JP4886989B2 - Electronic component mounting device - Google Patents

Electronic component mounting device Download PDF

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JP4886989B2
JP4886989B2 JP2005012258A JP2005012258A JP4886989B2 JP 4886989 B2 JP4886989 B2 JP 4886989B2 JP 2005012258 A JP2005012258 A JP 2005012258A JP 2005012258 A JP2005012258 A JP 2005012258A JP 4886989 B2 JP4886989 B2 JP 4886989B2
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component
electronic component
image
suction
recognition
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JP2006202934A (en
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明裕 浦川
貴志 吉井
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Hitachi High Tech Instruments Co Ltd
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Description

本発明は、所定の部品供給ユニットより部品吸着位置に供給された各電子部品を装着ヘッドに設けられた複数の吸着ノズルにより吸着して取出し、これらの吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理装置で認識処理する電子部品装着装置に関する。   In the present invention, each electronic component supplied to a component suction position from a predetermined component supply unit is picked up by a plurality of suction nozzles provided in a mounting head, and a plurality of electronic components sucked and held by these suction nozzles This invention relates to an electronic component mounting apparatus in which a component recognition camera captures images in a batch and recognizes the recognition processing device.

吸着ノズルに吸着保持された電子部品を部品認識カメラが撮像して異常と判断した場合、例えば電子部品のリード曲りや、いわゆる立ち吸着等により認識不良（姿勢不良や吸着異常を含む）とされたときには、部品回収箱に回収している（例えば特許文献１参照）。
特開２００３−６９２８７号公報 When an electronic component picked up and held by the suction nozzle is imaged by the component recognition camera and judged to be abnormal, for example, recognition failure (including poor posture or abnormal suction) has occurred due to lead bending of the electronic component, so-called standing suction, etc. Sometimes it is collected in a parts collection box (see, for example, Patent Document 1).
JP 2003-69287 A

しかし、複数の吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理するが、異常であるとされた電子部品を含む画像を表示装置に後に表示しても管理者がどの電子部品が認識異常なのかがわかりずらい。   However, the component recognition camera captures and recognizes a plurality of electronic components sucked and held by the plurality of suction nozzles in a lump. However, an image including the electronic components determined to be abnormal is displayed on the display device later. However, it is difficult for the administrator to determine which electronic component is abnormally recognized.

そこで本発明は、複数の吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理して、いずれかの電子部品が認識異常である場合に記憶装置に格納された画像に基づき、どの電子部品が認識異常であるかがわかるように表示することを目的とする。   Therefore, according to the present invention, a plurality of electronic components sucked and held by a plurality of suction nozzles are collectively imaged and recognized by a component recognition camera, and stored in a storage device when any of the electronic components is abnormally recognized. It is intended to display so that it can be understood which electronic component is recognized abnormally based on the displayed image.

第１の発明は、所定の部品供給ユニットより部品吸着位置に供給された各電子部品を装着ヘッドに設けられた複数の吸着ノズルにより吸着して取出し、これらの吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理装置で認識処理する電子部品装着装置において、前記複数の吸着ノズルのうち位置表示対象の吸着ノズルを設定するための設定装置と、前記部品認識カメラが一括して撮像した複数の電子部品の画像を格納する記憶装置と、この記憶装置に格納された画像に基づき前記設定装置に設定された吸着ノズルの配置位置より表示対象座標位置を算出する算出装置と、この算出装置により算出された表示対象座標位置の電子部品の画像を拡大表示する表示装置とを設けたことを特徴とする。 In the first invention , each electronic component supplied to a component suction position from a predetermined component supply unit is picked up by a plurality of suction nozzles provided in the mounting head, and a plurality of suction components held by the suction nozzles are held. In an electronic component mounting apparatus in which electronic components are collectively imaged by a component recognition camera and recognized and processed by a recognition processing device, a setting device for setting a suction nozzle that is a position display target among the plurality of suction nozzles, and the component A display device coordinate position is calculated from a storage device that stores images of a plurality of electronic components picked up by the recognition camera at a time, and an arrangement position of the suction nozzle set in the setting device based on the image stored in the storage device And a display device that enlarges and displays an image of the electronic component at the display target coordinate position calculated by the calculation device.

第２の発明は、所定の部品供給ユニットより部品吸着位置に供給された各電子部品を装着ヘッドに設けられた複数の吸着ノズルにより吸着して取出し、これらの吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理装置で認識処理する電子部品装着装置において、前記複数の吸着ノズルのうち位置表示対象の吸着ノズルを設定するための設定装置と、前記撮像された画像を格納する記憶装置と、この記憶装置に格納された画像に基づき前記設定装置に設定された吸着ノズルの配置位置より表示対象座標位置を算出する算出装置と、前記部品認識カメラが一括して撮像した複数の電子部品の画像を表示すると共に、前記算出装置により算出された表示対象座標位置の電子部品の画像を囲むように表示する表示装置とを設けたことを特徴とする In the second invention , each electronic component supplied to a component suction position from a predetermined component supply unit is picked up by a plurality of suction nozzles provided in the mounting head, and a plurality of suction components held by these suction nozzles are held. In an electronic component mounting apparatus in which electronic components are collectively imaged by a component recognition camera and recognized and processed by a recognition processing device, a setting device for setting a suction nozzle that is a position display target among the plurality of suction nozzles, and the imaging A storage device for storing the captured image, a calculation device for calculating a display target coordinate position from an arrangement position of the suction nozzle set in the setting device based on the image stored in the storage device, and the component recognition camera. A table that displays images of a plurality of electronic components captured in this manner and surrounds the image of the electronic component at the display target coordinate position calculated by the calculation device. Characterized by providing a device

本発明は、電子部品を吸着した複数の吸着ノズルのうち設定された吸着ノズルの表示対象座標位置の電子部品の画像を拡大表示したり、前記部品認識カメラが一括して撮像した複数の電子部品の画像を表示しながら前記表示対象座標位置の電子部品の画像を囲むように特定表示させることができるから、作業者が特定の吸着ノズルの吸着状態や特定電子部品の吸着状態の監視（管理）を行なうのに最適で作業効率を大幅に向上させることできる。 The present invention enlarges and displays an image of an electronic component at a display target coordinate position of a set suction nozzle among a plurality of suction nozzles that have picked up an electronic component, or a plurality of electronic components picked up by the component recognition camera Since the image can be displayed in a specific manner so as to surround the image of the electronic component at the display target coordinate position, the operator can monitor (manage) the suction state of the specific suction nozzle and the suction state of the specific electronic component. The work efficiency is greatly improved.

以下、図面に基づき、本発明の実施の形態を説明する。図１は電子部品装着装置１の平面図で、該装置１の基台２上には種々の電子部品を夫々その部品取出位置（部品吸着位置）に１個ずつ供給する部品供給ユニット３が複数並設されている。対向する供給ユニット３群の間には供給コンベア４、位置決め部５及び排出コンベア６が設けられている。前記供給コンベア４は上流側装置より受けたプリント基板Ｐを前記位置決め部５に搬送し、この位置決め部５で位置決め機構（図示せず）により位置決めされた該基板Ｐ上に電子部品が装着された後、排出コンベア６に搬送され、下流側装置に搬送される。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and a plurality of component supply units 3 for supplying various electronic components one by one to their component extraction positions (component adsorption positions) on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) in the positioning unit 5. Then, it is conveyed by the discharge conveyor 6, and is conveyed to a downstream apparatus.

８はＸ方向に長い一対のビームであり、Ｙ軸駆動モータ９の駆動によりネジ軸１０を回転させ、左右一対のガイド１１に沿ってプリント基板Ｐや部品供給ユニット３の部品取出部（部品吸着位置）上方を個別にＹ方向に移動する。   Reference numeral 8 denotes a pair of beams that are long in the X direction. The screw shaft 10 is rotated by driving a Y-axis drive motor 9, and a component take-out part (component suction unit) of the printed circuit board P and the component supply unit 3 is aligned along a pair of left and right guides 11. Position) Move upward in the Y direction individually.

各ビーム８にはその長手方向、即ちＸ方向にＸ軸駆動モータ１５によりガイドに沿って移動するヘッド取付体１２が設けられ、装着ヘッド７の底面図である図７に示すように、該取付体１２には複数本の吸着ノズル１３を有する装着ヘッド７が設けられる。そして、前記装着ヘッド７には前記吸着ノズル１３を上下動させるための上下軸駆動モータ１６が搭載され、また鉛直軸周りに回転させるためのθ軸駆動モータ１７が搭載されている。したが.って、装着ヘッド７の吸着ノズル１３はＸ方向及びＹ方向に移動可能であり、鉛直軸回りに回転可能で、かつ上下動可能となっている。   Each beam 8 is provided with a head mounting body 12 that moves along the guide in the longitudinal direction, that is, in the X direction, by an X-axis drive motor 15. As shown in FIG. The body 12 is provided with a mounting head 7 having a plurality of suction nozzles 13. The mounting head 7 is equipped with a vertical axis drive motor 16 for moving the suction nozzle 13 up and down, and a θ-axis drive motor 17 for rotating around the vertical axis. Therefore, the suction nozzle 13 of the mounting head 7 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

１８は部品認識カメラで、電子部品Ｄが吸着ノズル１３に対してどれだけ位置ずれして吸着保持されているかＸＹ方向及び回転角度につき、位置認識するために電子部品Ｄを撮像する。   Reference numeral 18 denotes a component recognition camera that captures an image of the electronic component D in order to recognize the position of the electronic component D with respect to the suction nozzle 13 with respect to the XY direction and the rotation angle.

次に、図２は本電子部品装着装置１の制御ブロック図である。３０は本装着装置の装着に係る動作を統括制御する制御部としてのＣＰＵ、３１は電子部品の装着順序毎（ステップ番号毎）にプリント基板Ｐ内でのＸ方向（Ｘで示す）、Ｙ方向（Ｙで示す）、角度（Ｚで示す）の位置情報及び各部品供給ユニット３の配置番号情報及び装着ヘッドでの使用する吸着ノズルの位置を示すノズル位置情報から成る装着データ（図３参照）や、前記各部品供給ユニット３の配置番号に対応した各電子部品の種類（部品ＩＤ）及びどんな吸着ノズル（ノズルＩＤ）を使用するかを示す部品配置データ（図４参照）や、どの装着ヘッド７（ヘッド１は手前の装着ヘッド、ヘッド２は奥方）のどの位置（ノズル番号で示す）にどんな吸着ノズル（ノズルＩＤ）が装着されているかを示すノズル配置データ（図５参照）や、電子部品毎の電子部品のサイズ等から成るパーツライブラリデータ等を格納するＲＡＭ（ランダム・アクセス・メモリ）、３２はプログラムを格納するＲＯＭ（リ−ド・オンリー・メモリ）である。   Next, FIG. 2 is a control block diagram of the electronic component mounting apparatus 1. Reference numeral 30 denotes a CPU as a control unit that performs overall control of operations related to the mounting of the mounting apparatus. Reference numeral 31 denotes an X direction (indicated by X) and Y direction in the printed circuit board P for each mounting order (step number) of electronic components. Mounting data consisting of position information (indicated by Y), angle (indicated by Z), arrangement number information of each component supply unit 3, and nozzle position information indicating the position of the suction nozzle used in the mounting head (see FIG. 3) And component placement data (see FIG. 4) indicating the type (component ID) of each electronic component corresponding to the placement number of each component supply unit 3 and what suction nozzle (nozzle ID) is used, and which mounting head 7 (see FIG. 5), which indicates which suction nozzle (nozzle ID) is mounted at which position (indicated by the nozzle number) of 7 (head 1 is the front mounting head, head 2 is the back) RAM for storing parts library data and the like made of the size of electronic components for each electronic component (Random Access Memory), 32 denotes a ROM for storing a program - (read only memory).

そして、ＣＰＵ３０は前記ＲＡＭ３１に記憶されたデータに基づき、前記ＲＯＭ３２に格納されたプログラムに従い、電子部品装着装置の部品装着動作に係る動作を統括制御する。即ち、ＣＰＵ３０は、駆動回路３３を介して前記Ｘ軸駆動モータ１５、前記Ｙ軸駆動モータ９、前記上下軸駆動モータ１６及び前記θ軸駆動モータ１７の駆動を制御する。   The CPU 30 controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 32 based on the data stored in the RAM 31. That is, the CPU 30 controls the driving of the X-axis drive motor 15, the Y-axis drive motor 9, the vertical axis drive motor 16, and the θ-axis drive motor 17 via the drive circuit 33.

３４はインターフェース３５を介して前記ＣＰＵ３０に接続される認識処理装置で、前記部品認識カメラ１８により撮像して取込まれた画像の認識処理が該認識処理装置３４にて行われ、ＣＰＵ３０に処理結果が送出される。即ち、ＣＰＵ３０は、前記部品認識カメラ１８により撮像された画像を認識処理（位置ずれ量の算出など）するように指示を認識処理装置３４に出力すると共に、認識処理結果を認識処理装置３４から受取るものである。   A recognition processing device 34 is connected to the CPU 30 via the interface 35. The recognition processing device 34 performs recognition processing of an image captured by the component recognition camera 18, and the processing result is sent to the CPU 30. Is sent out. That is, the CPU 30 outputs an instruction to the recognition processing device 34 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 18 and receives the recognition processing result from the recognition processing device 34. Is.

即ち、前記認識処理装置３４の認識処理により電子部品Ｄの位置ずれ量が把握されると、その結果がＣＰＵ３０に送られ、ＣＰＵ３０は電子部品Ｄの位置ずれを補正すべく、前記ビーム８をＹ軸駆動モータ９の駆動によりＹ方向に、装着ヘッド７をＸ軸駆動モータ１５の駆動によりＸ方向に移動させることにより、またθ軸駆動モータ１７によりθ回転させ、Ｘ、Ｙ方向及び鉛直軸線回りへの回転角度位置の補正がなされるものである。   That is, when the amount of positional deviation of the electronic component D is grasped by the recognition processing of the recognition processing device 34, the result is sent to the CPU 30, and the CPU 30 moves the beam 8 to Y to correct the positional deviation of the electronic component D. By moving the mounting head 7 in the Y direction by driving the shaft driving motor 9 and by moving the mounting head 7 in the X direction by driving the X axis driving motor 15, and by rotating the θ by the θ axis driving motor 17, around the X, Y and vertical axes. The rotation angle position is corrected.

尚、前記部品認識カメラ１８より撮像された画像は表示装置としてのモニター３６に表示される。そして、前記モニター３６には種々のタッチパネルスイッチ３７が設けられ、作業者がタッチパネルスイッチ３７を操作することにより、図６に示すような画像の保存条件の設定を含む種々の設定を行うことができる。即ち、画像の保存条件はタッチパネルスイッチ３７の所定のスイッチ部を押圧操作することにより設定でき、図６に示すように、画像処理結果がＯＫ時（認識良好）や、ＮＧ時（認識異常）や、ＯＫ時及びＮＧ時のいずれの時にも画像をＲＡＭ３１に格納保存するように設定でき、また保存する対象を設定するために数字のスイッチ部を押圧操作することにより吸着ノズル番号を指定したり、部品供給ユニットのフィーダ番号（部品供給ユニットの配置番号）を指定することができる。ここでは、画像処理結果が例えば電子部品のリード曲りや、いわゆる立ち吸着等により認識不良（姿勢不良や吸着異常を含む）とされた時のＮＧ時（認識異常）のみその画像を格納するように、また吸着ノズル番号は「１」の吸着ノズルを指定するものとする。   The image picked up by the component recognition camera 18 is displayed on a monitor 36 as a display device. The monitor 36 is provided with various touch panel switches 37. When an operator operates the touch panel switch 37, various settings including setting of image storage conditions as shown in FIG. 6 can be performed. . That is, the image storage condition can be set by pressing a predetermined switch portion of the touch panel switch 37. As shown in FIG. 6, the image processing result is OK (recognition is good), NG (recognition is abnormal), The image can be set to be stored and saved in the RAM 31 at any time of OK and NG, and the suction nozzle number can be designated by pressing the numeric switch unit in order to set the object to be saved, The feeder number of the component supply unit (arrangement number of the component supply unit) can be designated. Here, the image is stored only at the time of NG (recognition abnormality) when the image processing result is a recognition failure (including posture failure and suction abnormality) due to, for example, lead bending of electronic parts or so-called standing suction. Further, the suction nozzle number is designated as “1”.

前記タッチパネルスイッチ３７はガラス基板の表面全体に透明導電膜がコーティングされ、四辺に電極が印刷されている。そのため、タッチパネルスイッチ３７の表面に極微小電流を流し、作業者がタッチすると四辺の電極に電流変化を起こし、電極と接続した回路基板によりタッチした座標値が計算される。従って、その座標値がある作業を行わせるスイッチ部として予め後述するＲＡＭ３１に記憶された座標値群の中の座標値と一致すれば、当該作業が行なわれることとなる。   The touch panel switch 37 has a transparent conductive film coated on the entire surface of a glass substrate, and electrodes are printed on four sides. For this reason, when a very small current is passed through the surface of the touch panel switch 37 and the operator touches it, a current change occurs in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Accordingly, if the coordinate value matches a coordinate value in a coordinate value group stored in advance in the RAM 31 as a switch unit for performing a certain operation, the operation is performed.

以上の構成により、作業者は始動スイッチ（図示せず）を押圧することにより部品装着装置の自動運転を行なうことができる。先ず、プリント基板Ｐが上流装置より供給コンベア４を介して位置決め部５に搬送され、図示しない位置決め機構により位置決め固定される。   With the above configuration, the operator can automatically operate the component mounting device by pressing a start switch (not shown). First, the printed circuit board P is conveyed from the upstream device to the positioning unit 5 via the supply conveyor 4, and is positioned and fixed by a positioning mechanism (not shown).

次いで、ＲＡＭ３１に格納されたプリント基板の装着すべきＸＹ座標位置、鉛直軸線回りへの回転角度位置及び各部品供給ユニット３の配置番号等が指定された装着データに従い、次々に装着ヘッド７が移動して電子部品の部品種に対応した吸着ノズル１３が装着すべき電子部品を所定の部品供給ユニット３から吸着して取出す。   Next, the mounting head 7 moves one after another according to the mounting data in which the XY coordinate position of the printed circuit board to be mounted, the rotation angle position around the vertical axis, the arrangement number of each component supply unit 3 and the like stored in the RAM 31 are designated. Then, the electronic component to be mounted by the suction nozzle 13 corresponding to the component type of the electronic component is sucked out from the predetermined component supply unit 3.

詳述すると、装着ヘッド７の吸着ノズル１３はステップ番号０００１の装着すべき電子部品を収納する部品供給ユニット３上方に位置するよう移動するが、Ｙ方向は駆動回路３３によりＹ軸駆動モータ９が駆動して一対のガイド１１に沿ってビーム８が移動し、Ｘ方向は駆動回路３３によりＸ軸駆動モータ１５が駆動して装着ヘッド７が移動し、既に所定の部品供給ユニット３は駆動されて部品吸着位置にて部品が取出し可能状態にあるため、上下軸駆動モータ１６が駆動回路３３により駆動して前記ノズル１３が下降して電子部品を吸着して取出し、次に装着ヘッド７は上昇し、ステップ番号０００２の装着すべき電子部品を収納する部品供給ユニット３上方に移動し、下降して取出すというように、ステップ番号００１２までの電子部品を取出す。   More specifically, the suction nozzle 13 of the mounting head 7 moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted of step number 0001, but the Y-axis drive motor 9 is driven by the drive circuit 33 in the Y direction. When driven, the beam 8 moves along the pair of guides 11. In the X direction, the X-axis drive motor 15 is driven by the drive circuit 33 to move the mounting head 7, and the predetermined component supply unit 3 has already been driven. Since the component can be taken out at the component suction position, the vertical axis drive motor 16 is driven by the drive circuit 33 and the nozzle 13 is lowered to suck and take out the electronic component, and then the mounting head 7 is raised. The electronic components up to step number 0012 are moved above the component supply unit 3 for storing the electronic components to be mounted at step number 0002, and are taken down and removed. Take out.

そして、吸着ノズル１３は位置決め部５にて位置決めされたプリント基板Ｐ上の所定位置に電子部品を装着するように移動するが、この装着ヘッド７の移動途中において、装着ヘッド７が移動しながら部品認識カメラ１８の上方位置を通過する際に１２本の吸着ノズル１３に吸着保持された電子部品が部品認識カメラ１８により一括して撮像される（フライ認識）。そして、図８に示すように、ＣＰＵ３０により部品認識実行命令がなされると、部品認識処理装置３４に画像を取込ませ、電子部品Ｄが当該吸着ノズル１３に対してどれだけ位置ずれして吸着保持されているかＸＹ方向及び回転角度につき認識処理装置３４により認識処理させる。そして、この電子部品の認識処理結果及び前述したプリント基板の認識処理結果に基づいて補正され、ＣＰＵ３０によりＹ軸駆動モータ９、Ｘ軸駆動モータ１５及びθ軸駆動モータ１７が制御され、次々にプリント基板Ｐの所定位置に装着されることとなる。   The suction nozzle 13 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the positioning unit 5, and the mounting head 7 moves while the mounting head 7 is moving. When passing through the upper position of the recognition camera 18, the electronic components sucked and held by the twelve suction nozzles 13 are collectively imaged by the component recognition camera 18 (fly recognition). Then, as shown in FIG. 8, when a component recognition execution command is made by the CPU 30, the component recognition processing device 34 captures an image, and how much the electronic component D is displaced with respect to the suction nozzle 13. Whether it is held or not is recognized by the recognition processing device 34 for the XY direction and the rotation angle. Then, correction is made based on the recognition processing result of the electronic component and the above-described recognition processing result of the printed circuit board, and the CPU 30 controls the Y-axis drive motor 9, the X-axis drive motor 15, and the θ-axis drive motor 17 to print one after another. The substrate P is mounted at a predetermined position.

ここで、各電子部品Ｄが吸着ノズル１３に吸着保持された状態で部品認識カメラ１８により撮像されて認識処理装置３４により認識処理された場合に、例えば電子部品Ｄのリード曲りや所謂立ち吸着等により認識不良（姿勢不良や吸着異常を含む）とされたときには、以下のように処理される。   Here, when each electronic component D is picked up and held by the suction nozzle 13 and picked up by the component recognition camera 18 and recognized by the recognition processing device 34, for example, lead bending of the electronic component D, so-called standing suction, etc. If the recognition failure (including posture failure and suction abnormality) is detected, the following processing is performed.

即ち、認識処理装置３４が認識処理し、その結果が画像保存条件に合致するか否かがＣＰＵ３０により判断されて、合致していると（認識異常であると）ＣＰＵ３０が判断すると、部品認識カメラ１８により撮像された画像がＲＡＭ３１に格納される。この場合、どの吸着ノズル１３に吸着された電子部品が認識異常であるかが、装着データ（図３参照）、部品配置データ（図４参照）、ノズル配置データ（図５参照）からＣＰＵ３０は判断できるため、認識異常の電子部品がどの装着ヘッド７のどの吸着ノズル１３に係るものであるかもＲＡＭ３１に格納される。   That is, the recognition processing device 34 performs recognition processing, and it is determined by the CPU 30 whether or not the result matches the image storage condition. When the CPU 30 determines that the result matches (recognition abnormality), the component recognition camera. The image picked up by 18 is stored in the RAM 31. In this case, the CPU 30 determines from which mounting data (refer to FIG. 3), component layout data (refer to FIG. 4), and nozzle layout data (refer to FIG. 5) whether the suction nozzle 13 has an electronic component that is abnormally recognized. Therefore, it is stored in the RAM 31 as to which suction nozzle 13 of which mounting head 7 the electronic component of which recognition is abnormal.

以下同様に、電子部品の装着動作が行われ、認識異常である場合には部品認識カメラ１８により撮像された画像はＲＡＭ３１に格納されることとなる。そして、作業者は電子部品の認識異常の解析をし、特定の吸着ノズル１３の吸着状態や特定電子部品の吸着状態の監視（管理）を行なう際に、タッチパネルスイッチ３７の表示スイッチ部を押圧操作し、前述の画像を表示させて、この表示させた画面においてどの電子部品が認識異常であるかを特定表示させる動作について説明する。   Similarly, when an electronic component mounting operation is performed and recognition is abnormal, an image captured by the component recognition camera 18 is stored in the RAM 31. Then, the operator analyzes the recognition abnormality of the electronic component, and presses the display switch portion of the touch panel switch 37 when monitoring (managing) the suction state of the specific suction nozzle 13 or the suction state of the specific electronic component. An operation of displaying the above-described image and specifically displaying which electronic component has a recognition abnormality on the displayed screen will be described.

先ず、タッチパネルスイッチ３７の表示スイッチ部を押圧操作すると、ＣＰＵ３０は認識異常に係る画像をモニター３６に表示（図１０左部）させると共にどの電子部品が認識異常であるかを特定表示させる。即ち、前記ＲＡＭ３１に格納された画像に基づいて、ＣＰＵ３０は現在の装着ヘッド７の回転位置角度と吸着ノズル１３の配置位置とがわかるので、図９のフローチャートに示すように、装着ヘッド７の回転位置角度と吸着ノズル配置位置より表示対象座標位置をＣＰＵ３０が算出し、次いでこの算出された表示対象座標位置がわかるようにＣＰＵ３０はモニター３６に表示させる。即ち、画面中心をスクロールして算出された表示対象座標位置を中心として拡大表示をするか（図１０右部参照）、円Ａで囲むように描画する（図１１参照）。   First, when the display switch portion of the touch panel switch 37 is pressed, the CPU 30 displays an image related to the recognition abnormality on the monitor 36 (the left part in FIG. 10) and specifies which electronic component has the recognition abnormality. That is, based on the image stored in the RAM 31, the CPU 30 knows the current rotation position angle of the mounting head 7 and the arrangement position of the suction nozzle 13. Therefore, as shown in the flowchart of FIG. The CPU 30 calculates the display target coordinate position from the position angle and the suction nozzle arrangement position, and then the CPU 30 displays the calculated display target coordinate position on the monitor 36 so that the calculated display target coordinate position can be known. That is, the screen is enlarged to be displayed with the display target coordinate position calculated by scrolling the center of the screen (see the right part of FIG. 10) or drawn so as to be surrounded by a circle A (see FIG. 11).

このように、認識異常に係る画像を表示させて、この表示させた画面においてどの電子部品が認識異常であるかを特定表示させることができるから、作業者は電子部品の認識異常の解析をすることができる。また、図６に示した設定画面において、画像処理結果が「ＯＫ時」又は「ＯＫ／ＮＧ時（ＯＫ時及びＮＧ時のいずれの時）」を指定し、更に吸着ノズルの番号を指定した場合には、作業者がタッチパネルスイッチ３７の表示スイッチ部を押圧操作すると、認識正常や異常にかかわらず、指定された吸着ノズルに係る画像（拡大画像又は位置を特定する描画）が表示される。このため、特定の吸着ノズル１３の吸着状態や特定電子部品の吸着状態の監視（管理）を行なうのに最適で作業効率を大幅に向上させることができる。   As described above, since the image related to the recognition abnormality can be displayed and which electronic component is recognized abnormally on the displayed screen, the worker analyzes the recognition abnormality of the electronic component. be able to. In the setting screen shown in FIG. 6, when the image processing result is “OK” or “OK / NG (either OK or NG)”, and the suction nozzle number is specified. When the operator presses the display switch portion of the touch panel switch 37, an image (enlarged image or drawing specifying the position) relating to the designated suction nozzle is displayed regardless of whether the recognition is normal or abnormal. For this reason, it is optimal for monitoring (managing) the suction state of the specific suction nozzle 13 and the suction state of the specific electronic component, and can greatly improve the work efficiency.

なお、モニター３６が表示するのは、設定装置により設定された吸着ノズル１３に係るものや、設定された部品供給ユニットに係るものとすることにより、表示が特に必要な場合に限るようにすることもできる。   The display on the monitor 36 is related to the suction nozzle 13 set by the setting device or the set component supply unit, so that the display is limited to the case where the display is particularly necessary. You can also.

以上本発明の実施形態について説明したが、上述の説明に基づいて当業者にとって種々の代替例、修正又は変形が可能であり、本発明はその趣旨を逸脱しない範囲で前述の代替例、修正又は変形を包含するものである。   Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

電子部品装着装置の平面図である。It is a top view of an electronic component mounting apparatus. 本電子部品装着装置の制御ブロック図である。It is a control block diagram of this electronic component mounting apparatus. 装着データを示す図である。It is a figure which shows mounting data. 部品配置データを示す図である。It is a figure which shows component arrangement | positioning data. 吸着ノズル配置データを示す図である。It is a figure which shows adsorption nozzle arrangement | positioning data. 画像保存条件の設定画面を示す図である。It is a figure which shows the setting screen of an image preservation | save condition. 装着ヘッドの底面を示す図である。It is a figure which shows the bottom face of a mounting head. 画像保存処理にフローチャートを示す図である。It is a figure which shows a flowchart in an image preservation | save process. 保存画像の表示フローチャートを示す図である。It is a figure which shows the display flowchart of a preserve | saved image. 認識異常に係る画像及び認識異常に係る特定電子部品を示す図である。It is a figure which shows the specific electronic component which concerns on the image which concerns on recognition abnormality, and recognition abnormality. 認識異常に係る特定電子部品を表示する図である。It is a figure which displays the specific electronic component which concerns on recognition abnormality.

符号の説明Explanation of symbols

３ 部品供給ユニット
７ 装着ヘッド
１３ 吸着ノズル
１８ 部品認識カメラ
３０ ＣＰＵ
３１ ＲＡＭ
３６ モニター

3 Component Supply Unit 7 Mounting Head 13 Suction Nozzle 18 Component Recognition Camera 30 CPU
31 RAM
36 monitors

Claims (2)

所定の部品供給ユニットより部品吸着位置に供給された各電子部品を装着ヘッドに設けられた複数の吸着ノズルにより吸着して取出し、これらの吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理装置で認識処理する電子部品装着装置において、前記複数の吸着ノズルのうち位置表示対象の吸着ノズルを設定するための設定装置と、前記部品認識カメラが一括して撮像した複数の電子部品の画像を格納する記憶装置と、この記憶装置に格納された画像に基づき前記設定装置に設定された吸着ノズルの配置位置より表示対象座標位置を算出する算出装置と、この算出装置により算出された表示対象座標位置の電子部品の画像を拡大表示する表示装置とを設けたことを特徴とする電子部品装着装置。 Each electronic component supplied to a component suction position from a predetermined component supply unit is picked up by a plurality of suction nozzles provided in the mounting head, and a plurality of electronic components sucked and held by these suction nozzles are component recognition cameras. In the electronic component mounting apparatus that picks up images at once and performs recognition processing with the recognition processing device, the setting device for setting the suction nozzles for position display among the plurality of suction nozzles and the component recognition camera are collectively A storage device for storing images of a plurality of captured electronic components, a calculation device for calculating a display target coordinate position from an arrangement position of the suction nozzle set in the setting device based on the image stored in the storage device, and An electronic component mounting apparatus comprising: a display device that enlarges and displays an image of an electronic component at a display target coordinate position calculated by a calculation device. 所定の部品供給ユニットより部品吸着位置に供給された各電子部品を装着ヘッドに設けられた複数の吸着ノズルにより吸着して取出し、これらの吸着ノズルに吸着保持された複数の電子部品を部品認識カメラが一括して撮像して認識処理装置で認識処理する電子部品装着装置において、前記複数の吸着ノズルのうち位置表示対象の吸着ノズルを設定するための設定装置と、前記撮像された画像を格納する記憶装置と、この記憶装置に格納された画像に基づき前記設定装置に設定された吸着ノズルの配置位置より表示対象座標位置を算出する算出装置と、前記部品認識カメラが一括して撮像した複数の電子部品の画像を表示すると共に、前記算出装置により算出された表示対象座標位置の電子部品の画像を囲むように表示する表示装置とを設けたことを特徴とする電子部品装着装置。 Each electronic component supplied to a component suction position from a predetermined component supply unit is picked up by a plurality of suction nozzles provided in the mounting head, and a plurality of electronic components sucked and held by these suction nozzles are component recognition cameras. In the electronic component mounting apparatus that collectively picks up an image and performs recognition processing with the recognition processing device, a setting device for setting a suction nozzle that is a position display target among the plurality of suction nozzles, and the captured image are stored A storage device, a calculation device that calculates a display target coordinate position from an arrangement position of the suction nozzle set in the setting device based on an image stored in the storage device, and a plurality of images captured by the component recognition camera in a lump displays an image of the electronic component, it is provided a display device and which displays to surround the image of the electronic component to be displayed coordinate positions calculated by the calculating device An electronic component mounting apparatus characterized by.
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