WO2015010407A1 - 一种led及显示设备 - Google Patents
一种led及显示设备 Download PDFInfo
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- WO2015010407A1 WO2015010407A1 PCT/CN2013/088394 CN2013088394W WO2015010407A1 WO 2015010407 A1 WO2015010407 A1 WO 2015010407A1 CN 2013088394 W CN2013088394 W CN 2013088394W WO 2015010407 A1 WO2015010407 A1 WO 2015010407A1
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- WO
- WIPO (PCT)
- Prior art keywords
- led
- led chip
- quantum dot
- doped
- lamp cover
- Prior art date
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- 239000002096 quantum dot Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000004382 potting Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005286 illumination Methods 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- JGIATAMCQXIDNZ-UHFFFAOYSA-N calcium sulfide Chemical compound [Ca]=S JGIATAMCQXIDNZ-UHFFFAOYSA-N 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910001422 barium ion Inorganic materials 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005987 sulfurization reaction Methods 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 abstract 2
- 239000008188 pellet Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Definitions
- Embodiments of the present invention relate to display technology, and more particularly to an LED and a display device including the same. Background technique
- LEDs Light Emitting Diodes
- the principle of LED illumination is:
- the LED chip is a blue chip, and the quantum dot material is doped in the potting glue. After the blue light emitted by the LED chip is irradiated to the quantum dot, the quantum dot material is excited to emit red light and green light, and RGB The base color is used to synthesize white light.
- the current quantum dot materials are filled in the potting compound, and the potting compound is potted on the LED chip.
- the heat generated causes the temperature of the LED chip to rise, and at the same time, the temperature of the quantum dot material in the potting compound rises. This temperature rise reduces the stability of the quantum dot material and produces color deviations.
- Embodiments of the present invention provide an LED to reduce color deviation of LED illumination. Embodiments of the present invention also provide a display device including the LED.
- An LED according to an embodiment of the invention includes: a light emitting diode (LED) chip, a potting compound potted on the LED chip, and a lamp cover over the potting glue, wherein:
- the lampshade is doped with a quantum dot material that is capable of emitting light under the illumination of light emitted by the LED chip.
- a display device comprising a light emitting diode LED according to an embodiment of the invention.
- the quantum dot material capable of emitting light under the illumination of the light emitted by the LED chip is doped in the lamp cover, since the lamp cover is far from the LED chip, wherein the doped quantum dot material is subjected to the LED chip temperature Less affected. In this way, the color deviation of the light emitted by the LED can be reduced. Further, the display quality of the display device using the LED can be improved.
- FIG. 1 is a schematic structural diagram of an LED according to an embodiment of the present invention.
- FIG. 2 is a schematic structural view of an LED according to another embodiment of the present invention.
- FIG. 3 is a schematic view showing the structure of an LED according to still another embodiment of the present invention. detailed description
- Embodiments of the present invention provide an LED, a quantum dot material capable of emitting light under illumination of light emitted by an LED chip is doped in a lamp cover, and the quantum dot material is less affected by the temperature of the LED chip because the lamp cover is farther away from the LED chip. , can reduce the color deviation of the light emitted by the LED.
- the LED 100 provided by the embodiment of the present invention includes:
- the globe 103 is doped with a quantum dot material 104 which is capable of emitting light under the illumination of the light emitted by the LED chip 101.
- the LED 100 can be used as a light source in a liquid crystal display device, and can also be used as a light source in a lighting device.
- the quantum dot material 104 emits light having a wavelength greater than that of the blue light, such as yellow light, red light, and green light, under the blue light emitted by the LED chip 101.
- the lampshade can exhibit red, green, white, and the like.
- the quantum dot material 104 may be a mixture of calcium sulfide and a sulfide ion doped with copper ions, and / Or a metal ruthenium ion-doped volatilization, wherein a mixture of calcium sulfide and a copper ion-doped volatilization can emit red light under the blue light emitted by the LED chip 101, and the doping of the metal-doped ion can be The blue light emitted by the LED chip 101 emits green light.
- the LED can emit light of a desired color.
- the raw material is processed into pellets, and the pellets are produced into a lampshade 103 by injection molding.
- the quantum dot material 104 When the quantum dot material 104 is doped into the lampshade 103, it may be doped during the production of the pellets to form pellets doped with the quantum dot material 104; the pellets may also be processed to form a doped quantum dot material.
- the pellets of 104; doping of the quantum dot material 104 may also be performed when the pellets 103 are injection molded using the pellets.
- a gap may be left between the lamp cover 103 and the potting compound 102, as shown in FIG.
- the heat generated by the LED chip 101 is not easily transmitted to the lamp cover 103, which reduces the influence of the temperature of the LED chip 101 on the stability of the quantum dot material 104, and ensures the color display quality.
- the gap between the lamp cover 103 and the potting glue can be set to a vacuum. At this time, the heat generated by the LED chip 101 is hard to be conducted into the lamp cover 103, and the quantum dot material 104 is no longer affected by the heat generated by the LED chip 101, thereby avoiding The color deviation of the LED light emission due to the heat generation of the LED chip 101.
- the LED chip 101 and the lamp cover 103 are both fixed on the LED substrate due to
- the LED substrate is usually provided with a circuit formed of a conductive layer, so that the lamp cover 103 is fixed on the resistive film provided outside the conductive layer of the LED substrate.
- FIG. 2 An LED structure in accordance with another embodiment of the present invention is shown in FIG. As shown in Figure 2, the substrate
- the LED chip 1 is fixed on the substrate plating layer 3 by a die bonding glue 2
- the metal wire 8 connects the LED chip 1 with the positive and negative conductive layers 6, and the conductive layer 6 and the substrate plating layer 3 are provided with heat conduction.
- the insulating layer 5 and the potting glue 9 encapsulate the LED chip 2 and the metal wire 8, and the lamp cover 10 is fixed on the resistive film
- lampshade 10 is doped with a plurality of quantum dot materials 11.
- the LED chip 301 can be fixed on the LED substrate 305, and the lamp cover 303 doped with the quantum dot material 304 is fixed inside the package casing 306 of the LED. At this time, the lamp cover 303 and The distance of the LED chip 301 is larger, further reducing the influence of the heat generated by the LED chip 301 on the quantum dot material 304 in the lamp cover 303.
- Embodiments of the present invention also provide a display device including the above LED.
- the quantum dot material capable of emitting light under the illumination of the emitted light of the LED chip is doped in the lamp cover. Since the lamp cover is far away from the LED chip, the quantum dot material is subjected to the LED chip. The temperature effect is small. This can reduce the color deviation of the light emitted by the LED and improve the display quality.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
一种LED(100)及使用该LED(100)的显示设备。LED(100)包括LED芯片(101,1,301)、灌封在LED芯片(101,1,301)上的灌封胶(102,9)、以及罩在灌封胶(102,9)上的灯罩(103,10,303)。灯罩(103,10,303)中掺杂有能够在LED芯片(101,1,301)的光照下发光的量子点材料(104,11,304)。由于量子点材料(104)掺杂在灯罩(103,10,303)中,灯罩(103,10,303)距离LED芯片(101,1,301)较远,量子点材料(104)受到LED芯片(101,1,301)温度的影响较小,使用该LED(100)的显示设备可以减小色彩偏差,提高显示质量。
Description
一种 LED及显示设备 技术领域
本发明的实施例涉及显示技术, 尤其涉及一种 LED及包括该 LED的显 示设备。 背景技术
目前, 在显示设备中, 尤其是液晶显示设备中, 背光源通常采用 LED ( Light Emitting Diode, 发光二极管)作照明用。
LED的发光原理是: LED芯片为蓝色芯片,在灌封胶中掺杂量子点材料, LED 芯片发出的蓝光照射到量子点后, 激发量子点材料发出红光和绿光, RGB这三种基色以合成白光。
然而,目前的量子点材料均填充在灌封胶中,灌封胶灌封在 LED芯片上。 LED芯片长时间工作时, 产生的热使 LED芯片温度升高, 同时也使灌封胶 内量子点材料的温度升高。 这种温升会降低量子点材料的稳定性, 产生色彩 偏差。 发明内容
本发明实施例提供了一种 LED, 以减小 LED发光的色彩偏差。 本发明 的实施例还提供了一种包含该 LED的显示设备。
根据本发明实施例的 LED, 包括: 发光二极管(LED )芯片、 灌封在所 述 LED芯片上的灌封胶以及罩在所述灌封胶上的灯罩, 其中:
所述灯罩中掺杂有量子点材料,该量子点材料能够在 LED芯片发出的光 的照射下发光。
一种显示设备, 包括根据本发明实施例的发光二极管 LED。
在根据本发明实施例的 LED中, 能够在 LED芯片发出的光的照射下发 光的量子点材料掺杂在灯罩中, 由于灯罩距离 LED芯片较远,其中掺杂的量 子点材料受 LED芯片温度影响较小。 这样, 可以减小 LED发出的光的色彩 偏差。 进而, 可以提高采用该 LED的显示设备的显示质量。
附图说明
为了更清楚地说明本发明实施例的技术方案, 下面将对实施例的附图作 筒单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例, 而非对本发明的限制。
图 1为本发明实施例提供的 LED结构示意图;
图 2为根据本发明另一实施例的 LED结构示意图; 以及
图 3为根据本发明又一实施例的 LED结构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚, 下面将结合本发 明实施例的附图,对本发明实施例的技术方案进行清楚、 完整地描述。显然, 所描述的实施例是本发明的一部分实施例, 而不是全部的实施例。 基于所描 述的本发明的实施例, 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例, 都属于本发明保护的范围。
本发明的实施例提供了一种 LED, 能够在 LED芯片发出的光的照射下 发光的量子点材料掺杂在灯罩中, 由于灯罩距离 LED芯片较远,量子点材料 受到 LED芯片温度影响较小, 可以减小 LED发出的光的色彩偏差。
如图 1所示, 本发明实施例提供的 LED 100, 包括:
LED芯片 101、灌封在 LED芯片 101上的灌封胶 102以及罩在灌封胶上 的灯罩 103, 其中:
灯罩 103中掺杂有量子点材料 104, 该量子点材料能够在 LED芯片 101 发出的光的照射下发光。
该 LED 100可以用作液晶显示设备中的光源,也可以用作照明设备中的 光源。
通常, LED芯片 101通电后发出蓝光,量子点材料 104在 LED芯片 101 发出的蓝光照射下, 可以发出波长大于蓝光的波长的光线, 例如黄光、 红光 和绿光。
根据掺杂的量子点材料 104的成分不同, 灯罩可以呈现出红光、 绿光、 白光等颜色。
量子点材料 104可以采用硫化钙与掺杂有铜离子的硫化辞的混合物,和 /
或掺杂有金属铕离子的硫化辞, 其中, 硫化钙与掺杂有铜离子的硫化辞的混 合物能够在 LED芯片 101发出的蓝光照射下发出红光,掺杂金属铕离子的硫 化辞能够在 LED芯片 101发出的蓝光照射下发出绿光。
合理设置并调整量子点材料 104中各个成分的配比,即可使得 LED发出 所需颜色的光。
通常, 生产灯罩 103时, 是将原材料加工为粒料, 再通过注塑将粒料生 产为灯罩 103。
在向灯罩 103中掺杂量子点材料 104时, 可以在生产粒料时进行掺杂, 形成掺杂有量子点材料 104的粒料; 也可以对粒料进行加工, 形成掺杂有量 子点材料 104的粒料; 还可以在使用粒料进行灯罩 103的注塑时, 进行量子 点材料 104的掺杂。
为了进一步减小 LED芯片 101发热对量子点材料 104的影响,可以在灯 罩 103与灌封胶 102之间留有间隙, 如图 1所示。 当灯罩 103与灌封胶 102 之间具有间隙时, LED芯片 101发出的热量便不容易传导到灯罩 103中, 减 弱 LED芯片 101的温度对量子点材料 104稳定性的影响,保证颜色显示质量。
更进一步,可以将灯罩 103与灌封胶之间的间隙设置为真空,此时, LED 芯片 101发出的热量难以传导到灯罩 103中,量子点材料 104不再受到 LED 芯片 101发热的影响, 避免了由于 LED芯片 101发热导致的 LED发光的色 彩偏差。
通常情况下, LED芯片 101 以及灯罩 103均固定在 LED基板上, 由于
LED基板上通常设置有导电层形成的电路, 所以灯罩 103固定在 LED基板 的导电层外设置的阻抗膜上。
在图 2中示出了根据本发明另一实施例的 LED结构。如图 2所示,基板
4上镀有基板镀层 3, LED芯片 1通过固晶胶 2固定在基板镀层 3上, 金属 线 8将 LED芯片 1与正负导电层 6连接,导电层 6和基板镀层 3之间设置有 导热绝缘层 5 ,灌封胶 9灌封 LED芯片 2与金属线 8,灯罩 10固定在阻抗膜
7上, 其中灯罩 10中掺杂若干量子点材料 11。
为了进一步减小 LED芯片发出的热量对灯罩中量子点材料的影响,如图
3所示, 可以将 LED芯片 301固定在 LED基板 305上, 而将掺杂有量子点 材料 304的灯罩 303固定在 LED的封装壳体 306内侧, 此时, 灯罩 303与
LED芯片 301的距离更大, 进一步减小了 LED芯片 301发热对灯罩 303中 量子点材料 304的影响。
本发明实施例还提供一种显示设备, 包括上述 LED。
在本发明实施例提供一种 LED及显示设备中, 能够在 LED芯片的发出 的光的照射下发光的量子点材料掺杂在灯罩中, 由于灯罩距离 LED 芯片较 远, 量子点材料受到 LED芯片温度影响较小。 这样可以减小 LED发出的光 的色彩偏差, 提高显示质量。
以上所述仅是本发明的示范性实施方式, 而非用于限制本发明的保护范 围, 本发明的保护范围由所附的权利要求确定。
Claims
1. 一种 LED, 其包括: 发光二极管 LED芯片、 灌封在所述 LED芯片 上的灌封胶以及罩在所述灌封胶上的灯罩, 其中:
所述灯罩中掺杂有量子点材料,该量子点材料能够在 LED芯片发出的光 的照射下发光。
2. 如权利要求 1所述的 LED, 其中, 所述灯罩与所述灌封胶之间具有 间隙。
3. 如权利要求 2所述的 LED, 其中, 所述灯罩与所述灌封胶之间的间 隙为真空。
4. 如权利要求 1至 3中任何一项所述的 LED, 其中, 所述 LED芯片在 通电后发出蓝光;在所述 LED芯片发出的蓝光的照射下,所述量子点材料发 出的光的波长大于蓝光的波长。
5. 如权利要求 4所述的 LED, 其中, 所述波长大于蓝光的波长的光为 黄光、 红光或绿光。
6. 如权利要求 1至 5中任何一项所述的 LED, 其中, 所述量子点材料 包括硫化钙与掺杂有铜离子的硫化辞的混合物, 或掺杂有铕离子的硫化辞, 所述混合物用于在所述 LED芯片发出的蓝光照射下发出红光,所述掺杂有铕 离子的石克化辞用于在所述 LED芯片发出的蓝光照射下发出绿光。
7. 如权利要求 1至 5中任何一项所述的 LED, 其中, 所述量子点材料 包括硫化钙与掺杂有铜离子的硫化辞的混合物以及掺杂有铕离子的硫化辞, 所述混合物用于在所述 LED芯片发出的蓝光照射下发出红光,所述掺杂有铕 离子的石克化辞用于在所述 LED芯片发出的蓝光照射下发出绿光。
8. 如权利要求 1至 7任何一项所述的 LED, 其还包括 LED基板, 所述 LED芯片以及所述灯罩固定在所述 LED基板上。
9. 如权利要求 8所述的 LED, 其中, 所述 LED芯片通过固晶胶固定在 所述 LED基板上; 所述灯罩固定在设置在 LED基板上的导电层上的阻抗膜 上。
10. 如权利要求 1至 7中任何一项所述的 LED, 其中, 所述 LED还包 括 LED基板和封装壳体, 所述 LED芯片固定在 LED基板上, 所述灯罩固定
在所述封装壳体的内侧。
11. 一种显示设备, 其包括如权利要求 1至 10中任何一项所述的 LED 用作背光源。
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CN2013103197055A CN103441123A (zh) | 2013-07-26 | 2013-07-26 | 一种led及显示设备 |
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CN105449078A (zh) * | 2015-12-21 | 2016-03-30 | 华中科技大学 | 一种白光led及其制备方法 |
CN106299090A (zh) * | 2016-10-10 | 2017-01-04 | 天津中环电子照明科技有限公司 | 一种远程量子点白光led封装器件 |
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