WO2014127584A1 - 发光器件、背光源模组及显示装置 - Google Patents

发光器件、背光源模组及显示装置 Download PDF

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Publication number
WO2014127584A1
WO2014127584A1 PCT/CN2013/074729 CN2013074729W WO2014127584A1 WO 2014127584 A1 WO2014127584 A1 WO 2014127584A1 CN 2013074729 W CN2013074729 W CN 2013074729W WO 2014127584 A1 WO2014127584 A1 WO 2014127584A1
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Prior art keywords
light
emitting device
light emitting
emitting unit
heat
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PCT/CN2013/074729
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English (en)
French (fr)
Inventor
龚占双
夏龙
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合肥京东方光电科技有限公司
京东方科技集团股份有限公司
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Publication of WO2014127584A1 publication Critical patent/WO2014127584A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • Light emitting device backlight module and display device
  • Embodiments of the present invention relate to the field of display manufacturing, and in particular, to a light emitting device, a backlight module, and a display device. Background technique
  • a light-emitting diode As a backlight light-emitting structure for a liquid crystal display device, a light-emitting diode (LED) is a luminescent material widely used at present, and has the advantages of small volume, low power consumption, and long service life. LED is a solid-state semiconductor device that can directly convert electrical energy into light energy. Its main structure is a semiconductor wafer. One end of the semiconductor wafer is connected to the negative pole of the power supply, the other end is connected to the positive pole of the power supply, and the whole wafer is epoxy. Encapsulated. The semiconductor wafer consists of two parts, one of which is a P-type semiconductor, in which the hole dominates, and the other end is an N-type semiconductor, with electrons predominating.
  • the LED work a large amount of electric energy is converted into heat energy, which causes the temperature of the LED light bar to rise.
  • the LED is easily damaged on the one hand, and the service life of the LED light bar is reduced.
  • the LED light bar generates a large amount of heat. , high temperature, will also affect the liquid crystal display quality, such as black light leakage, water ripple (mura) and so on.
  • the photoelectric conversion rate of LED is only about 30%, and the rest generates heat.
  • the conventional heat dissipation structure is that the circuit board is mounted on the mounting surface of aluminum, which is limited to heat conduction and has limited heat dissipation. Summary of the invention
  • Embodiments of the present invention provide a light emitting device, a backlight module, and a display device, which can simultaneously realize two heat dissipation modes of heat conduction and heat convection, thereby achieving good heat dissipation performance.
  • a light emitting device including: a light emitting unit disposed on the light emitting unit
  • the printed circuit board (PCB) component includes: an insulating and thermally conductive layer disposed on an outer side of the light emitting unit, and a heat sink having a hollowed out region disposed under the PCB assembly.
  • a backlight module including the above-described light emitting device, and a back frame disposed under the light emitting device.
  • a display device including the backlight module described above.
  • FIG. 1 is a schematic structural diagram of a light emitting device according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of a heat sink according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of another light emitting device according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural diagram of still another light emitting device according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural diagram of a light emitting device according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic structural diagram of another light emitting device according to Embodiment 3 of the present invention.
  • FIG. 7 is a schematic structural diagram of a backlight module according to Embodiment 4 of the present invention.
  • FIG. 8 is a schematic structural diagram of another backlight module according to Embodiment 4 of the present invention
  • FIG. 9 is a schematic structural diagram of still another backlight module according to Embodiment 4 of the present invention.
  • an embodiment of the present invention provides a light emitting device including a light emitting unit and a PCB assembly disposed under the light emitting unit.
  • the light emitting device further includes: an insulating heat conduction disposed on an outer side of the light emitting unit a layer, and a heat sink having a hollowed out region disposed under the PCB assembly.
  • the light emitting unit includes an illuminant, a packaging material, and the like, the encapsulating material encapsulates the illuminant, and of course, the electrode lead connected to the positive and negative electrodes of the illuminator, as these are prior art, No longer.
  • the illuminant is an LED granule
  • the illuminating unit may include an illuminant, an encapsulating material, and a sealing resin, and the encapsulating material and the sealing resin enclose the illuminant.
  • the light emitting device can be used as an LED light bar, and one LED light bar is composed of a plurality of light emitting units. In the embodiment of the present invention, the number of the light emitting units is not limited.
  • the side of the PCB assembly to which the light unit is connected is referred to as the front side and the other side is the back side.
  • the outer side surface of the insulating heat conduction layer disposed on the outer surface of the light emitting unit refers to a surface located around the light emitting unit.
  • the shape and size of the hollow area on the heat sink are set according to actual conditions, and are not limited herein.
  • the embodiment of the present invention provides a light emitting device, the light emitting device includes a light emitting unit, a PCB assembly disposed under the light emitting unit, and an insulating heat conducting layer disposed on an outer side of the light emitting unit, and a heat sink having a hollowed out area under the PCB assembly; heat generated by the operation of the light emitting device is radiated by heat conduction on the one hand, and hollow space is formed on the heat sink by providing a hollow space on the other hand.
  • the upper convection condition is used to rapidly dissipate heat; the heat generated by the operation of the illuminating device can be diffused more quickly and efficiently by the above two methods of heat diffusion, so that the illuminating device provided by the embodiment of the invention can achieve good performance. Thermal performance.
  • the light emitting unit includes an illuminant, and the illuminant is an LED granule.
  • the heat sink is made of PVC (polyvinyl chloride, polyvinyl chloride, and PVC).
  • the insulating and thermally conductive layer is made of PPS (polyphenylene sulfide, PPS) or PA (polyamide, polyamide).
  • PPS polyphenylene sulfide, PPS
  • PA polyamide, polyamide
  • an embodiment of the present invention provides a light emitting device 100.
  • the light emitting device 100 includes: a light emitting unit 10, a PCB assembly 20 disposed under the light emitting unit, and an outer side of the light emitting unit 10.
  • the structure of the heat sink 40 is as shown in FIG. 2, and the shape of the hollow region 401 can be, for example, a rectangle; the material of the heat sink 40 can be, for example, PVC.
  • the material thereof may be, for example, PPS or PA.
  • the hollowed-out region 401 of the fin 40 can form a flow condition, and a circulating flow between the hotter portion and the cooler portion of the gas rapidly diffuses the heat to make the temperature tend to be uniform.
  • part of the heat can be dissipated by heat conduction.
  • the structure of the illuminating device 100 provided by the embodiment of the present invention may be as shown in FIG. 3 , wherein the illuminating unit 10 may include an illuminant 101 , an encapsulating material 102 , and a sealing resin 103 .
  • the encapsulating material 102 and the sealing resin 103 enclose the illuminator 101.
  • the illuminant is not limited to only the LED particles, and may be other, which is not limited herein.
  • the shape of the hollow region 401 of the heat sink 40 is not limited to a rectangular shape.
  • the shape of the hollow region 401 may also be a circular shape, an elliptical shape, or the like, as seen from a plan view. Shape, not limited here.
  • the PCB assembly 20 may further include a power source (not shown) disposed on a back surface thereof, and the power source is located in the hollow area 401.
  • a power source (not shown) disposed on a back surface thereof, and the power source is located in the hollow area 401.
  • the power supply is disposed on the back surface of the PCB assembly 20 and located in the hollowed out region 401, which is more advantageous for rapidly dissipating heat by means of thermal convection.
  • the power source is located in the hollowed out area 401, and the power source can be completely placed in the hollowed out after the PCB assembly 20 is completely attached to the heat sink 40 having the hollowed out area 401. In area 401.
  • the illuminating unit 10 may further be provided with a positioning hole (located at a position corresponding to the positioning post in FIG. 4); the PCB assembly 20 includes a positioning post 201 disposed on a front surface thereof. And the positioning post 201 is matched with the positioning hole.
  • Embodiment 2 By arranging the positioning post 201 in the PCB assembly 20 and matching the positioning hole provided on the light emitting unit 10 to fix the light emitting unit 10, the movement of the light emitting unit 10 can be prevented.
  • Embodiment 2
  • the light emitting device provided by the embodiment of the present invention is different from the light emitting device shown in FIG. 4 in that the light emitting device 100 of the present embodiment further includes a first radiation heat dissipation disposed on the upper surface of the light emitting unit 10. Coating 50.
  • the first radiation heat-dissipating coating 50 can be obtained, for example, by coating a polymer radiation heat-dissipating paint on the upper surface of the light-emitting unit 10.
  • the first radiation heat dissipation coating 50 disposed on the upper surface of the light emitting unit 10 can radiate heat through the first radiation heat dissipation coating 50 to the atmospheric space in the form of an infrared wavelength of 8 ⁇ m to 13 ⁇ m, thereby reducing the surface of the light emitting unit 10. And internal temperature.
  • the polymer radiation heat-dissipating paint itself is not affected by the surrounding medium, it can also have the characteristics of insulation, corrosion resistance, water repellency, acid and alkali resistance, etc. while performing radiation cooling effect on the light-emitting unit. 10 plays a very good role in protection.
  • the light emitting device provided by the embodiment of the present invention is different from the light emitting device shown in FIG. 4 in that the light emitting device 100 of the present embodiment further includes the light emitting unit 10 and the insulating and thermally conductive layer 30.
  • a first radiation heat dissipating coating 50 ′ is disposed on the upper surface of the light emitting unit 10 and the insulating and thermally conductive layer 30 , which helps to dispose a part of heat conducted to the insulating and thermally conductive layer 30 over the insulating and thermally conductive layer 30 .
  • the first radiation-dissipating coating 50' is radiated out to dissipate heat more efficiently.
  • the heat generated by the operation of the light-emitting device is radiated by the insulating and thermally conductive layer 30 on the one hand, and the hollow space is formed by providing the hollowed-out region 401 on the heat sink 40, thereby obtaining a bottom-up convection condition.
  • the above three heat diffusion methods can be used to generate the light emitting device. The heat is diffused faster and more efficiently, so that the light-emitting device provided by the embodiment of the invention can achieve good heat dissipation performance.
  • an embodiment of the present invention provides a backlight module.
  • the backlight module includes: a light emitting device 100, and a back frame 200 disposed under the light emitting device.
  • the material of the back frame 200 may be a metal material such as aluminum alloy, or pure aluminum, or brass, or copper.
  • the light emitting device 100 is the same as the light emitting device of the first embodiment.
  • the back frame 200 of the metal material can further heat-dissipate, and on the other hand, the mechanical strength of the light-emitting device 100 can be enhanced to protect the light-emitting device 100.
  • the structure of the illuminating device 100 provided by the embodiment of the present invention may be as shown in FIG. 8 , wherein the illuminating unit 10 may include the illuminant 101 , the encapsulating material 102 , and the sealing resin 103 .
  • the encapsulating material 102 and the encapsulating resin 103 encapsulate the illuminator 101.
  • the light emitting device 100 may further include a first radiation heat dissipation coating 50' disposed on the upper surface of the light emitting unit 10 and the insulating heat conducting layer 30.
  • the backlight module may further include a second radiation heat dissipation coating 60 disposed between the light emitting device 100 and the back frame 200.
  • the second radiation heat dissipating coating 60 can be applied to the side of the back frame 200 opposite to the light emitting device 100, for example, by further radiating heat through the back frame.
  • the heat generated by the operation of the light-emitting device is radiated by the insulating and thermally conductive layer 30 on the one hand, and the hollow space is formed by providing the hollowed-out region 401 on the heat sink 40, thereby obtaining a bottom-up convection condition.
  • the heat generated by the light-emitting device can be further generated by the above three heat diffusion methods.
  • the light-emitting device provided by the embodiment of the invention can achieve good heat dissipation performance.
  • Embodiments of the present invention provide a display device including the above-described backlight module.
  • the display device may be, for example, a liquid crystal display device, and may be a product or component having any display function such as a liquid crystal display, a liquid crystal television, a digital photo frame, a mobile phone, or a tablet computer.
  • the display device may be a small-sized display device such as a mobile phone that is sensitive to heat.
  • the display device provided by the embodiment of the invention has good heat dissipation performance due to the use of the foregoing light-emitting device, so that when the display device is applied, the heat dissipation of the light-emitting device can be prevented from affecting the display screen.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

提供了一种发光器件（100）、背光源模组及显示装置。发光器件（100）包括发光单元（10）、设置于发光单元下方的PCB组件（20），进一步包括：设置在发光单元外侧面的绝缘导热层（30）、设置于PCB组件（20）下方的具有镂空区域（401）的散热片（40）。

Description

发光器件、 背光源模组及显示装置 技术领域
本发明的实施例涉及显示器制造领域， 尤其涉及一种发光器件、 背光源 模组及显示装置。 背景技术
作为液晶显示器件用背光源发光结构， 发光二极管 （Light Emitting Diode, 筒称 LED )是现阶段应用广泛的一种发光材料， 具有体积小， 耗电 量低， 使用寿命长等优点。 LED是一种固态的半导体器件， 它可以直接把电 能转化为光能， 其主要结构是一个半导体晶片， 该半导体晶片的一端连接电 源的负极， 另一端连接电源的正极， 整个晶片被环氧树脂封装起来。 半导体 晶片由两部分组成， 一部分是 P型半导体， 在它里面空穴占主导地位， 另一 端是 N型半导体， 电子占主导地位。 当这两种半导体连接起来的时候， 它们 之间就形成一个 " P-N结" 。 当电流通过导线作用于这个半导体晶片的时候， 电子就会被推向 P区， 在 P区里电子跟空穴复合， 然后就会以光子的形式发 出能量， 这就是 LED发光的原理。
LED工作中会有大量的电能转化为热能， 使 LED灯条温度升高， 当散 热性不好时， 一方面容易损坏 LED, 降低 LED灯条的使用寿命， 另一方面 LED灯条发热量大， 温度高， 也会对液晶显示画质产生影响， 如黑态画面的 漏光， 水波纹（mura )等。
目前， LED的光电转换率仅为 30 %左右， 其余则生成热， 这部分热量， 传统沿用的散热结构是电路板安装在铝制的安装平面上， 仅限于热传导， 散 热量有限。 发明内容
本发明的实施例提供一种发光器件、 背光源模组及显示装置， 可同时实 现热传导和热对流两种散热方式， 从而达到良好的散热性能。
一方面， 提供了一种发光器件， 包括： 发光单元、 设置于所述发光单元 下方的印制电路板（Printed Circuit Board, 筒称 PCB )组件； 进一步包括： 设置于所述发光单元外侧面的绝缘导热层、以及设置于所述 PCB组件下方的 具有镂空区域的散热片。
另一方面， 提供了一种背光源模组， 包括上述的发光器件， 以及设置于 所述发光器件下方的背框。
再一方面， 提供了一种显示装置， 包括上述的背光源模组。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为本发明实施例一提供的一种发光器件的结构示意图；
图 2为本发明实施例一提供的一种散热片的结构示意图
图 3为本发明实施例一提供的另一种发光器件的结构示意图；
图 4为本发明实施例一提供的又一种发光器件的结构示意图；
图 5为本发明实施例二提供的一种发光器件的结构示意图；
图 6为本发明实施例三提供的另一种发光器件的结构示意图；
图 7为本发明实施例四提供的一种背光源模组的结构示意图；
图 8为本发明实施例四提供的另一种背光源模组的结构示意图； 图 9为本发明实施例四提供的又一种背光源模组的结构示意图。
附图标记： 100-发光器件； 10-发光单元， 101-发光体， 102-封装材料； 103-密封树脂； 20-PCB组件， 201-定位柱； 30-绝缘导热层； 40-散热片， 401- 镂空区域； 50, 50' -第一辐射散热涂层； 60-第二辐射散热涂层； 200-背框。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。 总地来说， 本发明的实施例提供了一种发光器件， 包括发光单元、 设置 于所述发光单元下方的 PCB组件； 所述发光器件还包括： 设置于所述发光单 元外侧面的绝缘导热层、以及设置于所述 PCB组件下方的具有镂空区域的散 热片。
需要说明的是， 第一， 发光单元包括发光体和封装材料等， 封装材料将 发光体封装起来， 当然还包括与发光体的正负极连接的电极引线， 由于这些 为现有技术， 在此不再赘述。 当发光体为 LED颗粒时， 所述发光单元可包括 发光体， 封装材料， 以及密封树脂， 所述封装材料和密封树脂将发光体封装 起来。 所述发光器件可用作 LED灯条， 一个 LED灯条由若干个发光单元组 成。 在本发明实施例中， 不对所述发光单元的个数进行限定。 发光单元供电的电源，在本发明实施例中，将与发光单元连接的 PCB组件的 一面称为正面， 另一面则为背面。
第三， 上述设置于所述发光单元外侧面的绝缘导热层所指的外侧面， 是 指位于所述发光单元周边的表面。
第四， 所述散热片上的镂空区域的形状以及尺寸， 根据实际情况进行设 定， 在此不做限定。
本发明实施例提供了一种发光器件， 所述发光器件包括发光单元、 设置 于所述发光单元下方的 PCB组件，还包括设置于所述发光单元外侧面的绝缘 导热层、 以及设置于所述 PCB组件下方的具有镂空区域的散热片；发光器件 工作时发出的热量， 一方面通过绝缘导热层以热传导方式散发， 另一方面通 过在散热片上设置镂空区域形成中空的空间， 可得到自下而上的对流条件， 以将热量迅速扩散； 通过上述两种热量扩散方式可将发光器件工作时所产生 的热量更快更有效的扩散出去， 从而使得本发明实施例提供的发光器件可达 到良好的散热性能。
在一个示例中， 所述发光单元包括发光体， 所述发光体为 LED颗粒。 在一个示例中， 所述散热片的材质为 PVC (聚氯乙烯， Polyvinylchlorid, 筒称 PVC )。
在一个示例中，所述绝缘导热层的材质为 PPS (聚苯硫醚， Polyphenylene sulfide, 筒称 PPS ) , 或 PA (聚酰胺， Polyamide, 筒称 PA )。 实施例一
如图 1所示， 本发明实施例提供了一种发光器件 100, 该发光器件 100 包括： 发光单元 10、 设置于所述发光单元下方的 PCB组件 20、 设置于所述 发光单元 10外侧面的绝缘导热层 30、 以及设置于所述 PCB组件 20下方的 具有镂空区域的散热片 40。
其中，所述散热片 40的结构如图 2所示，其镂空区域 401的形状例如可 以为矩形； 所述散热片 40的材质例如可以为 PVC。对于所述绝缘导热层 30, 其材质例如可以为 PPS或 PA。
这样，根据气体热对流的基本原理，散热片 40的镂空区域 401可形成流 动条件， 气体中较热部分和较冷部分之间通过循环流动以将热量迅速扩散， 使温度趋于均匀。 同时， 通过在所述发光单元 10外侧面设置绝缘导热层 30, 可以将部分热量以热传导方式散发出去。
若发光体 101为 LED颗粒，则本发明实施例提供的发光器件 100的结构 可如图 3所示， 其中所述发光单元 10可以包括发光体 101、 封装材料 102、 以及密封树脂 103, 所述封装材料 102和密封树脂 103将发光体 101封装起 来。 需要说明的是， 在本发明所有实施例中， 所述发光体并不限于仅为 LED 颗粒， 也可以其他， 在此不做限定。
需要说明的是，本发明实施例中所述散热片 40的镂空区域 401的形状并 不限于矩形状，从俯视方向看过去，所述镂空区域 401的形状还可以是圓形， 橢圓形等任意形状， 在此不做限定。
可选地，所述 PCB组件 20还可包括设置于其背面的电源（图中未标出 ), 且所述电源位于所述镂空区域 401内。
由于在所述 PCB组件 20中，电源的发热量最大，将电源设置在所述 PCB 组件 20的背面，并位于所述镂空区域 401内，这样更有利于通过热对流的方 式将热量迅速扩散。
需要说明的是，所述电源位于所述镂空区域 401内，是指在所述 PCB组 件 20与所述具有镂空区域 401的散热片 40完全贴合后， 所述电源可完全置 于所述镂空区域 401中。
可选地， 如图 4所示， 所述发光单元 10上还可设置有定位孔（位于图 4 中与定位柱对应的位置）；所述 PCB组件 20包括设置于其正面的定位柱 201 , 且所述定位柱 201与所述定位孔相匹配。
通过在所述 PCB组件 20中设置定位柱 201 , 并与所述发光单元 10上设 置的定位孔匹配来固定所述发光单元 10, 可避免发光单元 10发生移动。 实施例二
如图 5所示， 本发明实施例提供的发光器件与图 4所示的发光器件不同 之处在于，本实施例的发光器件 100还包括设置于所述发光单元 10上表面的 第一辐射散热涂层 50。 所述第一辐射散热涂层 50例如可以通过将高分子辐 射散热涂料涂布在发光单元 10上表面制得。
发光单元 10上表面设置的第一辐射散热涂层 50, 能够以 8 μ ιη ~ 13 μ ιη 红外波长的形式向大气空间辐射经第一辐射散热涂层 50的热量，从而可降低 发光单元 10表面和内部的温度。此外， 由于高分子辐射散热涂料本身不受周 围介质影响， 其在起到辐射降温作用的同时， 也可起到绝缘性、 防腐性、 防 水性、 抗酸碱性等特性， 对所述发光单元 10起到很好的保护作用。 实施例三
如图 6所示， 本发明实施例提供的发光器件与图 4所示发光器件的不同 之处在于，本实施例的发光器件 100还包括设置于所述发光单元 10和所述绝 缘导热层 30上表面的第一辐射散热涂层 50' 。
在所述发光单元 10和所述绝缘导热层 30上表面均设置第一辐射散热涂 层 50' , 这样有助于将传导到绝缘导热层 30的一部分热量经设置于所述绝 缘导热层 30上方的第一辐射散热涂层 50' 辐射出去， 可以更加高效的进行 散热。
由此，发光器件工作时发出的热量，一方面通过绝缘导热层 30以热传导 方式散发， 另一方面通过在散热片 40上设置镂空区域 401形成中空的空间， 可得到自下而上的对流条件， 以将热量迅速扩散， 再一方面通过第一辐射散 热涂层 50' 向大气空间辐射经第一辐射散热涂层 50' 的热量；通过上述三种 热量扩散方式可将发光器件工作时所产生的热量更快更有效的扩散出去， 从 而使得本发明实施例提供的发光器件可达到良好的散热性能。 实施例四
如图 7所示，本发明实施例提供了一种背光源模组，该背光源模组包括： 发光器件 100, 以及设置于所述发光器件下方的背框 200。 其中， 所述背框 200 的材质可以为诸如铝合金， 或纯铝， 或黄铜， 或紫铜等金属材质。 所述 发光器件 100与实施例一的发光器件相同。
在本发明实施例中， 金属材质的背框 200, —方面可以进一步的进行散 热， 另一方面也能加强发光器件 100的机械强度， 起到保护发光器件 100的 作用。
进一步地，若发光体 101为 LED颗粒，则本发明实施例提供的发光器件 100的结构可如图 8所示， 其中所述发光单元 10可以包括发光体 101、 封装 材料 102、 以及密封树脂 103, 所述封装材料 102和密封树脂 103将发光体 101封装起来。 可选地， 发光器件 100还可包括设置于所述发光单元 10和绝 缘导热层 30上表面的第一辐射散热涂层 50' 。
如图 9所示，可选地，所述背光源模组还可包括设置于所述发光器件 100 和所述背框 200之间的第二辐射散热涂层 60。
所述第二辐射散热涂层 60例如可以通过将高分子辐射散热涂料涂布在 所述背框 200相对所述发光器件 100的一面， 这样可以进一步通过热辐射的 形式经背框向外散热。
由此，发光器件工作时发出的热量，一方面通过绝缘导热层 30以热传导 方式散发， 另一方面通过在散热片 40上设置镂空区域 401形成中空的空间， 可得到自下而上的对流条件， 以将热量迅速扩散， 再一方面通过第一辐射散 热涂层 50' 和第二辐射热涂层 60向外辐射热量； 通过上述三种热量扩散方 式可将发光器件工作时所产生的热量更快更有效的扩散出去， 从而使得本发 明实施例提供的发光器件可达到良好的散热性能。 实施例五
本发明实施例提供了一种显示装置，该显示装置包括上述的背光源模组。 上述显示装置例如可以是液晶显示装置，可以为液晶显示器、液晶电视、 数码相框、 手机、 平板电脑等具有任何显示功能的产品或者部件。 特别的， 上述显示装置可以为对发热量敏感的手机等小尺寸显示器件。 本发明实施例提供的显示装置， 由于其采用前述的发光器件， 其散热性 能好， 使得应用于显示装置时， 可避免发光器件散热不好对显示画面产生影 响。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、一种发光器件， 包括发光单元、设置于所述发光单元下方的印制电路 板 (PCB)组件； 该发光器件还包括： 设置于所述发光单元外侧面的绝缘导热 层、 以及设置于所述 PCB组件下方的具有镂空区域的散热片。
2、 根据权利要求 1所述的发光器件， 其中所述 PCB组件包括设置于其 背面的电源， 且所述电源位于所述镂空区域内。
3、根据权利要求 1或 2所述的发光器件，其中所述发光单元上设置有定 位孔； 所述 PCB组件包括设置于其正面的定位柱，且所述定位柱与所述定位 孔相匹配。
4、根据权利要求 1至 3任一项所述的发光器件，还包括： 至少设置于所 述发光单元上表面的第一辐射散热涂层。
5、根据权利要求 4所述的发光器件，其中所述第一辐射散热涂层设置于 所述发光单元上表面和所述绝缘导热层上表面。
6、根据权利要求 1至 5任一项所述的发光器件，其中所述发光单元包括 发光体， 所述发光体为 LED颗粒。
7、根据权利要求 1至 6任一项所述的发光器件，其中所述散热片的材质 为聚氯乙烯， 所述绝缘导热层的材质为聚苯硫醚或聚酰胺。
8、一种背光源模组， 包括权利要求 1至 7任一项所述的发光器件， 以及 设置于所述发光器件下方的背框。
9、根据权利要求 8所述的背光源模组，还包括设置于所述发光器件和所 述背框之间的第二辐射散热涂层。
10、 一种显示装置， 包括权利要求 8或 9所述的背光源模组。
PCT/CN2013/074729 2013-02-21 2013-04-25 发光器件、背光源模组及显示装置 WO2014127584A1 (zh)

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