WO2013180047A1 - High-efficiency heat exchanger and high-efficiency heat exchange method - Google Patents

High-efficiency heat exchanger and high-efficiency heat exchange method Download PDF

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Publication number
WO2013180047A1
WO2013180047A1 PCT/JP2013/064584 JP2013064584W WO2013180047A1 WO 2013180047 A1 WO2013180047 A1 WO 2013180047A1 JP 2013064584 W JP2013064584 W JP 2013064584W WO 2013180047 A1 WO2013180047 A1 WO 2013180047A1
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Prior art keywords
heat
heat exchange
heat exchanger
exchange fluid
exchanger according
Prior art date
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PCT/JP2013/064584
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French (fr)
Japanese (ja)
Inventor
木村 洋一
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四国計測工業株式会社
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Application filed by 四国計測工業株式会社 filed Critical 四国計測工業株式会社
Priority to KR1020147035593A priority Critical patent/KR102100785B1/en
Priority to US14/403,678 priority patent/US20150159958A1/en
Priority to JP2014518429A priority patent/JP5992518B2/en
Publication of WO2013180047A1 publication Critical patent/WO2013180047A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24VCOLLECTION, PRODUCTION OR USE OF HEAT NOT OTHERWISE PROVIDED FOR
    • F24V30/00Apparatus or devices using heat produced by exothermal chemical reactions other than combustion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D5/00Devices using endothermic chemical reactions, e.g. using frigorific mixtures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/04Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/06Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0022Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for chemical reactors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0042Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for foodstuffs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/005Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for medical applications
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089Coatings, claddings or bonding layers made from metals or metal alloys

Definitions

  • the present invention relates to a heat exchange technique in which the field of application is not limited. It is particularly useful for heat exchange of gases or liquids of corrosive substances such as acids and alkalis, temperature control of high-purity water, high-purity silicon compounds when manufacturing semiconductors, etc. To solve the problems of corrosion of equipment and contamination of high-purity substances and to improve the heat exchange rate. That is, the present invention can provide a high-efficiency heat exchanger and heat exchange method with less corrosion of the apparatus and contamination by impurities in all technical fields that require cooling, heating, and temperature control of substances.
  • a heat source not only a heat source but also a heat absorption source may be referred to as a “heat source”.
  • the term “fluid” in the present specification includes those accompanied by a phase change (for example, a phase change from liquid to gas) by heating or rapid heating.
  • a heat exchanger is a device that heats or cools one object by directly or indirectly contacting two objects with different temperatures, and heats or cools one object.
  • Boilers, steam generators, food production, chemical production, refrigeration For industrial use such as storage, it is used for cooling, heating, and refrigeration.
  • a heat exchanger usually has a structure corresponding to the characteristics of the heat exchange material. For example, for a chemical solution that performs heat exchange with a highly corrosive chemical solution such as hydrofluoric acid, nitric acid, and sulfuric acid.
  • a heat exchanger it is necessary to heat and cool fluids such as highly corrosive strong acids and strong alkalis using chemical resistant heat exchangers. In this case, resin materials that are not easily affected by acids and alkalis.
  • the indirect heating in which the contact portion material made of is immersed in a heat medium to perform heat exchange is typical.
  • FIG. 1 is a schematic diagram showing a typical indirect heat exchange. While a heat exchange fluid (acid, alkali, water, etc.) is conveyed from the inlet 2 to the outlet 3 in the resin pipe 1, FIG. Heat exchange is performed through the resin pipe 1 by the heat medium 4 whose temperature is adjusted by the heat source 5.
  • This method can increase the surface area of the resin pipe 1 on the contact side, for example, lengthen the pipe 1 in the heat medium 4 to increase the contact area with the heat medium 4 and improve the heat exchange efficiency.
  • this may result in a costly device including a device and containers for adjusting the temperature of the fluid with a heat source.
  • a typical example of a direct heating method in which heat is exchanged directly with a heat source without using a heat medium is shown in FIG.
  • the heat source 5 comes into contact with the tube 1 made of the above material to exchange heat directly.
  • the heat exchange fluid or the heat exchange medium does not corrode the equipment such as the transfer pipe, the heat exchange process does not contaminate the heat exchange fluid, and the heat exchange is performed efficiently. ,Is required.
  • the transport pipe is protected by being covered with a resin or ceramics so that the transport pipe is not affected by the heat exchange medium or the heat exchange fluid.
  • a resin or ceramics so that the transport pipe is not affected by the heat exchange medium or the heat exchange fluid.
  • the tube through which the heated fluid flows is made of a heat resistant alloy
  • the outside of the heat resistant alloy tube Is covered with a cover material made of a ceramic alloy composite material through a thermal expansion buffer material, and the ceramic alloy composite material constituting the cover material contains Al and AlN, and AlN is 1 wt% or more and 90 wt% or less.
  • (Al + AlN + AlON) has been proposed as a heat exchanger tube for heat exchange (Patent Document 1) having a total ratio of 50 wt% to 100 wt%.
  • Fluororesin is known to be excellent in corrosion resistance and heat resistance against various chemicals.
  • the transport tube is made of only fluororesin, the fluororesin itself is inherently a poor conductor of heat.
  • the fluororesin is used on the surface of metal with good thermal conductivity.
  • Many proposals have been made to form a film.
  • a film For example, in a gas-use facility member having at least two layers of a coating film containing a fluorine resin on a substrate, the content of the fluorine resin in each layer is sequentially changed in accordance with the uppermost layer film from the lowermost layer film coated on the substrate.
  • Gas use equipment member Patent Document 2 used as a heat exchanger or the like having a coating film that is increased and the content of the inorganic filler is sequentially reduced,
  • the present invention provides a plate fin type heat exchanger and a plate type heat exchanger using the aluminum alloy material in a heat transfer part using an aluminum alloy material having excellent corrosion resistance and a corrosive fluid as a medium. It has an organic phosphonic acid undercoat on the aluminum alloy material surface used in plate fin type heat exchangers, plate type heat exchangers, etc. using a heat transfer part with a fluid as a medium, and further after drying It has a fluorine resin paint film with an average thickness of 1 to 100 ⁇ m and improves the durability of the adhesion of the paint film, and has excellent corrosion resistance against corrosive fluids such as seawater (Patent Literature) 3) has been proposed.
  • the heat transfer surface of the heat exchanger is made of fluororesin-impregnated carbon.
  • the heat exchanger is a block made of fluororesin-impregnated carbon in a housing, and includes a hydrogen chloride aqueous solution flow path through which a hydrogen chloride aqueous solution flows, and a heat medium through which the heat medium flows.
  • Patent Document 4 A block heat exchanger in which a block provided with a flow path is arranged has been proposed (Patent Document 4).
  • a heat exchanger made of stainless steel can be used for a heat exchange material whose liquid contact part can be made of metal.
  • stainless steel has a problem that it is necessary to use a heat source with a large capacity in order to obtain a constant heat exchange capability among metals, so that a large body and an increase in power consumption are required.
  • attempts have been made to use various materials in the heat exchanger.
  • the heat exchange efficiency is high, particularly for heat exchange materials with high corrosivity. Development of heat exchange technology was desired.
  • the present invention provides a heat exchanger having high heat exchange performance and corrosion resistance for a heat exchange fluid.
  • a member that contacts the fluid is generally brought into contact with a heat medium such as a heat source or a refrigerant to perform heat exchange. It was selected according to the characteristics.
  • the material of the selected contact member is not necessarily excellent in heat conduction. In this case, for example, a large number of electric heaters that are heat sources or a large-capacity electric heater can be used. It may be necessary to compensate for the disadvantages of low members. As a result, it was often encountered that the energy efficiency of heat exchange was low and the equipment was large.
  • the present invention is characterized in that highly efficient heat exchange can be performed even when the material of the contact portion is selected by paying attention only to the characteristics of the heat exchange fluid. In other words, it is possible to make a low-cost and compact product.
  • An object of the present invention is to provide a high-efficiency heat exchanger that can be applied in a wide range of fields regardless of the heat exchange target fluid. It is another object of the present invention to provide a heat exchanger in which the equipment is not corroded by the heat exchange fluid and the heat exchanged fluid is not contaminated.
  • the present invention provides a heat exchanger having excellent heat conduction characteristics in heating or cooling of an aqueous solution such as hydrofluoric acid and hydrogen chloride, a gas, and an alkaline aqueous solution such as sodium hydroxide, which are highly corrosive.
  • the present invention also provides a heat exchange technique that enables highly efficient heat exchange while maintaining high purity of the heat exchange fluid.
  • the present invention is composed of the technical matters described below.
  • a heat source a heat transfer structure that contacts the heat exchange fluid, and a heat transfer member that transfers heat from the heat source to the heat transfer structure, and the heat exchange fluid and the heat transfer structure
  • the heat transfer structure includes a body having an inlet, an outlet, and a heat exchange fluid flow path, and a number of heat conductors attached to the body.
  • the inner wall surface of the heat exchange fluid flow path constituting the contact surface with the heat exchange fluid is made of a material that is stable to the heat exchange fluid, and the heat conductor has a higher thermal conductivity than the material of the body.
  • the heat exchanger is characterized in that it is made of a good material, and the heat conductor is mounted in a position near the heat exchange fluid flow path and not in contact with the heat exchange fluid.
  • the plurality of heat conductors include a plurality of heat conductors arranged to face each other with the heat exchange fluid flow path interposed therebetween.
  • the heat transfer member includes two heat transfer members sandwiching the body, and one or more heat conductors are extended from each of the two heat transfer members. .
  • the mode in which the heat conductor is extended includes not only a mode in which the heat transfer member and the heat conductor are integrally formed, but also a mode in which a separate heat conductor is attached to the heat transfer member. included.
  • the heat exchanger according to [4] or [5], wherein at least a part of the plurality of heat conductors has an outer surface having a zigzag structure.
  • the majority of the heat conductors have the outer surface of the zigzag structure.
  • the heat exchanger according to [6] or [7], wherein the heat conductor having the outer surface of the zigzag structure is a screw.
  • the heat exchanger according to [8], wherein the heat conductor having the outer surface of the zigzag structure is a screw having a flat head.
  • a heat conductor made of a relatively high material and placing a heat conductor made of a material having a relatively low thermal conductivity on the side farther from the inlet than the side closer to the inlet A heat exchange method that suppresses uneven temperature distribution that occurs upstream and downstream of the exchange fluid flow path.
  • a heat exchange method that suppresses uneven temperature distribution that occurs upstream and downstream of the exchange fluid flow path.
  • a heat transfer fluid is provided through a contact surface between the heat exchange fluid and the heat transfer structure, the heat transfer fluid being in contact with the heat exchange fluid flowing through the flow channel and the heat exchange fluid flowing through the flow channel.
  • the heat transfer structure has a surface constituting a contact surface with the heat exchange fluid made of a material that is stable with respect to the heat exchange fluid;
  • a heat conductor is mounted on the heat transfer structure, and the heat conductor is made of a material having better thermal conductivity than the material of the heat transfer structure;
  • the heat conductor is mounted near the contact surface with the heat exchange fluid and not in contact with the heat exchange fluid;
  • a heat exchanger in which the heat transfer efficiency is improved at the surface where the heat transfer structure and the heat exchange fluid contact with each other.
  • examples of the pin-like structure include a cylindrical shape and a polygonal column shape, and include a zigzag structure on the outer surface.
  • the material of the heat transfer structure is resin or metal.
  • the heat conductor is a metal having better heat conductivity than the material of the heat transfer structure.
  • thermoelectric transfer structure In a heat exchange method in which a heat transfer structure is brought into contact with a heat exchange fluid and heat transfer type heat exchange is performed through a contact surface between the heat exchange fluid and the heat transfer structure, (A) the heat transfer structure has a surface constituting a contact surface with the heat exchange fluid made of a material that is stable with respect to the heat exchange fluid; (B) a heat conductor is mounted on the heat transfer structure, and the heat conductor is made of a material having better thermal conductivity than the material of the heat transfer structure; (C) the heat conductor is mounted near the contact surface with the heat exchange fluid and not in contact with the heat exchange fluid;
  • the heat exchange method is characterized in that the heat transfer efficiency at the surface where the heat transfer structure and the heat exchange fluid come into contact with each other is increased by the above.
  • the following effects can be achieved by the present invention. Since acids and alkalis react violently with metals, it is not possible to use metals in the contact area. Therefore, conventionally, a heat exchanger using a resin for the contact portion has been used. However, since the heat conductivity is low, the heat efficiency is poor, and the configuration of the apparatus is greatly complicated. According to the present invention, a heat exchanger having a compact structure with high heat exchange efficiency can be provided, and the reaction between the heat exchanger and the heat exchange fluid such as acid or alkali is avoided, so that high-purity acid, alkali, etc. The temperature can be adjusted without being contaminated by trace components.
  • the present invention makes full use of hydrodynamics and thermodynamics and adopts a direct heating method, so that even if all the contact parts with the heat exchange fluid are made of resin, power saving, space saving, conversion efficiency Good heat exchange technology.
  • the heat exchange capacity of 80% or more has been realized even in the configuration in which the contact portion with the fluid to be heated is directly metal-free and the heat exchange capability is 80% or more. The present invention has been made possible.
  • FIG. 7-1 shows the cross section in a vertical surface (vertical direction)
  • FIG. 7-1 shows the cross section in a vertical surface (vertical direction)
  • FIG. 7-1 shows the cross section in a vertical surface (vertical direction)
  • FIG. 7-1 shows the cross section in a vertical surface (vertical direction)
  • FIG. 7 It is a figure which shows arrangement
  • (D) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (a).
  • (E) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (b).
  • (F) is the structural example which made the outer surface of the heat conductor the zigzag structure in the example of arrangement
  • FIG. 13 it is the structural example which shape
  • A) is the example of arrangement
  • (B) is an arrangement example in which two heat conductors sandwiching the heat exchange fluid flow path are extended from above and below.
  • (C) is an arrangement example in which four heat conductors sandwiching the heat exchange fluid channel are extended from above and below.
  • (D) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (a).
  • (E) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (b).
  • (F) is the structural example which made the outer surface of the heat conductor zigzag structure in the example of arrangement
  • the present invention includes a passage through which a heat exchange fluid passes and a heat transfer structure that contacts the heat exchange fluid that passes through the passage, and transfers heat through a contact surface between the heat exchange fluid and the heat transfer structure.
  • the surface of the heat transfer structure that constitutes the contact surface with the heat exchange fluid is made of a material that is stable with respect to the heat exchange fluid.
  • a heat conductor is attached to the heat transfer structure, and the heat conductor is made of a material having better thermal conductivity than the material of the heat transfer structure, (3) The heat conductor is mounted near the contact surface with the heat exchange fluid and not in contact with the heat exchange fluid.
  • the heat exchanger and the heat exchange method are improved in heat conduction efficiency at the surface where the heat transfer structure and the heat exchange fluid contact with each other.
  • a heat transfer structure made of a material (material) that does not affect the heat exchange fluid has a higher thermal conductivity than the material of the heat transfer structure (particularly, the portion that contacts the heat exchange fluid).
  • the heat conductor made of is mounted in a position where it does not come into contact with the fluid, and the heat transfer structure is heated or cooled, so that the heat is transferred from the heat source to the heat exchange fluid to efficiently heat and cool the fluid. It is possible to do that.
  • liquids and gases having various characteristics are targeted for a heat exchange fluid to be heated or cooled by a heat exchanger.
  • aqueous solutions of acids or alkalis are used for chemical reactions or etching processes, but these react violently with metals, so it may not be possible to use metals in contact with acids and alkalis.
  • Heat exchangers used for heat exchange of such reactive heat exchange fluids include products that use resin, but the efficiency of heat exchange is poor because resin has low thermal conductivity and is required. In many cases, the electric power is large and the shape and structure are large and complicated.
  • the heat exchanger of the present invention employs a direct heating method, and there is no limitation as long as the surface constituting the contact surface with the heat exchange fluid is made of a material that is stable with respect to the heat exchange fluid. All parts can provide efficient heat exchange with power saving, space saving and thermal efficiency of 80% or more despite resin.
  • the heat exchange fluid in the present invention is not particularly limited.
  • hydrochloric acid, sulfuric acid, nitric acid, chromic acid, phosphoric acid, hydrofluoric acid, acetic acid, perchloric acid, hydrobromic acid, fluorosilicic acid examples thereof include solutions or gases such as corrosive acids such as boric acid, alkalis such as ammonia, potassium hydroxide and sodium hydroxide, and metal salts such as chlorinated silicon, and high purity water.
  • These heat exchange fluids are used as raw materials for reaction with other substances or as chemicals used in reaction processes such as etching liquids, and are used for purposes that are controlled to an appropriate temperature by a heat exchanger. Is done.
  • the heat exchanger of the present invention can heat, cool, or control the temperature of these heat exchange fluids with high efficiency and without contamination by trace impurities.
  • the heat transfer structure of the present invention has a surface that serves as a contact surface with the heat exchange fluid and a heat conductor.
  • the contact surface of the heat transfer structure that contacts the heat exchange fluid is made of a material that is stable with respect to the heat exchange fluid. That is, a material that does not react with the surface of the heat transfer structure and the heat exchange fluid or a material that does not elute the components of the heat transfer structure from the surface is selected in a temperature range where heat exchange is performed.
  • the reactivity (corrosiveness) of the heat exchange fluid varies depending on the surface material and contact temperature of the heat transfer structure, and the allowable range of purity after heat exchange varies depending on the application and properties of the heat exchange fluid. Therefore, it cannot be specified in general.
  • a metal halide or an etching agent used for manufacturing a semiconductor device uses a high-purity substance, so that a decrease in purity due to heat exchange treatment is not allowed.
  • a heat exchanger for turbines changes in the purity of the heat exchange fluid due to the heat exchange process are often not a problem.
  • the material (material) of the member that becomes the surface of the heat transfer structure in contact with the heat exchange fluid includes metals such as iron, carbon steel, stainless steel, aluminum and titanium, synthetic resins such as fluorine resin and polyester, although it is appropriately selected from ceramics and the like, a fluororesin is preferred when heat exchange is performed on highly corrosive acids.
  • fluorine resin examples include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), polychlorotrifluoroethylene ( PCTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), tetrafluoroethylene-ethylene copolymer (ETFE), polyvinyl fluoride (PVF), fluorinated polypropylene (FLPP), polyvinylidene fluoride (PVDF), etc. Can be illustrated.
  • PTFE polytetrafluoroethylene
  • PFA tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer
  • FEP tetrafluoroethylene-hexafluoropropylene copolymer
  • PCTFE polychlorotrifluoroethylene
  • ECTFE ethylene-ch
  • the heat transfer structure of the heat exchanger according to the present invention includes a heat conductor therein, and the heat conductor is made of a material having a heat conductivity higher than that of the material of the heat transfer structure (particularly, a portion that contacts the heat exchange fluid). At the same time, it is mounted near the contact surface (heat exchange fluid flow path) with the heat exchange fluid and at a position that does not contact the heat exchange fluid.
  • An example of the structure of the heat transfer structure will be described with reference to FIG. 3 includes a heat transfer structure 6 having a body 61, a heat conductor 62, a heater plate 51 serving as a heat source, heat transfer plates 52a and 52b, and a heat exchange fluid flow path 7.
  • the heat from the plate 51 is diffused to the heat transfer structure 6 (the body 61 and the heat conductor 62) through the heat transfer plates 52a and 52b.
  • the body 61 and the heat conductor 62 are heated by the diffused heat, and at the same time, the heat heats the heat exchange fluid passing through the flow path 7 through the contact surface 63.
  • a dotted line arrow in FIG. 3 shows how heat is transferred from the body 61. Since the thermal conductivity of the heat conductor 62 is better than that of the material of the body 61, the temperature rises earlier than the body 61 and heat exchange to the heat exchange fluid can be performed efficiently.
  • the heat conductor 62 is embedded in the body 61 and is in contact with the heat transfer plate 52 a or the heater plate 51.
  • the heat conductor 62 and the flow path 7 are preferably as close as possible for efficient heat exchange.
  • the inner wall surface of the flow path 7 is preferably a flat surface or curved surface with no unevenness from the viewpoint of maintainability, but is preferably a zigzag structure from the viewpoint of enhancing the heat exchange capability.
  • the columnar heat conductors 62 can be individually installed by inserting them into holes provided in the body 61. Further, as shown in FIG. 4, the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed and installed by inserting the heat conductors 62 into the holes provided in the body 61. The installation position and the number of installation of the heat conductor 62 are determined in consideration of the efficiency of heat exchange. Further, by increasing the surface area of the heat conductor 62, the heat from the heat conductor 62 can be diffused uniformly and efficiently. In order to increase the surface area, it is preferable that the outer surface of the heat conductor 62 has a zigzag structure as shown in FIG.
  • annular peaks are continuous in the longitudinal direction of the outer surface of the heat conductor 62 (that is, a structure in which peaks and valleys are alternately continued).
  • the structure in which the annular ridges are continuous includes a case where ridges and grooves are formed in a spiral shape like a thread ridge and a groove. More preferably, the zigzag structure is formed so that the surface area of the outer surface of the heat conductor 62 is, for example, 1.5 to 3 times the surface area of the outer surface of the cylindrical body having the same diameter with no peaks (convex portions).
  • the zigzag structure heat conductor 62 is cured after being installed in a soft state before the resin is cured, or after the resin is cured, a hole is drilled with a drill or the like. This can be done by screwing in a heat conductor.
  • drilling is mainly performed.
  • FIG. 13 is a schematic cross-sectional view showing an arrangement variation of the heat conductor 62.
  • A is an example of arrangement in which two heat conductors 62 sandwiching the heat exchange fluid flow path 7 are extended from above.
  • B is an arrangement example in which two heat conductors 62 sandwiching the heat exchange fluid flow path 7 are extended from above and below.
  • C is an arrangement example in which four heat conductors 62 sandwiching the heat exchange fluid flow path 7 are extended from above and below.
  • D is a configuration example in which the outer surface of the heat conductor 62 has a zigzag structure in the arrangement example of the heat conductor 62 in (a).
  • (E) is a configuration example in which the outer surface of the heat conductor 62 has a zigzag structure in the arrangement example of the heat conductor 62 in (b).
  • (F) is a configuration example in which the outer surface of the heat conductor 62 has a zigzag structure in the arrangement example of the heat conductor 62 in (c).
  • a plurality of heat conductors 62 are arranged to face each other with the heat exchange fluid flow path 7 interposed therebetween.
  • heater plates 51a and 51b are provided. Since these elements have the same configuration as the heat exchanger 101 of FIGS. 3 and 5 except that there are two heater plates, the description thereof will be omitted. In FIGS. 13A and 13D, the lower heater plate 51b may not be provided.
  • FIG. 14 is a configuration example in which the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed in FIG. 13. 14A to 14F, a plurality of heat conductors 62 are arranged to face each other with the heat exchange fluid flow path 7 interposed therebetween. Except for the fact that the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed, the configuration is the same as in FIGS.
  • FIG. 15 is a diagram for explaining the temperature distribution when heat conductors of different materials are arranged, (a) is a plan view and a temperature distribution diagram when the same type of heat conductor 62 is arranged, FIG. 5B is a plan view and a temperature distribution diagram when the heat conductor 62 made of a different material is mounted.
  • 135 mounting holes for inserting the heat conductor 62 into the heat transfer plate 52 and the body 61 are substantially omitted. It is provided at equal intervals.
  • Each heat conductor 62 is detachably mounted in the heat transfer plate 52 and the mounting hole of the body 61.
  • each heat conductor 62 may be configured by a screw having a flat head and screwed into the mounting hole.
  • a large number of heat conductors 62 may be configured by combining heat conductors 62 made of a plurality of materials. By combining the heat conductors 62 made of a plurality of materials, it is possible to eliminate temperature distribution unevenness that occurs on the upstream side and the downstream side of the flow path 7. Further, it is possible to reduce the manufacturing cost by disposing the heat conductor 62 made of an expensive material only in a necessary place and arranging the heat conductor 62 made of an inexpensive material in another place. .
  • FIG. 15 (a) all the heat conductors 62 are constituted by aluminum pins
  • FIG. 15 (b) the heat conductors 62 from the left to the fifth row are constituted by aluminum pins, and from the left.
  • the heat conductors 62 in the sixth and subsequent rows are constituted by copper pins. That is, in FIG. 15A, 135 aluminum pins are attached as the heat conductor 62, whereas in FIG. 15B, 45 copper pins are attached upstream of the heat conductor 62. An aluminum pin is installed on the downstream side.
  • the right diagrams of FIG. 15A and FIG. 15B are diagrams showing a temperature distribution image. In FIG. 15A, the left half is relatively low temperature and the right half is relatively high temperature, whereas in FIG.
  • the temperature distribution unevenness is temporarily eliminated.
  • the heat conductor 62 made of a material having a high thermal conductivity is arranged on the upstream side, and the heat conductor 62 made of a material having a relatively low heat conductivity is arranged on the downstream side, so that the upstream side It is possible to reduce the temperature distribution unevenness on the downstream side. By reducing the temperature distribution unevenness, distortion of the body, the heat transfer plate, and the like can be suppressed, and the life of the heater can be prevented from being shortened.
  • FIG. 16 is a plan view of the heat exchanger 104 in which the heat conductors 62 are arranged at different densities on the upstream side and the downstream side.
  • all the heat conductors 62 are made of aluminum pins, and the configurations of the heat transfer plate 52, the body 61, and the like are the same as those of the heat exchanger 104 in FIG.
  • nine thermal conductors 62 are arranged in the vertical direction from the left to the fifth column, and four or five thermal conductors 62 are arranged in the vertical direction in the sixth to fifteenth columns from the left. Yes.
  • the heat conductors 62 As described above, it is possible to reduce the temperature distribution unevenness between the upstream side and the downstream side by arranging the heat conductors 62 at a high density on the upstream side and arranging the heat conductors 62 at a low density on the downstream side. It is.
  • the heat conductors 62 made of materials having different thermal conductivities are arranged on the upstream side and the downstream side so that the temperature distribution unevenness on the upstream side and the downstream side can be adjusted more finely. May be.
  • FIGS. 17A and 17B are views showing a cross-sectional structure of the heat exchanger 105 with a shower head, in which FIG. 17A shows a cross section in a plane (horizontal direction) and FIG. 17B shows a vertical plane (vertical direction).
  • the heat exchanger 105 with a shower head includes a heater plate 51, a heat transfer plate 52, a large number of heat conductors 62, and a body 61 having a heat exchange fluid flow path 7. A large number of discharge ports 75 communicating with 7 are formed.
  • the heat exchanger 105 with a shower head has two inflow ports 83 a and 83 b, and the heat exchange fluid 73 is heated from the inflow port to the flow path 7 and discharged from the discharge port 75.
  • a large number of heat conductors 62 are composed of a copper pin-like member arranged on the upstream side near the inflow ports 83a and 83b and an aluminum pin-like member arranged on the downstream side, as in FIG. 15B.
  • the temperature distribution unevenness over the entire length of the flow path 7 is minimized.
  • a copper pin-like member is mainly arranged on the side close to the left and right sides, and an aluminum pin-like member is mainly arranged in the central portion.
  • the flow path 7 is provided with a large number of bent portions 71, and the heat exchange fluid collides with the flow path walls at the bent portions 71 to generate turbulent flow, thereby eliminating uneven heating. It has come to be. Therefore, fluids having substantially the same temperature are discharged from each of the multiple discharge ports 75.
  • the heat exchanger 105 with a shower head is mainly used for the gas shower which discharges gas, it may discharge a liquid.
  • the heat exchanger 105 with a shower head one or more heat exchangers without a shower head are arranged on the upper stage, and the two inlets of the heat exchanger 105 and the outlet of the upper heat exchanger are connected by a branch pipe. Accordingly, a multi-stage configuration may be used (see FIG. 18 described later).
  • FIG. 6 is a cross-sectional view of the main part of the cylindrical heat exchanger 102 embodying the present invention.
  • a heat transfer structure 6 including a heat conductor 62 and a body 61 is installed on the inner surface of the cylindrical heat source 5.
  • the heat conductor 62 has a zigzag-shaped surface as a flow path side and a flat surface as a heat source 5.
  • the body 61 covers the surface of the heat conductor 62 and forms a flow path 7 to contact the heat exchange fluid.
  • the body 61 is preferably a thin film formed on the surface of the heat conductor 62, and the surface in contact with the heat exchange fluid preferably has a zigzag shape similar to that of the heat conductor 62. By making the zigzag shape with an increased contact surface area, the heat exchange efficiency on the surface is improved.
  • FIG. 12 is a schematic cross-sectional view illustrating the zigzag structure of the flow path of the heat exchange fluid, (a) is a diagram illustrating the case where the surface area is doubled, and (b) is the adjustment of the pitch depth.
  • FIG. FIG. 12A shows an example in which the inner surface of the heat transfer structure 6 in contact with the heat exchange fluid 73 has a zigzag structure in which equilateral triangles having a cross section of 2 mm on one side are continuous. That is, the inner side surface of the heat transfer structure 6 has a structure in which an annular peak continues in the longitudinal direction.
  • the surface area of the inner surface of the heat transfer structure 6 is twice that of the flat inner surface without the zigzag structure, so that the heat exchange efficiency can be doubled.
  • the zigzag structure of the heat transfer structure 6 is not limited to that shown in FIG. 12, but it is disclosed that the zigzag structure is formed so that the surface area of the inner surface of the heat transfer structure 6 is 1.5 to 3 times, for example.
  • the left view of FIG. 12B shows a state in which a gap 74 is formed between the inner surface of the heat transfer structure 6 and the fluid 73. In this state, a non-contact portion is formed between the inner surface of the heat transfer structure 6 and the fluid 73, so that the heat exchange efficiency is lowered. Therefore, in the case where such a non-contact portion due to the gap 74 is expected, it is necessary to adjust the pitch (groove) of the zigzag structure so that the non-contact portion does not occur.
  • the cylindrical heat exchanger 102 may be configured to be detachable, and a plurality of cylindrical heat exchangers 102 having different pitches may be prepared.
  • the heat conductor 62 is made of a material having a better thermal conductivity than that of the body 61.
  • the better heat conductivity is a relative comparison of the values of both materials, and an absolute value is specified. It is not a thing.
  • the thermal conductivity of plastic is about 0.2 W / m ⁇ K
  • fluorine resin is about 0.25
  • carbon steel is about 47
  • stainless steel is about 15, aluminum 237
  • pure copper 386 Pyrex glass (PYREX: registered trademark) )
  • a value of about 1 is usually indicated.
  • the material may be selected in consideration of the relative thermal conductivity, and since the fluororesin has a low value among these, when the fluororesin is used as the body 61, the material of any material is heated. As a conductor, the thermal efficiency is improved.
  • the material of the heat transfer structure 6 (body 61) is a metal, for example, when stainless steel is used as the body, the heat conductor has a higher thermal conductivity than the material of the heat transfer structure 6 (body 61). Good metals such as carbon steel, aluminum and pure copper can be selected as the heat conductor. However, the higher the thermal conductivity, the more preferable the material (material) of the heat conductor.
  • a heat exchanger in which the contact surface 63 of the heat exchange fluid and the heat transfer structure 6 is coated with fluorine resin, and the body 61 is made of stainless steel.
  • the corrosion resistance of 8 mm thick stainless steel and fluorine resin is known.
  • the overall heat transfer coefficient of the coated plate is measured, it is 1070 W / m 2 ⁇ K only for stainless steel, but when the 500 ⁇ m corrosion resistant coating is provided, the coefficient is 291 and the heat transfer amount is 1/3. The result is obtained. It has also been reported that when a 50 ⁇ m corrosion resistant coating is provided, the heat transfer coefficient is 845. Therefore, the distance between the heat conductor and the heat exchange fluid is preferably as short as possible.
  • the structure of the heat exchanger which concerns on the specific example 1 of this invention is shown concretely.
  • the heat exchanger 103 shown in FIG. 7 is a rectangular parallelepiped having a size of 150 mm ⁇ 195 mm ⁇ height 34 mm, and many heat exchange fluids pass from the inlet connector (inlet) 81 to the outlet connector (outlet) 82 before flowing out.
  • Heat exchange is performed by passing through the heat exchange fluid flow path 7 having bending points (bending portions) 71 and 72.
  • the flow path 7 is provided by forming a groove-like space in a body 61 made of a block made of fluorine resin.
  • On the both sides of the flow path 7, 172 heat conductors 62 are installed with an interval of 600 ⁇ m.
  • the heat conductor 62 is composed of a cross-recessed countersunk screw (screw having a flat head) made of copper having a diameter of 3 mm and a length of 18 mm, and is screwed through a heat transfer plate 52a into a hole provided in the body 61 of the heat transfer structure. ing. Since the upper surface of this screw is flat, the upper surface of the heat transfer plate 52a can be made flush.
  • the body portion of the screw in which the groove is formed is preferably a cylinder with the same diameter that does not taper.
  • a heat source (not shown) is provided in contact with at least a region where the heat conductor 62 is provided on the heat transfer plate 52a.
  • the heat source is preferably provided so as to be in contact with both surfaces of the heat transfer plates 52a and 52b.
  • Examples of the heat source include a stainless steel plate using a nichrome wire having a heater capacity of 1600 W as a heat source and a mica plate using a nickel alloy having a heater capacity of 4000 W as a heat source.
  • the exposed surface of the heat source is preferably covered with a heat insulating material, and more preferably, the entire outermost surface of the heat exchanger 103 is covered with the heat insulating material.
  • the heat transfer plate 52b is physically connected to the heat transfer plate 52a, and heat from the heat source is transmitted to the heat conductor 62 and the body 61 via the heat transfer plates 52a and 52b.
  • the heat transfer plate 52 a is an upper surface
  • the heat transfer plate 52 b is a bottom surface
  • a hollow rectangular parallelepiped structure including a frame body connecting them is used.
  • the heat transfer plates 52 a and 52 b (and the frame) may be made of the same material as that of the heat conductor 62, or may be made of a material having better heat conductivity than the heat conductor 62.
  • the flow path 7 through which the heat exchange fluid passes has a width of 6 mm, a depth of 20 mm, and a length of 1795 mm, and has a number of bending points (bent portions) in the middle.
  • a bent and bent portion 72 that turns the flow path traveling direction 90 degrees toward the inlet side (IN direction) is provided, and the two flow paths A and B are configured to bend. I try to increase the number of departments.
  • This flow path system is not limited to two in FIG. 7, and may be three or more.
  • the heat exchange fluid flowing through the flow path collides with the flow path wall to form a turbulent flow, so heat exchange at the flow path wall (contact surface) is efficient.
  • the two parallel flow paths indicate, for example, those having an arrangement relationship like the two flow paths denoted by reference numerals 7 and 7 in FIG. From another viewpoint, it is preferable that the flow path 7 meanders so as to sew a gap between the heat conductors 62 arranged at substantially equal intervals.
  • Heat exchange efficiency can be improved by connecting a plurality of the heat exchangers 103 of the present invention shown in FIG.
  • the installation position and the number of installation layers of the heat conductor 62 can be provided while actually considering the efficiency of heat exchange, and it corresponds to a place where the temperature of the heat exchange fluid is too lower than the standard. It is possible to process the body 61 so that the heat conductor 62 can be installed by newly providing a hole for installing the heat conductor 62.
  • FIG. 18 is a side view when the heat exchanger 103 shown in FIG. 7 is stacked to form a multi-stage heat exchanger.
  • a multistage configuration can be achieved.
  • a four-stage configuration is used, but the present invention is not limited to this configuration, and any number of stages can be used as long as the number of stages is two or more.
  • the heat exchanger has a multi-stage configuration as described above, in the heat exchanger other than the lowermost layer, the flow path 7 is heated not only from the heat source located above but also from the heat source located below. That is, in the example of FIG.
  • the heat transfer plate 52 b is also heated from the heat source (heater plate) below it.
  • the surface to be a laminated surface is not covered with a heat insulating material, and the heat source in the lower stage and the heat transfer plate in the upper stage are in direct contact with each other.
  • the heat exchanger of this invention it is possible to extend the length of a flow path easily by setting it as a multistage structure.
  • the internal structure is not changed in accordance with the flow rate of the heat exchange fluid, and the flow size of the flow path and the overall length can be changed to enable the response from a large flow rate to a small flow rate. Yes.
  • a heat exchange performance of 80% or more can be obtained even if the body size is 1 ⁇ 2.
  • heat exchange is performed at a flow rate of 50 L / min or more, it can be handled by increasing the body size.
  • FIG. 19 is a configuration diagram of the temperature adjustment supply device 110 according to the second specific example of the present invention.
  • the temperature control supply device 110 includes a cooling heat exchanger 106, a cooling device 111, and pipes 112a and 112b and 113a and 113b.
  • the cooling heat exchanger 106 includes the heat transfer structure 6 and cooler plates 54a and 54b. The same heat transfer structure 6 as the heat exchangers 101 to 104 can be used.
  • Each of the cooler plates 54a and 54b is provided with a flow path through which the refrigerant circulates. For example, an antifreeze or a gas refrigerant is used as the refrigerant.
  • the refrigerant cooled by the cooling device 111 is supplied to the cooling heat exchanger 106 through the piping 112a, absorbs heat when passing through the cooling heat exchanger 106, and returns to the cooling device 111 through the piping 112b.
  • the cooling heat exchanger 106 is supplied again through the pipe 112a.
  • the heat exchange fluid 73 (for example, pure water) is supplied to the cooling heat exchanger 106 from the pipe 113a, is cooled when passing through the cooling heat exchanger 106, and is discharged from the pipe 113b.
  • thermography The measurement result by thermography is shown in FIG. In the drawing, it was confirmed that the dark colored portion is the high temperature portion, and the high temperature portion coincides with the installation location of the heat conductor 62. It was also found that the temperature distribution of the entire heat exchanger is uniform and can be heated uniformly.
  • the outlet temperature was measured by testing in a wide range of set temperatures of 40 to 160 ° C. and a flow rate of 10 to 50 L / min. The result is shown in FIG. It was found that the heat conversion rate was 80% or more over a wide range of set temperatures and flow rates. It has been found that the heat exchanger of the present invention can flexibly accommodate a wide range of flow rates with the same apparatus.
  • the performance of the heat exchanger of the present invention in which the heat transfer with the heat exchange fluid is via resin and the conventional heat exchanger via stainless steel is compared using the electric heating panel used in Example 1. did.
  • the humidified air was heat-exchanged as in Example 1.
  • the conventional heat exchanger dry nitrogen was heat-exchanged.
  • the result is shown in FIG.
  • the metal 30L is the measurement result of the heat exchanger using stainless steel
  • the resin 30L is the measurement result of the heat exchanger of the present invention. From FIG. 11, it was recognized that the heat exchanger of the present invention showed the same performance as that of a conventional stainless steel product even though the contact portion was made of resin.
  • the heat exchanger of the present invention was tested against H 2 O mist, and the conventional product is intended for dry nitrogen. Since the air containing water mist requires heat corresponding to the latent heat of water, it can be seen that the present invention has higher performance than that shown in FIG.
  • the heat exchanger of the present invention is excellent in heat exchanging property and can prevent corrosion of the heat exchanger due to the heat exchange fluid and contamination of the heat exchange fluid accompanying the corrosion.
  • heating, cooling, and temperature control can be efficiently performed by heat exchange without reducing the purity of the high-purity substance.
  • the heat exchanger and heat exchange method of the present invention are highly efficient heat such as a heating / evaporation device and a cooling / condensing device that require corrosion resistance for the purity of the product, such as chemical, pharmaceutical, food, fiber, electric power, and nuclear power industries. A wide range of use is possible as an exchanger.

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Abstract

[Problem] To provide a high-efficiency heat exchanger which can be applied to a high-purity fluid to be subjected to heat exchange. [Solution] A heat exchanger is provided with a flow passage through which fluid to be subjected to heat exchange flows and a heat transmission structure which is in contact with the fluid to be subjected to heat exchange flowing through the flow passage. The heat exchanger performs heat exchange by heat transfer effected through the contact surface where the fluid to be subjected to heat exchange and the heat transmission structure are in contact with each other. The heat exchanger is characterized in that: (1) the surface of the heat transmission structure, which is in contact with the fluid to be subjected to heat exchange, consists of a material stable against the fluid to be subjected to heat exchange; (2) the heat transmission structure is provided with a heat conduction body, and the heat conduction body consists of a material having a good coefficient of heat conductivity; and (3) the heat conduction body is mounted near the contact surface, which is in contact with the fluid to be subjected to heat exchange, at a position not in contact with the fluid. In the heat exchanger, the efficiency of heat conduction through the surface where the heat transmission structure and the fluid to be subjected to heat exchange are in contact with each other is high.

Description

高効率熱交換器および高効率熱交換方法High efficiency heat exchanger and high efficiency heat exchange method
 
 本発明は、適用分野が限定されることのない熱交換技術に関するものである。特に、酸やアルカリなどの腐食性物質の気体または液体の熱交換や、高純度水、半導体を製造する際の高純度ケイ素化合物などを温度制御する際に有用であり、熱交換の際に生起する装置類の腐食や高純度物質の汚染の問題の解決および熱交換率の向上が実現される。
 すなわち、本発明は、物質の冷却、加熱や温度調節を必要とする技術分野全般において、装置の腐食、不純物による汚染が少なく高効率の熱交換器および熱交換方法を提供することができる。
 なお、本明細書では、加熱源のみならず、吸熱源も含めて「熱源」と呼ぶ場合がある。また、本明細書における「流体」には、加熱または急熱により相変化(例えば、液体から気体への相変化)を伴うものも含まれる。

The present invention relates to a heat exchange technique in which the field of application is not limited. It is particularly useful for heat exchange of gases or liquids of corrosive substances such as acids and alkalis, temperature control of high-purity water, high-purity silicon compounds when manufacturing semiconductors, etc. To solve the problems of corrosion of equipment and contamination of high-purity substances and to improve the heat exchange rate.
That is, the present invention can provide a high-efficiency heat exchanger and heat exchange method with less corrosion of the apparatus and contamination by impurities in all technical fields that require cooling, heating, and temperature control of substances.
In this specification, not only a heat source but also a heat absorption source may be referred to as a “heat source”. In addition, the term “fluid” in the present specification includes those accompanied by a phase change (for example, a phase change from liquid to gas) by heating or rapid heating.
 
 熱交換器は温度の異なる2つの物体を直接または間接的に接触させて熱を伝達して一方の物体を加熱あるいは冷却する装置であり、ボイラー、蒸気発生器、食品製造や化学薬品製造、冷蔵保管といった産業用として、冷却工程、加熱工程、冷蔵に使用されている。
 熱交換器は、通常、被熱交換物質の特性に応じた構造を備えたものであり、例えば、弗化水素酸、硝酸、硫酸などの腐食性の大きい薬液に対して熱交換を行う薬液用熱交換器としては、耐薬品性のある熱交換器を用いて腐食性の高い強酸、強アルカリなどの流体を加熱および冷却する必要があり、この場合は、酸やアルカリに侵されにくい樹脂材料からなる接触部材料を熱媒体中に浸し熱交換を行う間接加熱が代表的なものである。

A heat exchanger is a device that heats or cools one object by directly or indirectly contacting two objects with different temperatures, and heats or cools one object. Boilers, steam generators, food production, chemical production, refrigeration For industrial use such as storage, it is used for cooling, heating, and refrigeration.
A heat exchanger usually has a structure corresponding to the characteristics of the heat exchange material. For example, for a chemical solution that performs heat exchange with a highly corrosive chemical solution such as hydrofluoric acid, nitric acid, and sulfuric acid. As a heat exchanger, it is necessary to heat and cool fluids such as highly corrosive strong acids and strong alkalis using chemical resistant heat exchangers. In this case, resin materials that are not easily affected by acids and alkalis. The indirect heating in which the contact portion material made of is immersed in a heat medium to perform heat exchange is typical.
 
 図1は、代表的な間接熱交換を示した模式図であり、樹脂製管1内を被熱交換流体(酸、アルカリ、水など)が入り口2から出口3へと搬送される間に、熱源5により温度が調整された熱媒体4により樹脂製管1を介して熱交換が行われる。この方法は接触側の樹脂製パイプ1の表面積を増やすこと、例えば、熱媒体4中の管1を長くすることで熱媒体4との接触面積を増加させて熱交換効率を向上させることが出来るが、それにより、熱源で流体を温度調節する装置や容器類を含めてコスト的にも高価な装置となることがある。また、熱媒体を介さないで直接熱源との熱交換をする直接加熱方式の代表的な例を図2に示すと、被熱交換流体に対して耐食性が良好な材質からなり、温度特性に優れた材料からなる管1に熱源5が接触して直接熱交換する。
 いずれの方式においても、被熱交換流体あるいは熱交換媒体により搬送管などの装置が腐食されないこと、熱交換工程において被熱交換流体を汚染することがないこと、および熱交換が効率よく行われること、が必要となる。

FIG. 1 is a schematic diagram showing a typical indirect heat exchange. While a heat exchange fluid (acid, alkali, water, etc.) is conveyed from the inlet 2 to the outlet 3 in the resin pipe 1, FIG. Heat exchange is performed through the resin pipe 1 by the heat medium 4 whose temperature is adjusted by the heat source 5. This method can increase the surface area of the resin pipe 1 on the contact side, for example, lengthen the pipe 1 in the heat medium 4 to increase the contact area with the heat medium 4 and improve the heat exchange efficiency. However, this may result in a costly device including a device and containers for adjusting the temperature of the fluid with a heat source. A typical example of a direct heating method in which heat is exchanged directly with a heat source without using a heat medium is shown in FIG. 2 and is made of a material having good corrosion resistance with respect to the heat exchange fluid, and has excellent temperature characteristics. The heat source 5 comes into contact with the tube 1 made of the above material to exchange heat directly.
In any method, the heat exchange fluid or the heat exchange medium does not corrode the equipment such as the transfer pipe, the heat exchange process does not contaminate the heat exchange fluid, and the heat exchange is performed efficiently. ,Is required.
 
 そこで、搬送管が熱交換媒体あるいは被熱交換流体により腐食などの影響がなされないように、搬送管を樹脂やセラミックス類で被覆して保護することが行われている。
 例えば、高温ガス雰囲気中に設けられ前記高温ガスから伝熱管内の被加熱流体に熱交換をする熱交換用伝熱管において、被加熱流体が流れる管は耐熱合金からなり、該耐熱合金管の外側を、熱膨張緩衝材を介してセラミックス合金複合材料からなるカバー材で覆う三層構造からなり、前記カバー材を構成するセラミックス合金複合材料はAlとAlNを含み、AlNを1wt%以上90wt%以下、(Al+AlN+AlON)の合計割合が50wt%以上100wt%以下である熱交換用伝熱管(特許文献1)が提案されている。

Therefore, the transport pipe is protected by being covered with a resin or ceramics so that the transport pipe is not affected by the heat exchange medium or the heat exchange fluid.
For example, in a heat exchange heat transfer tube that is provided in a high temperature gas atmosphere and exchanges heat from the high temperature gas to a heated fluid in the heat transfer tube, the tube through which the heated fluid flows is made of a heat resistant alloy, and the outside of the heat resistant alloy tube Is covered with a cover material made of a ceramic alloy composite material through a thermal expansion buffer material, and the ceramic alloy composite material constituting the cover material contains Al and AlN, and AlN is 1 wt% or more and 90 wt% or less. , (Al + AlN + AlON) has been proposed as a heat exchanger tube for heat exchange (Patent Document 1) having a total ratio of 50 wt% to 100 wt%.
 
 弗素樹脂は、各種の薬剤に対して耐食性および耐熱性に優れることが知られているが、例えば、搬送管を弗素樹脂のみで構成すると、弗素樹脂自体が本来熱の不良導体であるために熱交換効率が低く、所定温度に到達するために長時間を要し、また所定温度での温度制御の精度も悪いという欠点を改善するために、弗素樹脂を熱伝導性の良好な金属などの表面に被膜形成する提案が数多くなされてきた。例えば、基体上に弗素樹脂を含有する少なくとも2層の塗膜を有するガス使用設備用部材において、基材上に塗装される最下層膜から最上層膜に従って、各層中弗素樹脂の含有量を順次増大させ、且つ無機充填剤の含有量を順次減少させた塗膜を有する熱交換器などとして用いられるガス使用設備用部材(特許文献2)や、

Fluororesin is known to be excellent in corrosion resistance and heat resistance against various chemicals. For example, if the transport tube is made of only fluororesin, the fluororesin itself is inherently a poor conductor of heat. In order to improve the disadvantages of low exchange efficiency, long time to reach the specified temperature, and poor temperature control accuracy at the specified temperature, the fluororesin is used on the surface of metal with good thermal conductivity. Many proposals have been made to form a film. For example, in a gas-use facility member having at least two layers of a coating film containing a fluorine resin on a substrate, the content of the fluorine resin in each layer is sequentially changed in accordance with the uppermost layer film from the lowermost layer film coated on the substrate. Gas use equipment member (Patent Document 2) used as a heat exchanger or the like having a coating film that is increased and the content of the inorganic filler is sequentially reduced,
 
 耐食性が優れたアルミニウム合金材および腐食性を有する流体を媒体とする伝熱部に前記アルミニウム合金材を用いたプレートフィン式熱交換器、プレート式熱交換器を提供するものであって、腐食性を有する流体を媒体とする伝熱部を用いたプレートフィン式熱交換器、プレート式熱交換器などに用いるアルミニウム合金材表面に、有機ホスホン酸下地皮膜を有し、更にその上に、乾燥後の膜厚で1~100μmの平均厚みの弗素樹脂塗料皮膜を有して、塗膜密着の耐久性を向上させて、海水などの腐食性を有する流体に対する耐食性が優れるものとすること(特許文献3)が提案されている。
 このように、熱伝導の良い金属に樹脂コーティングする方法が一般的にあるが、2種類の材料の熱膨張が異なることから、膨張収縮に対応しがたくコーティング層が剥離することがあり、金属部の腐食および金属類による汚染の原因となる問題が生じることがある。更にこの方法では、樹脂コーティング部のピンホールからの対象流体が浸透し同様の問題が避けられない。

The present invention provides a plate fin type heat exchanger and a plate type heat exchanger using the aluminum alloy material in a heat transfer part using an aluminum alloy material having excellent corrosion resistance and a corrosive fluid as a medium. It has an organic phosphonic acid undercoat on the aluminum alloy material surface used in plate fin type heat exchangers, plate type heat exchangers, etc. using a heat transfer part with a fluid as a medium, and further after drying It has a fluorine resin paint film with an average thickness of 1 to 100 μm and improves the durability of the adhesion of the paint film, and has excellent corrosion resistance against corrosive fluids such as seawater (Patent Literature) 3) has been proposed.
As described above, there is a general method of resin coating on a metal having good thermal conductivity. However, since the two materials have different thermal expansion, the coating layer may peel off in response to expansion and contraction. Problems that cause corrosion of parts and contamination by metals may occur. Furthermore, in this method, the target fluid from the pinhole in the resin coating portion permeates and the same problem cannot be avoided.
 
 また、熱伝導性および耐食性に優れた炭素が採用される場合がある。例えば、熱交換器を用いて伝熱面を変質させることなく、塩素を含む塩化水素水溶液を大量に加熱または冷却し得る方法において、熱交換器の伝熱面が弗素樹脂含浸カーボンで構成されていることを特徴とし、この熱交換器は、ハウジング内に、弗素樹脂含浸カーボンで構成されてなるブロックであって、塩化水素水溶液が流通する塩化水素水溶液流路と、熱媒体が流通する熱媒体流路とが設けられたブロックを配置してなるブロック式熱交換器が提案されている(特許文献4)。
 また、接液部が金属で対応可能な被熱交換物質に対してはステンレス鋼からなる熱交換器を使うことが出来る。しかしながら、ステンレス鋼は金属の中でも熱伝導率が低く一定の熱交換能力を得る為には容量の大きい熱源を使用する必要があり本体の大型化および消費電力の増大が要求される問題がある。
 このように、高い耐食性を得ると共に熱交換効率を増大させる目的で、種々の材料が熱交換器に用いる試みがなされたが、特に腐食性の高い被熱交換物質に対応できる熱交換効率の高い熱交換技術の開発が望まれていた。

Moreover, carbon excellent in thermal conductivity and corrosion resistance may be employed. For example, in a method that can heat or cool a large amount of an aqueous hydrogen chloride solution containing chlorine without altering the heat transfer surface using a heat exchanger, the heat transfer surface of the heat exchanger is made of fluororesin-impregnated carbon. The heat exchanger is a block made of fluororesin-impregnated carbon in a housing, and includes a hydrogen chloride aqueous solution flow path through which a hydrogen chloride aqueous solution flows, and a heat medium through which the heat medium flows. A block heat exchanger in which a block provided with a flow path is arranged has been proposed (Patent Document 4).
In addition, a heat exchanger made of stainless steel can be used for a heat exchange material whose liquid contact part can be made of metal. However, stainless steel has a problem that it is necessary to use a heat source with a large capacity in order to obtain a constant heat exchange capability among metals, so that a large body and an increase in power consumption are required.
As described above, in order to obtain high corrosion resistance and increase heat exchange efficiency, attempts have been made to use various materials in the heat exchanger. However, the heat exchange efficiency is high, particularly for heat exchange materials with high corrosivity. Development of heat exchange technology was desired.
 
特許第3674401号公報 特開2004-283699号公報 特開2008-156748号公報 特開2006-289799号公報 特開平9-280786号公報

Japanese Patent No. 3674401 JP 2004-283699 A JP 2008-156748 A JP 2006-289799 A JP-A-9-280786
 
 本発明は、上記従来技術に鑑み、被熱交換流体に対する熱交換性能および耐食性が共に高い熱交換器を提供するものである。
 従来の熱交換器では被熱交換流体を熱交換する際に流体が接触する部材を熱源、冷媒などの熱媒体に接触させ熱交換する方法が一般的であるが、接触部材の材質は流体の特性に合わせて選択されていた。しかしながら、選択した接触部材の材質が必ずしも熱伝導に優れていると限らず、その場合には、例えば、熱源である電熱ヒーターを多数使用したり、容量の大きい電熱ヒーターを用いることにより熱伝導の低い部材の欠点を補うことが必要となることがあった。そうすると、熱交換でのエネルギー効率は低く、機器も大型となることにしばしば遭遇した。

In view of the above prior art, the present invention provides a heat exchanger having high heat exchange performance and corrosion resistance for a heat exchange fluid.
In a conventional heat exchanger, when a heat exchange fluid is heat-exchanged, a member that contacts the fluid is generally brought into contact with a heat medium such as a heat source or a refrigerant to perform heat exchange. It was selected according to the characteristics. However, the material of the selected contact member is not necessarily excellent in heat conduction. In this case, for example, a large number of electric heaters that are heat sources or a large-capacity electric heater can be used. It may be necessary to compensate for the disadvantages of low members. As a result, it was often encountered that the energy efficiency of heat exchange was low and the equipment was large.
 
 本発明は、被熱交換流体の特性にのみ注目して接触部の材質を選択した場合であっても高効率な熱交換を行えることを特徴とするものであるが、さらに、装置が大がかりにならず、低コストでコンパクトな製品とすることを可能とする。本発明は、熱交換対象流体を選ばず広い分野での応用が可能である高効率熱交換器の提供を目的とする。また、本発明は、被熱交換流体による機器の腐食が無く、また、熱交換された流体が汚染されることがない熱交換器を提供することを目的とするものである。さらに本発明は、腐食性の強い弗酸や塩化水素などの水溶液や気体、水酸化ナトリウムなどのアルカリ水溶液の加熱あるいは冷却において熱伝導特性の優れた熱交換器を提供するものである。また、本発明は、被熱交換流体の高純度を維持しながら高効率の熱交換を可能とする熱交換技術を提供するものである。

The present invention is characterized in that highly efficient heat exchange can be performed even when the material of the contact portion is selected by paying attention only to the characteristics of the heat exchange fluid. In other words, it is possible to make a low-cost and compact product. An object of the present invention is to provide a high-efficiency heat exchanger that can be applied in a wide range of fields regardless of the heat exchange target fluid. It is another object of the present invention to provide a heat exchanger in which the equipment is not corroded by the heat exchange fluid and the heat exchanged fluid is not contaminated. Furthermore, the present invention provides a heat exchanger having excellent heat conduction characteristics in heating or cooling of an aqueous solution such as hydrofluoric acid and hydrogen chloride, a gas, and an alkaline aqueous solution such as sodium hydroxide, which are highly corrosive. The present invention also provides a heat exchange technique that enables highly efficient heat exchange while maintaining high purity of the heat exchange fluid.
 
 本発明は以下に記載の技術的事項から構成される。
[1]熱源と、被熱交換流体に接触する熱伝達構造体と、熱源からの熱を熱伝達構造体に伝熱する伝熱部材を具備し、被熱交換流体と熱伝達構造体との接触面を通して伝熱型熱交換をなす熱交換器において、熱伝達構造体は、流入口、流出口および被熱交換流体流路を有するボデーと、ボデーに装着される多数の熱伝導体とを備えてなり、被熱交換流体との接触面を構成する被熱交換流体流路の内壁面は被熱交換流体に対して安定な材質からなること、熱伝導体はボデーの材料より熱伝導率の良い材料からなること、熱伝導体は、被熱交換流体流路の近傍であって被熱交換流体には接触しない位置に装着されていること、を特徴とする熱交換器。
[2]多数の熱伝導体が、被熱交換流体流路を挟んで対向配置された複数個の熱伝導体を含む[1]に記載の熱交換器。
[3]伝熱部材が、ボデーを挟む2つの伝熱部材からなり、2つの伝熱部材のそれぞれから1以上の熱伝導体が延出される[1]または[2]に記載の熱交換器。ここで、熱伝導体が延出される態様には、伝熱部材と熱伝導体とが一体的に成形される態様のみならず、伝熱部材に別体の熱伝導体が装着される態様も含まれる。
[4]熱伝導体が、ピン状の構造を有するものである[1]から[3]のいずれかに記載の熱交換器。
[5]多数の熱伝導体の少なくとも一部が、板状の伝熱部材と一体的に形成される[4]に記載の熱交換器。
[6]多数の熱伝導体の少なくとも一部が、ジグザグ構造の外側面を有するものである[4]または[5]に記載の熱交換器。好ましくは、多数の熱伝導体の過半数をジグザグ構造の外側面を有するものとする。
[7]外側面の表面積が、凸部が無い外側面とした場合の1.5~3倍となるジグザグ構造である[6]に記載の熱交換器。
[8]ジグザグ構造の外側面を有する熱伝導体が、ネジである[6]または[7]に記載の熱交換器。
[9]ジグザグ構造の外側面を有する熱伝導体が、頭部がフラットなネジである[8]に記載の熱交換器。

The present invention is composed of the technical matters described below.
[1] A heat source, a heat transfer structure that contacts the heat exchange fluid, and a heat transfer member that transfers heat from the heat source to the heat transfer structure, and the heat exchange fluid and the heat transfer structure In a heat exchanger that performs heat transfer heat exchange through a contact surface, the heat transfer structure includes a body having an inlet, an outlet, and a heat exchange fluid flow path, and a number of heat conductors attached to the body. The inner wall surface of the heat exchange fluid flow path constituting the contact surface with the heat exchange fluid is made of a material that is stable to the heat exchange fluid, and the heat conductor has a higher thermal conductivity than the material of the body. The heat exchanger is characterized in that it is made of a good material, and the heat conductor is mounted in a position near the heat exchange fluid flow path and not in contact with the heat exchange fluid.
[2] The heat exchanger according to [1], wherein the plurality of heat conductors include a plurality of heat conductors arranged to face each other with the heat exchange fluid flow path interposed therebetween.
[3] The heat exchanger according to [1] or [2], wherein the heat transfer member includes two heat transfer members sandwiching the body, and one or more heat conductors are extended from each of the two heat transfer members. . Here, the mode in which the heat conductor is extended includes not only a mode in which the heat transfer member and the heat conductor are integrally formed, but also a mode in which a separate heat conductor is attached to the heat transfer member. included.
[4] The heat exchanger according to any one of [1] to [3], wherein the heat conductor has a pin-like structure.
[5] The heat exchanger according to [4], wherein at least some of the large number of heat conductors are formed integrally with a plate-like heat transfer member.
[6] The heat exchanger according to [4] or [5], wherein at least a part of the plurality of heat conductors has an outer surface having a zigzag structure. Preferably, the majority of the heat conductors have the outer surface of the zigzag structure.
[7] The heat exchanger according to [6], wherein the outer surface has a zigzag structure in which the surface area of the outer surface is 1.5 to 3 times that of the outer surface having no protrusions.
[8] The heat exchanger according to [6] or [7], wherein the heat conductor having the outer surface of the zigzag structure is a screw.
[9] The heat exchanger according to [8], wherein the heat conductor having the outer surface of the zigzag structure is a screw having a flat head.
 
[10]被熱交換流体流路が、複数の屈曲部を有する[1]から[9]のいずれかに記載の熱交換器。
[11]被熱交換流体流路が、流入口側に方向転換する折り返し屈曲部を有する[10]に記載の熱交換器。
[12]流入口に近い側に配置された熱伝導体の少なくとも一部が、流入口から遠い側に配置された熱伝導体と比べ熱伝導率の高い材料からなる熱伝導体である[1]から[11]のいずれかに記載の熱交換器。ここで、流入口に近い側とは、例えば、流路の全長のうち流入口から1/2、1/3または1/4をいい、流入口から遠い側も同様である。
[13]流入口から遠い側と比べ、流入口に近い側では熱伝導体の数が多く、かつ、高密度で配置されている[1]から[12]のいずれかに記載の熱交換器。
[14]流出口が、外界と連通する吐出口である[12]または[13]に記載の熱交換器。
[15][1]から[13]のいずれかに記載の熱交換器を複数個積層してなる熱交換器。
[16]被熱交換流体流路の内壁面が、樹脂である[1]から[15]のいずれかに記載の熱交換器。
[17]被熱交換流体流路の内壁面が、金属またはカーボンである[1]から[15]のいずれかに記載の熱交換器。
[18]多数の熱伝導体が、銅からなる熱伝導体およびアルミからなる熱伝導体を含む[1]から[17]のいずれかに記載の熱交換器。
[19]熱源が、加熱源である[1]から[18]のいずれかに記載の熱交換器。
[20]熱源が、吸熱源である[1]から[18]のいずれかに記載の熱交換器。
[21][1]から[20]のいずれかに記載の熱交換器を用いて、流体と伝熱型熱交換を行う熱交換方法。

[10] The heat exchanger according to any one of [1] to [9], wherein the heat exchange fluid channel has a plurality of bent portions.
[11] The heat exchanger according to [10], wherein the heat exchange fluid channel has a folded back portion that changes direction toward the inlet.
[12] At least a part of the heat conductor disposed on the side close to the inlet is a heat conductor made of a material having a higher thermal conductivity than the heat conductor disposed on the side far from the inlet [1] ] To [11]. Here, the side close to the inflow port is, for example, 1/2, 1/3 or 1/4 of the total length of the flow path from the inflow port, and the same applies to the side far from the inflow port.
[13] The heat exchanger according to any one of [1] to [12], wherein the number of heat conductors is greater on the side closer to the inlet than the side far from the inlet and is arranged at a high density. .
[14] The heat exchanger according to [12] or [13], wherein the outflow port is a discharge port communicating with the outside.
[15] A heat exchanger in which a plurality of heat exchangers according to any one of [1] to [13] are stacked.
[16] The heat exchanger according to any one of [1] to [15], wherein the inner wall surface of the heat exchange fluid channel is resin.
[17] The heat exchanger according to any one of [1] to [15], wherein the inner wall surface of the heat exchange fluid channel is metal or carbon.
[18] The heat exchanger according to any one of [1] to [17], wherein the multiple heat conductors include a heat conductor made of copper and a heat conductor made of aluminum.
[19] The heat exchanger according to any one of [1] to [18], wherein the heat source is a heating source.
[20] The heat exchanger according to any one of [1] to [18], wherein the heat source is an endothermic source.
[21] A heat exchange method for performing heat transfer type heat exchange with a fluid using the heat exchanger according to any one of [1] to [20].
 
[22][12]に記載の熱交換器を用いて、流体と伝熱型熱交換を行う熱交換方法であって、流入口に近い側に、流入口から遠い側と比べ熱伝導率が相対的に高い材料からなる熱伝導体を配置し、流入口から遠い側に、流入口から近い側と比べ熱伝導率が相対的に低い材料からなる熱伝導体を配置することにより、被熱交換流体流路の上流側と下流側で生じる温度分布のムラを抑える熱交換方法。
[23][13]に記載の熱交換器を用いて、流体と伝熱型熱交換を行う熱交換方法であって、流入口に近い側に、流入口から遠い側と比べ熱伝導率が相対的に高い材料からなる熱伝導体を配置し、流入口から遠い側に、流入口から近い側と比べ熱伝導率が相対的に低い材料からなる熱伝導体を配置することにより、被熱交換流体流路の上流側と下流側で生じる温度分布のムラを抑える熱交換方法。
[24][16]に記載の熱交換器を用いて、腐食性を有する流体と伝熱型熱交換を行う熱交換方法。

[22] A heat exchange method for performing heat transfer heat exchange with a fluid using the heat exchanger according to [12], wherein the thermal conductivity is closer to the inlet and closer to the side farther from the inlet. By placing a heat conductor made of a relatively high material and placing a heat conductor made of a material having a relatively low thermal conductivity on the side farther from the inlet than the side closer to the inlet, A heat exchange method that suppresses uneven temperature distribution that occurs upstream and downstream of the exchange fluid flow path.
[23] A heat exchange method for performing heat transfer heat exchange with a fluid using the heat exchanger according to [13], wherein the heat conductivity is closer to the inlet and closer to the side farther from the inlet. By placing a heat conductor made of a relatively high material and placing a heat conductor made of a material having a relatively low thermal conductivity on the side farther from the inlet than the side closer to the inlet, A heat exchange method that suppresses uneven temperature distribution that occurs upstream and downstream of the exchange fluid flow path.
[24] A heat exchange method for performing heat transfer heat exchange with a corrosive fluid using the heat exchanger according to [16].
 
 別の観点からは、本発明は以下に記載の技術的事項から構成される。
(1)被熱交換流体の流路と、その流路を流れる被熱交換流体に接触する熱伝達構造体を具備し、被熱交換流体と熱伝達構造体との接触面を通して伝熱型熱交換をなす熱交換器において、
(a)熱伝達構造体は、被熱交換流体との接触面を構成する表面は被熱交換流体に対して安定な材質からなること、
(b)熱伝達構造体には熱伝導体が装着され、その熱伝導体は熱伝達構造体の材料より熱伝導率の良い材料からなること、
(c)熱伝導体は、被熱交換流体との接触面の近傍であって被熱交換流体には接触しない位置に装着されていること、
 を特徴とする熱伝達構造体と被熱交換流体が接触する面での熱伝導効率が高められている熱交換器。
(2)熱伝導体がピン状の構造を有するものである上記(1)に記載の熱交換器。ここで、ピン状の構造としては、例えば、円柱形状、多角柱形状が挙げられ、外側面がジグザグ構造であるものも含まれる。
(3)熱伝導体がジグザグ構造の表面を有するものである上記(1)または(2)に記載の熱交換器。
(4)熱伝達構造体の被熱交換流体との接触面がジグザグ構造となっている上記(1)から(3)のいずれかに記載の熱交換器。
(5)被熱交換流体の流路が、被熱交換流体を乱流化して熱伝達率の効率化を図る折り返し構造となっている上記(1)から(4)のいずれかに記載の熱交換器。
(6)流路が、口径および/または全長を変更可能に構成されている上記(1)から(5)のいずれかに記載の熱交換器。
(7)被熱交換流体が、気体または液体である上記(1)から(6)のいずれかに記載の熱交換器。
(8)熱伝達構造体の材料が、樹脂または金属である上記(1)から(7)のいずれかに記載の熱交換器。
(9)熱伝導体が、熱伝達構造体の材料より熱伝導率の良い金属である上記(1)から(8)のいずれかに記載の熱交換器。

From another viewpoint, the present invention is composed of the technical matters described below.
(1) A heat transfer fluid is provided through a contact surface between the heat exchange fluid and the heat transfer structure, the heat transfer fluid being in contact with the heat exchange fluid flowing through the flow channel and the heat exchange fluid flowing through the flow channel. In exchange heat exchangers,
(A) the heat transfer structure has a surface constituting a contact surface with the heat exchange fluid made of a material that is stable with respect to the heat exchange fluid;
(B) a heat conductor is mounted on the heat transfer structure, and the heat conductor is made of a material having better thermal conductivity than the material of the heat transfer structure;
(C) the heat conductor is mounted near the contact surface with the heat exchange fluid and not in contact with the heat exchange fluid;
A heat exchanger in which the heat transfer efficiency is improved at the surface where the heat transfer structure and the heat exchange fluid contact with each other.
(2) The heat exchanger according to (1), wherein the heat conductor has a pin-like structure. Here, examples of the pin-like structure include a cylindrical shape and a polygonal column shape, and include a zigzag structure on the outer surface.
(3) The heat exchanger according to (1) or (2), wherein the heat conductor has a zigzag structure surface.
(4) The heat exchanger according to any one of (1) to (3), wherein a contact surface of the heat transfer structure with the heat exchange fluid has a zigzag structure.
(5) The heat according to any one of (1) to (4), wherein the flow path of the heat exchange fluid has a folded structure for turbulent flow of the heat exchange fluid to improve the efficiency of heat transfer. Exchanger.
(6) The heat exchanger according to any one of (1) to (5), wherein the flow path is configured so that the diameter and / or the total length can be changed.
(7) The heat exchanger according to any one of (1) to (6), wherein the heat exchange fluid is gas or liquid.
(8) The heat exchanger according to any one of (1) to (7), wherein the material of the heat transfer structure is resin or metal.
(9) The heat exchanger according to any one of (1) to (8), wherein the heat conductor is a metal having better heat conductivity than the material of the heat transfer structure.
 
(10)被熱交換流体に熱伝達構造体を接触させて、被熱交換流体と熱伝達構造体との接触面を通して伝熱型熱交換をおこなう熱交換方法において、
(a)熱伝達構造体は、被熱交換流体との接触面を構成する表面は被熱交換流体に対して安定な材質からなること、
(b)熱伝達構造体には熱伝導体が装着され、その熱伝導体は熱伝達構造体の材料より熱伝導率の良い材料からなること、
(c)熱伝導体は、被熱交換流体との接触面の近傍であって被熱交換流体には接触しない位置に装着されていること、
 により熱伝達構造体と被熱交換流体が接触する面での熱伝導効率が高めていることを特徴とする熱交換方法。
(11)熱伝導体がピン状の構造を有するものである上記(10)に記載の熱交換方法。
(12)熱伝導体がジグザグ構造の表面を有するものである上記(10)または(11)に記載の熱交換方法。
(13)熱伝達構造体の被熱交換流体との接触面がジグザグ構造となっている上記(10)から(12)のいずれかに記載の熱交換方法。
(14)被熱交換流体の流路が、被熱交換流体を乱流化して熱伝達率の効率化を図る折り返し構造となっている上記(10)から(13)のいずれかに記載の熱交換方法。
(15)流路が、口径および/または全長を変更可能に構成されている上記(10)から(14)のいずれかに記載の熱交換方法。
(16)被熱交換流体が、気体または液体である上記(10)から(15)のいずれかに記載の熱交換方法。
(17)熱伝達構造体の材料が、樹脂または金属である上記(10)から(16)のいずれかに記載の熱交換方法。
(18)熱伝導体が、熱伝達構造体の材料より熱伝導率の良い金属である上記(10)から(17)のいずれかに記載の熱交換方法。

(10) In a heat exchange method in which a heat transfer structure is brought into contact with a heat exchange fluid and heat transfer type heat exchange is performed through a contact surface between the heat exchange fluid and the heat transfer structure,
(A) the heat transfer structure has a surface constituting a contact surface with the heat exchange fluid made of a material that is stable with respect to the heat exchange fluid;
(B) a heat conductor is mounted on the heat transfer structure, and the heat conductor is made of a material having better thermal conductivity than the material of the heat transfer structure;
(C) the heat conductor is mounted near the contact surface with the heat exchange fluid and not in contact with the heat exchange fluid;
The heat exchange method is characterized in that the heat transfer efficiency at the surface where the heat transfer structure and the heat exchange fluid come into contact with each other is increased by the above.
(11) The heat exchange method according to (10), wherein the heat conductor has a pin-like structure.
(12) The heat exchange method according to (10) or (11), wherein the heat conductor has a zigzag surface.
(13) The heat exchange method according to any one of (10) to (12), wherein a contact surface of the heat transfer structure with the heat exchange fluid has a zigzag structure.
(14) The heat according to any one of (10) to (13), wherein the flow path of the heat exchange fluid has a folded structure that turbulently heats the heat exchange fluid to improve the efficiency of heat transfer. method of exchange.
(15) The heat exchange method according to any one of (10) to (14), wherein the flow path is configured so that the diameter and / or the total length can be changed.
(16) The heat exchange method according to any one of (10) to (15), wherein the heat exchange fluid is gas or liquid.
(17) The heat exchange method according to any one of (10) to (16), wherein the material of the heat transfer structure is resin or metal.
(18) The heat exchange method according to any one of (10) to (17), wherein the heat conductor is a metal having better heat conductivity than the material of the heat transfer structure.
 
 本発明により以下に記載の効果が奏される。
 酸、アルカリ類は金属に対して激しく反応するため、その接触部に金属を使用することは出来ない。そこで、従来は、接触部に樹脂を用いた熱交換器が用いられていたが、熱伝導率が低いために熱効率が悪く、装置としての構成も大きく複雑となっていた。本発明により高い熱交換効率でコンパクトな構造の熱交換器を提供でき、また、熱交換器と酸やアルカリなどの被熱交換流体との反応は回避されるので、高純度の酸、アルカリなどの温度調整が微量成分により汚染されることなく可能となる。また、高純度水などの酸、アルカリ以外の物質に対しても液状、ガス状などその形態にかかわらず適用が可能である。
 さらに、本発明は、流体力学と熱力学を駆使し、直接加熱方式を採用することにより、被熱交換流体との接触部をすべて樹脂製とした場合においても、省電力で省スペース、変換効率の良い熱交換技術を提供することができる。
 また、被加熱流体との接触部をメタルフリーとして直接熱交換を行う構成でも、80%以上の熱交換能力を実現したことからも、従来の技術から抜きん出た性能を有する熱交換器の提供を本発明は可能にしたといえる。

The following effects can be achieved by the present invention.
Since acids and alkalis react violently with metals, it is not possible to use metals in the contact area. Therefore, conventionally, a heat exchanger using a resin for the contact portion has been used. However, since the heat conductivity is low, the heat efficiency is poor, and the configuration of the apparatus is greatly complicated. According to the present invention, a heat exchanger having a compact structure with high heat exchange efficiency can be provided, and the reaction between the heat exchanger and the heat exchange fluid such as acid or alkali is avoided, so that high-purity acid, alkali, etc. The temperature can be adjusted without being contaminated by trace components. Moreover, it can be applied to substances other than acids and alkalis such as high-purity water regardless of the form such as liquid or gaseous.
Furthermore, the present invention makes full use of hydrodynamics and thermodynamics and adopts a direct heating method, so that even if all the contact parts with the heat exchange fluid are made of resin, power saving, space saving, conversion efficiency Good heat exchange technology.
In addition, the heat exchange capacity of 80% or more has been realized even in the configuration in which the contact portion with the fluid to be heated is directly metal-free and the heat exchange capability is 80% or more. The present invention has been made possible.
 
従来の代表的間接加熱による熱交換を示す概略図である。 従来の代表的な直接加熱による熱交換を示す概略図である。 複数の独立した熱伝導体を用いた伝熱型熱交換器の一例を示す概略断面図である。 複数の熱伝導体が、伝熱プレートと一体にされている伝熱型熱交換器の一例を示す概略断面図である。 ジグザグな表面構造を有している熱伝導体を用いた伝熱型熱交換器の一例を示す概略断面図である。 被熱交換流体の流路がジグザグな形状をなしている伝熱型熱交換器の一例を示す概略断面図である。 本発明の具体例1に係る熱交換器の断面構造を示す図であり、図7-1は縦面(垂直方向)、図7-2は平面(水平方向)での断面を示す。 熱交換能力を試験した装置の配置を示す図である。 サーモグラフィーによる温度分布の確認をした図面であり、濃い部分には熱伝導体が設置されて温度が周囲より上昇していることを示す。 試験結果の出口ガス温度と設定温度の測定値の関係を示す図である。 本発明の樹脂を介した熱交換と金属面を介した熱交換の熱交換能力を対比した図である。 被熱交換流体の流路のジグザグ構造を説明する模式断面図であり、(a)は表面積を2倍とする場合を説明する図であり、(b)はピッチ深さの調節を説明する図である。 熱伝導体の配置バリエーションを示す概略断面図である。(a)は、被熱交換流体流路を挟む2本の熱伝導体を上方から延出した配置例である。(b)は、被熱交換流体流路を挟む2本の熱伝導体を上方および下方から延出した配置例である。(c)は、被熱交換流体流路を挟む4本の熱伝導体を上方および下方から延出した配置例である。(d)は、(a)の熱伝導体の配置例において、熱伝導体の外側面をジグザグ構造とした構成例である。(e)は、(b)の熱伝導体の配置例において、熱伝導体の外側面をジグザグ構造とした構成例である。(f)は、(c)の熱伝導体の配置例において、熱伝導体の外側面をジグザグ構造とした構成例である。 図13において、伝熱プレートと複数の熱伝導体とを一体に成形した構成例である。(a)は、被熱交換流体流路を挟む2本の熱伝導体を上方から延出した配置例である。(b)は、被熱交換流体流路を挟む2本の熱伝導体を上方および下方から延出した配置例である。(c)は、被熱交換流体流路を挟む4本の熱伝導体を上方および下方から延出した配置例である。(d)は、(a)の熱伝導体の配置例において、熱伝導体の外側面をジグザグ構造とした構成例である。(e)は、(b)の熱伝導体の配置例において、熱伝導体の外側面をジグザグ構造とした構成例である。(f)は、(c)の熱伝導体の配置例において、熱伝導体の外側面をジグザグ構造とした構成例である。 異なる材質の熱伝導体を配置した場合の温度分布を説明する図であり、(a)は同一種類の熱伝導体を配置した場合の平面図と温度分布図であり、(b)は異なる材質の熱伝導体を装着した場合の平面図と温度分布図である。 上流側と下流側とで異なる密度で熱伝導体を配置した熱交換器の平面図である。 本発明のシャワーヘッド付き熱交換器の断面構造を示す図であり、(a)は平面(水平方向)、(b)は縦面(垂直方向)での断面を示す。 図7に示す熱交換器を積層して多段構成の熱交換器とした場合の側面図である。 本発明の具体例2に係る温調供給装置の構成図である。

It is the schematic which shows the heat exchange by the conventional typical indirect heating. It is the schematic which shows the heat exchange by the conventional typical direct heating. It is a schematic sectional drawing which shows an example of the heat-transfer type heat exchanger using the some independent heat conductor. It is a schematic sectional drawing which shows an example of the heat-transfer type heat exchanger with which the several heat conductor is united with the heat-transfer plate. It is a schematic sectional drawing which shows an example of the heat transfer type heat exchanger using the heat conductor which has a zigzag surface structure. It is a schematic sectional drawing which shows an example of the heat-transfer type heat exchanger whose flow path of a heat exchange fluid has comprised the zigzag shape. It is a figure which shows the cross-section of the heat exchanger which concerns on the specific example 1 of this invention, FIG. 7-1 shows the cross section in a vertical surface (vertical direction), and FIG. It is a figure which shows arrangement | positioning of the apparatus which tested the heat exchange capability. It is the figure which confirmed the temperature distribution by thermography, and shows that the heat conductor is installed in the dark part and temperature is rising from the circumference | surroundings. It is a figure which shows the relationship between the measured value of the exit gas temperature of a test result, and preset temperature. It is the figure which contrasted the heat exchange capability of the heat exchange through the resin of this invention, and the heat exchange through a metal surface. It is a schematic cross section explaining the zigzag structure of the channel of the heat exchange fluid, (a) is a diagram explaining the case where the surface area is doubled, (b) is a diagram explaining the adjustment of the pitch depth It is. It is a schematic sectional drawing which shows the arrangement | positioning variation of a heat conductor. (A) is the example of arrangement | positioning which extended the two heat conductors which pinched | interpose a to-be-heat-exchanged fluid flow path from upper direction. (B) is an arrangement example in which two heat conductors sandwiching the heat exchange fluid flow path are extended from above and below. (C) is an arrangement example in which four heat conductors sandwiching the heat exchange fluid channel are extended from above and below. (D) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (a). (E) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (b). (F) is the structural example which made the outer surface of the heat conductor the zigzag structure in the example of arrangement | positioning of the heat conductor of (c). In FIG. 13, it is the structural example which shape | molded the heat-transfer plate and the several heat conductor integrally. (A) is the example of arrangement | positioning which extended the two heat conductors which pinched | interpose a to-be-heat-exchanged fluid flow path from upper direction. (B) is an arrangement example in which two heat conductors sandwiching the heat exchange fluid flow path are extended from above and below. (C) is an arrangement example in which four heat conductors sandwiching the heat exchange fluid channel are extended from above and below. (D) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (a). (E) is a configuration example in which the outer surface of the heat conductor has a zigzag structure in the arrangement example of the heat conductor in (b). (F) is the structural example which made the outer surface of the heat conductor zigzag structure in the example of arrangement | positioning of the heat conductor of (c). It is a figure explaining the temperature distribution at the time of arrange | positioning the heat conductor of a different material, (a) is a top view at the time of arrange | positioning the same kind of heat conductor, and a temperature distribution figure, (b) is a different material. It is a top view at the time of mounting | wearing with the heat conductor, and a temperature distribution map. It is a top view of the heat exchanger which has arrange | positioned a heat conductor with a different density by the upstream and downstream. It is a figure which shows the cross-section of the heat exchanger with a shower head of this invention, (a) shows a plane (horizontal direction), (b) shows the cross section in a vertical surface (vertical direction). It is a side view at the time of laminating | stacking the heat exchanger shown in FIG. 7, and setting it as the heat exchanger of a multistage structure. It is a block diagram of the temperature control supply apparatus which concerns on the specific example 2 of this invention.
 
 本発明は、被熱交換流体が通過する通路と、その通路を通過する被熱交換流体に接触する熱伝達構造体を具備し、被熱交換流体と熱伝達構造体との接触面を通して伝熱型熱交換をなす熱交換器において、
(1)熱伝達構造体は、被熱交換流体との接触面を構成する表面は被熱交換流体に対して安定な材質からなること、
(2)熱伝達構造体には熱伝導体が装着され、その熱伝導体は熱伝達構造体の材料より熱伝導率の良い材料からなること、
(3)熱伝導体は、被熱交換流体との接触面の近傍であって被熱交換流体には接触しない位置に装着されていること、
 を特徴とする熱伝達構造体と被熱交換流体が接触する面での熱伝導効率が高められている熱交換器および熱交換方法に関するものである。
 本発明は、被熱交換流体と影響し合わない材質(材料)からなる熱伝達構造体には、熱伝達構造体(特に被熱交換流体と接触する部分)の材料より熱伝導率の良い材料からなる熱伝導体を流体と接触しない位置に装着し、熱伝達用構造体を加熱または冷却することで、被熱交換流体に熱源からの熱を伝達させることにより流体を効率よく加熱、冷却することを可能としたものである。

The present invention includes a passage through which a heat exchange fluid passes and a heat transfer structure that contacts the heat exchange fluid that passes through the passage, and transfers heat through a contact surface between the heat exchange fluid and the heat transfer structure. In heat exchangers that perform mold heat exchange,
(1) The surface of the heat transfer structure that constitutes the contact surface with the heat exchange fluid is made of a material that is stable with respect to the heat exchange fluid.
(2) A heat conductor is attached to the heat transfer structure, and the heat conductor is made of a material having better thermal conductivity than the material of the heat transfer structure,
(3) The heat conductor is mounted near the contact surface with the heat exchange fluid and not in contact with the heat exchange fluid.
The heat exchanger and the heat exchange method are improved in heat conduction efficiency at the surface where the heat transfer structure and the heat exchange fluid contact with each other.
In the present invention, a heat transfer structure made of a material (material) that does not affect the heat exchange fluid has a higher thermal conductivity than the material of the heat transfer structure (particularly, the portion that contacts the heat exchange fluid). The heat conductor made of is mounted in a position where it does not come into contact with the fluid, and the heat transfer structure is heated or cooled, so that the heat is transferred from the heat source to the heat exchange fluid to efficiently heat and cool the fluid. It is possible to do that.
 
 一般に、熱交換器により加熱あるいは冷却する被熱交換流体には様々な特性を有する液体や気体が対象とされている。例えば、酸またはアルカリの水溶液が化学反応あるいはエッチング処理などに使用されるが、これらは金属に対して激しく反応するため、酸やアルカリとの接触部には金属を使用することが出来ないことが多い。こうした反応性のある被熱交換流体の熱交換に使用される熱交換器には樹脂を用いた製品があるが、樹脂は熱伝導率が低いために熱交換の効率は悪く、必要とされる電力も大きくなりその形状構造も大きく複雑となることが多い。
 本発明の熱交換器は、直接加熱方式を採用し、被熱交換流体との接触面を構成する表面は被熱交換流体に対して安定な材質からなるものであれば制限はなく、例えば接触部はすべて樹脂にもかかわらず省電力で省スペース、熱効率が80%以上の効率の良い熱交換を提供することを可能とする。

In general, liquids and gases having various characteristics are targeted for a heat exchange fluid to be heated or cooled by a heat exchanger. For example, aqueous solutions of acids or alkalis are used for chemical reactions or etching processes, but these react violently with metals, so it may not be possible to use metals in contact with acids and alkalis. Many. Heat exchangers used for heat exchange of such reactive heat exchange fluids include products that use resin, but the efficiency of heat exchange is poor because resin has low thermal conductivity and is required. In many cases, the electric power is large and the shape and structure are large and complicated.
The heat exchanger of the present invention employs a direct heating method, and there is no limitation as long as the surface constituting the contact surface with the heat exchange fluid is made of a material that is stable with respect to the heat exchange fluid. All parts can provide efficient heat exchange with power saving, space saving and thermal efficiency of 80% or more despite resin.
 
[被熱交換流体]
 本発明での被熱交換流体としては特に限定されるものではないが、例えば、塩酸、硫酸、硝酸、クロム酸、リン酸、弗酸、酢酸、過塩素酸、臭化水素酸、弗化珪酸、ホウ酸などの腐食性を有する酸類、アンモニア、水酸化カリウム、水酸化ナトリウムなどのアルカリ類、および塩素化珪素などの金属塩類などの溶液または気体、さらには高純度水を挙げることが出来る。これらの被熱交換流体は、他の物質との反応原料として、またはエッチング液などの反応工程に使用される薬液として使用されるものであり熱交換器によって適度な温度に制御されて目的に使用される。本発明の熱交換器は、これらの被熱交換流体を高効率で、微量不純物の汚染がない状態で加熱、冷却または温度制御することが出来る。

[Heat exchange fluid]
The heat exchange fluid in the present invention is not particularly limited. For example, hydrochloric acid, sulfuric acid, nitric acid, chromic acid, phosphoric acid, hydrofluoric acid, acetic acid, perchloric acid, hydrobromic acid, fluorosilicic acid Examples thereof include solutions or gases such as corrosive acids such as boric acid, alkalis such as ammonia, potassium hydroxide and sodium hydroxide, and metal salts such as chlorinated silicon, and high purity water. These heat exchange fluids are used as raw materials for reaction with other substances or as chemicals used in reaction processes such as etching liquids, and are used for purposes that are controlled to an appropriate temperature by a heat exchanger. Is done. The heat exchanger of the present invention can heat, cool, or control the temperature of these heat exchange fluids with high efficiency and without contamination by trace impurities.
 
[熱伝達構造体]
 本発明の熱伝達構造体は、被熱交換流体との接触面となる表面と熱伝導体を有する。被熱交換流体と接触する熱伝達構造体の接触面は、被熱交換流体に対して安定な材質からなる。すなわち、熱交換が行われる温度領域において、熱伝達構造体の表面と被熱交換流体が反応することがない材質あるいは表面から熱伝達構造体の成分が溶出しない材質が選択される。被熱交換流体の反応性(腐食性)は、熱伝達構造体の表面の材質および接触温度などにより異なり、また、被熱交換流体の用途、性状によっても熱交換後の純度の許容範囲が異なるため一概に特定することはできない。例えば、半導体装置の製造に使用される金属ハロゲン化物やエッチング剤では高純度の物質が使用されるため、熱交換処理による純度の低下は許されない。しかし、タービン用の熱交換器であれば熱交換処理による被熱交換流体の純度の変化は問題とされない場合が多い。

[Heat transfer structure]
The heat transfer structure of the present invention has a surface that serves as a contact surface with the heat exchange fluid and a heat conductor. The contact surface of the heat transfer structure that contacts the heat exchange fluid is made of a material that is stable with respect to the heat exchange fluid. That is, a material that does not react with the surface of the heat transfer structure and the heat exchange fluid or a material that does not elute the components of the heat transfer structure from the surface is selected in a temperature range where heat exchange is performed. The reactivity (corrosiveness) of the heat exchange fluid varies depending on the surface material and contact temperature of the heat transfer structure, and the allowable range of purity after heat exchange varies depending on the application and properties of the heat exchange fluid. Therefore, it cannot be specified in general. For example, a metal halide or an etching agent used for manufacturing a semiconductor device uses a high-purity substance, so that a decrease in purity due to heat exchange treatment is not allowed. However, in the case of a heat exchanger for turbines, changes in the purity of the heat exchange fluid due to the heat exchange process are often not a problem.
 
 被熱交換流体と接触する熱伝達構造体の表面となる部材の材質(材料)としては、鉄、炭素鋼、ステンレス鋼、アルミニウム、チタンなどの金属類、弗素樹脂、ポリエステルなどの合成樹脂類、セラミックス類などから適宜選択して使用されるが、腐食性の強い酸類を熱交換する場合には弗素樹脂が好ましい。弗素樹脂としては、例えば、ポリテトラフルオロエチレン(PTFE)、テトラフルオロエチレン-パーフルオロアルキルビニルエーテル共重合体(PFA)、テトラフルオロエチレン-ヘキサフルオロプロピレン共重合体(FEP)、ポリクロロトリフルオロエチレン(PCTFE)、エチレン-クロロトリフルオロエチレン共重合体(ECTFE)、テトラフルオロエチレン-エチレン共重合体(ETFE)、ポリビニルフルオライド(PVF)、弗化ポリプロピレン(FLPP)、ポリビニリデンフルオライド(PVDF)などを例示することが出来る。

The material (material) of the member that becomes the surface of the heat transfer structure in contact with the heat exchange fluid includes metals such as iron, carbon steel, stainless steel, aluminum and titanium, synthetic resins such as fluorine resin and polyester, Although it is appropriately selected from ceramics and the like, a fluororesin is preferred when heat exchange is performed on highly corrosive acids. Examples of the fluorine resin include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), polychlorotrifluoroethylene ( PCTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), tetrafluoroethylene-ethylene copolymer (ETFE), polyvinyl fluoride (PVF), fluorinated polypropylene (FLPP), polyvinylidene fluoride (PVDF), etc. Can be illustrated.
 
 本発明の熱交換器の熱伝達構造体は内部に熱伝導体を備え、熱伝導体は熱伝達構造体(特に被熱交換流体と接触する部分)の材料より熱伝導率の良い材料からなるとともに、被熱交換流体との接触面(被熱交換流体流路)の近傍であって被熱交換流体には接触しない位置に装着されている。
 熱伝達構造体について図3を参照しながらその一例についてその構造を説明する。図3の熱交換器101は、ボデー61を有する熱伝達構造体6、熱伝導体62、熱源となるヒータープレート51、伝熱プレート52a、52b、および被熱交換流体流路7を備え、ヒータープレート51からの熱は伝熱プレート52a、52bを介して熱伝達構造体6(ボデー61および熱伝導体62)に拡散する。拡散した熱によりボデー61および熱伝導体62は加熱されると同時に熱は接触面63を通して流路7を通過する被熱交換流体を加熱する。図3中の点線矢印は、ボデー61から熱が伝達する様子を示している。熱伝導体62はボデー61の材料より熱伝導率が良いため、ボデー61よりも早く温度が上昇して被熱交換流体への熱交換を効率よく行うことが出来る。熱伝導体62はボデー61に埋め込まれて伝熱プレート52aまたはヒータープレート51と接触している。熱伝導体62と流路7はできるだけ接近していることが効率的な熱交換をするには好ましい。流路7の内壁面は、メンテナンス性の観点からは凹凸の無い平面あるいは曲面とすることが好ましいが、熱交換能力を高めるとの観点からはジグザグ構造とすることが好ましい。

The heat transfer structure of the heat exchanger according to the present invention includes a heat conductor therein, and the heat conductor is made of a material having a heat conductivity higher than that of the material of the heat transfer structure (particularly, a portion that contacts the heat exchange fluid). At the same time, it is mounted near the contact surface (heat exchange fluid flow path) with the heat exchange fluid and at a position that does not contact the heat exchange fluid.
An example of the structure of the heat transfer structure will be described with reference to FIG. 3 includes a heat transfer structure 6 having a body 61, a heat conductor 62, a heater plate 51 serving as a heat source, heat transfer plates 52a and 52b, and a heat exchange fluid flow path 7. The heat from the plate 51 is diffused to the heat transfer structure 6 (the body 61 and the heat conductor 62) through the heat transfer plates 52a and 52b. The body 61 and the heat conductor 62 are heated by the diffused heat, and at the same time, the heat heats the heat exchange fluid passing through the flow path 7 through the contact surface 63. A dotted line arrow in FIG. 3 shows how heat is transferred from the body 61. Since the thermal conductivity of the heat conductor 62 is better than that of the material of the body 61, the temperature rises earlier than the body 61 and heat exchange to the heat exchange fluid can be performed efficiently. The heat conductor 62 is embedded in the body 61 and is in contact with the heat transfer plate 52 a or the heater plate 51. The heat conductor 62 and the flow path 7 are preferably as close as possible for efficient heat exchange. The inner wall surface of the flow path 7 is preferably a flat surface or curved surface with no unevenness from the viewpoint of maintainability, but is preferably a zigzag structure from the viewpoint of enhancing the heat exchange capability.
 
 図3に示すように、円柱状の熱伝導体62は個別に、ボデー61に備えられた孔に挿入することにより設置することが出来る。また、図4に示すように、伝熱プレート52と複数の熱伝導体62が一体に成形され、ボデー61に設けた孔に熱伝導体62を挿入することにより設置される。熱伝導体62の設置位置および設置数は熱交換の効率などを考慮して決定される。また、熱伝導体62の表面積を大きくすることにより熱伝導体62からの熱の拡散を均一にまた効率的に行うことが出来る。表面積を拡大するには図5に示すように熱伝導体62の外側面をジグザグ構造にすることが好ましい。別の言い方をすれば、熱伝導体62の外面の長手方向に環状の山が連続する構造(すなわち、山と谷が交互に連続する構造)にすることが好ましい。ここにいう環状の山が連続する構造には、ネジの山と溝のようにらせん状に山および溝が形成される場合も含まれる。より好ましくは、熱伝導体62の外側面の表面積が、山(凸部)が無い同径の円柱体の外側面の表面積の例えば1.5~3倍となるようにジグザグ構造を形成する。ジグザグ構造の熱伝導体62の設置は、ボデー61が樹脂製である時は樹脂の硬化前の柔らかい状態の時に設置した後硬化させるか、樹脂の硬化後にドリルなどで穴をあけてジグザグ構造の熱伝導体をねじ込むなどにより行うことが出来る。ボデー61を金属とする場合は穴あけ加工が主となる。

As shown in FIG. 3, the columnar heat conductors 62 can be individually installed by inserting them into holes provided in the body 61. Further, as shown in FIG. 4, the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed and installed by inserting the heat conductors 62 into the holes provided in the body 61. The installation position and the number of installation of the heat conductor 62 are determined in consideration of the efficiency of heat exchange. Further, by increasing the surface area of the heat conductor 62, the heat from the heat conductor 62 can be diffused uniformly and efficiently. In order to increase the surface area, it is preferable that the outer surface of the heat conductor 62 has a zigzag structure as shown in FIG. In other words, it is preferable to have a structure in which annular peaks are continuous in the longitudinal direction of the outer surface of the heat conductor 62 (that is, a structure in which peaks and valleys are alternately continued). The structure in which the annular ridges are continuous includes a case where ridges and grooves are formed in a spiral shape like a thread ridge and a groove. More preferably, the zigzag structure is formed so that the surface area of the outer surface of the heat conductor 62 is, for example, 1.5 to 3 times the surface area of the outer surface of the cylindrical body having the same diameter with no peaks (convex portions). When the body 61 is made of a resin, the zigzag structure heat conductor 62 is cured after being installed in a soft state before the resin is cured, or after the resin is cured, a hole is drilled with a drill or the like. This can be done by screwing in a heat conductor. When the body 61 is made of metal, drilling is mainly performed.
 
 図13は、熱伝導体62の配置バリエーションを示す概略断面図である。
 (a)は、被熱交換流体流路7を挟む2本の熱伝導体62を上方から延出した配置例である。(b)は、被熱交換流体流路7を挟む2本の熱伝導体62を上方および下方から延出した配置例である。(c)は、被熱交換流体流路7を挟む4本の熱伝導体62を上方および下方から延出した配置例である。(d)は、(a)の熱伝導体62の配置例において、熱伝導体62の外側面をジグザグ構造とした構成例である。(e)は、(b)の熱伝導体62の配置例において、熱伝導体62の外側面をジグザグ構造とした構成例である。(f)は、(c)の熱伝導体62の配置例において、熱伝導体62の外側面をジグザグ構造とした構成例である。図13(a)~(f)のいずれの構成においても、被熱交換流体流路7を挟んで複数本の熱伝導体62が対向配置されている。

FIG. 13 is a schematic cross-sectional view showing an arrangement variation of the heat conductor 62.
(A) is an example of arrangement in which two heat conductors 62 sandwiching the heat exchange fluid flow path 7 are extended from above. (B) is an arrangement example in which two heat conductors 62 sandwiching the heat exchange fluid flow path 7 are extended from above and below. (C) is an arrangement example in which four heat conductors 62 sandwiching the heat exchange fluid flow path 7 are extended from above and below. (D) is a configuration example in which the outer surface of the heat conductor 62 has a zigzag structure in the arrangement example of the heat conductor 62 in (a). (E) is a configuration example in which the outer surface of the heat conductor 62 has a zigzag structure in the arrangement example of the heat conductor 62 in (b). (F) is a configuration example in which the outer surface of the heat conductor 62 has a zigzag structure in the arrangement example of the heat conductor 62 in (c). In any of the configurations shown in FIGS. 13A to 13F, a plurality of heat conductors 62 are arranged to face each other with the heat exchange fluid flow path 7 interposed therebetween.
 
 図13(a)~(f)のいずれの構成においても、ヒータープレート51aおよび51bと、伝熱プレート52aおよび52bと、ボデー61と、被熱交換流体流路7とを備えている。これらの要素は、ヒータープレートが2枚である点を除き、図3および図5の熱交換器101と同様の構成であるので説明を割愛する。なお、図13(a)および(d)においては、下方のヒータープレート51bを設けなくともよい。

13A to 13F, heater plates 51a and 51b, heat transfer plates 52a and 52b, a body 61, and a heat exchange fluid flow path 7 are provided. Since these elements have the same configuration as the heat exchanger 101 of FIGS. 3 and 5 except that there are two heater plates, the description thereof will be omitted. In FIGS. 13A and 13D, the lower heater plate 51b may not be provided.
 
 図14は、図13において、伝熱プレート52と複数の熱伝導体62とを一体に成形した構成例である。図14(a)~(f)のいずれの構成においても、被熱交換流体流路7を挟んで複数本の熱伝導体62が対向配置されている。伝熱プレート52と複数の熱伝導体62とを一体に成形された点を除いては、図4および図13と同様の構成であるので説明を割愛する。

FIG. 14 is a configuration example in which the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed in FIG. 13. 14A to 14F, a plurality of heat conductors 62 are arranged to face each other with the heat exchange fluid flow path 7 interposed therebetween. Except for the fact that the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed, the configuration is the same as in FIGS.
 
 図15は、異なる材質の熱伝導体を配置した場合の温度分布を説明する図であり、(a)は同一種類の熱伝導体62を配置した場合の平面図と温度分布図であり、(b)は異なる材質の熱伝導体62を装着した場合の平面図と温度分布図である。
 図15(a)および図15(b)のいずれの熱交換器104においても、伝熱プレート52およびボデー61(図示せず)に熱伝導体62を挿入するための135個の取付孔が略等間隔に設けられている。各熱伝導体62は、伝熱プレート52およびボデー61の取付孔に着脱自在に装着される。例えば、各熱伝導体62を頭部がフラットなネジにより構成し、取付孔に螺合して装着してもよい。多数個の熱伝導体62を、複数の材質からなる熱伝導体62を組み合わせて構成してもよい。複数の材質からなる熱伝導体62を組み合わせることで、流路7の上流側と下流側で生じる温度分布ムラを解消することが可能である。また、高価な材質からなる熱伝導体62を必要な場所にのみ配置し、他の場所には廉価な材質からなる熱伝導体62を配置することで、製造コストを低減させることが可能である。

FIG. 15 is a diagram for explaining the temperature distribution when heat conductors of different materials are arranged, (a) is a plan view and a temperature distribution diagram when the same type of heat conductor 62 is arranged, FIG. 5B is a plan view and a temperature distribution diagram when the heat conductor 62 made of a different material is mounted.
In both the heat exchangers 104 of FIG. 15A and FIG. 15B, 135 mounting holes for inserting the heat conductor 62 into the heat transfer plate 52 and the body 61 (not shown) are substantially omitted. It is provided at equal intervals. Each heat conductor 62 is detachably mounted in the heat transfer plate 52 and the mounting hole of the body 61. For example, each heat conductor 62 may be configured by a screw having a flat head and screwed into the mounting hole. A large number of heat conductors 62 may be configured by combining heat conductors 62 made of a plurality of materials. By combining the heat conductors 62 made of a plurality of materials, it is possible to eliminate temperature distribution unevenness that occurs on the upstream side and the downstream side of the flow path 7. Further, it is possible to reduce the manufacturing cost by disposing the heat conductor 62 made of an expensive material only in a necessary place and arranging the heat conductor 62 made of an inexpensive material in another place. .
 
 図15(a)では、全ての熱伝導体62をアルミ製ピンにより構成し、図15(b)では、左から5列目までの熱伝導体62をアルミ製のピンにより構成し、左から6列目以降の熱伝導体62を銅製ピンにより構成している。すなわち、図15(a)では熱伝導体62として135本のアルミ製ピンを装着しているのに対し、図15(b)では熱伝導体62の上流側に45本の銅製ピンを装着し、下流側にアルミ製ピンを装着している。
 図15(a)および図15(b)の右図は、温度分布イメージを示す図である。図15(a)では左側半分が相対的に低温であり、右側半分が相対的に高温であるのに対し、図15(b)では温度分布ムラが一応は解消されている。このように、熱伝導率の高い材料からなる熱伝導体62を上流側に配置し、熱伝導率が相対的に低い材料からなる熱伝導体62を下流側に配置することで、上流側と下流側の温度分布ムラを低減することが可能である。そして、温度分布ムラを低減させることにより、ボデー、伝熱プレート等の歪みを抑えることができ、また、ヒーター寿命の短命化を防ぐことができる。さらには、流入口通過時の温度と流出口通過時の温度差(ΔT)が大きくなると熱変性が生じる流体では、ΔTが大きくならないように出力を下げて加熱を行うことが従来は必要であったが、温度分布ムラを低減した本発明の熱交換器によれば、高効率な熱交換を行うことが可能となる。

In FIG. 15 (a), all the heat conductors 62 are constituted by aluminum pins, and in FIG. 15 (b), the heat conductors 62 from the left to the fifth row are constituted by aluminum pins, and from the left. The heat conductors 62 in the sixth and subsequent rows are constituted by copper pins. That is, in FIG. 15A, 135 aluminum pins are attached as the heat conductor 62, whereas in FIG. 15B, 45 copper pins are attached upstream of the heat conductor 62. An aluminum pin is installed on the downstream side.
The right diagrams of FIG. 15A and FIG. 15B are diagrams showing a temperature distribution image. In FIG. 15A, the left half is relatively low temperature and the right half is relatively high temperature, whereas in FIG. 15B, the temperature distribution unevenness is temporarily eliminated. In this way, the heat conductor 62 made of a material having a high thermal conductivity is arranged on the upstream side, and the heat conductor 62 made of a material having a relatively low heat conductivity is arranged on the downstream side, so that the upstream side It is possible to reduce the temperature distribution unevenness on the downstream side. By reducing the temperature distribution unevenness, distortion of the body, the heat transfer plate, and the like can be suppressed, and the life of the heater can be prevented from being shortened. Furthermore, in the past, it was necessary to heat the fluid that undergoes heat denaturation when the temperature difference (ΔT) between the passage at the inlet and the passage at the outlet increases, so that the output is reduced so that ΔT does not increase. However, according to the heat exchanger of the present invention in which temperature distribution unevenness is reduced, highly efficient heat exchange can be performed.
 
 図16は、上流側と下流側とで異なる密度で熱伝導体62を配置した熱交換器104の平面図である。この熱交換器104は、全ての熱伝導体62をアルミ製ピンにより構成しており、伝熱プレート52、ボディー61等の構成は、図15の熱交換器104と同様である。図16では、左から5列目までは上下方向に9個の熱伝導体62を配置し、左から6~15列目は上下方向に4個または5個の熱伝導体62を配置している。このように、上流側は高密度に熱伝導体62を配置し、下流側は低密度に熱伝導体62を配置することによっても、上流側と下流側の温度分布ムラを低減することが可能である。なお、図16の熱交換器104において、熱伝導率の異なる材料からなる熱伝導体62を上流側と下流側に配置して、上流側と下流側の温度分布ムラをより細かく調節するようにしてもよい。

FIG. 16 is a plan view of the heat exchanger 104 in which the heat conductors 62 are arranged at different densities on the upstream side and the downstream side. In this heat exchanger 104, all the heat conductors 62 are made of aluminum pins, and the configurations of the heat transfer plate 52, the body 61, and the like are the same as those of the heat exchanger 104 in FIG. In FIG. 16, nine thermal conductors 62 are arranged in the vertical direction from the left to the fifth column, and four or five thermal conductors 62 are arranged in the vertical direction in the sixth to fifteenth columns from the left. Yes. As described above, it is possible to reduce the temperature distribution unevenness between the upstream side and the downstream side by arranging the heat conductors 62 at a high density on the upstream side and arranging the heat conductors 62 at a low density on the downstream side. It is. In the heat exchanger 104 of FIG. 16, the heat conductors 62 made of materials having different thermal conductivities are arranged on the upstream side and the downstream side so that the temperature distribution unevenness on the upstream side and the downstream side can be adjusted more finely. May be.
 
 図17は、シャワーヘッド付き熱交換器105の断面構造を示す図であり、(a)は平面(水平方向)、(b)は縦面(垂直方向)での断面を示す。シャワーヘッド付き熱交換器105は、ヒータープレート51と、伝熱プレート52と、多数の熱伝導体62と、被熱交換流体流路7を有するボデー61とを備えてなり、ボデー61に流路7と連通する多数の吐出口75が形成されている。シャワーヘッド付き熱交換器105は、2つの流入口83a、83bを有しており、流入口から流路7に被熱交換流体73は、加熱されて吐出口75から吐出される。すなわち、シャワーヘッド付き熱交換器105では、外界と連通する吐出口75が流出口となる。
 多数の熱伝導体62は、図15(b)と同様に、流入口83a、83bに近い上流側に配置された銅製のピン状部材と下流側に配置されたアルミ製のピン状部材からなり、流路7の全長にわたる温度分布ムラが最小限となるように構成されている。別の言い方をすれば、左右両辺に近い側は主として銅製のピン状部材が配置され、中央部分には主としてアルミ製のピン状部材が配置されている。また、流路7には、多数の屈曲部71が設けられており、この屈曲部71において被熱交換流体が流路壁に衝突して乱流が発生することで、加熱の不均一が解消されるようになっている。従って、多数の吐出口75のそれぞれから、実質的に同じ温度の流体が吐出される。なお、シャワーヘッド付き熱交換器105は、主としてガスを吐出するガスシャワーに用いられるが、液体を吐出する場合もある。
 シャワーヘッド付き熱交換器105は、その上段に一又は複数のシャワーヘッド無し熱交換器を配置し、熱交換器105の2つの流入口と上段の熱交換器の流出口を分岐配管で接続することにより多段構成としてもよい(後述の図18参照)。

FIGS. 17A and 17B are views showing a cross-sectional structure of the heat exchanger 105 with a shower head, in which FIG. 17A shows a cross section in a plane (horizontal direction) and FIG. 17B shows a vertical plane (vertical direction). The heat exchanger 105 with a shower head includes a heater plate 51, a heat transfer plate 52, a large number of heat conductors 62, and a body 61 having a heat exchange fluid flow path 7. A large number of discharge ports 75 communicating with 7 are formed. The heat exchanger 105 with a shower head has two inflow ports 83 a and 83 b, and the heat exchange fluid 73 is heated from the inflow port to the flow path 7 and discharged from the discharge port 75. That is, in the heat exchanger 105 with a shower head, the discharge port 75 communicating with the outside becomes an outflow port.
A large number of heat conductors 62 are composed of a copper pin-like member arranged on the upstream side near the inflow ports 83a and 83b and an aluminum pin-like member arranged on the downstream side, as in FIG. 15B. The temperature distribution unevenness over the entire length of the flow path 7 is minimized. In other words, a copper pin-like member is mainly arranged on the side close to the left and right sides, and an aluminum pin-like member is mainly arranged in the central portion. In addition, the flow path 7 is provided with a large number of bent portions 71, and the heat exchange fluid collides with the flow path walls at the bent portions 71 to generate turbulent flow, thereby eliminating uneven heating. It has come to be. Therefore, fluids having substantially the same temperature are discharged from each of the multiple discharge ports 75. In addition, although the heat exchanger 105 with a shower head is mainly used for the gas shower which discharges gas, it may discharge a liquid.
In the heat exchanger 105 with a shower head, one or more heat exchangers without a shower head are arranged on the upper stage, and the two inlets of the heat exchanger 105 and the outlet of the upper heat exchanger are connected by a branch pipe. Accordingly, a multi-stage configuration may be used (see FIG. 18 described later).
 
 図6は、本発明を具現化した円筒状熱交換器102の要部断面図である。円筒型の熱源5の内面には、熱伝導体62とボデー61からなる熱伝達構造体6が設置され、熱伝導体62はジグザグ形状をした面を流路側に、平坦な面を熱源5に接し、ボデー61は熱伝導体62の表面を覆うと共に流路7を形成して被熱交換流体と接する。ここで、ボデー61は熱伝導体62の表面に形成された薄膜とすることが好ましく、また、被熱交換流体と接する面は熱伝導体62と同様のジグザグ形状となすことが好ましい。接触表面積を増したジグザグ形状にすることにより表面での熱交換効率が向上する。

FIG. 6 is a cross-sectional view of the main part of the cylindrical heat exchanger 102 embodying the present invention. A heat transfer structure 6 including a heat conductor 62 and a body 61 is installed on the inner surface of the cylindrical heat source 5. The heat conductor 62 has a zigzag-shaped surface as a flow path side and a flat surface as a heat source 5. The body 61 covers the surface of the heat conductor 62 and forms a flow path 7 to contact the heat exchange fluid. Here, the body 61 is preferably a thin film formed on the surface of the heat conductor 62, and the surface in contact with the heat exchange fluid preferably has a zigzag shape similar to that of the heat conductor 62. By making the zigzag shape with an increased contact surface area, the heat exchange efficiency on the surface is improved.
 
 図12は、被熱交換流体の流路のジグザグ構造を説明する模式断面図であり、(a)は表面積を2倍とする場合を説明する図であり、(b)はピッチ深さの調節を説明する図である。
 図12(a)は、被熱交換流体73と接触する熱伝達構造体6の内側面を、その断面が1辺2mmの正三角形が連続するようなジグザグ構造とした例である。すなわち、熱伝達構造体6の内側面は、その長手方向に環状の山が連続する構造となっている。このジグザグ構造によれば、熱伝達構造体6の内側面の表面積が、ジグザグ構造の無いフラットな内側面の2倍となるので、熱交換効率を倍増させることが可能である。熱伝達構造体6のジグザグ構造は図12に示すものに限定されず、熱伝達構造体6の内側面の表面積が例えば1.5~3倍となるようにジグザグ構造を形成することが開示される。

FIG. 12 is a schematic cross-sectional view illustrating the zigzag structure of the flow path of the heat exchange fluid, (a) is a diagram illustrating the case where the surface area is doubled, and (b) is the adjustment of the pitch depth. FIG.
FIG. 12A shows an example in which the inner surface of the heat transfer structure 6 in contact with the heat exchange fluid 73 has a zigzag structure in which equilateral triangles having a cross section of 2 mm on one side are continuous. That is, the inner side surface of the heat transfer structure 6 has a structure in which an annular peak continues in the longitudinal direction. According to the zigzag structure, the surface area of the inner surface of the heat transfer structure 6 is twice that of the flat inner surface without the zigzag structure, so that the heat exchange efficiency can be doubled. The zigzag structure of the heat transfer structure 6 is not limited to that shown in FIG. 12, but it is disclosed that the zigzag structure is formed so that the surface area of the inner surface of the heat transfer structure 6 is 1.5 to 3 times, for example. The
 
 熱伝達構造体6の内側面の表面積を増やすほど熱交換効率が向上するが、被熱交換流体73の流量、粘性などの性質によっては、やみくもに表面積を増やすことが好ましく無い場合もある。図12(b)の左図は、熱伝達構造体6の内側面と流体73との間に空隙74ができた状態を示している。この状態では、熱伝達構造体6の内側面と流体73とに非接触部分ができるので、熱交換効率は低下する。従って、このような空隙74による非接触部分の発生が見込まれる場合には、ジグザグ構造のピッチ(溝)を大きくすることで、非接触部分が生じないように調節することが必要となる。円筒状熱交換器102を着脱自在に構成し、ピッチの異なる複数の円筒状熱交換器102を準備するようにしてもよい。

As the surface area of the inner surface of the heat transfer structure 6 is increased, the heat exchange efficiency is improved. However, depending on properties such as the flow rate and viscosity of the heat exchange fluid 73, it may not be desirable to increase the surface area. The left view of FIG. 12B shows a state in which a gap 74 is formed between the inner surface of the heat transfer structure 6 and the fluid 73. In this state, a non-contact portion is formed between the inner surface of the heat transfer structure 6 and the fluid 73, so that the heat exchange efficiency is lowered. Therefore, in the case where such a non-contact portion due to the gap 74 is expected, it is necessary to adjust the pitch (groove) of the zigzag structure so that the non-contact portion does not occur. The cylindrical heat exchanger 102 may be configured to be detachable, and a plurality of cylindrical heat exchangers 102 having different pitches may be prepared.
 
[熱伝導体の材質と被熱交換流体との距離]
 熱伝導体62はボデー61よりも熱伝導率の良い材質物質が用いられるが、熱伝導率が良いとは、両者の材質の値の相対的な対比であり、絶対的な値が特定されるものではない。例えば、熱伝導率は、プラスチックで約0.2W/m・Kであり、弗素樹脂約0.25、炭素鋼約47、ステンレス鋼約15、アルミニウム237、純銅386、パイレックスガラス(PYREX:登録商標)約1、の値を通常示す。これらの中から材質を相対的な熱伝導率を考慮して選択すればよく、弗素樹脂はこれらの中では低い値であるから、弗素樹脂をボデー61とする場合はいずれの材質のものを熱伝導体としても熱効率は向上することとなる。また、熱伝達構造体6(ボデー61)の材料が金属である場合、例えばステンレス鋼をボデーとする場合は、熱伝導体が、熱伝達構造体6(ボデー61)の材料より熱伝導率の良い金属、例えば炭素鋼、アルミニウム、純銅を熱伝導体として選択することが可能である。ただし、熱伝導体の材質(材料)は熱伝導率が高いほど好ましい。

[Distance between heat conductor material and heat exchange fluid]
The heat conductor 62 is made of a material having a better thermal conductivity than that of the body 61. The better heat conductivity is a relative comparison of the values of both materials, and an absolute value is specified. It is not a thing. For example, the thermal conductivity of plastic is about 0.2 W / m · K, fluorine resin is about 0.25, carbon steel is about 47, stainless steel is about 15, aluminum 237, pure copper 386, Pyrex glass (PYREX: registered trademark) ) A value of about 1 is usually indicated. Of these, the material may be selected in consideration of the relative thermal conductivity, and since the fluororesin has a low value among these, when the fluororesin is used as the body 61, the material of any material is heated. As a conductor, the thermal efficiency is improved. When the material of the heat transfer structure 6 (body 61) is a metal, for example, when stainless steel is used as the body, the heat conductor has a higher thermal conductivity than the material of the heat transfer structure 6 (body 61). Good metals such as carbon steel, aluminum and pure copper can be selected as the heat conductor. However, the higher the thermal conductivity, the more preferable the material (material) of the heat conductor.
 
 例えば、被熱交換流体と熱伝達構造体6の接触面63を弗素樹脂のコーティングとなしボデー61をステンレス鋼とする熱交換器が知られているが、8mm厚のステンレス鋼と弗素樹脂による耐食被覆を施した板の総括伝熱係数を測定した例では、ステンレスのみでは1070W/m・Kであるのに対し、500μmの耐食被覆を設けると同係数は291となり伝熱量が1/3となる結果が得られている。また、50μmの耐食被覆を設ける場合は845の伝熱係数となることが報告されている。
 したがって、熱伝導体と被熱交換流体との距離はできるだけ近いほうが好ましい。

For example, a heat exchanger is known in which the contact surface 63 of the heat exchange fluid and the heat transfer structure 6 is coated with fluorine resin, and the body 61 is made of stainless steel. However, the corrosion resistance of 8 mm thick stainless steel and fluorine resin is known. In the example in which the overall heat transfer coefficient of the coated plate is measured, it is 1070 W / m 2 · K only for stainless steel, but when the 500 μm corrosion resistant coating is provided, the coefficient is 291 and the heat transfer amount is 1/3. The result is obtained. It has also been reported that when a 50 μm corrosion resistant coating is provided, the heat transfer coefficient is 845.
Therefore, the distance between the heat conductor and the heat exchange fluid is preferably as short as possible.
 
[熱交換器の具体例1]
 本発明の具体例1に係る熱交換器の構造を具体的に示す。図7に示す熱交換器103は、150mm×195mm×高さ34mmの直方体からなり、被熱交換流体が入口コネクター(流入口)81から入り出口コネクター(流出口)82から流出するまでに多くの屈曲点(屈曲部)71、72を有する被熱交換流体の流路7を通過することにより熱交換される。流路7は弗素樹脂からなるブロックからなるボデー61に溝状の空間を形成することにより設けられている。流路7の両側には600μmの間隔を置いて熱伝導体62が172本設置されている。熱伝導体62は直径3mm、長さ18mm銅製の十字孔付き皿小ネジ(頭部がフラットなネジ)からなり熱伝達構造体のボデー61に設けられた孔に伝熱プレート52aを通してネジ止めされている。このネジは上面が平らとなっているため、伝熱プレート52aの上面を面一にできる。溝が形成されるネジの胴部は、先細りしない同径の円柱状であることが好ましい。熱伝導体62に規格ネジを用いることで、熱交換器の製造コストを著しく低減させることが可能である。例えば、JIS規格のネジであるM3×20m ピッチ0.5mm(銅)、M4×12mm ピッチ0.7mm(アルミ)を使用することが開示される。

[Specific example 1 of heat exchanger]
The structure of the heat exchanger which concerns on the specific example 1 of this invention is shown concretely. The heat exchanger 103 shown in FIG. 7 is a rectangular parallelepiped having a size of 150 mm × 195 mm × height 34 mm, and many heat exchange fluids pass from the inlet connector (inlet) 81 to the outlet connector (outlet) 82 before flowing out. Heat exchange is performed by passing through the heat exchange fluid flow path 7 having bending points (bending portions) 71 and 72. The flow path 7 is provided by forming a groove-like space in a body 61 made of a block made of fluorine resin. On the both sides of the flow path 7, 172 heat conductors 62 are installed with an interval of 600 μm. The heat conductor 62 is composed of a cross-recessed countersunk screw (screw having a flat head) made of copper having a diameter of 3 mm and a length of 18 mm, and is screwed through a heat transfer plate 52a into a hole provided in the body 61 of the heat transfer structure. ing. Since the upper surface of this screw is flat, the upper surface of the heat transfer plate 52a can be made flush. The body portion of the screw in which the groove is formed is preferably a cylinder with the same diameter that does not taper. By using a standard screw for the heat conductor 62, it is possible to significantly reduce the manufacturing cost of the heat exchanger. For example, it is disclosed to use M3 × 20 m pitch 0.5 mm (copper) and M4 × 12 mm pitch 0.7 mm (aluminum), which are JIS standard screws.
 
 図示しない熱源は、伝熱プレート52aの少なくとも熱伝導体62が設けられている領域と接触するように設けられている。熱源は、伝熱プレート52aおよび52bの両面と接触するように設けることが好ましい。この熱源としては、例えば、ヒーター容量1600Wのニクロム線を熱源とするステンレス製プレート、ヒーター容量4000Wのニッケル合金を熱源とするマイカ製プレートが例示される。熱源の露出する面は断熱材で覆うことが好ましく、より好ましくは熱交換器103の最も外側の面の全面を断熱材で覆うようにする。
 伝熱プレート52bは、伝熱プレート52aと物理的に連結されており、熱源からの熱は伝熱プレート52a、52bを介して熱伝導体62およびボデー61に伝達される。図7の構成例では、伝熱プレート52aを上面、伝熱プレート52bを底面とし、これらを連結する枠体からなる中空の直方体構造としている。伝熱プレート52a、52b(および枠体)は、熱伝導体62と同じ材料で構成してもよいし、熱伝導体62よりも熱伝導率の良い材料で構成してもよい。

A heat source (not shown) is provided in contact with at least a region where the heat conductor 62 is provided on the heat transfer plate 52a. The heat source is preferably provided so as to be in contact with both surfaces of the heat transfer plates 52a and 52b. Examples of the heat source include a stainless steel plate using a nichrome wire having a heater capacity of 1600 W as a heat source and a mica plate using a nickel alloy having a heater capacity of 4000 W as a heat source. The exposed surface of the heat source is preferably covered with a heat insulating material, and more preferably, the entire outermost surface of the heat exchanger 103 is covered with the heat insulating material.
The heat transfer plate 52b is physically connected to the heat transfer plate 52a, and heat from the heat source is transmitted to the heat conductor 62 and the body 61 via the heat transfer plates 52a and 52b. In the configuration example of FIG. 7, the heat transfer plate 52 a is an upper surface, the heat transfer plate 52 b is a bottom surface, and a hollow rectangular parallelepiped structure including a frame body connecting them is used. The heat transfer plates 52 a and 52 b (and the frame) may be made of the same material as that of the heat conductor 62, or may be made of a material having better heat conductivity than the heat conductor 62.
 
 熱伝導体62と流路7(被熱交換流体)との間隔は600μmと接近しているため熱伝導は良好である。被熱交換流体が通過する流路7は幅6mm、深さ20mm、長さ1795mmあり、途中で何回もの屈曲点(屈曲部)を有している。この屈曲部を増やすためには、流路の進行方向を180度転回する屈曲部を設けるのみならず、流路の進行方向を折り返し転回する屈曲部をも設けることが好ましい。すなわち、図7の構成例では、流路の進行方向を流入口側(IN方向)に90度転回する折り返し屈曲部72を設け、AおよびBの2つの流路系統を構成することで、屈曲部を増やすようにしている。この流路系統は、図7の2つに限定されず、3つ以上としてもよい。この屈曲点(屈曲部)において、流路を流れる被熱交換流体は流路壁に衝突して乱流を形成することとなるため、流路壁(接触面)での熱交換が効率的となる。また、平行して配置された2本の流路7の間には、複数本の熱伝導体を設けることが好ましい。ここで、2本の平行する流路とは、例えば、図7で符号7,7が付された2本の流路のような配置関係にあるもののことを指す。別の観点からは、略等間隔に配置された熱伝導体62の隙間を縫うように流路7が蛇行するように設けることが好ましい。

Since the distance between the heat conductor 62 and the flow path 7 (heat exchange fluid) is as close as 600 μm, heat conduction is good. The flow path 7 through which the heat exchange fluid passes has a width of 6 mm, a depth of 20 mm, and a length of 1795 mm, and has a number of bending points (bent portions) in the middle. In order to increase the number of bent portions, it is preferable to provide not only a bent portion that turns the traveling direction of the flow path by 180 degrees, but also a bent portion that turns and turns the moving direction of the flow path. That is, in the configuration example of FIG. 7, a bent and bent portion 72 that turns the flow path traveling direction 90 degrees toward the inlet side (IN direction) is provided, and the two flow paths A and B are configured to bend. I try to increase the number of departments. This flow path system is not limited to two in FIG. 7, and may be three or more. At this bending point (bent portion), the heat exchange fluid flowing through the flow path collides with the flow path wall to form a turbulent flow, so heat exchange at the flow path wall (contact surface) is efficient. Become. In addition, it is preferable to provide a plurality of heat conductors between two flow paths 7 arranged in parallel. Here, the two parallel flow paths indicate, for example, those having an arrangement relationship like the two flow paths denoted by reference numerals 7 and 7 in FIG. From another viewpoint, it is preferable that the flow path 7 meanders so as to sew a gap between the heat conductors 62 arranged at substantially equal intervals.
 
 図7に示した本発明の熱交換器103をコネクター81,82で複数結合することにより熱交換効率を向上させることが出来る。また、熱伝導体62の設置位置、設置層数については熱交換の効率を実際に検討しながら設けることが可能であり、被熱交換流体の温度が規定よりも低すぎる箇所には、該当するボデー61に熱伝導体62の設置用孔を新たに設けて熱伝導体62を設置できるように加工することが出来る。

Heat exchange efficiency can be improved by connecting a plurality of the heat exchangers 103 of the present invention shown in FIG. In addition, the installation position and the number of installation layers of the heat conductor 62 can be provided while actually considering the efficiency of heat exchange, and it corresponds to a place where the temperature of the heat exchange fluid is too lower than the standard. It is possible to process the body 61 so that the heat conductor 62 can be installed by newly providing a hole for installing the heat conductor 62.
 
 図18は、図7に示す熱交換器103を積層して多段構成の熱交換器とした場合の側面図である。上段となる熱交換器103の入口コネクター81と下段となる出口コネクター82とを配管83a~83cにより接続することにより、多段構成とすることが可能である。図18の例では4段構成としているがこの構成に限定されず、2段以上であれば任意の段数とすることが可能である。このように熱交換器を多段構成とした場合、最下層以外の熱交換器では、流路7が上方にある熱源のみならず下方にある熱源からも加熱されることとなる。すなわち、図18の例では、伝熱プレート52bが、その下方にある熱源(ヒータープレート)からも加熱されることとなる。多段構成とする場合、積層面となる面は断熱材で覆わず、下の段にある熱源と上の段にある伝熱プレートが直接接するようにする。
 このように、本発明の熱交換器では、多段構成とすることで、流路の長さを容易に延長することが可能である。また、本発明の熱交換器では、被熱交換流体の流量にあわせて内部構造は変更することなく、流路の口径寸法および全長を変更することで大流量から小流量までの対応を可能としている。
 例えば、窒素ガス換算で10L/分以下の流量を熱変換する場合はボデー寸法を1/2のサイズにしても80%以上の熱交換性能が得られる。50L/分以上の流量を熱交換する場合はボデー寸法を大きくする事で対応が可能である。

FIG. 18 is a side view when the heat exchanger 103 shown in FIG. 7 is stacked to form a multi-stage heat exchanger. By connecting the inlet connector 81 of the upper heat exchanger 103 and the outlet connector 82 of the lower stage through pipes 83a to 83c, a multistage configuration can be achieved. In the example of FIG. 18, a four-stage configuration is used, but the present invention is not limited to this configuration, and any number of stages can be used as long as the number of stages is two or more. When the heat exchanger has a multi-stage configuration as described above, in the heat exchanger other than the lowermost layer, the flow path 7 is heated not only from the heat source located above but also from the heat source located below. That is, in the example of FIG. 18, the heat transfer plate 52 b is also heated from the heat source (heater plate) below it. In the case of a multi-stage configuration, the surface to be a laminated surface is not covered with a heat insulating material, and the heat source in the lower stage and the heat transfer plate in the upper stage are in direct contact with each other.
Thus, in the heat exchanger of this invention, it is possible to extend the length of a flow path easily by setting it as a multistage structure. In the heat exchanger of the present invention, the internal structure is not changed in accordance with the flow rate of the heat exchange fluid, and the flow size of the flow path and the overall length can be changed to enable the response from a large flow rate to a small flow rate. Yes.
For example, when heat-converting a flow rate of 10 L / min or less in terms of nitrogen gas, a heat exchange performance of 80% or more can be obtained even if the body size is ½. When heat exchange is performed at a flow rate of 50 L / min or more, it can be handled by increasing the body size.
 
[熱交換器の具体例2]
 図19は、本発明の具体例2に係る温調供給装置110の構成図である。この温調供給装置110は、冷却用熱交換器106と、冷却装置111と、配管112a、112bおよび113a、113bとを備えて構成される。
 冷却用熱交換器106は、熱伝達構造体6と、クーラープレート54a、54bとを備えて構成される。熱伝達構造体6は、熱交換器101~104と同じものを用いることができる。クーラープレート54a、54bは、いずれもその内部に冷媒が循環する流路が張り巡られている。冷媒は、例えば、不凍液、ガス冷媒を用いる。冷却装置111により冷却された冷媒は配管112aを通って冷却用熱交換器106に供給され、冷却用熱交換器106を通過する際に熱を吸収し、配管112bを通って冷却装置111に戻り、再び配管112aを通って冷却用熱交換器106に供給される。冷却用熱交換器106には配管113aから被熱交換流体73(例えば、純水)が供給され、冷却用熱交換器106を通過する際に冷却され、配管113bから排出される。

[Specific example 2 of heat exchanger]
FIG. 19 is a configuration diagram of the temperature adjustment supply device 110 according to the second specific example of the present invention. The temperature control supply device 110 includes a cooling heat exchanger 106, a cooling device 111, and pipes 112a and 112b and 113a and 113b.
The cooling heat exchanger 106 includes the heat transfer structure 6 and cooler plates 54a and 54b. The same heat transfer structure 6 as the heat exchangers 101 to 104 can be used. Each of the cooler plates 54a and 54b is provided with a flow path through which the refrigerant circulates. For example, an antifreeze or a gas refrigerant is used as the refrigerant. The refrigerant cooled by the cooling device 111 is supplied to the cooling heat exchanger 106 through the piping 112a, absorbs heat when passing through the cooling heat exchanger 106, and returns to the cooling device 111 through the piping 112b. The cooling heat exchanger 106 is supplied again through the pipe 112a. The heat exchange fluid 73 (for example, pure water) is supplied to the cooling heat exchanger 106 from the pipe 113a, is cooled when passing through the cooling heat exchanger 106, and is discharged from the pipe 113b.
 
 以下に、本発明の具体例を実施例として記載するが、これらの実施例は具体例を示すものであるからこれらにより本発明が限定されるものではない。

Specific examples of the present invention will be described below as examples, but these examples show specific examples, and the present invention is not limited thereby.
 
 上記の熱交換器の具体例で記載した図7の熱交換器103と同じ構成の熱交換器12を用いて、本発明により熱交換効率が向上することを実証した。
 試験は、図8に示す装置の配置により行った。流量制御器10によりその流量が制御された空気9をバブリング装置11において水を含ませ、次いで熱交換器12を通過させた。熱交換器12には電熱パネル温度制御装置13、PFA(テトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体)内部温度計測器14、出口ガス温度計測器15が配置されて熱交換を監視した。さらに、ボデー61表面の温度分布をサーモグラフィーにより計測した。サーモグラフィーによる計測結果を図9に示す。図面で色の濃い部分が温度の高い部分であり、温度の高い部分は熱伝導体62の設置個所と一致することが確認された。また、熱交換器全体の温度分布には偏りはなく均一な加熱が行えることがわかった。

Using the heat exchanger 12 having the same configuration as the heat exchanger 103 of FIG. 7 described in the specific example of the heat exchanger described above, it was demonstrated that the heat exchange efficiency is improved by the present invention.
The test was performed by the arrangement of the apparatus shown in FIG. The air 9 whose flow rate was controlled by the flow rate controller 10 contained water in the bubbling device 11 and then passed through the heat exchanger 12. In the heat exchanger 12, an electric heating panel temperature control device 13, a PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer) internal temperature measuring device 14, and an outlet gas temperature measuring device 15 are arranged to monitor heat exchange. Furthermore, the temperature distribution on the surface of the body 61 was measured by thermography. The measurement result by thermography is shown in FIG. In the drawing, it was confirmed that the dark colored portion is the high temperature portion, and the high temperature portion coincides with the installation location of the heat conductor 62. It was also found that the temperature distribution of the entire heat exchanger is uniform and can be heated uniformly.
 
 本実施例では、実施例1と同じ装置を使用して、設定温度40~160℃、流量10~50L/分の広い範囲で試験して出口温度を測定した。その結果を図10に示す。設定温度、流量が広い範囲で熱変換率が80%以上であることが判明した。本発明の熱交換器は同じ装置で広範囲の流量に柔軟に対応することが可能であることが判明した。

In this example, using the same apparatus as in Example 1, the outlet temperature was measured by testing in a wide range of set temperatures of 40 to 160 ° C. and a flow rate of 10 to 50 L / min. The result is shown in FIG. It was found that the heat conversion rate was 80% or more over a wide range of set temperatures and flow rates. It has been found that the heat exchanger of the present invention can flexibly accommodate a wide range of flow rates with the same apparatus.
 
 本実施例では、実施例1で使用した電熱パネルを使用して、被熱交換流体との熱伝達が樹脂を介する本発明熱交換器とステンレス鋼を介する従来の熱交換器との性能を対比した。本発明では、実施例1と同様に、加湿空気を熱交換した。他方、従来の熱交換器では乾燥窒素を熱交換した。その結果を図11に示す。メタル30Lはステンレス鋼を使用した熱交換器の測定結果、樹脂30Lは本発明の熱交換器の測定結果である。図11から、本発明の熱交換器では接触部分が樹脂製であるにもかかわらず、従来のステンレス鋼製の製品と同等の性能を示すことが認められた。
 また、本発明の熱交換器ではH0のミストに対して試験されたものであり、従来品では乾燥窒素を対象としたものである。水のミストを含む空気は水の潜熱にあたる熱を必要とするから本発明が図面11で示された以上に高性能であることが窺える。

In this example, the performance of the heat exchanger of the present invention in which the heat transfer with the heat exchange fluid is via resin and the conventional heat exchanger via stainless steel is compared using the electric heating panel used in Example 1. did. In the present invention, the humidified air was heat-exchanged as in Example 1. On the other hand, in the conventional heat exchanger, dry nitrogen was heat-exchanged. The result is shown in FIG. The metal 30L is the measurement result of the heat exchanger using stainless steel, and the resin 30L is the measurement result of the heat exchanger of the present invention. From FIG. 11, it was recognized that the heat exchanger of the present invention showed the same performance as that of a conventional stainless steel product even though the contact portion was made of resin.
The heat exchanger of the present invention was tested against H 2 O mist, and the conventional product is intended for dry nitrogen. Since the air containing water mist requires heat corresponding to the latent heat of water, it can be seen that the present invention has higher performance than that shown in FIG.
 
 本発明の熱交換器は、熱交換性に優れると共に被熱交換流体による熱交換器の腐食および腐食に伴う被熱交換流体の汚染を防止することを可能とするものであり、腐食性の薬剤および高純度物質の純度を低下させることなく熱交換により加熱、冷却および温度制御を効率よく実行することが出来る。例えば、高純度の物質を取り扱う半導体製造のプロセスに使用する薬品類の加熱、冷却に有用である。本発明の熱交換器および熱交換方法は、化学、医薬品、食品、繊維、電力、原子力産業等、製品の純度を耐食性が要求される加熱・蒸発装置、冷却・凝縮装置などの高効率の熱交換器として幅広い利用が可能となる。

The heat exchanger of the present invention is excellent in heat exchanging property and can prevent corrosion of the heat exchanger due to the heat exchange fluid and contamination of the heat exchange fluid accompanying the corrosion. In addition, heating, cooling, and temperature control can be efficiently performed by heat exchange without reducing the purity of the high-purity substance. For example, it is useful for heating and cooling chemicals used in semiconductor manufacturing processes that handle high-purity substances. The heat exchanger and heat exchange method of the present invention are highly efficient heat such as a heating / evaporation device and a cooling / condensing device that require corrosion resistance for the purity of the product, such as chemical, pharmaceutical, food, fiber, electric power, and nuclear power industries. A wide range of use is possible as an exchanger.
 
 1:樹脂製の管
 2:加熱対象物入口
 3:加熱対象物出口
 4:熱媒体
 5:熱源
51:ヒータープレート
52:伝熱プレート(伝熱部材)
53:断熱材
54:クーラープレート
 6:熱伝達構造体
61:ボデー
62:熱伝導体
63:接触面
 7:被熱交換流体流路
71:被熱交換流体流路の屈曲部
72:被熱交換流体流路の折り返し屈曲部
73:被熱交換流体
74:空隙
75:吐出口
 8:コネクター
81:入口コネクター(流入口)
82:出口コネクター(流出口)
83:配管
 9:空気
 10:流量制御機器
 11:空気の水中へのバブリング装置
 12:熱交換器
 13:電熱パネル温度制御・計測装置
 14:内部温度計測装置
 15:出口ガス温度計測装置
101~104:熱交換器
105:シャワーヘッド付き熱交換器
106:冷却用熱交換器
110:温調供給装置
111:冷却装置
112~113:配管

1: Resin pipe 2: Heated object inlet 3: Heated object outlet 4: Heat medium 5: Heat source 51: Heater plate 52: Heat transfer plate (heat transfer member)
53: Thermal insulation material 54: Cooler plate 6: Heat transfer structure 61: Body 62: Thermal conductor 63: Contact surface 7: Heat exchange fluid channel 71: Bent portion 72 of the heat exchange fluid channel: Heat exchange Folded bent portion 73 of fluid flow path: Heat exchange fluid 74: Gap 75: Discharge port 8: Connector 81: Inlet connector (inlet)
82: Outlet connector (outlet)
83: Piping 9: Air 10: Flow control device 11: Bubbling device for air into water 12: Heat exchanger 13: Electric heating panel temperature control / measurement device 14: Internal temperature measurement device 15: Outlet gas temperature measurement device 101-104 : Heat exchanger 105: Heat exchanger with shower head 106: Heat exchanger 110 for cooling 110: Temperature control supply device 111: Cooling devices 112 to 113: Piping

Claims (24)

  1.  熱源と、被熱交換流体に接触する熱伝達構造体と、熱源からの熱を熱伝達構造体に伝熱する伝熱部材を具備し、被熱交換流体と熱伝達構造体との接触面を通して伝熱型熱交換をなす熱交換器において、
     熱伝達構造体は、流入口、流出口および被熱交換流体流路を有するボデーと、ボデーに装着される多数の熱伝導体とを備えてなり、
     被熱交換流体との接触面を構成する被熱交換流体流路の内壁面は被熱交換流体に対して安定な材質からなること、
     熱伝導体はボデーの材料より熱伝導率の良い材料からなること、
     熱伝導体は、被熱交換流体流路の近傍であって被熱交換流体には接触しない位置に装着されていること、
     を特徴とする熱交換器。
    A heat source, a heat transfer structure that contacts the heat exchange fluid, and a heat transfer member that transfers heat from the heat source to the heat transfer structure, through a contact surface between the heat exchange fluid and the heat transfer structure In heat exchangers that perform heat transfer type heat exchange,
    The heat transfer structure includes a body having an inlet, an outlet, and a heat exchange fluid flow path, and a plurality of heat conductors attached to the body.
    The inner wall surface of the heat exchange fluid flow path constituting the contact surface with the heat exchange fluid is made of a material that is stable to the heat exchange fluid;
    The thermal conductor must be made of a material with better thermal conductivity than the body material,
    The heat conductor is mounted near the heat exchange fluid flow path and not in contact with the heat exchange fluid.
    A heat exchanger characterized by
  2.  多数の熱伝導体が、被熱交換流体流路を挟んで対向配置された複数個の熱伝導体を含む請求項1に記載の熱交換器。 The heat exchanger according to claim 1, wherein the plurality of heat conductors include a plurality of heat conductors arranged to face each other across the heat exchange fluid flow path.
  3.  伝熱部材が、ボデーを挟む2つの伝熱部材からなり、2つの伝熱部材のそれぞれから1以上の熱伝導体が延出される請求項1または2に記載の熱交換器。 The heat exchanger according to claim 1 or 2, wherein the heat transfer member includes two heat transfer members sandwiching the body, and one or more heat conductors extend from each of the two heat transfer members.
  4.  熱伝導体が、ピン状の構造を有するものである請求項1から3のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 3, wherein the heat conductor has a pin-like structure.
  5.  多数の熱伝導体の少なくとも一部が、板状の伝熱部材と一体的に形成される請求項4に記載の熱交換器。 The heat exchanger according to claim 4, wherein at least a part of the plurality of heat conductors is formed integrally with the plate-shaped heat transfer member.
  6.  多数の熱伝導体の少なくとも一部が、ジグザグ構造の外側面を有するものである請求項4または5に記載の熱交換器。 The heat exchanger according to claim 4 or 5, wherein at least a part of the plurality of heat conductors has an outer surface having a zigzag structure.
  7.  外側面の表面積が、凸部が無い外側面とした場合の1.5~3倍となるジグザグ構造である請求項6に記載の熱交換器。 The heat exchanger according to claim 6, wherein the heat exchanger has a zigzag structure in which the surface area of the outer surface is 1.5 to 3 times that of the outer surface having no protrusions.
  8.  ジグザグ構造の外側面を有する熱伝導体が、ネジである請求項6または7に記載の熱交換器。 The heat exchanger according to claim 6 or 7, wherein the heat conductor having the outer surface of the zigzag structure is a screw.
  9.  ジグザグ構造の外側面を有する熱伝導体が、頭部がフラットなネジである請求項8に記載の熱交換器。 The heat exchanger according to claim 8, wherein the heat conductor having the outer surface of the zigzag structure is a screw having a flat head.
  10.  被熱交換流体流路が、複数の屈曲部を有する請求項1から9のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 9, wherein the heat exchange fluid passage has a plurality of bent portions.
  11.  被熱交換流体流路が、流入口側に方向転換する折り返し屈曲部を有する請求項10に記載の熱交換器。 The heat exchanger according to claim 10, wherein the heat exchange fluid flow path has a folded back portion that changes direction toward the inflow port.
  12.  流入口に近い側に配置された熱伝導体の少なくとも一部が、流入口から遠い側に配置された熱伝導体と比べ熱伝導率の高い材料からなる熱伝導体である請求項1から11のいずれかに記載の熱交換器。 12. The thermal conductor made of a material having a higher thermal conductivity than at least a part of the thermal conductor arranged on the side close to the inlet, as compared with the thermal conductor arranged on the side far from the inlet. The heat exchanger in any one of.
  13.  流入口から遠い側と比べ、流入口に近い側では熱伝導体の数が多く、かつ、高密度で配置されている請求項1から12のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 12, wherein the number of heat conductors is greater on the side closer to the inlet than the side far from the inlet and is arranged at a high density.
  14.  流出口が、外界と連通する吐出口である請求項12または13に記載の熱交換器。 The heat exchanger according to claim 12 or 13, wherein the outlet is a discharge port communicating with the outside.
  15.  請求項1から13のいずれかに記載の熱交換器を複数個積層してなる熱交換器。 A heat exchanger formed by laminating a plurality of heat exchangers according to any one of claims 1 to 13.
  16.  被熱交換流体流路の内壁面が、樹脂である請求項1から15のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 15, wherein an inner wall surface of the heat exchange fluid passage is resin.
  17.  被熱交換流体流路の内壁面が、金属またはカーボンである請求項1から15のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 15, wherein an inner wall surface of the heat exchange fluid channel is metal or carbon.
  18.  多数の熱伝導体が、銅からなる熱伝導体およびアルミからなる熱伝導体を含む請求項1から17のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 17, wherein the plurality of heat conductors include a heat conductor made of copper and a heat conductor made of aluminum.
  19.  熱源が、加熱源である請求項1から18のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 18, wherein the heat source is a heating source.
  20.  熱源が、吸熱源である請求項1から18のいずれかに記載の熱交換器。 The heat exchanger according to any one of claims 1 to 18, wherein the heat source is an endothermic source.
  21.  請求項1から20のいずれかに記載の熱交換器を用いて、流体と伝熱型熱交換を行う熱交換方法。 A heat exchange method for performing heat transfer heat exchange with a fluid using the heat exchanger according to any one of claims 1 to 20.
  22.  請求項12に記載の熱交換器を用いて、流体と伝熱型熱交換を行う熱交換方法であって、
     流入口に近い側に、流入口から遠い側と比べ熱伝導率が相対的に高い材料からなる熱伝導体を配置し、流入口から遠い側に、流入口から近い側と比べ熱伝導率が相対的に低い材料からなる熱伝導体を配置することにより、被熱交換流体流路の上流側と下流側で生じる温度分布のムラを抑える熱交換方法。
    A heat exchange method for performing heat transfer type heat exchange with a fluid using the heat exchanger according to claim 12,
    A thermal conductor made of a material having a relatively high thermal conductivity compared to the side far from the inlet is arranged on the side near the inlet, and the thermal conductivity is higher on the side far from the inlet than the side near the inlet. A heat exchange method that suppresses uneven temperature distribution that occurs on the upstream side and the downstream side of a heat exchange fluid flow path by disposing a heat conductor made of a relatively low material.
  23.  請求項13に記載の熱交換器を用いて、流体と伝熱型熱交換を行う熱交換方法であって、
     流入口に近い側に、流入口から遠い側と比べ熱伝導率が相対的に高い材料からなる熱伝導体を配置し、流入口から遠い側に、流入口から近い側と比べ熱伝導率が相対的に低い材料からなる熱伝導体を配置することにより、被熱交換流体流路の上流側と下流側で生じる温度分布のムラを抑える熱交換方法。
    A heat exchange method for performing heat transfer heat exchange with a fluid using the heat exchanger according to claim 13,
    A thermal conductor made of a material having a relatively high thermal conductivity compared to the side far from the inlet is arranged on the side near the inlet, and the thermal conductivity is higher on the side far from the inlet than the side near the inlet. A heat exchange method that suppresses uneven temperature distribution that occurs on the upstream side and the downstream side of a heat exchange fluid flow path by disposing a heat conductor made of a relatively low material.
  24.  請求項16に記載の熱交換器を用いて、腐食性を有する流体と伝熱型熱交換を行う熱交換方法。

     
    A heat exchange method for performing heat transfer heat exchange with a corrosive fluid using the heat exchanger according to claim 16.

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