WO2014187105A1 - Method for cutting display panel, and display apparatus - Google Patents
Method for cutting display panel, and display apparatus Download PDFInfo
- Publication number
- WO2014187105A1 WO2014187105A1 PCT/CN2013/088828 CN2013088828W WO2014187105A1 WO 2014187105 A1 WO2014187105 A1 WO 2014187105A1 CN 2013088828 W CN2013088828 W CN 2013088828W WO 2014187105 A1 WO2014187105 A1 WO 2014187105A1
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- WO
- WIPO (PCT)
- Prior art keywords
- display panel
- cut
- area
- cutting method
- cutting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000001312 dry etching Methods 0.000 claims abstract description 9
- 238000001039 wet etching Methods 0.000 claims abstract description 8
- 239000011241 protective layer Substances 0.000 claims description 27
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 21
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 16
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 10
- 238000001020 plasma etching Methods 0.000 claims description 10
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 claims description 7
- 239000012188 paraffin wax Substances 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 5
- 229910018503 SF6 Inorganic materials 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 claims description 4
- 229960000909 sulfur hexafluoride Drugs 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/355—Temporary coating
Definitions
- Embodiments of the present invention relate to a cutting method and a display device for a display panel. Background technique
- Fig. 1 shows a cutting layout of a conventional display panel in which a substrate 1 is cut along a cutting line 10 by means of stress cutting or thermal cutting to obtain a plurality of panels 11.
- Embodiments of the present invention provide a cutting method and a display device for a display panel, which can avoid problems such as cracks, light leakage, and poor uniformity in a dark state when the display device is cut by stress cutting or thermal cutting.
- the display effect of the display device is improved.
- An aspect of the invention provides a method for cutting a display panel, comprising: forming a protective layer on an upper surface and a lower surface of the display panel, the protective layer comprising an array of protection regions and a plurality of regions to be cut, wherein The area to be cut is disposed between the adjacent protection areas; the display panel corresponding to the area to be cut is etched by a wet etching or a dry etching process.
- the protective layer is formed on the upper surface and the lower surface of the display panel by inkjet or printing or lamination.
- the material of the protective layer may be paraffin or resin.
- the thickness of the protective layer may range from 10 microns to 100 microns.
- the protection area of the upper surface of the display panel corresponds to the protection area of the lower surface of the display panel, the area to be cut of the upper surface of the display panel and the lower part of the display panel The area to be cut on the surface - corresponding.
- a display panel corresponding to the area to be cut is etched using a mixed solution of hydrofluoric acid and phosphoric acid.
- the weight percentage of the hydrofluoric acid is in the range of 0.5% to 10%
- the weight percentage of the phosphoric acid is in the range of 85% to 60%.
- a mixed gas of trifluoromethane and argon, or a mixed gas of carbon tetrafluoride and argon, or sulfur hexafluoride gas is used to etch the region to be cut.
- the corresponding display panel is a mixed gas of trifluoromethane and argon, or a mixed gas of carbon tetrafluoride and argon, or sulfur hexafluoride gas.
- the display panel may be a liquid crystal display panel or an organic light emitting diode display panel.
- Another aspect of the present invention provides a display device which is obtained by cutting a cutting method of any of the above-described display panels.
- FIG. 1 is a schematic view showing a cutting layout of a conventional display panel
- FIG. 2 is a schematic flow chart of a cutting method of a display panel according to an embodiment of the present invention
- FIG. 3 is a schematic view showing a cutting layout of a display panel according to an embodiment of the present invention.
- Figure 4 is a cross-sectional view taken along line a-a of Figure 3;
- FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention. detailed description
- An embodiment of the present invention provides a method for cutting a display panel, comprising: forming a protective layer on an upper surface and a lower surface of the display panel, the protective layer comprising an array of protection regions and a plurality of regions to be cut, wherein The area to be cut is disposed between adjacent protection areas; using wet etching Or a dry etching process to etch the display panel corresponding to the area to be cut. In the area to be cut, no protective layer is formed or the protective layer is removed, thereby exposing the corresponding portion of the display panel. After the cutting, a complete display panel (motherboard) is divided into a plurality of panel units, and then these panel units are subjected to subsequent processes to prepare a display device.
- the method for cutting the display panel 1 provided by the embodiment includes: forming a protective layer on the upper surface and the lower surface of the display panel by inkjet or printing or lamination.
- the upper surface of the display panel of the embodiment of the present invention may be the outer side of the color filter substrate of the display panel.
- the lower surface of the display panel may be the outer side of the array substrate, but in the present disclosure, “upper”, “lower”, “inner” and “outer” are used for the relative positions in the drawings of the specification, and are not limited thereto.
- a protective layer 2 is formed on the upper surface and the lower surface of the display panel 1, and the protective layer 2 includes an array of protective regions 20 and a plurality of regions 21 to be cut.
- the area to be cut 21 is disposed between adjacent protection areas 20, for example, in communication with each other. No protective layer is formed in the area to be cut 21 or the protective layer is removed.
- the array may be a pixel unit array of a display panel, including a gate line, a data line, a thin film transistor, a pixel electrode, or the like for implementing a circuit structure for display.
- the material of the protective layer 2 may be paraffin or resin.
- the paraffin wax is a suitable protective layer material because the paraffin wax is resistant to etching of hydrofluoric acid and phosphoric acid.
- a paraffin or paraffin series polymer material may be applied to the upper surface and the lower surface of the display panel 1 by an ink jet method. For example, it may be applied only to the area corresponding to the protected area 20 of the array. It is also possible to apply a resin or resin-based polymer material to the upper surface and the lower surface of the display panel 1 by printing, and similarly, it is possible to apply only to the region corresponding to the protective region 20 of the array.
- a protective layer on the upper surface and the lower surface of the display panel.
- a lamination method may also be used.
- a protective layer is formed on the upper surface and the lower surface of the display panel.
- the thickness of the protective layer 2 is in the range of 10 micrometers to 100 micrometers, because the thickness of the protective layer 2 is set in the range of 10 micrometers to 100 micrometers, and the corresponding area of the display panel 1 can be protected from being engraved. Eclipse can achieve the goal of saving as much as possible.
- the protective region 20 of the upper surface of the display panel 1 corresponds to the protective region 20 of the lower surface of the display panel 1, and the upper surface of the display panel 1 is
- the area to be cut 21 corresponds to the area 21 to be cut of the lower surface of the display panel 1.
- the display panel corresponding to the domain.
- the method for etching the display panel corresponding to the area to be cut by using the wet etching process comprises: etching the area to be cut by using a mixed solution of hydrofluoric acid (HF) and phosphoric acid (H3P04) The corresponding display panel.
- HF hydrofluoric acid
- H3P04 phosphoric acid
- the mixed solution of hydrofluoric acid and phosphoric acid can react with the glass (SiO 2 ) substrate, and the inside of the display panel is free from stress during etching, which can prevent the display panel from leaking light and having poor uniformity in the dark state due to cracks generated inside the display panel. The situation happened.
- the weight percentage of hydrofluoric acid is in the range of 0.5% to 10%, and the weight percentage of phosphoric acid is in the range of 85% to 60%.
- the weight percentage of a substance refers to: a percentage of the weight of a substance as a percentage of the total solution weight of a substance, that is, the weight of a substance is A, and the weight of a total solution containing a substance is B, then, the weight of a substance The percentage is A/B*100%.
- hydrofluoric acid having a weight percentage in the range of 0.5% to 10% means that the percentage of hydrofluoric acid in the mixed solution is in the range of 0.5% to 10%, and includes a boundary value (ie, 0.5%, 10%).
- the method of etching the display panel corresponding to the area to be cut by using a dry etching process includes: using a plasma etching method or a reactive ion etching method, using a mixture of trifluoromethane (CHF3) and argon (Ar) A gas, or a mixed gas of carbon tetrafluoride (CF4) and argon, or a sulfur hexafluoride (SF6) gas, or a mixed gas of CF4 and oxygen (02), etches a display panel corresponding to the area to be cut.
- CHF3 trifluoromethane
- Ar argon
- CF4 carbon tetrafluoride
- SF6 sulfur hexafluoride
- the principle of the plasma etching method is as follows: In the plasma etching, a high-frequency glow discharge reaction is used to activate the reaction gas into active particles, such as atoms or radicals, and the active particles diffuse to the portion to be etched, where they are The etching material is reacted to form a volatile product and removed. Its advantage is the fast etch rate while achieving good physical topography. This etching method is also called dry etching.
- RIE Reactive Ion Etching
- the wet etching or dry etching process is used to etch the corresponding area to be cut.
- the display panel 1 After the display panel, the display panel 1 includes the etched area 12.
- a margin of, for example, 0.05 mm to 0.15 mm may be left, that is, the distance between the etched region of the upper surface of the display panel and the etched region of the lower surface of the display panel is 0.05 mm to 0.15 mm.
- it is to prevent external etching from damaging the inside of the display panel.
- the display panel may be a liquid crystal display panel or an organic light-emitting diode (OLED) display panel, which is not limited by the present invention.
- OLED organic light-emitting diode
- Embodiments of the present invention provide a cutting method for a display panel.
- a protective layer may be formed on the upper surface and the lower surface of the display panel, the protective layer including an array of protection regions and a plurality of regions to be cut.
- the area to be cut is disposed between adjacent protection areas, and then the wet etching or dry etching process is used to etch the display panel corresponding to the area to be cut.
- the protection area and the area to be cut are first formed in the corresponding area of the display panel, and then the display panel corresponding to the cutting area is cut by wet etching or dry etching, thereby avoiding the prior art due to stress cutting or
- the method of hot cutting cuts the display panel and causes problems such as light leakage of the display device and poor uniformity in the dark state, and improves the display effect of the display device.
- the embodiment of the invention further provides a display device comprising a display panel, which is obtained, for example, by cutting by the cutting method of the display panel.
- the display device provided by the embodiment of the present invention may be a liquid crystal display device, and the liquid crystal display device may be a product or a component having a display function, such as a liquid crystal display, a liquid crystal television, a digital photo frame, a mobile phone, a tablet computer, etc.
- the device may also be an organic light emitting diode display device, including an array substrate, and an organic light emitting material and a package cover plate evaporated on the substrate.
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- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
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Abstract
A method for cutting a display panel (1) comprises: forming protecting layers (2) on an upper surface and a lower surface of a display panel (1), the protecting layers (2) comprising protecting regions (20) of an array and multiple to-be-cut regions (21), and each to-be-cut region (21) being disposed between adjacent protecting regions (20); and etching the display panel (1) corresponding to the to-be-cut region (21) by using a wet etching process or a dry etching process. By means of the method, problems such as light leakage and poor uniformity in a dark state of a display apparatus because a display panel (1) is cut by using stress cutting or thermal cutting can be avoided, thereby improving the display effect of the display apparatus.
Description
显示面板的切割方法及显示装置 技术领域 Cutting method and display device for display panel
本发明的实施例涉及一种显示面板的切割方法及显示装置。 背景技术 Embodiments of the present invention relate to a cutting method and a display device for a display panel. Background technique
现有的薄膜场效应晶体管液晶显示器 （ TFT-LCD , Thin Film Transistor-Liquid Crystal Display )基板是由一块完整的显示面板（母板）按 照预先设置的切割线，采用应力切割或热切割的方式切割为多块基板所得的。 图 1为传统的显示面板的切割布局， 采用应力切割或热切割的方式， 沿切割 线 10切割基板 1 , 以获得多块面板 11。 The existing TFT-LCD (Thin Film Transistor-Liquid Crystal Display) substrate is cut by a cutting or pre-setting cutting line according to a preset cutting line, and is cut by stress cutting or hot cutting. Obtained for multiple substrates. Fig. 1 shows a cutting layout of a conventional display panel in which a substrate 1 is cut along a cutting line 10 by means of stress cutting or thermal cutting to obtain a plurality of panels 11.
然而， 采用传统的应力切割或热切割的方式切割显示面板会导致显示面 板的切割边产生裂缝， 进而发生应变， 从而导致显示装置具有漏光以及暗态 时存在均一性不良等问题， 降低了 TFT-LCD的显示效果。 发明内容 However, cutting the display panel by conventional stress cutting or thermal cutting may cause cracks in the cutting edge of the display panel, and then strain occurs, thereby causing problems such as light leakage of the display device and poor uniformity in the dark state, and the TFT is lowered. LCD display effect. Summary of the invention
本发明的实施例提供一种显示面板的切割方法及显示装置， 能够避免由 于采用应力切割或热切割的方式切割显示面板而导致显示装置具有裂缝、 漏 光以及暗态时存在均一性不良等问题， 提高了显示装置的显示效果。 Embodiments of the present invention provide a cutting method and a display device for a display panel, which can avoid problems such as cracks, light leakage, and poor uniformity in a dark state when the display device is cut by stress cutting or thermal cutting. The display effect of the display device is improved.
本发明的一方面提供了一种显示面板的切割方法， 包括： 在显示面板的 上表面及下表面形成保护层， 所述保护层包括阵列的保护区域及多个待切割 区域， 其中， 所述待切割区域设置于相邻的保护区域之间； 采用湿法刻蚀或 干法刻蚀工艺， 刻蚀所述待切割区域所对应的显示面板。 An aspect of the invention provides a method for cutting a display panel, comprising: forming a protective layer on an upper surface and a lower surface of the display panel, the protective layer comprising an array of protection regions and a plurality of regions to be cut, wherein The area to be cut is disposed between the adjacent protection areas; the display panel corresponding to the area to be cut is etched by a wet etching or a dry etching process.
例如， 采用喷墨或印刷或层压的方式， 在所述显示面板的上表面及下表 面形成所述保护层。 For example, the protective layer is formed on the upper surface and the lower surface of the display panel by inkjet or printing or lamination.
例如， 所述保护层的材料可以为石蜡或树脂。 For example, the material of the protective layer may be paraffin or resin.
例如， 所述保护层的厚度可以在 10微米至 100微米的范围内。 For example, the thickness of the protective layer may range from 10 microns to 100 microns.
例如， 所述显示面板的上表面的保护区域与所述显示面板的下表面的保 护区域——对应， 所述显示面板的上表面的待切割区域与所述显示面板的下
表面的待切割区域——对应。 For example, the protection area of the upper surface of the display panel corresponds to the protection area of the lower surface of the display panel, the area to be cut of the upper surface of the display panel and the lower part of the display panel The area to be cut on the surface - corresponding.
例如， 采用氢氟酸和磷酸的混合溶液， 刻蚀所述待切割区域所对应的显 示面板。 例如， 所述氢氟酸的重量百分比在 0.5%至 10%的范围内， 所述磷酸 的重量百分比在 85%至 60%的范围内。 For example, a display panel corresponding to the area to be cut is etched using a mixed solution of hydrofluoric acid and phosphoric acid. For example, the weight percentage of the hydrofluoric acid is in the range of 0.5% to 10%, and the weight percentage of the phosphoric acid is in the range of 85% to 60%.
例如， 利用等离子体刻蚀法或反应离子刻蚀法， 采用三氟甲烷和氩的混 合气体， 或者四氟化碳和氩的混合气体， 或者六氟化硫气体， 刻蚀所述待切 割区域所对应的显示面板。 For example, using a plasma etching method or a reactive ion etching method, a mixed gas of trifluoromethane and argon, or a mixed gas of carbon tetrafluoride and argon, or sulfur hexafluoride gas is used to etch the region to be cut. The corresponding display panel.
所述显示面板可以为液晶显示面板或有机发光二极管显示面板。 The display panel may be a liquid crystal display panel or an organic light emitting diode display panel.
本发明的另一方面提供了一种显示装置， 所述显示装置为如上述任意所 述的显示面板的切割方法切割所得。 附图说明 Another aspect of the present invention provides a display device which is obtained by cutting a cutting method of any of the above-described display panels. DRAWINGS
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。 In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present invention, rather than to the present invention. limit.
图 1为传统的显示面板的切割布局示意图； 1 is a schematic view showing a cutting layout of a conventional display panel;
图 2为本发明实施例的显示面板的切割方法流程示意图； 2 is a schematic flow chart of a cutting method of a display panel according to an embodiment of the present invention;
图 3为本发明实施例的显示面板的切割布局示意图； 3 is a schematic view showing a cutting layout of a display panel according to an embodiment of the present invention;
图 4为图 3的 a-a向截面图； Figure 4 is a cross-sectional view taken along line a-a of Figure 3;
图 5为本发明实施例的显示面板结构示意图。 具体实施方式 FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention. detailed description
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。 The technical solutions of the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings of the embodiments of the present invention. It is apparent that the described embodiments are part of the embodiments of the invention, rather than all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without departing from the scope of the invention are within the scope of the invention.
本发明的一个实施例提供一种显示面板的切割方法， 包括： 在显示面板 的上表面及下表面形成保护层， 所述保护层包括阵列的保护区域及多个待切 割区域， 其中， 所述待切割区域设置于相邻的保护区域之间； 采用湿法刻蚀
或干法刻蚀工艺，刻蚀所述待切割区域所对应的显示面板。在待切割区域中， 没有形成保护层或保护层被除去， 从而露出显示面板的相应部分。 在切割之 后， 一块完整的显示面板（母板）被分割成多个面板单元， 然后这些面板单 元进行后续工序以制备显示装置。 An embodiment of the present invention provides a method for cutting a display panel, comprising: forming a protective layer on an upper surface and a lower surface of the display panel, the protective layer comprising an array of protection regions and a plurality of regions to be cut, wherein The area to be cut is disposed between adjacent protection areas; using wet etching Or a dry etching process to etch the display panel corresponding to the area to be cut. In the area to be cut, no protective layer is formed or the protective layer is removed, thereby exposing the corresponding portion of the display panel. After the cutting, a complete display panel (motherboard) is divided into a plurality of panel units, and then these panel units are subjected to subsequent processes to prepare a display device.
如图 2所示， 本实施例提供的显示面板 1的切割方法， 该方法包括： 采 用喷墨或印刷或层压的方式， 在显示面板的上表面及下表面形成保护层。 As shown in FIG. 2, the method for cutting the display panel 1 provided by the embodiment includes: forming a protective layer on the upper surface and the lower surface of the display panel by inkjet or printing or lamination.
需要说明的是， 由于显示面板是由阵列基板与彩膜基板对盒 ( cell-assembly )形成的， 因此， 本发明实施例的显示面板的上表面， 可以为 显示面板的彩膜基板的外侧， 显示面板的下表面， 可以为阵列基板的外侧， 但本公开中 "上" "下" "内" "外" 均是针对说明书附图中的相对位置而 言的， 此处不做限定语。 It should be noted that, since the display panel is formed by the array substrate and the color filter substrate, the upper surface of the display panel of the embodiment of the present invention may be the outer side of the color filter substrate of the display panel. The lower surface of the display panel may be the outer side of the array substrate, but in the present disclosure, "upper", "lower", "inner" and "outer" are used for the relative positions in the drawings of the specification, and are not limited thereto.
如图 3所示， 在显示面板 1的上表面及下表面形成保护层 2, 保护层 2 包括阵列的保护区域 20, 以及多个待切割区域 21。 待切割区域 21设置于相 邻的保护区域 20之间， 例如彼此相连通。 待切割区域 21中没有形成保护层 或保护层被去除。 阵列可以为显示面板的像素单元阵列， 包括栅线、数据线、 薄膜晶体管、 像素电极等用于实现显示的电路结构。 As shown in FIG. 3, a protective layer 2 is formed on the upper surface and the lower surface of the display panel 1, and the protective layer 2 includes an array of protective regions 20 and a plurality of regions 21 to be cut. The area to be cut 21 is disposed between adjacent protection areas 20, for example, in communication with each other. No protective layer is formed in the area to be cut 21 or the protective layer is removed. The array may be a pixel unit array of a display panel, including a gate line, a data line, a thin film transistor, a pixel electrode, or the like for implementing a circuit structure for display.
示例性的， 保护层 2的材料可以为石蜡或树脂， 优选地， 石蜡为较适合 的保护层材料， 因为石蜡可以抵抗氟酸及磷酸的刻蚀。 Illustratively, the material of the protective layer 2 may be paraffin or resin. Preferably, the paraffin wax is a suitable protective layer material because the paraffin wax is resistant to etching of hydrofluoric acid and phosphoric acid.
例如， 可以采用喷墨方式， 在显示面板 1的上表面及下表面涂覆石蜡或 石蜡系列的高分子材料。例如，可以仅涂覆在阵列的保护区域 20所对应的区 域。 也可以采用印刷方式， 在显示面板 1的上表面及下表面涂覆树脂或树脂 类的高分子材料， 同样的， 可以仅涂覆在阵列的保护区域 20所对应的区域。 For example, a paraffin or paraffin series polymer material may be applied to the upper surface and the lower surface of the display panel 1 by an ink jet method. For example, it may be applied only to the area corresponding to the protected area 20 of the array. It is also possible to apply a resin or resin-based polymer material to the upper surface and the lower surface of the display panel 1 by printing, and similarly, it is possible to apply only to the region corresponding to the protective region 20 of the array.
本领域技术人员可以理解的是， 在显示面板的上表面及下表面形成保护 层的方法有多种， 除了上述实施例提出的喷墨或印刷方式以外， 例如还可以 采用层压的方式， 在显示面板的上表面及下表面形成保护层。 It can be understood by those skilled in the art that there are various methods for forming a protective layer on the upper surface and the lower surface of the display panel. In addition to the inkjet or printing method proposed in the above embodiments, for example, a lamination method may also be used. A protective layer is formed on the upper surface and the lower surface of the display panel.
例如，保护层 2的厚度在 10微米至 100微米的范围内， 这是由于，将保 护层 2的厚度设置在 10微米至 100微米的范围内， 既可以保护显示面板 1 对应的区域不被刻蚀， 又可以达到尽可能节约成本的目的。 For example, the thickness of the protective layer 2 is in the range of 10 micrometers to 100 micrometers, because the thickness of the protective layer 2 is set in the range of 10 micrometers to 100 micrometers, and the corresponding area of the display panel 1 can be protected from being engraved. Eclipse can achieve the goal of saving as much as possible.
如图 4所示， 为图 3的 a-a向截面图， 显示面板 1的上表面的保护区域 20与显示面板 1的下表面的保护区域 20——对应， 显示面板 1的上表面的
待切割区域 21与显示面板 1的下表面的待切割区域 21——对应。 域所对应的显示面板。 As shown in FIG. 4, in the aa cross-sectional view of FIG. 3, the protective region 20 of the upper surface of the display panel 1 corresponds to the protective region 20 of the lower surface of the display panel 1, and the upper surface of the display panel 1 is The area to be cut 21 corresponds to the area 21 to be cut of the lower surface of the display panel 1. The display panel corresponding to the domain.
仍如图 3所示， 采用湿法刻蚀工艺， 刻蚀待切割区域所对应的显示面板 的方法包括： 采用氢氟酸（HF )和磷酸（H3P04 )的混合溶液， 刻蚀待切割 区域 21所对应的显示面板。 Still as shown in FIG. 3, the method for etching the display panel corresponding to the area to be cut by using the wet etching process comprises: etching the area to be cut by using a mixed solution of hydrofluoric acid (HF) and phosphoric acid (H3P04) The corresponding display panel.
氢氟酸和磷酸的混合溶液能够与玻璃（Si02 )基板发生反应， 且刻蚀时 显示面板内部无应力产生， 可以防止由于显示面板内部的应力产生裂缝而使 得显示面板漏光及暗态时均一性差的情况发生。 The mixed solution of hydrofluoric acid and phosphoric acid can react with the glass (SiO 2 ) substrate, and the inside of the display panel is free from stress during etching, which can prevent the display panel from leaking light and having poor uniformity in the dark state due to cracks generated inside the display panel. The situation happened.
优选地， 氢氟酸的重量百分比在 0.5%至 10%的范围内，磷酸的重量百分 比在 85%至 60%的范围内。 Preferably, the weight percentage of hydrofluoric acid is in the range of 0.5% to 10%, and the weight percentage of phosphoric acid is in the range of 85% to 60%.
这里， 某物质的重量百分比是指： 某物质的重量占包含某物质的总溶液 重量的百分比例， 即某物质的重量为 A, 包含某物质的总溶液重量为 B, 那 么， 某物质的重量百分比为 A/B*100%。 例如， 重量百分比在 0.5%至 10%的 范围内的氢氟酸是指氢氟酸在混合溶液中所占的百分比例在 0.5%至 10%的 范围内， 且包含边界值（即 0.5%、 10% ) 。 Here, the weight percentage of a substance refers to: a percentage of the weight of a substance as a percentage of the total solution weight of a substance, that is, the weight of a substance is A, and the weight of a total solution containing a substance is B, then, the weight of a substance The percentage is A/B*100%. For example, hydrofluoric acid having a weight percentage in the range of 0.5% to 10% means that the percentage of hydrofluoric acid in the mixed solution is in the range of 0.5% to 10%, and includes a boundary value (ie, 0.5%, 10%).
或者， 采用干法刻蚀工艺， 刻蚀待切割区域所对应的显示面板的方法包 括：利用等离子体刻蚀法或反应离子刻蚀法，采用三氟甲烷（ CHF3 )和氩（ Ar ) 的混合气体， 或者四氟化碳（CF4 )和氩的混合气体， 或者六氟化硫（SF6 ) 气体，或者 CF4和氧（ 02 )的混合气体，刻蚀待切割区域所对应的显示面板。 Alternatively, the method of etching the display panel corresponding to the area to be cut by using a dry etching process includes: using a plasma etching method or a reactive ion etching method, using a mixture of trifluoromethane (CHF3) and argon (Ar) A gas, or a mixed gas of carbon tetrafluoride (CF4) and argon, or a sulfur hexafluoride (SF6) gas, or a mixed gas of CF4 and oxygen (02), etches a display panel corresponding to the area to be cut.
等离子体刻蚀法的原理为： 等离子体刻蚀时采用高频辉光放点反应， 使 反应气体激活成活性粒子， 如原子或游离基， 这些活性粒子扩散到需要刻蚀 的部位， 在那里与被刻蚀材料进行反应， 形成挥发性生成物而被去除。 它的 优势在于快速刻蚀速率同时可获得良好的物理形貌。 这种刻蚀方法也叫做干 法刻蚀。 The principle of the plasma etching method is as follows: In the plasma etching, a high-frequency glow discharge reaction is used to activate the reaction gas into active particles, such as atoms or radicals, and the active particles diffuse to the portion to be etched, where they are The etching material is reacted to form a volatile product and removed. Its advantage is the fast etch rate while achieving good physical topography. This etching method is also called dry etching.
反应离子刻蚀（RIE, Reactive Ion Etching )法的原理为： 当在平板电极 之间施加例如 10MHZ-100MHZ的高频电压（RF, Radio Frequency ) 时会产 生数百微米厚的离子层（ion sheath ) , 在其中放入待刻蚀物体， 离子高速撞 击待刻蚀物体而完成化学反应蚀刻。 The principle of the Reactive Ion Etching (RIE) method is: When a high frequency voltage (RF, Radio Frequency) of, for example, 10 MHz to 100 MHz is applied between the plate electrodes, an ion layer of several hundred micrometers is generated. ), the object to be etched is placed therein, and the ion strikes the object to be etched at a high speed to complete the chemical reaction etching.
如图 5所示， 采用湿法刻蚀或干法刻蚀工艺， 刻蚀待切割区域所对应的
显示面板后， 显示面板 1包括已刻蚀区域 12。 时， 并非完全切割， 可以留下例如 0.05mm至 0.15mm余量， 即显示面板的 上表面的已刻蚀区域与显示面板的下表面的已刻蚀区域之间的距离在 0.05mm至 0.15mm的范围内， 这是为了防止外部的刻蚀损坏显示面板内部。 As shown in FIG. 5, the wet etching or dry etching process is used to etch the corresponding area to be cut. After the display panel, the display panel 1 includes the etched area 12. When not completely cut, a margin of, for example, 0.05 mm to 0.15 mm may be left, that is, the distance between the etched region of the upper surface of the display panel and the etched region of the lower surface of the display panel is 0.05 mm to 0.15 mm. Within the scope of this, it is to prevent external etching from damaging the inside of the display panel.
进一步地， 例如， 显示面板可以为液晶显示面板或有机发光二极管 ( OLED, Organic Light-Emitting Diode )显示面板， 本发明不#文限制。 Further, for example, the display panel may be a liquid crystal display panel or an organic light-emitting diode (OLED) display panel, which is not limited by the present invention.
本发明实施例提供了显示面板的切割方法， 在进行显示面板的切割时， 可以通过在显示面板的上表面及下表面形成保护层， 该保护层包括阵列的保 护区域及多个待切割区域。 待切割区域设置于相邻的保护区域之间， 进而采 用湿法刻蚀或干法刻蚀工艺， 刻蚀待切割区域所对应的显示面板。 通过该方 案， 首先在显示面板对应区域形成保护区域和待切割区域， 再采用湿法刻蚀 或干法刻蚀对待切割区域对应的显示面板进行切割， 进而能够避免现有技术 由于采用应力切割或热切割的方式切割显示面板而导致的显示装置漏光以及 暗态时均一性不良等问题， 提高的显示装置的显示效果。 Embodiments of the present invention provide a cutting method for a display panel. When performing cutting of the display panel, a protective layer may be formed on the upper surface and the lower surface of the display panel, the protective layer including an array of protection regions and a plurality of regions to be cut. The area to be cut is disposed between adjacent protection areas, and then the wet etching or dry etching process is used to etch the display panel corresponding to the area to be cut. Through the solution, the protection area and the area to be cut are first formed in the corresponding area of the display panel, and then the display panel corresponding to the cutting area is cut by wet etching or dry etching, thereby avoiding the prior art due to stress cutting or The method of hot cutting cuts the display panel and causes problems such as light leakage of the display device and poor uniformity in the dark state, and improves the display effect of the display device.
本发明实施例还提供一种显示装置， 包括显示面板， 该显示面板例如是 由上述显示面板的切割方法切割所得到的。 The embodiment of the invention further provides a display device comprising a display panel, which is obtained, for example, by cutting by the cutting method of the display panel.
本发明实施例提供的显示装置可以为液晶显示装置， 所述液晶显示装置 可以为液晶显示器、 液晶电视、 数码相框、 手机、 平板电脑等具有显示功能 的产品或者部件； 本发明实施例提供的显示装置还可以为有机发光二极管显 示装置， 包括阵列基板， 以及蒸镀于该基板之上的有机发光材料及封装盖板。 The display device provided by the embodiment of the present invention may be a liquid crystal display device, and the liquid crystal display device may be a product or a component having a display function, such as a liquid crystal display, a liquid crystal television, a digital photo frame, a mobile phone, a tablet computer, etc. The device may also be an organic light emitting diode display device, including an array substrate, and an organic light emitting material and a package cover plate evaporated on the substrate.
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。
The above is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the appended claims.
Claims
1、 一种显示面板的切割方法， 包括： 1. A cutting method for a display panel, including:
在显示面板的上表面及下表面形成保护层， 所述保护层包括阵列的保护 区域及多个待切割区域，其中，所述待切割区域设置于相邻的保护区域之间； 采用湿法刻蚀或干法刻蚀工艺，刻蚀所述待切割区域所对应的显示面板。 A protective layer is formed on the upper surface and lower surface of the display panel. The protective layer includes a protective area of the array and a plurality of areas to be cut, wherein the area to be cut is provided between adjacent protective areas; wet etching is used An etching or dry etching process is used to etch the display panel corresponding to the area to be cut.
2、根据权利要求 1所述的显示面板的切割方法， 其中， 采用喷墨或印刷 或层压的方式， 在所述显示面板的上表面及下表面形成所述保护层。 2. The display panel cutting method according to claim 1, wherein the protective layer is formed on the upper surface and lower surface of the display panel by using inkjet, printing or lamination.
3、根据权利要求 1或 2所述的显示面板的切割方法， 其中， 所述保护层 的材料为石蜡或树脂。 3. The display panel cutting method according to claim 1 or 2, wherein the material of the protective layer is paraffin wax or resin.
4、 根据权利要求 1-3中任一项所述的显示面板的切割方法， 其中， 所述 保护层厚度在 10微米至 100微米的范围内。 4. The display panel cutting method according to any one of claims 1 to 3, wherein the thickness of the protective layer is in the range of 10 microns to 100 microns.
5、 根据权利要求 1-4任一所述的显示面板的切割方法， 其中， 所述显示 面板的上表面的保护区域与所述显示面板的下表面的保护区域——对应， 所 述显示面板的上表面的待切割区域与所述显示面板的下表面的待切割区域一 一对应。 5. The cutting method of a display panel according to any one of claims 1 to 4, wherein the protective area on the upper surface of the display panel corresponds to the protective area on the lower surface of the display panel, and the display panel The area to be cut on the upper surface of the display panel corresponds to the area to be cut on the lower surface of the display panel.
6、 根据权利要求 1-5任一所述的显示面板的切割方法， 其中， 采用氢氟 酸和磷酸的混合溶液， 刻蚀所述待切割区域所对应的显示面板。 6. The display panel cutting method according to any one of claims 1 to 5, wherein a mixed solution of hydrofluoric acid and phosphoric acid is used to etch the display panel corresponding to the area to be cut.
7、根据权利要求 6所述的显示面板的切割方法， 其中， 所述氢氟酸的重 量百分比在 0.5%至 10%的范围内， 所述磷酸的重量百分比在 85%至 60%的 范围内。 7. The display panel cutting method according to claim 6, wherein the weight percentage of the hydrofluoric acid is in the range of 0.5% to 10%, and the weight percentage of the phosphoric acid is in the range of 85% to 60% .
8、 根据权利要求 1-5任一所述的显示面板的切割方法， 其中， 利用等离 子体刻蚀法或反应离子刻蚀法， 采用三氟甲烷和氩的混合气体， 或者四氟化 碳和氩的混合气体， 或者六氟化硫气体， 刻蚀所述待切割区域所对应的显示 面板。 8. The display panel cutting method according to any one of claims 1 to 5, wherein plasma etching or reactive ion etching is used, a mixed gas of trifluoromethane and argon, or carbon tetrafluoride and A mixed gas of argon or sulfur hexafluoride gas is used to etch the display panel corresponding to the area to be cut.
9、 根据权利要求 1-8任一所述的显示面板的切割方法， 其中， 所述显示 面板为液晶显示面板或有机发光二极管显示面板。 9. The cutting method of a display panel according to any one of claims 1 to 8, wherein the display panel is a liquid crystal display panel or an organic light-emitting diode display panel.
10、 一种根据权利要求 1-9中任意一项所述的显示面板的切割方法切割 所得的显示面板。 10. A display panel cut according to the display panel cutting method according to any one of claims 1-9.
11、 一种显示装置， 包括权利要求 10所述的显示面板。
11. A display device, comprising the display panel according to claim 10.
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- 2013-12-09 WO PCT/CN2013/088828 patent/WO2014187105A1/en active Application Filing
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| JP2005219960A (en) * | 2004-02-05 | 2005-08-18 | Nishiyama Stainless Chem Kk | Cutting and separation method of glass, glass substrate for flat panel display, and flat panel display |
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| CN103293742A (en) | 2013-09-11 |
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