WO2014091417A1 - Carrier structure and method of manufacturing the same - Google Patents

Carrier structure and method of manufacturing the same Download PDF

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Publication number
WO2014091417A1
WO2014091417A1 PCT/IB2013/060796 IB2013060796W WO2014091417A1 WO 2014091417 A1 WO2014091417 A1 WO 2014091417A1 IB 2013060796 W IB2013060796 W IB 2013060796W WO 2014091417 A1 WO2014091417 A1 WO 2014091417A1
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WO
WIPO (PCT)
Prior art keywords
carrier substrate
carrier
heat sink
carrier structure
sink portion
Prior art date
Application number
PCT/IB2013/060796
Other languages
French (fr)
Inventor
Josephus Paulus Augustinus Deeben
Rob Van Wijk
Original Assignee
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V. filed Critical Koninklijke Philips N.V.
Publication of WO2014091417A1 publication Critical patent/WO2014091417A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the present invention generally relates to the field of carrier structures and methods of manufacturing such carrier structures.
  • LED light-emitting diodes
  • LEDs provide numerous advantages such as a longer operational life, a reduced power consumption, and an increased efficiency related to the ratio between light energy and heat energy.
  • LED lamps may be used for a general lighting or even for a more specific lighting, as the color and the output power of the LEDs may be tuned.
  • Light-emitting arrangements comprising a plurality of light sources (e.g.
  • LEDs may generate a quick rise of the temperature of the light-emitting arrangement, especially if many light sources are driven at the same time.
  • the effect of heat may be detrimental to the light sources, and their operation may become erratic and unstable. As a consequence, the light from the light source may flicker, causing degradation of the quality of the display or illumination.
  • thermal management is an important issue to prevent thermal damage of the light sources, and it is necessary to dissipate excess heat in order to maintain the reliability of the light-emitting arrangement and to prevent premature failure of the light sources.
  • lighting devices may comprise heat sinks (heat dissipators) which are in thermal contact with the heat-generating light sources(s) and/or electronics.
  • PCB printed circuit board
  • the PCB may comprise an electrical insulating layer (e.g. a dielectric layer or a glass fibre-filled epoxy layer) and a metal layer provided below the insulating layer, arranged for heat conduction. Below the metal layer, there may further be provided a thermal interface material (TIM) for an increase of the thermal contact across jointed solid surfaces.
  • TIM thermal interface material
  • a surface of the first metal layer carries the electronic device, and the polymer layer is stacked between the first metal layer and the second metal layer. At least one interface between the first and second metal layers and the polymer layer is a micro-rough surface, comprising a plurality of nodular projections.
  • a carrier structure comprising a carrier substrate and a heat sink portion.
  • the carrier substrate is arranged to support at least one electronic element, and the heat sink portion is arranged for dissipating heat from the carrier substrate.
  • the carrier substrate is in physical contact with the heat sink portion, and the carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating.
  • a method of manufacturing a carrier structure comprises the step of providing a carrier substrate arranged to support at least one electronic element, wherein the carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating.
  • the method further comprises the step of providing a heat sink portion for dissipating heat from the carrier substrate.
  • the method comprises the step of arranging the carrier substrate on the heat sink portion to form the carrier structure, wherein the carrier substrate is in physical contact with the heat sink portion, and the carrier substrate and the heat sink portion are thermally connected to each other.
  • the present invention is based on the idea of providing a carrier structure, of which the carrier substrate, consisting of a homogeneous material, has the property of being both thermally conductive and electrically insulating.
  • the homogeneous carrier substrate material is hereby able to provide an efficient thermal path from the carrier substrate to the heat sink portion and an electrical insulation of the electronic element(s), without the need of additional layers, coatings, or the like for the purpose of providing a thermal conductivity and/or an electrical insulation.
  • the functions of a PCB and one or more layers are combined into the carrier substrate of the present invention.
  • the carrier structure of the present invention is able to provide an efficient thermal management and electrical insulation when in operation, while providing an uncomplicated and cost-effective construction of the carrier structure.
  • An advantage of the present invention is that the carrier structure, in its low number of components and in its arrangement without additional (auxiliary) layers, coatings, or the like, provides a robust and efficient construction for a conduction of heat and electrical insulation.
  • the thermally conductive and electrically insulating carrier substrate which consists of a homogeneous material, hereby combines (integrates) the properties of thermal conductivity and electrical insulation into one component.
  • the thermal conductivity and electrical insulation is integrated into the homogeneous carrier substrate material, wherein additional components such as (bottom) metal layers, coatings, (TIM) interfaces, etc., for a spreading of heat and/or components for electrical insulation may be dispensed with.
  • the present invention is further advantageous in that the low number of components of the carrier structure allows the carrier structure to withstand high operating temperatures which other existing arrangements cannot withstand.
  • This is understood as prior art arrangements comprising (several) components, layers and/or coatings to provide thermal conductivity and/or electrical insulation are more prone to defects due to a different thermal influence (e.g. thermal expansion) on the different materials used.
  • the carrier structure which is able to provide an efficient heat management and thermal insulation without the need of additional components, layers, coatings, etc., provides a cost-effective carrier structure.
  • the carrier structure provides a more environmental-friendly product compared to arrangements in the prior art, as fewer components and/or fewer materials are used in the carrier structure of the present invention.
  • the low number of components of the carrier structure implies an easier recycling, especially compared to arrangements comprising a relatively high number of components, layers and/or coatings which impede an easy disassembling and/or recycling operation.
  • the carrier structure of the present invention comprises a carrier substrate arranged to support at least one electronic element.
  • carrier it is here meant substantially any element for mechanical, thermal and/or electrical support.
  • the “carrier substrate” is a substrate (e.g. a film or sheet) arranged to provide mechanical, thermal and/or electrical support for electronic element(s) arranged thereon.
  • the carrier structure further comprises a heat sink portion for dissipating heat from the carrier substrate.
  • heat sink portion it is here meant a (passive) component arranged to dissipate heat into the surrounding medium (e.g. air) of the heat sink portion.
  • the heat sink portion may further be arranged to dissipate heat from the electronic element(s) arranged on the carrier substrate.
  • a thermal path may be provided from the electronic elements(s) to the heat sink portion, or via the carrier substrate to the heat sink portion.
  • the carrier substrate is in physical contact with the heat sink portion.
  • the carrier substrate is in direct physical contact with the heat sink portion without any intermediate components arranged for thermal conductivity and/or electrical insulation such as layers, coatings, or the like.
  • the carrier structure and the heat sink portion also are in (direct) thermal contact.
  • Fastening means e.g. glue
  • the carrier substrate of the carrier structure consists of a homogeneous material.
  • homogeneous material it is here meant a material having
  • the carrier substrate of the present invention consisting of a homogeneous material, has substantially the same thermal conductivity and electrical insulation throughout the material, and does thereby not comprise components, layers, coatings, or the like, arranged for thermal conductivity and/or electrical insulation.
  • the material of the carrier substrate is thermally conductive and electrically insulating. In other words, the material of the carrier substrate provides a relatively high thermal conductivity and electrical insulation.
  • the carrier structure may be provided without a heat sink portion.
  • a carrier structure arranged to support at least one electronic element, wherein the carrier structure comprises a carrier substrate consisting of a homogeneous material which is electrically insulating and thermally conductive for a conduction of heat from the carrier substrate, and wherein the carrier structure further comprises at least one conductive track arranged on the carrier substrate.
  • the carrier structure hereby provides an efficient heat management (dissipation) and thermal insulation without the need of additional components, layers, coatings, etc., provides a cost-effective carrier structure.
  • the material of the carrier substrate may comprise silicone.
  • the present embodiment is advantageous in that silicone provides a relatively high electrical insulation, and is thereby able to provide an effective insulation from the electronic element(s) arranged on the carrier substrate such as LEDs, transistors, electronic circuitry, etc. Due to the this property of the silicone material, any dielectric or electrical insulating layer may be dispensed with.
  • the relatively soft, pliable and flexible silicone material enables a cost-effective and fast processing of the carrier substrate.
  • the carrier substrate comprising silicone may be conveniently provided on a roll, and may thereafter be unrolled to allow a printing and/or drying of conductive tracks on the carrier substrate.
  • the carrier substrate may be rewound on the roll and transported before assembling a carrier structure comprising the carrier substrate.
  • the present embodiment is further advantageous in that silicone has the property of being thermally stable up to 250° C for several hours without leading to discoloration, e.g.
  • the silicone material provides the possibility of employing reflow soldering techniques and/or an electrically conductive glue for attaching electronic elements (e.g. LEDs) to the carrier substrate of the carrier structure.
  • the material may further comprises at least one oxide selected from the group consisting of aluminum oxide (AI 2 O 3 ), magnesium oxide (MgO), titanium dioxide (T1O 2 ) and zinc oxide (ZnO), and/or at least one nitride selected from the group consisting of aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and zirconium nitride (ZrN).
  • the present embodiment is advantageous in that the thermal conductivity of the silicone may be increased by dispersing a thermally conductive filler material in the silicone, wherein the filler material may comprise one or more nitrides and/or oxides.
  • a dispersion of oxide(s) and/or nitride(s) into the silicone of the carrier substrate even further improves the thermal conductivity of the carrier substrate, and enhances the thermal conduction from the carrier substrate to the heat sink portion of the carrier structure for dissipating heat from the carrier substrate.
  • the present embodiment is further advantageous in that the carrier substrate comprising silicone and an oxide may provide a relatively high reflection due to the material properties of the disclosed oxides.
  • the carrier structure may hereby provide a relatively high reflection of light from one or more light sources arranged on the carrier substrate.
  • the carrier structure may further comprise at least one conductive track on the carrier substrate.
  • one or more conductive (conductor, electrode) tracks may be provided (printed, plated or dispensed) directly on the carrier substrate, wherein the techniques may include metal plasma spraying, vacuum deposition (e.g. PVD), etc.
  • the present embodiment is advantageous in that the carrier substrate hereby allows an arrangement of one or more electronic components directly on the substrate. Compared to arrangements in the prior art, wherein additional (metal) layers are provided, upon which electronic devices are disposed, the present embodiment provides an improved arrangement in terms of (cost) efficiency and robustness.
  • the at least one conductive track may be flexible/bendable, such that the carrier substrate remains flexible even though one or more conductive tracks are provided on it.
  • the carrier substrate may be a printed circuit board (PCB).
  • the carrier substrate PCB is arranged to provide mechanical, thermal and/or electrical support for electronic element(s) arranged thereon, and comprises one or more conductive tracks or pathways.
  • the present embodiment is
  • the carrier substrate is hereby provided as a (preferably silicone -based) PCB with an integrated thermal conductivity, for conducting heat from the carrier substrate to the heat sink portion during operation, while providing an integrated electrical insulation.
  • the PCB of the present embodiment provides an efficient thermal management and electrical insulation without the need of additional components, layers, coatings, or the like.
  • carrier substrate may alternatively be provided as another thermally conductive and electrically insulating resin, such as a thermally conductive epoxy, polyimide, etc.
  • the carrier substrate may have a thickness of ⁇ 2 mm, preferably ⁇ 0.5 mm, and most preferably ⁇ 0.2 mm.
  • the present embodiment is advantageous in that the carrier substrate, and thereby also the carrier structure, is relatively thin compared to more voluminous and circumstantial arrangements in the prior art.
  • the present embodiment is advantageous in that the relatively thin carrier substrate is easily bendable/flexible, which facilitates the handling of the carrier substrate and allows carrier structures to be curved/formed in one, two or three dimensions.
  • a lighting device comprising at least one light source and a carrier structure according to any one of the preceding embodiments.
  • the carrier structure is arranged to support the at least one light source, wherein the carrier substrate of the carrier structure is in physical contact with the at least one light source.
  • physical contact it is in this context meant that the carrier substrate may be in direct contact with the light source(s) without any intermediate components arranged for thermal conductivity and/or electrical insulation such as layers, coatings, or the like.
  • fastening means e.g. glue
  • the present embodiment is advantageous in that the lighting device provides an efficient and robust thermal management and electrical insulation during operation. More specifically, during operation of the lighting device, heat is conducted from the carrier substrate of the carrier structure, and/or from the light source(s), to the heat sink portion of the carrier structure, wherein the carrier substrate and the heat sink portion provide any easy, efficient, reliable and robust structure compared to prior art arrangements comprising
  • the at least one light source may be attached to the carrier substrate of the carrier structure by means of reflow soldering or an electrically conductive glue.
  • the present embodiment is advantageous in that the at least one light source may be conveniently attached to the carrier substrate by the mentioned techniques.
  • the at least one light source may comprise at least one light emitting diode (LED).
  • the method of manufacturing the carrier structure may comprise the step of arranging the heat sink portion in a mould, wherein the heat sink portion is a heat-conductive sheet material. Further, the method comprises the step of providing the carrier substrate in a fluid state and injecting the carrier substrate into the mould. The method further comprises the step of moulding the heat sink portion and the carrier substrate, such that the heat sink portion and the carrier substrate are formed by the mould, and wherein the heat sink portion and the carrier substrate bond to each other. Furthermore, the method comprises the step of solidifying the carrier substrate, such that the heat sink portion and the carrier substrate form the carrier structure.
  • the present embodiment is advantageous in that the method provides an efficient and cost-effective method of manufacturing a carrier structure arranged to conduct heat to the heat sink portion and to provide electrical insulation.
  • the present embodiment is especially advantageous in that the method comprises few and efficient process steps.
  • the present method avoids the process of holding and/or precisely positioning a heat sink in the mould, which is needed in some prior art processes such as insert moulding.
  • no adhesive material is necessary for adhering the heat sink sheet material to the carrier substrate, and the heat sink portion becomes permanently bonded to the carrier substrate.
  • Another advantage of the method of the present invention is that the heat sink portion, in the form of a heat-conductive sheet material, is formed by the mould, wherein the heat sink portion easily adapts (i.e.
  • the overall form/shape of the carrier structure becomes relatively thin and conveniently handled. This is highly advantageous compared to methods in the prior art, wherein stiff and/or thick heat sink inserts are often used.
  • the feature of the easily formed heat sink portion (and carrier substrate) of the method of the present invention is especially advantageous when moulding a carrier structure with a non-flat shape, i.e. curved shape, as the heat sink portion is formed into (conforms to) the curved shape of the carrier structure.
  • the carrier substrate of the carrier structure may alternatively be manufactured by other moulding processes such as compression or extrusion moulding. As these are known to the skilled person, a more detailed description for manufacturing the carrier structure by the mentioned processes is therefore omitted.
  • the material of the carrier substrate may comprise silicone.
  • the material may further comprise at least one oxide selected from the group consisting of aluminum oxide (AI 2 O 3 ), magnesium oxide (MgO), titanium dioxide (T1O 2 ) and zinc oxide (ZnO), and/or at least one nitride selected from the group consisting of aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and zirconium nitride (ZrN).
  • the manufacture of the carrier structure may further comprise the step of applying at least one conductor track on the carrier substrate material.
  • a method of manufacturing a lighting device comprises the step of manufacturing a carrier structure according to any one of the preceding embodiments. Furthermore, the method comprises the step of providing at least one light source, and arranging (attaching) the at least one light source on the carrier structure.
  • the present embodiment is advantageous in that the manufacture of the carrier structure, comprising relatively few components and wherein additional layers, coatings, etc., for heat conduction and electrical insulation purposes may be dispensed with, contributes to a manufacturing of a lighting device which is (cost) efficient and convenient.
  • the attaching of the at least one light source (directly) to the carrier substrate of the carrier structure, e.g. by a reflow soldering technique and/or by an electrically conductive glue, even further contributes to an efficient manufacturing of the lighting device.
  • FIG. 1 is a schematic, cross-sectional view of an electronic device arrangement according to the prior art
  • Fig. 2 is a schematic, cross-sectional view of a lighting device according to an exemplifying embodiment of the present invention.
  • Figs. 3a-c are schematic illustrations of a method of manufacturing a carrier structure according to an exemplifying embodiment of the present invention.
  • Fig. 1 is a schematic, cross-sectional view of an electronic device arrangement 100 according to the prior art.
  • the arrangement 100 comprises a PCB substrate 110 which consists of several layers.
  • An electrically insulating layer 111 e.g. a dielectric layer or a glass fibre-filled epoxy layer, is provided between an upper conducting layer 112a and a lower conducting layer 112b.
  • the PCB substrate 110 further comprises an electrical insulator or glue 113 arranged below the lower conducting layer 112b, and a thermal interface material (TIM) 114 provided between the electric insulator 113 and a heat sink 115 which is attached to the PCB substrate 110.
  • TIM thermal interface material
  • the TIM 114 may be applied between the PCB substrate 110 and a metal heat- spreading plate, and the heat- spreading plate may in turn be thermally contacted to the heat sink 115.
  • Electronic element(s) 120 such as LEDs, transistors and/or electronic circuitry are arranged on the upper conducting layer 112a, wherein an electrical insulator (or glue) 121, which may comprise electrical tracks, is provided between the electronic elements 120 and the upper conducting layer 112a. Bonding wires 122 are coupled to the electronic elements 120 for power supply.
  • heat from the electronic element(s) 120 is spread by the upper conducting layer 112a through the electrically insulating layer 111 and through the lower conducting layer 112b.
  • the heat is further conducted through the insulator or glue 113 and though the TIM 114, which conducts the heat to the heat sink 115.
  • the heat sink 115 in its turn, dissipates the heat to the surrounding environment.
  • the construction and operation of the disclosed prior art arrangement 100 is complicated and circumstantial. As a consequence, the arrangement 100, as well as a manufacture of the arrangement 100, become relatively expensive. Furthermore, as the complicated arrangement 100 leads to an increased risk of an unsatisfactory heat dissipation during operation, there is a wish to provide alternative solutions which are able to provide an effective heat management and electrical insulation, and which further provide a more cost- effective product as well as a more cost-effective method of manufacturing the product.
  • Fig. 2 is a schematic, cross-sectional view of a lighting device 200 according to an exemplifying embodiment of the present invention.
  • the lighting device 200 comprises at least one light source 220 (schematically indicated in Fig. 2), which may be one or more LEDs. Bonding wires 222 are coupled to the light source(s) 220 for a supply of power.
  • the lighting device 200 further comprises a carrier structure 210, wherein the carrier
  • the structure 210 comprises a carrier substrate 230 arranged to support the light source(s) 220, and a heat sink portion 240 for dissipating heat from the carrier substrate 230.
  • the carrier structure 210 further comprises at least one conductive track 250 arranged on the carrier substrate 230.
  • the light source(s) 220 may be attached to the conductive track(s) 250 of the carrier structure 210 by means of reflow soldering or an electrically conductive glue (e.g. silver-based epoxy).
  • the carrier substrate 230 is arranged on top of the heat sink portion 240, and is in (direct) physical contact with the heat sink portion 240 without any (additional) layers, coatings, or the like between the carrier substrate 230 and the heat sink portion 240.
  • the carrier substrate 230 consists of a homogeneous material which is thermally conductive and electrically insulating. The thermal conductivity of the carrier substrate 230 may be
  • the carrier substrate 230 may have a break-through voltage of at least 4 kV.
  • the present invention is hereby based on the idea of providing a carrier structure 210, comprising a carrier substrate 230 and a heat sink portion 240, wherein the carrier substrate 230 of homogeneous material is both thermally conductive and electrically insulating.
  • the carrier substrate 230 is hereby able to provide an efficient thermal path 260 from the carrier substrate 230 to the heat sink portion 240 and into the surrounding air, as well as an electrical insulation of the electronic element(s), without the need of additional layers, coatings, or the like for the purpose of providing a thermal conductivity and/or an electrical insulation of the carrier structure 210.
  • the lighting device 200 comprising the carrier structure 210 of the present invention, is hereby provided an efficient thermal management and electrical insulation by the carrier structure 210 when in operation.
  • the uncomplicated and cost-effective construction of the carrier structure 210 further leads to a cost-effective lighting device 200.
  • the material of the carrier substrate 230 of the carrier structure 210 may comprise silicone. Silicone is advantageous in that it is thermally stable up to 250° C for several hours without leading to discoloration, e.g. yellowing.
  • the thermal conductivity of silicone may be increased by adding one or more highly thermally conductive ceramics, e.g. one or more oxides such as aluminum oxide (AI 2 O 3 ), magnesium oxide (MgO), titanium dioxide (Ti0 2 ) and/or zinc oxide (ZnO), and/or one or more nitrides, such as aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and/or zirconium nitride (ZrN). It will be appreciated that other ceramics than the mentioned oxides and nitrides may be dispensed into the carrier substrate 230 for enhancing the thermal conductivity.
  • the carrier e.g. one or more oxides such as aluminum oxide (AI 2 O 3 ), magnesium oxide (
  • the substrate 230 may further comprise one or more of the oxides for the purpose of reflection, i.e. to reflect incident light from the light source(s) 220 of the lighting device 200.
  • white A1 2 0 3 powder may be used in the carrier substrate 230.
  • the preferred amount of oxide (or white powder) dispersed in the carrier substrate 230 is dependent on the thickness of the carrier substrate 230.
  • the carrier substrate 230 has a thickness of 1-2 mm
  • the amount of oxide/white powder in the carrier substrate 230 may be 10-30 wt%.
  • a relatively thin carrier substrate 230 e.g.
  • the amount of oxide/white powder in the carrier substrate 230 may be up to 90 wt%.
  • the carrier structure 210 comprises one or more conductive
  • the carrier structure 210 of the present invention provides an improved arrangement in terms of (cost) efficiency and robustness. Furthermore, the carrier structure 210 becomes thinner compared to prior art arrangements, as additional layers may be dispensed with.
  • the carrier substrate 230 of the present invention may be a printed circuit board (PCB) for providing mechanical, thermal and/or electrical support for the electronic element(s) 220 arranged thereon.
  • the carrier substrate 230 is hereby provided as a (preferably silicone-based) PCB with an integrated thermal
  • the carrier substrate PCB 230 provides an efficient thermal management and electrical insulation without the need of additional components, layers, coatings, or the like, as present in the complex prior art arrangement 100.
  • the carrier substrate 230 of the carrier structure 210 has a thickness of ⁇ 2 mm, preferably ⁇ 0.5 mm, and most preferably ⁇ 0.2 mm.
  • the relatively thin carrier substrate 230 is hereby easily bendable/flexible, which facilitates the handling of the carrier substrate 230 and achieves a more compact carrier structure 210 and lighting device 200.
  • Figs. 3a-c are schematic illustrations of a method 300 of manufacturing a carrier structure 350 according to an embodiment of the present invention.
  • the method 300 comprises the step of providing a heat sink portion in form of a heat-conductive sheet material 310, wherein the sheet material 310 may be a relatively flat, thin material such as a sheet, a foil, or the like.
  • the foil may have a thickness of 0.15 mm to 0.35 mm (or even less), whereby the relatively small thickness leads to an even easier handling and/or arrangement of the metal foil.
  • the relatively small foil thickness saves material and handling costs even further, resulting in an even more cost-effective method 300 and carrier structure 350, respectively.
  • the relatively small metal foil thickness further contributes to a relatively small thickness of the total carrier structure 350, which consequently results in a lighter, more convenient and/or more easily arranged carrier structure 350.
  • the sheet material 310 may comprise one or more metals, e.g. aluminium. As aluminium is both inexpensive and possesses high heat-conductive properties, it is highly advantageous for the use as a cost-effective sheet material 310.
  • the method 300 further comprises the step of arranging 320 the sheet material 310 in a mould 330, and closing the mould 330.
  • the method 300 further comprises the step of providing a carrier substrate 340 in a fluid state and injecting 325 the carrier substrate 340 into the mould 330, which is shown in Fig. 3b.
  • the carrier substrate 340 In its fluid state, the carrier substrate 340 is able to conform to the shape of the mould 330.
  • the method 300 further comprises the step of moulding the carrier substrate 340 and the sheet material 310, such that the carrier substrate 340 and the sheet material 310 are formed by the mould 330, and wherein the carrier substrate 340 and the sheet material 310 bond to each other.
  • the method 300 further comprises the step of solidifying the carrier substrate 340, e.g. by cooling, hardening, curing and/or tempering.
  • the mould 330 is shown as a mould comprising a male and a female part, but it will be appreciated that it may be feasible to use virtually any kind of mould 330 in the present method 300.
  • the sheet material 310 is relatively thin, it is also easily formed/shaped by the mould 330. Hence, the sheet material 310 is thereby able to conform to the desired shape of the carrier structure 350.
  • the carrier substrate 340 and the sheet material 310 together form a carrier structure 350 which may be ejected from the mould 330.
  • An example of a carrier structure 350 is shown in Fig. 3c, but it will be appreciated that virtually any form/shape of the carrier structure 350 may be feasible, e.g. a relatively flat and/or a relatively round shape.
  • the carrier substrate 340 and the sheet material 310 of the carrier structure 350 are thermally connected to each other, such that carrier structure 350 is able to provide a thermal path between the carrier substrate 340 and the sheet material 310.
  • the efficient and cost-effective method of manufacturing the carrier structure 350 likewise results in a cost-effective carrier structure 350 which, when arranged e.g. in a lighting device, is arranged to efficiently dissipate heat generated by the lighting device during operation.
  • carrier substrate 340 of the carrier structure 350 may alternatively be formed by means of a compression moulding process or an extrusion process.
  • a method for manufacturing the carrier structure may comprise the step of compression molding the carrier substrate (e.g. comprising silicone). Further, the method may comprise the step of curing the carrier substrate. The method may further comprise the step of printing at least one conductive track on the carrier substrate. Furthermore, the method may comprise the step of curing the carrier substrate and the at least one conductive track.
  • alternative moulding techniques may be applied, such as extrusion moulding and injection moulding.
  • the carrier substrate may be moulded such that it is curved/formed in one, two or three dimensions (denoted as ID, 2D and 3D structures). In case of a 3D structure, the carrier structure may have a relatively flat portion (bottom portion) which may be used as a PCB portion, and the surrounding wall portions of the carrier structure may be provided as reflective portions.
  • the carrier structure may be provided without a heat sink portion
  • the carrier structure may be provided for lighting devices comprising LEDs with a medium or a relatively low power output and/or wherein the LED density, i.e. the number of LEDs per unit area of the carrier structure of the lighting device, is relatively low.
  • a carrier substrate with a thermal conductivity of > 1 W/mK may be enough for a dissipation of heat into the surrounding environment.
  • the lighting device 200, the carrier structure 210, 350 the carrier substrate 230, 340 and/or the heat sink portion 240 may have different dimensions and/or sizes than those depicted/described.
  • the carrier substrate 230, 340 and/or the heat sink portion 240 may be thicker/thinner compared to the corresponding elements as exemplified in the figures.

Abstract

A carrier structure (210) and a method (300) of manufacturing a carrier structure are provided. The carrier structure comprises a carrier substrate (230) and a heat sink portion (240). The carrier substrate is arranged to support at least one electronic element (220), and the heat sink portion is arranged for dissipating heat from the carrier substrate. The carrier substrate is in physical contact with the heat sink portion, and the carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating.

Description

Carrier structure and method of manufacturing the same
FIELD OF THE INVENTION
The present invention generally relates to the field of carrier structures and methods of manufacturing such carrier structures. BACKGROUND OF THE INVENTION
The use of light-emitting diodes (LED) for illumination purposes continues to attract attention. Compared to incandescent bulbs, LEDs provide numerous advantages such as a longer operational life, a reduced power consumption, and an increased efficiency related to the ratio between light energy and heat energy. LED lamps may be used for a general lighting or even for a more specific lighting, as the color and the output power of the LEDs may be tuned.
Light-emitting arrangements comprising a plurality of light sources (e.g.
LEDs) may generate a quick rise of the temperature of the light-emitting arrangement, especially if many light sources are driven at the same time. The effect of heat may be detrimental to the light sources, and their operation may become erratic and unstable. As a consequence, the light from the light source may flicker, causing degradation of the quality of the display or illumination. Hence, thermal management is an important issue to prevent thermal damage of the light sources, and it is necessary to dissipate excess heat in order to maintain the reliability of the light-emitting arrangement and to prevent premature failure of the light sources. For this purpose, lighting devices may comprise heat sinks (heat dissipators) which are in thermal contact with the heat-generating light sources(s) and/or electronics.
Many light-emitting arrangements in the prior art, which comprise LEDs, further comprise a printed circuit board (PCB) upon which the LEDs are arranged. The PCB may comprise an electrical insulating layer (e.g. a dielectric layer or a glass fibre-filled epoxy layer) and a metal layer provided below the insulating layer, arranged for heat conduction. Below the metal layer, there may further be provided a thermal interface material (TIM) for an increase of the thermal contact across jointed solid surfaces. US 2008/0057333 discloses a heat dissipation substrate for an electronic device. The substrate comprises a first metal layer, a second metal layer, and a polymer layer. A surface of the first metal layer carries the electronic device, and the polymer layer is stacked between the first metal layer and the second metal layer. At least one interface between the first and second metal layers and the polymer layer is a micro-rough surface, comprising a plurality of nodular projections.
However, the arrangement of the disclosed heat dissipation substrate is complicated and circumstantial. As a consequence, the heat dissipation substrate, as well as the manufacture of the substrate, become relatively expensive. Furthermore, the complicated arrangement of the heat dissipation substrate leads to an increased risk of an unsatisfactory heat dissipation during operation. Hence, alternative solutions are of interest which are able to provide an effective heat management, and which further provide a more cost-effective product as well as a more cost-effective method of manufacturing the product. SUMMARY OF THE INVENTION
It is an object of the present invention to mitigate the above problems and to provide a carrier structure, as well as a method of manufacturing the carrier structure, which is efficient and cost-effective.
This and other objects are achieved by providing a carrier structure and a method of manufacturing a carrier structure having the features in the independent claims. Preferred embodiments are defined in the dependent claims.
Hence, according to a first aspect of the present invention, there is provided a carrier structure, comprising a carrier substrate and a heat sink portion. The carrier substrate is arranged to support at least one electronic element, and the heat sink portion is arranged for dissipating heat from the carrier substrate. The carrier substrate is in physical contact with the heat sink portion, and the carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating.
According to a second aspect of the present invention, there is provided a method of manufacturing a carrier structure. The method comprises the step of providing a carrier substrate arranged to support at least one electronic element, wherein the carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating. The method further comprises the step of providing a heat sink portion for dissipating heat from the carrier substrate. Furthermore, the method comprises the step of arranging the carrier substrate on the heat sink portion to form the carrier structure, wherein the carrier substrate is in physical contact with the heat sink portion, and the carrier substrate and the heat sink portion are thermally connected to each other.
Thus, the present invention is based on the idea of providing a carrier structure, of which the carrier substrate, consisting of a homogeneous material, has the property of being both thermally conductive and electrically insulating. The homogeneous carrier substrate material is hereby able to provide an efficient thermal path from the carrier substrate to the heat sink portion and an electrical insulation of the electronic element(s), without the need of additional layers, coatings, or the like for the purpose of providing a thermal conductivity and/or an electrical insulation. In other words, the functions of a PCB and one or more layers (e.g. TIM) are combined into the carrier substrate of the present invention. Hence, the carrier structure of the present invention is able to provide an efficient thermal management and electrical insulation when in operation, while providing an uncomplicated and cost-effective construction of the carrier structure.
An advantage of the present invention is that the carrier structure, in its low number of components and in its arrangement without additional (auxiliary) layers, coatings, or the like, provides a robust and efficient construction for a conduction of heat and electrical insulation. The thermally conductive and electrically insulating carrier substrate, which consists of a homogeneous material, hereby combines (integrates) the properties of thermal conductivity and electrical insulation into one component. In other words, the thermal conductivity and electrical insulation is integrated into the homogeneous carrier substrate material, wherein additional components such as (bottom) metal layers, coatings, (TIM) interfaces, etc., for a spreading of heat and/or components for electrical insulation may be dispensed with.
The present invention is further advantageous in that the low number of components of the carrier structure allows the carrier structure to withstand high operating temperatures which other existing arrangements cannot withstand. This is understood as prior art arrangements comprising (several) components, layers and/or coatings to provide thermal conductivity and/or electrical insulation are more prone to defects due to a different thermal influence (e.g. thermal expansion) on the different materials used.
Another advantage of the present invention is that less material is needed in the carrier structure compared to arrangements in the prior art. Hence, the carrier structure, which is able to provide an efficient heat management and thermal insulation without the need of additional components, layers, coatings, etc., provides a cost-effective carrier structure. Furthermore, the carrier structure provides a more environmental-friendly product compared to arrangements in the prior art, as fewer components and/or fewer materials are used in the carrier structure of the present invention. Moreover, the low number of components of the carrier structure implies an easier recycling, especially compared to arrangements comprising a relatively high number of components, layers and/or coatings which impede an easy disassembling and/or recycling operation.
The carrier structure of the present invention comprises a carrier substrate arranged to support at least one electronic element. By the term "carrier", it is here meant substantially any element for mechanical, thermal and/or electrical support. Hence, the "carrier substrate" is a substrate (e.g. a film or sheet) arranged to provide mechanical, thermal and/or electrical support for electronic element(s) arranged thereon. The carrier structure further comprises a heat sink portion for dissipating heat from the carrier substrate. By the term "heat sink portion", it is here meant a (passive) component arranged to dissipate heat into the surrounding medium (e.g. air) of the heat sink portion. It will be appreciated that the heat sink portion may further be arranged to dissipate heat from the electronic element(s) arranged on the carrier substrate. In other words, a thermal path may be provided from the electronic elements(s) to the heat sink portion, or via the carrier substrate to the heat sink portion.
In the carrier structure of the present invention, the carrier substrate is in physical contact with the heat sink portion. In other words, the carrier substrate is in direct physical contact with the heat sink portion without any intermediate components arranged for thermal conductivity and/or electrical insulation such as layers, coatings, or the like. It will be appreciated that the carrier structure and the heat sink portion also are in (direct) thermal contact. Fastening means (e.g. glue) may be provided between the carrier substrate and the heat sink portion to guarantee a fastening of the substrate and the heat sink portion to each other.
The carrier substrate of the carrier structure consists of a homogeneous material. By the term "homogeneous material", it is here meant a material having
substantially the same physical properties throughout the material. More specifically, the carrier substrate of the present invention, consisting of a homogeneous material, has substantially the same thermal conductivity and electrical insulation throughout the material, and does thereby not comprise components, layers, coatings, or the like, arranged for thermal conductivity and/or electrical insulation. The material of the carrier substrate is thermally conductive and electrically insulating. In other words, the material of the carrier substrate provides a relatively high thermal conductivity and electrical insulation.
It will be appreciated that in an alternative realization of the present invention, the carrier structure may be provided without a heat sink portion. Hence, there may be provided a carrier structure arranged to support at least one electronic element, wherein the carrier structure comprises a carrier substrate consisting of a homogeneous material which is electrically insulating and thermally conductive for a conduction of heat from the carrier substrate, and wherein the carrier structure further comprises at least one conductive track arranged on the carrier substrate. The carrier structure hereby provides an efficient heat management (dissipation) and thermal insulation without the need of additional components, layers, coatings, etc., provides a cost-effective carrier structure.
According to an embodiment of the present invention, the material of the carrier substrate may comprise silicone. The present embodiment is advantageous in that silicone provides a relatively high electrical insulation, and is thereby able to provide an effective insulation from the electronic element(s) arranged on the carrier substrate such as LEDs, transistors, electronic circuitry, etc. Due to the this property of the silicone material, any dielectric or electrical insulating layer may be dispensed with. Furthermore, the relatively soft, pliable and flexible silicone material enables a cost-effective and fast processing of the carrier substrate. For example, the carrier substrate comprising silicone may be conveniently provided on a roll, and may thereafter be unrolled to allow a printing and/or drying of conductive tracks on the carrier substrate. Then, the carrier substrate may be rewound on the roll and transported before assembling a carrier structure comprising the carrier substrate. The present embodiment is further advantageous in that silicone has the property of being thermally stable up to 250° C for several hours without leading to discoloration, e.g.
yellowing. By this, the silicone material provides the possibility of employing reflow soldering techniques and/or an electrically conductive glue for attaching electronic elements (e.g. LEDs) to the carrier substrate of the carrier structure.
According to an embodiment of the present invention, the material may further comprises at least one oxide selected from the group consisting of aluminum oxide (AI2O3), magnesium oxide (MgO), titanium dioxide (T1O2) and zinc oxide (ZnO), and/or at least one nitride selected from the group consisting of aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and zirconium nitride (ZrN). The present embodiment is advantageous in that the thermal conductivity of the silicone may be increased by dispersing a thermally conductive filler material in the silicone, wherein the filler material may comprise one or more nitrides and/or oxides. Hence, a dispersion of oxide(s) and/or nitride(s) into the silicone of the carrier substrate even further improves the thermal conductivity of the carrier substrate, and enhances the thermal conduction from the carrier substrate to the heat sink portion of the carrier structure for dissipating heat from the carrier substrate. The present embodiment is further advantageous in that the carrier substrate comprising silicone and an oxide may provide a relatively high reflection due to the material properties of the disclosed oxides. Hence, the carrier structure may hereby provide a relatively high reflection of light from one or more light sources arranged on the carrier substrate. In prior art arrangements (e.g.
conventional PCBs), additional layers and/or coatings need to be applied to achieve this effect, such as white solder resist material, white conformal coatings, etc. The present embodiment, on the other hand, avoids complicated and circumstantial arrangements of this kind, and instead provides a much more (cost) efficient, robust, and easily achievable carrier structure for providing a high reflectivity.
According to an embodiment of the present invention, the carrier structure may further comprise at least one conductive track on the carrier substrate. In other words, one or more conductive (conductor, electrode) tracks may be provided (printed, plated or dispensed) directly on the carrier substrate, wherein the techniques may include metal plasma spraying, vacuum deposition (e.g. PVD), etc. The present embodiment is advantageous in that the carrier substrate hereby allows an arrangement of one or more electronic components directly on the substrate. Compared to arrangements in the prior art, wherein additional (metal) layers are provided, upon which electronic devices are disposed, the present embodiment provides an improved arrangement in terms of (cost) efficiency and robustness. Furthermore, the at least one conductive track may be flexible/bendable, such that the carrier substrate remains flexible even though one or more conductive tracks are provided on it.
According to an embodiment of the present invention, the carrier substrate may be a printed circuit board (PCB). The carrier substrate PCB is arranged to provide mechanical, thermal and/or electrical support for electronic element(s) arranged thereon, and comprises one or more conductive tracks or pathways. The present embodiment is
advantageous in that the carrier substrate is hereby provided as a (preferably silicone -based) PCB with an integrated thermal conductivity, for conducting heat from the carrier substrate to the heat sink portion during operation, while providing an integrated electrical insulation. Hence, the PCB of the present embodiment provides an efficient thermal management and electrical insulation without the need of additional components, layers, coatings, or the like. It will be appreciated that carrier substrate may alternatively be provided as another thermally conductive and electrically insulating resin, such as a thermally conductive epoxy, polyimide, etc.
According to an embodiment of the present invention, the carrier substrate may have a thickness of < 2 mm, preferably < 0.5 mm, and most preferably < 0.2 mm. The present embodiment is advantageous in that the carrier substrate, and thereby also the carrier structure, is relatively thin compared to more voluminous and circumstantial arrangements in the prior art. The present embodiment is advantageous in that the relatively thin carrier substrate is easily bendable/flexible, which facilitates the handling of the carrier substrate and allows carrier structures to be curved/formed in one, two or three dimensions.
According to an embodiment of the present invention, there is provided a lighting device comprising at least one light source and a carrier structure according to any one of the preceding embodiments. The carrier structure is arranged to support the at least one light source, wherein the carrier substrate of the carrier structure is in physical contact with the at least one light source. By "physical contact", it is in this context meant that the carrier substrate may be in direct contact with the light source(s) without any intermediate components arranged for thermal conductivity and/or electrical insulation such as layers, coatings, or the like. However, fastening means (e.g. glue) may be provided between the carrier substrate and the light source(s) to guarantee a fastening of the light source(s) to the substrate. The present embodiment is advantageous in that the lighting device provides an efficient and robust thermal management and electrical insulation during operation. More specifically, during operation of the lighting device, heat is conducted from the carrier substrate of the carrier structure, and/or from the light source(s), to the heat sink portion of the carrier structure, wherein the carrier substrate and the heat sink portion provide any easy, efficient, reliable and robust structure compared to prior art arrangements comprising
(additional) layers, coatings and/or interfaces. Furthermore, the reliable and robust carrier structure of the present invention, which leads to an improved dissipation of heat from the lighting device compared to other arrangements in the prior art, results in an improved service life of the illumination device.
According to an embodiment of the present invention, the at least one light source may be attached to the carrier substrate of the carrier structure by means of reflow soldering or an electrically conductive glue. The present embodiment is advantageous in that the at least one light source may be conveniently attached to the carrier substrate by the mentioned techniques. According to an embodiment of the present invention, the at least one light source may comprise at least one light emitting diode (LED).
According to an embodiment of the present invention, the method of manufacturing the carrier structure may comprise the step of arranging the heat sink portion in a mould, wherein the heat sink portion is a heat-conductive sheet material. Further, the method comprises the step of providing the carrier substrate in a fluid state and injecting the carrier substrate into the mould. The method further comprises the step of moulding the heat sink portion and the carrier substrate, such that the heat sink portion and the carrier substrate are formed by the mould, and wherein the heat sink portion and the carrier substrate bond to each other. Furthermore, the method comprises the step of solidifying the carrier substrate, such that the heat sink portion and the carrier substrate form the carrier structure. The present embodiment is advantageous in that the method provides an efficient and cost-effective method of manufacturing a carrier structure arranged to conduct heat to the heat sink portion and to provide electrical insulation. The present embodiment is especially advantageous in that the method comprises few and efficient process steps. By arranging (placing) a heat sink portion in a mould before injecting the carrier substrate in a fluid state, the present method avoids the process of holding and/or precisely positioning a heat sink in the mould, which is needed in some prior art processes such as insert moulding. Moreover, no adhesive material is necessary for adhering the heat sink sheet material to the carrier substrate, and the heat sink portion becomes permanently bonded to the carrier substrate. Another advantage of the method of the present invention is that the heat sink portion, in the form of a heat-conductive sheet material, is formed by the mould, wherein the heat sink portion easily adapts (i.e.
forms, bends and/or shapes) according to the shape of the mould. As a result, the overall form/shape of the carrier structure becomes relatively thin and conveniently handled. This is highly advantageous compared to methods in the prior art, wherein stiff and/or thick heat sink inserts are often used. Furthermore, the feature of the easily formed heat sink portion (and carrier substrate) of the method of the present invention is especially advantageous when moulding a carrier structure with a non-flat shape, i.e. curved shape, as the heat sink portion is formed into (conforms to) the curved shape of the carrier structure.
It will be appreciated that the carrier substrate of the carrier structure may alternatively be manufactured by other moulding processes such as compression or extrusion moulding. As these are known to the skilled person, a more detailed description for manufacturing the carrier structure by the mentioned processes is therefore omitted. According to an embodiment of the method of manufacturing the carrier structure, the material of the carrier substrate may comprise silicone. Furthermore, according to yet another embodiment of the method of the present invention, the material may further comprise at least one oxide selected from the group consisting of aluminum oxide (AI2O3), magnesium oxide (MgO), titanium dioxide (T1O2) and zinc oxide (ZnO), and/or at least one nitride selected from the group consisting of aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and zirconium nitride (ZrN). According to yet another embodiment of the method of the present invention, the manufacture of the carrier structure may further comprise the step of applying at least one conductor track on the carrier substrate material. The advantages of the use of silicone as a carrier substrate material, the inclusion of oxide(s) and/or nitride(s) in the carrier substrate material, and/or the application of at least one conductor track have been presented in the description of the first aspect of the present invention, and it is hereby referred to those sections in the text.
According to an embodiment of the present invention, there is provided a method of manufacturing a lighting device. The method comprises the step of manufacturing a carrier structure according to any one of the preceding embodiments. Furthermore, the method comprises the step of providing at least one light source, and arranging (attaching) the at least one light source on the carrier structure. The present embodiment is advantageous in that the manufacture of the carrier structure, comprising relatively few components and wherein additional layers, coatings, etc., for heat conduction and electrical insulation purposes may be dispensed with, contributes to a manufacturing of a lighting device which is (cost) efficient and convenient. The attaching of the at least one light source (directly) to the carrier substrate of the carrier structure, e.g. by a reflow soldering technique and/or by an electrically conductive glue, even further contributes to an efficient manufacturing of the lighting device.
Further objectives of, features of, and advantages with, the present invention will become apparent when studying the following detailed disclosure, the drawings and the appended claims. Those skilled in the art will realize that different features of the present invention can be combined to create embodiments other than those described in the following.
BRIEF DESCRIPTION OF THE DRAWINGS
This and other aspects of the present invention will now be described in more detail, with reference to the appended drawings showing embodiment(s) of the invention. Fig. 1 is a schematic, cross-sectional view of an electronic device arrangement according to the prior art;
Fig. 2 is a schematic, cross-sectional view of a lighting device according to an exemplifying embodiment of the present invention; and
Figs. 3a-c are schematic illustrations of a method of manufacturing a carrier structure according to an exemplifying embodiment of the present invention.
DETAILED DESCRIPTION
Fig. 1 is a schematic, cross-sectional view of an electronic device arrangement 100 according to the prior art. The arrangement 100 comprises a PCB substrate 110 which consists of several layers. An electrically insulating layer 111, e.g. a dielectric layer or a glass fibre-filled epoxy layer, is provided between an upper conducting layer 112a and a lower conducting layer 112b. The PCB substrate 110 further comprises an electrical insulator or glue 113 arranged below the lower conducting layer 112b, and a thermal interface material (TIM) 114 provided between the electric insulator 113 and a heat sink 115 which is attached to the PCB substrate 110. In a case the area of the heat sink 115 is larger than the PCB substrate 110, the TIM 114 may be applied between the PCB substrate 110 and a metal heat- spreading plate, and the heat- spreading plate may in turn be thermally contacted to the heat sink 115. Electronic element(s) 120, such as LEDs, transistors and/or electronic circuitry are arranged on the upper conducting layer 112a, wherein an electrical insulator (or glue) 121, which may comprise electrical tracks, is provided between the electronic elements 120 and the upper conducting layer 112a. Bonding wires 122 are coupled to the electronic elements 120 for power supply.
During operation of the electronic device arrangement 100, heat from the electronic element(s) 120 is spread by the upper conducting layer 112a through the electrically insulating layer 111 and through the lower conducting layer 112b. The heat is further conducted through the insulator or glue 113 and though the TIM 114, which conducts the heat to the heat sink 115. The heat sink 115, in its turn, dissipates the heat to the surrounding environment.
The construction and operation of the disclosed prior art arrangement 100 is complicated and circumstantial. As a consequence, the arrangement 100, as well as a manufacture of the arrangement 100, become relatively expensive. Furthermore, as the complicated arrangement 100 leads to an increased risk of an unsatisfactory heat dissipation during operation, there is a wish to provide alternative solutions which are able to provide an effective heat management and electrical insulation, and which further provide a more cost- effective product as well as a more cost-effective method of manufacturing the product.
Fig. 2 is a schematic, cross-sectional view of a lighting device 200 according to an exemplifying embodiment of the present invention. The lighting device 200 comprises at least one light source 220 (schematically indicated in Fig. 2), which may be one or more LEDs. Bonding wires 222 are coupled to the light source(s) 220 for a supply of power. The lighting device 200 further comprises a carrier structure 210, wherein the carrier
structure 210 comprises a carrier substrate 230 arranged to support the light source(s) 220, and a heat sink portion 240 for dissipating heat from the carrier substrate 230. The carrier structure 210 further comprises at least one conductive track 250 arranged on the carrier substrate 230. The light source(s) 220 may be attached to the conductive track(s) 250 of the carrier structure 210 by means of reflow soldering or an electrically conductive glue (e.g. silver-based epoxy).
The carrier substrate 230 is arranged on top of the heat sink portion 240, and is in (direct) physical contact with the heat sink portion 240 without any (additional) layers, coatings, or the like between the carrier substrate 230 and the heat sink portion 240. The carrier substrate 230 consists of a homogeneous material which is thermally conductive and electrically insulating. The thermal conductivity of the carrier substrate 230 may be
1-2 W/mK, or even higher. Furthermore, the carrier substrate 230 may have a break-through voltage of at least 4 kV.
The present invention is hereby based on the idea of providing a carrier structure 210, comprising a carrier substrate 230 and a heat sink portion 240, wherein the carrier substrate 230 of homogeneous material is both thermally conductive and electrically insulating. The carrier substrate 230 is hereby able to provide an efficient thermal path 260 from the carrier substrate 230 to the heat sink portion 240 and into the surrounding air, as well as an electrical insulation of the electronic element(s), without the need of additional layers, coatings, or the like for the purpose of providing a thermal conductivity and/or an electrical insulation of the carrier structure 210. The lighting device 200, comprising the carrier structure 210 of the present invention, is hereby provided an efficient thermal management and electrical insulation by the carrier structure 210 when in operation.
Furthermore, the uncomplicated and cost-effective construction of the carrier structure 210 further leads to a cost-effective lighting device 200.
The material of the carrier substrate 230 of the carrier structure 210 may comprise silicone. Silicone is advantageous in that it is thermally stable up to 250° C for several hours without leading to discoloration, e.g. yellowing. The thermal conductivity of silicone may be increased by adding one or more highly thermally conductive ceramics, e.g. one or more oxides such as aluminum oxide (AI2O3), magnesium oxide (MgO), titanium dioxide (Ti02) and/or zinc oxide (ZnO), and/or one or more nitrides, such as aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and/or zirconium nitride (ZrN). It will be appreciated that other ceramics than the mentioned oxides and nitrides may be dispensed into the carrier substrate 230 for enhancing the thermal conductivity. The carrier
substrate 230 may further comprise one or more of the oxides for the purpose of reflection, i.e. to reflect incident light from the light source(s) 220 of the lighting device 200. For example, white A1203 powder may be used in the carrier substrate 230. The preferred amount of oxide (or white powder) dispersed in the carrier substrate 230 is dependent on the thickness of the carrier substrate 230. For example, in a case the carrier substrate 230 has a thickness of 1-2 mm, the amount of oxide/white powder in the carrier substrate 230 may be 10-30 wt%. For a relatively thin carrier substrate 230, e.g. for the preferred thickness of < 0.5 mm, or the even more preferred thickness of < 0.2 mm, the amount of oxide/white powder in the carrier substrate 230 may be up to 90 wt%. For reasons of thermal conductivity, it is recommended to use a relatively thin carrier substrate 230 with a relatively high
concentration of oxide.
In Fig. 2, the carrier structure 210 comprises one or more conductive
(conductor, electrode) tracks 250 which are printed, plated or dispensed directly on the carrier substrate 230. Compared to the exemplifying prior art arrangement 100, wherein the electronic devices 120 are arranged upon the additional metal layer 112a, the carrier structure 210 of the present invention provides an improved arrangement in terms of (cost) efficiency and robustness. Furthermore, the carrier structure 210 becomes thinner compared to prior art arrangements, as additional layers may be dispensed with.
It will be appreciated that the carrier substrate 230 of the present invention may be a printed circuit board (PCB) for providing mechanical, thermal and/or electrical support for the electronic element(s) 220 arranged thereon. The carrier substrate 230 is hereby provided as a (preferably silicone-based) PCB with an integrated thermal
conductivity, for providing the thermal path 260 from the carrier substrate 230 to the heat sink portion 240 during operation, while providing an integrated electrical insulation. By this, the carrier substrate PCB 230 provides an efficient thermal management and electrical insulation without the need of additional components, layers, coatings, or the like, as present in the complex prior art arrangement 100. The carrier substrate 230 of the carrier structure 210 has a thickness of < 2 mm, preferably < 0.5 mm, and most preferably < 0.2 mm. The relatively thin carrier substrate 230 is hereby easily bendable/flexible, which facilitates the handling of the carrier substrate 230 and achieves a more compact carrier structure 210 and lighting device 200.
Figs. 3a-c are schematic illustrations of a method 300 of manufacturing a carrier structure 350 according to an embodiment of the present invention. The method 300 comprises the step of providing a heat sink portion in form of a heat-conductive sheet material 310, wherein the sheet material 310 may be a relatively flat, thin material such as a sheet, a foil, or the like. The foil may have a thickness of 0.15 mm to 0.35 mm (or even less), whereby the relatively small thickness leads to an even easier handling and/or arrangement of the metal foil. Furthermore, the relatively small foil thickness saves material and handling costs even further, resulting in an even more cost-effective method 300 and carrier structure 350, respectively. The relatively small metal foil thickness further contributes to a relatively small thickness of the total carrier structure 350, which consequently results in a lighter, more convenient and/or more easily arranged carrier structure 350. The sheet material 310 may comprise one or more metals, e.g. aluminium. As aluminium is both inexpensive and possesses high heat-conductive properties, it is highly advantageous for the use as a cost-effective sheet material 310. The method 300 further comprises the step of arranging 320 the sheet material 310 in a mould 330, and closing the mould 330. The method 300 further comprises the step of providing a carrier substrate 340 in a fluid state and injecting 325 the carrier substrate 340 into the mould 330, which is shown in Fig. 3b. In its fluid state, the carrier substrate 340 is able to conform to the shape of the mould 330. The method 300 further comprises the step of moulding the carrier substrate 340 and the sheet material 310, such that the carrier substrate 340 and the sheet material 310 are formed by the mould 330, and wherein the carrier substrate 340 and the sheet material 310 bond to each other. The method 300 further comprises the step of solidifying the carrier substrate 340, e.g. by cooling, hardening, curing and/or tempering. In Fig. 3b, the mould 330 is shown as a mould comprising a male and a female part, but it will be appreciated that it may be feasible to use virtually any kind of mould 330 in the present method 300. As the sheet material 310 is relatively thin, it is also easily formed/shaped by the mould 330. Hence, the sheet material 310 is thereby able to conform to the desired shape of the carrier structure 350.
After solidifying, the carrier substrate 340 and the sheet material 310 together form a carrier structure 350 which may be ejected from the mould 330. An example of a carrier structure 350 is shown in Fig. 3c, but it will be appreciated that virtually any form/shape of the carrier structure 350 may be feasible, e.g. a relatively flat and/or a relatively round shape. The carrier substrate 340 and the sheet material 310 of the carrier structure 350 are thermally connected to each other, such that carrier structure 350 is able to provide a thermal path between the carrier substrate 340 and the sheet material 310. The efficient and cost-effective method of manufacturing the carrier structure 350 likewise results in a cost-effective carrier structure 350 which, when arranged e.g. in a lighting device, is arranged to efficiently dissipate heat generated by the lighting device during operation.
It will be appreciated that the carrier substrate 340 of the carrier structure 350 may alternatively be formed by means of a compression moulding process or an extrusion process.
Furthermore, it will be appreciated that in the alternative realization of the present invention, wherein the carrier structure may be provided without a heat sink portion, a method for manufacturing the carrier structure may comprise the step of compression molding the carrier substrate (e.g. comprising silicone). Further, the method may comprise the step of curing the carrier substrate. The method may further comprise the step of printing at least one conductive track on the carrier substrate. Furthermore, the method may comprise the step of curing the carrier substrate and the at least one conductive track. It will be appreciated that alternative moulding techniques may be applied, such as extrusion moulding and injection moulding. Furthermore, the carrier substrate may be moulded such that it is curved/formed in one, two or three dimensions (denoted as ID, 2D and 3D structures). In case of a 3D structure, the carrier structure may have a relatively flat portion (bottom portion) which may be used as a PCB portion, and the surrounding wall portions of the carrier structure may be provided as reflective portions.
The alternative realization of the present invention, wherein the carrier structure may be provided without a heat sink portion, may be provided for lighting devices comprising LEDs with a medium or a relatively low power output and/or wherein the LED density, i.e. the number of LEDs per unit area of the carrier structure of the lighting device, is relatively low. For example, a carrier substrate with a thermal conductivity of > 1 W/mK may be enough for a dissipation of heat into the surrounding environment.
The person skilled in the art realizes that the present invention by no means is limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims. For example, the lighting device 200, the carrier structure 210, 350 the carrier substrate 230, 340 and/or the heat sink portion 240 may have different dimensions and/or sizes than those depicted/described. For example, the carrier substrate 230, 340 and/or the heat sink portion 240 may be thicker/thinner compared to the corresponding elements as exemplified in the figures.

Claims

CLAIMS:
1. A carrier structure (210), comprising:
a carrier substrate (230) arranged to support at least one electronic element, and
a heat sink portion (240) for dissipating heat from said carrier substrate, wherein said carrier substrate is in physical contact with said heat sink portion, and wherein said carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating.
2. The carrier structure according to claim 1, wherein said material comprises silicone.
3. The carrier structure according to claim 2, wherein said material further comprises at least one oxide selected from the group consisting of aluminum oxide (Α1203), magnesium oxide (MgO), titanium dioxide (Ti02) and zinc oxide (ZnO), and/or at least one nitride selected from the group consisting of aluminum nitride (A1N), boron nitride (BN), silicon nitride (SiN) and zirconium nitride (ZrN).
4. The carrier structure according to any one of the preceding claims, wherein said carrier structure further comprises at least one conductive track (250) on said carrier substrate.
5. The carrier structure according to any one of the preceding claims, wherein said carrier substrate is a printed circuit board.
6. The carrier structure according to any one of the preceding claims, wherein said carrier substrate has a thickness of < 2 mm, preferably < 0.5 mm, and most preferably < 0.2 mm.
7. A lighting device (200), comprising:
at least one light source, and
a carrier structure according to any one of the preceding claims, arranged to support said at least one light source, wherein said carrier substrate of said carrier structure is in physical contact with said at least one light source.
8. The lighting device according to claim 7, wherein said at least one light source is attached to said carrier substrate of said carrier structure by means of reflow soldering or an electrically conductive glue.
9. The lighting device according to any one of claims 7-8, wherein said at least one light source comprises at least one light emitting diode.
10. A method (300) of manufacturing a carrier structure (210), comprising the steps of:
providing a carrier substrate (230) arranged to support at least one electronic element, wherein said carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating;
providing a heat sink portion (240) for dissipating heat from said carrier substrate; and
arranging said carrier substrate on said heat sink portion to form said carrier structure, wherein said carrier substrate is in physical contact with said heat sink portion and wherein said carrier substrate and said heat sink portion are thermally connected to each other.
11. The method according to claim 10, wherein said heat sink portion is a heat- conductive sheet material (310), comprising the steps of:
arranging (320) said heat sink portion in a mould (330);
providing said carrier substrate (340) in a fluid state and injecting (325) said carrier substrate into the mould;
moulding said heat sink portion and said carrier substrate, such that said heat sink portion and said carrier substrate are formed by the mould, and wherein said heat sink portion and said carrier substrate bond to each other; and solidifying said carrier substrate, such that said heat sink portion and said carrier substrate form said carrier structure.
12. The method according to claim 10 or 11, wherein the material of said carrier substrate comprises silicone.
13. The method according to claim 12, wherein the material of said carrier substrate further comprises at least one oxide selected from the group consisting of aluminum oxide (AI2O3), magnesium oxide (MgO), titanium dioxide (Ti02) and zinc oxide (ZnO), and/or at least one nitride selected from the group consisting of aluminum nitride (AIN), boron nitride (BN), silicon nitride (SiN) and zirconium nitride (ZrN).
14. The method according to any one of claims 10-13, further comprising the step of applying at least one conductor track (250) on said carrier substrate.
15. A method of manufacturing a lighting device (200), comprising the steps of:
manufacturing a carrier structure according to any one of claims 10-14, and providing at least one light source, and arranging said at least one light source on said carrier structure.
PCT/IB2013/060796 2012-12-12 2013-12-11 Carrier structure and method of manufacturing the same WO2014091417A1 (en)

Applications Claiming Priority (2)

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US201261736061P 2012-12-12 2012-12-12
US61/736,061 2012-12-12

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0566043A2 (en) * 1992-04-14 1993-10-20 Hitachi Chemical Co., Ltd. Method of producing boards for printed wiring
US20070003702A1 (en) * 2003-11-17 2007-01-04 Fumito Nishida Method of preparing a metal-silicone rubber composite
US20080057333A1 (en) 2006-08-30 2008-03-06 Polytronics Technology Corporation Heat dissipation substrate for electronic device
EP2230889A1 (en) * 2007-08-08 2010-09-22 Ain Co., Ltd. Method for producing wiring board and wiring board
EP2490513A2 (en) * 2011-02-20 2012-08-22 Essence Solar Solutions Ltd. Light and heat resistant circuit board apparatus and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0566043A2 (en) * 1992-04-14 1993-10-20 Hitachi Chemical Co., Ltd. Method of producing boards for printed wiring
US20070003702A1 (en) * 2003-11-17 2007-01-04 Fumito Nishida Method of preparing a metal-silicone rubber composite
US20080057333A1 (en) 2006-08-30 2008-03-06 Polytronics Technology Corporation Heat dissipation substrate for electronic device
EP2230889A1 (en) * 2007-08-08 2010-09-22 Ain Co., Ltd. Method for producing wiring board and wiring board
EP2490513A2 (en) * 2011-02-20 2012-08-22 Essence Solar Solutions Ltd. Light and heat resistant circuit board apparatus and method

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