WO2014169508A1 - Antenna-carrying logo and production method thereof, and electrical device having said logo - Google Patents

Antenna-carrying logo and production method thereof, and electrical device having said logo Download PDF

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Publication number
WO2014169508A1
WO2014169508A1 PCT/CN2013/076755 CN2013076755W WO2014169508A1 WO 2014169508 A1 WO2014169508 A1 WO 2014169508A1 CN 2013076755 W CN2013076755 W CN 2013076755W WO 2014169508 A1 WO2014169508 A1 WO 2014169508A1
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WO
WIPO (PCT)
Prior art keywords
layer
logo
antenna
electronic device
disposed
Prior art date
Application number
PCT/CN2013/076755
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French (fr)
Chinese (zh)
Inventor
刘丽梅
邓毅
Original Assignee
络派模切（北京）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 络派模切（北京）有限公司 filed Critical 络派模切（北京）有限公司
Priority to PCT/CN2013/076755 priority Critical patent/WO2014169508A1/en
Publication of WO2014169508A1 publication Critical patent/WO2014169508A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

Definitions

  • the present invention relates to a logo and a method of manufacturing the same, and an electronic device having the logo, the logo having an antenna and widely used in various electronic devices such as a mobile phone, a computer, an MP3, an MP4, a tablet, a digital camera, and the like.
  • logo is an English saying of device identification, which is generally set on the surface of the product for product identification and promotion. The logo allows consumers to remember the product body and brand culture.
  • logos on electronic devices such as mobile phones, computers, MP3s, MP4s, tablets, and digital cameras usually only have appearance functions. Therefore, general electronic device manufacturers usually purchase corresponding logos from manufacturers that specialize in producing various logos, and then It is mounted on the housing of the electronic device. The logos of these purchases are usually different depending on the type of product, but as the miniaturization of electronic devices develops, these logos are gradually getting smaller and smaller.
  • logos are usually flat sheets, and the surface is provided with a recognizable planar or three-dimensional pattern by means of printing or etching, such as a specific graphic or text, or a protrusion having an identification function is provided on the surface of the sheet. Form the corresponding identification mark. After the manufacturer purchases these logos, they are usually attached to the surface of the housing of the electronic device or embedded in the pits or through holes in the surface of the housing of the electronic device.
  • US6667719A and CN201868560U attempt to add the function of the antenna based on the logo.
  • the antenna is designed to be a logo, and the logo is set outside the electronic product, so that the logo has the functions of visual recognition and signal transmission.
  • the product described in the above prior art is not so much a logo as a special shaped antenna.
  • the antenna has the shape of a letter, so it looks like a logo, but it is subject to logo when actually used. Limitations of meaning, for example, for Apple's electronic product logo, which is just an Apple icon style, does not contain any text, so you can't use antennas of this shape; or even if the product logo contains similar letters, then the antenna Can only be designed into this letter shape, the performance of the antenna is greatly limited, and as the logo gets smaller and smaller, this particular letter-shaped antenna has almost no height of less than ten millimeters. The antenna can hardly perform any performance, and the logo of this particular letter needs to be specially designed for each product, and the adaptability is very poor. On the other hand, since the antenna must be metallic, the logo can only be metallic, so additional structures are needed to secure it to the housing, adding to the cost.
  • An arrangement of an antenna for an electronic device is disclosed in US 2011/0050509 A1, which arranges an antenna on the inner side of the metal casing of the electronic device, opens a hole at a position where the antenna is located, and sets a non-metallic logo in the hole to The wireless signal can be transmitted to the antenna through the hole in which the logo is located, or the signal radiated by the antenna can be transmitted to the outside of the metal casing through the hole in which the logo is located.
  • the inventors conceived to provide a logo with an antenna, which has the functions of external recognition and transceiving signals, and can be widely applied to each of them without being limited to a metal casing and a non-metal casing. Electronic devices without the need to make complex changes to the electronics housing and provide better signal reception/transmission capabilities.
  • the technical problem to be solved by the present invention is to provide a logo with an antenna, a method of manufacturing the same, and an electronic device having the logo to reduce or avoid the aforementioned problems.
  • the present invention provides a logo with an antenna for being disposed on a casing of an electronic device, the logo being in the form of a sheet, wherein the logo has at least one non-metal carrier layer and one An antenna layer having an outer surface facing an outer side of the electronic device and an inner surface facing an inner side of the electronic device, the outer surface of the carrier layer having a pattern for appearance recognition, the inside of the carrier layer
  • the antenna layer is integrally formed on a surface, and the antenna layer has a conductive member electrically connectable to a circuit inside the electronic device.
  • the present invention also provides an electronic device having the above logo, the electronic device having a housing, the logo being disposed on the housing, wherein the housing has a cover An aperture below the logo, the antenna layer of the logo being electrically connected to a circuit inside the electronic device via the aperture through a conductive member thereon.
  • the present invention further provides an electronic device having the above logo, the electronic device having a housing, the logo being disposed on the housing, wherein the housing has at least one
  • the pattern on the logo has a uniform shape, and the logo is disposed on an inner surface of the outer casing, and the pattern is exposed through the through hole for appearance recognition.
  • the present invention also provides a method for manufacturing a logo with an antenna, comprising the following steps:
  • the antenna layer is formed by printing on an inner surface of the carrier layer; or the antenna layer formed by printing on a flexible printed circuit board is pasted on an inner surface of the carrier layer;
  • an insulating layer is disposed on the surface of the antenna layer; or a layer of iron oxide is disposed on the surface of the antenna layer after the above step; or a layer of insulation is disposed on the surface of the antenna layer after the above step a layer, and then a layer of iron oxide layer is disposed outside the insulating layer;
  • the pattern for appearance recognition is die-cut or spray-coated or printed on the outer surface of the carrier layer.
  • the present invention also proposes another method for manufacturing a logo with an antenna, comprising the following steps:
  • an insulating layer is disposed on the surface of the antenna layer; or a layer of iron oxide is disposed on the surface of the antenna layer after the above step; or a layer of insulation is disposed on the surface of the antenna layer after the above step a layer, and then a layer of iron oxide layer is disposed outside the insulating layer;
  • the pattern for appearance recognition is die-cut or spray-coated or printed on the outer surface of the carrier layer.
  • the antenna with antenna provided by the invention and the manufacturing method thereof and the electronic device having the logo wherein the logo has the functions of appearance recognition and signal transmission, and can be not limited to the metal casing and the non-metal casing, and is widely applicable to various types. Electronic equipment without the need to make complex changes to the electronics housing and provide better signal reception/transmission capabilities.
  • FIG. 1a, 1b, 1c are schematic perspective views of a logo with an antenna according to the present invention.
  • FIGS. 1a and 1b are respectively a perspective view showing the structure of the logo of FIGS. 1a and 1b applied to the outer casing of the electronic device;
  • Figure 3a corresponds to the E-E cross-sectional view of Figure 2a;
  • Figure 3b shows a variant of Figure 3a
  • Figure 3c corresponds to the F-F cross-sectional view of Figure 2b;
  • Figure 3d shows a variant of Figure 3c.
  • FIG. 1a, 1b, 1c show a schematic perspective view of a logo with an antenna according to the present invention, as shown, these logos 1 is a sheet shape, wherein the surface of the logo 1 in FIG. 1a is provided with a flat character-like pattern 100 for appearance recognition by printing (the upper four letters of the letter LOGO are shown in the figure); the logo in FIG. 1b The surface of 1 is integrally formed with a raised pattern 100 for appearance recognition; and the logo in FIG. 1c The surface of 1 is integrally formed with a plurality of protrusions having an identification function, and the protrusions constitute a pattern 100 for appearance recognition. These patterns 100 for appearance recognition can be formed in logo by die cutting or spraying or printing. On the surface of 1. Those skilled in the art will appreciate that the pattern 100 on logo 1 referred to in this application contains graphics or text for appearance recognition, or a combination of graphics and text.
  • a coating or printing process similar to the formation of a logo layer in CN201904983U may be referred to, or the pattern 100 may be formed by die-cutting using the process described in the rotary die-cutting apparatus of CN202192640U, cited herein These prior art are referred to as references and will not be repeatedly described.
  • the logo shown in the figure 1 can be widely used in a variety of electronic devices, such as mobile phones, computers, MP3, MP4, tablets, digital cameras and so on.
  • the aforementioned logo 1 can generally be used to be disposed on the rear surface of an electronic device such as a mobile phone, that is, on the outer casing 2 of the back of the mobile phone.
  • the outer casing 2 in Fig. 2a is directly pasted with a logo 1, which corresponds to the logo 1 shape in Fig. 1a.
  • the outer casing 2 of Figure 2b has a logo 1, the logo 1 and the logo in Figure 1b 1 shape corresponds.
  • the outer casing 2 has a through hole 21 conforming to the shape of the raised pattern 100 on the logo 1, logo 1 is disposed on the inner surface of the outer casing 2, and the raised pattern 100 thereon is exposed through this through hole 21 for appearance recognition.
  • the pattern 100 formed by the plurality of protrusions in Fig. 1c can also be displayed through a plurality of through holes in the outer casing, since there is no essential difference from Fig. 2b, so no corresponding attachment is provided.
  • the figure is represented.
  • FIGS. 1a to 1c and FIGS. 3a to 3d wherein FIG. 3a corresponds to the EE cross-sectional view in FIG. 2a.
  • Figure 3b shows a variant of Figure 3a;
  • Figure 3c shows a FF cross-sectional view of Figure 2b, and
  • Figure 3d shows a variant of Figure 3c.
  • the logo of the present invention 1 is in the form of a sheet for being placed on the outer casing 2 of the electronic device.
  • logo 1 having at least one non-metallic carrier layer 11 and an antenna layer 12 having an outer surface 10 facing the outside of the electronic device and an inner surface 20 facing the inside of the electronic device, the outer surface 10 of the carrier layer 11 having an appearance for identification
  • the pattern 100, the inner surface 20 of the carrier layer 11 is integrally formed with the antenna layer 12.
  • the antenna layer 12 described in the present invention is a general concept, which may include only one resonant antenna (not shown) as generally understood, and may also include other structures associated with wireless connections.
  • the antenna layer 12 may include only a resonant antenna, or may include an NFC (or RFID) chip, a resonant antenna, or the like as a whole.
  • the antenna layer 12 has a conductive member 121 that can be electrically connected to a circuit inside the electronic device.
  • the conductive member 121 may be a wire as shown in the drawing, or may be a conductive adhesive, a conductive foam or the like that connects the antenna layer 12 with a circuit inside the electronic device.
  • the conductive member 121 is a conductive contact that is electrically connected to the antenna layer 12, and a circuit board inside the electronic device is provided with an electrically conductive pin that is electrically connectable to the conductive contact.
  • the conductive member 121 is an electrically conductive pin that is electrically connected to the antenna layer, and the circuit board inside the electronic device is provided with a conductive contact electrically connectable to the pin. .
  • the carrier layer 11 it is necessary to define the carrier layer 11 as a non-metal because the antenna layer 12 is integrally formed on the inner surface 20 of the carrier layer 11, and therefore, if the carrier layer 11 is made of a metal material or other material having a shielded wireless signal. Therefore, it is meaningless to arrange the antenna layer 12 on the inner surface 20 side of the carrier layer 11.
  • the surface of the antenna layer 12 is covered with an insulating layer (not shown), and the antenna layer 12 is located between the insulating layer and the carrier layer 11.
  • the insulating layer is arranged to prevent the antenna layer 12 from being exposed, and is short-circuited with the metal casing 2 or other metal parts, resulting in malfunction or damage.
  • the conductive member 121 disposed on the antenna layer 12 should maintain a state that can be electrically connected to a circuit inside the electronic device. For example, if the conductive member 121 is a conductive contact, the insulating layer should not cover the conductive layer. Contact.
  • the surface of the insulating layer (the side away from the antenna layer 12) may further be provided with a layer of iron oxide layer (not shown) display).
  • the surface of the antenna layer 12 is provided with an iron oxide layer
  • the surface of the antenna layer since the iron oxide layer itself is not electrically conductive, the surface of the antenna layer may not be provided with an insulating layer.
  • the surface of the antenna layer 12 is preferably covered with an insulating layer.
  • FIG. 3a it corresponds to the E-E cross-sectional view in FIG. 2a, wherein the electronic device has a housing 2, the logo 1 is disposed on the outer casing 2, and the logo 1 is directly attached to the outer casing 2 of the electronic device.
  • the outer casing 2 has a small hole 22 hidden under the logo 1.
  • Logo The antenna layer 12 of 1 may be electrically connected to a circuit (not shown) inside the electronic device via the small hole 22 via a conductive member 121 (a wire shown in the drawing).
  • Figure 3b shows a variant of Figure 3a, the logo 1 is disposed in a recess 23 in the outer casing 2, and the small hole 22 is located in the recess 23.
  • the logo 1 may be stuck in the dimples 23 by glue or the like, or may be mechanically embedded in the dimples 23.
  • Logo The antenna layer 12 of 1 can be electrically connected to a circuit (not shown) inside the electronic device via the small hole 22 via a conductive member 121 (a wire shown in the drawing).
  • the corresponding view shows the F-F cross-sectional view in FIG. 2b, wherein the electronic device also has a housing 2, the logo 1 is disposed on the outer casing 2, as seen from the figure, the outer casing 2 has a through hole 21 corresponding to the raised pattern 100 on the logo 1, logo 1 may be disposed on the inner surface of the outer casing 2 of the electronic device by pasting or the like, and the pattern 100 is exposed through the through hole 21 for appearance recognition.
  • logo The antenna layer 12 of 1 can be electrically connected to a circuit (not shown) inside the electronic device through the conductive member 121 (the wire shown in the drawing).
  • Figure 3d shows a variant of Figure 3c, which shows a similar logo in Figure 1c.
  • 1 is disposed on the outer casing 2 of the electronic device, that is, the outer casing 2 has a plurality of the logos
  • the pattern 100 of the plurality of protrusions formed on the first shape has a uniform shape of the through hole 21, and the pattern 100 composed of the plurality of protrusions is respectively exposed through the plurality of through holes 21 for appearance recognition.
  • the antenna layer 12 of 1 can be electrically connected to a circuit (not shown) inside the electronic device through the conductive member 121 (the wire shown in the drawing).
  • the logo 1 is integrally disposed in a recess 24 of the inner surface of the outer casing 2 such that the outer surface of the logo 1 is not higher than the dimple 24, or the logo is lowered as much as possible 1 highlights the height of the inner surface of the outer casing 2 to prevent the protruding logo 1 antenna from interfering with the internal space of the electronic device.
  • the antenna layer of 1 causes shielding. That is to say, when the outer casing 2 is non-metal, the antenna layer of the electronic device 1 may not need to be provided with an insulating layer, and even the iron oxide layer may not be provided; and if the outer casing 2 is metal, the antenna layer needs to be provided with an insulating layer.
  • FIGS. 3b, 3c, 3d are also required to punch or mill the dimples 23 or the through holes 21 or the dimples 24 in the process of manufacturing the outer casing 2, and since the antenna layer 12 is disposed and carried.
  • the layer 11 is integrally formed, and then there is no need to make any additional structural changes to the outer casing or the electronic device, and can be widely applied to existing devices to add new antenna functions, such as NFC functions.
  • the latter two forms of structure can also break the limitation of logo size.
  • logo size For small devices, especially for electronic devices such as mobile phones, the logo size is getting smaller and smaller, and sometimes even the entire logo inner surface is utilized. There is not much area available for the antenna layer.
  • the logo of the latter two structures (Figs. 3c and 3d) 1
  • the carrier layer 11 is disposed on the inner side of the outer casing 2, so that the carrier layer 11 can be made much larger than the pattern 100 for appearance recognition, and the logo displayed on the outside of the electronic device does not give a large area. The awkward feeling does not damage the integrity of the electronic device design.
  • the larger area of the carrier layer 11 inside the outer casing 2 can give the antenna layer 12 sufficient design space, thereby breaking the logo size limit and providing better signal receiving/transmitting capability.
  • the logo of the present invention can combine the functions of appearance recognition and signal transmission, and can be not limited to a metal casing and a non-metal casing, and is widely applicable to various electronic devices and can provide better signal receiving/transmitting capability.
  • the logo of the present invention can be manufactured by the following steps. First, a non-metal carrier layer 11 is provided, and the antenna layer 12 is formed on the inner surface of the carrier layer 11 by printing; or, the inner surface of the carrier layer 11 is pasted through The antenna layer 12 is formed by a flexible printed circuit board.
  • the conductive member 121 is formed on the antenna layer 12 at a later time or at the same time. For example, a wire may be attached thereto after the antenna layer 12 is formed, or a conductive foam or the like may be bonded; or, if the conductive member 121 is a conductive contact, the conductive contact may be formed while printing the antenna layer 12, or The conductive contacts may be integrally formed with the flexible printed circuit board and then bonded to the carrier layer 11.
  • the antenna layer 12 formed by the above method may only include the resonant antenna; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above steps, for example, spraying an insulating varnish; or may be in the antenna layer 12 after the above steps.
  • a layer of iron oxide layer is disposed on the surface; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above step, and then a layer of iron oxide layer is disposed outside the insulating layer.
  • the pattern 100 for appearance recognition is die-cut or spray-coated or printed on the outer surface 10 of the carrier layer 12.
  • the method of forming the pattern 100 for appearance recognition may employ the processes of the prior art described above, and thus will not be described in detail.
  • the antenna layer 12 can also be formed by a laser direct structuring process.
  • a laser direct structuring process reference is made to the applicant's earlier CN102781187A invention patent application, in which a detailed background description of the laser direct structuring of the antenna is made, which is incorporated herein by reference.
  • the logo of the present embodiment can be manufactured by the following steps. First, a carrier layer 11 having laser directly molded plastic is provided, and the antenna layer 12 is formed on the inner surface 20 of the carrier layer 11 by a laser direct molding process. .
  • the conductive member 121 is formed on the antenna layer 12 at a later time or at the same time.
  • a wire may be attached to the antenna layer 12, or a conductive foam or the like may be bonded; or, if the conductive member 121 is a conductive contact, the conductive contact may be formed while the laser directly shapes the antenna layer 12.
  • the antenna layer 12 formed by the above method may only include the resonant antenna; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above steps, for example, spraying an insulating varnish; or may be in the antenna layer 12 after the above steps.
  • a layer of iron oxide layer is disposed on the surface; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above step, and then a layer of iron oxide layer is disposed outside the insulating layer.
  • the pattern 100 for appearance recognition is die-cut or spray-coated or printed on the outer surface 10 of the carrier layer 11.

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  • Computer Networks & Wireless Communication (AREA)
  • Telephone Set Structure (AREA)

Abstract

The present invention provides an antenna-carrying logo for use on the outer housing of an electrical device, said logo being sheet-like and including at least one non-metal carrier layer and one antenna layer; the carrier layer has an outer surface which faces the outside of the electrical device and an inner surface which faces the inside of the electrical device; the outer surface of the carrier layer has a pattern used for visual recognition, the inner surface of the carrier layer is integrally formed with the antenna layer, and the antenna layer has a conductive component which can electrically connect with an electrical circuit within the electrical device. The present invention additionally provides an electrical device having the above logo, and a method for producing the above logo. The logo provided in the present invention combines the functions of being visually recognizable and sending and receiving signals, and does not need to be limited to metal outer housings and non-metal outer housings, is widely applicable across a variety of electrical devices and can provide for improved signal reception/emission capabilities.

Description

一种带天线的logo及其制造方法以及具有该logo的电子设备  Logo with antenna and manufacturing method thereof, and electronic device having the same 技术领域Technical field
本发明涉及一种logo及其制造方法以及具有该logo的电子设备，所述logo带有天线并可广泛用于各种电子设备，例如手机、电脑、MP3、MP4、平板电脑、数码相机等。 The present invention relates to a logo and a method of manufacturing the same, and an electronic device having the logo, the logo having an antenna and widely used in various electronic devices such as a mobile phone, a computer, an MP3, an MP4, a tablet, a digital camera, and the like.
背景技术Background technique
Logo是设备标识的英文说法，一般设置在产品表面，用于产品的识别和推广，通过logo可以让消费者记住产品主体和品牌文化。Logo is an English saying of device identification, which is generally set on the surface of the product for product identification and promotion. The logo allows consumers to remember the product body and brand culture.
手机、电脑、MP3、MP4、平板电脑、数码相机等电子设备上的logo通常仅仅具有外观上的功能，因此，一般电子设备生产商通常向专门生产各种logo的厂家采购相应的logo，然后将其装配于电子设备的壳体上。这些采购的logo通常根据产品的类型不同大小也不同，不过随着电子设备小型化的发展，这些logo也逐渐变得越来越小。Logos on electronic devices such as mobile phones, computers, MP3s, MP4s, tablets, and digital cameras usually only have appearance functions. Therefore, general electronic device manufacturers usually purchase corresponding logos from manufacturers that specialize in producing various logos, and then It is mounted on the housing of the electronic device. The logos of these purchases are usually different depending on the type of product, but as the miniaturization of electronic devices develops, these logos are gradually getting smaller and smaller.
这些logo通常为扁平的薄片，表面通过印刷或者刻蚀等手段设置有可供识别的平面或者立体图案，例如特定的图形或文字，或者在薄片的表面设置具备识别功能的凸起，由这些凸起组成相应的识别标记。生产厂家采购了这些logo后，通常将其粘贴在电子设备的壳体表面，或者嵌入到电子设备的壳体表面的凹坑或通孔中。These logos are usually flat sheets, and the surface is provided with a recognizable planar or three-dimensional pattern by means of printing or etching, such as a specific graphic or text, or a protrusion having an identification function is provided on the surface of the sheet. Form the corresponding identification mark. After the manufacturer purchases these logos, they are usually attached to the surface of the housing of the electronic device or embedded in the pits or through holes in the surface of the housing of the electronic device.
US6667719A和CN201868560U试图在logo的基础上增加天线的功能，其将天线设计成logo，将logo设置于电子产品的外部，使logo兼具外观识别和收发信号的功能。US6667719A and CN201868560U attempt to add the function of the antenna based on the logo. The antenna is designed to be a logo, and the logo is set outside the electronic product, so that the logo has the functions of visual recognition and signal transmission.
但是上述现有技术中描述的产品与其说是一种logo，还不如说是一种特殊形状的天线而已，这种天线具备字母的形状，因此看起来像logo，但是实际使用的时候会受到logo含义的限制，例如对于苹果公司的电子产品logo，其仅仅是一个苹果的图标样式，不包含任何文字，因此就不能用这种形状的天线；或者即便产品logo中含有类似的字母，那么天线也只能设计成这种字母形状的，天线的性能受到极大的限制，况且随着logo越来越小，这种特定的字母形状的天线几乎只有不到十个毫米的高度大小，采用这样的天线几乎发挥不了任何效能，而且这种特定字母的logo需要对每种产品进行专门设计，适应性很差。另一方面，由于天线必须是金属的，因此这种logo也只能是金属的，因此需要提供额外结构将其固定于壳体上，增加了成本。However, the product described in the above prior art is not so much a logo as a special shaped antenna. The antenna has the shape of a letter, so it looks like a logo, but it is subject to logo when actually used. Limitations of meaning, for example, for Apple's electronic product logo, which is just an Apple icon style, does not contain any text, so you can't use antennas of this shape; or even if the product logo contains similar letters, then the antenna Can only be designed into this letter shape, the performance of the antenna is greatly limited, and as the logo gets smaller and smaller, this particular letter-shaped antenna has almost no height of less than ten millimeters. The antenna can hardly perform any performance, and the logo of this particular letter needs to be specially designed for each product, and the adaptability is very poor. On the other hand, since the antenna must be metallic, the logo can only be metallic, so additional structures are needed to secure it to the housing, adding to the cost.
随着电子产品小型化以及无线功能的扩展，诸如Wlan、Bluetooth、GPRS、3G等功能全部集成在设备里面，各种无线功能的天线的设计以及位置的摆放，对产品的性能有相当大的影响。目前大部分的天线设计为内藏式的，在较小机构空间的情况下，摆放空间受到严重的挤压，导致效益不足。而近来出现的NFC（Near Field Communication，近距离无线通信）技术或者RFID（Radio Frequency Identification，射频识别）技术类的短距离的非接触式通信技术也大受欢迎，要将这些技术所用到的天线进一步集成在手机等电子设备中越发困难起来，因此很多厂商开始想办法将新加入的功能天线设置到电子设备的外壳上去，从而不用改变原有的天线设计和摆放，以节省成本。With the miniaturization of electronic products and the expansion of wireless functions, functions such as Wlan, Bluetooth, GPRS, and 3G are all integrated in the device. The design of various wireless functions and the placement of the position have considerable performance on the product. influences. At present, most of the antennas are designed to be built-in. In the case of a small institutional space, the placement space is severely squeezed, resulting in insufficient efficiency. And recently NFC (Near Field Communication, Near Field Communication (RFID) technology or RFID (Radio Frequency Identification, radio frequency identification) Technology short-distance contactless communication technology is also very popular. It is more difficult to integrate the antennas used in these technologies into electronic devices such as mobile phones. Therefore, many manufacturers have begun to find ways to add new ones. The functional antenna is placed on the outer casing of the electronic device, so that the original antenna design and placement are not changed, thereby saving costs.
US2011/0050509A1中公开了一种用于电子设备的天线的布置方式，其将天线布置在电子设备的金属外壳的内侧，在天线所在的位置开设一个孔，在孔中设置非金属的logo，以使无线信号可以通过logo所在的孔进入金属外壳内部传递给天线，或者使天线辐射的信号通过logo所在的孔传递到金属外壳的外部。An arrangement of an antenna for an electronic device is disclosed in US 2011/0050509 A1, which arranges an antenna on the inner side of the metal casing of the electronic device, opens a hole at a position where the antenna is located, and sets a non-metallic logo in the hole to The wireless signal can be transmitted to the antenna through the hole in which the logo is located, or the signal radiated by the antenna can be transmitted to the outside of the metal casing through the hole in which the logo is located.
但是上述现有技术需要在金属外壳内侧设置额外的结构来支撑天线，结构非常复杂。而且这种设计仅对金属外壳适用，对于非金属外壳来说，这样的设计明显多余，因为设置在非金属外壳内侧的天线本身就可以与外侧进行无线信号的传递，完全不用在外壳上开一个孔，然后将logo塞到孔中去，起码从功能上来说是没有必要的。However, the above prior art requires an additional structure inside the metal casing to support the antenna, and the structure is very complicated. Moreover, this design is only applicable to metal casings. For non-metallic casings, such a design is obviously redundant, because the antenna itself disposed inside the non-metallic casing can transmit wireless signals with the outside, without having to open a casing on the casing. Holes, then plug the logo into the hole, at least functionally not necessary.
因此，基于发明人在上述现有技术的基础上，设想提供一种带天线的logo，使其兼具外观识别和收发信号的功能，并且可以不限于金属外壳和非金属外壳，广泛适用于各种电子设备，而无需对电子设备的外壳进行复杂的改动并能提供更好的信号接收/发射能力。Therefore, based on the above-mentioned prior art, the inventors conceived to provide a logo with an antenna, which has the functions of external recognition and transceiving signals, and can be widely applied to each of them without being limited to a metal casing and a non-metal casing. Electronic devices without the need to make complex changes to the electronics housing and provide better signal reception/transmission capabilities.
技术问题technical problem
本发明要解决的技术问题是提供一种带天线的logo及其制造方法以及具有该logo的电子设备，以减少或避免前面所提到的问题。 The technical problem to be solved by the present invention is to provide a logo with an antenna, a method of manufacturing the same, and an electronic device having the logo to reduce or avoid the aforementioned problems.
技术解决方案Technical solution
为解决上述技术问题，本发明提出了一种带有天线的logo，用于设置于电子设备的外壳上，所述logo为片状，其中，所述logo至少具有一个非金属的承载层和一个天线层，所述承载层具有朝向所述电子设备外侧的外表面和朝向所述电子设备内侧的内表面，所述承载层的外表面上具有用于外观识别的图案，所述承载层的内表面上一体形成有所述天线层，所述天线层具有可与所述电子设备内部的电路电连接的导电部件。In order to solve the above technical problem, the present invention provides a logo with an antenna for being disposed on a casing of an electronic device, the logo being in the form of a sheet, wherein the logo has at least one non-metal carrier layer and one An antenna layer having an outer surface facing an outer side of the electronic device and an inner surface facing an inner side of the electronic device, the outer surface of the carrier layer having a pattern for appearance recognition, the inside of the carrier layer The antenna layer is integrally formed on a surface, and the antenna layer has a conductive member electrically connectable to a circuit inside the electronic device.
为解决上述技术问题，本发明还提出了一种具有上述logo的电子设备，所述电子设备具有一个外壳，所述logo设置于所述外壳的上，其中，所述外壳具有一个遮蔽于所述logo下方的小孔，所述logo的所述天线层通过其上的导电部件经由所述小孔与所述电子设备内部的电路电连接。In order to solve the above technical problem, the present invention also provides an electronic device having the above logo, the electronic device having a housing, the logo being disposed on the housing, wherein the housing has a cover An aperture below the logo, the antenna layer of the logo being electrically connected to a circuit inside the electronic device via the aperture through a conductive member thereon.
为解决上述技术问题，本发明还提供了另一种具有上述logo的电子设备，所述电子设备具有一个外壳，所述logo设置于所述外壳的上，其中，所述外壳上具有至少一个与所述logo上的图案形状一致的通孔，所述logo设置于所述外壳的内表面，所述图案通过所述通孔显露在外用于外观识别。In order to solve the above technical problem, the present invention further provides an electronic device having the above logo, the electronic device having a housing, the logo being disposed on the housing, wherein the housing has at least one The pattern on the logo has a uniform shape, and the logo is disposed on an inner surface of the outer casing, and the pattern is exposed through the through hole for appearance recognition.
为解决上述技术问题，本发明还提出了一种带天线的logo的制造方法，包括如下步骤：In order to solve the above technical problem, the present invention also provides a method for manufacturing a logo with an antenna, comprising the following steps:
提供一个非金属的承载层，在所述承载层的内表面通过印刷形成所述天线层；或者，在所述承载层的内表面粘贴通过柔性印刷电路板印制形成的所述天线层；Providing a non-metal carrier layer, the antenna layer is formed by printing on an inner surface of the carrier layer; or the antenna layer formed by printing on a flexible printed circuit board is pasted on an inner surface of the carrier layer;
之后或者同时在所述天线层上形成导电部件；Forming a conductive member on the antenna layer later or simultaneously;
在上述步骤之后，在所述天线层表面设置一层绝缘层；或者在上述步骤之后在所述天线层表面设置一层铁氧化层；或者在上述步骤之后在所述天线层表面设置一层绝缘层，之后在所述绝缘层外侧再设置一层铁氧化层；After the above steps, an insulating layer is disposed on the surface of the antenna layer; or a layer of iron oxide is disposed on the surface of the antenna layer after the above step; or a layer of insulation is disposed on the surface of the antenna layer after the above step a layer, and then a layer of iron oxide layer is disposed outside the insulating layer;
在所述承载层的外表面通过模切或者喷涂或者印刷所述用于外观识别的图案。The pattern for appearance recognition is die-cut or spray-coated or printed on the outer surface of the carrier layer.
为解决上述技术问题，本发明还提出了另一种带天线的logo的制造方法，包括如下步骤：In order to solve the above technical problem, the present invention also proposes another method for manufacturing a logo with an antenna, comprising the following steps:
提供一个具备激光直接成型塑料的承载层，通过激光直接成型工艺在所述承载层的内表面形成所述天线层；Providing a carrier layer having a laser direct molding plastic, and forming the antenna layer on an inner surface of the carrier layer by a laser direct molding process;
之后或者同时在所述天线层上形成导电部件；Forming a conductive member on the antenna layer later or simultaneously;
在上述步骤之后，在所述天线层表面设置一层绝缘层；或者在上述步骤之后在所述天线层表面设置一层铁氧化层；或者在上述步骤之后在所述天线层表面设置一层绝缘层，之后在所述绝缘层外侧再设置一层铁氧化层；After the above steps, an insulating layer is disposed on the surface of the antenna layer; or a layer of iron oxide is disposed on the surface of the antenna layer after the above step; or a layer of insulation is disposed on the surface of the antenna layer after the above step a layer, and then a layer of iron oxide layer is disposed outside the insulating layer;
在所述承载层的外表面通过模切或者喷涂或者印刷所述用于外观识别的图案。The pattern for appearance recognition is die-cut or spray-coated or printed on the outer surface of the carrier layer.
有益效果Beneficial effect
本发明所提供的带天线的logo及其制造方法以及具有该logo的电子设备，其中的logo兼具外观识别和收发信号的功能，并且可以不限于金属外壳和非金属外壳，广泛适用于各种电子设备，而无需对电子设备的外壳进行复杂的改动并能提供更好的信号接收/发射能力。The antenna with antenna provided by the invention and the manufacturing method thereof and the electronic device having the logo, wherein the logo has the functions of appearance recognition and signal transmission, and can be not limited to the metal casing and the non-metal casing, and is widely applicable to various types. Electronic equipment without the need to make complex changes to the electronics housing and provide better signal reception/transmission capabilities.
附图说明DRAWINGS
以下附图仅旨在于对本发明做示意性说明和解释，并不限定本发明的范围。其中，The following drawings are only intended to illustrate and explain the present invention, and do not limit the scope of the invention. among them,
图1a、1b、1c显示的是根据本发明的带有天线的logo的立体结构示意图；1a, 1b, 1c are schematic perspective views of a logo with an antenna according to the present invention;
图2a和2b分别显示的是图1a、1b中的logo应用于电子设备外壳上的立体结构示意图；2a and 2b are respectively a perspective view showing the structure of the logo of FIGS. 1a and 1b applied to the outer casing of the electronic device;
图3a对应显示的是图2a中的E-E截面视图；Figure 3a corresponds to the E-E cross-sectional view of Figure 2a;
图3b显示的是图3a的一种变形形式；Figure 3b shows a variant of Figure 3a;
图3c对应显示的是图2b中的F-F截面视图；Figure 3c corresponds to the F-F cross-sectional view of Figure 2b;
图3d显示的是图3c的一种变形形式。Figure 3d shows a variant of Figure 3c.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图说明本发明的具体实施方式。其中，相同的部件采用相同的标号。For a better understanding of the technical features, objects and effects of the present invention, the embodiments of the present invention will be described with reference to the accompanying drawings. Wherein the same components are given the same reference numerals.
图1a、1b、1c显示的是根据本发明的带有天线的logo的立体结构示意图，如图所示，这些logo 1为片状，其中，图1a中的logo 1的表面通过印刷设置有用于外观识别的平面文字状的图案100（图中显示的是大写的4个英文字母LOGO）；图1b中的logo 1的表面一体形成有凸起的、用于外观识别的图案100；而图1c中的logo 1的表面一体形成有多个具备识别功能的凸起，由这些凸起组成用于外观识别的图案100。这些用于外观识别的图案100可以通过模切或者喷涂或者印刷的方式形成在logo 1的表面上。本领域技术人员应当理解，本申请中提及的logo 1上的图案100包含用于外观识别的图形或者文字，或者图形和文字的结合。1a, 1b, 1c show a schematic perspective view of a logo with an antenna according to the present invention, as shown, these logos 1 is a sheet shape, wherein the surface of the logo 1 in FIG. 1a is provided with a flat character-like pattern 100 for appearance recognition by printing (the upper four letters of the letter LOGO are shown in the figure); the logo in FIG. 1b The surface of 1 is integrally formed with a raised pattern 100 for appearance recognition; and the logo in FIG. 1c The surface of 1 is integrally formed with a plurality of protrusions having an identification function, and the protrusions constitute a pattern 100 for appearance recognition. These patterns 100 for appearance recognition can be formed in logo by die cutting or spraying or printing. On the surface of 1. Those skilled in the art will appreciate that the pattern 100 on logo 1 referred to in this application contains graphics or text for appearance recognition, or a combination of graphics and text.
关于形成图案100的方法，可以参见CN201904983U中形成logo层类似的喷涂或者印刷工艺，或者可以采用CN202192640U中的轮转模切设备中所描述的工艺通过模切的方式形成所述图案100，此处引用这些现有技术作为参考，并不再对这些工艺进行重复描述。Regarding the method of forming the pattern 100, a coating or printing process similar to the formation of a logo layer in CN201904983U may be referred to, or the pattern 100 may be formed by die-cutting using the process described in the rotary die-cutting apparatus of CN202192640U, cited herein These prior art are referred to as references and will not be repeatedly described.
图中所示logo 1可广泛用于各种电子设备，例如手机、电脑、MP3、MP4、平板电脑、数码相机等。The logo shown in the figure 1 can be widely used in a variety of electronic devices, such as mobile phones, computers, MP3, MP4, tablets, digital cameras and so on.
下面以手机为例，具体说明本发明的logo 1的具体结构。The specific structure of the logo 1 of the present invention will be specifically described below by taking a mobile phone as an example.
如图2a和2b所示，前述的logo 1通常可以用于设置于手机之类的电子设备的后表面，亦即设置于手机背部的外壳2上。As shown in Figures 2a and 2b, the aforementioned logo 1 can generally be used to be disposed on the rear surface of an electronic device such as a mobile phone, that is, on the outer casing 2 of the back of the mobile phone.
图2a中的外壳2上直接粘贴有一个logo 1，该logo 1与图1a中的logo 1形状相对应。The outer casing 2 in Fig. 2a is directly pasted with a logo 1, which corresponds to the logo 1 shape in Fig. 1a.
图2b的外壳2上具有一个logo 1，该logo 1与图1b中的logo 1形状相对应。外壳2上具有一个与logo 1上的凸起的图案100形状一致的通孔21，logo 1设置于外壳2的内表面，其上凸起的图案100穿过这个通孔21显露出来用于外观识别。The outer casing 2 of Figure 2b has a logo 1, the logo 1 and the logo in Figure 1b 1 shape corresponds. The outer casing 2 has a through hole 21 conforming to the shape of the raised pattern 100 on the logo 1, logo 1 is disposed on the inner surface of the outer casing 2, and the raised pattern 100 thereon is exposed through this through hole 21 for appearance recognition.
类似于图2b中的情形，图1c中多个凸起所形成的图案100也可以穿过外壳上的多个通孔而显示出来，因为与图2b没有本质的区别，因此没有提供对应的附图进行表示。Similar to the situation in Fig. 2b, the pattern 100 formed by the plurality of protrusions in Fig. 1c can also be displayed through a plurality of through holes in the outer casing, since there is no essential difference from Fig. 2b, so no corresponding attachment is provided. The figure is represented.
以上描述的logo 1与现有技术最大的不同，也就是本发明解决现有技术的技术问题的要点显示在图1a~1c以及图3a~3d中，其中，图3a对应显示的是图2a中的E-E截面视图，图3b显示的是图3a的一种变形形式；图3c对应显示的是图2b中的F-F截面视图，图3d显示的是图3c的一种变形形式。The logo described above 1 is the biggest difference from the prior art, that is, the gist of the present invention to solve the technical problems of the prior art is shown in FIGS. 1a to 1c and FIGS. 3a to 3d, wherein FIG. 3a corresponds to the EE cross-sectional view in FIG. 2a. Figure 3b shows a variant of Figure 3a; Figure 3c shows a FF cross-sectional view of Figure 2b, and Figure 3d shows a variant of Figure 3c.
如图3a~3d所示，并参照图1a~1c，本发明的logo 1为片状，用于设置于电子设备的外壳2上。其中，logo 1至少具有一个非金属的承载层11和一个天线层12，承载层11具有朝向电子设备外侧的外表面10和朝向电子设备内侧的内表面20，承载层11的外表面10具有用于外观识别的图案100，承载层11的内表面20一体形成有天线层12。As shown in Figures 3a to 3d, and with reference to Figures 1a to 1c, the logo of the present invention 1 is in the form of a sheet for being placed on the outer casing 2 of the electronic device. Among them, logo 1 having at least one non-metallic carrier layer 11 and an antenna layer 12 having an outer surface 10 facing the outside of the electronic device and an inner surface 20 facing the inside of the electronic device, the outer surface 10 of the carrier layer 11 having an appearance for identification The pattern 100, the inner surface 20 of the carrier layer 11 is integrally formed with the antenna layer 12.
其中，本发明中所述的天线层12是一个概括性的概念，其可以如通常所理解的那样仅仅包括一个谐振天线（图中未显示），也可以包含与无线连接相关联的其它结构，例如，如果所述天线层12是用于NFC（或RFID）通信的，则天线层12可以仅仅包含谐振天线，或者整体包含NFC（或RFID）芯片、谐振天线等。Wherein, the antenna layer 12 described in the present invention is a general concept, which may include only one resonant antenna (not shown) as generally understood, and may also include other structures associated with wireless connections. For example, if the antenna layer 12 is for NFC (or RFID) communication, the antenna layer 12 may include only a resonant antenna, or may include an NFC (or RFID) chip, a resonant antenna, or the like as a whole.
天线层12具有可与电子设备内部的电路电连接的导电部件121。在一个具体实施例中，所述导电部件121可以是如图所示的导线，也可以是将天线层12与电子设备内部的电路连接起来的导电胶，导电泡棉等。在一个优选实施例中，所述导电部件121是与天线层12保持电连接的导电触点，电子设备内部的电路板上设置有可与所述导电触点电连接的可导电的pin脚。或者，在另一个具体实施例中，所述导电部件121是与天线层保持电连接的可导电的pin脚，电子设备内部的电路板上设置有可与所述pin脚电连接的导电触点。The antenna layer 12 has a conductive member 121 that can be electrically connected to a circuit inside the electronic device. In a specific embodiment, the conductive member 121 may be a wire as shown in the drawing, or may be a conductive adhesive, a conductive foam or the like that connects the antenna layer 12 with a circuit inside the electronic device. In a preferred embodiment, the conductive member 121 is a conductive contact that is electrically connected to the antenna layer 12, and a circuit board inside the electronic device is provided with an electrically conductive pin that is electrically connectable to the conductive contact. Or, in another specific embodiment, the conductive member 121 is an electrically conductive pin that is electrically connected to the antenna layer, and the circuit board inside the electronic device is provided with a conductive contact electrically connectable to the pin. .
在本发明中，限定承载层11为非金属是有必要的，因为天线层12一体形成于承载层11的内表面20，因此，如果承载层11为金属材料或者其它具备屏蔽无线信号的材料制成，则将天线层12设置于承载层11的内表面20一侧也就没有任何意义了。In the present invention, it is necessary to define the carrier layer 11 as a non-metal because the antenna layer 12 is integrally formed on the inner surface 20 of the carrier layer 11, and therefore, if the carrier layer 11 is made of a metal material or other material having a shielded wireless signal. Therefore, it is meaningless to arrange the antenna layer 12 on the inner surface 20 side of the carrier layer 11.
在一个具体实施例中，天线层12表面覆盖有一层绝缘层（图中未显示），天线层12位于所述绝缘层和承载层11之间。绝缘层的设置是为了避免天线层12裸露在外，与金属材质的外壳2或者其它金属部件短接，导致功能失效或者损坏。当然，本领域技术人员应当理解，天线层12上设置的导电部件121应当保持可以与电子设备内部的电路电连接的状态，例如，如果导电部件121为导电触点，则绝缘层不应当覆盖导电触点。In a specific embodiment, the surface of the antenna layer 12 is covered with an insulating layer (not shown), and the antenna layer 12 is located between the insulating layer and the carrier layer 11. The insulating layer is arranged to prevent the antenna layer 12 from being exposed, and is short-circuited with the metal casing 2 or other metal parts, resulting in malfunction or damage. Of course, those skilled in the art should understand that the conductive member 121 disposed on the antenna layer 12 should maintain a state that can be electrically connected to a circuit inside the electronic device. For example, if the conductive member 121 is a conductive contact, the insulating layer should not cover the conductive layer. Contact.
在另一个具体实施例中，为了增强谐振天线收发信号的强度，防止涡流产生从而增加通讯距离，绝缘层的表面（远离天线层12的一侧）可以进一步设置一层铁氧化层（图中未显示）。In another embodiment, in order to enhance the strength of the signal transmitted and received by the resonant antenna, prevent eddy current generation and increase the communication distance, the surface of the insulating layer (the side away from the antenna layer 12) may further be provided with a layer of iron oxide layer (not shown) display).
在另一个具体实施例中，天线层12表面设置有铁氧化层的情况下，由于铁氧化层本身是不导电的，因此天线层表面可以不设置绝缘层。但是，有时候是否需要设置铁氧化层是难以确定的，因此，为避免短路，天线层12表面优选覆盖有绝缘层。In another embodiment, in the case where the surface of the antenna layer 12 is provided with an iron oxide layer, since the iron oxide layer itself is not electrically conductive, the surface of the antenna layer may not be provided with an insulating layer. However, sometimes it is difficult to determine whether or not it is necessary to provide a ferrite layer. Therefore, in order to avoid a short circuit, the surface of the antenna layer 12 is preferably covered with an insulating layer.
下面参照附图进一步的说明具备本发明的logo 1的电子设备的详细结构。The detailed structure of the electronic device including the logo 1 of the present invention will be further described below with reference to the drawings.
如图3a所示，其对应显示的是图2a中的E-E截面视图，其中，所述电子设备具有一个外壳2，所述logo 1设置于所述外壳2的上，图中显示的是logo 1直接粘贴在电子设备的外壳2上，从图中可见，外壳2具有一个遮蔽于所述logo 1下方的小孔22，所述logo 1的所述天线层12可以通过其上的导电部件121（图中显示的是导线）经由所述小孔22与所述电子设备内部的电路（图中未显示）电连接。As shown in FIG. 3a, it corresponds to the E-E cross-sectional view in FIG. 2a, wherein the electronic device has a housing 2, the logo 1 is disposed on the outer casing 2, and the logo 1 is directly attached to the outer casing 2 of the electronic device. As can be seen from the figure, the outer casing 2 has a small hole 22 hidden under the logo 1. Logo The antenna layer 12 of 1 may be electrically connected to a circuit (not shown) inside the electronic device via the small hole 22 via a conductive member 121 (a wire shown in the drawing).
图3b显示的是图3a的一种变形形式，所述logo 1设置于所述外壳2上的一个凹坑23中，所述小孔22位于所述凹坑23中。所述logo 1可以通过粘胶等粘贴在凹坑23中，也可以通过机械方式嵌入到所述凹坑23中。logo 1的天线层12可以通过其上的导电部件121（图中显示的是导线）经由所述小孔22与所述电子设备内部的电路（图中未显示）电连接。Figure 3b shows a variant of Figure 3a, the logo 1 is disposed in a recess 23 in the outer casing 2, and the small hole 22 is located in the recess 23. The logo 1 may be stuck in the dimples 23 by glue or the like, or may be mechanically embedded in the dimples 23. Logo The antenna layer 12 of 1 can be electrically connected to a circuit (not shown) inside the electronic device via the small hole 22 via a conductive member 121 (a wire shown in the drawing).
如图3c所示，其对应显示的是图2b中的F-F截面视图，其中，所述电子设备同样具有一个外壳2，所述logo 1设置于所述外壳2上，从图中可见，所述外壳2上具有一个与所述logo 1上凸起的图案100一致的通孔21，logo 1可以通过粘贴等方式设置在电子设备的外壳2的内表面，所述图案100通过所述通孔21显露在外用于外观识别。logo 1的天线层12可以通过其上的导电部件121（图中显示的是导线）与电子设备内部的电路（图中未显示）电连接。As shown in FIG. 3c, the corresponding view shows the F-F cross-sectional view in FIG. 2b, wherein the electronic device also has a housing 2, the logo 1 is disposed on the outer casing 2, as seen from the figure, the outer casing 2 has a through hole 21 corresponding to the raised pattern 100 on the logo 1, logo 1 may be disposed on the inner surface of the outer casing 2 of the electronic device by pasting or the like, and the pattern 100 is exposed through the through hole 21 for appearance recognition. Logo The antenna layer 12 of 1 can be electrically connected to a circuit (not shown) inside the electronic device through the conductive member 121 (the wire shown in the drawing).
图3d显示的是图3c的一种变形形式，其显示的其实是图1c中类似的logo 1设置于电子设备的外壳2上的情形，亦即，所述外壳2上具有多个与所述logo 1上的多个凸起构成的图案100形状一致的通孔21，所述由多个凸起构成的图案100通过所述多个通孔21分别显露在外用于外观识别。logo 1的天线层12可以通过其上的导电部件121（图中显示的是导线）与电子设备内部的电路（图中未显示）电连接。Figure 3d shows a variant of Figure 3c, which shows a similar logo in Figure 1c. 1 is disposed on the outer casing 2 of the electronic device, that is, the outer casing 2 has a plurality of the logos The pattern 100 of the plurality of protrusions formed on the first shape has a uniform shape of the through hole 21, and the pattern 100 composed of the plurality of protrusions is respectively exposed through the plurality of through holes 21 for appearance recognition. Logo The antenna layer 12 of 1 can be electrically connected to a circuit (not shown) inside the electronic device through the conductive member 121 (the wire shown in the drawing).
图3d显示的变形形式与图3c最大的改进之处在于，所述logo 1整体设置于所述外壳2的内表面的一个凹坑24中，使得所述logo 1的外侧表面不高出所述凹坑24，或者尽量降低所述logo 1突出所述外壳2的内表面的高度，以避免突出的logo 1天线对电子设备内部空间造成干扰。The most improved of the variant shown in Figure 3d and Figure 3c is that the logo 1 is integrally disposed in a recess 24 of the inner surface of the outer casing 2 such that the outer surface of the logo 1 is not higher than the dimple 24, or the logo is lowered as much as possible 1 highlights the height of the inner surface of the outer casing 2 to prevent the protruding logo 1 antenna from interfering with the internal space of the electronic device.
图3a~3d所示的这四种形式的电子设备，前两种形式下（图3a和3b），因为logo 1是设置在外壳2的外侧的，因此电子设备的外壳2可以是金属的，也可以是非金属的，都不会对logo 1的天线层造成屏蔽。也就是说，当外壳2是非金属的情况下，电子设备1的天线层可以不用设置绝缘层，甚至也可以不用设置铁氧化层；而如果外壳2是金属的，则天线层需要设置绝缘层，为了避免金属外壳对无线信号的干扰和吸收，最好还要设置铁氧化层，以增强谐振天线接收信号的强度。而且这两种形式几乎不用对外壳做什么复杂的改动，尤其是对图3a所示的形式来说，仅仅只需要在外壳上钻一个小孔22就可以了。The four forms of electronic devices shown in Figures 3a to 3d, in the first two forms (Figures 3a and 3b), because of the logo 1 is disposed on the outer side of the outer casing 2, so the outer casing 2 of the electronic device may be metal or non-metallic, and will not have a logo. The antenna layer of 1 causes shielding. That is to say, when the outer casing 2 is non-metal, the antenna layer of the electronic device 1 may not need to be provided with an insulating layer, and even the iron oxide layer may not be provided; and if the outer casing 2 is metal, the antenna layer needs to be provided with an insulating layer. In order to avoid interference and absorption of the wireless signal by the metal casing, it is preferable to provide an iron oxide layer to enhance the strength of the signal received by the resonant antenna. Moreover, the two forms require almost no complicated modifications to the housing, especially for the form shown in Figure 3a, which only requires drilling a small hole 22 in the housing.
后两种形式（图3c和3d）同样可以不限于金属外壳或者非金属外壳，因为外壳2上设置了通孔21，提供了电子信号传递的通道，因此无论是金属外壳还是非金属外壳都是适用的。在对于外壳的改动方面，图3b，3c，3d也只要在制造外壳2的过程中，冲压或者铣削出凹坑23或者通孔21或者凹坑24就可以了，并且由于天线层12设置与承载层11一体成型，之后就不需要对外壳或者电子设备做任何额外的结构改动了，可以广泛适用于现有的各种设备增加新的天线功能，例如NFC功能等。The latter two forms (Figs. 3c and 3d) are also not limited to metal casings or non-metallic casings, since the casing 2 is provided with through holes 21 to provide a passage for electronic signal transmission, so whether it is a metal casing or a non-metal casing Applicable. In terms of modifications to the outer casing, FIGS. 3b, 3c, 3d are also required to punch or mill the dimples 23 or the through holes 21 or the dimples 24 in the process of manufacturing the outer casing 2, and since the antenna layer 12 is disposed and carried. The layer 11 is integrally formed, and then there is no need to make any additional structural changes to the outer casing or the electronic device, and can be widely applied to existing devices to add new antenna functions, such as NFC functions.
另外，这后两种形式的结构还可以突破logo尺寸的限制，对于小型设备来说，尤其是手机之类的电子设备，logo尺寸越来越小，有时即便将整个logo内侧表面都利用起来也没有多少面积可用于天线层。而从图中可见，这后两种结构（图3c和3d）的logo 1将承载层11设置于外壳2的内侧，因此可以将承载层11做得比用于外观识别的图案100大得多，从电子设备外部显示的logo来看并不会给人面积较大、突兀的感觉，从而不会破坏电子设备外观设计的完整性。而外壳2内侧的承载层11较大的面积可以给予天线层12足够的设计空间，从而可以突破logo尺寸的限制，提供更好的信号接收/发射能力。In addition, the latter two forms of structure can also break the limitation of logo size. For small devices, especially for electronic devices such as mobile phones, the logo size is getting smaller and smaller, and sometimes even the entire logo inner surface is utilized. There is not much area available for the antenna layer. As can be seen from the figure, the logo of the latter two structures (Figs. 3c and 3d) 1 The carrier layer 11 is disposed on the inner side of the outer casing 2, so that the carrier layer 11 can be made much larger than the pattern 100 for appearance recognition, and the logo displayed on the outside of the electronic device does not give a large area. The awkward feeling does not damage the integrity of the electronic device design. The larger area of the carrier layer 11 inside the outer casing 2 can give the antenna layer 12 sufficient design space, thereby breaking the logo size limit and providing better signal receiving/transmitting capability.
由此可见，本发明的logo可以兼具外观识别和收发信号的功能，并且可以不限于金属外壳和非金属外壳，广泛适用于各种电子设备并能提供更好的信号接收/发射能力。It can be seen that the logo of the present invention can combine the functions of appearance recognition and signal transmission, and can be not limited to a metal casing and a non-metal casing, and is widely applicable to various electronic devices and can provide better signal receiving/transmitting capability.
下面参照附图进一步的说明本发明的logo 1的制造方法。The method of manufacturing the logo 1 of the present invention will be further described below with reference to the accompanying drawings.
本发明的logo可以通过如下步骤制造，首先，提供一个非金属的承载层11，在所述承载层11内表面通过印刷形成所述天线层12；或者，在所述承载层11内表面粘贴通过柔性印刷电路板印制形成的所述天线层12。The logo of the present invention can be manufactured by the following steps. First, a non-metal carrier layer 11 is provided, and the antenna layer 12 is formed on the inner surface of the carrier layer 11 by printing; or, the inner surface of the carrier layer 11 is pasted through The antenna layer 12 is formed by a flexible printed circuit board.
之后或者同时在天线层12上形成导电部件121。例如可以在形成天线层12后在其上连接导线，或者粘接导电泡棉等；或者，如果导电部件121为导电触点，则导电触点可以在印刷所述天线层12的同时形成，或者所述导电触点可以与柔性印刷电路板一体形成然后粘接到承载层11上。The conductive member 121 is formed on the antenna layer 12 at a later time or at the same time. For example, a wire may be attached thereto after the antenna layer 12 is formed, or a conductive foam or the like may be bonded; or, if the conductive member 121 is a conductive contact, the conductive contact may be formed while printing the antenna layer 12, or The conductive contacts may be integrally formed with the flexible printed circuit board and then bonded to the carrier layer 11.
通过上述方法所形成的天线层12可以仅仅只包含谐振天线；或者还可以在上述步骤之后在天线层12表面设置一层绝缘层，例如喷涂绝缘漆；或者还可以在上述步骤之后在天线层12表面设置一层铁氧化层；或者还可以在上述步骤之后在天线层12表面设置一层绝缘层，之后在绝缘层外侧再设置一层铁氧化层。The antenna layer 12 formed by the above method may only include the resonant antenna; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above steps, for example, spraying an insulating varnish; or may be in the antenna layer 12 after the above steps. A layer of iron oxide layer is disposed on the surface; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above step, and then a layer of iron oxide layer is disposed outside the insulating layer.
最后，在所述承载层12的外表面10上通过模切或者喷涂或者印刷所述用于外观识别的图案100。形成用于外观识别的图案100的方法可以采用前面所述的现有技术中的工艺，因此不再详细描述。Finally, the pattern 100 for appearance recognition is die-cut or spray-coated or printed on the outer surface 10 of the carrier layer 12. The method of forming the pattern 100 for appearance recognition may employ the processes of the prior art described above, and thus will not be described in detail.
在本发明的另一个具体实施例中，还可以通过激光直接成型工艺形成所述天线层12。关于激光直接成型工艺可以参见申请人早先的CN102781187A发明专利申请，其中对于激光直接成型构成天线进行了详细的背景描述，此处引用作为参考。具体来说，本实施例的logo可以通过如下步骤制造，首先，提供一个具备激光直接成型塑料的承载层11，通过激光直接成型工艺在所述承载层11的内表面20形成所述天线层12。In another embodiment of the invention, the antenna layer 12 can also be formed by a laser direct structuring process. For a laser direct structuring process, reference is made to the applicant's earlier CN102781187A invention patent application, in which a detailed background description of the laser direct structuring of the antenna is made, which is incorporated herein by reference. Specifically, the logo of the present embodiment can be manufactured by the following steps. First, a carrier layer 11 having laser directly molded plastic is provided, and the antenna layer 12 is formed on the inner surface 20 of the carrier layer 11 by a laser direct molding process. .
之后或者同时在天线层12上形成导电部件121。例如可以在天线层12上连接导线，或者粘接导电泡棉等；或者，如果导电部件121为导电触点，则导电触点可以在激光直接成型所述天线层12的同时形成。The conductive member 121 is formed on the antenna layer 12 at a later time or at the same time. For example, a wire may be attached to the antenna layer 12, or a conductive foam or the like may be bonded; or, if the conductive member 121 is a conductive contact, the conductive contact may be formed while the laser directly shapes the antenna layer 12.
通过上述方法所形成的天线层12可以仅仅只包含谐振天线；或者还可以在上述步骤之后在天线层12表面设置一层绝缘层，例如喷涂绝缘漆；或者还可以在上述步骤之后在天线层12表面设置一层铁氧化层；或者还可以在上述步骤之后在天线层12表面设置一层绝缘层，之后在绝缘层外侧再设置一层铁氧化层。The antenna layer 12 formed by the above method may only include the resonant antenna; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above steps, for example, spraying an insulating varnish; or may be in the antenna layer 12 after the above steps. A layer of iron oxide layer is disposed on the surface; or an insulating layer may be disposed on the surface of the antenna layer 12 after the above step, and then a layer of iron oxide layer is disposed outside the insulating layer.
最后，在所述承载层11的外表面10上通过模切或者喷涂或者印刷所述用于外观识别的图案100。Finally, the pattern 100 for appearance recognition is die-cut or spray-coated or printed on the outer surface 10 of the carrier layer 11.
本领域技术人员应当理解，虽然本发明是按照多个实施例的方式进行描述的，但是并非每个实施例仅包含一个独立的技术方案。说明书中如此叙述仅仅是为了清楚起见，本领域技术人员应当将说明书作为一个整体加以理解，并将各实施例中所涉及的技术方案看作是可以相互组合成不同实施例的方式来理解本发明的保护范围。It should be understood by those skilled in the art that although the present invention is described in terms of various embodiments, not every embodiment includes only one independent technical solution. The description in the specification is only for the sake of clarity, and the present invention should be understood as a whole, and the technical solutions involved in the embodiments are considered as being able to be combined with each other to understand the present invention. The scope of protection.
以上所述仅为本发明示意性的具体实施方式，并非用以限定本发明的范围。任何本领域的技术人员，在不脱离本发明的构思和原则的前提下所作的等同变化、修改与结合，均应属于本发明保护的范围。The above is only the exemplary embodiments of the present invention and is not intended to limit the scope of the present invention. Equivalent changes, modifications, and combinations of the invention may be made without departing from the spirit and scope of the invention.

Claims (10)

  1. 一种带有天线的logo，用于设置于电子设备的外壳（2）上，所述logo（1）为片状，其特征在于，所述logo（1）至少具有一个非金属的承载层（11）和一个天线层（12），所述承载层（11）具有朝向所述电子设备外侧的外表面（10）和朝向所述电子设备内侧的内表面（20），所述承载层（11）的外表面（10）上具有用于外观识别的图案（100），所述承载层（11）的内表面（20）上一体形成有所述天线层（12），所述天线层（12）具有可与所述电子设备内部的电路电连接的导电部件（121）。 A logo with an antenna for being disposed on a casing (2) of an electronic device, the logo (1) being in the form of a sheet, characterized in that the logo (1) has at least one non-metal carrier layer ( 11) and an antenna layer (12) having an outer surface (10) facing the outside of the electronic device and an inner surface (20) facing the inner side of the electronic device, the carrier layer (11) a pattern (100) for appearance recognition on the outer surface (10), the antenna layer (12) integrally formed on the inner surface (20) of the carrier layer (11), the antenna layer (12) A conductive member (121) having electrical connections to circuitry within the electronic device.
  2. 如权利要求1所述的logo，其特征在于，所述天线层（12）表面覆盖有一层绝缘层，所述天线层（12）位于所述绝缘层和所述承载层（11）之间。The logo according to claim 1, wherein said antenna layer (12) is covered with an insulating layer, said antenna layer (12) being located between said insulating layer and said carrier layer (11).
  3. 如权利要求2所述的logo，其特征在于，所述绝缘层表面进一步设置有一层铁氧化层。The logo according to claim 2, wherein the surface of the insulating layer is further provided with a layer of iron oxide.
  4. 如权利要求1所述的logo，其特征在于，所述天线层（12）表面进一步设置有一层铁氧化层。 The logo according to claim 1, wherein the surface of the antenna layer (12) is further provided with a layer of iron oxide.
  5. 一种具有如权利要求1-4之一所述的logo的电子设备，所述电子设备具有一个外壳（2），所述logo（1）设置于所述外壳（2）上，其特征在于，所述外壳（2）具有一个遮蔽于所述logo（1）下方的小孔（22），所述logo（1）的所述天线层（12）通过其上的导电部件（121）经由所述小孔（22）与所述电子设备内部的电路电连接。An electronic device having a logo according to any one of claims 1 to 4, the electronic device having a housing (2), the logo (1) being disposed on the housing (2), characterized in that The outer casing (2) has a small hole (22) shielded under the logo (1), and the antenna layer (12) of the logo (1) passes through the conductive member (121) thereon The aperture (22) is electrically coupled to circuitry within the electronic device.
  6. 如权利要求5所述的电子设备，其特征在于，所述logo（1）设置于所述外壳（2）上的一个凹坑（23）中，所述小孔（22）位于所述凹坑（23）中。 The electronic device according to claim 5, wherein said logo (1) is disposed in a pit (23) on said outer casing (2), said small hole (22) being located in said pit (23) Medium.
  7. 一种具有如权利要求1-4之一所述的logo的电子设备，所述电子设备具有一个外壳（2），所述logo（1）设置于所述外壳（2）上，其特征在于，所述外壳（2）上具有至少一个与所述logo（1）上的图案（100）形状一致的通孔（21），所述logo（1）设置于所述外壳（2）的内表面，所述图案（100）通过所述通孔（21）显露在外用于外观识别。An electronic device having a logo according to any one of claims 1 to 4, the electronic device having a housing (2), the logo (1) being disposed on the housing (2), characterized in that The outer casing (2) has at least one through hole (21) conforming to the shape of the pattern (100) on the logo (1), and the logo (1) is disposed on an inner surface of the outer casing (2). The pattern (100) is exposed through the through hole (21) for appearance recognition.
  8. 如权利要求7所述的电子设备，其特征在于，所述logo（1）整体设置于所述外壳（2）的内表面的一个凹坑（24）中。 The electronic device according to claim 7, wherein said logo (1) is integrally disposed in a recess (24) of an inner surface of said outer casing (2).
  9. 一种带天线的logo的制造方法，包括如下步骤：A method for manufacturing a logo with an antenna includes the following steps:
    提供一个非金属的承载层（11），在所述承载层（11）的内表面（20）通过印刷形成所述天线层（12）；或者，在所述承载层（11）的内表面（20）粘贴通过柔性印刷电路板印制形成的所述天线层（12）；Providing a non-metallic carrier layer (11) on which the antenna layer (12) is formed by printing on the inner surface (20) of the carrier layer (11); or on the inner surface of the carrier layer (11) ( 20) pasting the antenna layer (12) formed by printing on a flexible printed circuit board;
    之后或者同时在所述天线层（12）上形成导电部件（121）；Forming a conductive member (121) on the antenna layer (12) at a later time or at the same time;
    在上述步骤之后，在所述天线层（12）表面设置一层绝缘层；或者在上述步骤之后在所述天线层（12）表面设置一层铁氧化层；或者在上述步骤之后在所述天线层（12）表面设置一层绝缘层，之后在所述绝缘层外侧再设置一层铁氧化层；After the above steps, an insulating layer is disposed on the surface of the antenna layer (12); or a layer of iron oxide is disposed on the surface of the antenna layer (12) after the above steps; or after the above steps at the antenna An insulating layer is disposed on the surface of the layer (12), and then a layer of iron oxide layer is disposed outside the insulating layer;
    在所述承载层（11）的外表面（10）通过模切或者喷涂或者印刷所述用于外观识别的图案（100）。The pattern (100) for appearance recognition is die-cut or spray-coated or printed on the outer surface (10) of the carrier layer (11).
  10. 一种带天线的logo的制造方法，包括如下步骤：A method for manufacturing a logo with an antenna includes the following steps:
    提供一个具备激光直接成型塑料的承载层（11），通过激光直接成型工艺在所述承载层（11）的内表面（20）形成所述天线层（12）；Providing a carrier layer (11) having a laser direct molding plastic, the antenna layer (12) being formed on the inner surface (20) of the carrier layer (11) by a laser direct molding process;
    之后或者同时在所述天线层（12）上形成导电部件（121）；Forming a conductive member (121) on the antenna layer (12) at a later time or at the same time;
    在上述步骤之后，在所述天线层（12）表面设置一层绝缘层；或者在上述步骤之后在所述天线层（12）表面设置一层铁氧化层；或者在上述步骤之后在所述天线层（12）表面设置一层绝缘层，之后在所述绝缘层外侧再设置一层铁氧化层；After the above steps, an insulating layer is disposed on the surface of the antenna layer (12); or a layer of iron oxide is disposed on the surface of the antenna layer (12) after the above steps; or after the above steps at the antenna An insulating layer is disposed on the surface of the layer (12), and then a layer of iron oxide layer is disposed outside the insulating layer;
    在所述承载层（11）的外表面（10）通过模切或者喷涂或者印刷所述用于外观识别的图案（100）。The pattern (100) for appearance recognition is die-cut or spray-coated or printed on the outer surface (10) of the carrier layer (11).
PCT/CN2013/076755 2013-06-05 2013-06-05 Antenna-carrying logo and production method thereof, and electrical device having said logo WO2014169508A1 (en)

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WO2014206280A1 (en) 2013-06-26 2014-12-31 Shenzhen Byd Auto R&D Company Limited Metal shell and cell phone comprising the same
US9954583B2 (en) 2014-03-28 2018-04-24 Byd Company Limited Mobile terminal and near field communication antenna
CN112202470A (en) * 2020-10-09 2021-01-08 珠海格力电器股份有限公司 Antenna equipment of mobile terminal, control method and device thereof and mobile terminal
CN114466540A (en) * 2021-08-06 2022-05-10 荣耀终端有限公司 Decoration, electronic equipment's shell and electronic equipment

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CN103094661A (en) * 2011-11-01 2013-05-08 索尼公司 Electronic Apparatus
CN103310705A (en) * 2013-06-05 2013-09-18 络派模切（北京）有限公司 Logo provided with antenna, manufacturing thereof, and electronic equipment adopting same
CN203276723U (en) * 2013-06-05 2013-11-06 络派模切（北京）有限公司 Logo provided with antenna and electronic device provided therewith

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WO2014206280A1 (en) 2013-06-26 2014-12-31 Shenzhen Byd Auto R&D Company Limited Metal shell and cell phone comprising the same
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EP3014962A4 (en) * 2013-06-26 2017-02-22 BYD Company Limited Metal shell and cell phone comprising the same
US9954583B2 (en) 2014-03-28 2018-04-24 Byd Company Limited Mobile terminal and near field communication antenna
CN112202470A (en) * 2020-10-09 2021-01-08 珠海格力电器股份有限公司 Antenna equipment of mobile terminal, control method and device thereof and mobile terminal
CN114466540A (en) * 2021-08-06 2022-05-10 荣耀终端有限公司 Decoration, electronic equipment's shell and electronic equipment
CN114466540B (en) * 2021-08-06 2023-02-24 荣耀终端有限公司 Decoration, electronic equipment's shell and electronic equipment

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