WO2014171387A1 - 導電性粘着シート、その製造方法及びそれを用いて得た電子端末 - Google Patents
導電性粘着シート、その製造方法及びそれを用いて得た電子端末 Download PDFInfo
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- WO2014171387A1 WO2014171387A1 PCT/JP2014/060382 JP2014060382W WO2014171387A1 WO 2014171387 A1 WO2014171387 A1 WO 2014171387A1 JP 2014060382 W JP2014060382 W JP 2014060382W WO 2014171387 A1 WO2014171387 A1 WO 2014171387A1
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- sensitive adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Definitions
- the present invention relates to a conductive pressure-sensitive adhesive sheet that can be used for manufacturing electronic devices such as portable electronic terminals.
- a conductive adhesive sheet is often used for the purpose of shielding electromagnetic waves that can be generated from the electronic device or imparting antistatic properties to an arbitrary site.
- a pressure-sensitive adhesive sheet having a conductive pressure-sensitive adhesive layer containing a conductive filler on a conductive base material made of, for example, metal foil is known (see, for example, Patent Documents 1 and 2). ).
- the conductive adhesive sheet using the metal foil as described above is not sufficient in terms of flexibility, when there is a minute step on the surface of the adherend, the step portion cannot be followed, In some cases, voids were formed at the interface between the adherend and the pressure-sensitive adhesive layer.
- the conductive adhesive sheet as described above is often not sufficient in terms of the reworkability, and may not be reused and re-applied.
- a conductive adhesive sheet that has both a level of conductivity that can sufficiently shield electromagnetic waves and the like, a level of flexibility that can follow the stepped portion, etc. of the adherend, and reworkability has not yet been found. It was not put out.
- the problem to be solved by the present invention is a conductivity that has both a level of conductivity that can sufficiently shield electromagnetic waves and the like, a level of flexibility that can follow the stepped portion, etc. of the adherend, and reworkability. It is to provide an adhesive sheet.
- the conductive base material is plated with a wet polyester nonwoven fabric base material including an electroless plating treatment. Obtained by processing, By using a conductive pressure-sensitive adhesive sheet in which the conductive pressure-sensitive adhesive layer contains 3% by mass to 50% by mass of conductive particles with respect to the whole conductive pressure-sensitive adhesive layer, the above-described problems have been solved.
- the conductive pressure-sensitive adhesive sheet of the present invention has a level of conductivity that can sufficiently shield electromagnetic waves, etc., a level of flexibility that can follow stepped portions and the like derived from fine irregularities of the adherend, and reworkability Since it has excellent adhesion to adherends, it is suitable for use in, for example, electromagnetic wave shielding sheets that can be used in the manufacture of electronic devices and the like, adhesive sheets for grounding fixing to prevent static charge, etc. be able to.
- the conductive pressure-sensitive adhesive sheet of the present invention is a conductive pressure-sensitive adhesive sheet having a conductive pressure-sensitive adhesive layer on at least one surface of a conductive base material.
- the conductive adhesive layer contains 3% by mass to 50% by mass of conductive particles with respect to the entire conductive adhesive layer. It is characterized by this.
- the “sheet” means a form having at least one conductive adhesive layer on at least one surface of a conductive substrate.
- seat contains all the product forms, such as a sheet
- the conductive adhesive sheet of the present invention for example, a structure having a single layer or a plurality of layers of the conductive adhesive layer on one side of the conductive substrate, the conductive adhesive layer on both sides of the conductive substrate.
- the structure which has a single layer or multiple layers, respectively is mentioned.
- the conductive adhesive sheet of the present invention may have a layer other than the conductive base material and the conductive adhesive layer as necessary.
- the conductive adhesive sheet preferably has a total thickness of 100 ⁇ m or less, more preferably has a total thickness of 60 ⁇ m or less, and has a total thickness of 40 ⁇ m or less. Is more preferable because it can maintain excellent flexibility, conductivity and adhesiveness, and contribute to thinning of electronic devices and the like.
- the lower limit of the total thickness of the conductive pressure-sensitive adhesive sheet is preferably 5 ⁇ m or more.
- the said total thickness points out the thickness of electroconductive adhesive sheet itself which does not contain a peeling film.
- the conductive substrate constituting the conductive pressure-sensitive adhesive sheet of the present invention one obtained by subjecting a wet polyester nonwoven fabric substrate to plating treatment including electroless plating treatment can be used.
- a substrate having a thickness of 6 ⁇ m to 50 ⁇ m is preferably used, and a substrate having a thickness of 10 ⁇ m to 30 ⁇ m is more preferable.
- those having a tensile strength in the MD (flow) direction of 3 N / 20 mm to 35 N / 20 mm are preferably used, and those having a tensile strength of 5 N / 20 mm to 30 N / 20 mm are used. More preferably, it is more preferably 10N / 20mm to 27N / 20mm.
- a conductive base material having a tensile strength in the TD (width) direction of 0.5 N / 20 mm to 35 N / 20 mm, preferably 3 N / 20 mm to 30 N / 20 mm. It is more preferable to use one that is 10 N / 20 mm to 27 N / 20 mm.
- the reworkability makes it difficult to cause the conductive pressure-sensitive adhesive sheet to be shredded and has excellent reworkability. Can be maintained, and a conductive pressure-sensitive adhesive sheet having good adhesion between the conductive substrate and the conductive pressure-sensitive adhesive layer can be obtained.
- a material having a [MD direction tensile strength / TD direction tensile strength] in the range of 0.7 to 1.3 is used. It is preferable because it is difficult to cause tearing of the pressure-sensitive adhesive sheet and can maintain excellent reworkability.
- the tensile strength refers to a value measured by pulling at a speed of 300 mm / min according to JIS Z0237-2010.
- said electroconductive base material it is preferable to use what has a surface resistance value (x-axis direction, y-axis direction) of 0.5 ⁇ / 25 mm ⁇ 25 mm or less, and 0.1 ⁇ / 25 mm ⁇ 25 mm or less. It is more preferable to use one having a surface resistance value (x-axis direction, y-axis direction), and one having a surface resistance value (x-axis direction, y-axis direction) of 0.05 ⁇ / 25 mm ⁇ 25 mm or less is used. It is more preferable to use a material having a surface resistance value (x, y) of 0.01 ⁇ / 25 mm ⁇ 25 mm or less, in order to give even more excellent conductivity.
- the conductive substrate preferably has a vertical surface resistance value (z-axis direction) of 0.1 ⁇ / 25 mm ⁇ 25 mm or less, and has a vertical surface resistance of 0.05 ⁇ / 25 mm ⁇ 25 mm or less. It is more preferable to use a material having a value (z-axis direction), and it is preferable to use a material having a vertical surface resistance value (z-axis direction) of 0.03 ⁇ / 25 mm ⁇ 25 mm or less, and 0.01 ⁇ / 25 mm. It is particularly preferable to use one having a vertical surface resistance value (z-axis direction) of ⁇ 25 mm or less in order to impart even more excellent conductivity.
- vertical surface resistance value (z-axis direction) points out the value measured by the method described in the Example.
- a wet polyester nonwoven fabric substrate is used.
- the specific nonwoven fabric base material it is possible to prevent peeling of the plating layer formed by the plating treatment, and it is possible to obtain a conductive pressure-sensitive adhesive sheet having further excellent reworkability.
- wet polyester-based non-woven fabric substrate those obtained by paper-making polyester fibers dispersed in water or the like can be used.
- polyester fiber for example, a fiber having a diameter of 2 ⁇ m to 10 ⁇ m is preferably used, and a fiber having a diameter of 3 ⁇ m to 8 ⁇ m is more preferable.
- the papermaking method is not particularly limited, and examples thereof include a method using a circular paper machine, a short paper machine, a long paper machine, and a slanted short paper machine.
- the wet polyester nonwoven fabric base material it is preferable to use a heated one for the purpose of binding polyester fibers after paper making by the above method.
- the wet polyester nonwoven fabric base material preferably has a basis weight in the range of 2 g / m 2 to 20 g / m 2 in order to achieve both excellent flexibility and strength. It is more preferable to use a material having a basis weight in the range of / m 2 to 16 g / m 2 , and a material having a basis weight in the range of 6 g / m 2 to 15 g / m 2 is thin and reworked. It is further preferable for obtaining a conductive pressure-sensitive adhesive sheet having excellent properties.
- one having a thickness of 5 ⁇ m to 50 ⁇ m is preferably used, more preferably one having a thickness of 10 ⁇ m to 30 ⁇ m, more preferably 14 ⁇ m to 20 ⁇ m. It is particularly preferred to use one.
- those having a tensile strength in the MD (flow) direction of 2 N / 20 mm to 30 N / 20 mm are preferably used, and those having a tensile strength of 5 N / 20 mm to 28 N / 20 mm are used. More preferably, it is more preferable to use the one of 10 N / 20 mm to 25 N / 20 mm.
- the wet polyester nonwoven fabric base material preferably has a tensile strength in the TD (width) direction of 0.3 N / 20 mm to 30 N / 20 mm, and preferably 2 N / 20 mm to 27 N / 20 mm. It is more preferable to use one having a thickness of 9 N / 20 mm to 25 N / 20 mm.
- the tensile strength refers to a value measured by pulling at a speed of 300 mm / min according to JIS Z0237-2010.
- the conductive substrate can be produced by subjecting the wet polyester nonwoven fabric substrate to a plating treatment including an electroless plating treatment.
- plating process including electroless plating process means a process of performing electroless plating process once or a plurality of times, a process of performing electroplating process once or a plurality of times after the electroless plating process, and electrolysis This refers to a process in which the electroless plating process is performed once or a plurality of times after the plating process is performed once or a plurality of times.
- it is preferable to further perform an electroless plating process or an electrolytic plating process after performing the electroless plating process it is preferable to further perform an electroless plating process or an electrolytic plating process after performing the electroless plating process, and it is more preferable to perform an electrolytic plating process after performing the electroless plating process.
- the electroless plating treatment method for example, by immersing the wet unsaturated polyester nonwoven fabric substrate in a liquid containing a catalyst such as palladium, or an electroless plating liquid containing a metal ion and a reducing agent, The method of forming a metal film on the surface of a nonwoven fabric base material is mentioned.
- the step of washing the wet polyester nonwoven fabric substrate, the step of activating the catalyst, the wet polyester nonwoven fabric substrate and the plating treatment are performed. You may pass through the process of washing or drying a thing.
- the wet polyester nonwoven fabric substrate is washed and washed with water, then a catalyst is applied to the wet polyester nonwoven fabric substrate, washed with water, the catalyst is activated, and washed with water.
- the wet polyester type nonwoven fabric base material is immersed in an electroless plating solution, washed with water and dried.
- Examples of the metal ions contained in the electroless plating solution include ions such as copper, nickel, silver, platinum, and aluminum, and the use of at least one ion of copper or nickel further improves conductivity. In view of achieving both low cost and low cost, it is more preferable to use copper ions to provide even better adhesion.
- the metal ions are preferably contained in an amount of 0.001 mol / l to 0.2 mol / l with respect to the electroless plating solution.
- the metal ions are preferably derived from copper sulfate, nickel sulfate, nickel chloride, palladium chloride, silver chloride, silver nitrate and mixtures thereof, and more preferably using copper sulfate, nickel sulfate, nickel chloride, It is preferable for the presence of copper or nickel ions suitable for achieving both excellent conductivity and low cost.
- Examples of the reducing agent that may be contained in the electroless plating solution include sodium hypophosphite, sodium borohydride, potassium borohydride, Rochelle salt, dimethylamine borane, diethylamine borane, formalin, and hydrazine compounds.
- Hydrated hydrazine, hydrazine hydrochloride, hydrazine sulfate, methyl hydrazine, 1,2-dimethylhydrazine, acetohydrazine, phenylhydrazine and the like can use hydroquinone and the like, and it is preferable to use sodium hypophosphite and formalin.
- the reducing agent is preferably contained in an amount of 0.001 mol / l to 0.4 mol / l with respect to the electroless plating solution.
- electroless plating solution in addition to the above components, those containing complexing agents, pH adjusting agents, buffering agents, plating accelerators, stabilizers and the like as auxiliary components can be used.
- the complexing agent examples include organic acid salts such as sodium citrate, potassium citrate, and Rochelle salt, thioglycolic acid, ammonia, triethanolamine, glycine, ethylenediamine, ethylenediaminediacetate, o-aminophenol, pyridine, and the like. It is preferable to use sodium citrate.
- the complexing agent is preferably contained in an amount of 0.001 mol / l to 4.0 mol / l with respect to the electroless plating solution.
- pH adjuster for example, sodium hydroxide, ammonium hydroxide, inorganic acid, organic acid or the like is preferably used.
- the buffer it is preferable to use, for example, an organic metal, an alkali metal salt of an inorganic acid, sodium citrate, sodium acetate, ammonium chloride, ammonium sulfate, oxycarboxylic acid, dihydrogen phosphate, boric acid, carbonic acid, or the like.
- plating accelerator sulfide, fluoride or the like can be used.
- lead chloride As the stabilizer, lead chloride, sulfide, nitride, 2,2-bipyridine, 2-mercaptobenzothiazole, nicotinic acid and the like can be used as appropriate.
- the range is preferably 1 g / m 2 to 20 g / m 2 , more preferably 3 g / m 2 to 10 g / m 2 , and 5 g / m 2 to 8 g / m 2 . More preferably.
- the conductive base material used in the present invention it is preferable to use a wet polyester-based nonwoven fabric base material that has been subjected to an electroless metal plating treatment and then subjected to an electroless plating treatment or an electrolytic plating treatment. It is more preferable to use what has been subjected to electroplating because the plating layer can be stably formed in a relatively short time because the production cost can be reduced and the strength can be increased.
- Examples of the electrolytic plating solution that can be used for the electrolytic plating treatment include copper plating solutions including copper pyrophosphate, copper cyanide bath, copper sulfate bath, nickel plating solutions including watt bath, chloride bath, sulfamic acid bath, and the like.
- a chromium plating solution containing a bath or the like, or a plating solution containing gold, silver, tin, zinc or the like can be used.
- the conductive base material it is excellent in storage stability that the outermost layer is a plating layer containing nickel, and excellent in terms of adhesion between the wet polyester nonwoven fabric base material and the plating layer, And since it is excellent in electroconductivity, it is preferable.
- the outermost layer preferably contains 1g / m 2 ⁇ 10g / m 2 of nickel, more preferably containing 2g / m 2 ⁇ 8g / m 2, may contain 2.5g / m 2 ⁇ 6g / m 2 Further, it is more preferable to achieve both the excellent storage stability, adhesion and conductivity.
- the conductive base material for example, a wet base polyester non-woven base material, a non-electrolytic copper plating process, and a conductive base material subjected to an electrolytic nickel plating process in order, a wet base polyester non-woven base
- the material include a conductive base material in which an electroless copper plating process, an electrolytic copper plating process, and an electrolytic nickel plating process are sequentially performed.
- the conductive adhesive layer contains 3% by mass to 50% by mass of conductive particles with respect to the entire conductive adhesive layer.
- a conductive pressure-sensitive adhesive sheet having such a conductive pressure-sensitive adhesive layer has excellent conductivity.
- the conductive pressure-sensitive adhesive layer it is preferable to use a conductive particle containing 5% by mass to 50% by mass of conductive particles with respect to the entire conductive pressure-sensitive adhesive layer. It is more preferable to use a material containing 15% by mass to 45% by mass, and even more excellent electrical conductivity and a level of flexibility capable of following a stepped portion or the like of the adherend, Since reworkability can be expressed, it is preferable.
- the conductive adhesive layer preferably has a thickness of 3 ⁇ m to 25 ⁇ m, more preferably 5 ⁇ m to 20 ⁇ m, and more preferably 7 ⁇ m to 18 ⁇ m.
- Use of a material can provide a conductive pressure-sensitive adhesive sheet that achieves both excellent adhesion and thinning.
- the conductive adhesive layer can be formed by using an adhesive composition containing conductive particles and an adhesive component.
- the conductive particles contained in the conductive adhesive layer include metal particles such as gold, silver, copper, nickel, and aluminum, conductive resin particles such as carbon and graphite, the resin, solid glass beads, and hollow glass.
- metal particles such as gold, silver, copper, nickel, and aluminum
- conductive resin particles such as carbon and graphite
- the resin solid glass beads
- hollow glass particles whose surface is coated with metal can be used.
- the use of nickel particles, copper particles, or silver particles as the conductive particles further improves the conductivity and adhesive strength, and further improves the productivity of the conductive adhesive sheet. In addition, it is preferable.
- the conductive particles for example, surface needle-like nickel particles having a large number of needle-like shapes on the surface of particles produced by the carbonyl method, or the surface needle-like particles are smoothed to obtain spherical particles.
- copper particles and silver particles produced by the ultra high pressure swirling water atomization method are smoothed to obtain spherical particles.
- the conductive particles those having a spherical shape or a surface needle shape are preferably used.
- the conductive particles preferably have an aspect ratio of 1 to 2, more preferably those having an aspect ratio of 1 to 1.5, and more preferably an aspect ratio of 1 to 1.2. It is more preferable to use one having The aspect ratio can be measured by observing the surface of the conductive particles using a scanning electron microscope.
- the conductive particles it is possible to use those having a tap density of 2g / cm 3 ⁇ 7g / cm 3, preferably for hard settling and aggregation at the time of forming the conductive pressure sensitive adhesive layer, 3 g / cm 3 It is more preferable to use one having a tap density of ⁇ 6 g / cm 3 , and still more preferred to use one having a tap density of 4 g / cm 3 to 5 g / cm 3 .
- the conductive particles those having a particle diameter d50 of 3 ⁇ m to 20 ⁇ m and a particle diameter d85 of 6 ⁇ m to 40 ⁇ m are preferably used.
- the particle diameter d50 of the conductive particles is more preferably 4 ⁇ m to 15 ⁇ m, further preferably 5 ⁇ m to 12 ⁇ m, and particularly preferably 6 ⁇ m to 10 ⁇ m.
- the particle diameter d85 of the conductive particles is more preferably 8 ⁇ m to 30 ⁇ m, still more preferably 9 ⁇ m to 25 ⁇ m, and particularly preferably 10 ⁇ m to 20 ⁇ m.
- the particle diameter d50 represents a 50% cumulative value (median diameter) in the particle size distribution
- the particle diameter d85 represents an 85% cumulative value.
- the particle diameter is a value measured by a laser analysis / scattering method.
- the measuring device is a value measured with a laser diffraction particle size distribution analyzer SALD-3000 manufactured by Shimadzu Corporation.
- those having a particle diameter d50 of 50% to 150% of the thickness of the conductive pressure-sensitive adhesive layer are preferably selected and used, and those having a particle size of 60% to 120% are selected. It is more preferable to use, and it is further preferable to select and use one that is 70% to 100%.
- the conductive particles those having a particle diameter d85 of 80% to 200% of the thickness of the conductive pressure-sensitive adhesive layer are preferably used and more preferably 100% to 150%. It is more preferable to select and use, and it is even more preferable to select and use one that is 110% to 140%.
- the conductivity and adhesive strength are further improved, and the production efficiency of the conductive pressure-sensitive adhesive sheet can be further improved.
- the conductive particles are preferably used in the range of 5 to 100 parts by mass with respect to 100 parts by mass of the adhesive component (solid content) contained in the conductive adhesive layer. It is more preferable to use in the range of 20 parts by weight, and use in the range of 20 parts by weight to 80 parts by weight further improves the conductivity and adhesive strength and further improves the production efficiency of the conductive adhesive sheet. It is particularly preferable because it can be used.
- the conductive particles are preferably used in the range of 5 to 100 parts by mass with respect to 100 parts by mass of the acrylic polymer (solid content) contained in the conductive adhesive layer. It is more preferably used in the range of 10 to 100 parts by weight, and the use in the range of 20 to 80 parts by weight is more excellent in conductivity and adhesive strength and produces a conductive adhesive sheet. It is particularly preferable because the efficiency can be further improved.
- a method of mixing the conductive particles and the pressure-sensitive adhesive component for example, a method of mixing a conductive material, a pressure-sensitive adhesive component such as an acrylic polymer that is a pressure-sensitive adhesive component, and the additive or the like. Can be mentioned.
- the pressure-sensitive adhesive component such as the acrylic polymer, a solvent, and, if necessary, an additive may be mixed in advance.
- a dispersion mixer such as a dissolver, a butterfly mixer, a BDM biaxial mixer, or a planetary mixer can be used. Among them, it is preferable to use a dissolver and a butterfly mixer capable of applying a medium share that can suppress an increase in viscosity during the mixing.
- the pressure-sensitive adhesive component constituting the conductive pressure-sensitive adhesive layer for example, an acrylic pressure-sensitive adhesive composition, a silicone-based pressure-sensitive adhesive composition, a rubber-based pressure-sensitive adhesive composition, or the like can be used.
- an acrylic pressure-sensitive adhesive composition it is preferable to use an acrylic pressure-sensitive adhesive composition in order to reduce the production cost of the conductive pressure-sensitive adhesive sheet and further improve the adhesiveness.
- acrylic pressure-sensitive adhesive composition for example, a material containing an acrylic polymer can be used.
- acrylic polymer those obtained by polymerizing monomer components can be used.
- the monomer component for example, a monomer component containing (meth) acrylate having an alkyl group having 1 to 14 carbon atoms can be used.
- Examples of the (meth) acrylate having an alkyl group having 1 to 14 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl.
- the (meth) acrylate having an alkyl group having 1 to 14 carbon atoms it is preferable to use a (meth) acrylate having an alkyl group having 4 to 12 carbon atoms. It is more preferable to use (meth) acrylate having a linear or branched alkyl group of ⁇ 9, and it is more preferable to use n-butyl acrylate and 2-ethylhexyl acrylate alone or in combination of two kinds.
- the (meth) acrylate having an alkyl group having 1 to 14 carbon atoms is preferably used in the range of 80% by mass to 98.5% by mass with respect to the total amount of the monomer component, and 90% by mass to It is more preferable to use in the range of 98.5% by mass.
- a polar vinyl monomer can be used as the monomer component.
- the polar vinyl monomer one or more vinyl monomers having a hydroxyl group, vinyl monomers having a carboxyl group, vinyl monomers having an amide group, and the like can be used.
- acrylic acid methacrylic acid, itaconic acid, maleic acid, (meth) acrylic acid dimer, crotonic acid, ethylene oxide-modified succinic acid acrylate, etc.
- acrylic acid methacrylic acid is preferably used, and acrylic acid is more preferably used.
- the vinyl monomer having a carboxyl group is preferably used in the range of 1% by mass to 10% by mass with respect to the total amount of the monomer components, and is 1.5% by mass to 6% by mass. More preferably, the content is 2% by mass to 4% by mass when the initial adhesive strength to the metal surface constituting the adherend is excellent and the conductive adhesive tape is stored under high temperature and high humidity. However, it is more preferable because excellent adhesion strength to the adherend can be expressed. Further, acrylic acid preferable as the vinyl monomer having a carboxyl group is more excellent for the adherend when used in the range of 1% by mass to 6% by mass with respect to the total amount of the monomer components. This is preferable because both wettability and adhesive strength can be achieved.
- Examples of the vinyl monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 6-hydroxyhexyl (meth) acrylate.
- a (meth) acrylate having a hydroxyl group can be used.
- vinyl monomer having an amide group for example, N-vinylpyrrolidone, N-vinylcaprolactam, acryloylmorpholine, acrylamide, N, N-dimethylacrylamide and the like can be used.
- vinyl monomers examples include sulfonic acid group-containing monomers such as vinyl acetate, ethylene oxide-modified succinic acid acrylate, 2-acrylamido-2-methylpropanesulfonic acid, 2-methoxyethyl (meth) acrylate, and 2-phenoxy. Terminal alkoxy-modified (meth) acrylates such as ethyl (meth) acrylate can be used.
- the polar vinyl monomer is preferably used in a range of 0.2% by mass to 15% by mass with respect to the total amount of the monomer components, and is used in a range of 0.4% by mass to 10% by mass. It is more preferable to use in the range of 0.5% by mass to 6% by mass because it is easy to adjust the adhesive strength to a suitable range.
- the acrylic polymer can be produced by polymerizing the above monomer components by a known method such as a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, and the production cost among others. It is preferable to employ a solution polymerization method in order to reduce the amount and improve the production efficiency.
- acrylic polymer obtained by the above method those having a weight average molecular weight of 300,000 to 1,500,000 are preferably used, and those having a weight average molecular weight of 500,000 to 1,200,000 are more preferably used. preferable.
- the conductive pressure-sensitive adhesive layer preferably has a three-dimensional cross-linked structure in order to further enhance the cohesive force and to further improve the adhesion.
- the degree of crosslinking can be recognized by using a gel fraction represented by an insoluble content after being immersed in toluene, which is a good solvent for the acrylic polymer, for 24 hours.
- the conductive adhesive layer preferably has a gel fraction of 25% to 65% by weight, more preferably 35% to 60% by weight, and 40%. It is more preferable to use a material having a mass% to 55% by mass because the cohesive force in the shear direction and the peel resistance can be improved.
- the gel fraction can be calculated by the following formula.
- Gel fraction (% by mass) ⁇ (Adhesive layer mass after immersion in toluene) / (Adhesive layer mass before immersion in toluene) ⁇ ⁇ 100
- Adhesive layer mass (Mass of conductive adhesive sheet)-(Mass of substrate)-(Mass of conductive particles)
- a pressure-sensitive adhesive containing a cross-linking agent together with the acrylic polymer, for example.
- crosslinking agent for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a chelating crosslinking agent, an aziridine crosslinking agent, or the like can be used.
- the kind of the crosslinking agent it is preferable to use one corresponding to the functional group of the acrylic polymer. For example, when using what has a carboxyl group as said acrylic polymer, it is suitable to use an isocyanate type crosslinking agent.
- the cross-linking agent is preferably used by selecting an amount in which the gel fraction of the conductive pressure-sensitive adhesive layer falls within the above range.
- the conductive pressure-sensitive adhesive layer may contain a tackifier resin for the purpose of further improving the adhesive strength.
- the tackifying resin examples include rosin resins, terpene resins, aliphatic (C5) and aromatic (C9) petroleum resins, styrene resins, phenol resins, xylene resins, methacrylic resins, and the like. Can be used. Among these, as the tackifying resin, it is preferable to use a rosin resin, and it is more preferable to use a polymerized rosin resin. The amount of the tackifying resin used is preferably in the range of 10 to 50 parts by mass with respect to 100 parts by mass of the (meth) acrylic polymer.
- the conductive adhesive layer may contain various additives as necessary.
- additive for example, plasticizers, softeners, metal deactivators, antioxidants, pigments, dyes and the like can be used.
- a material containing a predetermined amount of the conductive material and the pressure-sensitive adhesive component can be used as the pressure-sensitive adhesive that can be used for forming the conductive pressure-sensitive adhesive layer.
- a layer containing a triazole compound can be used as the conductive adhesive layer.
- triazole compound for example, benzotriazole, tolyltriazole and its potassium salt, 3- (N-salicyloyl) amino-1,2,4 triazole, 2- (2′-hydroxy-5methylphenyl) benzotriazole and the like are used.
- benzotriazole is particularly preferable because it can suppress a decrease in adhesion strength that can be generated when left in an environment of high temperature and high humidity.
- the triazole-based compound is preferably used in the range of 0.05 to 3.0 parts by mass with respect to 100 parts by mass (solid content) of the acrylic pressure-sensitive adhesive composition, and 0.1 to 1 part by mass. It is more preferable to use in the range of 5 parts by mass, and use in the range of 0.3 to 1.0 parts by mass provides excellent adhesion retention and when left in a high temperature and high humidity environment. It is more preferable because it can suppress a decrease in adhesive strength that may occur.
- the pressure-sensitive adhesive obtained by the above method can be used exclusively for forming a conductive pressure-sensitive adhesive layer.
- the solid content of the pressure-sensitive adhesive is preferably in the range of 10% by mass to 70% by mass, more preferably in the range of 30% by mass to 55% by mass, and in the range of 43% by mass to 50% by mass. More preferably.
- the conductive pressure-sensitive adhesive sheet of the present invention is prepared by, for example, applying the pressure-sensitive adhesive to the surface of a release film using a roll coater or a die coater, and drying the coated layer in an environment of about 50 ° C. to 120 ° C.
- the thermal lamination is preferably performed at 40 ° C to 120 ° C, more preferably at 50 ° C to 100 ° C, and further preferably at 60 ° C to 90 ° C.
- the conductive pressure-sensitive adhesive sheet of the present invention may be one in which a film is laminated until it is affixed to an adherend.
- the release film examples include paper such as kraft paper, glassine paper, and high-quality paper; resin films such as polyethylene, polypropylene (OPP, CPP), and polyethylene terephthalate; laminated paper obtained by laminating the paper and resin film; A material obtained by applying a release treatment such as a silicone-based resin to one or both surfaces of a material subjected to a sealing treatment with clay or polyvinyl alcohol can be used.
- a release treatment such as a silicone-based resin to one or both surfaces of a material subjected to a sealing treatment with clay or polyvinyl alcohol can be used.
- FIG. 1 is a single-sided pressure-sensitive adhesive sheet in which a conductive pressure-sensitive adhesive layer 2 is laminated on a conductive substrate 1.
- FIG. 2 shows a double-sided pressure-sensitive adhesive sheet in which a conductive pressure-sensitive adhesive layer 2 is laminated on both surfaces of a conductive substrate 1.
- the structure by which the peeling film was provided in the surface of the adhesive layer 2 can be used preferably.
- the conductive pressure-sensitive adhesive sheet of the present invention is excellent in flexibility and has good adhesion to the adherend, conductivity and reworkability. Therefore, the conductive pressure-sensitive adhesive sheet is used for shielding electromagnetic waves used in electrical and electronic equipment, and for antistatic grounding. Useful for fixation. In particular, it can be suitably applied to applications in which there are convex and concave portions and affixed to a built-in component of a small electronic terminal such as a portable electronic device where it is difficult to affix a conductive adhesive sheet.
- the water-washed product was immersed in an aqueous solution containing 1 g / l of palladium chloride and 20 ml / l of hydrochloric acid at room temperature for about 10 minutes, and then washed with water.
- the water-washed product contains 10 g / l copper sulfate, 7 ml / l formaldehyde, 8 g / l sodium hydroxide, 30 g / l ethylenediaminetetraacetic acid (EDTA-4Na) and 0.25 ml / l stabilizer.
- a wet polyester nonwoven fabric subjected to electroless plating was obtained by immersing in an electroless plating solution adjusted to 40 ° C. for 20 minutes and then washing with water.
- the electroless-plated wet polyester nonwoven fabric is immersed in an electrolytic copper plating solution (Okuno Pharmaceutical Co., Ltd., Top Lucina SF), and the copper plating amount by the electrolytic copper plating solution is 6 g / m 2 .
- an electrolytic copper plating solution (Okuno Pharmaceutical Co., Ltd., Top Lucina SF)
- the copper plating amount by the electrolytic copper plating solution is 6 g / m 2 .
- a conductive base material (A) is produced by immersing in an electrolytic nickel plating solution, electrolytic nickel plating so that the nickel plating amount by the electrolytic nickel plating solution is 4 g / m 2 , washing with water and drying. did.
- the water-washed product was copper sulfate 10 g / l, formaldehyde 7 ml / l, sodium hydroxide 8 g / l, ethylenediaminetetraacetic acid tetrasodium (EDTA-4Na) 30 g / l and stabilizer (0.25 ml / l).
- an electroless plating solution adjusted to 40 ° C. containing 60 minutes and subjected to electroless plating so that the amount of copper plating by the electroless plating solution is 6 g / m 2 .
- a conductive substrate (E) was prepared.
- the water-washed product contains nickel sulfate 20 g / l, sodium citrate 30 g / l, sodium hypophosphite 15 g / l and ammonium chloride 30 g / l, and adjusted to pH 9.5 with aqueous ammonia.
- the substrate is immersed in an electroless plating solution at 40 ° C. for 60 minutes, subjected to electroless plating so that the amount of nickel plated by the electroless plating solution is 6 g / m 2 , washed with water, and dried to form a conductive substrate. (F) was produced.
- the water-washed product was copper sulfate 10 g / l, formaldehyde 7 ml / l, sodium hydroxide 8 g / l, ethylenediaminetetraacetic acid tetrasodium (EDTA-4Na) 30 g / l and stabilizer (0.25 ml / l).
- an electroless copper plating solution adjusted to 40 ° C. containing 60 minutes, subjecting the electroless copper plating solution to a copper plating amount of 6 g / m 2, and then washing with water.
- a wet polyester nonwoven fabric subjected to electroless copper plating treatment was obtained.
- the electroless copper-plated wet polyester nonwoven fabric contains nickel sulfate 20 g / l, sodium citrate 30 g / l, sodium hypophosphite 15 g / l and ammonium chloride 30 g / l. It is immersed in an electroless nickel plating solution adjusted to pH 9.5 at 40 ° C. for 30 minutes, subjected to electroless nickel plating so that the amount of nickel plating by the electroless nickel plating solution is 4 g / m 2, and then washed with water. Thus, a conductive substrate (G) was produced.
- the water-washed product was immersed in an aqueous solution containing 1 g / l of palladium chloride and 20 ml / l of hydrochloric acid at room temperature for about 10 minutes, and then washed with water.
- the water-washed product contains 10 g / l copper sulfate, 7 ml / l formaldehyde, 8 g / l sodium hydroxide, 30 g / l ethylenediaminetetraacetic acid (EDTA-4Na) and 0.25 ml / l stabilizer.
- a wet polyester nonwoven fabric subjected to electroless plating was obtained by immersing in an electroless plating solution adjusted to 40 ° C. for 20 minutes and then washing with water.
- the electroless-plated wet polyester nonwoven fabric was charged with 240 g / l nickel sulfate, 45 g / l nickel chloride, 30 g / l boric acid, 2 g / l saccharin, and 0.2 g / l 1,4-butynediol.
- a conductive base material (H) is produced by immersing in an electrolytic nickel plating solution, and subjecting the electrolytic nickel plating solution to electrolytic nickel plating so that the amount of nickel plating is 4 g / m 2 , washing with water, and drying. did.
- Production Example 12 [Conductive Substrate (L)] Except for using the wet polyester nonwoven fabric “D54E” (basis weight 16 g / m 2 , thickness 43 ⁇ m) manufactured by Nippon Paper Industries Papiria Co., Ltd. instead of the wet polyester nonwoven fabric “Type A” manufactured by Miki Tokushu Paper Co., Ltd. A conductive substrate (L) was produced in the same manner as in Production Example 1.
- Preparation Example 1 [Preparation of acrylic pressure-sensitive adhesive composition (1)] In a reaction vessel equipped with a condenser, a stirrer, a thermometer, and a dropping funnel, 96.4 parts by mass of n-butyl acrylate, 0.1 part by mass of 2-hydroxyethyl acrylate, 3.5 parts by mass of acrylic acid and a polymerization initiator By dissolving 0.1 part by mass of 2,2′-azobisisobutylnitrile in 100 parts by mass of ethyl acetate, purging the inside of the reaction vessel with nitrogen, and then polymerizing at 80 ° C. for 12 hours, an acrylic having a weight average molecular weight of 600,000 is obtained. A system copolymer solution was obtained.
- Preparation Example 2 [Preparation of acrylic pressure-sensitive adhesive composition (2)] In a reaction vessel equipped with a condenser, a stirrer, a thermometer, and a dropping funnel, 99.9 parts by mass of n-butyl acrylate, 0.1 part by mass of 2-hydroxyethyl acrylate, and 2,2′-azobisisobutyl as a polymerization initiator 0.1 parts by mass of nitrile was dissolved in 100 parts by mass of ethyl acetate, the inside of the reaction vessel was purged with nitrogen, and then polymerized at 80 ° C. for 12 hours to obtain an acrylic copolymer solution having a weight average molecular weight of 600,000. .
- Preparation Example 3 [Preparation of acrylic pressure-sensitive adhesive composition (3)] In a reaction vessel equipped with a condenser, a stirrer, a thermometer, and a dropping funnel, 92.9 parts by mass of n-butyl acrylate, 0.1 part by mass of 2-hydroxyethyl acrylate, 7 parts by mass of acrylic acid, 2, An acrylic copolymer having a weight average molecular weight of 600,000 is dissolved by dissolving 0.1 part by weight of 2′-azobisisobutylnitrile in 100 parts by weight of ethyl acetate, purging the inside of the reaction vessel with nitrogen, and polymerizing at 80 ° C. for 12 hours. A polymer solution was obtained.
- Preparation Example 4 [Preparation of acrylic pressure-sensitive adhesive composition (4)] In a reaction vessel equipped with a condenser, a stirrer, a thermometer, and a dropping funnel, 97.4 parts by mass of n-butyl acrylate, 0.1 part by mass of 2-hydroxyethyl acrylate, 2.5 parts by mass of acrylic acid, as a polymerization initiator By dissolving 0.1 part by mass of 2,2′-azobisisobutylnitrile in 100 parts by mass of ethyl acetate, purging the inside of the reaction vessel with nitrogen, and then polymerizing at 80 ° C. for 12 hours, an acrylic having a weight average molecular weight of 600,000 is obtained. A system copolymer solution was obtained.
- Preparation Example 5 [Preparation of conductive adhesive composition (1A-1)] 100 parts by weight of the acrylic pressure-sensitive adhesive composition (1) (solid content: 45% by weight) and nickel powder “NI123J” manufactured by Fukuda Metal Foil Powder Co., Ltd. (particle diameter d50: 6.3 ⁇ m, particle diameter d85: 10) 0.0 ⁇ m, tap density: 4.3 g / cm 3 , 22.5 parts by mass of Inco Ltd. “NI123”) and Vernock NC40 (an isocyanate-based crosslinking agent manufactured by DIC Corporation, solid) as a crosslinking agent (Min.
- Preparation Example 6 [Preparation of conductive adhesive composition (1A-2)] A conductive adhesive (1A-2) was prepared in the same manner as in Preparation Example 5 except that the amount of nickel powder “NI123J” manufactured by Fukuda Metal Foil Powder Co., Ltd. was changed from 22.5 parts by mass to 9 parts by mass. )
- Preparation Example 7 [Preparation of conductive adhesive composition (1A-3)] A conductive adhesive (1A-3) was prepared in the same manner as in Preparation Example 5, except that the amount of nickel powder “NI123J” manufactured by Fukuda Metal Foil Powder Co., Ltd. was changed from 22.5 parts by mass to 36 parts by mass. )
- Preparation Example 8 [Preparation of conductive adhesive composition (1A-4)] A conductive adhesive (1A-4) was prepared in the same manner as in Preparation Example 5 except that the amount of nickel powder “NI123J” manufactured by Fukuda Metal Foil Powder Co., Ltd. was changed from 22.5 parts by mass to 0 parts by mass. )
- Preparation Example 9 [Preparation of conductive adhesive composition (1A-5)]
- the conductive adhesive (1A) was prepared in the same manner as in Preparation Example 5, except that the amount of nickel powder “NI123J” manufactured by Fukuda Metal Foil Powder Co., Ltd. was changed from 22.5 parts by mass to 67.5 parts by mass. -5) was obtained.
- Preparation Example 10 [Preparation of conductive adhesive composition (2A)] A conductive pressure-sensitive adhesive (2A) was obtained in the same manner as in Preparation Example 5, except that the acrylic pressure-sensitive adhesive composition (2) was used instead of the acrylic pressure-sensitive adhesive composition (1).
- Preparation Example 11 [Preparation of conductive adhesive composition (3A)] A conductive pressure-sensitive adhesive (3A) was obtained in the same manner as in Preparation Example 5, except that the acrylic pressure-sensitive adhesive composition (3) was used instead of the acrylic pressure-sensitive adhesive composition (1).
- Preparation Example 12 [Preparation of conductive adhesive composition (4A)] A conductive adhesive (4A) was obtained in the same manner as in Preparation Example 5, except that the acrylic adhesive composition (4) was used instead of the acrylic adhesive composition (1).
- Preparation Example 13 [Preparation of conductive adhesive composition (1B)] Instead of the nickel powder “NI123J” manufactured by Fukuda Metal Foil Powder Co., Ltd., 22.5 mass of nickel powder “NI123” (particle diameter d50: 10.7, particle diameter d85: 25.0 ⁇ m) manufactured by Incori Ltd. A conductive pressure-sensitive adhesive (1B) was obtained in the same manner as in Preparation Example 5, except that a part of the product was used.
- Example 1 A comma coater is applied to the conductive adhesive composition (1A-1) on a release film “PET38 ⁇ 1 A3” manufactured by Nipper Corporation so that the thickness of the conductive adhesive layer after drying is 9 ⁇ m.
- the conductive pressure-sensitive adhesive layer was prepared by applying and drying for 2 minutes in a drier set at 80 ° C.
- the conductive pressure-sensitive adhesive layer is pasted on both sides of the conductive base material (A), they are thermally laminated at 80 ° C., and then cured at 40 ° C. for 48 hours to produce a conductive pressure-sensitive adhesive sheet. did.
- Example 2 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (B) was used instead of the conductive substrate (A).
- Example 3 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (C) was used instead of the conductive substrate (A).
- Example 4 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (D) was used instead of the conductive substrate (A).
- Example 5 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the conductive pressure-sensitive adhesive composition (1A-2) was used instead of the conductive pressure-sensitive adhesive composition (1A-1).
- Example 6 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the conductive pressure-sensitive adhesive composition (1A-3) was used instead of the conductive pressure-sensitive adhesive composition (1A-1).
- Example 7 Example 1 except that the conductive pressure-sensitive adhesive composition (2A) was used instead of the conductive pressure-sensitive adhesive composition (1A-1), and the curing time was changed from 48 hours to 120 hours.
- a conductive pressure-sensitive adhesive sheet was prepared by the method described above.
- Example 8 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the conductive pressure-sensitive adhesive composition (3A) was used instead of the conductive pressure-sensitive adhesive composition (1A-1).
- Example 9 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the conductive pressure-sensitive adhesive composition (4A) was used instead of the conductive pressure-sensitive adhesive composition (1A-1).
- Example 10 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the thickness of the conductive pressure-sensitive adhesive layer was changed from 9 ⁇ m to 7 ⁇ m.
- Example 11 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the thickness of the conductive pressure-sensitive adhesive layer was changed from 9 ⁇ m to 15 ⁇ m.
- Example 12 Implemented except that instead of the conductive adhesive composition (1A-1), the conductive adhesive composition (1B) was used and the thickness of the conductive adhesive layer was changed from 9 ⁇ m to 18 ⁇ m.
- a conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1.
- Example 13 (Example 13) Implemented except that the conductive adhesive composition (1B) was used in place of the conductive adhesive composition (1A-1) and the thickness of the conductive adhesive layer was changed from 9 ⁇ m to 13 ⁇ m.
- a conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1.
- Example 14 A conductive adhesive sheet of Example 14 was prepared in the same manner as Example 1 except that the plated nonwoven fabric E was used instead of the plated nonwoven fabric A.
- Example 15 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (F) was used instead of the conductive substrate (A).
- Example 16 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (G) was used instead of the conductive substrate (A).
- Example 17 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (H) was used instead of the conductive substrate (A).
- Example 1 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (I) was used instead of the conductive substrate (A).
- Example 2 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (J) was used instead of the conductive substrate (A).
- Example 3 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (K) was used instead of the conductive substrate (A).
- Example 4 A conductive adhesive sheet was produced in the same manner as in Example 1 except that the conductive substrate (L) was used instead of the conductive substrate (A).
- Example 5 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the conductive pressure-sensitive adhesive composition (1A-4) was used instead of the conductive pressure-sensitive adhesive composition (1A-1).
- Example 6 A conductive pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the conductive pressure-sensitive adhesive composition (1A-5) was used instead of the conductive pressure-sensitive adhesive composition (1A-1).
- the following evaluation was performed on the conductive base material, the conductive pressure-sensitive adhesive layer, and the conductive pressure-sensitive adhesive sheet, and the obtained results are shown in the table below.
- surface represents the usage-amount (mass%) of acrylic acid with respect to the whole quantity of the monomer component used for manufacture of an acryl-type copolymer.
- the amount of metal powder in the table represents the content (% by mass) of conductive particles with respect to the entire conductive adhesive layer.
- the follow-up evaluation results of Example 1 and Reference Example 1 are shown in FIGS.
- the particle diameter of the conductive particles refers to a value measured using a laser diffraction particle size distribution analyzer SALD-3000 manufactured by Shimadzu Corporation and using isopropanol as a dispersion medium.
- a terminal is connected to the brass electrode and the copper foil with a surface pressure of 20 N applied from above the brass electrode, and a milliohm meter (manufactured by NF Circuit Design Co., Ltd.) in an environment of 23 ° C. and 50% RH. ) was used to measure the resistance value when a current of 10 ⁇ A was passed. The case where the resistance value was 500 m ⁇ or less was regarded as acceptable.
- the thickness of the conductive adhesive sheet was measured using a thickness meter “TH-102” manufactured by Tester Sangyo Co., Ltd.
- a conductive base material of 30 mm width ⁇ 30 mm width is sandwiched between two brass electrodes of 25 mm ⁇ 25 mm, and a terminal is connected to each brass electrode with a surface pressure of 20 N applied from above the brass electrode.
- the resistance value when a current of 10 ⁇ A was passed was measured using a milliohm meter (manufactured by NF Circuit Design) in an environment of 23 ° C. and 50% RH.
- a conductive adhesive sheet having a width of 20 mm was prepared, and a test piece was prepared by lining one surface with a polyethylene terephthalate film (S25 manufactured by Unitika Ltd.) having a thickness of 25 ⁇ m.
- the pressure-sensitive adhesive layer of the test piece was attached to a stainless steel plate (hereinafter referred to as a stainless steel plate) subjected to hairline polishing treatment using No. 360 water-resistant abrasive paper in an environment of 23 ° C. and 50% RH. They were crimped by reciprocating a 0 kg roller once.
- the pressure-bonded product is allowed to stand at room temperature for 1 hour, and then peeled 180 degrees by using a tensile tester (Tensilon RTA-100, manufactured by A & D) at a tensile speed of 300 mm / min.
- the adhesive force was measured.
- the test of the said adhesive force was performed with respect to each adhesive layer (double-sided adhesive layer) of an electroconductive adhesive sheet, and the lower value was described in the table
- a conductive adhesive sheet was attached by hand to a metal plate having a substantially semicircular step having a depth of 5 mm and a width of 10 mm, and the followability to the step was evaluated.
- the pressure-sensitive adhesive sheets of Examples 1 to 18 of the present invention were excellent in followability and good in adhesion, conductivity and reworkability.
- the pressure-sensitive adhesive sheets of Comparative Examples 1 to 4 were excellent in followability, conductivity, and adhesiveness, but remarkably inferior in reworkability.
- the pressure-sensitive adhesive sheet of Comparative Example 5 was inferior in conductivity.
- the pressure-sensitive adhesive sheet of Comparative Example 6 was inferior in adhesiveness and reworkability.
- the pressure-sensitive adhesive sheet of the reference example was inferior in followability, and floated and torn at the step portion.
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Abstract
Description
前記導電性粘着剤層が、前記導電性粘着剤層全体に対して導電性粒子を3質量%~50質量%含有するものである導電性粘着シートを使用することによって、上記課題を解決した。
ゲル分率(質量%)={(トルエンに浸漬した後の粘着剤層質量)/(トルエンに浸漬する前の粘着剤層質量)}×100
粘着剤層質量=(導電性粘着シートの質量)-(基材の質量)-(導電性粒子の質量)
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」(坪量10g/m2、厚さ15μm、ポリエステル繊維の直径5μm(平均径))を、塩化第一錫10g/l、塩酸20ml/lを含んだ水溶液に常温で約5分間浸漬し、その後、水洗いした。
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」の代わりに、旭化成株式会社製の湿式ポリエステル不織布「シルキーファインWS7A-05-6」(坪量6g/m2、厚さ18μm、ポリエステル繊維の直径4.5μm(平均径))を使用したこと以外は、製造例1と同様の方法で導電性基材(B)を作製した。
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」の代わりに、旭化成株式会社製の湿式ポリエステル不織布「シルキーファインWS7A-04」(坪量4g/m2、厚さ16μm、ポリエステル繊維の直径4.5μm(平均径))を使用したこと以外は、製造例1と同様の方法で導電性基材(C)を作製した。
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」の代わりに、日本製紙パピリア株式会社製の湿式ポリエステル不織布「5.5g/m2」(坪量5.5g/m2、厚さ14μm、ポリエステル繊維の直径4.5μm(平均径))を使用したこと以外は、製造例1と同様の方法で導電性基材(D)を作製した。
常温下、三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」(坪量10g/m2、厚さ15μm、ポリエステル繊維の直径5μm(平均径))を、塩化第一錫10g/l及び塩酸20ml/lを含有する水溶液に約5分間浸漬し、水洗いした後、塩化パラジウム1g/l及び塩酸20ml/lを含む水溶液に約10分浸漬し、水洗いした。
常温下、三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」(坪量10g/m2、厚さ15μm、ポリエステル繊維の直径5μm(平均径))を、塩化第一錫10g/l及び塩酸20ml/lを含む水溶液に約5分間浸漬し、水洗いした後、塩化パラジウム1g/l及び塩酸20ml/lを含む水溶液に約10分浸漬し、水洗いした。
常温下、三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」(坪量10g/m2、厚さ15μm、ポリエステル繊維の直径5μm(平均径))を、塩化第一錫10g/l及び塩酸20ml/lを含む水溶液に約5分間浸漬し、水洗いした後、塩化パラジウム1g/l及び塩酸20ml/lを含む水溶液に約10分浸漬し、水洗いした。
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」(坪量10g/m2、厚さ15μm、ポリエステル繊維の直径5μm(平均径))を、塩化第一錫10g/l、塩酸20ml/lを含んだ水溶液に常温で約5分間浸漬し、その後、水洗いした。
旭化成せんい株式会社製プレシゼ(乾式ポリエステル不織布に銅とニッケルがメッキ処理されたもの)を導電性基材(I)とした。
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」の代わりに、JX日鉱日石エネルギー株式会社製の乾式ポリエステル不織布「ミライフTY0503FE」(坪量8g/m2、厚さ28μm、ポリエステル繊維の直径12μm(平均径))を用いたこと以外は、製造例1と同様の方法で導電性基材(J)を作製した。
[メッキ不織布K]
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」の代わりに、JX日鉱日石エネルギー株式会社製の乾式ポリエステル不織布「ミライフT10」(坪量10g/m2、厚さ28μm、ポリエステル繊維の直径10μm(平均径))を用いたこと以外は、製造例1と同様の方法で導電性基材(K)を作製した。
三木特種製紙株式会社製の湿式ポリエステル不織布「タイプA」の代わりに、日本製紙パピリア株式会社製の湿式麻不織布「D54E」(坪量16g/m2、厚さ43μm)を用いたこと以外は、製造例1と同様の方法で導電性基材(L)を作製した。
冷却管、撹拌機、温度計、滴下漏斗を備えた反応容器にn-ブチルアクリレート96.4質量部、2-ヒドロキシエチルアクリレート0.1質量部、アクリル酸3.5質量部と重合開始剤として2,2’-アゾビスイソブチルニトリル0.1質量部を酢酸エチル100質量部に溶解し、反応容器内を窒素置換した後、80℃で12時間重合させることによって、重量平均分子量60万のアクリル系共重合体溶液を得た。
冷却管、撹拌機、温度計、滴下漏斗を備えた反応容器にn-ブチルアクリレート99.9質量部、2-ヒドロキシエチルアクリレート0.1質量部、重合開始剤として2,2’-アゾビスイソブチルニトリル0.1質量部を酢酸エチル100質量部に溶解し、反応容器内を窒素置換した後、80℃で12時間重合させることによって、重量平均分子量60万のアクリル系共重合体溶液を得た。
冷却管、撹拌機、温度計、滴下漏斗を備えた反応容器にn-ブチルアクリレート92.9質量部、2-ヒドロキシエチルアクリレート0.1質量部、アクリル酸7質量部、重合開始剤として2,2’-アゾビスイソブチルニトリル0.1質量部を酢酸エチル100質量部に溶解し、反応容器内を窒素置換した後、80℃で12時間重合させることによって、重量平均分子量60万のアクリル系共重合体溶液を得た。
冷却管、撹拌機、温度計、滴下漏斗を備えた反応容器にn-ブチルアクリレート97.4質量部、2-ヒドロキシエチルアクリレート0.1質量部、アクリル酸2.5質量部、重合開始剤として2,2’-アゾビスイソブチルニトリル0.1質量部を酢酸エチル100質量部に溶解し、反応容器内を窒素置換した後、80℃で12時間重合させることによって、重量平均分子量60万のアクリル系共重合体溶液を得た。
前記アクリル系粘着剤組成物(1)100質量部(固形分45質量%)と、福田金属箔粉工業株式会社製のニッケル粉「NI123J」(粒子径d50:6.3μm、粒子径d85:10.0μm、タップ密度:4.3g/cm3、インコリミテッド社「NI123」を平滑化処理したもの)22.5質量部と、架橋剤としてバーノックNC40(DIC株式会社製のイソシアネート系架橋剤、固形分40質量%)2.5質量部と、ベンゾトリアゾール0.23質量部とを混合し、酢酸エチルを用い固形分濃度を47質量%に調整したものを、分散攪拌機を用いて10分間撹拌することによって導電性粘着剤(1A-1)を得た。
福田金属箔粉工業株式会社製のニッケル粉「NI123J」の使用量を22.5質量部から9質量部に変更したこと以外は、調製例5と同様の方法で導電性粘着剤(1A-2)を得た。
福田金属箔粉工業株式会社製のニッケル粉「NI123J」の使用量を22.5質量部から36質量部に変更したこと以外は、調製例5と同様の方法で導電性粘着剤(1A-3)を得た。
福田金属箔粉工業株式会社製のニッケル粉「NI123J」の使用量を22.5質量部から0質量部に変更したこと以外は、調製例5と同様の方法で導電性粘着剤(1A-4)を得た。
福田金属箔粉工業株式会社製のニッケル粉「NI123J」の使用量を22.5質量部から67.5質量部に変更したこと以外は、調製例5と同様の方法で導電性粘着剤(1A-5)を得た。
前記アクリル系粘着剤組成物(1)の代わりに、前記アクリル系粘着剤組成物(2)を使用すること以外は、調製例5と同様の方法で導電性粘着剤(2A)を得た。
前記アクリル系粘着剤組成物(1)の代わりに、前記アクリル系粘着剤組成物(3)を使用すること以外は、調製例5と同様の方法で導電性粘着剤(3A)を得た。
前記アクリル系粘着剤組成物(1)の代わりに、前記アクリル系粘着剤組成物(4)を使用すること以外は、調製例5と同様の方法で導電性粘着剤(4A)を得た。
福田金属箔粉工業株式会社製のニッケル粉「NI123J」の代わりに、インコリミテッド社製のニッケル粉「NI123」(粒子径d50:10.7、粒子径d85:25.0μm)を22.5質量部使用したこと以外は、調製例5と同様の方法で導電性粘着剤(1B)を得た。
前記導電性粘着剤組成物(1A-1)を、ニッパ株式会社製の剥離フィルム「PET38×1 A3」上に、乾燥後の導電性粘着剤層の厚さが9μmになるようにコンマコーターを用いて塗工し、80℃に設定した乾燥器で2分間乾燥させることによって導電性粘着剤層を作製した。
導電性基材(A)の代わりに、導電性基材(B)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(C)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(D)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(1A-2)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(1A-3)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(2A)を使用し、かつ、養生時間を48時間から120時間に変更したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(3A)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(4A)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤層の厚さを9μmから7μmに変更したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤層の厚さを9μmから15μmに変更したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(1B)を使用し、かつ、導電性粘着剤層の厚さを9μmから18μmに変更したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(1B)を使用し、かつ、導電性粘着剤層の厚さを9μmから13μmに変更したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
メッキ不織布Aの代わりに、メッキ不織布Eを用いた以外は実施例1と同様に実施例14の導電性粘着シートを作成した。
導電性基材(A)の代わりに、導電性基材(F)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(G)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(H)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(I)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(J)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(K)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、導電性基材(L)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(1A-4)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粘着剤組成物(1A-1)の代わりに、導電性粘着剤組成物(1A-5)を使用したこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性基材(A)の代わりに、厚さ9μmの無機防錆(クロメート)処理した電解銅箔(CF-T9FZ-SV、福田金属箔粉工業社製)を用いたこと以外は、実施例1と同様の方法で導電性粘着シートを作製した。
導電性粒子の粒子径は、株式会社島津製作所製のレーザー回折式粒度分布測定器SALD-3000を用い、分散媒にイソプロパノールを使用して測定した値を指す。
30mm幅×30mm幅の導電性粘着シートの一方の面を25mm×25mmの真鍮製電極に貼り付けた。導電性粘着シートのもう一方の面に30mm×80mmの銅箔(厚さ35μm)を貼り付けた。
各導電性粘着剤組成物を用いて剥離フィルム上に形成された導電性粘着剤層に、PETフィルム25μm(ユニチカ社製S25)を裏打ちした試料を作成し、その厚さをテスター産業社製の厚さ計「TH-102」を用いて測定した。前記測定値から、前記剥離フィルム及びPETフィルムの厚さを減じた値を導電性粘着剤層の厚さとした。
テスター産業社製の厚さ計「TH-102」を用い導電性粘着シートの厚さを測定した。
30mm幅×30mm幅の導電性基材を、二つの25mm×25mmの真鍮製電極に挟み込み、真鍮製電極の上から面圧20Nの荷重をかけた状態で、各真鍮製電極に端子を接続し、23℃及び50%RHの環境下、ミリオームメーター(エヌエフ回路設計製)を用い10μAの電流を流した際の抵抗値を測定した。
20mm幅の導電性粘着シートを用意し、一方の面を厚さ25μmのポリエチレンテレフタレートフィルム(ユニチカ株式会社製S25)を用い裏打ちしたものを試験片とした。
深さ5mm及び幅10mmの略半円型の段差を有する金属板に、導電性粘着シートを手で貼付け、段差への追従性を評価した。
前記方法で接着力を測定した際にステンレス板への糊残りの有無を評価した。
前記方法で接着力を測定した際に、導電性粘着シートが破れるか否かを評価した。5つの導電性粘着シートを用いて試験を実施し、下記基準にて評価した。
2 導電性粘着剤層
Claims (14)
- 導電性基材の少なくとも片面に、導電性粘着剤層を有する導電性粘着シートであって、
前記導電性基材が、湿式ポリエステル系不織布基材に、無電解メッキ処理を含むメッキ処理を施すことによって得られたものであり、
前記導電性粘着剤層が、前記導電性粘着剤層全体に対して導電性粒子を3質量%~50質量%含有するものであることを特徴とする導電性粘着シート。 - 前記導電性粒子が、銅またはニッケルを含むものである請求項1記載の導電性粘着シート。
- 前記無電解メッキ処理が、銅またはニッケルの少なくとも1種を用いて行う処理である請求項1に記載の導電性粘着シート。
- 前記導電性基材が、湿式ポリエステル系不織布基材に無電解メッキ処理を施した後、さらに無電解メッキ処理または電解メッキ処理を施すことによって得られたものである請求項1に記載の導電性粘着シート。
- 前記導電性基材が、湿式のポリエステル系不織布基材に、無電解銅メッキ処理を施した後、さらに電解ニッケルメッキ処理を施すことによって得られたものである請求項4に記載の導電性粘着シート。
- 前記導電性基材が、湿式のポリエステル系不織布基材に、無電解銅メッキ処理、電解銅メッキ処理及び電解ニッケルメッキ処理を順に施すことによって得られたものである請求項4に記載の導電性粘着シート。
- 前記導電性粘着剤層が、導電性粒子とアクリル系重合体とを含有するアクリル系粘着剤を用いて形成される層であり、前記アクリル系重合体が、1質量%~6質量%のアクリル酸を含有する単量体成分を重合させることによって得られたものである請求項1に記載の導電性粘着シート。
- 前記湿式のポリエステル系不織布基材の坪量が2g/m2~20g/m2である請求項1に記載の導電性粘着シート。
- 前記湿式のポリエステル系不織布基材の厚さが5μm~50μmである請求項1に記載の導電性粘着シート。
- 前記湿式のポリエステル系不織布基材の引張強度(MD方向)が2N/20mm~30N/20mmであり、かつ、その引張強度(TD方向)が0.3N/20mm~30N/20mmである請求項1に記載の導電性粘着シート。
- 前記導電性粘着剤層の厚さが3μm~25μmであり、かつ、前記導電性粒子の平均粒径d50が3μm~20μmである請求項1に記載の導電性粘着シート。
- 前記導電性粘着剤層と前記導電性基材とが、40℃~120℃の温度で熱ラミネートすることによって積層されたものである請求項1に記載の導電性粘着シート。
- 前記導電性基材の少なくとも片面に前記導電性粘着剤層を載置したものを、40℃~120℃の温度でラミネートすることを特徴とする導電性粘着シートの製造方法。
- 請求項1~12のいずれか1項に記載の導電性粘着シートが、部品に貼付された構成を有する電子端末。
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KR (1) | KR102061585B1 (ja) |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016108438A (ja) * | 2014-12-05 | 2016-06-20 | Dic株式会社 | 熱伝導性粘着テープ及び物品 |
WO2017170371A1 (ja) * | 2016-03-30 | 2017-10-05 | 積水化学工業株式会社 | 導電性粘着テープ |
CN107709489A (zh) * | 2015-10-07 | 2018-02-16 | 积水化学工业株式会社 | 带粘接剂层的金属包覆无纺布、带粘接剂层的金属包覆无纺布的制造方法、及包覆芯线 |
JP2019001930A (ja) * | 2017-06-16 | 2019-01-10 | Dic株式会社 | 導電性粘着シート |
JP2019001931A (ja) * | 2017-06-16 | 2019-01-10 | Dic株式会社 | 導電性粘着シート |
JP2019059889A (ja) * | 2017-09-28 | 2019-04-18 | 信越ポリマー株式会社 | コンクリート表面被覆部材用シリコーンゴム組成物、それを用いたコンクリート表面被覆部材及びコンクリート表面被覆方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9080087B2 (en) * | 2010-07-22 | 2015-07-14 | Construction Research & Technology Gmbh | Reduction in modulus of polyurethane sealants and adhesives |
JP6660542B2 (ja) * | 2015-11-30 | 2020-03-11 | タツタ電線株式会社 | テキスタイル用ストレッチャブル導電性フィルム |
JP6930239B2 (ja) * | 2017-06-15 | 2021-09-01 | Dic株式会社 | 導電性粘着シート |
CN109890124B (zh) * | 2017-12-06 | 2024-03-19 | 昆山雅森电子材料科技有限公司 | 多层异向穿刺型导电布胶及使用其的fpc补强屏蔽结构 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000261107A (ja) * | 1999-03-08 | 2000-09-22 | Tomoegawa Paper Co Ltd | 電磁波シールド用金属繊維シート付フレキシブルプリント基板及びその製造方法 |
JP2006297714A (ja) * | 2005-04-19 | 2006-11-02 | Seiren Co Ltd | 転写用金属薄膜シート |
JP2009091485A (ja) * | 2007-10-10 | 2009-04-30 | Nitto Denko Corp | 配線回路基板用両面粘着テープ又はシートおよび配線回路基板 |
JP2009114412A (ja) * | 2007-11-09 | 2009-05-28 | Teijin Fibers Ltd | 導電性を有する難燃粘着テープ |
JP2013018956A (ja) * | 2011-06-16 | 2013-01-31 | Seiren Co Ltd | 導電テープ及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4403360B2 (ja) | 2003-02-28 | 2010-01-27 | Dic株式会社 | 導電性粘着シート |
JP2009544815A (ja) * | 2006-07-24 | 2009-12-17 | スリーエム イノベイティブ プロパティズ カンパニー | 導電性感圧性接着剤 |
JP5291316B2 (ja) | 2007-09-26 | 2013-09-18 | 日東電工株式会社 | 導電性粘着テープ |
-
2014
- 2014-04-10 WO PCT/JP2014/060382 patent/WO2014171387A1/ja active Application Filing
- 2014-04-10 KR KR1020157018434A patent/KR102061585B1/ko active IP Right Grant
- 2014-04-10 JP JP2014544280A patent/JP5660418B1/ja active Active
- 2014-04-10 CN CN201480021189.0A patent/CN105164223B/zh active Active
- 2014-04-16 TW TW103113848A patent/TWI599635B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000261107A (ja) * | 1999-03-08 | 2000-09-22 | Tomoegawa Paper Co Ltd | 電磁波シールド用金属繊維シート付フレキシブルプリント基板及びその製造方法 |
JP2006297714A (ja) * | 2005-04-19 | 2006-11-02 | Seiren Co Ltd | 転写用金属薄膜シート |
JP2009091485A (ja) * | 2007-10-10 | 2009-04-30 | Nitto Denko Corp | 配線回路基板用両面粘着テープ又はシートおよび配線回路基板 |
JP2009114412A (ja) * | 2007-11-09 | 2009-05-28 | Teijin Fibers Ltd | 導電性を有する難燃粘着テープ |
JP2013018956A (ja) * | 2011-06-16 | 2013-01-31 | Seiren Co Ltd | 導電テープ及びその製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016108438A (ja) * | 2014-12-05 | 2016-06-20 | Dic株式会社 | 熱伝導性粘着テープ及び物品 |
CN107709489A (zh) * | 2015-10-07 | 2018-02-16 | 积水化学工业株式会社 | 带粘接剂层的金属包覆无纺布、带粘接剂层的金属包覆无纺布的制造方法、及包覆芯线 |
JPWO2017061597A1 (ja) * | 2015-10-07 | 2018-07-26 | 積水化学工業株式会社 | 接着剤層付き金属被覆不織布、接着剤層付き金属被覆不織布の製造方法、及び被覆芯線 |
WO2017170371A1 (ja) * | 2016-03-30 | 2017-10-05 | 積水化学工業株式会社 | 導電性粘着テープ |
JP2019001930A (ja) * | 2017-06-16 | 2019-01-10 | Dic株式会社 | 導電性粘着シート |
JP2019001931A (ja) * | 2017-06-16 | 2019-01-10 | Dic株式会社 | 導電性粘着シート |
JP6996121B2 (ja) | 2017-06-16 | 2022-01-17 | Dic株式会社 | 導電性粘着シート |
JP2019059889A (ja) * | 2017-09-28 | 2019-04-18 | 信越ポリマー株式会社 | コンクリート表面被覆部材用シリコーンゴム組成物、それを用いたコンクリート表面被覆部材及びコンクリート表面被覆方法 |
Also Published As
Publication number | Publication date |
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JPWO2014171387A1 (ja) | 2017-02-23 |
JP5660418B1 (ja) | 2015-01-28 |
CN105164223B (zh) | 2018-05-29 |
CN105164223A (zh) | 2015-12-16 |
KR20150144740A (ko) | 2015-12-28 |
KR102061585B1 (ko) | 2020-01-03 |
TW201446936A (zh) | 2014-12-16 |
TWI599635B (zh) | 2017-09-21 |
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