WO2013183198A1 - Lamp and lighting device - Google Patents

Lamp and lighting device Download PDF

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Publication number
WO2013183198A1
WO2013183198A1 PCT/JP2013/001166 JP2013001166W WO2013183198A1 WO 2013183198 A1 WO2013183198 A1 WO 2013183198A1 JP 2013001166 W JP2013001166 W JP 2013001166W WO 2013183198 A1 WO2013183198 A1 WO 2013183198A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
lamp
peripheral surface
housing
power supply
Prior art date
Application number
PCT/JP2013/001166
Other languages
French (fr)
Japanese (ja)
Inventor
田村　哲志
吉典 覚野
松井　伸幸
智成 橋本
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013527801A priority Critical patent/JPWO2013183198A1/en
Publication of WO2013183198A1 publication Critical patent/WO2013183198A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp including a light emitting module as a light source and a lighting apparatus using the same, and more particularly to a heat dissipation improvement technique.
  • the casing used for this type of lamp is a casing made of a plate material in which both surfaces of a metal plate are covered with an insulating member, and to the outside of the casing while securing the electrical insulation between the casing and the power supply unit.
  • Patent Document 2 There has been proposed a case capable of suppressing the short circuit leakage (see Patent Document 2).
  • FIG. 10 A cross-sectional view of a state in which a base 1060 is attached to a housing 1070 according to the prior art described in Patent Document 2 is shown in FIG.
  • the base 1060 is used in a state where the light emitting module is mounted on the upper surface.
  • the housing 1070 is formed in a cylindrical shape, and is expanded in diameter toward one side along the cylinder axis.
  • the housing 1070 includes a cylindrical metal member 1072 and a first insulating member 1074 covering the outer peripheral surface of the metal member 1072, and a second insulating member 1076 covering the entire inner peripheral surface of the metal member 1072 (see FIG. 16). See the enlarged view).
  • the entire inner peripheral surface of the metal member 1072 is covered with the second insulating member 1076, so the second insulation is performed between the metal member 1072 and the peripheral portion of the base 1060.
  • the member 1076 intervenes. Then, the heat conducted from the light emitting module to the base 1060 is less likely to be transmitted to the metal member 1072, and there is a possibility that sufficient heat dissipation performance can not be obtained.
  • This invention is made in view of the above subjects, Comprising: It aims at providing the lamp which can aim at heat dissipation improvement, controlling the short circuit to the exterior.
  • a lamp includes a light source, a power supply unit, a housing, and a base.
  • the power supply unit supplies power to the light source.
  • the housing is tubular and the power supply unit is disposed inside.
  • the base is formed of a metal plate having a first main surface and a second main surface, and the first main surface is disposed on the power supply unit side in the housing and opposite to the power supply unit side.
  • a light source is disposed on the second main surface on the side.
  • the housing further includes a first member, a second member, and a third member.
  • the first member is made of a metal material and has a tubular shape.
  • the second member is made of an insulating material and has a tubular shape, and covers the outer peripheral surface in a state of being in close contact with the outer peripheral surface of the first member.
  • the third member is made of an insulating material and has a cylindrical shape, and a portion excluding at least an end portion on one side of the housing among the inner peripheral surface in a state of being in close contact with the inner peripheral surface of the first member Cover the
  • the base is located inside the one-side end of the first member, and the base and the one-side end of the first member are separated via a contact, an air gap, or a heat conductive member. .
  • the outer peripheral surface of the first member made of a metal material is covered by the second member made of an insulating material.
  • the outer peripheral surface of the first member is covered with the second member made of the insulating material, so that the first member goes out of the casing. Can prevent current leakage.
  • the base is located inside the one end of the first member on one side, and the base and the one end of the first member are in contact with or void or thermally conductive. It is spaced apart through the member.
  • FIG. 1 is a partially broken perspective view showing a lamp according to Embodiment 1;
  • FIG. 2 is a cross-sectional view showing a lamp according to Embodiment 1;
  • (A) is a perspective view of the housing
  • (b) is a schematic sectional drawing,
  • (c) is a schematic sectional drawing of the housing
  • FIG. 3 is a cross-sectional view of the lamp according to Embodiment 1, taken along the line AA of FIG. 2; The top view when it sees from the direction along a lamp
  • FIG. 1 is a partially broken perspective view showing a lamp according to Embodiment 1;
  • FIG. 2 is a cross-sectional view showing a lamp according to Embodiment 1;
  • (A) is a perspective view of the housing
  • FIG. 7 is a cross-sectional view for illustrating a manufacturing process of the housing according to the first embodiment.
  • FIG. 7 is a cross-sectional view for illustrating a manufacturing process of the housing according to the first embodiment.
  • FIG. 7 is a cross-sectional view for illustrating a manufacturing process of the housing according to the first embodiment.
  • FIG. 7 is a partially broken side view of a lighting device according to a second embodiment. The fragmentary sectional view of the lamp concerning a modification.
  • Embodiment 1 ⁇ 1> Configuration
  • FIG. 1 A partially broken perspective view showing the lamp 1 according to the present embodiment is shown in FIG. 1, and a cross-sectional view showing the lamp 1 according to the present embodiment is shown in FIG.
  • the lamp 1 is an LED lamp that is an alternative to an incandescent lamp, and is a light source, a light emitting module 10 as a light source, a globe 20, a light scattering member 32, a reflecting member 34, and a cap 40.
  • a power supply unit 50, a base 60, and a housing 70 are provided.
  • the alternate long and short dash line drawn in the vertical direction of the drawing in FIG. 2 indicates the lamp axis J of the lamp 1.
  • the lamp axis J is an axis serving as a rotation center when attaching the lamp 1 to a socket of a lighting device (not shown), and coincides with the cylindrical axis J1 of the housing 70.
  • the upper side of the drawing is described as the upper side of the lamp 1 and the lower side of the drawing is as the lower side of the lamp 1.
  • the light emitting module 10 includes a mounting substrate 12 and a plurality of light emitting units 14 disposed on the mounting substrate 12.
  • the light emitting unit 14 includes a semiconductor light emitting element (not shown) and a plurality of sealing bodies provided on the mounting substrate 12 so as to cover the semiconductor light emitting element.
  • the semiconductor light emitting element is a light emitting diode (LED), but the semiconductor light emitting element may be, for example, an EL element (electric luminescence element).
  • the semiconductor light emitting device may be a COB (Chip on Board) type on the mounting substrate 12 or an SMD (Surface Mount Device) type.
  • the mounting substrate 12 is substantially annular. Further, a through hole 12 a which penetrates in the thickness direction of the mounting substrate 12 and into which a twisted pair wiring 54 described later is inserted is penetrated in a substantially central portion of the mounting substrate 12. Further, through holes 12 c through which screws 66 for fixing the mounting substrate 12 together with the light scattering member 32 and the reflecting member 34 to the base 60 are inserted through the mounting substrate 12.
  • the sealing body is mainly made of a translucent material.
  • a wavelength conversion material for converting the wavelength of light is mixed into the translucent material.
  • a silicone resin can be used as the translucent material
  • phosphor particles can be used as the wavelength conversion material, for example.
  • a blue LED for emitting blue light and a sealing body formed of a translucent material mixed with phosphor particles for wavelength-converting blue light to yellow light are adopted. Then, a part of blue light emitted from the blue LED is wavelength-converted to yellow light by the sealing body, and white light formed by mixing blue light and yellow light is emitted from the light emitting unit 14.
  • the semiconductor light emitting element emitting blue light and the sealing body for converting blue light into yellow light are used, semiconductor light emitting elements emitting light of other colors and wavelength conversion to other wavelengths are used.
  • a sealing body for performing the In addition it is not necessary for the light transmitting material to be mixed with the wavelength conversion material. For example, when using a semiconductor light emitting element emitting white light, or three kinds of semiconductor light emitting elements emitting blue light, red light and green light It is not necessary to mix a wavelength conversion material in a translucent material, when mixing these luminescent colors and using it and obtaining white light.
  • the globe 20 is formed of glass, a resin material or the like, and the inner surface 20a is subjected to a diffusion treatment for diffusing the light emitted from the light emitting module 10, for example, a diffusion treatment with silica or a white pigment .
  • the glove 20 is attached to a housing 70. And the light which injected into the inner surface 20a of the glove
  • the shape of the globe 20 may be any shape such as a shape simulating a bulb of an A-type light bulb.
  • the light scattering member 32 includes a substantially cylindrical first light scattering portion 32a and a substantially cylindrical second light scattering portion 32b provided above the first light scattering portion 32a.
  • the outer diameter of each of the first light scattering portion 32a and the second light scattering portion 32b gradually increases from the lower side to the upper side, and the outer peripheral surface of the enlarged diameter portion is the reflection surface 32a1 of the light scattering member 32. , 32b1.
  • the inner diameter of the light scattering member 32 is formed uniformly throughout the vertical direction.
  • the light scattering member 32 is fixed to the base 60 by screws 66.
  • the light emitting unit 14 is annularly disposed around the light scattering member 32 on the mounting substrate 12.
  • the light scattering member 32 is made of a translucent material in which translucent light scattering particles having an average particle diameter of 1 ⁇ m or less are dispersed and mixed. Specifically, particles of a light transmitting material such as titania, silica, alumina, zinc oxide or the like are dispersed in a base portion of a resin material such as polycarbonate, or a light transmitting material such as glass or ceramic. It will be done.
  • the light-transmissive material constituting the base portion and the particle portion is preferably colorless and transparent, but is not limited thereto, and may be colored and transparent as long as it has light-transmitting properties. In order to scatter light efficiently inside the light scattering member 32, it is preferable that the light transmitting material forming the particle portion has a refractive index higher than that of the light transmitting material forming the base portion.
  • the reflecting member 34 is formed in a cylindrical shape, and is disposed inside the light scattering member 32.
  • the reflecting member 34 is fixed to the base 60 by screws 66 in a state of being disposed above the mounting substrate 12 which constitutes a part of the light emitting module 10.
  • the reflective member 34 is formed of a metal material.
  • the metal material include a pure metal consisting of a single metal element such as Al, Ag, Au, Ni, Rh, Pd, etc., and an alloy consisting of a plurality of metal elements or a metal element and a nonmetal element.
  • Be as a material which comprises the reflection member 34, it is not limited to a metal material, For example, other materials with high light reflectivity in visible light area
  • the base 40 is a member for receiving power from the light fixture socket when the lamp 1 is attached to the light fixture and turned on.
  • the type of the base 40 is not particularly limited, and examples thereof include an Edison type E26 base and an E17 base.
  • the base 40 includes a shell portion 42 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 46 attached to the shell portion 42 via an insulating portion 44.
  • the power supply unit 50 includes a rectifying and smoothing circuit that rectifies and smoothes alternating current supplied from the base 40, and a voltage conversion circuit that boosts and lowers and outputs an input voltage from the rectifying and smoothing circuit.
  • the power supply unit 50 may include another circuit such as a light control circuit.
  • the power supply unit 50 includes a circuit board 50a on which a wiring forming part of a rectifying and smoothing circuit and a voltage conversion circuit is formed, and a plurality of electronic components 50b mounted on the circuit board 50a.
  • the plurality of electronic components 50b include a smoothing electrolytic capacitor 50d that constitutes a part of the rectifying and smoothing circuit. In FIG. 2, only some electronic components are given reference numerals.
  • the power supply unit 50 and the base 40 are electrically connected by the power supply lines 52a and 52b, and alternating current is input from the base 40 to the power supply unit 50 via the power supply lines 52a and 52b.
  • the power supply line 52 a is connected to the shell portion 42 of the base 40
  • the power supply line 52 b is connected to the eyelet portion 46 of the base 40.
  • the power supply unit 50 and the light emitting module 10 are electrically connected by the twisted pair wiring 54, and direct current is supplied from the power supply unit 50 to the light emitting module 10 via the twisted pair wiring 54.
  • the base 60 is formed in a substantially disc shape.
  • a mounting substrate 12 which constitutes a part of the light emitting module 10 is disposed on the upper surface of the base 60.
  • most of the lower surface of the mounting substrate 12 is in contact with the base 60. Thereby, the heat generated at the mounting substrate 12 is easily conducted to the base 60 side.
  • the shape of the base 60 is not limited to disk shape, For example, an ellipse, a polygon, and cyclic
  • through holes 60d are formed at a plurality of places (for example, three places) arranged at equal intervals in the peripheral part.
  • the through hole 60d has a first through hole 60d1 whose inner diameter is substantially equal to the outer diameter of the shaft 62a of the screw 62, and an inner diameter larger than the first through hole 60d1 and substantially equal to the outer diameter of the head 62b of the screw 62. It consists of the second through hole 60d2.
  • the base 62 is fixed to the housing 70 by inserting the screws 62 into the through holes 60 d and screwing the screws 62 into screw holes 76 b 1 described later provided in the housing 70.
  • the depth of the second through hole 60 d 2 is larger than the thickness of the head portion 62 b of the screw 62.
  • the head portion 62 b of the screw 62 does not protrude to the upper surface side of the base 60 in a state where the screw 62 is screwed into the screw hole 76 b 1.
  • a through hole 60 e for inserting the twisted pair wiring 54 led from the power supply unit 50 from the lower surface side to the upper surface side of the base 60 is provided in a substantially central portion of the base 60.
  • a screw hole 60 f is provided in a region surrounding the through hole 60 e in the base 60.
  • the screw holes 60f are provided at a plurality of places (for example, three places) arranged at equal intervals around the through holes 60e. Then, with the light emitting module 10, the light scattering member 32 and the reflecting member 34 mounted on the upper surface of the base 60, when the screw 66 is screwed into the screw hole 60f, the light emitting module 10 with the light scattering member on the base 60 32 and the reflecting member 34 are fastened together.
  • a collar portion 60 b protruding downward from the base 60 is provided at the periphery of the base 60.
  • the collar 60 b is provided over the entire peripheral edge of the base 60.
  • a projecting portion 60c which protrudes downward is provided at a position corresponding to the outer peripheral portion of the through hole 60d on the lower surface of the base 60.
  • two flange portions 60h projecting outward of the base 60 in the direction orthogonal to the thickness direction of the base 60 are provided over the entire circumference. The two flange portions 60 h are provided in a state of being separated in the thickness direction of the base 60.
  • each flange portion 60h is close to the inner circumferential surface of the globe 20, and the heat conducted from the light emitting module 10 to the base 60 is easily transmitted from the flange portion 60h to the globe 20.
  • the heat generated in the light emitting module 10 can be transmitted to the globe 20 and released from the outer surface of the globe 20 to the outside.
  • the base 60 is formed of a metal material.
  • a metal material for example, a pure metal consisting of a single metal element such as Al, Ag, Au, Ni, Rh, Pd, etc., an alloy consisting of a plurality of metal elements or a metal element and a nonmetal element, etc. It can be mentioned.
  • the material constituting base 60 is not limited to the metal material, and may be made of, for example, a nonmetal material such as a resin material or a ceramic.
  • the housing 70 includes a first member 72, a second member 74, a third member 76, a fourth member 78, and a fifth member 79.
  • FIG. 3 (a) A perspective view of the case 70 is shown in FIG. 3 (a), a schematic cross-sectional view is shown in FIG. 3 (b), and the case 2070 according to the comparative example is a schematic view of the same portion as the enlarged view of FIG.
  • FIG. 3 (c) A cross sectional view is shown in FIG. 3 (c).
  • FIG. 3 (b) is a view when viewed in another cross section intersecting with the cross section shown in FIG. 2.
  • the shape of the fifth member 2079 is different from the shape of the first member 79 according to the present embodiment.
  • a part of the housing 70 has a three-layer structure including a first member 72, a second member 74, and a third member 76.
  • the first member 72 has a cylindrical shape, and the diameter is reduced from the upper end to the lower end.
  • the first member 72 is formed of a metal material.
  • the metal material include a pure metal consisting of a single metal element such as Al, Ag, Au, Ni, Rh, Pd, etc., and an alloy consisting of a plurality of metal elements or a metal element and a nonmetal element.
  • the second member 74 has a cylindrical shape and covers the outer circumferential surface in a state of being in close contact with the outer circumferential surface of the first member 72.
  • the second member 74 is formed of an insulating material made of a resin material, an inorganic material, or a mixture thereof.
  • a resin material a thermoplastic resin and a thermosetting resin are mentioned.
  • terephthalate polypropylene, phenol resin, and melamine resin.
  • inorganic material glass, ceramic, silica, titania, alumina, silica alumina, zirconia, zinc oxide, barium oxide, strontium oxide, zirconium oxide, boron nitride, aluminum nitride and the like can be mentioned.
  • the third member 76 is formed in a substantially cylindrical shape, and covers a region from the lower end edge to the vicinity of the upper end edge of the inner peripheral surface of the first member 72.
  • the third member 76 is formed of an insulating material made of a resin material or an inorganic material. Since the resin material and the inorganic material are the same as the material forming the second member 74, the detailed description will be omitted.
  • the third member 76 is composed of a main body 76a, a protrusion 76b, and a guide 73.
  • the main body 76a is formed in a substantially cylindrical shape, and a plurality of substantially rectangular windows 76a1 are formed. A part of the inner peripheral surface of the first member 72 is exposed from each window 76a1.
  • the shape of the window 76a1 is not limited to a substantially rectangular shape, and may be another shape such as a circle.
  • window part 76a1 is formed in the area
  • the heat generated by the power supply unit 50 is easily transmitted to the first member 72 made of a metal material with high thermal conductivity, and the heat generated by the power supply unit 50 is transmitted to the outside of the lamp 1 by that amount. It can improve.
  • FIG. 1 A cross section when the case 70 is broken along a plane indicated by the line AA in FIG. 2 is shown in FIG.
  • the circuit board 50 a is disposed inside the housing 70 in a state in which both end portions abut on the third member 76.
  • the windows 76a1 are all formed in the third member 76 in contact with the circuit board 50a, that is, in the region excluding the region between the first guide rib 73a and the second guide rib 73b. .
  • a portion of the inner peripheral surface of the first member 72 covered by the third member 76 protrudes from at least the first member 72 exposed from the window 76a1 and the circuit board 50a It is set so that the insulation between the lead end portion 56 can be secured.
  • the area of the covering region in consideration of manufacturing variations of the amount of protrusion of the lead end portion 56. Specifically, first, manufacturing variations of the protrusion amount of the lead end portion 56 are grasped in advance. Then, the area of the covering area is set such that the electrical insulation between the lead end portion 56 and the first member 72 can be secured when the protrusion amount of the lead end portion 56 takes the maximum value of the manufacturing variation. It is preferable to do.
  • the covering portion is set in consideration of securing the insulation between the first member 72 exposed from the window 76a1 and the lead end portion 56 protruding from the circuit board 50a.
  • insulation between the first member 72 and the lead end portion 56 is compared with a configuration in which only the lower end portion of the inner peripheral surface of the first member 72 is covered with the insulating member. It has the advantage of being easy to secure.
  • the protrusion 76 b is provided to protrude from the main body 76 a toward the cylinder axis J1.
  • Three protrusions 76 b are provided at equal intervals around the cylinder axis J 1. Further, the amount of protrusion of each protrusion 76 b increases as it goes upward from the lower side in the direction of the cylinder axis J 1.
  • a screw hole 76b1 into which the screw 62 can be screwed is opened at the upper end surface of the protrusion 76b.
  • the base 60 is fixed to the third member 76 by screwing the screw 62 into the screw hole 76 b 1 in a state where the base 60 is placed on the protrusion 76 b.
  • the guiding portion 73 is for guiding the power supply unit 50 inserted from the upper opening of the housing 70 to a predetermined position in the housing 70.
  • the guide portion 73 is provided on the inner peripheral surface of the main body portion 76 a and extends along the direction of the cylinder axis J 1 of the housing 70.
  • the guide portion 73 includes a first guide rib 73a and a second guide rib 73b which are extended in the direction of the cylinder axis J1. And the space
  • the portion in contact with the third member 76 corresponds to a portion from the portion corresponding to the lower end edge of the third member 76 in FIG. 2 to the portion separated by the length L20 toward the upper end portion.
  • the contact area with the third member 76 can be increased as compared with a configuration in which only the lower end portion of the circuit board 50a is in contact with the third member 76.
  • the heat transfer efficiency from the circuit board 50a to the third member 76 can be improved. Further, since most of the end portions of the circuit board 50a are supported by the guide portion 73, it is possible to suppress the swinging of the circuit board 50a when an impact is applied to the lamp 1. Therefore, for example, compared to a configuration in which only the lower end portion of the circuit board 50a is supported by the guide, the electrical insulation between the circuit board 50a and the first member 72 when an impact is applied to the lamp 1 is obtained. It has the advantage of being easy to secure.
  • the fourth member 78 has a cylindrical shape and extends downward from the lower end of the second member 74. Further, a male screw portion is formed on the outer peripheral surface of the fourth member 78, and the lower opening 78c of the fourth member 78 is closed by the mouthpiece 40 by fitting the mouthpiece 40 to the male screw portion. It is done. Inside the fourth member 78, an electrolytic capacitor 50d that constitutes a part of the power supply unit 50 is disposed.
  • FIG. 1 A plan view of the lamp 1 when viewed from the direction along the lamp axis J with the cap 40 removed is shown in FIG.
  • the shape of the inner peripheral surface of the fourth member 78 is a shape along the outer peripheral surface of the electrolytic capacitor 50d, and accordingly, the inner peripheral surface of the fourth member 78 and the electrolytic capacitor 50d The distance between the outer circumferential surface is smaller.
  • the fourth member 78 in the cross section orthogonal to the direction of the cylinder axis J1 of the housing 70, the fourth member 78 has a circular outer circumferential surface and a part of the inner circumferential surface (in FIG. It has a thickness distribution such that portions facing in the orthogonal direction are close to the outer peripheral surface of the electrolytic capacitor 50d.
  • concave portions 78a and 78b for inserting the power supply lines 52a and 52b are formed in portions of the inner peripheral surface of the fourth member 78 facing each other between the two electrolytic capacitors 50d.
  • the fourth member 78 Since the fourth member 78 has the above-described thickness distribution, the heat generated in the electrolytic capacitor 50 d can be easily transmitted to the fourth member 78. Then, the heat transferred to the fourth member 78 is released to the lighting device side through the base 40 and the socket (not shown) of the lighting device fitted to the base 40. In this way, by promoting the release of heat generated by the electrolytic capacitor 50d to the lighting device side, it is possible to suppress the thermal destruction of the electrolytic capacitor 50d.
  • the fourth member 78 is formed of an insulating material made of a resin material or an inorganic material. Since the resin material and the inorganic material are the same as the material forming the second member 74, the detailed description will be omitted.
  • the fifth member 79 has a cylindrical shape and extends upward from the upper end of the second member 74.
  • the fifth member 79 is separated from the circumferential surface of the base 60 in a state where the base 60 is disposed inside the upper end portion of the housing 70.
  • the glove 20 is attached to the housing 70 in a state where the opening end 20 b is disposed between the inner peripheral surface of the fifth member 79 and the peripheral surface of the base 60.
  • the opening end 20 b of the glove 20 is formed of an adhesive (not shown) or the like interposed between the inner peripheral surface of the fifth member 79 and the peripheral surface of the base 60. It is fixed to the table 60.
  • the glove 20 may be press-fit and fixed to the inside of the fifth member 79.
  • the open end of the glove 20 may be embedded in the adhesive filled between the fifth member 79 and the circumferential surface of the base 60.
  • an adhesive agent the thing which uses as a main raw material the resin material (for example, silicone resin etc.) with good heat conductivity is mentioned, for example.
  • the base 60 is disposed inside the upper end of the first member 72, and between the base 60 and the upper end of the first member 72, a resin material having good thermal conductivity is interposed. It will be.
  • the resin material may be filled between the entire peripheral surface of the base 60 and the inner peripheral surface of the upper end portion of the first member 72.
  • a portion in which the resin material intervenes and a portion in which a gap is formed may exist. .
  • an adhesive made of a thermally conductive resin material may be filled between the glove 20 and the fifth member 79. Further, between the globe 20 and the fifth member 79, portions to which the adhesive is applied may be scattered at a plurality of locations on the inner peripheral portion of the fifth member 79.
  • the upper end portion of the fifth member 79 abuts on the outer peripheral surface of the glove 20 over the entire circumference of the casing 70 around the cylinder axis J1.
  • the base 60 and the first member 72 are spatially isolated from the outside of the lamp 1 so that the user can not touch the base 60 or the first member 72 from the outside of the lamp 1. By doing this, the safety of the user who handles the lamp 1 can be improved.
  • the fifth member 79 is formed of an insulating material made of a resin material or an inorganic material. Since the resin material and the inorganic material are the same as the material forming the second member 74, the detailed description will be omitted.
  • the lamp 1 By the way, in the lamp 1, creeping discharge is prevented from being generated between the outer peripheral surface of the second member 74 and the first member 72 if the circuit board 50a and the first member 72 are conducted by any chance. Is important from the viewpoint of safety. In this respect, the lamp 1 has such a performance that no creeping discharge (electric breakdown) occurs even if a voltage of 3 to 4 kV or more is applied between the outer peripheral surface of the second member 74 and the first member 72. Is being sought internationally.
  • the length L10 along the cylinder axis of the casing 70 of the fifth member 79 is set to 4 mm or more.
  • the case 70 according to the present embodiment is obtained by integrally molding a member made of a metal material and a member made of a resin material, and the case 70 is from the side to which the glove 20 is attached, A portion of a so-called single-layer structure made of a resin material, a portion of a so-called two-layer structure formed of a layer made of a metal material inside a layer made of a resin material, a resin material on both sides in the thickness direction of a layer made of a metal material A so-called three-layer structure portion in which the following layer is formed and a so-called one-layer structure portion made of a resin material are arranged in order.
  • FIG. 6A shows a partially broken plan view of the lamp 1 with the light emitting module 10, the globe 20, the light scattering member 32, and the reflecting member 34 removed, as viewed from the lamp axis direction.
  • the outer diameter of the base 60 is smaller than the inner diameter of the upper end of the first member 72, and between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60.
  • the gap W is generated over the entire peripheral surface of the base 60. This is due to the following reason.
  • the base 60 is rotated around the cylindrical axis J 1 of the housing 70 with respect to the housing 70 to provide the through holes 60 d of the base 60 and the projection 76 b of the third member 76.
  • the positions of the screw holes 76b1 are adjusted to coincide with each other when viewed from the direction along the cylinder axis J1.
  • the base 60 is difficult to rotate with respect to the housing 70 due to the friction of the contact portion. Therefore, by providing the gap W between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60, the base 60 can be easily rotated with respect to the housing 70. It is easy to adjust the position of
  • the lamp 1 it is important to set the heat transfer efficiency from the base 60 to the first member 72 to a certain degree. The reason is that the heat transfer efficiency from the base 60 to the first member 72 is low, and when the temperature of the base 60 rises, the temperature of the light emitting module 10 also rises. As a result, the luminous efficiency of the light emitting portion 14 is increased. Because the
  • the distance between the peripheral surface of the base 60 and the inner peripheral surface of the first member 72 is set to a prescribed length determined by the heat transfer efficiency from the base 60 to the first member 72. Ru.
  • FIG. 6B shows the relationship between the temperature of the base 60 and the size of the gap W between the base 60 and the first member 72 when the light emitting module 10 is lit for the lamp 1. .
  • the temperature of the base 60 at the time of lighting of the light emitting module 10 increases substantially exponentially as the length of the gap W increases. That is, when the length of the gap W increases, the heat transfer efficiency from the base 60 to the first member 72 decreases, and the temperature of the base 60 rises accordingly.
  • the upper limit value of the allowable temperature of the base 60 needs to be set to a value determined from the upper limit value of the allowable temperature of the light emitting module 10.
  • the allowable temperature of the light emitting module 10 is determined from the temperature characteristics of the light emitting unit 14 of the light emitting module 10. For example, if the temperature characteristic of the light emitting portion 14 exceeds 90 ° C., the luminous efficiency drops sharply, the allowable temperature of the light emitting module 10 becomes 90 ° C. or lower, and the upper limit Tth of the allowable temperature of the base 60 is also 90 ° C.
  • the inventor is an example of a lamp 1 having a base 60 having a diameter of 47 mm and a thickness of 2 mm, and a first member 72 having a length of 5 cm in the direction of the cylinder axis J1 of the housing 70 and consuming 6 W
  • the upper limit Tth of the allowable temperature of the base 60 in FIG. 6B is 90 ° C.
  • the upper limit Wth of the gap W is about 100 ⁇ m. That is, in the lamp 1 according to this embodiment, the defined length determined by the heat transfer efficiency from the base 60 to the first member 72 is about 100 ⁇ m.
  • the first member 72 is formed of Al, which is a metal material
  • the fifth member 2079 and the second member 74 are formed of polybutylene terephthalate.
  • the thermal expansion coefficient of Al constituting the first member 72 is about 25 ⁇ 10 ⁇ 6 [1 / K]
  • the polybutylene terephthalate constituting the second member 74 and the fifth member 2079 The thermal expansion coefficient is about 60 ⁇ 10 ⁇ 6 [1 / K].
  • the second member is caused by the difference in the thermal expansion coefficients of the materials constituting the first member 72, the second member 74, and the fifth member 2079.
  • 74 and the fifth member 2079 are stressed. Specifically, when the ambient temperature sharply decreases, the contraction width of the second member 74 and the fifth member 2079 becomes larger than the contraction width of the first member 72, and as a result, the inner ridge portion 2079a of the fifth member 2079
  • a force is applied in the upward direction along the cylinder axis direction of the housing 2070.
  • the force applied to the inner flange portion 2079a is large, there is a possibility that a crack or the like may be generated in the second member 74 and the fifth member 2079.
  • the upper end surface of the first member 72 is exposed without being covered by a part of the fifth member 79.
  • the second member 74 and the fifth member 79 are placed in an environment where the temperature change is large, the second member 74 and the fifth member are caused due to the difference in the thermal expansion coefficients of the materials constituting the first member The stress applied to 79 can be reduced.
  • the base 60 is mounted in the upper end surface of the protrusion part 76b of the 3rd member 76, and the base 60 is stabilized in the state which the attitude
  • the lamp 1 since the outer diameter of the base is slightly larger than the inner diameter of the casing and the variation in the attitude of the base 60 can be reduced compared to the configuration in which the base is press-fitted and fixed to the casing, the lamp 1 Is advantageous in that variations in light distribution characteristics of the light source can be reduced.
  • the housing 70 is formed by filling the molten resin material in the mold and solidifying the resin material in a state where the first member 72 is disposed in the mold. The details will be described below.
  • FIGS. 7 and 8 Cross-sectional views for explaining a method of manufacturing the housing 70 are shown in FIGS. 7 and 8.
  • the fixed mold 1376 and the movable mold 1374 are prepared.
  • the fixed mold 1376 has a portion (hereinafter referred to as “projected portion”) 1376a equal to the shape of the region inside the housing 70.
  • the movable mold 1374 has a cavity 1374 a having a shape along the outer shape of the housing 70, and is movable in the projecting direction of the projecting portion 1376 a with respect to the fixed mold 1376 is there.
  • the movable mold 1374 and the fixed mold 1376 can seal the cavity 1374a of the movable mold 1374 in a state where the first member 72 is disposed in the cavity 1374a of the movable mold 1374.
  • the movable mold 1374 and the fixed mold 1376 are made of, for example, a heat-resistant steel such as carbon steel. Also. In a part of the movable mold 1374, an injection hole 1374b for injecting a molten resin material is formed in a space formed by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a of the fixed mold 1376 by a molding machine. It is done.
  • the first member 72 is placed on the projecting portion 1376a of the fixed mold 1376 (see the arrow in FIG. 7A).
  • the movable mold 1374 is placed on the outside of the first member 72 (see the arrow in FIG. 7B). Then, the first member 72 is disposed in the space surrounded by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a of the fixed mold 1376, and the space is sealed.
  • the nozzle N of the molding machine is connected to the injection hole 1374b, and the molten resin material is injected from the nozzle N through the injection hole 1374b.
  • the injection pressure may be set to about 10 to 3000 kgf / cm 2 .
  • the space excluding the portion occupied by the first member 72 in the space surrounded by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a of the fixed mold 1376 is filled with the resin material (FIG. 8 (a )reference).
  • the resin material when a thermoplastic resin is used as the resin material, for example, the resin material is melted by heating to a temperature that is higher by 50 ° C. to 150 ° C. than the melting point of the resin material.
  • the viscosity of the resin material in the molten state can be reduced by melting at a temperature several tens to a few tens of degrees higher than the melting point, and the resin material can be easily filled.
  • the movable mold 1374 and the fixed mold 1376 filled with the resin material are cooled to solidify the resin material, and thereafter, the movable mold 1374 is moved relative to the fixed mold 1376 in the projecting direction of the projecting portion 1376a. It pulls out (refer arrow AR1 of FIG.8 (b)).
  • the structure 1270 including the first member 72 is removed from the fixed mold 1376 (see an arrow AR2 in FIG. 8B).
  • the structure 1270 has a shape in which the surplus portion 1278 protrudes from a portion of the housing 70 corresponding to the injection hole 1374b of the movable mold 1374.
  • the volume of the region located inside the first member 72 (hereinafter referred to as “the inner region") and the region located outside the first member 72 (hereinafter referred to as the “outside region”). And the volume of.
  • the filling of the resin material of the inner region is complete after the filling of the resin material of the outer region is completed. Then, only the filling of the resin material in the outer region is completed, and while the filling of the resin material in the inner region is not completed, the pressure applied from the outer side to the inner side of the first member 72 is applied to the outer side from the inner side of the first member The pressure is larger than the pressure, and the first member 72 may be distorted. If the housing 70 is formed in a state in which the first member 72 is distorted, stress may be generated in the second member 74 and the third member 76, and the housing 70 may be easily deteriorated.
  • the pressure applied from the outside to the inside of the first member 72 during the process of filling the resin material is made substantially equal by making the volume of the inner region substantially equal to the volume of the outer region.
  • the pressure applied from the inside to the outside of the member is always made substantially equal. In this way, the strain applied to the first member 72 during the process of filling the resin material is reduced. And the improvement of the anti-deterioration performance of case 70 is aimed at.
  • thermosetting resin In addition, although the case where a thermoplastic resin is used as a resin material was demonstrated above, as a resin material, it is not limited to a thermoplastic resin, You may use a thermosetting resin. In this case, the resin material melted by heating the resin material to about 50 ° C. is filled in the space surrounded by the cavity 1374 a of the movable mold 1374 and the projecting portion 1376 a of the fixed mold 1376. Then, the movable mold 1374 and the fixed mold 1376 filled with the resin material are heated to about 150 ° C. to solidify the resin material.
  • the thermosetting resin has a lower viscosity in the molten state than a thermoplastic resin. Therefore, since the injection pressure can be lowered, there is an advantage that the pressure applied to the first member 72 can be reduced during the process of filling the resin material.
  • the outer peripheral surface of the first member 72 made of a metal material is covered by the second member 74 made of an insulating material.
  • the outer peripheral surface of the first member 72 is covered with the second member 74 made of an insulating material, thereby the first Electric leakage from the member 72 to the outside of the housing 70 can be prevented.
  • the base 60 and the first member 72 are separated via a gap.
  • base 60 to first member 72 The heat transfer efficiency can be improved, and accordingly, the heat dissipation can be improved.
  • Second Embodiment A partially broken side view of a lighting device 501 according to the present embodiment is shown in FIG.
  • the lighting device 501 includes the lamp 1 according to the first embodiment and a lighting fixture 503.
  • the lighting fixture 503 is a so-called lighting device for downlight.
  • the lighting fixture 503 is connected to a socket 505 which is electrically connected to the lamp 1 and holds the lamp, a bowl-shaped reflection plate 507 which reflects light emitted from the lamp 1 in a predetermined direction, and an external commercial power supply. And a connection unit 509.
  • the reflecting plate 507 here is attached to the ceiling 511 such that the socket 505 side is located on the back side of the ceiling 511 via the opening 513 of the ceiling 511.
  • the structure of the illuminating device shown in FIG. 9 is a mere example, and is not limited to the above-mentioned lighting fixture for downlights.
  • the lamp axis J of the lamp 1 is disposed so as to substantially coincide with the central axis of the wedge-shaped reflection plate 507, but the lamp axis J of the lamp 1 is the center of the reflection plate 507 It may be disposed in an inclined state with respect to the axis.
  • a part of the power supply unit 50 built in the lamp 1 may be disposed on the lighting fixture 503 side.
  • FIG. 2 A cross-sectional view of the lamp 2 according to the present modification is shown in FIG.
  • the shape of the base 260 and the shape of the third member 276 constituting a part of the housing 270 are different from those of the first embodiment.
  • the same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
  • a region surrounded by the flange portion 260b on the lower surface side of the base 260 forms a recess 260g.
  • the upper end of the power supply unit 50 is located inside the recess 260g.
  • the length of the main body 276a of the third member 276 and the protrusion 276b in the direction of the cylinder axis J1 of the housing 270 is shorter than that of the third member 76 according to the first embodiment.
  • the lengths of the flange portion 260 b and the projecting portion 260 c of the base 260 in the cylinder axial direction of the housing 70 are longer.
  • the length L2 of the portion not covered by the third member 276 at the upper end of the first member 72 is longer than the same length L1 of the lamp 1 of the first embodiment. It has become.
  • the area of the portion facing the circumferential surface of the base 260 on the inner circumferential surface of the first member 72 is increased compared to the lamp 1.
  • the heat transfer efficiency from the base 260 to the first member 72 is increased in the lamp 2 compared to the lamp 1.
  • the length L1 may be determined based on the heat transfer efficiency from the base 260 to the first member 72.
  • the heat transfer efficiency from the base 260 to the first member 72 can be defined by the area of the portion of the inner peripheral surface of the first member 72 facing the peripheral surface of the base 260.
  • the gap W between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60 is an example of the lamp 1 generated over the entire peripheral surface of the base 60.
  • the present invention is not limited to this, and at least a part of the circumferential surface of the base may be in contact with the inner circumferential surface of the upper end portion of the first member 72.
  • the inner circumferential surface of the first member 72 and the circumferential surface of the base 360 are in contact over the entire circumferential portion of the base 360. That is, the inner diameter of the portion of the inner peripheral surface of the first member 72 facing the peripheral surface of the base 360 is substantially equal to the outer diameter of the base 360. Thereby, the heat conducted from the light emitting module 10 to the base 360 is easily conducted to the first member 72 as compared with the lamp 1 according to the first embodiment, and the heat radiation characteristic is improved accordingly.
  • the tip of the plurality of (eight in FIG. 11B) protrusions 460g provided on the circumferential surface of the base 460 is the inner periphery of the first member 72. It is in contact with the surface.
  • the heat conducted from the light emitting module 10 to the base 460 can be conducted to the first member 72 through the contact portion between the protrusion 460 g and the first member 72.
  • the number of protrusions 460g is not limited to eight, and may be nine or more, or seven or less.
  • the protrusions 460 g are arranged at equal intervals in the circumferential direction of the base 460. Thus, heat can be isotropically transferred from the base 460 to the first member 72.
  • the base 460 is rotated with respect to the housing 70 about the cylindrical axis J1 of the housing 70 to position the through holes 60d of the base 460 and the screw holes 76b1 of the third member 76. Adjust the relationship.
  • the tip end of the protrusion 460g is arc-shaped when viewed from the direction of the cylinder axis J1 of the housing 70.
  • the friction resistance between is reduced. Therefore, compared to the configuration shown in FIG. 11A, the base 460 can be easily rotated with respect to the housing 70, and the position adjustment of the base 460 with respect to the housing 70 can be facilitated.
  • the shape of the protrusion 460g is not limited to this.
  • the shape as viewed from the direction of the cylinder axis J1 of the housing 70 may be another shape such as a substantially triangular shape.
  • the protrusion 460g is provided on the base 460 side, but the present invention is not limited to this.
  • the upper end portion of the first member 72 A configuration may be provided in which a projection that protrudes toward the cylinder axis J1 is provided.
  • the present invention is not limited to this, and a part of the electrolytic capacitor 50d may be disposed inside the first member and the third member.
  • FIG. 3 A partial cross-sectional view of a lamp 3 according to this modification is shown in FIG.
  • the same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
  • the upper end portion of the electrolytic capacitor 50 d is disposed inside the lower end portions of the first member 372, the second member 374 and the third member 376. Thereby, the heat generated in the electrolytic capacitor 50 d is easily conducted to the first member 372 through the third member 376.
  • the length of the fourth member 378 in the cylinder axial direction of the housing 370 is shorter than the length of the fourth member 78 in the lamp 1 of the first embodiment.
  • the distance L12 between the lower end of the first member 372 and the upper end of the shell 42 of the base 40 is the distance between the lower end of the first member 72 and the upper end of the shell 42 of the base 40 in the lamp 1. Is shorter than the distance L11.
  • the length L12 may be determined based on the heat transfer efficiency from the first member 372 to the shell portion 42 of the mouthpiece 40.
  • the heat transfer efficiency from the first member 372 to the shell portion 42 of the mouthpiece 40 is the heat of the portion of the fourth member 78 located between the lower end portion of the first member 372 and the shell portion 42 of the mouthpiece 40. It can be defined by the conductivity.
  • the example of the lamp 1 which includes the light scattering member 32 and the reflecting member 34 and in which the air gap is formed between the base 60 and the power supply unit 50 has been described.
  • a light-scattering member and a reflecting member for example, an area made of an insulating material between the base 60 and the power supply unit 50 and in which the base 60 is disposed in the housing, and the power supply unit It may be the composition provided with the separation member for separating with the field where 50 is arranged.
  • FIG. 4 A cross-sectional view of the lamp 4 according to the present modification is shown in FIG.
  • the same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
  • the lamp 4 is different from the lamp 1 according to the first embodiment in the shape of the globe 420, the shape of the base 560, and the shape of the third member 476 constituting a part of the housing 470. Further, the lamp 4 is different from the first embodiment in that the lamp 4 is provided with a dividing member 432 for dividing the area in which the base 560 is arranged and the area in which the power supply unit 50 is arranged in the housing 470. Do.
  • the globe 420 has a flatter shape than the globe 20 according to the first embodiment because the light scattering member 32 and the reflecting member 34 are not disposed inside. As a result, the size of the lamp 4 is smaller than that of the lamp 1 as the size of the globe 420 is smaller.
  • the base 560 is formed in a substantially disc shape.
  • the mounting substrate 12 which constitutes a part of the light emitting module 10 is disposed on the upper surface of the base 560.
  • a through hole 560 e for inserting the twisted pair wiring 54 led from the power supply unit 50 from the lower surface side to the upper surface side of the base 560 is provided in a substantially central portion of the base 560.
  • a collar portion 560 b protruding downward from the base 560 is provided on the periphery of the base 560.
  • the flange portion 560 b is provided over the entire peripheral portion of the base 560.
  • the housing 470 includes a first member 72, a second member 74, a third member 476, a fourth member 78, and a fifth member 79.
  • the third member 476 has substantially the same shape as the third member 76 according to the first embodiment, and a recess 476a1 for locking the separating member 432 is provided inside the upper end portion of the third member 476.
  • a recess 476a1 for locking the separating member 432 is provided inside the upper end portion of the third member 476.
  • the dividing member 432 has a cylindrical shape with a bottom, and a through hole 432a1 for inserting the twisted pair wire 54 is formed in the bottom wall 432a and can be engaged with the recess 476a1 of the third member 476 in the side wall 432b.
  • a convex portion 432 c is provided. Then, the separation member 432 is engaged with the upper end portion of the third member 476 by engaging the convex portion 432 c with the concave portion 476 a 1.
  • the separating member 432 is formed of an insulating material such as a synthetic resin.
  • the partition member 432 is disposed between the base 560 and the power supply unit 50, whereby the electrical insulation between the base 560 and the power supply unit 50 is improved.
  • the lamp 4 has a configuration without the light scattering member and the reflecting member, and the number of parts is reduced compared to the lamp 1 and accordingly, the process of attaching the light scattering member and the reflecting member to the base 560 is also unnecessary. ing. Accordingly, the lamp 4 can be reduced in weight by the reduction of the number of parts as compared with the lamp 1 and has an advantage that the manufacturing process can be simplified.
  • the first cylindrical member (shell portion 42), the second cylindrical member (insulation portion 44), and the third cylindrical member (eyelet portion 46) are integrally molded (so-called Although the example integrated by insert molding has been described, the structure of the base 40 is not limited to this.
  • an outer shell member consisting of a first cylindrical member, a second cylindrical member and a fifth cylindrical member is integrally formed, and an inner shell member consisting of a third cylindrical member and a fourth cylindrical member is resin molded It may be formed by
  • FIG. 11 A cross-sectional view of a lamp 1101 according to the present modification is shown in FIG.
  • the same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
  • the housing 1170 is composed of an outer shell member 1175 and an inner shell member 1177.
  • the outer shell member 1175 includes a first cylindrical member 1172, a second cylindrical member 1174 and a fifth cylindrical member 1179.
  • the inner shell member 1177 comprises a third cylindrical member 1176 and a fourth cylindrical member 1178.
  • the outer shell member 1175 is formed by integral molding, and the inner shell member 1177 is formed by resin molding.
  • the third cylindrical member 1176 includes a main body portion 1176 a, a plurality of projecting portions 1176 b, and a guide portion 73.
  • the main body portion 1176a is formed in a substantially cylindrical shape.
  • the protrusion 1176 b protrudes toward the inside of the main body 1176 a.
  • the fourth cylindrical member 1178 is continuous with the lower end portion of the main body portion 1176 a of the third cylindrical member 1176 and extends below the lower end portion of the main body portion 1176 a.
  • FIGS. 15A and 15B are schematic views for explaining a method of assembling a structure including a housing 1170 and a cap 40 according to the present modification.
  • the inner shell member 1177 is inserted from the upper opening of the outer shell member 1175 along the axial direction of the outer shell member 1175 (see arrow). Then, the inner circumferential surface of the first cylindrical member 1172 that constitutes a part of the outer shell member 1175 is brought into close contact with the outer circumferential surface of the third cylindrical member 1176. At this time, the male screw portion of the fourth cylindrical member 1178 protrudes from the lower opening of the outer shell member 1175.
  • the base 40 is fitted on the male screw portion of the fourth cylindrical member 1178 (see the arrow).
  • the outer shell member 1175 is fixed to the inner shell member 1177 by the base 40.
  • the outer shell member 1175 and the inner shell member 1177 are separately provided, which results from the difference between the thermal expansion coefficient of the outer shell member 1175 and the thermal expansion coefficient of the inner shell member 1177.
  • the occurrence of stress in the housing 1170 can be suppressed. Therefore, it is possible to suppress the occurrence of a crack or the like of the housing 1170 accompanying the generation of a stress in the housing 1170.
  • a heat conductive member such as silicone resin may be interposed.
  • a "heat conductive member” means a member having a thermal conductivity of 0.1 W / K ⁇ m or more.

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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract

A housing equipped with a lamp comprises: a first member comprising a metal material and having a cylindrical shape; a second member comprising an insulating material and having a cylindrical shape, and covering the outer peripheral surface of the first member while being attached to said outer peripheral surface; and a third member comprising an insulating material and having a cylindrical shape, and covering part of the inner peripheral surface of the first member, excluding at least the upper end, while being attached to said inner peripheral surface. In addition, the housing and a base are separated from each other by a gap.

Description

ランプおよび照明装置Lamps and lighting devices
　本発明は、光源としての発光モジュールを備えたランプおよびこれを用いた照明装置に関し、特に、放熱性向上技術に関する。 The present invention relates to a lamp including a light emitting module as a light source and a lighting apparatus using the same, and more particularly to a heat dissipation improvement technique.
　近年、白熱電球の代替品として、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）などの半導体発光素子を有する発光モジュールを利用した電球形ランプが普及しつつある（例えば、特許文献１参照）。 BACKGROUND ART In recent years, a bulb-shaped lamp using a light emitting module having a semiconductor light emitting element such as a light emitting diode (LED) as a substitute for an incandescent lamp is in widespread use (see, for example, Patent Document 1).
　この種のランプに用いられる筐体として、金属板の両面を絶縁部材で被覆した板材からなる筐体であって、筐体と電源ユニットとの電気的絶縁性を確保しつつ、筐体外部への漏電を抑制できる筐体が提案されている（特許文献２参照）。 The casing used for this type of lamp is a casing made of a plate material in which both surfaces of a metal plate are covered with an insulating member, and to the outside of the casing while securing the electrical insulation between the casing and the power supply unit. There has been proposed a case capable of suppressing the short circuit leakage (see Patent Document 2).
　特許文献２に記載された従来例に係る筐体１０７０に基台１０６０を取着した状態の断面図を図１６に示す。ここで、基台１０６０は、上面に発光モジュールが載置された状態で使用されるものである。 A cross-sectional view of a state in which a base 1060 is attached to a housing 1070 according to the prior art described in Patent Document 2 is shown in FIG. Here, the base 1060 is used in a state where the light emitting module is mounted on the upper surface.
　筐体１０７０は、円筒状に形成され、筒軸に沿った一方向側に向かって拡径している。この筐体１０７０は、円筒状の金属部材１０７２と金属部材１０７２の外周面を覆う第１絶縁部材１０７４と、金属部材１０７２の内周面全体を覆う第２絶縁部材１０７６とからなる（図１６の拡大図参照）。 The housing 1070 is formed in a cylindrical shape, and is expanded in diameter toward one side along the cylinder axis. The housing 1070 includes a cylindrical metal member 1072 and a first insulating member 1074 covering the outer peripheral surface of the metal member 1072, and a second insulating member 1076 covering the entire inner peripheral surface of the metal member 1072 (see FIG. 16). See the enlarged view).
特開２０１１－１９２５５７号公報JP, 2011-192557, A 特許第４６３７２７２号公報Patent No. 4637272
　しかしながら、図１６に示す筐体を用いる場合、金属部材１０７２の内周面全体が第２絶縁部材１０７６で覆われているため、金属部材１０７２と基台１０６０の周縁部との間に第２絶縁部材１０７６が介在してしまう。すると、発光モジュールから基台１０６０に伝導した熱が金属部材１０７２に伝達しにくくなり、十分な放熱性能が得られないおそれがある。 However, when the housing shown in FIG. 16 is used, the entire inner peripheral surface of the metal member 1072 is covered with the second insulating member 1076, so the second insulation is performed between the metal member 1072 and the peripheral portion of the base 1060. The member 1076 intervenes. Then, the heat conducted from the light emitting module to the base 1060 is less likely to be transmitted to the metal member 1072, and there is a possibility that sufficient heat dissipation performance can not be obtained.
　本発明は、上記のような課題に鑑みてなされたものであって、外部への漏電を抑制しながらも、放熱性向上を図ることができるランプを提供することを目的とする。 This invention is made in view of the above subjects, Comprising: It aims at providing the lamp which can aim at heat dissipation improvement, controlling the short circuit to the exterior.
　本発明の一態様に係るランプは、光源と、電源ユニットと、筐体と、基台とを備える。電源ユニットは、光源に電力を供給する。筐体は、筒状であり且つ内側に電源ユニットが配置される。基台は、第１主面と第２主面とを有する金属板からなり、前記筐体の内部において第１主面が電源ユニット側となるように配置されるとともに、電源ユニット側とは反対側の第２主面に光源が配設される。筐体は、更に、第１部材と、第２部材と、第３部材とを有する。第１部材は、金属材料からなり且つ筒状の形状を有する。第２部材は、絶縁性材料からなり且つ筒状の形状を有し、第１部材の外周面に密着した状態で外周面を覆う。第３部材は、絶縁性材料からなり且つ筒状の形状を有し、第１部材の内周面に密着した状態で内周面のうち、少なくとも筐体の一方向側の端部を除く部位を覆う。基台は、第１部材の一方向側の端部の内側に位置し、基台と第１部材の一方側の端部とは、接触または空隙或いは熱伝導性部材を介して離間している。 A lamp according to an aspect of the present invention includes a light source, a power supply unit, a housing, and a base. The power supply unit supplies power to the light source. The housing is tubular and the power supply unit is disposed inside. The base is formed of a metal plate having a first main surface and a second main surface, and the first main surface is disposed on the power supply unit side in the housing and opposite to the power supply unit side. A light source is disposed on the second main surface on the side. The housing further includes a first member, a second member, and a third member. The first member is made of a metal material and has a tubular shape. The second member is made of an insulating material and has a tubular shape, and covers the outer peripheral surface in a state of being in close contact with the outer peripheral surface of the first member. The third member is made of an insulating material and has a cylindrical shape, and a portion excluding at least an end portion on one side of the housing among the inner peripheral surface in a state of being in close contact with the inner peripheral surface of the first member Cover the The base is located inside the one-side end of the first member, and the base and the one-side end of the first member are separated via a contact, an air gap, or a heat conductive member. .
　本構成によれば、金属材料からなる第１部材の外周面が、絶縁性材料からなる第２部材により覆われている。これにより、光源から基台を介して第１部材に漏電した場合でも、第１部材の外周面が絶縁性材料からなる第２部材で覆われていることにより、第１部材から筐体外部への漏電を防止することができる。 According to this configuration, the outer peripheral surface of the first member made of a metal material is covered by the second member made of an insulating material. Thus, even when the light source leaks from the light source to the first member via the base, the outer peripheral surface of the first member is covered with the second member made of the insulating material, so that the first member goes out of the casing. Can prevent current leakage.
　また、本構成によれば、基台が、第１部材の一方向側の端部の内側に位置し、基台と第１部材の一方側の端部とが、接触または空隙或いは熱伝導性部材を介して離間している。これにより、基台と第１部材との間に断熱性材料からなる部材が介在する構成に比べて、基台から第１部材への伝熱効率を向上させることができるので、その分、放熱性向上を図ることができる。 Further, according to this configuration, the base is located inside the one end of the first member on one side, and the base and the one end of the first member are in contact with or void or thermally conductive. It is spaced apart through the member. Thereby, the heat transfer efficiency from the base to the first member can be improved as compared with the configuration in which the member made of the heat insulating material is interposed between the base and the first member, and accordingly, the heat dissipation It can improve.
実施の形態１に係るランプを示す一部破断した斜視図。FIG. 1 is a partially broken perspective view showing a lamp according to Embodiment 1; 実施の形態１に係るランプを示す断面図。FIG. 2 is a cross-sectional view showing a lamp according to Embodiment 1; （ａ）は実施の形態１に係る筐体の斜視図、（ｂ）は概略断面図、（ｃ）は比較例に係る筐体の概略断面図。(A) is a perspective view of the housing | casing which concerns on Embodiment 1, (b) is a schematic sectional drawing, (c) is a schematic sectional drawing of the housing | casing which concerns on a comparative example. 実施の形態１に係るランプについて、図２のＡ－Ａ線で破断したときの断面図。FIG. 3 is a cross-sectional view of the lamp according to Embodiment 1, taken along the line AA of FIG. 2; 実施の形態１に係るランプについて、口金を取り除いた状態でランプ軸に沿った方向から見たときの平面図。The top view when it sees from the direction along a lamp | ramp axis | shaft in the state which removed the nozzle | cap | die concerning the lamp | ramp which concerns on Embodiment 1. FIG. 実施の形態１に係るランプについて、（ａ）はグローブ、光散乱部材、反射部材および発光モジュールを取り除いた状態でランプ軸方向から見たときの一部破断した平面図、（ｂ）は発光モジュールの点灯時における、基台の温度と、基台と第１部材との間の隙間の大きさとの関係を示す図。In the lamp according to the first embodiment, (a) is a partially broken plan view as viewed from the lamp axial direction with the globe, the light scattering member, the reflecting member and the light emitting module removed, and (b) is a light emitting module The figure which shows the relationship between the temperature of the base at the time of lighting, and the magnitude | size of the clearance gap between a base and a 1st member. 実施の形態１に係る筐体の製造工程を説明するための断面図。FIG. 7 is a cross-sectional view for illustrating a manufacturing process of the housing according to the first embodiment. 実施の形態１に係る筐体の製造工程を説明するための断面図。FIG. 7 is a cross-sectional view for illustrating a manufacturing process of the housing according to the first embodiment. 実施の形態２に係る照明装置の一部破断した側面図。FIG. 7 is a partially broken side view of a lighting device according to a second embodiment. 変形例に係るランプの一部断面図。The fragmentary sectional view of the lamp concerning a modification. 変形例に係るランプについて、グローブ、光散乱部材、反射部材および発光モジュールを取り除いた状態でランプ軸方向から見たときの一部破断した平面図。About the lamp which concerns on a modification, the partially broken top view when it sees from the lamp | ramp axial direction in the state which removed the globe, the light-scattering member, the reflective member, and the light emitting module. 変形例に係るランプの一部断面図。The fragmentary sectional view of the lamp concerning a modification. 変形例に係るランプの断面図。Sectional drawing of the lamp | ramp which concerns on a modification. 変形例に係るランプの断面図。Sectional drawing of the lamp | ramp which concerns on a modification. 変形例に係る筐体および口金からなる構造体の組み立て方法を説明するための模式図。The schematic diagram for demonstrating the assembling method of the structure which consists of a housing | casing and a nozzle | cap which concerns on a modification. 従来例に係る筐体に基台を取着した状態の断面図。Sectional drawing of the state which attached the base to the housing | casing which concerns on a prior art example.
　＜実施の形態１＞
　＜１＞構成
　以下、本実施の形態に係るランプ１の構成について説明する。本実施の形態に係るランプ１を示す一部破断した斜視図を図１に示し、本実施の形態に係るランプ１を示す断面図を図２に示す。 Embodiment 1
<1> Configuration Hereinafter, the configuration of the lamp 1 according to the present embodiment will be described. A partially broken perspective view showing the lamp 1 according to the present embodiment is shown in FIG. 1, and a cross-sectional view showing the lamp 1 according to the present embodiment is shown in FIG.
　本実施の形態に係るランプ１は、白熱電球の代替品となるＬＥＤランプであって、光源である発光モジュール１０と、グローブ２０と、光散乱部材３２と、反射部材３４と、口金４０と、電源ユニット５０と、基台６０と、筐体７０とを備える。 The lamp 1 according to the present embodiment is an LED lamp that is an alternative to an incandescent lamp, and is a light source, a light emitting module 10 as a light source, a globe 20, a light scattering member 32, a reflecting member 34, and a cap 40. A power supply unit 50, a base 60, and a housing 70 are provided.
　なお、図２において紙面上下方向に沿って描かれた一点鎖線は、ランプ１のランプ軸Ｊを示している。ランプ軸Ｊとは、ランプ１を照明装置（不図示）のソケットに取り付ける際の回転中心となる軸であり、筐体７０の筒軸Ｊ１と一致している。また、以下の明細書では、図２において、紙面上方をランプ１の上方、紙面下方をランプ１の下方として説明する。 The alternate long and short dash line drawn in the vertical direction of the drawing in FIG. 2 indicates the lamp axis J of the lamp 1. The lamp axis J is an axis serving as a rotation center when attaching the lamp 1 to a socket of a lighting device (not shown), and coincides with the cylindrical axis J1 of the housing 70. Further, in the following specification, in FIG. 2, the upper side of the drawing is described as the upper side of the lamp 1 and the lower side of the drawing is as the lower side of the lamp 1.
　＜発光モジュール＞
　発光モジュール１０は、実装基板１２と、実装基板１２上に配設された複数の発光部１４とを備える。 <Light emitting module>
The light emitting module 10 includes a mounting substrate 12 and a plurality of light emitting units 14 disposed on the mounting substrate 12.
　発光部１４は、半導体発光素子（図示せず）と当該半導体発光素子を被覆するように実装基板１２上に設けられた複数の封止体とを備える。なお、本実施の形態では、半導体発光素子はＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）であるが、半導体発光素子は、例えば、ＥＬ素子（エレクトリックルミネッセンス素子）であってもよい。また、半導体発光素子は、実装基板１２上にＣＯＢ（Ｃｈｉｐ　ｏｎ　Ｂｏａｒｄ）型であってもよいし、ＳＭＤ（Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ）型であってもよい。 The light emitting unit 14 includes a semiconductor light emitting element (not shown) and a plurality of sealing bodies provided on the mounting substrate 12 so as to cover the semiconductor light emitting element. In the present embodiment, the semiconductor light emitting element is a light emitting diode (LED), but the semiconductor light emitting element may be, for example, an EL element (electric luminescence element). The semiconductor light emitting device may be a COB (Chip on Board) type on the mounting substrate 12 or an SMD (Surface Mount Device) type.
　実装基板１２は、略円環状である。また、実装基板１２の略中央部には、実装基板１２の厚み方向に貫通しており後述のツイストペア配線５４が挿通される貫通孔１２ａが貫設されている。また、実装基板１２には、当該実装基板１２を光散乱部材３２および反射部材３４と共に基台６０に共締め固定するための螺子６６が挿通される貫通孔１２ｃが貫設されている。 The mounting substrate 12 is substantially annular. Further, a through hole 12 a which penetrates in the thickness direction of the mounting substrate 12 and into which a twisted pair wiring 54 described later is inserted is penetrated in a substantially central portion of the mounting substrate 12. Further, through holes 12 c through which screws 66 for fixing the mounting substrate 12 together with the light scattering member 32 and the reflecting member 34 to the base 60 are inserted through the mounting substrate 12.
　封止体は、主として透光性材料からなる。半導体発光素子から発せられた光の波長を所定の波長へと変換する必要がある場合には、透光性材料に光の波長を変換する波長変換材料が混入される。透光性材料としては、例えばシリコーン樹脂を利用することができ、波長変換材料としては、例えば蛍光体粒子を利用することができる。本実施の形態では、青色光を出射する青色ＬＥＤと、青色光を黄色光に波長変換する蛍光体粒子が混入された透光性材料で形成された封止体とが採用されている。そして、青色ＬＥＤから出射された青色光の一部が封止体によって黄色光に波長変換され、青色光と黄色光とが混色してなる白色光が発光部１４から出射される。 The sealing body is mainly made of a translucent material. When it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element into a predetermined wavelength, a wavelength conversion material for converting the wavelength of light is mixed into the translucent material. For example, a silicone resin can be used as the translucent material, and phosphor particles can be used as the wavelength conversion material, for example. In the present embodiment, a blue LED for emitting blue light and a sealing body formed of a translucent material mixed with phosphor particles for wavelength-converting blue light to yellow light are adopted. Then, a part of blue light emitted from the blue LED is wavelength-converted to yellow light by the sealing body, and white light formed by mixing blue light and yellow light is emitted from the light emitting unit 14.
　なお、本実施の形態では、青色発光の半導体発光素子と、青色光を黄色光に変換する封止体とを用いているが、他の発光色の半導体発光素子および他の波長への波長変換を行なう封止体とを用いるものであってもよい。また、透光性材料には必ずしも波長変換材料が混入されている必要はなく、例えば、白色発光の半導体発光素子を利用する場合や、青色発光、赤色発光、緑色発光の３種類の半導体発光素子を用いてこれらの発光色を混色して白色光を得る場合は、透光性材料に波長変換材料を混入する必要はない。 In this embodiment, although the semiconductor light emitting element emitting blue light and the sealing body for converting blue light into yellow light are used, semiconductor light emitting elements emitting light of other colors and wavelength conversion to other wavelengths are used. And a sealing body for performing the In addition, it is not necessary for the light transmitting material to be mixed with the wavelength conversion material. For example, when using a semiconductor light emitting element emitting white light, or three kinds of semiconductor light emitting elements emitting blue light, red light and green light It is not necessary to mix a wavelength conversion material in a translucent material, when mixing these luminescent colors and using it and obtaining white light.
　＜グローブ＞
　グローブ２０は、ガラス、樹脂材料等で形成されており、その内面２０ａには、発光モジュール１０から発せられた光を拡散させる拡散処理、例えば、シリカや白色顔料等による拡散処理が施されている。このグローブ２０は、筐体７０に取り付けられている。そして、発光モジュール１０からグローブ２０の内面２０ａに入射した光は、グローブ２０の周壁を透過して外部に取り出される。なお、グローブ２０の形状は、Ａ型の電球のバルブを模した形状等どのような形状であってもよい。 <Globe>
The globe 20 is formed of glass, a resin material or the like, and the inner surface 20a is subjected to a diffusion treatment for diffusing the light emitted from the light emitting module 10, for example, a diffusion treatment with silica or a white pigment . The glove 20 is attached to a housing 70. And the light which injected into the inner surface 20a of the glove | globe 20 from the light emitting module 10 permeate | transmits the surrounding wall of the glove | globe 20, and is taken out outside. The shape of the globe 20 may be any shape such as a shape simulating a bulb of an A-type light bulb.
　＜光散乱部材＞
　光散乱部材３２は、略円筒状の第１光散乱部３２ａと、第１光散乱部３２ａの上方に設けられた略円筒状の第２光散乱部３２ｂとからなる。第１光散乱部３２ａおよび第２光散乱部３２ｂは、いずれも外径が下方から上方へ向けて漸次拡径しており、その拡径した部分の外周面が光散乱部材３２の反射面３２ａ１，３２ｂ１となっている。一方、光散乱部材３２の内径は、上下方向全体に亘って均一に形成されている。また、光散乱部材３２は、螺子６６により基台６０に固定されている。実装基板１２上において、光散乱部材３２の周りに発光部１４が環状に配置されている。 <Light scattering member>
The light scattering member 32 includes a substantially cylindrical first light scattering portion 32a and a substantially cylindrical second light scattering portion 32b provided above the first light scattering portion 32a. The outer diameter of each of the first light scattering portion 32a and the second light scattering portion 32b gradually increases from the lower side to the upper side, and the outer peripheral surface of the enlarged diameter portion is the reflection surface 32a1 of the light scattering member 32. , 32b1. On the other hand, the inner diameter of the light scattering member 32 is formed uniformly throughout the vertical direction. The light scattering member 32 is fixed to the base 60 by screws 66. The light emitting unit 14 is annularly disposed around the light scattering member 32 on the mounting substrate 12.
　光散乱部材３２は、平均粒子径１μｍ以下の透光性光散乱粒子が分散混入された透光性材料からなる。具体的には、ポリカーボネート等の樹脂材料、ガラス、セラミック等の透光性材料で形成された基体部分に、チタニア、シリカ、アルミナ、酸化亜鉛等の透光性材料で形成された粒子部分が分散されてなるものである。この基体部分および粒子部分を構成する透光性材料は、それぞれ無色透明であることが好ましいが、これに限定されず、透光性を有していれば有色透明であってもよい。光散乱部材３２の内部で効率良く光を散乱させるためには、粒子部分を構成する透光性材料は、基体部分を構成する透光性材料よりも、屈折率が高いほうがよい。 The light scattering member 32 is made of a translucent material in which translucent light scattering particles having an average particle diameter of 1 μm or less are dispersed and mixed. Specifically, particles of a light transmitting material such as titania, silica, alumina, zinc oxide or the like are dispersed in a base portion of a resin material such as polycarbonate, or a light transmitting material such as glass or ceramic. It will be done. The light-transmissive material constituting the base portion and the particle portion is preferably colorless and transparent, but is not limited thereto, and may be colored and transparent as long as it has light-transmitting properties. In order to scatter light efficiently inside the light scattering member 32, it is preferable that the light transmitting material forming the particle portion has a refractive index higher than that of the light transmitting material forming the base portion.
　＜反射部材＞
　反射部材３４は、円筒状に形成されており、光散乱部材３２の内側に配置されている。反射部材３４は、発光モジュール１０の一部を構成する実装基板１２の上方に配置された状態で螺子６６により基台６０に固定されている。反射部材３４は、金属材料から形成されている。金属材料としては、例えばＡｌ、Ａｇ、Ａｕ、Ｎｉ、Ｒｈ、Ｐｄ等の単一の金属元素からなる純金属、さらには、複数の金属元素あるいは金属元素と非金属元素とからなる合金等が挙げられる。なお、反射部材３４を構成する材料としては、金属材料に限定されるものではなく、例えば、白色のポリカーボネート樹脂等の可視光域での光反射率の高い他の材料であってもよい。 <Reflecting member>
The reflecting member 34 is formed in a cylindrical shape, and is disposed inside the light scattering member 32. The reflecting member 34 is fixed to the base 60 by screws 66 in a state of being disposed above the mounting substrate 12 which constitutes a part of the light emitting module 10. The reflective member 34 is formed of a metal material. Examples of the metal material include a pure metal consisting of a single metal element such as Al, Ag, Au, Ni, Rh, Pd, etc., and an alloy consisting of a plurality of metal elements or a metal element and a nonmetal element. Be In addition, as a material which comprises the reflection member 34, it is not limited to a metal material, For example, other materials with high light reflectivity in visible light area | regions, such as white polycarbonate resin, may be sufficient.
　＜口金＞
　口金４０は、ランプ１が照明器具に取り付けられ点灯された際に、照明器具のソケットから電力を受けるための部材である。口金４０の種類は、特に限定されるものではないが、例えばエジソンタイプであるＥ２６口金やＥ１７口金が挙げられる。口金４０は、略円筒形状であって外周面が雄ネジとなっているシェル部４２と、シェル部４２に絶縁部４４を介して装着されたアイレット部４６とを備える。 <Cap>
The base 40 is a member for receiving power from the light fixture socket when the lamp 1 is attached to the light fixture and turned on. The type of the base 40 is not particularly limited, and examples thereof include an Edison type E26 base and an E17 base. The base 40 includes a shell portion 42 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 46 attached to the shell portion 42 via an insulating portion 44.
　＜電源ユニット＞
　電源ユニット５０は、口金４０から供給される交流を整流平滑する整流平滑回路と、整流平滑回路からの入力電圧を昇降圧して出力する電圧変換回路とを備える。なお、電源ユニット５０は、調光回路等の他の回路を備えるものであってもよい。この電源ユニット５０は、整流平滑回路および電圧変換回路の一部を構成する配線が形成された回路基板５０ａと、回路基板５０ａに実装された複数の電子部品５０ｂとからなる。複数の電子部品５０ｂには、整流平滑回路の一部を構成する平滑用の電解コンデンサ５０ｄが含まれている。図２では一部の電子部品にのみ符号を付している。 <Power supply unit>
The power supply unit 50 includes a rectifying and smoothing circuit that rectifies and smoothes alternating current supplied from the base 40, and a voltage conversion circuit that boosts and lowers and outputs an input voltage from the rectifying and smoothing circuit. The power supply unit 50 may include another circuit such as a light control circuit. The power supply unit 50 includes a circuit board 50a on which a wiring forming part of a rectifying and smoothing circuit and a voltage conversion circuit is formed, and a plurality of electronic components 50b mounted on the circuit board 50a. The plurality of electronic components 50b include a smoothing electrolytic capacitor 50d that constitutes a part of the rectifying and smoothing circuit. In FIG. 2, only some electronic components are given reference numerals.
　電源ユニット５０と口金４０とは、電源線５２ａ，５２ｂによって電気的に接続されており、口金４０から電源線５２ａ，５２ｂを介して電源ユニット５０に交流が入力される。ここで、電源線５２ａが口金４０のシェル部４２に接続され、電源線５２ｂが口金４０のアイレット部４６に接続されている。 The power supply unit 50 and the base 40 are electrically connected by the power supply lines 52a and 52b, and alternating current is input from the base 40 to the power supply unit 50 via the power supply lines 52a and 52b. Here, the power supply line 52 a is connected to the shell portion 42 of the base 40, and the power supply line 52 b is connected to the eyelet portion 46 of the base 40.
　また、電源ユニット５０と発光モジュール１０とは、ツイストペア配線５４によって電気的に接続されており、電源ユニット５０からツイストペア配線５４を介して発光モジュール１０に直流が供給される。 Further, the power supply unit 50 and the light emitting module 10 are electrically connected by the twisted pair wiring 54, and direct current is supplied from the power supply unit 50 to the light emitting module 10 via the twisted pair wiring 54.
　そして、回路基板５０ａにおける電子部品５０ｂが実装される側とは反対側の面には、電子部品５０ｂのリードの先端部（以下、「リード先端部」と称する。）５６が突出している。 Then, on the surface of the circuit board 50a opposite to the side on which the electronic component 50b is mounted, a tip end portion (hereinafter referred to as "lead tip portion") 56 of the lead of the electronic component 50b protrudes.
　＜基台＞
　基台６０は、略円板状に形成されている。基台６０の上面には、発光モジュール１０の一部を構成する実装基板１２が配設されている。ここで、実装基板１２は、その下面の大部分が基台６０に当接している。これにより、実装基板１２で生じた熱が、基台６０側に伝導し易くなっている。なお、基台６０の形状は、円板状に限定されるものではなく、例えば、平面視で楕円や多角形、環状であってもよい。 <Base>
The base 60 is formed in a substantially disc shape. A mounting substrate 12 which constitutes a part of the light emitting module 10 is disposed on the upper surface of the base 60. Here, most of the lower surface of the mounting substrate 12 is in contact with the base 60. Thereby, the heat generated at the mounting substrate 12 is easily conducted to the base 60 side. In addition, the shape of the base 60 is not limited to disk shape, For example, an ellipse, a polygon, and cyclic | annular form may be sufficient by planar view.
　基台６０には、周部で等間隔に並んだ複数個所（例えば、３箇所）に貫通孔６０ｄが形成されている。この貫通孔６０ｄは、内径が螺子６２の軸部６２ａの外径に略等しい第１貫通孔６０ｄ１と、内径が第１貫通孔６０ｄ１よりも大きく且つ螺子６２の頭部６２ｂの外径に略等しい第２貫通孔６０ｄ２とからなる。そして、各貫通孔６０ｄに螺子６２を挿通し、各螺子６２を筐体７０に設けられた後述の螺子孔７６ｂ１それぞれに螺合させることにより、基台６０が筐体７０に固定される。第２貫通孔６０ｄ２の深さは、螺子６２の頭部６２ｂの厚みに比べて大きくなっている。これにより、螺子６２が螺子孔７６ｂ１に螺合した状態において、螺子６２の頭部６２ｂが、基台６０の上面側に突出してしまうことがない。 In the base 60, through holes 60d are formed at a plurality of places (for example, three places) arranged at equal intervals in the peripheral part. The through hole 60d has a first through hole 60d1 whose inner diameter is substantially equal to the outer diameter of the shaft 62a of the screw 62, and an inner diameter larger than the first through hole 60d1 and substantially equal to the outer diameter of the head 62b of the screw 62. It consists of the second through hole 60d2. The base 62 is fixed to the housing 70 by inserting the screws 62 into the through holes 60 d and screwing the screws 62 into screw holes 76 b 1 described later provided in the housing 70. The depth of the second through hole 60 d 2 is larger than the thickness of the head portion 62 b of the screw 62. Thus, the head portion 62 b of the screw 62 does not protrude to the upper surface side of the base 60 in a state where the screw 62 is screwed into the screw hole 76 b 1.
　また、基台６０の略中央部には、電源ユニット５０から導出されたツイストペア配線５４を基台６０の下面側から上面側に挿通させるための貫通孔６０ｅが設けられている。また、基台６０における貫通孔６０ｅを囲繞する領域には、螺子孔６０ｆが設けられている。この螺子孔６０ｆは、貫通孔６０ｅ周りに等間隔に並んだ複数箇所（例えば、３箇所）に設けられている。そして、基台６０の上面に発光モジュール１０、光散乱部材３２および反射部材３４を載置した状態で、螺子６６を螺子孔６０ｆに螺合させると、基台６０に発光モジュール１０、光散乱部材３２および反射部材３４が共締め固定される。 Further, a through hole 60 e for inserting the twisted pair wiring 54 led from the power supply unit 50 from the lower surface side to the upper surface side of the base 60 is provided in a substantially central portion of the base 60. Further, a screw hole 60 f is provided in a region surrounding the through hole 60 e in the base 60. The screw holes 60f are provided at a plurality of places (for example, three places) arranged at equal intervals around the through holes 60e. Then, with the light emitting module 10, the light scattering member 32 and the reflecting member 34 mounted on the upper surface of the base 60, when the screw 66 is screwed into the screw hole 60f, the light emitting module 10 with the light scattering member on the base 60 32 and the reflecting member 34 are fastened together.
　基台６０の周部には、基台６０から下方向に突出する鍔部６０ｂが設けられている。この鍔部６０ｂは、基台６０の周縁部全体に亘って設けられている。更に、基台６０の下面における貫通孔６０ｄの外周部に対応する位置には、下方向に突出する突出部６０ｃが設けられている。また、基台６０の周面には、全周に亘って基台６０の厚み方向に直交する方向において基台６０の外側に突出するフランジ部６０ｈが２つ設けられている。この２つのフランジ部６０ｈは、基台６０の厚み方向に離間した状態で設けられている。また、各フランジ部６０ｈの先端部は、グローブ２０の内周面に近接しており、発光モジュール１０から基台６０に伝導した熱が、フランジ部６０ｈからグローブ２０に伝達し易くなっている。これにより、発光モジュール１０で発生した熱をグローブ２０に伝達させ、グローブ２０の外表面から外部に放出することができる。 A collar portion 60 b protruding downward from the base 60 is provided at the periphery of the base 60. The collar 60 b is provided over the entire peripheral edge of the base 60. Further, at a position corresponding to the outer peripheral portion of the through hole 60d on the lower surface of the base 60, a projecting portion 60c which protrudes downward is provided. Further, on the circumferential surface of the base 60, two flange portions 60h projecting outward of the base 60 in the direction orthogonal to the thickness direction of the base 60 are provided over the entire circumference. The two flange portions 60 h are provided in a state of being separated in the thickness direction of the base 60. The tip of each flange portion 60h is close to the inner circumferential surface of the globe 20, and the heat conducted from the light emitting module 10 to the base 60 is easily transmitted from the flange portion 60h to the globe 20. Thus, the heat generated in the light emitting module 10 can be transmitted to the globe 20 and released from the outer surface of the globe 20 to the outside.
　また、基台６０は、金属材料から形成されている。この金属材料としては、例えばＡｌ、Ａｇ、Ａｕ、Ｎｉ、Ｒｈ、Ｐｄ等の単一の金属元素からなる純金属、さらには、複数の金属元素あるいは金属元素と非金属元素とからなる合金等が挙げられる。なお、本実施の形態では、基台６０を構成する材料は、金属材料に限定されるものではなく、例えば、樹脂材料やセラミックス等の非金属材料から構成してもよい。 Further, the base 60 is formed of a metal material. As this metal material, for example, a pure metal consisting of a single metal element such as Al, Ag, Au, Ni, Rh, Pd, etc., an alloy consisting of a plurality of metal elements or a metal element and a nonmetal element, etc. It can be mentioned. In the present embodiment, the material constituting base 60 is not limited to the metal material, and may be made of, for example, a nonmetal material such as a resin material or a ceramic.
　＜筐体＞
　筐体７０は、第１部材７２と、第２部材７４と、第３部材７６と、第４部材７８と、第５部材７９とからなる。 <Case>
The housing 70 includes a first member 72, a second member 74, a third member 76, a fourth member 78, and a fifth member 79.
　筐体７０の斜視図を図３（ａ）に示し、概略断面図を図３（ｂ）に示し、比較例に係る筐体２０７０について、図３（ｂ）の拡大図と同様の部位の概略断面図を図３（ｃ）に示す。ここで、図３（ｂ）は、図２に示す断面とは交差する別の断面で見たときの図である。比較例に係る筐体２０７０は、第５部材２０７９の形状が本実施の形態に係る第１部材７９の形状と相違する。 A perspective view of the case 70 is shown in FIG. 3 (a), a schematic cross-sectional view is shown in FIG. 3 (b), and the case 2070 according to the comparative example is a schematic view of the same portion as the enlarged view of FIG. A cross sectional view is shown in FIG. 3 (c). Here, FIG. 3 (b) is a view when viewed in another cross section intersecting with the cross section shown in FIG. 2. In the case 2070 according to the comparative example, the shape of the fifth member 2079 is different from the shape of the first member 79 according to the present embodiment.
　図１および図３（ｂ）に示すように、筐体７０の一部は、第１部材７２と、第２部材７４と、第３部材７６とからなる３層構造となっている。 As shown in FIGS. 1 and 3B, a part of the housing 70 has a three-layer structure including a first member 72, a second member 74, and a third member 76.
　図２並びに図３（ａ）および（ｂ）に示すように、第１部材７２は、円筒状の形状を有し、上端部から下端部に向かって縮径している。 As shown in FIG. 2 and FIGS. 3A and 3B, the first member 72 has a cylindrical shape, and the diameter is reduced from the upper end to the lower end.
　第１部材７２は、金属材料から形成されている。金属材料としては、例えばＡｌ、Ａｇ、Ａｕ、Ｎｉ、Ｒｈ、Ｐｄ等の単一の金属元素からなる純金属、さらには、複数の金属元素あるいは金属元素と非金属元素とからなる合金等が挙げられる。 The first member 72 is formed of a metal material. Examples of the metal material include a pure metal consisting of a single metal element such as Al, Ag, Au, Ni, Rh, Pd, etc., and an alloy consisting of a plurality of metal elements or a metal element and a nonmetal element. Be
　第２部材７４は、円筒状の形状を有し、第１部材７２の外周面に密着した状態で当該外周面を覆っている。 The second member 74 has a cylindrical shape and covers the outer circumferential surface in a state of being in close contact with the outer circumferential surface of the first member 72.
　第２部材７４は、樹脂材料或いは無機材料或いはそれらの混合物からなる絶縁性材料で形成されている。樹脂材料としては、熱可塑性樹脂や熱硬化性樹脂が挙げられる。具体的には、ポリブチレンテレフタレート、ポリオキシメチル、ポリアミド、ポリフェニルサルフィド、ポリカーボネート、アクリル、フッ素系アクリル、シリコーン系アクリル、エポキシアクリレート、ポリスチレン、アクリロニトリルスチレン、シクロオレフィンポリマー、メチルスチレン、フルオレン、ポリエチレンテレフタレート、ポリプロピレン、フェノール樹脂、メラミン樹脂、などが挙げられる。また、無機材料としては、ガラス、セラミック、シリカ、チタニア、アルミナ、シリカアルミナ、ジルコニア、酸化亜鉛、酸化バリウム、酸化ストロンチウム、酸化ジルコニウム、窒化ホウ素、窒化アルミニウム等が挙げられる。 The second member 74 is formed of an insulating material made of a resin material, an inorganic material, or a mixture thereof. As a resin material, a thermoplastic resin and a thermosetting resin are mentioned. Specifically, polybutylene terephthalate, polyoxymethyl, polyamide, polyphenyl sulfide, polycarbonate, acrylic, fluorine-based acrylic, silicone-based acrylic, epoxy acrylate, polystyrene, acrylonitrile styrene, cycloolefin polymer, methylstyrene, fluorene, polyethylene Examples thereof include terephthalate, polypropylene, phenol resin, and melamine resin. Further, as the inorganic material, glass, ceramic, silica, titania, alumina, silica alumina, zirconia, zinc oxide, barium oxide, strontium oxide, zirconium oxide, boron nitride, aluminum nitride and the like can be mentioned.
　第３部材７６は、略円筒状に形成され、第１部材７２の内周面における下端縁から上端縁近傍に至る領域を覆っている。 The third member 76 is formed in a substantially cylindrical shape, and covers a region from the lower end edge to the vicinity of the upper end edge of the inner peripheral surface of the first member 72.
　第３部材７６は、樹脂材料或いは無機材料からなる絶縁性材料で形成されている。この樹脂材料および無機材料は、第２部材７４を構成する材料を同じであるので詳細な説明は省略する。 The third member 76 is formed of an insulating material made of a resin material or an inorganic material. Since the resin material and the inorganic material are the same as the material forming the second member 74, the detailed description will be omitted.
　図３（ａ）に示すように、第３部材７６は、本体部７６ａと、突出部７６ｂと、案内部７３とからなる。 As shown in FIG. 3A, the third member 76 is composed of a main body 76a, a protrusion 76b, and a guide 73.
　本体部７６ａは、略円筒状に形成され、複数の略矩形状の窓部７６ａ１が形成されている。各窓部７６ａ１からは、第１部材７２の内周面の一部が露出している。なお、窓部７６ａ１の形状は、略矩形状に限定されるものではなく、例えば、円形等他の形状であってもよい。 The main body 76a is formed in a substantially cylindrical shape, and a plurality of substantially rectangular windows 76a1 are formed. A part of the inner peripheral surface of the first member 72 is exposed from each window 76a1. The shape of the window 76a1 is not limited to a substantially rectangular shape, and may be another shape such as a circle.
　また、図２および図３（ａ）に示すように、窓部７６ａ１は、第３部材７６のうち筒軸Ｊ１方向で電源ユニット５０が配置される領域に形成されている。これにより、電源ユニット５０で発生した熱が、熱伝導性のよい金属材料からなる第１部材７２に伝達し易くなり、その分、電源ユニット５０で発生した熱のランプ１外部への伝達特性の向上を図ることができる。 Moreover, as shown to FIG. 2 and FIG. 3 (a), window part 76a1 is formed in the area | region where the power supply unit 50 is arrange | positioned in the cylinder axis J1 direction among the 3rd members 76. As shown in FIG. As a result, the heat generated by the power supply unit 50 is easily transmitted to the first member 72 made of a metal material with high thermal conductivity, and the heat generated by the power supply unit 50 is transmitted to the outside of the lamp 1 by that amount. It can improve.
　筐体７０を図２のＡ－Ａ線で示す平面で破断したときの断面を図４に示す。 A cross section when the case 70 is broken along a plane indicated by the line AA in FIG. 2 is shown in FIG.
　図４に示すように、回路基板５０ａは、両端部が第３部材７６に当接した状態で筐体７０の内側に配置されている。そして、窓部７６ａ１は、いずれも第３部材７６のうち回路基板５０ａとの当接部位、即ち、第１案内リブ７３ａと第２案内リブ７３ｂとの間の部位を除く部位に形成されている。 As shown in FIG. 4, the circuit board 50 a is disposed inside the housing 70 in a state in which both end portions abut on the third member 76. The windows 76a1 are all formed in the third member 76 in contact with the circuit board 50a, that is, in the region excluding the region between the first guide rib 73a and the second guide rib 73b. .
　また、第１部材７２の内周面における第３部材７６で覆われた部位（以下、「被覆部位」と称する。）は、少なくとも窓部７６ａ１から露出した第１部材７２と回路基板５０ａから突出したリード先端部５６との間の絶縁性を確保できるように設定されている。ここにおいて、上記被覆領域の面積は、リード先端部５６の突出量の製造ばらつきを考慮して設定するのが好ましい。具体的には、まず、リード先端部５６の突出量の製造ばらつきを予め把握しておく。そして、リード先端部５６の突出量が製造ばらつきの最大値をとるときに、リード先端部５６と第１部材７２との間の電気的絶縁性が確保できるように、上記被覆領域の面積を設定するのが好ましい。 Further, a portion of the inner peripheral surface of the first member 72 covered by the third member 76 (hereinafter referred to as "covered portion") protrudes from at least the first member 72 exposed from the window 76a1 and the circuit board 50a It is set so that the insulation between the lead end portion 56 can be secured. Here, it is preferable to set the area of the covering region in consideration of manufacturing variations of the amount of protrusion of the lead end portion 56. Specifically, first, manufacturing variations of the protrusion amount of the lead end portion 56 are grasped in advance. Then, the area of the covering area is set such that the electrical insulation between the lead end portion 56 and the first member 72 can be secured when the protrusion amount of the lead end portion 56 takes the maximum value of the manufacturing variation. It is preferable to do.
　このように、被覆部位が、窓部７６ａ１から露出した第１部材７２と回路基板５０ａから突出したリード先端部５６との間の絶縁性確保を考慮して設定されている。これにより、本実施の形態に係るランプ１では、第１部材７２の内周面の下端部だけが絶縁部材で覆われている構成に比べて、第１部材７２とリード先端部５６との絶縁性を確保し易いという利点がある。 As described above, the covering portion is set in consideration of securing the insulation between the first member 72 exposed from the window 76a1 and the lead end portion 56 protruding from the circuit board 50a. Thereby, in the lamp 1 according to the present embodiment, insulation between the first member 72 and the lead end portion 56 is compared with a configuration in which only the lower end portion of the inner peripheral surface of the first member 72 is covered with the insulating member. It has the advantage of being easy to secure.
　図３に示すように、突出部７６ｂは、本体部７６ａから筒軸Ｊ１に向かって突設されている。突出部７６ｂは、筒軸Ｊ１周りに等間隔に３つ設けられている。また、各突出部７６ｂは、筒軸Ｊ１方向における下方から上方に向かうほど突出量が大きくなっている。突出部７６ｂの上端面には、螺子６２が螺合可能な螺子孔７６ｂ１が開口している。図２に示すように、基台６０は、突出部７６ｂに載置された状態で螺子６２を螺子孔７６ｂ１に螺合することにより基台６０が第３部材７６に固定される。案内部７３は、筐体７０の上側開口から挿入される電源ユニット５０を筐体７０内における所定の位置に案内するためのものである。案内部７３は、本体部７６ａの内周面に設けられ、筐体７０の筒軸Ｊ１方向に沿って延長されている。案内部７３は、筒軸Ｊ１方向に延長された第１案内リブ７３ａと第２案内リブ７３ｂとからなる。そして、第１案内リブ７３ａと第２案内リブ７３ｂとの間の間隔は、回路基板５０ａの厚みと略同じになっている。 As shown in FIG. 3, the protrusion 76 b is provided to protrude from the main body 76 a toward the cylinder axis J1. Three protrusions 76 b are provided at equal intervals around the cylinder axis J 1. Further, the amount of protrusion of each protrusion 76 b increases as it goes upward from the lower side in the direction of the cylinder axis J 1. A screw hole 76b1 into which the screw 62 can be screwed is opened at the upper end surface of the protrusion 76b. As shown in FIG. 2, the base 60 is fixed to the third member 76 by screwing the screw 62 into the screw hole 76 b 1 in a state where the base 60 is placed on the protrusion 76 b. The guiding portion 73 is for guiding the power supply unit 50 inserted from the upper opening of the housing 70 to a predetermined position in the housing 70. The guide portion 73 is provided on the inner peripheral surface of the main body portion 76 a and extends along the direction of the cylinder axis J 1 of the housing 70. The guide portion 73 includes a first guide rib 73a and a second guide rib 73b which are extended in the direction of the cylinder axis J1. And the space | interval between the 1st guide rib 73a and the 2nd guide rib 73b is substantially the same as the thickness of the circuit board 50a.
　また、図２に示すように、回路基板５０ａは、第３部材７６の内側に固定された状態で、回路基板５０ａにおける筐体７０の筒軸方向に直交する方向における両端縁の大部分が第３部材７６に当接している。ここで、第３部材７６に当接している部分とは、図２における第３部材７６の下端縁に対応する部位から上端部側に長さＬ２０だけ離間した部位に至るまでの部分に相当する。これにより、例えば、回路基板５０ａの下端部のみが第３部材７６に当接している構成に比べて、第３部材７６との接触面積を大きくすることができる。このため、回路基板５０ａから第３部材７６への伝熱効率を向上させることができる。また、回路基板５０ａの上記両端縁の大部分が案内部７３により支持されているので、ランプ１に衝撃が加わったときの回路基板５０ａの揺動を抑制することができる。従って、例えば、回路基板５０ａの下端部のみが案内部により支持されている構成に比べて、ランプ１に衝撃が加わったときの回路基板５０ａと第１部材７２との間の電気的絶縁性を確保しやすいという利点がある。 Further, as shown in FIG. 2, in a state where the circuit board 50 a is fixed to the inside of the third member 76, most of both end edges in the direction orthogonal to the cylinder axis direction of the casing 70 in the circuit board 50 a 3 is in contact with the member 76. Here, the portion in contact with the third member 76 corresponds to a portion from the portion corresponding to the lower end edge of the third member 76 in FIG. 2 to the portion separated by the length L20 toward the upper end portion. . Thus, for example, the contact area with the third member 76 can be increased as compared with a configuration in which only the lower end portion of the circuit board 50a is in contact with the third member 76. Therefore, the heat transfer efficiency from the circuit board 50a to the third member 76 can be improved. Further, since most of the end portions of the circuit board 50a are supported by the guide portion 73, it is possible to suppress the swinging of the circuit board 50a when an impact is applied to the lamp 1. Therefore, for example, compared to a configuration in which only the lower end portion of the circuit board 50a is supported by the guide, the electrical insulation between the circuit board 50a and the first member 72 when an impact is applied to the lamp 1 is obtained. It has the advantage of being easy to secure.
　図２および図３に示すように、第４部材７８は、円筒状の形状を有し、第２部材７４の下端部から下方向に延出している。また、第４部材７８の外周面には、雄螺子部が形成されており、雄螺子部に口金４０が外嵌されることにより、第４部材７８の下側開口７８ｃが口金４０により塞がれている。第４部材７８の内部には、電源ユニット５０の一部を構成する電解コンデンサ５０ｄが配置されている。 As shown in FIGS. 2 and 3, the fourth member 78 has a cylindrical shape and extends downward from the lower end of the second member 74. Further, a male screw portion is formed on the outer peripheral surface of the fourth member 78, and the lower opening 78c of the fourth member 78 is closed by the mouthpiece 40 by fitting the mouthpiece 40 to the male screw portion. It is done. Inside the fourth member 78, an electrolytic capacitor 50d that constitutes a part of the power supply unit 50 is disposed.
　ランプ１について、口金４０を取り除いた状態でランプ軸Ｊに沿った方向から見たときの平面図を図５に示す。 A plan view of the lamp 1 when viewed from the direction along the lamp axis J with the cap 40 removed is shown in FIG.
　図５に示すように、第４部材７８の内周面の形状は、電解コンデンサ５０ｄの外周面に沿った形状となっており、その分、第４部材７８の内周面と電解コンデンサ５０ｄの外周面との間の距離が小さくなっている。言い換えると、第４部材７８は、筐体７０の筒軸Ｊ１方向に直交する断面において、外周面が円形であり且つ内周面の一部（図５では、２つの電解コンデンサ５０ｄの並び方向に直交する方向で対向する部位）が電解コンデンサ５０ｄの外周面に近づくような厚み分布を有している。また、第４部材７８の内周面のうち、２つの電解コンデンサ５０ｄの間に対向する部位には、電源線５２ａ，５２ｂを挿通させるための凹部７８ａ，７８ｂが形成されている。 As shown in FIG. 5, the shape of the inner peripheral surface of the fourth member 78 is a shape along the outer peripheral surface of the electrolytic capacitor 50d, and accordingly, the inner peripheral surface of the fourth member 78 and the electrolytic capacitor 50d The distance between the outer circumferential surface is smaller. In other words, in the cross section orthogonal to the direction of the cylinder axis J1 of the housing 70, the fourth member 78 has a circular outer circumferential surface and a part of the inner circumferential surface (in FIG. It has a thickness distribution such that portions facing in the orthogonal direction are close to the outer peripheral surface of the electrolytic capacitor 50d. Further, concave portions 78a and 78b for inserting the power supply lines 52a and 52b are formed in portions of the inner peripheral surface of the fourth member 78 facing each other between the two electrolytic capacitors 50d.
　第４部材７８が前述のような厚み分布を有していることにより、電解コンデンサ５０ｄで発生した熱が、第４部材７８に伝達し易くなっている。そして、第４部材７８に伝達した熱は、口金４０および口金４０に嵌合する照明装置のソケット（図示せず）を介して照明装置側に放出される。このようにして、電解コンデンサ５０ｄで発生した熱の照明装置側への放出を促進することで、電解コンデンサ５０ｄの熱破壊の抑制を図ることができる。 Since the fourth member 78 has the above-described thickness distribution, the heat generated in the electrolytic capacitor 50 d can be easily transmitted to the fourth member 78. Then, the heat transferred to the fourth member 78 is released to the lighting device side through the base 40 and the socket (not shown) of the lighting device fitted to the base 40. In this way, by promoting the release of heat generated by the electrolytic capacitor 50d to the lighting device side, it is possible to suppress the thermal destruction of the electrolytic capacitor 50d.
　第４部材７８は、樹脂材料或いは無機材料からなる絶縁性材料で形成されている。この樹脂材料および無機材料は、第２部材７４を構成する材料を同じであるので詳細な説明は省略する。 The fourth member 78 is formed of an insulating material made of a resin material or an inorganic material. Since the resin material and the inorganic material are the same as the material forming the second member 74, the detailed description will be omitted.
　図２および図３に示すように、第５部材７９は、円筒状の形状を有し、第２部材７４の上端部から上側に延出している。第５部材７９は、筐体７０の上端部の内側に基台６０が配置された状態で基台６０の周面から離間している。そして、グローブ２０は、その開口端部２０ｂが第５部材７９の内周面と基台６０の周面との間に配置された状態で筐体７０に取着されている。ここで、グローブ２０は、第５部材７９の内周面と基台６０の周面との間に介在させた接着剤（図示せず）等によりその開口端部２０ｂが第５部材７９や基台６０に固着されている。なお、グローブ２０は、第５部材７９の内側に圧入固定されるものであってもよい。 As shown in FIGS. 2 and 3, the fifth member 79 has a cylindrical shape and extends upward from the upper end of the second member 74. The fifth member 79 is separated from the circumferential surface of the base 60 in a state where the base 60 is disposed inside the upper end portion of the housing 70. The glove 20 is attached to the housing 70 in a state where the opening end 20 b is disposed between the inner peripheral surface of the fifth member 79 and the peripheral surface of the base 60. Here, the opening end 20 b of the glove 20 is formed of an adhesive (not shown) or the like interposed between the inner peripheral surface of the fifth member 79 and the peripheral surface of the base 60. It is fixed to the table 60. The glove 20 may be press-fit and fixed to the inside of the fifth member 79.
　或いは、第５部材７９と基台６０の周面との間に充填された接着剤の中に、グローブ２０の開口端部が埋設されているものであってもよい。ここで、接着剤としては、例えば、熱伝導性の良い樹脂材料（例えば、シリコーン樹脂等）を主原料とするものが挙げられる。 Alternatively, the open end of the glove 20 may be embedded in the adhesive filled between the fifth member 79 and the circumferential surface of the base 60. Here, as an adhesive agent, the thing which uses as a main raw material the resin material (for example, silicone resin etc.) with good heat conductivity is mentioned, for example.
　ここにおいて、基台６０は、第１部材７２の上端部の内側に配置され、基台６０と第１部材７２の上端部との間には、熱伝導性の良い樹脂材料が介在していることになる。ここで、基台６０の周面全体と第１部材７２の上端部の内周面との間に樹脂材料が充填されているものであってもよい。或いは、基台６０の周面と第１部材７２の上端部の内周面との間に、樹脂材料が介在する部分と、空隙が形成されている部分とが存在するものであってもよい。 Here, the base 60 is disposed inside the upper end of the first member 72, and between the base 60 and the upper end of the first member 72, a resin material having good thermal conductivity is interposed. It will be. Here, the resin material may be filled between the entire peripheral surface of the base 60 and the inner peripheral surface of the upper end portion of the first member 72. Alternatively, between the circumferential surface of the base 60 and the inner circumferential surface of the upper end portion of the first member 72, a portion in which the resin material intervenes and a portion in which a gap is formed may exist. .
　更には、グローブ２０と第５部材７９との間に熱伝導性の樹脂材料からなる接着剤が充填されているものであってもよい。また、グローブ２０と第５部材７９との間において、接着剤が塗布された部分が第５部材７９の内周部の複数個所に点在していてもよい。 Furthermore, an adhesive made of a thermally conductive resin material may be filled between the glove 20 and the fifth member 79. Further, between the globe 20 and the fifth member 79, portions to which the adhesive is applied may be scattered at a plurality of locations on the inner peripheral portion of the fifth member 79.
　また、第５部材７９の上端部は、筐体７０の筒軸Ｊ１周りの全周に亘ってグローブ２０の外周面に当接している。これにより、基台６０および第１部材７２が、ランプ１の外部と空間的に遮断され、ユーザがランプ１外部から基台６０や第１部材７２に触れることができないようになっている。こうすることで、ランプ１を取り扱うユーザの安全性向上を図ることができる。 Further, the upper end portion of the fifth member 79 abuts on the outer peripheral surface of the glove 20 over the entire circumference of the casing 70 around the cylinder axis J1. Thereby, the base 60 and the first member 72 are spatially isolated from the outside of the lamp 1 so that the user can not touch the base 60 or the first member 72 from the outside of the lamp 1. By doing this, the safety of the user who handles the lamp 1 can be improved.
　この第５部材７９は、樹脂材料或いは無機材料からなる絶縁性材料で形成されている。この樹脂材料および無機材料は、第２部材７４を構成する材料を同じであるので詳細な説明は省略する。 The fifth member 79 is formed of an insulating material made of a resin material or an inorganic material. Since the resin material and the inorganic material are the same as the material forming the second member 74, the detailed description will be omitted.
　ところで、ランプ１においては、万が一、回路基板５０ａと第１部材７２とが導通してしまった場合、第２部材７４の外周面と第１部材７２との間で沿面放電が生じないようにすることが安全性の観点から重要である。この点について、ランプ１に対して、第２部材７４の外周面と第１部材７２との間に、３乃至４ｋＶ以上の電圧が印加されても沿面放電（絶縁破壊）が生じないだけの性能が国際的に求められつつある。 By the way, in the lamp 1, creeping discharge is prevented from being generated between the outer peripheral surface of the second member 74 and the first member 72 if the circuit board 50a and the first member 72 are conducted by any chance. Is important from the viewpoint of safety. In this respect, the lamp 1 has such a performance that no creeping discharge (electric breakdown) occurs even if a voltage of 3 to 4 kV or more is applied between the outer peripheral surface of the second member 74 and the first member 72. Is being sought internationally.
　このことを考慮すると、第５部材７９の筐体７０の筒軸に沿った長さＬ１０は、４ｍｍ以上に設定するのが好ましい。 In consideration of this, it is preferable to set the length L10 along the cylinder axis of the casing 70 of the fifth member 79 to 4 mm or more.
　以上のように、本実施の形態に係る筐体７０は、金属材料からなる部材と樹脂材料からなる部材を一体成形したものであり、筐体７０は、グローブ２０が取着される側から、樹脂材料からなるいわゆる１層構造の部位、樹脂材料からなる層の内側に金属材料からなる層が形成されてなるいわゆる２層構造の部位、金属材料からなる層の厚み方向の両側に樹脂材料からなる層が形成されてなるいわゆる３層構造の部位、樹脂材料からなるいわゆる１層構造の部位が順番に配置されている。 As described above, the case 70 according to the present embodiment is obtained by integrally molding a member made of a metal material and a member made of a resin material, and the case 70 is from the side to which the glove 20 is attached, A portion of a so-called single-layer structure made of a resin material, a portion of a so-called two-layer structure formed of a layer made of a metal material inside a layer made of a resin material, a resin material on both sides in the thickness direction of a layer made of a metal material A so-called three-layer structure portion in which the following layer is formed and a so-called one-layer structure portion made of a resin material are arranged in order.
　ところで、ランプ１では、基台６０が筐体７０に固定された状態では、基台６０の周面と第１部材７２の内周面との間に隙間が生じている。 By the way, in the lamp 1, when the base 60 is fixed to the housing 70, a gap is generated between the peripheral surface of the base 60 and the inner peripheral surface of the first member 72.
　ランプ１について、発光モジュール１０、グローブ２０、光散乱部材３２および反射部材３４を取り除いた状態でランプ軸方向から見たときの一部破断した平面図を図６（ａ）に示す。 FIG. 6A shows a partially broken plan view of the lamp 1 with the light emitting module 10, the globe 20, the light scattering member 32, and the reflecting member 34 removed, as viewed from the lamp axis direction.
　図６（ａ）に示すように、基台６０の外径は、第１部材７２の上端部の内径よりも小さく、第１部材７２の内周面と基台６０の周面との間の隙間Ｗは、基台６０の周面全体に亘って生じている。これは次の理由による。 As shown in FIG. 6A, the outer diameter of the base 60 is smaller than the inner diameter of the upper end of the first member 72, and between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60. The gap W is generated over the entire peripheral surface of the base 60. This is due to the following reason.
　ランプ１の製造工程では、基台６０を筐体７０に対して筐体７０の筒軸Ｊ１周りに回転させて、基台６０の貫通孔６０ｄの位置と第３部材７６の突出部７６ｂに設けられた螺子孔７６ｂ１の位置とが筒軸Ｊ１に沿った方向から見たときに一致するように調整する。このとき、第１部材７２の内周面と基台６０の周面とが面接触していると、接触部分の摩擦により基台６０を筐体７０に対して回転させにくくなってしまう。そこで、第１部材７２の内周面と基台６０の周面との間に隙間Ｗを設けることにより、基台６０を筐体７０に対して回転させ易くし、基台６０の筐体７０に対する位置調整を容易にしているのである。 In the manufacturing process of the lamp 1, the base 60 is rotated around the cylindrical axis J 1 of the housing 70 with respect to the housing 70 to provide the through holes 60 d of the base 60 and the projection 76 b of the third member 76. The positions of the screw holes 76b1 are adjusted to coincide with each other when viewed from the direction along the cylinder axis J1. At this time, when the inner peripheral surface of the first member 72 and the peripheral surface of the base 60 are in surface contact, the base 60 is difficult to rotate with respect to the housing 70 due to the friction of the contact portion. Therefore, by providing the gap W between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60, the base 60 can be easily rotated with respect to the housing 70. It is easy to adjust the position of
　一方、ランプ１では、基台６０から第１部材７２への熱伝達効率をある程度の大きさにしておくことが重要である。その理由は、基台６０から第１部材７２への熱伝達効率が低く、基台６０の温度が上昇してしまうと、発光モジュール１０の温度も上昇し、その結果、発光部１４の発光効率が低下してしまうからである。 On the other hand, in the lamp 1, it is important to set the heat transfer efficiency from the base 60 to the first member 72 to a certain degree. The reason is that the heat transfer efficiency from the base 60 to the first member 72 is low, and when the temperature of the base 60 rises, the temperature of the light emitting module 10 also rises. As a result, the luminous efficiency of the light emitting portion 14 is increased. Because the
　そこで、ランプ１では、基台６０の周面と第１部材７２の内周面との間の距離が、基台６０から第１部材７２への熱伝達効率により定まる規定の長さに設定される。 Therefore, in the lamp 1, the distance between the peripheral surface of the base 60 and the inner peripheral surface of the first member 72 is set to a prescribed length determined by the heat transfer efficiency from the base 60 to the first member 72. Ru.
　ランプ１について、発光モジュール１０の点灯時における、基台６０の温度と、基台６０と第１部材７２との間の隙間Ｗの大きさとの関係を表した図を図６（ｂ）に示す。 FIG. 6B shows the relationship between the temperature of the base 60 and the size of the gap W between the base 60 and the first member 72 when the light emitting module 10 is lit for the lamp 1. .
　図６（ｂ）に示すように、発光モジュール１０の点灯時における基台６０の温度は、隙間Ｗの長さが増加するに伴い、略指数関数的に増加していく。つまり、隙間Ｗの長さが増加すると、基台６０から第１部材７２への熱伝達効率が減少し、その分、基台６０の温度が上昇する。 As shown in FIG. 6B, the temperature of the base 60 at the time of lighting of the light emitting module 10 increases substantially exponentially as the length of the gap W increases. That is, when the length of the gap W increases, the heat transfer efficiency from the base 60 to the first member 72 decreases, and the temperature of the base 60 rises accordingly.
　ここで、基台６０の許容温度の上限値は、発光モジュール１０の許容温度の上限値から定まる値に設定する必要がある。この発光モジュール１０の許容温度は、発光モジュール１０の発光部１４の温度特性から定まる。例えば、発光部１４の温度特性が、９０℃を超えると急激に発光効率が低下するものであれば、発光モジュール１０の許容温度は９０℃以下となり、基台６０の許容温度の上限値Ｔｔｈも９０℃となる。 Here, the upper limit value of the allowable temperature of the base 60 needs to be set to a value determined from the upper limit value of the allowable temperature of the light emitting module 10. The allowable temperature of the light emitting module 10 is determined from the temperature characteristics of the light emitting unit 14 of the light emitting module 10. For example, if the temperature characteristic of the light emitting portion 14 exceeds 90 ° C., the luminous efficiency drops sharply, the allowable temperature of the light emitting module 10 becomes 90 ° C. or lower, and the upper limit Tth of the allowable temperature of the base 60 is also 90 ° C.
　ここにおいて、発明者は、直径４７ｍｍ、厚み２ｍｍの基台６０と、筐体７０の筒軸Ｊ１方向の長さが５ｃｍの第１部材７２とを備え消費電力が６Ｗのランプ１の一実施例では、図６（ｂ）における基台６０の許容温度の上限値Ｔｔｈが９０℃の場合、隙間Ｗの上限値Ｗｔｈは約１００μｍとなるという知見を得ている。つまり、この一実施例に係るランプ１では、基台６０から第１部材７２への熱伝達効率により定まる規定の長さが約１００μｍとなる。 Here, the inventor is an example of a lamp 1 having a base 60 having a diameter of 47 mm and a thickness of 2 mm, and a first member 72 having a length of 5 cm in the direction of the cylinder axis J1 of the housing 70 and consuming 6 W In the case where the upper limit Tth of the allowable temperature of the base 60 in FIG. 6B is 90 ° C., it is found that the upper limit Wth of the gap W is about 100 μm. That is, in the lamp 1 according to this embodiment, the defined length determined by the heat transfer efficiency from the base 60 to the first member 72 is about 100 μm.
　次に、本実施の形態に係る筐体７０について比較例の筐体２０７０と対比しながら説明する。 Next, the case 70 according to the present embodiment will be described in comparison with the case 2070 of the comparative example.
　図３（ｂ）に示すように、筐体７０は、第１部材７２の上端面の一部が第５部材７９の一部に覆われることなく露出している。 As shown in FIG. 3B, in the case 70, a part of the upper end surface of the first member 72 is exposed without being covered by a part of the fifth member 79.
　一方、図３（ｃ）に示すように、比較例に係る筐体２０７０では、第１部材７２の上端面の一部が第５部材２０７９の下端部から内側に突出する内鍔部２０７９ａにより覆われている。ここで、第１部材７２が金属材料であるＡｌから形成され、第５部材２０７９および第２部材７４がポリブチレンテレフタレートから形成されているとする。ここで、第１部材７２を構成するＡｌの熱膨張係数が２５×１０-6［１／Ｋ］程度であるのに対して、第２部材７４および第５部材２０７９を構成するポリブチレンテレフタレートの熱膨張係数が約６０×１０-6［１／Ｋ］である。従って、この筐体２０７０は、温度変化の大きい環境に置くと、第１部材７２、第２部材７４および第５部材２０７９それぞれを構成する材料の熱膨張係数の差異に起因して、第２部材７４および第５部材２０７９に応力が加わる。具体的には、周囲温度が急激に低下すると、第２部材７４および第５部材２０７９の収縮幅が第１部材７２の収縮幅よりも大きくなり、その結果、第５部材２０７９の内鍔部２０７９ａに対して、筐体２０７０の筒軸方向に沿って上に押し上げる方向に力が加わる。この内鍔部２０７９ａに加わる力が大きい場合、第２部材７４および第５部材２０７９にクラック等が発生してしまうおそれがある。 On the other hand, as shown in FIG. 3C, in the case 2070 according to the comparative example, a part of the upper end surface of the first member 72 is covered by the inner flange portion 2079a projecting inward from the lower end of the fifth member 2079. It is Here, it is assumed that the first member 72 is formed of Al, which is a metal material, and the fifth member 2079 and the second member 74 are formed of polybutylene terephthalate. Here, while the thermal expansion coefficient of Al constituting the first member 72 is about 25 × 10 −6 [1 / K], the polybutylene terephthalate constituting the second member 74 and the fifth member 2079 The thermal expansion coefficient is about 60 × 10 −6 [1 / K]. Therefore, when the housing 2070 is placed in a large temperature change environment, the second member is caused by the difference in the thermal expansion coefficients of the materials constituting the first member 72, the second member 74, and the fifth member 2079. 74 and the fifth member 2079 are stressed. Specifically, when the ambient temperature sharply decreases, the contraction width of the second member 74 and the fifth member 2079 becomes larger than the contraction width of the first member 72, and as a result, the inner ridge portion 2079a of the fifth member 2079 On the other hand, a force is applied in the upward direction along the cylinder axis direction of the housing 2070. When the force applied to the inner flange portion 2079a is large, there is a possibility that a crack or the like may be generated in the second member 74 and the fifth member 2079.
　これに対して、本実施の形態に係る筐体７０では、第１部材７２の上端面が第５部材７９の一部に覆われることなく露出している。これにより、温度変化の大きい環境に置いても、第１部材７２、第２部材７４および第５部材７９それぞれを構成する材料の熱膨張係数の差異に起因して第２部材７４および第５部材７９に加わる応力を低減することができる。 On the other hand, in the case 70 according to the present embodiment, the upper end surface of the first member 72 is exposed without being covered by a part of the fifth member 79. As a result, even if the first member 72, the second member 74 and the fifth member 79 are placed in an environment where the temperature change is large, the second member 74 and the fifth member are caused due to the difference in the thermal expansion coefficients of the materials constituting the first member The stress applied to 79 can be reduced.
　ところで、本実施の形態に係るランプ１を製造する場合、基台６０を第３部材７６の突出部７６ｂの上端面に載置し、基台６０の姿勢が安定した状態で、基台６０を筐体７０に螺子６２を用いて固定する。従って、ランプ１を複数製造する場合、当該複数のランプ１間で、基台６０を筐体７０に固定した後における基台６０の姿勢のばらつきを低減することができる。従って、複数のランプ１間で、基台６０の上面に設けられた発光モジュール１０の主出射方向のばらつきを低減することができ、ひいては、ランプ１の配光特性のばらつきを低減できる。 By the way, when manufacturing the lamp 1 which concerns on this Embodiment, the base 60 is mounted in the upper end surface of the protrusion part 76b of the 3rd member 76, and the base 60 is stabilized in the state which the attitude | position of the base 60 was stable. It fixes to the housing | casing 70 using the screw 62. As shown in FIG. Therefore, in the case where a plurality of lamps 1 are manufactured, it is possible to reduce variation in the attitude of the base 60 after fixing the base 60 to the housing 70 among the plurality of lamps 1. Accordingly, it is possible to reduce the variation in the main emission direction of the light emitting module 10 provided on the upper surface of the base 60 among the plurality of lamps 1 and, consequently, to reduce the variation in the light distribution characteristics of the lamps 1.
　また、基台の外径が筐体の内径に比べて若干大きく基台が筐体に圧入固定されている構成に比べて、基台６０の姿勢のばらつきを低減することができるので、ランプ１の配光特性のばらつきを低減できるという利点がある。 In addition, since the outer diameter of the base is slightly larger than the inner diameter of the casing and the variation in the attitude of the base 60 can be reduced compared to the configuration in which the base is press-fitted and fixed to the casing, the lamp 1 Is advantageous in that variations in light distribution characteristics of the light source can be reduced.
　＜２＞筐体の製造方法について
　本実施の形態に係る筐体７０の製造工程について説明する。ここでは、筐体７０が、金属材料からなる第１部材７２と、樹脂材料からなる第２部材７４乃至第５部材７９とを一体成型（いわゆるインサート成型）することにより形成される例について説明する。 <2> Method of Manufacturing Case The manufacturing process of the case 70 according to the present embodiment will be described. Here, an example will be described in which the case 70 is formed by integrally molding (so-called insert molding) the first member 72 made of a metal material and the second member 74 to the fifth member 79 made of a resin material. .
　具体的には、筐体７０は、金型内に第１部材７２を配置した状態で、金型内に溶融した樹脂材料を充填し、樹脂材料を固化させることにより形成される。以下、詳細に説明する。 Specifically, the housing 70 is formed by filling the molten resin material in the mold and solidifying the resin material in a state where the first member 72 is disposed in the mold. The details will be described below.
　筐体７０の製造方法を説明するための断面図を図７および図８に示す。 Cross-sectional views for explaining a method of manufacturing the housing 70 are shown in FIGS. 7 and 8.
　まず、固定金型１３７６および可動金型１３７４を準備する。図７（ａ）に示すように、固定金型１３７６は、筐体７０の内側の領域の形状に等しい部位（以下、「突出部位」と称す。）１３７６ａを有する。図７（ｂ）に示すように、可動金型１３７４は、筐体７０の外形に沿った形状を有する空洞１３７４ａを有し、固定金型１３７６に対して突出部位１３７６ａの突出方向に移動可能である。ここにおいて、可動金型１３７４と固定金型１３７６とは、可動金型１３７４の空洞１３７４ａ内に第１部材７２が配置された状態で、可動金型１３７４の空洞１３７４ａを密閉状態にすることができる形状を有している。ここで、可動金型１３７４および固定金型１３７６は、例えば、炭素鋼等の耐熱鋼から形成されている。また。可動金型１３７４の一部には、成型機により可動金型１３７４の空洞１３７４ａと固定金型１３７６の突出部位１３７６ａとにより形成される空間に溶融した樹脂材料を射出するための射出孔１３７４ｂが形成されている。 First, the fixed mold 1376 and the movable mold 1374 are prepared. As shown in FIG. 7A, the fixed mold 1376 has a portion (hereinafter referred to as “projected portion”) 1376a equal to the shape of the region inside the housing 70. As shown in FIG. 7 (b), the movable mold 1374 has a cavity 1374 a having a shape along the outer shape of the housing 70, and is movable in the projecting direction of the projecting portion 1376 a with respect to the fixed mold 1376 is there. Here, the movable mold 1374 and the fixed mold 1376 can seal the cavity 1374a of the movable mold 1374 in a state where the first member 72 is disposed in the cavity 1374a of the movable mold 1374. It has a shape. Here, the movable mold 1374 and the fixed mold 1376 are made of, for example, a heat-resistant steel such as carbon steel. Also. In a part of the movable mold 1374, an injection hole 1374b for injecting a molten resin material is formed in a space formed by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a of the fixed mold 1376 by a molding machine. It is done.
　次に、第１部材７２を固定金型１３７６の突出部位１３７６ａに被せる（図７（ａ）の矢印参照）。 Next, the first member 72 is placed on the projecting portion 1376a of the fixed mold 1376 (see the arrow in FIG. 7A).
　続いて、可動金型１３７４を第１部材７２の外側に被せる（図７（ｂ）の矢印参照）。すると、第１部材７２は、可動金型１３７４の空洞１３７４ａと固定金型１３７６の突出部位１３７６ａとで囲まれた空間内に配置されるとともに、当該空間は密閉された状態となる。 Subsequently, the movable mold 1374 is placed on the outside of the first member 72 (see the arrow in FIG. 7B). Then, the first member 72 is disposed in the space surrounded by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a of the fixed mold 1376, and the space is sealed.
　その後、成型機のノズルＮを射出孔１３７４ｂに接続し、ノズルＮから射出孔１３７４ｂを介して溶融した樹脂材料を射出する。このとき、射出圧は、１０乃至３０００ｋｇｆ／ｃｍ2程度に設定すればよい。すると、可動金型１３７４の空洞１３７４ａと固定金型１３７６の突出部位１３７６ａとで囲まれた空間のうち第１部材７２で占有される部分を除く空間が樹脂材料で充填される（図８（ａ）参照）。 Thereafter, the nozzle N of the molding machine is connected to the injection hole 1374b, and the molten resin material is injected from the nozzle N through the injection hole 1374b. At this time, the injection pressure may be set to about 10 to 3000 kgf / cm 2 . Then, the space excluding the portion occupied by the first member 72 in the space surrounded by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a of the fixed mold 1376 is filled with the resin material (FIG. 8 (a )reference).
　ここで、樹脂材料として熱可塑性樹脂を用いる場合、例えば、当該樹脂材料の融点よりも５０℃乃至１５０℃だけ高い温度に熱することにより樹脂材料を溶融する。このように、融点よりも数十度乃至百数十度だけ高い温度で溶融することにより、溶融状態における樹脂材料の粘度を低下させることができ、樹脂材料を充填し易くなる。 Here, when a thermoplastic resin is used as the resin material, for example, the resin material is melted by heating to a temperature that is higher by 50 ° C. to 150 ° C. than the melting point of the resin material. Thus, the viscosity of the resin material in the molten state can be reduced by melting at a temperature several tens to a few tens of degrees higher than the melting point, and the resin material can be easily filled.
　そして、樹脂材料が充填された可動金型１３７４および固定金型１３７６を冷却することにより、樹脂材料を固化し、その後、可動金型１３７４を固定金型１３７６に対して突出部位１３７６ａの突出方向に引き抜く（図８（ｂ）の矢印ＡＲ１参照）。 Then, the movable mold 1374 and the fixed mold 1376 filled with the resin material are cooled to solidify the resin material, and thereafter, the movable mold 1374 is moved relative to the fixed mold 1376 in the projecting direction of the projecting portion 1376a. It pulls out (refer arrow AR1 of FIG.8 (b)).
　そして、第１部材７２を含む構造体１２７０を固定金型１３７６から取り外す（図８（ｂ）の矢印ＡＲ２参照）。ここで、構造体１２７０は、筐体７０における可動金型１３７４の射出孔１３７４ｂに対応する部位に余り部１２７８が突出した形状をしている。 Then, the structure 1270 including the first member 72 is removed from the fixed mold 1376 (see an arrow AR2 in FIG. 8B). Here, the structure 1270 has a shape in which the surplus portion 1278 protrudes from a portion of the housing 70 corresponding to the injection hole 1374b of the movable mold 1374.
　最後に構造体１２７０から余り部１２７８を削り取ることにより、図３に示すような筐体７０が完成する。 Finally, the remaining portion 1278 is scraped off the structure 1270 to complete the housing 70 as shown in FIG.
　ところで、本実施の形態では、可動金型１３７４の空洞１３７４ａと固定金型１３７６の突出部位１３７６ａ（図７（ｂ）参照）とで囲まれた空間のうち、第１部材７２の筒軸に直交する方向において、第１部材７２よりも内側に位置する領域（以下、「内側領域」と称する。）の容積と、第１部材７２の外側に位置する領域（以下、「外側領域」と称する。）の容積とが略等しくなっている。 By the way, in the present embodiment, in the space surrounded by the cavity 1374a of the movable mold 1374 and the projecting portion 1376a (see FIG. 7B) of the fixed mold 1376, it is orthogonal to the cylinder axis of the first member 72. In the direction, the volume of the region located inside the first member 72 (hereinafter referred to as "the inner region") and the region located outside the first member 72 (hereinafter referred to as the "outside region"). And the volume of.
　例えば、内側領域の容積が外側領域の容積よりも大きい場合、外側領域の樹脂材料の充填が完了した後に内側領域の樹脂材料の充填が完了する。すると、外側領域の樹脂材料の充填のみが完了し、内側領域の樹脂材料の充填が完了していない期間では、第１部材７２の外側から内側に加わる圧力が第１部材の内側から外側に加わる圧力に比べて大きくなり、第１部材７２に歪が加わってしまうおそれがある。第１部材７２に歪が加わった状態で筐体７０が形成されると、第２部材７４や第３部材７６に応力が生じてしまい、筐体７０が劣化し易くなるおそれがある。 For example, if the volume of the inner region is greater than the volume of the outer region, the filling of the resin material of the inner region is complete after the filling of the resin material of the outer region is completed. Then, only the filling of the resin material in the outer region is completed, and while the filling of the resin material in the inner region is not completed, the pressure applied from the outer side to the inner side of the first member 72 is applied to the outer side from the inner side of the first member The pressure is larger than the pressure, and the first member 72 may be distorted. If the housing 70 is formed in a state in which the first member 72 is distorted, stress may be generated in the second member 74 and the third member 76, and the housing 70 may be easily deteriorated.
　これに対して、本実施の形態では、内側領域の容積と外側領域の容積とを略等しくすることにより、樹脂材料を充填する工程中、第１部材７２の外側から内側に加わる圧力と第１部材の内側から外側に加わる圧力とが常に略等しくなるようにしている。このようにして、樹脂材料を充填する工程中における第１部材７２に加わる歪を低減している。そして、筐体７０の耐劣化性能の向上を図っている。 On the other hand, in the present embodiment, the pressure applied from the outside to the inside of the first member 72 during the process of filling the resin material is made substantially equal by making the volume of the inner region substantially equal to the volume of the outer region. The pressure applied from the inside to the outside of the member is always made substantially equal. In this way, the strain applied to the first member 72 during the process of filling the resin material is reduced. And the improvement of the anti-deterioration performance of case 70 is aimed at.
　なお、前述では、樹脂材料として熱可塑性樹脂を用いる場合について説明したが、樹脂材料としては熱可塑性樹脂に限定されるものではなく、熱硬化性樹脂を用いてもよい。この場合、樹脂材料を約５０℃程度に熱することにより溶融した樹脂材料を、可動金型１３７４の空洞１３７４ａと固定金型１３７６の突出部位１３７６ａとで囲まれた空間に充填する。そして、樹脂材料が充填された可動金型１３７４および固定金型１３７６を約１５０℃程度に加熱することにより樹脂材料を固化させる。この熱硬化性樹脂は、溶融した状態における粘度が熱可塑性樹脂に比べて低い。そのため、射出圧を低くすることができるので、樹脂材料を充填する工程中に、第１部材７２に加わる圧力を低減することができるという利点がある。 In addition, although the case where a thermoplastic resin is used as a resin material was demonstrated above, as a resin material, it is not limited to a thermoplastic resin, You may use a thermosetting resin. In this case, the resin material melted by heating the resin material to about 50 ° C. is filled in the space surrounded by the cavity 1374 a of the movable mold 1374 and the projecting portion 1376 a of the fixed mold 1376. Then, the movable mold 1374 and the fixed mold 1376 filled with the resin material are heated to about 150 ° C. to solidify the resin material. The thermosetting resin has a lower viscosity in the molten state than a thermoplastic resin. Therefore, since the injection pressure can be lowered, there is an advantage that the pressure applied to the first member 72 can be reduced during the process of filling the resin material.
　＜３＞まとめ
　結局、本実施の形態に係るランプ１では、金属材料からなる第１部材７２の外周面が、絶縁性材料からなる第２部材７４により覆われている。これにより、発光モジュール１０から基台６０を介して第１部材７２に漏電した場合でも、第１部材７２の外周面が絶縁性材料からなる第２部材７４で覆われていることにより、第１部材７２から筐体７０外部への漏電を防止することができる。 <3> Summary After all, in the lamp 1 according to the present embodiment, the outer peripheral surface of the first member 72 made of a metal material is covered by the second member 74 made of an insulating material. Thus, even when the light emitting module 10 leaks to the first member 72 through the base 60, the outer peripheral surface of the first member 72 is covered with the second member 74 made of an insulating material, thereby the first Electric leakage from the member 72 to the outside of the housing 70 can be prevented.
　また、基台６０と第１部材７２とは、空隙を介して離間している。これにより、基台６０の周面と第１部材７２の内周面との間に、断熱性材料からなる部材が介在する構成（図１４参照）に比べて、基台６０から第１部材７２への伝熱効率を向上させることができるので、その分、放熱性向上を図ることができる。 Further, the base 60 and the first member 72 are separated via a gap. Thus, compared to a configuration in which a member made of a heat insulating material is interposed between the circumferential surface of base 60 and the inner circumferential surface of first member 72 (see FIG. 14), base 60 to first member 72 The heat transfer efficiency can be improved, and accordingly, the heat dissipation can be improved.
　＜実施の形態２＞
　本実施の形態に係る照明装置５０１の一部破断した側面図を図９に示す。 Second Embodiment
A partially broken side view of a lighting device 501 according to the present embodiment is shown in FIG.
　照明装置５０１は、実施の形態１に係るランプ１と、照明器具５０３とを備える。ここで、照明器具５０３は、いわゆるダウンライト用照明装置である。 The lighting device 501 includes the lamp 1 according to the first embodiment and a lighting fixture 503. Here, the lighting fixture 503 is a so-called lighting device for downlight.
　照明器具５０３は、ランプ１と電気的に接続され且つランプを保持するソケット５０５と、ランプ１から発せられた光を所定方向に反射させる椀状の反射板５０７と、外部の商用電源と接続される接続部５０９とを備える。 The lighting fixture 503 is connected to a socket 505 which is electrically connected to the lamp 1 and holds the lamp, a bowl-shaped reflection plate 507 which reflects light emitted from the lamp 1 in a predetermined direction, and an external commercial power supply. And a connection unit 509.
　ここでの反射板５０７は、天井５１１の開口５１３を介してソケット５０５側が天井５１１の裏側に位置するように天井５１１に取り付けられている。 The reflecting plate 507 here is attached to the ceiling 511 such that the socket 505 side is located on the back side of the ceiling 511 via the opening 513 of the ceiling 511.
　なお、図９に示す照明装置の構造は単なる一例であり、前述のダウンライト用照明器具に限定されるものでない。また、照明装置５０１では、ランプ１のランプ軸Ｊが、椀状をした反射板５０７の中心軸と略一致するように配置されていたが、ランプ１のランプ軸Ｊが、反射板５０７の中心軸に対し傾斜した状態で配置されるものであってもよい。更に、ランプ１に内蔵された電源ユニット５０の一部を、照明器具５０３側に配置してもよい。 In addition, the structure of the illuminating device shown in FIG. 9 is a mere example, and is not limited to the above-mentioned lighting fixture for downlights. Further, in the lighting device 501, the lamp axis J of the lamp 1 is disposed so as to substantially coincide with the central axis of the wedge-shaped reflection plate 507, but the lamp axis J of the lamp 1 is the center of the reflection plate 507 It may be disposed in an inclined state with respect to the axis. Furthermore, a part of the power supply unit 50 built in the lamp 1 may be disposed on the lighting fixture 503 side.
　＜変形例＞
　（１）実施の形態１では、電源ユニット５０が全て第３部材７６の内側に配置されているランプ１の例について説明したが、これに限定されるものではなく、電源ユニット５０の一部が、基台６０の電源ユニット５０側の主面に形成された凹部の内側に配置されているものであってもよい。 <Modification>
(1) In the first embodiment, although the example of the lamp 1 in which all the power supply units 50 are disposed inside the third member 76 has been described, the present invention is not limited to this. Alternatively, it may be disposed inside a recess formed on the main surface of the base 60 on the power supply unit 50 side.
　本変形例に係るランプ２の断面図を図１０に示す。ランプ２では、基台２６０の形状と、筐体２７０の一部を構成する第３部材２７６の形状とが、実施の形態１とは相違する。なお、実施の形態１と同様の構成については同一の符号を付して適宜説明を省略する。 A cross-sectional view of the lamp 2 according to the present modification is shown in FIG. In the lamp 2, the shape of the base 260 and the shape of the third member 276 constituting a part of the housing 270 are different from those of the first embodiment. The same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
　本変形例に係るランプ２では、基台２６０の下面側における鍔部２６０ｂで囲まれた領域が凹部２６０ｇを形成している。そして、この凹部２６０ｇの内側に電源ユニット５０の上端部が位置している。具体的には、第３部材２７６の本体部２７６ａおよび突出部２７６ｂの筐体２７０の筒軸Ｊ１方向における長さが、実施の形態１に係る第３部材７６に比べて短くなっている。これにより、ランプ１に比べて、電源ユニット５０で発生した熱が、第１部材７２に伝達し易くなっているので、その分、電源ユニット５０の熱負荷を低減することができる。従って、電源ユニット５０の長寿命化を図ることができる。 In the lamp 2 according to the present modification, a region surrounded by the flange portion 260b on the lower surface side of the base 260 forms a recess 260g. The upper end of the power supply unit 50 is located inside the recess 260g. Specifically, the length of the main body 276a of the third member 276 and the protrusion 276b in the direction of the cylinder axis J1 of the housing 270 is shorter than that of the third member 76 according to the first embodiment. As a result, the heat generated by the power supply unit 50 is more easily transmitted to the first member 72 compared to the lamp 1, so the heat load of the power supply unit 50 can be reduced accordingly. Therefore, the life of the power supply unit 50 can be extended.
　また、ランプ２は、実施の形態１に係るランプ１に比べて、筐体７０の筒軸方向における、基台２６０の鍔部２６０ｂおよび突出部２６０ｃの長さが長い。また、筐体７０の筒軸方向において、第１部材７２の上端部における第３部材２７６で覆われない部分の長さＬ２が、実施の形態１のランプ１の同長さＬ１に比べて長くなっている。これにより、ランプ２は、ランプ１に比べて、第１部材７２の内周面における基台２６０の周面に対向する部位の面積が増加している。そして、ランプ２は、ランプ１に比べて基台２６０から第１部材７２への伝熱効率が増大している。この長さＬ１は、基台２６０から第１部材７２への熱伝達効率に基づいて定めればよい。この基台２６０から第１部材７２への熱伝達効率は、第１部材７２の内周面のうち基台２６０の周面に対向する部位の面積により規定することができる。 Further, in the lamp 2, compared with the lamp 1 according to the first embodiment, the lengths of the flange portion 260 b and the projecting portion 260 c of the base 260 in the cylinder axial direction of the housing 70 are longer. Further, in the cylinder axial direction of the housing 70, the length L2 of the portion not covered by the third member 276 at the upper end of the first member 72 is longer than the same length L1 of the lamp 1 of the first embodiment. It has become. Thus, in the lamp 2, the area of the portion facing the circumferential surface of the base 260 on the inner circumferential surface of the first member 72 is increased compared to the lamp 1. The heat transfer efficiency from the base 260 to the first member 72 is increased in the lamp 2 compared to the lamp 1. The length L1 may be determined based on the heat transfer efficiency from the base 260 to the first member 72. The heat transfer efficiency from the base 260 to the first member 72 can be defined by the area of the portion of the inner peripheral surface of the first member 72 facing the peripheral surface of the base 260.
　（２）実施の形態１では、第１部材７２の内周面と基台６０の周面との間の隙間Ｗは、基台６０の周面全体に亘って生じているランプ１の例について説明したがこれに限定されるものではなく、基台の周面の少なくとも一部が、第１部材７２の上端部の内周面に接触しているものであってもよい。 (2) In the first embodiment, the gap W between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60 is an example of the lamp 1 generated over the entire peripheral surface of the base 60. Although described above, the present invention is not limited to this, and at least a part of the circumferential surface of the base may be in contact with the inner circumferential surface of the upper end portion of the first member 72.
　本変形例に係るランプについて、発光モジュール１０、グローブ２０、光散乱部材３２および反射部材３４を取り除いた状態における一部破断した平面図を図１１（ａ）および（ｂ）に示す。 A partially broken plan view of the lamp according to the present modification with the light emitting module 10, the globe 20, the light scattering member 32, and the reflecting member 34 removed is shown in FIGS. 11 (a) and 11 (b).
　図１１（ａ）に示す構成では、第１部材７２の内周面と基台３６０の周面とが基台３６０の周部全体に亘って接触している。つまり、第１部材７２の内周面のうち基台３６０の周面に対向する部位の内径が、基台３６０の外径と略等しくなっている。これにより、実施の形態１に係るランプ１に比べて、発光モジュール１０から基台３６０に伝導した熱が第１部材７２に伝導し易く、その分、放熱特性が向上している。 In the configuration shown in FIG. 11A, the inner circumferential surface of the first member 72 and the circumferential surface of the base 360 are in contact over the entire circumferential portion of the base 360. That is, the inner diameter of the portion of the inner peripheral surface of the first member 72 facing the peripheral surface of the base 360 is substantially equal to the outer diameter of the base 360. Thereby, the heat conducted from the light emitting module 10 to the base 360 is easily conducted to the first member 72 as compared with the lamp 1 according to the first embodiment, and the heat radiation characteristic is improved accordingly.
　また、図１１（ｂ）に示す構成では、基台４６０の周面に突設された複数（図１１（ｂ）では８個）の突起部４６０ｇの先端部が、第１部材７２の内周面に接触している。これにより、発光モジュール１０から基台４６０に伝導した熱が、突起部４６０ｇと第１部材７２との接触部位を介して第１部材７２に伝導させることができる。なお、突起部４６０ｇの個数は、８個に限定されるものではなく、９個以上であってもよいし、７個以下であてもよい。また、各突起部４６０ｇは、基台４６０の周方向に等間隔に並んでいる。これにより、基台４６０から第１部材７２に等方的に熱を伝達させることができる。 Further, in the configuration shown in FIG. 11B, the tip of the plurality of (eight in FIG. 11B) protrusions 460g provided on the circumferential surface of the base 460 is the inner periphery of the first member 72. It is in contact with the surface. Thus, the heat conducted from the light emitting module 10 to the base 460 can be conducted to the first member 72 through the contact portion between the protrusion 460 g and the first member 72. The number of protrusions 460g is not limited to eight, and may be nine or more, or seven or less. The protrusions 460 g are arranged at equal intervals in the circumferential direction of the base 460. Thus, heat can be isotropically transferred from the base 460 to the first member 72.
　ところで、ランプの製造工程では、基台４６０を筐体７０に対して筐体７０の筒軸Ｊ１周りに回転させて、基台４６０の貫通孔６０ｄと第３部材７６の螺子孔７６ｂ１との位置関係を調整する。 By the way, in the manufacturing process of the lamp, the base 460 is rotated with respect to the housing 70 about the cylindrical axis J1 of the housing 70 to position the through holes 60d of the base 460 and the screw holes 76b1 of the third member 76. Adjust the relationship.
　これに対して、図１１（ｂ）に示す構成では、突起部４６０ｇの先端部が、筐体７０の筒軸Ｊ１方向から見たときに弧状となっている。これにより、図１１（ａ）に示す構成に比べて、基台４６０を筐体７０に対して筒軸Ｊ１周りに回転させる際の基台４６０の周面と第１部材７２の内周面との間の摩擦抵抗が小さくなっている。従って、図１１（ａ）に示す構成に比べて、基台４６０を筐体７０に対して回転させ易く、基台４６０の筐体７０に対する位置調整が容易になっている。 On the other hand, in the configuration shown in FIG. 11B, the tip end of the protrusion 460g is arc-shaped when viewed from the direction of the cylinder axis J1 of the housing 70. Thus, the peripheral surface of the base 460 and the inner peripheral surface of the first member 72 when the base 460 is rotated around the cylindrical axis J1 with respect to the housing 70 as compared with the configuration shown in FIG. The friction resistance between is reduced. Therefore, compared to the configuration shown in FIG. 11A, the base 460 can be easily rotated with respect to the housing 70, and the position adjustment of the base 460 with respect to the housing 70 can be facilitated.
　なお、突起部４６０ｇの形状はこれに限定されるものではなく、例えば、筐体７０の筒軸Ｊ１方向から見たときの形状が略三角形状等他の形状であってもよい。また、図１１（ｂ）に示す構成では、突起部４６０ｇが基台４６０側に設けられているが、これに限定されるものではなく、例えば、第１部材７２の上端部に筐体７０の筒軸Ｊ１に向かって突出する突起部を設けた構成であってもよい。 The shape of the protrusion 460g is not limited to this. For example, the shape as viewed from the direction of the cylinder axis J1 of the housing 70 may be another shape such as a substantially triangular shape. Further, in the configuration shown in FIG. 11B, the protrusion 460g is provided on the base 460 side, but the present invention is not limited to this. For example, the upper end portion of the first member 72 A configuration may be provided in which a projection that protrudes toward the cylinder axis J1 is provided.
　（３）実施の形態１では、電源ユニット５０の回路基板５０ａが第３部材７６の内側に配置され、電解コンデンサ５０ｄ全体が第４部材７８の内側に配置されているランプ１の例について説明したが、これに限定されるものではなく、電解コンデンサ５０ｄの一部が第１部材および第３部材の内側に配置されているものであってもよい。 (3) In the first embodiment, the example of the lamp 1 in which the circuit board 50a of the power supply unit 50 is disposed inside the third member 76 and the entire electrolytic capacitor 50d is disposed inside the fourth member 78 has been described. However, the present invention is not limited to this, and a part of the electrolytic capacitor 50d may be disposed inside the first member and the third member.
　本変形例に係るランプ３の一部断面図を図１２に示す。なお、実施の形態１と同様の構成については同一の符号を付して適宜説明を省略する。 A partial cross-sectional view of a lamp 3 according to this modification is shown in FIG. The same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
　図１２に示すように、ランプ３では、第１部材３７２、第２部材３７４および第３部材３７６の下端部の内側に、電解コンデンサ５０ｄの上端部が配置されている。これにより、電解コンデンサ５０ｄで発生した熱が、第３部材３７６を介して第１部材３７２に伝導しやすくなっている。 As shown in FIG. 12, in the lamp 3, the upper end portion of the electrolytic capacitor 50 d is disposed inside the lower end portions of the first member 372, the second member 374 and the third member 376. Thereby, the heat generated in the electrolytic capacitor 50 d is easily conducted to the first member 372 through the third member 376.
　また、ランプ３では、筐体３７０の筒軸方向における、第４部材３７８の長さが、実施の形態１のランプ１における第４部材７８の長さに比べて短くなっている。そして、第１部材３７２の下端部と口金４０のシェル部４２の上端部との間の距離Ｌ１２が、ランプ１における第１部材７２の下端部と口金４０のシェル部４２の上端部との間の距離Ｌ１１に比べて短い。これにより、ランプ３では、ランプ１に比べて、第１部材７２に伝導した熱が、口金４０に伝導し易くなっている。この長さＬ１２は、第１部材３７２から口金４０のシェル部４２への熱伝達効率に基づいて定めればよい。ここにおいて、第１部材３７２から口金４０のシェル部４２への熱伝達効率は、第４部材７８のうち第１部材３７２の下端部と口金４０のシェル部４２との間に介在する部位の熱伝導率により規定することができる。 Further, in the lamp 3, the length of the fourth member 378 in the cylinder axial direction of the housing 370 is shorter than the length of the fourth member 78 in the lamp 1 of the first embodiment. The distance L12 between the lower end of the first member 372 and the upper end of the shell 42 of the base 40 is the distance between the lower end of the first member 72 and the upper end of the shell 42 of the base 40 in the lamp 1. Is shorter than the distance L11. Thereby, in the lamp 3, the heat conducted to the first member 72 is more easily conducted to the base 40 than the lamp 1. The length L12 may be determined based on the heat transfer efficiency from the first member 372 to the shell portion 42 of the mouthpiece 40. Here, the heat transfer efficiency from the first member 372 to the shell portion 42 of the mouthpiece 40 is the heat of the portion of the fourth member 78 located between the lower end portion of the first member 372 and the shell portion 42 of the mouthpiece 40. It can be defined by the conductivity.
　（４）実施の形態１では、光散乱部材３２および反射部材３４を備え、基台６０と電源ユニット５０との間に空隙が形成されているランプ１の例について説明したが、これに限定されるものではなく、例えば、光散乱部材および反射部材を備えておらず、基台６０と電源ユニット５０との間に、絶縁性材料からなり筐体内における基台６０が配置される領域と電源ユニット５０が配置される領域とを区切るための区切部材を備える構成であってもよい。 (4) In the first embodiment, the example of the lamp 1 which includes the light scattering member 32 and the reflecting member 34 and in which the air gap is formed between the base 60 and the power supply unit 50 has been described. And a light-scattering member and a reflecting member, for example, an area made of an insulating material between the base 60 and the power supply unit 50 and in which the base 60 is disposed in the housing, and the power supply unit It may be the composition provided with the separation member for separating with the field where 50 is arranged.
　本変形例に係るランプ４の断面図を図１３に示す。なお、実施の形態１と同様の構成については同一の符号を付して適宜説明を省略する。 A cross-sectional view of the lamp 4 according to the present modification is shown in FIG. The same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
　ランプ４は、グローブ４２０の形状、基台５６０の形状および筐体４７０の一部を構成する第３部材４７６の形状が実施の形態１に係るランプ１とは相違する。また、ランプ４は、筐体４７０内において、基台５６０が配置される領域と電源ユニット５０が配置される領域とを区切るための区切部材４３２を備えている点が実施の形態１とは相違する。 The lamp 4 is different from the lamp 1 according to the first embodiment in the shape of the globe 420, the shape of the base 560, and the shape of the third member 476 constituting a part of the housing 470. Further, the lamp 4 is different from the first embodiment in that the lamp 4 is provided with a dividing member 432 for dividing the area in which the base 560 is arranged and the area in which the power supply unit 50 is arranged in the housing 470. Do.
　グローブ４２０は、内側に光散乱部材３２や反射部材３４が配置されない分、実施の形態１に係るグローブ２０に比べて扁平な形状を有する。これにより、ランプ４は、グローブ４２０の大きさが小さい分、ランプ１に比べて小型化されている。 The globe 420 has a flatter shape than the globe 20 according to the first embodiment because the light scattering member 32 and the reflecting member 34 are not disposed inside. As a result, the size of the lamp 4 is smaller than that of the lamp 1 as the size of the globe 420 is smaller.
　基台５６０は、略円板状に形成されている。基台５６０の上面には、発光モジュール１０の一部を構成する実装基板１２が配設されている。基台５６０の略中央部には、電源ユニット５０から導出されたツイストペア配線５４を基台５６０の下面側から上面側に挿通させるための貫通孔５６０ｅが設けられている。基台５６０の周部には、基台５６０から下方向に突出する鍔部５６０ｂが設けられている。この鍔部５６０ｂは、基台５６０の周縁部全体に亘って設けられている。 The base 560 is formed in a substantially disc shape. The mounting substrate 12 which constitutes a part of the light emitting module 10 is disposed on the upper surface of the base 560. A through hole 560 e for inserting the twisted pair wiring 54 led from the power supply unit 50 from the lower surface side to the upper surface side of the base 560 is provided in a substantially central portion of the base 560. A collar portion 560 b protruding downward from the base 560 is provided on the periphery of the base 560. The flange portion 560 b is provided over the entire peripheral portion of the base 560.
　筐体４７０は、第１部材７２と、第２部材７４と、第３部材４７６と、第４部材７８と、第５部材７９とからなる。そして、第３部材４７６は、実施の形態１に係る第３部材７６と略同様の形状を有し、その上端部の内側に区切部材４３２を係止するための凹部４７６ａ１が設けられている点が実施の形態１に係る第３部材７６と相違する。 The housing 470 includes a first member 72, a second member 74, a third member 476, a fourth member 78, and a fifth member 79. The third member 476 has substantially the same shape as the third member 76 according to the first embodiment, and a recess 476a1 for locking the separating member 432 is provided inside the upper end portion of the third member 476. Are different from the third member 76 according to the first embodiment.
　区切部材４３２は、有底円筒状の形状を有し、底壁４３２ａにツイストペア配線５４を挿通させるための貫通孔４３２ａ１が形成されるとともに、側壁４３２ｂに第３部材４７６の凹部４７６ａ１に係合可能な凸部４３２ｃが設けられている。そして、この凸部４３２ｃを凹部４７６ａ１に係合させることにより、区切部材４３２が第３部材４７６の上端部に係止される。また、区切部材４３２は、合成樹脂等の絶縁材料から形成されている。 The dividing member 432 has a cylindrical shape with a bottom, and a through hole 432a1 for inserting the twisted pair wire 54 is formed in the bottom wall 432a and can be engaged with the recess 476a1 of the third member 476 in the side wall 432b. A convex portion 432 c is provided. Then, the separation member 432 is engaged with the upper end portion of the third member 476 by engaging the convex portion 432 c with the concave portion 476 a 1. The separating member 432 is formed of an insulating material such as a synthetic resin.
　ランプ４では、基台５６０と電源ユニット５０との間に区切部材４３２が配置されていることにより、基台５６０と電源ユニット５０との間の電気的絶縁性が向上している。また、ランプ４は、光散乱部材や反射部材が無い構成であり、ランプ１に比べて部品点数が削減されており、それに伴い光散乱部材や反射部材を基台５６０に取り付ける工程も不要となっている。従って、ランプ４は、ランプ１に比べて部品点数の削減による軽量化が図れるとともに、製造工程の簡素化を図ることができるという利点もある。 In the lamp 4, the partition member 432 is disposed between the base 560 and the power supply unit 50, whereby the electrical insulation between the base 560 and the power supply unit 50 is improved. Further, the lamp 4 has a configuration without the light scattering member and the reflecting member, and the number of parts is reduced compared to the lamp 1 and accordingly, the process of attaching the light scattering member and the reflecting member to the base 560 is also unnecessary. ing. Accordingly, the lamp 4 can be reduced in weight by the reduction of the number of parts as compared with the lamp 1 and has an advantage that the manufacturing process can be simplified.
　（５）実施の形態１では、口金４０が、第１円筒状部材（シェル部４２）、第２円筒状部材（絶縁部４４）および第３円筒状部材（アイレット部４６）が一体成型（いわゆるインサート成型）により一体化されている例について説明したが、口金４０の構造はこれに限定されるものではない。例えば、第１円筒状部材、第２円筒状部材および第５円筒状部材からなる外殻部材が一体成形で形成され、第３円筒状部材および第４円筒状部材からなる内殻部材が樹脂成型により形成されていてもよい。 (5) In the first embodiment, in the die 40, the first cylindrical member (shell portion 42), the second cylindrical member (insulation portion 44), and the third cylindrical member (eyelet portion 46) are integrally molded (so-called Although the example integrated by insert molding has been described, the structure of the base 40 is not limited to this. For example, an outer shell member consisting of a first cylindrical member, a second cylindrical member and a fifth cylindrical member is integrally formed, and an inner shell member consisting of a third cylindrical member and a fourth cylindrical member is resin molded It may be formed by
　本変形例に係るランプ１１０１の断面図を図１４に示す。なお、実施の形態１と同様の構成については同一の符号を付して適宜説明を省略する。 A cross-sectional view of a lamp 1101 according to the present modification is shown in FIG. The same components as those of the first embodiment are denoted by the same reference numerals, and the description will not be repeated.
　筐体１１７０は、外殻部材１１７５と、内殻部材１１７７とからなる。外殻部材１１７５は、第１円筒状部材１１７２、第２円筒状部材１１７４および第５円筒状部材１１７９からなる。内殻部材１１７７は、第３円筒状部材１１７６および第４円筒状部材１１７８からなる。また、外殻部材１１７５は、一体成形により形成され、内殻部材１１７７は、樹脂成型により形成されている。 The housing 1170 is composed of an outer shell member 1175 and an inner shell member 1177. The outer shell member 1175 includes a first cylindrical member 1172, a second cylindrical member 1174 and a fifth cylindrical member 1179. The inner shell member 1177 comprises a third cylindrical member 1176 and a fourth cylindrical member 1178. The outer shell member 1175 is formed by integral molding, and the inner shell member 1177 is formed by resin molding.
　第３円筒状部材１１７６は、本体部１１７６ａと、複数の突出部１１７６ｂと、案内部７３とを備える。本体部１１７６ａは、略円筒状に形成されている。突出部１１７６ｂは、本体部１１７６ａの内側に向かって突出している。 The third cylindrical member 1176 includes a main body portion 1176 a, a plurality of projecting portions 1176 b, and a guide portion 73. The main body portion 1176a is formed in a substantially cylindrical shape. The protrusion 1176 b protrudes toward the inside of the main body 1176 a.
　第４円筒状部材１１７８は、第３円筒状部材１１７６の本体部１１７６ａの下端部に連続し、本体部１１７６ａの下端部よりも下側に延出している。 The fourth cylindrical member 1178 is continuous with the lower end portion of the main body portion 1176 a of the third cylindrical member 1176 and extends below the lower end portion of the main body portion 1176 a.
　次に、筐体１１７０および口金４０からなる構造体の組み立て方法について説明する。 Next, a method of assembling a structure including the housing 1170 and the base 40 will be described.
　本変形例に係る筐体１１７０および口金４０からなる構造体の組み立て方法を説明するための模式図を図１５（ａ）および（ｂ）に示す。 FIGS. 15A and 15B are schematic views for explaining a method of assembling a structure including a housing 1170 and a cap 40 according to the present modification.
　まず、図１５（ａ）に示すように、内殻部材１１７７を外殻部材１１７５の上側開口から外殻部材１１７５の筒軸方向に沿って挿入する（矢印参照）。そして、外殻部材１１７５の一部を構成する第１円筒状部材１１７２の内周面を、第３円筒状部材１１７６の外周面に密着させる。このとき、第４円筒状部材１１７８の雄螺子部が外殻部材１１７５の下側開口から突出した状態となる。 First, as shown in FIG. 15 (a), the inner shell member 1177 is inserted from the upper opening of the outer shell member 1175 along the axial direction of the outer shell member 1175 (see arrow). Then, the inner circumferential surface of the first cylindrical member 1172 that constitutes a part of the outer shell member 1175 is brought into close contact with the outer circumferential surface of the third cylindrical member 1176. At this time, the male screw portion of the fourth cylindrical member 1178 protrudes from the lower opening of the outer shell member 1175.
　次に、図１５（ｂ）に示すように、第４円筒状部材１１７８の雄螺子部に口金４０を外嵌させる（矢印参照）。 Next, as shown in FIG. 15B, the base 40 is fitted on the male screw portion of the fourth cylindrical member 1178 (see the arrow).
　ここにおいて、外殻部材１１７５が、口金４０により内殻部材１１７７に固定された状態となる。 Here, the outer shell member 1175 is fixed to the inner shell member 1177 by the base 40.
　本構成によれば、外殻部材１１７５と内殻部材１１７７とが別体となっていることにより、外殻部材１１７５の熱膨張係数と内殻部材１１７７の熱膨張係数との差異に起因して筐体１１７０に応力が発生するのを抑制できる。従って、筐体１１７０内に応力が発生することに伴う筐体１１７０の割れ等の発生を抑制できる。 According to the present configuration, the outer shell member 1175 and the inner shell member 1177 are separately provided, which results from the difference between the thermal expansion coefficient of the outer shell member 1175 and the thermal expansion coefficient of the inner shell member 1177. The occurrence of stress in the housing 1170 can be suppressed. Therefore, it is possible to suppress the occurrence of a crack or the like of the housing 1170 accompanying the generation of a stress in the housing 1170.
　（６）実施の形態１では、基台６０の周面全体に亘って、第１部材７２の内周面と基台６０の周面との間に隙間Ｗが生じている例について説明したが、この隙間Ｗにシリコーン樹脂等の熱伝導性部材が介在していてもよい。ここで、「熱伝導性部材」とは、熱伝導率が０．１Ｗ／Ｋ・ｍ以上の部材を意味する。 (6) In the first embodiment, the example has been described in which the gap W is generated between the inner peripheral surface of the first member 72 and the peripheral surface of the base 60 over the entire peripheral surface of the base 60. In the gap W, a heat conductive member such as silicone resin may be interposed. Here, a "heat conductive member" means a member having a thermal conductivity of 0.1 W / K · m or more.
　１，２，３，４，１１０１，１２０１　ランプ
　１０　　　　発光モジュール
　４０　　　　口金
　５０　　　　電源ユニット
　６０，２６０，３６０，４６０，５６０　基台
　７０，２７０，３７０，４７０　筐体
　７２，３７２　第１円筒状部材
　７４，３７４　第２円筒状部材
　７６，２７６，３７６，４７６　第３円筒状部材
　７６ａ，２７６ａ　本体部
　７６ａ１　　窓部
　７６ｂ，２７６ｂ　突出部
　７８，３７８　第４円筒状部材
　７９　　　　第５円筒状部材
　７８ａ，２６０ｇ　凹部
　４３２　　　区切部材
　４３２ｃ　　凸部
　４６０ｇ　　突起部
　４７６ａ１　凹部
　５０１　　　照明装置 1, 2, 3, 4, 1101, 1201 lamp 10 light emitting module 40 base 50 power supply unit 60, 260, 360, 460, 560 base 70, 270, 370, 470 housing 72, 372 first cylindrical member 74, 374 Second cylindrical member 76, 276, 376, 476 Third cylindrical member 76a, 276a Body 76a1 Window 76b, 276b Projection 78, 378 Fourth cylindrical member 79 Fifth cylindrical member 78a, 260g Recess 432 Sectioning member 432c convex part 460g protrusion part 476a1 concave part 501 lighting device

Claims (8)

  1. 　光源と、
    　前記光源に電力を供給する電源ユニットと、
    　筒状であり且つ内側に前記電源ユニットが配置される筐体と、
    　第１主面と第２主面とを有する金属板からなり、前記筐体の内部において前記第１主面が前記電源ユニット側となるように配置されるとともに、前記電源ユニット側とは反対側の前記第２主面に前記光源が配設される基台とを備え、
    　前記筐体は、
    　金属材料からなり且つ筒状の形状を有する第１部材と、
    　絶縁性材料からなり、前記第１部材の外周面に密着した状態で前記外周面を覆う第２部材と、
    　絶縁性材料からなり、前記第１部材の内周面に密着した状態で前記内周面のうち、前記第１部材の筒軸に沿った一方向側の端部を除く部位を覆う第３部材とを有し、
    　前記基台は、前記第１部材の前記一方向側の端部の内側に位置し、前記基台と前記第１部材の前記一方向側の端部とは、接触または空隙或いは熱伝導性部材を介して離間している
    　ことを特徴とするランプ。     Light source,
    A power supply unit for supplying power to the light source;
    A casing which is cylindrical and in which the power supply unit is disposed inside;
    It consists of a metal plate which has the 1st principal surface and the 2nd principal surface, and while being arranged so that the 1st principal surface may become the above-mentioned power supply unit inside the above-mentioned case, the opposite side to the above-mentioned power supply unit side A base on which the light source is disposed on the second main surface of
    The housing is
    A first member made of a metal material and having a tubular shape;
    A second member made of an insulating material and covering the outer peripheral surface in a state of being in close contact with the outer peripheral surface of the first member;
    A third member made of an insulating material and covering a portion of the inner peripheral surface except the end on one side along the cylinder axis of the first member in close contact with the inner peripheral surface of the first member Have and
    The base is located inside the one end of the first member on one side, and the base and the one end of the first member are in contact with or in the air gap or a heat conductive member. The lamp is characterized by being spaced apart.
  2. 　前記第３部材は、少なくとも一部に窓部が形成されている
    　ことを特徴とする請求項１記載のランプ。     The lamp according to claim 1, wherein the third member has a window formed at least in part.
  3. 　前記窓部は、前記第３部材のうち、筒軸に直交する方向において前記電源ユニットに対向する領域に少なくとも形成されている。
    　ことを特徴とする請求項２記載のランプ。     The window portion is at least formed in a region of the third member facing the power supply unit in a direction perpendicular to the cylinder axis.
    The lamp according to claim 2, characterized in that.
  4. 　前記基台の前記第１主面に凹部が形成され、当該凹部に前記電源ユニットの少なくとも一部が配置されている
    　ことを特徴とする請求項１乃至３のいずれか１項に記載のランプ。     The lamp according to any one of claims 1 to 3, wherein a recess is formed on the first main surface of the base, and at least a part of the power supply unit is disposed in the recess.
  5. 　前記基台と前記第１部材の前記一方向側の端部の内周面との間の、前記第１部材の筒軸方向に直交する方向における距離は、前記基台から前記第１部材への熱伝達効率により定まる規定の長さ以下である
    　ことを特徴とする請求項１乃至４のいずれか１項に記載のランプ。     The distance between the base and the inner peripheral surface of the one end of the first member in the direction orthogonal to the cylinder axis direction of the first member is the distance from the base to the first member The lamp according to any one of claims 1 to 4, wherein the lamp has a length equal to or less than a predetermined length determined by the heat transfer efficiency of the lamp.
  6. 　有底筒状に形成された口金を更に備え、
    　前記筐体は、絶縁性材料からなり且つ筒状の形状を有し、前記第２部材の前記一方向側とは反対の他方向側の端部から前記他方向に延出した第４部材を有し、
    　前記口金は、前記第４部材に外嵌されている
    　ことを特徴とする請求項１乃至５のいずれか１項に記載のランプ。     It further comprises a base formed in a bottomed cylindrical shape,
    The housing is made of an insulating material and has a cylindrical shape, and a fourth member extending in the other direction from an end on the other direction side opposite to the one direction side of the second member is used. Have
    The lamp according to any one of claims 1 to 5, wherein the base is externally fitted to the fourth member.
  7. 　グローブを更に備え、
    　前記筐体は、絶縁性材料からなり且つ筒状の形状を有し、前記第２部材の前記一方向側の端部から前記一方向側に延出した第５部材を有し、
    　前記第５部材は、前記基台の周面から離間しており、
    　前記グローブの開口端部が、前記第５部材の内側に配置されている
    　ことを特徴とする請求項１乃至６のいずれか１項に記載のランプ。     Further equipped with gloves,
    The housing is made of an insulating material and has a tubular shape, and includes a fifth member extending from the end on the one side of the second member to the one side.
    The fifth member is separated from the circumferential surface of the base,
    The lamp according to any one of claims 1 to 6, wherein the open end of the globe is disposed inside the fifth member.
  8. 　請求項１乃至７のいずれか１項に記載のランプを備える
    　ことを特徴とする照明装置。
                                                                                         A lighting device comprising the lamp according to any one of claims 1 to 7.
PCT/JP2013/001166 2012-06-07 2013-02-27 Lamp and lighting device WO2013183198A1 (en)

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