WO2014048834A1 - Boîtier pour un composant optoélectronique, module électronique, procédé de fabrication de boîtiers et procédé de fabrication de modules électroniques - Google Patents

Boîtier pour un composant optoélectronique, module électronique, procédé de fabrication de boîtiers et procédé de fabrication de modules électroniques Download PDF

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Publication number
WO2014048834A1
WO2014048834A1 PCT/EP2013/069503 EP2013069503W WO2014048834A1 WO 2014048834 A1 WO2014048834 A1 WO 2014048834A1 EP 2013069503 W EP2013069503 W EP 2013069503W WO 2014048834 A1 WO2014048834 A1 WO 2014048834A1
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WO
WIPO (PCT)
Prior art keywords
housing
lead frame
contact
leadframe
coated
Prior art date
Application number
PCT/EP2013/069503
Other languages
German (de)
English (en)
Inventor
Georg Bogner
Luca HAIBERGER
Michael Zitzlsperger
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2014048834A1 publication Critical patent/WO2014048834A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • the invention relates to a housing for an optoelectronic component, an electronic assembly, a method for producing housings and a method for producing electronic assemblies.
  • An optoelectronic component can be, for example, a component which absorbs electromagnetic radiation and / or emits an electromagnetic radiation.
  • An electromagnetic radiation absorbing component may be, for example, a solar cell.
  • an electromagnetic light emitting device may be an Organic Light Emitting Diode (OLED), a White Organic Light Emitting Diode (WOLED), a Light Emitting Diode (LED), or a Laser Diode.
  • OLED Organic Light Emitting Diode
  • WOLED White Organic Light Emitting Diode
  • LED Light Emitting Diode
  • An electromagnetic radiation absorbing and emitting device may be for example a reflection light barrier.
  • Optoelectronic devices are often in housings
  • housing for electronic components such as QFN (quad flat no leads) housing
  • QFN quad flat no leads
  • the QFN packages are also available as QFN packages and / or as Micro Lead Frame (MLF)
  • QFN includes different sizes of IC packages, all of which can be soldered as surface mounted components on printed circuit boards. In this description, the term “QFN” will also be representative of the following terms
  • MLPQ Micro Leadframe Package Quad
  • MLPM Micro Leadframe Package Micro
  • MLPD Micro Leadframe Package
  • Dual Dual Micro Leadframe Package DDRMLF
  • Dual Fiat No-lead Package DNF
  • Thin Dual Fiat No-lead Package TDFN
  • Ultra Thin Dual Fiat No-lead Package UDFN
  • Extreme Thin Dual XDFN Fiat No-lead Package QFN-TEP (Quad Fiat No Lead Package with Top Exposed Ped)
  • TQFN Thin Quad Fiat No Lead Package
  • VQFN Very Thin Quad Fiat No Leads Package
  • the electrical connections pins do not protrude in the form of wires laterally beyond the dimensions of Kunststoffustummantelung, but are in the form of
  • a housing is designed as a QFN housing may mean, for example, that the housing has no wires leading to the outside, which for example project laterally out of the housing and which, for example, would have to be bent downward when the housing is arranged on a printed circuit board.
  • the leadframes may, for example, initially be present in a lead frame composite and made of this
  • the leadframes can be coated with a coating (plating), for example a metallic coating.
  • the lead frames for example, two each
  • Lead frame sections wherein, for example, one of the lead frame sections has a receiving area for receiving and / or electrical contacting of the electronic
  • the lead frame may be, for example, a metal structure having as ladder frame sections corresponding to one, two or more pieces of metal.
  • leadframe composite which may be a metal frame, for example.
  • Leadframe composite for example, from a
  • Leadframe blank for example, a flat
  • Metal plate is formed, for example by a chemical method such as etching, or by a mechanical method such as punching.
  • the leadframe composite may, for example, a plurality of later, for example, electrode-forming
  • Lead frame composite can be interconnected, for example by means of metal webs.
  • Comprise leadframe portions which form, for example, the electrodes, wherein the leadframe portions are no longer physically connected to each other by means of the metal, i. For example, after the metal bars have already been cut.
  • the electrodes form
  • Lead frame itself or represent isolated lead frame of a lead frame composite.
  • the lead frame composite can for example be embedded in a molding material, for example in a mold process, for example an injection molding or transfer molding process.
  • the molding material may be formed, for example, as KunststoffStoffummantelung.
  • the molding material may, for example, epoxy, silicone or a hybrid material having, for example, one of having said materials.
  • the structure of molding material and embedded therein lead frame composite can also be referred to as a housing composite. That the
  • Embedded molding material means that the lead frame or its lead frame sections are at least partially surrounded by the molding material. Parts of the ladder frame can remain free of mold material.
  • the electrical connections for contacting the housing, in particular the leadframe sections of the housing may be exposed on a lower side of the leadframe. Also, at one of the bottom
  • Receiving recesses in which the receiving areas and / or contact areas are exposed be free of molding material.
  • the housings can be singulated from the housing assembly, for example by means of sawing or cutting.
  • the electrical contacts of the housings are on a side opposite the receiving areas of the leadframe sections
  • Printed circuit board can be placed directly on the resulting physical contact between the housing and circuit board and the electrical contact to the
  • Lead frame and / or a thermal coupling of the housing can be made to the circuit board.
  • housings which are formed and in which the optoelectronic components are arranged so that they are laterally tilted mounted on a printed circuit board, so that for example the side of the housing which is substantially perpendicular to a surface of the circuit board, the receiving recess to record the
  • electromagnetic radiation emitting devices that they the electromagnetic radiation substantially laterally, ie in the direction parallel to the Surface of the circuit board, emit.
  • the electronic assemblies with such housings and electromagnetic radiation emitting components arranged therein are referred to, for example, as “side viewers”, “sideviewers” or “(micro) side LEDs”.
  • QFN housings have no wires on their side surfaces, by means of which they could be contacted laterally tilted on a printed circuit board.
  • the QFN housings may have on their side surfaces only front and / or parting surfaces, in particular sawing or cutting surfaces of the leadframes, in particular of the leadframe sections, which arise when the housing is singulated.
  • these interfaces are not coated and relatively rough and are only relatively poor for electrical
  • a housing for an optoelectronic device which is simple and inexpensive to produce, for example, according to a QFN housing, and / or can be easily mounted on a circuit board that one side of the
  • Housing having a receiving recess for receiving the optoelectronic component is aligned perpendicular or at least substantially perpendicular to a surface of the circuit board.
  • Housing having a receiving recess in which an optoelectronic device is arranged, vertically or is aligned at least substantially perpendicular to a surface of the circuit board.
  • a method for manufacturing optoelectronic package packages that enables the packages to be simply and inexpensively manufactured, for example, according to QFN packages, and / or that allows the packages to be easily mounted on a printed circuit board in that sides of the housings which have receiving recesses for accommodating the optoelectronic components are aligned perpendicularly or at least substantially perpendicular to a surface of the printed circuit board.
  • a method for manufacturing electronic assemblies is provided, which allows the electronic assemblies simple and
  • Assemblies having receiving recesses in which the optoelectronic components are arranged, are aligned perpendicular or at least substantially perpendicular to a surface of the circuit board.
  • a housing for an optoelectronic component has a leadframe which is formed from an electrically conductive first material and which is coated with an electrically conductive second material.
  • the lead frame has a first lead frame portion and a second lead frame portion which are physically separated from each other.
  • the first lead frame portion has a receiving area for arranging the optoelectronic
  • the housing further comprises a molding material, in which the lead frame is embedded and which has a receiving recess on a first side of the housing, in which the receiving area and the contact area are exposed.
  • Lead frame section have to contact the
  • Leadframe portions are exposed on a second side of the housing which forms an edge of the housing with the first side of the housing, wherein the leadframe portions are tapered in the direction perpendicular to the second side of the housing and in which the leadframe portions are coated with the second material are.
  • the exposed and coated on the second side of the housing leadframe sections allow the housing tilted side to be mounted on a circuit board
  • Lead frame sections are exposed and coated, simply soldered to printed circuit boards of the circuit board.
  • the fact that the first side of the housing is oriented substantially perpendicular to the surface may mean that the first side and the surface of the
  • PCB an angle between 70 ° and 110 °
  • the housing may be formed, for example, according to a QFN housing.
  • the exposed and coated on the second side of the housing allow
  • Lead frame sections to provide a side mount QFN housing can be used for an electromagnetic radiation emitting device, thereby
  • a sidelooker and / or sideviewer in QFN construction and thus a QFN sidelooker or QFN sideviewer is provided.
  • the housing may be secured in the contact portions on the second and / or third side to one or two printed circuit boards.
  • the third side of the case can be
  • the housing For example, with the first side of the housing form a further edge of the housing.
  • portions of the second and / or third sides of the housing are
  • Lead frame exposed which are not coated with the second material. These are, for example, separating surfaces which, when the housing is singulated, form a housing composite
  • Lead frame sections in the contact sections each L-shaped and each have a base portion and a respective leg portion.
  • the leg portions extend from the corresponding one
  • the base sections each form part of the first side of the lead frame.
  • the leg portions are exposed on the second side of the housing and coated with the second material. For example, the
  • Lead frame sections in the L-shaped portions bent such that the leg portions with the corresponding base portions at an angle of 90 °.
  • the leg portions can be physically and electrically connected to the
  • Lead frame sections in the contact sections each U-shaped.
  • the contact sections each U-shaped.
  • Lead frame portions in the contact portions each have a base portion and two leg portions extending from the respective base portions.
  • the base sections each form part of the first side of the lead frame.
  • In each contact section are a
  • a cut surface is formed on at least one of the leg portions on a fourth side of the housing, and at the corresponding leg portion, a terrace surface is formed facing away from the cut surface.
  • the cut surface is the same size as the terrace surface. This may help to align and / or balance the housing when mounting to a circuit board, for example by means of a solder connection, relative to the circuit board, for example, to align and / or balance evenly.
  • an electronic package that includes the package and the package
  • the optoelectronic component is arranged in the receiving region and electrically contacted in the contact region.
  • the electronic module can also be used as an optoelectronic module
  • the electronic assembly is
  • a QFN sidelooker or QFN sideviewer for example, a QFN sidelooker or QFN sideviewer.
  • the electronic assembly includes a circuit board having conductive traces and on which the housing is arranged so that the second side of the housing faces the circuit board.
  • the first side of the housing is perpendicular or at least substantially perpendicular to the surface of the housing
  • a main emission direction of the optoelectronic component may be parallel or at least substantially parallel to the surface of the printed circuit board.
  • the main radiation direction can be characterized, for example, by a beam path of electromagnetic radiation and / or run along a beam path of electromagnetic radiation emitted by the beam
  • Optoelectronic component is emitted and along the beam path, the maximum light intensity of the emitted from the optoelectronic component electromagnetic radiation. That the main radiation direction of the optoelectronic component is directed substantially parallel to the surface of the printed circuit board can
  • Main emission direction, and the surface of the circuit board include an angle, for example, between -10 ° and + 10 °, for example, between -5 ° and 5 °, for example, from about 0 ° or are parallel.
  • a method of manufacturing packages for optoelectronic devices is provided. In the method is first a
  • Leitrahmenrohling provided, which is formed of an electrically conductive first material.
  • Leadframe blank is produced a Leitrahmenverbund.
  • the lead frame assembly has a leadframe for each housing, each leadframe having a first leadframe
  • Lead frame sections a receiving area for placing the optoelectronic component and the second
  • Lead frame sections on a contact area for contacting the optoelectronic device.
  • Leadframe composite are in separation areas, where the housing should be separated from each other,
  • the lead frame composite is coated with an electrically conductive second material.
  • the coated ladder frame composite is so in one
  • the molding material on a first side of the housing has a receiving recess in which the receiving area and the contact area are exposed.
  • the contact recesses remain free of molding material.
  • Lead frame composite is separated along the separation areas.
  • the housings are basically manufactured according to the QFN principle.
  • the contact recesses are formed in the separation areas.
  • the separation regions are arranged to intersect at crossing points and the contact recesses are formed at the crossing points. This can contribute to forming a contact section by forming a contact recess in up to four adjacent housings.
  • Lead frame sections extending in the direction perpendicular to the first sides of the lead frame. This contributes to the fact that after separating the housing, the exposed at the second or third side of the housing contact portions of the leadframe sections, which are coated with the second material, are particularly large, which can contribute to a good physical and electrical contact.
  • Punching methods are formed in which the edges of the recesses are extruded in the direction perpendicular to the first side of the lead frame.
  • the inner walls of the contact recesses extending perpendicular to the first side of the leadframe form, after the housing has been singulated, for example, the leg sections of the U-shaped or L-shaped leadframe sections in the contact sections.
  • a method for manufacturing electronic assemblies in which packages are made, for example, according to the
  • At least one of the housings is arranged on a printed circuit board that has conductor tracks, such that the second side of the housing
  • Printed circuit board faces.
  • the contact sections are electrically coupled to the conductor tracks.
  • the first side of the housing is perpendicular or at least substantially aligned perpendicular to the surface of the circuit board. Trap of electromagnetic radiation emitting
  • Component as optoelectronic device can be any organic compound as optoelectronic device.
  • Optoelectronic device may be parallel or at least substantially parallel to the surface of the circuit board.
  • Fig. 1 is a first side of an embodiment of a
  • FIG. 2 shows a fourth side of the housing according to FIG. 1 facing away from the first side
  • FIG. 3 shows a second side of the housing according to FIG. 1, which adjoins the first and the fourth side;
  • FIG. 4 shows a third side of the housing according to FIG. 1, which adjoins the first and the fourth side and which faces away from the second side;
  • FIG. 5A shows a first end side of the housing according to FIG. 1;
  • Fig. 5B a second end face of the housing according to Figure 1, from the first end face of the housing
  • FIG. 6 shows an exemplary embodiment of a leadframe composite during a method for producing a housing for an optoelectronic component
  • 7 shows an embodiment of a housing assembly during a method for producing a
  • Fig. 8 is a first side of an embodiment of a
  • FIG. 9A shows a first end face of the housing according to FIG. 8;
  • FIG. 9B shows a second end face of the housing according to FIG. 8;
  • FIG. 9A shows a first end face of the housing according to FIG. 8;
  • FIG. 9B shows a second end face of the housing according to FIG. 8;
  • FIG. 9A shows a first end face of the housing according to FIG. 8;
  • FIG. 9B shows a second end face of the housing according to FIG. 8;
  • FIG. 9A shows a first end face of the housing according to FIG. 8;
  • FIG. 9B shows a second end face of the housing according to FIG. 8;
  • FIG. 10 shows an embodiment of a housing composite
  • Fig. 11 is a first side of an embodiment of a
  • FIG. 12 shows a first side of an embodiment of an electronic assembly
  • Fig. 13A is a side view of an embodiment of an electronic assembly
  • Fig. 13B is a side view of an embodiment of an electronic assembly; a detailed side view of a
  • Embodiments be an electromagnetic radiation emitting and / or electromagnetic radiation absorbing component.
  • Radiation absorbing component may be, for example, a solar cell.
  • emitting device can in different
  • Embodiments be a semiconductor device emitting electromagnetic radiation and / or as a electromagnetic radiation emitting diode, as an organic electromagnetic radiation emitting diode, as an electromagnetic radiation emitting transistor or as an organic electromagnetic radiation
  • the radiation may, for example, be light in the visible range, for example blue or white light, UV light and / or infrared light.
  • the component emitting electromagnetic radiation can be designed, for example, as a light-emitting diode (LED) or as an organic light-emitting diode (OLED).
  • LED light-emitting diode
  • OLED organic light-emitting diode
  • Component may be part of an integrated circuit in various embodiments. Furthermore, a
  • Fig.l shows a first side 4 of an embodiment of a housing 2 for an optoelectronic device.
  • a second side 6 of the housing 2 forms with the first side 4 an edge of the housing 2.
  • a third side 8 of the housing 2 forms with the first side 4 a further edge of the housing 2.
  • a first end face 10 of the housing 2 is adjacent to the first Page 4, the second page 6 and the first page 8.
  • a second end face 11 of the housing 2 is from the first
  • the housing 2 is suitable for receiving a
  • a carrier for example a printed circuit board
  • the second side 6 faces the carrier and / or that the first side 4 is oriented perpendicular or substantially perpendicular to a surface of the carrier.
  • a carrier for example a printed circuit board
  • the electromagnetic radiation in parallel or at least in Substantially parallel to a surface of the carrier, such as the circuit board, are emitted.
  • Housing 2 may be referred to, for example, as a sidelooker housing and / or as a QFN sidelooker housing.
  • the housing 2 can be used for example in a mobile device, for example a mobile phone, a PDA or a tablet PC, or in a motor vehicle.
  • a thickness of the housing 2 may, for example, be 100 ⁇ m to 1 mm, for example 200 ⁇ m to 500 ⁇ m, for example 250 ⁇ m to 300 ⁇ m.
  • a thickness of the lead frame 12 may be, for example, 100 pm to 500 pm, for example 150 pm to 300 pm.
  • the printed circuit board may be, for example, a FR1, FR2, FR3, FR4, FR5, CEM1, CEM2, CEM3, CEM4 or CEM5 printed circuit board, for example a plated-through FR-4 printed circuit board.
  • the housing 2 has a lead frame 12, which is formed of an electrically conductive first material.
  • the lead frame 12 is coated with an electrically conductive second material.
  • the lead frame 12 may, for example, a first lead frame portion 17 and a second
  • Lead frame portion 19 have the physical
  • the first leadframe section 17 may, for example, have a receiving region 16 for receiving the optoelectronic component.
  • the second leadframe section 19 may, for example, have a contact region 18 for electrically contacting the optoelectronic component.
  • the contact region 18 can be electrically coupled to an ESD protection diode, for example a Zener diode.
  • the ESD protection diode may be bonded to the contact region 18.
  • the electrically conductive first material comprises, for example, a metal, for example copper, for example CuW or CuMo, copper alloys, brass, nickel and / or iron,
  • the electrically conductive second material has, for example a metal on or, for example, nickel, palladium or gold or a mixture or alloy comprising one or more of said metals.
  • the coating may have a thickness, for example, between 0.01 ⁇ m and 0.5 ⁇ m, for example between 0.1 ⁇ m and 0.4 ⁇ m, for example between 0.15 ⁇ m and 0.3 ⁇ m.
  • the coating may have a layer sequence,
  • a layer sequence comprising a Ni layer, a Pd layer and / or an Au layer.
  • the layer sequence can be 0.5 ⁇ m-2.1 ⁇ m thick
  • Ni layer an approximately 0.05 pm thick Pd layer and / or an approximately 0.01 pm thick Au layer.
  • the lead frame 12 may, for example, in a
  • the molding material 14 may comprise, for example, epoxy, silicone or a hybrid of epoxy and / or silicone.
  • the material of the molding material 14 may, for example, be white and / or be particularly stable and / or resistant to the electromagnetic radiation generated by the optoelectronic component, for example radiation-resistant and / or heat-resistant.
  • Molding material 14 has a receiving recess 15 in which the receiving area 16 and the contact area 18 are exposed. It is also located between the first
  • Lead frame portion 19 molding material 14, the first lead frame portion 17 relative to the second
  • the housing 2 has, for example, at the end faces 10, 11 contact portions 22.
  • the contact portions 22 may alternatively be arranged spaced from the end faces 10, 11. In the contact portions 22 are the
  • Lead frame 12 for example, the first
  • Lead frame portion 19, and / or the molding material 14 tapers.
  • the lead frame 12 for example, the first lead frame portion 17 and / or the second lead frame portion 19, and / or the
  • Lead frame portion 19 be formed. This can be formed. This can be formed.
  • 22 terrace surfaces 20 are formed in the contact portions, which form at the first and second sides 6, 8 of the housing and at the first and second end faces 10, 11 terraces and / or steps.
  • FIG. 2 shows a fourth side 24 of the housing 2 according to FIG. 1, which faces away from the first side 4.
  • the second housing 2 may be formed, for example, completely planar and / or planar. In other words, the housing 2 has, for example, no terrace surfaces 20 on its fourth side 24. In contrast, on the fourth side 24 of the lead frame 12, for example, the first Porterrahmabsacrificing 17 and / or the second
  • the housing 2 may have on the fourth side 24 a first electrically conductive region 26 and / or a second electrically conductive region 28, the first conductive region 26, for example, a rear side of the
  • Receiving area 16 and / or the second conductive area 28 may be, for example, a back of the contact area 18.
  • the housing 2 may be completely covered on its fourth side 24 except for the contact portions 22 with molding material 14.
  • the electrically conductive regions 26, 28 are electrically isolated in an additional process step.
  • FIG. 3 shows a view of the second side 6 of the housing 2 according to FIG. 1.
  • the housing 2 may have separating surfaces 30 of the leadframe 12, for example the first leadframe section 17 or the second, on the second side 6
  • Lead frame portion 19 have.
  • the lead frame 12 is not coated with the electrically conductive second material at the parting surfaces 30 of the lead frame 12.
  • the leadframe 12 may be coated with the second material before the housing 2 is singulated, so that the separation surfaces 30 of the leadframe 12, upon which there is no second, arise during the subsequent singulation
  • Lead frame 12 is exposed.
  • the parting surfaces 30 of the lead frame 12 may be made rougher than the coated surfaces of the lead frame 12.
  • the molding material 14 on the second side 6 may have a separating surface 32 of the molding material 14, which likewise arises when the housing 2 is singulated.
  • Shaped material 14 may be formed flush, for example. Before the separation of the housing, the parting surfaces 30, 32 in the corresponding housing assembly, for example, represent transitions from a housing 2 to an adjacent housing 2.
  • the third side 8 of the housing 2 may be designed, for example, substantially corresponding to the second side 6 of the housing 2.
  • FIG. 5A shows a view of the first end face 10 of FIG
  • Lead frame portion 17 can be seen that the
  • Lead frame 12 for example, the first
  • Base portion 29 from, for example, two leg portions 31 extend to the fourth side 24 of the
  • the leg portions 31 may, for example, with the base portion 29 include a right angle and / or be formed perpendicular or at least substantially perpendicular to this.
  • the first leadframe section 17 may not be coated on its front side and / or be free of the second material, since the housing 2 may be separated from an adjacent housing 2 when singulated from the housing assembly at the first end face 10, for example by means of cutting or sawing , Therefore, the lead frame 12 at the first end face 10, for example, one of
  • the molding material 14 and the lead frame 12 may at the first end face 10 of the housing. 2
  • FIG. 5B shows a view of the second end face 11 of the housing 2, which, for example, can essentially be designed correspondingly to the first end face 10.
  • the second lead frame portion 19 in the contact portion 22 for example, U-shaped
  • first end face 10th may be formed and the first end face 10th correspondingly, for example, have a base portion 29 and two leg portions 31.
  • Fig. 6 shows an embodiment of a
  • Leadframe composite 33 during a method for
  • Lead frame assembly 33 may, for example, several
  • Lead frame 12 for correspondingly have a plurality of housing 2.
  • the lead frames 12 may be connected to each other in the lead frame assembly 33, for example via first webs 36 and / or second webs 38.
  • first webs 36 may connect the first leadframe sections 17 of adjacent leadframes 12.
  • free recesses 35 and / or contact recesses 34 may be formed.
  • the lead frame assembly 33 may be formed by etching and / or stamping, for example.
  • the contact recesses 34 may be formed so that they have inner walls which extend in the direction perpendicular to the first side of the lead frame 12, ie in Fig. 6 in the plane, and / or are extruded.
  • the lead frame composite 33 is coated with the second material.
  • first dividing lines 38 and second dividing lines 40 perpendicular thereto are shown in broken lines.
  • the The first separating lines 38 intersect the second separating lines 40.
  • the separating lines 38, 40 designate separating regions in which the individual lead frames 12 are separated and / or singulated when the housing 2 is separated from the housing composite.
  • the leadframe composite 33 can be cut or sawn along the parting lines 38, 40.
  • the contact recesses 34 may, for example, be formed and / or arranged such that they pass through the parting lines 38, 40
  • the contact recesses 34 can overlap crossing points of the separating lines 38, 34.
  • each one of the contact recesses 34 is divided into four adjacent leadframe 12.
  • four housings 2 each have one segment of one of the contact recesses.
  • four segments of four corresponding contact recesses 34 may have.
  • the parting surfaces 30 may arise which are not coated.
  • the inner walls of the contact recesses 34 are largely spaced from the dividing lines 38, 40 and remain intact when separated and are still coated with the second material.
  • the contact recesses 34 that the lead frame 12 are tapered after singulation in the contact portions 22.
  • the contact recesses 34 can thus contribute to the
  • FIG. 7 shows a plan view of a housing composite 41, which may have, for example, the leadframe composite 33 according to FIG. 6, which is embedded, for example, in the molding material 14.
  • the lead frame composite 33 can
  • the molding material 14 such be that the receiving areas 16, the contact areas 18, the contact recesses 22 and / or the terrace surfaces 20 are free of molding material.
  • the receiving areas 16, the contact areas 18, the contact recesses 22 and / or the terrace surfaces 20 are free of molding material.
  • Form material 14 recesses 39 whose area is greater than that of the contact recesses 34 and the
  • Recesses 39 are the terrace surfaces 20 and the
  • the lead frame portions 17, 19 are not cut or sawed in the formed by the contact recesses 34 contact portions 22, so that even after the separation in the contact portions 22, the second material to the corresponding
  • Contact recesses 34 and the recesses 39 may be formed in various embodiments at all crossing points of the dividing lines 38, 40, which may contribute, for example, that the lead frame sections 17, 19 are formed in the contact portions 22 U-shaped.
  • Fig. 8 shows a view of a first side 4 of a
  • Embodiment of a housing 2 for example, largely the previously explained in the housing 2
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the housing 2 can correspond.
  • the first leadframe section 17 may, for example, be L-shaped in the contact section 22 and / or a base section 29 and
  • leg portion 31 may form part of the first side of lead frame 12.
  • the leg portion 31 may, for example, include a 90 ° angle with the base portion 29 and / or may be perpendicular or substantially thereon.
  • the first lead frame section 17 and the molding material 14 may, for example, at the first
  • End face 10 may be planar and / or flush.
  • FIG. 9B shows a view of the second end face 11 of the housing 2 according to FIG. 8, which, for example, largely corresponds to the first end face 10 of the housing 2
  • Contact portion 22 on the second end face 11 of the second contact portion 19 L-shaped and / or has a base portion 29 and a leg portion 31.
  • FIG. 10 shows a plan view of an exemplary embodiment of a housing assembly 41, which has a plurality of housings 2, for example housing 2 according to FIG. 8, during one
  • Contact recesses 34 and the recesses 39 may in various embodiments along the first or second dividing lines 38, 40 only on every second
  • junction point be formed, which may for example contribute to the lead frame sections 17, 19 are formed in the contact portions 22 L-shaped.
  • FIG. 11 shows an exemplary embodiment of the housing 2 which for example largely corresponds to that shown in FIG.
  • Embodiment of the housing 2 may correspond.
  • the receiving recess 15 may be arranged eccentrically, for example, closer to the third side 8 of the housing 2 than on the second side 6 of the housing 2.
  • FIG. 12 shows an embodiment of an electronic assembly 46, for example, a housing 2 according to one of the above explained embodiments and / or an optoelectronic device 42 may have.
  • the optoelectronic component 42 may, for example, be arranged in the receiving region 16 and / or electrically
  • Component 42 for example in the contact area 18th
  • FIG. 13A shows an exemplary embodiment of an electronic subassembly which may, for example, comprise the electronic subassembly 46 according to FIG. 12 and a printed circuit board 50.
  • the printed circuit board 50 may, for example, conductor tracks 52
  • Connection 54 for example, a solder joint, with the lead frame portions 17, 19 of the housing 2 in the
  • the optoelectronic component 42 can be coupled. If the optoelectronic component 42 is a component emitting electromagnetic radiation, then the optoelectronic component 42 can radiate electromagnetic radiation 48 during operation, for example such that the electromagnetic radiation 48 is radiated substantially parallel to a surface of the printed circuit board 50. That the electromagnetic radiation 48 in the
  • May be substantially parallel to the surface of the printed circuit board 50 may mean, for example, that a main emission of the electromagnetic radiation 48, for example, parallel or at least substantially parallel to the conductor tracks 52 having surface of the circuit board 50.
  • the main emission direction may, for example, correspond to a straight line perpendicular to an active, the electromagnetic radiation 48 emitting, surface of the optoelectronic device 42 is.
  • the main emission direction may correspond to a direction of the electromagnetic radiation along an optical path along which the
  • electromagnetic radiation has the largest beam intensity.
  • FIG. 13B shows an exemplary embodiment of an electronic assembly 46, which for example can largely correspond to the electronic assembly 46 shown in FIG. 12 and / or FIG. 13A.
  • one, two, or more reflectors 56 may be arranged, for example, for reflecting the electromagnetic radiation 48
  • the electromagnetic radiation 48 may be bundled by means of the reflectors 56 and / or deflected away from the printed circuit board 50.
  • Reflectors 56 may, for example, in the manner of a
  • the reflective film may be formed reflective film.
  • the reflective film may be arranged flat, parallel to the surface of the printed circuit board 50 on the printed circuit board 50.
  • the reflective film may, for example, have a recess through which the housing 2 can protrude.
  • FIG. 14 shows a view of an exemplary embodiment of the first end face 10 of the housing 2, which, for example, can be designed substantially corresponding to the first end face 10 of one of the previously explained housing 2.
  • the housing 2 is arranged, for example, on the conductor track 52 of the printed circuit board 50, wherein the solder is not shown in FIG. 14 for reasons of better depiction.
  • the first leadframe section 17 On the fourth side 24 of the housing 2, the first leadframe section 17 has a cut surface 60, which is formed when the corresponding contact recess 34 is formed. The cut surface 60 is from the terrace surface 20
  • the cut surface 60 and the terrace surface 20 may be formed, for example, the same size.
  • the cut surface 60 and the terrace surface 20 both adjoin the side of the leg portion 31, that of the track 52 is facing. This side of the leg portion 31 and at least partially the cut surface 60 and the
  • Terrace surface 20 can when attaching and / or
  • the housing 2 are wetted with solder. If the cutting surface 60 and the terrace surface 20 are formed equal size, so act when wetting with solder equal large Benet tion forces on both surfaces 20, 60. This causes a uniform alignment and / or balancing of the housing 2 relative to the circuit board 50. Further for example, the orientation of the housing 2 relative to the circuit board 50 may be predetermined by varying the sizes of the two surfaces 20, 60 relative to one another.
  • FIG. 15 shows a flow diagram of an embodiment of a method for producing housings for
  • Optoelectronic components for example for producing one of the above-described housing 2, and / or an embodiment of a method for producing electronic assemblies, for example for producing one of the above-described electronic
  • a step S2 for example, a
  • Lead frame blank are provided, which is formed for example of a metal plate.
  • a lead frame composite can be produced, for example one of the above
  • the lead frame assembly 33 can be made for example from the lead frame blank by means of etching and / or punching. Of the
  • Leadframe composite 33 may be in a single etch or
  • Leadframe composite 33 are produced by a combination of one or more etching and / or stamping processes. In a step S6 contact recesses in the
  • Leadframe composite are made, for example, the contact recesses 34 in the lead frame assembly 33.
  • the contact recesses 34 may be formed for example by means of etching or punching.
  • steps S4 and S6 may be performed in one step, for example, in an etching process or in one
  • step S4
  • steps S4 and S6 may be performed sequentially
  • the contact recesses 34 may be formed, for example, so that their inner walls are extruded and / or stretched perpendicular to the first side of the lead frame 12, whereby, for example, the
  • Leg portions 31 can be formed.
  • the lead frame assembly 33 are coated, for example in a galvanic process.
  • the lead frame composite 33 is metallized.
  • step S8 the contact recesses 34 and their inner walls, and optionally the leg portions 31, are coated.
  • the coating can contribute to the fact that the lead frames 12 can be easily and reliably electrically contacted on their coated surfaces,
  • the lead frame composite can be embedded, for example, the lead frame composite 33 can be embedded in the molding material 14. This can be the
  • Lead frame assembly 33 are inserted into a mold, which is a negative mold of the later housing composite
  • the mold points when inlaid
  • Lead frame composite 33 for example, in the
  • Receiving areas 16 and in the contact areas 18 and in the area of the recesses 39 highlights and / or stamp so that these areas are free of molding material 14
  • the housing composite comprising the lead frame composite 33, for example one of the housing assemblies 41 explained above, can be removed from the molding tool
  • optoelectronic components can be arranged in the housings 2 of the housing assembly 41, for example in each case one, two or more of the housings
  • the above explained optoelectronic components 42 per housing 2.
  • the optoelectronic components 42 can be arranged for example in the receiving recesses 15 of the housing 2.
  • the optoelectronic components 42 can also be arranged after the housing 2 has been singulated in the housings 2.
  • step S14 may be executed before step S12.
  • the procedure can be ended.
  • the optoelectronic components 42 may be embedded in a potting material before or after the singulation of the housing 2. For example, after arranging
  • the potting material may comprise, for example, silicone, TIO 2 and / or a converter material for converting the electromagnetic radiation.
  • Components 42 are called.
  • the above-explained method can be used with arranging the
  • Optoelectronic device 42 as a method for
  • 33 may be formed in all embodiments in the lead frame assemblies 33 more or fewer webs.
  • Recesses 39 be shaped differently, for example
  • the receiving recesses 15 may be formed differently, for example, circular, rectangular or square.
  • the leadframe sections 17, 19 may be U-shaped or L-shaped in all embodiments, and / or the leg sections 31 may have an acute or obtuse angle with the corresponding base sections 29.
  • the receiving recesses 15 can also be arranged eccentrically,
  • the receiving recesses 15 may be arranged eccentrically so that they are arranged closer to one of the end faces 10, 11 than the other of the end faces 10, 11.
  • the lead frame sections 17, 19 may also be formed so that optoelectronic components 42 can be arranged, which have their two electrical contacts on the
  • each of the leadframes may comprise more than two leadframe sections 17, 19, for example one for arranging the optoelectronic devices and two for contacting the optoelectronic devices.
  • the method for producing the housing 2 may comprise more or fewer steps.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un boîtier (2) pour un composant optoélectronique (42). Le boîtier présente un cadre conducteur (12) et un matériau moulé (14). Le cadre conducteur (12) est formé d'un premier matériau électroconducteur et est revêtu d'un deuxième matériau électroconducteur. Le cadre conducteur (12) présente une première et une deuxième partie (17, 19) qui sont corporellement séparées l'une de l'autre. Sur un premier côté du cadre conducteur (12), la première partie (17) présente une zone de réception (16) pour disposer le composant optoélectronique (42) et la deuxième partie (19) présente une zone de contact (18) pour la mise en contact du composant optoélectronique (42). Le cadre conducteur (12) est incorporé dans le matériau moulé (14). Le matériau moulé (14) présente sur un premier côté (4) du boîtier (2) un évidement de réception (15) dans lequel la zone de réception (16) et la zone de contact (18) sont dénudées. La première partie (17) et la deuxième partie (19) du cadre conducteur présentent respectivement pour la mise en contact de la partie (17, 19) correspondante au moins une partie de contact (22) où les parties (17, 19) sont dénudées sur un deuxième côté (6) du boîtier (2) formant avec le premier côté (4) du boîtier (2) un bord du boîtier (2), s'effilent dans la direction perpendiculaire au deuxième côté (6) du boîtier (2) et sont revêtues du deuxième matériau.
PCT/EP2013/069503 2012-09-27 2013-09-19 Boîtier pour un composant optoélectronique, module électronique, procédé de fabrication de boîtiers et procédé de fabrication de modules électroniques WO2014048834A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012109139.0A DE102012109139A1 (de) 2012-09-27 2012-09-27 Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen
DE102012109139.0 2012-09-27

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WO2014048834A1 true WO2014048834A1 (fr) 2014-04-03

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JP2015220426A (ja) * 2014-05-21 2015-12-07 日亜化学工業株式会社 発光装置
JP2019054248A (ja) * 2018-09-19 2019-04-04 日亜化学工業株式会社 発光装置

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DE102014116133B4 (de) 2014-11-05 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelements und Verfahren zum Herstellen einer optoelektronischen Anordnung

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WO2008002068A1 (fr) * 2006-06-27 2008-01-03 Seoul Semiconductor Co., Ltd. Del à vue latérale
EP2071641A2 (fr) * 2007-12-10 2009-06-17 Everlight Electronics Co., Ltd. Paquet de diode électroluminescente
US20090196070A1 (en) * 2008-02-05 2009-08-06 Kyong Jun Kim Light emitting apparatus and light unit having the same
EP2325901A1 (fr) * 2008-09-03 2011-05-25 Nichia Corporation Dispositif émetteur de lumière, conditionnement de résine, corps moulé en résine et procédés de fabrication d'un dispositif émetteur de lumière, d'un conditionnement de résine et d'un corps moulé en résine

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JP2019054248A (ja) * 2018-09-19 2019-04-04 日亜化学工業株式会社 発光装置

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