WO2014069144A1 - 有機エレクトロルミネッセンス発光装置、及びその製造方法 - Google Patents
有機エレクトロルミネッセンス発光装置、及びその製造方法 Download PDFInfo
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- WO2014069144A1 WO2014069144A1 PCT/JP2013/076690 JP2013076690W WO2014069144A1 WO 2014069144 A1 WO2014069144 A1 WO 2014069144A1 JP 2013076690 W JP2013076690 W JP 2013076690W WO 2014069144 A1 WO2014069144 A1 WO 2014069144A1
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- organic
- light emitting
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- emitting device
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/18—Tiled displays
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/805—Electrodes
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/84—Parallel electrical configurations of multiple OLEDs
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Definitions
- the present invention relates to an organic electroluminescence light-emitting device in which a plurality of organic electroluminescence elements are arranged in parallel in a tile shape, and a method for manufacturing the same.
- a large area light emitting panel is formed by arranging a plurality of organic electroluminescent elements in a tile shape in parallel, and a plurality of organic electroluminescent elements in the light emitting panel are electrically connected to form a large organic electroluminescence device as a whole. It is known to form a luminescence light emitting device (for example, Patent Document 1). Hereinafter, organic electroluminescence is simply referred to as “organic EL”.
- an organic EL element As a material for forming an organic EL element, a material that is easily deteriorated by contact with outside air (mainly oxygen or water vapor) is generally used.
- the organic layer of the organic EL element is likely to deteriorate due to contact with outside air.
- the organic substance contained in the organic layer of the organic EL element is easily denatured by oxygen or water vapor contained in the outside air.
- the luminance of the organic EL element is lowered, and the organic EL element may not emit light stably over a long period of time.
- the luminance of each organic EL element included in the organic EL light emitting device must be more stably maintained.
- Patent Document 2 a sealing layer having a gas barrier property outside the organic EL element in order to prevent a decrease in luminance of the organic EL element.
- a sealing layer 4 an oxygen barrier layer 42 and an oxygen absorption layer 41 that covers the outside of an organic layer made of the organic / light-emitting material 14 is provided.
- the sealing layer 4 covers the entire organic EL element except for the substrate 11.
- a light / thermosetting resin having an inorganic composition is used as the sealing layer 4.
- a large organic EL light emitting device cannot be obtained using an organic EL element that does not have a sealing layer.
- the portion where the electrode terminal is provided in the organic EL element is very narrow. For this reason, it is very complicated and difficult to provide a sealing layer in a portion excluding the electrode terminal of each organic EL element. Therefore, even if it is going to provide a sealing layer except the electrode terminal of each organic EL element, the case where an electrode terminal is covered with a sealing layer unexpectedly, or the case where an organic layer is exposed can be considered.
- Each organic EL element in which the electrode terminal is covered with the sealing layer cannot be electrically connected, and a large organic EL light-emitting device cannot be obtained. Further, when the organic layer is exposed, the organic EL element is deteriorated.
- An object of the present invention is to provide an organic EL light-emitting device in which deterioration of an organic EL element hardly occurs and a method for manufacturing the same.
- a plurality of organic EL elements each having an organic layer and electrode terminals are arranged in parallel in a tile shape on a base material, and the electrode terminals of each organic EL element are electrically connected.
- a light-emitting panel having a connection portion, and a sealing member for sealing including a light-emitting region composed of a plurality of organic layers and an interlayer region sandwiched between two adjacent organic layers in the light-emitting panel.
- the electrode terminal has an anode terminal and a cathode terminal, and the connecting portion straddles the anode terminal and the cathode terminal of two adjacent organic EL elements in the light-emitting panel.
- connection substrate having a connector member and a substrate on which the connector member is disposed is connected to anode terminals and cathode terminals of a plurality of organic EL elements in the light emitting panel.
- each organic EL element is electrically connected.
- the connection board further includes a connection circuit for connecting the organic EL element in the light emitting panel to an external power source, and the anode terminal and the cathode terminal of the organic EL element located at both ends of the connection circuit and the light emitting panel are electrically connected. It is connected to the.
- the sealing member has a side wall portion that surrounds at least the light emitting region and the interlayer region, and a ceiling portion that covers the light emitting region and the interlayer region.
- a sealing space is formed between the sealing member and the light emitting panel, and at least one of a desiccant and an oxygen absorbent is placed in the sealing space.
- the sealing member is a continuous resin layer that covers at least the light emitting region and the interlayer region without any gap.
- each organic EL element in the light-emitting panel further has a barrier layer that prevents intrusion of outside air.
- a method for manufacturing an organic EL light emitting device is provided.
- a plurality of organic EL elements having an organic layer and electrode terminals are arranged in parallel on a base material in a tile shape, and the electrode terminals of each organic EL element are electrically connected.
- a light emitting panel forming step having a connection step of forming a connection portion by connecting to a light emitting panel, a light emitting region comprising a plurality of organic layers in the light emitting panel, and an interlayer region sandwiched between two adjacent organic layers And a sealing step of sealing with a sealing member.
- the electrode terminal has an anode terminal and a cathode terminal
- the connecting step uses a connector member to connect two organic EL elements adjacent in the light emitting panel.
- This is a step of electrically connecting the anode terminal and the cathode terminal to form a connection portion.
- a sealing process is a process of sealing including the said connection part further.
- the connecting step connects a connection substrate having a connector member and a substrate provided with the connector member to anode terminals and cathode terminals of a plurality of organic EL elements in the light emitting panel. This is a step of electrically connecting each organic EL element to form a connection portion.
- FIG. 1 is a schematic plan view showing an organic EL light emitting device according to an embodiment of the present invention.
- FIG. 2 is an end view of the organic EL light emitting device of FIG. 1 cut along a line II-II.
- (A) And (b) is a schematic plan view which shows the correspondence of two adjacent organic EL elements.
- the schematic plan view which shows the organic electroluminescent light-emitting device which concerns on the 1st modification of this invention.
- FIG. 5 is an end view of the organic EL light emitting device of FIG. 4 cut along a VV line. The end view which shows the organic electroluminescent light-emitting device which concerns on the 2nd modification of this invention.
- FIG. 11 is an end view of the organic EL light emitting device of FIG. 10 cut along a XI-XI line.
- the schematic plan view which shows one Embodiment of the organic EL element used by this invention.
- the present invention will be described below with reference to the drawings. However, it should be noted that dimensions such as layer thickness and length in each figure are different from actual ones. Also, in this specification, there are cases where the first, second, etc. are added as prefixes of terms, but these prefixes are added only for distinguishing terms, and the order, superiority, inferiority, etc. It has no special meaning.
- the direction in which the organic EL elements are arranged in parallel is referred to as the A direction
- the direction substantially orthogonal to the A direction is referred to as the B direction.
- Organic EL device Before describing the configuration of the organic EL light-emitting device of the present invention, the basic configuration of the organic EL element used in the present invention will be described.
- the organic EL element used in the present invention has an element substrate and an organic EL layer laminated on the element substrate.
- the organic EL layer includes a first electrode layer stacked on the element substrate, an organic layer stacked on the first electrode layer, and a second electrode layer stacked on the organic layer.
- the layer structure of the organic EL element is not particularly limited as long as the above conditions are satisfied, and an arbitrary layer can be added.
- the organic EL element may be a top emission type element that can extract light from the front side of the element substrate (the side on which the organic EL layer is laminated), or may extract light from the back side of the element substrate. It may be a bottom emission type element that can be used.
- the organic EL element used in the present invention has electrode terminals (anode terminal and cathode terminal) capable of energizing the first and second electrode layers.
- the electrode terminal capable of energizing the first electrode layer is an anode terminal
- the electrode terminal capable of energizing the second electrode layer is a cathode. Terminal.
- the planar shape of the organic EL element is not particularly limited, but generally, an organic EL element having a substantially rectangular shape in plan view is used, and preferably, an organic EL element having a substantially strip shape in plan view is used. If an organic EL element having a substantially band shape in plan view is used, a large organic EL light-emitting device can be obtained by arranging a plurality of organic EL elements in parallel in the width direction.
- the size of the organic EL element having a substantially band shape in plan view is not particularly limited, but generally, the width: length of the organic EL element is 1: 3 to 1:20, preferably 1: 3 to 1: 10.
- the organic EL element 5 used in the present invention is preferably provided with electrode terminals (anode terminal 521 and cathode terminal 541) at both ends in the width direction.
- electrode terminals anode terminal 521 and cathode terminal 541 at both ends in the width direction.
- the left end in the width direction is the anode terminal 521
- the right end in the width direction is the cathode terminal 541.
- the first electrode layer 52 laminated on the element substrate 51 is an anode layer
- the second electrode layer 54 provided on the organic layer 53 is a cathode layer.
- the anode layer and the cathode layer may be reversed.
- FIGS. 1 and 2 a portion with a lattice pattern is a surface region 56 corresponding to the organic layer 53 of the organic EL element.
- FIGS. 9 to 11 The organic EL element 5 used in FIGS. 1 and 2, FIGS. 4 to 7, and FIGS. 9 to 11 is shown in FIGS. This is the organic EL element 5. 1 and 2, FIG. 4 to FIG. 7, and FIG. 9 to FIG. 11, the organic EL elements 5 in a planar view shown in FIG. 12 are arranged in parallel in the width direction. That is, in the illustrated example, the width direction of the organic EL element 5 corresponds to the A direction.
- the organic EL light emitting device of the present invention includes a light emitting panel having a base material and a plurality of organic EL elements arranged in parallel in the A direction on the base material.
- the organic EL element has an organic layer and electrode terminals (anode terminal and cathode terminal).
- the light emitting panel further includes a connection portion in which the electrode terminals of the respective organic EL elements are electrically connected.
- the electrode terminals (anode terminal and cathode terminal) of the organic EL element located at both ends of the light emitting panel are electrically connected to an external power source. Then, when a current is passed from the external power source to the electrode terminal, the light emitting layer included in the organic layer emits light.
- the organic EL light emitting device of the present invention includes a sealing member that includes a light emitting region composed of a plurality of organic layers and an interlayer region sandwiched between two adjacent organic layers in the light emitting panel.
- FIG. 1 is a schematic plan view showing an organic EL light emitting device 1 according to an embodiment of the present invention
- FIG. 2 is a schematic end view thereof.
- the connector member 61 provided in the space between the sealing member 3 and the light emitting panel 2 is represented by an alternate long and short dash line.
- the light-emitting panel 2 is formed of a base material 21 and a plurality of (for example, four) organic EL elements 5 arranged in parallel in the A direction in a tile shape on the base material 21.
- the plurality of organic EL elements 5 having a substantially band shape in plan view are regularly arranged in parallel with a slight gap in the width direction.
- the organic EL elements 5 arranged in parallel are fixed to the base material 21.
- the base material is preferably a flexible sheet.
- the base material is made of, for example, a material similar to a substrate of a connection substrate and an element substrate of an organic EL element described later.
- the base material may be either transparent or opaque, but in the case of forming a bottom emission type organic EL light emitting device, a transparent base material is used.
- the base material preferably has sealing properties (gas barrier property and water vapor barrier property).
- examples of the transparent index include a total light transmittance of 70% or more, preferably 80% or more.
- the total light transmittance refers to a value measured by a measuring method in accordance with JIS K7105 (plastic optical property test method).
- oxygen permeability is not more than 500cc / m 2 ⁇ day ⁇ atm , preferably not more than 100cc / m 2 ⁇ day ⁇ atm , more preferably, 50cc / m 2 ⁇ day ⁇ It can be exemplified that it is atm or less.
- the oxygen permeability is a value measured by a measuring method based on JIS K7126 in an atmosphere of 25 ° C.
- the water vapor permeability is 500 g / m 2 ⁇ day or less, preferably 100 g / m 2 ⁇ day or less, and more preferably 50 g / m 2 ⁇ day or less. Can be illustrated. However, the water vapor permeability is a value measured by a measurement method based on JIS K7129 in an atmosphere of 40 ° C. and 90% RH.
- the organic EL elements 5 in the light emitting panel 2 are arranged in parallel in the A direction so that the anode terminal 521 and the cathode terminal 541 are adjacent to each other.
- the anode terminal 521 and the cathode terminal 541 which are adjacent to each other as described above are electrically connected via the conductive connector member 61 straddling the electrode terminals 521 and 541. That is, in FIG. 1 and FIG. 2, the connection portion 6 includes the connector member 61.
- the anode terminal 521 of the organic EL element 5 located at one end of the light emitting panel 2 and the cathode terminal 541 of the organic EL element 5 located at the other end of the light emitting panel 2 are connected to an external power source (not shown). Lead wires 7 are connected to each other.
- the connecting portion 6 includes the connector member 61, but the present invention is not limited to this embodiment.
- position so that the side edge of the adjacent organic EL element 5 may contact
- the connector member 61 can be omitted.
- the contact points of the electrode terminals 521 and 541 become the connection portion 6.
- the adjacent organic EL element 5 in the light emission panel 2 is connected in series via the connector member 61.
- the organic EL elements 5 may be connected in parallel through conductive lead wires connected to the electrode terminals 521 and 541 of the organic EL elements 5 (not shown).
- the connection part 6 has a leader line.
- the side edge of the organic EL element 5 is a part which comprises the outline of the organic EL element 5 when it sees from the perpendicular direction with respect to the surface.
- a connector member will not be specifically limited if it has electroconductivity,
- the metal lump which has electroconductivity can be used.
- the lead wire forming material is not particularly limited as long as it has conductivity.
- a material obtained by processing a conductive metal into a linear shape can be used.
- the shape of a connector member or a lead wire is not specifically limited. 1 and 2, an elongated connector member 61 having substantially the same length as the organic EL element 5 is used.
- the light emitting panel 2 includes four organic EL elements 5, but the number of organic EL elements 5 constituting the light emitting panel 2 is not particularly limited.
- One light-emitting panel 2 is configured by using two or more organic EL elements 5, preferably by using 3 to 20 organic EL elements 5, and more preferably by 4 to 15 organic EL elements. It is configured using the element 5.
- Light emitting region and interlayer region By arranging a plurality of organic EL elements in a tile shape in parallel in the light emitting panel, a light emitting region composed of a plurality of organic layers and an interlayer region sandwiched between two adjacent organic layers are formed.
- the sealing member seals the light emitting region and the interlayer region.
- the light emitting region and the interlayer region will be described in detail.
- FIGS. 3A and 3B are schematic plan views showing an organic EL light emitting device having two organic EL elements.
- the base material, the connector member, the sealing member, and the like included in the organic EL light emitting device are omitted for convenience.
- the organic EL element is also shown shorter than usual.
- the interval between the organic EL elements is shown wider than usual for convenience.
- the two organic EL elements 5 each have a surface region 56 corresponding to the organic layer 53.
- the organic EL element 5 in the figure has surface regions 56 at the electrode terminals 521 and 541 and at portions excluding both ends in the longitudinal direction of the organic EL element 5 and the vicinity thereof.
- a lattice pattern is attached to the surface region 56.
- the light emitting region 22 is a region in which the surface regions 56 of all the organic EL elements 5 included in the organic EL light emitting device are combined.
- FIGS. 3A and 3B the region in which the two surface regions 56 and 56 are combined. It is.
- the light emitting panel 2 since the light emitting panel 2 includes four organic EL elements 5, the light emitting region 22 is formed by the four surface regions 56.
- the interlayer region 23 includes two side regions 561 and 561 of two surface regions 56 and 56 extending in the B direction, and side edges 562 of two surface regions 56 and 56 extending in the A direction. This is an area surrounded by two imaginary lines C and C connecting the ends of 562.
- the interlayer region 23 is represented by countless dots.
- the interlayer region 23 includes a cathode terminal 541 of the organic EL element 5 located on the left side in the drawing, an anode terminal 521 of the organic EL element 5 located on the right side, and both electrode terminals 521 and 541. And an area including the intervening area. Further, as shown in FIG.
- the interlayer region 23 is This is a region including the cathode terminal 541 of the organic EL element 5 arranged on the left side and the anode terminal 521 of the organic EL element 5 arranged on the right side.
- the sealing member is sealed so as to include a plurality of surface regions (light emitting regions) and interlayer regions.
- one sealing member is provided so as to straddle between a plurality of organic EL elements, and a plurality of surface regions (light emitting regions) and interlayer regions are sealed together by one sealing member.
- the connection part (connector member) is abbreviate
- the connection part (connector member) is sealed with the sealing member.
- the position where the connector member is provided is not particularly limited, but is preferably provided so that the connector member is located in the interlayer region 23.
- the sealing member 3 includes a side wall portion 31 that surrounds at least the light emitting region 22 and the interlayer region 23, and a ceiling portion 32 that covers the light emitting region 22 and the interlayer region 23. 1 and 2, the side wall 31 of the sealing member 3 is erected from the surface of the base material 21 via the adhesive layer 8. The side wall 31 of the sealing member 3 surrounds the plurality of organic EL elements 5. As described above, the connection portion 6 having the light emitting region 22, the interlayer region 23, and the connector member 61 is surrounded by the side wall portion 31 of the sealing member 3 and is covered by the ceiling portion 32 of the sealing member 3. . As shown in FIGS.
- the ceiling portion 32 of the sealing member 3 has a substantially rectangular shape in plan view, and the sealing member 3 has a substantially inverted U shape in cross-sectional view.
- the lead wire 7 electrically connected to the anode terminal 521 and the cathode terminal 541 of the organic EL element 5 located at both ends of the light emitting panel 2. Is partially sealed.
- the sealing member can prevent the outside air from entering the sealed space, it is possible to prevent the organic layer from being deteriorated by the outside air.
- members other than an organic EL element, a connector member, and a lead wire may be sealed in the sealing space. However, in the present specification, description of these members is omitted, and is not displayed on the drawings.
- the sealed space may be filled with an inert gas such as helium gas or nitrogen gas.
- a desiccant and / or an oxygen absorber may be disposed in the sealed space.
- the sealed space is filled with an inert gas, and a desiccant and an oxygen absorbent are disposed.
- the desiccant is not particularly limited, and a desiccant that chemically adsorbs moisture and maintains a solid state even when moisture is absorbed is used. Examples of such compounds include sodium oxide, potassium oxide, calcium oxide, and barium oxide.
- the oxygen absorbent is not particularly limited, and examples thereof include aluminum, iron, sodium, lithium, barium, and zinc.
- Filling the sealed space with an inert gas can more effectively prevent the organic layer from coming into contact with the outside air. Further, even when outside air enters the sealed space, if the desiccant and the oxygen absorbent are arranged in the sealed space, it is possible to effectively prevent the entered outside air from contacting the organic layer.
- the sealing member may be further laminated with a first barrier layer that prevents intrusion of outside air.
- the first barrier layer 34 is laminated on the ceiling portion 32 of the sealing member 3.
- the material for forming the first barrier layer is not particularly limited, and examples thereof include a metal vapor deposition film, a metal or silicon oxide film, an oxynitride film, a nitride film, and a metal foil.
- the metal of the metal deposition film include In, Sn, Pb, Cu, Ag, Ti, and the like.
- the metal oxide include MgO, SiO, Si x O y , Al 2 O 3 , GeO, and Ti 2 O.
- Examples of the metal foil include aluminum, copper, and stainless steel.
- the thickness of the first barrier layer is not particularly limited, but is, for example, 50 nm to 50 ⁇ m.
- the side wall portion of the sealing member is a portion surrounding at least the light emitting region and the interlayer region.
- the material for forming the side wall is not particularly limited as long as it has sealing properties.
- the side wall portion is formed from a resin having a sealing property. Examples of such resins include ethylene-vinyl alcohol copolymer, polyvinylidene chloride, nylon 6, nylon 66, polymetaxylylene adipamide, amorphous polyamide, polyethylene terephthalate, epoxy resin, and mixtures thereof.
- the thickness of the side wall portion is not particularly limited as long as the sealing property of the sealing member can be ensured.
- the thickness of the side wall is 0.3 mm to 3 mm, preferably 0.3 mm to 2 mm, and more preferably 0.3 mm to 1 mm. If the thickness of the side wall portion is less than 0.3 mm, the sealing performance of the sealing member may not be ensured, and if the thickness of the side wall portion exceeds 3 mm, the flexibility of the organic EL light emitting device may be impaired. .
- the ceiling part of the sealing member is a part that covers the light emitting region and the interlayer region.
- the material for forming the ceiling is not particularly limited as long as it has sealing properties.
- the ceiling part is formed of a transparent material.
- a transparent material By using a transparent material, it is possible to prevent light emitted from the top emission type organic EL element from being blocked by the ceiling. Examples of such a transparent material include glass and resin.
- the transparent resin the same resin as the material for forming the side wall portion can be used.
- the thickness of a ceiling part will not be specifically limited if it is a range which can ensure the sealing performance of a sealing member.
- the thickness of the ceiling is 0.05 mm to 3 mm, preferably 0.1 mm to 2 mm, and more preferably 0.1 mm to 1 mm.
- the method for manufacturing the sealing member is not particularly limited.
- the sealing member can be produced, for example, by forming a bottomless cylindrical side wall portion and then joining the ceiling portion so as to close one opening portion of the bottomless cylindrical shape.
- the ceiling part of a sealing member uses the same resin as the formation material of the said side wall part. If the forming material of the ceiling part and the side wall part is the same, a sealing member in which the side wall part and the ceiling part are seamlessly integrated can be obtained by injection molding or the like. Since the sealing member having no joint between the side wall portion and the ceiling portion does not cause separation of the ceiling portion and the side wall portion, it is possible to more effectively prevent intrusion of outside air.
- the connector member 61 may be provided in the one side part (upper part part in the figure) of the light emission panel 2. As shown in FIG. Since the connector member 61 is unevenly distributed on one side of the light-emitting panel 2 as described above, the material for forming the connector member 61 can be reduced, so that the lighter organic EL light-emitting device 1 can be obtained.
- the electrode terminals 521 and 541 located in the both ends of the light emission panel 2 may be exposed to the outer side of the sealing member 3.
- the side wall portion 31 of the sealing member 3 passes through the adhesive layer 8 from the surface of the electrode terminals (the anode terminal 521 and the cathode terminal 541) of the organic EL element 5 located at both ends of the light emitting panel 2.
- the organic layer 53 can be prevented from coming into contact with the outside air.
- the sealing member 3 may be a resin layer 35 that covers at least the light emitting region 22 and the interlayer region 23 without a gap.
- the sealing member 3 made of the resin layer 35 covers all the organic EL elements 5 in the light emitting panel 2 without any gap. That is, the connection portion 61 including the light emitting region 22, the interlayer region 23, and the connector member 61 in the light emitting panel 2 is sealed with the resin layer 35 that is the sealing member 3.
- the first barrier layer 34 described above may be laminated on the sealing member 3 (resin layer 35) (not shown). In FIG. 6, for convenience, the end surface of the resin layer 35 is not hatched, and countless dots are appended instead.
- the sealing member made of the resin layer is less likely to cause peeling of the sealing member at the boundary between the base material and the sealing member, and is difficult for outside air to enter. Therefore, deterioration of the organic layer can be effectively prevented.
- Resin used for a resin layer is not specifically limited, The same resin as what is used for said side wall part can be used.
- the resin used for the resin layer is preferably transparent.
- the resin layer 35 is provided so as to cover the entire surface of the electrode terminals located at both ends of the light emitting panel 2. However, the resin layer 35 may cover only a part of the electrode terminals located at both ends of the light emitting panel 2, and a part of the electrode terminals may be exposed outside the resin layer 35 (not shown).
- the material for forming the resin layer 35 is not particularly limited as long as it is a resin having a sealing property.
- the resins listed as the material for forming the side wall portion can be used.
- the shortest distance X between the side edge surface 351 of the resin layer 35 and the organic layer 53 is preferably 0.5 mm to 4 mm, more preferably 2 mm to 4 mm.
- the shortest distance Y between the surface 352 of the resin layer 35 and the surface of the organic layer 53 is preferably 0.05 mm to 3 mm, more preferably 0.1 mm to 3 mm.
- the sealing member 3 may be a flexible film 36 having flexibility and sealing properties as shown in FIG.
- the flexible film 36 is laminated so as to straddle the surfaces of the plurality of organic EL elements 5 included in the light emitting panel 2.
- the peripheral portion of the flexible film 36 shown in FIG. 7 is bonded onto the base material 21 via the adhesive layer 8.
- the thickness of the flexible film 36 is not particularly limited as long as the sealing property can be ensured, and is, for example, 0.05 mm to 3 mm, preferably 0.1 mm to 2 mm, more preferably 0.1 mm to 1 mm.
- the forming material of the flexible film 36 is not particularly limited as long as it is a resin having sealing properties, and for example, the resins listed as the forming material of the side wall portion can be used. Further, the flexible film 36 may have a single layer structure or a multilayer structure having two or more layers.
- the organic EL light emitting device of the present invention may have a connection substrate having a connector member and a substrate on which the connector member is disposed.
- Each organic EL element is electrically connected by connecting a connection board
- FIG. 8 is a schematic rear view showing an embodiment of the connection substrate 4 used in the present invention
- FIG. 9 is a state in which the connection substrate 4 and the plurality of organic EL elements 5 (light emitting panel 2) are electrically connected.
- FIG. 10 is a schematic plan view showing the organic EL light-emitting device 1 of the present invention obtained by providing the sealing member 3 on the connection substrate 4 and the plurality of organic EL elements 5 of FIG.
- the first and second connection circuits 411 and 412 of the connection substrate 4 are provided with countless dots
- the connector member 61 that is the connection portion 6 is provided with a lattice pattern. ing.
- FIG. 8 is a schematic rear view showing an embodiment of the connection substrate 4 used in the present invention
- FIG. 9 is a state in which the connection substrate 4 and the plurality of organic EL elements 5 (light emitting panel 2) are electrically connected.
- FIG. 10 is a schematic plan view showing the organic EL light-emitting device 1 of the present invention obtained by providing the sealing
- connection substrate 4 the first and second connection circuits 411 and 412 and the connector member 61 of the connection substrate 4 are indicated by a one-dot chain line for convenience.
- FIG. 11 for convenience, the end surface of the resin layer 35 is not hatched, and countless dots are appended instead.
- connection board 4 includes a connection circuit 41, a connector member 61, and a board 42 provided with the connection circuit 41 and the connector member 61.
- the connection circuit 41 is a member that connects the organic EL element 5 in the light emitting panel 2 to the external power source 9.
- the connector member 61 is a member that electrically connects the electrode terminals (the anode terminal 521 and the cathode terminal 541) of two adjacent organic EL elements 5 in the light emitting panel 2.
- the connection circuit 41 includes a first connection circuit 411 connected to the anode terminal 521 of the organic EL element 5 and a second connection circuit 412 connected to the cathode terminal 541 of the organic EL element 5.
- One end of both connection circuits 411 and 412 is connected to the anode terminal 521 or the cathode terminal 541 of the organic EL element 5, and the other end of both connection circuits 411 and 412 is connected to the external power supply 9.
- the connector member 61 is a member formed so as to straddle the anode terminal 521 and the cathode terminal 541 of the two adjacent organic EL elements 5 as described above.
- the adjacent organic EL elements 5 in the light emitting panel 2 are electrically connected via the connector member 61.
- substrate 42 is not specifically limited, For example, as shown in FIG. 8, it is set as the substantially rectangular shape from which one side protruded partially.
- the other end portion of the first connection circuit 411 and the other end portion of the second connection circuit 412 are disposed on the protruding portion.
- one end of the first connection circuit 411 and one end of the second connection circuit 412 are disposed at the end of the substrate 42 facing the protruding portion in the plane of the substrate 42.
- three connector members 61 are provided intermittently between the one end portion of the first connection circuit 411 and the one end portion of the second connection circuit 412 with a required interval.
- connection board may have portions other than the first and second connection circuits and the connector member. However, in the present specification, description of these portions is omitted and is not displayed on the drawings.
- connection circuit and the connector member on the substrate is not particularly limited.
- the connection circuit and the connector member are preferably formed by the same method, but may be formed by different methods.
- the connection circuit may be formed by printed wiring
- the connector member may be formed by soldering.
- each organic EL element 5 in the light emitting panel 2 includes an anode terminal 521 and a cathode terminal except for electrode terminals (anode terminal 521 and cathode terminal 541) located at both ends of the light emitting panel 2.
- 541 are arranged in parallel in the A direction so as to be adjacent to each other.
- the adjacent anode terminal 521 and cathode terminal 541 are electrically connected via the connector member 61 of the connection board 4.
- the anode terminal 521 and the cathode terminal 541 located at both ends of the light emitting panel 2 are connected to the first connection circuit 411 and the second connection circuit 412 of the connection substrate 4.
- the part where the electrode terminals 411 and 412 of two adjacent organic EL elements 5 in the light emitting panel 2 are connected is sealed with a sealing member.
- connection substrate 4 is connected so as to cover one side of the light emitting panel 2. That is, the connection substrate 4 is connected to the anode terminal 521 and the cathode terminal 541 of the plurality of organic EL elements 5 in the light emitting panel 2, whereby each organic EL element 5 is electrically connected and a plurality of organic EL elements are connected.
- the EL element 5 is integrated.
- the resin layer 35 as the sealing member 3 covers the plurality of organic EL elements 5 in the light emitting panel 2 and the connection substrate 4 connected to the plurality of organic EL elements 5 without any gap.
- connection portion 6 including the light emitting region 22, the interlayer region 23, and the connector member 61 in the light emitting panel 2 is embedded by the resin layer 35 that is the sealing member 3. Therefore, the sealing member 3 (resin layer 35) can not only prevent the organic layer 53 from coming into contact with the outside air but also firmly fix the connection between the plurality of organic EL elements 5 and the connection substrate 4. Since the connection between the plurality of organic EL elements 5 and the connection substrate 4 is firmly fixed, the connection substrate 4 can be prevented from falling off.
- the shortest distance X between the side edge surface 351 of the resin layer 35 and the organic layer 53 is preferably 0.5 mm to 4 mm, and more preferably 2 mm to 4 mm.
- the shortest distance Z between the surface 352 of the resin layer 35 and the surface of the organic layer 53 is preferably 0.05 mm to 5 mm, more preferably 0.1 mm to 5 mm.
- connection substrate is a member that electrically connects a plurality of organic EL elements in the light emitting panel, supplies current from an external power source to the light emitting panel, and integrates the plurality of organic EL elements in the light emitting panel.
- One connection board is attached to one light emitting panel.
- the connection substrate is a member that integrates a plurality of organic EL elements in the light-emitting panel.
- substrate which is a structural member of a connection board
- polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), Olefin resins containing ⁇ -olefin as a monomer component such as ethylene-propylene copolymer and ethylene-vinyl acetate copolymer (EVA); polyvinyl chloride (PVC); vinyl acetate resin; polycarbonate (PC); polyphenylene sulfide (PPS); amide resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); polyimide resins; polyether ether ketone (PEEK), and the like, preferably polyimide resins.
- the thickness of the substrate is not particularly limited, but is preferably 10 ⁇ m to 50 ⁇ m, more preferably 10 ⁇ m to 30 ⁇ m.
- an insulating substrate is used so that the connection circuit and the connector member are not electrically connected.
- the resin film forming materials listed above usually have insulating properties.
- an insulating layer is provided at least in a region where the connection circuit and the connector member are provided on the surface of the substrate.
- the substrate may be transparent or opaque.
- a transparent substrate is used. By using a transparent substrate, it is possible to prevent light emitted from the top emission type organic EL element from being blocked by the connection substrate.
- the size of the substrate is not particularly limited and can be designed as appropriate.
- substrate is not specifically limited, According to the arrangement
- connection circuit is a part that supplies current from an external power source to the light-emitting panel.
- the connection circuit includes a first connection circuit that is electrically connected to the anode terminal of the organic EL element, and a second connection circuit that is electrically connected to the cathode terminal.
- One end portions of the first and second connection circuits are connected to an anode terminal and a cathode terminal, respectively, and the other end portions thereof are connected to an anode and a cathode of an external power source.
- the other end portions of the first and second connection circuits may be directly connected to the external power supply, but may be indirectly connected to the external power supply via other members such as an IC chip.
- connection circuit is made of a conductive material, and its shape is not particularly limited.
- the connection circuit is preferably composed of wiring formed in a linear shape on the substrate, and more preferably is composed of printed wiring formed by attaching a thin film of a conductive material on the substrate.
- the material for forming the connection circuit is not particularly limited, and examples thereof include conductive materials such as metals such as platinum, gold, silver, copper, nickel, cobalt, and titanium; metal oxides such as ITO; inorganic materials such as graphite; . Since the electrical resistance is low, the forming material of the connection portion is preferably copper.
- a connector member is a part electrically connected so that the anode terminal and cathode terminal of an adjacent organic EL element in a light emission panel may be straddled.
- the shape of the connector member in plan view is not particularly limited, but is preferably elongated in plan view. If the connection substrate and the plurality of organic EL elements (light emitting panels) are connected, the adjacent anode terminal and cathode terminal can be connected even if there is a slight misalignment.
- the connector member is made of a conductive material.
- the connector member may be formed from, for example, wiring such as the above-described printed wiring, or may be formed from a lump of conductive material fixed on the substrate. Examples of the material for forming the connector portion include the material for forming the connection circuit.
- a connection substrate in which a connection circuit and a connector member are printed on a flexible substrate is particularly preferably used.
- a connection substrate printed and wired on a flexible substrate is generally called a flexible printed circuit board (FPC). Since the wiring pattern can be easily changed by using the FPC, the arrangement of the connector member and the connection circuit can be easily set. Therefore, a connection board suitable for the arrangement of the organic EL elements in the light emitting panel can be easily and inexpensively formed.
- FPC flexible printed circuit board
- the organic EL element used in the organic EL light emitting device of the present invention is not particularly limited as long as it has an organic layer, an anode terminal, and a cathode terminal. However, preferably, as described above, the organic EL elements shown in FIGS. 12 and 13 are used. Hereinafter, the layer structure of the organic EL element will be described.
- the element substrate is not particularly limited, and examples thereof include a glass substrate, a metal substrate, a synthetic resin substrate, and a ceramic substrate.
- the synthetic resin substrate include polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), and ethylene.
- -Olefin resins containing ⁇ -olefin as monomer component such as propylene copolymer, ethylene-vinyl acetate copolymer (EVA); polyvinyl chloride (PVC); vinyl acetate resin; polycarbonate (PC); PPS); Amide resins such as polyamide (nylon), wholly aromatic polyamide (aramid); polyimide resins; flexible synthetic resin films such as polyetheretherketone (PEEK).
- the metal substrate include a flexible thin plate made of stainless steel, copper, titanium, aluminum, an alloy, or the like.
- the element substrate is preferably excellent in heat dissipation.
- the element substrate preferably has a sealing property. Note that in the case of using a metal substrate, an insulating layer is provided on the surface of the metal substrate in order to insulate the electrode formed on the surface.
- the anode layer is made of a conductive film.
- the material for forming the anode layer is not particularly limited.
- ITO indium tin oxide
- ITSO indium tin oxide containing silicon oxide
- the thickness of the anode layer is not particularly limited, but is usually 0.01 ⁇ m to 1.0 ⁇ m.
- an optimum method can be adopted depending on the forming material, and examples thereof include a sputtering method, a vapor deposition method, and an ink jet method. For example, when forming an anode with a metal, a vapor deposition method is used.
- the anode layer 52 of the organic EL element 5 shown in FIG. 12 and FIG. 13 has an anode terminal 521 whose one end (left end in the drawing) is exposed.
- the anode terminal 521 only needs to be able to pass a current from an external power source to the anode layer 52 and may not be a portion where the anode layer 52 is exposed.
- the anode terminal 521 may be formed by laminating an auxiliary electrode layer on the exposed surface of the anode layer 52 (not shown). By passing the auxiliary electrode layer, it is possible to apply a voltage uniformly to the entire organic EL layer.
- the organic layer is a laminate composed of at least two functional layers.
- the structure of the organic layer for example, (A) a structure composed of three layers, a hole transport layer, a light emitting layer, and an electron transport layer, and (B) composed of two layers, a hole transport layer and a light emitting layer. Examples thereof include a structure, (C) a structure composed of two layers of a light emitting layer and an electron transport layer.
- the organic layer (B) the light emitting layer also serves as the electron transport layer.
- the organic layer (C) the light emitting layer also serves as the hole transport layer.
- the organic layer of the organic EL device used in the present invention may have any of the structures (A) to (C).
- the organic EL element of FIG. 11 has the structure (A).
- the organic layer having the structure (A) will be described.
- the hole transport layer 531 included in the organic layer 53 has a function of injecting holes into the light emitting layer 532
- the electron transport layer 533 has a function of injecting electrons into the light emitting layer 532.
- the organic EL element 5 electrons and holes injected from the anode layer 52 and the cathode layer 54 to the light emitting layer 532 are recombined to generate excitons. When the exciton returns to the ground state, the light emitting layer emits light.
- the hole transport layer is provided on the surface of the anode layer.
- any functional layer other than these may be interposed between the anode layer and the hole transport layer on condition that the luminous efficiency of the organic EL element is not lowered.
- the hole injection layer may be provided on the surface of the anode layer, and the hole transport layer may be provided on the surface of the hole injection layer.
- the hole injection layer is a layer having a function of assisting injection of holes from the anode layer to the hole transport layer. By providing the hole injection layer, holes are easily injected from the hole transport layer into the light emitting layer.
- the hole transport layer substantially has the function of a hole injection layer even if no hole injection layer is provided.
- a hole transport layer can also be formed.
- the material for forming the hole transport layer is not particularly limited as long as it is a material having a hole transport function.
- aromatic amine compounds such as 4,4 ′, 4 ′′ -tris (carbazol-9-yl) -triphenylamine (abbreviation: TcTa); 1,3-bis (N— Carbazole derivatives such as carbazolyl) benzene; spiros such as N, N′-bis (naphthalen-1-yl) -N, N′-bis (phenyl) -9,9′-spirobisfluorene (abbreviation: Spiro-NPB)
- Spiro-NPB 1,3-bis (N— Carbazole derivatives such as carbazolyl) benzene
- Spiro-NPB 1,3-bis (N— Carbazole derivatives such as carbazolyl) benzene
- Spiro-NPB 1,3-bis (N— Carbazole derivatives such as carbazolyl)
- the material for forming the hole injection layer is not particularly limited, and examples thereof include metal oxides such as vanadium oxide, niobium oxide, and tantalum oxide; phthalocyanine compounds such as phthalocyanine; hexaazatriphenylene hexacarbonitrile (abbreviation: HAT- CN) and the like; polymer compounds such as a mixture of 3,4-ethylenedioxythiophene and polystyrenesulfonic acid (abbreviation: PEDOT / PSS); and the like.
- the material for forming the hole injection layer may be used alone or in combination of two or more.
- the hole injection layer may have a multilayer structure of two or more layers.
- the thicknesses of the hole transport layer and the hole injection layer are not particularly limited, but are preferably 1 nm to 500 nm from the viewpoint of lowering the driving voltage.
- a method for forming the hole transport layer and the hole injection layer an optimum method can be adopted depending on the forming material, and examples thereof include a sputtering method, a vapor deposition method, an inkjet method, and a coating method.
- the light emitting layer is provided on the surface of the hole transport layer.
- the material for forming the light emitting layer is not particularly limited as long as it is a light emitting material.
- a material for forming the light emitting layer for example, a low molecular light emitting material such as a low molecular fluorescent light emitting material or a low molecular phosphorescent light emitting material can be used.
- low-molecular light-emitting material examples include aromatic dimethylidene compounds such as 4,4′-bis (2,2′-diphenylvinyl) -biphenyl (abbreviation: DPVBi); 5-methyl-2- [2- [4- Oxadiazole compounds such as (5-methyl-2-benzoxazolyl) phenyl] vinyl] benzoxazole; 3- (4-biphenylyl) -4-phenyl-5-tert-butylphenyl-1,2,4 A triazole derivative such as triazole; a styrylbenzene compound such as 1,4-bis (2-methylstyryl) benzene; a benzoquinone derivative; a naphthoquinone derivative; an anthraquinone derivative; a fluorenone derivative; an azomethine zinc complex, tris (8-quinolinolato) aluminum (Alq) 3 ) organometallic complexes such as;
- a host material doped with a light emitting dopant material may be used as a material for forming the light emitting layer.
- the host material for example, the above-described low-molecular light-emitting materials can be used, and in addition, 1,3,5-tris (carbazo-9-yl) benzene (abbreviation: TCP), 1,3-bis (N-carbazolyl) benzene (abbreviation: mCP), 2,6-bis (N-carbazolyl) pyridine, 9,9-di (4-dicarbazole-benzyl) fluorene (abbreviation: CPF), 4,4′-bis A carbazole derivative such as (carbazol-9-yl) -9,9-dimethyl-fluorene (abbreviation: DMFL-CBP) can be used.
- TCP 1,3,5-tris
- mCP 1,3-bis (N-carbazolyl) benzene
- CPF 9,9
- Examples of the dopant material include styryl derivatives; perylene derivatives; tris (2-phenylpyridyl) iridium (III) (Ir (ppy) 3 ), tris (1-phenylisoquinoline) iridium (III) (Ir (piq) 3 ), Phosphorescent metal complexes such as organic iridium complexes such as bis (1-phenylisoquinoline) (acetylacetonato) iridium (III) (abbreviation: Ir (piq) 2 (acac)), and the like.
- the material for forming the light emitting layer may include the above-described material for forming the hole transport layer, the material for forming the electron transport layer described later, and various additives.
- the thickness of the light emitting layer is not particularly limited, but is preferably 2 nm to 500 nm, for example.
- a method for forming the light emitting layer an optimum method can be adopted depending on the forming material, but it is usually formed by vapor deposition.
- the electron transport layer is provided on the surface of the light emitting layer (the back surface of the cathode layer).
- any functional layer other than these may be interposed between the cathode layer and the electron transport layer on condition that the luminous efficiency of the organic EL element is not lowered.
- the electron injection layer may be provided on the surface of the electron transport layer, and the cathode layer may be provided on the surface of the electron injection layer.
- the electron injection layer is a layer having a function of assisting injection of electrons from the cathode layer to the electron transport layer.
- an electron injection layer By providing the electron injection layer, electrons are easily injected from the electron transport layer into the light emitting layer.
- a material having both an electron transport function and an electron injection function as a material for forming an electron transport layer, a hole transport layer substantially having the function of an electron injection layer can be formed without providing an electron injection layer. You can also
- the material for forming the electron transport layer is not particularly limited as long as the material has an electron transport function.
- Examples of the material for forming the electron transport layer include tris (8-quinolinolato) aluminum (abbreviation: Alq 3 ), bis (2-methyl-8-quinolinolato) (4-phenylphenolato) aluminum (abbreviation: BAlq), and the like.
- the material for forming the electron injection layer is not particularly limited, and examples thereof include alkali metal compounds such as lithium fluoride (LiF) and cesium fluoride (CsF); alkaline earth metal compounds such as calcium fluoride (CaF 2 ); And a material for forming an electron transport layer.
- the material for forming the electron injection layer may be used alone or in combination of two or more.
- the electron injection layer may have a multilayer structure of two or more layers.
- the thicknesses of the electron transport layer and the electron injection layer are not particularly limited, but are preferably 1 nm to 500 nm from the viewpoint of lowering the driving voltage.
- an optimum method can be adopted depending on the material of formation, and examples thereof include a sputtering method, a vapor deposition method, an ink jet method, and a coating method.
- the cathode layer is made of a conductive film. Arbitrary functional layers other than these may be interposed between the cathode layer and the electron transport layer on condition that the luminous efficiency of the organic EL element is not lowered.
- the material for forming the cathode layer is not particularly limited. In the case of forming a top emission type organic EL element, a transparent cathode layer is used. As a material for forming a transparent and conductive cathode layer, indium tin oxide (ITO); indium tin oxide containing silicon oxide (ITSO); zinc oxide to which a conductive metal such as aluminum is added (ZnO: Al) A magnesium-silver alloy.
- the thickness of the cathode layer is not particularly limited, but is usually 0.01 ⁇ m to 1.0 ⁇ m.
- a method for forming the cathode layer an optimum method can be adopted depending on the forming material, and examples thereof include a sputtering method, a vapor deposition method, and an ink jet method.
- a sputtering method is used, and when the cathode layer is formed of a magnesium-silver alloy or a magnesium-silver laminated film, an evaporation method is used.
- the cathode layer 54 has a cathode terminal 541 whose one end (right end in the drawing) is exposed.
- the cathode terminal 541 only needs to be able to pass a current from the outside to the cathode layer 54 and is not a portion where the cathode layer 54 is exposed.
- the cathode terminal 541 can be formed by laminating an auxiliary electrode layer on the exposed surface of the cathode layer 54 (not shown).
- the second barrier layer is a layer that prevents the outside air from coming into contact with the organic layer 53.
- the second barrier layer 55 is stacked on the cathode layer 54.
- the material for forming the second barrier layer is not particularly limited, and the same material as that for the first barrier layer described above can be used.
- the thickness of the second barrier layer is not particularly limited, but is, for example, 50 nm to 50 ⁇ m.
- the organic EL light-emitting device manufacturing method of the present invention includes a step of arranging a plurality of organic EL elements each having an organic layer and an electrode terminal in a tile shape on a base material, and electrically connecting the electrode terminals of each organic electroluminescence element. And a light emitting panel forming step having a connecting step of forming a connection portion by connecting them together. Furthermore, the organic EL device manufacturing method of the present invention includes a light-emitting region composed of a plurality of organic layers in a light-emitting panel, and an sealing region sealed with a sealing member including an interlayer region sandwiched between two adjacent organic layers. It has a stop process.
- the light emitting panel formation process includes an arrangement process and a connection process.
- the arranging step is a step of arranging the plurality of organic EL elements described above in parallel on the base material in a tile shape.
- “arranging a plurality of organic EL elements in parallel in a tile shape” means that the organic EL elements are arranged so as not to overlap each other.
- the organic EL elements may be arranged so as to contact each other, or may be arranged at a necessary interval.
- the intervals may all be constant or may be different from each other.
- the interval between the organic EL elements is not particularly limited, but is usually 0.1 mm to 0.5 mm, and preferably 0.1 mm to 0.3 mm.
- a connection process is a process of forming a connection part by electrically connecting the electrode terminal of each organic electroluminescent element.
- the connecting portion is formed by the contact between the anode terminal of one adjacent organic EL element and the cathode terminal of the other organic EL element.
- the connection portion has a connector member.
- an independent connector member may be used, or a connection board having a connector member as used in Modification 3 of the present invention may be used.
- the connecting step includes a step of connecting the anode terminal and the cathode terminal of the organic EL element located at both ends of the light emitting panel to an external power source.
- an independent connector member an independent lead wire is connected to the electrode terminal of the organic EL element.
- a connection board having a connector member and a connection circuit as used in Modification 3 of the present invention it is not necessary to connect an independent lead wire to the electrode terminal of the organic EL element.
- connection method between these members and the electrode terminals is not particularly limited.
- connection method for example, wire bonding or solder reflow can be employed.
- substrate and an electrode terminal is not specifically limited.
- connection method for example, soldering or connection using an anisotropic conductive film (ACF) can be employed.
- the connection substrate is connected to a plurality of organic EL elements (light emitting panels) using ACF.
- the sealing step is a step of sealing using the above-described sealing member to include a light emitting region composed of a plurality of organic layers in the light emitting panel and an interlayer region sandwiched between two adjacent organic layers.
- a sealing member is a sealing member which has a side wall part and a ceiling part
- a sealing member consists of a resin layer
- a sealing member is a flexible film
- the sealing member is a sealing member having a side wall portion and a ceiling portion
- the organic layer is sealed by covering the light emitting panel with a sealing member prepared in advance.
- an adhesive is applied to the end of the side wall portion of the sealing member, the sealing member is bonded to the base material or the electrode terminal of the organic EL element, and then the adhesive is solidified to seal the sealing member.
- the members are bonded.
- the sealing member When the sealing member is bonded onto the base material and independent lead wires are connected to the electrode terminals located at both ends of the light emitting panel, the sealing member partially includes the lead wire and the base material. Glued on top. That is, a part of the lead wire is sealed in the sealing space and the other part is exposed outside the sealing space by the sealing process.
- a sealing process is preferably performed in inert gas atmosphere.
- the inert gas can be filled in the sealing space in parallel with the sealing step.
- the sealing member is a resin layer
- the light emitting region and the interlayer region are sealed by applying the molten resin on the base material and then solidifying the applied molten resin.
- coating molten resin on a base material the some organic EL element in a light emission panel is coat
- the sealing member partially embeds the lead wires. That is, in the sealing process, a part of the lead wire is embedded in the resin layer, and the other part is exposed to the outside of the resin layer.
- the sealing member is a flexible film
- an adhesive is applied to one surface of the flexible film, and then the flexible film is placed on the base material so as to cover a plurality of organic EL elements in the light-emitting panel.
- the light emitting region and the interlayer region are sealed by bonding together.
- sealing is performed including the connection portion formed in the connection step. That is, when the connector member is used in the connection process, the connection portion having the connector member is sealed in the sealing process.
- the connection substrate is used in the connection step, the connection between the connection substrate and the light-emitting panel can be further strengthened by sealing the connection portion having the connector member.
- the manufacturing method of the organic EL light emitting device of the present invention may further include a step of laminating the first barrier layer on the sealing member after the sealing step. By providing the first barrier layer, the organic layer is less likely to come into contact with the outside air.
- organic EL light emitting device and the manufacturing method thereof according to the present invention are not limited to the embodiment as described above, and can be appropriately changed in design within the range intended by the present invention.
- Example 1 Preparation of element substrate having insulating layer
- Acrylic resin manufactured by JSR Corporation, trade name “JEM-477”
- SUS304 stainless steel plate
- An anode layer made of an aluminum film having a thickness of 100 nm and HAT-CN having a thickness of 10 nm (1,4,5,8,9,12-hexaazatriphenylenehexacarbonitrile) on the insulating layer of the element substrate by vacuum deposition.
- a light emitting layer also serving as an electron transport layer
- Alq tris (8-quinolinolato) aluminum
- a cathode layer and a refractive index adjustment layer made of molybdenum trioxide having a thickness of 60 nm were deposited in this order.
- an organic EL layer was formed on the insulating layer of the element substrate to produce an organic EL element.
- a SiN film having a thickness of 200 nm was laminated by a sputtering method so as to cover a region (surface region) corresponding to the organic layer on the refractive index adjustment layer. Furthermore, an adhesive layer was formed by laminating an adhesive mainly composed of a low water content epoxy so as to have a thickness of 20 ⁇ m in the same region. Then, a PET film (trade name “DIAFOIL”, manufactured by Mitsubishi Plastics, Inc.) on which SiN was laminated to 200 nm was vacuum-laminated on the SiN film under the condition of being heated to 80 ° C. Thereafter, the adhesive layer was cured by heating at 100 ° C. for 2 hours.
- DIAFOIL manufactured by Mitsubishi Plastics, Inc.
- the SiN laminated PET film was bonded to the SiN film via the adhesive layer.
- the water vapor permeability of the adhesive layer was 40 g / m 2 ⁇ day.
- the 3rd 2nd barrier layer which consists of an adhesive bond layer, a SiN film
- connection substrate was a polyimide film having flexibility. That is, the connection board was FPC.
- the same SiN laminated PET film as used in the formation of the second barrier layer so as to cover the entire four organic EL elements arranged in parallel on the SUS base material (trade name “DIAFOIL” manufactured by Mitsubishi Plastics, Inc.) was laminated on the SUS base material.
- the same adhesive mainly composed of a low water content epoxy used in the formation of the second barrier layer was used. That is, the SiN laminated PET film was vacuum laminated on the entire organic EL element under the condition of being heated to 80 ° C. Thereafter, the adhesive layer was cured by heating at 100 ° C. for 2 hours. The thickness of the adhesive layer was 20 ⁇ m.
- a sealing member having a two-layer structure including a PET film on which SiN was laminated and an adhesive layer made of a low water content epoxy was bonded to the entire four organic EL elements.
- the total thickness of the sealing member was 70.2 ⁇ m.
- the sealing member was bonded together so that the connection part of a connection board
- the organic EL light emitting device according to Example 1 was manufactured by attaching the sealing member to the light emitting panel.
- Example 2 Instead of a PET film laminated with SiN, an EVA film having a thickness of 400 ⁇ m was vacuum-laminated under a condition heated to 100 ° C. as a sealing member, and between the EVA film and the four organic EL elements.
- An organic EL light emitting device according to Example 2 was produced in the same manner as in Example 1 except that the adhesive layer was not provided. That is, in Example 2, a sealing member made of only an EVA film was bonded to the entire four organic EL elements.
- the water vapor permeability of the EVA film was 18 g / m 2 ⁇ day.
- the total thickness of the sealing member was 400 ⁇ m.
- Example 3 Implemented except that a 700 ⁇ m thick glass plate was used as the base material instead of the stainless steel plate, and a 700 ⁇ m thick glass plate was used as the sealing member instead of the PET film laminated with SiN.
- An organic EL light emitting device according to Example 3 was produced by the same method as in Example 1.
- Comparative Example 1 An organic EL light emitting device according to Comparative Example 1 was produced in the same manner as in Example 1 except that sealing with a sealing member (PET film on which SiN was laminated) was not performed.
- the organic EL light-emitting device of the present invention can be used as a display device or a lighting device.
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Abstract
Description
具体的には、有機EL素子が有する有機層に含まれる有機物は、外気に含まれる酸素や水蒸気によって変性し易い。有機層に含まれる有機物が変性すると、有機EL素子の輝度が下がり、有機EL素子が長期間に渡り安定的に発光しないことがある。
特に大型の有機EL発光装置では、複数の有機EL素子が用いられるため、有機EL発光装置に含まれる各有機EL素子の輝度をより安定的に維持しなければならない。
また、封止層を有さない有機EL素子は、有機層が外気に接触するので、有機EL素子の劣化を生じ易い。そのため、封止層を有さない有機EL素子を用いて大型の有機EL発光装置を得ることはできない。
さらに、電極端子を除き部分的に封止層を設けた有機EL素子を用いて大型の有機EL発光装置を製造することも考えられる。しかし、有機EL素子において電極端子が設けられた部分は非常に狭い。そのため、各有機EL素子の電極端子を除いた部分に封止層を設けることは非常に煩雑且つ困難である。従って、各有機EL素子の電極端子を除いて封止層を設けようとしても、意に反して、電極端子が封止層で覆われる場合や有機層が露出する場合が考えられる。電極端子が封止層で覆われた各有機EL素子は、電気的に接続できず、大型の有機EL発光装置を得ることができない。また、有機層が露出すると、有機EL素子に劣化が生じる。
また、接続基板が、発光パネル内の有機EL素子を外部電源に接続する接続回路をさらに有しており、接続回路と発光パネルの両端に位置する有機EL素子の陽極端子及び陰極端子が電気的に接続されている。
さらに、本発明の他の好ましい有機EL発光装置は、封止部材が、少なくとも発光領域と層間領域とを隙間なく覆う連続した樹脂層である。
本発明の有機EL発光装置の製造方法は、有機層と電極端子とを有する複数の有機EL素子を母材上にタイル状に並列配置する配置工程、及び各有機EL素子の電極端子を電気的に接続することで接続部を形成する接続工程を有する発光パネル形成工程と、発光パネル内において、複数の有機層からなる発光領域、及び隣り合う2つの有機層に挟まれた層間領域を含んで封止部材により封止する封止工程と、を有する。
また、本明細書において、有機EL素子が並列配置される方向をA方向といい、前記A方向と略直交する方向をB方向という。
本発明の有機EL発光装置の構成を説明する前に、本発明で用いられる有機EL素子の基本的な構成について説明する。
有機EL層は、素子基板に積層された第1電極層と、第1電極層に積層された有機層と、有機層に積層された第2電極層と、を有する。
本発明において、有機EL素子の層構成は、上記の条件を満たす限り特に限定されず、任意の層を付加することができる。また、有機EL素子は、素子基板の表側(有機EL層が積層されている側)から光を取り出すことができるトップエミッション型の素子であってもよいし、素子基板の裏側から光を取り出すことができるボトムエミッション型の素子であってもよい。
第1電極層が陽極層である場合、第1電極層に通電可能な電極端子が陽極端子であり、第2電極層が陰極層である場合、第2電極層に通電可能な電極端子が陰極端子である。
平面視略帯状の有機EL素子を用いれば、その幅方向に複数の有機EL素子を並列配置することにより大型の有機EL発光装置を得ることができる。
平面視略帯状の有機EL素子の寸法は特に限定されないが、一般的には、有機EL素子の幅:長さが、1:3~1:20であり、好ましくは、1:3~1:10である。
本発明で用いられる有機EL素子5は、好ましくは、その幅方向両端部に電極端子(陽極端子521及び陰極端子541)が設けられている。図12では、幅方向左端部が陽極端子521であり、幅方向右端部が陰極端子541である。この場合、図13に示すように、素子基板51に積層された第1電極層52は陽極層であり、有機層53の上に設けられた第2電極層54は陰極層である。もっとも、陽極層と陰極層は、反対であってもよい。図12において格子状模様が付された部分は、有機EL素子の有機層53に対応する表面領域56である。
以下、有機EL発光装置の構成について説明するが、図1及び図2、図4~図7、並びに図9~図11で用いられている有機EL素子5は、図12及び図13で示される有機EL素子5である。図1及び図2、図4~図7、並びに図9~図11では、図12で表される平面視帯状の有機EL素子5が、その幅方向に並列配置されている。つまり、図示例では、有機EL素子5の幅方向がA方向に対応する。
本発明の有機EL発光装置は、母材と、母材上にA方向に並列配置された複数の有機EL素子と、を有する発光パネルを有する。有機EL素子は、有機層と電極端子(陽極端子及び陰極端子)とを有する。また、発光パネルは、さらに、各有機EL素子の電極端子が電気的に接続された接続部を有する。
発光パネルの両端部に位置する有機EL素子の電極端子(陽極端子及び陰極端子)は外部電源に電気的に接続される。そして、外部電源から電極端子に電流を流すことで、有機層に含まれる発光層が発光する。
発光パネル内の複数の有機EL素子は、接続部により電気的に接続されているため、外部電源から供給される電流は、発光パネル内の全ての有機EL素子に流れる。その結果、複数の有機EL素子が発光する。
さらに、本発明の有機EL発光装置は、発光パネル内において、複数の有機層からなる発光領域、及び隣り合う2つの有機層に挟まれた層間領域を含んで封止する封止部材を有する。封止部材により、発光領域及び層間領域が封止されることにより、発光パネル内の全ての有機EL素子の有機層が外気に接触することを防止できる。
なお、図1において、封止部材3と発光パネル2との間の空間(図2に示す封止空間33)に設けられたコネクタ部材61は、便宜上、一点鎖線によって表されている。
母材は、透明及び不透明の何れでよいが、ボトムエミッション型の有機EL発光装置を形成する場合には、透明な母材が用いられる。また、有機EL素子の有機層が外気に接触することを防止するため、母材は、封止性(ガスバリア性及び水蒸気バリア性)を有することが好ましい。
また、ガスバリア性の指標として、酸素透過度が500cc/m2・day・atm以下であり、好ましくは、100cc/m2・day・atm以下であり、より好ましくは、50cc/m2・day・atm以下であることが例示できる。ただし、酸素透過度は、25℃、100%RHの雰囲気下において、JIS K7126に準拠した測定法によって測定される値である。
さらに、水蒸気バリア性の指標として、水蒸気透過度が500g/m2・day以下であり、好ましくは、100g/m2・day以下であり、より好ましくは、50g/m2・day以下であることが例示できる。ただし、水蒸気透過度は、40℃、90%RHの雰囲気下において、JIS K7129に準拠した測定法によって測定される値である。
また、発光パネル2の一端に位置する有機EL素子5の陽極端子521と、発光パネル2の他端に位置する有機EL素子5の陰極端子541には、外部電源(図示せず)と接続するリード線7がそれぞれ接続される。
また、図1及び図2では、コネクタ部材61を介して発光パネル2内の隣り合う有機EL素子5が直列に接続されている。しかし、各有機EL素子5は、各有機EL素子5の電極端子521,541に接続された導電性の引出線を介して並列に接続されていてもよい(図示せず)。この場合、接続部6は引出線を有することとなる。
なお、本明細書において、有機EL素子5の側縁とは、その表面に対して鉛直方向から見たときに有機EL素子5の輪郭線を構成する部分である。
また、コネクタ部材やリード線の形状は特に限定されない。図1及び図2では、有機EL素子5と略同じ長さを有する細長状のコネクタ部材61が用いられている。
発光パネル内に複数の有機EL素子がタイル状に並列配置されることで、複数の有機層からなる発光領域と、隣り合う2つの有機層に挟まれた層間領域と、が形成される。封止部材は、この発光領域と層間領域とを封止する。
以下、発光領域、及び層間領域について詳述する。
図3(a)及び(b)において、2つの有機EL素子5は、それぞれ有機層53に対応する表面領域56を有する。同図の有機EL素子5は、電極端子521,541、並びに、有機EL素子5の長手方向両端部及びその近傍を除く部分に表面領域56を有する。同図では、表面領域56に格子状模様が付されている。
発光領域22は、有機EL発光装置が有する全ての有機EL素子5の表面領域56を合わせた領域であり、図3(a)及び(b)では、2つの表面領域56,56を合わせた領域である。なお、図1及び図2では、発光パネル2は、4つの有機EL素子5を含んでいるため、4つの表面領域56によって発光領域22が形成されている。
図3(a)では、層間領域23は、図面内で左側に位置する有機EL素子5の陰極端子541と、右側に位置する有機EL素子5の陽極端子521と、両電極端子521,541の間の領域と、を含んだ領域である。
また、図3(b)に示すように、B方向に延びる2つの有機EL素子5,5の側縁57,57同士が当接するように配置されている場合、層間領域23は、図面内において左側に配置している有機EL素子5の陰極端子541と、右側に配置している有機EL素子5の陽極端子521と、を含んだ領域である。
なお、図3(a)において、接続部(コネクタ部材)は省略されているが、好ましくは、接続部(コネクタ部材)は、封止部材によって封止されている。コネクタ部材が設けられる位置は特に限定されないが、好ましくは、層間領域23にコネクタ部材が位置するように設けられる。
封止部材3は、少なくとも発光領域22及び層間領域23を囲繞する側壁部31と、発光領域22及び層間領域23を覆う天井部32と、を有する。図1及び図2において、封止部材3の側壁部31は、母材21の表面から接着剤層8を介して立設されている。前記封止部材3の側壁部31は、複数の有機EL素子5の周囲を囲繞している。このように、発光領域22、層間領域23、及びコネクタ部材61を有する接続部6は、封止部材3の側壁部31によって囲繞され、且つ、封止部材3の天井部32によって覆われている。図1及び2に示すように、封止部材3の天井部32は、平面視略矩形状であり、封止部材3は、その断面視形状が、略逆U字状である。
なお、封止部材3と発光パネル2との間の封止空間33には、発光パネル2の両端に位置する有機EL素子5の陽極端子521及び陰極端子541と電気的に接続するリード線7の一部が封止されている。
なお、封止空間内には、有機EL素子、コネクタ部材、及びリード線以外の部材が封止されていてもよい。もっとも、本明細書においては、これらの部材についての説明を省略し、図面上においても表示していない。
好ましくは、封止空間内には、不活性ガスが充填されており、且つ、乾燥剤及び酸素吸収剤が配置されている。
乾燥剤は特に限定されず、化学的に水分を吸着すると共に吸湿しても固体状態を維持するものが用いられる。このような化合物としては、酸化ナトリウム、酸化カリウム、酸化カルシウム、酸化バリウムなどが挙げられる。
また、酸素吸収剤も特に限定されず、アルミニウム、鉄、ナトリウム、リチウム、バリウム、亜鉛などが挙げられる。
封止空間内に、不活性ガスを充填することにより、有機層が外気に接触することをより効果的に防止できる。また、封止空間内に外気が侵入した場合でも、封止空間内に乾燥剤及び酸素吸収剤が配置されていれば、侵入した外気が有機層に接触することを効果的に防止できる。
第1バリア層の形成材料は、特に限定されないが、金属蒸着膜、金属若しくは珪素の酸化物の膜、酸化窒化膜、窒化膜、金属箔などが挙げられる。前記金属蒸着膜の金属としては、例えば、In、Sn、Pb、Cu、Ag、Tiなどが挙げられる。前記金属酸化物としては、例えば、MgO、SiO、SixOy、Al2O3、GeO、Ti2Oなどが挙げられる。金属箔としては、例えば、アルミニウム、銅、ステンレスなどが挙げられる。第1バリア層の厚みは、特に限定されないが、例えば、50nm~50μmである。
封止部材の側壁部は、少なくとも発光領域と層間領域を囲繞する部分である。
側壁部の形成材料は、封止性を有するものであれば特に限定されない。好ましくは、側壁部は、封止性を有する樹脂から形成される。
このような樹脂としては、エチレン-ビニルアルコール共重合体、ポリ塩化ビニリデン、ナイロン6、ナイロン66、ポリメタキシリレンアジパミド、非晶性ポリアミド、ポリエチレンテレフタレートやエポキシ樹脂、これらの混合物などが挙げられる。
また、側壁部の厚みは、封止部材の封止性を担保できる範囲であれば特に限定されない。例えば、側壁部の厚みは0.3mm~3mmであり、好ましくは0.3mm~2mmであり、より好ましくは0.3mm~1mmである。
側壁部の厚みが0.3mmを下回ると、封止部材の封止性を担保できない虞があり、側壁部の厚みが3mmを上回ると、有機EL発光装置の可撓性が損なわれる虞がある。
封止部材の天井部は、発光領域と層間領域を覆う部分である。
天井部の形成材料は、封止性を有するものであれば特に限定されない。好ましくは、天井部は、透明な材料によって形成される。透明な材料を用いることで、トップエミッション型の有機EL素子から出射される光が、天井部によって遮られることを防止できる。
このように透明な材料としては、ガラス、樹脂等が挙げられる。透明な樹脂としては、上記の側壁部の形成材料と同様な樹脂を用いることができる。
天井部の厚みは封止部材の封止性を担保できる範囲であれば特に限定されない。例えば、天井部の厚みは0.05mm~3mmであり、好ましくは0.1mm~2mmであり、より好ましくは0.1mm~1mmである。
なお、封止部材の天井部は、上記側壁部の形成材料と同じ樹脂を用いることが好ましい。天井部と側壁部の形成材料が同じであれば、射出成形などにより、側壁部と天井部が繋ぎ目なく一体化した封止部材を得られる。
側壁部と天井部に繋ぎ目がない封止部材は、天井部と側壁部の剥離が生じないため、外気の侵入をより効果的に防止できる。
本発明では、図4及び図5に示すように、コネクタ部材61が、発光パネル2の一側部(図では上側部)に設けられていてもよい。このようにコネクタ部材61を発光パネル2の一側部に偏在させることにより、コネクタ部材61の形成材料を削減できるため、より軽量の有機EL発光装置1を得ることができる。
図4及び図5において、封止部材3の側壁部31は、発光パネル2の両端に位置する有機EL素子5の電極端子(陽極端子521及び陰極端子541)の表面から接着剤層8を介して立設されている。
本変形例においても、発光パネル2内の発光領域22及び層間領域23は、封止空間33内に封止されているため、有機層53が外気に接触することを防止できる。
また、側壁部31が、電極端子521,541の表面から立設されているため、封止部材3の外側には、電極端子521,541が露出した部分が形成される。この電極端子521,541が露出した部分に図1に示すようなリード線を接続することができる(図4及び図5では図示せず)。従って、封止部材3を取り外すことなく、リード線を簡単に交換することができる。
また、封止部材3は、少なくとも発光領域22及び層間領域23を隙間なく覆う樹脂層35であってもよい。この場合、例えば、図6に示すように、樹脂層35からなる封止部材3は、発光パネル2内の全ての有機EL素子5を隙間なく覆っている。即ち、発光パネル2内の発光領域22、層間領域23、及びコネクタ部材61を有する接続部61は、封止部材3である樹脂層35によって封止されている。
封止部材3(樹脂層35)には、上述した第1バリア層34が積層されていてもよい(図示せず)。
なお、図6では、便宜上、樹脂層35の端面には斜線を付しておらず、代わりに無数のドットを付している。
樹脂層に用いられる樹脂は、特に限定されず、上記の側壁部に用いられるものと同じ樹脂を用いることができる。トップエミッション型の有機EL素子に対応するため、樹脂層に用いられる樹脂は、透明であることが好ましい。
なお、図6において、樹脂層35は、発光パネル2の両端に位置する電極端子の全表面を被覆するように設けられている。しかし、樹脂層35は、発光パネル2の両端に位置する電極端子の一部のみを被覆し、樹脂層35の外側に電極端子の一部が露出していてもよい(図示せず)。
最短距離X及びYを上記範囲内とすることで、より効率的に有機層が外気と接触することを防止できる。最短距離X及びYが、上記範囲よりも短い場合、樹脂層内に外気が浸透し易くなる虞があり、最短距離X及びYが、上記範囲よりも長い場合、有機EL発光装置の可撓性が損なわれる虞がある。
また、封止部材3は、図7に示すように、可撓性及び封止性を有する可撓性フィルム36であってよい。可撓性フィルム36は、発光パネル2内に含まれる複数の有機EL素子5の表面を跨いで積層されている。
図7に示す可撓性フィルム36は、その周縁部が接着剤層8を介して母材21上に接着されている。
可撓性フィルム36の厚みは封止性を担保できる範囲であれば特に限定されず、例えば、0.05mm~3mmであり、好ましくは0.1mm~2mmであり、より好ましくは0.1mm~1mmである。
また、可撓性フィルム36の形成材料は、封止性を有する樹脂であれば特に限定されず、例えば、上記側壁部の形成材料として列挙した樹脂を用いることができる。また、可撓性フィルム36は単層構造であってもよいし、2以上の層を有する多層構造であってもよい。
本発明の有機EL発光装置は、コネクタ部材と、コネクタ部材が表面に配設された基板と、を有する接続基板を有していてもよい。接続基板が発光パネル内の複数の有機EL素子の陽極端子及び陰極端子に接続されることで、各有機EL素子が電気的に接続される。 また、封止部材は、接続基板が有するコネクタ部材を含めて封止する。
図8は、本発明で用いられる接続基板4の一実施形態を表す概略背面図であり、図9は、接続基板4と複数の有機EL素子5(発光パネル2)を電気的に接続した状態を表す概略平面図である。図10は、図9の接続基板4及び複数の有機EL素子5に封止部材3を設けることで得られる本発明の有機EL発光装置1を示す概略平面図である。
なお、図8において、便宜上、接続基板4の第1及び第2接続回路411,412には無数のドットを付しており、接続部6であるコネクタ部材61には、格子状模様を付している。また、図9において、接続基板4の第1及び第2接続回路411,412及びコネクタ部材61を、便宜上、一点鎖線によって表している。図11では、便宜上、樹脂層35の端面には斜線を付しておらず、代わりに無数のドットを付している。
コネクタ部材61は、上述のように、隣り合う2つの有機EL素子5の陽極端子521と陰極端子541に跨がるように形成された部材である。コネクタ部材61を介して発光パネル2内で隣り合う各有機EL素子5が電気的に接続される。
従って、第1及び第2接続回路411,412の他端部に接続された外部電源9から供給される電流は、接続回路41を通じて発光パネル2の両端に位置する有機EL素子5に流れ、且つ、コネクタ部材61を通じて発光パネル2内の全ての有機EL素子5に流れる。その結果、発光パネル2が発光する。
なお、接続基板は、第1及び第2接続回路、並びに、コネクタ部材以外の部分を有していてもよい。もっとも、本明細書においては、これらの部分についての説明を省略し、図面上においても表示していない。
発光パネル2内で隣り合う2つの有機EL素子5の電極端子411,412が接続された部分は、封止部材によって封止されている。
そして、封止部材3である樹脂層35は、発光パネル2内の複数の有機EL素子5と、複数の有機EL素子5に接続した接続基板4と、を隙間なく覆っている。即ち、発光パネル2内の発光領域22、層間領域23、及びコネクタ部材61を有する接続部6は、封止部材3である樹脂層35によって包埋されている。
従って、封止部材3(樹脂層35)により、有機層53が外気に接触することを防止できるだけでなく、複数の有機EL素子5と接続基板4の接続を強固に固定できる。複数の有機EL素子5と接続基板4の接続が強固に固定されるため、接続基板4が脱落することを防止できる。
なお、図11において、樹脂層35の側縁面351と有機層53との最短距離Xは、好ましくは、0.5mm~4mmであり、より好ましくは、2mm~4mmである。また、樹脂層35の表面352と有機層53の表面との最短距離Zは、好ましくは、0.05mm~5mmであり、より好ましくは、0.1mm~5mmである。
接続基板は、発光パネル内の複数の有機EL素子を電気的に接続し、発光パネルに外部電源からの電流を供給すると共に、発光パネル内の複数の有機EL素子を一体化する部材である。1つの発光パネルに対して、1つの接続基板が取り付けられる。
特に、接続基板の基板は、発光パネル内の複数の有機EL素子を一体化する部材である。
可撓性を有する基板としては、樹脂フィルムが好ましく用いられる。樹脂フィルムの形成材料としては、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリブチレンテレフタレート(PBT)等のポリエステル系樹脂;ポリエチレン(PE)、ポリプロピレン(PP)、ポリメチルペンテン(PMP)、エチレン-プロピレン共重合体、エチレン-酢酸ビニル共重合体(EVA)等のα-オレフィンをモノマー成分とするオレフィン系樹脂;ポリ塩化ビニル(PVC);酢酸ビニル系樹脂;ポリカーボネート(PC);ポリフェニレンスルフィド(PPS);ポリアミド(ナイロン)、全芳香族ポリアミド(アラミド)等のアミド系樹脂;ポリイミド系樹脂;ポリエーテルエーテルケトン(PEEK)などが挙げられ、好ましくは、ポリイミド系樹脂である。
基板の厚みは特に限定されないが、好ましくは、10μm~50μmであり、より好ましくは、10μm~30μmである。
また、基板の平面視形状は、特に限定されず、発光パネル内の有機EL素子の配列に合わせて適宜変更することができる。
接続回路は、発光パネルに外部電源からの電流を供給する部分である。接続回路は、有機EL素子の陽極端子に電気的に接続する第1接続回路と、陰極端子に電気的に接続する第2接続回路と、を有する。
第1及び第2接続回路の各一端部は、それぞれ陽極端子及び陰極端子に接続され、且つ、その各他端部は、外部電源の陽極及び陰極に接続される。もっとも、第1及び第2接続回路の各他端部は、外部電源に直接接続されていてもよいが、ICチップ等の他部材を介して間接的に外部電源に接続されていてもよい。
接続回路は、導電性を有する材料で形成されており、その形状は特に限定されない。例えば、接続回路は、好ましくは基板上に線状に形成された配線からなり、より好ましくは、基板上に導電性材料の薄膜を付着させることで形成されるプリント配線からなる。
接続回路の形成材料は、特に限定されず、白金、金、銀、銅、ニッケル、コバルト、チタン等の金属;ITO等の金属酸化物;黒鉛等の無機材料;などの導電性材料が挙げられる。電気抵抗が低いことから、接続部の形成材料は、銅が好ましい。
コネクタ部材は、発光パネル内の隣り合う有機EL素子の陽極端子と陰極端子を跨ぐように電気的に接続する部分である。
コネクタ部材の平面視形状は、特に限定されないが、好ましくは、平面視細長状である。平面視細長状であれば、接続基板と複数の有機EL素子(発光パネル)を接続する際に、多少位置ズレが生じても、隣り合う陽極端子と陰極端子を接続することができる。
コネクタ部材は、導電性を有する材料で形成されている。コネクタ部材は、例えば、上述のプリント配線などの配線から形成されていてもよく、基板上に固着された導電性材料の塊体から形成されていてもよい。コネクタ部の形成材料としては、前記接続回路の形成材料が例示できる。
FPCを用いれば、容易に配線パターンを変更できるので、コネクタ部材及び接続回路の配置を容易に設定できる。そのため、発光パネル内の有機EL素子の配置に適合した接続基板を、容易且つ安価に形成できる。
本発明の有機EL発光装置で用いられる有機EL素子は有機層、陽極端子、及び陰極端子を有していれば特に限定されない。
もっとも、好ましくは、上述したように図12及び図13に示す有機EL素子が用いられる。以下、有機EL素子の層構成について説明する。
素子基板は、特に限定されないが、例えば、ガラス基板、金属基板、合成樹脂基板、セラミック基板などが挙げられる。前記合成樹脂基板としては、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリブチレンテレフタレート(PBT)等のポリエステル系樹脂;ポリエチレン(PE)、ポリプロピレン(PP)、ポリメチルペンテン(PMP)、エチレン-プロピレン共重合体、エチレン-酢酸ビニル共重合体(EVA)等のα-オレフィンをモノマー成分とするオレフィン系樹脂;ポリ塩化ビニル(PVC);酢酸ビニル系樹脂;ポリカーボネート(PC);ポリフェニレンスルフィド(PPS);ポリアミド(ナイロン)、全芳香族ポリアミド(アラミド)等のアミド系樹脂;ポリイミド系樹脂;ポリエーテルエーテルケトン(PEEK)などのフレキシブルな合成樹脂フィルムが挙げられる。金属基板としては、ステンレス、銅、チタン、アルミニウム、合金などからなるフレキシブルな薄板などが挙げられる。
なお、金属基板を用いる場合には、その表面に形成される電極に対して絶縁するため、金属基板の表面に絶縁層が設けられる。
上記陽極層は、導電性を有する膜からなる。
陽極層の形成材料は、特に限定されないが、例えば、インジウム錫酸化物(ITO);酸化珪素を含むインジウム錫酸化物(ITSO);アルミニウム;金;白金;ニッケル;タングステン;銅;合金;などが挙げられる。陽極層の厚みは特に限定されないが、通常、0.01μm~1.0μmである。
陽極層の形成方法は、その形成材料に応じて最適な方法を採用できるが、スパッタ法、蒸着法、インクジェット法などが挙げられる。例えば、金属によって陽極を形成する場合には、蒸着法が用いられる。
有機層は、少なくとも2つの機能層からなる積層体である。有機層の構造としては、例えば、(A)正孔輸送層、発光層、及び電子輸送層の、3つの層からなる構造、(B)正孔輸送層及び発光層の、2つの層からなる構造、(C)発光層及び電子輸送層、の2つの層からなる構造、などが挙げられる。
前記(B)の有機層は、発光層が電子輸送層を兼用している。前記(C)の有機層は、発光層が正孔輸送層を兼用している。
本発明に用いられる有機EL素子の有機層は、上記(A)~(C)の何れの構造であってもよい。図11の有機EL素子は、(A)の構造を有する。以下、(A)の構造を有する有機層について説明する。
有機EL素子5においては、陽極層52及び陰極層54から発光層532に注入された電子及び正孔が再結合することにより、励起子(エキシトン)を生じる。この励起子が基底状態に戻るときに発光層が発光する。
例えば、正孔注入層が、陽極層の表面に設けられ、その正孔注入層の表面に正孔輸送層が設けられていてもよい。正孔注入層は、陽極層から正孔輸送層へ正孔の注入を補助する機能を有する層である。
正孔注入層を設けることにより、正孔輸送層から正孔が発光層へ注入され易くなる。
なお、正孔輸送層の形成材料として、正孔輸送機能及び正孔注入機能を併有するものを用いることにより、正孔注入層を設けなくても、実質的に正孔注入層の機能も有する正孔輸送層を形成することもできる。
正孔輸送層及び正孔注入層の厚みは、特に限定されないが、駆動電圧を下げるという観点から、それぞれ1nm~500nmが好ましい。
また、正孔輸送層及び正孔注入層の形成方法は、その形成材料に応じて最適な方法を採用できるが、例えば、スパッタ法、蒸着法、インクジェット法、コート法などが挙げられる。
発光層の形成材料は、発光性を有する材料であれば特に限定されない。発光層の形成材料としては、例えば、低分子蛍光発光材料、低分子燐光発光材料などの低分子発光材料を用いることができる。
前記ホスト材料としては、例えば、上述の低分子発光材料を用いることができ、これ以外に、1,3,5-トリス(カルバゾ-9-イル)ベンゼン(略称:TCP)、1,3-ビス(N-カルバゾリル)ベンゼン(略称:mCP)、2,6-ビス(N-カルバゾリル)ピリジン、9,9-ジ(4-ジカルバゾール-ベンジル)フルオレン(略称:CPF)、4,4’-ビス(カルバゾール-9-イル)-9,9-ジメチル-フルオレン(略称:DMFL-CBP)などのカルバゾール誘導体などを用いることができる。
さらに、発光層の形成材料には、上述の正孔輸送層の形成材料、後述の電子輸送層の形成材料、各種添加剤などが含まれていてもよい。
発光層の厚みは、特に限定されないが、例えば、2nm~500nmが好ましい。
また、発光層の形成方法は、その形成材料に応じて最適な方法を採用できるが、通常、蒸着法によって形成される。
例えば、電子注入層が、電子輸送層の表面に設けられ、電子注入層の表面に、陰極層が設けられていてもよい。電子注入層は、前記陰極層から電子輸送層へ電子の注入を補助する機能を有する層である。
なお、電子輸送層の形成材料として、電子輸送機能及び電子注入機能を併有するものを用いることにより、電子注入層を設けなくとも、実質的に電子注入層の機能を有する正孔輸送層を形成することもできる。
電子輸送層及び電子注入層の厚みは、特に限定されないが、駆動電圧を下げるという観点から、それぞれ1nm~500nmが好ましい。
また、電子輸送層及び電子注入層の形成方法は、その形成材料に応じて最適な方法を採用できるが、例えば、スパッタ法、蒸着法、インクジェット法、コート法などが挙げられる。
上記陰極層は、導電性を有する膜からなる。
有機EL素子の発光効率を低下させないことを条件として、陰極層と電子輸送層の間にこれら以外の任意の機能層が介在されていてもよい。
陰極層の形成材料は、特に限定されない。トップエミッション型の有機EL素子を形成する場合には、透明な陰極層が用いられる。透明及び導電性を有する陰極層の形成材料としては、インジウム錫酸化物(ITO);酸化珪素を含むインジウム錫酸化物(ITSO);アルミニウムなどの導電性金属を添加した酸化亜鉛(ZnO:Al);マグネシウム-銀合金などが挙げられる。陰極層の厚みは特に限定されないが、通常、0.01μm~1.0μmである。
陰極層の形成方法は、その形成材料に応じて最適な方法を採用できるが、例えば、スパッタ法、蒸着法、インクジェット法などが挙げられる。例えば、ITOによって陰極層を形成する場合には、スパッタ法が用いられ、マグネシウム-銀合金又はマグネシウム-銀積層膜によって陰極層を形成する場合には、蒸着法が用いられる。
第2バリア層は、有機層53に外気が接触することを防止する層である。図13では、第2バリア層55は、陰極層54に積層されている。
第2バリア層の形成材料は、特に限定されず、上述した第1バリア層と同じ形成材料を用いることができる。第2バリア層の厚みは、特に限定されないが、例えば、50nm~50μmである。
本発明の有機EL発光装置の製造方法は、有機層と電極端子とを有する複数の有機EL素子を母材上にタイル状に並列配置する配置工程、及び各有機エレクトロルミネッセンス素子の電極端子を電気的に接続することで接続部を形成する接続工程を有する発光パネル形成工程と、を有する。
さらに、本発明の有機EL素子の製造方法は、発光パネル内の複数の有機層からなる発光領域、及び隣り合う2つの有機層に挟まれた層間領域を含んで封止部材により封止する封止工程を有する。
発光パネル形成工程は、配置工程と接続工程とを有する。
配置工程は、上述した複数の有機EL素子を母材上にタイル状に並列配置する工程である。
ここで、「複数の有機EL素子をタイル状に並列配置する」とは、各有機EL素子同士が重なり合わないように並べられることを意味する。配置工程では、各有機EL素子が当接するように並べてもよいし、所要間隔を空けて並べてもよい。
各有機EL素子を所要間隔を空けて並べる場合、その間隔は全て一定であってもよいし、それぞれ異なっていてもよい。もっとも、各有機EL素子を、一定間隔を空けて並べることが好ましい。
各有機EL素子の間隔は、特に限定されないが、通常、0.1mm~0.5mmであり、好ましくは、0.1mm~0.3mmである。
例えば、上記配置工程において、有機EL素子が当接するように並べられた場合、隣り合う一方の有機EL素子の陽極端子と他方の有機EL素子の陰極端子が当接することにより接続部が形成される。
また、例えば、上記配置工程において、有機EL素子を所要間隔を空けて並べた場合、上記コネクタ部材を用いて隣り合う2つの有機EL素子の陽極端子と陰極端子とが電気的に接続することにより接続部が形成される。この場合、接続部はコネクタ部材を有する。
接続工程では、独立したコネクタ部材を用いてもよいし、本発明の変形例3で用いられるようなコネクタ部材を有する接続基板を用いてもよい。
独立したコネクタ部材を用いる場合、独立したリード線が有機EL素子の電極端子に接続される。他方、本発明の変形例3で用いられるようなコネクタ部材と接続回路を有する接続基板を用いる場合、独立したリード線を有機EL素子の電極端子に接続する必要はない。
また、接続基板を用いる場合も、接続基板と電極端子との接続方法は特に限定されない。接続方法としては、例えば、半田付け又は異方性導電フィルム(ACF)を用いた接続などを採用することができる。好ましくは、接続基板はACFを用いて複数の有機EL素子(発光パネル)に接続される。
封止工程は、上述した封止部材を用いて、発光パネル内の複数の有機層からなる発光領域、及び隣り合う2つの有機層に挟まれた層間領域を含んで封止する工程である。
以下、封止部材が、側壁部と天井部を有する封止部材である場合と、封止部材が、樹脂層からなる場合と、封止部材が可撓性フィルムである場合について説明する。
なお、封止部材が母材上に接着され且つ発光パネルの両端に位置する電極端子に独立したリード線が接続されている場合、封止部材は、このリード線を部分的に含んで母材上に接着される。つまり、封止工程により、リード線は、その一部が封止空間内に封止され、その他の部分が封止空間の外側に露出する。
なお、発光パネルの両端に位置する電極端子に独立したリード線が接続されている場合、封止部材(樹脂層)は、このリード線を部分的に包埋する。つまり、封止工程により、リード線は、その一部が樹脂層に包埋され、その他の部分が樹脂層の外側に露出する。
接続工程で接続基板を用いた場合、コネクタ部材を有する接続部を封止することにより、接続基板と発光パネルの接続をより強固にすることができる。
(絶縁層を有する素子基板の作製)
厚み50μmのステンレス板(SUS304)の上に、アクリル樹脂(JSR株式会社製、商品名「JEM-477」)をワイヤーバーにより塗工し、220℃で60分クリーンオーブンで加熱することでアクリル樹脂を硬化させ、厚み2μmの絶縁層を形成した。このようにして、ステンレス板と絶縁層とを有する素子基板を作製した。
前記素子基板の絶縁層の上に真空蒸着法により、厚み100nmのアルミニウム膜からなる陽極層、厚み10nmのHAT-CN(1,4,5,8,9,12-ヘキサアザトリフェニレンヘキサカルボニトリル)膜からなる正孔注入層、厚み50nmのNPB(N,N’-ビス(ナフタレン-1-イル)-N,N’-ビス(フェニル)-ベンジジン)膜からなる正孔輸送層、厚み45nmのAlq(トリス(8-キノリノラト)アルミニウム)膜からなる発光層(電子輸送層を兼ねる)、厚み0.5nmのフッ化リチウム膜からなる電子注入層、厚み5nm/15nmのMg/Ag共蒸着膜からなる陰極層、厚み60nmの三酸化モリブデンからなる屈折率調整層を、この順番に蒸着した。このようにして、素子基板の絶縁層の上に有機EL層を形成し、有機EL素子を作製した。
屈折率調整層の上の有機層に対応する領域(表面領域)を覆うように、スパッタ法により厚み200nmのSiN膜を積層した。
さらに、低含有水分エポキシを主成分とする接着剤を同領域に20μmの厚みとなるように積層することで接着剤層を形成した。そして、その上に、SiNが200nm積層されたPETフィルム(三菱樹脂株式会社製、商品名「DIAFOIL」)を、80℃に加熱した条件下でSiN膜上に真空ラミネートした。その後100℃で2時間加熱することで接着剤層を硬化させた。このようにして、SiN積層PETフィルムを接着剤層を介してSiN膜に貼り合わせた。なお、接着剤層の水蒸気透過度は、40g/m2・dayであった。
このように、接着剤層、SiN膜、及びPETフィルムからなる3層の第2バリア層を形成した。なお、SiNが積層されたPETフィルムの厚みは、SiN層を含めて50.2μmであるため、第2バリア層の総厚みは、70.2μmであった。
SUS母材上に4つの素子を並列配置し、各有機EL素子の電極端子(陽極端子及び陰極端子)に対し、図8に示すような接続基板のコネクタ部材を圧着することで、各有機EL素子が電気的に接続された発光パネルを形成した。
なお、接続基板は、その基板が可撓性を有するポリイミドフィルムであった。即ち、接続基板はFPCであった。
SUS母材上に並列配置された4つの有機EL素子全体を覆うように、上記第2バリア層の形成で用いたものと同じSiN積層PETフィルム(三菱樹脂株式会社製、商品名「DIAFOIL」)をSUS母材上に貼り合わせた。このPETフィルムとSUS母材との接着には、第2バリア層の形成で用いたものと同じ低含有水分エポキシを主成分とする接着剤を用いた。つまり、SiN積層PETフィルムを、80℃に加熱した条件下で有機EL素子全体に真空ラミネートした。その後100℃で2時間加熱することで接着剤層を硬化させた。接着剤層の厚みは20μmであった。
このように、SiNが積層されたPETフィルム、及び、低含有水分エポキシによる接着剤層を含む2層構造の封止部材を4つの有機EL素子全体に貼り合わせた。封止部材の総厚みは、70.2μmであった。
なお、封止部材は、接続基板(FPC)と電極端子の接続部も含めるように貼り合わされた。即ち、4つの表面領域からなる発光領域と、各有機層に挟まれた層間領域と、接続部は、封止部材によって封止された。
このように、封止部材を発光パネルに貼り合わせることで、実施例1に係る有機EL発光装置を作製した。
SiNが積層されたPETフィルムの代わりに、封止部材として、厚み400μmのEVAフィルムを、100℃に加熱した条件下で真空ラミネートしたこと、及び、EVAフィルムと4つの有機EL素子との間に接着剤層を設けなかったこと以外は実施例1と同様の方法により実施例2に係る有機EL発光装置を作製した。
即ち、実施例2では、EVAフィルムのみからなる封止部材を4つの有機EL素子全体に貼り合わせた。
なお、EVAフィルムの水蒸気透過度は、18g/m2・dayであった。封止部材の総厚みは、400μmであった。
ステンレス板の代わりに、母材として、厚み700μmのガラス板を用いたこと、及び、SiNが積層されたPETフィルムの代わりに、封止部材として、厚み700μmのガラス板を用いたこと以外は実施例1と同様の方法により実施例3に係る有機EL発光装置を作製した。
封止部材(SiNが積層されたPETフィルム)による封止を行わなかったこと以外は実施例1と同様の方法により比較例1に係る有機EL発光装置を作製した。
実施例1~3及び比較例1に係る各有機EL発光装置を恒温恒湿槽(槽内温度…60℃、槽内湿度…90%)に入れて500時間放置した。その後、恒温恒湿槽に入れる前の各有機EL発光装置の発光面積を基準(100%)として、恒温恒室槽に入れた後の各有機EL発光面積の発光面積の減少度を測定した。その結果を以下の表1に表す。
実施例1~3及び比較例1に係る各有機EL発光装置を折り曲げ、実用上十分に屈曲するか否かを目視により確認した。その結果を以下の表1に表す。
なお、表1において、「○」は、実用上十分に有機EL発光装置が屈曲したことを示し、「×」は、有機EL発光装置が全く屈曲しなかった、又は、実用上十分に屈曲しなかったことを示す。
Claims (14)
- 有機層と電極端子とを有する複数の有機エレクトロルミネッセンス素子が母材上にタイル状に並列配置され、且つ、各有機エレクトロルミネッセンス素子の電極端子が電気的に接続された接続部を有する発光パネルと、
前記発光パネル内において、複数の有機層からなる発光領域、及び隣り合う2つの有機層に挟まれた層間領域を含んで封止する封止部材と、
を有することを特徴とする有機エレクトロルミネッセンス発光装置。 - 前記電極端子が、陽極端子と陰極端子を有しており、
前記接続部が、前記発光パネル内で隣り合う2つの有機エレクトロルミネッセンス素子の陽極端子と陰極端子に跨がるコネクタ部材を有する請求項1に記載の有機エレクトロルミネッセンス発光装置。 - 前記封止部材が、前記接続部を含めて封止している請求項1又は2に記載の有機エレクトロルミネッセンス発光装置。
- 前記コネクタ部材が、前記発光パネルの一側部に設けられている請求項2又は3に記載の有機エレクトロルミネッセンス発光装置。
- 前記コネクタ部材と前記コネクタ部材が表面に配設された基板とを有する接続基板が、前記発光パネル内の複数の有機エレクトロルミネッセンス素子の陽極端子及び陰極端子に接続されることで、各有機エレクトロルミネッセンス素子が電気的に接続されている請求項2~4の何れかに記載の有機エレクトロルミネッセンス発光装置。
- 前記接続基板が、前記発光パネル内の有機エレクトロルミネッセンス素子を外部電源に接続する接続回路をさらに有しており、前記接続回路と前記発光パネルの両端に位置する有機エレクトロルミネッセンス素子の陽極端子及び陰極端子が電気的に接続されている請求項5に記載の有機エレクトロルミネッセンス発光装置。
- 前記封止部材が、少なくとも前記発光領域と前記層間領域とを囲繞する側壁部と、前記発光領域と前記層間領域とを覆う天井部と、を有する請求項1~6の何れかに記載の有機エレクトロルミネッセンス発光装置。
- 前記封止部材と前記発光パネルとの間に封止空間が形成されており、前記封止空間内に、乾燥剤及び酸素吸収剤のうち少なくとも一方が入れられている請求項7に記載の有機エレクトロルミネッセンス発光装置。
- 前記封止部材が、少なくとも前記発光領域と前記層間領域とを隙間なく覆う連続した樹脂層である請求項1~6の何れかに記載の有機エレクトロルミネッセンス発光装置。
- 前記発光パネル内の各有機エレクトロルミネッセンス素子が、外気の侵入を防止するバリア層をさらに有する請求項1~9の何れかに記載の有機エレクトロルミネッセンス発光装置。
- 有機層と電極端子とを有する複数の有機エレクトロルミネッセンス素子を母材上にタイル状に並列配置する配置工程、及び各有機エレクトロルミネッセンス素子の電極端子を電気的に接続することで接続部を形成する接続工程を有する発光パネル形成工程と、
前記発光パネル内において、複数の有機層からなる発光領域、及び隣り合う2つの有機層に挟まれた層間領域を含んで封止部材により封止する封止工程と、
を有することを特徴とする有機エレクトロルミネッセンス発光装置の製造方法。 - 前記電極端子が、陽極端子と陰極端子を有しており、
前記接続工程が、コネクタ部材を用いて、前記発光パネル内で隣り合う2つの有機エレクトロルミネッセンス素子の陽極端子と陰極端子とを電気的に接続し接続部を形成する工程である請求項11に記載の有機エレクトロルミネッセンス発光装置の製造方法。 - 前記封止工程が、さらに前記接続部を含めて封止する工程である請求項12に記載の有機エレクトロルミネッセンス発光装置の製造方法。
- 前記接続工程が、前記コネクタ部材と前記コネクタ部材が表面に配設された基板とを有する接続基板を前記発光パネル内の複数の有機エレクトロルミネッセンス素子の陽極端子及び陰極端子に接続することで各有機エレクトロルミネッセンス素子を電気的に接続し接続部を形成する工程である請求項12又は13に記載の有機エレクトロルミネッセンス発光装置の製造方法。
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Also Published As
Publication number | Publication date |
---|---|
JP2014089825A (ja) | 2014-05-15 |
CN104782228A (zh) | 2015-07-15 |
EP2914063A1 (en) | 2015-09-02 |
TW201421672A (zh) | 2014-06-01 |
EP2914063A4 (en) | 2015-11-04 |
KR20150079562A (ko) | 2015-07-08 |
US20150303402A1 (en) | 2015-10-22 |
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