WO2014041713A1 - Component mounting method and component mounting system - Google Patents

Component mounting method and component mounting system Download PDF

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Publication number
WO2014041713A1
WO2014041713A1 PCT/JP2013/001454 JP2013001454W WO2014041713A1 WO 2014041713 A1 WO2014041713 A1 WO 2014041713A1 JP 2013001454 W JP2013001454 W JP 2013001454W WO 2014041713 A1 WO2014041713 A1 WO 2014041713A1
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WO
WIPO (PCT)
Prior art keywords
solder
correction value
component
mounting
substrate
Prior art date
Application number
PCT/JP2013/001454
Other languages
French (fr)
Japanese (ja)
Inventor
中村　光男
伊藤　克彦
永井　大介
Original Assignee
パナソニック株式会社
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Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014041713A1 publication Critical patent/WO2014041713A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a component mounting method and a component mounting system for mounting a component by printing solder on an electrode of a substrate.
  • the component mounting system that prints solder on the board and mounts the parts on the board has a solder printing section that prints the solder on each electrode of the board, and the parts are mounted at the target mounting position on the board where the solder is printed by the solder printing section.
  • a component mounting portion is provided.
  • Some of such component mounting systems include a solder position detection unit that detects the position of each solder with respect to the electrodes by imaging the solder printed on each electrode of the substrate by the imaging unit using an imaging unit. (For example, patent document 1). Further, a corrected target mounting position obtained by calculating a correction value of the target mounting position of the component based on the position of each solder detected by the solder position detection unit and correcting the target mounting position with the calculated correction value.
  • the cause of the mounting failure is the solder position detection process in the solder position detection process and the correction value in the correction value calculation process. It is difficult to specify which of the calculation process and the component mounting process in the component mounting process. For this reason, there is a possibility that the production efficiency of the substrate is lowered due to a delay in the treatment for the mounting failure.
  • An object of the present invention is to provide a component mounting method and a component mounting system that can easily identify the cause of a mounting failure when a component mounting failure occurs on a board.
  • the component mounting method includes a solder printing process for printing solder on each electrode of a board, and detecting the position of the solder on the board by imaging the solder printed on the board in the solder printing process. Determining a relative positional relationship of the solder with respect to the corresponding electrode from the position of the solder on the substrate and the position of the electrode corresponding to the solder detected in the solder position detecting step A correction value calculating step of calculating a correction value of the target mounting position of the component based on the positional relationship, and a corrected target mounting position obtained by correcting the target mounting position with the correction value calculated in the correction value calculating step Calculated in a component mounting step of mounting the component on the substrate, a relative positional relationship of the solder obtained in the correction value calculation step with respect to the corresponding electrode, the target mounting position, and the correction value calculation step Based on the correction value, a display step for simultaneously displaying the direction of positional deviation of the solder with respect to the corresponding electrode and the correction direction of the target mounting position
  • a production program and data related to the component mounting unit for mounting the component at the corrected target mounting position are displayed, and the mounting failure is based on the displayed production program and data related to the component mounting unit. Judgment of the cause of the mounting failure of the component in which the occurrence of the failure occurs.
  • a component mounting system includes a solder printing unit that prints solder on each electrode of a board, and the position of the solder on the board by imaging the solder printed on the board by the solder printing unit.
  • a relative position relationship of the solder with respect to the corresponding electrode is obtained from the solder position detection unit to be detected, the position of the solder on the substrate detected by the solder position detection unit, and the position of the electrode corresponding to the solder.
  • a correction value calculation unit that calculates a correction value of the target mounting position of the component based on the relative positional relationship, and a corrected value obtained by correcting the target mounting position with the correction value calculated by the correction value calculation unit.
  • the component mounting unit that mounts the component at the target mounting position, the relative positional relationship of the solder obtained by the correction value calculation unit with respect to the corresponding electrode, the target mounting position, and the previous calculated by the correction value calculation unit Based on the correction value, and a display unit that displays the solder orientation of positional deviation with respect to the corresponding electrodes and orientation of the correction of the target mounting position by the correction value at the same time.
  • the direction of the positional deviation of each solder printed on the board with respect to the corresponding electrode and the direction of correction of the target mounting position of the component by the correction value are displayed at the same time, and when the mounting failure of the component on the board is found Is a process of detecting the position of the solder in the solder position detecting step, based on the direction of the positional deviation of each displayed solder with respect to the corresponding electrode and the direction of correction of the target mounting position based on the correction value. It is possible to easily identify the correction value calculation process in the correction value calculation process and the component mounting process in the component mounting process. For this reason, it is possible to quickly deal with the mounting failure, and it is possible to prevent the substrate production efficiency from being lowered.
  • the block diagram of the component mounting system in one embodiment of this invention The perspective view of the solder position detector which comprises the component mounting system in one embodiment of this invention
  • the block diagram which shows the control system of the solder position detector in one embodiment of this invention The top view of the board
  • substrate which the component mounting system in one embodiment of this invention makes object of component mounting 1 is a partially enlarged plan view of a board that is a component mounting target of a component mounting system according to an embodiment of the present invention;
  • the block diagram which shows the control system of the component mounting machine in one embodiment of this invention 1 is a partially enlarged plan view of a board that is a component mounting target of a component mounting system according to an embodiment of the present invention; (A), (b) and (c) are side views of the substrate for explaining the self-alignment effect in the component mounting system according to the embodiment of the present invention.
  • the component mounting system 1 shown in FIG. 1 prints solder Hd on the electrodes 3 of the substrate 2 and performs a component mounting operation for mounting the component 4 on the printed solder Hd.
  • the component mounting system 1 includes a solder printing machine 11, a solder position detector 12, a component mounting machine 13, and a reflow furnace 14 arranged in one direction (X-axis direction) in a horizontal plane in the following order.
  • a solder printer 11 carries in a substrate 2 input by an operator OP or from a substrate input device (not shown), positions it at a work position, and prints solder Hd on an electrode 3 provided on the substrate 2. Then, the substrate 2 is carried out to the solder position detector 12 on the downstream process side (solder printing process).
  • the solder position detector 12 is moved by a transport conveyor 22 that transports the substrate 2 on the base 21 in the X-axis direction, a head moving mechanism 23 composed of an orthogonal coordinate robot, and a head moving mechanism 23.
  • An inspection camera 24 is provided as an imaging means.
  • the head moving mechanism 23 includes a Y-axis table 23a provided on the base 21 extending in a horizontal plane direction (Y-axis direction) orthogonal to the X-axis direction, and extending in the X-axis direction, one end of which is a Y-axis table.
  • It has an X-axis table 23b provided on the X-axis table 23b so as to be movable in the Y-axis direction, and a moving stage 23c provided on the X-axis table 23b so as to be movable in the X-axis direction.
  • the inspection camera 24 is attached to the moving stage 23c with the imaging field of view directed downward.
  • the conveyance of the substrate 2 by the conveyor 22 and the positioning control to the working position, the movement control of the inspection camera 24 by the head moving mechanism 23, the imaging operation control of the inspection camera 24, and the imaging of the inspection camera 24 are performed.
  • Processing control of the image data obtained by the operation is performed by a detector control device 25 provided in the base 21.
  • the detector control device 25 When detecting that the substrate 2 has been sent from the solder printer 11, the detector control device 25 operates the conveyor 22 to carry in the substrate 2 and position it at a predetermined work position. Then, the detector control device 25 moves the inspection camera 24 to recognize the two marks m (FIGS. 2 and 4) provided at diagonal positions on the substrate 2, and the reference fixed to the substrate 2. Coordinates ( ⁇ coordinate system shown in FIG. 4) are set. Then, the detector control device 25 images the solder Hd (FIG. 5) printed on each electrode 3 of the substrate 2 by the solder printer 11, and the position (details) of each solder Hd with reference to the set ⁇ coordinate system. The position of the center PH of each solder Hd is detected (solder position detecting step).
  • the solder position detector 12 executes the solder position detection process, the solder position detector 12 carries the board 2 to the component mounting machine 13 on the downstream process side, and data on the position of each solder Hd on the board 2 detected in the solder position detection process. Is transmitted to the component mounting machine 13.
  • the component mounting machine 13 is moved on a base 31 by a transport conveyor 32 that transports the substrate 2 in the X-axis direction, a head moving mechanism 33 including a Cartesian coordinate robot, and a head moving mechanism 33.
  • the substrate camera 36 that is provided on the mounting head 34 and the imaging field of view is directed downward, and between the conveyor 32 and the parts feeder 35 on the base 31.
  • a component camera 37 is provided that has an imaging field of view directed upward.
  • the head moving mechanism 33 includes a Y-axis table 33a provided on the base 31 so as to extend in the Y-axis direction, and one end thereof is provided so as to be movable on the Y-axis table 33a in the Y-axis direction.
  • the mounting head 34 has a plurality of suction nozzles 34a extending downward and capable of moving in the vertical axis direction (Z-axis direction) and rotating around the Z axis. In the mounting head 34, the suction nozzle 34a picks up the component 4 that each of the parts feeders 35 supplies to the component supply port 35a.
  • the conveyance of the substrate 2 by the conveyance conveyor 32 and the positioning control to the working position, the movement control of the mounting head 34 by the head moving mechanism 33, the supply operation of the component 4 by each parts feeder 35 and the suction nozzle 34a The image obtained by the operation control of the suction mechanism 38 that performs the suction operation of the component 4 supplied by the parts feeder 35, the imaging operation control of the board camera 36 and the part camera 37, and the imaging operation of the board camera 36 and the part camera 37.
  • Data processing control is performed by a mounting machine control device 39 provided in the base 31.
  • the loading machine control device 39 When the mounting machine control device 39 detects that the substrate 2 has been sent from the solder position detector 12, the loading machine control device 39 operates the transport conveyor 32 to carry in the substrate 2 and position it at a predetermined work position.
  • the mounting machine control device 39 receives the position data of each solder Hd on the substrate 2 detected by the solder position detector 12 and sent from the detector control device 25, and receives the solder position storage unit 39a (FIG. 7).
  • the correction value calculation unit 39b (FIG. 7) stores the received position of each solder Hd on the substrate 2 and the electrode 3 corresponding to each solder Hd stored in the electrode position storage unit 39c (FIG. 7). The relative positional relationship of each solder Hd with respect to the electrode 3 is obtained from the position data.
  • the correction value calculation unit 39b calculates a correction value of the target mounting position M0 of the component 4 mounted on the board 2 based on the obtained relative positional relationship, and calculates the correction value of each calculated component 4 as a correction value. It is stored in the storage unit 39d (FIG. 7) (correction value calculation step).
  • the data of the target mounting position M0 of each component 4 is stored in the target mounting position storage unit 39e (FIG. 7) of the mounting machine control device 39.
  • the correction value of the target mounting position M0 for each component 4 is based on the ⁇ coordinate of the position of the center PH of each solder Hd with respect to the position of each center PD of the plurality of electrodes 3 to which the plurality of terminals of the component 4 are connected.
  • the positional deviation ( ⁇ , ⁇ ) that is, the positional deviation of each solder Hd with respect to the corresponding electrode 3 (see the enlarged view shown at the lower right in FIG.
  • the mounting machine control device 39 After executing the correction value calculation step, the mounting machine control device 39 recognizes the two marks m (FIGS. 6 and 4) provided on the substrate 2 by the substrate camera 36 and is fixed to the substrate 2. Set the reference coordinates (the aforementioned ⁇ coordinates). Then, the mounting machine control device 39 corrects the target mounting position M0 with the correction value calculated in the correction value calculating step, and mounts the component 4 on the corrected target mounting position M1 (FIG. 8) obtained thereby (component). Mounting process).
  • the component mounting machine 13 carries out the substrate 2 to the reflow furnace 14 on the downstream process side after executing the component mounting process.
  • the reflow furnace 14 reflows the solder Hd on the substrate 2 with respect to the substrate received from the component mounting machine 13 (solder reflow process).
  • solder reflow process the component mounting machine 13 mounts the component 4 so that the terminal 4a contacts the position of the solder Hd printed on the substrate 2 (FIG. 9A). Therefore, the self-alignment effect is exhibited by the flow of the solder Hd during reflow of the solder Hd (arrow A shown in FIG. 9B), and the component 4 is mounted at the target mounting position M0 (FIG. 9C). ).
  • the display control unit 39f (FIG. 7) of the mounting machine control device 39 obtains the correction value calculation step when there is a predetermined input operation by the operator OP from the input device 40 (FIG. 7) connected to the mounting machine control device 39.
  • Data on the relative positional relationship of each solder Hd with respect to the electrode 3 position data of each electrode 3 on the substrate 2 stored in the electrode position storage section 39c and position data of each solder Hd stored in the solder position storage section 39a
  • target Based on the data of the target mounting position M0 of each component 4 stored in the mounting position storage unit 39e and the correction value data of each component 4 calculated in the correction value calculation process and stored in the correction value storage unit 39d.
  • a screen GM (FIG.
  • the outer shape of the electrode 3, the target mounting position M0, and the outer shape of the component 4 when the component 4 is mounted at the target mounting position M0 are indicated by thin lines.
  • the outer shape of the solder Hd printed on the substrate 2, the corrected target mounting position M1, and the external shape of the component 4 when the component 4 is mounted at the corrected target mounting position M1 are shown. Shown in bold lines.
  • the screen GM shows arrows V1, V2, V3, V4 from the position of the center PD of the electrode 3 to the position of the center PH of the solder Hd so that the direction of the positional deviation of the solder Hd with respect to the electrode 3 can be seen.
  • the screen GM shows an arrow R from the target mounting position M0 to the corrected target mounting position M1 so that the correction direction of the target mounting position M0 of the component 4 based on the correction value can be seen.
  • the screen GM shown in FIG. 10 shows arrows V1, V2, V3, V4 indicating the direction of misalignment of the solder Hd with respect to the electrode 3, and an arrow R indicating the direction of correction of the target mounting position M0.
  • the lines in the screen GM are color-coded to print the outer shape of the electrode 3, the target mounting position M0, the outer shape of the component 4 when the component 4 is mounted at the target mounting position M0, and each electrode 3. If the outer shape of the solder Hd, the corrected target mounting position M1, and the outer shape of the component 4 when the component 4 is mounted at the corrected target mounting position M1, can be clearly shown in FIG.
  • the arrows V1, V2, V3, V4 indicating the direction of misalignment of the solder Hd with respect to each electrode 3 and the arrow R indicating the correction direction of the target mounting position M0 can be omitted. Further, as shown in FIG. 12, the outer shape of the electrode 3 and the target mounting position M0, and arrows V1, V2, V3, V4 indicating the direction of the positional deviation of the solder Hd with respect to each electrode 3 and the target mounting position M0 are corrected. Only the arrow R indicating the direction may be shown.
  • the screen GM displayed on the display device 41 is based on the relative positional relationship of each solder Hd obtained in the correction value calculation process with respect to the corresponding electrode 3, the target mounting position M0, and the correction value calculated in the correction value calculation process.
  • the display format is not particularly limited as long as the direction of displacement of each solder Hd with respect to the corresponding electrode 3 and the direction of correction of the target mounting position M0 by the correction value are displayed simultaneously.
  • the operator OP of the component mounting system 1 picks up the board 2 and inspects the mounting state of the parts 4.
  • the operator OP visually checks whether or not the component 4 is mounted at the original (before correction) target mounting position M0, and the mounting is not performed at the target mounting position M0.
  • an input operation is performed from the input device 40 described above.
  • the operator OP simultaneously displays the screen GM indicating the direction of the positional deviation of each solder Hd from the electrode 3 and the correction direction of the target mounting position M0 based on the correction value on the component 4 having the mounting failure. 41 is displayed.
  • the operator OP detects the position of the solder Hd in the solder position detection process performed by the solder position detector 12 and causes the component 4 to be defective. It is determined which of the correction value calculation process in the correction value calculation process performed by the machine 13 and the component mounting process in the component mounting process performed by the component mounting machine 13 has a problem (determination process). In this determination step, the operator OP determines that there is a problem in the detection process of the position of the solder Hd unless the direction of the positional deviation of each solder Hd is the same, and the direction of the positional deviation of the solder Hd is the same.
  • the display control unit 39f responds to an input operation from the input device 40, and the production program and data related to the component mounting unit that mounts the component 4 on the corrected target mounting position M1 on the display device 41, that is, the component mounting machine 13. Is displayed. For this reason, the operator OP determines the cause of the mounting failure for the component 4 in which the mounting failure has occurred (specifically, the component mounting step) based on the production program and data regarding the component mounting machine 13 displayed on the display device 41. It is possible to determine which part has caused the cause during execution.
  • the component mounting system 1 is printed on the board 2 by the solder printer 11 (solder printing unit) that prints the solder Hd on each electrode 3 of the board 2.
  • a solder position detector 12 solder position detector
  • a component mounting unit component mounting machine that mounts the component 4 at the corrected target mounting position M1 obtained by correcting the target mounting position M0 of the component 4 with the correction value calculated by the value calculation unit 39b and the correction value calculation unit 39b.
  • a display device 41 is provided as a display unit that simultaneously displays the direction of displacement with respect to the electrode 3 and the direction of correction of the target mounting position M0 by the correction value.
  • the component mounting method by the component mounting system 1 includes a solder printing process in which solder Hd is printed on each electrode 3 of the board 2, and images of the solder Hd printed on the board 2 in the solder printing process.
  • a solder position detecting step for detecting the position of the solder Hd, a position of each solder Hd on the substrate 2 detected in the solder position detecting step, and a position of the electrode 3 corresponding to each solder Hd relative to the corresponding electrode 3 of each solder Hd.
  • a positional relationship is obtained, a correction value calculating step for calculating a correction value for the target mounting position M0 of the component 4 based on the obtained relative positional relationship, and the target mounting position M0 is corrected with the correction value calculated in the correction value calculating step.
  • the cause of the mounting failure of the component 4 in which mounting failure has occurred after execution of the component mounting process based on the direction of displacement of each solder Hd with respect to the corresponding electrode 3 and the correction direction of the target mounting position based on the correction value. Includes a determination step of determining which of the position detection process of each solder Hd in the solder position detection step, the correction value calculation step in the correction value calculation step, and the component 4 mounting step in the component mounting step.
  • the target mounting position based on the direction of displacement and the correction value of each solder Hd printed on the substrate 2 with respect to the corresponding electrode 3.
  • the target mounting position based on the direction of the positional deviation of the displayed solder Hd with respect to the corresponding electrode 3 and the correction value.
  • the cause of the mounting failure is the detection process of the position of the solder Hd in the solder position detection process, the calculation process of the correction value in the correction value calculation process, and the mounting process of the component 4 in the component mounting process. It is possible to easily identify where it is. For this reason, it is possible to quickly deal with the mounting failure, and it is possible to prevent the production efficiency of the substrate 2 from being lowered.
  • a component mounting method and a component mounting system that can easily identify the cause of a mounting failure when a component mounting failure occurs on a board.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

In the present invention, on the basis of a relative positional relationship with respect to an electrode corresponding to solder on a substrate, a target fitting position of a component, and a correction value for the target fitting position, the orientation of positional displacement with respect to the electrode corresponding to the solder and the orientation of the correction of the target fitting position according to the correction value are　simultaneously displayed on a display device. It is determined, for a component in which a fitting defect has occurred after component fitting, whether the cause of the fitting defect is in the process for detecting the position of the solder, the process for calculating the correction value, or the process for fitting the component.

Description

部品実装方法及び部品実装システムComponent mounting method and component mounting system
　本発明は、基板の電極に半田を印刷して部品を装着する部品実装方法及び部品実装システムに関するものである。 The present invention relates to a component mounting method and a component mounting system for mounting a component by printing solder on an electrode of a substrate.
　基板上に半田を印刷して部品を装着する部品実装システムは、基板の各電極に半田を印刷する半田印刷部と、半田印刷部により半田が印刷された基板上の目標装着位置に部品を装着する部品装着部を備える。このような部品実装システムの中には、半田印刷部で基板の各電極に印刷された半田を撮像手段により撮像して各半田の電極に対する位置を検出する半田位置検出部を備えたものがある（例えば特許文献１）。更には、半田位置検出部で検出された各半田の位置に基づいて部品の目標装着位置の補正値を算出し、その算出した補正値で目標装着位置を補正して得られる補正後の目標装着位置に部品を装着するようにしたタイプの部品実装システムも知られている。この装着位置補正タイプの部品実装システムでは、部品装着の実行後の半田リフロー時における半田の溶融に伴うセルフアライメント効果によって部品が本来の（補正前の）目標装着位置に移動するので、基板上の正確な位置への部品の装着が可能である（例えば特許文献２）。 The component mounting system that prints solder on the board and mounts the parts on the board has a solder printing section that prints the solder on each electrode of the board, and the parts are mounted at the target mounting position on the board where the solder is printed by the solder printing section. A component mounting portion is provided. Some of such component mounting systems include a solder position detection unit that detects the position of each solder with respect to the electrodes by imaging the solder printed on each electrode of the substrate by the imaging unit using an imaging unit. (For example, patent document 1). Further, a corrected target mounting position obtained by calculating a correction value of the target mounting position of the component based on the position of each solder detected by the solder position detection unit and correcting the target mounting position with the calculated correction value. There is also known a component mounting system in which a component is mounted at a position. In this mounting position correction type component mounting system, the component moves to the original (before correction) target mounting position due to the self-alignment effect caused by the melting of solder during solder reflow after component mounting. The component can be mounted at an accurate position (for example, Patent Document 2).
日本国特開２００７－２７１６３８号公報Japanese Unexamined Patent Publication No. 2007-271638 日本国特開２００８－７２０３４号公報Japanese Unexamined Patent Publication No. 2008-72034
　上記従来の装着位置補正タイプの部品実装システムでは、基板に対する部品の装着不良が発生した場合、その装着不良の原因が、半田位置検出工程における半田の位置の検出過程、補正値算出工程における補正値の算出過程、及び部品装着工程における部品の装着過程のいずれにあるのかを特定することが困難である。このため、装着不良に対する処置が遅れて基板の生産効率が低下するおそれがある。 In the conventional mounting position correction type component mounting system described above, when a component mounting failure occurs on the board, the cause of the mounting failure is the solder position detection process in the solder position detection process and the correction value in the correction value calculation process. It is difficult to specify which of the calculation process and the component mounting process in the component mounting process. For this reason, there is a possibility that the production efficiency of the substrate is lowered due to a delay in the treatment for the mounting failure.
　本発明の目的は、基板に対する部品の装着不良が発生した場合に、その装着不良の原因を容易に特定することができる部品実装方法及び部品実装システムを提供することである。 An object of the present invention is to provide a component mounting method and a component mounting system that can easily identify the cause of a mounting failure when a component mounting failure occurs on a board.
　本発明に係る部品実装方法は、基板の各電極に半田を印刷する半田印刷工程と、前記半田印刷工程で前記基板に印刷した前記半田を撮像することにより前記基板上の前記半田の位置を検出する半田位置検出工程と、前記半田位置検出工程で検出した前記基板上の前記半田の位置と前記半田に対応する電極の位置から前記半田の対応する電極に対する相対位置関係を求め、その求めた相対位置関係に基づいて部品の目標装着位置の補正値を算出する補正値算出工程と、前記補正値算出工程で算出した前記補正値で前記目標装着位置を補正して得られる補正後の目標装着位置に前記部品を装着する部品装着工程と、前記補正値算出工程で求めた前記半田の対応する電極に対する相対位置関係、前記目標装着位置、及び前記補正値算出工程で算出した前記補正値に基づいて、前記半田の対応する電極に対する位置ずれの向き及び前記補正値による前記目標装着位置の補正の向きを同時に表示する表示工程と、前記表示工程で表示した前記半田の対応する電極に対する位置ずれの向き及び前記補正値による前記目標装着位置の補正の向きに基づいて、前記部品装着工程の実行後に装着不良が発生している部品について、その装着不良の原因が前記半田位置検出工程における前記半田の位置の検出過程、前記補正値算出工程における前記補正値の算出過程、及び前記部品装着工程における前記部品の装着過程のいずれにあるかの判断を行う判断工程とを含む。 The component mounting method according to the present invention includes a solder printing process for printing solder on each electrode of a board, and detecting the position of the solder on the board by imaging the solder printed on the board in the solder printing process. Determining a relative positional relationship of the solder with respect to the corresponding electrode from the position of the solder on the substrate and the position of the electrode corresponding to the solder detected in the solder position detecting step A correction value calculating step of calculating a correction value of the target mounting position of the component based on the positional relationship, and a corrected target mounting position obtained by correcting the target mounting position with the correction value calculated in the correction value calculating step Calculated in a component mounting step of mounting the component on the substrate, a relative positional relationship of the solder obtained in the correction value calculation step with respect to the corresponding electrode, the target mounting position, and the correction value calculation step Based on the correction value, a display step for simultaneously displaying the direction of positional deviation of the solder with respect to the corresponding electrode and the correction direction of the target mounting position based on the correction value, and the correspondence of the solder displayed in the display step Based on the direction of displacement with respect to the electrode to be performed and the direction of correction of the target mounting position based on the correction value, the component of the mounting failure after the execution of the component mounting process is caused by the solder position. A determination step of determining which of the solder position detection step in the detection step, the correction value calculation step in the correction value calculation step, and the component mounting step in the component mounting step.
　上記部品実装方法では、前記補正後の目標装着位置に前記部品を装着する部品装着部に関する生産プログラム及びデータを表示し、その表示した前記部品装着部に関する生産プログラム及びデータに基づいて、前記装着不良が発生している部品についての前記装着不良の原因の判断を行う。 In the component mounting method, a production program and data related to the component mounting unit for mounting the component at the corrected target mounting position are displayed, and the mounting failure is based on the displayed production program and data related to the component mounting unit. Judgment of the cause of the mounting failure of the component in which the occurrence of the failure occurs.
　本発明に係る部品実装システムは、基板の各電極に半田を印刷する半田印刷部と、前記半田印刷部で前記基板に印刷された前記半田を撮像することにより前記基板上の前記半田の位置を検出する半田位置検出部と、前記半田位置検出部で検出された前記基板上の前記半田の位置と前記半田に対応する電極の位置から前記半田の対応する電極に対する相対位置関係を求め、その求めた相対位置関係に基づいて部品の目標装着位置の補正値を算出する補正値算出部と、前記補正値算出部で算出された前記補正値で前記目標装着位置を補正して得られる補正後の目標装着位置に部品を装着する部品装着部と、前記補正値算出部で求められた前記半田の対応する電極に対する相対位置関係、前記目標装着位置、及び前記補正値算出部で算出された前記補正値に基づいて、前記半田の対応する電極に対する位置ずれの向き及び前記補正値による前記目標装着位置の補正の向きを同時に表示する表示部とを備えた。 A component mounting system according to the present invention includes a solder printing unit that prints solder on each electrode of a board, and the position of the solder on the board by imaging the solder printed on the board by the solder printing unit. A relative position relationship of the solder with respect to the corresponding electrode is obtained from the solder position detection unit to be detected, the position of the solder on the substrate detected by the solder position detection unit, and the position of the electrode corresponding to the solder. A correction value calculation unit that calculates a correction value of the target mounting position of the component based on the relative positional relationship, and a corrected value obtained by correcting the target mounting position with the correction value calculated by the correction value calculation unit The component mounting unit that mounts the component at the target mounting position, the relative positional relationship of the solder obtained by the correction value calculation unit with respect to the corresponding electrode, the target mounting position, and the previous calculated by the correction value calculation unit Based on the correction value, and a display unit that displays the solder orientation of positional deviation with respect to the corresponding electrodes and orientation of the correction of the target mounting position by the correction value at the same time.
　本発明では、基板上に印刷した各半田の対応する電極に対する位置ずれの向き及び補正値による部品の目標装着位置の補正の向きが同時に表示され、基板に対する部品の装着不良が発見された場合には、その表示された各半田の対応する電極に対する位置ずれの向き及び補正値による目標装着位置の補正の向きに基づいて、装着不良の原因が、半田位置検出工程における半田の位置の検出過程、補正値算出工程における補正値の算出過程、及び部品装着工程における部品の装着過程のいずれにあるのかを容易に特定することができる。このため、装着不良に対する処置を迅速に行うことができ、基板の生産効率が低下することを防止することができる。 In the present invention, the direction of the positional deviation of each solder printed on the board with respect to the corresponding electrode and the direction of correction of the target mounting position of the component by the correction value are displayed at the same time, and when the mounting failure of the component on the board is found Is a process of detecting the position of the solder in the solder position detecting step, based on the direction of the positional deviation of each displayed solder with respect to the corresponding electrode and the direction of correction of the target mounting position based on the correction value. It is possible to easily identify the correction value calculation process in the correction value calculation process and the component mounting process in the component mounting process. For this reason, it is possible to quickly deal with the mounting failure, and it is possible to prevent the substrate production efficiency from being lowered.
本発明の一実施の形態における部品実装システムの構成図The block diagram of the component mounting system in one embodiment of this invention 本発明の一実施の形態における部品実装システムを構成する半田位置検出機の斜視図The perspective view of the solder position detector which comprises the component mounting system in one embodiment of this invention 本発明の一実施の形態における半田位置検出機の制御系統を示すブロック図The block diagram which shows the control system of the solder position detector in one embodiment of this invention 本発明の一実施の形態における部品実装システムが部品実装の対象とする基板の平面図The top view of the board | substrate which the component mounting system in one embodiment of this invention makes object of component mounting 本発明の一実施の形態における部品実装システムが部品実装の対象とする基板の部分拡大平面図1 is a partially enlarged plan view of a board that is a component mounting target of a component mounting system according to an embodiment of the present invention; 本発明の一実施の形態における部品実装システムを構成する部品装機部の斜視図The perspective view of the component equipment part which comprises the component mounting system in one embodiment of this invention 本発明の一実施の形態における部品装着機の制御系統を示すブロック図The block diagram which shows the control system of the component mounting machine in one embodiment of this invention 本発明の一実施の形態における部品実装システムが部品実装の対象とする基板の部分拡大平面図1 is a partially enlarged plan view of a board that is a component mounting target of a component mounting system according to an embodiment of the present invention; （ａ）、（ｂ）及び（ｃ）は本発明の一実施の形態における部品実装システムにおけるセルフアライメント効果を説明する基板の側面図(A), (b) and (c) are side views of the substrate for explaining the self-alignment effect in the component mounting system according to the embodiment of the present invention. 本発明の一実施の形態における部品実装システムが備える表示装置が表示する画面の一例を示す図The figure which shows an example of the screen which the display apparatus with which the component mounting system in one embodiment of this invention has is displayed 本発明の一実施の形態における表示装置が表示する画面の一例を示す図The figure which shows an example of the screen which the display apparatus in one embodiment of this invention displays 本発明の一実施の形態における表示装置が表示する画面の一例を示す図The figure which shows an example of the screen which the display apparatus in one embodiment of this invention displays
　以下、図面を参照して本発明の実施の形態について説明する。図１に示す部品実装システム１は、基板２の電極３に半田Ｈｄを印刷し、その印刷した半田Ｈｄ上に部品４を装着する部品実装作業を行う。部品実装システム１は、水平面内の一の方向（Ｘ軸方向とする）に下記順で並べられた半田印刷機１１、半田位置検出機１２、部品装着機１３、及びリフロー炉１４を備える。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The component mounting system 1 shown in FIG. 1 prints solder Hd on the electrodes 3 of the substrate 2 and performs a component mounting operation for mounting the component 4 on the printed solder Hd. The component mounting system 1 includes a solder printing machine 11, a solder position detector 12, a component mounting machine 13, and a reflow furnace 14 arranged in one direction (X-axis direction) in a horizontal plane in the following order.
　図１において、半田印刷機１１は、オペレータＯＰによって或いは図示しない基板投入装置から投入された基板２を搬入して作業位置へ位置決めし、基板２に設けられた電極３上に半田Ｈｄの印刷を施して基板２を下流工程側の半田位置検出機１２に搬出する（半田印刷工程）。 In FIG. 1, a solder printer 11 carries in a substrate 2 input by an operator OP or from a substrate input device (not shown), positions it at a work position, and prints solder Hd on an electrode 3 provided on the substrate 2. Then, the substrate 2 is carried out to the solder position detector 12 on the downstream process side (solder printing process).
　半田位置検出機１２は、図２に示すように、基台２１上に基板２をＸ軸方向に搬送する搬送コンベア２２、直交座標ロボットから成るヘッド移動機構２３、及びヘッド移動機構２３によって移動される撮像手段としての検査カメラ２４を備える。ヘッド移動機構２３は、基台２１上をＸ軸方向と直交する水平面内方向（Ｙ軸方向とする）に延びて設けられたＹ軸テーブル２３ａ、Ｘ軸方向に延びてその一端がＹ軸テーブル２３ａ上をＹ軸方向に移動自在に設けられたＸ軸テーブル２３ｂ、及びＸ軸テーブル２３ｂ上をＸ軸方向に移動自在に設けられた移動ステージ２３ｃを有する。検査カメラ２４は、撮像視野が下方に向けた状態で移動ステージ２３ｃに取り付けられている。 As shown in FIG. 2, the solder position detector 12 is moved by a transport conveyor 22 that transports the substrate 2 on the base 21 in the X-axis direction, a head moving mechanism 23 composed of an orthogonal coordinate robot, and a head moving mechanism 23. An inspection camera 24 is provided as an imaging means. The head moving mechanism 23 includes a Y-axis table 23a provided on the base 21 extending in a horizontal plane direction (Y-axis direction) orthogonal to the X-axis direction, and extending in the X-axis direction, one end of which is a Y-axis table. It has an X-axis table 23b provided on the X-axis table 23b so as to be movable in the Y-axis direction, and a moving stage 23c provided on the X-axis table 23b so as to be movable in the X-axis direction. The inspection camera 24 is attached to the moving stage 23c with the imaging field of view directed downward.
　図３に示すように、搬送コンベア２２による基板２の搬送及び作業位置への位置決め制御、ヘッド移動機構２３による検査カメラ２４の移動制御、検査カメラ２４の撮像動作制御、並びに、検査カメラ２４の撮像動作によって得られた画像データの処理制御は、基台２１内に設けられた検出機制御装置２５によって行われる。 As shown in FIG. 3, the conveyance of the substrate 2 by the conveyor 22 and the positioning control to the working position, the movement control of the inspection camera 24 by the head moving mechanism 23, the imaging operation control of the inspection camera 24, and the imaging of the inspection camera 24 are performed. Processing control of the image data obtained by the operation is performed by a detector control device 25 provided in the base 21.
　検出機制御装置２５は、半田印刷機１１から基板２が送られてきたことを検知したら、搬送コンベア２２を作動させて基板２の搬入を行い、所定の作業位置に位置決めする。そして、検出機制御装置２５は、検査カメラ２４を移動させて、基板２上の対角位置に設けられた２つのマークｍ（図２及び図４）を認識し、基板２に固定された基準座標（図４に示すεη座標系）を設定する。そして、検出機制御装置２５は、半田印刷機１１によって基板２の各電極３に印刷された半田Ｈｄ（図５）の撮像を行い、設定したεη座標系を基準として各半田Ｈｄの位置（詳細には各半田Ｈｄの中心ＰＨの位置）を検出する（半田位置検出工程）。 When detecting that the substrate 2 has been sent from the solder printer 11, the detector control device 25 operates the conveyor 22 to carry in the substrate 2 and position it at a predetermined work position. Then, the detector control device 25 moves the inspection camera 24 to recognize the two marks m (FIGS. 2 and 4) provided at diagonal positions on the substrate 2, and the reference fixed to the substrate 2. Coordinates (εη coordinate system shown in FIG. 4) are set. Then, the detector control device 25 images the solder Hd (FIG. 5) printed on each electrode 3 of the substrate 2 by the solder printer 11, and the position (details) of each solder Hd with reference to the set εη coordinate system. The position of the center PH of each solder Hd is detected (solder position detecting step).
　半田位置検出機１２は、上記半田位置検出工程を実行したら、基板２を下流工程側の部品装着機１３に搬出するとともに、半田位置検出工程で検出した基板２上の各半田Ｈｄの位置のデータを部品装着機１３に送信する。 When the solder position detector 12 executes the solder position detection process, the solder position detector 12 carries the board 2 to the component mounting machine 13 on the downstream process side, and data on the position of each solder Hd on the board 2 detected in the solder position detection process. Is transmitted to the component mounting machine 13.
　部品装着機１３は、図６に示すように、基台３１上に、基板２をＸ軸方向に搬送する搬送コンベア３２、直交座標ロボットから成るヘッド移動機構３３、ヘッド移動機構３３によって移動される装着ヘッド３４、部品４の供給を行う複数のパーツフィーダ３５、装着ヘッド３４に設けられ撮像視野が下方に向けられた基板カメラ３６、及び基台３１上の搬送コンベア３２とパーツフィーダ３５の間に設けられ撮像視野が上方に向けられた部品カメラ３７を備える。 As shown in FIG. 6, the component mounting machine 13 is moved on a base 31 by a transport conveyor 32 that transports the substrate 2 in the X-axis direction, a head moving mechanism 33 including a Cartesian coordinate robot, and a head moving mechanism 33. The mounting head 34, a plurality of parts feeders 35 that supply the components 4, the substrate camera 36 that is provided on the mounting head 34 and the imaging field of view is directed downward, and between the conveyor 32 and the parts feeder 35 on the base 31. A component camera 37 is provided that has an imaging field of view directed upward.
　ヘッド移動機構３３は、基台３１上にＹ軸方向に延びて設けられたＹ軸テーブル３３ａ、Ｘ軸方向に延びてその一端がＹ軸テーブル３３ａ上をＹ軸方向に移動自在に設けられたＸ軸テーブル３３ｂ、及びＸ軸テーブル３３ｂ上をＸ軸方向に移動自在に設けられた移動ステージ３３ｃから成る。装着ヘッド３４は、下方に延びて上下軸方向（Ｚ軸方向とする）への移動及びＺ軸回りの回転動作が可能な複数の吸着ノズル３４ａを有する。装着ヘッド３４では、各パーツフィーダ３５が部品供給口３５ａに供給する部品４を吸着ノズル３４ａがピックアップする。 The head moving mechanism 33 includes a Y-axis table 33a provided on the base 31 so as to extend in the Y-axis direction, and one end thereof is provided so as to be movable on the Y-axis table 33a in the Y-axis direction. An X-axis table 33b and a moving stage 33c provided on the X-axis table 33b so as to be movable in the X-axis direction. The mounting head 34 has a plurality of suction nozzles 34a extending downward and capable of moving in the vertical axis direction (Z-axis direction) and rotating around the Z axis. In the mounting head 34, the suction nozzle 34a picks up the component 4 that each of the parts feeders 35 supplies to the component supply port 35a.
　図７に示すように、搬送コンベア３２による基板２の搬送及び作業位置への位置決め制御、ヘッド移動機構３３による装着ヘッド３４の移動制御、各パーツフィーダ３５による部品４の供給動作及び吸着ノズル３４ａにパーツフィーダ３５が供給する部品４の吸着動作を行わせる吸着機構３８の作動制御、基板カメラ３６及び部品カメラ３７の撮像動作制御、並びに、基板カメラ３６及び部品カメラ３７の撮像動作によって得られた画像データの処理制御は、基台３１内に設けられた装着機制御装置３９によって行われる。 As shown in FIG. 7, the conveyance of the substrate 2 by the conveyance conveyor 32 and the positioning control to the working position, the movement control of the mounting head 34 by the head moving mechanism 33, the supply operation of the component 4 by each parts feeder 35 and the suction nozzle 34a The image obtained by the operation control of the suction mechanism 38 that performs the suction operation of the component 4 supplied by the parts feeder 35, the imaging operation control of the board camera 36 and the part camera 37, and the imaging operation of the board camera 36 and the part camera 37. Data processing control is performed by a mounting machine control device 39 provided in the base 31.
　装着機制御装置３９は、半田位置検出機１２から基板２が送られてきたことを検知したら、搬送コンベア３２を作動させて基板２の搬入を行い、所定の作業位置に位置決めする。そして、装着機制御装置３９では、半田位置検出機１２で検出され、検出機制御装置２５から送られてきた基板２上の各半田Ｈｄの位置のデータを受け取って半田位置記憶部３９ａ（図７）に格納する一方、補正値算出部３９ｂ（図７）は、受け取った基板２上の各半田Ｈｄの位置と電極位置記憶部３９ｃ（図７）が記憶する各半田Ｈｄに対応する電極３の位置のデータから、各半田Ｈｄの電極３に対する相対位置関係を求める。そして、補正値算出部３９ｂは、求めた相対位置関係に基づいて基板２上に装着される部品４の目標装着位置Ｍ０の補正値を算出し、その算出した各部品４の補正値を補正値記憶部３９ｄ（図７）に格納する（補正値算出工程）。 When the mounting machine control device 39 detects that the substrate 2 has been sent from the solder position detector 12, the loading machine control device 39 operates the transport conveyor 32 to carry in the substrate 2 and position it at a predetermined work position. The mounting machine control device 39 receives the position data of each solder Hd on the substrate 2 detected by the solder position detector 12 and sent from the detector control device 25, and receives the solder position storage unit 39a (FIG. 7). The correction value calculation unit 39b (FIG. 7) stores the received position of each solder Hd on the substrate 2 and the electrode 3 corresponding to each solder Hd stored in the electrode position storage unit 39c (FIG. 7). The relative positional relationship of each solder Hd with respect to the electrode 3 is obtained from the position data. Then, the correction value calculation unit 39b calculates a correction value of the target mounting position M0 of the component 4 mounted on the board 2 based on the obtained relative positional relationship, and calculates the correction value of each calculated component 4 as a correction value. It is stored in the storage unit 39d (FIG. 7) (correction value calculation step).
　ここで、各部品４の目標装着位置Ｍ０のデータは、装着機制御装置３９の目標装着位置記憶部３９ｅ（図７）に格納されている。各部品４についての目標装着位置Ｍ０の補正値は、その部品４が有する複数の端子が接続される複数の電極３の各中心ＰＤの位置に対する各半田Ｈｄの中心ＰＨの位置のεη座標を基準とした位置ずれ（Δε，Δη）、すなわち各半田Ｈｄの対応する電極３に対する位置ずれ（図８中の右下方に示す拡大図参照）を求めたうえで、各半田Ｈｄの位置ずれのε軸方向及びη軸方向の各平均値（ａｖε，ａｖη）（図８中の左下方に示す拡大図参照）を算出することによって求められる。 Here, the data of the target mounting position M0 of each component 4 is stored in the target mounting position storage unit 39e (FIG. 7) of the mounting machine control device 39. The correction value of the target mounting position M0 for each component 4 is based on the εη coordinate of the position of the center PH of each solder Hd with respect to the position of each center PD of the plurality of electrodes 3 to which the plurality of terminals of the component 4 are connected. The positional deviation (Δε, Δη), that is, the positional deviation of each solder Hd with respect to the corresponding electrode 3 (see the enlarged view shown at the lower right in FIG. 8) is obtained, and the ε axis of the positional deviation of each solder Hd It calculates | requires by calculating each average value (av (epsilon), av (eta)) (refer the enlarged view shown in the lower left in FIG. 8) of a direction and (eta) -axis direction.
　装着機制御装置３９は、上記補正値算出工程を実行したら、基板カメラ３６によって基板２上に設けられた前述の２つのマークｍ（図６及び図４）を認識し、基板２に固定された基準座標（前述のεη座標）を設定する。そして、装着機制御装置３９は、補正値算出工程で算出した補正値で目標装着位置Ｍ０を補正し、これにより得られる補正後の目標装着位置Ｍ１（図８）に部品４を装着する（部品装着工程）。 After executing the correction value calculation step, the mounting machine control device 39 recognizes the two marks m (FIGS. 6 and 4) provided on the substrate 2 by the substrate camera 36 and is fixed to the substrate 2. Set the reference coordinates (the aforementioned εη coordinates). Then, the mounting machine control device 39 corrects the target mounting position M0 with the correction value calculated in the correction value calculating step, and mounts the component 4 on the corrected target mounting position M1 (FIG. 8) obtained thereby (component). Mounting process).
　部品装着機１３は、上記部品装着工程を実行したら、基板２を下流工程側のリフロー炉１４に搬出する。 The component mounting machine 13 carries out the substrate 2 to the reflow furnace 14 on the downstream process side after executing the component mounting process.
　リフロー炉１４は、部品装着機１３から受け取った基板に対して基板２上の半田Ｈｄをリフローする（半田リフロー工程）。この半田リフロー工程では、部品装着機１３が、基板２上に印刷された半田Ｈｄの位置に端子４ａが接触するようにして部品４を装着する（図９（ａ））。このため、半田Ｈｄのリフロー時における半田Ｈｄの流動（図９（ｂ）中に示す矢印Ａ）によってセルフアライメント効果が発揮され、部品４が目標装着位置Ｍ０に装着される（図９（ｃ））。 The reflow furnace 14 reflows the solder Hd on the substrate 2 with respect to the substrate received from the component mounting machine 13 (solder reflow process). In this solder reflow process, the component mounting machine 13 mounts the component 4 so that the terminal 4a contacts the position of the solder Hd printed on the substrate 2 (FIG. 9A). Therefore, the self-alignment effect is exhibited by the flow of the solder Hd during reflow of the solder Hd (arrow A shown in FIG. 9B), and the component 4 is mounted at the target mounting position M0 (FIG. 9C). ).
　装着機制御装置３９の表示制御部３９ｆ（図７）は、装着機制御装置３９に繋がる入力装置４０（図７）からオペレータＯＰによる所定の入力操作があったときには、補正値算出工程で求めた各半田Ｈｄの電極３に対する相対位置関係のデータ（電極位置記憶部３９ｃが記憶する基板２の各電極３の位置のデータ及び半田位置記憶部３９ａが記憶する各半田Ｈｄの位置のデータ）、目標装着位置記憶部３９ｅが記憶する各部品４の目標装着位置Ｍ０のデータ、及び補正値算出工程で算出され補正値記憶部３９ｄが記憶する各部品４についての補正値のデータに基づいて、基板２上の各半田Ｈｄの電極３に対する位置ずれの向き及び補正値による部品４の目標装着位置Ｍ０の補正の向きを同時に示す画面ＧＭ（図１０）を、装着機制御装置３９に繋がる表示装置４１に表示させる（表示工程）。 The display control unit 39f (FIG. 7) of the mounting machine control device 39 obtains the correction value calculation step when there is a predetermined input operation by the operator OP from the input device 40 (FIG. 7) connected to the mounting machine control device 39. Data on the relative positional relationship of each solder Hd with respect to the electrode 3 (position data of each electrode 3 on the substrate 2 stored in the electrode position storage section 39c and position data of each solder Hd stored in the solder position storage section 39a), target Based on the data of the target mounting position M0 of each component 4 stored in the mounting position storage unit 39e and the correction value data of each component 4 calculated in the correction value calculation process and stored in the correction value storage unit 39d. A screen GM (FIG. 10) that simultaneously indicates the direction of misalignment of each solder Hd with respect to the electrode 3 and the direction of correction of the target mounting position M0 of the component 4 based on the correction value is displayed on the mounting machine control device 3. It is displayed on the display device 41 connected to the (display step).
　図１０に示す画面ＧＭには、電極３の外形、目標装着位置Ｍ０、及びこの目標装着位置Ｍ０に部品４が装着された場合の部品４の外形が細線で示されている。また、画面ＧＭには、基板２上に印刷された半田Ｈｄの外形、補正後の目標装着位置Ｍ１、及びこの補正後の目標装着位置Ｍ１に部品４が装着された場合の部品４の外形が太線で示されている。そして、画面ＧＭには、電極３に対する半田Ｈｄの位置ずれの向きが分かるように、電極３の中心ＰＤの位置から半田Ｈｄの中心ＰＨの位置へ向かう矢印Ｖ１，Ｖ２，Ｖ３，Ｖ４が示されている。さらに、画面ＧＭには、補正値による部品４の目標装着位置Ｍ０の補正の向きが分かるように、目標装着位置Ｍ０から補正後の目標装着位置Ｍ１へ向かう矢印Ｒが示されている。 In the screen GM shown in FIG. 10, the outer shape of the electrode 3, the target mounting position M0, and the outer shape of the component 4 when the component 4 is mounted at the target mounting position M0 are indicated by thin lines. Further, on the screen GM, the outer shape of the solder Hd printed on the substrate 2, the corrected target mounting position M1, and the external shape of the component 4 when the component 4 is mounted at the corrected target mounting position M1 are shown. Shown in bold lines. The screen GM shows arrows V1, V2, V3, V4 from the position of the center PD of the electrode 3 to the position of the center PH of the solder Hd so that the direction of the positional deviation of the solder Hd with respect to the electrode 3 can be seen. ing. Further, the screen GM shows an arrow R from the target mounting position M0 to the corrected target mounting position M1 so that the correction direction of the target mounting position M0 of the component 4 based on the correction value can be seen.
　なお、図１０に示す画面ＧＭには、電極３に対する半田Ｈｄの位置ずれの向きを示す矢印Ｖ１，Ｖ２，Ｖ３，Ｖ４と、目標装着位置Ｍ０の補正の向きを示す矢印Ｒが示されている。しかし、画面ＧＭ内の線を色分けするなどして電極３の外形、目標装着位置Ｍ０、及びこの目標装着位置Ｍ０に部品４が装着された場合の部品４の外形と、各電極３に印刷された半田Ｈｄの外形、補正後の目標装着位置Ｍ１、及びこの補正後の目標装着位置Ｍ１に部品４が装着された場合の部品４の外形とが明瞭に区別できるのであれば、図１１に示すように、各電極３に対する半田Ｈｄの位置ずれの向きを示す矢印Ｖ１，Ｖ２，Ｖ３，Ｖ４及び目標装着位置Ｍ０の補正の向きを示す矢印Ｒを省略することができる。また、図１２に示すように、電極３の外形及び目標装着位置Ｍ０と、各電極３に対する半田Ｈｄの位置ずれの向きを示す矢印Ｖ１，Ｖ２，Ｖ３，Ｖ４、及び目標装着位置Ｍ０の補正の向きを示す矢印Ｒのみを示すようにしてもよい。 Note that the screen GM shown in FIG. 10 shows arrows V1, V2, V3, V4 indicating the direction of misalignment of the solder Hd with respect to the electrode 3, and an arrow R indicating the direction of correction of the target mounting position M0. . However, the lines in the screen GM are color-coded to print the outer shape of the electrode 3, the target mounting position M0, the outer shape of the component 4 when the component 4 is mounted at the target mounting position M0, and each electrode 3. If the outer shape of the solder Hd, the corrected target mounting position M1, and the outer shape of the component 4 when the component 4 is mounted at the corrected target mounting position M1, can be clearly shown in FIG. As described above, the arrows V1, V2, V3, V4 indicating the direction of misalignment of the solder Hd with respect to each electrode 3 and the arrow R indicating the correction direction of the target mounting position M0 can be omitted. Further, as shown in FIG. 12, the outer shape of the electrode 3 and the target mounting position M0, and arrows V1, V2, V3, V4 indicating the direction of the positional deviation of the solder Hd with respect to each electrode 3 and the target mounting position M0 are corrected. Only the arrow R indicating the direction may be shown.
　すなわち、表示装置４１に表示される画面ＧＭは、補正値算出工程で求めた各半田Ｈｄの対応する電極３に対する相対位置関係、目標装着位置Ｍ０、及び補正値算出工程で算出した補正値に基づいて、各半田Ｈｄの対応する電極３に対する位置ずれの向き及び補正値による目標装着位置Ｍ０の補正の向きを同時に表示するものであれば、その表示形式は特に限定されない。 That is, the screen GM displayed on the display device 41 is based on the relative positional relationship of each solder Hd obtained in the correction value calculation process with respect to the corresponding electrode 3, the target mounting position M0, and the correction value calculated in the correction value calculation process. The display format is not particularly limited as long as the direction of displacement of each solder Hd with respect to the corresponding electrode 3 and the direction of correction of the target mounting position M0 by the correction value are displayed simultaneously.
　部品実装システム１のオペレータＯＰは、リフロー炉１４から基板２が搬出された場合には、その基板２を手に取って部品４の装着状態の検査を行う。この部品４の装着状態の検査では、オペレータＯＰは、部品４が本来の（補正前の）目標装着位置Ｍ０に装着されているかどうかを目視によって確認し、目標装着位置Ｍ０に装着されていない装着不良状態の部品４を発見した場合には、前述の入力装置４０から入力操作を行う。さらに、オペレータＯＰは、装着不良のあった部品４について、各半田Ｈｄの電極３からの位置ずれの向き及び補正値による目標装着位置Ｍ０の補正の向きを同時に示す画面ＧＭを、前述の表示装置４１に表示させる。 When the board 2 is unloaded from the reflow furnace 14, the operator OP of the component mounting system 1 picks up the board 2 and inspects the mounting state of the parts 4. In the inspection of the mounting state of the component 4, the operator OP visually checks whether or not the component 4 is mounted at the original (before correction) target mounting position M0, and the mounting is not performed at the target mounting position M0. When a defective part 4 is found, an input operation is performed from the input device 40 described above. Further, the operator OP simultaneously displays the screen GM indicating the direction of the positional deviation of each solder Hd from the electrode 3 and the correction direction of the target mounting position M0 based on the correction value on the component 4 having the mounting failure. 41 is displayed.
　そして、オペレータＯＰは、表示装置４１に表示された画面ＧＭに基づいて、部品４の装着不良の原因が、半田位置検出機１２が行う半田位置検出工程における半田Ｈｄの位置の検出過程、部品装着機１３が行う補正値算出工程における補正値の算出過程、及び部品装着機１３が行う部品装着工程における部品４の装着過程のいずれに問題があるのかを判断する（判断工程）。この判断工程において、オペレータＯＰは、各半田Ｈｄの位置ずれの向きが全て同じでなければ半田Ｈｄの位置の検出過程に問題があると判断し、半田Ｈｄの位置ずれの向きが全て同じであるが、補正値による目標装着位置Ｍ０の補正の向きが半田Ｈｄの位置ずれの向きと同じでなければ補正値の算出過程に問題があると判断し、それ以外の場合には部品４の装着過程に問題があると判断する。 Then, based on the screen GM displayed on the display device 41, the operator OP detects the position of the solder Hd in the solder position detection process performed by the solder position detector 12 and causes the component 4 to be defective. It is determined which of the correction value calculation process in the correction value calculation process performed by the machine 13 and the component mounting process in the component mounting process performed by the component mounting machine 13 has a problem (determination process). In this determination step, the operator OP determines that there is a problem in the detection process of the position of the solder Hd unless the direction of the positional deviation of each solder Hd is the same, and the direction of the positional deviation of the solder Hd is the same. However, if the correction direction of the target mounting position M0 by the correction value is not the same as the direction of the positional deviation of the solder Hd, it is determined that there is a problem in the correction value calculation process. It is judged that there is a problem.
　図１０に示す例（図１１及び図１２についても同じ）では、各半田Ｈｄの位置ずれの向きは全て同じであるので半田Ｈｄの位置の検出過程に問題はなく、補正値による目標装着位置Ｍ０の補正の向きは半田Ｈｄの位置ずれの向きと同じであるので補正値の算出過程にも問題はない。よって、図１０に示す部品４が装着不良であった場合、その原因は部品４の装着過程に問題があると判断できる。 In the example shown in FIG. 10 (the same applies to FIGS. 11 and 12), since the direction of positional deviation of each solder Hd is the same, there is no problem in the process of detecting the position of the solder Hd, and the target mounting position M0 based on the correction value. Since the correction direction is the same as the misalignment direction of the solder Hd, there is no problem in the correction value calculation process. Therefore, when the component 4 shown in FIG. 10 is poorly mounted, it can be determined that the cause is a problem in the mounting process of the component 4.
　また、表示制御部３９ｆは、入力装置４０からの入力操作に応じ、表示装置４１に、補正後の目標装着位置Ｍ１に部品４を装着する部品装着部、すなわち部品装着機１３に関する生産プログラム及びデータを表示させる。このためオペレータＯＰは、表示装置４１に表示された部品装着機１３に関する生産プログラム及びデータに基づいて、装着不良が発生した部品４についての装着不良の原因の判断（具体的には、部品装着工程の実行中、どの部位のどの動作に原因があったかの判断）を行うことが可能である。 Further, the display control unit 39f responds to an input operation from the input device 40, and the production program and data related to the component mounting unit that mounts the component 4 on the corrected target mounting position M1 on the display device 41, that is, the component mounting machine 13. Is displayed. For this reason, the operator OP determines the cause of the mounting failure for the component 4 in which the mounting failure has occurred (specifically, the component mounting step) based on the production program and data regarding the component mounting machine 13 displayed on the display device 41. It is possible to determine which part has caused the cause during execution.
　以上説明したように、本実施の形態における部品実装システム１は、基板２の各電極３に半田Ｈｄを印刷する半田印刷機１１（半田印刷部）、半田印刷機１１で基板２に印刷された各半田Ｈｄを撮像することにより基板２上の各半田Ｈｄの位置を検出する半田位置検出機１２（半田位置検出部）、半田位置検出機１２で検出された基板２上の各半田Ｈｄの位置と各半田Ｈｄに対応する電極３の位置から各半田Ｈｄの対応する電極３に対する相対位置関係を求め、その求めた相対位置関係に基づいて部品４の目標装着位置Ｍ０の補正値を算出する補正値算出部３９ｂ、補正値算出部３９ｂで算出された補正値で部品４の目標装着位置Ｍ０を補正して得られる補正後の目標装着位置Ｍ１に部品４を装着する部品装着部（部品装着機１３）、並びに、補正値算出部３９ｂで求められた各半田Ｈｄの対応する電極３に対する相対位置関係、目標装着位置Ｍ０、及び補正値算出部３９ｂで算出された補正値に基づいて、各半田Ｈｄの対応する電極３に対する位置ずれの向き及び補正値による目標装着位置Ｍ０の補正の向きを同時に表示する表示部としての表示装置４１を備える。 As described above, the component mounting system 1 according to the present embodiment is printed on the board 2 by the solder printer 11 (solder printing unit) that prints the solder Hd on each electrode 3 of the board 2. A solder position detector 12 (solder position detector) that detects the position of each solder Hd on the substrate 2 by imaging each solder Hd, and the position of each solder Hd on the substrate 2 detected by the solder position detector 12 And the position of the electrode 3 corresponding to each solder Hd to obtain the relative positional relationship of each solder Hd to the corresponding electrode 3, and the correction to calculate the correction value of the target mounting position M0 of the component 4 based on the obtained relative positional relationship A component mounting unit (component mounting machine) that mounts the component 4 at the corrected target mounting position M1 obtained by correcting the target mounting position M0 of the component 4 with the correction value calculated by the value calculation unit 39b and the correction value calculation unit 39b. 13), line Based on the relative positional relationship of each solder Hd obtained by the correction value calculation unit 39b with respect to the corresponding electrode 3, the target mounting position M0, and the correction value calculated by the correction value calculation unit 39b, the corresponding solder Hd corresponds. A display device 41 is provided as a display unit that simultaneously displays the direction of displacement with respect to the electrode 3 and the direction of correction of the target mounting position M0 by the correction value.
　また、この部品実装システム１による部品実装方法は、基板２の各電極３に半田Ｈｄを印刷する半田印刷工程、半田印刷工程で基板２に印刷した半田Ｈｄを撮像することにより基板２上の各半田Ｈｄの位置を検出する半田位置検出工程、半田位置検出工程で検出した基板２上の各半田Ｈｄの位置と各半田Ｈｄに対応する電極３の位置から各半田Ｈｄの対応する電極３に対する相対位置関係を求め、その求めた相対位置関係に基づいて部品４の目標装着位置Ｍ０の補正値を算出する補正値算出工程、補正値算出工程で算出した補正値で目標装着位置Ｍ０を補正して得られる補正後の目標装着位置Ｍ１に部品４を装着する部品装着工程、補正値算出工程で求めた各半田Ｈｄの対応する電極３に対する相対位置関係、目標装着位置Ｍ０及び補正値算出工程で算出した補正値に基づいて、各半田Ｈｄの対応する電極３に対する位置ずれの向き及び補正値による目標装着位置Ｍ０の補正の向きを同時に表示する表示工程、並びに、表示工程で表示した各半田Ｈｄの対応する電極３に対する位置ずれの向き及び補正値による目標装着位置の補正の向きに基づいて、部品装着工程の実行後に装着不良が発生している部品４について、その装着不良の原因が半田位置検出工程における各半田Ｈｄの位置の検出過程、補正値算出工程における補正値の算出過程、及び部品装着工程における部品４の装着過程のいずれにあるかの判断を行う判断工程を含む。 In addition, the component mounting method by the component mounting system 1 includes a solder printing process in which solder Hd is printed on each electrode 3 of the board 2, and images of the solder Hd printed on the board 2 in the solder printing process. A solder position detecting step for detecting the position of the solder Hd, a position of each solder Hd on the substrate 2 detected in the solder position detecting step, and a position of the electrode 3 corresponding to each solder Hd relative to the corresponding electrode 3 of each solder Hd. A positional relationship is obtained, a correction value calculating step for calculating a correction value for the target mounting position M0 of the component 4 based on the obtained relative positional relationship, and the target mounting position M0 is corrected with the correction value calculated in the correction value calculating step. The component mounting step of mounting the component 4 at the corrected target mounting position M1 obtained, the relative positional relationship of each solder Hd obtained in the correction value calculating step with respect to the corresponding electrode 3, the target mounting position M0 and the correction value Based on the correction value calculated in the exiting process, the display process of displaying simultaneously the direction of positional deviation of each solder Hd with respect to the corresponding electrode 3 and the correction direction of the target mounting position M0 by the correction value, and the display process The cause of the mounting failure of the component 4 in which mounting failure has occurred after execution of the component mounting process based on the direction of displacement of each solder Hd with respect to the corresponding electrode 3 and the correction direction of the target mounting position based on the correction value. Includes a determination step of determining which of the position detection process of each solder Hd in the solder position detection step, the correction value calculation step in the correction value calculation step, and the component 4 mounting step in the component mounting step.
　このように、本実施の形態における部品実装システム１及び部品実装システム１による部品実装方法では、基板２上に印刷した各半田Ｈｄの対応する電極３に対する位置ずれの向き及び補正値による目標装着位置Ｍ０の補正の向きが同時に示され、基板２に対する部品４の装着不良が発見された場合には、その表示された各半田Ｈｄの対応する電極３に対する位置ずれの向き及び補正値による目標装着位置Ｍ０の補正の向きに基づいて、装着不良の原因が、半田位置検出工程における半田Ｈｄの位置の検出過程、補正値算出工程における補正値の算出過程、及び部品装着工程における部品４の装着過程のいずれにあるのかを容易に特定することができる。このため、装着不良に対する処置を迅速に行うことができ、基板２の生産効率が低下することを防止できる。 As described above, in the component mounting system 1 and the component mounting method using the component mounting system 1 according to the present embodiment, the target mounting position based on the direction of displacement and the correction value of each solder Hd printed on the substrate 2 with respect to the corresponding electrode 3. When the direction of correction of M0 is shown at the same time and a mounting failure of the component 4 on the board 2 is found, the target mounting position based on the direction of the positional deviation of the displayed solder Hd with respect to the corresponding electrode 3 and the correction value. Based on the correction direction of M0, the cause of the mounting failure is the detection process of the position of the solder Hd in the solder position detection process, the calculation process of the correction value in the correction value calculation process, and the mounting process of the component 4 in the component mounting process. It is possible to easily identify where it is. For this reason, it is possible to quickly deal with the mounting failure, and it is possible to prevent the production efficiency of the substrate 2 from being lowered.
　本発明を詳細にまた特定の実施態様を参照して説明したが、本発明の精神と範囲を逸脱することなく様々な変更や修正を加えることができることは当業者にとって明らかである。 Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
　本出願は、2012年9月14日出願の日本特許出願（特願2012-202568）に基づくものであり、その内容はここに参照として取り込まれる。 This application is based on a Japanese patent application filed on September 14, 2012 (Japanese Patent Application No. 2012-202568), the contents of which are incorporated herein by reference.
　基板に対する部品の装着不良が発生した場合に、その装着不良の原因を容易に特定することができる部品実装方法及び部品実装システムを提供する。 Provided is a component mounting method and a component mounting system that can easily identify the cause of a mounting failure when a component mounting failure occurs on a board.
１　部品実装システム
２　基板
３　電極
１１　半田印刷機（半田印刷部）
１２　半田位置検出機（半田位置検出部）
１３　部品装着機（部品装着部）
３９ｂ　補正値算出部
４１　表示装置（表示部）
Ｈｄ　半田
Ｍ０　目標装着位置
Ｍ１　補正後の目標装着位置 DESCRIPTION OF SYMBOLS 1 Component mounting system 2 Board | substrate 3 Electrode 11 Solder printer (solder printing part)
12 Solder position detector (solder position detector)
13 Component mounting machine (component mounting unit)
39b Correction value calculation unit 41 Display device (display unit)
Hd Solder M0 Target mounting position M1 Target mounting position after correction

Claims (3)

  1. 　基板の各電極に半田を印刷する半田印刷工程と、
    　前記半田印刷工程で前記基板に印刷した前記半田を撮像することにより前記基板上の前記半田の位置を検出する半田位置検出工程と、
    　前記半田位置検出工程で検出した前記基板上の前記半田の位置と前記半田に対応する電極の位置から前記半田の対応する電極に対する相対位置関係を求め、その求めた相対位置関係に基づいて部品の目標装着位置の補正値を算出する補正値算出工程と、
    　前記補正値算出工程で算出した前記補正値で前記目標装着位置を補正して得られる補正後の目標装着位置に前記部品を装着する部品装着工程と、
    　前記補正値算出工程で求めた前記半田の対応する電極に対する相対位置関係、前記目標装着位置、及び前記補正値算出工程で算出した前記補正値に基づいて、前記半田の対応する電極に対する位置ずれの向き及び前記補正値による前記目標装着位置の補正の向きを同時に表示する表示工程と、
    　前記表示工程で表示した前記半田の対応する電極に対する位置ずれの向き及び前記補正値による前記目標装着位置の補正の向きに基づいて、前記部品装着工程の実行後に装着不良が発生している部品について、その装着不良の原因が前記半田位置検出工程における前記半田の位置の検出過程、前記補正値算出工程における前記補正値の算出過程、及び前記部品装着工程における前記部品の装着過程のいずれにあるかの判断を行う判断工程と、
    を含むことを特徴とする部品実装方法。     A solder printing process for printing solder on each electrode of the substrate;
    A solder position detecting step of detecting the position of the solder on the substrate by imaging the solder printed on the substrate in the solder printing step;
    A relative positional relationship of the solder with respect to the corresponding electrode is obtained from the position of the solder on the substrate detected in the solder position detecting step and the position of the electrode corresponding to the solder, and based on the obtained relative positional relationship, A correction value calculating step for calculating a correction value of the target mounting position;
    A component mounting step of mounting the component at a corrected target mounting position obtained by correcting the target mounting position with the correction value calculated in the correction value calculating step;
    Based on the relative positional relationship of the solder with respect to the corresponding electrode obtained in the correction value calculation step, the target mounting position, and the correction value calculated in the correction value calculation step, the positional deviation of the solder with respect to the corresponding electrode is determined. A display step of simultaneously displaying a direction and a correction direction of the target mounting position based on the correction value;
    Based on the orientation of the positional deviation of the solder with respect to the corresponding electrode displayed in the display step and the correction direction of the target mounting position based on the correction value, a component in which mounting failure has occurred after execution of the component mounting step Whether the cause of the mounting failure is in the solder position detection process in the solder position detection process, the correction value calculation process in the correction value calculation process, or the component mounting process in the component mounting process A determination process for determining
    A component mounting method comprising:
  2. 　前記補正後の目標装着位置に前記部品を装着する部品装着部に関する生産プログラム及びデータを表示し、その表示した前記部品装着部に関する生産プログラム及びデータに基づいて、前記装着不良が発生している部品についての前記装着不良の原因の判断を行うことを特徴とする請求項１に記載の部品実装方法。 A production program and data related to a component mounting unit that mounts the component at the corrected target mounting position are displayed, and the component in which the mounting failure has occurred is generated based on the displayed production program and data related to the component mounting unit. The component mounting method according to claim 1, wherein the cause of the mounting failure is determined.
  3. 　基板の各電極に半田を印刷する半田印刷部と、
    　前記半田印刷部で前記基板に印刷された前記半田を撮像することにより前記基板上の前記半田の位置を検出する半田位置検出部と、
    　前記半田位置検出部で検出された前記基板上の前記半田の位置と前記半田に対応する電極の位置から前記半田の対応する電極に対する相対位置関係を求め、その求めた相対位置関係に基づいて部品の目標装着位置の補正値を算出する補正値算出部と、
    　前記補正値算出部で算出された前記補正値で前記目標装着位置を補正して得られる補正後の目標装着位置に部品を装着する部品装着部と、
    　前記補正値算出部で求められた前記半田の対応する電極に対する相対位置関係、前記目標装着位置、及び前記補正値算出部で算出された前記補正値に基づいて、前記半田の対応する電極に対する位置ずれの向き及び前記補正値による前記目標装着位置の補正の向きを同時に表示する表示部と、
    を備えたことを特徴とする部品実装システム。     A solder printing section for printing solder on each electrode of the substrate;
    A solder position detecting unit for detecting the position of the solder on the substrate by imaging the solder printed on the substrate by the solder printing unit;
    A relative positional relationship of the solder with respect to the corresponding electrode is obtained from the position of the solder on the substrate detected by the solder position detecting unit and the position of the electrode corresponding to the solder, and the component is based on the obtained relative positional relationship. A correction value calculation unit for calculating a correction value of the target mounting position of
    A component mounting unit that mounts a component at a corrected target mounting position obtained by correcting the target mounting position with the correction value calculated by the correction value calculating unit;
    The position of the solder with respect to the corresponding electrode based on the relative positional relationship of the solder with respect to the corresponding electrode obtained by the correction value calculation unit, the target mounting position, and the correction value calculated with the correction value calculation unit. A display unit for simultaneously displaying the direction of deviation and the direction of correction of the target mounting position based on the correction value;
    A component mounting system characterized by comprising:
PCT/JP2013/001454 2012-09-14 2013-03-07 Component mounting method and component mounting system WO2014041713A1 (en)

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JP2002271096A (en) * 2001-03-06 2002-09-20 Matsushita Electric Ind Co Ltd Method and apparatus for mounting electronic component, electronic component mounting system, method for forming data about electronic component mounting, apparatus for forming mounting data and program used therefor
JP2007096022A (en) * 2005-09-29 2007-04-12 Omron Corp Method and device for solder printing inspection
JP2008270696A (en) * 2006-07-14 2008-11-06 Juki Corp Component mounting position correcting method and component mounting apparatus
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JP2002271096A (en) * 2001-03-06 2002-09-20 Matsushita Electric Ind Co Ltd Method and apparatus for mounting electronic component, electronic component mounting system, method for forming data about electronic component mounting, apparatus for forming mounting data and program used therefor
JP2007096022A (en) * 2005-09-29 2007-04-12 Omron Corp Method and device for solder printing inspection
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JP2008300526A (en) * 2007-05-30 2008-12-11 Yamaha Motor Co Ltd Mounting line, apparatus and method of inspecting mounting substrate

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