WO2015062155A1 - Micro-inductor and manufacturing method therefor - Google Patents

Micro-inductor and manufacturing method therefor Download PDF

Info

Publication number
WO2015062155A1
WO2015062155A1 PCT/CN2014/000134 CN2014000134W WO2015062155A1 WO 2015062155 A1 WO2015062155 A1 WO 2015062155A1 CN 2014000134 W CN2014000134 W CN 2014000134W WO 2015062155 A1 WO2015062155 A1 WO 2015062155A1
Authority
WO
WIPO (PCT)
Prior art keywords
support body
wiring
magnetic core
inductor
micro
Prior art date
Application number
PCT/CN2014/000134
Other languages
French (fr)
Chinese (zh)
Inventor
时启猛
曲炳郡
刘乐杰
叶启
耿玉洁
王春华
Original Assignee
北京嘉岳同乐极电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201310537504.2A external-priority patent/CN104616859B/en
Application filed by 北京嘉岳同乐极电子有限公司 filed Critical 北京嘉岳同乐极电子有限公司
Publication of WO2015062155A1 publication Critical patent/WO2015062155A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core

Definitions

  • the invention relates to an inductor, in particular to a miniature inductor and a manufacturing method thereof. Background technique
  • Inductors are widely used in electrical equipment. In order to adapt to the development of miniaturization and thinning of electrical equipment such as cellular phones and PDAs, the inductance has gradually evolved toward miniaturization and thinning.
  • micro-inductors Due to the small size of the micro-inductors, especially the thinner thickness (less than a millimeter), the conventional manufacturing method for making a large-sized inductor (which directly winds the coil on the core) cannot obtain such a micro-inductance.
  • micro-inductors are obtained through a deposition process, that is, both the core and the coil are fabricated by a deposition process.
  • the deposition process is costly to produce, especially for the cost of manufacturing the core. Because the thickness of the core directly affects the overall performance of the micro-inductor, the thinner the core, the worse the overall performance of the micro-inductor; however, increasing the thickness of the core increases the cost of the micro-inductor. That is to say, the micro-inductance produced by the deposition process cannot balance the comprehensive performance and processing cost of the micro-inductor. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a micro-inductance and a manufacturing method thereof for the above-mentioned defects existing in the micro-inductor, which have excellent comprehensive performance and low processing cost.
  • the present invention provides a miniature inductor including a magnetic core and a coil, the magnetic core being disposed inside the coil, the coil including a support body and a wiring, the wiring being spirally disposed on the support body .
  • the support body is a flexible support body made of a flexible material, and a plurality of sections of the wiring section are disposed on the surface of the flexible support body, and the flexible support body is bent to form a hollow columnar structure, and opposite ends of the flexible support body
  • the portions are stacked, and the wiring segments are sequentially electrically connected in a staggered manner to form a continuous wiring, and the magnetic core is fixed to the inner side of the hollow cylindrical structure.
  • the support body is a rigid support body of a hollow columnar structure made of a hard material, and the rigid support body is provided with a recess and a groove, and the groove surrounds the hard support in a spiral manner
  • the wiring is disposed in the recess, and a pad of the coil is disposed in the recess, and the pad is electrically connected to an end of the wiring.
  • the support body includes a first support body and a second support body, and a plurality of first wiring segments and second wiring segments are respectively disposed on surfaces of the first support body and the second support body, First wiring segment and The second wiring segments are sequentially and end-interleaved by the electrical connection members to form a continuous wiring.
  • the magnetic core is made of a ferrite material.
  • the magnetic core is made of a ferrite material of 5 MHz to 3 GHz.
  • the magnetic core is made of a ferrite material of 9 MHz to 20 MHz.
  • the thickness of the magnetic core is greater than or equal to 30 microns and less than 2.0 mm.
  • the thickness of the magnetic core is greater than or equal to 70 microns and less than 0.7 mm.
  • an encapsulation layer is further included for encapsulating the coil and the magnetic core.
  • the micro inductor is used for an antenna in the communication field.
  • the invention also provides a method for manufacturing a miniature inductor, comprising:
  • the coil includes a support body and a wiring, and the wiring is spirally disposed on the support body;
  • the magnetic core is fixed to the inner side of the coil.
  • the support body being a flexible support body
  • the flexible support body is bent to form a hollow columnar structure, the ends of the flexible support body are stacked, and the segments of the segments are sequentially electrically connected end to end to form a continuous wiring.
  • the support body being a rigid support body
  • the groove is disposed in a spiral manner around a circumference of the rigid support body, and the concave portion is disposed at an end of the groove;
  • a wiring is provided in the recess, a pad is provided in the recess, and an end of the wiring is electrically connected to the corresponding pad.
  • the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
  • the method further includes: packaging the coil and the magnetic core with an insulating material.
  • the present invention also provides a method for fabricating a miniature inductor, including:
  • the first component comprising a first support body and a plurality of first wiring segments disposed on a surface of the first support body;
  • the first component and the second component are disposed opposite each other, and the magnetic core is fixed between the first component and the second component;
  • the plurality of first wiring segments and the plurality of second wiring segments are sequentially alternately electrically connected to each other to form a continuous wiring.
  • step of sequentially interleaving the first wiring segment and the second wiring segment in the first and last staggered corresponding electrical connections first forming a through hole penetrating through the first supporting body, the second supporting body and the supporting cofferdam at the electrical connection position; Then, a conductive metal is deposited in the via hole, thereby sequentially connecting the corresponding first wiring segment and the second wiring segment to the corresponding electrical connection.
  • the support cofferdam is integral with the first component or the second component.
  • the first support body and the second support body are made of an insulating material, and the insulating material comprises a polypropylene resin and an epoxy resin.
  • the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
  • the present invention also provides a method for fabricating a miniature inductor, including:
  • the conductive layer is patterned by a patterning process to obtain a wiring segment on the surface of the support; the wiring segments of the surfaces of the two support plates are sequentially staggered and correspondingly electrically connected;
  • the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
  • the support plate is made of polypropylene resin or epoxy resin; and the conductive layer is a copper film.
  • the step of staggering the wiring segments of the two surface of the support plate in sequence is: Obtaining a through hole at an end of the wiring segment, the through hole penetrating the upper and lower pieces of the support plate and the conductive layer on a surface thereof in a thickness direction;
  • Conductive metal is deposited in the via hole by a deposition process, thereby sequentially interleaving the wiring segments on the two support plates in a corresponding electrical connection.
  • the step of increasing the thickness of the wiring segment is further included, and the thickness of the wiring segment is increased by a plating, a physical vapor deposition process or a chemical vapor deposition process.
  • an insulating treatment step is also included, that is, the surface of the micro-inductor except the pad region is coated with an insulating material.
  • the micro-inductor provided by the present invention forms a coil by using a support body and a wiring provided on the support body, that is, the support body is arranged in a cylindrical shape, and the wiring is spirally arranged on the support body, and the volume of the coil can be reduced by the support body, especially
  • the thickness of the small coil is such that the core thickness is increased for the purpose of increasing the total volume of the coil, thereby improving the overall performance of the micro-inductor.
  • the support body adopts a flexible support body, and the flexible support body has strong toughness and can be bent into different shapes according to actual needs; moreover, the thickness of the flexible support body can reach micron level, and the thickness of the micro inductor can be reduced; Obtained by deposition, the wiring is not only strong in toughness, but also capable of adapting to the bending of the flexible support; and the thickness is so thin that the thickness of the wiring does not substantially affect the thickness of the coil, and the thickness of the coil is substantially equal to the thickness of the support. In addition, the cost of obtaining wiring by deposition is low.
  • the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes, and the manufacturing cost of such a processed core It is much lower than the traditional deposition methods (such as sol-gel method, PVD and CVD), and the thickness of the core has little effect on the manufacturing cost of the core. Therefore, the thickness of the core can be adjusted according to actual needs, so that A micro-inductor with superior overall performance is obtained, and the processing cost is low.
  • traditional deposition methods such as sol-gel method, PVD and CVD
  • the inductance can be made by an existing method.
  • the existing method of manufacturing a large volume of electric power cannot be adapted to a micro-inductance having a thickness of 3 mm or less, especially 2 mm or less.
  • the deposition method mainly produces inductances of several micrometers or ten micrometers.
  • the thickness of the inductor reaches several tens of micrometers, the manufacturing cost of the deposition method is multiplied. Therefore, as an advantage of the present invention, the core has a thickness greater than or equal to 30 microns and less than 2.0 mm.
  • the micro-inductor in this thickness interval can ensure the comprehensive performance of the inductance and quality factor of the micro-inductor, and can reduce the manufacturing cost of the micro-inductor.
  • the thickness of the magnetic core is greater than or equal to 70 microns, and less than 0.7 mm, in order to reduce the volume of the micro-inductor and to improve the overall performance and yield of the micro-inductance.
  • the ferrite core material of 5MHz ⁇ 3GH Z.
  • a micro-inductor can be fabricated using a ferrite material of 9 MHz to 20 MHz.
  • the coil includes a cylindrical support body and a wiring, and the wiring is spirally disposed on the support body, thereby reducing the manufacturing cost and improving the overall performance of the micro-inductor.
  • FIG. 1 is a cross-sectional view of a longitudinal direction (perpendicular to a coil axis) of a miniature inductor according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a lateral direction (parallel to an axis of a coil) of a micro-inductor according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of a rigid support body according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of a micro inductor according to an embodiment of the present invention.
  • FIG. 5a is a schematic structural view of a flexible support body according to an embodiment of the present invention.
  • FIG. 5b is a schematic structural view of another flexible support body according to an embodiment of the present invention.
  • FIG. 6a is a perspective view showing a partial structure of a miniature inductor according to another embodiment of the present invention.
  • 6b is a side view showing a partial structure of a micro inductor according to still another embodiment of the present invention.
  • FIG. 7 is a flow chart of manufacturing a miniature inductor according to an embodiment of the present invention.
  • FIG. 8 is a flow chart of manufacturing a coil according to an embodiment of the present invention.
  • FIG. 9 is a flow chart of manufacturing a micro-inductor (hard support) according to an embodiment of the present invention
  • FIG. 10a is a top view of a micro-inductor fabricated by a micro-inductor manufacturing method according to an embodiment of the present invention
  • FIG. 10b is a micro-inductor according to an embodiment of the present invention
  • 11a is a schematic structural view of a first component of an embodiment of the present invention.
  • Figure l ib is a schematic structural view of the first component and the magnetic core of the embodiment of the present invention.
  • FIG. 11c is a schematic structural view of the first component, the support cofferdam and the magnetic core fixed according to an embodiment of the present invention
  • FIG. 1 id is a schematic structural view of the first wiring segment and the second wiring segment correspondingly electrically connected according to an embodiment of the present invention
  • FIG. 1 is a cross-sectional view of the micro-inductor in the direction of A-A in FIG. 10a according to an embodiment of the present invention
  • FIG. 12 is a flow chart of mass-making a micro-inductor according to an embodiment of the present invention
  • FIG. 13 is a cross-sectional view showing the steps of a method for mass-making a miniature inductor according to an embodiment of the present invention.
  • the micro-inductor includes a magnetic core 1, a coil 2, an encapsulation layer 3, and a pad (not shown).
  • the magnetic core 1 is disposed inside the coil 2.
  • the coil 2 is sleeved on The outer side of the magnetic core 1.
  • Each of the ends of the coil 2 is provided with a pad for electrically connecting the micro-inductor to other external components.
  • the encapsulation layer 3 is used to encapsulate the magnetic core 1 and the coil 2. In some applications, the miniature inductor can be left without the encapsulation layer 3.
  • the coil 2 includes a support body 21 and a wiring 22.
  • the wiring 22 has a thickness of only several to several tens of micrometers, and the support body 21 is for supporting the wiring 22.
  • the support body 21 is a hollow columnar structure such as a square cylindrical structure, a circular cylindrical structure or a triangular cylindrical structure, or a cylindrical structure of other shapes.
  • the shape of the support body 21 is determined in accordance with the outer shape of the magnetic core 1, that is, the support body 21 is to be matched with the outer shape of the magnetic core 1, so that the support body 21 closely fits the magnetic core 1.
  • the support body 21 is a rigid support made of a hard material.
  • a groove 21 1 and a recess 212 are provided on the periphery of the support body 21, and the groove 21 1 is disposed around the support body 21 in a spiral manner.
  • a concave portion 212 is disposed at each end of the groove 211, and the recess portion 212 and the recess 21 1 are respectively disposed.
  • the groove 21 1 is for setting the wiring 22, and the recess 212 is for setting the tray 4.
  • the wiring 22 is wound in the recess 21 1 and the end of the wiring 22 is electrically connected to the pad 4 correspondingly.
  • the recess 21 1 facilitates controlling the width and spacing of the wiring, thereby improving the performance of the micro-inductor. It should be noted that the wiring 21 1 mentioned herein should be understood in a broad sense, which can also be obtained by deposition.
  • the support body 21 may be made of a non-conductive material or a conductive material.
  • the surface of the wire needs to have an insulating layer.
  • the support 21 provides support and/or positioning for the wiring 22 to modularize the coil 2, which not only facilitates the storage, transportation and assembly of the coil 2, but also facilitates the assembly of the miniature inductor.
  • the magnetic core 1 is fixed to the inner side of the support body 2.
  • the support body 21 is a flexible support made of a flexible material.
  • the wiring 22 is provided on the surface of the flexible support 21 or embedded in the interior of the flexible support 21, which can be obtained by deposition or copper plating, a patterning process.
  • the wiring 22 is formed by connecting a plurality of sections of wiring sections. When the flexible support 21 is bent so that its opposite ends are overlapped, the wiring segments are sequentially connected to the end-to-end staggered electrical connection to form a continuous wiring 22.
  • the wiring segments provided on the flexible support body 21 may be disposed obliquely as shown in FIG. 5a; or, one of the segments of the wiring segments is inclined and the other portion is horizontally disposed as shown in FIG. 5b.
  • the manner in which the wiring segments are arranged is not limited to the manner mentioned in this specification.
  • the flexible support body 21 is bent according to the outer shape of the magnetic core 1, so that the flexible support body 21 is made
  • the magnetic core 1 is closely fitted (wrapped), and the wiring segments 22 are sequentially staggered to correspond to electrical connections. Since the flexible support body is easily bent and deformed, it is possible to obtain hollow cylindrical structures of different shapes according to the outer shape of the magnetic core 1, thereby increasing the diversity of the structure of the coil 2.
  • the thickness of the flexible support is easily controlled at the micron level, and the thickness of the micro inductor is reduced; the wiring 22 is obtained by deposition, and the wiring 22 obtained in this way is not only thin, but also has good toughness and can be bent and deformed with the flexible support. .
  • the support body 21 includes a first support body 21a and a second support body 21b, and the first support body 21a and the second support body 21b are disposed opposite to each other.
  • a plurality of first wiring segments 22a' and second wiring segments 22b' are respectively disposed on the surfaces of the first support body 21a and the second support body 21b, and electricity is disposed between the first support body 21a and the second support body 21b.
  • the connecting portion 5 is configured to sequentially and firstly electrically interconnect the first wiring segment 22a' and the second wiring segment 22b' to obtain the connected wiring 22.
  • the electrical connection portion 5 is a conductive post or a conductive ball for electrically connecting the first wiring segment 22a' and the second wiring segment 22b', and also for supporting and fixing the first support body 21a and the second support body 21b.
  • the first support body 21a and the second support body 21b maintain a constant distance.
  • connection points 23 are provided at the ends of the first wiring segment 22a' and the second wiring segment 22b', and the width of the connection point 23 may be smaller than Equal to or greater than the width of the wiring segment.
  • the width of the connection point 23 is larger than the width of the wiring segment, which not only facilitates the electrical connection of the first wiring segment 22a' and the second wiring segment 22b' with the electrical connection portion 5, but also reduces the difficulty in fabricating the coil 2.
  • a pad 4 is also provided on the surface of the first support 21a or the second support 21b, that is, the pad 4 is provided at the end of the wiring 22.
  • the thickness of the magnetic core is greater than or equal to 30 ⁇ m and less than 2.0 mm.
  • the micro-inductor of this thickness interval can ensure the comprehensive performance of the inductance and quality factor of the micro-inductor, and the magnetic core 1 can be obtained by powder sintering or by sheet machining or casting to reduce the manufacturing cost of the micro-inductor.
  • the thickness of the magnetic core is less than 0.7 mm and greater than or equal to 70 microns to reduce the volume of the micro-inductor and to improve the overall performance and yield of the micro-inductor.
  • the magnetic core 1 is made of a ferrite material.
  • the ferrite material can be selected from a ferrite material of 5 MHz to 3 GHz.
  • the antenna in the communication field can use a ferrite material of 9 MHz to 20 MHz.
  • the magnetic core 1 is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
  • the cost of the method of making the magnetic core 1 is much lower than that of the conventional deposition method (such as sol-gel method, PVD, CVD), and the thickness of the magnetic core has little effect on the manufacturing cost.
  • the thickness of the magnetic core can be adjusted according to actual needs, so that the micro-inductor with superior comprehensive performance can be obtained, and the processing cost can be reduced.
  • the thickness of the support body 21 can be arbitrarily set as needed. Considering the strength of the support body 21 and the thickness of the micro-inductor, the thickness of the support body 21 is selected to be 20 to 400 ⁇ m. Of course, this does not mean that the thickness of the support body 21 can be selected only from 20 to 400 ⁇ m. In practice, the thickness of the support 21 can be greater than 400 microns, or less than 20 microns.
  • the miniature inductor also includes a pad 4 and an encapsulation layer 3.
  • the pad 4 is disposed at the end of the coil 2 for electrical connection between the micro-inductor and other electronic components.
  • the encapsulation layer 3 is used to encapsulate the magnetic core 1 and the coil 2.
  • the encapsulation layer is made of an insulating material, such as ceramic or resin.
  • the tray 4 can be disposed on the surface of the support body, such as on the upper surface, the lower surface of the micro-inductor or on the upper surface and the lower surface (the upper surface and the lower surface are a relative concept, which is based on micro Depending on how the inductor is placed, it can also be placed at the end of the miniature inductor, as shown in Figure 2. However, it should be noted that when the micro-inductor is used for the antenna, the pad 4 cannot be placed at the end of the inductor to prevent the pad 4 from affecting the transmission and reception of the antenna.
  • the coil is obtained by using the support and the wiring provided on the support, that is, the support is provided in a cylindrical shape, and the wiring is spirally provided on the support to modularize the coil.
  • the inductor is fabricated, the core and the coil are assembled together, thereby reducing the manufacturing cost of the micro inductor.
  • the magnetic core 1 is placed inside the coil 2 when the coil is produced.
  • the invention also provides a method of fabricating a miniature inductor.
  • the manufacturing method of the micro inductor includes:
  • Step S l providing a magnetic core.
  • the magnetic core is made of a ferrite material, and the ferrite material is a ferrite of 5 MHz to 3 GHz.
  • the ferrite material is a ferrite of 5 MHz to 3 GHz.
  • micro-inductors made of ferrite material of 9MHz ⁇ 20 ⁇ z can be used.
  • the core is sintered by ferrite powder, or formed by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
  • the thickness of the core is greater than or equal to 30 microns and less than 2.0 mm.
  • the micro-inductor of this thickness interval can ensure the comprehensive performance of the inductance and quality factor of the micro-inductor.
  • the magnetic core can be sintered by ferrite powder, or formed by ferrite sheet machining, or by casting and tableting. , sintering, cutting process molding to reduce the manufacturing cost of micro-inductors.
  • the thickness of the magnetic core is greater than or equal to 70 micrometers, less than 0.7 millimeters, to reduce the volume of the miniature inductor and to improve the overall performance and yield of the miniature inductor.
  • Step S2 providing a coil.
  • the coil includes a support body and a wiring, and the wiring is spirally disposed on a periphery of the support body. As shown in Figure 8, The specific manufacturing process of the coil includes:
  • Step S2 providing a plate-like (sheet-like) support.
  • the support body of the embodiment is a flexible support made of a soft material.
  • Step S22 forming a plurality of segments of the wiring on the support.
  • Multi-section wiring segments are formed on the flexible support by means of deposition such as electroplating, or by physical vapor deposition such as magnetron sputtering, or by chemical vapor deposition, or by means of a copper-clad film on a patterned flexible support. Make wiring segments on.
  • the wiring segments can be formed on the surface of the support or embedded in the interior of the support.
  • Step S23 the opposite ends of the support body are stacked, and the segments of the segments are sequentially staggered and correspondingly electrically connected to form a spiral continuous wiring.
  • the flexible support is bent in accordance with the outer shape of the core, and the opposite ends are stacked while the segments are alternately electrically connected to form a spiral continuous wiring on the outer side of the flexible support.
  • the shape of the magnetic core may be circular, square, triangular or other shape, and the shape of the flexible support after bending is correspondingly circular, square, triangular or other shape.
  • a modular coil is obtained from step S21 to step S23, which is convenient for storage, assembly and transportation.
  • step S3 the magnetic core is disposed on the inner side of the support body and fixed.
  • the magnetic core is inserted into the inner side of the support body, and the magnetic core and the support body are fixed together by means such as gluing.
  • the magnetic core is embedded inside the coil during bending of the flexible support.
  • Step S4 encapsulation.
  • the core and the coil are packaged, and the coil and the core are encapsulated by an insulating material.
  • the insulating material may be ceramic or resin or the like.
  • the embodiment further includes the step of providing a pad at both ends of the coil. Pads are provided at both ends of the coil for electrical connection of the miniature inductor to other electronic components.
  • Step S91 a magnetic core is provided.
  • the material selection and manufacturing method of the magnetic core are the same as those in the foregoing embodiment, and will not be described herein.
  • Step S92 providing a coil.
  • the coil includes a rigid support and wiring (also referred to herein as a wire), the rigid support is a hollow cylindrical structure, and the hollow region is used to provide a magnetic core. Grooves and recesses are formed in the rigid support body, the grooves are axially disposed around the rigid support body in a spiral manner, and the recesses are provided at the ends of the grooves and communicate with the grooves. Then through the sink The integration method forms a wiring in the recess, forms a pad in the recess, and electrically connects the wiring to the pad. When wiring is obtained without deposition, the coil can be obtained by winding a wire around a groove of a rigid support.
  • step S93 the magnetic core is fixed to the inner side of the coil.
  • the micro-inductor fabrication method further includes a packaging step, step S94, in which the coil and the magnetic core are encapsulated with an insulating material.
  • the following embodiment provides another method of fabricating a miniature inductor by which a miniature inductor as shown in Figure 10a is fabricated.
  • the manufacturing method of the micro inductor includes:
  • Step S101 providing a first component, the first component comprising a first support body and a plurality of first wiring segments disposed on a surface of the first support body.
  • the first member 91 includes a first support body 91 1 and a plurality of first wiring segments 912 provided on the surface of the first support body.
  • the first support body 91 1 is made of an insulating material such as a polypropylene resin or an epoxy resin.
  • the first wiring segment 912 is formed on the surface of the first support 91 1 by a coating, exposure, development, and etching process. Or the first wiring segment 912 is obtained on the surface of the first support 91 1 by a deposition process, as shown in Fig. 11a.
  • Step S102 providing a magnetic core to fix the magnetic core to the first component.
  • the magnetic core 1 is formed by sintering a ferrite powder, or by a ferrite sheet machine, or by a casting, tableting, sintering, or cutting process.
  • the material and thickness of the magnetic core are described above and will not be described here. Fix the core to the first part, as shown in Figure l ib.
  • the magnetic core 1 can be fixed by supporting the cofferdam.
  • a support dam 8 is provided on the side of the first component 91 where the magnetic core 1 is disposed (not shown in FIG. 1 1 c, which can be seen in FIG. 1), and the support dam 8 is along the coil 2.
  • the support cofferdam 8 is made of an insulating material such as polypropylene resin or epoxy resin or other filler (such as glue for bonding various layers of resin material).
  • the support coam 8 can be obtained by solidifying on the surface of the first member 91, such as by first providing an uncured resin on the surface of the first member 91, and obtaining a support coam 8 when the resin is solidified.
  • the support dam 8 is integrally formed with the first member 91, i.e., when the first support 91 1 is machined, the support dam 8 is formed directly on the first support 91 1 .
  • Step S103 providing a second component, the second component comprising a second support body and a plurality of second wiring segments disposed on a surface of the second support body.
  • the second member 92 includes a second support body 921 and a plurality of second wiring segments 922 provided on the surface of the second support body 921, and the second support body 921 is made of an insulating material such as polypropylene resin or epoxy resin.
  • the second member 92 is placed on the magnetic core 1 so that the magnetic core 1 is disposed between the first member 91 and the second member 92.
  • the first member 91 and the second member 92 are supported by the support dam 8 and the magnetic core 1, that is, the support dam 8 Not only for supporting the first member 91 and the second member 92, but also for positioning the magnetic core 1.
  • the support dam 8 may also be integrated with the second member 92, that is, the support dam 8 and the second support 921 are integrally formed.
  • Step S104 the second component is stacked and fixed on the top of the magnetic core.
  • the second member 92 is placed on top of the magnetic core 1, that is, the first member 91 and the second member 92 are oppositely disposed, and the magnetic core 1 is sandwiched between the first member 91 and the second member 92, as shown in FIG. Show.
  • step S105 the plurality of first wiring segments and the plurality of second wiring segments are sequentially and alternately electrically connected to form a continuous wiring.
  • a hole is punched in an end portion of the wiring segment, the hole penetrating through the thickness of the first support body 911 and the second support body 921, the first wiring segment 912, the second wiring segment 922, and the support cofferdam 8, and then conductive is deposited in the hole
  • the metal forms the electrical connection portion 5, thereby electrically connecting the first wiring segment 912 and the second wiring segment 922 to each other to obtain continuous wiring, as shown in FIG.
  • a modified embodiment of the above-described method of fabricating the micro-inductor first obtains the first member 91, the second member 92, and the magnetic core 1, respectively, and then superposed the magnetic core 1 between the first member 91 and the second member 92.
  • Step S106 making an encapsulation layer.
  • the encapsulation layer is made of an insulating or wear-resistant material such as ceramics or resin. This step can be implemented according to actual needs.
  • FIG. 11a to l id are cross-sectional views taken along line B-B of Fig. 10a, and Fig. 1 is a cross-sectional view taken along line A-A of Fig. 10a. .
  • the first component and the magnetic core are first fixed, the second component is superposed on the magnetic core, and finally the plurality of first wiring segments and the first component are disposed on the first component. And connecting the plurality of second wiring segments of the second component to the electrical connection, and forming the first wiring segment and the second wiring segment to form a coil, wherein the magnetic core is disposed on the coil during the process of fabricating the coil
  • a micro-inductor having a thickness of 3 mm or less, especially 2 mm or less is obtained at a low cost, and the thickness of the magnetic core is no longer limited by the manufacturing process, so that the micro-inductor has excellent comprehensive performance such as inductance value and quality factor. .
  • the present invention also provides a method for mass-making a miniature inductor.
  • a method for fabricating a miniature inductor includes:
  • Step S l l l providing a magnetic core, and obtaining a groove extending through the thickness thereof on the magnetic core.
  • the magnetic core 111 is made of ferrite, which is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
  • a groove 115 is formed in the core 111 through the thickness thereof, and the distance between the two grooves 115 is equal to the magnetic field of the micro inductor to be processed.
  • the width of the core is shown in Figure 13 (A).
  • Step S112 providing a support plate, and providing a conductive layer on the surface of the support plate.
  • the support plate 112 is made of an insulating resin material such as polypropylene resin or epoxy resin, and the thickness of the support plate 112 can be arbitrarily set as needed. In this embodiment, the support plate 112 is 20 to 30 ⁇ m thick.
  • the conductive layer 113 provided on the surface of the support plate 112 is obtained by laminating a film such as a copper film on the surface of the support plate.
  • step S113 the magnetic core is stacked between the two supporting plates and fixed, and the side of the supporting plate not provided with the conductive layer is disposed opposite to each other.
  • the magnetic core 111 is stacked between the two support plates 112, and the side of the support plate 112 where the conductive layer 113 is not disposed is disposed opposite to each other, as shown in Fig. 13(B).
  • the magnetic core 111 and the two support plates 112 are fixed together by extrusion bonding or the like.
  • the groove 115 on the magnetic core 111 can be filled with the adhesive material (e.g., adhesive resin) on the surface of the support plate 112 to flow into the groove 115.
  • the groove 115 can also be filled with other insulating, non-magnetic materials, and the filling material can serve as a support.
  • Step S114 patterning the conductive layer by a patterning process to obtain a wiring segment on the surface of the support.
  • the conductive layer 113 is patterned by a patterning process such as gluing, exposure, development, etching, etc., and a desired conductive pattern is obtained on the surface of the support 112, as shown in Fig. 13(C), in which a wiring segment is actually obtained on the surface of the support.
  • the length of the wiring segment is slightly larger than the width of the core 11 between the two grooves U5.
  • step S115 the wiring segments on the surfaces of the two support plates are sequentially staggered and correspondingly electrically connected, and the thickness of the wiring segments is increased.
  • step S115 a through hole is first obtained at the end of the wiring section, and the through hole penetrates the upper and lower support plates and the conductive layer on the surface thereof and the filling material in the groove 115 in the thickness direction.
  • the through holes are to be shifted from the core 111 to prevent the electrical connection members from being connected to the magnetic core 111.
  • a conductive metal is deposited in the via hole by a deposition process such as electroplating, so that the wiring segments on the two support plates are sequentially alternately electrically connected to each other to form a continuous wiring, as shown in Fig. 13(D).
  • the conductive layer 113 provided on the surface of the support plate 112 is thin, usually only 2 to 3 ⁇ m, so it is necessary to increase the thickness of the conductive layer 113, that is, increase the thickness of the wiring segment.
  • the thickness of the conductive layer 113 can be increased while electrically connecting the wiring segments.
  • the thickness of the final wiring layer is greater than 40 microns, but this does not mean that the thickness of the wiring layer must be greater than 40 microns.
  • this embodiment can also increase the thickness of the conductive layer 113 by a physical vapor deposition process such as electroplating, magnetron sputtering, or a chemical vapor deposition process. Further, if the thickness of the conductive layer obtained in step S112 is thick, it is not necessary to increase the thickness of the conductive layer in step S115.
  • Step S116 dicing to obtain a single inductor.
  • the insulating treatment may be performed according to actual needs, that is, the surface of the micro-inductor is coated with an insulating protective layer by a coating process, but the pad region is exposed, and the insulating protective layer can be protected. Micro inductors.
  • the micro-inductor is simple in manufacturing method, and is suitable for mass production of micro-inductors, reducing the cost of micro-inductors and improving the comprehensive performance of inductance and quality factor of micro-inductors.
  • the coil includes a cylindrical support body and a wiring, and the wiring is spirally disposed on the support body to obtain a coil.
  • the coil is modularized, and when the inductor is made, the core and the coil are assembled together, thereby reducing the manufacturing cost of the micro inductor.
  • micro-inductor mentioned in the above embodiments can be used not only as an inductor but also as an antenna for communication, mobile payment and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Provided is a micro-inductor, comprising a magnetic core and a coil, wherein the coil comprises a support body and wiring; the support body is of a cylindrical structure; the wiring is arranged on the support body in a helical manner; and the magnetic core is arranged at the inner side of the support body. The micro-inductor has good comprehensive performance, is easy to manufacture and has low costs. Also provided is a manufacturing method for a micro-inductor.

Description

微型电感及其制作方法  Micro inductor and manufacturing method thereof
技术领域  Technical field
本发明涉及一种电感，具体涉及一种微型电感及其制作方法。 背景技术  The invention relates to an inductor, in particular to a miniature inductor and a manufacturing method thereof. Background technique
电感被广泛应用于电器设备。 为了适应便携式电话、 掌上电脑等电气设备向 小型化和薄型化的发展， 电感逐渐向微型化和薄型化发展。  Inductors are widely used in electrical equipment. In order to adapt to the development of miniaturization and thinning of electrical equipment such as cellular phones and PDAs, the inductance has gradually evolved toward miniaturization and thinning.
由于微型电感的体积小， 尤其是厚度较薄 （厚度在毫米级以下） ， 用于制作 体积较大的电感的传统制作方法 （直接在磁芯上绕置线圈） 无法获得这种微型电 感。 目前， 微型电感是通过沉积工艺获得， 即磁芯和线圈均是通过沉积工艺制作。 然而， 沉积工艺的制作成本较高， 尤其对于磁芯的制作成本。 因为磁芯的厚度直 接影响微型电感的综合性能， 磁芯的厚度越薄， 微型电感的综合性能越差； 但增 加磁芯的厚度， 又会增加微型电感的成本。 也就是说， 采用沉积工艺制作微型电 感无法兼顾微型电感的综合性能和加工成本。 发明内容  Due to the small size of the micro-inductors, especially the thinner thickness (less than a millimeter), the conventional manufacturing method for making a large-sized inductor (which directly winds the coil on the core) cannot obtain such a micro-inductance. At present, micro-inductors are obtained through a deposition process, that is, both the core and the coil are fabricated by a deposition process. However, the deposition process is costly to produce, especially for the cost of manufacturing the core. Because the thickness of the core directly affects the overall performance of the micro-inductor, the thinner the core, the worse the overall performance of the micro-inductor; however, increasing the thickness of the core increases the cost of the micro-inductor. That is to say, the micro-inductance produced by the deposition process cannot balance the comprehensive performance and processing cost of the micro-inductor. Summary of the invention
本发明要解决的技术问题就是针对微型电感中存在的上述缺陷， 提供一种微 型电感及其制作方法， 其综合性能优良， 而且加工成本低。  The technical problem to be solved by the present invention is to provide a micro-inductance and a manufacturing method thereof for the above-mentioned defects existing in the micro-inductor, which have excellent comprehensive performance and low processing cost.
为此， 本发明提供一种微型电感， 包括磁芯和线圈， 所述磁芯设于所述线圈的 内侧， 所述线圈包括支撑体和布线， 所述布线以螺旋方式设于所述支撑体。  To this end, the present invention provides a miniature inductor including a magnetic core and a coil, the magnetic core being disposed inside the coil, the coil including a support body and a wiring, the wiring being spirally disposed on the support body .
其中， 所述支撑体为柔性材料制作的柔性支撑体， 在所述柔性支撑体的表面 设有多段布线段， 所述柔性支撑体弯折形成空心柱状结构， 所述柔性支撑体的两 相对端部叠置， 并使所述布线段依次首尾交错电连接形成连续的所述布线， 所述 磁芯固定于所述空心柱状结构的内侧。  The support body is a flexible support body made of a flexible material, and a plurality of sections of the wiring section are disposed on the surface of the flexible support body, and the flexible support body is bent to form a hollow columnar structure, and opposite ends of the flexible support body The portions are stacked, and the wiring segments are sequentially electrically connected in a staggered manner to form a continuous wiring, and the magnetic core is fixed to the inner side of the hollow cylindrical structure.
其中， 所述支撑体为硬质材料制成的空心柱状结构的硬质支撑体， 在所述硬 质支撑体上设有凹部和凹槽， 所述凹槽以螺旋方式环绕所述硬质支撑体， 所述布 线设于所述凹槽， 所述线圈的焊盘设于所述凹部， 所述焊盘与所述布线的端部对 应电连接。  Wherein the support body is a rigid support body of a hollow columnar structure made of a hard material, and the rigid support body is provided with a recess and a groove, and the groove surrounds the hard support in a spiral manner The wiring is disposed in the recess, and a pad of the coil is disposed in the recess, and the pad is electrically connected to an end of the wiring.
其中， 所述支撑体包括第一支撑体和第二支撑体， 在所述第一支撑体和所述 第二支撑体的表面分别设有多条第一布线段和第二布线段， 所述第一布线段和所 述第二布线段通过电连接部件依次首尾交错对应电连接形成连续的布线。 其中， 所述磁芯采用铁氧体材料制作。 The support body includes a first support body and a second support body, and a plurality of first wiring segments and second wiring segments are respectively disposed on surfaces of the first support body and the second support body, First wiring segment and The second wiring segments are sequentially and end-interleaved by the electrical connection members to form a continuous wiring. Wherein, the magnetic core is made of a ferrite material.
其中， 所述磁芯采用 5MHz〜3GHz的铁氧体材料制作。  The magnetic core is made of a ferrite material of 5 MHz to 3 GHz.
其中， 所述磁芯采用 9MHz〜20MHz的铁氧体材料制作。  The magnetic core is made of a ferrite material of 9 MHz to 20 MHz.
其中， 所述磁芯的厚度大于或等于 30微米， 且小于 2. 0毫米。  Wherein, the thickness of the magnetic core is greater than or equal to 30 microns and less than 2.0 mm.
其中， 所述磁芯的厚度大于或等于 70微米， 且小于 0. 7毫米。  The thickness of the magnetic core is greater than or equal to 70 microns and less than 0.7 mm.
其中， 还包括封装层， 用于封装所述线圈和所述磁芯。  Wherein, an encapsulation layer is further included for encapsulating the coil and the magnetic core.
其中， 所述微型电感用于通讯领域的天线。  The micro inductor is used for an antenna in the communication field.
本发明还提供一种微型电感的制作方法， 包括：  The invention also provides a method for manufacturing a miniature inductor, comprising:
提供磁芯；  Providing a magnetic core;
提供线圈， 所述线圈包括支撑体和布线， 而且所述布线以螺旋方式设于所述 支撑体；  Providing a coil, the coil includes a support body and a wiring, and the wiring is spirally disposed on the support body;
将所述磁芯固定于所述线圈的内侧。  The magnetic core is fixed to the inner side of the coil.
其中， 所述线圈通过以下方式获得：  Wherein the coil is obtained by:
提供支撑体， 所述支撑体为柔性支撑体；  Providing a support body, the support body being a flexible support body;
在所述柔性支撑体的表面获得多段布线段；  Obtaining a plurality of sections of wiring segments on a surface of the flexible support;
将所述柔性支撑体弯折形成空心柱状结构， 所述柔性支撑体的端部叠置， 并 使各段所述布线段依次首尾交错电连接以形成连续的所述布线。  The flexible support body is bent to form a hollow columnar structure, the ends of the flexible support body are stacked, and the segments of the segments are sequentially electrically connected end to end to form a continuous wiring.
其中， 所述线圈通过以下方式获得：  Wherein the coil is obtained by:
提供支撑体， 所述支撑体为硬质支撑体；  Providing a support body, the support body being a rigid support body;
在所述硬质支撑体上形成凹槽和凹部， 所述凹槽以螺旋方式环绕所述硬质支 撑体的周缘设置， 所述凹部设于所述凹槽的端部；  Forming a groove and a recess on the hard support body, the groove is disposed in a spiral manner around a circumference of the rigid support body, and the concave portion is disposed at an end of the groove;
在所述凹槽内设置布线， 在所述凹部内设置焊盘， 并使所述布线的端部与对 应的所述焊盘电连接。  A wiring is provided in the recess, a pad is provided in the recess, and an end of the wiring is electrically connected to the corresponding pad.
其中，所述磁芯通过铁氧体粉末烧结成型，或者通过铁氧体板材机加工成型， 或者通过流延、 压片、 烧结、 切割工艺成型。  Wherein, the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
其中， 还包括： 利用绝缘材料将所述线圈和所述磁芯封装。  The method further includes: packaging the coil and the magnetic core with an insulating material.
另外， 本发明还提供一种微型电感的制作方法， 包括：  In addition, the present invention also provides a method for fabricating a miniature inductor, including:
提供第一部件， 所述第一部件包括第一支撑体和设于所述第一支撑体表面的 多段第一布线段；  Providing a first component, the first component comprising a first support body and a plurality of first wiring segments disposed on a surface of the first support body;
提供磁芯， 将所述磁芯固定于所述第一部件； 提供第二部件， 所述第二部件包括第二支撑体和设于所述第二支撑体表面的 多段第二布线段； Providing a magnetic core, the magnetic core being fixed to the first component; Providing a second component, the second component comprising a second support body and a plurality of second wiring segments disposed on a surface of the second support body;
所述第一部件和所述第二部件相对设置， 并将所述磁芯固定于所述第一部件 和所述第二部件之间；  The first component and the second component are disposed opposite each other, and the magnetic core is fixed between the first component and the second component;
将多段第一布线段和多段第二布线段依次首尾交错对应电连接以形成连续 的布线。  The plurality of first wiring segments and the plurality of second wiring segments are sequentially alternately electrically connected to each other to form a continuous wiring.
其中， 还包括：  Among them, it also includes:
在所述第一部件和所述第二部件之间形成支撑围堰， 所述支撑围堰沿所述线 圈的轴向设置；  Forming a support coam between the first member and the second member, the support coam being disposed along an axial direction of the coil;
在将第一布线段和第二布线段依次首尾交错对应电连接步骤中， 首先在电连 接位置形成贯穿所述第一支撑体、 所述第二支撑体和所述支撑围堰的通孔； 然后 在所述通孔内沉积导电金属， 从而将对应的所述第一布线段和所述第二布线段依 次首尾交错对应电连接。  In the step of sequentially interleaving the first wiring segment and the second wiring segment in the first and last staggered corresponding electrical connections, first forming a through hole penetrating through the first supporting body, the second supporting body and the supporting cofferdam at the electrical connection position; Then, a conductive metal is deposited in the via hole, thereby sequentially connecting the corresponding first wiring segment and the second wiring segment to the corresponding electrical connection.
其中， 所述支撑围堰与所述第一部件或第二部件为一体结构。  Wherein, the support cofferdam is integral with the first component or the second component.
其中， 所述第一支撑体和所述第二支撑体采用绝缘材料制作， 所述绝缘材料 包括聚丙烯树脂和环氧树脂。  Wherein, the first support body and the second support body are made of an insulating material, and the insulating material comprises a polypropylene resin and an epoxy resin.
其中，所述磁芯通过铁氧体粉末烧结成型，或者通过铁氧体板材机加工成型， 或者通过流延、 压片、 烧结、 切割工艺成型。  Wherein, the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
此外， 本发明还提供一种微型电感的制作方法， 包括：  In addition, the present invention also provides a method for fabricating a miniature inductor, including:
提供磁芯， 并在所述磁芯上获得贯穿其厚度的凹槽；  Providing a magnetic core, and obtaining a groove extending through the thickness thereof on the magnetic core;
提供支撑板， 在所述支撑板的表面设有导电层；  Providing a support plate, and providing a conductive layer on a surface of the support plate;
将所述磁芯叠置于两块所述支撑板之间并固定， 而且所述两块支撑板未设置 导电层的那一面相向设置；  Stacking the magnetic core between two pieces of the support plate and fixing, and the one side of the two support plates not provided with the conductive layer is disposed opposite to each other;
通过图形化工艺图形化所述导电层， 以在所述支撑体表面获得布线段； 将两个所述支撑板表面的所述布线段依次首尾交错对应电连接；  The conductive layer is patterned by a patterning process to obtain a wiring segment on the surface of the support; the wiring segments of the surfaces of the two support plates are sequentially staggered and correspondingly electrically connected;
划片， 获得单个电感。  Draw a single inductor.
其中，所述磁芯通过铁氧体粉末烧结成型，或者通过铁氧体板材机加工成型， 或者通过流延、 压片、 烧结、 切割工艺成型。  Wherein, the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
其中， 所述支撑板采用聚丙烯树脂或环氧树脂制作； 所述导电层为铜膜。 其中， 将两个所述支撑板表面的所述布线段依次首尾交错对应电连接步骤包 括： 在所述布线段的端部获得通孔， 所述通孔在厚度方向贯穿上下两块所述支撑 板及其表面的所述导电层； Wherein, the support plate is made of polypropylene resin or epoxy resin; and the conductive layer is a copper film. Wherein, the step of staggering the wiring segments of the two surface of the support plate in sequence is: Obtaining a through hole at an end of the wiring segment, the through hole penetrating the upper and lower pieces of the support plate and the conductive layer on a surface thereof in a thickness direction;
通过沉积工艺在所述通孔沉积导电金属， 从而将两个所述支撑板上的所述布 线段依次首尾交错对应电连接。  Conductive metal is deposited in the via hole by a deposition process, thereby sequentially interleaving the wiring segments on the two support plates in a corresponding electrical connection.
其中， 还包括增加所述布线段的厚度步骤， 通过电镀、 物理气相沉积工艺或 化学气相沉积工艺增加所述布线段的厚度。  Wherein, the step of increasing the thickness of the wiring segment is further included, and the thickness of the wiring segment is increased by a plating, a physical vapor deposition process or a chemical vapor deposition process.
其中， 还包括绝缘化处理步骤， 即在微型电感除所述焊盘区域外的表面涂覆 绝缘材料。  Therein, an insulating treatment step is also included, that is, the surface of the micro-inductor except the pad region is coated with an insulating material.
本发明具有以下有益效果：  The invention has the following beneficial effects:
本发明提供的微型电感， 利用支撑体和设于支撑体的布线形成线圈， 即将支 撑体设置成筒状， 布线以螺旋方式设于支撑体， 借助支撑体可以减小线圈的体积， 尤其是减小线圈的厚度， 从而在线圈总体积不变的情况下， 达到增加磁芯厚度的目 的， 从而提高微型电感的综合性能。  The micro-inductor provided by the present invention forms a coil by using a support body and a wiring provided on the support body, that is, the support body is arranged in a cylindrical shape, and the wiring is spirally arranged on the support body, and the volume of the coil can be reduced by the support body, especially The thickness of the small coil is such that the core thickness is increased for the purpose of increasing the total volume of the coil, thereby improving the overall performance of the micro-inductor.
作为本发明的一个优点， 支撑体采用柔性支撑体， 柔性支撑体韧性较强， 可 以根据实际需要弯曲成不同形状； 而且， 柔性支撑体的厚度可以达到微米级， 可 以降低微型电感的厚度； 布线以沉积方式获得， 这种布线不仅韧性较强， 能够适 应柔性支撑体的弯曲；而且厚度很薄，使得布线的厚度基本上不影响线圈的厚度， 线圈的厚度大体上等于支撑体的厚度。 此外， 以沉积方式获得布线的成本较低。  As an advantage of the present invention, the support body adopts a flexible support body, and the flexible support body has strong toughness and can be bent into different shapes according to actual needs; moreover, the thickness of the flexible support body can reach micron level, and the thickness of the micro inductor can be reduced; Obtained by deposition, the wiring is not only strong in toughness, but also capable of adapting to the bending of the flexible support; and the thickness is so thin that the thickness of the wiring does not substantially affect the thickness of the coil, and the thickness of the coil is substantially equal to the thickness of the support. In addition, the cost of obtaining wiring by deposition is low.
作为本发明的另一个优点， 磁芯通过铁氧体粉末烧结成型， 或者通过铁氧体 板材机加工成型， 或者通过流延、 压片、 烧结、 切割工艺成型， 这种加工磁芯的 制作成本远低于传统的沉积方式 （如溶胶凝胶法、 PVD 和 CVD ) ， 而且， 磁芯的 厚度对磁芯的制作成本影响不大， 因此， 可以根据实际需要调节磁芯的厚度， 从 而可以即获得综合性能优越的微型电感， 而且加工成本低。  As another advantage of the present invention, the magnetic core is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes, and the manufacturing cost of such a processed core It is much lower than the traditional deposition methods (such as sol-gel method, PVD and CVD), and the thickness of the core has little effect on the manufacturing cost of the core. Therefore, the thickness of the core can be adjusted according to actual needs, so that A micro-inductor with superior overall performance is obtained, and the processing cost is low.
当电感的体积较大时， 可以采用现有的方法制作电感。 但是， 现有大体积电 感的制作方法无法适应制作厚度在 3毫米以下， 尤其是在 2毫米以下时的微型电 感。 同时， 沉积方式主要制作几微米或十几微米的电感， 当电感厚度达到几十微 米时， 沉积方式的制作成本成倍上升。 因此， 作为本发明的一个优点， 磁芯的厚 度大于或等于 30微米， 且小于 2. 0毫米。 这个厚度区间的微型电感既可保证微 型电感的电感值、 品质因子等综合性能， 又能降低微型电感的制作成本。  When the volume of the inductor is large, the inductance can be made by an existing method. However, the existing method of manufacturing a large volume of electric power cannot be adapted to a micro-inductance having a thickness of 3 mm or less, especially 2 mm or less. At the same time, the deposition method mainly produces inductances of several micrometers or ten micrometers. When the thickness of the inductor reaches several tens of micrometers, the manufacturing cost of the deposition method is multiplied. Therefore, as an advantage of the present invention, the core has a thickness greater than or equal to 30 microns and less than 2.0 mm. The micro-inductor in this thickness interval can ensure the comprehensive performance of the inductance and quality factor of the micro-inductor, and can reduce the manufacturing cost of the micro-inductor.
作为本发明的一个优点， 为了减小微型电感的体积以及提高微型电感的综合 性能及成品率， 磁芯的厚度大于或等于 70微米， 且小于 0. 7毫米。 作为本发明的再一个优点， 磁芯采用 5MHz〜3GHZ 的铁氧体材料制作。 如用 作天线时， 可以采用 9MHz〜20 MHz的铁氧体材料制作微型电感。 5毫米。 The thickness of the magnetic core is greater than or equal to 70 microns, and less than 0.7 mm, in order to reduce the volume of the micro-inductor and to improve the overall performance and yield of the micro-inductance. As a further advantage of the present invention, the ferrite core material of 5MHz~3GH Z. When used as an antenna, a micro-inductor can be fabricated using a ferrite material of 9 MHz to 20 MHz.
本发明提供的微型电感的制作方法， 线圈包括筒状的支撑体和布线， 所述布 线以螺旋方式设于所述支撑体， 从而降低了制作成本， 而且可以提高微型电感的 综合性能。 附图说明  According to the manufacturing method of the micro-inductor of the present invention, the coil includes a cylindrical support body and a wiring, and the wiring is spirally disposed on the support body, thereby reducing the manufacturing cost and improving the overall performance of the micro-inductor. DRAWINGS
图 1为本发明实施例微型电感的纵向（垂直于线圈轴线）截面图；  1 is a cross-sectional view of a longitudinal direction (perpendicular to a coil axis) of a miniature inductor according to an embodiment of the present invention;
图 2为本发明实施例微型电感的横向（平行于线圈的轴线）截面图； 图 3为本发明实施例中硬质支撑体的结构示意图；  2 is a cross-sectional view of a lateral direction (parallel to an axis of a coil) of a micro-inductor according to an embodiment of the present invention; FIG. 3 is a schematic structural view of a rigid support body according to an embodiment of the present invention;
图 4为本发明实施例微型电感的结构示意图；  4 is a schematic structural view of a micro inductor according to an embodiment of the present invention;
图 5a为本发明实施例中柔性支撑体的结构示意图；  FIG. 5a is a schematic structural view of a flexible support body according to an embodiment of the present invention; FIG.
图 5b为本发明实施例中另一种柔性支撑体的结构示意图；  FIG. 5b is a schematic structural view of another flexible support body according to an embodiment of the present invention; FIG.
图 6a为本发明另一实施例微型电感的部分结构的立体示意图；  6a is a perspective view showing a partial structure of a miniature inductor according to another embodiment of the present invention;
图 6b为本发明再一实施例微型电感的部分结构的侧视图；  6b is a side view showing a partial structure of a micro inductor according to still another embodiment of the present invention;
图 7为本发明实施例微型电感的制作流程图；  7 is a flow chart of manufacturing a miniature inductor according to an embodiment of the present invention;
图 8为本发明实施例线圈的制作流程图；  8 is a flow chart of manufacturing a coil according to an embodiment of the present invention;
图 9为本发明实施例另一微型电感 （硬质支撑体） 的制作流程图； 图 10a为本发明实施例微型电感制作方法制作的微型电感的俯视图； 图 10b为本发明实施例微型电感制作方法的流程图， 通过该制作方法制作出 图 10a所示的微型电感；  9 is a flow chart of manufacturing a micro-inductor (hard support) according to an embodiment of the present invention; FIG. 10a is a top view of a micro-inductor fabricated by a micro-inductor manufacturing method according to an embodiment of the present invention; FIG. 10b is a micro-inductor according to an embodiment of the present invention; a flow chart of the method, by which the micro-inductor shown in FIG. 10a is fabricated;
图 11a为本发明实施例第一部件的结构示意图；  11a is a schematic structural view of a first component of an embodiment of the present invention;
图 l ib为本发明实施例第一部件和磁芯组合后的结构示意图；  Figure l ib is a schematic structural view of the first component and the magnetic core of the embodiment of the present invention;
图 11c为本发明实施例将第一部件、 支撑围堰和磁芯固定后的结构示意图； 图 l id为本发明实施例将第一布线段和第二布线段对应电连接后的结构示意 图；  11c is a schematic structural view of the first component, the support cofferdam and the magnetic core fixed according to an embodiment of the present invention; FIG. 1 id is a schematic structural view of the first wiring segment and the second wiring segment correspondingly electrically connected according to an embodiment of the present invention;
图 l ie为本发明实施例微型电感沿图 10a中 A- A方向的截面示意图； 图 12为本发明实施例批量制作微型电感的流程图；  1 is a cross-sectional view of the micro-inductor in the direction of A-A in FIG. 10a according to an embodiment of the present invention; FIG. 12 is a flow chart of mass-making a micro-inductor according to an embodiment of the present invention;
图 13为本发明实施例批量制作微型电感的方法各步骤截面示意图。 具体实施方式 为使本领域的技术人员更好地理解本发明的技术方案， 下面结合附图对本发 明提供的微型电感及其制作方法进行详细描述。 FIG. 13 is a cross-sectional view showing the steps of a method for mass-making a miniature inductor according to an embodiment of the present invention. detailed description In order to enable those skilled in the art to better understand the technical solutions of the present invention, the micro-inductors provided by the present invention and the manufacturing method thereof will be described in detail below with reference to the accompanying drawings.
如图 1和图 2所示， 微型电感包括磁芯 1、 线圈 2、 封装层 3和焊盘（图中未 示出）， 磁芯 1 设于线圈 2的内侧， 换言之， 线圈 2套设于磁芯 1 的外侧。 在线 圈 2的两个端部各设有一焊盘， 用于微型电感与其它外部器件的电连接。 封装层 3用于封装磁芯 1和线圈 2。 在某些应用领域的微型电感可以不设置封装层 3。  As shown in FIGS. 1 and 2, the micro-inductor includes a magnetic core 1, a coil 2, an encapsulation layer 3, and a pad (not shown). The magnetic core 1 is disposed inside the coil 2. In other words, the coil 2 is sleeved on The outer side of the magnetic core 1. Each of the ends of the coil 2 is provided with a pad for electrically connecting the micro-inductor to other external components. The encapsulation layer 3 is used to encapsulate the magnetic core 1 and the coil 2. In some applications, the miniature inductor can be left without the encapsulation layer 3.
如图 2所示， 线圈 2包括支撑体 21和布线 22。布线 22的厚度仅有几到几十 微米， 支撑体 21用于支撑布线 22。 支撑体 21为空心柱状结构， 如方形的筒状结 构、 圆形筒状结构或三角形筒状结构， 或者采用其它形状的筒状结构。 实际上， 支撑体 21的形状根据磁芯 1的外形确定，即支撑体 21要与磁芯 1的外形相匹配， 以使支撑体 21紧密地贴合磁芯 1。  As shown in Fig. 2, the coil 2 includes a support body 21 and a wiring 22. The wiring 22 has a thickness of only several to several tens of micrometers, and the support body 21 is for supporting the wiring 22. The support body 21 is a hollow columnar structure such as a square cylindrical structure, a circular cylindrical structure or a triangular cylindrical structure, or a cylindrical structure of other shapes. Actually, the shape of the support body 21 is determined in accordance with the outer shape of the magnetic core 1, that is, the support body 21 is to be matched with the outer shape of the magnetic core 1, so that the support body 21 closely fits the magnetic core 1.
如图 3所示， 支撑体 21为硬质材料制作的硬质支撑体。 在支撑体 21的周缘 设有凹槽 21 1和凹部 212， 凹槽 21 1 以螺旋方式环绕支撑体 21设置， 在凹槽 211 的两端部分别设置一凹部 212， 凹部 212与凹槽 21 1连通。 凹槽 21 1用于设置布 线 22， 凹部 212用于设置悍盘 4。 制作线圈 2时， 将布线 22缠绕在凹槽 21 1 内 并使布线 22的端部与焊盘 4对应电连接。 凹槽 21 1有利于控制布线的宽度和间 距， 从而提高微型电感的性能。 需说明的是， 在此提及的布线 21 1应作广义理解， 其同样可以通过沉积方式获得。  As shown in Fig. 3, the support body 21 is a rigid support made of a hard material. A groove 21 1 and a recess 212 are provided on the periphery of the support body 21, and the groove 21 1 is disposed around the support body 21 in a spiral manner. A concave portion 212 is disposed at each end of the groove 211, and the recess portion 212 and the recess 21 1 are respectively disposed. Connected. The groove 21 1 is for setting the wiring 22, and the recess 212 is for setting the tray 4. When the coil 2 is fabricated, the wiring 22 is wound in the recess 21 1 and the end of the wiring 22 is electrically connected to the pad 4 correspondingly. The recess 21 1 facilitates controlling the width and spacing of the wiring, thereby improving the performance of the micro-inductor. It should be noted that the wiring 21 1 mentioned herein should be understood in a broad sense, which can also be obtained by deposition.
需要说明的是， 支撑体 21 可以采用非导电材料制作， 也可以采用导电材料 制作。 当支撑体 21采用导电材料制作时， 导线的表面需要有绝缘层。 支撑体 21 为布线 22提供支撑和 /或定位， 使线圈 2模块化， 这不仅有助于线圈 2的存放、 运输以及装配， 而且利于微型电感的装配。 在装配时， 只要将磁芯 1固定支撑体 2的内侧。  It should be noted that the support body 21 may be made of a non-conductive material or a conductive material. When the support 21 is made of a conductive material, the surface of the wire needs to have an insulating layer. The support 21 provides support and/or positioning for the wiring 22 to modularize the coil 2, which not only facilitates the storage, transportation and assembly of the coil 2, but also facilitates the assembly of the miniature inductor. At the time of assembly, the magnetic core 1 is fixed to the inner side of the support body 2.
如图 1和图 4所示， 支撑体 21采用柔性材料制作的柔性支撑体。 布线 22设 于柔性支撑体 21的表面， 或者嵌于柔性支撑体 21的内部， 其可通过沉积方式或 覆铜膜、 图形化工艺获得。 在本实施例中， 布线 22 是由多段布线段连接而成。 在弯折柔性支撑体 21， 使其两相对端部叠置时， 布线段依次对应首尾交错电连接 形成连续的布线 22。 需要说明的是， 设于柔性支撑体 21的布线段可以倾斜设置， 如图 5a所示； 或者， 每段布线段中一部分倾斜设置， 另一部分水平设置， 如图 5b所示。 当然， 布线段的设置方式并不仅限于本说明书中提及的方式。  As shown in Figs. 1 and 4, the support body 21 is a flexible support made of a flexible material. The wiring 22 is provided on the surface of the flexible support 21 or embedded in the interior of the flexible support 21, which can be obtained by deposition or copper plating, a patterning process. In the present embodiment, the wiring 22 is formed by connecting a plurality of sections of wiring sections. When the flexible support 21 is bent so that its opposite ends are overlapped, the wiring segments are sequentially connected to the end-to-end staggered electrical connection to form a continuous wiring 22. It should be noted that the wiring segments provided on the flexible support body 21 may be disposed obliquely as shown in FIG. 5a; or, one of the segments of the wiring segments is inclined and the other portion is horizontally disposed as shown in FIG. 5b. Of course, the manner in which the wiring segments are arranged is not limited to the manner mentioned in this specification.
在制作线圈 2时， 根据磁芯 1 的外形弯折柔性支撑体 21， 使柔性支撑体 21 紧密贴合 （包裹） 磁芯 1， 并使布线段 22依次首尾交错对应电连接。 由于柔性支 撑体易于弯曲变形， 其可以根据磁芯 1的外形获得不同形状的空心柱状结构， 从 而增加线圈 2结构的多样性。 而且， 柔性支撑体的厚度易于控制在微米级， 降低 微型电感的厚度； 布线 22以沉积方式获得， 通过这种方式获得的布线 22不仅厚 度薄， 而且韧性好， 可以随柔性支撑体任意弯曲变形。 When the coil 2 is fabricated, the flexible support body 21 is bent according to the outer shape of the magnetic core 1, so that the flexible support body 21 is made The magnetic core 1 is closely fitted (wrapped), and the wiring segments 22 are sequentially staggered to correspond to electrical connections. Since the flexible support body is easily bent and deformed, it is possible to obtain hollow cylindrical structures of different shapes according to the outer shape of the magnetic core 1, thereby increasing the diversity of the structure of the coil 2. Moreover, the thickness of the flexible support is easily controlled at the micron level, and the thickness of the micro inductor is reduced; the wiring 22 is obtained by deposition, and the wiring 22 obtained in this way is not only thin, but also has good toughness and can be bent and deformed with the flexible support. .
在另一实施例中， 如图 6a和图 6b所示， 支撑体 21包括第一支撑体 21a和 第二支撑体 21b，第一支撑体 21a和第二支撑体 21b相对设置。在第一支撑体 21a 和第二支撑体 21b 的表面分别设有多条第一布线段 22a' 和第二布线段 22b' ， 而且在第一支撑体 21a和第二支撑体 21b之间设置电连接部 5， 用于将第一布线 段 22a' 和第二布线段 22b' 依次首尾交错对应电连接， 以获得连接的布线 22。 电连接部 5为导电柱或导电球， 其既用于电连接第一布线段 22a' 和第二布线段 22b' , 也可用于支撑和固定第一支撑体 21a 和第二支撑体 21b， 使第一支撑体 21a和第二支撑体 21b保持恒定的距离。  In another embodiment, as shown in Figs. 6a and 6b, the support body 21 includes a first support body 21a and a second support body 21b, and the first support body 21a and the second support body 21b are disposed opposite to each other. A plurality of first wiring segments 22a' and second wiring segments 22b' are respectively disposed on the surfaces of the first support body 21a and the second support body 21b, and electricity is disposed between the first support body 21a and the second support body 21b. The connecting portion 5 is configured to sequentially and firstly electrically interconnect the first wiring segment 22a' and the second wiring segment 22b' to obtain the connected wiring 22. The electrical connection portion 5 is a conductive post or a conductive ball for electrically connecting the first wiring segment 22a' and the second wiring segment 22b', and also for supporting and fixing the first support body 21a and the second support body 21b. The first support body 21a and the second support body 21b maintain a constant distance.
为了易于使第一布线段 22a' 和第二布线段 22b' 电连接，在第一布线段 22a ' 和第二布线段 22b' 的端部均设置连接点 23， 连接点 23 的宽度可以小于、 等 于或大于布线段的宽度。 优选地， 连接点 23 的宽度大于布线段的宽度， 这样不 仅有利于使第一布线段 22a' 、 第二布线段 22b' 与电连接部 5 的电连接， 而且 可以降低线圈 2的制作难度。 在第一支撑体 21a或第二支撑体 21b的表面还设有 焊盘 4， 即焊盘 4设置在布线 22的端部。  In order to easily electrically connect the first wiring segment 22a' and the second wiring segment 22b', connection points 23 are provided at the ends of the first wiring segment 22a' and the second wiring segment 22b', and the width of the connection point 23 may be smaller than Equal to or greater than the width of the wiring segment. Preferably, the width of the connection point 23 is larger than the width of the wiring segment, which not only facilitates the electrical connection of the first wiring segment 22a' and the second wiring segment 22b' with the electrical connection portion 5, but also reduces the difficulty in fabricating the coil 2. A pad 4 is also provided on the surface of the first support 21a or the second support 21b, that is, the pad 4 is provided at the end of the wiring 22.
本实施例的微型电感， 磁芯的厚度大于或等于 30微米， 且小于 2.0毫米。 这个厚度区间的微型电感既可保证微型电感的电感值、 品质因子等综合性能， 又 能以粉末烧结方式或用板材机加工方式或流延方式获得磁芯 1， 以降低微型电感 的制作成本。 优选地， 磁芯的厚度小于 0.7毫米， 大于或等于 70微米， 以减小 微型电感的体积以及提高微型电感的综合性能及成品率。  In the micro-inductor of this embodiment, the thickness of the magnetic core is greater than or equal to 30 μm and less than 2.0 mm. The micro-inductor of this thickness interval can ensure the comprehensive performance of the inductance and quality factor of the micro-inductor, and the magnetic core 1 can be obtained by powder sintering or by sheet machining or casting to reduce the manufacturing cost of the micro-inductor. Preferably, the thickness of the magnetic core is less than 0.7 mm and greater than or equal to 70 microns to reduce the volume of the micro-inductor and to improve the overall performance and yield of the micro-inductor.
磁芯 1 采用铁氧体材料制作。 铁氧体材料可以选用 5MHz〜3GHz 的铁氧体材 料。 如， 在通讯领域的天线可采用 9MHz〜20MHz的铁氧体材料。 磁芯 1通过铁氧 体粉末烧结成型， 或者通过铁氧体板材机加工成型， 或者通过流延、 压片、烧结、 切割工艺成型。 这种制作磁芯 1的方式的成本远低于传统的沉积方式 （如溶胶凝 胶法、 PVD、 CVD) ， 而且， 磁芯的厚度对这种制作成本影响不大。 因此， 可以根 据实际需要调节磁芯的厚度， 从而可以即获得综合性能优越的微型电感， 又降低 加工成本。 在本实施例中， 支撑体 21 的厚度可以根据需要任意设定。 综合考虑支撑体 21的强度以及微型电感的厚度， 支撑体 21的厚度选择 20〜400微米， 当然， 这 并不表示支撑体 21的厚度仅能选择 20〜400微米。 实际上， 支撑体 21的厚度可 以大于 400微米， 或小于 20微米。 The magnetic core 1 is made of a ferrite material. The ferrite material can be selected from a ferrite material of 5 MHz to 3 GHz. For example, the antenna in the communication field can use a ferrite material of 9 MHz to 20 MHz. The magnetic core 1 is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes. The cost of the method of making the magnetic core 1 is much lower than that of the conventional deposition method (such as sol-gel method, PVD, CVD), and the thickness of the magnetic core has little effect on the manufacturing cost. Therefore, the thickness of the magnetic core can be adjusted according to actual needs, so that the micro-inductor with superior comprehensive performance can be obtained, and the processing cost can be reduced. In the present embodiment, the thickness of the support body 21 can be arbitrarily set as needed. Considering the strength of the support body 21 and the thickness of the micro-inductor, the thickness of the support body 21 is selected to be 20 to 400 μm. Of course, this does not mean that the thickness of the support body 21 can be selected only from 20 to 400 μm. In practice, the thickness of the support 21 can be greater than 400 microns, or less than 20 microns.
微型电感还包括焊盘 4和封装层 3。 其中， 焊盘 4设于线圈 2的端部， 用于 微型电感与其它电子元器件的电连接。 封装层 3用于将磁芯 1和线圈 2封装。 封 装层采用绝缘材料制作， 如采用陶瓷或树脂材料制作。  The miniature inductor also includes a pad 4 and an encapsulation layer 3. The pad 4 is disposed at the end of the coil 2 for electrical connection between the micro-inductor and other electronic components. The encapsulation layer 3 is used to encapsulate the magnetic core 1 and the coil 2. The encapsulation layer is made of an insulating material, such as ceramic or resin.
需要说明的是， 悍盘 4既可设于支撑体的表面， 如设于微型电感的上表面、 下表面或在上表面、 下表面 （上表面和下表面是一个相对的概念， 是根据微型电 感的放置方式而定） ， 也可设于微型电感的端部， 如图 2所示。 但需说明的是， 当该微型电感被用于天线时， 焊盘 4不能设于电感的端部， 以避免焊盘 4影响天 线的发射和接收。  It should be noted that the tray 4 can be disposed on the surface of the support body, such as on the upper surface, the lower surface of the micro-inductor or on the upper surface and the lower surface (the upper surface and the lower surface are a relative concept, which is based on micro Depending on how the inductor is placed, it can also be placed at the end of the miniature inductor, as shown in Figure 2. However, it should be noted that when the micro-inductor is used for the antenna, the pad 4 cannot be placed at the end of the inductor to prevent the pad 4 from affecting the transmission and reception of the antenna.
本实施例提供的微型电感， 利用支撑体和设于支撑体的布线获得线圈， 即将 支撑体设置成筒状， 布线以螺旋方式设于支撑体， 从而将线圈模块化。 在制作电感 时， 将磁芯和线圈装配在一起， 从而降低了微型电感的制作成本。 或者， 在制作 线圈时， 将磁芯 1设于线圈 2的内侧。  In the micro-inductor provided in this embodiment, the coil is obtained by using the support and the wiring provided on the support, that is, the support is provided in a cylindrical shape, and the wiring is spirally provided on the support to modularize the coil. When the inductor is fabricated, the core and the coil are assembled together, thereby reducing the manufacturing cost of the micro inductor. Alternatively, the magnetic core 1 is placed inside the coil 2 when the coil is produced.
本发明还提供了微型电感的制作方法。 当线圈采用柔性线路板时， 如图 7所 示， 微型电感的制作方法包括：  The invention also provides a method of fabricating a miniature inductor. When the coil is a flexible circuit board, as shown in Fig. 7, the manufacturing method of the micro inductor includes:
步骤 S l， 提供磁芯。  Step S l, providing a magnetic core.
磁芯采用铁氧体材料制作， 铁氧体材料为 5MHz〜3GHz 的铁氧体。 对某些通 讯领域的天线可采用 9MHz〜20匪 z的铁氧体材料制作的微型电感。 磁芯通过铁氧 体粉末烧结成型， 或者通过铁氧体板材机加工成型， 或者通过流延、 压片、 烧结、 切割工艺成型。  The magnetic core is made of a ferrite material, and the ferrite material is a ferrite of 5 MHz to 3 GHz. For some antennas in the communication field, micro-inductors made of ferrite material of 9MHz~20匪z can be used. The core is sintered by ferrite powder, or formed by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes.
磁芯的厚度大于或等于 30微米， 且小于 2. 0毫米。 这个厚度区间的微型电 感既可保证微型电感的电感值、 品质因子等综合性能， 磁芯又能通过铁氧体粉末 烧结成型， 或者通过铁氧体板材机加工成型， 或者通过流延、 压片、 烧结、 切割 工艺成型， 以降低微型电感的制作成本。 优选地， 磁芯的厚度大于或等于 70 微 米， 小于 0. 7毫米， 以减小微型电感的体积以及提高微型电感的综合性能及成品 率。  The thickness of the core is greater than or equal to 30 microns and less than 2.0 mm. The micro-inductor of this thickness interval can ensure the comprehensive performance of the inductance and quality factor of the micro-inductor. The magnetic core can be sintered by ferrite powder, or formed by ferrite sheet machining, or by casting and tableting. , sintering, cutting process molding to reduce the manufacturing cost of micro-inductors. Preferably, the thickness of the magnetic core is greater than or equal to 70 micrometers, less than 0.7 millimeters, to reduce the volume of the miniature inductor and to improve the overall performance and yield of the miniature inductor.
步骤 S2， 提供线圈。  Step S2, providing a coil.
线圈包括支撑体和布线， 布线以螺旋方式设于支撑体的周缘。 如图 8所示， 线圈的具体制作过程包括： The coil includes a support body and a wiring, and the wiring is spirally disposed on a periphery of the support body. As shown in Figure 8, The specific manufacturing process of the coil includes:
步骤 S2 1， 提供板状 （片状） 的支撑体。  Step S2 1, providing a plate-like (sheet-like) support.
本实施例支撑体采用软质材料制作的柔性支撑体。  The support body of the embodiment is a flexible support made of a soft material.
步骤 S22， 在支撑体上制作多段布线段。  Step S22, forming a plurality of segments of the wiring on the support.
通过电镀等沉积方式在柔性支撑体上制作多段布线段， 或采用磁控溅射等物 理气相沉积方式， 或者采用化学气相沉积方式， 或者通过图形化柔性支撑体上的 覆铜膜方式在支撑体上制作布线段。 布线段可以在支撑体的表面制作， 也可以嵌 入支撑体的内部。  Multi-section wiring segments are formed on the flexible support by means of deposition such as electroplating, or by physical vapor deposition such as magnetron sputtering, or by chemical vapor deposition, or by means of a copper-clad film on a patterned flexible support. Make wiring segments on. The wiring segments can be formed on the surface of the support or embedded in the interior of the support.
步骤 S23 , 将支撑体的两相对端部叠置， 并使各段布线段依次首尾交错对应 电连接形成螺旋形的连续布线。  Step S23, the opposite ends of the support body are stacked, and the segments of the segments are sequentially staggered and correspondingly electrically connected to form a spiral continuous wiring.
将柔性支撑体按照磁芯的外形弯折， 并使两相对的端部叠置， 同时使各段布 线段交错对应电连接， 以在柔性支撑体的外侧形成螺旋形的连续布线。 磁芯的形 状可以是圆形、 方形、 三角形或其它形状， 弯折后的柔性支撑体的形状对应地为 圆形、 方形、 三角形或其它形状。  The flexible support is bent in accordance with the outer shape of the core, and the opposite ends are stacked while the segments are alternately electrically connected to form a spiral continuous wiring on the outer side of the flexible support. The shape of the magnetic core may be circular, square, triangular or other shape, and the shape of the flexible support after bending is correspondingly circular, square, triangular or other shape.
由步骤 S21至步骤 S23获得模块化的线圈， 其便于储存、 装配和运输。  A modular coil is obtained from step S21 to step S23, which is convenient for storage, assembly and transportation.
步骤 S3， 将磁芯设于支撑体的内侧并固定。  In step S3, the magnetic core is disposed on the inner side of the support body and fixed.
将磁芯***支撑体的内侧， 并用诸如胶粘等方式将磁芯和支撑体固定在一 起。 在另一实施例中， 磁芯是在弯折柔性支撑体的过程中嵌置于线圈的内侧。  The magnetic core is inserted into the inner side of the support body, and the magnetic core and the support body are fixed together by means such as gluing. In another embodiment, the magnetic core is embedded inside the coil during bending of the flexible support.
步骤 S4， 封装。  Step S4, encapsulation.
将磁芯和线圈封装， 利用绝缘材料将线圈和磁芯封装。 绝缘材料可以是陶瓷 或树脂等。  The core and the coil are packaged, and the coil and the core are encapsulated by an insulating material. The insulating material may be ceramic or resin or the like.
在制作线圈时， 如果未在支撑体的表面制作悍盘， 那么本实施例还包括： 在 线圈的两端部设置焊盘步骤。 在线圈的两端部设置焊盘， 用于微型电感与其它电 子元器件的电连接。  When the coil is fabricated, if the disk is not formed on the surface of the support, the embodiment further includes the step of providing a pad at both ends of the coil. Pads are provided at both ends of the coil for electrical connection of the miniature inductor to other electronic components.
另外， 当线圈采用硬质支撑板时， 如图 9所示， 微型电感的制作方法如下： 步骤 S91， 提供磁芯。  In addition, when the coil is made of a hard support plate, as shown in Fig. 9, the micro-inductor is manufactured as follows: Step S91, a magnetic core is provided.
磁芯的材料选择、 制作方式同前述实施例， 在此不再赘述。  The material selection and manufacturing method of the magnetic core are the same as those in the foregoing embodiment, and will not be described herein.
步骤 S92， 提供线圈。  Step S92, providing a coil.
线圈包括硬质支撑体和布线 （在此也可称为导线） ， 硬质支撑体为空心柱状 结构， 空心区域用于设置磁芯。 在硬质支撑体上加工出凹槽和凹部， 凹槽轴向以 螺旋方式环绕硬质支撑体设置， 凹部设于凹槽的端部并与凹槽连通。 然后通过沉 积方式在凹槽内形成布线， 在凹部内形成焊盘， 并使布线与焊盘电连接。 当不采 用沉积方式获得布线时， 可以通过将导线缠绕在硬质支撑体的凹槽内获得线圈。 The coil includes a rigid support and wiring (also referred to herein as a wire), the rigid support is a hollow cylindrical structure, and the hollow region is used to provide a magnetic core. Grooves and recesses are formed in the rigid support body, the grooves are axially disposed around the rigid support body in a spiral manner, and the recesses are provided at the ends of the grooves and communicate with the grooves. Then through the sink The integration method forms a wiring in the recess, forms a pad in the recess, and electrically connects the wiring to the pad. When wiring is obtained without deposition, the coil can be obtained by winding a wire around a groove of a rigid support.
步骤 S93， 将磁芯固定于线圈的内侧。  In step S93, the magnetic core is fixed to the inner side of the coil.
将磁芯***线圈内侧并固定， 获得微型电感。  Insert the core into the inside of the coil and fix it to obtain a miniature inductor.
在某些领域， 微型电感制作方法还包括封装步骤， 即步骤 S94， 利用绝缘材 料将所述线圈和所述磁芯封装。  In some fields, the micro-inductor fabrication method further includes a packaging step, step S94, in which the coil and the magnetic core are encapsulated with an insulating material.
下面实施例提供了另一种微型电感的制作方法， 通过该方法制作出如图 10a 所示的微型电感。 结合图 10a、 10b所示， 微型电感的制作方法包括：  The following embodiment provides another method of fabricating a miniature inductor by which a miniature inductor as shown in Figure 10a is fabricated. As shown in FIG. 10a and FIG. 10b, the manufacturing method of the micro inductor includes:
步骤 S 101 , 提供第一部件， 第一部件包括第一支撑体和设于第一支撑体表面 的多段第一布线段。  Step S101, providing a first component, the first component comprising a first support body and a plurality of first wiring segments disposed on a surface of the first support body.
第一部件 91 包括第一支撑体 91 1和设于第一支撑体表面的多段第一布线段 912。 第一支撑体 91 1 采用诸如聚丙烯树脂、 环氧树脂等绝缘材料制作。 通过涂 胶、 曝光、 显影、 刻蚀工艺形成于第一支撑体 91 1的表面第一布线段 912。 或者 通过沉积工艺在第一支撑体 91 1的表面获得第一布线段 912， 如图 1 1a所示。  The first member 91 includes a first support body 91 1 and a plurality of first wiring segments 912 provided on the surface of the first support body. The first support body 91 1 is made of an insulating material such as a polypropylene resin or an epoxy resin. The first wiring segment 912 is formed on the surface of the first support 91 1 by a coating, exposure, development, and etching process. Or the first wiring segment 912 is obtained on the surface of the first support 91 1 by a deposition process, as shown in Fig. 11a.
步骤 S 102 , 提供磁芯， 将磁芯固定于第一部件。  Step S102, providing a magnetic core to fix the magnetic core to the first component.
磁芯 1是通过铁氧体粉末烧结成型， 或者通过铁氧体板材机加工成型， 或者 通过流延、 压片、 烧结、 切割工艺成型。 磁芯的材料和厚度参见上文， 在此不再 赘述。 将磁芯固定于第一部件， 如图 l ib所示。  The magnetic core 1 is formed by sintering a ferrite powder, or by a ferrite sheet machine, or by a casting, tableting, sintering, or cutting process. The material and thickness of the magnetic core are described above and will not be described here. Fix the core to the first part, as shown in Figure l ib.
磁芯 1可以通过支撑围堰来固定。如图 1 1c所示， 在第一部件 91设置磁芯 1 一侧设置支撑围堰 8 (图 1 1 c中未示出， 在图 l i e中可以看到） ， 支撑围堰 8沿 线圈 2的轴向设置。 支撑围堰 8采用绝缘材料制作， 如聚丙烯树脂或环氧树脂或 其它填充胶 （如用于粘合各层树脂材料的胶） 。 支撑围堰 8可以通过凝固方式在 第一部件 91的表面获得， 如首先将未固化的树脂设于第一部件 91的表面， 待树 脂凝固即获得支撑围堰 8。在另一实施例中， 支撑围堰 8与第一部件 91为一体结 构， 即在加工第一支撑体 91 1时， 直接在第一支撑体 91 1上形成支撑围堰 8。  The magnetic core 1 can be fixed by supporting the cofferdam. As shown in FIG. 1 1c, a support dam 8 is provided on the side of the first component 91 where the magnetic core 1 is disposed (not shown in FIG. 1 1 c, which can be seen in FIG. 1), and the support dam 8 is along the coil 2. Axial setting. The support cofferdam 8 is made of an insulating material such as polypropylene resin or epoxy resin or other filler (such as glue for bonding various layers of resin material). The support coam 8 can be obtained by solidifying on the surface of the first member 91, such as by first providing an uncured resin on the surface of the first member 91, and obtaining a support coam 8 when the resin is solidified. In another embodiment, the support dam 8 is integrally formed with the first member 91, i.e., when the first support 91 1 is machined, the support dam 8 is formed directly on the first support 91 1 .
步骤 S 103 , 提供第二部件， 第二部件包括第二支撑体和设于第二支撑体表面 的多段第二布线段。  Step S103, providing a second component, the second component comprising a second support body and a plurality of second wiring segments disposed on a surface of the second support body.
第二部件 92包括第二支撑体 921和设于第二支撑体 921表面的多段第二布 线段 922， 第二支撑体 921采用诸如聚丙烯树脂、环氧树脂等绝缘材料材料制作。 将第二部件 92叠置于磁芯 1，从而将磁芯 1设于第一部件 91和第二部件 92之间。 第一部件 91和第二部件 92由支撑围堰 8和磁芯 1支撑， 也就是说， 支撑围堰 8 不仅用于支撑第一部件 91和第二部件 92， 而且可用于定位磁芯 1。 需说明的是， 支撑围堰 8也可以与第二部件 92为一体结构， 即支撑围堰 8与第二支撑体 921 一体加工成型。 The second member 92 includes a second support body 921 and a plurality of second wiring segments 922 provided on the surface of the second support body 921, and the second support body 921 is made of an insulating material such as polypropylene resin or epoxy resin. The second member 92 is placed on the magnetic core 1 so that the magnetic core 1 is disposed between the first member 91 and the second member 92. The first member 91 and the second member 92 are supported by the support dam 8 and the magnetic core 1, that is, the support dam 8 Not only for supporting the first member 91 and the second member 92, but also for positioning the magnetic core 1. It should be noted that the support dam 8 may also be integrated with the second member 92, that is, the support dam 8 and the second support 921 are integrally formed.
步骤 S 104 , 将第二部件叠置固定于磁芯的顶部。  Step S104, the second component is stacked and fixed on the top of the magnetic core.
将第二部件 92叠置于磁芯 1 的顶部， 即第一部件 91和第二部件 92相对设 置， 磁芯 1夹持在第一部件 91和第二部件 92之间， 如图 l id所示。  The second member 92 is placed on top of the magnetic core 1, that is, the first member 91 and the second member 92 are oppositely disposed, and the magnetic core 1 is sandwiched between the first member 91 and the second member 92, as shown in FIG. Show.
步骤 S105 ,将多段第一布线段和多段第二布线段依次首尾交错对应电连接以 形成连续的布线。  In step S105, the plurality of first wiring segments and the plurality of second wiring segments are sequentially and alternately electrically connected to form a continuous wiring.
在布线段的端部打孔， 该孔贯穿第一支撑体 911和第二支撑体 921、 第一布 线段 912、 第二布线段 922以及支撑围堰 8的厚度， 然后在该孔内沉积导电金属 形成电连接部 5， 从而将第一布线段 912和第二布线段 922对应电连接以获得连 续布线， 如图 l ie所示。  A hole is punched in an end portion of the wiring segment, the hole penetrating through the thickness of the first support body 911 and the second support body 921, the first wiring segment 912, the second wiring segment 922, and the support cofferdam 8, and then conductive is deposited in the hole The metal forms the electrical connection portion 5, thereby electrically connecting the first wiring segment 912 and the second wiring segment 922 to each other to obtain continuous wiring, as shown in FIG.
上述微型电感的制作方法的一个变型实施例， 首先分别获得第一部件 91、第 二部件 92和磁芯 1， 然后将磁芯 1叠置在第一部件 91和第二部件 92之间。  A modified embodiment of the above-described method of fabricating the micro-inductor first obtains the first member 91, the second member 92, and the magnetic core 1, respectively, and then superposed the magnetic core 1 between the first member 91 and the second member 92.
步骤 S 106， 制作封装层。  Step S106, making an encapsulation layer.
制作封装层， 封装层采用绝缘、 耐磨的材料制作， 如陶瓷、 树脂等材料。 这 一步骤可以根据实际需要选择实施。  The encapsulation layer is made of an insulating or wear-resistant material such as ceramics or resin. This step can be implemented according to actual needs.
图 11a至 l id的截面图为沿图 10a中 B- B线的截面图， 图 l ie所示截面图为 沿图 10a中 A- A线的截面图。 .  11a to l id are cross-sectional views taken along line B-B of Fig. 10a, and Fig. 1 is a cross-sectional view taken along line A-A of Fig. 10a. .
在本实施例微型电感的制作方法中， 首先将第一部件和磁芯固定， 再将第二 部件叠置固定于磁芯， 最后将设于所述第一部件的多段第一布线段和设于所述第 二部件的多段第二布线段对应电连接， 并使所述第一布线段和所述第二布线段形 成线圈， 该方法是在制作线圈的过程中将磁芯设于线圈的内侧， 以低成本地获得 厚度在 3毫米以下， 尤其是在 2毫米以下的微型电感， 而且磁芯的厚度不再受制 作工艺的限制， 使得微型电感具有优良的电感值、 品质因子等综合性能。  In the manufacturing method of the micro-inductor of the embodiment, the first component and the magnetic core are first fixed, the second component is superposed on the magnetic core, and finally the plurality of first wiring segments and the first component are disposed on the first component. And connecting the plurality of second wiring segments of the second component to the electrical connection, and forming the first wiring segment and the second wiring segment to form a coil, wherein the magnetic core is disposed on the coil during the process of fabricating the coil On the inner side, a micro-inductor having a thickness of 3 mm or less, especially 2 mm or less, is obtained at a low cost, and the thickness of the magnetic core is no longer limited by the manufacturing process, so that the micro-inductor has excellent comprehensive performance such as inductance value and quality factor. .
此外， 本发明还提供一种批量制作微型电感的方法， 如图 12和图 13所示， 微型电感的制作方法包括：  In addition, the present invention also provides a method for mass-making a miniature inductor. As shown in FIG. 12 and FIG. 13, a method for fabricating a miniature inductor includes:
步骤 S l l l， 提供磁芯， 并在磁芯上获得贯穿其厚度的凹槽。  Step S l l l, providing a magnetic core, and obtaining a groove extending through the thickness thereof on the magnetic core.
利用铁氧体制作磁芯 111， 其通过铁氧体粉末烧结成型， 或者通过铁氧体板 材机加工成型， 或者通过流延、 压片、 烧结、 切割工艺成。 在磁芯 111上加工出 贯穿其厚度的凹槽 115 , 两个凹槽 115之间的间距等于所要加工的微型电感中磁 芯的宽度， 如图 13 (A) 所示。 The magnetic core 111 is made of ferrite, which is formed by sintering of ferrite powder, or by ferrite sheet machining, or by casting, tableting, sintering, and cutting processes. A groove 115 is formed in the core 111 through the thickness thereof, and the distance between the two grooves 115 is equal to the magnetic field of the micro inductor to be processed. The width of the core is shown in Figure 13 (A).
步骤 S112， 提供支撑板， 在支撑板的表面设有导电层。  Step S112, providing a support plate, and providing a conductive layer on the surface of the support plate.
支撑板 112釆用聚丙烯树脂或环氧树脂等绝缘树脂材料制作， 支撑板 112的 厚度可以根据需要任意设定， 本实施例采用 20〜30微米厚的支撑板 112。设于支 撑板 112表面的导电层 113通过覆膜的方式获得， 如将铜膜覆在支撑板的表面。  The support plate 112 is made of an insulating resin material such as polypropylene resin or epoxy resin, and the thickness of the support plate 112 can be arbitrarily set as needed. In this embodiment, the support plate 112 is 20 to 30 μm thick. The conductive layer 113 provided on the surface of the support plate 112 is obtained by laminating a film such as a copper film on the surface of the support plate.
步骤 S113, 将磁芯叠置于两块支撑板之间并固定， 而且支撑板未设置导电层 的那一面相向设置。  In step S113, the magnetic core is stacked between the two supporting plates and fixed, and the side of the supporting plate not provided with the conductive layer is disposed opposite to each other.
将磁芯 111叠置于两块支撑板 112之间， 而且支撑板 112未设置导电层 113 的那一面相向设置， 如图 13 (B) 。 通过挤压粘合等方式将磁芯 111和两块支撑 板 112固定在一起。在挤压粘合过程中，磁芯 111上的凹槽 115能够被支撑板 112 表面的粘合材料 （如粘合树脂） 流入凹槽 115而将其填充。 当然， 凹槽 115也可 以采用其它绝缘、 非导磁的材料填充， 填充材料可以起到支撑作用。  The magnetic core 111 is stacked between the two support plates 112, and the side of the support plate 112 where the conductive layer 113 is not disposed is disposed opposite to each other, as shown in Fig. 13(B). The magnetic core 111 and the two support plates 112 are fixed together by extrusion bonding or the like. In the extrusion bonding process, the groove 115 on the magnetic core 111 can be filled with the adhesive material (e.g., adhesive resin) on the surface of the support plate 112 to flow into the groove 115. Of course, the groove 115 can also be filled with other insulating, non-magnetic materials, and the filling material can serve as a support.
步骤 S114, 通过图形化工艺图形化导电层， 以在支撑体表面获得布线段。 通过涂胶、 曝光、 显影、 蚀刻等图形化工艺图形化导电层 113， 在支撑体 112 表面获得所需的导电图形， 如图 13 (C) ， 实际上是在支撑体表面获得了布线段。 布线段的长度略大于两个凹槽 U5之间磁芯 11〗的宽度。  Step S114, patterning the conductive layer by a patterning process to obtain a wiring segment on the surface of the support. The conductive layer 113 is patterned by a patterning process such as gluing, exposure, development, etching, etc., and a desired conductive pattern is obtained on the surface of the support 112, as shown in Fig. 13(C), in which a wiring segment is actually obtained on the surface of the support. The length of the wiring segment is slightly larger than the width of the core 11 between the two grooves U5.
步骤 S115, 将两个支撑板表面的布线段依次首尾交错对应电连接， 并增加布 线段的厚度。  In step S115, the wiring segments on the surfaces of the two support plates are sequentially staggered and correspondingly electrically connected, and the thickness of the wiring segments is increased.
在步骤 S115 中， 首先在布线段的端部获得通孔， 通孔在厚度方向贯穿上下 两块支撑板及其表面的导电层以及凹槽 115内的填充材料。 通孔要与磁芯 111错 开， 以避免电连接部件与磁芯 111连接。 然后通过电镀等沉积工艺在通孔内沉积 导电金属， 从而将两个支撑板上的布线段依次首尾交错对应电连接， 形成连续的 布线， 如图 13 (D) 所示。  In step S115, a through hole is first obtained at the end of the wiring section, and the through hole penetrates the upper and lower support plates and the conductive layer on the surface thereof and the filling material in the groove 115 in the thickness direction. The through holes are to be shifted from the core 111 to prevent the electrical connection members from being connected to the magnetic core 111. Then, a conductive metal is deposited in the via hole by a deposition process such as electroplating, so that the wiring segments on the two support plates are sequentially alternately electrically connected to each other to form a continuous wiring, as shown in Fig. 13(D).
需要说明的是， 从成本考虑， 设于支撑板 112表面的导电层 113较薄， 通常 仅有 2〜3微米， 因此需要增加导电层 113 的厚度， 即增加布线段的厚度。 在电 连接布线段的同时可以增加导电层 113的厚度。 结合电感的性能， 最终布线层的 厚度大于 40微米， 但这并不表示布线层的厚度必须大于 40微米。 当然， 本实施 例还可通过电镀、 磁控溅射等物理气相沉积工艺或化学气相沉积工艺增加导电层 113的厚度。 另外， 如果在步骤 S112中获得导电层的厚度较厚， 在步骤 S115中 就不需要增加导电层的厚度。  It should be noted that, from the viewpoint of cost, the conductive layer 113 provided on the surface of the support plate 112 is thin, usually only 2 to 3 μm, so it is necessary to increase the thickness of the conductive layer 113, that is, increase the thickness of the wiring segment. The thickness of the conductive layer 113 can be increased while electrically connecting the wiring segments. In combination with the performance of the inductor, the thickness of the final wiring layer is greater than 40 microns, but this does not mean that the thickness of the wiring layer must be greater than 40 microns. Of course, this embodiment can also increase the thickness of the conductive layer 113 by a physical vapor deposition process such as electroplating, magnetron sputtering, or a chemical vapor deposition process. Further, if the thickness of the conductive layer obtained in step S112 is thick, it is not necessary to increase the thickness of the conductive layer in step S115.
步骤 S116， 划片， 获得单个电感。 沿着凹槽位置 （图 13 ( D ) 中箭头所指位置） 划片， 获得单个电感， 即获得 产品 Step S116, dicing to obtain a single inductor. Draw a piece along the groove position (the position indicated by the arrow in Figure 13 (D)) to obtain a single inductor, that is, obtain the product
在步骤 S 1 15之后， 步骤 S 1 16之前也可以根据实际需要进行绝缘化处理， 即 通过涂覆工艺在微型电感的表面涂覆绝缘保护层， 但将焊盘区域露出， 绝缘保护 层可以保护微型电感。  After step S1 15 , before the step S 16 16 , the insulating treatment may be performed according to actual needs, that is, the surface of the micro-inductor is coated with an insulating protective layer by a coating process, but the pad region is exposed, and the insulating protective layer can be protected. Micro inductors.
这种微型电感的制作方法简单， 适于批量生产微型电感， 降低微型电感的成 本以及提高微型电感的电感值、 品质因子等综合性能。  The micro-inductor is simple in manufacturing method, and is suitable for mass production of micro-inductors, reducing the cost of micro-inductors and improving the comprehensive performance of inductance and quality factor of micro-inductors.
本实施例提供的微型电感的制作方法， 线圈包括筒状的支撑体和布线， 所述 布线以螺旋方式设于所述支撑体， 从而获得线圈。 即将线圈模块化， 制作电感时， 将磁芯和线圈装配在一起， 从而降低了微型电感的制作成本。  In the manufacturing method of the micro-inductor provided in the embodiment, the coil includes a cylindrical support body and a wiring, and the wiring is spirally disposed on the support body to obtain a coil. The coil is modularized, and when the inductor is made, the core and the coil are assembled together, thereby reducing the manufacturing cost of the micro inductor.
需要说明的是， 上述实施例提及的微型电感不仅可作为电感使用， 还可作为 天线， 用于通讯、 移动支付等领域。  It should be noted that the micro-inductor mentioned in the above embodiments can be used not only as an inductor but also as an antenna for communication, mobile payment and the like.
可以理解的是， 以上实施方式仅仅是为了说明本发明的原理而采用的示例性 实施方式， 然而本发明并不局限于此。 对于本领域内的普通技术人员而言， 在不 脱离本发明的精神和实质的情况下， 可以做出各种变型和改进， 这些变型和改进 也视为本发明的保护范围。  It is to be understood that the above embodiments are merely exemplary embodiments employed to explain the principles of the invention, but the invention is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention. These modifications and improvements are also considered to be within the scope of the invention.

Claims

权 利 要 求 书 claims
1、 一种微型电感， 包括磁芯和线圈， 所述磁芯设于所述线圈的内侧， 其特征 在于， 所述线圈包括支撑体和布线， 所述布线以螺旋方式设于所述支撑体。 1. A miniature inductor, including a magnetic core and a coil. The magnetic core is provided inside the coil. It is characterized in that the coil includes a support body and wiring, and the wiring is provided in a spiral manner on the support body. .
2、 根据权利要求 1所述的微型电感， 其特征在于， 所述支撑体为柔性材料制 作的柔性支撑体， 在所述柔性支撑体的表面设有多段布线段， 所述柔性支撑体弯 折形成空心柱状结构， 所述柔性支撑体的两相对端部叠置， 并使所述布线段依次 首尾交错电连接形成连续的所述布线， 所述磁芯固定于所述空心柱状结构的内 侧。 2. The microinductor according to claim 1, characterized in that, the support body is a flexible support body made of flexible material, multiple wiring segments are provided on the surface of the flexible support body, and the flexible support body is bent A hollow columnar structure is formed, two opposite ends of the flexible support body are overlapped, and the wiring segments are electrically connected end to end in order to form a continuous wiring, and the magnetic core is fixed on the inside of the hollow columnar structure.
3、 根据权利要求 1所述的微型电感， 其特征在于， 所述支撑体为硬质材料制 成的空心柱状结构的硬质支撑体， 在所述硬质支撑体上设有凹部和凹槽， 所述凹 槽以螺旋方式环绕所述硬质支撑体， 所述布线设于所述凹槽， 所述线圈的焊盘设 于所述凹部， 所述焊盘与所述布线的端部对应电连接。 3. The microinductor according to claim 1, characterized in that the support body is a hard support body with a hollow columnar structure made of hard material, and the hard support body is provided with recesses and grooves. , the groove surrounds the hard support in a spiral manner, the wiring is provided in the groove, the soldering pad of the coil is provided in the recess, the soldering pad corresponds to the end of the wiring Electrical connection.
4、 根据权利要求 1所述的微型电感， 其特征在于， 所述支撑体包括第一支撑 体和第二支撑体， 在所述第一支撑体和所述第二支撑体的表面分别设有多条第一 布线段和第二布线段， 所述第一布线段和所述第二布线段通过电连接部件依次首 尾交错对应电连接形成连续的布线。 4. The microinductor according to claim 1, characterized in that the support body includes a first support body and a second support body, and are respectively provided on the surfaces of the first support body and the second support body. There are a plurality of first wiring segments and second wiring segments, and the first wiring segments and the second wiring segments are electrically connected in sequence and staggered end to end through electrical connection components to form a continuous wiring.
5、 根据权利要求 1所述的微型电感， 其特征在于， 所述磁芯采用铁氧体材料 制作。 5. The microinductor according to claim 1, characterized in that the magnetic core is made of ferrite material.
6、 根据权利要求 5所述的微型电感， 其特征在于， 所述磁芯采用 5MHz〜3GHz 的铁氧体材料制作。 6. The micro inductor according to claim 5, characterized in that the magnetic core is made of ferrite material of 5MHz~3GHz.
7、根据权利要求 5所述的微型电感， 其特征在于， 所述磁芯采用 9MHz〜20MHz 的铁氧体材料制作。 7. The micro inductor according to claim 5, characterized in that the magnetic core is made of ferrite material of 9MHz~20MHz.
8、 根据权利要求 5所述的微型电感， 其特征在于， 所述磁芯的厚度大于或等 于 30微米， 且小于 2. 0毫米。 8. The microinductor according to claim 5, characterized in that the thickness of the magnetic core is greater than or equal to 30 microns and less than 2.0 mm.
9、 根据权利要求 5所述的微型电感， 其特征在于， 所述磁芯的厚度大于或等 于 70微米， 且小于 0. 7毫米。 9. The micro-inductor according to claim 5, wherein the thickness of the magnetic core is greater than or equal to 70 microns and less than 0.7 mm.
10、 根据权利要求 1所述的微型电感， 其特征在于， 还包括封装层， 用于封装 所述线圈和所述磁芯。 10. The microinductor according to claim 1, further comprising an encapsulation layer for encapsulating the coil and the magnetic core.
1 1、 根据权利要求 1所述的微型电感， 其特征在于， 所述微型电感用于通讯领 域的天线。 11. The microinductor according to claim 1, characterized in that the microinductor is used as an antenna in the field of communication.
12、 一种微型电感的制作方法， 其特征在于， 包括： 12. A method of manufacturing a micro-inductor, characterized by including:
提供磁芯； Magnetic core provided;
提供线圈， 所述线圈包括支撑体和布线， 而且所述布线以螺旋方式设于所述 支撑体； A coil is provided, the coil includes a support body and wiring, and the wiring is provided in a spiral manner on the support body;
将所述磁芯固定于所述线圈的内侧。 The magnetic core is fixed to the inside of the coil.
13、 根据权利要求 12所述的微型电感的制作方法， 其特征在于， 所述线圈通 过以下方式获得： 13. The method of manufacturing a microinductor according to claim 12, characterized in that the coil is obtained in the following manner:
提供支撑体， 所述支撑体为柔性支撑体； Provide a support body, the support body being a flexible support body;
在所述柔性支撑体的表面获得多段布线段； Obtain multiple wiring segments on the surface of the flexible support body;
将所述柔性支撑体弯折形成空心柱状结构， 所述柔性支撑体的端部叠置， 并 使各段所述布线段依次首尾交错电连接以形成连续的所述布线。 The flexible support body is bent to form a hollow columnar structure, the ends of the flexible support body are overlapped, and the wiring segments are electrically connected end to end in order to form continuous wiring.
14、 根据权利要求 12所述的微型电感的制作方法， 其特征在于， 所述线圈通 过以下方式获得： 14. The method of manufacturing a microinductor according to claim 12, characterized in that the coil is obtained in the following manner:
提供支撑体， 所述支撑体为硬质支撑体； Provide a support body, the support body being a hard support body;
在所述硬质支撑体上形成凹槽和凹部， 所述凹槽以螺旋方式环绕所述硬质支 撑体的周缘设置， 所述凹部设于所述凹槽的端部； A groove and a recess are formed on the hard support body, the groove is arranged in a spiral manner around the periphery of the hard support body, and the recess is provided at an end of the groove;
在所述凹槽内设置布线， 在所述凹部内设置焊盘， 并使所述布线的端部与对 应的所述焊盘电连接。 Wiring is provided in the groove, a bonding pad is provided in the recess, and an end of the wiring is electrically connected to the corresponding bonding pad.
15、 根据权利要求 12所述的微型电感的制作方法， 其特征在于， 所述磁芯通 过铁氧体粉末烧结成型， 或者通过铁氧体板材机加工成型， 或者通过流延、压片、 烧结、 切割工艺成型。 15. The manufacturing method of micro-inductor according to claim 12, characterized in that the magnetic core is formed by sintering ferrite powder, or by machining of ferrite plate, or by casting, pressing or sintering. , cutting process forming.
16、 根据权利要求 12所述的微型电感的制作方法， 其特征在于， 还包括： 利 用绝缘材料将所述线圈和所述磁芯封装。 16. The method of manufacturing a microinductor according to claim 12, further comprising: encapsulating the coil and the magnetic core with an insulating material.
17、 一种微型电感的制作方法， 其特征在于， 包括： 17. A method of manufacturing a micro-inductor, characterized by including:
提供第一部件， 所述第一部件包括第一支撑体和设于所述第一支撑体表面的 多段第一布线段； Provide a first component, the first component including a first support body and a plurality of first wiring segments provided on the surface of the first support body;
提供磁芯， 将所述磁芯固定于所述第一部件； providing a magnetic core, fixing the magnetic core to the first component;
提供第二部件， 所述第二部件包括第二支撑体和设于所述第二支撑体表面的 多段第二布线段； Provide a second component, the second component including a second support body and a plurality of second wiring segments provided on the surface of the second support body;
所述第一部件和所述第二部件相对设置， 并将所述磁芯固定于所述第一部件 和所述第二部件之间； The first component and the second component are arranged oppositely, and the magnetic core is fixed between the first component and the second component;
将多段第一布线段和多段第二布线段依次首尾交错对应电连接以形成连续 的布线。 A plurality of first wiring segments and a plurality of second wiring segments are alternately electrically connected end-to-end in order to form a continuous wiring.
18、 根据权利要求 17所述的微型电感的制作方法， 其特征在于， 还包括： 在所述第一部件和所述第二部件之间形成支撑围堰， 所述支撑围堰沿所述线 圈的轴向设置； 18. The method of manufacturing a microinductor according to claim 17, further comprising: forming a support dam between the first component and the second component, the support dam being along the coil axial setting;
在将第一布线段和第二布线段依次首尾交错对应电连接步骤中， 首先在电连 接位置形成贯穿所述第一支撑体、 所述第二支撑体和所述支撑围堰的通孔； 然后 在所述通孔内沉积导电金属， 从而将对应的所述第一布线段和所述第二布线段依 次首尾交错对应电连接。 In the step of electrically connecting the first wiring segments and the second wiring segments in sequence, a through hole penetrating the first support body, the second support body and the support cofferdam is first formed at the electrical connection position; Then, conductive metal is deposited in the through hole, thereby electrically connecting the corresponding first wiring segments and the second wiring segments in a staggered sequence.
19、 根据权利要求 18所述的微型电感的制作方法， 其特征在于， 所述支撑围 堰与所述第一部件或第二部件为一体结构。 19. The method of manufacturing a microinductor according to claim 18, wherein the support dam and the first component or the second component are an integral structure.
20、 根据权利要求 17所述的微型电感的制作方法， 其特征在于， 所述第一支 支撑体采用绝缘材料制作， 所述绝缘材料包括聚丙烯树脂和环氧 20. The manufacturing method of micro inductor according to claim 17, characterized in that, the first The support body is made of insulating materials, including polypropylene resin and epoxy.
21、 根据权利要求 1 7所述的微型电感的制作方法， 其特征在于， 所述磁芯通 过铁氧体粉末烧结成型， 或者通过铁氧体板材机加工成型， 或者通过流延、压片、 烧结、 切割工艺成型。 21. The manufacturing method of micro-inductor according to claim 17, characterized in that the magnetic core is formed by sintering ferrite powder, or by machining of ferrite plate, or by casting, pressing, Sintering and cutting process forming.
22、 一种微型电感的制作方法， 其特征在于， 包括： 22. A method of making a micro inductor, characterized by:
提供磁芯， 并在所述磁芯上获得贯穿其厚度的凹槽； providing a magnetic core and obtaining in said magnetic core grooves throughout its thickness;
提供支撑板， 在所述支撑板的表面设有导电层； Provide a support plate, with a conductive layer provided on the surface of the support plate;
将所述磁芯叠置于两块所述支撑板之间并固定， 而且所述两块支撑板未设置 导电层的那一面相向设置； The magnetic core is stacked between the two support plates and fixed, and the sides of the two support plates that are not provided with a conductive layer are facing each other;
通过图形化工艺图形化所述导电层， 以在所述支撑体表面获得布线段； 将两个所述支撑板表面的所述布线段依次首尾交错对应电连接； The conductive layer is patterned through a patterning process to obtain wiring segments on the surface of the support body; the wiring segments on the surfaces of the two support plates are alternately electrically connected end to end in sequence;
划片， 获得单个电感。 Divide to obtain a single inductor.
23、 根据权利要求 22所述的微型电感的制作方法， 其特征在于， 所述磁芯通 过铁氧体粉末烧结成型， 或者通过铁氧体板材机加工成型， 或者通过流延、压片、 烧结、 切割工艺成型。 23. The manufacturing method of micro-inductor according to claim 22, characterized in that the magnetic core is formed by sintering ferrite powder, or by machining of ferrite plate, or by casting, pressing or sintering. , cutting process forming.
24、 根据权利要求 22所述的微型电感的制作方法， 其特征在于， 所述支撑板 采用聚丙烯树脂或环氧树脂制作； 所述导电层为铜膜。 24. The method of manufacturing a microinductor according to claim 22, wherein the support plate is made of polypropylene resin or epoxy resin; and the conductive layer is a copper film.
25、 根据权利要求 24所述的微型电感的制作方法， 其特征在于， 将两个所述 支撑板表面的所述布线段依次首尾交错对应电连接步骤包括： 25. The manufacturing method of a microinductor according to claim 24, wherein the step of electrically connecting the wiring segments on the surfaces of the two support plates in sequence includes:
在所述布线段的端部获得通孔， 所述通孔在厚度方向贯穿上下两块所述支撑 板及其表面的所述导电层； A through hole is obtained at the end of the wiring section, and the through hole penetrates the upper and lower support plates and the conductive layer on their surface in the thickness direction;
通过沉积工艺在所述通孔沉积导电金属， 从而将两个所述支撑板上的所述布 线段依次首尾交错对应电连接。 Conductive metal is deposited on the through holes through a deposition process, so that the wiring segments on the two support boards are electrically connected in sequence, staggered end to end.
26、 根据权利要求 22所述的微型电感的制作方法， 其特征在于， 还包括增加 所述布线段的厚度步骤， 物理气相沉积工艺或化学气相沉积工艺增加 所述布线段的厚度。 26. The method of manufacturing a microinductor according to claim 22, further comprising: adding In the thickness step of the wiring segment, a physical vapor deposition process or a chemical vapor deposition process increases the thickness of the wiring segment.
27、 根据权利要求 22所述的微型电感的制作方法， 其特征在于， 还包括绝缘 化处理步骤， 即在微型电感除所述焊盘区域外的表面涂覆绝缘材料。 27. The method of manufacturing a micro-inductor according to claim 22, further comprising an insulating step of coating an insulating material on the surface of the micro-inductor except for the pad area.
PCT/CN2014/000134 2013-11-04 2014-01-29 Micro-inductor and manufacturing method therefor WO2015062155A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201310537504.2A CN104616859B (en) 2013-11-04 2013-11-04 Miniature inductance and preparation method thereof
CN201310537504.2 2013-11-04
CN201410020112 2014-01-16
CN201410020112.3 2014-01-16

Publications (1)

Publication Number Publication Date
WO2015062155A1 true WO2015062155A1 (en) 2015-05-07

Family

ID=53003217

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/000134 WO2015062155A1 (en) 2013-11-04 2014-01-29 Micro-inductor and manufacturing method therefor

Country Status (1)

Country Link
WO (1) WO2015062155A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19707177A1 (en) * 1997-02-22 1998-09-03 Inotech Kunststofftechnik Gmbh Choke coil inductance for electric circuit
CN2435824Y (en) * 2000-07-20 2001-06-20 佳叶科技有限公司 Packed chip inductance
US20020013005A1 (en) * 1996-11-19 2002-01-31 Samsung Electronics Co., Ltd. Inductor for semiconductor device and method of making the same
US6531945B1 (en) * 2000-03-10 2003-03-11 Micron Technology, Inc. Integrated circuit inductor with a magnetic core
CN101322201A (en) * 2005-10-05 2008-12-10 Nxp股份有限公司 Multi-layer inductive element for integrated circuit
CN101356688A (en) * 2006-02-08 2009-01-28 胜美达集团株式会社 Coil for antenna
CN202601367U (en) * 2012-05-30 2012-12-12 天津信达宇通电器有限公司 Inductance device of bidirectional adjustable magnetic core
CN103000537A (en) * 2011-09-15 2013-03-27 万国半导体股份有限公司 Wafer-level package structure and production method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020013005A1 (en) * 1996-11-19 2002-01-31 Samsung Electronics Co., Ltd. Inductor for semiconductor device and method of making the same
DE19707177A1 (en) * 1997-02-22 1998-09-03 Inotech Kunststofftechnik Gmbh Choke coil inductance for electric circuit
US6531945B1 (en) * 2000-03-10 2003-03-11 Micron Technology, Inc. Integrated circuit inductor with a magnetic core
CN2435824Y (en) * 2000-07-20 2001-06-20 佳叶科技有限公司 Packed chip inductance
CN101322201A (en) * 2005-10-05 2008-12-10 Nxp股份有限公司 Multi-layer inductive element for integrated circuit
CN101356688A (en) * 2006-02-08 2009-01-28 胜美达集团株式会社 Coil for antenna
CN103000537A (en) * 2011-09-15 2013-03-27 万国半导体股份有限公司 Wafer-level package structure and production method thereof
CN202601367U (en) * 2012-05-30 2012-12-12 天津信达宇通电器有限公司 Inductance device of bidirectional adjustable magnetic core

Similar Documents

Publication Publication Date Title
JP6639626B2 (en) Coil component and method of manufacturing the same
US8466764B2 (en) Low profile layered coil and cores for magnetic components
JP3800540B2 (en) Inductance element manufacturing method, multilayer electronic component, multilayer electronic component module, and manufacturing method thereof
US7791445B2 (en) Low profile layered coil and cores for magnetic components
US8378777B2 (en) Magnetic electrical device
US8234778B2 (en) Substrate inductive devices and methods
CN106469603B (en) Coil electronic component
US20120119863A1 (en) Common mode filter and method of manufacturing the same
CN109148106B (en) Coil assembly and method of manufacturing the same
CN108573791B (en) Coil electronic component and method for manufacturing same
KR20120023700A (en) Low profile layered coil and cores for magnetic components
WO2021043343A2 (en) Integrally formed inductor and manufacturing method therefor
US10804025B2 (en) Coil component and method for fabricating the same
KR20170073159A (en) Coil component
US20140176278A1 (en) Inductor and manufacturing method thereof
CN105684111B (en) The manufacture method and electronic component of electronic component
US20160307693A1 (en) Electronic component and manufacturing method thereof
JP6716867B2 (en) Coil component and manufacturing method thereof
US20190074127A1 (en) Mounting substrate
KR20170073554A (en) Coil component
JP2005044952A (en) Common mode choke coil and manufacturing method thereof, and common mode choke coil array
JP2003257744A (en) Magnetic element, manufacturing method thereof, and power-supply module using the same
WO2015062155A1 (en) Micro-inductor and manufacturing method therefor
US7040014B2 (en) Method of producing a helical coil chip
US11051406B2 (en) Component carrier with integrated inductor and manufacturing method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14858303

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14858303

Country of ref document: EP

Kind code of ref document: A1