WO2014084011A1 - 高周波信号線路及びこれを備えた電子機器 - Google Patents
高周波信号線路及びこれを備えた電子機器 Download PDFInfo
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- WO2014084011A1 WO2014084011A1 PCT/JP2013/079977 JP2013079977W WO2014084011A1 WO 2014084011 A1 WO2014084011 A1 WO 2014084011A1 JP 2013079977 W JP2013079977 W JP 2013079977W WO 2014084011 A1 WO2014084011 A1 WO 2014084011A1
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- line
- axis direction
- signal line
- frequency signal
- interlayer connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/082—Multilayer dielectric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Definitions
- the present invention relates to a high-frequency signal line and an electronic device including the same, and more particularly to a high-frequency signal line used for transmitting a high-frequency signal and an electronic device including the same.
- the high-frequency signal line includes a dielectric element body, a signal line, and two ground conductors.
- the dielectric body is configured by laminating a plurality of dielectric sheets.
- the signal line is provided in the dielectric body.
- the two ground conductors sandwich the signal line from the stacking direction in the dielectric body.
- the signal line and the two ground conductors form a stripline structure.
- one of the ground conductors is provided with a plurality of openings that overlap with the signal lines when viewed in plan from the stacking direction. This makes it difficult to form a capacitor between the signal line and one of the ground conductors. Therefore, the distance between the signal line and one ground conductor in the stacking direction can be reduced, and the high-frequency signal line can be thinned.
- the high-frequency signal line as described above is used, for example, for connecting two circuit boards.
- FIG. 31 is a diagram showing a high-frequency signal transmission line 500 in which a central portion in the longitudinal direction has a meander shape.
- FIG. 32 is a diagram showing the high-frequency signal transmission line 500 when both ends are pulled.
- the center portion of the high-frequency signal transmission line 500 has a meander shape.
- the high-frequency signal transmission line 500 is configured by connecting line parts 502a to 502e.
- the line portion 502a extends in the left-right direction.
- the line portion 502b extends downward from the right end of the line portion 502a.
- the line portion 502c extends from the lower end of the line portion 502b toward the left side.
- the line portion 502d extends downward from the left end of the line portion 502c.
- the line portion 502e extends from the lower end of the line portion 502d toward the right side.
- the lengths of the line portions 502b and 502d are sufficiently shorter than the lengths of the line portions 502a, 502c, and 502e.
- the high-frequency signal transmission line 500 As described above, when two circuit boards are connected, the left end of the line portion 502a is pulled to the left side, and the right end of the line portion 502e is pulled to the right side. Thereby, as shown in FIG. 32, the high-frequency signal transmission line 500 is deformed so as to form a Z-shape. As a result, the distance between the two connectors provided at both ends of the high-frequency signal transmission line 500 is increased. Therefore, the two connectors can be easily connected to the two circuit boards, respectively.
- the via-hole conductor connecting the two ground conductors provided inside may be damaged.
- the high-frequency signal transmission line 500 includes a signal line and two ground conductors, and these form a stripline structure. Therefore, the two ground conductors are connected to each other by via hole conductors.
- an object of the present invention is to provide a high-frequency signal line that can prevent the interlayer connection conductor from being damaged, and an electronic device including the same.
- a high-frequency signal line is a dielectric element body formed by laminating a plurality of flexible dielectric sheets, and is a first line extending in a predetermined direction.
- a second line portion extending along the first line portion, an end on one side of the first line portion in the predetermined direction, and the predetermined portion of the second line portion
- a dielectric element body connecting a first line portion and a third line portion shorter than the second line portion, and connecting the first end portion in one direction to the first line portion;
- the signal line extending along the second line part and the third line part, and the dielectric element body is provided on one side in the stacking direction with respect to the signal line.
- first ground conductor facing the signal line, and the dielectric body other than the signal line in the stacking direction.
- a second ground conductor facing the signal line by being provided on the side, and provided in at least one of the first line part and the second line part, and penetrates the dielectric sheet
- the first ground conductor and one or more interlayer connection conductors connecting the second ground conductor are provided, and the interlayer connection conductor is laminated in the third line portion. When viewed in plan from the direction, it is not provided on the other side of the predetermined direction with respect to the signal line.
- An electronic apparatus includes a housing and a high-frequency signal line housed in the housing, and the high-frequency signal line includes a plurality of flexible dielectric sheets.
- a dielectric element body configured by being stacked, a first line portion extending in a predetermined direction, and a second line portion extending along the first line portion, The one end of the first line portion in the predetermined direction is connected to the one end of the second line portion in the predetermined direction, and the first line portion and the second line portion
- a dielectric element body including a third line portion shorter than the two line portions, and extending along the first line portion, the second line portion, and the third line portion.
- at least one of the second line portions, and one or more interlayer connections connecting the first ground conductor and the second ground conductor by penetrating the dielectric sheet A conductor, and the interlayer connection conductor is not provided on the other side of the predetermined direction from the signal line when viewed in plan from the stacking direction in the third line portion, It is characterized by.
- the interlayer connection conductor can be prevented from being damaged.
- FIG. 2 is an exploded view of the high-frequency signal line in FIG. 1.
- FIG. 2 is an exploded view of the high-frequency signal line in FIG. 1.
- FIG. 2 is an exploded view of the high-frequency signal line in FIG. 1.
- FIG. 2 is an exploded view of the high-frequency signal line in FIG. 1.
- FIG. 2 is an exploded view of the high-frequency signal line in FIG. 1.
- FIG. 3 is a cross-sectional structure diagram along AA in FIG. 2.
- FIG. 3 is a cross-sectional structure diagram along BB in FIG. 2.
- FIG. 1 is an external perspective view of a high-frequency signal transmission line 10 according to an embodiment of the present invention.
- 2 to 6 are exploded views of the high-frequency signal line 10 of FIG.
- FIG. 7 is a cross-sectional structural view taken along line AA in FIG.
- FIG. 8 is a cross-sectional structural view taken along the line BB of FIG.
- the stacking direction of the high-frequency signal transmission line 10 is defined as the z-axis direction.
- the longitudinal direction of the high-frequency signal transmission line 10 is defined as the x-axis direction, and the direction orthogonal to the x-axis direction and the z-axis direction is defined as the y-axis direction.
- the high-frequency signal line 10 is used for connecting two high-frequency circuits in an electronic device such as a mobile phone. As shown in FIGS. 1 to 8, the high-frequency signal line 10 includes a dielectric body 12, external terminals 16a and 16b, a signal line 20, a reference ground conductor 22, an auxiliary ground conductor 24, and a via-hole conductor (interlayer connection portion) b1. , B2, B1 to B4 and connectors 100a, 100b.
- the dielectric body 12 is a flexible plate-like member having a longitudinal direction in the x-axis direction when viewed in plan from the z-axis direction. It has a meander shape extending so as to vibrate in the y-axis direction.
- the dielectric body 12 includes line portions 12a to 12e and connection portions 12f and 12g.
- the dielectric body 12 is configured by laminating a protective layer 14 and dielectric sheets 18 a to 18 c in this order from the positive direction side to the negative direction side in the z-axis direction. It is a laminate.
- the main surface on the positive side in the z-axis direction of the dielectric body 12 is referred to as the front surface
- the main surface on the negative direction side in the z-axis direction of the dielectric body 12 is referred to as the back surface.
- the line portion 12a (first line portion) extends in the x-axis direction and has a strip shape having a uniform width in the y-axis direction.
- the line portion 12c (second line portion) extends in the x-axis direction along the line portion 12a and has a strip shape having a uniform width in the y-axis direction.
- the line portion 12c is provided on the negative direction side in the y-axis direction with respect to the line portion 12a.
- the end portion on the positive direction side in the x-axis direction of the line portion 12a and the end portion on the positive direction side in the x-axis direction of the line portion 12c are adjacent to each other in the y-axis direction.
- the line portion 12b (third line portion) extends in the y-axis direction and has a strip shape having a uniform width in the x-axis direction.
- the line portion 12b connects the end portion on the positive direction side in the x-axis direction of the line portion 12a and the end portion on the positive direction side in the x-axis direction of the line portion 12c.
- the length of the line portion 12b is shorter than the length of the line portions 12a and 12c.
- the line portion 12e (fourth line portion) extends in the x-axis direction along the line portion 12c and has a strip shape having a uniform width in the y-axis direction. Moreover, it is provided on the negative direction side in the y-axis direction from the line portion 12c. That is, the line portion 12e is provided on the opposite side of the line portion 12a with respect to the line portion 12c.
- the end portion on the negative direction side in the x-axis direction of the line portion 12c and the end portion on the negative direction side in the x-axis direction of the line portion 12e are adjacent to each other in the y-axis direction.
- the line portion 12d (fifth line portion) extends in the y-axis direction and has a strip shape having a uniform width in the x-axis direction.
- the line portion 12d connects the end portion on the negative direction side in the x-axis direction of the line portion 12c and the end portion on the negative direction side in the x-axis direction of the line portion 12e.
- the length of the line portion 12d is shorter than the length of the line portions 12c and 12e.
- the width in the y-axis direction of the line portions 12a, 12c, and 12e is equal to the width in the x-axis direction of the line portions 12b and 12d.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- connection portions 12f and 12g are connected to the end portion on the negative direction side in the x-axis direction of the line portion 12a and the end portion on the positive direction side in the x-axis direction of the line portion 12e, respectively, as viewed in plan from the z-axis direction. Sometimes it has a rectangular shape.
- the widths of the connecting portions 12f and 12g in the y-axis direction are larger than the widths of the line portions 12a, 12c and 12e in the y-axis direction and the widths of the line portions 12b and 12d in the x-axis direction.
- the dielectric sheets 18a to 18c have the same planar shape as the dielectric body 12 when viewed in plan from the z-axis direction.
- the dielectric sheets 18a to 18c are made of flexible thermoplastic resin such as polyimide or liquid crystal polymer.
- the front surface the main surface on the positive side in the z-axis direction of the dielectric sheets 18a to 18c
- the main surface on the negative direction side in the z-axis direction of the dielectric sheets 18a to 18c is referred to as the back surface.
- the thickness T1 of the dielectric sheet 18a is larger than the thickness T2 of the dielectric sheet 18b.
- the thickness T1 is, for example, 50 to 300 ⁇ m. In the present embodiment, the thickness T1 is 100 ⁇ m.
- the thickness T2 is, for example, 10 to 100 ⁇ m. In the present embodiment, the thickness T2 is 50 ⁇ m.
- the dielectric sheet 18a is composed of line portions 18a-a to 18a-e and connection portions 18a-f and 18a-g as shown in FIGS.
- the dielectric sheet 18b includes line portions 18b-a to 18b-e and connection portions 18b-f and 18b-g.
- the dielectric sheet 18c includes line portions 18c-a to 18c-e and connection portions 18c-f and 18c-g.
- the line portions 18a-a, 18b-a, and 18c-a constitute the line portion 12a.
- the line portions 18a-b, 18b-b, and 18c-b constitute the line portion 12b.
- the line portions 18a-c, 18b-c, and 18c-c constitute the line portion 12c.
- the line portions 18a-d, 18b-d, and 18c-d constitute the line portion 12d.
- the line portions 18a-e, 18b-e, and 18c-e constitute the line portion 12e.
- the connecting portions 18a-f, 18b-f, and 18c-f constitute a connecting portion 12f.
- the connecting portions 18a-g, 18b-g, and 18c-g constitute a connecting portion 12g.
- the signal line 20 transmits a high-frequency signal and extends along the line parts 12a to 12e and the connection parts 12f and 12g. That is, the signal line 20 extends from the connection part 12f to the line part 12a. It is a linear conductor extending to the connecting portion 12g along the extending direction of 12e.
- the signal line 20 is formed on the surface of the dielectric sheet 18b, and is composed of line conductors 20a to 20f.
- the line conductor 20a extends along the x-axis direction in the line portion 18b-a, and is located at the approximate center in the y-axis direction of the line portion 18b-a.
- the line conductor 20b extends along the y-axis direction in the line portion 18b-b, and is positioned approximately at the center of the line portion 18b-b in the x-axis direction.
- the line conductor 20c extends along the x-axis direction in the line portion 18b-c, and is located at the approximate center in the y-axis direction of the line portion 18b-c.
- the line conductor 20d extends along the y-axis direction in the line portion 18b-d, and is positioned substantially at the center in the x-axis direction of the line portion 18b-d.
- the line conductor 20e extends along the x-axis direction in the line portion 18b-e, and is positioned approximately at the center in the y-axis direction of the line portion 18b-e.
- the line conductors 20a to 20e are connected so as to be arranged in this order.
- the line conductor 20f is connected to the end of the line conductor 20a on the negative side in the x-axis direction, and extends along the x-axis direction at the connection portion 18b-f. As shown in FIG. 2, the end of the line conductor 20f on the negative side in the x-axis direction is located approximately at the center of the connecting portion 18b-f.
- the line conductor 20g is connected to the end on the positive direction side in the x-axis direction of the line conductor 20e, and extends along the x-axis direction at the connection portion 18b-g. As shown in FIG. 3, the end of the line conductor 20g on the positive side in the x-axis direction is positioned substantially at the center of the connecting portion 18b-g.
- the line width of the signal line 20 is, for example, 300 ⁇ m to 700 ⁇ m. In the present embodiment, the line width of the signal line 20 is 300 ⁇ m.
- the signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the signal line 20 is formed on the surface of the dielectric sheet 18b means that the signal line 20 is formed by patterning a metal foil formed by plating on the surface of the dielectric sheet 18b, It means that the signal line 20 is formed by patterning the metal foil attached to the surface of the dielectric sheet 18b.
- the surface roughness of the surface where the signal line 20 is in contact with the dielectric sheet 18b is the surface roughness of the surface where the signal line 20 is not in contact with the dielectric sheet 18b. It becomes larger than the roughness.
- the reference ground conductor 22 is a solid conductor layer provided in the dielectric element body 12 on the positive direction side in the z-axis direction with respect to the signal line 20. More specifically, the reference ground conductor 22 is formed on the surface of the dielectric sheet 18a and faces the signal line 20 through the dielectric sheet 18a. The reference ground conductor 22 is not provided with an opening at a position overlapping the signal line 20.
- the characteristic impedance of the high-frequency signal line 10 is determined mainly based on the facing area and distance between the signal line 20 and the reference ground conductor 22 and the relative dielectric constant of the dielectric sheets 18a to 18c.
- the characteristic impedance of the high-frequency signal line 10 is set to 50 ⁇ , for example, the signal line 20 and the reference ground conductor 22 are designed so that the characteristic impedance of the high-frequency signal line 10 is 55 ⁇ , which is slightly higher than 50 ⁇ . . Then, the shape of the auxiliary ground conductor 24 described later is adjusted so that the characteristic impedance of the high-frequency signal line 10 is 50 ⁇ by the signal line 20, the reference ground conductor 22, and the auxiliary ground conductor 24.
- the reference ground conductor 22 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the reference ground conductor 22 is formed on the surface of the dielectric sheet 18a. That is, the reference ground conductor 22 is formed by patterning a metal foil formed by plating on the surface of the dielectric sheet 18a. Alternatively, the reference ground conductor 22 is formed by patterning the metal foil attached to the surface of the dielectric sheet 18a. Further, since the surface of the reference ground conductor 22 is smoothed, the surface roughness of the surface where the reference ground conductor 22 is in contact with the dielectric sheet 18a is not in contact with the dielectric sheet 18a. It becomes larger than the surface roughness of the surface.
- the reference ground conductor 22 includes main conductors 22a to 22e and terminal conductors 22f and 22g.
- the main conductor 22a is provided on the surface of the line portion 18a-a and extends along the x-axis direction.
- the main conductor 22b is provided on the surface of the line portion 18a-b and extends along the y-axis direction.
- the main conductor 22c is provided on the surface of the line portion 18a-c, and extends along the x-axis direction.
- the main conductor 22d is provided on the surface of the line portion 18a-d and extends along the y-axis direction.
- the main conductor 22e is provided on the surface of the line portion 18a-e and extends along the x-axis direction.
- the main conductors 22a to 22e are connected so as to be arranged in this order.
- the terminal conductor 22f is provided on the surface of the connecting portion 18a-f and forms a rectangular ring.
- the terminal conductor 22g is connected to the end of the main conductor 22a on the negative direction side in the x-axis direction.
- the terminal conductor 22g is provided on the surface of the connecting portion 18a-g and forms a rectangular ring.
- the terminal conductor 22g is connected to the end on the positive direction side in the x-axis direction of the main conductor 22e.
- the auxiliary ground conductor 24 is provided on the negative side in the z-axis direction from the signal line 20 as shown in FIGS.
- the auxiliary ground conductor 24 is provided with a plurality of openings 30 arranged along the signal line 20. More specifically, the auxiliary ground conductor 24 is formed on the surface of the dielectric sheet 18c and faces the signal line 20 through the dielectric sheet 18b.
- the auxiliary ground conductor 24 is a ground conductor that also functions as a shield.
- the main surface on the positive direction side in the z-axis direction of the auxiliary ground conductor 24 is referred to as a front surface
- the main surface on the negative direction side in the z-axis direction of the auxiliary ground conductor 24 is referred to as a back surface.
- the auxiliary ground conductor 24 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the auxiliary ground conductor 24 is formed on the surface of the dielectric sheet 18c means that the auxiliary ground conductor 24 is formed by patterning a metal foil formed by plating on the surface of the dielectric sheet 18c.
- the surface of the auxiliary ground conductor 24 is smoothed, the surface roughness of the surface where the auxiliary ground conductor 24 is in contact with the dielectric sheet 18c is not in contact with the dielectric sheet 18c. It becomes larger than the surface roughness of the surface.
- the auxiliary ground conductor 24 includes line conductors 24a to 24e and terminal conductors 24f and 24g.
- the main conductor 24a is provided on the surface of the line portion 18c-a, and extends along the x-axis direction.
- the main conductor 24b is provided on the surface of the line portion 18c-b and extends along the y-axis direction.
- the main conductor 24c is provided on the surface of the line portion 18c-c, and extends along the x-axis direction.
- the main conductor 24d is provided on the surface of the line portion 18c-d and extends along the y-axis direction.
- the main conductor 24e is provided on the surface of the line portion 18c-e, and extends along the x-axis direction.
- the main conductors 24a to 24e are connected so as to be arranged in this order.
- the terminal conductor 24f is provided on the surface of the connecting portion 18c-f and forms a rectangular ring.
- the terminal conductor 24f is connected to the end of the main conductor 24a on the negative direction side in the x-axis direction.
- the terminal conductor 24g is provided on the surface of the connecting portion 18c-g and forms a rectangular ring.
- the terminal conductor 24g is connected to the end of the main conductor 24e on the positive side in the x-axis direction.
- the main conductors 24a to 24e are provided with a plurality of rectangular openings 30 extending in the x-axis direction. Further, a portion sandwiched between the openings 30 in the main conductors 24a to 24e is referred to as a bridge portion 90.
- the bridge part 90 is a linear conductor extending in the y-axis direction.
- the main conductors 24a to 24e form a ladder shape.
- the plurality of openings 30 and the plurality of bridge portions 90 alternately overlap with the signal line 20 when viewed in plan from the z-axis direction. In the present embodiment, the signal line 20 crosses the opening 30 and the bridge portion 90.
- the auxiliary ground conductor 24 is designed for fine adjustment so that the characteristic impedance of the high-frequency signal line 10 is 50 ⁇ . Furthermore, the interval in the x-axis direction of the bridge portion 90 of the auxiliary ground conductor 24 is designed so that no radiation noise is generated within the use band.
- the signal line 20 is sandwiched between the reference ground conductor 22 and the auxiliary ground conductor 24 from both sides in the z-axis direction. That is, the signal line 20, the reference ground conductor 22, and the auxiliary ground conductor 24 have a triplate type stripline structure. Further, the distance (distance in the z-axis direction) between the signal line 20 and the reference ground conductor 22 is substantially equal to the thickness T1 of the dielectric sheet 18a as shown in FIGS. 7 and 8, for example, 50 ⁇ m to 300 ⁇ m. . In the present embodiment, the distance between the signal line 20 and the reference ground conductor 22 is 100 ⁇ m.
- the distance (distance in the z-axis direction) between the signal line 20 and the auxiliary ground conductor 24 is substantially equal to the thickness T2 of the dielectric sheet 18b as shown in FIGS. 7 and 8, for example, 10 ⁇ m to 100 ⁇ m. .
- the distance between the signal line 20 and the auxiliary ground conductor 24 is 50 ⁇ m. That is, the distance between the auxiliary ground conductor 24 and the signal line 20 in the z-axis direction is designed to be smaller than the distance between the reference ground conductor 22 and the signal line 20 in the z-axis direction.
- the external terminal 16a is a rectangular conductor formed at the center on the surface of the connecting portion 18a-f. Therefore, the external terminal 16a overlaps with the end portion on the negative direction side in the x-axis direction of the line conductor 20f of the signal line 20 when viewed in plan from the z-axis direction.
- the external terminal 16b is a rectangular conductor formed at the center on the surface of the connecting portion 18a-g. Therefore, the external terminal 16b overlaps with the end portion on the positive direction side in the x-axis direction of the line conductor 20g of the signal line 20 when viewed in plan from the z-axis direction.
- External terminals 16a and 16b are made of a metal material having a small specific resistance mainly composed of silver or copper. Further, Ni / Au plating is applied to the surfaces of the external terminals 16a and 16b. Here, the external terminals 16a and 16b are formed on the surface of the dielectric sheet 18a. The metal foil formed by plating on the surface of the dielectric sheet 18a is patterned to form the external terminals 16a and 16b. It indicates that the external terminals 16a and 16b are formed by patterning the metal foil attached to the surface of the dielectric sheet 18a.
- the surface roughness of the surface where the external terminals 16a and 16b are in contact with the dielectric sheet 18a is the same as that of the external terminals 16a and 16b. It becomes larger than the surface roughness of the non-contact surface.
- the via-hole conductor b1 passes through the connecting portion 18a-f of the dielectric sheet 18a in the z-axis direction, and the end of the external terminal 16a and the line conductor 20f on the negative direction side in the x-axis direction. And connected.
- the via-hole conductor b2 passes through the connecting portions 18a-g of the dielectric sheet 18a in the z-axis direction, and is the end of the external terminal 16b and the line conductor 20g on the positive side in the x-axis direction. And connected. Thereby, the signal line 20 is connected between the external terminals 16a and 16b.
- the via-hole conductors b1 and b2 are formed by filling a metal material in a through hole formed in the dielectric sheet 18a.
- the plurality of via-hole conductors B1 penetrate the line portions 18a-a, 18a-b, 18a-c, and 18a-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B1 are provided on the positive side in the y-axis direction with respect to the bridge portions 90 in the line portions 18aa and 18a-e. Are in a row.
- the plurality of via-hole conductors B1 are provided on the positive side in the x-axis direction with respect to the bridge portions 90 in the line portions 18a-b, and are arranged in a line in the x-axis direction. Yes. Further, as shown in FIG.
- the plurality of via-hole conductors B1 are provided on the negative direction side in the y-axis direction with respect to the bridge portions 90 in the line portions 18a-c, and are arranged in a line in the x-axis direction. Yes. However, the via-hole conductor B1 is not provided in the line portions 18a-d as shown in FIG.
- the plurality of via-hole conductors B2 penetrate the line portions 18b-a, 18b-b, 18b-c, and 18b-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B2 are provided on the positive side in the y-axis direction from the bridge portions 90 in the line portions 18b-a and 18b-e. Are in a row.
- the plurality of via-hole conductors B2 are provided on the positive side in the x-axis direction with respect to each bridge portion 90 in the line portion 18b-b, and are arranged in a line in the x-axis direction. Yes. Further, as shown in FIG.
- the plurality of via-hole conductors B2 are provided on the negative direction side in the y-axis direction from the bridge portions 90 in the line portions 18b-c, and are arranged in a line in the x-axis direction. Yes. However, the via-hole conductor B2 is not provided in the line portion 18b-d as shown in FIG.
- the via-hole conductor B1 and the via-hole conductor B2 constitute one via-hole conductor by being connected to each other, and connect the reference ground conductor 22 and the auxiliary ground conductor 24.
- the via-hole conductors B1 and B2 are formed by filling a metal material in through holes formed in the dielectric sheets 18a and 18b.
- the plurality of via-hole conductors B3 penetrate the line portions 18a-a, 18a-c, 18a-d, and 18a-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B3 are provided on the negative direction side in the y-axis direction from the bridge portions 90 in the line portions 18a-a and 18a-e. Are in a row.
- the plurality of via-hole conductors B3 are provided on the positive side in the y-axis direction with respect to the bridge portions 90 in the line portions 18a-c, and are arranged in a line in the x-axis direction. Yes.
- the plurality of via-hole conductors B3 are provided on the negative direction side in the x-axis direction with respect to the bridge portions 90 in the line portions 18a-d, and are arranged in a line in the y-axis direction. Yes. However, the via-hole conductor B3 is not provided in the line portions 18a-b as shown in FIG.
- the plurality of via-hole conductors B4 penetrate the line portions 18b-a, 18b-c, 18b-d, and 18b-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B4 are provided on the negative direction side in the y-axis direction from the bridge portions 90 in the line portions 18b-a and 18b-e. Are in a row.
- the plurality of via-hole conductors B4 are provided on the positive side in the y-axis direction with respect to the bridge portions 90 in the line portions 18b-c, and are arranged in a line in the x-axis direction. Yes. Further, as shown in FIG.
- the plurality of via-hole conductors B4 are provided on the negative direction side in the x-axis direction from the bridge portions 90 in the line portions 18b-d, and are arranged in a line in the y-axis direction. Yes. However, the via-hole conductor B4 is not provided in the line portion 18b-b as shown in FIG.
- the via-hole conductor B3 and the via-hole conductor B4 constitute one via-hole conductor by being connected to each other, and connect the reference ground conductor 22 and the auxiliary ground conductor 24.
- the via-hole conductors B3 and B4 are formed by filling a metal material in through holes formed in the dielectric sheets 18a and 18b.
- the via-hole conductors B1 and B2 are, as shown in FIG. 6, the positive side of the signal line 20 in the x-axis direction relative to the line conductor 20d of the signal line 20 when viewed in plan from the z-axis direction. Is not provided. That is, when viewed in plan from the z-axis direction, via hole conductors are not provided in regions closer to the line portions 12c and 12e than the line conductor 20d in the line portion 12d.
- the via-hole conductors B3 and B4 are provided on the negative side of the signal line 20 in the x-axis direction with respect to the line conductor 20b of the signal line 20 when viewed in plan from the z-axis direction. It is not done. That is, when viewed in plan from the z-axis direction, via hole conductors are not provided in regions closer to the line portions 12a and 12c than the line conductor 20b in the line portion 12b.
- the protective layer 14 is an insulating film that covers substantially the entire surface of the dielectric sheet 18a. Thereby, the protective layer 14 covers the reference ground conductor 22.
- the protective layer 14 is made of a flexible resin such as a resist material, for example.
- the protective layer 14 includes line portions 14a to 14e and connection portions 14f and 14g.
- the line portions 14a to 14e cover the main conductors 22a to 22e by covering the entire surface of the line portions 18a-a to 18a-e.
- the connecting portion 14f is connected to the end portion on the negative side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-f.
- openings Ha to Hd are provided in the connection portion 14f.
- the opening Ha is a rectangular opening provided in the center of the connection portion 14f.
- the external terminal 16a is exposed to the outside through the opening Ha.
- the opening Hb is a rectangular opening provided on the positive side in the y-axis direction with respect to the opening Ha.
- the opening Hc is a rectangular opening provided on the negative direction side in the x-axis direction from the opening Ha.
- the opening Hd is a rectangular opening provided on the negative side in the y-axis direction with respect to the opening Ha.
- the terminal conductor 22f functions as an external terminal by being exposed to the outside through the openings Hb to Hd.
- the connecting portion 14g is connected to the end portion on the positive side in the x-axis direction of the line portion 14e and covers the surface of the connecting portion 18a-g.
- openings He to Hh are provided in the connection portion 14g.
- the opening He is a rectangular opening provided in the center of the connecting portion 14g.
- the external terminal 16b is exposed to the outside through the opening He.
- the opening Hf is a rectangular opening provided on the positive direction side in the y-axis direction with respect to the opening He.
- the opening Hg is a rectangular opening provided closer to the positive direction side in the x-axis direction than the opening He.
- the opening Hh is a rectangular opening provided on the negative side in the y-axis direction with respect to the opening He.
- the terminal conductor 22g functions as an external terminal by being exposed to the outside through the openings Hf to Hh.
- the characteristic impedance of the signal line 20 periodically varies between the impedance Z1 and the impedance Z2. More specifically, a relatively small capacitance is formed between the signal line 20, the reference ground conductor 22, and the auxiliary ground conductor 24 at a portion overlapping the opening 30 in the signal line 20. Therefore, the characteristic impedance of the portion of the signal line 20 that overlaps the opening 30 is a relatively high impedance Z1.
- the characteristic impedance of the portion of the signal line 20 that overlaps the bridge portion 90 is a relatively low impedance Z2.
- the openings 30 and the bridge portions 90 are alternately arranged in the x-axis direction. Therefore, the characteristic impedance of the signal line 20 periodically varies between the impedance Z1 and the impedance Z2.
- the impedance Z1 is, for example, 55 ⁇
- the impedance Z2 is, for example, 45 ⁇ .
- the average characteristic impedance of the entire signal line 20 is, for example, 50 ⁇ .
- FIG. 9 is an external perspective view of the connector 100 b of the high-frequency signal transmission line 10.
- FIG. 10 is a cross-sectional structure diagram of the high-frequency signal transmission line 10.
- the connector 100b includes a connector body 102, external terminals 104 and 106, a central conductor 108, and an external conductor 110 as shown in FIGS.
- the connector main body 102 has a shape in which a cylindrical member is connected to a rectangular plate member, and is made of an insulating material such as a resin.
- the external terminal 104 is provided at a position facing the external terminal 16b on the negative side surface in the z-axis direction of the plate member of the connector main body 102.
- the external terminal 106 is provided at a position corresponding to the terminal conductor 22g exposed through the openings Hf to Hh on the negative side surface in the z-axis direction of the plate member of the connector main body 102.
- the center conductor 108 is provided at the center of the cylindrical member of the connector main body 102 and is connected to the external terminal 104.
- the center conductor 108 is a signal terminal for inputting or outputting a high frequency signal.
- the external conductor 110 is provided on the inner peripheral surface of the cylindrical member of the connector main body 102 and is connected to the external terminal 106.
- the outer conductor 110 is a ground terminal that is maintained at a ground potential.
- the connector 100b configured as described above is provided on the surface of the connecting portion 12g so that the external terminal 104 is connected to the external terminal 16b and the external terminal 106 is connected to the terminal conductor 22g.
- the signal line 20 is electrically connected to the central conductor 108.
- the reference ground conductor 22 and the auxiliary ground conductor 24 are electrically connected to the external conductor 110.
- FIG. 11 is a plan view of the electronic device 200 using the high-frequency signal transmission line 10 from the y-axis direction.
- FIG. 12 is a plan view of the electronic device 200 using the high-frequency signal transmission line 10 from the z-axis direction.
- FIG. 13 is a diagram showing the high-frequency signal line 10 when attached to the circuit boards 202a and 202b.
- the high-frequency signal line 10 is used in an electronic device 200 as shown in FIGS.
- the electronic device 200 includes the high-frequency signal line 10, circuit boards 202 a and 202 b, receptacles 204 a and 204 b, a battery pack (metal body) 206, and a housing 210.
- the housing 210 accommodates the high-frequency signal line 10, the circuit boards 202a and 202b, the receptacles 204a and 204b, and the battery pack 206.
- the circuit board 202a is provided with, for example, a transmission circuit or a reception circuit including an antenna.
- a power supply circuit is provided on the circuit board 202b.
- the battery pack 206 is a lithium ion secondary battery, for example, and has a structure in which the surface is covered with a metal cover.
- the circuit board 202a, the battery pack 206, and the circuit board 202b are arranged in this order from the negative direction side to the positive direction side in the x-axis direction.
- the receptacles 204a and 204b are provided on the main surfaces of the circuit boards 202a and 202b on the negative side in the z-axis direction, respectively.
- Connectors 100a and 100b are connected to receptacles 204a and 204b, respectively.
- a high frequency signal having a frequency of, for example, 2 GHz transmitted between the circuit boards 202a and 202b is applied to the central conductor 108 of the connectors 100a and 100b via the receptacles 204a and 204b.
- the external conductor 110 of the connectors 100a and 100b is kept at the ground potential via the circuit boards 202a and 202b and the receptacles 204a and 204b.
- the high-frequency signal transmission line 10 connects between the circuit boards 202a and 202b.
- the surface of the dielectric body 12 (more precisely, the protective layer 14) is in contact with the battery pack 206.
- the dielectric body 12 and the battery pack 206 are fixed with an adhesive or the like.
- the surface of the dielectric body 12 is a main surface located on the reference ground conductor 22 side with respect to the signal line 20. Therefore, the solid reference ground conductor 22 is located between the signal line 20 and the battery pack 206.
- the connector 100a when attaching the high-frequency signal line 10 to the circuit boards 202a and 202b, the connector 100a is pulled in the negative direction side in the x-axis direction, and the connector 100b is pulled in the positive direction side in the x-axis direction.
- the line part 12a is pulled to the negative direction side in the x-axis direction
- the line part 12e is pulled to the positive direction side in the x-axis direction. Therefore, the end on the positive direction side in the x-axis direction of the line portion 12c is pulled to the negative direction side in the x-axis direction by the line portion 12a via the line portion 12b, and the negative direction side in the x-axis direction of the line portion 12c.
- the end is pulled to the negative side in the x-axis direction by the line portion 12e via the line portion 12d.
- the line portion 12c rotates counterclockwise when viewed from the positive side in the y-axis direction, and the line portions 12b and 12d are twisted.
- the distance between the connectors 100a and 100b in FIG. 13 in the pulled state becomes longer than the distance between the connectors 100a and 100b in FIG. Therefore, since the length of the high-frequency signal transmission line 10 can be adjusted to a certain value, the connectors 100a and 100b can be easily attached to the connectors 204a and 204b.
- dielectric sheets 18a to 18c made of a thermoplastic resin having a copper foil (metal film) formed on the entire surface are prepared. Specifically, copper foil is attached to the surfaces of the dielectric sheets 18a to 18c. Further, the surface of the copper foil of the dielectric sheets 18a to 18c is smoothed by, for example, applying a zinc plating for rust prevention.
- the dielectric sheets 18a to 18c are liquid crystal polymers. The thickness of the copper foil is 10 ⁇ m to 20 ⁇ m.
- the external terminals 16a and 16b and the reference ground conductor 22 shown in FIGS. 2 to 6 are formed on the surface of the dielectric sheet 18a.
- a resist having the same shape as the external terminals 16a and 16b and the reference ground conductor 22 shown in FIGS. 2 to 6 is printed on the copper foil on the surface of the dielectric sheet 18a.
- the copper foil of the part which is not covered with the resist is removed by performing an etching process with respect to copper foil. Thereafter, a resist removing solution is sprayed to remove the resist.
- the external terminals 16a and 16b and the reference ground conductor 22 as shown in FIGS. 2 to 6 are formed on the surface of the dielectric sheet 18a by a photolithography process.
- the signal line 20 shown in FIGS. 2 to 6 is formed on the surface of the dielectric sheet 18b. Further, the auxiliary ground conductor 24 shown in FIGS. 2 to 6 is formed on the surface of the dielectric sheet 18c.
- the formation process of the signal line 20 and the auxiliary ground conductor 24 is the same as the formation process of the external terminals 16a and 16b and the reference ground conductor 22, the description thereof is omitted.
- a through hole is formed by irradiating a laser beam to a position where the via hole conductors b1, b2, B1 to B4 of the dielectric sheets 18a and 18b are formed. Then, the through hole is filled with a conductive paste to form via-hole conductors b1, b2, B1 to B4.
- the dielectric sheets 18a to 18c are stacked in this order from the positive direction side in the z-axis direction to the negative direction side to form the dielectric element body 12. Then, the dielectric sheets 18a to 18c are integrated by applying heat and pressure to the dielectric sheets 18a to 18c from the positive and negative directions in the z-axis direction.
- a protective layer 14 covering the reference ground conductor 22 is formed on the surface of the dielectric sheet 18a by applying a resin (resist) paste by screen printing.
- the connectors 100a and 100b are mounted on the external terminals 16a and 16b and the terminal conductors 22f and 22g on the connection portions 12f and 12g using solder. Thereby, the high frequency signal track 10 shown in FIG. 1 is obtained.
- the long side on the negative direction side in the x-axis direction of the line portion 12b is connected to the end portion on the positive direction side in the x-axis direction of the line portion 12a and the end portion on the positive direction side in the x-axis direction of the line portion 12c. . For this reason, a large twist occurs in a region on the negative direction side in the x-axis direction with respect to the line conductor 20b in the line portion 12b.
- a via-hole conductor is not provided in a region on the negative direction side in the x-axis direction with respect to the line conductor 20 b in the line portion 12 b. As a result, the via hole conductor is prevented from being damaged by twisting the line portion 12b.
- the line portion 12d is also twisted.
- the long side on the positive direction side in the x-axis direction of the line portion 12d is connected to the end portion on the negative direction side in the x-axis direction of the line portion 12c and the end portion on the negative direction side in the x-axis direction of the line portion 12e. . Therefore, a large twist occurs in the region on the positive side in the x-axis direction with respect to the line conductor 20d in the line portion 12d.
- the via-hole conductor is not provided in the region on the positive side in the x-axis direction with respect to the line conductor 20d in the line portion 12d. Thereby, the via hole conductor is prevented from being damaged by twisting the line portion 12d.
- the via-hole conductors B1 to B4 are provided in the line portions 12a, 12c, and 12e, the ground potential can be stabilized in those portions.
- the high-frequency signal transmission line 10 it is possible to reduce the thickness. More specifically, in the high-frequency signal transmission line 10, an opening 30 is provided in the auxiliary ground conductor 24. This makes it difficult for a capacitance to be formed between the signal line 20 and the auxiliary ground conductor 24. Therefore, even if the distance between the signal line 20 and the auxiliary ground conductor 24 in the z-axis direction is reduced, the capacitance formed between the signal line 20 and the auxiliary ground conductor 24 does not become too large. Therefore, the characteristic impedance of the signal line 20 is unlikely to deviate from a predetermined characteristic impedance (for example, 50 ⁇ ). As a result, according to the high frequency signal line 10, it is possible to reduce the thickness while maintaining the characteristic impedance of the signal line 20 at a predetermined characteristic impedance.
- a predetermined characteristic impedance for example, 50 ⁇
- the high frequency signal line 10 when the high frequency signal line 10 is attached to a metal body such as the battery pack 206, the characteristic impedance of the signal line 20 is suppressed from fluctuating. More specifically, the high-frequency signal line 10 is attached to the battery pack 206 so that the solid reference ground conductor 22 is positioned between the signal line 20 and the battery pack 206. As a result, the signal line 20 and the battery pack 206 do not face each other through the opening, and the formation of a capacitance between the signal line 20 and the battery pack 206 is suppressed. As a result, the high frequency signal line 10 is affixed to the battery pack 206, thereby suppressing the characteristic impedance of the signal line 20 from being lowered.
- FIG. 14 and 15 are exploded views of the high-frequency signal transmission line 10a according to the first modification.
- FIG. 1 is used about the external appearance perspective view of the high frequency signal transmission line 10a which concerns on a 1st modification.
- the high frequency signal line 10a is different from the high frequency signal line 10 in that the via hole conductors B1 to B4 are not provided in the line portions 12b and 12d.
- the high-frequency signal transmission line 10a will be described focusing on the difference.
- the via-hole conductors B1 to B4 are not provided on the positive side and the negative side of the line conductor 20b in the x-axis direction.
- the via-hole conductors B1 to B4 are not provided on the positive side and the negative side in the x-axis direction of the line conductor 20d.
- via-hole conductors B1 to B4 are provided in the line portions 12a, 12c, and 12e, but no via-hole conductor is provided in the line portions 12b and 12d in which twisting occurs. . Thereby, it is more effectively suppressed that the via-hole conductor is damaged.
- FIG. 16 to 20 are exploded views of the high-frequency signal transmission line 10b according to the second modification.
- FIG. 1 is used for the external perspective view of the high-frequency signal transmission line 10b according to the second modification.
- the high-frequency signal line 10 b is different from the high-frequency signal line 10 in the shapes of the signal line 20 and the auxiliary ground conductor 24.
- the high-frequency signal transmission line 10b will be described focusing on the difference.
- the main conductors 24a and 24e of the auxiliary ground conductor 24 are provided with a plurality of openings 30 and 32 each having a parallelogram shape extending in the x-axis direction, as shown in FIGS. More specifically, the main conductors 24a and 24e have a plurality of connection portions 70 and 72, sides 74 and 76, and a plurality of bridge portions 78, 80, 86, and 88.
- the side 74 is a linear conductor that forms a negative side of the main conductor 24a in the y-axis direction, and extends in the x-axis direction.
- the side 76 is a linear conductor constituting the side on the positive direction side in the y-axis direction of the main conductor 24a, and extends in the x-axis direction.
- the plurality of connecting portions 70 protrude from the side 74 to the positive direction side in the y-axis direction and have a semicircular shape.
- the plurality of connection portions 70 are arranged in a line at equal intervals in the x-axis direction.
- the plurality of connecting portions 72 protrude from the side 76 to the negative direction side in the y-axis direction and have a semicircular shape.
- the plurality of connection portions 72 are arranged in a line at equal intervals in the x-axis direction.
- connection part 70 and the connection part 72 are provided at different positions in the x-axis direction.
- the connection portions 70 and the connection portions 72 are alternately arranged in the x-axis direction.
- the connection part 72 is located in the middle of the two connection parts 70 adjacent in the x-axis direction in the x-axis direction.
- the connection part 70 is located in the middle of two connection parts 72 adjacent in the x-axis direction in the x-axis direction.
- the bridge portion 78 is a linear conductor that is inclined so as to advance from the connection portion 70 to the positive direction side in the y-axis direction and to the positive direction side in the x-axis direction, and is connected to the side 76.
- the bridge portion 80 is a linear conductor that is inclined so as to advance from the connection portion 72 to the negative direction side in the y-axis direction and to the negative direction side in the x-axis direction, and is connected to the side 74.
- the bridge part 78 and the bridge part 80 are parallel. Thereby, an opening 30 is formed in a region surrounded by the sides 74 and 76 and the bridge portions 78 and 80.
- the bridge portion 86 is a linear conductor that is inclined so as to advance from the connection portion 72 in the negative direction side in the y-axis direction to the positive direction side in the x-axis direction, and is connected to the side 74.
- the bridge portion 88 is a linear conductor that is inclined so as to advance from the connection portion 70 toward the positive direction side in the y-axis direction while traveling toward the negative direction side in the x-axis direction, and is connected to the side 76.
- the bridge part 86 and the bridge part 88 are parallel. Thereby, the opening 32 is formed in a region surrounded by the sides 74 and 76 and the bridge portions 86 and 88.
- a notch C1 is provided in the side 74 of the main conductors 24a and 24e.
- the notch C ⁇ b> 1 is provided on the negative side in the y-axis direction with respect to the connection portion 72 in the main conductors 24 a and 24 e. As a result, the side 74 is separated at the notch C1.
- a notch C2 is provided in the side 76 of the main conductors 24a and 24e.
- the notch C2 is provided on the positive side in the y-axis direction with respect to the connecting portion 70 in the main conductors 24a and 24e. As a result, the side 76 is separated at the notch C2.
- the main conductor 24c of the auxiliary ground conductor 24 is provided with a plurality of openings 30 and 32 having a parallelogram shape extending in the x-axis direction, as shown in FIG.
- the main conductor 24c has a structure in which the main conductors 24a and 24e are rotated 180 degrees around the z-axis. Therefore, detailed description of the main conductor 24c is omitted.
- the main conductor 24b of the auxiliary ground conductor 24 has a connecting portion 72, a side 76, and a plurality of bridge portions 80 and 86, as shown in FIG.
- the side 76 is a linear conductor that constitutes a side on the positive direction side in the x-axis direction of the main conductor 24b, and extends in the y-axis direction.
- the connecting portion 72 protrudes from the side 76 to the negative direction side in the x-axis direction and has a semicircular shape.
- the connecting portion 72 is provided at the center of the side 76 in the y-axis direction.
- the bridge portion 80 is a linear conductor that is inclined so as to advance from the connection portion 72 to the negative direction side in the x-axis direction and to the positive direction side in the y-axis direction.
- the bridge portion 80 is connected to the side 74 of the line portion 12a.
- the bridge portion 86 is a linear conductor that is inclined so as to travel from the connection portion 72 to the negative direction side in the y-axis direction while traveling from the negative direction side in the x-axis direction.
- the bridge portion 86 is connected to the side 74 of the line portion 12c.
- the side 74 is not provided in the main conductor 24b. Thereby, the notch C1 is provided.
- the main conductor 24d of the auxiliary ground conductor 24 has a connecting portion 70, a side 74, and a plurality of bridge portions 78 and 88, as shown in FIG.
- the side 74 is a linear conductor that forms a side on the negative direction side in the x-axis direction of the main conductor 24d, and extends in the y-axis direction.
- the connecting portion 70 protrudes from the side 74 toward the positive direction in the x-axis direction, and has a semicircular shape.
- the connecting portion 70 is provided at the center of the side 74 in the y-axis direction.
- the bridge portion 78 is a linear conductor that is inclined so as to travel from the connecting portion 70 toward the positive direction side in the x-axis direction while traveling toward the negative direction side in the y-axis direction.
- the bridge portion 78 is connected to the side 76 of the line portion 12e.
- the bridge portion 88 is a linear conductor that is inclined so as to advance from the connection portion 70 to the positive direction side in the y-axis direction while proceeding to the positive direction side in the x-axis direction.
- the bridge portion 88 is connected to the side 76 of the line portion 12c.
- the side 76 is not provided in the main conductor 24d. Thereby, the notch C2 is provided.
- the plurality of via-hole conductors B11 penetrate the line portions 18a-a, 18a-c, 18a-d, and 18a-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B11 are arranged on the negative side in the y-axis direction with respect to the center line L in the y-axis direction of the line portions 12a and 12e in the line portions 18a-a and 18a-e. Are arranged in a line in the x-axis direction. Further, as shown in FIG.
- the plurality of via-hole conductors B11 are provided on the positive side in the y-axis direction with respect to the center line L in the y-axis direction of the line portion 12c in the line portions 18a-c. It is lined up in the axial direction. Further, as shown in FIG. 20, the plurality of via-hole conductors B11 are provided on the negative side in the x-axis direction with respect to the center line L in the x-axis direction of the line portion 12d in the line portion 18a-d. However, the via-hole conductor B11 is not provided in the line portions 18a-b as shown in FIG.
- the plurality of via-hole conductors B12 pass through the line portions 18b-a, 18b-c, 18b-d, and 18b-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B12 are on the negative direction side in the y-axis direction with respect to the center line L in the y-axis direction of the line portions 12a and 12e in the line portions 18b-a and 18be-e. Are arranged in a line in the x-axis direction. Further, as shown in FIG.
- the plurality of via-hole conductors B12 are provided on the positive side in the y-axis direction with respect to the center line L in the y-axis direction of the line portion 12c in the line portion 18b-c. It is lined up in the axial direction. Further, as shown in FIG. 20, the plurality of via-hole conductors B12 are provided on the negative side in the x-axis direction with respect to the center line L in the x-axis direction of the line portion 12d in the line portion 18b-d. However, the via-hole conductor B12 is not provided in the line portion 18b-b as shown in FIG.
- the via-hole conductor B11 and the via-hole conductor B12 are connected to each other to form one via-hole conductor, and connect the reference ground conductor 22 and the connection portion 70 of the auxiliary ground conductor 24.
- the via-hole conductors B11 and B12 are formed by filling a metal material into through holes formed in the dielectric sheets 18a and 18b.
- the plurality of via-hole conductors B13 penetrate the line portions 18a-a, 18b-b, 18a-c, and 18a-e in the z-axis direction, as shown in FIGS.
- the plurality of via-hole conductors B13 are arranged on the positive side in the y-axis direction with respect to the center line L in the y-axis direction of the line portions 12a and 12e in the line portions 18a-a and 18a-e. Are arranged in a line in the x-axis direction. Further, as shown in FIG.
- the plurality of via-hole conductors B13 are provided on the negative side in the y-axis direction with respect to the center line L in the y-axis direction of the line portion 12c in the line portions 18a-c. It is lined up in a line in the axial direction. Further, as shown in FIG. 19, the plurality of via-hole conductors B13 are provided on the positive side in the x-axis direction with respect to the center line L in the x-axis direction of the line portion 12b in the line portions 18a-b. However, the via-hole conductor B13 is not provided in the line portions 18a-d as shown in FIG.
- the plurality of via-hole conductors B14 pass through the line portions 18b-a, 18b-b, 18b-c, and 18b-e in the z-axis direction as shown in FIGS.
- the plurality of via-hole conductors B14 are arranged in the positive direction side in the y-axis direction with respect to the center line L in the y-axis direction of the line portions 12a and 12e in the line portions 18b-a and 18be-e. Are arranged in a line in the x-axis direction. Further, as shown in FIG.
- the plurality of via-hole conductors B14 are provided on the negative side in the y-axis direction with respect to the center line L in the y-axis direction of the line portion 12c in the line portion 18b-c. It is lined up in the axial direction. As shown in FIG. 19, the plurality of via-hole conductors B14 are provided on the positive side in the x-axis direction with respect to the center line L in the x-axis direction of the line portion 12b in the line portion 18b-b. However, the via-hole conductor B14 is not provided in the line portion 18b-d as shown in FIG.
- the via-hole conductor B13 and the via-hole conductor B14 are connected to each other to form one via-hole conductor, and connect the reference ground conductor 22 and the connection portion 72 of the auxiliary ground conductor 24.
- the via-hole conductors B13 and B14 are formed by filling a metal material in through holes formed in the dielectric sheets 18a and 18b.
- a section in which the via-hole conductors B11 and B12 are provided is referred to as a section A2.
- the section A2 means a region that overlaps the via-hole conductors B11 and B12 in the y-axis direction.
- a section where the via-hole conductors B13 and B14 are provided is referred to as a section A3.
- the section A3 means a region overlapping with the via-hole conductors B13 and B14 in the y-axis direction.
- the via-hole conductors B11 and B12 and the via-hole conductors B13 and B14 are provided at different positions in the x-axis direction in the line portions 12a, 12c, and 12e.
- the via-hole conductors B11 and B12 and the via-hole conductors B13 and B14 are alternately arranged in the x-axis direction.
- the via-hole conductors B11 and B12 are located in the middle of two via-hole conductors B13 and B14 adjacent in the x-axis direction in the x-axis direction.
- the via-hole conductors B13 and B14 are located in the middle of two via-hole conductors B11 and B12 adjacent in the x-axis direction in the x-axis direction.
- a section sandwiched between the section A2 and the section A3 is referred to as a section A1.
- the section A1 is a section where the via-hole conductors B11 to B14 are not provided.
- the signal line 20 meanders as shown in FIGS. First, the line conductors 20a and 20e in the line portions 12a and 12e will be described.
- the line conductors 20a and 20e in the section A1 are located closer to the negative direction side in the y-axis direction than the line conductors 20a and 20e in the section A2. Furthermore, the line conductors 20a and 20e in the section A1 are located on the positive side in the y-axis direction with respect to the line conductors 20a and 20e in the section A3. As a result, the signal line 20 bypasses the via-hole conductors B11 and B12 and the via-hole conductors B13 and B14.
- the line conductors 20a and 20e have thick line portions 50, 52, and 54 and thin line portions 56, 58, 60, and 62.
- the line width of the thick line portions 50, 52, 54 is the line width W1.
- the line width of the thin line portions 56, 58, 60, 62 is the line width W2.
- the line width W1 is larger than the line width W2.
- the thick line portion 50 extends in the x-axis direction on the center line L in the y-axis direction of the line portions 18b-a and 18b-e in the section A1.
- the thick line portion 50 overlaps the openings 30 and 32 when viewed in plan from the z-axis direction. Therefore, the thick line portion 50 does not overlap the auxiliary ground conductor 24 when viewed in plan from the z-axis direction.
- the thick line part 52 extends in the x-axis direction in the positive direction side in the y-axis direction from the center line L in the y-axis direction of the line parts 18b-a and 18b-e in the section A2. However, both ends in the x-axis direction of the thick line portion 52 protrude into the section A1.
- the thick line portion 52 overlaps the notch C2 when viewed in plan from the z-axis direction. Therefore, the thick line portion 52 does not overlap the auxiliary ground conductor 24 when viewed in plan from the z-axis direction.
- the thick line portion 54 extends in the x-axis direction in the negative direction side in the y-axis direction from the center line L in the y-axis direction of the line portions 18b-a and 18b-e in the section A3. However, both ends of the thick line portion 54 in the x-axis direction protrude into the section A1.
- the thick line portion 54 overlaps the notch C1 when viewed in plan from the z-axis direction. Therefore, the thick line portion 54 does not overlap the auxiliary ground conductor 24 when viewed in plan from the z-axis direction. Both ends of the thick line portions 50, 52, 54 as described above are tapered.
- the thin line portion 56 connects the end portion on the positive direction side in the x-axis direction of the thick line portion 52 and the end portion on the negative direction side in the x-axis direction of the thick line portion 50 in the section A1.
- the thin line portion 56 is inclined so as to advance toward the positive direction side in the x-axis direction while proceeding toward the negative direction side in the y-axis direction. Further, as shown in FIGS. 16 and 17, the thin line portion 56 overlaps the bridge portion 78 when viewed in plan from the y-axis direction.
- the thin line portion 58 connects the end portion on the positive side in the x-axis direction of the thick line portion 50 and the end portion on the negative direction side in the x-axis direction of the thick line portion 54 in the section A1.
- the thin wire portion 58 is inclined so as to advance toward the positive direction side in the x-axis direction while proceeding toward the negative direction side in the y-axis direction. Further, as shown in FIGS. 16 and 17, the thin line portion 58 overlaps the bridge portion 80 when viewed in plan from the y-axis direction.
- the fine line portion 60 connects the end portion on the positive direction side in the x-axis direction of the thick line portion 50 and the end portion on the negative direction side in the x-axis direction of the thick line portion 52 in the section A1.
- the thin line portion 60 is inclined so as to advance toward the positive direction side in the x-axis direction while traveling toward the positive direction side in the y-axis direction. Further, as shown in FIGS. 16 and 17, the thin line portion 60 overlaps the bridge portion 88 when viewed in plan from the y-axis direction.
- the thin line portion 62 connects the end portion on the positive direction side in the x-axis direction of the thick line portion 54 and the end portion on the negative direction side in the x-axis direction of the thick line portion 50 in the section A1.
- the thin wire portion 62 is inclined so as to advance toward the positive direction side in the x-axis direction while traveling toward the positive direction side in the y-axis direction. Further, as shown in FIGS. 16 and 17, the thin line portion 62 overlaps with the bridge portion 86 when viewed in plan from the y-axis direction.
- the line conductor 20c has a structure in which the line conductors 20a and 20e are rotated 180 degrees around the z axis. Therefore, detailed description of the line conductor 20c is omitted.
- the line conductor 20b in the line portion 12b bypasses the via-hole conductors B13 and B14 as shown in FIG. More specifically, the line conductor 20 b has a thick line portion 54 and thin line portions 58 and 62.
- the line width of the thick line portion 54 is the line width W1.
- the line width of the thin line portions 58 and 62 is the line width W2.
- the line width W1 is larger than the line width W2.
- the thick line portion 54 extends in the y-axis direction on the negative side in the x-axis direction from the center line L in the x-axis direction of the line portion 18b-b at the center in the y-axis direction of the line portion 12b.
- the thick line portion 54 overlaps the notch C1 when viewed in plan from the z-axis direction. Therefore, the thick line portion 54 does not overlap the auxiliary ground conductor 24 when viewed in plan from the z-axis direction. Both ends of the thick line portion 54 as described above are tapered.
- the fine line portion 58 connects the end portion on the positive side in the y-axis direction of the thick line portion 54 and the end portion on the positive direction side in the x-axis direction of the thick line portion 50 of the line portion 12a. Further, as shown in FIG. 19, the thin line portion 58 overlaps the bridge portion 80 when viewed in plan from the y-axis direction.
- the fine line portion 62 connects the end portion on the negative direction side in the y-axis direction of the thick line portion 54 and the end portion on the positive direction side in the x-axis direction of the thick line portion 50 of the line portion 12c. Further, as shown in FIG. 19, the thin line portion 62 overlaps the bridge portion 86 when viewed in plan from the y-axis direction.
- the line conductor 20d in the line portion 12d bypasses the via-hole conductors B11 and B12 as shown in FIG. More specifically, the line conductor 20 d has a thick line portion 52 and thin line portions 56 and 60.
- the line width of the thick line portion 52 is the line width W1.
- the line width of the thin line portions 56 and 60 is the line width W2.
- the line width W1 is larger than the line width W2.
- the thick line portion 52 extends in the y-axis direction on the positive side in the x-axis direction from the center line L in the x-axis direction of the line portion 18b-d at the center in the y-axis direction of the line portion 12d.
- the thick line portion 52 overlaps the notch C2 when viewed in plan from the z-axis direction. Therefore, the thick line portion 52 does not overlap the auxiliary ground conductor 24 when viewed in plan from the z-axis direction. Both ends of the thick line portion 52 as described above are tapered.
- the thin line portion 56 connects the end portion on the negative direction side in the y-axis direction of the thick line portion 52 and the end portion on the negative direction side in the x-axis direction of the thick line portion 50 of the line portion 12e. Further, as shown in FIG. 20, the thin line portion 56 overlaps the bridge portion 78 when viewed in plan from the y-axis direction.
- the fine line portion 60 connects the end portion on the positive direction side in the y-axis direction of the thick line portion 52 and the end portion on the negative direction side in the x-axis direction of the thick line portion 50 of the line portion 12c. Further, as shown in FIG. 20, the thin line portion 60 overlaps the bridge portion 88 when viewed in plan from the y-axis direction.
- the via-hole conductor can be prevented from being damaged, as with the high-frequency signal line 10. Further, according to the high-frequency signal line 10 b, it is not necessary to form two via-hole conductors along the signal line 20 unlike the high-frequency signal line 10. Therefore, the width of the signal line 20 can be increased, and transmission loss can be reduced. Further, unlike the high-frequency signal line 10, there is no need to change the arrangement balance of the via-hole conductors in the line parts 12b and 12d. Therefore, in the line portions 12b and 12d, it is possible to suppress the balance between the other line portions and the ground potential from being lost.
- FIG. 21 is a plan view of the high-frequency signal transmission line 10c according to the third modification from the z-axis direction.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high-frequency signal line 10c is different from the high-frequency signal line 10 in the configuration of the connection portions of the line portions 12a to 12c and the connection portions of the line portions 12c to 12e.
- the high-frequency signal transmission line 10c will be described focusing on the difference.
- the inner peripheral part formed by connecting the line parts 12a to 12c is punched into a circle. Thereby, the circular hole H1 is formed. Similarly, the inner peripheral portion formed by connecting the line portions 12c to 12e is punched into a circle. Thereby, the circular hole H2 is formed.
- the via-hole conductors B1 to B4 can be prevented from being damaged, as with the high-frequency signal line 10.
- the line portion 12b is twisted, the line portion 12b is prevented from being broken from the corner of the inner peripheral portion.
- FIG. 22 is a plan view of the high-frequency signal transmission line 10d according to the fourth modification example from the z-axis direction.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high frequency signal line 10d is different from the high frequency signal line 10c at the positions of the holes H1 and H2.
- the high-frequency signal transmission line 10d will be described focusing on the difference.
- the hole H1 of the high-frequency signal line 10d is provided on the positive side in the y-axis direction with respect to the hole H1 of the high-frequency signal line 10c. Thereby, in the high-frequency signal transmission line 10d, the hole H1 does not protrude from the line part 12c but protrudes only from the line part 12a.
- the hole H2 of the high-frequency signal line 10d is provided on the negative side in the y-axis direction with respect to the hole H2 of the high-frequency signal line 10c. Thereby, in the high-frequency signal transmission line 10d, the hole H2 does not protrude from the line part 12c but protrudes only from the line part 12e.
- the via-hole conductors B1 to B4 can be prevented from being damaged, like the high-frequency signal line 10c.
- the line portion 12b is twisted, the line portion 12b is prevented from being broken from the corner of the inner peripheral portion.
- the diameters of the holes H1 and H2 of the high-frequency signal line 10d can be made smaller than the diameters of the holes H1 and H2 of the high-frequency signal line 10c. This increases the degree of freedom in designing the signal line 20, the reference ground conductor 22, the auxiliary ground conductor 24, and the via-hole conductors B1 to B4 in the line portion 12c.
- FIG. 23 is a plan view of the high-frequency signal transmission line 10e according to the fifth modification from the z-axis direction.
- FIG. 24 is a plan view of a mother laminate 300 that is an aggregate of a plurality of high-frequency signal transmission lines 10e. In FIG. 23, the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high frequency signal line 10e is different from the high frequency signal line 10 in that the outer edge is rectangular.
- the high-frequency signal transmission line 10e will be described focusing on the difference.
- a cut line C11 extending in the x-axis direction is provided on the positive side in the y-axis direction from the center of the dielectric element body 12 in the y-axis direction.
- the cut line C11 extends from the short side of the dielectric element body 12 on the negative direction side in the x-axis direction toward the positive direction side in the x-axis direction.
- the cut line C11 does not reach the short side of the dielectric body 12 on the positive direction side in the x-axis direction. Thereby, the line portions 12a to 12c are formed.
- a cut line C12 extending in the x-axis direction is provided on the negative direction side in the y-axis direction from the center in the y-axis direction of the dielectric element body 12.
- the cut line C12 extends from the short side of the dielectric element body 12 on the positive direction side in the x-axis direction toward the negative direction side in the x-axis direction.
- the cut line C12 does not reach the short side of the dielectric element body 12 on the negative direction side in the x-axis direction. Thereby, the line portions 12c to 12e are formed.
- the via-hole conductor is prevented from being damaged, like the high-frequency signal line 10a.
- the high-frequency signal transmission line 10e has a rectangular shape. Therefore, as shown in FIG. 24, the high-frequency signal transmission lines 10e can be arranged in a matrix without forming a gap in the mother laminated body 300. As a result, a larger number of high-frequency signal transmission lines 10e can be produced from the mother laminate 300.
- FIG. 25 is a plan view of the high-frequency signal transmission line 10f according to the sixth modification from the z-axis direction.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high-frequency signal line 10f has a hole H4 formed at the end on the positive direction side in the x-axis direction of the cut line C11, and a hole H5 formed at the end on the negative direction side in the x-axis direction of the cut line C12. This is different from the high-frequency signal transmission line 10e.
- the via-hole conductors B1 to B4 are suppressed from being damaged in the same manner as the high-frequency signal line 10e.
- the circular hole H4 is provided at the end on the positive direction side in the x-axis direction of the cut line C11, so that the line 12b is prevented from being broken when the line 12b is twisted. Is done.
- the circular hole H5 is provided at the end of the cut line C12 on the negative side in the x-axis direction, so that when the line portion 12d is twisted, the line portion 12d is prevented from being broken.
- FIG. 26 is a plan view of the high-frequency signal transmission line 10g according to the seventh modification example from the z-axis direction.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high-frequency signal line 10g is different from the high-frequency signal line 10e in the shape of the cut lines C11 and C12.
- the high-frequency signal transmission line 10g will be described focusing on the difference.
- the cut lines C11 and C12 are L-shaped. More specifically, the cut line C11 extends from the vicinity of the negative side in the y-axis direction toward the positive direction side in the y-axis direction on the negative side in the x-axis direction of the dielectric body 12. Later, it is bent to the positive side in the x-axis direction. Further, it is punched out so that a gap is formed between the line portion 12a and the line portion 12c.
- the cut line C12 extends from the vicinity of the positive side in the y-axis direction toward the negative side in the y-axis direction on the positive side in the x-axis direction of the dielectric body 12, and then in the x-axis direction. It is bent to the negative direction side. Further, it is punched out so that a gap is formed between the line portion 12c and the line portion 12e.
- the via-hole conductors B1 to B4 are suppressed from being damaged similarly to the high-frequency signal line 10e.
- FIG. 27 is a plan view of the high-frequency signal transmission line 10h according to the eighth modification from the z-axis direction.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high-frequency signal line 10h has a high-frequency signal line in that a gap is formed between the connection part 12f and the line part 12d and a gap is formed between the connection part 12g and the line part 12b. It is different from 10g.
- the via-hole conductors B1 to B4 are suppressed from being damaged, like the high-frequency signal line 10g.
- FIG. 28 is a plan view of the high-frequency signal transmission line 10i according to the ninth modified example from the z-axis direction.
- the boundaries of the line portions 12a to 12e are indicated by dotted lines.
- the high frequency signal line 10i is different from the high frequency signal line 10h in the length in the x-axis direction. Specifically, the length of the high-frequency signal line 10i in the x-axis direction is longer than the length of the high-frequency signal line 10h in the x-axis direction.
- the via-hole conductors B1 to B4 are suppressed from being damaged, like the high-frequency signal line 10g.
- FIG. 29A is a plan view of the line portions 12a to 12c of the high-frequency signal transmission line 10j according to the tenth modified example from the z-axis direction.
- FIG. 29B is a plan view of the line portions 12c to 12e of the high-frequency signal transmission line 10j according to the tenth modification from the z-axis direction.
- the high frequency signal line 10j is different from the high frequency signal line 10a in the interval between the via-hole conductors.
- the high-frequency signal transmission line 10j will be described focusing on the difference.
- the via-hole conductor provided closest to the end on the positive side in the x-axis direction in the line portion 12a is referred to as a via-hole conductor Ba.
- the via-hole conductor provided closest to the end on the positive side in the x-axis direction in the line portion 12c is referred to as a via-hole conductor Bb.
- a portion closest to the via-hole conductor Ba in the signal line 20 is defined as a portion Pa.
- a portion closest to the via-hole conductor Bb in the signal line 20 is defined as a portion Pb.
- the length La of the signal line 20 between the part Pa and the part Pb is preferably 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20, and more preferably 1 ⁇ 4 or less.
- the length La of the signal line 20 between the portion Pa and the portion Pb is 0.0375 m or less when it is 1 ⁇ 4 or less of the high-frequency signal.
- the via-hole conductor provided closest to the end portion on the negative direction side in the x-axis direction in the line portion 12c is referred to as a via-hole conductor Bc.
- the via hole conductor provided closest to the end on the negative direction side in the x-axis direction in the line portion 12e is referred to as a via hole conductor Bd.
- a portion closest to the via-hole conductor Bc in the signal line 20 is defined as a portion Pc.
- a portion closest to the via-hole conductor Bd in the signal line 20 is defined as a portion Pd.
- the length Lb of the signal line 20 between the part Pc and the part Pd is preferably 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20 and more preferably 1 ⁇ 4 or less.
- the length Lb of the signal line 20 between the portion Pc and the portion Pd is 0.0375 m or less when it is 1/4 or less of the high frequency signal. .
- the via-hole conductor is more effectively suppressed from being damaged, as with the high-frequency signal line 10a.
- the line portion 12b will be described as an example.
- the via-hole conductors Ba and Bb are close to the signal line 20 in the portions Pa and Pb, a capacitance is formed between them. Therefore, the characteristic impedance of the signal line 20 in the parts Pa and Pb is lower than the characteristic impedance of the signal line 20 between the part Pa and the part Pb. Therefore, reflection of a high frequency signal occurs in the portions Pa and Pb, and a standing wave having the portions Pa and Pb as antinodes is generated between the portion Pa and the portion Pb. Such a standing wave may cause noise.
- the length La of the signal line 20 between the portion Pa and the portion Pb is 1 ⁇ 2 or less of the wavelength of the high frequency signal transmitted through the signal line 20.
- the high-frequency signal line 10j noise is suppressed from being mixed into the high-frequency signal transmitted through the signal line 20 in and near the line portions 12b and 12d.
- the line portion 12b and the vicinity thereof will be described as an example.
- the signal line 20 is sandwiched between the reference ground conductor 22 and the auxiliary ground conductor 24 from both sides in the z-axis direction, noise is suppressed from being radiated from the signal line 20 in the z-axis direction.
- the via-hole conductor exists in the x-axis direction or the y-axis direction of the signal line 20. Therefore, noise is likely to be radiated from the signal line 20 in the x-axis direction or the y-axis direction.
- the line conductor 20a of the line portion 12a and the line conductor 20b of the line portion 12b are close to each other. Therefore, as indicated by an arrow M in FIG. 29A, when noise is radiated from the line portion 12a in the x-axis direction or the y-axis direction, the noise may be mixed into the high-frequency signal transmitted through the signal line 12b. Similarly, as indicated by an arrow M in FIG. 29A, when noise is radiated from the line portion 12b in the x-axis direction or the y-axis direction, the noise may be mixed into the high-frequency signal transmitted through the signal line 12a. As a result, the line portion 12a and the line portion 12b are electromagnetically coupled, and there is a possibility that transmission loss occurs.
- the length La of the signal line 20 between the portion Pa and the portion Pb is 1/4 or less of the wavelength of the high frequency signal transmitted through the signal line 20.
- the standing wave which has a frequency of 2 times or less of the high frequency signal transmitted through the signal line 20 between the part Pa and the part Pb is generated.
- the frequency of the high-frequency signal transmitted through the signal line 20 is 2 GHz
- the occurrence of a standing wave of 4 GHz or less is suppressed.
- the frequency of the high frequency signal transmitted through the signal line 20 is 2 GHz
- a high frequency signal having a bandwidth of 1 GHz to 3 GHz is generally transmitted to the signal line 20.
- FIG. 30A is a plan view of the line portions 12a to 12c of the high-frequency signal transmission line 10k according to the eleventh modification from the z-axis direction.
- FIG. 30B is a diagram when the line portions 12c to 12e of the high-frequency signal transmission line 10k according to the eleventh modification are viewed in plan from the z-axis direction.
- the high-frequency signal line 10k is different from the high-frequency signal line 10b in the interval between the via-hole conductors.
- the high-frequency signal transmission line 10k will be described focusing on the difference.
- the via-hole conductor provided closest to the end on the positive side in the x-axis direction in the line portion 12a is referred to as a via-hole conductor Be.
- the via-hole conductor provided closest to the end on the positive side in the x-axis direction in the line portion 12c is referred to as a via-hole conductor Bf.
- a via hole conductor provided closest to the line portion 12a in the line portion 12b is referred to as a via hole conductor Bg.
- the via-hole conductor Bg is provided closest to the line portion 12c in the line portion 12b.
- a portion closest to the via-hole conductor Be in the signal line 20 is defined as a portion Pe.
- a portion closest to the via-hole conductor Bf in the signal line 20 is defined as a portion Pf.
- a portion closest to the via-hole conductor Bg in the signal line 20 is defined as a portion Pg.
- the length Lc of the signal line 20 between the part Pe and the part Pg is preferably 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20, and more preferably 1 ⁇ 4 or less.
- the length Ld of the signal line 20 between the part Pf and the part Pg is preferably 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20 and more preferably 1 ⁇ 4 or less.
- the via-hole conductor provided closest to the end on the negative side in the x-axis direction in the line portion 12c is referred to as a via-hole conductor Bh.
- the via-hole conductor provided closest to the end on the negative direction side in the x-axis direction in the line portion 12e is referred to as a via-hole conductor Bi.
- a via hole conductor provided closest to the line portion 12c in the line portion 12d is referred to as a via hole conductor Bj.
- the via-hole conductor Bj is provided closest to the line portion 12e in the line portion 12d.
- a portion closest to the via-hole conductor Bh in the signal line 20 is defined as a portion Ph.
- a portion of the signal line 20 that is closest to the via-hole conductor Bi is defined as a portion Pi.
- a portion closest to the via-hole conductor Bj in the signal line 20 is defined as a portion Pj.
- the length Le of the signal line 20 between the part Ph and the part Pj is preferably 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20, and more preferably 1 ⁇ 4 or less.
- the length Lf of the signal line 20 between the part Pi and the part Pj is preferably 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20, and more preferably 1 ⁇ 4 or less.
- the via-hole conductor is more effectively suppressed from being damaged, like the high-frequency signal transmission line 10b.
- the line portion 12b will be described as an example.
- the via-hole conductors Be and Bg are close to the signal line 20, so that a capacitance is formed between them. Therefore, the characteristic impedance of the signal line 20 in the parts Pe and Pg is lower than the characteristic impedance of the signal line 20 between the part Pe and the part Pg. Therefore, reflection of the high-frequency signal occurs in the parts Pe and Pg, and a standing wave having the parts Pe and Pg as antinodes is generated between the parts Pe and Pg. Such a standing wave may cause noise.
- the length Lc of the signal line 20 between the part Pe and the part Pg is 1 ⁇ 2 or less of the wavelength of the high-frequency signal transmitted through the signal line 20.
- the high-frequency signal line 10k it is possible to suppress noise from being mixed into the high-frequency signal transmitted through the signal line 20 in the line portions 12b and 12d and in the vicinity thereof.
- the line portion 12b and the vicinity thereof will be described as an example.
- the signal line 20 is sandwiched between the reference ground conductor 22 and the auxiliary ground conductor 24 from both sides in the z-axis direction, noise is suppressed from being radiated from the signal line 20 in the z-axis direction.
- the via-hole conductor exists in the x-axis direction or the y-axis direction of the signal line 20. Therefore, noise is likely to be radiated from the signal line 20 in the x-axis direction or the y-axis direction.
- the line conductor 20a of the line portion 12a and the line conductor 20b of the line portion 12b are close to each other. Therefore, as shown by an arrow M in FIG. 30A, when noise is radiated from the line portion 12a in the x-axis direction or the y-axis direction, the noise may be mixed into the high-frequency signal transmitted through the signal line 12b. Similarly, as indicated by an arrow M in FIG. 30A, when noise is radiated from the line portion 12b in the x-axis direction or the y-axis direction, the noise may be mixed into the high-frequency signal transmitted through the signal line 12a. As a result, the line portion 12a and the line portion 12b are electromagnetically coupled, and there is a possibility that transmission loss occurs.
- the length Lc of the signal line 20 between the portion Pe and the portion Pg is 1 ⁇ 4 or less of the wavelength of the high-frequency signal transmitted through the signal line 20.
- a plurality of via-hole conductors B13 and B14 may be provided in the line portion 12b.
- a plurality of via-hole conductors B11 and B12 may be provided in the line portion 12d.
- the high-frequency signal line according to the present invention is not limited to the high-frequency signal lines 10, 10a to 10k, and can be changed within the scope of the gist thereof.
- the protective layer 14 is formed by screen printing, but may be formed by a photolithography process.
- the connectors 100a and 100b may not be mounted on the high-frequency signal lines 10, 10a to 10k. In this case, the ends of the high-frequency signal lines 10, 10a to 10k and the circuit board are connected by solder or the like.
- the connector 100a may be mounted only on one end of the high-frequency signal lines 10, 10a to 10k.
- a through-hole conductor may be used instead of the via-hole conductor.
- the through-hole conductor is an interlayer connection portion in which a conductor is formed on the inner peripheral surface of a through hole provided in the dielectric element body 12 by means such as plating.
- the opening 90 may not be provided in the auxiliary ground conductor 24.
- the via-hole conductors B1 to B4 need not be provided in all of the line portions 12a, 12b, and 12e, and may be provided in only at least one line portion. However, the via-hole conductors B1 to B4 are preferably provided in all of the line portions 12a, 12b, and 12e in order to stabilize the ground potential.
- the high-frequency signal lines 10, 10a to 10k may be used as high-frequency signal lines in an RF circuit board such as an antenna front end module.
- the present invention is useful for a high-frequency signal line and an electronic device including the same, and is particularly excellent in that the damage to the interlayer connection conductor can be suppressed.
- B1 to B4, B11 to B14 Via-hole conductors 10, 10a to 10k High-frequency signal line 12 Dielectric body 12a to 12g Line part 14 Protective layers 18a to 18c Dielectric sheet 20 Signal line 22 Reference ground conductor 24 Opening 100a, 100b Connector 200 Electronic device
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Abstract
Description
以下に、本発明の一実施形態に係る高周波信号線路の構成について図面を参照しながら説明する。図1は、本発明の一実施形態に係る高周波信号線路10の外観斜視図である。図2ないし図6は、図1の高周波信号線路10の分解図である。図7は、図2のA-Aにおける断面構造図である。図8は、図2のB-Bにおける断面構造図である。以下では、高周波信号線路10の積層方向をz軸方向と定義する。また、高周波信号線路10の長手方向をx軸方向と定義し、x軸方向及びz軸方向に直交する方向をy軸方向と定義する。
以下に、高周波信号線路10の製造方法について図2ないし図6を参照しながら説明する。以下では、一つの高周波信号線路10が作製される場合を例にとって説明するが、実際には、大判の誘電体シートが積層及びカットされることにより、同時に複数の高周波信号線路10が作製される。
以上のように構成された高周波信号線路10によれば、ビアホール導体B1~B4が破損することを抑制できる。より詳細には、図13に示すように、高周波信号線路10が回路基板202a,202bに取り付けられる際には、コネクタ100aがx軸方向の負方向側に引っ張られ、コネクタ100bがx軸方向の正方向側に引っ張られる。この際、線路部12bにねじれが生じる。線路部12bのx軸方向の負方向側の長辺には線路部12aのx軸方向の正方向側の端部及び線路部12cのx軸方向の正方向側の端部が接続されている。そのため、線路部12bにおいて線路導体20bよりもx軸方向の負方向側の領域において大きなねじれが発生する。
以下に、第1の変形例に係る高周波信号線路の構成について図面を参照しながら説明する。図14及び図15は、第1の変形例に係る高周波信号線路10aの分解図である。なお、第1の変形例に係る高周波信号線路10aの外観斜視図については図1を援用する。
以下に、第2の変形例に係る高周波信号線路の構成について図面を参照しながら説明する。図16ないし図20は、第2の変形例に係る高周波信号線路10bの分解図である。なお、第2の変形例に係る高周波信号線路10bの外観斜視図については図1を援用する。
以上のように構成された高周波信号線路10bによれば、高周波信号線路10と同様に、ビアホール導体が破損することを抑制できる。また、高周波信号線路10bによれば、高周波信号線路10のように信号線路20に沿って2つずつのビアホール導体を形成する必要がない。したがって、信号線路20を幅を大きくすることができ、伝送ロスを低減させることができる。また、高周波信号線路10のように線路部12b,12dにおいてビアホール導体の配置バランスを異ならせる必要がない。したがって、線路部12b,12dにおいて、他の線路部とグランド電位のバランスが崩れることを抑制できる。
以下に、第3の変形例に係る高周波信号線路について図面を参照しながら説明する。図21は、第3の変形例に係る高周波信号線路10cをz軸方向から平面視した図である。図21では、線路部12a~12eの境界については点線で示した。
以下に、第4の変形例に係る高周波信号線路について図面を参照しながら説明する。図22は、第4の変形例に係る高周波信号線路10dをz軸方向から平面視した図である。図22では、線路部12a~12eの境界については点線で示した。
以下に、第5の変形例に係る高周波信号線路10eについて図面を参照しながら説明する。図23は、第5の変形例に係る高周波信号線路10eをz軸方向から平面視した図である。図24は、複数の高周波信号線路10eの集合体であるマザー積層体300を平面視した図である。図23では、線路部12a~12eの境界については点線で示した。
以下に、第6の変形例に係る高周波信号線路10fについて図面を参照しながら説明する。図25は、第6の変形例に係る高周波信号線路10fをz軸方向から平面視した図である。図25では、線路部12a~12eの境界については点線で示した。
以下に、第7の変形例に係る高周波信号線路10gについて図面を参照しながら説明する。図26は、第7の変形例に係る高周波信号線路10gをz軸方向から平面視した図である。図26では、線路部12a~12eの境界については点線で示した。
以下に、第8の変形例に係る高周波信号線路10hについて図面を参照しながら説明する。図27は、第8の変形例に係る高周波信号線路10hをz軸方向から平面視した図である。図27では、線路部12a~12eの境界については点線で示した。
以下に、第9の変形例に係る高周波信号線路10iについて図面を参照しながら説明する。図28は、第9の変形例に係る高周波信号線路10iをz軸方向から平面視した図である。図28では、線路部12a~12eの境界については点線で示した。
以下に、第10の変形例に係る高周波信号線路10jについて図面を参照しながら説明する。図29Aは、第10の変形例に係る高周波信号線路10jの線路部12a~12cをz軸方向から平面視した図である。図29Bは、第10の変形例に係る高周波信号線路10jの線路部12c~12eをz軸方向から平面視した図である。
以下に、第11の変形例に係る高周波信号線路10kについて図面を参照しながら説明する。図30Aは、第11の変形例に係る高周波信号線路10kの線路部12a~12cをz軸方向から平面視した図である。図30Bは、第11の変形例に係る高周波信号線路10kの線路部12c~12eをz軸方向から平面視した図である。
本発明に係る高周波信号線路は、高周波信号線路10,10a~10kに限らず、その要旨の範囲内において変更可能である。
10,10a~10k 高周波信号線路
12 誘電体素体
12a~12g 線路部
14 保護層
18a~18c 誘電体シート
20 信号線路
22 基準グランド導体
24 補助グランド導体
30,32 開口
100a,100b コネクタ
200 電子機器
Claims (11)
- 可撓性を有する複数の誘電体シートが積層されて構成されている誘電体素体であって、所定方向に延在している第1の線路部と、該第1の線路部に沿って延在している第2の線路部と、該第1の線路部の該所定方向における一方側の端部と該第2の線路部の該所定方向における一方側の端部とを接続し、かつ、該第1の線路部及び該第2の線路部よりも短い第3の線路部と、を含んでいる誘電体素体と、
前記第1の線路部、前記第2の線路部、及び前記第3の線路部に沿って延在している信号線路と、
前記誘電体素体において前記信号線路よりも積層方向の一方側に設けられることにより該信号線路と対向している第1のグランド導体と、
前記誘電体素体において前記信号線路よりも積層方向の他方側に設けられることにより該信号線路と対向している第2のグランド導体と、
前記第1の線路部及び前記第2の線路部の少なくとも一方において設けられ、かつ、前記誘電体シートを貫通することにより、前記第1のグランド導体と前記第2のグランド導体とを接続している1以上の層間接続導体と、
を備えており、
前記層間接続導体は、前記第3の線路部において、積層方向から平面視したときに、前記信号線路よりも前記所定方向の他方側には設けられていないこと、
を特徴とする高周波信号線路。 - 前記層間接続導体は、前記第3の線路部には設けられていないこと、
を特徴とする請求項1に記載の高周波信号線路。 - 前記第1の線路部において前記所定方向における一方側の端部に対して最も近くに設けられている前記層間接続導体を第1の層間接続導体とし、前記第2の線路部において該所定方向における一方側の端部に対して最も近くに設けられている前記層間接続導体を第2の層間接続導体とし、
前記信号線路において前記第1の層間接続導体に最も近接している第1の部分と該信号線路において前記第2の層間接続導体に最も近接している第2の部分との間における該信号線路の長さは、該信号線路を伝送される電磁波の波長の1/4以下であること、
を特徴とする請求項2に記載の高周波信号線路。 - 前記誘電体素体は、前記第2の線路部に関して前記第1の線路部の反対側に設けられ、かつ、該第2の線路部に沿って延在している第4の線路部と、該第2の線路部の前記所定方向における他方側の端部と該第4の線路部の該所定方向における他方側の端部とを接続し、かつ、該第2の線路部及び該第4の線路部よりも短い第5の線路部と、を更に含んでおり、
前記層間接続導体は、前記第5の線路部において、積層方向から平面視したときに、前記信号線路よりも前記所定方向の一方側には設けられていないこと、
を特徴とする請求項1ないし請求項3のいずれかに記載の高周波信号線路。 - 前記層間接続導体は、前記第5の線路部には設けられておらず、
前記第2の線路部において前記所定方向における他方側の端部に対して最も近くに設けられている前記層間接続導体を第3の層間接続導体とし、前記第4の線路部において該所定方向における他方側の端部に対して最も近くに設けられている前記層間接続導体を第4の層間接続導体とし、
前記信号線路において前記第3の層間接続導体に最も近接している第3の部分と該信号線路において前記第4の層間接続導体に最も近接している第4の部分との間における該信号線路の長さは、該信号線路を伝送される電磁波の波長の1/4以下であること、
を特徴とする請求項4に記載の高周波信号線路。 - 前記第1の線路部が前記所定方向の他方側に引っ張られ、かつ、前記第5の線路部が該所定方向の一方側に引っ張られること、
を特徴とする請求項4又は請求項5のいずれかに記載の高周波信号線路。 - 前記層間接続導体は、前記第1の線路部ないし前記第3の線路部に設けられており、
前記第1の線路部において前記所定方向における一方側の端部に対して最も近くに設けられている前記層間接続導体を第5の層間接続導体とし、前記第3の線路部において該第1の線路部に対して最も近くに設けられている前記層間接続導体を第6の層間接続導体とし、
前記信号線路において前記第5の層間接続導体に最も近接している第5の部分と該信号線路において前記第6の層間接続導体に最も近接している第6の部分との間における該信号線路の長さは、該信号線路を伝送される電磁波の波長の1/4以下であること、
を特徴とする請求項1に記載の高周波信号線路。 - 前記第2の線路部において前記所定方向における一方側の端部に対して最も近くに設けられている前記層間接続導体を第7の層間接続導体とし、前記第3の線路部において該第2の線路部に対して最も近くに設けられている前記層間接続導体を第8の層間接続導体とし、
前記信号線路において前記第7の層間接続導体に最も近接している第7の部分と該信号線路において前記第8の層間接続導体に最も近接している第8の部分との間における該信号線路の長さは、該信号線路を伝送される電磁波の波長の1/4以下であること、
を特徴とする請求項7に記載の高周波信号線路。 - 前記誘電体素体は、前記第2の線路部に関して前記第1の線路部の反対側に設けられ、かつ、該第2の線路部に沿って延在している第4の線路部と、該第2の線路部の前記所定方向における他方側の端部と該第4の線路部の該所定方向における他方側の端部とを接続し、かつ、該第2の線路部及び該第4の線路部よりも短い第5の線路部と、を更に含んでおり、
前記層間接続導体は、前記第5の線路部において、積層方向から平面視したときに、前記信号線路よりも前記所定方向の一方側には設けられておらず、
前記層間接続導体は、前記第2の線路部、前記第4の線路部及び前記第5の線路部に設けられており、
前記第2の線路部において前記所定方向における他方側の端部に対して最も近くに設けられている前記層間接続導体を第9の層間接続導体とし、前記第5の線路部において該第2の線路部に対して最も近くに設けられている前記層間接続導体を第10の層間接続導体とし、
前記信号線路において前記第9の層間接続導体に最も近接している第9の部分と該信号線路において前記第10の層間接続導体に最も近接している第10の部分との間における該信号線路の長さは、該信号線路を伝送される電磁波の波長の1/4以下であること、
を特徴とする請求項7又は請求項8のいずれかに記載の高周波信号線路。 - 前記第4の線路部において前記所定方向における他方側の端部に対して最も近くに設けられている前記層間接続導体を第11の層間接続導体とし、前記第5の線路部において該第4の線路部に対して最も近くに設けられている前記層間接続導体を第12の層間接続導体とし、
前記信号線路において前記第11の層間接続導体に最も近接している第11の部分と該信号線路において前記第12の層間接続導体に最も近接している第12の部分との間における該信号線路の長さは、該信号線路を伝送される電磁波の波長の1/4以下であること、
を特徴とする請求項9に記載の高周波信号線路。 - 筐体と、
前記筐体に収納されている高周波信号線路と、
を備えており、
前記高周波信号線路は、
可撓性を有する複数の誘電体シートが積層されて構成されている誘電体素体であって、所定方向に延在している第1の線路部と、該第1の線路部に沿って延在している第2の線路部と、該第1の線路部の該所定方向における一方側の端部と該第2の線路部の該所定方向における一方側の端部とを接続し、かつ、該第1の線路部及び該第2の線路部よりも短い第3の線路部と、を含んでいる誘電体素体と、
前記第1の線路部、前記第2の線路部及び前記第3の線路部に沿って延在している信号線路と、
前記誘電体素体において前記信号線路よりも積層方向の一方側に設けられることにより該信号線路と対向している第1のグランド導体と、
前記誘電体素体において前記信号線路よりも積層方向の他方側に設けられることにより該信号線路と対向している第2のグランド導体と、
前記第1の線路部及び前記第2の線路部の少なくとも一方において設けられ、かつ、前記誘電体シートを貫通することにより、前記第1のグランド導体と前記第2のグランド導体とを接続している1以上の層間接続導体と、
を備えており、
前記層間接続導体は、前記第3の線路部において、積層方向から平面視したときに、前記信号線路よりも前記所定方向の他方側には設けられていないこと、
を特徴とする電子機器。
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WO2012074100A1 (ja) * | 2010-12-03 | 2012-06-07 | 株式会社村田製作所 | 高周波信号線路 |
TW201236517A (en) * | 2010-12-03 | 2012-09-01 | Murata Manufacturing Co | High-frequency signal line and electronic device |
KR20120102728A (ko) * | 2010-12-03 | 2012-09-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 고주파 신호 선로 |
JP5041108B2 (ja) * | 2010-12-03 | 2012-10-03 | 株式会社村田製作所 | 高周波信号線路 |
CN102986308A (zh) * | 2010-12-03 | 2013-03-20 | 株式会社村田制作所 | 高频信号线路 |
EP2574155A1 (en) * | 2010-12-03 | 2013-03-27 | Murata Manufacturing Co., Ltd. | High-frequency signal line |
US20130127560A1 (en) * | 2010-12-03 | 2013-05-23 | Murata Manufacturing Co., Ltd. | High-frequency signal transmission line |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016009802A1 (ja) * | 2014-07-18 | 2016-01-21 | 株式会社村田製作所 | 高周波信号伝送線路 |
JP5988011B2 (ja) * | 2014-07-18 | 2016-09-07 | 株式会社村田製作所 | 高周波信号伝送線路 |
US10027009B2 (en) | 2014-07-18 | 2018-07-17 | Murata Manufacturing Co., Ltd. | High-frequency signal transmission line |
Also Published As
Publication number | Publication date |
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JPWO2014084011A1 (ja) | 2017-01-05 |
CN204303962U (zh) | 2015-04-29 |
US9484612B2 (en) | 2016-11-01 |
JP5673898B2 (ja) | 2015-02-18 |
US20150054600A1 (en) | 2015-02-26 |
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