CN108063150B

CN108063150B - Electronic device

Info

Publication number: CN108063150B
Application number: CN201711437409.XA
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2020-08-18
Anticipated expiration: 2037-12-26
Also published as: CN108063150A

Abstract

The electronic device disclosed by the invention comprises a shell, an input/output module, a vibration module and a piezoelectric element. The input/output module is arranged in the shell and comprises a packaging shell, an infrared light supplement lamp, a proximity infrared lamp and a proximity sensor. The packaging shell comprises a packaging substrate, and the infrared light supplement lamp, the proximity infrared lamp and the proximity sensor are packaged in the packaging shell and are borne on the packaging substrate. The infrared light supplementing lamp and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, and the proximity sensor is used for receiving infrared light reflected by an object to detect the distance of the object. The vibration module is installed on the casing, and piezoelectric element combines and with the input/output module interval with the vibration module, and piezoelectric element is used for taking place deformation so that the vibration module vibrates when being exerted the electrical signal. The integration level of input/output module is higher, and the volume is less, and electron device adopts piezoelectric element and vibration module to realize bone conduction transaudient, can effectively guarantee the privacy of conversation content.

Description

Electronic device

Technical Field

The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an electronic device.

An electronic device according to an embodiment of the present invention includes:

a housing;

the input and output module is arranged in the shell and comprises a packaging shell, an infrared light supplement lamp, a proximity infrared lamp and a proximity sensor, the packaging shell comprises a packaging substrate, the infrared light supplement lamp, the proximity infrared lamp and the proximity sensor are packaged in the packaging shell and are borne on the packaging substrate, the infrared light supplement lamp and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, and the proximity sensor is used for receiving infrared light reflected by an object to detect the distance of the object;

the vibration module is arranged on the shell; and

the piezoelectric element is combined with the vibration module and is spaced from the input and output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate.

In some embodiments, the vibration module includes a display screen and a transparent cover plate, the display screen is disposed on the housing and forms an accommodation cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodation cavity, the display screen is combined with the cover plate, the housing is provided with a housing proximity light-emitting through hole, a housing light-filling through hole, a housing proximity light-receiving through hole, and a housing vibration through hole, which are spaced from each other, the proximity infrared lamp corresponds to the housing proximity light-emitting through hole, the infrared light-filling lamp corresponds to the housing light-filling through hole, the proximity sensor corresponds to the housing proximity light-receiving through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.

In some embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.

In some embodiments, the input/output module further includes a chip, and the infrared fill-in light, the proximity infrared light, and the proximity sensor are all formed on one chip.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, a light supplement window, a proximity light emitting window and a proximity light receiving window are formed at the package top, the light supplement window corresponds to the infrared light supplement lamp, the proximity light emitting window corresponds to the proximity infrared lamp, and the proximity light receiving window corresponds to the proximity sensor.

In some embodiments, the input/output module further includes a light supplement lamp lens, and the light supplement lamp lens is disposed in the package housing and corresponds to the infrared light supplement lamp; and/or the input/output module further comprises a proximity lamp lens, and the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp; and/or the input/output module further comprises a proximity sensing lens, and the proximity sensing lens is arranged in the packaging shell and corresponds to the proximity sensor.

In some embodiments, the input/output module further includes a light supplement lamp lens, a proximity lamp lens and a proximity sensing lens, which are disposed in the package housing, wherein the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, the proximity sensing lens corresponds to the proximity sensor, and the light supplement lamp lens, the proximity lamp lens and the proximity sensing lens are located on the same transparent substrate.

In some embodiments, the input/output module further includes a plurality of metal shielding plates, and the plurality of metal shielding plates are respectively located in the package housing and between any two of the infrared fill light, the proximity infrared light, and the proximity sensor.

In some embodiments, the input/output module further includes an optical enclosure made of a light-transmissive material, the optical enclosure is formed on the package substrate and located in the package housing, and the optical enclosure encloses the infrared fill light, the proximity infrared light, and the proximity sensor.

In some embodiments, the input/output module further includes a plurality of light-emitting partitions, and the light-emitting partitions are respectively formed in the optical enclosure and located between any two of the infrared fill light, the proximity infrared light, and the proximity sensor.

In some embodiments, a ground pin, a fill-in light pin, a proximity light pin, and a proximity sensing pin are formed on the input/output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the proximity sensing pin are enabled, the proximity sensor receives infrared light reflected by an object to detect the distance of the object.

In some embodiments, an infrared transparent ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the casing, and the infrared transparent ink blocks at least one of the casing approaching light emitting through hole, the casing light supplement through hole, the casing approaching light receiving through hole, and the casing vibration through hole.

In some embodiments, the electronic device further includes a light sensor and an imaging module, the imaging module includes a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base includes a mounting surface located between the lens barrel and the image sensor, and the light sensor is disposed on the mounting surface.

In some embodiments, the imaging module comprises at least one of a visible light camera and an infrared light camera.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, centers of the input/output module, the infrared camera, the visible light camera, the piezoelectric element, and the structured light projector are located on a same line segment, and sequentially from one end to the other end of the line segment:

the input/output module, the structured light projector, the piezoelectric element, the infrared camera and the visible light camera; or

The input/output module, the infrared camera, the piezoelectric element, the visible light camera and the structured light projector; or

The infrared camera, the input-output module, the piezoelectric element, the visible light camera and the structured light projector; or

The infrared camera, the visible light camera, the piezoelectric element, the input/output module and the structured light projector.

In some embodiments, the electronic device further includes an imaging module and a light sensor, the imaging module is installed on the housing, the imaging module includes a camera housing and a lens module, the top surface of the camera housing is a step surface and includes a first sub-top surface and a second sub-top surface which are connected, the second sub-top surface is opposite to the first sub-top surface, inclines and forms a cut with the first sub-top surface, the top surface has been provided with a light exit hole, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the light sensor is disposed at the first sub-top surface.

In some embodiments, the electronic device further includes an imaging module and a photo sensor, the imaging module includes a camera housing and two lens modules, a top surface of the camera housing is provided with a notch to form a stepped top surface, the top surface includes a first step surface and a second step surface lower than the first step surface, the first step surface is provided with two light-emitting through holes, each light-emitting through hole corresponds to the lens module, and the photo sensor is disposed at the second step surface.

In some embodiments, the electronic device further includes an imaging module and a light sensor, the imaging module includes a lens base, a lens barrel mounted on the lens base, and a substrate partially disposed in the lens base, and the light sensor is disposed on the substrate.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, centers of the input/output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line segment, and the piezoelectric element is located between the line segment and the top of the housing.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, the number of the piezoelectric elements is plural, the number of the casing vibration through holes is plural, the plural piezoelectric elements correspond to the plural casing vibration through holes, each piezoelectric element is accommodated in the corresponding casing vibration through hole, centers of the input/output module, the infrared camera, the visible light camera, the plural piezoelectric elements, and the structured light projector are located on the same line segment, and at least one of the input/output module, the infrared camera, the visible light camera, and the structured light projector is disposed between two adjacent piezoelectric elements.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, the piezoelectric element includes a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the casing vibration through holes is multiple, the plurality of piezoelectric bumps correspond to the plurality of casing vibration through holes, each of the piezoelectric bumps is partially received in the corresponding casing vibration through hole and is combined with the cover plate, the input/output module, the infrared camera, the visible light camera, and the structured light projector are located between the cover plate and the piezoelectric body, the centers of the input/output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located on the same line segment, and the input/output module, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located between two adjacent piezoelectric bumps, At least one of the infrared camera, the visible light camera, and the structured light projector.

In the electronic device of the embodiment of the invention, the input/output module integrates the infrared light supplement lamp, the proximity infrared lamp and the proximity sensor into a single packaging body structure, and integrates the functions of transmitting and receiving infrared light for infrared distance measurement and infrared light supplement, so that the input/output module has higher integration level and smaller volume, and the input/output module saves the space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because infrared light filling lamp, the near infrared lamp and the proximity sensor are borne on the same packaging substrate, compared with the infrared light filling lamp, the near infrared lamp and the proximity sensor in the traditional process, different wafers are required to be manufactured respectively and then combined on the PCB substrate for packaging, and the packaging efficiency is improved. Furthermore, the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction sound transmission, replaces the traditional telephone receiver structure which is used for transmitting sound through air, effectively ensures the privacy of conversation content on the one hand, and on the other hand, because the original telephone receiver is cancelled, the through hole which corresponds to the telephone receiver is avoided being arranged on the cover plate, the process is simpler, and the appearance is more attractive.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIG. 4 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line V-V;

FIG. 6 is a schematic partial cross-sectional view of the electronic device of FIG. 1 taken along line VI-VI;

FIG. 7 is a schematic perspective view of a photosensor and an imaging module of an electronic device according to some embodiments of the present invention;

fig. 8 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 10 to 11 are schematic arrangement diagrams of electronic components of the electronic device according to the embodiment of the present invention;

FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

FIG. 13 is a schematic partial cross-sectional view of the electronic device of FIG. 12 taken along line XIII-XIII;

FIG. 14 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIGS. 15 to 17 are schematic partial cross-sectional views of an electronic device according to an embodiment of the present invention taken along a position corresponding to the XV-XV line in FIG. 1;

fig. 18 to 25 are schematic perspective views of a photosensor and an imaging module of an electronic device according to an embodiment of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout. In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic component includes an input/output module 10, a light sensor 50 (see fig. 7), a vibration module 30a (see fig. 5), a piezoelectric element 70, an imaging module 60 (see fig. 7), and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 and 3, the input/output module 10 is a single package structure, and includes a package housing 11, an infrared fill-in light 12, a proximity infrared light 13, and a proximity sensor 1 d.

The packaging shell 11 is used for packaging the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d at the same time, or the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d are packaged in the packaging shell 11 at the same time. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10. In the present embodiment, the centers of the infrared fill-in light 12, the proximity infrared light 13, and the proximity sensor 1d are located on the same line segment, for example: an infrared light supplement lamp 12, a proximity infrared lamp 13 and a proximity sensor 1d are sequentially arranged from one end to the other end of the line segment; or, a proximity infrared lamp 13, an infrared light supplement lamp 12 and a proximity sensor 1d are sequentially arranged from one end to the other end of the line segment; or, the proximity infrared lamp 13, the proximity sensor 1d and the infrared light supplement lamp 12 are sequentially arranged from one end to the other end of the line segment. In other embodiments, the connection line between the centers of the infrared fill-in light 12, the proximity infrared light 13 and the proximity sensor 1d is triangular.

The package substrate 111 is used for carrying the infrared fill-in light 12, the proximity infrared light 13 and the proximity sensor 1 d. When the input/output module 10 is manufactured, the infrared fill-in light 12, the proximity infrared light 13, and the proximity sensor 1d may be formed on one chip 14, and then the infrared fill-in light 12, the proximity infrared light 13, the proximity sensor 1d, and the chip 14 are disposed on the package substrate 111 together, specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100.

The packaging side wall 112 can surround the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d, the packaging side wall 112 extends from the packaging substrate 111, the packaging side wall 112 can be combined with the packaging substrate 111, preferably, the packaging side wall 112 and the packaging substrate 111 are detachably connected, so that the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d can be conveniently overhauled after the packaging side wall 112 is taken down. The package sidewall 112 may be made of a material opaque to infrared light to prevent infrared light emitted from the infrared fill light 12 or the near infrared light 13 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A supplementary lighting window 1131, a proximity light emitting window 1132 and a proximity light receiving window 1133 are formed on the package top 113, the supplementary lighting window 1131 corresponds to the infrared supplementary lighting lamp 12, and infrared light emitted by the infrared supplementary lighting lamp 12 passes through the supplementary lighting window 1131; the proximity light emission window 1132 corresponds to the proximity infrared lamp 13, and infrared light emitted by the proximity infrared lamp 13 passes out of the proximity light emission window 1132; the proximity light-receiving window 1133 corresponds to the proximity sensor 1d, and the infrared light reflected by the object can pass through the proximity light-receiving window 1133 and be incident on the proximity sensor 1 d. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the fill light window 1131, the proximity light emitting window 1132 and the proximity light receiving window 1133 are all through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is made of a material opaque to infrared light, a material transparent to infrared light, and a material opaque to visible light, and specifically, the fill light window 1131, the proximity light emitting window 1132, and the proximity light receiving window 1133 are made of a material transparent to infrared light, and the rest of the package top is made of a material opaque to infrared light and visible light. Further, the light filling window 1131 and the proximity light emitting window 1132 may be formed with lens structures to improve an infrared light emission angle emitted from the light filling window 1131 and the proximity light emitting window 1132, for example, the light filling window 1131 is formed with a concave lens structure to diffuse light passing through the light filling window 1131 to be emitted outward; a convex lens structure is formed near the light emitting window 1132, so that light rays passing through the light emitting window 1132 are gathered and emitted outwards; the proximity light-collecting window 1133 may also be formed with a lens structure to improve the emission angle of infrared light incident from the proximity light-collecting window 1133, for example, the proximity light-collecting window 1133 has a convex lens structure to converge and project light incident from the proximity light-collecting window 1133 onto the proximity sensor 1 d.

The infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d can be formed on one chip 14, the size of the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d after integration is further reduced, and the preparation process is simple. The infrared fill-in light 12 can emit infrared light, the infrared light passes through the fill-in light window 1131 to project onto the surface of the object, and the infrared camera 62 (as shown in fig. 1) of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared fill-in light 12 is used for infrared fill-in light). The proximity infrared lamp 13 may emit infrared light, which passes through the proximity light emitting window 1132 and reaches the surface of the object, and the proximity sensor 1d receives the infrared light reflected by the object incident from the proximity light receiving window 1133 to determine the distance from the object to the electronic device 100 (at this time, the proximity infrared lamp 13 is used for infrared ranging). The light sensor 50 receives visible light in the ambient light and detects the intensity of the visible light (as shown in fig. 7).

The infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light to the outside of the packaging shell 11 at different powers, specifically, the infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light simultaneously, and the input and output module 10 is used for infrared light supplementing and infrared distance measurement simultaneously; the infrared light supplement lamp 12 can emit light rays and does not emit light rays close to the infrared lamp 13, and the input and output module 10 is only used for infrared light supplement; or the infrared light supplement lamp 12 does not emit light and is close to the infrared lamp 13 to emit light, and the input and output module 10 is only used for infrared distance measurement.

Referring to fig. 4, in the embodiment of the invention, the input/output module 10 is formed with a ground pin 15, a fill-in light pin 16, a proximity light pin 17, and a proximity sensing pin 1 f. The ground pin 15, the fill-in light pin 16, the proximity light pin 17, and the proximity sensing pin 1f may be formed on the package substrate 111, and when the ground pin 15 and the fill-in light pin 16 are enabled (i.e., when the ground pin 15 and the fill-in light pin 16 are connected to the circuit), the infrared fill-in light 12 emits infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are on), the proximity infrared lamp 13 emits infrared light. When the ground pin 15 and the proximity sensing pin 1f are enabled (i.e., when the ground pin 15 and the proximity sensing pin 1f are connected to the circuit), the proximity sensor 1d detects infrared light emitted from the proximity infrared lamp 13 and reflected by the object as a basis for determining the distance from the object to the electronic device 100.

Referring to fig. 1 and 5, the housing 20 may serve as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The chassis 20 may be a housing of the electronic device 100.

Referring to fig. 1, 5 and 6, the housing 20 includes a top portion 21 and a bottom portion 22, and at a position corresponding to the electronic component, the housing 20 is provided with a housing proximity light emitting through hole 23, a housing supplementary light through hole 24, a housing proximity light receiving through hole 2f and a housing vibration through hole 2a which are spaced apart from each other. When the input/output module 10 is disposed in the casing 20, the proximity infrared lamp 13 corresponds to the casing proximity light-emitting through hole 23, the infrared light-compensating lamp 12 corresponds to the casing light-compensating through hole 24, and the proximity sensor 1d corresponds to the casing proximity light-receiving through hole 2 f. The light emitted by the near infrared lamp 13 corresponding to the near light emitting through hole 23 of the chassis can pass through the near light emitting through hole 23 of the chassis, specifically, the near infrared lamp 13 is opposite to the near light emitting through hole 23 of the chassis, or the light emitted by the near infrared lamp 13 passes through the near light emitting through hole 23 of the chassis after being acted by the light guide element. The infrared light supplement lamp 12 corresponds to the chassis light supplement through hole 24, and the description thereof is omitted. The proximity sensor 1d corresponds to the case proximity light receiving through hole 2f, which means that infrared light reflected by an object can pass through the case proximity light receiving through hole 2f and be incident on the proximity sensor 1d, specifically, the proximity sensor 1d is directly opposite to the case proximity light receiving through hole 2f, or light incident by the infrared light passes through the case proximity light receiving through hole 2f and is incident on the proximity sensor 1d after being acted by the light guide element. In the embodiment shown in fig. 6, the chassis near light-emitting through hole 23, the chassis light supplement through hole 24 and the chassis near light-receiving through hole 2f may be spaced from each other, and in other embodiments, the chassis near light-emitting through hole 23, the chassis light supplement through hole 24 and the chassis near light-receiving through hole 2f may be communicated with each other.

The vibration module 30a is mounted on the cabinet 20. The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 and the cover plate 30 are combined to form the vibration module 30a, so as to improve the rigidity of the vibration module 30 a. The display screen 90 is disposed on the housing 20 and forms a receiving cavity 91 with the housing 20, and the cover plate 30 is disposed on the housing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the input/output module 10 according to the embodiment of the invention can occupy a smaller volume, the volume for disposing the display screen 90 in the housing 20 can be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the display 90, the input/output module 10 and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22, and the top portion 21 is located above the bottom portion 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, the input/output module 10 may be disposed between the display 90 and the top portion 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.

The piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a twin wafer, or a laminated piezoelectric element 70. The piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the input-output module 10. Specifically, the piezoelectric element 70 is accommodated in the casing vibration through hole 2a, is coupled to the cover plate 30, and is spaced apart from the casing 20, and may be: the piezoelectric element 70 is partially accommodated in the chassis vibration through hole 2a, or the piezoelectric element 70 is entirely accommodated in the chassis vibration through hole 2 a. When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 is mechanically deformed, for example, expanded or contracted, due to the inverse piezoelectric effect, thereby causing the vibration module 30a coupled to the piezoelectric element 70 to vibrate according to the frequency of the electric signal. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth). In this way, the user can realize the functions of voice call, listening to music, etc. through the piezoelectric element 70 and the vibration module 30 a. In an embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal and apply an electrical signal corresponding to the sound signal to the two ends of the piezoelectric element 70.

It can be understood that the traditional receiver structure adopts air conduction sound, the local sound pressure of the receiver is usually about 90 dB-100 dB when the receiver works, and the sound is still about 50 dB-60 dB even if the sound is transmitted to the range of 1 meter around in the quiet surrounding environment (such as in the general office environment of about 50 dB), which causes the conversation content among the callers to be perceived around, resulting in privacy leakage. The electronic device 100 according to the embodiment of the invention adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and the sound of the call is mainly sensed by the bone conduction of the vibration and can effectively ensure the privacy of the call content.

Referring again to fig. 5 and 6, the piezoelectric element 70 and the display screen 90 are attached to the cover plate 30 by the joint 30 b. The bonding member 30b is an adhesive, a double-sided tape, an adhesive tape, or the like having a thermosetting property and an ultraviolet curing property. For example, the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet-curing acrylic adhesive). The area of the cover 30 bonded to the piezoelectric element 70 is spaced apart from the area of the cover 30 bonded to the display screen 90 to prevent the display of the display screen 90 from being interfered with by the piezoelectric element 70. Of course, the cover 30 can also be coupled to the housing 20 by the coupling member 30b, so that compared with the case where the cover 30 is directly disposed on the housing 20, the vibration of the vibration module 30a can be prevented from being directly transmitted to the housing 20, thereby reducing the possibility that the user may drop the electronic device 100 due to the excessive vibration amplitude of the housing 20.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 6, the cover plate 30 covers the chassis light filling through hole 24, the chassis near light emitting through hole 23, the chassis near light receiving through hole 2f, and the chassis vibration through hole 2a, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered with the infrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.

The infrared transmission ink 40 can further shield at least one of the chassis approach light emitting through hole 23, the chassis light supplement through hole 24, the chassis approach light receiving through hole 2f, and the chassis vibration through hole 2a, that is, the infrared transmission ink 40 can simultaneously cover the chassis approach light emitting through hole 23, the chassis light supplement through hole 24, the chassis approach light receiving through hole 2f, and the chassis vibration through hole 2a (as shown in fig. 6), so that a user cannot easily see the internal structure of the electronic device 100 through the chassis approach light emitting through hole 23, the chassis light supplement through hole 24, the chassis approach light receiving through hole 2f, and the chassis vibration through hole 2a, and the electronic device 100 has a more beautiful appearance; the infrared transmission ink 40 can also cover the shell near light-emitting through hole 23, and does not cover the shell light-supplementing through hole 24, the shell near light-receiving through hole 2f and the shell vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell light supplement through hole 24, and does not cover the shell near light emitting through hole 23, the shell near light receiving through hole 2f and the shell vibration through hole 2 a; the infrared transmission ink 40 can also cover the case approach light receiving through hole 2f, and does not cover the case approach light emitting through hole 23, the case light supplement through hole 24 and the case vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell vibration through hole 2a and the shell approach light receiving through hole 2f, and does not cover the shell approach light emitting through hole 23 and the shell light supplement through hole 24; the infrared transparent ink 40 may cover the chassis near light emitting through hole 23 and the chassis light supplement through hole 24, and may not cover the chassis near light receiving through hole 2f and the chassis vibration through hole 2a, etc., which is not limited herein.

Referring to FIG. 7, the optical sensor 50 is a single package. The light sensor 50 receives the visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90.

Referring to fig. 1 and 7, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 7, the optical sensor 50 is disposed on the mounting surface 631, and specifically, the orthogonal projection of the optical sensor 50 on the plane of the mounting surface 631 at least partially falls on the mounting surface 631, so that the optical sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by both the optical sensor 50 and the imaging module 60 is small.

Referring to fig. 1, the structured light projector 80 is configured to emit structured light to the outside, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain the depth information of the object to be measured.

In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the input-output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70 and the structured light projector 80 are located on the same line segment. Specifically, the input/output module 10, the structured light projector 80, the piezoelectric element 70, the infrared camera 62, and the visible light camera 61 (as shown in fig. 8) are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 may form a dual camera (as shown in fig. 22); or an input/output module 10, an infrared camera 62, a piezoelectric element 70, a visible light camera 61 and a structured light projector 80 (as shown in fig. 1) are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the input/output module 10, the piezoelectric element 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the input/output module 10 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera (as shown in fig. 22). Of course, the arrangement of the input/output module 10, the infrared camera 62, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Referring to fig. 9, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The centers of the input-output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the housing 20. Specifically, the input/output module 10, the structured light projector 80, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment; or the input/output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment (as shown in fig. 9); or the infrared camera 62, the input and output module 10, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the input/output module 10 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 is not limited to the above example. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, so that the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover plate 30 is saved.

Further, referring to fig. 7, the optical sensor 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, and of course, the optical sensor 50 may not be disposed on the mounting surface 631, for example, the optical sensor 50 may be disposed adjacent to the input/output module 10, or disposed adjacent to the piezoelectric element 70, which is not limited herein.

In summary, in the electronic device 100 according to the embodiment of the invention, the input/output module 10 integrates the infrared fill-in light 12, the proximity infrared light 13 and the proximity sensor 1d into a single package structure, and integrates the functions of transmitting and receiving infrared light for infrared distance measurement and infrared fill-in light, so that the input/output module 10 has a higher integration level and a smaller volume, and the input/output module 10 saves space for realizing the functions of infrared fill-in light and infrared distance measurement. In addition, because the infrared fill-in light lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d are supported on the same package substrate 111, compared with the infrared fill-in light lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d in the conventional process, which need to be manufactured by different wafers and then assembled on a PCB substrate for packaging, the packaging efficiency is improved. Moreover, the electronic device 100 adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and replaces the traditional receiver structure which conducts sound through air, so that on one hand, the privacy of the conversation content can be effectively ensured; on the other hand, the original telephone receiver is eliminated, so that a through hole corresponding to the telephone receiver is not formed in the cover plate 30, the process is simpler, the appearance is more attractive, and dust or moisture can be prevented from entering the electronic device 100.

Referring to fig. 6 and 10, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach light emitting through hole 23, a casing light supplement through hole 24, a casing approach light receiving through hole 2f and a casing vibration through hole 2a which are spaced from each other. The proximity infrared lamp 13 corresponds to the case proximity light-emitting through hole 23, the infrared light supplement lamp 12 corresponds to the case light supplement through hole 24, and the proximity sensor 1d corresponds to the case proximity light-receiving through hole 2 f. The number of the piezoelectric elements 70 is plural, the number of the chassis vibration through holes 2a is plural, the plural piezoelectric elements 70 correspond to the plural chassis vibration through holes 2a, and each piezoelectric element 70 is accommodated in the corresponding chassis vibration through hole 2 a. The centers of the input and output module 10, the infrared camera 62, the visible light camera 61, the plurality of piezoelectric elements 70 and the structured light projector 80 are located on the same line segment, and at least one of the input and output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 is arranged between two adjacent piezoelectric elements 70. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric elements 70, the input/output module 10, the structured light projector 80, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 10); or the piezoelectric element 70, the input/output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric elements 70 is three, and the piezoelectric elements 70, the input/output module 10, the structured light projector 80, the piezoelectric elements 70, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 (shown in fig. 11) are arranged in sequence from one end to the other end of the line segment; or the piezoelectric element 70, the input/output module 10, the piezoelectric element 70, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80, and the like are arranged in sequence from one end to the other end of the line segment. Of course, the number of the piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric elements 70 are combined with the cover plate 30, and specifically, the plurality of piezoelectric elements 70 are respectively attached to the cover plate 30 by the joining members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to two ends of the piezoelectric elements 70, and the piezoelectric elements 70 are mechanically deformed, so that the piezoelectric elements 70 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality of piezoelectric elements 70 simultaneously drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is uniform and has higher intensity, which is beneficial to stably transmitting the bone conduction sound to the auditory nerve of the user.

Referring to fig. 6, 12 and 13, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach light emitting through hole 23, a casing light supplement through hole 24, a casing approach light receiving through hole 2f and a casing vibration through hole 2a which are spaced from each other. The proximity infrared lamp 13 corresponds to the case proximity light-emitting through hole 23, the infrared light supplement lamp 12 corresponds to the case light supplement through hole 24, and the proximity sensor 1d corresponds to the case proximity light-receiving through hole 2 f. The piezoelectric element 70 includes a piezoelectric body 71 and a plurality of piezoelectric bumps 72 extending from the piezoelectric body 71, the number of the piezoelectric bumps 72 is plural, the number of the chassis vibration through holes 2a is plural, the plurality of piezoelectric bumps 72 correspond to the plurality of chassis vibration through holes 2a, and each piezoelectric bump 72 is partially received in the corresponding chassis vibration through hole 2a and is coupled to the cover plate 30. The input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover plate 30 and the piezoelectric body 71. The centers of the input and output module 10, the infrared camera 62, the visible light camera 61, the plurality of piezoelectric bumps 72 and the structured light projector 80 are located on the same line segment, and at least one of the input and output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 is arranged between two adjacent piezoelectric bumps 72. For example, the number of the piezoelectric bumps 72 is two, and the piezoelectric bumps 72, the input/output module 10, the structured light projector 80, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the input-output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is three, and the piezoelectric bumps 72, the input/output module 10, the structured light projector 80, the piezoelectric bumps 72, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the input-output module 10, the piezoelectric bump 72, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is five, and the piezoelectric bumps 72, the input/output module 10, the piezoelectric bumps 72, the structured light projector 80, the piezoelectric bumps 72, the infrared camera 62, the piezoelectric bumps 72, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 13). Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric bumps 72 are combined with the cap plate 30, and more specifically, the plurality of piezoelectric bumps 72 are respectively attached to the cap plate 30 by the bonding members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bumps 72 is mechanically deformed, so that the piezoelectric bumps 72 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment shown in fig. 13, the housing 20 is provided with a housing vibration through hole 2a, an input/output through hole 25, a structured light through hole 26, an infrared light through hole 27, and a visible light through hole 28 which are spaced from each other. The case vibration through hole 2a corresponds to the piezoelectric bump 72, the input/output through hole 25 corresponds to the input/output module 10, the structured light through hole 26 corresponds to the structured light projector 80, the infrared light through hole 27 corresponds to the infrared light camera 62, and the visible light through hole 28 corresponds to the visible light camera 61. The input/output through hole 25 can be replaced by the above-mentioned spaced case proximity light-emitting through hole 23 and case light supplement through hole 24 and case proximity light-receiving through hole 2f, or the input/output through hole 25 is formed by the above-mentioned case proximity light-emitting through hole 23, case light supplement through hole 24 and case proximity light-receiving through hole 2 f. In addition, the structured light through hole 26 corresponds to the structured light projector 80, that is, the structured light emitted by the structured light projector 80 can pass through the structured light through hole 26, the infrared light through hole 27 corresponds to the infrared camera 62, that is, the infrared camera 62 can receive the infrared light reflected by the object from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61, that is, the visible light camera 61 can receive the visible light reflected by the object from the visible light through hole 28.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is more uniform and stronger, which is beneficial to stably transmitting bone conduction sound to the auditory nerve of the user; in addition, the plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, so that an electrical signal can be simultaneously applied to the plurality of piezoelectric bumps 72, and the vibration module 30a can be driven to vibrate synchronously from a plurality of different positions; furthermore, the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover plate 30 and the piezoelectric body 71, and the piezoelectric bumps 72 are inserted, so that the electronic device 100 has a small overall size and saves space.

Referring to fig. 3, in some embodiments, the input/output module 10 further includes a fill-in lamp lens 18, a proximity lamp lens 19, and a proximity sensing lens 1 e. The fill light lens 18 is disposed in the package housing 11 and corresponds to the infrared fill light 12. The proximity lamp lens 19 is provided inside the package case 11 and corresponds to the proximity infrared lamp 13. The proximity sensor lens 1e is disposed in the package case 11 and corresponds to the proximity sensor 1 d. The infrared light emitted by the infrared fill light 12 is focused into the fill light window 1131 under the action of the fill light lens 18 to be emitted, so as to reduce the amount of light emitted to other areas of the package sidewall 112 and the package top 113. Similarly, the infrared light emitted from the proximity infrared lamp 13 is focused by the proximity lamp lens 19 into the proximity light emission window 1132 and emitted, and the amount of light emitted to the package sidewall 112 and other areas of the package top 113 is reduced. Similarly, when the infrared light reflected by the object entering through the proximity light receiving window 1133 enters the proximity sensor lens 1e, the proximity sensor lens 1e condenses the infrared light onto the proximity sensor 1d, thereby reducing the amount of light transmitted to the area other than the proximity sensor 1 d. Specifically, the light supplement lamp lens 18, the proximity lamp lens 19 and the proximity sensing lens 1e may be located on the same transparent substrate, and more specifically, the light supplement lamp lens 18, the proximity lamp lens 19 and the proximity sensing lens 1e may be integrally formed with the transparent substrate. Of course, the input/output module 10 may be provided with only one or two of the light supplement lamp lens 18, the proximity lamp lens 19, and the proximity sensing lens 1e, or may not be provided with the light supplement lamp lens 18, the proximity lamp lens 19, and the proximity sensing lens 1 e.

Referring to fig. 3, in some embodiments, the input/output module 10 further includes a plurality of metal shielding plates 1a, the plurality of metal shielding plates 1a are all located in the package housing 11, and the plurality of metal shielding plates 1a are respectively located between any two of the infrared fill-in light 12, the proximity infrared light 13, and the proximity sensor 1 d. When the centers of the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d are located on the same line segment, the number of the metal shielding plates 1a is two; if an infrared light supplement lamp 12, a proximity infrared lamp 13 and a proximity sensor 1d are sequentially arranged from one end to the other end of the line segment, two metal shielding plates 1a are respectively positioned between the infrared light supplement lamp 12 and the proximity infrared lamp 13 and between the proximity infrared lamp 13 and the proximity sensor 1 d; if a proximity infrared lamp 13, an infrared light supplement lamp 12 and a proximity sensor 1d are sequentially arranged from one end to the other end of the line segment, two metal shielding plates 1a are respectively positioned between the infrared light supplement lamp 12 and the proximity infrared lamp 13 and between the infrared light supplement lamp 12 and the proximity sensor 1 d; if the proximity infrared lamp 13, the proximity sensor 1d and the infrared light supplement lamp 12 are sequentially arranged from one end to the other end of the line segment, the two metal shielding plates 1a are respectively positioned between the proximity sensor 1d and the proximity infrared lamp 13 and between the infrared light supplement lamp 12 and the proximity sensor 1 d. Metal shielding plate 1a is located infrared light filling lamp 12 and is close between infrared lamp 13, metal shielding plate 1a can shield infrared light filling lamp 12 and is close infrared lamp 13 electromagnetic interference each other on the one hand, infrared light filling lamp 12 can not influence each other with the luminous intensity and the chronogenesis that are close infrared lamp 13, on the other hand metal shielding plate 1a can be used for isolated infrared light filling lamp 12 place cavity and the cavity that is close infrared lamp 13 place, light can not get into another cavity from a cavity. The metal shielding plate 1a is located between the infrared light supplement lamp 12 and the proximity sensor 1d or between the proximity sensor 1d and the proximity infrared lamp 13, so that the infrared light supplement lamp 12 and the proximity infrared lamp 13 can be prevented from being incident on the proximity sensor 1d at the initial emission infrared light, and the electromagnetic interference between the infrared light supplement lamp 12 and the proximity sensor 1d or the electromagnetic interference between the proximity infrared lamp 13 and the proximity sensor 1d can be shielded.

Referring to fig. 14, in some embodiments, the input/output module 10 further includes an optical enclosure 1 b. The optical enclosure 1b is made of a light-transmissive material, and the optical enclosure 1b is formed on the package substrate 111 and located inside the package case 11. The optical enclosure 1b encloses the infrared fill light 12, the proximity infrared light 13 and the proximity sensor 1 d. Specifically, optics sealing cover 1b can form through encapsulating injection molding process, and optics sealing cover 1b can adopt transparent thermosetting epoxy to make to in use is difficult for softening, and optics sealing cover 1b can fix infrared light filling lamp 12, be close infrared lamp 13, and the relative position between the proximity sensor 1d three, and makes infrared light filling lamp 12, be close infrared lamp 13, and proximity sensor 1d be difficult for rocking in encapsulation casing 11.

In addition, referring to fig. 14, the input/output module 10 further includes a plurality of light-emitting partition plates 1c, and the light-emitting partition plates 1c are formed in the optical enclosure 1b and located among the infrared fill-in light 12, the proximity infrared light 13, and the proximity sensor 1 d. When the centers of the infrared light supplement lamp 12, the proximity infrared lamp 13 and the proximity sensor 1d are located on the same line segment, the number of the light-emitting partition plates 1c is two; if an infrared light supplement lamp 12, a proximity infrared lamp 13 and a proximity sensor 1d are sequentially arranged from one end to the other end of the line segment, two light-emitting partition plates 1c are respectively positioned between the infrared light supplement lamp 12 and the proximity infrared lamp 13 and between the proximity infrared lamp 13 and the proximity sensor 1 d; if a proximity infrared lamp 13, an infrared light supplement lamp 12 and a proximity sensor 1d are sequentially arranged from one end to the other end of the line segment, two light-emitting partition plates 1c are respectively positioned between the infrared light supplement lamp 12 and the proximity infrared lamp 13 and between the infrared light supplement lamp 12 and the proximity sensor 1 d; if the proximity infrared lamp 13, the proximity sensor 1d and the infrared light supplement lamp 12 are sequentially arranged from one end to the other end of the line segment, the two light-emitting partition plates 1c are respectively positioned between the proximity sensor 1d and the proximity infrared lamp 13 and between the infrared light supplement lamp 12 and the proximity sensor 1 d. The light-emitting partition board 1c can be used for separating the infrared light supplement lamp 12 from the near infrared lamp 13, light emitted by the infrared light supplement lamp 12 cannot penetrate out of the near light-emitting window 1132, and light emitted by the near infrared lamp 13 cannot penetrate out of the light supplement window 1131. The light-emitting partition board 1c can block infrared light rays initially emitted by the infrared fill-in light lamp 12 and the proximity infrared lamp 13 from being incident on the proximity sensor 1d, and simultaneously block infrared light entering from the proximity light-receiving window 1133 and emitting to the proximity sensor 1d to influence the light emission of the infrared fill-in light lamp 12 and the proximity infrared lamp 13.

Referring to fig. 7, in some embodiments, the optical sensor 50 of the above embodiments may be disposed on the mounting surface 631 of the mirror base 63. The lens mount 63 can be the lens mount 63 of the infrared camera 62, and can also be the lens mount 63 of the visible camera 61.

Referring to fig. 15, in some embodiments, the cover plate 30 may further have a cover plate light supplement through hole 34, the cover plate light supplement through hole 34 corresponds to the chassis light supplement through hole 24, and the infrared light emitted by the infrared light supplement lamp 12 passes through the chassis light supplement through hole 24 and then passes through the electronic device 100 from the cover plate light supplement through hole 34. In this case, the infrared transparent ink 40 may be disposed on the cover 30 at a position corresponding to the chassis approach light emitting through hole 23, so that it is difficult for a user to see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach light emitting through hole 23, and the electronic device 100 has a beautiful appearance.

Referring to fig. 16, in some embodiments, the cover 30 may further include a cover proximity light-emitting through hole 33, the cover proximity light-emitting through hole 33 corresponds to the chassis proximity light-emitting through hole 23, and the infrared light emitted by the proximity infrared lamp 13 passes through the chassis proximity light-emitting through hole 23 and then passes through the cover proximity light-emitting through hole 33 to pass through the electronic device 100. At this time, the infrared transmissive ink 40 may be disposed at a position on the cover plate 30 corresponding to the chassis light supplement through hole 24, so that the user is difficult to see the infrared light supplement lamp 12 inside the electronic device 100 through the chassis light supplement through hole 24, and the electronic device 100 has a beautiful appearance.

Referring to fig. 17, in some embodiments, the cover 30 may further include a cover approaching light receiving through hole 36, the cover approaching light receiving through hole 36 corresponds to the case approaching light receiving through hole 2f and the proximity sensor 1d, and the infrared light reflected by the object outside the electronic device 100 passes through the cover approaching light receiving through hole 36 and the case approaching light receiving through hole 2f and then may be incident on the proximity sensor 1 d.

Referring to fig. 18, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the light sensor 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror base 63, another part of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with a main board of the electronic device 100. When the optical sensor 50 is disposed on the substrate 66, the optical sensor 50 is disposed outside the lens holder 63, and the optical sensor 50 may be connected to an FPC.

The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the photosensor 50 may be fixed on the substrate 66 of the visible light camera 61; the light sensor 50 may be mounted on a substrate 66 of the infrared camera 62. Further, base plate 66 still includes the stiffening plate, and the stiffening plate setting is in the one side that carries on the back with light sense ware 50 to increase base plate 66's bulk strength, make FPC be difficult for taking place around folding, be difficult for taking place to rock when light sense ware 50 sets up on base plate 66 simultaneously. In one example, the light sensor 50 can also be fixed to the outer sidewall of the mirror base 63, for example, by bonding.

Referring to fig. 19, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. Light sensor 50 is disposed at first sub-top surface 671. In this embodiment, the imaging module 60 can be a visible light camera 61, and the optical sensor 50 is a single package. In other embodiments, the imaging module 60 may be an infrared camera 62.

The imaging module 60 of the present embodiment has the cut 675, and the optical sensor 50 is disposed on the first sub-top surface 671, so that the optical sensor 50 and the imaging module 60 are disposed compactly, and the horizontal space occupied by the two modules is small, thereby saving the installation space in the electronic device 100.

With continued reference to fig. 19, in some embodiments, the optical sensor 50 of the above embodiments is disposed on the first sub-top surface 671 and is located outside the camera housing 67, and specifically, a projection of the entire optical sensor 50 along a direction perpendicular to the first sub-top surface 671 may be located inside the first sub-top surface 671 (as shown in fig. 19); alternatively, a portion of light sensor 50 is located within first sub-top surface 671 along a projection perpendicular to first sub-top surface 671. That is, at least a portion of the optical sensor 50 is located directly above the first sub-top surface 671, so that the optical sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two modules is small, thereby further saving the installation space in the electronic device 100.

Referring to fig. 20, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the light sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the light sensor 50. The light sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the light sensor 50 and the camera housing 67 are more stable and the light sensor 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 21, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the light sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the light sensor 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the optical sensor 50 may be connected to an FPC.

The optical sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the optical sensor 50 and the camera housing 67 are more stable and the optical sensor 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 is disposed on the substrate 66 and the light sensor 50 is disposed on the substrate 66, so that the light sensor 50 can be stably mounted in the camera housing 67.

Referring to fig. 22, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the first tread 677, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is located between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The light sensor 50 is disposed on the second step face 678 and outside the camera housing 67. The photo sensor 50 is a single package. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.

The imaging module 60 of the present embodiment has a cut 675, and the light sensor 50 is disposed on the second step surface 678, such that the light sensor 50 and the imaging module 60 are disposed compactly, and the horizontal space occupied by the two is small, thereby saving the installation space in the electronic device 100.

Referring to fig. 23, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, compared to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 is wider, thereby facilitating the arrangement of the light sensor 50 on the second tread 678.

Referring to fig. 22 and 23, in some embodiments, the light sensor 50 of the above embodiments is disposed on the second step 678 and outside the camera housing 67. Specifically, when the cut 675 is opened at the edge of the top surface 670, the projection of the entire light sensor 50 along the direction perpendicular to the second step surface 678 can be located in the second step surface 678; alternatively, a projection of a portion of the light sensor 50 along a direction perpendicular to the second step surface 678 is located within the second step surface 678 (as shown in fig. 22). That is, at least a portion of the light sensor 50 is located directly above the second step 678. When the cutout 675 is opened at the middle position of the top surface 670, the entire projection of the light sensor 50 along the direction perpendicular to the second step surface 678 can be located in the second step surface 678 (as shown in fig. 23). Thus, the optical sensor 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the two is small, so that the installation space in the electronic device 100 is further saved.

Referring to fig. 24, the second step surface 678 of the above embodiment is provided with a light hole 676, and the light sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the light sensor 50. The light sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the light sensor 50 and the camera housing 67 are more stable and the light sensor 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 25, in some embodiments, a light hole 676 is formed on the second step surface 678 of the above embodiments, and the light sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the light sensor 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the optical sensor 50 may be connected to an FPC.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

a housing;

the vibration module is arranged on the shell and comprises a display screen and a light-transmitting cover plate; and

a piezoelectric element coupled to the vibration module and spaced apart from the input-output module, the piezoelectric element being configured to deform when an electrical signal is applied thereto to vibrate the vibration module; the area of the cover plate combined with the piezoelectric element is separated from the area of the cover plate combined with the display screen;

the piezoelectric element comprises a plurality of piezoelectric lugs, and the piezoelectric lugs drive the vibration module to vibrate from a plurality of different positions combined with the cover plate.

2. The electronic device according to claim 1, wherein the display screen is disposed on the housing and forms an accommodation cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodation cavity, the display screen is combined with the cover plate, the housing is provided with a housing proximity light-emitting through hole, a housing light-filling through hole, a housing proximity light-receiving through hole, and a housing vibration through hole, which are spaced apart from each other, the proximity infrared lamp corresponds to the housing proximity light-emitting through hole, the infrared light-filling lamp corresponds to the housing light-filling through hole, the proximity sensor corresponds to the housing proximity light-receiving through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.

3. The electronic device of claim 2, wherein the piezoelectric element and the display screen are attached to the cover plate by a joint.

4. The electronic device of claim 1, wherein the input-output module further comprises a chip, and the infrared fill-in light, the proximity infrared light, and the proximity sensor are all formed on one chip.

5. The electronic device according to claim 1, wherein the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a fill light window, a proximity light emitting window and a proximity light receiving window, the fill light window corresponds to the infrared fill light, the proximity light emitting window corresponds to the proximity infrared light, and the proximity light receiving window corresponds to the proximity sensor.

6. The electronic device according to claim 1, wherein the input/output module further comprises a fill-in lamp lens, and the fill-in lamp lens is disposed in the package housing and corresponds to the infrared fill-in lamp; and/or

The input and output module also comprises a proximity lamp lens which is arranged in the packaging shell and corresponds to the proximity infrared lamp; and/or

The input and output module further comprises a proximity sensing lens, and the proximity sensing lens is arranged in the packaging shell and corresponds to the proximity sensor.

7. The electronic device according to claim 1, wherein the input/output module further includes a fill-in light lens, a proximity light lens, and a proximity sensing lens disposed in the package housing, the fill-in light lens corresponds to the infrared fill-in light, the proximity light lens corresponds to the proximity infrared light, the proximity sensing lens corresponds to the proximity sensor, and the fill-in light lens, the proximity light lens, and the proximity sensing lens are disposed on a same transparent substrate.

8. The electronic device of claim 1, wherein the input/output module further comprises a plurality of metal shielding plates, and the plurality of metal shielding plates are respectively located in the package housing and between any two of the infrared fill-in light, the proximity infrared light, and the proximity sensor.

9. The electronic device of claim 1, wherein the input-output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located within the package housing, the optical enclosure enclosing the infrared fill light, the proximity infrared light, and the proximity sensor.

10. The electronic device of claim 9, wherein the input/output module further comprises a plurality of light-emitting partitions, and the plurality of light-emitting partitions are respectively formed in the optical enclosure and located between any two of the infrared fill light, the proximity infrared light, and the proximity sensor.

11. The electronic device according to claim 1, wherein a ground pin, a fill-in light pin, a proximity light pin and a proximity sensor pin are formed on the input/output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the proximity sensing pin are enabled, the proximity sensor receives infrared light reflected by an object to detect the distance of the object.

12. The electronic device of claim 2, wherein an infrared transparent ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the housing, and the infrared transparent ink blocks at least one of the housing proximity light emitting through hole, the housing light supplement through hole, the housing proximity light receiving through hole, and the housing vibration through hole.

13. The electronic device according to claim 1, further comprising a light sensor and an imaging module, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor accommodated in the lens base, the lens base comprises a mounting surface located between the lens barrel and the image sensor, and the light sensor is disposed on the mounting surface.

14. The electronic device according to claim 1, further comprising an imaging module and a light sensor, wherein the imaging module is mounted on the housing, the imaging module comprises a camera housing and a lens module, a top surface of the camera housing is a step surface and comprises a first sub-top surface and a second sub-top surface connected to each other, the second sub-top surface is inclined with respect to the first sub-top surface and forms a notch with the first sub-top surface, the top surface has a light exit hole, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the light sensor is disposed at the first sub-top surface.

15. The electronic device according to claim 1, further comprising an imaging module and a photo sensor, wherein the imaging module comprises a camera housing and two lens modules, a top surface of the camera housing is cut to form a stepped top surface, the top surface comprises a first step surface and a second step surface lower than the first step surface, the first step surface is provided with two light-emitting through holes, each light-emitting through hole corresponds to one lens module, and the photo sensor is disposed at the second step surface.

16. The electronic device of claim 1, further comprising an imaging module and a light sensor, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and a substrate partially disposed in the lens base, and the light sensor is disposed on the substrate.

17. The electronic device of claim 2, further comprising an infrared camera, a visible light camera, and a structured light projector, wherein centers of the input-output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line segment, and wherein the piezoelectric element is located between the line segment and a top of the housing.

18. The electronic device according to claim 2, further comprising an infrared camera, a visible light camera, and a structured light projector, wherein the number of the piezoelectric elements is plural, the number of the case vibration through holes is plural, the plural piezoelectric elements correspond to the plural case vibration through holes, each piezoelectric element is accommodated in the corresponding case vibration through hole, centers of the input/output module, the infrared camera, the visible light camera, the plural piezoelectric elements, and the structured light projector are located on a same line, and at least one of the input/output module, the infrared camera, the visible light camera, and the structured light projector is disposed between two adjacent piezoelectric elements.

19. The electronic device of claim 2, further comprising an infrared camera, a visible light camera, and a structured light projector, wherein the piezoelectric element comprises a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the case vibration through holes is plural, the plurality of piezoelectric bumps correspond to the plurality of case vibration through holes, each of the piezoelectric bumps is partially received in the corresponding case vibration through hole and is coupled to the cover plate, the input/output module, the infrared camera, the visible light camera, and the structured light projector are located between the cover plate and the piezoelectric body, and centers of the input/output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located on the same line segment, at least one of the input/output module, the infrared camera, the visible light camera and the structured light projector is arranged between two adjacent piezoelectric lugs.