WO2014079084A1 - 一种背光模组及液晶显示装置 - Google Patents
一种背光模组及液晶显示装置 Download PDFInfo
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- WO2014079084A1 WO2014079084A1 PCT/CN2012/085499 CN2012085499W WO2014079084A1 WO 2014079084 A1 WO2014079084 A1 WO 2014079084A1 CN 2012085499 W CN2012085499 W CN 2012085499W WO 2014079084 A1 WO2014079084 A1 WO 2014079084A1
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- plate
- heat
- back plate
- light source
- liquid crystal
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
Definitions
- the present invention relates to the field of liquid crystal display technology, and in particular, to a backlight module and a liquid crystal display device.
- the liquid crystal display device 100 includes a liquid crystal panel 110, a plastic frame 120, and a backlight module 130.
- the plastic frame 120 is partially located between the liquid crystal panel 110 and the backlight module 130.
- the backlight module 130 includes a back plate 134, an LED 131, an aluminum extrusion 133, and a metal-based printed circuit board (MCPCB) 132.
- MCPCB metal-based printed circuit board
- a portion of the aluminum extrusion 133 is located between the side plates of the back plate 134 and the MCPCB 132, and is in direct contact with the inner surface of the side plates of the back plate 134 and the MCPCB 132, respectively.
- the plastic frame 120 is in direct contact with the outer surface of the side plate of the back plate 134.
- the LED 131 emits heat, and the generated heat is transferred to the aluminum extrusion 133 through the MCPCB 132 and transferred to the backing plate 134 by the aluminum extrusion 133. Since the plastic frame 120 is in contact with the liquid crystal panel 110 and the back plate 134 of the backlight module 130, a part of the heat from the LED 131 is transmitted from the plastic frame 120 to the liquid crystal panel 110. When the liquid crystal panel 110 is overheated, uneven brightness of the liquid crystal panel 110 is likely to occur (Thermal The phenomenon of Mura).
- the technical problem to be solved by the present invention is to provide a backlight module and a liquid crystal display device capable of blocking heat transfer from a heat source to a liquid crystal panel, thereby reducing brightness unevenness of the liquid crystal panel.
- a technical solution adopted by the present invention is to provide a backlight module, which includes a back plate, a heat source, a heat conductor, and a thermal blocking mechanism, the back plate including a bottom plate and a side from the bottom plate a bent side plate, the heat source is a light source, the light source is disposed adjacent to a side plate of the back plate, the heat conductor is partially located between the light source and the side plate of the back plate, and the other portion is thermally coupled to the bottom plate of the back plate, The light source is thermally coupled to the heat conductor, and a gap of 0.5 to 4 mm is disposed between the heat conductor and the side plate of the back plate to form the thermal barrier mechanism for performing heat from the light source and transmitted to the back plate.
- the thermal barrier mechanism further includes a bent portion between the side plate and the bottom plate of the back plate, the disconnected position corresponding to the position of the light source, and the side plate adjacent to the disconnected position and the bottom plate A reinforcing mechanism is provided at the bend.
- a backlight module including a back plate, a heat source, and a thermal blocking mechanism.
- the heat source and the back plate are relatively fixedly disposed, and the thermal blocking mechanism is disposed. The heat from the heat source and transmitted to the backing plate is blocked in the heat transfer route between the backing plate and the heat source.
- the backlight module includes a heat conductive body, and the back plate includes a bottom plate and a side plate bent upward from a side of the bottom plate, the heat source is a light source, and the light source is disposed adjacent to a side plate of the back plate, the heat conductor One portion is located between the light source and the side plate of the back plate, and the other portion is thermally coupled to the bottom plate of the back plate, the light source is thermally coupled to the heat conductor, and a gap is formed between the heat conductor and the side plate of the back plate to form the Thermal barrier mechanism.
- the gap size is 0.5 to 4 mm.
- the thermal blocking mechanism comprises a broken portion between the side plate and the bottom plate of the back plate, and the disconnected position is corresponding to the position of the light source.
- a bending mechanism is disposed at a bend between the side plate adjacent to the disconnected position and the bottom plate.
- the reinforcing mechanism is a reinforcing rib disposed at a bend between the side plate and the bottom plate.
- a liquid crystal display device including a liquid crystal panel, a middle frame, a backlight module, and a thermal blocking mechanism, wherein the middle frame is disposed on the liquid crystal panel and the backlight module.
- the backlight module includes a back plate and a heat source, the heat source and the back plate are oppositely disposed, and the heat blocking mechanism is disposed in a heat transfer route between the liquid crystal panel and the heat source, and the heat source is from the heat source. And the heat transmitted to the liquid crystal panel is blocked.
- the backlight module includes a heat conductor
- the backboard includes a bottom plate and a side plate bent upward from a side of the bottom plate, and the heat transfer body and the side plate of the back plate are located between the liquid crystal panel and the heat source.
- the heat source is a light source disposed adjacent to a side plate of the back plate, the heat conductor is partially located between the light source and the side plate of the back plate, and the other portion is thermally coupled to the bottom plate of the back plate, the light source and The heat conductor is thermally coupled, and a gap is formed between the heat conductor and the side plate of the backboard to form the thermal barrier mechanism.
- the thermal blocking mechanism comprises a broken portion between the side plate and the bottom plate of the back plate, and the disconnected position is corresponding to the position of the light source.
- a bending mechanism is disposed at a bend between the side plate adjacent to the disconnected position and the bottom plate.
- the invention has the beneficial effects that: different from the prior art, the invention provides a thermal blocking mechanism in the heat transfer path of the heat source and the liquid crystal panel, and the heat of the heat insulating source is transmitted to the liquid crystal panel, thereby reducing the appearance of the liquid crystal panel due to overheating. Uneven brightness.
- FIG. 1 is a partial structural schematic view of a liquid crystal display device in the prior art
- FIG. 2 is a partial structural schematic view of an embodiment of a liquid crystal display device of the present invention.
- FIG. 3 is a partial structural schematic view of another embodiment of a liquid crystal display device of the present invention.
- Figure 4 is a partial perspective view of the back plate of Figure 3;
- FIG. 5 is a partial structural schematic view of an embodiment of a backlight module of the present invention.
- FIG. 2 is a partial schematic structural view of an embodiment of a liquid crystal display device of the present invention.
- the liquid crystal display device 200 includes a liquid crystal panel 210, a middle frame 220, a backlight module 230, and a thermal blocking mechanism 240.
- the middle frame 220 includes a rectangular frame body 221 with an intermediate window opening and a first side plate 222 extending downward from the outer side of the rectangular frame body 221 .
- the backlight module 230 includes a light source 231, a heat conductor 232, a back plate 233, and an MCPCB 234.
- the back plate 233 includes a first bottom plate 2332 and a second side plate 2331 that is bent upward from the outer side of the first bottom plate 2332.
- the heat conductor 232 includes a second bottom plate 2322 and a third side plate 2321 extending upward from a side of the second bottom plate 2322.
- the second bottom plate 2322 of the heat conductor 232 is attached to the upper surface of the first bottom plate 2332 of the back plate 233, and forms a thermal coupling structure with the first bottom plate 2332, and the third side plate 2321 of the thermal conductor 232 is adjacent to the back plate 233.
- the second side plate 2331 is disposed.
- the light source 231 is fixedly disposed opposite to the back plate 233 and adjacent to the second side plate 2331.
- the third side plate 2321 of the heat conductor 232 is located between the light source 231 and the second side plate 2331 of the back plate 233, and is disposed on one side of the horizontal direction of the MCPCB 234, and the light source 231 is fixed on the other side of the MCPCB 234, and The side of the second side plate 2331 facing away from the back plate 233 forms a thermal coupling structure between the light source 231 and the heat conductor 232.
- the rectangular frame 221 of the middle frame 220 is disposed on the second side plate 2331 of the back plate 233, and the first side plate 222 is disposed on the outer side of the second side plate 2331 of the back plate 233 in the horizontal direction.
- the thermal barrier mechanism 240 is disposed in a heat transfer path between the back plate 233 and the heat conductor 232 to block heat from the light source 231 and transmitted to the back plate 233.
- a gap is formed between the heat conductor 232 and the second side plate 2331 to form a thermal barrier mechanism 240.
- the heat blocking mechanism 240 is specifically described: the light source 231 emits heat to generate heat, and since the light source 231 forms a thermal coupling structure with the heat conductor 232, the light source 231 transfers part of the heat to the heat conductor 232.
- the air in the gap can be regarded as not flowing. At this time, the air in the gap acts only for heat conduction and has no heat transfer effect. Since the thermal conductivity of the air is relatively small, the air in the gap at this time has only a heat insulating effect, that is, functions to block the heat transfer from the heat conductor 232 to the second side plate 2331.
- the gap acts to block heat transfer from the light source 231 to the liquid crystal panel 210, thereby reducing the brightness unevenness of the liquid crystal panel 210 due to overheating.
- the gap between the heat conductor 232 and the second side plate 2331 forms a thermal barrier mechanism 240.
- the gap distance between the heat conductor 232 and the second side plate 2331 is set to 0.5 to 4 mm, such as 1 mm, 2 mm, or 3 mm, etc., but the gap distance is not limited to 0.5 to 4 mm.
- the technician can take the distance with better insulation effect as the gap distance according to the actual situation.
- the middle frame of the full text is disposed outside the backlight module, but the middle frame should not be considered to be disposed outside the backlight module. In other embodiments, the middle frame may also be integrated into the backlight module.
- FIG. 3 is a partial schematic structural view of another embodiment of the liquid crystal display device of the present invention
- FIG. 4 is a partial perspective view of the back plate of FIG.
- the present embodiment provides a more optimized embodiment.
- the present embodiment is further optimized based on the previous embodiment. Therefore, the same components of the liquid crystal display device 300 and the previous embodiment will not be further described. If necessary, refer to the related embodiment. description.
- the thermal barrier mechanism 340 of the present embodiment includes a gap 341 between the heat conductor 332 and the second side plate 3331 of the back plate 333, and a second side plate of the back plate 333.
- a portion 342 is bent between the 3331 and the first bottom plate 3332.
- the position of the disconnecting portion 342 corresponds to the position setting of the light source 331.
- the thermal blocking mechanism 340 will be further described.
- the light source 331 emits heat and is transferred to the heat conductor 332 thermally coupled thereto.
- the presence of the gap 341 blocks the heat of the heat conductor 332 from being directly transmitted to the second side plate 3331 of the back plate 333, thereby blocking part of the heat transfer from the light source 331.
- the heat conductor 332 is thermally coupled to the first bottom plate 3332 of the back plate 333, heat of the heat conductor 332 is transmitted to the second side plate 3331 via the first bottom plate 3332, and then passes through the second side plate 3331.
- Block 320 is passed to liquid crystal panel 310.
- the disconnecting portion 342 is disposed at a bend between the second side plate 3331 of the back plate 333 and the first bottom plate 3332, and the heat transfer of the first bottom plate 3332 to the second side plate 3331 is blocked to some extent, thereby further Heat from the light source 331 is blocked from being transmitted to the liquid crystal panel 310.
- the present embodiment is provided with a reinforcing mechanism 343 for reducing the breaking portion 342 at a bend between the second side plate 3331 adjacent to the breaking portion 342 and the first bottom plate 3332. The effect of weakening the strength of the backing plate 333 is caused.
- the present embodiment provides a disconnecting portion 342 at a bend between the second side plate 3331 of the back plate 333 and the first bottom plate 3332, however, on the second side.
- the connection between the plate 3331 and the first bottom plate 3332 is disconnected, which has a certain influence on the strength of the back plate 333.
- a reinforcing mechanism 343 is provided at a bend between the second side plate 3331 adjacent to the breaking portion 342 and the first bottom plate 3332.
- the reinforcing mechanism 343 can be implemented by other reinforcing methods, and is not limited to being passed through a bend between the second side plate 3331 adjacent to the breaking portion 342 and the first bottom plate 3332.
- the ribs are provided (the shape of the back is a groove).
- the invention provides a thermal blocking mechanism between the heat conductor and the back plate, and blocks heat from the light source to be transmitted to the liquid crystal panel through the back plate, thereby further reducing the brightness unevenness of the liquid crystal panel due to overheating. More preferably, the present invention is further provided with a reinforcing mechanism at a bend between the second side plate adjacent to the disconnecting portion and the first bottom plate, thereby achieving better heat insulation and avoiding the strength of the back plate. Excessive impact.
- FIG. 5 is a partial structural diagram of an embodiment of a backlight module of the present invention.
- the backlight module 500 in this embodiment includes a light source 510, a heat conductor 520, a back plate 530, an MCPCB 550, and a thermal blocking mechanism 540.
- the back plate 530 includes a first bottom plate 532 and a second bent upward from the outer side of the first bottom plate 532.
- the heat conductor 520 includes a second bottom plate 522 and a third side plate 521 extending upward from a side of the second bottom plate 522.
- the second bottom plate 522 of the heat conductor 520 is attached to the upper surface of the first bottom plate 532 of the back plate 530, and forms a thermal coupling structure with the first bottom plate 532, and the third side plate 521 of the thermal conductor 520 is adjacent to the back plate 530.
- the second side plate 531 is disposed.
- the light source 510 is fixedly disposed opposite to the back plate 530 and adjacent to the second side plate 531.
- the third side plate 521 of the heat conductor 520 is located between the light source 510 and the second side plate 531 of the back plate 530, and is disposed on one side of the MCPCB 550 in the horizontal direction, and the light source 510 is fixed on the other side of the MCPCB 550, and The side of the second side plate 531 facing away from the back plate 530 forms a thermal coupling structure between the light source 510 and the heat conductor 520.
- the thermal barrier mechanism 540 is disposed in a heat transfer path between the back plate 530 and the heat conductor 520 to block heat from the light source 510 and transmitted to the back plate 530.
- a gap is formed between the heat conductor 520 and the second side plate 531 to form a thermal barrier mechanism 540.
- the heat blocking mechanism 540 is specifically illustrated in conjunction with FIGS. 2 and 5 .
- the light source 510 emits heat to generate a heat source. Since the light source 510 forms a thermal coupling structure with the heat conductor 520 , the light source 510 transfers part of the heat to the heat conductor 520 .
- the air in the gap can be regarded as not flowing. At this time, the air in the gap only serves heat conduction, and Heat transfer effect.
- the air in the gap at this time has only a heat insulating effect, that is, functions to block heat transfer from the heat conductor 520 to the second side plate 531.
- the gap between the heat conductor 520 and the second side plate 531 forms a thermal barrier mechanism 540.
- the middle frame is thermally coupled to the second side plate 531 and the liquid crystal panel, respectively, and the thermal blocking mechanism 540 blocks heat transfer from the heat conductor 520 to the second side plate 531. Further, thermal blocking Mechanism 540 blocks heat transfer from light source 510 to the liquid crystal panel.
- the gap distance between the heat conductor 520 and the second side plate 531 is set to 0.5 to 4 mm, such as 1 mm, 2 mm, or 3 mm, etc., but the gap distance is not limited to 0.5 to 4 mm.
- the technician can take the distance with better insulation effect as the gap distance according to the actual situation.
- the backlight module 500 of the present embodiment does not include the middle frame.
- the backlight module 500 of the present invention does not include the middle frame. In other embodiments, the middle frame may be integrated into the backlight module 500.
- the present embodiment provides a more optimized backlight module implementation.
- This embodiment is further optimized on the basis of the previous embodiment. Therefore, the backlight module 500 and the structure of the previous embodiment are not described in detail. If necessary, refer to the related embodiment. description.
- the thermal barrier mechanism 540 of the present embodiment includes a gap between the heat conductor 520 and the second side plate 531, and the second side plate 531 of the back plate 530 and the first bottom plate.
- the part between the 532 is broken at the bend.
- the position of the broken portion between the second side plate 531 of the back plate 530 and the first bottom plate 532 is corresponding to the position of the light source 510.
- the thermal blocking mechanism 540 is further described.
- the thermal insulation principle of the gap between the thermal conductor 520 and the second side plate 531 has been described in detail. Please refer to the related text description of the previous embodiment. .
- the light source 510 emits heat to generate heat and is transmitted to the heat conductor 520 thermally coupled thereto, and the presence of a gap between the heat conductor 520 and the second side plate 531 blocks the heat of the heat conductor 520 from being directly transmitted to the second side plate 531.
- the heat conductor 520 is thermally coupled to the first bottom plate 532, the heat of the heat conductor 520 is transferred to the second side plate 531 via the first bottom plate 532.
- a disconnection portion is provided at a bend between the second side plate 531 and the first bottom plate 532, which blocks the heat transfer of the first bottom plate 532 to the second side plate 531 to a certain extent, thereby further blocking the light source 510. The heat is transferred to the second side plate 531.
- the present embodiment is provided with a reinforcing mechanism at a bend between the second side plate 531 adjacent to the disconnecting portion and the first bottom plate 532, the reinforcing mechanism for reducing the broken portion to cause the back plate 530 The effect of weakening strength.
- the present embodiment provides a disconnected portion at a bend between the second side plate 531 and the first bottom plate 532, however, at the second side plate 531 and the first The connection of the bottom plate 532 is broken, which will have a certain influence on the strength of the back plate 530.
- a reinforcing mechanism is provided at a bend between the second side plate 531 adjacent to the disconnected portion and the first bottom plate 532.
- the present embodiment is implemented by providing a reinforcing rib (the shape of the back surface is a groove) at a bend between the second side plate 531 adjacent to the disconnected portion and the first bottom plate 532, adjacent to the side of the heat conductor 332. Strong.
- the reinforcing mechanism may be implemented by other reinforcing methods, and is not limited to being provided by bending at a bend between the second side plate 531 and the first bottom plate 532 adjacent to the disconnecting portion.
- the ribs (the shape of the back is a groove) are realized.
- the invention provides a thermal blocking mechanism between the heat conductor and the back plate, blocks the heat from the light source from being transmitted to the second side plate, and then passes through the middle frame to the liquid crystal panel in the liquid crystal display device corresponding to the backlight module, thereby Further, the brightness unevenness of the liquid crystal panel due to overheating is further alleviated. More preferably, the present invention is further provided with a reinforcing mechanism at a bend between the second side plate adjacent to the disconnecting portion and the first bottom plate, thereby achieving better heat insulation and avoiding the strength of the back plate. Excessive impact.
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Abstract
提供一种背光模组（230）及液晶显示装置，该背光模组（230）包括：背板（233）、热源（231）以及热阻隔机构（240），该热源（231）与背板（233）相对固定设置，该热阻隔机构（240）设置于背板（233）与热源（231）之间的热传递路线之中，对来自热源（231）并传递至背板（233）的热进行阻隔。通过在热源（231）与液晶面板（210）的热传递路线中设置热阻隔机构（240），阻隔热源（231）的热量传递至液晶面板（210），从而减轻了液晶面板（210）由于过热而出现的亮度不均匀现象。
Description
【技术领域】
本发明涉及液晶显示技术领域，特别是涉及一种背光模组及液晶显示装置。
【背景技术】
现有技术中，液晶显示装置结构通常如图1所示。液晶显示装置100包括液晶面板110、胶框120和背光模组130。其中，胶框120部分位于液晶面板110和背光模组130之间。背光模组130包括背板134、LED131、铝挤133以及金属基印刷电路板(MCPCB)132。其中，铝挤133的一部分位于背板134的侧板与MCPCB132之间，且分别与背板134的侧板的内表面和MCPCB132直接接触。胶框120则直接与背板134的侧板外表面接触。
LED131发光产生热，而所产生的热会通过MCPCB132传递到铝挤133，并由铝挤133传递至背板134。由于胶框120分别与液晶面板110和背光模组130的背板134接触，来自LED131的部分热就从胶框120传递至液晶面板110。当液晶面板110过热时，容易出现液晶面板110的亮度不均匀（Thermal
Mura）的现象。
【发明内容】
本发明主要解决的技术问题是提供一种背光模组及液晶显示装置，能够阻隔来自热源的热传递至液晶面板，减轻液晶面板的亮度不均匀现象。
为解决上述技术问题，本发明采用的一种技术方案是：提供一种背光模组，其中，包括背板、热源、导热体以及热阻隔机构，所述背板包括底板和自底板边侧向上弯折的侧板，所述热源是光源，所述光源邻近背板的侧板设置，所述导热体一部分位于光源和背板的侧板之间，另一部分与背板的底板热耦合，所述光源与导热体热耦合，所述导热体与背板的侧板之间设有0.5~4毫米的间隙，形成所述热阻隔机构，以对来自所述光源并传递至背板的热进行阻隔，所述热阻隔机构还包括背板的侧板与底板之间弯折处断开部分，所述断开位置对应光源位置设置，且邻近所述断开位置的侧板与底板之间的弯折处设置有补强机构。
为解决上述技术问题，本发明采用的另一种技术方案是：提供一种背光模组，包括背板、热源以及热阻隔机构，所述热源与背板相对固定设置，所述热阻隔机构设置于背板与热源之间的热传递路线之中，对来自所述热源并传递至背板的热进行阻隔。
其中，所述背光模组包括导热体，所述背板包括底板和自底板边侧向上弯折的侧板，所述热源是光源，所述光源邻近背板的侧板设置，所述导热体一部分位于光源和背板的侧板之间，另一部分与背板的底板热耦合，所述光源与导热体热耦合，所述导热体与背板的侧板之间设有间隙，形成所述热阻隔机构。
其中，所述间隙大小为0.5~4毫米。
其中，所述热阻隔机构包括背板的侧板与底板之间弯折处断开部分，所述断开位置对应光源位置设置。
其中，邻近所述断开位置的侧板与底板之间的弯折处设置有补强机构。
其中，所述补强机构为设置于侧板与底板之间的弯折处的补强肋。
为了解决以上技术问题，本发明采用的再一种技术方案是：提供一种液晶显示装置，包括液晶面板、中框、背光模组以及热阻隔机构，所述中框设置于液晶面板和背光模组之间，所述背光模组包括背板和热源，所述热源与背板相对固定设置，所述热阻隔机构设置于液晶面板与热源之间的热传递路线之中，对来自所述热源并传递至液晶面板的热进行阻隔。
其中，所述背光模组包括导热体，所述背板包括底板和自底板边侧向上弯折的侧板，所述导热体和背板的侧板位于液晶面板与热源之间的热传递路线之中，所述热源是光源，所述光源邻近背板的侧板设置，所述导热体一部分位于光源和背板的侧板之间，另一部分与背板的底板热耦合，所述光源与导热体热耦合，所述导热体与背板的侧板之间设有间隙，形成所述热阻隔机构。
其中，所述热阻隔机构包括背板的侧板与底板之间弯折处断开部分，所述断开位置对应光源位置设置。
其中，邻近所述断开位置的侧板与底板之间的弯折处设置有补强机构。
本发明的有益效果是：区别于现有技术，本发明通过在热源与液晶面板的热传递路线中设置热阻隔机构，阻隔热源的热量传递至液晶面板，从而减轻了液晶面板由于过热而出现的亮度不均现象。
【附图说明】
图1是现有技术中一种液晶显示装置的部分结构示意图；
图2是本发明液晶显示装置一实施方式的部分结构示意图；
图3是本发明液晶显示装置另一实施方式的部分结构示意图；
图4是图3中背板的局部立体示意图；
图5是本发明背光模组一实施方式的部分结构示意图。
【具体实施方式】
下面结合附图和具体的实施方式进行说明。
请参阅图2，图2是本发明液晶显示装置一实施方式的部分结构示意图。本实施方式中，液晶显示装置200包括：液晶面板210、中框220、背光模组230及热阻隔机构240。
中框220包括中间开窗的矩形框体221以及自矩形框体221外侧向下延伸的第一侧板222。背光模组230包括光源231、导热体232、背板233以及MCPCB234。背板233包括第一底板2332和自第一底板2332外侧向上弯折的第二侧板2331。导热体232包括第二底板2322和自第二底板2322一侧向上延伸的第三侧板2321。
其中，导热体232的第二底板2322贴附于背板233的第一底板2332上表面，与第一底板2332之间形成热耦合结构，并且导热体232的第三侧板2321邻近背板233的第二侧板2331设置。光源231与背板233相对固定设置，并邻近第二侧板2331。具体上，导热体232的第三侧板2321位于光源231和背板233的第二侧板2331之间，且设置在MCPCB234水平方向的一侧，而光源231固定于MCPCB234另一侧上，并且背对背板233的第二侧板2331一侧，使得光源231与导热体232之间形成热耦合结构。此外，中框220的矩形框体221设置于背板233的第二侧板2331之上，而第一侧板222则设置于背板233的第二侧板2331水平方向的外侧。
热阻隔机构240设置于背板233与导热体232之间的热传递路线之中，对来自光源231并传递至背板233的热进行阻隔。本实施方式中，导热体232与第二侧板2331之间设有间隙，形成热阻隔机构240。
对热阻隔机构240进行具体的说明：光源231发光产生热而形成热源，由于光源231与导热体232之间形成热耦合结构，光源231将部分热传递至导热体232。因导热体232与第二侧板2331之间设有间隙，且间隙距离小于温度边界层时，间隙中的空气可以看成是不流动的。此时，间隙中的空气只起导热作用，无传热效果。由于空气的热导率比较小，所以此时间隙中的空气只有保温效果，也就是起到阻隔导热体232的热传递至第二侧板2331的作用。进一步说，上述间隙起到了阻隔来自光源231的热传递至液晶面板210的作用，进而减轻液晶面板210由于过热而出现的亮度不均匀现象。换言之，导热体232与第二侧板2331之间的间隙形成了热阻隔机构240。
在本实施方式中，导热体232与第二侧板2331之间的间隙距离设置为0.5~4毫米，比如1毫米、2毫米或3毫米等，但间隙距离不限于设置为0.5~4毫米。在具体实施时，技术人员可以根据实际情况取隔热效果较好的距离作为间隙距离。为了便于说明，全文的中框为设置在背光模组之外，但不应认为中框仅限于设置在背光模组之外，在其他实施方式中，中框也可以集成于背光模组中。
请参与图3和图4，图3是本发明液晶显示装置另一实施方式的部分结构示意图，图4是图3中背板的局部立体示意图。为了达到更好的隔热效果，本实施方式提供了一种更为优化的实施方式。本实施方式是在上一实施方式的基础上实现进一步优化的，故对于液晶显示装置300与上一实施方式结构相同部分不再进行一一赘述，如有需要，请参阅上一实施方式的相关描述。
与上一实施方式比较，更为优化的是，本实施方式的热阻隔机构340包括导热体332与背板333的第二侧板3331之间的间隙341，及背板333的第二侧板3331与第一底板3332之间弯折处断开部分342。在本实施方式中，为了实现更好的隔热效果，断开部分342的位置对应光源331位置设置。
对热阻隔机构340进行进一步说明：在上一实施方式中，已对间隙341的隔热原理进行的详细说明，请参照上一实施方式的相关文字描述。光源331发光产生热并传递至与其热耦合的导热体332，间隙341的存在阻隔了导热体332的热直接传递至背板333的第二侧板3331，从而阻隔了来自光源331的部分热量传递至液晶面板310。然而，另一方面，由于导热体332与背板333的第一底板3332热耦合，导热体332的热量会经第一底板3332传递至第二侧板3331，进而从第二侧板3331经过中框320传递至液晶面板310。本实施方式在背板333的第二侧板3331与第一底板3332之间弯折处设置断开部分342，一定程度上阻隔了第一底板3332的热传递至第二侧板3331，从而进一步阻隔了来自光源331的热传递至液晶面板310。
更为优化地，本实施方式在邻近断开部分342的第二侧板3331与第一底板3332之间的弯折处设置有补强机构343，该补强机构343用于减少断开部分342造成背板333强度减弱的影响。
前面已有描述，即为了实现更好的隔热，本实施方式在背板333的第二侧板3331与第一底板3332之间弯折处设置了断开部分342，然而，在第二侧板3331和第一底板3332连接处设置断开，会对背板333的强度造成一定的影响。为了减少上述影响，在邻近断开部分342的第二侧板3331与第一底板3332之间的弯折处设置补强机构343。具体地，本实施方式是通过在邻近断开部分342的第二侧板3331与第一底板3332之间的弯折处、邻近导热体332一侧设置加强肋（背面的形状为凹槽）来实现补强。需要说明的是，在其他实施方式中，补强机构343可以通过其他补强方式实现，并不仅限于通过在邻近断开部分342的第二侧板3331与第一底板3332之间的弯折处设置加强肋（背面的形状为凹槽）实现。
本发明通过在导热体与背板之间设置热阻隔机构，阻隔了来自光源的热通过背板传递至液晶面板，从而进一步减轻了液晶面板由于过热而出现的亮度不均匀现象。更优化地，本发明还在邻近断开部分的第二侧板与第一底板之间的弯折处设置有补强机构，在实现更好隔热的同时，也避免了对背板强度的过多影响。
请参阅图5，图5是本发明背光模组一实施方式的部分结构示意图。本实施方式中的背光模组500包括：光源510、导热体520、背板530、MCPCB550以及热阻隔机构540，背板530包括第一底板532和自第一底板532外侧向上弯折的第二侧板531。导热体520包括第二底板522和自第二底板522一侧向上延伸的第三侧板521。
其中，导热体520的第二底板522贴附于背板530的第一底板532上表面，与第一底板532之间形成热耦合结构，并且导热体520的第三侧板521邻近背板530的第二侧板531设置。光源510与背板530相对固定设置，并邻近第二侧板531。具体上，导热体520的第三侧板521位于光源510和背板530的第二侧板531之间，且设置在MCPCB550水平方向的一侧，而光源510固定于MCPCB550另一侧上，并且背对背板530的第二侧板531一侧，使得光源510与导热体520之间形成热耦合结构。
热阻隔机构540设置于背板530与导热体520之间的热传递路线之中，对来自光源510并传递至背板530的热进行阻隔。本实施方式中，导热体520与第二侧板531之间设有间隙，形成热阻隔机构540。
结合图2和图5对热阻隔机构540进行具体的说明，光源510发光产生热而形成热源，由于光源510与导热体520之间形成热耦合结构，光源510将部分热传递至导热体520。因导热体520与第二侧板531之间设有间隙，且间隙距离小于温度边界层时，间隙中的空气可以看成是不流动的，此时，间隙中的空气只起导热作用，无传热效果。由于空气的热导率比较小，所以此时间隙中的空气只有保温效果，也就是起到阻隔导热体520的热传递至第二侧板531的作用。换言之，导热体520与第二侧板531之间的间隙形成了热阻隔机构540。根据图2可知，在液晶显示装置中，中框分别与第二侧板531和液晶面板热耦合，热阻隔机构540阻隔了导热体520的热传递至第二侧板531，进一步说，热阻隔机构540就阻隔了来自光源510的热传递至液晶面板。
在本实施方式中，导热体520与第二侧板531之间的间隙距离设置为0.5~4毫米，比如1毫米、2毫米或3毫米等，但间隙距离不限于设置为0.5~4毫米。在具体实施时，技术人员可以根据实际情况取隔热效果较好的距离作为间隙距离。同时，本实施方式的背光模组500不包括中框，但不应认为本发明背光模组500不包括中框，在其他实施方式中，可以将中框集成于背光模组500中。
请参阅图3至图5，为了达到更好的隔热效果，本实施方式提供了一种更为优化的背光模组实施方式。本实施方式是在上一实施方式的基础上实现进一步优化的，故对于背光模组500与上一实施方式结构相同部分不再进行一一赘述，如有需要，请参阅上一实施方式的相关描述。
与上一实施方式比较，更为优化的是，本实施方式的热阻隔机构540包括导热体520与第二侧板531之间的间隙，及背板530的第二侧板531与第一底板532之间弯折处断开部分。在本实施方式中，为了实现更好的隔热效果，背板530的第二侧板531与第一底板532之间弯折处断开部分的位置对应光源510位置设置。
对热阻隔机构540进行进一步说明：在上一实施方式中，已对导热体520与第二侧板531之间的间隙的隔热原理进行的详细说明，请参照上一实施方式的相关文字描述。光源510发光产生热并传递至与其热耦合的导热体520，导热体520与第二侧板531之间间隙的存在阻隔了导热体520的热直接传递至第二侧板531。然而，另一方面，由于导热体520与第一底板532热耦合，导热体520的热量会经第一底板532传递至第二侧板531。本实施方式在第二侧板531与第一底板532之间弯折处设置断开部分，一定程度上阻隔了第一底板532的热传递至第二侧板531，从而进一步阻隔了来自光源510的热传递至第二侧板531。
更为优化地，本实施方式在邻近断开部分的第二侧板531与第一底板532之间的弯折处设置有补强机构，该补强机构用于减少断开部分造成背板530强度减弱的影响。
前面已有描述，即为了实现更好的隔热，本实施方式在第二侧板531与第一底板532之间弯折处设置了断开部分，然而，在第二侧板531和第一底板532连接处设置断开，会对背板530的强度造成一定的影响。为了减少上述影响，在邻近断开部分的第二侧板531与第一底板532之间的弯折处设置补强机构。具体地，本实施方式是通过在邻近断开部分的第二侧板531与第一底板532之间的弯折处、邻近热导体332一侧设置加强肋（背面的形状为凹槽）实现补强。需要说明的是，在其他实施方式中，补强机构可以通过其他补强方式实现，并不仅限于通过在邻近断开部分的第二侧板531与第一底板532之间的弯折处设置加强肋（背面的形状为凹槽）实现。
本发明通过在导热体与背板之间设置热阻隔机构，阻隔了来自光源的热传递至第二侧板，进而经中框传递至背光模组所对应的液晶显示装置中的液晶面板，从而进一步减轻了液晶面板由于过热而出现的亮度不均匀现象。更优化地，本发明还在邻近断开部分的第二侧板与第一底板之间的弯折处设置有补强机构，在实现更好隔热的同时，也避免了对背板强度的过多影响。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。
Claims (11)
- 一种背光模组，其中，包括背板、热源、导热体以及热阻隔机构，所述背板包括底板和自底板边侧向上弯折的侧板，所述热源是光源，所述光源邻近背板的侧板设置，所述导热体一部分位于光源和背板的侧板之间，另一部分与背板的底板热耦合，所述光源与导热体热耦合，所述导热体与背板的侧板之间设有0.5~4毫米的间隙，形成所述热阻隔机构，以对来自所述光源并传递至背板的热进行阻隔，所述热阻隔机构还包括背板的侧板与底板之间弯折处断开部分，所述断开位置对应光源位置设置，且邻近所述断开位置的侧板与底板之间的弯折处设置有补强机构。
- 一种背光模组，其中，包括背板、热源以及热阻隔机构，所述热源与背板相对固定设置，所述热阻隔机构设置于背板与热源之间的热传递路线之中，对来自所述热源并传递至背板的热进行阻隔。
- 根据权利要求2所述的背光模组，其中，所述背光模组包括导热体，所述背板包括底板和自底板边侧向上弯折的侧板，所述热源是光源，所述光源邻近背板的侧板设置，所述导热体一部分位于光源和背板的侧板之间，另一部分与背板的底板热耦合，所述光源与导热体热耦合，所述导热体与背板的侧板之间设有间隙，形成所述热阻隔机构。
- 根据权利要求3所述的背光模组，其中，所述间隙大小为0.5~4毫米。
- 根据权利要求3所述的背光模组，其中，所述热阻隔机构包括背板的侧板与底板之间弯折处断开部分，所述断开位置对应光源位置设置。
- 根据权利要求5所述的背光模组，其中，邻近所述断开位置的侧板与底板之间的弯折处设置有补强机构。
- 根据权利要求6所述的背光模组，其中，所述补强机构为设置于侧板与底板之间的弯折处的补强肋。
- 一种液晶显示装置，其中，包括液晶面板、中框、背光模组以及热阻隔机构，所述中框设置于液晶面板和背光模组之间，所述背光模组包括背板和热源，所述热源与背板相对固定设置，所述热阻隔机构设置于液晶面板与热源之间的热传递路线之中，对来自所述热源并传递至液晶面板的热进行阻隔。
- 根据权利要求8所述的液晶显示装置，其中，所述背光模组包括导热体，所述背板包括底板和自底板边侧向上弯折的侧板，所述导热体和背板的侧板位于液晶面板与热源之间的热传递路线之中，所述热源是光源，所述光源邻近背板的侧板设置，所述导热体一部分位于光源和背板的侧板之间，另一部分与背板的底板热耦合，所述光源与导热体热耦合，所述导热体与背板的侧板之间设有间隙，形成所述热阻隔机构。
- 根据权利要求9所述的液晶显示装置，其中，所述热阻隔机构包括背板的侧板与底板之间弯折处断开部分，所述断开位置对应光源位置设置。
- 根据权利要求10所述的液晶显示装置，其中，邻近所述断开位置的侧板与底板之间的弯折处设置有补强机构。
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| CN205213232U (zh) * | 2015-11-18 | 2016-05-04 | 乐视致新电子科技（天津）有限公司 | 一种用于液晶显示设备的散热结构 |
| CN107436508A (zh) * | 2016-05-25 | 2017-12-05 | 鸿富锦精密工业（深圳）有限公司 | 背光模组及液晶显示装置 |
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