：Embodiment 2:
如图4至故6所示，本发明实施例二的示意图。4 to 6 show a schematic diagram of Embodiment 2 of the present invention.
本实施例的基板10为单层铝材，反光面11为抛光处理的高反射率表面，其LED芯片20、第一荧光层40、第二荧光层50与实施例一类似。The substrate 10 of the present embodiment is a single-layer aluminum material, and the reflective surface 11 is a polished high-reflectivity surface. The LED chip 20, the first fluorescent layer 40, and the second fluorescent layer 50 are similar to the first embodiment.
不同的是，该邦定线30跨接于LED芯片20之间的部分各自具有一个固定点31固定于第一荧光层40上表面，该固定点使邦定线30的悬空部分固定于第一荧光层40上表面的固定点31.该结构使整个模组具有良好的抗震性能。The difference between the bonding wires 30 and the LED chips 20 respectively has a fixing point 31 fixed on the upper surface of the first fluorescent layer 40, and the fixing point fixes the floating portion of the bonding wire 30 to the first surface. A fixed point on the upper surface of the phosphor layer 40. This structure gives the entire module good shock resistance.
由于本方案的基板10为导电材料，其与LED芯片20具有电连接，构成了LED模组导电通路的一部分，节省了一条极性连线，使基板10功能得到复用。Since the substrate 10 of the present embodiment is a conductive material, it has electrical connection with the LED chip 20, which constitutes a part of the conductive path of the LED module, saves a polarity connection, and multiplexes the functions of the substrate 10.
实施例三：Embodiment 3:
如图7至图9所示，本发明一实施例的示意图；7 to 9 are schematic views of an embodiment of the present invention;
本方案一种条形LED模组的结构，它包括一个长条形的基板10’，该基板10’为通体金属材料，具有良好的导热和反光效果。它具有一平整的上表面12’；在上表面12’上固定有LED芯片20’，两者之间具有绝缘胶21’。The structure of a strip LED module comprises an elongated substrate 10' which is a through-metal material and has good thermal and reflective effects. It has a flat upper surface 12'; an LED chip 20' is attached to the upper surface 12' with an insulating glue 21' therebetween.
LED芯片20’的电极部分朝上，连接体30’连接于各个LED芯片20’的电极，根据其串、并联的需求，将该LED芯片20’连接为完整的负载回路。在整个基板10’的上表面12’配合有一层荧光层50’，该荧光层50’覆盖了LED芯片20’和连接体30’。特别地，在基板10’的上表面12’其长边边缘横截面为圆角11’。The electrode portion of the LED chip 20' faces upward, and the connector 30' is connected to the electrodes of the respective LED chips 20'. The LED chip 20' is connected as a complete load circuit in accordance with the string and parallel requirements. A phosphor layer 50' is fitted over the upper surface 12' of the entire substrate 10', and the phosphor layer 50' covers the LED chip 20' and the connector 30'. Specifically, the long side edge cross section of the upper surface 12' of the substrate 10' is a rounded corner 11'.
本方案具有快速成型的特点，首先LED芯片20’直接贴装于导电导热的基板10’就完成了其固定和散热的设置；然后连接体30’使所有LED芯片20’完成电气连接，构成完整负载回路；最后荧光层50’覆盖在其上完成光学和光谱方面的处理，使该LED模组具有完整的照明光输出功能。圆角11’的形态使荧光层50’在喷涂成型时依靠自身张力限制在上表面12’的边缘内，防止荧光层50’因为溢出导致的形状不规则、发光体不均匀的情况，特别适合于快速涂刷的工艺，保障了模组成型的高效率。另一方面，本结构层级少，导热路径短，可获得较高的光效和良好的散热效果，省略了LED芯片20’的单个封装要求，节省了成本。The solution has the characteristics of rapid prototyping. Firstly, the LED chip 20' is directly mounted on the conductive and thermally conductive substrate 10' to complete its fixing and heat dissipating arrangement; then the connecting body 30' enables all the LED chips 20' to be electrically connected to form a complete The load circuit; the final fluorescent layer 50' covers the optical and spectral processing thereon, so that the LED module has a complete illumination light output function. The shape of the rounded corner 11' is such that the fluorescent layer 50' is restrained in the edge of the upper surface 12' by its own tension during the spray molding, and the fluorescent layer 50' is prevented from being irregular in shape and uneven in the illuminant due to overflow, and is particularly suitable. The high-efficiency process of the module is ensured in the process of rapid brushing. On the other hand, the structure has few levels, the heat conduction path is short, high light efficiency and good heat dissipation effect can be obtained, and the single package requirement of the LED chip 20' is omitted, thereby saving cost.
本方案还具有其他一些特点：This program also has other features:
基板10’为单层金属的结构。进一步削减了基板10’的成本和结构，使其导热效果、机械强度等得到保证。连接体30’形态为跨接于该LED芯片20’的邦定线，其在LED芯片20’之间的部分悬空于上表面12’，该结构使整个模组的成型工艺时间进一步缩短，因为LED芯片20’的电连接部分可以用打线设备实现快速打线连接，配合荧光层50’的整体涂刷工艺，可在短时间内大面积成型模组，具有批量生产的优势。The substrate 10' is a single-layer metal structure. Further, the cost and structure of the substrate 10' are further reduced, and the heat conduction effect, mechanical strength, and the like are secured. The connector 30' is in the form of a bonding wire bridging the LED chip 20', and a portion between the LED chips 20' is suspended from the upper surface 12'. This structure further shortens the molding process time of the entire module because The electrical connection portion of the LED chip 20' can be quickly connected by a wire bonding device, and the overall coating process of the fluorescent layer 50' can be used to form a module in a large area in a short time, which has the advantage of mass production.
考虑到圆角11’的成型速度，基板10’的上表面12’其长边边缘结构为冲压成型的收缩边缘结构，即基板10’在成型时其冲压模具是从上而下冲压成型，其圆角11’即可成型，该形状不需要打磨，为基板10’上表面12’边缘收缩的形状，一致性好。Considering the forming speed of the rounded corner 11', the long side edge structure of the upper surface 12' of the substrate 10' is a press-formed shrink-edged edge structure, that is, the stamping die of the substrate 10' is formed from top to bottom during molding, The rounded corner 11' can be formed, and the shape does not need to be ground, and the shape of the upper surface 12' of the substrate 10' is contracted, and the consistency is good.
在基板10’的上表面12’，其长度方向的两端位置还具有约束该荧光层50’长度的围墙胶体60’，该围墙胶体60’贯穿该上表面12’的宽度方向，配合于该上表面，配合上述的边缘，整个上表面12’对荧光层具有约束的效果，因此，在大批量同时生产时荧光层50’成型的一致性好。The upper surface 12' of the substrate 10' has a wall colloid 60' that constrains the length of the fluorescent layer 50' at both ends in the longitudinal direction, and the wall colloid 60' penetrates the width direction of the upper surface 12' to fit the The upper surface, in combination with the above-mentioned edges, has the effect that the entire upper surface 12' has a confinement effect on the fluorescent layer, and therefore, the uniformity of the formation of the fluorescent layer 50' is good in simultaneous mass production.
实施例四Embodiment 4
如图10至图12所示，本发明实施例四的示意图。10 to 12 are schematic views of Embodiment 4 of the present invention.
本方案包括一个长条状、平板型的基板10”，其两端18”和19”为单层金属导体的形态。在基板10”上固定了LED芯片20”，LED芯片20”是通过绝缘胶21”固定配合于基板10”的上表面12”，其电极方向朝上。The present invention comprises a long strip-shaped, flat-type substrate 10", the ends 18" and 19" of which are in the form of a single-layer metal conductor. The LED chip 20" is fixed on the substrate 10", and the LED chip 20" is insulated The glue 21" is fixedly fitted to the upper surface 12" of the substrate 10" with its electrode direction facing upward.
用邦定线30连接于LED芯片20”之间、上表面12”的上方，使所有LED芯片20”构成完整的负载回路（串、并联及其组合）。最后有一荧光粉层50”，配合于上表面12”，覆盖LED芯片20”和绑定线30”。其中，基板10”的两端18”、19”与该LED芯片所在的负载回路输入端连通，即作为整个基板10”上LED芯片20”所构成的负载的两端。The bonding wire 30 is connected between the LED chips 20" and above the upper surface 12", so that all the LED chips 20" constitute a complete load circuit (string, parallel and combinations thereof). Finally, a phosphor layer 50" is matched. The upper surface 12" covers the LED chip 20" and the bonding wire 30". The two ends 18", 19" of the substrate 10" are in communication with the load loop input end where the LED chip is located, that is, as the entire substrate 10" Both ends of the load formed by the LED chip 20".
如此，购成了便于级联的长条形LED模组方案，当需要将多片基板10”串联时，可以通过熔融焊接的方式（激光、碰焊等）将基板10”沿其长度方向串联起来构成具有机械强度的连接整体，较之传统PCB板方式的基板10”而言，其连接速度快，而且不需要焊锡等额外的耗材，节省了成本。In this way, a long strip LED module solution that facilitates cascading is purchased. When multiple substrates 10" are required to be connected in series, the substrate 10" can be connected in series along its length by means of fusion welding (laser, bump welding, etc.). It forms a joint with mechanical strength, which is faster than the conventional PCB board type substrate 10′′, and does not require additional consumables such as solder, which saves cost.
本方案还具有其他一些特点：邦定线30”在LED芯片20”之间的部分悬空于上表面12”，该形态有助于邦定线30”快速打线，同时可以利用荧光粉层50”作为固定材料稳定邦定线的悬空部分。The solution also has other features: a portion of the bonding wire 30" between the LED chips 20" is suspended from the upper surface 12", which helps the bonding wire 30" to quickly wire, and can utilize the phosphor layer 50. "As a fixed material, stabilize the hanging part of the bonding line."
实施例五Embodiment 5
如图13至图15所示，本发明实施例五的示意图。13 to 15 are schematic views of Embodiment 5 of the present invention.
本实施例是一个多片复合体，如图15所示，多个基板10”沿其宽度方向并联，且彼此之间具有缝隙14”，通过连接段13”固接成整片，当多片的单体其上的部件固定完成后，将连接端段13”切断成单体，再进行纵向连接。该形状利于LED芯片20”的多片邦定和批量生产。This embodiment is a multi-piece composite body. As shown in FIG. 15, a plurality of substrates 10" are connected in parallel in the width direction thereof, and have slits 14" between each other, and are fixed into a whole piece by the connecting portion 13", when a plurality of pieces are After the components on the unit are fixed, the connecting end section 13" is cut into a single body and then longitudinally connected. This shape facilitates multi-piece bonding and mass production of the LED chip 20".
本方案的LED芯片20”与实施例一类似，不同的是绑定线30”在LED芯片20”之间的部分具有固定于该上表面的固定段，通过固定片31”固定于基板10”。固定片31”可以是导体材料，邦定线30”直接快速打线于其上。该结构使邦定线30”整体结构更牢固。The LED chip 20" of the present embodiment is similar to the first embodiment except that the portion of the bonding wire 30" between the LED chips 20" has a fixing portion fixed to the upper surface, and is fixed to the substrate 10 by the fixing piece 31"" The fixing piece 31" may be a conductor material, and the bonding wire 30" is directly fastened thereto. This structure makes the bonding wire 30" overall structure stronger.
本方案基板10”通体为单层金属结构，LED芯片20”所在的负载回路一端连接于基板10”；另一端通过一个过渡芯片60”引出。过渡芯片60”与基板10”保持绝缘。该形态的基板10”结构更简单，纵向连接的机械强度更高。The substrate 10" of the solution is a single-layer metal structure, and one end of the load circuit where the LED chip 20" is located is connected to the substrate 10"; the other end is led out through a transition chip 60". The transition chip 60" is insulated from the substrate 10". The structure of the substrate 10" of this form is simpler, and the mechanical strength of the longitudinal connection is higher.
实施例六Embodiment 6
图16至图18展示了本发明实施例六的构造图。16 to 18 are views showing the configuration of a sixth embodiment of the present invention.
它有一个镜面的基板10’”，该基板10’”用金属或者陶瓷材料，本身具有较小的热阻。多颗LED芯片，包括21’”、22’”通过一绝缘胶层60’”配合固定于基板10’”的上表面；LED芯片两个一组构成一LED对20’”，如本图所示的LED芯片21’”和22’”，就构成了一LED对，LED对为单元，沿该基板10’”长度方向，即图16中自左至右的方向排列分布，且该LED芯片21’”和22’”的电极面向上。在基板10’”的上表面还用绝缘胶层60’”固定了基板电极51’”。It has a mirrored substrate 10'" which is made of a metal or ceramic material and which itself has a small thermal resistance. A plurality of LED chips, including 21'", 22'" are fixed to the upper surface of the substrate 10'" by an insulating adhesive layer 60'"; the LED chips are formed in two groups to form an LED pair 20'", as shown in the figure. The illustrated LED chips 21'" and 22'" constitute an LED pair, the LED pairs are units, arranged along the length direction of the substrate 10'", that is, from left to right in FIG. 16, and the LED chip The electrodes of 21'" and 22'" face up. The substrate electrode 51'" is also fixed on the upper surface of the substrate 10'" with an insulating layer 60'".
邦定线30’”作为构造LED芯片电气拓扑结构的主要连线，连接于基板电极51’”与LED芯片包括21’”、22’”的电极；其中该LED对20’”两端具有并联部40’”，使该LED对成为一个电气并联的并联单元，例如LED芯片21’”和22’”相互并联，该并联部40’”与基板10’”之间具有绝缘物70’”。The bonding wire 30'" serves as a main connection for constructing the electrical topology of the LED chip, and is connected to the substrate electrode 51'" and the LED chip includes electrodes of 21'", 22'"; wherein the LED pair 20'" has parallel connections at both ends The portion 40'" causes the pair of LEDs to be an electrically parallel parallel unit, for example, the LED chips 21'" and 22'" are connected in parallel with each other, and the insulator 70'" is provided between the parallel portion 40'" and the substrate 10'".
在基板10’”的上表面配合有荧光粉层50’”，荧光粉层覆盖了LED芯片、邦定线30’”、绝缘物70’”和绝缘胶层60’”；所有的并联单元通过该并联部40’”相串联构成一LED串；基板电极51’”、并联单元构成完整的电气回路，也即，该基板10’”上所有的LED芯片，都是两两并联后再串联起来的拓扑结构。A phosphor layer 50'" is fitted on the upper surface of the substrate 10'", and the phosphor layer covers the LED chip, the bonding wire 30'", the insulator 70'" and the insulating layer 60'"; all the parallel cells pass The parallel portion 40'" is connected in series to form an LED string; the substrate electrode 51'" and the parallel unit constitute a complete electrical circuit, that is, all the LED chips on the substrate 10'" are connected in parallel and then connected in series. Topology.
本方案的实施步骤如下：The implementation steps of this program are as follows:
1）先提供一镜面的、具有良导热性能的基板10’”；1) first providing a mirrored substrate 10' with good thermal conductivity;
2）将LED芯片通过一绝缘胶层60’”配合固定于基板10的上表面；且LED芯片每两个一组构成一LED对，例如LED芯片21’”和22’”组成一LED对20’”；该LED对20’”沿该基板10’”的长度方向排列，且LED芯片的电极面向上；再将导体材料的基板电极51’”通过一绝缘胶层60’”配合固定于基板10’”的上表面；2) fixing the LED chip to the upper surface of the substrate 10 through an insulating glue layer 60'"; and the LED chips form an LED pair every two groups, for example, the LED chips 21'" and 22'" constitute an LED pair 20 The LED pair 20'" is arranged along the length direction of the substrate 10'", and the electrode of the LED chip faces upward; the substrate electrode 51'" of the conductor material is then fixed to the substrate by an insulating glue layer 60'" The upper surface of 10'";
3）采用打线设备将邦定线30’”打线于基板电极51’”与LED芯片的电极；每两个相邻的LED对之间设置一个并联部40’”，邦定线30’”自该LED对中各个LED芯片的电极引出后连接于该并联部40’”，使该LED对成为一个电气并联的并联单元；所有的并联单元通过该并联部40’”相串联构成一LED串；同时使基板电极51’”、并联单元构成完整的电气回路。3) using a wire bonding device to wire the bonding wire 30'" to the substrate electrode 51'" and the electrode of the LED chip; a parallel portion 40'" is disposed between each two adjacent LED pairs, and the bonding wire 30' "Connecting from the electrode of each LED chip in the LED pair to the parallel portion 40'", the LED pair becomes an electrically parallel parallel unit; all the parallel units are connected in series through the parallel portion 40'" to form an LED String; at the same time, the substrate electrode 51'" and the parallel unit constitute a complete electrical circuit.
4）在所述基板的上表面涂覆荧光粉层50’”，该荧光粉层50’”覆盖LED芯片、邦定线30’”和绝缘胶层60’”；4) coating a phosphor layer 50'" on the upper surface of the substrate, the phosphor layer 50'" covering the LED chip, the bonding wire 30'" and the insulating layer 60'";
其中，步骤2）在该基板表面设置绝缘物70’”，此绝缘物70’”介于该上表面与并联部40’”之间。Wherein step 2) is provided with an insulator 70'" on the surface of the substrate, the insulator 70'" being interposed between the upper surface and the parallel portion 40'".
本方案具有许多优点，首先，基板10’”在本构造和工艺下省略了多层结构和焊接点，例如传统PCB铝基板，避免了铝基板PCB形态的多层形态带来的热阻过大和成本过高，也避免了PCB式基板焊接工艺/构造带来的导热不均、高温损坏LED芯片的隐患，其LED芯片的固定工艺简单，结构简单，加工速度快。The solution has many advantages. First, the substrate 10'" omits the multilayer structure and solder joints under the present configuration and process, such as a conventional PCB aluminum substrate, which avoids the excessive thermal resistance caused by the multilayer form of the aluminum substrate PCB form. The cost is too high, and the uneven heat conduction caused by the PCB substrate welding process/structure is avoided, and the hidden trouble of the LED chip caused by the high temperature is avoided. The fixing process of the LED chip is simple, the structure is simple, and the processing speed is fast.
采用邦定线作为LED芯片拓扑连接的导体，一方面充分利用了打线工艺的速度优势，同时也节省了这些连接带来的金属材料损耗，另一方面，所构造的并联单元，使整个LED串具有良好的抗失效性能，即使任何一个并联单元中的LED芯片损坏，整个LED串仍然保持发亮，而且在荧光粉层的覆盖下明暗均匀。The bonding wire is used as the conductor of the LED chip topological connection. On the one hand, the speed advantage of the wire bonding process is fully utilized, and the metal material loss caused by these connections is also saved. On the other hand, the parallel unit is constructed to make the whole LED The string has good resistance to failure. Even if the LED chips in any of the parallel units are damaged, the entire LED string remains bright and uniform under the coverage of the phosphor layer.
本实施例还具有其他一些特点：并联部40’”包括一过渡芯片的形态，绝缘物70’”为绝缘胶，将过渡芯片固定配合于基板10’”之间，使二者紧密配合。该形态的并联部40’”比较牢固、使邦定线30的打线速度具有较快的保障。This embodiment also has other features: the parallel portion 40'" includes a form of a transition chip, and the insulator 70'" is an insulating glue, and the transition chip is fixedly fitted between the substrates 10'" so that the two are closely matched. The parallel portion 40' of the shape is relatively strong, so that the wire speed of the bonding wire 30 has a relatively fast guarantee.
实施例七：Example 7:
如图19至图22所示，本发明实施例七的示意图。19 to 22 are schematic views of Embodiment 7 of the present invention.
本方案有一个导热的基板10’”，该基板10’”用上表面高抛光的铝材料，具有高反射率、高导热的特点。多颗LED芯片，包括21’”、22’”通过一绝缘胶层60’”配合固定于基板10’”的上表面；LED芯片两个一组构成一LED对，如本图所示的LED芯片21’”和22’”，就构成了一LED对20’”，LED对20’”为单元，沿该基板10’”长度方向，即图1中自左至右的方向排列分布，且该LED芯片21’”和22’”的电极面向上。在基板10’”的上表面还用绝缘胶层60’”固定了基板电极51’”。The solution has a thermally conductive substrate 10'" which is made of a highly polished aluminum material having a high reflectivity and high thermal conductivity. A plurality of LED chips, including 21'" and 22'", are fixed to the upper surface of the substrate 10'" by an insulating adhesive layer 60'"; the LED chips are formed in two groups to form an LED pair, such as the LED shown in the figure. The chips 21'" and 22'" constitute an LED pair 20'", and the LED pair 20'" is a unit, arranged along the length direction of the substrate 10'", that is, from left to right in FIG. The electrodes of the LED chips 21'" and 22'" face upward. The substrate electrode 51'" is also fixed on the upper surface of the substrate 10'" with an insulating layer 60'".
邦定线30’”作为构造LED芯片电气拓扑结构的主要连线，连接于基板电极51’”与LED芯片包括21’”、22’”的电极；其中该LED对20’”两端具有并联部40’”，邦定线30’”自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元，例如LED芯片21’”和22’”相互并联，该并联部40’”与基板10’”之间具有绝缘物70’”。The bonding wire 30'" serves as a main connection for constructing the electrical topology of the LED chip, and is connected to the substrate electrode 51'" and the LED chip includes electrodes of 21'", 22'"; wherein the LED pair 20'" has parallel connections at both ends The portion 40'", the bonding wire 30'" is drawn from the electrodes of the LED chips in the pair of LEDs, and is connected to the parallel portion, so that the LED pair becomes an electrically parallel parallel unit, such as LED chips 21'" and 22' "In parallel with each other, the parallel portion 40'" and the substrate 10'" have an insulator 70'".
在基板10’”的上表面配合有荧光粉层50’”，荧光粉层覆盖了LED芯片、邦定线30’”、绝缘物70’”和绝缘胶层60’”；所有的联单元通过该并联部40’”相串联构成一LED串；基板电极51’”、并联单元构成完整的电气回路，也即，该基板10’”上所有的LED芯片，都是两两并联后再串联起来的拓扑结构。A phosphor layer 50'" is fitted on the upper surface of the substrate 10'", and the phosphor layer covers the LED chip, the bonding wire 30'", the insulator 70'" and the insulating layer 60'"; all the joint units pass The parallel portion 40'" is connected in series to form an LED string; the substrate electrode 51'" and the parallel unit constitute a complete electrical circuit, that is, all the LED chips on the substrate 10'" are connected in parallel and then connected in series. Topology.
不同于实施例一的是，本方案并联部40’”形态为邦定线30’”相互交叉电接触构成的交叉点；该交叉点悬空于基板10’”上表面；绝缘物70’”为配合于该基板表面的绝缘胶；交叉点涂覆导电胶31’”。该方案使得并联部40’”的成型非常快速，省略了过渡芯片的结构，使LED芯片的拓扑连接具有快速成型的特点，同时也同实施例一使LED芯片具有先并联后串联的高可靠性结构。Different from the first embodiment, the parallel portion 40'" of the present embodiment is an intersection formed by the mutual contact of the bonding wires 30'"; the intersection is suspended on the upper surface of the substrate 10'"; the insulator 70'" is The insulating glue is matched on the surface of the substrate; the conductive paste 31'" is coated at the intersection. This solution makes the formation of the parallel portion 40'" very fast, omitting the structure of the transition chip, and the topological connection of the LED chip has the characteristics of rapid prototyping. At the same time, as in the first embodiment, the LED chip has a high reliability structure in which the LED chips are connected in series and then connected in series.
每个LED对中的两个LED芯片其连线与基板的长度方向夹角α为锐角，且每个LED对的倾斜方向一致，这一点在图19中可看出，该结构一方面使得邦定线30’”在交叉点的夹角更趋向于直角，其交叉接触较稳固；另一方面使LED芯片的几何排列结构易于利用摆动式贴装机快速贴装，工艺速度快。考虑到邦定线在交叉点的电接触，需要在并联部40’”处涂覆导电胶，例如银胶等优质导电胶体。The angle between the line connecting the two LED chips in each LED pair and the length direction of the substrate is an acute angle, and the inclination direction of each LED pair is the same, as can be seen in Fig. 19, the structure on the one hand makes the state The angle of the alignment 30'" at the intersection point tends to be a right angle, and the cross contact is relatively stable; on the other hand, the geometric arrangement of the LED chip is easy to be quickly mounted by the oscillating type placement machine, and the process speed is fast. Considering the bonding The electrical contact of the wires at the intersection requires the application of a conductive paste, such as a high-quality conductive paste such as silver glue, at the parallel portion 40'".
本方案的基板10’”为良导体，基板电极51和该基板分别串联于该LED串的两端。使得基板被充分利用为整个LED拓扑的一端电极，简化了电极引线。The substrate 10'" of the present embodiment is a good conductor, and the substrate electrode 51 and the substrate are respectively connected in series at both ends of the LED string, so that the substrate is fully utilized as one end electrode of the entire LED topology, simplifying the electrode lead.
该实施例的步骤如下：The steps of this embodiment are as follows:
1）先提供一具有良导热性能的铝质基板10’”；1) first providing an aluminum substrate 10'" having good thermal conductivity;
2）将LED芯片通过一绝缘胶层60’”配合固定于基板10’”的上表面；且LED芯片每两个一组构成一LED对，例如LED芯片21’”和22’”组成一LED对20’”；该LED对20’”沿该基板10’”的长度方向排列，且LED芯片的电极面向上；再将导体材料的基板电极51’”通过一绝缘胶层60’”配合固定于基板的上表面；2) the LED chip is fixed to the upper surface of the substrate 10'" by an insulating glue layer 60'"; and the LED chips form an LED pair every two groups, for example, the LED chips 21'" and 22'" constitute an LED. Pair 20'"; the LED pair 20'" is arranged along the length direction of the substrate 10'", and the electrode of the LED chip faces upward; and the substrate electrode 51'" of the conductor material is further fixed by an insulating glue layer 60'" On the upper surface of the substrate;
3）采用打线设备将邦定线30’”打线于基板电极51’”与LED芯片的电极；每两个相邻的LED对之间设置一个并联部40’”，邦定线30’”自该LED对中各个LED芯片的电极引出后连接于该并联部40’”，使该LED对成为一个电气并联的并联单元；所有的并联单元通过该并联部40’”相串联构成一LED串；同时使基板电极51’”、并联单元构成完整的电气回路。3) using a wire bonding device to wire the bonding wire 30'" to the substrate electrode 51'" and the electrode of the LED chip; a parallel portion 40'" is disposed between each two adjacent LED pairs, and the bonding wire 30' "Connecting from the electrode of each LED chip in the LED pair to the parallel portion 40'", the LED pair becomes an electrically parallel parallel unit; all the parallel units are connected in series through the parallel portion 40'" to form an LED String; at the same time, the substrate electrode 51'" and the parallel unit constitute a complete electrical circuit.
4）在所述基板的上表面涂覆荧光粉层50’”，该荧光粉层50’”覆盖LED芯片、邦定线30’”和绝缘胶层60’”；4) coating a phosphor layer 50'" on the upper surface of the substrate, the phosphor layer 50'" covering the LED chip, the bonding wire 30'" and the insulating layer 60'";
其中，步骤1）之后即用绝缘胶喷涂于在该基板10’”上表面作为绝缘物70’”；邦定线30’”在LED对之间交叉并电接触构成并联部40’”；该并联部成型后涂覆导电胶31’”；并且该并联部40’”采用悬空的状态位于该上表面和绝缘物70’”上方。Wherein, after step 1), an insulating glue is sprayed on the upper surface of the substrate 10'" as an insulator 70'"; a bonding line 30'" crosses between the pair of LEDs and electrically contacts to form a parallel portion 40'"; The parallel portion is formed by applying a conductive paste 31'"; and the parallel portion 40'" is positioned above the upper surface and the insulator 70'" in a suspended state.
特别地，为实现并联部40’”的电接触强度，邦定线30’”从上往下下压的一支其弧度小于下方者，因此必然会压迫下方者使其形变，从而具有可靠电接触，配合导电胶31’”，得到了并联部的快速成型。In particular, in order to achieve the electrical contact strength of the parallel portion 40'", the bonding line 30'" is pressed from the top to the bottom with a curvature smaller than the lower one, so that the lower one is forced to deform and thus has reliable electric power. Contact, with the conductive adhesive 31'", rapid prototyping of the parallel portion is obtained.
以上所述，仅为本发明较佳实施例而已，故不能依此限定本发明实施的范围，即依本发明专利范围及说明书内容所作的等效变化与修饰，皆应仍属本发明涵盖的范围内。The above is only the preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, that is, equivalent changes and modifications made in accordance with the scope of the invention and the contents of the specification should still be covered by the present invention. Within the scope.
工业实用性Industrial applicability
本发明一种LED模组使用高反射率的基板保证了光源光效高；邦定线作为LED芯片拓扑连接的导体，充分利用了打线工艺的速度优势，同时也节省了这些连接带来的金属材料损耗；所构造的并联单元使整个LED串具有良好的抗失效性能。LED芯片的拓扑连接具有快速成型的特点，使得整个LED模组光线处理面积大，效率高，且颜色一致性好，具有良好的工业实用性。The LED module of the invention uses the high reflectivity substrate to ensure high light source efficiency; the bonding wire is used as the conductor of the LED chip topological connection, fully utilizing the speed advantage of the wire bonding process, and also saving the connection of these connections. Metal material loss; the constructed parallel unit provides good resistance to failure for the entire LED string. The topological connection of the LED chip has the characteristics of rapid prototyping, which makes the whole LED module have large light processing area, high efficiency, good color consistency and good industrial applicability.

Claims (25)

  1. 一种LED模组结构，其特征在于：它包括： An LED module structure is characterized in that it comprises:
    一导热的基板，其上表面具有一反光面；a thermally conductive substrate having a reflective surface on an upper surface thereof;
    LED芯片，通过一绝缘层固定于所述反光面之上；该LED芯片宽度不大于所述反光面；该LED芯片的电极朝上；The LED chip is fixed on the reflective surface by an insulating layer; the LED chip has a width not greater than the reflective surface; the LED chip has an electrode facing upward;
    第一荧光层，配合于所述反光面，且位于所述LED芯片固定位置的外周；a first fluorescent layer, coupled to the reflective surface, and located at an outer periphery of the fixed position of the LED chip;
    邦定线，连接于所述LED芯片的电极之间，将其连接为完整的负载通路；位于所述第一荧光层之上；a bonding wire connected between the electrodes of the LED chip and connected as a complete load path; being located above the first fluorescent layer;
    第二荧光层，覆盖所述反光面上的所有部分包括该LED芯片、邦定线和所述第一荧光层。A second phosphor layer covering all portions of the reflective surface includes the LED chip, a bonding line, and the first phosphor layer.
  2. 根据权利要求1所述一种LED模组结构，其特征在于：该邦定线跨接于所述LED芯片之间的部分悬空于所述第一荧光层上方。The LED module structure of claim 1 , wherein a portion of the bonding line spanning between the LED chips is suspended above the first phosphor layer.
  3. 根据权利要求1所述一种LED模组结构，其特征在于：该邦定线跨接于所述LED芯片之间的部分具有至少一个固定点固定于所述第一荧光层上表面。The LED module structure of claim 1 , wherein the portion of the bonding wire spanning between the LED chips has at least one fixed point fixed to an upper surface of the first phosphor layer.
  4. 根据权利要求1所述一种LED模组结构，其特征在于：所述基板为导电材料，与所述LED芯片具有电连接。The LED module structure according to claim 1, wherein the substrate is a conductive material and has electrical connection with the LED chip.
  5. 根据权利要求1或2或3或4所述一种LED模组结构，其特征在于：所述基板为单层。The LED module structure according to claim 1 or 2 or 3 or 4, wherein the substrate is a single layer.
  6. 一种LED模组结构，其特征在于：包括：An LED module structure, comprising:
    基板，长条形，具有一平整的上表面；a substrate, elongated, having a flat upper surface;
    LED芯片，固定于所述上表面；An LED chip fixed to the upper surface;
    连接体，连接于所述LED芯片的电极，将该LED芯片连接为完整的负载回路；以及a connector connected to the electrode of the LED chip to connect the LED chip to a complete load circuit;
    荧光层，配合于所述基板的上表面，覆盖所述LED芯片和连接体；a fluorescent layer, coupled to the upper surface of the substrate, covering the LED chip and the connecting body;
    其中，所述基板的上表面其长边边缘横截面为圆角。Wherein, the upper surface of the substrate has a rounded edge with a rounded cross section.
  7. 根据权利要求6所述一种LED模组结构，其特征在于：所述基板为单层结构。The LED module structure according to claim 6, wherein the substrate is a single layer structure.
  8. 根据权利要求6所述一种LED模组结构，其特征在于：所述连接体形态为跨接于该LED芯片的邦定线，其在所述LED芯片之间的部分悬空于所述上表面。The LED module structure according to claim 6, wherein the connector is in the form of a bonding wire bridging the LED chip, and a portion between the LED chips is suspended on the upper surface. .
  9. 根据权利要求6或7或8所述一种LED模组结构，其特征在于：所述基板的上表面其长边边缘结构为冲压成型的收缩边缘结构。The LED module structure according to claim 6 or 7 or 8, wherein the upper surface of the substrate has a long-edge edge structure which is a stamped and formed contracted edge structure.
  10. 根据权利要求9所述一种LED模组结构，其特征在于：所述基板的上表面在其长度方向的两端位置还具有约束该荧光层长度的围墙胶体，该围墙胶体贯穿该上表面的宽度方向，配合于该上表面。The LED module structure according to claim 9, wherein the upper surface of the substrate further has a wall colloid for restraining the length of the fluorescent layer at both ends in the longitudinal direction thereof, and the wall colloid penetrates the upper surface. The width direction is fitted to the upper surface.
  11. 一种LED模组结构，其特征在于：它包括：An LED module structure is characterized in that it comprises:
    基板，平板型长条状，其两端为单层金属导体；The substrate is a strip-shaped strip having a single-layer metal conductor at both ends thereof;
    LED芯片，通过绝缘胶固定配合于所述基板的上表面，其电极方向朝上；The LED chip is fixedly coupled to the upper surface of the substrate by an insulating glue with an electrode direction facing upward;
    邦定线，连接于所述LED芯片之间、所述上表面的上方；以及a bonding wire connected between the LED chips and above the upper surface;
    荧光粉层，配合于所述上表面，覆盖所述LED芯片和绑定线；a phosphor layer, coupled to the upper surface, covering the LED chip and the bonding wire;
    其中，所述基板的两端与该LED芯片所在的负载回路输入端对应连通。The two ends of the substrate are correspondingly connected to the input end of the load circuit where the LED chip is located.
  12. 根据权利要求11所述一种LED模组结构，其特征在于：所述绑定线在所述LED芯片之间的部分具有固定于该上表面的固定段，该固定段通过固定片固定于基板。The LED module structure according to claim 11, wherein a portion of the bonding wire between the LED chips has a fixing segment fixed to the upper surface, and the fixing segment is fixed to the substrate by a fixing piece. .
  13. 根据权利要求11所述一种LED模组结构，其特征在于：所述邦定线在所述LED芯片之间的部分悬空于所述上表面。The LED module structure according to claim 11, wherein a portion of the bonding line between the LED chips is suspended from the upper surface.
  14. 根据权利要求11或12或13所述一种LED模组结构，其特征在于：所述基板通体为单层金属结构，连通了该LED芯片所在负载回路的一端。The LED module structure according to claim 11 or 12 or 13, wherein the substrate is a single-layer metal structure that communicates with one end of the load circuit where the LED chip is located.
  15. 根据权利要求14所述一种LED模组结构，其特征在于：该基板具有多片，沿其宽度方向并联，且彼此之间具有缝隙，通过连接段固接成整片。The LED module structure according to claim 14, wherein the substrate has a plurality of sheets, which are connected in parallel in the width direction thereof and have a gap between each other, and are fixed into a whole piece through the connecting portion.
  16. 一种LED模组结构，其特征在于：它包括：An LED module structure is characterized in that it comprises:
    基板；Substrate
    LED芯片，通过一绝缘胶层配合固定于所述基板的上表面；该LED芯片两个一组构成一LED对，且沿该基板长度方向排列；该LED芯片的电极面向上；The LED chip is fixed to the upper surface of the substrate by an insulating layer; the LED chips are formed in two groups to form an LED pair and arranged along the length direction of the substrate; the electrode of the LED chip faces upward;
    基板电极，通过一绝缘胶层配合固定于所述基板的上表面；The substrate electrode is fixed to the upper surface of the substrate by an insulating layer;
    邦定线，连接于所述基板电极与所述LED芯片的电极；其中该LED对两端具有并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；该并联部与所述基板之间具有绝缘物；a bonding wire connected to the substrate electrode and the electrode of the LED chip; wherein the LED has a parallel portion at both ends, the bonding wire is drawn from the electrode of each LED chip of the LED pair, and then connected to the parallel portion The LED pair is made into an electrically parallel parallel unit; the parallel portion and the substrate have an insulator;
    荧光粉层，配合于所述基板的上表面，覆盖所述LED芯片、邦定线、绝缘物和绝缘胶层；a phosphor layer is disposed on the upper surface of the substrate to cover the LED chip, the bonding wire, the insulator and the insulating layer;
    其中，所有的所述并联单元通过该并联部相串联构成一LED串；所述基板电极、并联单元构成完整的电气回路。Wherein all the parallel units are connected in series through the parallel portion to form an LED string; the substrate electrode and the parallel unit constitute a complete electrical circuit.
  17. 根据权利要求16所述一种LED模组结构，其特征在于：所述并联部包括一过渡芯片，所述绝缘物为固定配合于该过渡芯片与基板之间的绝缘胶。The LED module structure according to claim 16, wherein the parallel portion comprises a transition chip, and the insulator is an insulating glue fixedly fitted between the transition chip and the substrate.
  18. 根据权利要求16所述一种LED模组结构，其特征在于：所述并联部形态为所述邦定线相互交叉电接触构成的交叉点；该交叉点悬空于所述基板表面；所述绝缘物为配合于该基板表面的绝缘胶；所述交叉点涂覆导电胶。The LED module structure according to claim 16, wherein the parallel portion is in the form of an intersection formed by the intersecting electrical contact of the bonding wires; the intersection is suspended on the surface of the substrate; the insulation The material is an insulating glue that is fitted to the surface of the substrate; the intersection is coated with a conductive paste.
  19. 根据权利要求16或17或18所述一种LED模组结构，其特征在于：所述上表面为高反射率的表面。The LED module structure according to claim 16 or 17 or 18, wherein the upper surface is a surface having a high reflectivity.
  20. 根据权利要求19所述一种LED模组结构，其特征在于：所述基板为良导体，所述基板电极和该基板分别串联于该LED串的两端。The LED module structure according to claim 19, wherein the substrate is a good conductor, and the substrate electrode and the substrate are respectively connected in series at two ends of the LED string.
  21. 一种LED模组的制造工艺，其特征在于：包括：A manufacturing process of an LED module, comprising:
    1）提供一具有良导热性能的基板；1) providing a substrate having good thermal conductivity;
    2）将LED芯片通过一绝缘胶层配合固定于所述基板的上表面；且LED芯片每两个一组构成一LED对，该LED对沿该基板的长度方向排列，且该LED芯片的电极面向上；再将导体材料的基板电极通过一绝缘胶层配合固定于所述基板的上表面；2) fixing the LED chip to the upper surface of the substrate through an insulating adhesive layer; and each of the LED chips constitutes an LED pair, the LED pairs are arranged along the length direction of the substrate, and the electrodes of the LED chip Facing upward; the substrate electrode of the conductor material is further fixed to the upper surface of the substrate through an insulating adhesive layer;
    3）采用打线设备将邦定线打线于基板电极与所述LED芯片的电极；每两个相邻的所述LED对之间设置一个并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；所有的所述并联单元通过该并联部相串联构成一LED串；同时使所述基板电极、并联单元构成完整的电气回路；3) using a wire bonding device to wire the bonding wire to the electrode of the substrate and the electrode of the LED chip; a parallel portion is disposed between each two adjacent pairs of the LEDs, and the bonding wire is aligned from the LED The electrodes of each LED chip are connected to the parallel portion, so that the LED pair becomes an electrically parallel parallel unit; all of the parallel units are connected in series through the parallel portion to form an LED string; and the substrate electrodes and the parallel are simultaneously The unit constitutes a complete electrical circuit;
    4）在所述基板的上表面涂覆荧光粉层，该荧光粉层覆盖所述LED芯片、邦定线和绝缘胶层；4) coating a phosphor layer on the upper surface of the substrate, the phosphor layer covering the LED chip, the bonding wire and the insulating rubber layer;
    其中，所述步骤1）或者步骤2）在该基板表面设置绝缘物，介于该上表面与所述并联部之间。Wherein the step 1) or the step 2) is provided with an insulator on the surface of the substrate between the upper surface and the parallel portion.
  22. 根据权利要求21所述一种LED模组的制造工艺，其特征在于：在所述步骤2）之后在该基板上表面用绝缘胶作为所述绝缘物，再将一过渡芯片通过该绝缘物粘贴配合于该上表面。The manufacturing process of an LED module according to claim 21, wherein after the step 2), an insulating paste is used as the insulator on the upper surface of the substrate, and a transition chip is pasted through the insulator. Fitted to the upper surface.
  23. 根据权利要求21所述一种LED模组的制造工艺，其特征在于：所述步骤1）之后即用绝缘胶喷涂于在该基板上表面作为所述绝缘物；所述邦定线在所述LED对之间交叉并电接触构成所述并联部；该并联部成型后涂覆导电胶；并且该并联部采用悬空的状态位于该上表面和绝缘物上方。The manufacturing process of an LED module according to claim 21, wherein the step 1) is sprayed with an insulating glue on the upper surface of the substrate as the insulator; the bonding line is in the The parallel and electrically contact between the pair of LEDs constitutes the parallel portion; the parallel portion is formed with a conductive paste after molding; and the parallel portion is in a suspended state above the upper surface and the insulator.
  24. 根据权利要求21或22或23所述一种LED模组的制造工艺，其特征在于：所述基板为良导体；步骤3）中将所述基板电极和该基板分别用该邦定线串联于该LED串的两端。The manufacturing process of an LED module according to claim 21 or 22 or 23, wherein the substrate is a good conductor; in step 3), the substrate electrode and the substrate are respectively connected in series by the bonding wire. Both ends of the LED string.
  25. 根据权利要求24所述一种LED模组的制造工艺，其特征在于：每个所述LED对中的两个所述LED芯片其连线与所述基板的长度方向夹角为锐角，且每个所述LED对的所述连线倾斜方向一致。The manufacturing process of an LED module according to claim 24, wherein an angle between a line connecting the two LED chips of each of the LED pairs and a length direction of the substrate is an acute angle, and each The lines of the pair of LEDs are inclined in the same direction.
PCT/CN2014/091581 2013-11-21 2014-11-19 Led module structure, and manufacturing process for led module WO2015074551A1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
CN201320747043.7 2013-11-21
CN201320745974.3U CN203596366U (en) 2013-11-21 2013-11-21 LED module structure easy to process
CN201320746062.8U CN203596369U (en) 2013-11-21 2013-11-21 High luminous efficiency LED module structure
CN201320747138.9 2013-11-21
CN201310598109.5A CN104659028B (en) 2013-11-21 2013-11-21 The construction and its manufacturing process of a kind of LED module
CN201320746062.8 2013-11-21
CN201320747138.9U CN203617297U (en) 2013-11-21 2013-11-21 Structure of LED module
CN201320745974.3 2013-11-21
CN201310598109.5 2013-11-21
CN201320747043.7U CN203596350U (en) 2013-11-21 2013-11-21 Bar-shaped LED module structure

Publications (1)

Publication Number Publication Date
WO2015074551A1 true WO2015074551A1 (en) 2015-05-28

Family

ID=53178950

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/091581 WO2015074551A1 (en) 2013-11-21 2014-11-19 Led module structure, and manufacturing process for led module

Country Status (1)

Country Link
WO (1) WO2015074551A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106683574A (en) * 2015-11-11 2017-05-17 利亚德光电股份有限公司 Light-emitting diode display screen and application thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022148A (en) * 2007-01-11 2007-08-22 鹤山丽得电子实业有限公司 Method for producing light-emitted diode package structure
CN101266968A (en) * 2007-03-15 2008-09-17 夏普株式会社 Light emitting device and method for manufacturing the same
CN101846256A (en) * 2010-05-04 2010-09-29 蔡州 Led light source
CN102646761A (en) * 2011-02-21 2012-08-22 展晶科技(深圳)有限公司 LED (light-emitting diode) packaging process
CN103090244A (en) * 2011-10-31 2013-05-08 艾泰库思株式会社 Led mounting circuit board, belt-like flexible led light and led illuminating device using the same
CN203596366U (en) * 2013-11-21 2014-05-14 福建省万邦光电科技有限公司 LED module structure easy to process
CN203596350U (en) * 2013-11-21 2014-05-14 福建省万邦光电科技有限公司 Bar-shaped LED module structure
CN203596369U (en) * 2013-11-21 2014-05-14 福建省万邦光电科技有限公司 High luminous efficiency LED module structure
CN203617297U (en) * 2013-11-21 2014-05-28 福建省万邦光电科技有限公司 Structure of LED module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022148A (en) * 2007-01-11 2007-08-22 鹤山丽得电子实业有限公司 Method for producing light-emitted diode package structure
CN101266968A (en) * 2007-03-15 2008-09-17 夏普株式会社 Light emitting device and method for manufacturing the same
CN101846256A (en) * 2010-05-04 2010-09-29 蔡州 Led light source
CN102646761A (en) * 2011-02-21 2012-08-22 展晶科技(深圳)有限公司 LED (light-emitting diode) packaging process
CN103090244A (en) * 2011-10-31 2013-05-08 艾泰库思株式会社 Led mounting circuit board, belt-like flexible led light and led illuminating device using the same
CN203596366U (en) * 2013-11-21 2014-05-14 福建省万邦光电科技有限公司 LED module structure easy to process
CN203596350U (en) * 2013-11-21 2014-05-14 福建省万邦光电科技有限公司 Bar-shaped LED module structure
CN203596369U (en) * 2013-11-21 2014-05-14 福建省万邦光电科技有限公司 High luminous efficiency LED module structure
CN203617297U (en) * 2013-11-21 2014-05-28 福建省万邦光电科技有限公司 Structure of LED module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106683574A (en) * 2015-11-11 2017-05-17 利亚德光电股份有限公司 Light-emitting diode display screen and application thereof

Similar Documents

Publication Publication Date Title
WO2017065545A1 (en) Compact light emitting diode chip and light emitting device including the same
WO2017030396A1 (en) Light-emitting element, light-emitting element package comprising light-emitting element, and light-emitting device comprising light-emitting element package
WO2010050694A2 (en) Light emitting diode
WO2015076592A1 (en) Backlight unit, double cone-shaped reflector, double cone-shaped reflector strip, lighting device, and method for manufacturing double cone-shaped reflector
WO2014038794A1 (en) Wafer level light-emitting diode array
WO2013036070A2 (en) Lighting device and lighting control method
WO2016032167A1 (en) Light-emitting element package
WO2011145794A1 (en) Light emitting diode chip having wavelength conversion layer and manufacturing method thereof, and package including same and manufacturing method thereof
WO2019124843A1 (en) Chip scale package light emitting diode
WO2016133292A1 (en) Light-emitting device with improved light extraction efficiency
WO2013122337A1 (en) Light emitting package
WO2016190651A1 (en) Optical lens, lighting module, and light unit comprising same
WO2013089334A1 (en) Lighting device
WO2016117905A1 (en) Light source module and lighting device
WO2017078441A1 (en) Semiconductor device
WO2013036062A2 (en) Lighting module
WO2016018071A1 (en) Light source module
WO2016126066A1 (en) Light-emitting module and lighting apparatus provided with same
WO2019045277A1 (en) Light emitting device for pixel and led display device
WO2019027192A1 (en) Semiconductor device package and light source device
WO2019088704A1 (en) Light emitting device package and lighting device having same
WO2015074551A1 (en) Led module structure, and manufacturing process for led module
WO2016011967A1 (en) Led light source for industrial detection
WO2014148805A1 (en) Led illumination device
WO2017043782A1 (en) Lens and light emitting unit including same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14864905

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14864905

Country of ref document: EP

Kind code of ref document: A1