WO2013175709A1 - 液晶表示装置 - Google Patents
液晶表示装置 Download PDFInfo
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- WO2013175709A1 WO2013175709A1 PCT/JP2013/002698 JP2013002698W WO2013175709A1 WO 2013175709 A1 WO2013175709 A1 WO 2013175709A1 JP 2013002698 W JP2013002698 W JP 2013002698W WO 2013175709 A1 WO2013175709 A1 WO 2013175709A1
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- liquid crystal
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/133711—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
- G02F1/133723—Polyimide, polyamide-imide
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
Definitions
- the present invention relates to a liquid crystal display device, and more particularly to a structure for controlling an application region of an alignment film in a frame region of a display panel.
- the liquid crystal display device can be reduced in thickness and has low power consumption, it is widely used as a display for OA devices such as TVs and personal computers, portable electronic devices such as mobile phones and smartphones, cockpits of automobiles and airplanes, etc. Yes.
- the liquid crystal display device includes a display panel and a backlight unit attached to the back side of the display panel.
- the display panel has a configuration in which an array substrate including a switching element such as a thin film transistor and a counter substrate arranged to face the array substrate are bonded to each other with a sealing material. Is filled with liquid crystal material.
- As the counter substrate a substrate that is slightly smaller than the array substrate is employed, and a drive circuit is mounted on the terminal region of the array substrate exposed by this.
- the display panel includes a display area for displaying an image and a non-display area surrounding the display area.
- An alignment film is formed on the surface of the array substrate in contact with the liquid crystal layer so as to cover at least the display region.
- an alignment film is formed on the surface of the counter substrate in contact with the liquid crystal so as to cover at least the display region.
- the alignment film can be formed by, for example, rubbing the surface of a resin film such as polyimide formed using a flexographic printing method, an ink jet method, or the like. It is excellent in that it can be drawn directly on the substrate, it is low-contamination because of a non-contact process, it consumes less solution, and it can shorten the working time.
- An ink jet method is preferably used for the film.
- the alignment film is formed by the ink jet method
- a resin having a lower viscosity is used as a raw material for the alignment film than in the case of the flexo method. Therefore, the alignment film is formed in a region around the region to be printed (display region). Raw materials are likely to leak. Therefore, when the non-display area around the display area is small and the space between the display area and the seal material area cannot be secured large, the alignment film flows out to the seal material area. In this case, since the adhesion between the sealing material and the alignment film is insufficient, the liquid crystal material of the liquid crystal layer leaks without being completely sealed.
- Patent Document 1 discloses a groove extending long in the direction along the outer periphery of the display area in a substantially annular area outside the display area and inside the area where the sealing material is disposed.
- a liquid crystal display device having a configuration including: And according to this structure, even if the liquid resin material applied using the inkjet method spreads outside the display region, the spread of the resin material in the groove portion can be stopped, and the alignment film outside the display region can be stopped. It is described that wetting and spreading can be suppressed.
- Patent Document 1 further discloses a configuration in which a conductive film such as an ITO film is formed on the groove surface. It is described that the liquid resin material, which is an alignment film material, has low wettability with respect to the ITO film, and therefore, by adopting this configuration, wetting and spreading of the liquid resin material in the groove portion can be stopped.
- Patent Document 1 in order to prevent the alignment film from reaching the region where the sealing material is formed and the adhesion between the sealing material and the substrate is insufficient, the structure for preventing the alignment film from spreading (along the outer periphery of the display region) is disclosed. It is described that a groove portion extending in a long direction is provided so as not to overlap the region of the sealing material. However, if the structure for preventing the spread of the alignment film is provided so as not to overlap with the seal region, the frame region is enlarged accordingly.
- An object of the present invention is to obtain a liquid crystal display device that realizes a narrow frame without reducing the adhesion of a sealing material in a display panel.
- the liquid crystal display device of the present invention for solving the above-described problems is provided on the outside of the display region, the array substrate, the counter substrate disposed to face the array substrate, and the array substrate and the counter substrate are bonded together.
- a plurality of grooves extending along the sealing material are formed on the surface of the liquid crystal layer of the array substrate so as to be separated from each other in the width direction of the sealing material.
- the alignment film is filled in some or all of the plurality of grooves formed on the display region side of the seal material in the width direction, and the seal material and the alignment film are in contact with each other, and The width direction of the sealing material Anti display region side than the developing unit without going through the alignment film, characterized in that the sealing member and the array substrate are in direct contact.
- a plurality of grooves extending along the sealing material are formed on the liquid crystal layer side surface of the counter substrate so as to be separated from each other in the width direction of the sealing material.
- the alignment film is filled in some or all of the plurality of grooves of the array substrate and the counter substrate formed on the display area side of the seal material in the width direction, and the seal material and the alignment film are in contact with each other.
- the seal material, the array substrate, and the counter substrate are in direct contact with each other on the side opposite to the display area than the intermediate portion in the width direction of the seal material without passing through the alignment film.
- the alignment film material is applied using the ink jet method, the alignment film material is formed outside the substrate. Therefore, the alignment film is spread to the middle part in the width direction of the seal region.
- the alignment film is provided on the surface of the array substrate and the counter substrate on the display area side from the middle part in the width direction of the seal area, the adhesion between the substrate and the sealing material is compared with the case where there is no alignment film. Although it is inferior, there is no alignment film on the side opposite to the display area in the width direction of the seal area, so each substrate is in direct contact with the seal material, and excellent adhesion between each substrate and the seal material. can get. Therefore, the array substrate and the counter substrate are satisfactorily bonded with the sealing material, and the space where the liquid crystal layer is provided is sufficiently sealed.
- the substrate is bonded to the sealing material without passing through an organic insulating material or the like in the grooved portion. Yes. That is, it can be seen that the sealing material is bonded to the structure made of a metal such as an inorganic material or a transparent conductive film in the grooved portion, and is firmly bonded in the groove.
- the width of the frame region can be obtained without damaging the adhesion between the substrate and the sealing material by forming a plurality of grooves for regulating the outflow of the alignment film material in the sealing region. Can be reduced.
- the insulating film constituting the array substrate is made of an organic insulating film, and the plurality of grooves are formed by removing the organic insulating film.
- the plurality of grooves are formed by removing all of the organic insulating film in the thickness direction.
- an acrylic resin is preferably used as the organic insulating film.
- the organic insulating film of the second insulating film is completely divided into the inner peripheral side and the outer peripheral side of the seal region by the groove. For this reason, even if moisture or the like contained in the outside air enters the organic insulating film from the side opposite to the display area of the seal area, moisture does not permeate the second insulating film on the display area side. Therefore, there is no possibility that the adhesion at the interface between the alignment film and the second insulating film is deteriorated. Therefore, the adhesiveness between the sealing material and the substrate is improved even in the region where the alignment film exists on the display region side in the middle of the seal region in the width direction.
- the counter substrate is provided with a color filter layer in at least the display region and the region provided with the sealing material, and the groove has a part of the color filter layer in the seal region in the thickness direction. Or you may form in the location from which all were removed.
- the counter substrate is provided with an overcoat layer at least in the display area and the area where the seal material is provided, and the groove is formed in a place where the overcoat layer in the seal area is partially or entirely removed in the thickness direction. May be.
- the first wiring, the first insulating film, the second wiring, and the second insulating film are sequentially stacked on the array substrate, and the first wiring and the groove overlap in a plan view. It is preferable that a stopper layer made of the same layer as the second wiring is provided between the first insulating film and the second insulating film.
- the first wiring since the first wiring is not exposed on the surface of the groove when the groove is formed, adjacent first wirings leak through an object such as conductive dust existing on the groove surface. There is no fear. Therefore, even if the groove is formed so as to cross the first wiring or the like, the problem that the first wirings are short-circuited or the like is suppressed.
- a transparent conductive film is provided on the groove surface so as to cover at least the stopper layer.
- the stopper layer is not exposed on the surface of the groove, and the stopper layer is prevented from being corroded and deteriorated.
- the liquid crystal display device of the present invention is preferably provided so that the plurality of grooves are arranged in 2 to 20 rows.
- the present invention it is possible to realize a narrow frame without reducing the adhesion of the sealing material in the display panel of the liquid crystal display device.
- FIG. 1 is a plan view of a liquid crystal display device according to Embodiment 1.
- FIG. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 is a schematic plan view of an array substrate according to Embodiment 1.
- FIG. 4 is an enlarged plan view in a region AR1 of FIG.
- FIG. 5 is an enlarged plan view in a region AR2 of FIG.
- FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5.
- FIG. 6 is a cross-sectional view taken along line VII-VII in FIG. 5.
- 6 is a cross-sectional view of a liquid crystal display device according to Embodiment 2.
- FIG. 10 is a schematic plan view of an array substrate according to Modification Example 1.
- FIG. 10 is a schematic plan view of an array substrate according to Modification Example 1.
- FIG. 10 is a cross-sectional view of a liquid crystal display device according to Modification Example 1.
- FIG. 10 is a cross-sectional view of a liquid crystal display device according to modification example 2.
- 10 is a schematic plan view of an array substrate according to Modification 3.
- FIG. 10 is a schematic plan view of an array substrate according to Modification 4.
- FIG. 10 is a schematic plan view of an array substrate according to Modification 5.
- FIG. 6 is a schematic plan view of an array substrate according to Embodiment 3.
- FIG. 6 is a cross-sectional view of a liquid crystal display device according to Embodiment 3.
- FIG. It is sectional drawing of the liquid crystal display device which concerns on the modification 6.
- FIG. 1 and 2 are overall schematic views of a liquid crystal display device 10 according to the present embodiment.
- 3 is a schematic plan view of the array substrate 20
- FIG. 4 is an enlarged view of the area AR1 in FIG. 3
- FIG. 5 is an enlarged view of the area AR2 in FIG. 6
- FIG. 7 is a cross-sectional view of the liquid crystal display device including a cross section taken along line VII-VII in FIG.
- a frame-like frame region F is defined at the peripheral edge of the substrate, and a region surrounded by the frame region F is a display region D.
- the liquid crystal display device 10 includes an array substrate 20 and a counter substrate 30 that are arranged to face each other.
- the array substrate 20 and the counter substrate 30 are bonded to each other with an annular sealing material 40 arranged in a frame shape with their outer peripheral edge portions as seal regions SL.
- a liquid crystal layer 50 is provided in a space surrounded by the sealing material 40 between both the substrates 20 and 30 and constitutes a display region D.
- a part of the frame area F around the display area D in the array substrate 20 protrudes from the counter substrate 30 and serves as a terminal area T for attaching an external connection terminal such as a mounted component.
- a first conductive film (first wiring) including a gate signal line (not shown), a gate insulating film 23 (first insulating film), A second conductive film (second wiring) including a source signal line (not shown), an interlayer insulating film 25 (second insulating film), and a third conductive film including a pixel electrode 26a are stacked (see FIG. 6). reference.).
- the first conductive film and the second conductive film are formed, for example, by laminating a titanium (Ti) film and an upper copper (Cu) film.
- the gate insulating film 23 (first insulating film) is formed of, for example, a silicon nitride (SiNx) film.
- the interlayer insulating film 25 includes, for example, an inorganic insulating film (for example, a silicon nitride (SiNx) film) as a passivation film and an organic insulating film (for example, an acrylic resin film) on the upper layer. Is formed.
- an inorganic insulating film for example, a silicon nitride (SiNx) film
- an organic insulating film for example, an acrylic resin film
- the plurality of gate signal lines and the plurality of source signal lines are arranged in parallel with each other and the gate signal lines and the source signal lines are orthogonal to each other. ing.
- a region partitioned by the gate signal line and the source signal line constitutes a single pixel, and a thin film transistor is provided for each pixel, and a plurality of pixel electrodes 26a are arranged so as to correspond to the thin film transistor.
- the interlayer insulating film 25 is provided so as to cover the entire surface of the substrate including the frame region F.
- the source signal line and the gate signal line are led out to the terminal region T by a lead line (for example, the wiring 22a in FIGS. 6 and 7), and a gate driver (not shown) and a source are respectively provided. It is connected to a driver (not shown).
- An alignment film 27 is provided on the surface of the array substrate 20 on the liquid crystal layer 50 side so as to cover a region including the display region D. As shown in FIG. 5, the alignment film 27 is provided on the outer side from the display region D so as to extend to the middle portion in the width direction of the seal region SL.
- the alignment film 27 is made of, for example, a polyimide resin.
- the array substrate 20 is provided with an annular groove 28 so as to surround the display area D in the seal area SL.
- the grooves 28 are provided in a plurality of rows so as to extend along the seal material 40 while being spaced apart from each other in the width direction of the seal material 40.
- the grooves 28 are preferably formed in 2 to 20 rows (6 rows in FIGS. 3 to 7).
- the trench 28 is formed at a location where the interlayer insulating film 25 has been removed.
- the groove 28 has a width of 2 to 50 ⁇ m, more preferably 4 to 20 ⁇ m.
- the plurality of grooves 28 are formed so as to be arranged at a pitch of, for example, 4 to 100 ⁇ m.
- an island-shaped stopper layer 24 a is formed in the region that becomes the bottom surface of the groove 28 corresponding to the intersection of the wiring 22 a and the groove 28.
- the stopper layer 24a is made of the second conductive film and is formed simultaneously with the source signal line. Since the stopper layer 24a is provided, the wiring 22a located on the bottom surface of the groove 28 is not exposed on the surface of the groove 28, and the adjacent wiring through an object such as conductive dust existing on the surface of the groove 28. There is no risk of leakage between 22a. Therefore, even if the groove 28 is formed so as to cross the wiring 22a made of the first conductive film, the problem that the wirings 22a are short-circuited does not occur.
- a part of the stopper layer 24a may be connected to a transfer pad (not shown) that applies a common potential to the common electrode 34 described later.
- the stopper layer 24a may be electrically connected to the common electrode 34 via conductive beads (not shown) or the like.
- the stopper layer 24a and the common electrode 34 are only held at the same common potential, and current leakage occurs. There is no problem of display failure due to.
- the stopper layer 24a not connected to the transfer pad is in a floating state, even if the stopper layer 24a in the floating state is electrically connected to the common electrode 34, problems such as display defects due to current leakage still occur. Absent.
- a transparent conductive film 26b is further formed in an island shape so as to cover the surface of the groove 28 at a portion where the wiring 22a and the groove 28 intersect.
- the stopper layer 24a provided on the bottom surface of the groove 28 is not exposed on the surface of the groove 28, and the stopper layer 24a is prevented from being corroded and deteriorated.
- the transparent conductive film 26b is composed of a third conductive film and is formed simultaneously with the pixel electrode 26a.
- the transparent conductive film 26b is not an essential configuration.
- a color filter layer 32 a, a black matrix 33, and a common electrode 34 are stacked on a substrate body 31. (Shown) is configured.
- the color filter layer 32a is provided so as to correspond to each pixel, and is colored, for example, red, green, and blue according to the emission color.
- the black matrix 33 is provided in a light shielding region that partitions the color filter layer 32a.
- the common electrode 34 is provided so as to cover the entire surface of the substrate including the frame region F, and is provided in the frame region F of the array substrate 20 via conductive beads (not shown) mixed in the sealing material 40. It is held at a common potential applied from a transfer pad (not shown).
- the color filter layer 32b is formed of the same resin as the material constituting the color filter layer 32a.
- the color filter layer 32b is formed so as to correspond to at least the seal region SL in the frame region F.
- An alignment film 35 is provided on the surface of the counter substrate 30 on the liquid crystal layer 50 side so as to cover a region including the display region D.
- the alignment film 35 is provided on the outer side from the display region D so as to extend to the middle portion in the width direction of the seal region SL.
- the alignment film 35 is made of, for example, a polyimide resin.
- the counter substrate 30 is provided with an annular groove 36 so as to surround the display region D in the seal region SL (see FIGS. 6 and 7).
- the grooves 36 are provided in a plurality of rows so as to extend along the sealing material 40 while being spaced apart from each other in the width direction of the sealing material 40.
- the grooves 36 are preferably formed in 2 to 20 rows (6 rows in FIG. 6). As shown in FIGS. 6 and 7, the groove 36 is formed at a location where the color filter layer 32b made of the same layer as the color filter layer 32a is removed.
- the groove 36 has a width of 2 to 50 ⁇ m, more preferably 4 to 20 ⁇ m.
- the plurality of grooves 36 are formed so as to be arranged at a pitch of 4 to 100 ⁇ m, for example.
- the grooves 28 and 36 are formed in an annular shape so as to surround the display region D. Therefore, the liquid crystal is directed from the display region D toward the frame region F when the alignment films 27 and 35 are formed. It is possible to suppress the flow of the alignment film material, and to reduce the area from which the alignment film material flows out.
- the sealing material 40 is provided in an annular shape outside the display region D, and the array substrate 20 and the counter substrate 30 are bonded together. As shown in FIGS. 6 and 7, some of the plurality of grooves 28 and 36 (four of the six grooves 28 and 36 in FIGS. 6 and 7) are covered with alignment films 27 and 35, respectively. The display region D side of the sealing material 40 with respect to the intermediate portion in the width direction is filled in the grooves 28 and 36 covered with the alignment films 27 and 35 and is in contact with the alignment films 27 and 35.
- the sealing material 40 since the alignment films 27 and 35 do not exist on the side opposite to the display area (on the side opposite to the display area) from the intermediate portion in the width direction of the sealing material 40, the sealing material 40 has interlayer insulation on the array substrate 20 side. It is in direct contact with the film 25 and the transparent conductive film 26b. On the counter substrate 30 side, the sealing material 40 is in direct contact with the common electrode 34.
- a crushed glass fiber 41 is mixed as a spacer for keeping the distance between the array substrate 20 and the counter substrate 30 constant.
- the glass fiber pulverized product 41 has, for example, a fiber diameter of about 4 to 8 ⁇ m and a length of about 10 to 100 ⁇ m.
- the fiber diameter and length of the crushed glass fiber 41 are preferably larger than the width of the grooves 28 and 36. . However, if the system cannot be enlarged, only the length may be used.
- the pulverized glass fiber 41 is sandwiched between the surface of the interlayer insulating film 25 and the surface of the color filter layer 32b, and keeps the distance between the array substrate 20 and the counter substrate 30 constant.
- the liquid crystal layer 50 is formed of, for example, nematic liquid crystal.
- liquid crystal display device 10 configured as described above, in each pixel, when the TFT is turned on, a potential difference is generated between the pixel electrode 26a and the common electrode 34, and a predetermined voltage is applied to the liquid crystal capacitor formed of the liquid crystal layer 50. Is applied. In the liquid crystal display device 10, the transmittance of light incident from the outside is adjusted using the fact that the alignment state of liquid crystal molecules changes according to the magnitude of the applied voltage, and a desired image is displayed.
- a first conductive film including a gate signal line and a wiring 22a, a gate insulating film 23, and a second conductive film including a source signal line and a stopper layer 24a are sequentially formed on the substrate body 21. Laminate.
- a silicon nitride (SiNx) film is formed as an inorganic insulating film so as to cover the entire surface of the substrate, and an acrylic resin film is further formed as an organic insulating film, thereby forming an interlayer insulating film 25.
- a photosensitive acrylic resin film is exposed as an organic insulating film
- development processing is performed to remove the acrylic resin film in the groove 28, and a silicon nitride (SiNx) film is formed using the acrylic resin film as a mask.
- the trench 28 is formed by removing the silicon nitride film at the trench 28 by dry etching.
- the development process is performed after applying the resist agent for each layer or two layers in a lump, and etching is further performed between the layers.
- the trench 28 is formed by removing the insulating film 25.
- the stopper layer 24a or the substrate body 21 is completely exposed on the surface of the groove 28 formed by removing the interlayer insulating film 25.
- a third conductive film including the pixel electrode 26a and the transparent conductive film 26b is stacked using a transparent conductive material such as ITO or IZO.
- an alignment film 27 is formed using an ink jet method so as to cover the display region D.
- the liquid polyimide which is the alignment film material, flows to the frame region F and spreads.
- the groove 28 restricts the outflow of the polyimide, the polyimide film is disposed on the outer peripheral side from the middle part of the plurality of grooves 28. Is not formed.
- the color filter layers 32a and 32b and the black matrix 33 are formed on the substrate body 31 by using a known method, and after the color filter layer 32b is exposed, development processing is performed to remove the color filter layer 32b.
- a groove 36 is provided.
- a development process is performed after applying a resist material, and etching is further performed to remove the color filter layer 32b, and a groove 36 is provided.
- the common electrode 34 is laminated so as to cover them.
- the alignment film 35 is laminated in the same manner as the alignment film 27 of the array substrate 20.
- the liquid polyimide which is the alignment film material, flows to the frame region F and spreads.
- the groove 36 restricts the outflow of the polyimide, the polyimide film is disposed on the outer peripheral side from the middle part of the plurality of grooves 36. Is not formed.
- a sealing material 40 is applied to one of the surfaces of the array substrate 20 and the counter substrate 30, and a liquid crystal material is dropped on a region surrounded by the sealing material 40.
- the material 40 is cured to bond the substrates 20 and 30 together. Thereby, the display panel is completed.
- a liquid crystal material may be introduced between the two substrates 20 and 30 by using a vacuum injection method utilizing capillary action.
- the sealing material 40 is applied in a frame shape so as to have an opening serving as a liquid crystal material injection port, and then the substrates 20 and 30 are bonded together to cure the sealing material 40. Then, after dividing the substrate into cell sizes, a liquid crystal material is injected from the opening of the sealing material 40 in a vacuum atmosphere, and finally, the injection port is sealed with a sealing material.
- a polarizing plate is attached to the display panel, a mounting member is mounted, and a modularization process such as mounting a backlight is performed.
- a modularization process such as mounting a backlight is performed.
- the alignment film material is used using the inkjet method.
- the groove is restricted from flowing out of the alignment film material to the outside of the substrate, and the alignment films 27 and 35 are formed to extend to the middle part in the width direction of the seal region SL (the hatched lines in FIG. 5). (See the area indicated by.)
- the alignment films 27 and 35 are provided on the surfaces of the array substrate 20 and the counter substrate 30 inside the intermediate portion in the width direction of the seal region SL, the adhesion between the substrate and the sealing material 40 is determined by the alignment film. Although inferior to the case where there is no, the alignment films 27 and 35 do not exist outside the intermediate portion in the width direction of the seal region SL, so that excellent adhesion between each substrate and the seal material 40 can be obtained. Therefore, the array substrate 20 and the counter substrate 30 are satisfactorily bonded with the sealing material 40, and the space where the liquid crystal layer 50 is provided is sufficiently sealed.
- the array substrate 20 has a transparent conductive film 26b (see FIG. 6) in a portion where the groove 28 is present. ) Or the substrate body 21 (see FIG. 7). That is, it can be seen that the sealing material 40 is bonded to a structure made of an inorganic material in a portion where the groove 28 is present, and is firmly bonded in the groove 28.
- the counter substrate 30 has a common electrode 34 (see FIG. 6) in a portion where the groove 36 is provided. .) Is adhered to the sealing material 40. That is, it can be seen that the sealing material 40 is bonded to a structure made of an inorganic material in a portion where the groove 36 is provided, and is firmly bonded in the groove 36.
- the frame is obtained without impairing the adhesion of the substrate.
- the width of the region F can be reduced.
- the interlayer insulating film 25 made of an organic insulating material is formed on the bottom surface of the groove 28.
- the configuration is completely removed. That is, the interlayer insulating film 25 provided on the outer peripheral side of the seal region SL is completely independent of the interlayer insulating film 25 on the inner peripheral side of the seal region SL by the annular groove 28. Therefore, even if moisture or the like enters from the outer peripheral side interlayer insulating film 25 of the seal region SL exposed to the outside air, the moisture does not permeate into the inner peripheral side interlayer insulating film 25. There is no possibility that the adhesion at the interface between the alignment film and the interlayer insulating film 25 deteriorates due to moisture permeation.
- the array substrate 20 and the counter substrate 30 are arranged to face each other, and are bonded by the seal material 40 arranged at the outer peripheral edge thereof, and are surrounded by the seal material 40.
- a liquid crystal layer 50 is provided as a display layer.
- the liquid crystal display device 10 is different from the first embodiment in that it is an IPS (In-Plane-Switching) liquid crystal display. That is, the second embodiment is different from the first embodiment in that the common electrode is formed not on the counter substrate 30 but on the array substrate 20 and the pixel electrode 26a is provided in a comb shape in a plan view.
- the array substrate 20 includes a first conductive film including a gate signal line (not shown), a gate insulating film 23, and a second conductive film including a source signal line (not shown) on the substrate body 21.
- the first interlayer insulating film 25a, the first transparent electrode provided as the common electrode 29, the second interlayer insulating film 25b, the second transparent electrode including the pixel electrode 26a, and the alignment film 27 are laminated.
- the first interlayer insulating film 25a is formed of an inorganic insulating material such as silicon nitride (SiNx), for example.
- the second interlayer insulating film 25b is formed of an organic insulating material such as acrylic resin, for example.
- the trench 28 is formed at a location where the first and second interlayer insulating films 25a and 25b are removed. Similar to the first embodiment, the stopper layer 24a provided under the first interlayer insulating film 25a is exposed at the bottom of the groove 28, and the transparent conductive film 26b is formed so as to cover the surface of the groove 28 including the stopper layer 24a. Is provided.
- the second interlayer insulating film 25b is formed of a photosensitive acrylic resin
- the photosensitive acrylic resin is exposed to the development process, and the first interlayer insulating film 25a ( The trench 28 is formed by dry etching the silicon nitride film) and removing the interlayer insulating film 25.
- the second interlayer insulating film 25b is formed of an acrylic resin having no photosensitivity
- a resist agent is applied to the second interlayer insulating film 25b, and then development processing is performed and etching is performed to perform the second interlayer insulating film 25b.
- the trench 28 is formed by removing the insulating film 25b, further applying a resist agent to the first interlayer insulating film 25a, developing, and etching to remove the first interlayer insulating film 25a.
- the groove 28 may be formed by collectively developing and etching the first interlayer insulating film 25a and the second insulating film 25b.
- the first interlayer insulating film 25a (silicon nitride film) and before forming the second interlayer insulating film 25b, the first interlayer insulating film 25a is first etched to remove the groove 28 portion, The first transparent electrode including the common electrode 29 and the second interlayer insulating film 25b (photosensitive acrylic resin) are formed, and then development processing is performed to remove the groove 28 portion of the second interlayer insulating film 25b. May be formed.
- the overcoat layer 37 is made of, for example, a transparent acrylic resin, and is provided on the entire surface of the substrate so as to cover the color filter layer 32 a and the black matrix 33.
- the groove 36 is formed at a location where the overcoat layer 37 provided in the frame region F is removed.
- the groove 36 is subjected to development processing after the overcoat layer 37 is exposed, or if the overcoat layer 37 does not have photosensitivity, the development processing is performed after applying a resist material, and further etching is performed.
- the overcoat layer 37 is removed and formed.
- the liquid crystal display device 10 having the above configuration applies a predetermined voltage for each pixel to the liquid crystal layer 50 between each pixel electrode 26a and the common electrode 29 on the array substrate 20, and generates a liquid crystal layer by an electric field generated in the horizontal direction. 50 orientation states are changed. Thereby, the transmittance of light transmitted through the display panel is adjusted, and a desired image is displayed.
- the liquid crystal display device 10 having the above-described configuration can be manufactured according to the manufacturing method of the first embodiment based on the manufacturing method of the conventional IPS liquid crystal display device.
- the sealing material 40 is directly bonded to the substrate body 31 that is a glass substrate, and higher adhesion can be obtained between the counter substrate 30 and the sealing material 40.
- Modification 1 In the above embodiment, it has been described that all of the plurality of grooves 28 and 36 are formed in the seal region SL in the array substrate 20 and the counter substrate 30, but this is not a limitation.
- two inner rows of the six rows 28 may be formed on the inner peripheral side with respect to the seal region SL.
- the width of the frame region F can be reduced.
- Modification 2 In the above embodiment, it has been described that the grooves 28 and 36 are formed in six rows on both the array substrate 20 and the counter substrate 30, but the number of grooves formed on both substrates may be different. .
- the positions of the grooves 28 and 36 of the array substrate 20 and the counter substrate 30 do not correspond one-to-one.
- the glass fiber pulverized material 41 mixed in the sealing material 40 as a spacer is not limited to the array substrate 20 and the counter substrate. No problem occurs because it is sandwiched by 30.
- the array substrate 20 and the counter substrate 30 have been described as having the grooves 28 and 36 formed in a frame shape along the seal region SL, but the present invention is not particularly limited thereto.
- a groove may be provided along only one side of the seal region SL.
- the groove 28 is formed along the upper side. May be.
- the grooves 28 and 36 are not limited to being formed so as to extend continuously as in the above-described embodiment.
- the groove 28 may be discontinuous and formed in a broken line shape.
- the plurality of grooves 28 are arranged in a staggered manner so that the adjacent grooves 28 and the regions where no grooves are formed are not adjacent to each other, the effect of suppressing the flow of the alignment film material can be enhanced. .
- the same silicon film as the semiconductor layer of the thin film transistor may be formed in an island shape between the gate insulating film 23 and the stopper layer 24a. Even when the surface of the gate insulating film 23 is raised due to the presence of the wiring 22a, the occurrence of leakage can be prevented more reliably by overlaying the silicon layer on the lower layer of the stopper layer 24a.
- both the organic insulating film and the inorganic insulating film are removed from the interlayer insulating film 25 to expose the stopper layer 24 a or the substrate body 21 on the surface of the groove 28.
- an IPS liquid crystal display in which the first interlayer insulating film 25a is formed of an inorganic insulating material such as silicon nitride (SiNx) and the second interlayer insulating film 25b is formed of an organic insulating material such as acrylic resin.
- SiNx silicon nitride
- the groove 28 is formed only in the second interlayer insulating film 25b by using the first interlayer insulating film 25a as a stopper layer when the groove 28 is formed. Is possible. In this case, since the first interlayer insulating film 25a is used as a stopper layer, it is not necessary to provide the stopper layer 24a with the second conductive film.
- the counter substrate 30 is provided with the black matrix 33 at the boundary between the display region D and the frame region F and is shielded from light.
- the display is not performed on the array substrate 20 side but the counter substrate 30.
- the boundary between the region D and the frame region F may be shielded from light.
- the second conductive film can be used to shield the region.
- the grooves 28 and 36 are formed in both the array substrate 20 and the counter substrate 30, respectively.
- the groove 28 is formed in the array substrate 20
- the counter substrate 30 side has The groove may not be formed.
- the alignment film 35 is partially removed by performing laser irradiation or the like in a predetermined region provided with a transfer pad or the like, so that the frame region has a narrow frame equivalent to the array substrate 20. can do.
- the array substrate 20 and the counter substrate 30 are arranged to face each other, and are bonded by the seal material 40 arranged at the outer peripheral edge thereof, and are surrounded by the seal material 40.
- a liquid crystal layer 50 is provided as a display layer.
- This liquid crystal display device 10 is different from the first and second embodiments in that the gate driver region GD and the source driver region SD are arranged inside the seal region SL as shown in FIG.
- the liquid crystal display device 10 is an FFS (Fringe Field Switching) liquid crystal display including a TFT having a top gate structure. That is, as in the second embodiment, the common electrode 29 is formed in a slit shape on the array substrate 20 instead of the counter substrate 30, and the pixel electrode 26a is provided in a solid shape in plan view.
- FFS Field Switching
- the array substrate 20 includes a first inorganic insulating film 21B, a semiconductor film 21C, a gate insulating film 23, a first conductive film including a gate electrode 22, and a second inorganic insulating film 23B on a substrate body 21.
- a conductive film and an alignment film 27 are stacked.
- the first inorganic insulating film 21B, the second inorganic insulating film 23B, and the third inorganic insulating film 25b are formed of an inorganic insulating material such as a silicon oxide film (SiO 2 ) or silicon nitride (SiNx), for example.
- the organic insulating film 25a is formed of an organic insulating material such as an acrylic resin, for example.
- the semiconductor film 21C, the gate electrode 22, and the source / drain electrode 24b constitute a TFT having a top gate structure.
- As the semiconductor film 21C for example, a low-temperature polysilicon (LTPS) film, a CG silicon (continuous grain boundary crystal silicon) film, or the like is used.
- LTPS low-temperature polysilicon
- CG silicon continuous grain boundary crystal silicon
- the groove 28 is formed at a location where the organic insulating film 25a has been removed.
- the groove 28 is provided with a third inorganic insulating film 25b so as to cover the surface thereof.
- a wiring layer 24a made of the same second conductive film as the source / drain electrode 24b may be provided as a stopper layer in a region of the trench 28 that overlaps with the gate metal 22b and the semiconductor film 21Cb.
- the semiconductor film 21Cb and the gate metal 22b overlapping the trench 28 constitute a part of the gate driver GD.
- the groove 28 is formed by performing development after the photosensitive acrylic resin is exposed.
- the organic insulating film 25a is formed of an acrylic resin having no photosensitivity
- development is performed, etching is performed to remove the organic insulating film 25a, and Then, after applying a resist agent to the organic insulating film 25a, development processing is performed, and etching is performed to remove the organic insulating film 25a, thereby forming the grooves 28.
- the second conductive film may be provided as a stopper layer in the groove region so that the insulating film below the organic insulating film is not removed by etching.
- the wiring layer 24a is used as a wiring, it may be provided even in a region where the semiconductor film 21Cb and the gate metal 22b constituting a part of the gate driver GD are not present. Further, the surface of the groove 28 may be covered with the same first transparent conductive film as the pixel electrode 26 a or the second transparent conductive film same as the common electrode 29. When the surface of the groove 28 is covered with the first transparent conductive film or the second transparent conductive film and the lower wiring layer 24a or the like is used as the wiring, a short circuit between the wirings is caused through these transparent conductive films. It is necessary to make a design that does not occur. For example, it is necessary to have a patterning design in which the wiring layer 24a and the transparent conductive film do not overlap each other, or a design in which the second inorganic insulating film 25b and the like are interposed.
- the overcoat layer 37 is made of, for example, a transparent acrylic resin, and is provided on the entire surface of the substrate so as to cover the color filter layer 32 a and the black matrix 33.
- the groove 36 is formed at a location where the overcoat layer 37 provided in the frame region F is removed.
- the groove 36 is subjected to development processing after the overcoat layer 37 is exposed, or if the overcoat layer 37 does not have photosensitivity, the development processing is performed after applying a resist material, and further etching is performed.
- the overcoat layer 37 is removed and formed.
- the liquid crystal display device 10 configured as described above applies a predetermined voltage for each pixel to the liquid crystal layer 50 between each pixel electrode 26a and the common electrode 29 on the array substrate 20, and generates a liquid crystal by a fringe electric field generated in the horizontal direction.
- the orientation state of the layer 50 is changed. Thereby, the transmittance of light transmitted through the display panel is adjusted, and a desired image is displayed.
- the liquid crystal display device 10 having the above-described configuration can be manufactured according to the manufacturing method of the first embodiment based on the manufacturing method of the conventional IPS liquid crystal display device.
- the source driver region SD and the gate driver region GD are provided inside the seal region SL, circuits provided in the source driver region SD and the gate driver region GD are connected to the array substrate 20. And in the sealed space between the counter substrate 30. A plurality of grooves 28 are formed in the seal region SL, and the organic insulating film is divided between the inner side and the outer side by the grooves 28. Therefore, moisture, oxygen, etc. existing outside the sealing space travel along the organic insulating film. Reaching the inside of the sealed space is suppressed, so that not only circuits in the pixel region but also circuits provided in the source driver region SD and the gate driver region GD can be prevented from being deteriorated by moisture and oxygen.
- the sealing material 40 is directly bonded to the substrate body 31 that is a glass substrate, and higher adhesion can be obtained between the counter substrate 30 and the sealing material 40.
- the FFS liquid crystal display of the liquid crystal display device 10 has been described as including a top gate TFT.
- the FFS liquid crystal display includes a bottom gate TFT. Also good.
- the array substrate 20 includes a first conductive film including a gate electrode 22, a gate insulating film 23, a semiconductor film 21C, a wiring layer 24a, and source / drain electrodes 24b on a substrate body 21.
- a second transparent conductive film including a second conductive film, a first inorganic insulating film 23B, an organic insulating film 25a, a first transparent conductive film provided as a common electrode 29, a second inorganic insulating film 25b, and a pixel electrode 26a;
- An alignment film 27 is laminated.
- the first inorganic insulating film 23B and the second inorganic insulating film 25b are made of an inorganic insulating material such as silicon nitride (SiNx), for example.
- the organic insulating film 25a is formed of an organic insulating material such as an acrylic resin, for example.
- the gate electrode 22, the semiconductor film 21C, and the source / drain electrode 24b constitute a bottom gate TFT.
- As the semiconductor film 21C for example, an amorphous silicon (a-Si) film, an oxide semiconductor film (for example, an In—Ga—Zn-based oxide (IGZO) film), or the like is used. As shown in FIG.
- TFT for driving a pixel there are a TFT for driving a pixel and a TFT in a circuit in the gate driver region as the TFT.
- the TFT provided in the circuit of the gate driver region GD may be provided so as to overlap with the groove 28 as shown in FIG. 17 or may be provided so as not to overlap with the groove 28.
- the groove 28 is formed at a location where the organic insulating film 25a has been removed.
- the groove 28 is provided with a second inorganic insulating film 25b so as to cover the surface thereof.
- the groove 28 is formed by performing development after the photosensitive acrylic resin is exposed.
- the organic insulating film 25a is formed of an acrylic resin having no photosensitivity
- development is performed, etching is performed to remove the organic insulating film 25a, and Then, after applying a resist agent to the organic insulating film 25a, development processing is performed, and etching is performed to remove the organic insulating film 25a, thereby forming the grooves 28.
- the counter substrate 30 and other configurations are the same as those in the third embodiment.
- the liquid crystal display device 10 configured as described above applies a predetermined voltage for each pixel to the liquid crystal layer 50 between each pixel electrode 26a and the common electrode 29 on the array substrate 20, and generates a liquid crystal by a fringe electric field generated in the horizontal direction.
- the orientation state of the layer 50 is changed. Thereby, the transmittance of light transmitted through the display panel is adjusted, and a desired image is displayed.
- the present invention is useful for a liquid crystal display device.
- it is useful for a structure for controlling the application region of the alignment film in the frame region of the display panel.
- liquid crystal display device 20 array substrate 21 substrate body 22a wiring (first wiring) 23 Gate insulating film (first insulating film) 24a Stopper layer (second wiring) 25 Interlayer insulation film (second insulation film) 26b Transparent conductive film 27 Alignment film 28 Groove 30 Counter substrate 32a Color filter layer 32b Color filter layer 34 Common electrode 35 Alignment film 36 Groove 37 Overcoat layer 40 Sealing material 50 Liquid crystal layer
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Abstract
Description
(液晶表示装置)
図1及び2は、本実施形態に係る液晶表示装置10の全体概略図を示す。図3は、アレイ基板20の概略平面図であり、図4は図3の領域AR1の拡大図、及び図5は図4の領域AR2の拡大図である。また、図6は図5のVI-VI線における断面を含む液晶表示装置の断面図、及び図7は図5のVII-VII線における断面を含む液晶表示装置の断面図である。
アレイ基板20は、ボトムゲート型の薄膜トランジスタを備える場合、基板本体21上に、ゲート信号線(不図示)を含む第1導電膜(第1配線)、ゲート絶縁膜23(第1絶縁膜)、ソース信号線(不図示)を含む第2導電膜(第2配線)、層間絶縁膜25(第2絶縁膜)、及び画素電極26aを含む第3導電膜が積層形成されている(図6を参照。)。第1導電膜や第2導電膜は、例えば、チタン(Ti)膜とその上層の銅(Cu)膜とが積層されて形成されている。ゲート絶縁膜23(第1絶縁膜)は、例えば、窒化シリコン(SiNx)膜で形成されている。層間絶縁膜25(第2絶縁膜)は、例えば、パッシベーション膜としての無機絶縁膜(例えば、窒化シリコン(SiNx)膜)と、その上層の有機絶縁膜(例えば、アクリル樹脂膜)とが積層されて形成されている。なお、薄膜トランジスタがトップゲート型の場合には、第1導電膜の形成前にゲート絶縁膜23を形成し、第1導電膜を覆う絶縁膜を第1絶縁膜として形成することとなる。
対向基板30は、基板本体31上に、カラーフィルタ層32a及びブラックマトリクス33、並びに共通電極34が積層形成されており、基板外周縁部の額縁領域Fにおいては、ブラックマトリクス33で遮光領域(不図示)が構成されている。具体的には、対向基板30の表示領域Dでは、カラーフィルタ層32aは、各画素に対応するように設けられ、発光色に応じて例えば赤色、緑色及び青色に着色されている。また、ブラックマトリクス33は、カラーフィルタ層32aを区画する遮光領域に設けられている。共通電極34は、額縁領域Fを含めた基板全面を覆うように設けられ、シール材40に混入された導電性ビーズ(不図示)等を介して、アレイ基板20の額縁領域Fに設けられたトランスファパッド(不図示)から与えられた共通電位に保持されている。そして、対向基板30の額縁領域Fでは、カラーフィルタ層32aを構成する材料と同一の樹脂でカラーフィルタ層32bが形成されている。カラーフィルタ層32bは、額縁領域Fのうち少なくともシール領域SLに対応するように形成されている。
次に、上記の構成の液晶表示装置の製造方法を説明する。
本実施形態の構成の液晶表示装置10によれば、アレイ基板20と対向基板30の額縁領域Fにおいてシール領域SLに溝28や溝36が形成されているので、インクジェット法を用いて配向膜材料を塗布すると、配向膜材料が基板外方に流れ出すのが溝によって規制され、シール領域SLの幅方向の中途部まで配向膜27,35が広がるように形成されることとなる(図5の斜線で示す領域を参照。)。
次に、実施形態2の液晶表示装置10について説明する。なお、実施形態1と同一又は対応する構成については実施形態1と同一の参照符号を用いて説明する。
上記の実施形態では、アレイ基板20や対向基板30において、複数の溝28,36の全てがシール領域SLに形成されるとして説明しているが、特にこれに限定されない。例えば、図9及び図10に変形例1として示すように、6列の溝28のうち内側の2列は、シール領域SLよりも内周側に形成されていてもよい。この場合でも、配向膜材料の外方への流出を規制するための溝28のうち4列がシール領域SLに形成されているので、額縁領域Fの幅を小さくすることができる。
上記の実施形態では、アレイ基板20にも対向基板30にも溝28,36が6列ずつ形成されているとして説明しているが、両基板に形成される溝の数が異なっていてもよい。例えば、図11に変形例2として示すように、アレイ基板20側には溝28が6列形成される一方で、対向基板30側には溝36が7列形成されていてもよい。この場合、アレイ基板20と対向基板30の溝28,36の位置が1対1で対応しないこととなるが、スペーサとしてシール材40に混入するガラス繊維粉砕物41は、アレイ基板20及び対向基板30で挟まれるので、問題は生じない。
上記の実施形態では、アレイ基板20や対向基板30において、シール領域SLに沿って枠状に溝28,36が形成されているとして説明したが、特にこれに限定されない。例えば、シール領域SLの1つの辺のみに沿うように溝が設けられていてもよい。例えば、図12に変形例3として示すように、アレイ基板20の1つの辺(図12では上辺)に沿って端子領域Tが設けられている場合には、上辺に沿うように溝28が形成されていてもよい。
また、溝28,36は、上記の実施形態のように連続して延びるように形成されていることに限定されない。例えば、図13に変形例4として示すように、溝28が非連続であって破線状に形成されていてもよい。この場合、隣接する溝28と溝が形成されていない領域が隣接しないように、複数の溝28を千鳥状に配列して形成すると、配向膜材料が流れるのを抑制する効果を高めることができる。
上記の実施形態では、アレイ基板20の溝28の形成において、層間絶縁膜25のうち有機絶縁膜と無機絶縁膜の両方を除去して溝28の表面にストッパ層24a又は基板本体21を露出させるとして説明したが、層間絶縁膜25のうち少なくとも有機絶縁膜のみが除去されていればよい。例えば、実施形態2のように、第1層間絶縁膜25aを窒化シリコン(SiNx)等の無機絶縁材料で、第2層間絶縁膜25bをアクリル樹脂等の有機絶縁材料で形成したIPS方式の液晶表示装置10の場合には、変形例5として図14に示すように、第1層間絶縁膜25aを溝28形成時のストッパ層として用いて、第2層間絶縁膜25bにのみ溝28を形成することが可能である。この場合、第1層間絶縁膜25aをストッパ層として用いるので、第2導電膜でストッパ層24aを設ける必要がない。
上記の実施形態では、対向基板30には、表示領域Dと額縁領域Fの境界にブラックマトリクス33が設けられて遮光されているとして説明したが、対向基板30ではなくアレイ基板20側において、表示領域Dと額縁領域Fの境界が遮光されていてもよい。この場合、例えば第2導電膜を用いて当該領域を遮光することができる。
次に、実施形態3の液晶表示装置10について説明する。なお、実施形態1と同一又は対応する構成については実施形態1や2と同一の参照符号を用いて説明する。
実施形態3では、液晶表示装置10のFFS液晶ディスプレイがトップゲート構造のTFTを備えるとして説明したが、図17に変形例6として示すように、FFS液晶ディスプレイがボトムゲート構造のTFTを備えていてもよい。
20 アレイ基板
21 基板本体
22a 配線(第1配線)
23 ゲート絶縁膜(第1絶縁膜)
24a ストッパ層(第2配線)
25 層間絶縁膜(第2絶縁膜)
26b 透明導電膜
27 配向膜
28 溝
30 対向基板
32a カラーフィルタ層
32b カラーフィルタ層
34 共通電極
35 配向膜
36 溝
37 オーバーコート層
40 シール材
50 液晶層
Claims (12)
- アレイ基板と、
上記アレイ基板に対向して配置された対向基板と、
表示領域外側に設けられ、上記アレイ基板及び対向基板を貼り合わせるシール材と、
上記アレイ基板と対向基板との間の上記シール材に囲まれた領域に設けられた液晶層と、
上記アレイ基板及び対向基板の液晶層側表面のうち表示領域を含む領域にそれぞれ設けられた配向膜と、を備えた液晶表示装置であって、
上記アレイ基板の上記液晶層側表面には、該シール材に沿って延びる複数の溝が、シール材の幅方向に互いに離間して形成され、
上記シール材の幅方向中途部よりも表示領域側に形成された上記複数の溝の一部又は全部に上記配向膜が充填され、上記シール材と該配向膜とが接触し、且つ、上記シール材の該幅方向中途部よりも反表示領域側は上記配向膜を介さず、シール材と上記アレイ基板とが直接接触している
ことを特徴とする液晶表示装置。 - 請求項1に記載された液晶表示装置において、
上記対向基板の上記液晶層側表面には、該シール材に沿って延びる複数の溝が、シール材の幅方向に互いに離間して形成され、
上記シール材の幅方向中途部よりも表示領域側に形成された上記アレイ基板及び対向基板の複数の溝の一部又は全部に上記配向膜が充填され、上記シール材と該配向膜とが接触し、且つ、上記シール材の該幅方向中途部よりも反表示領域側は上記配向膜を介さず、シール材と上記アレイ基板及び対向基板とが直接接触していることを特徴とする液晶表示装置。 - 請求項1又は2に記載された液晶表示装置において、
上記アレイ基板を構成する絶縁膜の少なくとも一部は有機絶縁膜で構成され、
上記複数の溝は、上記有機絶縁膜が除去されて形成されたことを特徴とする液晶表示装置。 - 請求項3に記載された液晶表示装置において、
上記複数の溝は、上記有機絶縁膜が厚さ方向に全て除去されて形成されたことを特徴とする液晶表示装置。 - 請求項3又は4に記載された液晶表示装置において、
上記有機絶縁膜はアクリル樹脂で形成されていることを特徴とする液晶表示装置。 - 請求項2に記載された液晶表示装置において、
上記対向基板は、少なくとも表示領域及び上記シール材が設けられた領域にカラーフィルタ層が設けられ、
上記溝は、上記シール材が設けられた領域におけるカラーフィルタ層が厚さ方向に一部又は全て除去された箇所に形成されていることを特徴とする液晶表示装置。 - 請求項2に記載された液晶表示装置において、
上記対向基板は、少なくとも表示領域及びシール材が設けられた領域にオーバーコート層が設けられ、
上記溝は、上記シール材が設けられた領域におけるオーバーコート層が厚さ方向に一部又は全て除去された箇所に形成されていることを特徴とする液晶表示装置。 - 請求項1~7のいずれか1項に記載された液晶表示装置において、
上記アレイ基板において、第1配線、第1絶縁膜、第2配線及び第2絶縁膜が順に積層され、平面視で上記第1配線及び上記溝が重なる領域では、上記第1絶縁膜と第2絶縁膜の間に上記第2配線と同一層からなるストッパ層が設けられていることを特徴とする液晶表示装置。 - 請求項8に記載された液晶表示装置において、
上記溝表面に、少なくとも上記ストッパ層を覆うように透明導電膜が設けられていることを特徴とする液晶表示装置。 - 請求項1~9のいずれか1項に記載された液晶表示装置において、
上記アレイ基板に形成された複数の溝は、2~20列並ぶように設けられていることを特徴とする液晶表示装置。 - 請求項2,7及び8のいずれか1項に記載された液晶表示装置において、
上記対向基板に形成された複数の溝は、2~20列並ぶように設けられていることを特徴とする液晶表示装置。 - 基板本体上に第1配線、第1絶縁膜、第2配線及び第2絶縁膜が順に積層されたアレイ基板と、
上記アレイ基板に対向して配置された対向基板と、
表示領域外側に設けられ、上記アレイ基板及び対向基板を貼り合わせる環状のシール材と、
上記アレイ基板と対向基板との間の上記シール材に囲まれた領域に設けられた液晶層と、
上記アレイ基板及び対向基板の液晶層側表面のうち表示領域を含む領域にそれぞれ設けられ、表示領域外側に延びる配向膜と、
上記シール材が設けられた領域において上記アレイ基板の上記液晶層側表面に形成され、互いにシール材の幅方向に離間して該シール材に沿って延びる複数の溝と、
を備えた液晶表示装置であって、
上記シール材の幅方向中途部よりも表示領域側が上記複数の溝の一部又は全部に充填されて上記配向膜と接触し、且つ、上記シール材の該幅方向中途部寄りの反表示領域側が上記アレイ基板と直接接触している
ことを特徴とする液晶表示装置。
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- 2013-04-22 SG SG11201407574RA patent/SG11201407574RA/en unknown
- 2013-04-22 JP JP2014516648A patent/JP5857125B2/ja active Active
- 2013-04-22 EP EP13793965.8A patent/EP2857894A4/en not_active Ceased
- 2013-04-22 US US14/400,560 patent/US9448441B2/en active Active
- 2013-04-22 KR KR1020147035020A patent/KR20150020204A/ko not_active Application Discontinuation
- 2013-04-22 CN CN201380026212.0A patent/CN104335111B/zh not_active Expired - Fee Related
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JP2015118216A (ja) * | 2013-12-18 | 2015-06-25 | 株式会社ジャパンディスプレイ | 表示装置 |
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JP2018189717A (ja) * | 2017-04-28 | 2018-11-29 | 三菱電機株式会社 | 液晶表示装置およびその製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
CN104335111B (zh) | 2017-03-29 |
US9448441B2 (en) | 2016-09-20 |
EP2857894A1 (en) | 2015-04-08 |
US20150131041A1 (en) | 2015-05-14 |
KR20150020204A (ko) | 2015-02-25 |
JPWO2013175709A1 (ja) | 2016-01-12 |
CN104335111A (zh) | 2015-02-04 |
JP5857125B2 (ja) | 2016-02-10 |
EP2857894A4 (en) | 2015-06-17 |
SG11201407574RA (en) | 2014-12-30 |
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