WO2015035763A1 - 一种led球泡灯及其模块化的led灯主体件 - Google Patents

一种led球泡灯及其模块化的led灯主体件 Download PDF

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Publication number
WO2015035763A1
WO2015035763A1 PCT/CN2014/074118 CN2014074118W WO2015035763A1 WO 2015035763 A1 WO2015035763 A1 WO 2015035763A1 CN 2014074118 W CN2014074118 W CN 2014074118W WO 2015035763 A1 WO2015035763 A1 WO 2015035763A1
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Prior art keywords
led
led lamp
heat dissipation
main component
light
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PCT/CN2014/074118
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English (en)
French (fr)
Inventor
宣炯华
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Xuan Jionghua
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Publication of WO2015035763A1 publication Critical patent/WO2015035763A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of LED lamp technology, and in particular to an LED bulb lamp and a modular LED lamp body member thereof.
  • a Light-Emitting Diode (LED) is a semiconductor electronic component capable of emitting light. This kind of electronic component appeared as early as 1962. In the early days, it only emitted low-light red light. Later, it developed other versions of monochromatic light. The light that has been emitted today has spread all over visible light, infrared light and ultraviolet light, and the luminosity has increased to equivalent. The luminosity. The use is also used as an indicator light, display panel, etc.; with the continuous advancement of technology, LEDs have been widely used in displays, TV lighting decoration and lighting. The characteristics of the LED are: low operating voltage; low operating current; good impact and shock resistance, high reliability, long life; high luminous efficiency. It is because of the above characteristics that LED lamps have emerged.
  • LED lighting fixtures have been widely used in various places, and there is a higher demand for the diversity of functions used in lighting.
  • the LED lamps provided by the prior art have poor heat dissipation effect and are prone to overheating. In the case of overheating and high temperature, the LED chip light source is prematurely light aging, which reduces the original design performance and life of the lamp.
  • a first object of the present invention is to provide a modular LED lamp body member, which can effectively improve heat dissipation efficiency and stability, reduce post-production processes, and improve production efficiency, and can greatly improve Product quality and service life.
  • a second object of the present invention is to provide an LED bulb lamp, which can effectively improve heat dissipation efficiency and stability, reduce post-production processes, improve production efficiency, and greatly improve product quality and use. life.
  • a modular LED lamp body member includes a heat sink, an LED die, and a light transmissive UV film; a heat dissipation impact surface is formed on a top surface of the heat sink; and a crystal hole is opened in the heat radiation impact surface
  • the LED die is disposed in the crystal hole position; the transparent UV film is disposed on a top surface of the LED die, and the two are fixed in the crystal hole position by a package; the LED The die has a connecting line, and the heat-dissipating impact surface has a positive/negative electrode contact, and the connecting wire is electrically connected to the positive and negative contacts of the power source.
  • the inner side of the heat sink has a plurality of heat dissipation fins, and each of the heat dissipation fins forms a heat dissipation pair flow passage.
  • a light reflecting layer is further disposed between the LED die and the crystal hole position.
  • the utility model further comprises a core ring disposed on the heat radiation impact surface and located above the LED die.
  • An LED bulb comprising the above-mentioned LED lamp body member, comprising a translucent cover, a reflector, and a driver assembly; the transmissive cover is disposed on a top surface of the LED lamp body; the reflector is mounted The top surface of the LED lamp body member is simultaneously located in the light transmissive cover; the driver assembly is mounted on the bottom surface of the LED lamp body member.
  • a first portion is disposed at a connection portion between the driver assembly and the LED lamp body member a sealing ring; a second sealing ring is disposed at a portion where the reflective sheet is connected to the heat-dissipating impact surface of the heat sink; and the reflective sheet is sealed and fixed to the hood by a sealant layer.
  • the modular LED lamp body member provided by the invention directly encapsulates the LED die on the heat dissipation impact surface of the heat sink through the COB (chip-on-chip) process package, and forms a standardization. Module. While effectively improving the heat dissipation efficiency and stability, modular components are used to standardize the various components of the product, further reducing the assembly of excessive components during the production process, forming standard modular components, greatly improving production. Efficiency, and further savings in production costs.
  • the invention also provides a technical solution of an LED bulb, which can effectively improve the heat dissipation efficiency and stability, reduce the post-production process, improve the production efficiency, and greatly improve the quality and service life of the product. . Further, it can also have waterproof performance and enhance the waterproof safety effect.
  • FIG. 1 is an exploded view showing the structure of an LED lamp body member provided by the present invention
  • FIG. 2 is an assembled structural view of a main body of an LED lamp provided by the present invention
  • FIG. 3 is a schematic view showing the connection of the connecting wires of the LED lamp body member provided by the present invention.
  • FIG. 4 is a partial enlarged view of a portion of FIG. 3;
  • FIG. 5 is an exploded view of the main body of the LED lamp for a lamp of the present invention.
  • Figure 6 is a structural exploded view of the main body of the LED lamp for a street lamp provided by the present invention.
  • FIG. 7 is a structural exploded view of the main body of the LED lamp for spotlights provided by the present invention
  • 8 is a structural exploded view of an LED bulb provided by the present invention
  • FIG. 9 is an exploded view of another LED bulb provided by the present invention.
  • an embodiment of the present invention discloses a modular LED lamp body member, which includes a heat sink 110, and a heat dissipation impact surface 113 is disposed on the heat sink, and the heat dissipation impact surface 113
  • a silicon wafer die 121 is disposed on the wafer hole 111, and the LED die 121 is covered with a transparent UV film 123.
  • the LED die 121 and the transparent UV film 123 are encapsulated. It is fixed on the crystal hole 111 of the heat-dissipating surface 113.
  • the LED die 121 has a connecting line 122.
  • the heat-dissipating surface 113 has a positive and negative contact of the power source (not shown), and the connecting line 122 on the LED die 121 is soldered.
  • the positive and negative contact points of the power supply impact surface 113 form an electrical connection.
  • the main body of the LED lamp disclosed in this embodiment is a whole body, so that the product becomes a standard part, and other components can be formed into standard modular parts, the assembly process is simplified, the assembly can be completely mechanized in the production process, the production efficiency is improved, and the saving is saved. Cost of production.
  • this embodiment changes the structure of the existing LED lamp body member, and uses the heat sink to realize the function of the substrate, and the LED die is disposed on the heat radiation impact surface of the heat sink surface, so that the heat generated by the LED die can be
  • the heat dissipation directly through the heat sink solves the problem that the heat transfer rate caused by the secondary conduction is too slow, and the heat dissipation effect is improved.
  • the inner side of the heat sink 110 may have a plurality of heat dissipation fins 112 , and the heat dissipation fins 112 form a heat dissipation pair flow path 114 .
  • the thermal impact surface connects the heat dissipation fins to the outer surface 360 of the LED lamp body. Radiation heat dissipation, heat dissipation fins and heat dissipation channels increase the area of the heat sink in contact with the air, and at the same time form the natural convection of the air, which can effectively spread the heat quickly and stabilize the heat dissipation.
  • the LED die can be bonded to the transparent UV film to form an LED chip, which is easy to assemble.
  • a reflective layer (not labeled) is further disposed between the LED die 121 and the wafer hole 111.
  • the reflective layer is mainly disposed at the top surface of the position of the crystal hole, and the function is to reflect the light emitted by the LED die, thereby further improving the brightness of the lamp.
  • the embodiment may further include a core ring 212 disposed on the heat dissipation surface and located around the LED die. The core protector can protect the LED die when assembled into a lamp in this embodiment.
  • the embodiment further discloses an LED lamp body member suitable for a par light, a street lamp, and a spotlight.
  • the overall shape is different, but all are based on the same inventive concept, and all include heat dissipation.
  • the main component 110 is a main component such as a wafer hole 111, an LED die 121, and a transparent UV film 123.
  • a wafer hole 111 a wafer hole 111
  • an LED die 121 a transparent UV film 123.
  • the LED die is directly encapsulated on the heat-dissipating surface of the heat sink through the COB chip-on-chip process, so that the LED body part forms a standardized module, which not only effectively improves the heat dissipation effect and the stability of the lamp, but also enables the modular assembly of the LED lamp.
  • the other parts of the luminaire are set as standard parts, simplifying the connection between the parts, reducing the excessive assembly of parts during the production process, greatly improving production efficiency and further saving production costs.
  • Embodiment 2 As shown in FIG. 8, this embodiment discloses an LED bulb comprising the LED lamp body member 210 in Embodiment 1, comprising a transmissive cover 240, a retroreflective sheet 230, and a driver assembly 220;
  • the transmissive cover 340 is disposed on the top surface of the LED lamp body member 210;
  • the retroreflective sheet 230 is mounted on the top surface of the LED lamp body member 210 while being located in the transmissive cover 230;
  • the driver assembly 220 is mounted on the bottom surface of the LED lamp body member 210. Specifically, it may be inserted at the bottom of the LED lamp body member 210 and fixed by a screw 211.
  • the overall structure of the embodiment is simple and easy to assemble.
  • the simple structure of the embodiment simplifies the production process and greatly improves the production efficiency in the actual production process.
  • the LED lamp body member included in the embodiment has better heat dissipation effect as a core component, and increases the service life, thereby making the overall service life of the embodiment longer and more stable.
  • the embodiment discloses an LED bulb having a better waterproof and dustproof effect, which is improved on the basis of the embodiment 2.
  • the technical solution of the embodiment is:
  • the light transmissive cover 340, the retroreflective sheet 330, the driver assembly 320, and the LED lamp body member 310 are disposed;
  • the translucent cover 340 is disposed on the top surface of the LED lamp body member 310;
  • the retroreflective sheet 330 is fixed to the top of the LED lamp body member 310 by screws 332.
  • the driver assembly 320 is mounted on the bottom surface of the LED lamp body member 310. Specifically, it may be inserted into the bottom of the LED lamp body member 310 and fixed by screws 331.
  • a first sealing ring 321 is disposed at a connecting portion of the driver assembly 320 and the LED lamp body member 310; and a second sealing ring 311 is disposed at a portion where the reflecting sheet 330 is connected to the heat-dissipating impact surface of the heat sink.
  • the reflector is sealed with a hood by a sealant layer (not shown).
  • the sealant layer is disposed at a position where the reflector is in contact with the hood, and is used to lock the reflector and the hood to prevent artificial separation of the hood and reflection.
  • the sheet which prevents the sealing and waterproofing of the part, is artificially damaged, and the sealant layer also has the effect of strengthening the waterproof and dustproof seal.
  • the three-stage waterproof treatment is used, the first sealing ring can be used as the waterproof treatment of the driver assembly to the radiator, and the second sealing ring is waterproofed from the heat-dissipating impact surface to the reflective sheet, and the sealing layer is
  • the waterproof treatment between the reflector and the translucent cover after three levels of waterproof treatment, can form a sealed whole from the translucent cover to the light source to the driver assembly, and the waterproof effect is excellent, and the efficient dissipation performance of the LED main body It can effectively solve the heat dissipation problem of the sealed space.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种模块化的LED灯主体件，包括：散热器（110）、LED晶粒（121）、透光UV膜（123）；在所述散热器（110）顶面开设有散热冲击面（113）；在所述散热冲击面（113）开设有布晶孔位（111），所述LED晶粒（121）装设在布晶孔位（111）中；所述透光UV膜（123）设置在所述LED晶粒（121）顶面，两者通过封装的形式固定在所述布晶孔位（111）内；所述LED晶粒（121）上具有连接线（122），所述散热冲击面（113）上具有电源正负极接点，所述连接线（122）与所述电源正负极接点电性连接。该模块化的LED灯主体件有效提升散热功效和稳定性，减少了后期生产工序，且提高了生产效率，并能大幅提升产品的质量及使用寿命。

Description

一种 LED球泡灯及其模块化的 LED灯主体件 技术领域 本发明涉及 LED灯技术领域， 特别涉及一种 LED球泡灯及其模块化的 LED灯主体件。 背景技术 发光二极管（Light-Emitting Diode, LED )是一种能发光的半导体电子元 件。 这种电子元件早在 1962年出现， 早期只能发出低光度的红光， 之后发展 出其他单色光的版本， 时至今日能发出的光已遍及可见光、 红外线及紫外线， 光度也提高到相当的光度。 而用途也由初时作为指示灯、 显示板等； 随着技 术的不断进步， 发光二极管已被广泛的应用于显示器、 电视机釆光装饰和照 明。 发光二极管的特点是： 工作电压低； 工作电流很小； 抗冲击和抗震性能 好， 可靠性高， 寿命长； 发光效率高。 正是由于上述特性， LED灯具应运而 生。
随着 LED在照明技术内的飞速发展， LED照明灯具逐步广泛地应用于各 类场所， 对灯具照明使用功能的多样性有了更高需求。 现有技术提供的 LED 灯具的散热效果不佳， 容易出现过热现象， 在过热高温的情况下， 导致 LED 芯片光源过早光衰老化， 降低了灯具的原设计使用效能和寿命。
在 LED灯具的生产工艺中， LED灯具由多个零配件组装而成， 部分零配 件需要高度精确组装， 其中 LED灯主体件是 LED灯具的核心部件。 现有的 LED灯主体件是将 LED晶粒布设在基板上， 之后将基板固定在散热器上， 同 时搭配其他元件构成。 在工作的时候， LED 晶粒发光产生的热量最先传递至 基板， 再由基板传递至散热器散热， 此时热量必须经过两级传递， 导致热量 传导速度过慢，这正是上述 LED灯具散热效果不佳的主要原因。 同时 LED灯 具的复杂结构也增加了后期生产工序， 生产效率较低 发明内容 本发明的第一发明目的在于提供一种模块化的 LED灯主体件， 应用该技 术方案可以有效提升散热功效和稳定性， 减少了后期生产工序， 且提高了生 产效率， 并能大幅提升产品的质量及使用寿命。
本发明的第二发明目的在于提供一种 LED球泡灯， 应用该技术方案可以 有效提升散热功效和稳定性， 减少了后期生产工序， 且提高了生产效率， 并能 大幅提升产品的质量及使用寿命。
为了实现上述发明目的， 本发明的完整技术方案是：
一种模块化的 LED灯主体件， 包括散热器， LED晶粒、 透光 UV膜； 在 所述散热器顶面开设有散热冲击面； 在所述散热冲击面开设有布晶孔位， 所 述 LED晶粒装设在所述布晶孔位中；所述透光 UV膜设置在所述 LED晶粒顶 面， 两者通过封装的形式固定在所述布晶孔位内； 所述 LED晶粒上具有连接 线， 所述散热冲击面上具有电源正负极接点， 所述连接线与所述电源正负极 接点电性连接。 优选的， 所述散热器的内侧具有多个散热鳍片， 各散热鳍片之间构成散 热对流道。
优选的， 在所述 LED晶粒与所述布晶孔位之间还设置有反光层。
优选的， 还包括装设在所述散热冲击面上且位于所述 LED晶粒上方的护 芯圈。
一种包含了上述的 LED灯主体件的 LED球泡灯， 包括透光罩、 反光片、 驱动器总成； 所述透光罩罩在所述 LED灯主体件的顶面； 所述反光片安装在 所述 LED灯主体件顶面，同时位于透光罩内；所述驱动器总成安装在所述 LED 灯主体件的底面。
优选的， 在所述驱动器总成与所述 LED灯主体件的连接部位设置有第一 密封圈； 在所述反光片与所述散热器的散热冲击面连接的部位设置有第二密 封圈； 通过密封胶层将所述反光片与遮光罩密封固定。。
由上可见， 应用本实施例技术方案， 本发明提供的模块化的 LED灯主体 件， 通过 COB (板上芯片）工艺封装， 直接将 LED晶粒封装在散热器的散热 冲击面上， 形成标准化模块。 在有效提升散热功效和稳定性的同时， 使用模 块化的组件， 把产品各个部件定为标准件， 进一步减少在生产过程中过多的 部件组装， 形成标准模块化的各个部件， 大大提升了生产效率， 又能进一步 的节省生产成本。
本发明同时提供一种 LED球泡灯的技术方案， 该 LED球泡灯可以有效提 升散热功效和稳定性， 减少了后期生产工序， 且提高了生产效率， 并能大幅提 升产品的质量及使用寿命。 进一步的还可以具有防水性能， 加强了防水安全 效果。 附图说明 为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。
图 1为本发明提供的 LED灯主体件的结构分解图；
图 2为本发明提供的 LED灯主体件的装配结构图；
图 3为本发明提供的 LED灯主体件的连接线的连接示意图；
图 4为图 3中 A处的局部放大图； 图 5为本发明提供的帕灯用的 LED灯主体件的结构分解图；
图 6为本发明提供的路灯用的 LED灯主体件的结构分解图；
图 7为本发明提供的射灯用的 LED灯主体件的结构分解图； 图 8为本发明提供的 LED球泡灯的结构分解图； 图 9为本发明提供的另一种 LED球泡灯的结构分解图。 具体实施方式 下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行 清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而 不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有作 出创造性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。 实施例 1: 如图 1-图 4所示， 本发明实施例公开了一种模块化的 LED灯主体件， 其 中包括散热器 110， 在散热器上开设有散热冲击面 113， 散热冲击面 113上设 置有布晶孔位 111， 布晶孔位 111中装设有 LED晶粒 121， LED晶粒 121上 覆盖有透光 UV膜 123， LED晶粒 121与透光 UV膜 123以封装的形式固定 在散热冲击面 113的布晶孔位 111上， LED晶粒 121上具有连接线 122， 散 热冲击面 113上具有电源正负极接点 （未标示）， LED晶粒 121上的连接线 122焊接散热冲击面 113的电源正负极接点， 形成电性连接。 本实施例公开的 LED灯主体为一个整体， 使产品成为标准件， 同时可使 其他各个部件形成标准模块化部件， 简化组装流程， 在生产过程中可以完全 机械化组装， 提高了生产效率， 节省了生产成本。 特别说明的是， 本实施例改变了现有 LED灯主体件的结构， 利用散热器 实现基板的作用，在散热器表面开设的散热冲击面上布设 LED晶粒，使得 LED 晶粒产生的热量可以直接通过散热器散热， 解决了二级传导导致的热量传递 速率过慢的问题， 提高了散热功效。 如图 2所示， 作为可以选择的技术方案， 散热器 110的内侧可以具有多 个散热鳍片 112， 各散热鳍片 112之间构成散热对流道 114。 LED晶粒通过散 热冲击面连接散热鳍片至 LED灯主体件外表面 360。 辐射散热， 散热鳍片和 散热流道增加了散热器与空气接触的面积， 同时形成空气自然对流， 能有效 把热量快速扩散， 散热稳定。 而在实际生产中， LED晶粒可以与透光 UV膜 贴合后构成 LED芯片， 便于组装。 如图 1所示，作为可以选择的技术方案，在 LED晶粒 121与布晶孔位 111 之间还设置有反光层 （未标示）。 该反光层主要设置在布晶孔位的位置顶面， 其作用是反射 LED晶粒发出的光线， 进一步提高灯具的亮度。 如图 8所示， 作为可以选择的技术方案， 本实施例还可以包括装设在散 热冲击面上且位于 LED晶粒四周的护芯圈 212。 该护芯圈在本实施例在组装 成灯具的时候可以起到保护 LED晶粒的作用。
如图 5-图 7所示，本实施例还依次公开了适用于帕灯、路灯、射灯的 LED 灯主体件， 其整体形状虽然不同， 但是都是基于相同的发明构思， 都包含了 散热器 110、 散热冲击面上开设的布晶孔位 111、 LED晶粒 121、 透光 UV膜 123等主要部件。 这里仅仅是产品的示意图。
把 LED晶粒通过 COB板上芯片工艺直接封装在散热器的散热冲击面上， 使得 LED主体件形成标准化模块， 既有效提升散热功效和灯具稳定性， 又能 使 LED灯具模块化组装， 把将灯具其他部件定为标准件， 简化部件之间的连 接， 减少在生产过程中过多的部件组装， 大大提升了生产效率， 进一步节省 生产成本。
实施例 2: 如图 8所示，本实施例公开了一种包含了实施例 1内的 LED灯主体件 210 的 LED球泡灯， 包括透光罩 240、 反光片 230、 驱动器总成 220; 透光罩 340 罩在 LED灯主体件 210的顶面； 反光片 230安装在 LED灯主体件 210顶面， 同时位于透光罩 230内； 驱动器总成 220安装在 LED灯主体件 210的底面， 具体的， 可以是插设在 LED灯主体件 210的底部， 并且通过螺丝 211固定。 本实施例整体结构简单， 组装方便， 在实际的使用中若单一部件损坏， 可以只更换该损坏的部件即可使得本实施例再次投入使用， 避免了整体的报 废， 节约了资源。 而本实施例的简单结构， 在实际的生产过程中， 简化了生 产工序， 大大地提高了生产效率。 本实施例包含的 LED灯主体件作为核心部 件散热效果更好， 增加了使用寿命， 进而使得本实施例整体使用寿命更长， 更稳定。 实施例 3:
如图 9所示， 与实施例 2不同的是， 本实施例公开了一种防水防尘效果 更佳的 LED球泡灯， 是在实施例 2的基础上改进， 本实施例技术方案为： 包 括透光罩 340、 反光片 330、 驱动器总成 320、 LED灯主体件 310; 透光罩 340 罩在 LED灯主体件 310的顶面；反光片 330通过螺丝 332固定在 LED灯主体 件 310顶面， 同时位于透光罩 330内； 驱动器总成 320安装在 LED灯主体件 310的底面， 具体的， 可以是插设在 LED灯主体件 310的底部， 并且通过螺 丝 331固定。 特别的地方在于： 在驱动器总成 320与所述 LED灯主体件 310 的连接部位设置有第一密封圈 321;在反光片 330与散热器的散热冲击面连接 的部位设置有第二密封圈 311。 通过密封胶层 (未标示）将反光片与遮光罩密 封固定， 该密封胶层设置在反光片与遮光罩接触的部位， 用于锁死反光片和 遮光罩， 防止人为的分离遮光罩与反光片， 进而防止该部分的密封防水防尘 措施遭到人为破坏， 同时密封胶层还起到加强防水防尘密封的效果。 本实施例釆用了三级防水的处理， 第一密封圈可以作为驱动器总成到散 热器的防水处理， 第二密封圈是从散热冲击面到反光片之间的防水处理， 密 封胶层是反光片到透光罩之间的防水处理， 经过三级防水处理可以使得从透 光罩到光源， 再到驱动器总成， 形成一个密封整体， 防水效果极佳， 而 LED 主体件的高效散热性能能有效地解决密封空间的散热问题。
以上所述的实施方式， 并不构成对该技术方案保护范围的限定。 任何在 上述实施方式的精神和原则之内所作的修改、 等同替换和改进等， 均应包含 在该技术方案的保护范围之内

Claims

WO 2015/035763 权 利 要 求 书 PCT/CN2014/074118
1、 一种模块化的 LED灯主体件， 其特征在于：
包括散热器， LED晶粒、 透光 UV膜；
在所述散热器顶面开设有散热冲击面；
在所述散热冲击面开设有布晶孔位， 所述 LED晶粒装设在所述布晶孔位 中；
所述透光 UV膜设置在所述 LED晶粒顶面， 两者通过封装的形式固定在 所述布晶孔位内； 所述 LED晶粒上具有连接线， 所述散热冲击面上具有电源正负极接点， 所述连接线与所述电源正负极接点电性连接。
2、 根据权利要求 1所述的一种模块化的 LED灯主体件， 其特征在于： 所述散热器的内侧具有多个散热鳍片， 各散热鳍片之间构成散热对流道。
3、 根据权利要求 1所述的一种模块化的 LED灯主体件， 其特征在于： 在所述 LED晶粒与所述布晶孔位之间还设置有反光层。
4、 根据权利要求 1所述的一种模块化的 LED灯主体件， 其特征在于： 还包括装设在所述散热冲击面上且位于所述 LED晶粒上方的护芯圈。
5、 一种包含了权 1-4所述的 LED灯主体件的 LED球泡灯， 其特征在于： 包括透光罩、 反光片、 驱动器总成；
所述透光罩罩在所述 LED灯主体件的顶面；
所述反光片安装在所述 LED灯主体件顶面， 同时位于透光罩内； 所述驱动器总成安装在所述 LED灯主体件的底面。
6、 根据权利要求 5所述的一种 LED球泡灯， 其特征在于：
在所述驱动器总成与所述 LED灯主体件的连接部位设置有第一密封圈； 在所述反光片与所述散热器的散热冲击面连接的部位设置有第二密封 圈；
通过密封胶层将所述反光片与遮光罩密封固定。
PCT/CN2014/074118 2013-09-10 2014-03-26 一种led球泡灯及其模块化的led灯主体件 WO2015035763A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201297527Y (zh) * 2008-11-07 2009-08-26 舟山浩德光电科技有限公司 带有散热器的led灯泡
CN101865396A (zh) * 2010-07-07 2010-10-20 深圳市超频三科技有限公司 Led发光模组
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
CN202901971U (zh) * 2012-11-20 2013-04-24 宣炯华 一种led灯
CN103453365A (zh) * 2013-09-10 2013-12-18 宣炯华 一种模块化的led灯主体件
CN203453868U (zh) * 2013-09-10 2014-02-26 宣炯华 一种模块化的led灯主体件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201513857U (zh) * 2009-07-17 2010-06-23 四川格兰德科技有限公司 一种自带热管的翼片式散热器的led工矿灯
CN202024135U (zh) * 2011-03-04 2011-11-02 东莞市远大光电科技有限公司 高光效的led灯泡
CN202062716U (zh) * 2011-05-05 2011-12-07 常州市泛亚微透科技有限公司 一种led灯具防水透气膜贴片

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201297527Y (zh) * 2008-11-07 2009-08-26 舟山浩德光电科技有限公司 带有散热器的led灯泡
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
CN101865396A (zh) * 2010-07-07 2010-10-20 深圳市超频三科技有限公司 Led发光模组
CN202901971U (zh) * 2012-11-20 2013-04-24 宣炯华 一种led灯
CN103453365A (zh) * 2013-09-10 2013-12-18 宣炯华 一种模块化的led灯主体件
CN203453868U (zh) * 2013-09-10 2014-02-26 宣炯华 一种模块化的led灯主体件

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