WO2014114211A1 - Capteur tactile et écran tactile - Google Patents

Capteur tactile et écran tactile Download PDF

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Publication number
WO2014114211A1
WO2014114211A1 PCT/CN2014/070884 CN2014070884W WO2014114211A1 WO 2014114211 A1 WO2014114211 A1 WO 2014114211A1 CN 2014070884 W CN2014070884 W CN 2014070884W WO 2014114211 A1 WO2014114211 A1 WO 2014114211A1
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WO
WIPO (PCT)
Prior art keywords
conductive
conductive element
axial
touch sensor
dielectric
Prior art date
Application number
PCT/CN2014/070884
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English (en)
Chinese (zh)
Inventor
许毅中
徐国书
黄邦熊
Original Assignee
宸鸿科技(厦门)有限公司
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Publication of WO2014114211A1 publication Critical patent/WO2014114211A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to touch technologies, and more particularly to a touch sensor and a touch panel.
  • Touch panel Panel As an interface tool for data communication, it has been widely used in household appliances, communication devices and electronic information devices.
  • the thin and light touch panel is an important direction for its development, but its development is limited by the structural performance and process technology. Specifically, in the pursuit of the thin and light touch panel, some solutions hope to reduce the touch. The thickness of each layer inside the panel is realized, but the thickness of some hierarchical structures is limited due to the excellent structural performance. If the materials used in the hierarchical structure are replaced, it will be limited by the process and other factors. Finding the balance point is the key to making the touch panel light and thin.
  • the invention provides a touch sensor and a touch panel, which can realize the slimness and thinness of the touch panel under the premise of ensuring the excellent performance of the touch panel.
  • the present invention provides a touch sensor, comprising: a first conductive element; a second conductive element, wherein the second conductive element is sputtered in an environment having a temperature of 160 degrees Celsius or more a crystalline indium tin oxide film of the film; and a dielectric element disposed between the first conductive element and the second conductive element.
  • the dielectric element has a dielectric constant value greater than or equal to 5 and less than or equal to 80.
  • the dielectric element has a thickness in the range of greater than or equal to 0.05 microns and less than or equal to 1 micron.
  • the first conductive element is a crystalline indium tin oxide film that is sputtered into a film at an environment temperature of 160 degrees Celsius or greater.
  • the first conductive element comprises a plurality of first axial electrodes and a plurality of conductive elements
  • the second conductive elements comprise a plurality of electrical wires
  • the first axial electrodes are electrically insulated from each other
  • the conductive units are insulated from each other, and the electrical wiring electrically connects the two adjacent conductive units to form a plurality of second axial electrodes.
  • the first conductive element comprises a plurality of electrical connections
  • the second conductive element comprises a plurality of first axial electrodes and a plurality of conductive units, wherein the first axial electrodes are electrically insulated from each other, The conductive units are insulated from each other, and the electrical wiring electrically connects the two adjacent conductive units to form a plurality of second axial electrodes.
  • the dielectric component is composed of a plurality of insulating blocks, and the insulating block is disposed between the electrical wiring and the first axial electrode to electrically insulate the first axial direction.
  • An electrode and the second axial electrode are disposed between the insulating blocks, and the insulating block is disposed between the electrical wiring and the first axial electrode to electrically insulate the first axial direction.
  • An electrode and the second axial electrode are disposed between the electrical wiring and the first axial electrode to electrically insulate the first axial direction.
  • the dielectric element covers the first conductive element and a corresponding perforation is provided at the junction of the electrical connection and the conductive unit.
  • the first conductive element comprises a plurality of first axial electrodes, the first axial electrodes are insulated from each other, and the second conductive elements comprise a plurality of second axial electrodes, the second axis Insulating the electrodes to each other, wherein the dielectric element is disposed between the first axial electrode and the second axial electrode to electrically insulate the first axial electrode from the second axial electrode .
  • the second conductive element is a crystalline indium tin oxide film that is sputter-deposited in an environment having a temperature of greater than or equal to 260 degrees Celsius and less than or equal to 300 degrees Celsius.
  • the dielectric component material is silicon nitride, aluminum oxide, silicon germanium oxide, antimony trioxide, antimony oxide, zirconium oxide, hafnium oxide, hafnium aluminum oxide, titanium dioxide and One of its mixtures.
  • the materials of the first conductive element, the second conductive element and the dielectric element are all transparent materials.
  • the invention further provides a touch panel, comprising: a touch sensor comprising a first conductive element; and a second conductive element, wherein the second conductive element is at a temperature greater than or equal to 160 a film of crystalline indium tin oxide film sputtered in a Celsius environment; and a dielectric element disposed between the first conductive element and the second conductive element; a substrate, the first conductive element disposed at On the substrate.
  • the dielectric element has a dielectric constant value greater than or equal to 5 and less than or equal to 80.
  • the dielectric element has a thickness in the range of greater than or equal to 0.05 microns and less than or equal to 1 micron.
  • the first conductive element is a crystalline indium tin oxide film.
  • the first conductive element comprises a plurality of first axial electrodes and a plurality of conductive elements
  • the second conductive elements comprise a plurality of electrical wires
  • the first axial electrodes are electrically insulated from each other
  • the conductive units are insulated from each other, and the electrical wiring electrically connects the two adjacent conductive units to form a plurality of second axial electrodes.
  • the dielectric component is composed of a plurality of insulating blocks, and the insulating block is disposed between the electrical wiring and the first axial electrode to electrically insulate the first axial direction.
  • An electrode and the second axial electrode are disposed between the insulating blocks, and the insulating block is disposed between the electrical wiring and the first axial electrode to electrically insulate the first axial direction.
  • An electrode and the second axial electrode are disposed between the electrical wiring and the first axial electrode to electrically insulate the first axial direction.
  • the dielectric element covers the first conductive element and a corresponding perforation is provided at the junction of the electrical connection and the conductive unit.
  • the first conductive element comprises a plurality of first axial electrodes, the first axial electrodes are insulated from each other, and the second conductive elements comprise a plurality of second axial electrodes, the second axis Insulating the electrodes to each other, wherein the dielectric element is disposed between the first axial electrode and the second axial electrode to electrically insulate the first axial electrode from the second axial electrode .
  • the substrate is a tempered glass sheet.
  • the second conductive element is a crystalline indium tin oxide film that is sputter-deposited in an environment having a temperature of greater than or equal to 260 degrees Celsius and less than or equal to 300 degrees Celsius.
  • the dielectric component material is silicon nitride, aluminum oxide, silicon germanium oxide, antimony trioxide, antimony oxide, zirconium oxide, hafnium oxide, hafnium aluminum oxide, titanium dioxide and One of its mixtures.
  • the materials of the first conductive element, the second conductive element and the dielectric element are all transparent materials.
  • the performance of the second conductive member has high transmittance, low resistance
  • the high stability and thin thickness feature improve the stability of the second conductive component, which not only reduces the thickness of the touch panel, but also ensures the performance of the touch panel.
  • FIG. 1 is a schematic view showing a laminated structure of a touch sensor of the present invention
  • FIG. 2A is a schematic view showing a first embodiment of a touch sensor according to the present invention.
  • Figure 2B is a schematic cross-sectional view along section line II' shown in Figure 2A;
  • FIG. 3A is a schematic structural view of a second embodiment of a touch sensor according to the present invention.
  • 3B is a schematic structural view of an embodiment of the present invention.
  • FIG. 4A is a schematic structural view of a third embodiment of the present invention.
  • Figure 4B is a schematic cross-sectional view along the section line HH' shown in Figure 4A;
  • 5A is a schematic structural view of a fourth embodiment of the present invention.
  • FIG. 5B is a schematic structural view of an embodiment of the present invention.
  • Fig. 6 is a view showing the thickness variation of the crystalline indium tin oxide film according to the present invention as a function of temperature.
  • FIG. 1 is a schematic diagram of a laminated structure of a touch sensor according to the present invention.
  • the touch sensor 10 includes a first conductive element 11 , a second conductive element 12 , and a dielectric element 13 , and is disposed on the first conductive element 11 , and the dielectric element 13 is disposed on the first conductive element 11 and the second conductive element Between 12.
  • the present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
  • FIG. 2A is a schematic view of a first embodiment of a touch sensor of the present invention
  • FIG. 2B is a cross-sectional view taken along line II' of FIG. 2A.
  • This embodiment discloses a touch sensor 101 having a two-layer electrode structure.
  • the touch sensor 101 includes a first conductive element 11, a second conductive element 12, and a dielectric element 13, wherein the second conductive element 12 is located on the first conductive element 11, and the dielectric element 13 is disposed on the first conductive element 11 and Between the second conductive elements 12.
  • the first conductive element 11 includes a plurality of first axial electrodes 111, the plurality of first axial electrodes extend along the first direction X, and are electrically insulated from each other;
  • the second conductive element 12 includes a plurality of second axial electrodes 121, and a plurality of second The axial electrodes extend in the Y direction and are insulated from each other;
  • the dielectric element 13 is disposed between the first axial electrode 111 and the second axial electrode 121 to electrically insulate the first axial electrode 111 and the second axial electrode 121.
  • the first axial electrode 111 and the second axial electrode 121 are for receiving a touch action and generating a corresponding output signal.
  • the dielectric element 13 is a full-surface structure. It should be noted that in other embodiments of the present invention, the dielectric element 13 may also be composed of a plurality of insulating blocks, and the insulating block may be combined with the first conductive element. 11 or the second conductive elements 12 are identical in pattern and overlap each other, and may also be disposed only at the intersection of the first conductive element 11 and the second conductive element 12.
  • FIG. 3A is a schematic structural view of a second embodiment of a touch sensor according to the present invention.
  • This embodiment discloses a touch sensor 102 having a single-layer electrode structure.
  • the touch sensor 102 includes a first conductive element 11, a second conductive element 12, and a dielectric element 13, wherein the second conductive element 12 is located on the first conductive element 11, and the dielectric element 13 is disposed on the first conductive element 11 and Between the second conductive elements 12.
  • the first conductive element 11 includes a plurality of first axial electrodes 111 and a plurality of conductive elements 1211.
  • the second conductive elements 12 include a plurality of electrical wires 1212.
  • the electrical wires 1212 are electrically connected to two adjacent conductive units 1211 to form a plurality of second axes. To the electrode 121. It should be noted that the components of the first conductive element 11 and the second conductive element 12 can be interchanged.
  • the first conductive element comprises a plurality of electrical wires
  • the second conductive element comprises a plurality of first axial electrodes and a plurality of conductive elements.
  • the plurality of first axial electrodes 111 extend in the X direction and are insulated from each other, and the conductive units 1211 are arranged in the Y direction and insulated from each other, and the first axial electrodes 111 and the conductive units 1211 are insulated from each other.
  • the dielectric element 13 is composed of a plurality of insulating blocks 131.
  • the insulating block is disposed between the electrical wiring 1212 and the first axial electrode 111 to electrically insulate the first axial electrode 111 and the second axial electrode. 121.
  • FIG. 3B is a schematic structural view of an embodiment of the present invention.
  • the dielectric element 13 can be a fully perforated structure, that is, the dielectric element 13 covers the first conductive element 11, and a through hole 130 is provided at the electrical connection of the electrical connection 1212 and the conductive unit 1211 to ensure electrical wiring.
  • the conduction between the 1212 and the conductive unit 1211 ensures that the electrical wiring 1212 and the first axial electrode 111 are insulated from each other.
  • FIG. 4A is a schematic structural view of a third embodiment of the present invention
  • FIG. 4B is a cross-sectional view along the line HH' of FIG. 4A.
  • the touch panel 20 includes a touch sensor 21 and a substrate 22, wherein the touch sensor 21 includes a first conductive element 31, a second conductive element 32, and a dielectric element 33, wherein the first conductive element 31 is disposed on the substrate 22.
  • the second conductive element 32 is a crystalline indium tin oxide film sputter-deposited in an environment having a temperature of 160 degrees Celsius or more, and is disposed on the first conductive element 31, and the dielectric element 33 is disposed on the first conductive element 31 and Between the second conductive elements 32.
  • the touch sensor is a two-layer electrode structure of the touch sensor 21, wherein the first conductive element 31 includes a plurality of first axial electrodes 311, and the plurality of first axial electrodes 311 are disposed on the substrate 22, and The first conductive element 32 extends in the Y direction and is insulated from each other The first axial electrode 311 and the second axial electrode 321 are electrically insulated between the one axial electrode 311 and the second axial electrode 321 . The first axial electrode 311 and the second axial electrode 321 are used to receive a touch action and generate a corresponding output signal.
  • the dielectric element 33 is a full-surface structure. It should be noted that in other embodiments of the present invention, the dielectric element 33 may also be composed of a plurality of insulating blocks, and the insulating block may be combined with the first conductive element. 31 or the second conductive elements 32 are identical in pattern and overlap each other, and may also be disposed only at the intersection of the first conductive element 31 and the second conductive element 32.
  • the touch sensor 21 is a two-layer electrode structure. It can be understood that, in the present invention, the touch sensing structure can also be a single-layer electrode structure, as shown in FIG. 5A, and FIG. 5A is the first embodiment of the present invention.
  • the touch panel 20 includes a touch sensor 21 and a substrate 22, wherein the touch sensor 21 includes a first conductive element 31, a second conductive element 32, and a dielectric element 33, wherein the first conductive element 31 is disposed on the substrate 22.
  • the plurality of first axial electrodes 311 and the plurality of conductive elements 3211 are included.
  • the second conductive elements 32 include a plurality of electrical wires 3212.
  • the electrical wires 3212 are electrically connected to two adjacent conductive units 3211 to form a plurality of second axial electrodes 321 .
  • the first axial electrodes 311 extend in the X direction and are insulated from each other, and the conductive units 3211 are arranged in the Y direction and insulated from each other, and the first axial electrodes 311 and the conductive units 3211 are insulated from each other.
  • the dielectric element 33 is composed of a plurality of insulating blocks 331 disposed correspondingly between the electrical wiring 3212 and the first axial electrode 311 to electrically insulate the first axial electrode 311 from the second axial direction. Electrode 321. It is to be noted that, in other embodiments of the present invention, as shown in FIG.
  • FIG. 5B is a schematic structural view of an embodiment of the present invention.
  • the dielectric element 33 can be a fully perforated structure, that is, the dielectric element 33 covers the first conductive element 31, and a through hole 330 is provided at the electrical connection of the electrical connection 3212 and the conductive unit 3211 to ensure electrical wiring.
  • the conduction between the 3212 and the conductive unit 3211 ensures that the electrical wiring 3212 and the first axial electrode 311 are insulated from each other.
  • the substrate 22 is a carrier for carrying the touch sensor 21. After being attached to a cover, it can be used as a touch device alone, or assembled with an electronic device such as a display screen to form a touch. Control the display.
  • the substrate 22 can also be a tempered glass plate, the glass plate includes upper and lower opposite surfaces, wherein the upper surface can be directly used for user touch, and the touch sensor is disposed on the lower surface to form a single piece.
  • the touch panel is directly assembled with an electronic device such as a display screen to form a touch display screen.
  • the single-chip touch panel is lighter and thinner.
  • the second conductive element 12 is a crystalline indium tin oxide film which is sputtered into a film at a temperature of 160 degrees Celsius or more, and the general indium tin oxide film is first in an environment having a temperature lower than 160 degrees Celsius.
  • the amorphous indium tin oxide film is formed by sputtering, and then crystallized by high temperature treatment to obtain a crystalline indium tin oxide film.
  • the difference between the crystalline indium tin oxide film of the present invention and the crystalline indium tin oxide film formed by the general process is that When the resistance is fixed, the thickness of the crystalline indium tin oxide film of the present invention is only 50% of the thickness of the crystalline indium tin oxide film formed by the general process.
  • the product requires that the indium tin oxide film has a square resistance of 75 ohms, and the temperature is greater than
  • the thickness of the crystallized indium tin oxide film sputtered into the film at or equal to 160 degrees Celsius is about 0.023 micrometers
  • the thickness of the crystalline indium tin oxide film obtained by treating the amorphous indium tin oxide at a high temperature is about 0.046 micrometers.
  • the present invention can realize the thinning and thinning of the touch panel by reducing the thickness of the second conductive element.
  • the crystalline indium tin oxide film disclosed by the present invention is more transparent than the crystalline indium tin oxide film formed by the general process. High luminosity, smoother material surface and excellent electrical continuity.
  • the material of the first conductive component in the present invention may also be a crystalline indium tin oxide film which is sputtered into a film at a temperature of 160 degrees Celsius or more to improve the overall performance of the touch sensor.
  • the touch panel can be further thinned and thinned.
  • the first conductive element and the second conductive element are both crystalline indium tin oxide films which are sputtered into a film at a temperature of 160 degrees Celsius or more
  • the conductive layer needs to be fabricated after the dielectric element is formed (the first conductive element or the second conductive element), and the high temperature environment during the manufacturing process will simultaneously affect the already formed dielectric element, for example, in forming the first
  • at least the ambient temperature needs to be greater than 160 degrees Celsius.
  • the organic photoresist insulating material will be cracked under the temperature environment, thereby causing deformation and insulation performance degradation, which seriously affects the product yield.
  • the dielectric component preferably uses a material having a dielectric constant greater than or equal to 5 and less than or equal to 80, such as silicon nitride (Si3N4), and trioxide.
  • Si3N4 silicon nitride
  • the dielectric element may be composed of tantalum oxide (Ta 2 O 3 ) alone or a mixture of the above materials, such as yttrium oxide-yttrium silicon oxide (Ta 2 O 3 - HfO2), cerium oxide-silicon dioxide (Ta2O3-SiO2), silicon dioxide-yttria-yttrium silicon oxide (SiO2-Ta2O3-HfO2), etc. .
  • the use of this material can greatly reduce or even completely avoid this phenomenon.
  • the thickness of the dielectric component ranges from greater than or equal to 0.05 micrometers and less than or equal to 1 micrometer, and thus The thickness of the entire structure of the touch sensor can be reduced.
  • a crystalline indium tin oxide film which is sputtered and formed in a temperature of 160 degrees Celsius or more can be used.
  • a material having a dielectric constant greater than or equal to 5 and less than or equal to 80 is used as the dielectric element to reduce the thickness of the touch sensor as a whole, and at the same time ensure the touch sensing
  • the performance of the device can also be achieved by using a material having a dielectric constant value greater than or equal to 5 and less than or equal to 80 as a dielectric element for the purpose of reducing the thickness of the touch sensor.
  • the optimal temperature range for the formation of the crystalline indium tin oxide film by sputtering is 300 degrees Celsius at 260 degrees Celsius, as shown in FIG.
  • FIG. 6 is a schematic view showing the thickness variation of the crystalline indium tin oxide film according to the present invention.
  • the thickness of tin varies greatly with temperature; when the temperature range is between 160 ° C and 260 ° C, the curve becomes relatively flat, indicating that the thickness of crystalline indium tin oxide changes gently with temperature in this temperature range, but From the overall point of view, there is still a certain degree of curvature reduction; when the temperature range is 260 degrees Celsius to 300 degrees Celsius, the curve approaches parallel to the X axis, indicating that the thickness of crystalline indium tin oxide hardly changes with temperature in this temperature range.
  • a temperature range of 260 degrees Celsius or more and 300 degrees Celsius or less is preferred.
  • the materials of the first conductive element, the second conductive element, and the dielectric element are all transparent materials, so that the touch sensor is a fully transparent structure, and further, the substrate in the present invention is also It can be a transparent substrate. In practical applications, the touch panel can be directly placed in front of the display without affecting the display effect of the display.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Position Input By Displaying (AREA)
  • Push-Button Switches (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Electronic Switches (AREA)

Abstract

La présente invention a trait au domaine des technologies tactiles, et concerne un capteur tactile comprenant : un premier élément conducteur ; un second élément conducteur, le second élément conducteur étant un film d'oxyde d'étain et d'indium cristallin formé par pulvérisation dans un environnement où la température est supérieure ou égale à 160° Celsius ; et un élément diélectrique disposé entre le premier élément conducteur et le second élément conducteur. Le second élément conducteur selon la présente invention est doté de caractéristiques de luminosité élevée, de faible résistance et de haute stabilité, permet d'améliorer la stabilité du capteur tactile, garantit la robustesse d'un circuit de détection sur un écran tactile et prolonge la durée de vie de l'écran tactile. La présente invention concerne en outre un écran tactile.
PCT/CN2014/070884 2013-01-28 2014-01-20 Capteur tactile et écran tactile WO2014114211A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310033139.1 2013-01-28
CN201310033139.1A CN103970317B (zh) 2013-01-28 2013-01-28 触控感应器及触控面板

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WO2014114211A1 true WO2014114211A1 (fr) 2014-07-31

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CN108762555B (zh) * 2018-05-21 2021-12-03 京东方科技集团股份有限公司 触控基板和触控装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101493737A (zh) * 2009-02-27 2009-07-29 深圳市豪威薄膜技术有限公司 一种显示器触摸屏结构及其制作方法
CN102270074A (zh) * 2010-06-02 2011-12-07 群康科技(深圳)有限公司 电极结构及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3224352B2 (ja) * 1997-02-21 2001-10-29 出光興産株式会社 多色発光装置
TWI322374B (en) * 2006-04-14 2010-03-21 Ritdisplay Corp Light transmission touch panel and manufacturing method thereof
TWI389020B (zh) * 2008-03-25 2013-03-11 Elan Microelectronics 觸控面板裝置
TWI575281B (zh) * 2009-08-19 2017-03-21 Elan Microelectronics Corp Capacitive touch panel and manufacturing method thereof
JP5556436B2 (ja) * 2009-10-13 2014-07-23 東洋紡株式会社 透明導電性積層フィルム及び透明導電性積層シート並びにタッチパネル
WO2012026519A1 (fr) * 2010-08-26 2012-03-01 パナソニック株式会社 Base transparente électroconductrice, panneau tactile, panneau tactile résistif et panneau tactile capacitif

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101493737A (zh) * 2009-02-27 2009-07-29 深圳市豪威薄膜技术有限公司 一种显示器触摸屏结构及其制作方法
CN102270074A (zh) * 2010-06-02 2011-12-07 群康科技(深圳)有限公司 电极结构及其制造方法

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