WO2015046328A1 - Procédé de fabrication de capteur de vitesse de flux/débit thermique, et capteur de vitesse de flux/débit thermique - Google Patents

Procédé de fabrication de capteur de vitesse de flux/débit thermique, et capteur de vitesse de flux/débit thermique Download PDF

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Publication number
WO2015046328A1
WO2015046328A1 PCT/JP2014/075424 JP2014075424W WO2015046328A1 WO 2015046328 A1 WO2015046328 A1 WO 2015046328A1 JP 2014075424 W JP2014075424 W JP 2014075424W WO 2015046328 A1 WO2015046328 A1 WO 2015046328A1
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WIPO (PCT)
Prior art keywords
substrate
flow rate
flow velocity
velocity detection
detection unit
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Application number
PCT/JP2014/075424
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English (en)
Japanese (ja)
Inventor
林泰正
Original Assignee
林泰正
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Publication date
Application filed by 林泰正 filed Critical 林泰正
Priority to KR1020167010915A priority Critical patent/KR101786741B1/ko
Publication of WO2015046328A1 publication Critical patent/WO2015046328A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/696—Circuits therefor, e.g. constant-current flow meters

Definitions

  • the present invention relates to a flow velocity / flow rate sensor manufacturing method and a flow velocity / flow rate sensor for measuring a flow velocity and a flow rate of a fluid, and more particularly, to a heater element that generates heat by a supply current and a temperature from the heater element that changes according to the flow velocity.
  • the present invention relates to a method of manufacturing a thermal flow rate / flow rate sensor and a flow rate / flow rate sensor for manufacturing a flow rate detection unit having a temperature measuring element to be detected and an air temperature measurement element for measuring an air temperature by using mounting parts.
  • a thermal flow rate / flow rate sensor utilizes the fact that the amount of heat from the heater element deprived by the fluid changes depending on the fluid flow rate. The flow rate is measured and the flow rate of the fluid is calculated from the result.
  • the flow rate / flow rate sensor generally includes a temperature compensation element so that the influence of the change in temperature on the output (heat amount) from the flow rate detection unit can be compensated when the temperature of the fluid to be detected for the flow rate changes. ing.
  • Q (a + bu) (T ⁇ Ta) Formula (1)
  • Q is the amount of heat generated by the heating element
  • u is the flow velocity
  • T is the temperature of the heating element
  • Ta is the temperature of the surrounding fluid
  • a and b are constants, which depend on the material and structure of the heating element.
  • FIG. 12 shows Conventional Example 1.
  • a booster circuit 60 In order to cause the wind speed detection sensor to self-heat, a booster circuit 60, a constant current circuit 61, a current-voltage conversion circuit 62, and the like are required as a control circuit for the wind speed detection element 63. is there.
  • the wind speed detecting element 63 is not necessarily required when the platinum resistor is used. Further, in the case of the wind speed detecting element 63 of the conventional example 1, it is converted into a voltage value by using a bridge circuit, this voltage value is amplified, and the flow velocity value is calculated by the wind speed value converting section 64 of the computer processing unit. Yes.
  • the reference resistor 65 and the air temperature detection element 66 measure the temperature of the surrounding fluid.
  • the bridge circuit needs to be adjusted at the time of shipment or installation. Further, for the constant current circuit 61 and the current-voltage conversion circuit 62, it is necessary to perform operations such as adjustment of individual differences in circuit characteristics and recording to a computer.
  • elements suitable as elements for detecting the wind speed are limited parts or custom-made items.
  • the characteristics are standardized, but most of them are provided by custom-made products, which causes high costs.
  • the temperature measuring element for detecting the heating element temperature T and the heater as the heat source are composed of the same element, which is also one of the causes of high cost.
  • FIG. 75 is a reference resistance
  • 76 is an air temperature detecting element
  • 74 is a wind speed value conversion (such as a microcomputer).
  • the wind speed detecting element 73 for detecting the heating element temperature T and the heater 71 are thermally connected directly. That is, they are physically joined.
  • the circuit configuration shown in FIG. 13 is compared with the circuit configuration shown in FIG. 12, the circuit configuration shown in FIG. 13 is simplified. Therefore, the cost can be reduced correspondingly.
  • the thing of the prior art example 2 shown in FIG. 14 is a prototype in which the inventor constituted the flow velocity detection part by the element (the heater element 80 and the temperature measuring element 81) with a lead wire, and the heater element 80 and the temperature measuring element 81 is a flow velocity / flow rate sensor having a structure separated from 81.
  • a heater element 80 connected to a heater power supply 82 for heating and a temperature measuring element 81 for measuring the temperature of heat transmitted from the heater element 80 are connected via a lead wire 83. ing.
  • the heat conduction speed of the heat conducted from the heater element 80 to the temperature measuring element 81 via the lead wire 83 is poor, and it takes time to increase the temperature of the temperature measuring element 81 once the heat is deprived.
  • the heat conduction speed fluctuates depending on the connection position of the lead wire 83 and the amount of solder at the time of soldering for connection, which is far from cost reduction and practical use.
  • a flow rate detection unit and an air temperature measurement unit are provided on a single substrate such as a silicon substrate or other electronic substrate, and the flow rate detection unit must be heated by a heater. . Therefore, when the flow velocity detection unit and the temperature measurement unit are provided on a single substrate, the temperature measurement unit is affected by the heat from the flow velocity detection unit that travels through the substrate and cannot accurately measure the temperature. There is a problem.
  • a ceramic substrate 90 having low thermal conductivity is used as a substrate member of the thermal wind speed sensor, and one end side of the ceramic substrate 90 is used.
  • the wind speed detecting sensor RH and the temperature measuring sensor RT which is a temperature compensating sensor, are directly formed on the other end side by printing or vapor deposition of a platinum material.
  • the temperature measurement sensor RT is separated from the wind speed detection sensor RH transmitted through the ceramic substrate 90. It is configured so as not to be affected by the heat of as much as possible.
  • Reference numeral 91 denotes a hybrid IC.
  • the thermistor (fluid temperature detecting element) 102 and the flow rate detecting portion of the thermal flow rate / flow rate sensor 100 may be damaged by an external impact
  • the protector 101 that protects the thermistor 102 is integrated as a unit.
  • the thing of the structure integrated as a unit is already integrated as a unit at the time of pipe attachment, and is not manufactured by integral molding.
  • a protective guard such as the protector 101 is necessary, and this protective guard is generally manufactured as a separate part and must be combined.
  • Reference numeral 103 denotes a detection passage
  • 104 denotes a circuit case
  • 105 denotes a structure.
  • the element for detecting the flow velocity described in the conventional example 1 shown in FIG. 12 has a size of several mm to several tens of mm. It is necessary to extend and fix the lead wire, and it is not possible to use an automatic assembly machine (automatic mounting machine) such as an electronic component automatic mounting machine that is generally used. For this reason, there is only a method for manually assembling or creating a new automatic assembly machine as a custom-made product and using it, which also causes high costs.
  • the wind speed detecting element 63 of the conventional example 1 uses a temperature measuring element such as a platinum resistor or a thermistor in the wind speed detecting section, and is supported by a thin copper wire attached to the temperature measuring element.
  • a temperature measuring element such as a platinum resistor or a thermistor in the wind speed detecting section
  • the structure supported by the copper wire is weak against mechanical impacts, and moreover, because it is a metal, it is not suitable for long-term continuous use due to damage caused by rust or corrosion. Therefore, in order to improve the durability, there is an option of thickening the wind speed detecting element 63 and the attached copper wire, but in this case, the response is poor and the performance deteriorates, so it is not realistic. There's a problem.
  • the circuit configuration for detecting the heating element temperature T is simplified, compared with the circuit configuration shown in FIG. 12, and the cost is reduced.
  • the wind speed detecting element 73 for detecting the heating element temperature T and the heater 71 are directly connected thermally. That is, if the physical connection between the wind speed detection element 73 and the heater 71 is not constant to some extent, the difference in solids increases, and the labor for fixing adjustment as a flow velocity / flow rate sensor increases.
  • the constant a and the constant b must be obtained for each individual, as is apparent from the King equation shown in the above equation (1). Therefore, there is a problem that the labor for product adjustment increases and the compatibility of the detection unit is also poor.
  • MEMS Micro Electric Mechanical System
  • the heater element 80 and the temperature measuring element 81 are separated and the heater element 80 and the temperature measuring element 81 are connected via the lead wire 83.
  • the heat conduction speed when heat is conducted from the heater element 80 to the temperature measuring element 81 through 83 is poor, and it takes time to increase the temperature of the temperature measuring element 81 once the heat is deprived.
  • the heat conduction speed varies depending on the connection position of the lead wire 83 and the amount of solder at the time of soldering for connection.
  • a lead wire is preferably used. Although it is necessary to reduce the amount of heat dissipated through the lead wire by making it thin, there is a problem that if the lead wire is made thin, it becomes weak against mechanical shock.
  • the wind speed in the duct is measured, and there is a problem that it can be used only when the airflow is unidirectional. Further, since a distance is provided between the wind speed detection sensor RH and the temperature measurement sensor RT, the air in which the wind speed detection sensor RH and the temperature measurement sensor RT are in contact particularly in the case of a slight wind speed. The effect on measurement accuracy due to different conditions must be taken into account. Further, since it is assumed that the hybrid IC 91 is arranged at the center of the ceramic substrate 90, there is a problem that it is necessary to consider the influence of the turbulence of the air flow by the hybrid IC 91 on the measurement value. In addition, if the distance between RH and RT is shortened, the influence of heat conduction cannot be ignored, so there is a problem that there is a limit to downsizing.
  • the present invention provides a method of manufacturing a thermal flow rate / flow rate sensor and a thermal flow rate / flow rate sensor, and a heat generation part (heater element) for detecting a flow rate and the temperature of heat from the heat generation unit.
  • a single plate-like substrate is used as the substrate for the flow velocity detection unit for measuring the flow rate, and a general-purpose substrate manufacturing apparatus is used, and further, electronic components mounted on the flow velocity detection unit use a general-purpose automatic mounting machine.
  • the first object is to form a flow velocity detection unit by mounting general-purpose surface mount components, and by providing a space between the flow velocity detection unit and the air temperature measurement unit, the flow velocity detection unit
  • the second object is to reduce heat conduction from the heat generating part to the temperature measuring part.
  • the third effect is to reduce the influence of the heat from the flow rate detection unit on the temperature measurement unit.
  • the purpose is.
  • by providing a guard that protects the flow velocity detector that has a structure protruding from the substrate it is possible to prevent damage to the thermal flow velocity / flow sensor due to external impact and to prevent burns due to erroneous contact of the flow velocity detector.
  • the purpose of 4 is.
  • the invention according to claim 1 is a fluid flow velocity comprising a heater element that generates heat by a supply current, and a flow velocity detector having a temperature measuring element that detects the temperature of the heat from the heater element that changes according to the flow velocity. And a method of manufacturing a thermal flow rate / flow rate sensor for measuring the flow rate,
  • the heater element and the temperature measuring element are general-purpose surface-mount components.
  • a board part for mounting the flow rate detector is formed on a single plate of the thermal flow rate / flow rate sensor, and the flow rate detector is formed on this board part.
  • a fluid flow velocity comprising a heater element that generates heat by a supply current, and a flow velocity detector having a temperature measuring element that detects the temperature of the heat from the heater element that varies according to the flow velocity.
  • a method of manufacturing a thermal flow rate / flow rate sensor for measuring the flow rate The heater element and the temperature measuring element are general-purpose surface-mount components, and extend integrally from the main part of the board, which is the main part of this board, to the center of one end of the single plate-like board of the thermal flow rate / flow rate sensor.
  • the elongated flow rate detection unit support is formed integrally with the substrate, and the substrate part on which the flow rate detection unit is mounted is formed at the tip of the flow rate detection unit support.
  • a heater element and a temperature measuring element are formed by forming a circuit pattern for the detection unit and mounting the heater element and the temperature measuring element adjacent to each other on the surface mounting portion of the substrate portion on which the flow velocity detection unit is mounted.
  • the thermal flow velocity / flow rate sensor formed using a general-purpose substrate manufacturing device so that the flow velocity detection portion formed at the surface mounting location is supported by the main portion of the substrate by the flow velocity detection portion support portion. It is a manufacturing method.
  • a fluid flow velocity comprising a heater element that generates heat by a supply current, and a flow velocity detection unit that includes a temperature measuring element that detects the temperature of heat from the heater element that varies according to the flow velocity.
  • the heater element and the temperature measuring element are general-purpose surface-mount components, and from a single substrate of the thermal flow rate / flow rate sensor, the belt-shaped outer peripheral portion constituting the main part of the substrate, which is the main part of the substrate, A pair of elongated flow velocity detecting portion support portions integrally formed with the substrate and extending integrally from the main portion of the substrate constituting the belt-shaped outer peripheral portion toward the center, and the pair of flow velocity detection portion support portions A substrate portion on which the flow velocity detection unit supported at the tip is mounted integrally with the main portion of the substrate, a circuit pattern for the flow velocity detection portion is formed on the substrate portion on which the flow velocity detection portion is mounted, and the flow velocity detection portion is A heater element is mounted on one surface of the surface mounting part of the board part to be mounted, and the temperature measuring element is placed opposite to the surface mounting part of the heater element, and the surface mounting part of the board part on which the flow velocity detector is mounted.
  • the main part of the substrate constituting the belt-shaped outer peripheral part is used as a guard part for protecting the flow rate detection part, and a space is provided around the flow rate detection part.
  • a flow rate detector having a heater element that generates heat by a supply current, and a temperature measuring element that detects a temperature of heat from the heater element that changes in accordance with the flow rate, and measures the temperature.
  • the heater element, the temperature measuring element, and the temperature measuring element are general-purpose surface-mount components.
  • the main part of the board which is the main part of this board, is formed on both sides of one end of a single plate of the thermal flow rate / flow rate sensor.
  • the elongated flow velocity detection portion support portion and the temperature measurement portion support portion that are integrally extended from each other are separated from each other and formed integrally with the substrate, and the flow velocity detection is performed at the tip of the flow velocity detection portion support portion.
  • a heater element is formed by forming a circuit pattern for an air temperature measurement part on the board part and mounting the heater element and the temperature measurement element adjacent to each other on the surface mounting part of the board part on which the flow velocity detection part is mounted.
  • the temperature sensor A flow rate detection unit formed by contact connection is formed, an air temperature measurement unit formed by mounting an air temperature measurement element is formed on the surface mounting portion of the substrate portion on which the air temperature measurement unit is mounted, and the substrate portion on which the flow rate detection unit is mounted A surface mounting location, a support for a flow velocity detection unit that integrally extends from the surface mounting location to the main part of the substrate, a surface mounting location of the board portion on which the air temperature measurement unit is mounted, and from the surface mounting location to the main part of the substrate.
  • the air temperature measuring element and the air temperature measuring element respectively formed at the respective surface mounting locations by cutting the peripheral part of the substrate, leaving the temperature measuring element supporting part extending integrally with the air temperature detecting element, respectively.
  • the support part and the temperature measurement element support part are each formed in a structure supported on the main part of the substrate, and a space is provided around the flow rate detection part and the temperature measurement element.
  • the flow rate sensor formed by using a general-purpose substrate manufacturing apparatus such that the structure in which a plate-shaped substrate main portion.
  • the flow velocity detection unit is mounted by arranging a temperature measuring element and a pair of heater elements opposed to each other across the temperature measuring element. By doing so, the heater element and the temperature measuring element are thermally connected directly.
  • a flow rate detector having a heater element that generates heat by a supply current, and a temperature measuring element that detects a temperature of heat from the heater element that changes in accordance with the flow rate, and measures the temperature.
  • the heater element, temperature measuring element, and air temperature measuring element are general-purpose surface-mount components, and a belt-shaped structure that forms the main part of this board from a single plate-like board of the thermal flow rate / flow rate sensor
  • the outer peripheral part is formed integrally with the substrate, and a slender flow rate detection part support part integrally extending from the main part of the substrate is formed integrally with the substrate at the central part of one end of the substrate.
  • the substrate part for mounting the flow velocity detection part is formed so as to be positioned at the center part of the belt-like outer peripheral part, and the circuit pattern for the flow velocity detection part is formed on this substrate part, A circuit pattern for the air temperature measurement unit is formed on the surface, and the heater element and the temperature measurement element are mounted adjacent to each other on the surface mounting portion of the board portion on which the flow velocity detection unit is mounted.
  • an air temperature measuring unit is formed by mounting an air temperature measuring element on the surface mounting part of the belt-shaped outer periphery, and the surface mounting part of the substrate part on which the flow velocity detecting part is mounted and the surface mounting part
  • the flow rate detection unit formed at the surface mounting location is cut for the flow rate detection unit by cutting the peripheral part of the substrate, leaving the support for the flow rate detection unit extending integrally to the main part of the substrate and the belt-shaped outer periphery.
  • the invention according to claim 7 is the invention according to any one of claims 1 to 6, wherein the thermal flow rate / flow rate sensor is a thermal flow rate / flow rate sensor formed using a general-purpose automatic mounting machine. Is the method.
  • a flow rate detector having a heater element that generates heat by a supply current, and a temperature measuring element that detects a temperature of heat from the heater element that changes in accordance with the flow rate, and an air temperature are measured.
  • thermo flow rate / flow rate sensor that measures the flow rate and flow rate of a fluid consisting of an air temperature measurement unit having an air temperature measurement element
  • a single plate-like substrate of the thermal flow rate / flow rate sensor a substrate part on which the flow rate detection unit formed on this substrate is mounted, a circuit pattern for the flow rate detection unit formed on this substrate part, and a flow rate detection Mounting of the heater element, which is a general-purpose surface-mounted component mounted on one surface of the surface-mounted part of the board part on which the part is mounted, and the surface of the board part for mounting the flow velocity detection unit facing the surface-mounted part of the heater element
  • Flow velocity detection formed integrally with the substrate at the peripheral part of the board excluding the temperature measuring element which is a general-purpose surface-mounted component mounted on the other side of the location, and the surface mounting location of the board portion where the flow velocity detection unit is mounted
  • the substrate part at the surface mounting location is mounted by mounting and mounting the heater support element and the temperature measuring element constituting the flow velocity detection portion on both surface mounting locations
  • a fluid flow velocity comprising a heater element that generates heat by a supply current, and a flow velocity detector having a temperature measuring element that detects a temperature of the heat from the heater element that changes in accordance with the flow velocity. And in the thermal flow rate / flow rate sensor that measures the flow rate, A single plate-like substrate for the thermal flow rate / flow rate sensor and an elongated shape that is integrally formed with the substrate at the center of one end of the substrate and that extends integrally from the substrate main part, which is the main part of the substrate.
  • the heater element and the temperature measuring device are formed by mounting the heater element, which is a general-purpose mounting component, and the temperature measuring element, which is a general-purpose mounting component, adjacent to each other and mounted on the surface mounting portion of the board portion on which the part is mounted.
  • It consists of a flow rate detection unit that is thermally connected directly to the element, and a surface mounting part of the board part on which this flow rate detection part is mounted, and a flow rate detection part that extends integrally from this surface mounting part to the main part of the board Leaving the support
  • the heat flow formed by using a general-purpose substrate manufacturing apparatus so that the flow velocity detection part formed at the surface mounting location is supported by the main part of the substrate by the flow velocity detection part support part by cutting the peripheral part of This is a flow rate / flow rate sensor.
  • a fluid flow velocity comprising a heater element that generates heat by a supply current, and a flow velocity detector having a temperature measuring element that detects the temperature of heat from the heater element that changes in accordance with the flow velocity.
  • a single plate-like substrate of the thermal flow rate / flow rate sensor, a belt-like outer peripheral portion constituting the main portion of the substrate integrally formed from this substrate, and a main substrate constituting this belt-like outer peripheral portion A pair of elongated flow velocity detecting portion support portions integrally extending from the first portion toward the center, and a pair of flow velocity detection portion support portions that are supported at the distal ends of the pair of flow velocity detection portion support portions and integrally formed with the main portion of the substrate.
  • the main substrate constituting the belt-shaped outer peripheral portion is formed by cutting the peripheral portion of the substrate while leaving a pair of flow velocity detecting portion supporting portions integrally extending from the surface mounting portion to the main substrate portion and the belt-shaped outer peripheral portion.
  • flow With a guard portion for protecting the detector, so that a structure in which a space around the flow rate detecting unit, a thermal type flow rate-flow sensor formed by using a general-purpose substrate manufacturing apparatus.
  • a flow rate detector having a heater element that generates heat by a supply current, and a temperature measuring element that detects a temperature of heat from the heater element that changes in accordance with the flow rate, and measures the temperature.
  • a thermal flow rate / flow rate sensor that measures the flow rate and flow rate of a fluid consisting of an air temperature measurement unit having an air temperature measurement element
  • a single plate-like substrate for the thermal flow rate / flow rate sensor and an elongated shape that is formed on both sides of one end of the substrate so as to be separated from each other and integrally extend from the main part of the board, which is the main part of the board.
  • the flow rate detection unit support part and the temperature measurement unit support part, the substrate part for mounting the flow rate detection part formed at the tip of the flow rate detection part support part, and the flow rate detection part formed on the substrate part A circuit pattern, a board part for mounting a temperature measurement part formed at the tip of the support part for the temperature measurement part, a circuit pattern for the temperature measurement part formed on this board part, and a board part for mounting the flow rate detection part
  • the heater element and the temperature measuring element are thermally formed by arranging the heater element, which is a general-purpose surface-mounted component, and the temperature-measuring element, which is a general-purpose surface-mounted component, arranged adjacent to each other and mounted at the surface mounting location.
  • a direct connection to the flow It consists of a detection unit and a temperature measurement unit with a temperature measurement element mounted on the surface mounting part of the substrate part on which the temperature measurement unit is mounted.
  • Support portion for the flow velocity detection portion that integrally extends from the location to the main portion of the substrate, the surface mounting location of the substrate portion on which the temperature measurement portion is mounted, and the temperature measurement element that extends integrally from the surface mounting location to the main portion of the substrate
  • a thermal type flow rate-flow sensor formed by using a general-purpose substrate manufacturing apparatus such that the structure in which a plate-shaped substrate main portion.
  • the flow velocity detection unit is mounted by arranging a temperature measuring element and a pair of heater elements facing each other across the temperature measuring element. By doing so, the heater element and the temperature measuring element are formed in a structure in which they are thermally connected directly.
  • a flow rate detector having a heater element that generates heat by a supply current, and a temperature measuring element that detects the temperature of heat from the heater element that changes in accordance with the flow rate, and measures the temperature.
  • a thermal flow rate / flow rate sensor that measures the flow rate and flow rate of a fluid consisting of an air temperature measurement unit having an air temperature measurement element
  • a single plate-like substrate of the thermal flow rate / flow rate sensor a belt-shaped outer peripheral portion constituting the main portion of the substrate, which is the main portion of the substrate integrally formed from this substrate, and a substrate at one central portion of this substrate
  • a flow rate detecting portion supporting portion formed in an elongated shape integrally extending from the main portion of the substrate, and formed at the tip portion of the flow velocity detecting portion supporting portion, and at the center portion of the belt-shaped outer peripheral portion
  • a heater element formed by mounting a heater element, which is a general-purpose surface-mounted component, and a temperature-me
  • the substrate main part that forms the belt-shaped outer peripheral part is formed as a guard part that protects the flow rate detecting part, and the flow rate detecting part and the temperature measuring element
  • a space is provided between the flow velocity detection unit and the temperature measurement element, and a general substrate manufacturing apparatus is used so that a plate-like substrate main part is provided.
  • Thermal flow rate / flow rate sensor It is.
  • the invention according to claim 14 is the invention according to any one of claims 8 to 13, wherein the thermal flow velocity / flow rate sensor is a thermal flow velocity / flow rate sensor formed using a general-purpose automatic mounting machine. .
  • the flow velocity detection unit 5 uses a heater element 4 which is a general-purpose electronic component for surface mounting and a temperature measuring element 3 which measures the temperature of heat from the heater, and a method for manufacturing a plate-shaped electronic substrate. Since each electronic component can be mounted on a board by an automatic mounting machine generally used in the above, the assembly process can be automated easily, and the assembly cost is very low.
  • the heater element 4 and the temperature measuring element 3 have a structure in which they are thermally connected directly via the board portion 1a of the mounting location, a flow rate detection unit 5 with good responsiveness can be obtained, and an individual Since the flow velocity detection unit 5 with little difference is obtained, adjustment as a sensor is not required, and the cost is reduced.
  • the heater element 4 and the temperature measuring element 3 have a structure in which they are thermally connected directly via the board portion 1a of the mounting location, a flow rate detection unit 5 with good responsiveness can be obtained, and an individual Since the flow velocity detection unit 5 with little difference is obtained, adjustment as a sensor is not required, and the cost is reduced.
  • a flow rate detection element manufactured using MEMS which is a device manufacturing method using a general semiconductor manufacturing process
  • MEMS Micro Electric Mechanical System
  • a plate-shaped electronic substrate is manufactured using a general-purpose substrate manufacturing apparatus and a commonly used automatic mounting machine can be used.
  • the cost of the initial cost on the manufacturing unit price is negligible compared with MEMS because the cost is the same as for the electronic substrate.
  • there are currently automatic assembly machines that can handle products with a small production quantity even a product with a small production quantity will not be extremely expensive.
  • the initial cost can be kept low, customization and variation development are easy.
  • the flow velocity detection portion support portion 22 can be formed in its shape (width, length, etc.) according to the desired thermal conductivity, and the flow velocity detection portion 20 is supported by the flow velocity detection portion support portion 22.
  • the substrate material of the substrate 21 and the flow velocity detecting portion support portion 22 is a member having a low thermal conductivity similar to that of the substrate portion 1a of the first embodiment (FR-4 substrate: thermal conductivity is 0.45 W). / M / K) is used.
  • the flow velocity detection portion support portion 22 is elongated, heat conduction from the flow velocity detection portion 20 to the substrate main portion 21 b of the substrate 21 can be suppressed, and further, the flow velocity detection portion support portion 22 is fixed through the mounting hole 23. It is also possible to suppress heat conduction to other devices.
  • the inventions according to claims 5 and 12 are configured as described above, the same effects as the inventions according to claims 4 and 11 can be obtained, and even when the temperature of the temperature measuring element 3 is lowered.
  • the heater element 4 is arranged so as to sandwich the temperature measuring element 3 and the number of the heater elements 4 is increased so that the temperature of the temperature measuring element 3 can be recovered more quickly. Therefore, the responsiveness as a thermal flow rate / flow rate sensor is improved. I can do it.
  • the guard portion 56 can be used to It is possible to protect the flow velocity detection unit 50 that protrudes from the portion 51b through the flow velocity detection unit support portion 52. Furthermore, the guard part 56 can also prevent burns caused by erroneous contact with the heater element 4 that generates heat in the flow velocity detection part 50. Further, the guard portion 56 can be integrally formed with the substrate by a numerically controlled machine (NCM: Numerically Controlled Machine) (hereinafter referred to as NCM) or the like in the substrate manufacturing stage, thereby greatly reducing manufacturing and assembly costs. I can do it.
  • NCM numerically controlled machine
  • FIG. 1 It is a block diagram at the time of comprising the temperature measuring element for detecting the heat generating body temperature Th, and the heater element used as a heat-generation source by a separate element which shows the prior art example 2.
  • FIG. It is a principal part block diagram of the flow velocity and the flow sensor which showed the prior art example 3, and was invented as a trial. It is a principal part block diagram of the flow velocity and flow volume sensor which shows the prior art example 4.
  • a flow rate of fluid comprising a heater element, which is a general-purpose surface-mounted component that generates heat by a supply current, and a temperature measuring element that detects the temperature of heat from the heater element that changes according to the flow rate; and
  • the heater element and the temperature measuring element are general-purpose surface-mount components, and on both sides of one end of the plate-like single substrate of the thermal flow rate / flow rate sensor,
  • the elongated flow velocity detecting portion support portion and the temperature measuring portion support portion that are integrally extended from the substrate main portion, which is the main portion of the substrate, are formed integrally with the substrate so as to be separated from each other.
  • a substrate portion on which the flow velocity detection unit is mounted is formed at the tip of the flow velocity detection portion support portion, and a circuit pattern for the flow velocity detection portion is formed on the substrate portion.
  • a substrate part for mounting the temperature measurement unit is formed at the tip of the temperature measurement unit support part, and a circuit pattern for the temperature measurement unit is formed on the substrate part.
  • a detection unit is formed.
  • An air temperature measurement unit formed by mounting an air temperature measurement element is formed on the surface mounting portion of the substrate portion on which the air temperature measurement unit is mounted.
  • the temperature measuring element is formed in a structure that is supported by the main part of the substrate by the flow velocity detection unit support and the temperature measurement element support, respectively, and a space is provided around the flow rate detection unit and the temperature measurement element.
  • a space is provided between the flow rate detection unit and the air temperature measurement element, and a general substrate manufacturing apparatus and a general-purpose automatic mounting machine are used so as to have a structure in which a plate-like substrate main part is provided.
  • thermal flow rate / flow rate sensor General conditions required for a practical thermal flow rate / flow rate sensor are good measurement accuracy and responsiveness, low power consumption, and low cost.
  • electronic components such as surface-mounted components mounted on the surface of a substrate are becoming smaller, more accurate, and lower in cost.
  • Such electronic components are generally used as distribution products.
  • electronic components having an error accuracy of about ⁇ 1% due to individual differences among electronic components are available as general distribution products.
  • An automatic mounting machine for mounting these electronic components on a substrate has also been generalized, and automation has been established for a method for mounting electronic components such as surface mounting components using the automatic mounting machine. If these general-purpose electronic components and automatic mounting machines can be used, a thermal flow rate / flow rate sensor with good measurement accuracy and low cost can be realized.
  • the heat generated by the heat generation part of the thermal flow rate / flow rate sensor is transferred through the copper wire etc. It is important to suppress.
  • the heat generating part has the highest power consumption, and the heat generated by the heat generating part escapes to other devices, that is, not only the power consumption increases, This is because it means that the responsiveness of the sensor itself is deteriorated.
  • FR-4 FRAME RETARDANT TYPE 4
  • its strength is 55% compared to copper wire.
  • the thermal conductivity is as low as 0.1% with respect to the copper wire.
  • the heat conduction through an object depends on the cross-sectional area and temperature difference of the structure of the object.
  • the thermal conductivity of air is 0.0241 W / m ⁇ K
  • the thermal conductivity of the FR-4 substrate is 0.45 W / m ⁇ K.
  • These thermal conductivities are lower than the thermal conductivities of copper, 403 W / m ⁇ K. Therefore, in the present invention, the thermal flow velocity / flow rate sensor is structurally provided with a portion having a low thermal conductivity that becomes a bottleneck, and a method of suppressing thermal conduction is used.
  • FIG. 1 is a schematic view of a main part showing a first embodiment of the present invention.
  • a single plate-like substrate 1 is formed on a substrate portion 1a that forms a flow velocity detecting portion of a flow velocity / flow rate sensor and the substrate portion 1a. It is comprised by the board
  • a temperature measuring unit described later is omitted.
  • the plate-like single substrate 1 is not limited to this embodiment, and FR-4 made of glass epoxy, which is generally widely sold as a printed board, is used in all embodiments described later.
  • the substrate 1 may be a polyamide substrate, or a substrate formed of a member having low thermal conductivity, such as a glass epoxy substrate such as FR-4, a ceramic substrate, or the like. Yes. In this embodiment, only the substrate portion 1a on which the flow velocity detection unit 5 is formed is described, and the substrate main portion (not shown) is omitted.
  • Reference numeral 2 denotes a circuit pattern for the flow velocity detection unit formed on the surface of the substrate portion 1a.
  • General-purpose electronic components the heater element 4 and the temperature measuring element 3 are mounted on the mounting portion of the substrate portion 1a of the flow velocity detection unit 5, respectively. Is implemented. Since the circuit pattern 2 is formed of a copper thin film, the amount of current flowing through the circuit pattern 2 is made as small as possible in order to reduce heat conduction. For that purpose, it is desirable to narrow the width of the circuit pattern 2 of the substrate portion 1a of the flow velocity detector 5 within a range allowed by the manufacturing technology of the substrate 1. When the width of the circuit pattern 2 of the substrate portion 1a is narrowed, the environmental resistance is deteriorated.
  • the substrate portion 1 a around the mounting location of the heater element 4 and the temperature measuring element 3 constituting the flow velocity detection unit 5 constitutes a flow velocity detection unit support 9 that supports the flow velocity detection unit 5.
  • the temperature measuring element 3 is a general-purpose electronic component.
  • the terminal of the temperature measuring element 3 is soldered to a corresponding portion of the circuit pattern for the flow velocity detecting portion formed on the surface of the substrate portion 1a. Fixed and implemented.
  • the heater element 4 is a general-purpose electronic component, and is located opposite to a corresponding portion of the circuit pattern for the flow velocity detection portion formed on the back surface of the substrate portion 1a (a mounting portion where the temperature measuring element 3 is mounted). ), The terminal of the heater element 4 is fixed by soldering and mounted. Therefore, the heater element 4 and the temperature measuring element 3 have a structure in which both sides (front surface and back surface) of the substrate portion 1a are thermally connected directly via the mounting portion of the substrate portion 1a.
  • Reference numeral 6 denotes a pad, which is an output terminal for taking out a signal from the flow velocity detector 5.
  • the substrate portion around the flow velocity detection unit 5 constituted by the heater element 4 and the temperature measuring element 3 acts as a flow velocity detection unit support unit 9 that supports and supports the flow velocity detection unit 5. is doing. Furthermore, the board
  • the plate-shaped substrate is manufactured using a general-purpose substrate manufacturing apparatus and an automatic mounting machine used in a general manufacturing process of a plate-shaped electronic device substrate.
  • a solder paste is applied to a mounting portion of the plate-like substrate portion 1a on which the circuit pattern 2 of the flow velocity detection unit 5 is formed by a solder paste printer.
  • the temperature measuring element 3 is mounted on the front surface of the substrate portion 1a by the automatic mounting machine, and the heater element 4 is the same as the back surface of the substrate portion 1a, and the mounting location opposite to the mounting location of the temperature measuring device 3. To be mounted.
  • the temperature measuring element 3 and the heater element 4 are soldered and fixed by a reflow furnace or a flow device. Since the heater element 4 and the temperature measuring element 3 are soldered to the mounting portions on the front and back surfaces of the substrate portion 1a, both the elements 3 and 4 are thermally directly connected via the substrate portion of the mounting portion. It has a structure.
  • the substrate portion 1 a around the flow velocity detection unit 5 constitutes a flow velocity detection unit support 9 that supports the flow velocity detection unit 5.
  • the substrate portion 1a extends integrally with the main portion of the substrate.
  • a method of thinning the lead wire of the heater element 4 is generally used in order to secure a heat generation amount with a small supply power. Since metal wires such as copper and stainless steel, which are the main components of the lead wire, have high thermal conductivity, make the lead wire as thin as possible and lead it from the heater element 4 of the flow velocity detection unit 5 to the main part of the substrate or other devices. This is because it was necessary to suppress the amount of heat that escapes along the wire. On the other hand, however, when the lead wire is made thin, it becomes weak against mechanical shock, and there is a problem that the flow velocity detection unit 5 is easily damaged.
  • the substrate material of the plate-like substrate portion 1a is less than copper in terms of mechanical strength, but has a lower thermal conductivity (FR-4 substrate: thermal conductivity is 0.45 W). / M / K) is used. Therefore, from the viewpoint of heat radiation from the heater element 4 of the flow velocity detection unit 5 to the main part of the substrate and other devices, the flow velocity detection unit support portion 9 is formed of the same member as the substrate portion 1a as in this embodiment. In such a case, there is no need to make it thinner as in the case of a conventional lead wire, and there is an effect that the mechanical strength becomes higher.
  • the heater element 4 is heated by a current supplied from an internal power supply (not shown) of the substrate portion 1a.
  • the heat of the heater element 4 changes according to the flow rate of the fluid, and this heat is measured by the temperature measuring element 3 via the substrate at the mounting portion of the substrate portion 1a.
  • Direct thermal conduction to The temperature of the conducted heat is measured by the temperature measuring element 3, and the flow velocity is calculated from the measured value based on the operating principle of the thermal flow velocity / flow rate sensor described above.
  • the flow rate detector 5 of the thermal flow rate / flow rate sensor includes a heater element 4 which is a general-purpose electronic component for surface mounting, and a temperature measuring element 3 for measuring the temperature of heat from the heater, Since each electronic component can be mounted on the board by an automatic mounting machine generally used in the manufacturing method of a plate-shaped electronic board, the assembly process can be automated easily and the assembling cost is very low. .
  • the heater element 4 and the temperature measuring element 3 have a structure in which they are thermally connected directly via the board portion 1a of the mounting location, a flow rate detection unit 5 with good responsiveness can be obtained, and an individual Since the flow velocity detection unit 5 with little difference is obtained, adjustment as a sensor is not required, and the cost is reduced.
  • a flow rate detecting element manufactured using MEMS which is a device manufacturing method using a general semiconductor manufacturing process
  • MEMS Micro Electric Mechanical System
  • a plate-shaped electronic substrate is manufactured using a general-purpose substrate manufacturing apparatus and a commonly used automatic mounting machine can be used.
  • the cost of the initial cost on the manufacturing unit price is negligible compared with MEMS because the cost is the same as for the electronic substrate.
  • there are currently automatic assembly machines that can handle products with a small production quantity even a product with a small production quantity will not be extremely expensive.
  • the initial cost can be kept low, customization and variation development are easy.
  • FIG. 2 is a schematic diagram showing the main part of a second embodiment of the present invention.
  • the same parts as those in the first embodiment are denoted by the same names and the same numbers, and the description thereof is omitted. Also, the temperature measuring element for measuring the temperature is omitted.
  • a flow velocity detection unit 20 supported by an elongated flow velocity detection unit support 22 extending integrally from the substrate main portion 21 b is formed at the center of one end of the plate-like substrate 21. ing.
  • a circuit pattern (not shown) for the flow velocity detection unit is formed on the surface of the plate-like substrate portion 21a on which the flow velocity detection unit 20 is mounted, and the temperature measuring element 3 and the heater are formed on the surface mounting portion.
  • Each element 4 is mounted by soldering to constitute a flow velocity detection unit 20. Therefore, the temperature measuring element 3 and the heater element 4 are surface-mounted on the substrate portion 1a, and the elements 3 and 4 are arranged and mounted adjacent to each other so as to be thermally connected directly. It has become.
  • the temperature measuring element 3 and the heater element 4 are respectively mounted on the front surface and the back surface of the substrate portion 21a. It may be made to be a structure directly connected through the heat.
  • the flow velocity detection portion support portion 22 that supports the flow velocity detection portion 20 is provided with the substrate main portion 21b, the temperature measuring element 3 and the heater element 4, where the substrate portion 21a is left, and the surrounding substrate is made of NCM or the like. It is formed by cutting. Accordingly, the substrate portion 21a on which the flow velocity detection unit 20 composed of the temperature measuring element 3 and the heater element 4 is formed is integrally supported by the substrate main portion 21b by the flow velocity detection unit support portion 22 having an elongated structure. It has a structure.
  • Reference numeral 23 denotes a mounting hole for fixing the thermal flow rate / flow rate sensor to another device or the like.
  • the temperature measuring element has a circuit configuration that also serves as a heater element
  • the temperature measuring element having such a circuit configuration is mounted on the flow velocity detection unit 20, and similarly, the flow rate detection unit support unit 22 having an elongated structure is used. If supported, the same effect can be obtained.
  • the flow velocity detection unit support portion 22 can be formed in its shape (width, length, etc.) in accordance with the desired thermal conductivity, and the flow velocity detection portion 20 is supported by the flow velocity detection portion support portion 22.
  • the substrate material of the substrate 21 and the flow velocity detecting portion support portion 22 is a member having a low thermal conductivity similar to that of the substrate portion 1a of the first embodiment (FR-4 substrate: the thermal conductivity is 0.1). 45 W / m / K) is used.
  • the flow velocity detection portion support portion 22 by forming the flow velocity detection portion support portion 22 to be elongated, heat conduction from the flow velocity detection portion 20 to the substrate main portion 21 b of the substrate 21 can be suppressed, and further, the flow velocity detection portion support portion 22 is fixed through the mounting hole 23. It is also possible to suppress heat conduction to other devices.
  • FIG. 3 is a schematic view showing the main part of a third embodiment of the present invention.
  • the same name and the same number are used and the description is abbreviate
  • the temperature measuring element for measuring the temperature is omitted.
  • the substrate main portion 31b of the plate-like substrate 31 is formed in a shape having a circular belt-shaped outer peripheral portion, and a pair of flow velocity detection portions extending integrally from the belt-shaped outer peripheral portion toward the center.
  • a support portion 32 is formed.
  • a substrate portion 31 a that forms the flow velocity detection unit 30 is integrally formed at the distal ends of the pair of flow velocity detection unit support portions 32. Therefore, the substrate portion 31a has a structure supported by the pair of flow velocity detecting portion support portions 32 at the central portion of the substrate main portion 31b. In order to form such a structure, it is formed by cutting a plate-like substrate with NCM or the like as in the case of the second embodiment.
  • the shape of the substrate main portion 31b is formed in the shape of a circular belt-shaped outer peripheral portion.
  • the shape of the belt-shaped outer peripheral portion constituting the substrate main portion 31b is not limited to this.
  • the substrate portion 31a may be formed on the inner portion of the belt-shaped outer peripheral portion constituting the substrate main portion 31b or in the center portion, and may be in a polygonal shape. Any structure supported by 32 may be used.
  • a circuit pattern (not shown) for the flow velocity detection unit is formed at the mounting location of the flow velocity detection unit 30 of the substrate portion 31a, and the heater element 4 is mounted on one surface by soldering.
  • the temperature measuring element 3 is mounted by soldering on the other surface of the substrate portion 31a so as to face the portion. Therefore, the heater element 4 and the temperature measuring element 3 have a structure in which both sides (front surface and back surface) of the substrate portion 31a are thermally connected directly via the mounting portion of the substrate portion 31a.
  • both elements 3 and 4 are disposed on one surface of the substrate portion 31a as described in the second embodiment. You may make it become the structure directly connected thermally by arrange
  • the flow velocity detection unit 30 has a structure that is supported by a pair of flow velocity detection unit support portions 32 integrally extending from the substrate main portion 31b at the central portion of the belt-shaped outer peripheral portion.
  • a space 33 is formed around the periphery.
  • Reference numeral 34 denotes a through hole to which a signal line for supplying power to the heater element 4 and outputting temperature measurement value data of the temperature measuring element 3 is connected. Since it is configured in this manner, the same effects as those of the first and second embodiments are obtained.
  • FIG. 4 is a schematic view of the essential portions showing a fourth embodiment of the present invention.
  • the same parts as those in the first to third embodiments are denoted by the same names and the same numbers, and the description thereof is omitted.
  • the purpose is to reduce the conduction of heat from the flow velocity detection unit 40 that affects the air temperature measurement unit 44.
  • An elongated flow velocity detection portion support portion 42 and an air temperature measurement portion support portion 43 that are integrally extended from the substrate main portion 41b are formed apart from each other.
  • a substrate portion 41a for mounting the flow velocity detection unit 40 supported by the flow velocity detection unit support portion 42 is formed at the distal end portion of the flow velocity detection portion support portion 42, and the distal end of the temperature measurement portion support portion 43 is formed.
  • the board portion 41c on which the temperature measuring unit 44 supported by the temperature measuring unit support unit 43 is mounted is formed using NCM or the like, as in the second embodiment.
  • a circuit pattern (not shown) for a flow velocity detection unit (not shown) and a circuit pattern for temperature measurement (not shown) are respectively provided on the surfaces of the substrate portion 41a on which the flow velocity detection unit 40 is mounted and the substrate portion 41c on which the temperature measurement unit 44 is mounted. ) Is formed.
  • a temperature measuring element 3 that is a general-purpose surface-mounting component and a heater element 4 that is a general-purpose surface-mounting component are each mounted by soldering on a surface-mounted portion of the substrate portion 41a to constitute a flow velocity detection unit 40.
  • a temperature measuring element 45, which is a general-purpose surface-mounted component, is mounted by soldering on the surface mounting portion of the portion 41c to constitute the temperature measuring unit 44.
  • the flow velocity detection unit 40 has a structure that is integrally supported by the substrate main portion 41b by the flow velocity detection portion support portion 42, and the air temperature measurement portion 44 has the substrate main portion 41b by the air temperature measurement portion support portion 43. It is a structure that is supported in a single piece. Further, the temperature measuring element 3 and the heater element 4 are mounted on the surface of the substrate portion 41a, and the elements 3 and 4 are disposed adjacent to each other and mounted so as to be thermally connected directly. It has become. Instead of arranging and mounting the temperature measuring element 3 and the heater element 4 adjacent to each other, as described in the first embodiment, the temperature measuring element 3 and the heater element 4 are respectively mounted on the front surface and the back surface of the substrate portion 41a. It may be made to be a structure directly connected through the heat.
  • a space 46 is provided around each of the flow velocity detection unit 40 and the air temperature measurement unit 44, and a space 47 is also provided between the flow velocity detection unit 40 and the air temperature measurement unit 44. And it has the structure which provided the plate-shaped board
  • Reference numeral 48 denotes an attachment hole for attaching the thermal flow rate / flow rate sensor to another device.
  • the heat conduction from the flow velocity detection unit 40 to the main substrate portion 41c can be reduced. Furthermore, the heat conduction can be further reduced by forming the support portion 42 for the flow velocity detection portion to be thin. A space 47 is formed between the flow velocity detection unit 40 and the air temperature measurement unit 44, and a space 46 is also formed around the flow velocity detection unit 40 and the air temperature measurement unit 44. The main part of the substrate is provided. In addition, by forming the temperature measurement unit support 43 of the temperature measurement unit 44 to be thin, the heat conduction to the temperature measurement unit 44 can be further reduced, and the heat from the flow velocity detection unit 40 is measured by the temperature measurement. The influence on the portion 44 can be reduced as much as possible.
  • FIG. 5 shows a modified example of the thermal flow rate / flow rate sensor shown in FIG. 4.
  • the flow rate detection unit 40 ′ is disposed so as to sandwich the temperature measuring element 3 and the temperature measuring element 3.
  • the two heater elements 4 are provided. Since it is configured in this manner, even when the temperature of the temperature measuring element 3 is lowered, the temperature of the temperature measuring element 3 is more quickly arranged by the heater elements 4 arranged so as to sandwich the temperature measuring element 3 and the number of the temperature measuring elements 3 is increased. Therefore, the responsiveness as a thermal flow rate / flow rate sensor can be improved. Further, by mounting a heater element on the opposite surface of the substrate, characteristics such as responsiveness can be further improved.
  • a flow rate detection unit in which a temperature measuring element and a heater element are mounted and an air temperature measurement unit in which an air temperature measurement element for measuring temperature is mounted are arranged on the same substrate.
  • the influence of the heat conduction from the heater element of the flow velocity detection unit on the temperature measurement unit becomes a problem. Therefore, in order to see this effect, the inventor, as shown in FIG. 6, the flow velocity detection unit 40A and the temperature measurement on the same substrate (the substrate main part 41b has a rectangular belt-shaped outer periphery).
  • a prototype A having a structure in which the portion 44A is arranged was created.
  • Example 4 the thermal flow velocity / flow rate sensor having the structure shown in FIG. 4 is used as a basic structure, the shape of the substrate portion 41a for detecting the flow velocity, the flow velocity detection portion support portion 42, and the temperature measurement portion support portion 43.
  • Prototypes prototypes B, C, D, and E with various lengths and the like were created and compared with prototype A. The results are shown in FIGS.
  • Reference numeral 42B denotes a flow velocity detection unit support
  • 43B denotes an air temperature measurement unit support
  • the prototype C shown in FIG. 8 has a structure in which the interval (space 47C) between the flow velocity detection portion support portion 42C and the temperature measurement portion support portion 43C is wider than that of the prototype B. As is apparent from the temperature distribution shown in FIG. 8, it has been found that the space 47C between the flow velocity detection portion support portion 42C and the temperature measurement portion support portion 43C does not affect the heat conduction.
  • the prototype D shown in FIG. 9 has a structure in which the area of the substrate main part 41cD is reduced compared to the prototype B. As is clear from the temperature distribution shown in FIG. 9, it has been found that the effect of heat conduction increases when the area of the substrate main portion 41cD is reduced.
  • 40D is a flow velocity detection unit
  • 42D is a flow velocity detection unit support unit
  • 43D is an air temperature measurement unit support unit
  • 44D is an air temperature measurement unit.
  • 41cE is a board
  • 40E is a flow velocity detection part
  • 44E is an air temperature measurement part.
  • the prototype B and the prototype C described in Example 4 have almost no influence on the temperature measurement unit 44B due to the heat conduction from the heater element of the flow velocity detection unit 40B, and there is no problem in practical use. The result was obtained.
  • FIG. 11 is a schematic view of the essential portions showing a fifth embodiment of the present invention.
  • the same parts as those in the first to fourth embodiments are denoted by the same names and the same numbers, and the description thereof is omitted.
  • the purpose of the fifth embodiment is to lower the heat conduction from the flow velocity detection unit 50 that affects the temperature measurement unit 54 and to protect the flow velocity detection unit 50.
  • an arch-shaped strip-shaped outer peripheral portion 51d extending integrally from the substrate main portion 51b of the single plate-like substrate 51 is formed, and the substrate main portion 51b of the plate-like substrate 51 is formed.
  • an elongated flow velocity detecting portion support portion 52 that is integrally extended from the substrate main portion 51b is formed.
  • a substrate portion 51 a on which the flow velocity detection unit 50 supported by the flow velocity detection portion support 52 is mounted is formed at the tip of the flow velocity detection portion support portion 52.
  • the length of the flow velocity detecting portion support portion 52 is adjusted so that the substrate portion 51a of the flow velocity detecting portion 50 is positioned at the center portion of the belt-shaped outer peripheral portion 51d. Therefore, the arch-shaped belt-shaped outer peripheral portion 51d serves as a guard portion 56 that protects the flow velocity detection portion 50 having a structure protruding from the substrate main portion 51b.
  • the heater element 4 and the temperature measuring element 3 are each mounted by soldering at the surface mounting location of the substrate portion 51a to constitute the flow velocity detection unit 50. Therefore, the temperature measuring element 3 and the heater element 4 are surface-mounted on the substrate portion 51a, and the elements 3 and 4 are disposed and mounted adjacent to each other so as to be thermally connected directly. It has become. Instead of arranging and mounting the temperature measuring element 3 and the heater element 4 adjacent to each other, as described in the first embodiment, the temperature measuring element 3 and the heater element 4 are respectively mounted on the front surface and the back surface of the substrate portion 51a. It may be made to be a structure directly connected through the heat.
  • the periphery of the flow velocity detection unit 50 and the flow velocity detection unit support unit 52 is formed using an NCM or the like in a state where the arch-shaped belt-like outer peripheral portion 51d extending from the substrate main portion 51b of the substrate 51 is left. Is formed.
  • the flow velocity detection unit 50 is supported by the flow velocity detection unit support unit 52. It is in a state of protruding from the substrate main part 51b.
  • Reference numeral 48 denotes an attachment hole for attaching the thermal flow rate / flow rate sensor to another device.
  • the guard portion 56 projects from the substrate main portion 51b via the flow velocity detecting portion support portion 52. It is possible to protect the existing flow velocity detection unit 50. Furthermore, the guard part 56 can also prevent burns caused by erroneous contact with the heater element 4 that generates heat in the flow velocity detection part 50. Further, since the guard portion 56 can be integrally formed with the substrate by NCM or the like at the substrate manufacturing stage, manufacturing and assembly costs can be greatly reduced.
  • PMV predicted average thermal sensation
  • ET effective temperature
  • OT working temperature
  • comfort evaluation indexes of human living environment all of which are calculated using the value of wind speed.
  • Temperature sensors and humidity sensors are becoming popular in ordinary households, but fans have been used as a method for maintaining comfort in summer since ancient times, and it is known that the wind is effective in maintaining and improving comfort. ing. This is because by removing the air staying layer and the boundary layer formed on the body surface of the living body by the air flow by the wind, the evaporation of the skin surface is promoted and the skin can obtain a cooling effect.
  • wind speed sensors have never been used in devices such as air conditioners and fans. Since the present invention can provide a flow rate / flow rate sensor with improved cost, durability, ease of manufacture, etc., there is a possibility of introduction into a living environment that has not been introduced in the past.

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  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
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  • Aviation & Aerospace Engineering (AREA)
  • Measuring Volume Flow (AREA)

Abstract

Dans la présente invention, une unité de détection de vitesse de flux est conçue à l'aide de composants électroniques génériques, d'un dispositif de fabrication de substrat et d'une ligne de machine de montage automatisé destinée au montage d'un élément de chauffage et d'un élément de mesure de température, qui constituent les composants génériques destinés à êtres montés, sur les deux côtés d'un substrat. Une partie de support allongée destinée à l'unité de détection de vitesse de flux est formée d'un seul tenant à partir d'une section centrale d'extrémité d'une partie principale de substrat, et l'unité de détection de vitesse de flux est formée sur la partie pointe de la partie de support. Une partie de support destinée à une unité de mesure de température d'air et la partie de support allongée destinée à l'unité de détection de vitesse de flux sont respectivement formées avec un espace ménagé entre celles-ci et s'étendent d'un seul tenant à partir des côtés sur la section centrale d'extrémité de la partie principale de substrat, et l'unité de mesure de température d'air et l'unité de détection de vitesse de flux sont respectivement formées sur les parties pointes des parties de support, un espace étant par là-même prévu entre l'unité de mesure de température d'air et l'unité de détection de vitesse de flux. Une paire allongée de parties de support destinées aux unités de détection de vitesse s'étendent d'un seul tenant vers le centre du substrat à partir de la partie principale de substrat qui forme une partie périphérique en forme de bande, et une unité de détection de vitesse de flux est formée sur la pointe de chaque partie de support, la partie périphérique en forme de bande servant par là-même en tant que partie de protection destinée à protéger les unités de détection de vitesse de flux et un espace étant prévu entre la partie de mesure de température d'air et les parties de détection de vitesse de flux.
PCT/JP2014/075424 2013-09-27 2014-09-25 Procédé de fabrication de capteur de vitesse de flux/débit thermique, et capteur de vitesse de flux/débit thermique WO2015046328A1 (fr)

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JP2013200812A JP6332932B2 (ja) 2013-09-27 2013-09-27 熱式流速・流量センサの製造方法及び熱式流速・流量センサ
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KR102177856B1 (ko) 2020-07-13 2020-11-11 (주)바이올 주위온도 의존성을 제거한 열질량 풍속센서를 이용한 풍속계
KR102165644B1 (ko) 2020-07-24 2020-10-14 (주)바이올 공기순환조절이 용이한 생물안전작업대
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