WO2014073905A1 - Optical proximity sensor, and method for manufacturing same - Google Patents

Optical proximity sensor, and method for manufacturing same Download PDF

Info

Publication number
WO2014073905A1
WO2014073905A1 PCT/KR2013/010136 KR2013010136W WO2014073905A1 WO 2014073905 A1 WO2014073905 A1 WO 2014073905A1 KR 2013010136 W KR2013010136 W KR 2013010136W WO 2014073905 A1 WO2014073905 A1 WO 2014073905A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
housing plate
light
pcb substrate
optical
Prior art date
Application number
PCT/KR2013/010136
Other languages
French (fr)
Korean (ko)
Inventor
송청담
Original Assignee
(주)신오전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120126984A external-priority patent/KR101336781B1/en
Priority claimed from KR1020120145372A external-priority patent/KR101457069B1/en
Priority claimed from KR1020130067779A external-priority patent/KR101476994B1/en
Application filed by (주)신오전자 filed Critical (주)신오전자
Priority to CN201390001048.3U priority Critical patent/CN205209633U/en
Publication of WO2014073905A1 publication Critical patent/WO2014073905A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0414—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using plane or convex mirrors, parallel phase plates, or plane beam-splitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors

Definitions

  • the present invention relates to a roughness sensor that implements a function of an illuminance sensor and a proximity sensor, and more particularly, to an optical roughness sensor that can increase light efficiency, improve EMI shielding characteristics, and reduce manufacturing cost of a light source, and to manufacture the same. It is about a method.
  • proximity sensor is a sensor that detects the proximity of an object without physical contact, and according to the sensing principle, a magnetic proximity sensor, an ultrasonic proximity sensor, an electrostatic proximity sensor, an inductive proximity sensor, an optical proximity sensor, etc. Separated by.
  • Optical Proximity Sensor consists of light emitting device that emits light and light receiving device that detects light.Infrared light emitting diode (IR LED) is mainly used as light emitting device, and phototransistor or photodiode is used as light receiving device. Used.
  • the illumination sensor is for detecting the brightness of the human eye, it consists of a light receiving element for detecting a visible light region. Therefore, since the optical proximity sensor and the illuminance sensor have similar parts, the trend is to use the illuminance sensor that integrates the illuminance sensor and the proximity sensor in small electronic products such as smart phones that require the illuminance sensor and the proximity sensor at the same time. .
  • the illuminance sensor is usually implemented as a light emitting unit and a light receiving unit as one assembly.
  • the light emitting unit emits infrared rays
  • the light receiving unit detects infrared rays of the light emitting unit reflected from an object to detect an infrared light receiving unit and surrounding visible light for detecting proximity. It consists of a visible light receiving unit for detecting the illuminance.
  • Conventional muscle illuminance sensor uses an injection molded lens to increase the light efficiency of the light source to secure a certain distance from which the object (subject) starts to be detected, but to prevent leakage of light. It is necessary to take additional measures such as sealing material, and the method of forming a reflector on a single-layer PCB plate is also difficult to form a uniform through-hole in the plate, so that the yield is remarkably low and the reality is insufficient. ) Designed without considering shielding, there is a problem in that reliability is reduced in a noise environment and costs are increased by using an expensive ceramic substrate.
  • an object of the present invention is to form a through-hole in a single layer plate (plate) and to coat the metal to form a reflector accurately and simply, this plate It also serves as a housing to protect the device being accommodated. Accordingly, an object of the present invention is to improve the light efficiency of the light source, improve the EMI shielding characteristics, and improve the manufacturing process, thereby reducing manufacturing costs. It is to provide a sensor and a method of manufacturing the same.
  • another object of the present invention is to form a through hole in a plate of a single layer (plate), and then coated with a dielectric on it to prevent oxidation in the air while using silver having good reflection properties of infrared rays It is to provide an optical roughness sensor and a method of manufacturing the same that can be lowered.
  • the senor of the present invention constitutes a side wall of a first cavity for mounting an IR LED chip, and has an inverted conical hole and an optical sensor cut off at a tip having a diameter larger than a lower diameter.
  • Conical hole is formed with the cut-out of the corner of the second cavity for mounting the integrated ASIC chip and the end diameter serving as the opening is smaller than the diameter of the lower part, and the surface roughness so that the side wall of the first cavity is well reflected
  • a housing plate formed to have a mirror surface and having a metal-coated reflector integrated therein;
  • a circuit pattern is formed to be bonded to the housing plate to form a first cavity and a second cavity, and to mount the elements accommodated on the bottom surface of the first cavity and the bottom surface of the second cavity and to be connected for electrical connection.
  • IR LED chip mounted on the PCB substrate on the bottom surface of the first cavity formed by the housing plate and the PCB substrate and emitting infrared light when power is supplied; And mounted on the bottom PCB board of the second cavity formed by the housing plate and the PCB board to drive the IR LED chip when power is supplied, and to detect proximity by receiving infrared rays reflected from an object, and to detect nearby visible light. It is characterized in that it comprises a photo sensor integrated ASIC chip for detecting the illuminance of the line.
  • the method of the present invention forms a first cavity hole for mounting an IR LED chip on a housing plate, and a second cavity hole for mounting an ASIC chip with an optical sensor integrated thereon, in whole or in part.
  • the roughness sensor according to the present invention can easily form a reflector by forming a through hole in a plate, thereby improving light efficiency of the light source, improving EMI shielding properties, and protecting the device in which the plate is accommodated. It also serves as a housing, simplifying the structure, improving the process and reducing manufacturing costs.
  • the roughness sensor according to the present invention coated silver on a cavity for accommodating infrared LEDs, and then coated a dielectric thereon to prevent oxidation in the air and improve light efficiency while using silver having good reflection characteristics of infrared rays.
  • a dielectric thereon to prevent oxidation in the air and improve light efficiency while using silver having good reflection characteristics of infrared rays.
  • the roughness sensor according to the present invention may use any one of plastic, rubber, silicone, foam, sponge, resin, and metal as the upper cap, and in the case of rubber, silicone, foam, and sponge, the adhesion to the mechanism is improved, and There is an additional effect that can prevent the parts from being destroyed by this.
  • FIG. 2 is a side cross-sectional view of an optical roughness sensor according to a first embodiment of the present invention
  • FIG. 3 is a perspective view of the housing plate shown in FIG.
  • FIG. 4 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention.
  • FIG. 5 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention.
  • FIG. 6 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention.
  • FIG. 7 is a block diagram illustrating an optical roughness sensor according to the present invention.
  • FIG. 1 is a schematic diagram illustrating a manufacturing procedure of a roughness sensor according to the present invention.
  • the manufacturing process of the roughness sensor according to the present invention includes forming a hole for a reflector and a mounting space in a square plate and coating a metal with a first sub-assembly process (S1 to S3), and a rectangular PCB.
  • the copper foil layer is formed, after the gold plating, the through hole is processed, and a pad for connecting with the outside is formed to mount the LED chip on the bottom part of the PCB board and the ASIC chip on the other part of the bottom board PCB.
  • a predetermined encapsulation process may be performed before or after the step S10. This process is based on a general purpose and a method of application, and thus is not particularly limited.
  • sidewalls of a cavity for mounting an IR LED chip and an ASIC chip are formed by forming through holes having a predetermined shape in a square plate (S1, S2).
  • the shape of the through hole for the cavity is a cone with a cut off or a cone with a cut off, a cylinder, an oval with a cut off, an inverted cone with a cut off, a square cone with a cut off, an inverted prismatic cone, an elliptical column, a square column, Or a variety of shapes, such as the double bond type of the above form (for example, a cylinder is possible on the square column) is possible.
  • the rectangular plate formed with the cavity also serves as a housing for accommodating the element.
  • the square plate is referred to as a 'housing plate'.
  • the housing plate is formed of a metal or plastic material by processing or injection molding, and all or a part of the reflector formed on the plate is coated with a metal such as gold or silver, thereby implementing the reflector integrated housing structure (S3).
  • the plated silver may be coated with a dielectric to prevent oxidation in the air while using silver having good reflection characteristics of infrared rays, thereby lowering the manufacturing cost.
  • the optical thickness of the dielectric thin film it is possible to increase the reflectance of the reflected light in the desired wavelength range to enhance the light reflected from the silver without loss, and as a dielectric, SiO 2 , TiO 2 , Al 2 O 3 And the like can be used.
  • the housing plate and the PCB are bonded to each other to complete an assembly having a first cavity in which an IR LED chip is mounted and a second cavity in which an ASIC chip is mounted (S10).
  • the cap is attached to the upper portion of the housing plate as necessary (S11).
  • the upper cap may be made of plastic, silicone, rubber, foam, sponge, resin, or metal. In the case of rubber, silicone, foam, and sponge, the upper cap may have an additional effect of improving device adhesion. You can get it.
  • the manufacturing cost can be reduced by easily forming holes in the housing plate using processing technology or injection molding.
  • the roughness sensor according to the present invention can increase the light efficiency by the reflector structure itself integrated into the housing plate for protecting the element to be accommodated, so that the condensation of the radiated light through the reflector is increased and consequently reflected from the subject to the light sensor Since the amount of light reached increases, it is possible to detect light reflected from a subject at a greater distance.
  • the integration time can be shortened, so that the proximity detection response speed or the output signal processing speed can be increased, and the metal such as gold is coated on the reflective surface to increase the light efficiency. Can be.
  • FIG. 2 is a side cross-sectional view of an optical roughness sensor according to a first embodiment of the present invention
  • 3 is a perspective view of a housing plate 110 used in the first embodiment of the present invention.
  • the optical roughness sensor 100 has an inverted corner of the sidewall 114a of the first cavity 112 for mounting the IR LED chip 140.
  • Conical holes hereinafter referred to simply as 'inverted cones'
  • conical holes hereinafter referred to as simply 'conical holes'
  • the side wall (114a) constituting the first cavity (112) is formed to have a mirror surface with a roughness of the surface so that the reflection is good, the reflector-integrated housing plate material 110 and the metal plate coated, the housing plate material 110 and Are bonded to form a first cavity 112 and a second cavity 118, and an IR LED chip 140 and an optical sensor integrated ASIC chip 150 on the bottom surfaces of the first cavity 112 and the second cavity 118.
  • a hole having a diameter of an end serving as an opening having a conical shape smaller than a diameter of a lower portion is formed, and is bonded to the PCB substrate 120 to form a second cavity 118.
  • the IR LED 140 When mounted on a PCB board on the bottom of the cavity, when the power is supplied, the IR LED 140 is driven and an infrared light reflected from the object is received to detect proximity and to detect the illuminance of visible light in the surroundings.
  • Cone formed in housing plate for drawing light It consists of an opening (118a) formed at the hole edge.
  • the IR LED chip 140 and the ASIC 150 are bonded to the PCB substrate 120 through the adhesive 162.
  • the housing plate 110 of the first embodiment includes a first cavity hole 112 formed in an inverted cone shape in which the diameter of the end serving as the opening 112a is larger than the diameter of the lower portion.
  • the second cavity hole 118 is formed in a conical shape having a diameter smaller than the diameter of the lower end of the tip 118a.
  • the side wall 114a constituting the first cavity 112 may be formed. It has a roughness of the surface to reflect well and is formed to be a mirror surface, and a metal such as gold is coated. The coating of metal is applied to all or part of the housing plate 110.
  • a silver coated layer 10 coated with silver having good infrared reflecting properties is formed on the sidewall 114a, and to prevent oxidation of silver on the silver coated layer.
  • Dielectric is coated to form dielectric layer 20.
  • the housing plate 110 of the first embodiment forms an inverted cone reflector in the first cavity 112 to efficiently radiate the light emitted from the IR LED 140 toward the opening 112a, and the housing plate (
  • the metal cavity is formed of a metal hole formed in the second cavity 118 and a metal layer formed on the PCB substrate 120 bonded to the housing plate, so that the second cavity is made of a metal body to be accommodated in the second cavity 118. It is possible to greatly shield the device from electromagnetic noise.
  • the housing plate 110 When the housing plate 110 is made of a plastic material, if necessary, that is, when the influence from electromagnetic noise occurs, the plate 110 is coated with a metal to shield the electromagnetic noise.
  • an opening 112a is formed at an end of an inverted conical hole formed in the housing plate 110 to emit light of the IR LED 140 from the first cavity 112, and the ASIC chip also is formed in the second cavity 118.
  • An opening 118a is formed at the end of the conical hole formed in the housing plate 110 to introduce light to the light receiving portion side of the 150.
  • the roughness sensor 100 has an inverted cone shape in which the diameter of the tip, which serves as the opening 112a, is greater than the diameter of the lower portion of the housing plate 110 that protects the received device. While forming a hole, a diagonal sidewall 114a is formed to be a mirror surface and coated with a metal. Then, the copper foil layer 122a is formed on the upper surface of the PCB substrate 120, and gold plating is performed. Then, the IR LED 140 is mounted thereon, and then coupled with the housing plate 110 to form a stem having a reflector shape. ) Constitutes a first cavity 122. Since the light emitted from the IR LED 140 of the first cavity 112 configured as described above is reflected by a reflector having an inverted cone shape, the light emitted can be efficiently passed through the opening 112a of the upper portion of the housing plate. have.
  • the plate 110 having a cavity is used as a housing, but considering that the height capable of constructing the reflector in the first cavity 112 is up to the thickness (height) of the plate, the plate 110 is a single layer. Since the thickness is sufficient to serve as the housing, it can afford to secure the height of the side wall of the reflector, thereby making it possible to lengthen the reflection path, which is a major factor for increasing the light condensing of the light emitted from the IR LED 140, and sufficiently reflects the light. I can make it big.
  • the present invention provides a single layer of reflector-integrated housing plate with a simple structure, thereby increasing space utilization and making it possible to fully utilize the height of the single layer, thereby easily securing a sufficient reflection path. The light efficiency can be increased.
  • the reflector configured in this way has a high emissivity in the direction of the direction of the opening surface as the light emitted in any direction from the IR LED passes through a long reflective path with a predetermined angle of inclined surface, so that the light condensation is increased without the lens and radiated within the required angle.
  • the amount of light is easily increased, and the light distribution of the emitted light and the amount of light are also easily adjusted by adjusting the angle of the reflection surface of the side wall.
  • the roughness sensor 100 can increase the light efficiency by the reflector structure itself integrated into the housing combined plate for protecting the element to be accommodated, so that the light condensation of the radiation is increased through the reflector
  • the amount of light that is reflected from the subject and reaches the light sensor also increases, so if you use a light sensor with a fixed detection power and an IR LED with a fixed self-emission light, It is possible to detect and reduce the integration time by quickly accumulating the required amount of critical light in the ASIC chip 150 integrated with the optical sensor, thereby increasing the proximity sensing response speed or the output signal processing speed, and the reflection surface of the metal such as gold
  • the coating can be performed to increase the light efficiency.
  • the detection distance of the subject can be further increased, and conversely, depending on the application, the detection distance may be lowered to a certain level required for use. In this way, the amount of emitted light of the IR LED 140 is increased. It is possible to reduce the area of the LED chip, which is one of the main factors to determine the cost, which also reduces the cost.
  • the light emitted to the side of the IR LED 140 may also be radiated to the opening 112a by the reflecting surface configured up to the side of the IR LED.
  • the light-receiving unit for detecting the light emitted from the first cavity (C1) reflected by the object is conical shape of the end of the end portion that serves as the opening 118a in the housing plate 110 is smaller than the diameter of the lower portion
  • the sidewalls 114b of the furnace holes are formed, the copper foil layer 122b is formed on the upper surface of the PCB substrate 120, and gold plating is performed.
  • the ASIC chip 150 having an optical sensor is mounted thereon, and then metal is coated.
  • the second cavity 118 is configured by combining with the housing plate 110.
  • the second cavity 118 configured as described above has the advantage that the EMI shielding property is improved even in the strong electromagnetic noise environment in which the ASIC chip 150 is shielded by the metal on the sidewall part and the lower part.
  • the housing plate 110 uses a plate of metal or plastic, and a metal coating is applied to all or part of the plate, in particular, in the case of applying a metal coating to only a portion of the plate 110 of plastic, the effect of electromagnetic noise is In a generated environment, a metal coating may be applied to the side walls of the second cavity 118 to prepare for electromagnetic noise.
  • first cavity 112 and the second cavity 118 are made of an opaque plastic-based material coated with metal or metal, the light emitted from the IR LED 140 is transferred to the photosensor of the ASIC chip 150. It is also possible to prevent leakage and cross talk.
  • the material of the reflector integrated housing plate 110 uses a conventional metal or an injection molded opaque plastic material, and the metal coated on the housing plate 110 uses a material that effectively reflects infrared rays such as gold.
  • PCB substrate 120 uses a material used for the PCB, for example FR-4.
  • FIG. 4 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention.
  • the optical roughness sensor 200 includes an inverted conical hole constituting a side wall of the first cavity 212 for mounting the IR LED chip 240.
  • a housing plate 210 having a square column-shaped hole constituting the side wall of the second cavity 218 and the housing plate 210 to be joined to form a first cavity 212 and a second cavity 218, and Square PCB board with circuit pattern formed to mount IR LED chip 240 and optical sensor integrated ASIC chip 250 on the bottom surface of first cavity 212 and second cavity 218 and connect them for electrical connection.
  • An IR LED chip 240 mounted on the PCB substrate on the bottom surface of the first cavity 212 formed by the housing plate 210 and the PCB substrate 220, and emits infrared rays when the power is supplied. And mounted on the PCB substrate on the bottom surface of the second cavity 212 formed by the housing plate 210 and the PCB substrate 220 to supply power. If also drive the IR LED chip 240 and the light-receiving as well as the infrared ray reflected by the object to detect a close-up and consists of a light sensor-integrated ASIC chip 250, which detects the intensity of visible light in the surrounding. Through-holes 224a and 224b and connection pads 226-1 to 226-5 for signal connection are formed in the PCB substrate 220.
  • the optical roughness sensor 200 of the second exemplary embodiment may connect the ASIC chip 250 and the reverse conical sidewall 214a of the first cavity 212 to accommodate the IR LED chip 240 in the housing plate 210.
  • a hole for the straight wall sidewall 214b of the second cavity 218 for receiving is formed, and the PCB substrate 220 has an IR LED (on the PCB substrate 220 of the bottom surface 222a of the first cavity 212).
  • 240 is mounted and the ASIC chip 250 is mounted on the PCB substrate 220 of the bottom surface 222b of the second cavity 218.
  • light is introduced into the light-receiving side of the ASIC chip 250 from the end of the inverted conical hole formed in the housing plate 210 and the second cavity 218 to emit light of the IR LED chip 240 from the first cavity 212.
  • Openings 212a and 218a are formed at the ends of the rectangular pillar-shaped holes formed in the housing plate 210, respectively.
  • the roughness sensor 200 has a diameter of the lower end of the end portion serving as the opening 212a in the housing plate 210 for protecting the received device. While forming a hole in a larger inverted cone shape, the diagonal side wall 214a is formed to be a mirror surface and coated with metal, and a copper foil layer 222a is formed on the upper surface of the PCB substrate 220, and then gold plating is performed. After mounting the IR LED 240 thereon, the first cavity 212 is configured as a kind of stem structure having a reflector shape by combining with the housing plate 210.
  • the light emitted from the IR LED 240 of the first cavity configured as described above is reflected by a reflector having an inverted cone shape, there is an advantage that the emitted light can be efficiently passed through the opening (Apature) 212a above the housing plate.
  • the light receiving unit for detecting the light emitted from the first cavity 212 reflected by the object is formed in the housing plate 210 to form a hole in a straight wall for mounting the ASIC 250 including a processor
  • the side wall 214b of the second cavity 218 is formed, the copper foil layer 222b is formed at the center of the upper surface of the PCB substrate 220, and gold plating is performed thereon, and then the ASIC chip 250 is mounted thereon.
  • the second cavity 218 is combined with the coated housing plate 210 to form the second cavity 218.
  • the ASIC chip 250 is shielded by the metal on the sidewall and the lower portion, so that EMI shielding characteristics are improved even in the surrounding strong electromagnetic noise environment.
  • the housing plate 210 uses a metal or plastic-based plate, and the metal coating is applied to all or part of the reflector formed on the plate, in particular, in the case of applying a metal coating to only a part of the plate 210 of plastic
  • a metal coating may be applied to the side walls of the second cavity 218 to prepare for electromagnetic noise.
  • a silver coated layer 10 coated with silver having good infrared reflection characteristics is formed on the sidewall 214a as shown in the enlarged view of FIG. 4, and oxidation of silver on the silver coated layer is performed.
  • oxidation of silver on the silver coated layer is performed.
  • dielectric is coated to form a dielectric layer 20.
  • first cavity 212 and the second cavity 218 are made of a metal or metal-based opaque plastic material, light emitted from the IR LED 240 is transferred to the photosensor of the ASIC chip 250. It is also possible to prevent leakage and cross talk.
  • FIG. 5 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention.
  • an inverted conical hole constituting the sidewall of the first cavity 312 for mounting the IR LED chip 340 is formed, and the sidewall of the inverted conical hole ( 314a is formed to have a mirror surface with good surface roughness to reflect well, and the reflector-integrated housing plate material 310 coated with metal and the housing plate material 310 are joined to form a first cavity 312, A rectangular PCB substrate 320 having a circuit pattern formed thereon so as to mount the IR LED chip 340 on the bottom surface 322a of the cavity and to be connected for electrical connection, and by the housing plate 310 and the PCB substrate 320.
  • the hole 314b is formed in the shape of a small cone and bonded to the PCB substrate 320 to form a second cache.
  • the tee 318 is formed and mounted on the PCB substrate 310 at the bottom of the second cavity 318, when the power is supplied, the IR LED 340 is driven and the infrared light reflected from the object is received to detect proximity.
  • the roughness sensor 300 is coupled with a housing plate 310 in which a reflector is integrated while protecting an element accommodated in the configuration of the present invention described in the first embodiment.
  • an opening 332 for emitting light of the IR LED 340 is formed on the first cavity 312 in which the IR LED 340 is mounted, and the light receiving part of the ASIC chip 350 is disposed on the second cavity 318.
  • An upper cap 330 having an opening 332 for introducing light to the side is further configured.
  • a silver coated layer 10 coated with silver having good infrared reflection characteristics is formed on the sidewall 314a as shown in the enlarged view of FIG. 5, and oxidation of silver on the silver coated layer is performed.
  • oxidation of silver on the silver coated layer is performed.
  • dielectric is coated to form a dielectric layer 20.
  • the first embodiment can be applied to a smart phone, etc. without the addition of a separate component to implement the effect of the present invention, but the optical and mechanical conformation of the light emission and incoming in the mobile phone to which the product of the first embodiment is applied
  • the additional upper cap 330 is configured as described above, the present invention freely adjusts the distance or aperture between the openings of the upper cap 330 without changing other components. There is an advantage that can facilitate easy matching.
  • the upper cap 330 may be formed of plastic, rubber, silicone, foam, sponge, resin, or metal. In the case of silicone, rubber, foam, and sponge, the adhesion Additional effects can be obtained.
  • FIG. 6 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention.
  • the optical roughness sensor 400 has a housing plate 410 in which a reflector is integrated while protecting an element accommodated in the configuration of the invention described in the second embodiment. ) And an opening 432 for emitting the light of the IR LED 440 is formed on the first cavity 412 on which the IR LED 440 is mounted, and the ASIC chip 450 is disposed on the second cavity 418.
  • the upper cap 430 of the quadrangular formed with an opening 432 for introducing light to the light-receiving portion side of the) is further configured.
  • a silver coated layer 10 coated with good infrared reflection characteristics is formed on the sidewall 414a as shown in the enlarged view of FIG. 4, and oxidation of silver on the silver coated layer is performed.
  • oxidation of silver on the silver coated layer is performed.
  • dielectric is coated to form a dielectric layer 20.
  • the second embodiment can be applied to a smart phone, etc. without the addition of a separate component to implement the effect of the present invention, but the optical and mechanical conformation of the light emission and incoming in the mobile phone to which the product of the second embodiment is applied
  • the additional upper cap 430 is configured as described above, the present invention freely adjusts the distance or aperture between the openings of the upper cap 430 without changing other components. There is an advantage that can facilitate easy matching.
  • the upper cap 430 may be formed of plastic, rubber, silicon, foam, sponge, resin, or metal, and in the case of silicon, rubber, foam, and sponge Additional effects can be obtained.
  • the ASIC chips 150 to 450 and the IR LEDs 140 to 440 are connected to each other through a copper foil pattern or wiring bonding of a PCB (not shown), and holes or via holes 124 to 424.
  • a PCB not shown
  • the housing plate which is itself metal or metal-coated, may be connected to the connection terminal formed on the bottom surface of the PCB substrate and grounded through a hole or via hole, if necessary.
  • the PCB substrates 120 to 420 have a structure in which a copper foil layer is formed on the FR-4 substrate.
  • one of the conventional methods is encapsulation with resin, epoxy, and silicon.
  • FIG. 7 is a block diagram illustrating an optical roughness sensor according to the present invention.
  • the roughness sensor includes an infrared light emitting diode (IR LED) 140 emitting infrared rays, an infrared ray sensing unit 151 for receiving infrared rays reflected from an object, and infrared sensing
  • An analog-to-digital converter 152 for converting the analog detection signal of the unit 151 to digital, an illumination intensity sensing unit 153 for sensing the illumination of visible light in the surroundings, and an analog sensing signal for converting the analog sensing signal of the illumination sensing unit into digital
  • An interface and a controller 156 for controlling the driver 157, and an IR LED driver 157 for driving the infrared light emitting diode 140.
  • the IR detector 151, the ADCs 152 and 154, the illumination intensity detector 153, the DSP 155, the interface and the controller 156, and the IR LED driver 157 are implemented by the ASIC chip 150.
  • the interface and controller 156 communicates with an external controller 42 in an I2C interface.
  • the IR detector 151 is an infrared photodiode for sensing proximity and the illuminance detector 153 is a photodiode for sensing illuminance of visible light in the surroundings.
  • the controller 42 exchanges data via the interrupt line INTB, SCL line, and SDA line.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Remote Sensing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

The present invention relates to an optical proximity sensor which is capable of improving the optical efficiency of a light source, which has improved EMI shielding characteristics, and which can be manufactured at a reduced manufacturing cost. The sensor of the present invention comprises: a reflector integrated housing plate having an inverse conical hole with a cut-out vertex and a conical hole with a cut-out vertex, the inverse conical hole forming a side wall of a first cavity for mounting an IR LED chip and having an upper end serving as an aperture with a diameter larger than the diameter of the lower end thereof, the conical hole forming a side wall of a second cavity for mounting an optical sensor integrated ASIC chip and having an upper end serving as an aperture with a diameter smaller than the diameter of the lower end thereof, each hole having a side wall with a mirror surface having a surface illumination for easy reflection, the whole or a portion of the plate being coated with metal, and the plate serving as a housing for protecting elements accommodated therein; a PCB substrate which is bonded to the housing plate so as to form a first cavity and a second cavity, and which has a circuit pattern formed thereon so as to mount elements received on the bottom surface of the first cavity and the bottom surface of the second cavity and enable wiring for electrical connection; the IR LED chip which is mounted on the PCB substrate on the bottom surface of the first cavity formed by the housing plate and the PCB substrate, and which emits infrared ray when powered; and the optical sensor integrated ASIC chip mounted onto the PCB substrate on the bottom surface of the second cavity formed by the housing plate and the PCB substrate so as to drive, when powered, the IR LED chip and receive infrared rays reflected by an object so as to sense proximity and to thus sense the intensity of illumination of the ambient visible light.

Description

광학 근조도 센서 및 그 제조방법 Optical roughness sensor and manufacturing method
본 발명은 조도센서와 근접센서 기능을 일체로 구현한 근조도 센서에 관한 것으로, 더욱 상세하게는 광원의 광효율을 높이고 EMI 차폐 특성이 향상되며 제조비용을 절감할 수 있는 광학 근조도센서 및 그 제조방법에 관한 것이다.The present invention relates to a roughness sensor that implements a function of an illuminance sensor and a proximity sensor, and more particularly, to an optical roughness sensor that can increase light efficiency, improve EMI shielding characteristics, and reduce manufacturing cost of a light source, and to manufacture the same. It is about a method.
일반적으로, 근접센서(Proximity Sensor)는 물리적인 접촉 없이 사물의 접근을 감지하는 센서로서, 감지원리에 따라 자기 근접센서와, 초음파 근접센서, 정전형 근접센서, 유도성 근접센서, 광학 근접센서 등으로 구분된다. 광학 근접센서(Optical Proximity Sensor)는 빛을 발생하는 발광소자와 빛을 감지하는 수광소자로 이루어지는데, 발광소자로는 주로 적외선 발광다이오드(IR LED)가 사용되고 수광소자로는 포토 트랜지스터나 포토 다이오드가 사용된다.Generally, proximity sensor is a sensor that detects the proximity of an object without physical contact, and according to the sensing principle, a magnetic proximity sensor, an ultrasonic proximity sensor, an electrostatic proximity sensor, an inductive proximity sensor, an optical proximity sensor, etc. Separated by. Optical Proximity Sensor consists of light emitting device that emits light and light receiving device that detects light.Infrared light emitting diode (IR LED) is mainly used as light emitting device, and phototransistor or photodiode is used as light receiving device. Used.
한편, 조도센서는 인간의 눈이 느끼는 밝기를 감지하기 위한 것으로, 가시광 영역을 감지하는 수광소자로 이루어진다. 따라서 광학 근접센서와 조도센서는 유사한 부분이 있으므로, 조도센서와 근접센서를 동시에 필요로 하는 소형 전자제품 예컨대, 스마트 폰 등에는 조도센서와 근접센서를 일체로 구현한 근조도 센서를 사용하는 추세이다.On the other hand, the illumination sensor is for detecting the brightness of the human eye, it consists of a light receiving element for detecting a visible light region. Therefore, since the optical proximity sensor and the illuminance sensor have similar parts, the trend is to use the illuminance sensor that integrates the illuminance sensor and the proximity sensor in small electronic products such as smart phones that require the illuminance sensor and the proximity sensor at the same time. .
근조도 센서는 통상 발광부와 수광부가 하나의 조립체로 구현되는데, 발광부는 적외선을 방사하고, 수광부는 사물에서 반사된 발광부의 적외선을 감지하여 근접을 검출하기 위한 적외선 수광부와 주변의 가시광선을 감지하여 조도를 검출하기 위한 가시광선 수광부로 이루어진다.The illuminance sensor is usually implemented as a light emitting unit and a light receiving unit as one assembly. The light emitting unit emits infrared rays, and the light receiving unit detects infrared rays of the light emitting unit reflected from an object to detect an infrared light receiving unit and surrounding visible light for detecting proximity. It consists of a visible light receiving unit for detecting the illuminance.
종래의 근조도 센서는 사물(피사체)이 접근하고 있음을 검출하기 시작하는 일정 거리를 확보하기 위하여 광원의 광효율을 높이는 방법으로 사출 성형된 렌즈를 사용하였으나 빛의 누설(leakage)을 방지하기 위하여 별도의 밀봉재와 같은 추가적인 조치가 필요하고, 단일층의 PCB 판재에 반사경을 형성하는 방법도 판재에 균일한 모양의 미관통홀을 형성하기 어려워 수율이 현저히 떨어져 현실성이 미흡한 문제점이 있으며, EMI(electromagnetic interference) 차폐를 고려하지 않고 설계되어 노이즈 환경에서 신뢰성이 떨어지고, 고가의 세라믹 기판을 사용하여 비용이 증가하는 문제점이 있다.Conventional muscle illuminance sensor uses an injection molded lens to increase the light efficiency of the light source to secure a certain distance from which the object (subject) starts to be detected, but to prevent leakage of light. It is necessary to take additional measures such as sealing material, and the method of forming a reflector on a single-layer PCB plate is also difficult to form a uniform through-hole in the plate, so that the yield is remarkably low and the reality is insufficient. ) Designed without considering shielding, there is a problem in that reliability is reduced in a noise environment and costs are increased by using an expensive ceramic substrate.
본 발명은 상기와 같은 문제점들을 해소하기 위해 제안된 것으로, 본 발명의 목적은 단일층의 판재(plate)에 관통 홀을 형성하고 금속을 코팅하여 반사경을 정밀하면서도 간단하게 형성할 수 있고, 이 판재는 수용되는 소자를 보호하기 위한 하우징(housing) 역할도 겸하게 한다. 이에 따라 본 발명의 목적은 광원의 광효율성을 높이고 EMI 차폐 특성이 향상되며 공정을 개선하여 제조비용을 절감할 수 있는 반사경 일체형 구조의 하우징 판재에 발광부와 수광부가 하나의 조립체로 구성된 광학 근조도 센서 및 그 제조방법을 제공하는 것이다.The present invention has been proposed to solve the above problems, an object of the present invention is to form a through-hole in a single layer plate (plate) and to coat the metal to form a reflector accurately and simply, this plate It also serves as a housing to protect the device being accommodated. Accordingly, an object of the present invention is to improve the light efficiency of the light source, improve the EMI shielding characteristics, and improve the manufacturing process, thereby reducing manufacturing costs. It is to provide a sensor and a method of manufacturing the same.
또한 본 발명의 다른 목적은 단일층의 판재(plate)에 관통 홀을 형성하고 은을 코팅한 후 그 위에 유전체를 코팅하여 적외선의 반사특성이 양호한 은을 사용하면서도 공기중에서 산화되는 것을 방지하여 제조단가를 낮출 수 있는 광학 근조도 센서 및 그 제조방법을 제공하는 것이다.In addition, another object of the present invention is to form a through hole in a plate of a single layer (plate), and then coated with a dielectric on it to prevent oxidation in the air while using silver having good reflection properties of infrared rays It is to provide an optical roughness sensor and a method of manufacturing the same that can be lowered.
상기와 같은 목적을 달성하기 위하여 본 발명의 센서는, IR LED칩을 실장하기 위한 제1 캐비티의 측벽을 구성하며 개구부 역할을 하는 끝단의 직경이 하부의 직경보다 큰 꼭지가 잘린 역원뿔형 홀과 광센서 일체형 ASIC칩을 실장하기 위한 제2 캐비티의 측벽을 구성하며 개구부 역할을 하는 끝단의 직경이 하부의 직경보다 작은 꼭지가 잘린 원뿔형 홀이 형성되어 있고, 제1 캐비티의 측벽이 반사가 잘 되도록 표면의 조도를 갖추어 경면이 되도록 형성되고 금속이 코팅된 반사경이 일체화된 하우징 판재; 상기 하우징 판재와 접합되어 제1 캐비티와 제2 캐비티를 형성하며, 제1 캐비티의 바닥면과 제2 캐비티의 바닥면에 수용되는 소자를 각각 마운트하고 전기적 접속을 위해 결선할 수 있도록 회로 패턴이 형성된 PCB 기판; 상기 하우징 판재와 상기 PCB 기판에 의해 형성된 제1 캐비티의 바닥면의 PCB 기판에 마운트되어 있고, 전원이 공급되면 적외선을 방출하는 IR LED칩; 및 상기 하우징 판재와 상기 PCB 기판에 의해 형성된 제2 캐비티의 바닥면 PCB 기판에 실장되어 전원이 공급되면 상기 IR LED칩을 구동함과 아울러 물체에서 반사된 적외선을 수광하여 근접을 감지하며 주변의 가시광선의 조도를 감지하는 광센서(photo sensor) 일체형 ASIC칩을 포함하여 구성된 것을 특징으로 한다.In order to achieve the above object, the sensor of the present invention constitutes a side wall of a first cavity for mounting an IR LED chip, and has an inverted conical hole and an optical sensor cut off at a tip having a diameter larger than a lower diameter. Conical hole is formed with the cut-out of the corner of the second cavity for mounting the integrated ASIC chip and the end diameter serving as the opening is smaller than the diameter of the lower part, and the surface roughness so that the side wall of the first cavity is well reflected A housing plate formed to have a mirror surface and having a metal-coated reflector integrated therein; A circuit pattern is formed to be bonded to the housing plate to form a first cavity and a second cavity, and to mount the elements accommodated on the bottom surface of the first cavity and the bottom surface of the second cavity and to be connected for electrical connection. PCB substrate; An IR LED chip mounted on the PCB substrate on the bottom surface of the first cavity formed by the housing plate and the PCB substrate and emitting infrared light when power is supplied; And mounted on the bottom PCB board of the second cavity formed by the housing plate and the PCB board to drive the IR LED chip when power is supplied, and to detect proximity by receiving infrared rays reflected from an object, and to detect nearby visible light. It is characterized in that it comprises a photo sensor integrated ASIC chip for detecting the illuminance of the line.
상기와 같은 목적을 달성하기 위하여 본 발명의 방법은, 하우징 판재에 IR LED칩을 실장하기 위한 제1 캐비티 홀과, 광센서 일체형 ASIC칩을 실장하기 위한 제2 캐비티 홀을 형성하고, 전부 또는 일부에 금속을 코팅하는 단계; PCB 기판을 준비한 후 동박층 형성 및 금 도금 후 쓰루 홀을 가공하고, 외부와 접속을 위한 패드를 형성하여 PCB 기판의 제1 캐비티 홀 영역에 LED칩을 실장하고 PCB 기판의 제2 캐비티 홀 영역에 광센서 일체형 ASIC칩을 실장하는 단계; 및 상기 하우징 판재와 상기 PCB 기판을 결합하여 조립체를 구성하는 단계; 및 필요에 따라 상부 캡을 부착하는 단계를 포함하여 구성된 것을 특징으로 한다.In order to achieve the above object, the method of the present invention forms a first cavity hole for mounting an IR LED chip on a housing plate, and a second cavity hole for mounting an ASIC chip with an optical sensor integrated thereon, in whole or in part. Coating a metal on the substrate; After preparing the PCB substrate, after forming the copper foil layer and gold plating, through holes are processed, and pads for external connection are formed to mount the LED chip in the first cavity hole region of the PCB substrate and to the second cavity hole region of the PCB substrate. Mounting an optical sensor integrated ASIC chip; And combining the housing plate and the PCB substrate to construct an assembly. And attaching an upper cap as necessary.
본 발명에 따른 근조도 센서는, 판재에 관통 홀을 형성하여 반사경을 용이하게 형성할 수 있고, 이에 따라 광원의 광효율성을 높이고 EMI 차폐 특성이 향상되며, 상기 판재가 수용되는 소자를 보호하기 위한 하우징 역할도 겸하게 되어 구조가 간단하게 되므로 공정이 개선되고 제조비용을 절감할 수 있다. The roughness sensor according to the present invention can easily form a reflector by forming a through hole in a plate, thereby improving light efficiency of the light source, improving EMI shielding properties, and protecting the device in which the plate is accommodated. It also serves as a housing, simplifying the structure, improving the process and reducing manufacturing costs.
특히, 본 발명에 따른 근조도 센서는 적외선 LED를 수용하기 위한 캐비티에 은을 코팅한 후 그 위에 유전체를 코팅하여 적외선의 반사특성이 양호한 은을 사용하면서도 공기 중에서 산화되는 것을 방지하고 광효율을 높이면서도 제조단가를 낮출 수 있는 장점이 있다.In particular, the roughness sensor according to the present invention coated silver on a cavity for accommodating infrared LEDs, and then coated a dielectric thereon to prevent oxidation in the air and improve light efficiency while using silver having good reflection characteristics of infrared rays. There is an advantage that can lower the manufacturing cost.
또한 본 발명에 따른 근조도 센서는 상부 캡으로서 플라스틱이나 러버, 실리콘, 폼, 스폰지, 수지, 금속 중 어느 하나를 사용할 수 있고, 러버와 실리콘, 폼, 스폰지의 경우 기구와 밀착성이 향상되고 충격에 의해 부품이 파괴되는 것을 방지할 수 있는 부가적인 효과가 있다. In addition, the roughness sensor according to the present invention may use any one of plastic, rubber, silicone, foam, sponge, resin, and metal as the upper cap, and in the case of rubber, silicone, foam, and sponge, the adhesion to the mechanism is improved, and There is an additional effect that can prevent the parts from being destroyed by this.
도 1은 본 발명에 따른 근조도 센서의 제조 절차를 도시한 순서도,1 is a flow chart showing a manufacturing procedure of the roughness sensor according to the present invention,
도 2는 본 발명의 제 1 실시예에 따른 광학 근조도 센서의 측단면도,2 is a side cross-sectional view of an optical roughness sensor according to a first embodiment of the present invention;
도 3은 도 2에 도시된 하우징 판재의 사시도,3 is a perspective view of the housing plate shown in FIG.
도 4는 본 발명의 제 2 실시예에 따른 광학 근조도 센서의 측단면도,4 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention;
도 5는 본 발명의 제 3 실시예에 따른 광학 근조도 센서의 측단면도,5 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention;
도 6은 본 발명의 제 4 실시예에 따른 광학 근조도 센서의 측단면도,6 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention;
도 7은 본 발명에 따른 광학 근조도 센서의 구성 블럭도이다.7 is a block diagram illustrating an optical roughness sensor according to the present invention.
본 발명과 본 발명의 실시에 의해 달성되는 기술적 과제는 다음에서 설명하는 본 발명의 바람직한 실시예들에 의하여 보다 명확해질 것이다. 다음의 실시예들은 단지 본 발명을 설명하기 위하여 예시된 것에 불과하며, 본 발명의 범위를 제한하기 위한 것은 아니다.The technical problems achieved by the present invention and the practice of the present invention will be more clearly understood by the preferred embodiments of the present invention described below. The following examples are merely illustrated to illustrate the present invention and are not intended to limit the scope of the present invention.
도 1은 본 발명에 따른 근조도 센서의 제조 절차를 도시한 개략도이다.1 is a schematic diagram illustrating a manufacturing procedure of a roughness sensor according to the present invention.
본 발명에 따른 근조도 센서의 제조절차는 도 1에 도시된 바와 같이, 사각 판재에 반사경 및 실장공간을 위한 홀을 형성하고 금속을 코팅하는 제1 서브 어셈블리 과정(S1~S3)과, 사각 PCB 기판을 준비한 후 동박층을 형성시키고 금 도금 후 쓰루 홀을 가공하고 외부와 접속을 위한 패드를 형성하여 PCB 기판의 바닥면 일부에 LED칩을 실장하고 PCB 기판의 바닥면 다른 일부에 ASIC칩을 실장하여 와이어 본딩하는 제2 서브 어셈블리 과정(S4~S9)과, 사각 판재와 PCB기판을 결합하여 조립체를 구성한 후 필요에 따라 상부 캡(커버)을 부착하는 메인 어셈블리 과정(S10~S11)으로 구성된다. 수용되는 소자와 본딩된 와이어를 보호하기 위하여 S10 단계의 앞 또는 뒤의 과정에서 소정의 encapsulation 공정을 수행할 수 있는데, 이 과정은 통상의 목적과 활용 방법에 의한 것이므로 특별히 한정하지 않았다.As shown in FIG. 1, the manufacturing process of the roughness sensor according to the present invention includes forming a hole for a reflector and a mounting space in a square plate and coating a metal with a first sub-assembly process (S1 to S3), and a rectangular PCB. After preparing the board, the copper foil layer is formed, after the gold plating, the through hole is processed, and a pad for connecting with the outside is formed to mount the LED chip on the bottom part of the PCB board and the ASIC chip on the other part of the bottom board PCB. The second sub-assembly process (S4 ~ S9) of wire bonding, and the main assembly process (S10 ~ S11) of attaching the upper cap (cover) as necessary after combining the square plate and the PCB board to configure the assembly. . In order to protect the device and the bonded wire to be accommodated, a predetermined encapsulation process may be performed before or after the step S10. This process is based on a general purpose and a method of application, and thus is not particularly limited.
도 1을 참조하면, 본 발명에 따른 실시예의 제1 서브 어셈블리 과정에서는 사각 판재에 소정 형상의 관통 홀을 형성하여 IR LED칩과 ASIC칩을 실장하기 위한 캐비티의 측벽을 형성한다(S1,S2). 예컨대, 캐비티를 위한 관통홀의 형상은 꼭지가 잘린 원뿔형이나 꼭지가 잘린 역원뿔형, 원기둥형, 꼭지가 잘린 타원뿔형, 꼭지가 잘린 역타원뿔형, 꼭지가 잘린 사각뿔형, 꼭지가 잘린 역사각뿔형, 타원기둥형, 사각기둥형, 또는 상기 형태의 이중 결합형(한 예로 사각기둥형 위에 원기둥형이 가능하다) 등 다양한 형상이 가능하다. 이와 같이 캐비티가 형성된 사각 판재는 소자를 수용하는 하우징으로서의 역할도 겸하게 된다. 이하의 설명에서는 사각 판재를 '하우징 판재'라 한다. 하우징 판재는 금속 또는 플라스틱 재료로 가공 또는 사출 성형법으로 형성하고, 판재에 형성된 반사경의 전부 또는 일부에 금이나 은과 같은 금속을 코팅하여, 반사경 일체형 하우징 구조로 구현한다(S3). 이때 반사경에 금 대신에 은을 도금할 경우에는 은을 도금한 후 유전체를 코팅하여 적외선의 반사특성이 양호한 은을 사용하면서도 공기 중에서 산화되는 것을 방지하여 제조 단가를 더욱 낮출 수 있다. 그리고 유전체 박막의 광학적 두께를 조절하여 다중 층으로 구현하면 원하는 파장 영역대의 반사광의 반사율을 더 높여 은에서 반사되는 빛을 손실없이 증강시킬 수 있고, 유전체로는 SiO2,TiO2, Al2O3 등이 사용될 수 있다.Referring to FIG. 1, in the first subassembly process according to the embodiment of the present invention, sidewalls of a cavity for mounting an IR LED chip and an ASIC chip are formed by forming through holes having a predetermined shape in a square plate (S1, S2). . For example, the shape of the through hole for the cavity is a cone with a cut off or a cone with a cut off, a cylinder, an oval with a cut off, an inverted cone with a cut off, a square cone with a cut off, an inverted prismatic cone, an elliptical column, a square column, Or a variety of shapes, such as the double bond type of the above form (for example, a cylinder is possible on the square column) is possible. Thus, the rectangular plate formed with the cavity also serves as a housing for accommodating the element. In the following description, the square plate is referred to as a 'housing plate'. The housing plate is formed of a metal or plastic material by processing or injection molding, and all or a part of the reflector formed on the plate is coated with a metal such as gold or silver, thereby implementing the reflector integrated housing structure (S3). In this case, when silver is plated instead of gold on the reflector, the plated silver may be coated with a dielectric to prevent oxidation in the air while using silver having good reflection characteristics of infrared rays, thereby lowering the manufacturing cost. And by controlling the optical thickness of the dielectric thin film to realize multiple layers, it is possible to increase the reflectance of the reflected light in the desired wavelength range to enhance the light reflected from the silver without loss, and as a dielectric, SiO 2 , TiO 2 , Al 2 O 3 And the like can be used.
또한 본 발명에 따른 실시예의 제2 서브 어셈블리 과정에서는 사각형의 FR-4 PCB 기판을 준비한 후 실장공간의 바닥면을 형성할 동박 영역에 금을 코팅하고 쓰루 홀을 가공한 후 패드를 형성한다(S4~S7). 그리고 제1 캐비티 위치에 IR LED칩을 실장하고, 제2 캐비티 위치에 수광소자(광센서)를 포함하는 ASIC칩을 실장한 후 와이어 본딩한다(S8,S9). In addition, in the second sub-assembly process according to the embodiment of the present invention, after preparing a rectangular FR-4 PCB substrate, gold is coated on the copper foil area to form the bottom surface of the mounting space, and a through hole is processed to form a pad (S4). ~ S7). An IR LED chip is mounted at the first cavity position, and an ASIC chip including a light receiving element (optical sensor) is mounted at the second cavity position and wire-bonded (S8, S9).
그리고 하우징 판재와 PCB 기판을 접합하여 IR LED칩이 실장된 제1 캐비티와 ASIC칩이 실장된 제2 캐비티를 갖춘 조립체를 완성한다(S10). Then, the housing plate and the PCB are bonded to each other to complete an assembly having a first cavity in which an IR LED chip is mounted and a second cavity in which an ASIC chip is mounted (S10).
또한 필요에 따라 하우징 판재의 상부에 캡을 부착한다(S11). 상부 캡은 플라스틱(Plastic)이나 실리콘, 러버(Rubber), 폼(Foam), 스폰지, 수지, 금속 재질로 구현될 수 있으며, 러버와 실리콘, 폼, 스폰지의 경우 기구 밀착성이 향상되는 부가적인 효과를 얻을 수 있다.In addition, the cap is attached to the upper portion of the housing plate as necessary (S11). The upper cap may be made of plastic, silicone, rubber, foam, sponge, resin, or metal. In the case of rubber, silicone, foam, and sponge, the upper cap may have an additional effect of improving device adhesion. You can get it.
이와 같이 본 발명에서는 하우징 판재에 가공 기술 또는 사출 성형을 이용하여 용이하게 홀을 형성하여 제조원가를 줄일 수 있다. 또한 본 발명에 따른 근조도 센서는 수용되는 소자를 보호하기 위한 하우징용 판재에 일체화시킨 반사경 구조 자체로 광효율을 높힐 수 있어 이 반사경을 통해 방사광의 집광도가 높아지고 결과적으로 피사체에서 반사되어 광센서에 도달되는 빛의 양도 많아지므로, 보다 먼 거리에 있는 피사체에서 반사된 빛을 검출할 수 있다. 그리고 광센서 일체형 ASIC 칩에서 필요한 임계 광량을 빠르게 축적하여 인티그레이션 시간을 줄임으로써 근접 감지 반응 속도나 출력 신호 처리 속도를 빠르게 할 수 있으며, 반사면에 금과 같은 금속을 코팅을 시행하여 광효율을 보다 높일 수 있다.As described above, in the present invention, the manufacturing cost can be reduced by easily forming holes in the housing plate using processing technology or injection molding. In addition, the roughness sensor according to the present invention can increase the light efficiency by the reflector structure itself integrated into the housing plate for protecting the element to be accommodated, so that the condensation of the radiated light through the reflector is increased and consequently reflected from the subject to the light sensor Since the amount of light reached increases, it is possible to detect light reflected from a subject at a greater distance. In addition, by rapidly accumulating the required amount of critical light in the integrated ASIC chip, the integration time can be shortened, so that the proximity detection response speed or the output signal processing speed can be increased, and the metal such as gold is coated on the reflective surface to increase the light efficiency. Can be.
도 2는 본 발명의 제 1 실시예에 따른 광학 근조도 센서의 측단면도이고, 3은 본 발명의 제1 실시예에 사용되는 하우징 판재(110)의 사시도이다.2 is a side cross-sectional view of an optical roughness sensor according to a first embodiment of the present invention, and 3 is a perspective view of a housing plate 110 used in the first embodiment of the present invention.
본 발명에 따른 광학 근조도 센서(100)는 도 2 및 도 3에 도시된 바와 같이, IR LED칩(140)을 실장하기 위한 제1 캐비티(112)의 측벽(114a)을 구성하는 꼭지가 잘린 역원뿔형 홀(이하의 설명에서는 간단히 '역원뿔형'이라 한다)과 제2 캐비티(118)의 측벽(114b)을 구성하는 꼭지가 잘린 원뿔형 홀(이하의 설명에서는 간단히 '원뿔형 홀'이라 한다)이 형성되어 있고, 특히 제1 캐비티(112)를 구성하는 측벽(114a)이 반사가 잘 되도록 표면의 조도를 갖추어 경면이 되도록 형성되고 금속이 코팅된 반사경 일체형 하우징 판재(110)와, 하우징 판재(110)와 접합되어 제1 캐비티(112)와 제2 캐비티(118)를 형성하며, 제1 캐비티(112) 및 제2 캐비티(118)의 바닥면에 IR LED칩(140)과 광센서 일체형 ASIC칩(150)을 각각 마운트하고 전기적 접속을 위해 결선할 수 있도록 회로 패턴이 형성된 PCB 기판(120)과, 하우징 판재(110)와 PCB 기판(120)에 의해 형성된 제1 캐비티(112)의 바닥면의 PCB 기판에 마운트되어 있고, 전원이 공급되면 적외선을 방출하는 IR LED칩(140)과, 하우징 판재(110)에 개구부의 역할을 하는 끝단의 직경이 하부의 직경보다 작은 원뿔 형태로 형성시킨 홀을 형성시키고 PCB 기판(120)과 접합되어 제2 캐비티(118)를 형성하며, 제2 캐비티 바닥면의 PCB 기판에 실장되어 전원이 공급되면 IR LED(140)를 구동함과 아울러 물체에서 반사된 적외선을 수광하여 근접을 감지하며 주변의 가시광선의 조도를 감지하는 광센서(photo sensor) 일체형 ASIC칩(150)과, 제 1 캐비티(112)에서 IR LED(140)의 빛을 방사하기 위해 하우징 판재에 형성된 역원뿔형 홀의 끝단에 형성된 개구부(112a)와, 제2 캐비티에 ASIC칩의 수광부측으로 광을 인입시키기 위해 하우징 판재에 형성된 원뿔형 홀의 끝단에 형성된 개구부(118a)로 구성된다. 여기서, IR LED칩(140)과 ASIC(150)은 접착제(162)를 통해 PCB기판(120)에 접착되어 있다.As shown in FIGS. 2 and 3, the optical roughness sensor 100 according to the present invention has an inverted corner of the sidewall 114a of the first cavity 112 for mounting the IR LED chip 140. Conical holes (hereinafter referred to simply as 'inverted cones') and conical holes (hereinafter referred to as simply 'conical holes') forming the sidewalls 114b of the second cavity 118 are formed. In particular, the side wall (114a) constituting the first cavity (112) is formed to have a mirror surface with a roughness of the surface so that the reflection is good, the reflector-integrated housing plate material 110 and the metal plate coated, the housing plate material 110 and Are bonded to form a first cavity 112 and a second cavity 118, and an IR LED chip 140 and an optical sensor integrated ASIC chip 150 on the bottom surfaces of the first cavity 112 and the second cavity 118. PCB boards with circuit patterns (1) for mounting each and wiring for electrical connection 20) and an IR LED chip 140 mounted on the PCB substrate on the bottom surface of the first cavity 112 formed by the housing plate 110 and the PCB substrate 120 and emitting infrared rays when the power is supplied. In the housing plate 110, a hole having a diameter of an end serving as an opening having a conical shape smaller than a diameter of a lower portion is formed, and is bonded to the PCB substrate 120 to form a second cavity 118. When mounted on a PCB board on the bottom of the cavity, when the power is supplied, the IR LED 140 is driven and an infrared light reflected from the object is received to detect proximity and to detect the illuminance of visible light in the surroundings. The ASIC chip 150, the opening 112a formed at the end of the inverted conical hole formed in the housing plate for emitting the light of the IR LED 140 from the first cavity 112, and the light receiving portion side of the ASIC chip in the second cavity. Cone formed in housing plate for drawing light It consists of an opening (118a) formed at the hole edge. Here, the IR LED chip 140 and the ASIC 150 are bonded to the PCB substrate 120 through the adhesive 162.
도 2 및 도 3을 참조하면, 제 1 실시예의 하우징 판재(110)에는 개구부(112a)의 역할을 하는 끝단의 직경이 하부의 직경보다 큰 역원뿔 형태로 형성시킨 제1 캐비티 홀(112)과, 개구부(118a)의 역할을 하는 끝단의 직경이 하부의 직경보다 작은 원뿔 형태로 형성시킨 제2 캐비티 홀(118)이 형성되어 있으며, 특히 제1 캐비티(112)를 구성하는 측벽(114a)은 반사가 잘 되도록 표면의 조도를 갖추어 경면이 되도록 형성되어 있고, 금과 같은 금속이 코팅되어 있다. 금속의 코팅은 하우징 판재(110)의 전부 또는 일부에 시행한다. 2 and 3, the housing plate 110 of the first embodiment includes a first cavity hole 112 formed in an inverted cone shape in which the diameter of the end serving as the opening 112a is larger than the diameter of the lower portion. The second cavity hole 118 is formed in a conical shape having a diameter smaller than the diameter of the lower end of the tip 118a. Particularly, the side wall 114a constituting the first cavity 112 may be formed. It has a roughness of the surface to reflect well and is formed to be a mirror surface, and a metal such as gold is coated. The coating of metal is applied to all or part of the housing plate 110.
제조원가를 낮추기 위해 금도금 대신에 은으로 코팅할 경우에는 도 2의 확대도와 같이 측벽(114a)에 적외선 반사 특성이 양호한 은이 코팅된 은코팅층(10)을 형성하고, 은코팅층 위에 은의 산화를 방지하기 위한 유전체가 코팅되 유전체층(20)을 형성한다. 하우징 판재(110)의 일부에만 금속을 코팅할 경우에는 제1 캐비티(112)의 측벽에 국부적으로 시행하고, 필요할 경우 제2 캐비티(118)의 측벽에도 국부적으로 시행한다.In the case of coating with silver instead of gold plating to reduce the manufacturing cost, as shown in the enlarged view of FIG. 2, a silver coated layer 10 coated with silver having good infrared reflecting properties is formed on the sidewall 114a, and to prevent oxidation of silver on the silver coated layer. Dielectric is coated to form dielectric layer 20. When only a portion of the housing plate 110 is coated with metal, it is locally applied to the sidewall of the first cavity 112, and if necessary, is also locally applied to the sidewall of the second cavity 118.
또한 제 1 실시예의 하우징 판재(110)는 제1 캐비티(112)에는 역원뿔형의 반사경을 형성하여 IR LED(140)로부터 방출되는 빛을 효율적으로 개구부(112a)측으로 방사시킬 수 있고, 하우징 판재(110)가 금속일 경우 제2 캐비티(118)에 형성된 금속체 홀과 하우징 판재에 접합되는 PCB 기판(120) 위에 형성된 금속층으로 구성되어 제2 캐비티가 금속체로 이루어지므로 제 2 캐비티(118)에 수용되는 소자를 전자파 노이즈로부터 대폭 차폐시킬 수 있도록 된 것이다. In addition, the housing plate 110 of the first embodiment forms an inverted cone reflector in the first cavity 112 to efficiently radiate the light emitted from the IR LED 140 toward the opening 112a, and the housing plate ( When 110 is a metal, the metal cavity is formed of a metal hole formed in the second cavity 118 and a metal layer formed on the PCB substrate 120 bonded to the housing plate, so that the second cavity is made of a metal body to be accommodated in the second cavity 118. It is possible to greatly shield the device from electromagnetic noise.
하우징 판재(110)를 플라스틱 재료로 구성하는 경우 필요에 따라 즉, 전자파 노이즈로부터의 영향이 발생할 경우 판재(110)를 금속으로 코팅하여 전자파 노이즈를 차폐한다. 그리고 제 1 캐비티(112)에서 IR LED(140)의 빛을 방사하기 위해 하우징 판재(110)에 형성된 역원뿔형 홀의 끝단에 개구부(112a)가 형성되어 있고, 제2 캐비티(118)에도 ASIC칩(150)의 수광부측으로 광을 인입시키기 위해 하우징 판재(110)에 형성된 원뿔형 홀의 끝단에 개구부(118a)가 형성되어 있다. When the housing plate 110 is made of a plastic material, if necessary, that is, when the influence from electromagnetic noise occurs, the plate 110 is coated with a metal to shield the electromagnetic noise. In addition, an opening 112a is formed at an end of an inverted conical hole formed in the housing plate 110 to emit light of the IR LED 140 from the first cavity 112, and the ASIC chip also is formed in the second cavity 118. An opening 118a is formed at the end of the conical hole formed in the housing plate 110 to introduce light to the light receiving portion side of the 150.
이와 같이 본 발명의 제 1 실시예에 따른 근조도 센서(100)는 수용되는 소자를 보호하는 하우징 판재(110)에 개구부(112a)의 역할을 하는 끝단의 직경이 하부의 직경보다 큰 역원뿔 형태로 홀을 형성시키면서 사선 형태의 측벽(114a)이 경면이 되도록 형성하고 금속을 코팅한다. 그리고 PCB 기판(120)의 상면에 동박층(122a)을 형성한 후 금도금을 시행하고, 그 위에 IR LED(140)를 마운트한 후 하우징 판재(110)와 결합하여 반사경 형태를 갖춘 일종의 스템(stem) 구조로 제 1 캐비티(122)를 구성한다. 이렇게 구성한 제1 캐비티(112)의 IR LED(140)에서 발광된 빛은 역원뿔 형태의 반사경에서 반사되므로 발광된 빛을 효율적으로 하우징 판재 상부의 개구부(Apature;112a)로 통과시킬 수 있는 장점이 있다. As such, the roughness sensor 100 according to the first embodiment of the present invention has an inverted cone shape in which the diameter of the tip, which serves as the opening 112a, is greater than the diameter of the lower portion of the housing plate 110 that protects the received device. While forming a hole, a diagonal sidewall 114a is formed to be a mirror surface and coated with a metal. Then, the copper foil layer 122a is formed on the upper surface of the PCB substrate 120, and gold plating is performed. Then, the IR LED 140 is mounted thereon, and then coupled with the housing plate 110 to form a stem having a reflector shape. ) Constitutes a first cavity 122. Since the light emitted from the IR LED 140 of the first cavity 112 configured as described above is reflected by a reflector having an inverted cone shape, the light emitted can be efficiently passed through the opening 112a of the upper portion of the housing plate. have.
본 발명은 캐비티가 형성된 판재(110)를 하우징 겸용으로 사용하는데, 제1 캐비티(112)에서 반사경을 구성할 수 있는 높이는 판재의 두께(높이)까지임을 감안할 때, 판재(110)는 단일층으로 하우징을 겸할 수 있도록 충분한 두께를 사용하므로 반사경의 측벽의 높이를 확보하는 데 여유가 있어 IR LED(140)에서 방출된 빛의 집광성을 높이는 주요 인자인 반사 경로를 길게 할 수 있고, 반사량을 충분히 크게 할 수 있다. According to the present invention, the plate 110 having a cavity is used as a housing, but considering that the height capable of constructing the reflector in the first cavity 112 is up to the thickness (height) of the plate, the plate 110 is a single layer. Since the thickness is sufficient to serve as the housing, it can afford to secure the height of the side wall of the reflector, thereby making it possible to lengthen the reflection path, which is a major factor for increasing the light condensing of the light emitted from the IR LED 140, and sufficiently reflects the light. I can make it big.
또한 충분한 반사 경로를 가지지 못할 경우 방사된 빛이 개구부의 측면으로 방사되어 원하는 영역 내에서의 빛의 분포도가 줄어들게 되는데, 종래에는 이를 방지하기 위하여 추가의 제조 공정을 거쳐 렌즈를 추가하여 빛을 모으려 하거나 또는 렌즈 자체만으로 빛을 모으려는 시도가 있으나, 본 발명은 반사경 일체형 하우징 판재가 단일층으로 구조가 간단하여 공간 활용성이 높아지고, 이 단일층의 높이를 충분히 활용할 수 있게 되므로 손쉽게 충분한 반사경로를 확보하여 광효율을 높일 수 있다. 이렇게 구성된 반사경은 IR LED에서 임의의 방향으로 방출된 빛이 일정한 각도의 경사면을 가진 긴 반사 경로를 통과하면서 개구부 면의 수선 방향으로의 방사율이 높아지므로 렌즈가 없이도 집광성이 높아져 필요한 각도 내에 방사된 광량의 증대가 용이하고, 측벽의 반사면의 각도 조절로 방사된 빛의 광분포 조절 및 광량의 조절도 용이하다. In addition, if the light does not have a sufficient reflection path, the emitted light is radiated to the side of the opening to reduce the distribution of light in a desired area. In order to prevent this, conventionally, an additional manufacturing process is performed to collect light by adding a lens or Alternatively, there is an attempt to collect light only by the lens itself, but the present invention provides a single layer of reflector-integrated housing plate with a simple structure, thereby increasing space utilization and making it possible to fully utilize the height of the single layer, thereby easily securing a sufficient reflection path. The light efficiency can be increased. The reflector configured in this way has a high emissivity in the direction of the direction of the opening surface as the light emitted in any direction from the IR LED passes through a long reflective path with a predetermined angle of inclined surface, so that the light condensation is increased without the lens and radiated within the required angle. The amount of light is easily increased, and the light distribution of the emitted light and the amount of light are also easily adjusted by adjusting the angle of the reflection surface of the side wall.
이와 같이 본 발명의 제1실시예에 따른 근조도 센서(100)는 수용되는 소자를 보호하기 위한 하우징 겸용 판재에 일체화시킨 반사경 구조 자체로 광효율을 높힐 수 있어 이 반사경을 통해 방사광의 집광도가 높아지고, 결과적으로 피사체에서 반사되어 광센서에 도달되는 빛의 양도 많아지므로, 고정된 검출력을 가진 광센서와 고정된 자체 방사 광량을 가진 IR LED를 사용한다면, 보다 먼 거리에 있는 피사체에서 반사된 빛을 검출할 수 있고, 광센서 일체형 ASIC 칩(150)에서 필요한 임계 광량을 빠르게 축적하여 인티그레이션 시간을 줄임으로써 근접 감지 반응 속도나 출력 신호 처리 속도를 빠르게 할 수 있으며, 또한 반사면에 금과 같은 금속의 코팅을 시행하므로 광효율을 보다 높일 수 있다. Thus, the roughness sensor 100 according to the first embodiment of the present invention can increase the light efficiency by the reflector structure itself integrated into the housing combined plate for protecting the element to be accommodated, so that the light condensation of the radiation is increased through the reflector As a result, the amount of light that is reflected from the subject and reaches the light sensor also increases, so if you use a light sensor with a fixed detection power and an IR LED with a fixed self-emission light, It is possible to detect and reduce the integration time by quickly accumulating the required amount of critical light in the ASIC chip 150 integrated with the optical sensor, thereby increasing the proximity sensing response speed or the output signal processing speed, and the reflection surface of the metal such as gold The coating can be performed to increase the light efficiency.
이와 같이 본 발명의 높은 광효율 구조에서는 피사체의 검출 거리를 보다 멀게 할 수 있으므로, 역으로 응용에 따라서는 사용에 필요한 일정 수준까지 검출 거리를 낮출 수도 있는데, 그 방법으로 IR LED(140)의 방사 광량을 결정하는 주요 인자 중의 하나인 LED 칩의 면적을 줄일 수 있게 되어 원가를 절감할 수 있는 효과도 발생한다.As described above, in the high light efficiency structure of the present invention, the detection distance of the subject can be further increased, and conversely, depending on the application, the detection distance may be lowered to a certain level required for use. In this way, the amount of emitted light of the IR LED 140 is increased. It is possible to reduce the area of the LED chip, which is one of the main factors to determine the cost, which also reduces the cost.
한편, 종래와 같이 사출 성형하여 렌즈를 사용하는 경우에는 IR LED(140)의 측면에도 수지로 몰딩하여야 하기 때문에 측면으로 방사되는 빛의 집광성이 확보되지 못하여 방사되는 빛의 광효율이 충분하지 못한 것에 반하여, 본 발명의 경우 IR LED(140)의 측면으로 방사되는 빛도 IR LED의 측면까지 구성된 반사면에 의하여 개구부(112a)로 방사시킬 수 있는 이점이 있다.On the other hand, in the case of using a lens by injection molding as in the prior art, since the side of the IR LED 140 must be molded with resin, the light condensing property of the light emitted to the side cannot be secured, and thus the light efficiency of the light emitted is not sufficient. On the contrary, in the present invention, the light emitted to the side of the IR LED 140 may also be radiated to the opening 112a by the reflecting surface configured up to the side of the IR LED.
또한 제 1 캐비티(C1)에서 방출된 빛이 물체에 반사되어 인입되는 빛을 감지하기 위한 수광부는 하우징 판재(110)에 개구부(118a)의 역할을 하는 끝단의 직경이 하부의 직경보다 작은 원뿔 형태로 홀의 측벽(114b)을 형성시키고, PCB 기판(120)의 상면에 동박층(122b)을 형성한 후 금도금을 시행하고 그 위에 광센서를 갖는 ASIC칩(150)을 마운트한 다음 금속이 코팅된 하우징 판재(110)와 결합하여 제 2 캐비티(118)를 구성한 것이다. 이렇게 구성한 제2 캐비티(118)는 ASIC칩(150)이 측벽부와 하부의 금속으로 차폐되어 주변의 강한 전자파 노이즈 환경에서도 EMI 차폐 특성이 향상되는 장점이 있다. 본 발명에서 하우징 판재(110)에는 금속 또는 플라스틱의 판재를 사용하고 판재의 전부 또는 일부에 금속 코팅을 시행하는데, 특히 플라스틱의 판재(110)에 일부에만 금속 코팅을 시행하는 경우 전자파 노이즈의 영향이 발생하는 환경에서는 제 2 캐비티(118)의 측벽에도 금속 코팅을 시행하여 전자파 노이즈에 대비할 수 있다.In addition, the light-receiving unit for detecting the light emitted from the first cavity (C1) reflected by the object is conical shape of the end of the end portion that serves as the opening 118a in the housing plate 110 is smaller than the diameter of the lower portion The sidewalls 114b of the furnace holes are formed, the copper foil layer 122b is formed on the upper surface of the PCB substrate 120, and gold plating is performed. Then, the ASIC chip 150 having an optical sensor is mounted thereon, and then metal is coated. The second cavity 118 is configured by combining with the housing plate 110. The second cavity 118 configured as described above has the advantage that the EMI shielding property is improved even in the strong electromagnetic noise environment in which the ASIC chip 150 is shielded by the metal on the sidewall part and the lower part. In the present invention, the housing plate 110 uses a plate of metal or plastic, and a metal coating is applied to all or part of the plate, in particular, in the case of applying a metal coating to only a portion of the plate 110 of plastic, the effect of electromagnetic noise is In a generated environment, a metal coating may be applied to the side walls of the second cavity 118 to prepare for electromagnetic noise.
아울러 제 1 캐비티(112)와 제 2 캐비티(118)가 금속 또는 금속이 코팅된 불투명의 플라스틱 계열의 재질로 구성되므로, IR LED(140)에서 발광된 빛이 ASIC칩(150)의 포토센서로 누설되어(leakage) 크로스 토크(Cross talk)되는 것도 방지할 수 있다. In addition, since the first cavity 112 and the second cavity 118 are made of an opaque plastic-based material coated with metal or metal, the light emitted from the IR LED 140 is transferred to the photosensor of the ASIC chip 150. It is also possible to prevent leakage and cross talk.
본 발명에서 반사경 일체형 하우징 판재(110)의 재료는 통상의 금속 또는 사출 성형된 불투명의 플라스틱 재료를 사용하며, 하우징 판재(110)에 코팅되는 금속은 금과 같이 적외선을 효과적으로 반사하는 물질을 사용하고, PCB 기판(120)은 PCB에 사용되는 재질을 사용하며 예컨대 FR-4를 들 수 있다.In the present invention, the material of the reflector integrated housing plate 110 uses a conventional metal or an injection molded opaque plastic material, and the metal coated on the housing plate 110 uses a material that effectively reflects infrared rays such as gold. , PCB substrate 120 uses a material used for the PCB, for example FR-4.
도 4는 본 발명의 제 2 실시예에 따른 광학 근조도 센서의 측단면도이다.4 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention.
본 발명의 제 2 실시예에 따른 광학 근조도 센서(200)는 도 4에 도시된 바와 같이, IR LED칩(240)을 실장하기 위한 제1 캐비티(212)의 측벽을 구성하는 역원뿔형 홀과 제2 캐비티(218)의 측벽을 구성하는 사각기둥형 홀이 형성된 하우징 판재(210)와, 하우징 판재(210)와 접합되어 제1 캐비티(212)와 제2 캐비티(218)를 형성하며, 제1 캐비티(212) 및 제2 캐비티(218)의 바닥면에 IR LED칩(240)과 광센서 일체형 ASIC칩(250)을 각각 마운트하고 전기적 접속을 위해 결선할 수 있도록 회로 패턴이 형성된 사각 PCB 기판(220)과, 하우징 판재(210)와 PCB 기판(220)에 의해 형성된 제1 캐비티(212)의 바닥면의 PCB 기판에 마운트되어 있고, 전원이 공급되면 적외선을 방출하는 IR LED칩(240)과, 하우징 판재(210)와 PCB 기판(220)에 의해 형성된 제2 캐비티(212)의 바닥면의 PCB 기판에 실장되어 전원이 공급되면 IR LED칩(240)을 구동함과 아울러 물체에서 반사된 적외선을 수광하여 근접을 감지하며 주변의 가시광선의 조도를 감지하는 광센서 일체형 ASIC칩(250)으로 구성된다. PCB 기판(220)에는 신호접속을 위한 쓰루홀(224a,224b)과 접속패드(226-1~226-5)가 형성되어 있다.As shown in FIG. 4, the optical roughness sensor 200 according to the second exemplary embodiment of the present invention includes an inverted conical hole constituting a side wall of the first cavity 212 for mounting the IR LED chip 240. A housing plate 210 having a square column-shaped hole constituting the side wall of the second cavity 218 and the housing plate 210 to be joined to form a first cavity 212 and a second cavity 218, and Square PCB board with circuit pattern formed to mount IR LED chip 240 and optical sensor integrated ASIC chip 250 on the bottom surface of first cavity 212 and second cavity 218 and connect them for electrical connection. An IR LED chip 240 mounted on the PCB substrate on the bottom surface of the first cavity 212 formed by the housing plate 210 and the PCB substrate 220, and emits infrared rays when the power is supplied. And mounted on the PCB substrate on the bottom surface of the second cavity 212 formed by the housing plate 210 and the PCB substrate 220 to supply power. If also drive the IR LED chip 240 and the light-receiving as well as the infrared ray reflected by the object to detect a close-up and consists of a light sensor-integrated ASIC chip 250, which detects the intensity of visible light in the surrounding. Through- holes 224a and 224b and connection pads 226-1 to 226-5 for signal connection are formed in the PCB substrate 220.
즉, 제2 실시예의 광학 근조도센서(200)는 하우징 판재(210)에 IR LED칩(240)을 수용하기 위한 제1 캐비티(212)의 역원뿔형 측벽(214a)과 ASIC칩(250)을 수용하기 위한 제2 캐비티(218)의 직벽형 측벽(214b)용 홀이 형성되고, PCB 기판(220)에는 제1 캐비티(212)의 바닥면(222a)의 PCB 기판(220) 위에 IR LED(240)를 실장하고 제2 캐비티(218)의 바닥면(222b)의 PCB 기판(220) 위에는 ASIC칩(250)을 실장한 것이다. 그리고 제 1 캐비티(212)에서 IR LED칩(240)의 빛을 방사하기 위해 하우징 판재(210)에 형성된 역원뿔형 홀의 끝단과 제2 캐비티(218)에서 ASIC칩(250)의 수광부측으로 광을 인입시키기 위해 하우징 판재(210)에 형성된 사각기둥형 홀의 끝단에 각각 개구부(212a,218a)가 형성되어 있다.That is, the optical roughness sensor 200 of the second exemplary embodiment may connect the ASIC chip 250 and the reverse conical sidewall 214a of the first cavity 212 to accommodate the IR LED chip 240 in the housing plate 210. A hole for the straight wall sidewall 214b of the second cavity 218 for receiving is formed, and the PCB substrate 220 has an IR LED (on the PCB substrate 220 of the bottom surface 222a of the first cavity 212). 240 is mounted and the ASIC chip 250 is mounted on the PCB substrate 220 of the bottom surface 222b of the second cavity 218. In addition, light is introduced into the light-receiving side of the ASIC chip 250 from the end of the inverted conical hole formed in the housing plate 210 and the second cavity 218 to emit light of the IR LED chip 240 from the first cavity 212. Openings 212a and 218a are formed at the ends of the rectangular pillar-shaped holes formed in the housing plate 210, respectively.
도 4를 참조하면, 본 발명의 제 2 실시예에 따른 근조도 센서(200)는 수용되는 소자를 보호하기 위한 하우징 판재(210)에 개구부(212a)의 역할을 하는 끝단의 직경이 하부의 직경보다 큰 역원뿔 형태로 구멍을 형성시키면서 사선 형태의 측벽(214a)이 경면이 되도록 형성하고 금속을 코팅하며, PCB 기판(220)의 상면에 동박층(222a)을 형성한 후 금 도금을 시행하고 그 위에 IR LED(240)를 마운트한 후 하우징 판재(210)와 결합하여 반사경 형태를 갖춘 일종의 스템(stem) 구조로 제 1 캐비티(212)를 구성한 것이다. 이렇게 구성한 제1 캐비티의 IR LED(240)에서 발광된 빛은 역원뿔 형태의 반사경에서 반사되므로 발광된 빛을 효율적으로 하우징 판재 상부의 개구부(Apature;212a)로 통과시킬 수 있는 장점이 있다. Referring to FIG. 4, the roughness sensor 200 according to the second embodiment of the present invention has a diameter of the lower end of the end portion serving as the opening 212a in the housing plate 210 for protecting the received device. While forming a hole in a larger inverted cone shape, the diagonal side wall 214a is formed to be a mirror surface and coated with metal, and a copper foil layer 222a is formed on the upper surface of the PCB substrate 220, and then gold plating is performed. After mounting the IR LED 240 thereon, the first cavity 212 is configured as a kind of stem structure having a reflector shape by combining with the housing plate 210. Since the light emitted from the IR LED 240 of the first cavity configured as described above is reflected by a reflector having an inverted cone shape, there is an advantage that the emitted light can be efficiently passed through the opening (Apature) 212a above the housing plate.
또한 제 1 캐비티(212)에서 방출된 빛이 물체에 반사되어 인입되는 빛을 감지하기 위한 수광부는 하우징 판재(210)에 직벽으로 홀을 형성하여 프로세서를 포함하는 ASIC(250)을 실장하기 위한 제2 캐비티(218)의 측벽(214b)을 형성하고, PCB 기판(220)의 상면의 중앙부에 동박층(222b)을 형성한 후 금 도금을 시행하고 그 위에 ASIC칩(250)을 마운트한 후 금속이 코팅된 하우징 판재(210)와 결합하여 제 2 캐비티(218)를 구성한다. 이렇게 구성한 제 2 캐비티(218)는 ASIC칩(250)이 측벽부와 하부의 금속으로 차폐되어 주변의 강한 전자파 노이즈 환경에서도 EMI 차폐 특성이 향상되는 이점이 있다. In addition, the light receiving unit for detecting the light emitted from the first cavity 212 reflected by the object is formed in the housing plate 210 to form a hole in a straight wall for mounting the ASIC 250 including a processor The side wall 214b of the second cavity 218 is formed, the copper foil layer 222b is formed at the center of the upper surface of the PCB substrate 220, and gold plating is performed thereon, and then the ASIC chip 250 is mounted thereon. The second cavity 218 is combined with the coated housing plate 210 to form the second cavity 218. In the second cavity 218 configured as described above, the ASIC chip 250 is shielded by the metal on the sidewall and the lower portion, so that EMI shielding characteristics are improved even in the surrounding strong electromagnetic noise environment.
본 발명에서 하우징 판재(210)에는 금속재 또는 플라스틱 계열의 판재를 사용하고 판재에 형성된 반사경의 전부 또는 일부에 금속 코팅을 시행하는데, 특히 플라스틱의 판재(210)에 일부에만 금속 코팅을 시행하는 경우 전자파 노이즈의 영향이 발생하는 환경에서는 제 2 캐비티(218)의 측벽에도 금속 코팅을 시행하여 전자파 노이즈에 대비할 수 있다.In the present invention, the housing plate 210 uses a metal or plastic-based plate, and the metal coating is applied to all or part of the reflector formed on the plate, in particular, in the case of applying a metal coating to only a part of the plate 210 of plastic In an environment where the influence of noise occurs, a metal coating may be applied to the side walls of the second cavity 218 to prepare for electromagnetic noise.
제조원가를 낮추기 위해 반사경을 금 도금 대신에 은으로 코팅할 경우에는 도 4의 확대도와 같이 측벽(214a)에 적외선 반사 특성이 양호한 은이 코팅된 은코팅층(10)을 형성하고, 은코팅층 위에 은의 산화를 방지하기 위한 유전체가 코팅되 유전체층(20)을 형성한다. When the reflector is coated with silver instead of gold plating to reduce the manufacturing cost, a silver coated layer 10 coated with silver having good infrared reflection characteristics is formed on the sidewall 214a as shown in the enlarged view of FIG. 4, and oxidation of silver on the silver coated layer is performed. To prevent the dielectric is coated to form a dielectric layer 20.
아울러 제 1 캐비티(212)와 제 2 캐비티(218)가 금속 또는 금속이 코팅된 불투명의 플라스틱 계열의 재질로 구성되므로, IR LED(240)에서 발광된 빛이 ASIC칩(250)의 포토센서로 누설되어(leakage) 크로스 토크(Cross talk)되는 것도 방지할 수 있다. In addition, since the first cavity 212 and the second cavity 218 are made of a metal or metal-based opaque plastic material, light emitted from the IR LED 240 is transferred to the photosensor of the ASIC chip 250. It is also possible to prevent leakage and cross talk.
도 5는 본 발명의 제 3 실시예에 따른 광학 근조도 센서의 측단면도이다.5 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention.
본 발명의 제 3 실시예에 따른 근조도 센서(300)는 IR LED칩(340)을 실장하기 위한 제1 캐비티(312)의 측벽을 구성하는 역원뿔형 홀이 형성되어 있고, 역원뿔형 홀의 측벽(314a)이 반사가 잘 되도록 표면의 조도를 갖추어 경면이 되도록 형성시키고 금속이 코팅된 반사경 일체형 하우징 판재(310)와, 하우징 판재(310)와 접합되어 제1 캐비티(312)를 형성하며, 제1 캐비티의 바닥면(322a)에 IR LED칩(340)을 마운트하고 전기적 접속을 위해 결선할 수 있도록 회로 패턴이 형성된 사각 PCB 기판(320)과, 하우징 판재(310)와 PCB 기판(320)에 의해 형성된 제1 캐비티(312)의 바닥면의 PCB 기판(320)에 마운트되어 있고, 전원이 공급되면 적외선을 방출하는 IR LED(240)와, 하우징 판재(210)에 끝단의 직경이 하부의 직경보다 작은 원뿔 형태로 홀(314b)을 형성시키고 PCB 기판(320)과 접합되어 제2 캐비티(318)를 형성하며, 제2 캐비티(318) 바닥면의 PCB 기판(310)에 실장되어 전원이 공급되면 IR LED(340)를 구동함과 아울러 물체에서 반사된 적외선을 수광하여 근접을 감지하며 주변의 가시광선의 조도를 감지하는 광센서(photo sensor) 일체형 ASIC칩(350)과, 하우징 판재(310)와 결합되어 IR LED(340)가 실장되는 제1 캐비티(312) 위에 IR LED(340)의 빛을 방사하기 위한 개구부(332)가 형성되어 있으며, 제2 캐비티(318) 위에 ASIC칩(350)의 수광부측으로 광을 인입시키기 위한 개구부(332)가 형성된 상부 캡(330)으로 구성된다.In the roughness sensor 300 according to the third embodiment of the present invention, an inverted conical hole constituting the sidewall of the first cavity 312 for mounting the IR LED chip 340 is formed, and the sidewall of the inverted conical hole ( 314a is formed to have a mirror surface with good surface roughness to reflect well, and the reflector-integrated housing plate material 310 coated with metal and the housing plate material 310 are joined to form a first cavity 312, A rectangular PCB substrate 320 having a circuit pattern formed thereon so as to mount the IR LED chip 340 on the bottom surface 322a of the cavity and to be connected for electrical connection, and by the housing plate 310 and the PCB substrate 320. It is mounted on the PCB substrate 320 on the bottom surface of the formed first cavity 312, the IR LED 240 and the housing plate 210, which emits infrared rays when power is supplied, the diameter of the end is lower than the diameter of the lower The hole 314b is formed in the shape of a small cone and bonded to the PCB substrate 320 to form a second cache. The tee 318 is formed and mounted on the PCB substrate 310 at the bottom of the second cavity 318, when the power is supplied, the IR LED 340 is driven and the infrared light reflected from the object is received to detect proximity. And an IR sensor 340 on the first cavity 312 in which the IR sensor 340 is mounted in combination with the photo sensor integrated ASIC chip 350 for sensing the illumination of visible light in the surroundings and the housing plate 310. And an opening 332 for emitting light of () and an upper cap 330 having an opening 332 for introducing light onto the light receiving portion side of the ASIC chip 350 on the second cavity 318. .
도 5를 참조하면, 본 발명의 제 3 실시예에 따른 근조도 센서(300)는 제 1 실시예에서 기술한 발명의 구성에 수용되는 소자를 보호하면서 반사경이 일체화된 하우징 판재(310)와 결합되어 IR LED(340)가 실장되는 제1 캐비티(312) 위에 IR LED(340)의 빛을 방사하기 위한 개구부(332)가 형성되어 있으며, 제2 캐비티(318) 위에 ASIC칩(350)의 수광부측으로 광을 인입시키기 위한 개구부(332)가 형성된 상부 캡(330)을 추가로 구성한다.Referring to FIG. 5, the roughness sensor 300 according to the third embodiment of the present invention is coupled with a housing plate 310 in which a reflector is integrated while protecting an element accommodated in the configuration of the present invention described in the first embodiment. And an opening 332 for emitting light of the IR LED 340 is formed on the first cavity 312 in which the IR LED 340 is mounted, and the light receiving part of the ASIC chip 350 is disposed on the second cavity 318. An upper cap 330 having an opening 332 for introducing light to the side is further configured.
또한 제조원가를 낮추기 위해 반사경을 금 도금 대신에 은으로 코팅할 경우에는 도 5의 확대도와 같이 측벽(314a)에 적외선 반사 특성이 양호한 은이 코팅된 은코팅층(10)을 형성하고, 은코팅층 위에 은의 산화를 방지하기 위한 유전체가 코팅되 유전체층(20)을 형성한다. In addition, when the reflector is coated with silver instead of gold plating to reduce manufacturing cost, a silver coated layer 10 coated with silver having good infrared reflection characteristics is formed on the sidewall 314a as shown in the enlarged view of FIG. 5, and oxidation of silver on the silver coated layer is performed. To prevent the dielectric is coated to form a dielectric layer 20.
한편, 상기 제1 실시예는 별도의 구성품 추가하지 않아도 스마트 폰 등에 적용하여 본 발명의 효과를 구현할 수 있으나, 제1 실시예의 제품이 적용되는 휴대폰 등에서 광의 방출과 인입의 광학적 형합과 기구적 형합을 별도로 맞추어야 하는 경우가 발생하는데, 상기와 같이 추가의 상부 캡(330)을 구성할 경우 본 발명에서는 타 부품의 변경없이 상부 캡(330)의 개구부 간의 거리나 구경을 자유로이 조절하여 적용 대상과 광학적 기구적 형합을 용이하게 할 수 있는 이점이 있다.  On the other hand, the first embodiment can be applied to a smart phone, etc. without the addition of a separate component to implement the effect of the present invention, but the optical and mechanical conformation of the light emission and incoming in the mobile phone to which the product of the first embodiment is applied When the additional upper cap 330 is configured as described above, the present invention freely adjusts the distance or aperture between the openings of the upper cap 330 without changing other components. There is an advantage that can facilitate easy matching.
상부 캡(330)은 플라스틱(Plastic)이나 러버(Rubber), 실리콘(Silicone), 폼(Foam), 스폰지, 수지, 금속 재질로 구현될 수 있으며, 실리콘이나 러버와 폼, 스폰지의 경우 기구 밀착성이 향상되는 부가적인 효과를 얻을 수 있다.The upper cap 330 may be formed of plastic, rubber, silicone, foam, sponge, resin, or metal. In the case of silicone, rubber, foam, and sponge, the adhesion Additional effects can be obtained.
도 6은 본 발명의 제 4 실시예에 따른 광학 근조도 센서의 측단면도이다.6 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention.
본 발명의 제 4 실시예에 따른 광학 근조도 센서(400)는 도 6에 도시된 바와 같이, 제 2 실시예에서 기술한 발명의 구성에 수용되는 소자를 보호하면서 반사경이 일체화된 하우징 판재(410)와 결합되어 IR LED(440)가 실장되는 제1 캐비티(412) 위에 IR LED(440)의 빛을 방사하기 위한 개구부(432)가 형성되어 있으며, 제2 캐비티(418) 위에 ASIC칩(450)의 수광부측으로 광을 인입시키기 위한 개구부(432)가 형성된 사각형의 상부 캡(430)을 추가로 구성한 것이다. As shown in FIG. 6, the optical roughness sensor 400 according to the fourth embodiment of the present invention has a housing plate 410 in which a reflector is integrated while protecting an element accommodated in the configuration of the invention described in the second embodiment. ) And an opening 432 for emitting the light of the IR LED 440 is formed on the first cavity 412 on which the IR LED 440 is mounted, and the ASIC chip 450 is disposed on the second cavity 418. The upper cap 430 of the quadrangular formed with an opening 432 for introducing light to the light-receiving portion side of the) is further configured.
또한 제조원가를 낮추기 위해 반사경을 금 도금 대신에 은으로 코팅할 경우에는 도 4의 확대도와 같이 측벽(414a)에 적외선 반사 특성이 양호한 은이 코팅된 은코팅층(10)을 형성하고, 은코팅층 위에 은의 산화를 방지하기 위한 유전체가 코팅되 유전체층(20)을 형성한다. In addition, when the reflector is coated with silver instead of gold plating in order to reduce manufacturing costs, a silver coated layer 10 coated with good infrared reflection characteristics is formed on the sidewall 414a as shown in the enlarged view of FIG. 4, and oxidation of silver on the silver coated layer is performed. To prevent the dielectric is coated to form a dielectric layer 20.
한편, 상기 제2 실시예는 별도의 구성품 추가하지 않아도 스마트 폰 등에 적용하여 본 발명의 효과를 구현할 수 있으나, 제2 실시예의 제품이 적용되는 휴대폰 등에서 광의 방출과 인입의 광학적 형합과 기구적 형합을 별도로 맞추어야 하는 경우가 발생하는데, 상기와 같이 추가의 상부 캡(430)을 구성할 경우 본 발명에서는 타 부품의 변경없이 상부 캡(430)의 개구부 간의 거리나 구경을 자유로이 조절하여 적용 대상과 광학적 기구적 형합을 용이하게 할 수 있는 이점이 있다.On the other hand, the second embodiment can be applied to a smart phone, etc. without the addition of a separate component to implement the effect of the present invention, but the optical and mechanical conformation of the light emission and incoming in the mobile phone to which the product of the second embodiment is applied When the additional upper cap 430 is configured as described above, the present invention freely adjusts the distance or aperture between the openings of the upper cap 430 without changing other components. There is an advantage that can facilitate easy matching.
상부 캡(430)은 플라스틱(Plastic)이나 러버(Rubber), 실리콘(Silicone), 폼(Foam), 스폰지, 수지, 금속 재질로 구현될 수 있으며, 실리콘이나 러버와 폼, 스폰지의 경우 기구 밀착성이 향상되는 부가적인 효과를 얻을 수 있다.The upper cap 430 may be formed of plastic, rubber, silicon, foam, sponge, resin, or metal, and in the case of silicon, rubber, foam, and sponge Additional effects can be obtained.
도 2 내지 도 6을 참조하면, ASIC칩(150~450)과 IR LED(140~440)는 미도시된 PCB의 동박 패턴이나 와이어링 본딩을 통해 연결되어 있고, 홀 또는 비아홀(124~424)을 통해 PCB 기판(120~420)의 저면에 형성된 접속단자(126-1~126-5; 226-1~226-5; 326-1~326-5; 426-1~426-5)와 연결되어 전기적인 회로를 구성하고 있다. 자체가 금속이거나 금속이 코팅된 하우징 판재도 필요에 따라 홀 또는 비아홀을 통해 PCB 기판의 저면에 형성된 접속단자와 연결되어 접지할 수 있다. PCB 기판(120~420)은 FR-4 기판에 동박층이 형성된 구조로 되어 있다. 아울러 ASIC칩과 LED 및 와이어의 보호를 위하여 통상적인 방법 중의 하나로 수지나 에폭시, 실리콘 등으로 encapsulation한다.2 to 6, the ASIC chips 150 to 450 and the IR LEDs 140 to 440 are connected to each other through a copper foil pattern or wiring bonding of a PCB (not shown), and holes or via holes 124 to 424. Connected to the connection terminals 126-1 to 126-5; 226-1 to 226-5; 326-1 to 326-5; 426-1 to 426-5 formed on the bottom of the PCB boards 120 to 420 through the And constitutes an electrical circuit. The housing plate, which is itself metal or metal-coated, may be connected to the connection terminal formed on the bottom surface of the PCB substrate and grounded through a hole or via hole, if necessary. The PCB substrates 120 to 420 have a structure in which a copper foil layer is formed on the FR-4 substrate. In addition, for the protection of ASIC chips, LEDs, and wires, one of the conventional methods is encapsulation with resin, epoxy, and silicon.
도 7은 본 발명에 따른 광학 근조도 센서의 구성 블럭도이다.7 is a block diagram illustrating an optical roughness sensor according to the present invention.
본 발명에 따른 근조도 센서는 도 7에 도시된 바와 같이, 적외선을 방사하는 적외선 발광다이오드(IR LED;140)와, 사물에서 반사된 적외선을 수광하기 위한 적외선 감지부(151)와, 적외선 감지부(151)의 아날로그 감지신호를 디지털로 변환하는 아날로그 디지털 변환기(152)와, 주변의 가시광선의 조도를 감지하기 위한 조도감지부(153)와, 조도감지부의 아날로그 감지신호를 디지털로 변환하는 아날로그 디지털 변환기(154)와, 디지털로 변환된 감지신호를 처리하여 근접과 조도를 산출하기 위한 디지털 신호 처리부(155)와, 디지털 신호 처리부의 감지 데이터를 소정의 통신방식으로 외부와 소통하고 IR LED 구동부(157)를 제어하기 위한 인터페이스 및 제어부(156)와, 적외선 발광 다이오드(140)를 구동하기 위한 IR LED 구동부(157)로 구성된다. 여기서, IR 감지부(151)와, ADC(152,154), 조도감지부(153), DSP(155), 인터페이스 및 제어부(156), IR LED 구동부(157)는 ASIC칩(150)으로 구현되는 것이 바람직하고, 인터페이스 및 제어부(156)는 I2C 인터페이스 방식으로 외부의 컨트롤러(42)와 통신한다.As shown in FIG. 7, the roughness sensor according to the present invention includes an infrared light emitting diode (IR LED) 140 emitting infrared rays, an infrared ray sensing unit 151 for receiving infrared rays reflected from an object, and infrared sensing An analog-to-digital converter 152 for converting the analog detection signal of the unit 151 to digital, an illumination intensity sensing unit 153 for sensing the illumination of visible light in the surroundings, and an analog sensing signal for converting the analog sensing signal of the illumination sensing unit into digital The analog-to-digital converter 154, the digital signal processor 155 for processing the digitally sensed signal to calculate the proximity and illuminance, and the sensed data of the digital signal processor to communicate with the outside in a predetermined communication method and IR LED An interface and a controller 156 for controlling the driver 157, and an IR LED driver 157 for driving the infrared light emitting diode 140. Here, the IR detector 151, the ADCs 152 and 154, the illumination intensity detector 153, the DSP 155, the interface and the controller 156, and the IR LED driver 157 are implemented by the ASIC chip 150. Preferably, the interface and controller 156 communicates with an external controller 42 in an I2C interface.
도 7을 참조하면, IR 감지부(151)는 근접을 감지하기 위한 적외선 포토 다이오드이고, 조도감지부(153)는 주변의 가시광선의 조도를 감지하기 위한 포토 다이오드이며, 인터페이스 및 제어부(156)와 컨트롤러(42)는 인터럽트선(INTB), SCL선, SDA선을 통해 데이터를 교환한다.Referring to FIG. 7, the IR detector 151 is an infrared photodiode for sensing proximity and the illuminance detector 153 is a photodiode for sensing illuminance of visible light in the surroundings. The controller 42 exchanges data via the interrupt line INTB, SCL line, and SDA line.
이상에서 본 발명은 도면에 도시된 일 실시예를 참고로 설명되었으나, 본 기술분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다.The present invention has been described above with reference to one embodiment shown in the drawings, but those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Claims (15)

  1. IR LED칩을 실장하기 위한 제1 캐비티의 측벽을 구성하며 개구부의 역할을 하는 끝단의 직경이 하부의 직경보다 큰 꼭지가 잘린 역원뿔형 홀과 제2 캐비티의 측벽을 구성하며 개구부의 역할을 하는 끝단의 직경이 하부의 직경보다 작은 꼭지가 잘린 원뿔형 홀이 형성되어 있고, 제1 캐비티의 측벽이 반사가 잘 되도록 표면의 조도를 갖추어 경면이 되도록 형성되고 금속이 코팅된 반사경이 일체화된 하우징 판재;It constitutes the side wall of the first cavity for mounting the IR LED chip and forms the sidewall of the second cavity and the inverted conical hole with the cutout of the end diameter acting as the opening is larger than the diameter of the lower part and the end of the end serving as the opening A housing plate having a conical hole with a diameter smaller than a diameter of a lower portion formed therein, the sidewall of the first cavity having a roughness of the surface such that the surface of the first cavity is reflected, and having a mirror surface and having a metal-coated reflector integrated therein;
    상기 하우징 판재와 접합되어 제1 캐비티와 제2 캐비티를 형성하며, 제1 캐비티의 바닥면과 제2 캐비티의 바닥면에 수용되는 소자를 각각 마운트하고 전기적 접속을 위해 결선할 수 있도록 회로 패턴이 형성된 PCB 기판;A circuit pattern is formed to be bonded to the housing plate to form a first cavity and a second cavity, and to mount the elements accommodated on the bottom surface of the first cavity and the bottom surface of the second cavity and to be connected for electrical connection. PCB substrate;
    상기 하우징 판재와 상기 PCB 기판에 의해 형성된 제1 캐비티의 바닥면의 PCB 기판에 마운트되어 있고, 전원이 공급되면 적외선을 방출하는 IR LED칩; 및An IR LED chip mounted on the PCB substrate on the bottom surface of the first cavity formed by the housing plate and the PCB substrate and emitting infrared light when power is supplied; And
    상기 하우징 판재와 상기 PCB 기판에 의해 형성된 제2 캐비티의 바닥면의 PCB 기판에 실장되어 전원이 공급되면 상기 IR LED칩을 구동함과 아울러 물체에서 반사된 적외선을 수광하여 근접을 감지하며 주변의 가시광선의 조도를 감지하는 광센서(photo sensor) 일체형 ASIC칩을 포함하여 구성된 것을 특징으로 하는 광학 근조도 센서.When the power is supplied by being mounted on the PCB board of the bottom surface of the second cavity formed by the housing plate and the PCB board, the IR LED chip is driven and the infrared light reflected from the object is received to sense the proximity and the surrounding visible light. Optical roughness sensor comprising a photo sensor integrated ASIC chip for detecting the illuminance of the line.
  2. 제1항에 있어서, 상기 하우징 판재는The method of claim 1, wherein the housing plate
    금속 또는 플라스틱으로 구성된 것을 특징으로 하는 광학 근조도 센서.Optical roughness sensor, characterized in that composed of metal or plastic.
  3. 제1항에 있어서, 상기 하우징 판재의 반사경에 코팅된 금속은 금이나 은이고, 은이 코팅될 경우에는 그 위에 유전체층이 더 코팅되어 적외선의 반사특성이 양호한 은을 사용하면서도 공기 중에서 산화되는 것을 방지하여 광효율을 높이면서도 제조단가를 낮출 수 있도록 된 것을 특징으로 하는 광학 근조도 센서.The method of claim 1, wherein the metal coated on the reflector of the housing plate is gold or silver, and when silver is coated, a dielectric layer is further coated thereon to prevent oxidation in air while using silver having good reflection characteristics of infrared rays. Optical roughness sensor, characterized in that the manufacturing cost can be lowered while increasing the light efficiency.
  4. 제3항에 있어서, 상기 유전체층은The method of claim 3, wherein the dielectric layer
    SiO2, TiO2, Al2O3 중 어느 하나로 이루어진 것을 특징으로 하는 광학 근조도 센서.Optical roughness sensor comprising any one of SiO 2 , TiO 2 , Al 2 O 3 .
  5. 제1항에 있어서, 상기 광학근조도 센서는The method of claim 1, wherein the optical roughness sensor
    상기 하우징 판재와 결합되어 상기 IR LED칩이 실장되는 제1 캐비티 위에 IR LED의 빛을 방사하기 위한 개구부가 형성되어 있으며, 제2 캐비티 위에 ASIC칩의 수광부측으로 광을 인입시키기 위한 개구부가 형성된 상부 캡을 더 포함하는 것을 특징으로 하는 광학 근조도 센서.An upper cap coupled to the housing plate to form an opening for emitting light of the IR LED on a first cavity on which the IR LED chip is mounted, and an upper cap having an opening for introducing light to the light-receiving side of the ASIC chip on the second cavity; Optical roughness sensor further comprises.
  6. 제5항에 있어서, 상기 상부 캡은The method of claim 5, wherein the upper cap
    플라스틱이나 러버, 실리콘, 폼, 스폰지, 수지, 금속 중 어느 하나로 이루어지고, 러버나 실리콘, 폼, 스폰지의 경우 기구 밀착성이 향상된 것을 특징으로 하는 광학 근조도 센서.An optical roughness sensor comprising one of plastic, rubber, silicone, foam, sponge, resin, and metal, and in the case of rubber, silicone, foam, and sponge, the adhesion of instruments is improved.
  7. 제1항에 있어서, 상기 하우징 판재에 형성되는 제1 캐비티 또는 제2 캐비티의 형태는According to claim 1, wherein the shape of the first cavity or the second cavity formed in the housing plate
    꼭지가 잘린 원뿔형이나 꼭지가 잘린 역원뿔형, 원기둥형, 꼭지가 잘린 타원뿔형, 꼭지가 잘린 역타원뿔형, 꼭지가 잘린 사각뿔형, 꼭지가 잘린 역사각뿔형, 타원기둥형, 사각기둥형, 또는 상기 형태의 이중 결합형 중 어느 하나인 것을 특징으로 하는 광학 근조도 센서.A truncated cone, a truncated inverted cone, a cylinder, a truncated elliptical cone, a truncated inverted cone, a truncated square pyramid, a truncated inverted pyramid, an elliptic cylinder, a square pillar, or a double-join of the above type. Optical roughness sensor, characterized in that one.
  8. IR LED칩을 실장하기 위한 제1 캐비티의 측벽을 구성하는 꼭지가 잘린 역원뿔형 홀과 제2 캐비티의 측벽을 구성하는 사각기둥형 홀이 형성되어 있고, 상기 꼭지가 잘린 역원뿔형 홀의 끝단과 상기 사각기둥형 홀의 끝단에 개구부가 형성되어 있으며, 상기 제1 캐비티의 측벽이 반사가 잘 되도록 표면의 조도를 갖추어 경면이 되도록 형성되고 금속이 코팅된 반사경이 일체화된 하우징 판재;An inverted conical hole having a cutout that forms the sidewall of the first cavity for mounting the IR LED chip and a square-shaped hole that forms the sidewall of the second cavity, and an end of the inverted conical hole with the cutout and the square-pillar shape A housing plate having an opening formed at an end of the hole, the sidewall of the first cavity having a roughness of a surface such that the sidewall of the first cavity has a reflection, and a mirror surface coated with a metal, and having a metal-coated reflector integrated therein;
    상기 하우징 판재와 접합되어 제1 캐비티와 제2 캐비티를 형성하며, 제1 캐비티의 바닥면과 제2 캐비티의 바닥면에 수용되는 소자를 각각 마운트하고 전기적 접속을 위해 결선할 수 있도록 회로 패턴이 형성된 PCB 기판;A circuit pattern is formed to be bonded to the housing plate to form a first cavity and a second cavity, and to mount the elements accommodated on the bottom surface of the first cavity and the bottom surface of the second cavity and to be connected for electrical connection. PCB substrate;
    상기 하우징 판재와 상기 PCB 기판에 의해 형성된 제1 캐비티의 바닥면의 PCB 기판에 마운트되어 있고, 전원이 공급되면 적외선을 방출하는 IR LED칩; 및An IR LED chip mounted on the PCB substrate on the bottom surface of the first cavity formed by the housing plate and the PCB substrate and emitting infrared light when power is supplied; And
    상기 하우징 판재와 상기 PCB 기판에 의해 형성된 제2 캐비티의 바닥면의 PCB 기판에 실장되어 전원이 공급되면 상기 IR LED칩을 구동함과 아울러 물체에서 반사된 적외선을 수광하여 근접을 감지하며 주변의 가시광선의 조도를 감지하는 광센서 일체형 ASIC칩을 포함하여 구성된 것을 특징으로 하는 광학 근조도 센서.When the power is supplied by being mounted on the PCB board of the bottom surface of the second cavity formed by the housing plate and the PCB board, the IR LED chip is driven and the infrared light reflected from the object is received to sense the proximity and the surrounding visible light. Optical roughness sensor, characterized in that it comprises an optical sensor integrated ASIC chip for detecting the illuminance of the line.
  9. 제8항에 있어서, 상기 광학근조도 센서는The method of claim 8, wherein the optical roughness sensor
    상기 하우징 판재와 결합되어 상기 IR LED칩이 실장되는 제1 캐비티 위에 IR LED의 빛을 방사하기 위한 개구부가 형성되어 있으며, 제2 캐비티 위에 ASIC칩의 수광부측으로 광을 인입시키기 위한 개구부가 형성된 상부 캡을 더 포함하는 것을 특징으로 하는 광학 근조도 센서.An upper cap coupled to the housing plate to form an opening for emitting light of the IR LED on a first cavity on which the IR LED chip is mounted, and an upper cap having an opening for introducing light to the light-receiving side of the ASIC chip on the second cavity; Optical roughness sensor further comprises.
  10. 제9항에 있어서, 상기 상부 캡은10. The method of claim 9, wherein the upper cap
    플라스틱이나 러버, 실리콘, 폼, 스폰지, 수지, 금속 중 어느 하나로 이루어지고, 러버나 실리콘, 폼, 스폰지의 경우 기구 밀착성이 향상된 것을 특징으로 하는 광학 근조도 센서.An optical roughness sensor comprising one of plastic, rubber, silicone, foam, sponge, resin, and metal, and in the case of rubber, silicone, foam, and sponge, the adhesion of instruments is improved.
  11. 제8항에 있어서, 상기 하우징 판재의 반사경에 코팅된 금속은 금이나 은이고, 은이 코팅될 경우에는 그 위에 유전체층이 더 코팅되어 적외선의 반사특성이 양호한 은을 사용하면서도 공기 중에서 산화되는 것을 방지하여 광효율을 높이면서도 제조단가를 낮출 수 있도록 된 것을 특징으로 하는 광학 근조도 센서.The method according to claim 8, wherein the metal coated on the reflector of the housing plate is gold or silver, and when silver is coated, a dielectric layer is further coated thereon to prevent oxidation in air while using silver having good reflection properties of infrared rays. Optical roughness sensor, characterized in that the manufacturing cost can be lowered while increasing the light efficiency.
  12. 제8항에 있어서, 상기 하우징 판재에 형성되는 제1 캐비티 또는 제2 캐비티의 형태는The method of claim 8, wherein the form of the first cavity or the second cavity formed in the housing plate
    꼭지가 잘린 원뿔형이나 꼭지가 잘린 역원뿔형, 원기둥형, 꼭지가 잘린 타원뿔형, 꼭지가 잘린 역타원뿔형, 꼭지가 잘린 사각뿔형, 꼭지가 잘린 역사각뿔형, 타원기둥형, 사각기둥형, 또는 상기 형태의 이중 결합형 중 어느 하나인 것을 특징으로 하는 광학 근조도 센서.A truncated cone, a truncated inverted cone, a cylinder, a truncated elliptical cone, a truncated inverted cone, a truncated square pyramid, a truncated inverted pyramid, an elliptic cylinder, a square pillar, or a double-join of the above type. Optical roughness sensor, characterized in that one.
  13. 하우징 판재를 준비한 후 IR LED칩을 실장하기 위한 제1 캐비티 홀과, 광센서 일체형 ASIC칩을 실장하기 위한 제2 캐비티 홀을 형성하는 제 1 단계;Preparing a housing plate and forming a first cavity hole for mounting an IR LED chip and a second cavity hole for mounting an optical sensor integrated ASIC chip;
    PCB 기판을 준비한 후 동박 금 도금 후 쓰루 홀을 가공하고, 외부와 접속을 위한 패드를 형성하여 PCB 기판의 제1 캐비티 홀 영역에 IR LED칩을 실장하고 PCB 기판의 제2 캐비티 홀 영역에 광센서 일체형 ASIC칩을 실장하는 제 2 단계; 및After preparing the PCB substrate, after processing copper hole gold plating, through-holes are formed, pads are connected to the outside to mount the IR LED chip in the first cavity hole area of the PCB substrate, and the optical sensor in the second cavity hole area of the PCB substrate. A second step of mounting the integrated ASIC chip; And
    상기 하우징 판재와 상기 PCB 기판을 결합한 후 필요에 따라 상부 캡을 부착하는 제 3 단계를 포함하여 구성된 것을 특징으로 하는 광학 근조도 센서 제조 방법.And a third step of attaching the upper cap as necessary after joining the housing plate and the PCB substrate.
  14. 제13항에 있어서, 상기 제 1 단계는 The method of claim 13, wherein the first step is
    상기 제 1 케비티 홀의 측벽이나 상기 제 2 캐비티 홀의 측벽에 금 도금하거나 은 도금 후 유전체층을 코팅하는 것을 특징으로 하는 광학 근조도 센서 제조 방법.And coating a dielectric layer after gold plating or silver plating on the sidewall of the first cavity hole or the sidewall of the second cavity hole.
  15. 제13항에 있어서, 상기 제 1 단계에서 하우징 판재에 형성되는 제1 캐비티 또는 제2 캐비티의 형태는The method of claim 13, wherein the first cavity or the second cavity formed in the housing plate in the first step is
    꼭지가 잘린 원뿔형이나 꼭지가 잘린 역원뿔형, 원기둥형, 꼭지가 잘린 타원뿔형, 꼭지가 잘린 역타원뿔형, 꼭지가 잘린 사각뿔형, 꼭지가 잘린 역사각뿔형, 타원기둥형, 사각기둥형, 또는 상기 형태의 이중 결합형 중 어느 하나인 것을 특징으로 하는 광학 근조도 센서 제조 방법.A truncated cone, a truncated inverted cone, a cylinder, a truncated elliptical cone, a truncated inverted cone, a truncated square pyramid, a truncated inverted pyramid, an elliptic cylinder, a square pillar, or a double-join of the above type. Optical roughness sensor manufacturing method characterized in that one.
PCT/KR2013/010136 2012-11-09 2013-11-08 Optical proximity sensor, and method for manufacturing same WO2014073905A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201390001048.3U CN205209633U (en) 2012-11-09 2013-11-08 Nearly light intensity sensor of optics

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020120126984A KR101336781B1 (en) 2012-11-09 2012-11-09 Optical proximity sensor with ambient light sensor and method of making the same
KR10-2012-0126984 2012-11-09
KR10-2012-0145372 2012-12-13
KR1020120145372A KR101457069B1 (en) 2012-12-13 2012-12-13 Optical proximity sensor with ambient light sensor
KR10-2013-0067779 2013-06-13
KR1020130067779A KR101476994B1 (en) 2013-06-13 2013-06-13 Optical proximity sensor with ambient light sensor and method of making the same

Publications (1)

Publication Number Publication Date
WO2014073905A1 true WO2014073905A1 (en) 2014-05-15

Family

ID=50684928

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/010136 WO2014073905A1 (en) 2012-11-09 2013-11-08 Optical proximity sensor, and method for manufacturing same

Country Status (2)

Country Link
CN (1) CN205209633U (en)
WO (1) WO2014073905A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016105230A1 (en) * 2014-12-24 2016-06-30 Общество С Ограниченной Ответственостью "Микросенсор Технолоджи" Device for determining chemical substances in a medium being analyzed
WO2017101253A1 (en) * 2015-12-18 2017-06-22 深圳市金立通信设备有限公司 Laser ranging device, imaging device, and terminal thereof
US11486817B2 (en) * 2019-10-30 2022-11-01 Ricoh Company, Ltd. Detecting device, detecting unit, and detecting system

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190305170A1 (en) * 2016-07-14 2019-10-03 Kyocera Corporation Photosensor package, photosensor device, and electronic module
EP3139159A1 (en) * 2016-08-23 2017-03-08 Sensirion AG Sensor assembly
CN106449543A (en) * 2016-08-30 2017-02-22 张为凤 Photoelectron semiconductor device
CN106449437A (en) * 2016-08-30 2017-02-22 张为凤 Photoelectron semiconductor device manufacturing method
CN106298747B (en) * 2016-08-30 2018-07-24 南通威尔电机有限公司 A kind of light-detecting device
CN106449864B (en) * 2016-08-30 2018-05-29 江苏派诺光电科技股份有限公司 A kind of manufacturing method of light-detecting device
CN109116443B (en) * 2018-10-17 2021-08-27 深圳南方德尔汽车电子有限公司 Rainfall and sunlight sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100081052A (en) * 2009-01-05 2010-07-14 삼성전자주식회사 Detecting apparatus using a proximity sensor and mobile device having the same
JP3172668U (en) * 2011-09-27 2012-01-05 菱生精密工業股▲分▼有限公司 Optical module
KR20120087779A (en) * 2011-11-16 2012-08-07 주식회사 오디텍 Method for manufacturing proximity sensor
KR101176819B1 (en) * 2011-06-24 2012-08-24 광전자 주식회사 Ambient light and proximity sensor package and method for manufacturing thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100081052A (en) * 2009-01-05 2010-07-14 삼성전자주식회사 Detecting apparatus using a proximity sensor and mobile device having the same
KR101176819B1 (en) * 2011-06-24 2012-08-24 광전자 주식회사 Ambient light and proximity sensor package and method for manufacturing thereof
JP3172668U (en) * 2011-09-27 2012-01-05 菱生精密工業股▲分▼有限公司 Optical module
KR20120087779A (en) * 2011-11-16 2012-08-07 주식회사 오디텍 Method for manufacturing proximity sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016105230A1 (en) * 2014-12-24 2016-06-30 Общество С Ограниченной Ответственостью "Микросенсор Технолоджи" Device for determining chemical substances in a medium being analyzed
WO2017101253A1 (en) * 2015-12-18 2017-06-22 深圳市金立通信设备有限公司 Laser ranging device, imaging device, and terminal thereof
US11486817B2 (en) * 2019-10-30 2022-11-01 Ricoh Company, Ltd. Detecting device, detecting unit, and detecting system

Also Published As

Publication number Publication date
CN205209633U (en) 2016-05-04

Similar Documents

Publication Publication Date Title
WO2014073905A1 (en) Optical proximity sensor, and method for manufacturing same
KR101457069B1 (en) Optical proximity sensor with ambient light sensor
CN108012004B (en) Electronic device
WO2014077643A1 (en) Light-emitting device and electronic apparatus including same
KR101476994B1 (en) Optical proximity sensor with ambient light sensor and method of making the same
CN108040148B (en) Input/output module and electronic device
WO2013122358A1 (en) Light emitting module having lens
KR101336781B1 (en) Optical proximity sensor with ambient light sensor and method of making the same
CN108183984B (en) Input/output module and electronic device
US20070194339A1 (en) Optical data communication module
CN108063150B (en) Electronic device
CN108183987B (en) Electronic device
TWM608988U (en) Proximity sensing device
CN108200239B (en) Electronic device
CN108023985B (en) Electronic device
TW201539258A (en) Electronic device with high electrostatic protection
CN108200235B (en) Output module and electronic device
KR101313626B1 (en) Optical proximity sensor with ambient light sensor
CN108124034B (en) Electronic device
CN108183992B (en) Electronic device
CN108156285B (en) Electronic device
KR101313623B1 (en) Optical proximity sensor with ambient light sensor
CN108200234B (en) Electronic device
WO2019059522A1 (en) Optical sensor package
CN212967702U (en) Modular infrared proximity and ambient light brightness sensor packaging system

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13853486

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13853486

Country of ref document: EP

Kind code of ref document: A1