WO2013166798A1 - Thinned sound chamber device - Google Patents

Thinned sound chamber device Download PDF

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Publication number
WO2013166798A1
WO2013166798A1 PCT/CN2012/082258 CN2012082258W WO2013166798A1 WO 2013166798 A1 WO2013166798 A1 WO 2013166798A1 CN 2012082258 W CN2012082258 W CN 2012082258W WO 2013166798 A1 WO2013166798 A1 WO 2013166798A1
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WO
WIPO (PCT)
Prior art keywords
sound chamber
chamber
speaker
sound
front cover
Prior art date
Application number
PCT/CN2012/082258
Other languages
French (fr)
Chinese (zh)
Inventor
曾元清
Original Assignee
广东欧珀移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2013166798A1 publication Critical patent/WO2013166798A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the utility model relates to a sound chamber device, in particular to a thin sound chamber device mainly used in a mobile phone and an electronic digital product thereof.
  • the speaker unit In order to ensure the problem of sound quality and volume difference caused by the interference of sound waves before and after the speaker, the speaker unit is sealed in the casing, so that the acoustic short circuit phenomenon can be prevented.
  • Commonly used sound chamber structures are constructed in a 'sandwich' structure, that is, a structure in which a speaker unit, a sealed bubble surface, and a sound chamber housing form a seal, which not only reduces the efficiency of the speaker but also the bass performance of the speaker. Negative effects.
  • the volume of the speaker cavity is usually increased by increasing the thickness of the sound cavity, thereby improving the efficiency of the speaker. Although this increase the efficiency of the speaker, it will affect the thickness of the mobile electronic device.
  • the technical problem to be solved by the present invention is to provide a thinned sound chamber device with good sound quality and thin overall thickness.
  • the present invention adopts the following technical solutions:
  • a thin sound chamber device comprises a speaker and a sound chamber upper shell and a sound chamber lower shell, wherein the speaker is fixed to the sound chamber upper shell and the sound chamber lower shell, and the sound chamber upper shell and the lower shell are covered
  • the speaker comprises a magnetic bowl and a front cover, the lower chamber of the sound chamber is attached to the magnetic bowl, the front cover is attached to the upper casing of the sound chamber, and the magnetic bowl, the front cover, the upper chamber of the sound chamber and the lower housing of the sound chamber are formed.
  • the sound chamber is sealed, and the rear sound hole of the speaker is located in the sound chamber.
  • the magnetic bowl of the speaker is bonded to the lower chamber of the sound chamber by glue.
  • the magnetic bowl of the speaker is directly injection molded in the mold with the lower chamber of the sound chamber.
  • the front cover of the speaker is glued to the upper chamber of the sound chamber.
  • the front cover of the speaker and the upper chamber of the sound chamber are integrally formed.
  • the utility model effectively reduces the overall thickness of the sound chamber, thereby reducing the overall thickness of the device for assembling the sound chamber device and improving the sound quality effect.
  • the sound cavity structure is no longer a bottleneck for the thickness of mobile electronic devices, and can be widely used in electronic digital products such as mobile phones.
  • Figure 1 is a schematic front view of the utility model
  • Figure 2 is a schematic cross-sectional view taken along the line A-A of Figure 1;
  • Figure 3 is a perspective view of a perspective view of another perspective of the present invention.
  • the present invention discloses a thinned sound chamber device comprising a speaker 2 and a sound chamber upper housing 31, a sound chamber lower housing 32, a speaker 2 and a sound chamber upper housing 31.
  • the sound chamber upper housing 31 and the sound chamber lower housing 32 are fixedly mounted, and the speaker 2 includes a magnetic bowl 22 and a front cover 21, and the sound chamber lower housing 32 is attached to the magnetic bowl 22.
  • the front cover 21 is attached to the upper chamber 31 of the sound chamber, and the magnetic bowl 22, the front cover 21, the upper chamber upper casing 31 and the lower chamber housing 32 form a sealed sound chamber 3, and the rear sound hole 23 of the speaker 2 Located in the sound chamber 3.
  • the magnetic bowl 22 of the speaker 2 is glued to the lower chamber 32 of the sound chamber, or the magnetic bowl 22 and the lower chamber 32 are injection molded by the in-mold insert.
  • the front cover 21 of the speaker 2 is glued to the upper chamber 31 of the sound chamber, or the front cover and the upper casing of the sound chamber are integrally formed as a separate component.
  • the magnetic bowl of the speaker forms a plane with the lower casing of the sound chamber, and the front cover of the speaker and the upper casing of the sound chamber form a plane to ensure the sealing of the sound chamber.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A thinned sound chamber device comprising a speaker (2), a sound chamber upper housing (31), and a sound chamber lower housing (32). The speaker (2) is fixed with the sound chamber upper housing (31) and the sound chamber lower housing (32). The sound chamber upper housing (31) and the sound chamber lower housing (32) are fitted with each other. The speaker (2) comprises a ceramic bowl (22) and a front hood (21). The sound chamber lower housing (32) is fitted with the ceramic bowl (22). The front hood (21) is attached to the sound chamber upper housing (31). The ceramic bowl (22), the front hood (21), the sound chamber upper housing (31), and the sound chamber lower housing (32) compose a sealed sound chamber (3), while a rear sound outlet opening (23) of the speaker (2) is arranged within the sound chamber (3). By reducing the overall thickness of the sound chamber, the overall thickness of a corresponding mobile electronic device is reduced, while at the same time, the speaker sound quality of the device is improved.

Description

一种薄型化音腔装置  Thin type sound chamber device
技术领域  Technical field
本实用新型涉及一种音腔装置，具体地说是一种主要应用在手机及其电子数码产品上的薄型化音腔装置。  The utility model relates to a sound chamber device, in particular to a thin sound chamber device mainly used in a mobile phone and an electronic digital product thereof.
背景技术 Background technique
为了保证扬声器前后的声波干涉而导致音质和音量差的问题，因此都采用将扬声器单元密封在壳体内，这样可以防止声短路现象。常用的音腔结构都是采用'三明治'的结构方式，即扬声器单元、密封泡面和音腔壳体之间形成密封的结构，这样不仅降低了扬声器的使用效率，而且还可对扬声器的低音性能造成负面影响。为了解决这一现象，通常会通过增加音腔的厚度来增加扬声器音腔的容积，从而提高扬声器的使用效率。此举虽然提高了扬声器的使用效率，但势必影响移动电子设备的整机厚度。 In order to ensure the problem of sound quality and volume difference caused by the interference of sound waves before and after the speaker, the speaker unit is sealed in the casing, so that the acoustic short circuit phenomenon can be prevented. Commonly used sound chamber structures are constructed in a 'sandwich' structure, that is, a structure in which a speaker unit, a sealed bubble surface, and a sound chamber housing form a seal, which not only reduces the efficiency of the speaker but also the bass performance of the speaker. Negative effects. In order to solve this phenomenon, the volume of the speaker cavity is usually increased by increasing the thickness of the sound cavity, thereby improving the efficiency of the speaker. Although this increase the efficiency of the speaker, it will affect the thickness of the mobile electronic device.
发明内容 Summary of the invention
本实用新型要解决的技术问题是提供一种音质效果佳、整体厚度较薄的薄型化音腔装置。  The technical problem to be solved by the present invention is to provide a thinned sound chamber device with good sound quality and thin overall thickness.
为了解决上述技术问题，本发明采取以下技术方案： In order to solve the above technical problems, the present invention adopts the following technical solutions:
一种薄型化音腔装置，包括扬声器和音腔上壳体、音腔下壳体，扬声器与音腔上壳体和音腔下壳体相固定，所音腔上壳体和下壳体相盖装，扬声器包括磁碗和前罩，音腔下壳体与磁碗装接，前罩与音腔上壳体装接，磁碗、前罩、音腔上壳体及音腔下壳体组成一密封音腔，且扬声器的后出声孔位于该音腔内。 A thin sound chamber device comprises a speaker and a sound chamber upper shell and a sound chamber lower shell, wherein the speaker is fixed to the sound chamber upper shell and the sound chamber lower shell, and the sound chamber upper shell and the lower shell are covered The speaker comprises a magnetic bowl and a front cover, the lower chamber of the sound chamber is attached to the magnetic bowl, the front cover is attached to the upper casing of the sound chamber, and the magnetic bowl, the front cover, the upper chamber of the sound chamber and the lower housing of the sound chamber are formed. The sound chamber is sealed, and the rear sound hole of the speaker is located in the sound chamber.
所述扬声器的磁碗与音腔下壳体通过胶水粘接。 The magnetic bowl of the speaker is bonded to the lower chamber of the sound chamber by glue.
所述扬声器的磁碗与音腔下壳体在模内直接注塑成型。 The magnetic bowl of the speaker is directly injection molded in the mold with the lower chamber of the sound chamber.
所述扬声器的前罩与音腔上壳体通过胶水粘接。 The front cover of the speaker is glued to the upper chamber of the sound chamber.
所述扬声器的前罩与音腔上壳体为一体成型结构。 The front cover of the speaker and the upper chamber of the sound chamber are integrally formed.
本实用新型有效降低音腔的整体厚度，从而使装配该类音腔装置的设备的整体厚度也降低，并且提高了音质效果， 使音腔结构不再成为移动电子设备厚度的瓶颈，可广泛应用在手机等电子数码产品内。 The utility model effectively reduces the overall thickness of the sound chamber, thereby reducing the overall thickness of the device for assembling the sound chamber device and improving the sound quality effect. The sound cavity structure is no longer a bottleneck for the thickness of mobile electronic devices, and can be widely used in electronic digital products such as mobile phones.
附图说明DRAWINGS
附图1为本实用新型主视结构示意图； Figure 1 is a schematic front view of the utility model;
附图2为附图1的A-A向剖面结构示意图； Figure 2 is a schematic cross-sectional view taken along the line A-A of Figure 1;
附图3为本实用新型另一视角的立体结构示意图。 Figure 3 is a perspective view of a perspective view of another perspective of the present invention.
具体实施方式 detailed description
为了便于本领域技术人员的理解，下面结合附图对本实用新型作进一步的描述。  In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the accompanying drawings.
如附图1、2、3所示，本实用新型揭示了一种薄型化音腔装置，包括扬声器2和音腔上壳体31、音腔下壳体32，扬声器2与音腔上壳体31和音腔下壳体32相固定，所音腔上壳体31和音腔下壳体32相盖装，扬声器2包括磁碗22和前罩21，音腔下壳体32与磁碗22装接，前罩21与音腔上壳体31装接，磁碗22、前罩21、音腔上壳体31及音腔下壳体32组成一密封音腔3，且扬声器2的后出声孔23位于该音腔3内。扬声器2的磁碗22与音腔下壳体32通过胶水粘接，或者磁碗22与音腔下壳体32通过模内嵌件注塑成型。扬声器2的前罩21与音腔上壳体31通过胶水粘接，或者前罩与音腔上壳体为一体成型为一个独立的部件。扬声器的磁碗与音腔下壳体组成一平面，扬声器的前罩与音腔上壳体组成一平面，保证音腔的密封性。 As shown in Figures 1, 2 and 3, the present invention discloses a thinned sound chamber device comprising a speaker 2 and a sound chamber upper housing 31, a sound chamber lower housing 32, a speaker 2 and a sound chamber upper housing 31. The sound chamber upper housing 31 and the sound chamber lower housing 32 are fixedly mounted, and the speaker 2 includes a magnetic bowl 22 and a front cover 21, and the sound chamber lower housing 32 is attached to the magnetic bowl 22. The front cover 21 is attached to the upper chamber 31 of the sound chamber, and the magnetic bowl 22, the front cover 21, the upper chamber upper casing 31 and the lower chamber housing 32 form a sealed sound chamber 3, and the rear sound hole 23 of the speaker 2 Located in the sound chamber 3. The magnetic bowl 22 of the speaker 2 is glued to the lower chamber 32 of the sound chamber, or the magnetic bowl 22 and the lower chamber 32 are injection molded by the in-mold insert. The front cover 21 of the speaker 2 is glued to the upper chamber 31 of the sound chamber, or the front cover and the upper casing of the sound chamber are integrally formed as a separate component. The magnetic bowl of the speaker forms a plane with the lower casing of the sound chamber, and the front cover of the speaker and the upper casing of the sound chamber form a plane to ensure the sealing of the sound chamber.
以上所述并非是对本实用新型技术方案的限定，在不脱离本实用新型的发明构思的前提下任何显而易见的替换均在本实用新型的保护范围之内。 The above description is not intended to limit the technical solutions of the present invention, and any obvious alternatives are within the scope of the present invention without departing from the inventive concept.

Claims (5)

  1. 一种薄型化音腔装置，包括扬声器（2）和音腔上壳体（31）、音腔下壳体（32），扬声器与音腔上壳体和音腔下壳体相固定，其特征在于：所音腔上壳体和音腔下壳体相盖装，扬声器包括磁碗（22）和前罩（21），音腔下壳体与磁碗装接，前罩与音腔上壳体装接，磁碗、前罩、音腔上壳体及音腔下壳体组成一密封音腔（3），且扬声器的后出声孔（23）位于该音腔内。 A thinned sound chamber device comprises a speaker (2) and a sound chamber upper casing (31) and a sound chamber lower casing (32). The speaker is fixed to the sound chamber upper casing and the sound chamber lower casing, and is characterized in that: The upper chamber of the sound chamber is covered with the lower casing of the sound chamber, and the speaker comprises a magnetic bowl (22) and a front cover (21). The lower chamber of the sound chamber is attached to the magnetic bowl, and the front cover is attached to the upper chamber of the sound chamber. The magnetic bowl, the front cover, the upper chamber of the sound chamber and the lower chamber of the sound chamber form a sealed sound chamber (3), and the rear sound hole (23) of the speaker is located in the sound chamber.
  2. 根据权利要求1所述的薄型化音腔装置，其特征在于：所述扬声器的磁碗与音腔下壳体通过胶水粘接。  The thinned sound chamber device according to claim 1, wherein the magnetic bowl of the speaker is bonded to the lower chamber of the sound chamber by glue.
  3. 根据权利要求1所述的薄型化音腔装置，其特征在于：所述扬声器的磁碗与音腔下壳体在模内直接注塑成型。 The thinned sound chamber device according to claim 1, wherein the magnetic bowl of the speaker and the lower chamber of the sound chamber are directly injection molded in the mold.
  4. 根据权利要求1所述的薄型化音腔装置，其特征在于：所述扬声器的前罩与音腔上壳体通过胶水粘接。 The thinned sound chamber device according to claim 1, wherein the front cover of the speaker is bonded to the upper chamber of the sound chamber by glue.
  5. 根据权利要求1或4所述的薄型化音腔装置，其特征在于：所述扬声器的前罩与音腔上壳体为一体成型结构。 The thinned sound chamber device according to claim 1 or 4, wherein the front cover of the speaker and the upper chamber of the sound chamber are integrally formed.
PCT/CN2012/082258 2012-05-11 2012-09-28 Thinned sound chamber device WO2013166798A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN 201220209141 CN202587300U (en) 2012-05-11 2012-05-11 Thin-type sound cavity device
CN201220209141.0 2012-05-11

Publications (1)

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WO2013166798A1 true WO2013166798A1 (en) 2013-11-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107948892A (en) * 2017-12-20 2018-04-20 东莞迪芬尼电声科技有限公司 The micro injection bonded structure and its processing method of a kind of loudspeaker

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10129619B2 (en) 2015-09-15 2018-11-13 Goertek Inc. Receiver

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1383346A (en) * 2001-04-23 2002-12-04 日本电气株式会社 Loudspeaker system
US20050190941A1 (en) * 2004-02-03 2005-09-01 Benq Corporation Resonance chamber of a cellular phone
CN101056327A (en) * 2006-04-12 2007-10-17 富准精密工业(深圳)有限公司 Mobile phone and its sound box structure
CN101170311B (en) * 2006-10-25 2012-02-22 Lg电子株式会社 Mobile communication device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1383346A (en) * 2001-04-23 2002-12-04 日本电气株式会社 Loudspeaker system
US20050190941A1 (en) * 2004-02-03 2005-09-01 Benq Corporation Resonance chamber of a cellular phone
CN101056327A (en) * 2006-04-12 2007-10-17 富准精密工业(深圳)有限公司 Mobile phone and its sound box structure
CN101170311B (en) * 2006-10-25 2012-02-22 Lg电子株式会社 Mobile communication device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107948892A (en) * 2017-12-20 2018-04-20 东莞迪芬尼电声科技有限公司 The micro injection bonded structure and its processing method of a kind of loudspeaker
CN107948892B (en) * 2017-12-20 2023-12-01 东莞迪芬尼电声科技有限公司 Micro injection molding bonding structure of loudspeaker and processing method thereof

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