CN103453365B - 一种模块化的led灯主体件 - Google Patents

一种模块化的led灯主体件 Download PDF

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CN103453365B
CN103453365B CN201310408359.8A CN201310408359A CN103453365B CN 103453365 B CN103453365 B CN 103453365B CN 201310408359 A CN201310408359 A CN 201310408359A CN 103453365 B CN103453365 B CN 103453365B
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led
radiating
radiator
led grain
lamp main
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CN103453365A (zh
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宣紫程
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Guangdong Nine Star Technology Co., Ltd.
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Qianhai Nine Star Low Carbon Technology (shenzhen) Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明提供一种模块化的LED灯主体件，包括：散热器(110)，所述散热器上具有散热冲击面(113)，所述散热冲击面(113)上设置有布晶孔位(111)，所述布晶孔位(111)中装设有LED晶粒(121)，所述LED晶粒(121)上覆盖有透光UV膜(123)，并以封装的形式固定在所述散热冲击面(113)的布晶孔(111)上，所述LED晶粒(121)上的连接线焊接在所述散热冲击面(113)的电源正负极接点上。该模块化的LED灯主体件有效提升散热功效和稳定性，并减少了后期组装工序和高额的人工成本，且提高了产品的质量，并能大幅提升产品的使用寿命。

Description

一种模块化的LED灯主体件
技术领域
本发明涉及LED灯技术领域，特别涉及一种模块化的LED灯主体件。
背景技术
随着LED照明技术的出现，LED照明灯具广泛应用于各类场所，目前现有技术提供的LED灯的散热效果不良出现过热现象，促使LED芯片光源过早光衰老化，直至整灯熄灭，降低了灯具的原设计使用效能和寿命。同时对提升灯具照明使用功能的多样性，提出了需求，具在正套生产工艺中，各个环节的高度组装中，容易出现操作不当，导至产品不良率居高不下，造成生产的生本增加。例如：COB芯片在封装过程中人为用力不当，人为静电冲击，芯片到散热器贴合不良，产生烧机等一系列常见问题，使生产成本增加，在LED灯具中使用寿命短的主要因素。
发明内容
本发明提供一种模块化的LED灯主体件，有效提升散热功效和稳定性，减少了后期生产工序，且提高了生产效率，并能大幅提升产品的质量及使用寿命。
为了实现上述目的，本发明提供以下技术方案：
一种模块化的LED灯主体件，包括：散热器，所述散热器上具有散热冲击面，所述散热冲击面上设置有布晶孔位，所述布晶孔位中装设有LED晶粒，所述LED晶粒上具有连接线，所述LED晶粒上覆盖有透光UV膜，所述LED晶粒与透光UV膜以封装的形式固定在所述散热冲击面的布晶孔位上，所述LED晶粒上的连接线焊接所述散热冲击面的电源正负极接点上。
优选地，所述模块化的LED灯主体件还包括：装设在所述散热冲击面上且位于所述LED晶粒上方的护芯圈，散热器还通过螺丝杆固定连接驱动器后座。
优选地，所述模块化的LED灯主体件还包括透光罩，所述透光罩与所述透光UV膜之间还设置有反光片。
通过实施以上技术方案，具有以下技术效果：本发明提供的模块化的LED灯主体件，通过COB(板上芯片)工艺封装，直接将LED晶粒封装在散热器的散热冲击面上，形成标准化模块。在有效提升散热功效和稳定性的同时，使用模块化的组件，把产品各个部件定为标准件，进一步减少在生产过程中过多的部件组装，形成标准模块化的各个部件，大大提升了生产效率，又能进一步的节省生产成本。同样的方法可实现球泡灯、帕灯、射灯、投光灯、路灯等COB灯具应用领域，通过封装技术，一步到位使COB芯片与散热器完美组合，使LED主体件有多次循环利用的价值。
附图说明
图1为本发明提供的模块化的LED灯主体件的散热器的结构分解图；
图2为本发明提供的模块化的LED灯主体件的散热器的装配结构图；
图3为本发明提供的模块化的LED灯主体件的散热器的连接线的连接图；
图4为图3的A处放大图；
图5为本发明提供的具有透光罩的模块化的LED灯主体件的结构分解图；
图6为本发明提供的具有透光罩的模块化的LED灯主体件的结构分解图；
图7为本发明提供的另一种具有透光罩的模块化的LED灯(帕灯)主体件的结构分解图；
图8为本发明提供的另一种具有透光罩的模块化的LED灯(路灯)主体件的结构分解图；
图9为本发明提供的另一种具有透光罩的模块化的LED灯(射灯)主体件的结构分解图。
具体实施方式
为了更好的理解本发明的技术方案，下面结合附图详细描述本发明提供的实施例。
本发明实施例提供一种模块化的LED灯主体件，如图1-图9所示，其包括：散热器110，所述散热器上具有散热冲击面113，所述散热冲击面113上设置有布晶孔位111，所述散热冲击面113上设置有布晶孔位111，所述布晶孔位111中装设有LED晶粒121，所述LED晶粒121上具有连接线122，所述LED晶粒121上覆盖有透光UV膜123，所述LED晶粒121与透光UV膜123以封装的形式固定在所述散热冲击面113的布晶孔位111上，所述LED晶粒121上的连接线122焊接所述散热冲击面113的电源正负极接点上。
另外，该散热器110还包括散热鳍片112和散热对流孔114。该散热器110中还装设有驱动器后座130，该驱动器后座130连接该LED晶粒121，以驱动该LED晶粒121发光。所述LED晶粒121与透光UV膜123形成LED芯片120。
本发明实施例提供模块化的LED灯主体件通过散热冲击面连接散热鳍片至外壳360°辐射散热，同时形成空气自然对流，能有效把热量快速扩散，散热性好且稳定。把LED晶粒通过COB板上芯片工艺封装，直接封装在散热器的散热冲击面上，形成标准化模块。在有效提升散热功效和稳定性的同时，使用模块化的组件，把产品各个部件定为标准件，进一步减少在生产过程中过多的部件组装，形成标准模块化的各个部件，大大提升了生产效率，又能进一步的节省生产成本。
在上述实施例基础上，进一步的，所述模块化的LED灯主体件，还包括：装设在所述散热冲击面上且位于所述LED晶粒112上方的护芯圈131，散热器110还通过螺丝杆134固定连接驱动器后座130。
在上述实施例基础上，进一步的，还包括透光罩133，所述透光罩133与所述透光UV膜123之间还设置有反光片132。
以上对本发明实施例所提供的一种模块化的LED灯主体件进行了详细介绍，对于本领域的一般技术人员，依据本发明实施例的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (1)

1.一种模块化的LED灯主体件，其特征在于：包括散热器，所述散热器上具有散热冲击面，所述散热冲击面上设置有布晶孔位，所述布晶孔位中装设有LED晶粒，所述LED晶粒上具有连接线，所述LED晶粒上覆盖有透光UV膜，所述LED晶粒与透光UV膜以封装的形式固定在所述散热冲击面的布晶孔位上，所述LED晶粒上的连接线焊接所述散热冲击面的电源正负极接点上；所述散热器还包括散热鳍片和散热对流孔；所述散热鳍片环绕散热冲击面呈辐射状分布；所述散热对流孔设置在相邻的两个散热鳍片之间；所述散热器中还装设有驱动器后座，该驱动器后座连接该LED晶粒，以驱动该LED晶粒发光；所述LED晶粒与透光UV膜形成LED芯片；还包括：装设在所述散热冲击面上且位于所述LED晶粒上方的护芯圈，散热器还通过螺丝杆固定连接驱动器后座；透光罩，所述透光罩与所述透光UV膜之间设置有反光片。
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CN103453365B (zh) * 2013-09-10 2017-05-03 前海玖星光能低碳科技（深圳）有限公司 一种模块化的led灯主体件

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CN201513857U (zh) * 2009-07-17 2010-06-23 四川格兰德科技有限公司 一种自带热管的翼片式散热器的led工矿灯
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CN202062716U (zh) * 2011-05-05 2011-12-07 常州市泛亚微透科技有限公司 一种led灯具防水透气膜贴片
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CN202024135U (zh) * 2011-03-04 2011-11-02 东莞市远大光电科技有限公司 高光效的led灯泡
CN202062716U (zh) * 2011-05-05 2011-12-07 常州市泛亚微透科技有限公司 一种led灯具防水透气膜贴片
CN202901971U (zh) * 2012-11-20 2013-04-24 宣炯华 一种led灯
CN203453868U (zh) * 2013-09-10 2014-02-26 宣炯华 一种模块化的led灯主体件

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