CN204906711U - Surface mounting formula electret capacitor microphone - Google Patents
Surface mounting formula electret capacitor microphone Download PDFInfo
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- CN204906711U CN204906711U CN201520463707.6U CN201520463707U CN204906711U CN 204906711 U CN204906711 U CN 204906711U CN 201520463707 U CN201520463707 U CN 201520463707U CN 204906711 U CN204906711 U CN 204906711U
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- tai
- pcb board
- discharge duct
- air discharge
- cavity
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a surface mounting formula electret capacitor microphone, it includes: PCB board, copper ring, cavity, the back of the body utmost point, gasket, vibrating diaphragm, becket and the shell of mutually supporting and installing, the PCB board as the bearing part of whole microphone, be provided with on this PCB board and be used for a plurality of xi tai of welded, height such as this xitai, and be formed with the air discharge duct between the two adjacent tin platforms, this air discharge duct extends to PCB flange reason. The utility model discloses the structure is very simple, just owing to respectively be formed with air discharge duct between first xi tai who sets up and the second tin platform and between the two adjacent second tin platforms on the PCB board, consequently is in the utility model discloses carry on reflow soldering when welding with outer subsides pad, first, second xi tai and the air that pastes outward between the pad can pass through at reflow soldering melting in -process the air discharge duct discharge to stop to appear floating high phenomenon, so that can reach the welding effect and the quality of ideal, be favorable to reduction in production cost and improve market competition.
Description
Technical field:
The utility model relates to microphone product technical field, refers in particular to a kind of surface-adhered type electret capacitor microphone.
Background technology:
Electroacoustic transducer receives acoustical signal and exports the signal of telecommunication or receive the signal of telecommunication and export a kind of device of acoustical signal, and conventional has microphone, loud speaker, earphone, transmitter and receiver.Sound-electric transducer a kind ofly to be instigated by the energy in sound system, converts acoustic energy (mechanical energy) to electric flux simultaneously and be transported to the components and parts gone in electric system.Electricity-sonic transducer a kind ofly to be instigated by the energy in electricity system, electric energy conversion become machinery (acoustics) Energy transfer to the components and parts in sound system simultaneously.
Electret microphone is a kind of microphone in electroacoustic transducer, and by prior iunjected charge, polarized electret replaces the condenser microphone of polarization power supply for it.Electret microphone has two types, and one does vibrating diaphragm with high molecular film material in body, and now, vibrating diaphragm is responsible for acoustic receiver and polarizing voltage dual role simultaneously; Another kind makees rear pole plate with electret material, and at this moment it only plays a part polarizing voltage.Because this kind of microphone does not need polarizing voltage, simplify the structure.In addition because its electroacoustic property is good, so replace the microphone of additional polarizing voltage in sound recording, public address and outdoor noise testing gradually.
Due to the development of science and technology, increasing electronic product has stopped hand assembled welding microphone, but employing and automatic sucking thereof are assembled with the technique pasted, and carries out high temperature reflux welding by Reflow Soldering.But, because electret capcitor microphone is when with outer subsides pad pasting board, due to the impact of Reflow Soldering pulling force, there will be floating high phenomenon after having microphone to mount, thus affect overall structure assembling, so that do not reach perfect condition after welding, greatly may need to do over again, be unfavorable for reducing production cost and improving the market competitiveness.
Utility model content:
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of surface-adhered type electret capacitor microphone.
In order to solve the problems of the technologies described above, the utility model have employed following technical proposals: this surface-adhered type electret capacitor microphone comprises: cooperatively interact pcb board, copper ring, cavity, backplane, pad, vibrating diaphragm, becket and the shell installed, described pcb board is as the bearing part of whole microphone, this pcb board is provided with the some Xi Tai for welding, this tin platform is contour, and being formed with air discharge duct between adjacent two tin platforms, this air discharge duct extends to pcb board edge.
Furthermore, in technique scheme, described Xi Tai comprises: the second Xi Tai that the first Xi Tai and four being arranged at pcb board center is symmetrically set outside the first tin platform, wherein, is formed with described air discharge duct respectively between the second tin platform and between the second Xi Tai and the first tin platform.
Furthermore, in technique scheme, described first tin platform is rounded.
Furthermore, in technique scheme, described second Xi Tai is fan-shaped.
Furthermore, in technique scheme, described copper ring and cavity are installed on pcb board, and copper ring is positioned at inside cavities; Described backplane is arranged on copper ring, and flushes with cavity port; Described pad is arranged on backplane and cavity, and described vibrating diaphragm is arranged on pad; Described becket is arranged on vibrating diaphragm; Copper ring, cavity, backplane, pad, vibrating diaphragm, becket are fixed on pcb board by described shell.
Furthermore, in technique scheme, described shell is provided with the tone-entering hole corresponding with the hole of becket; Described backplane is provided with through hole.
Furthermore, in technique scheme, described shell is provided with high temperature resistant dustproof cloth, this high temperature resistant dustproof cloth is covered on described tone-entering hole.
After adopting technique scheme, the utility model has following beneficial effect compared with prior art: the utility model structure is very simple, and due between the first Xi Tai that pcb board is arranged and the second tin platform and be formed with air discharge duct respectively between adjacent two second tin platforms, so that the utility model and outer subsides pad carry out Reflow Soldering weld time, first, air between second Xi Tai and outer subsides pad can be discharged by described air discharge duct in Reflow Soldering melting process, thus stop to occur floating high phenomenon, so that desirable welding effect and quality can be reached, be conducive to reducing production cost and improving the market competitiveness.
Accompanying drawing illustrates:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is vertical view of the present utility model;
Embodiment:
Below in conjunction with specific embodiments and the drawings, the utility model is further illustrated.
See shown in Fig. 1,2, be a kind of surface-adhered type electret capacitor microphone, it comprises: cooperatively interact pcb board 1, copper ring 2, cavity 3, backplane 4, pad 5, vibrating diaphragm 6, becket 7 and the shell 8 installed.
Specifically, described copper ring 2 and cavity 3 are installed on pcb board 1, and copper ring 2 is positioned at inside cavity 3; Described backplane 4 is arranged on copper ring 2, and flushes with cavity 3 port; Described pad 5 is arranged at backplane 4 with on cavity 3, and described vibrating diaphragm 6 is arranged on pad 5; Described becket 7 is arranged on vibrating diaphragm 6; Copper ring 2, cavity 3, backplane 4, pad 5, vibrating diaphragm 6, becket 7 are fixed on pcb board 1 by described shell 8.
Described shell 8 is provided with the tone-entering hole 81 corresponding with the hole of becket 7; Described backplane 4 is provided with through hole 41.In addition, described shell 8 is provided with high temperature resistant dustproof cloth 82, this high temperature resistant dustproof cloth 82 is covered on described tone-entering hole 81.
Described pcb board 1 is as the bearing part of whole microphone, and this pcb board 1 is provided with the some tin platforms 11 for welding, this tin platform 11 is contour, and is formed with air discharge duct 110 between adjacent two tin platforms 11, and this air discharge duct 110 extends to pcb board 1 edge.Specifically, described tin platform 11 comprises: the first tin platform 111 and four the second tin platforms 112 be symmetrically set outside the first tin platform 111 that are arranged at pcb board 1 center, wherein, described air discharge duct 110 is formed with respectively between the second tin platform 112 and between the second tin platform 112 and the first tin platform 111.Wherein, described first tin platform 111 is rounded; Described second tin platform 112 is in fan-shaped.
Described pcb board 1 is provided with resistance or electric capacity.
The utility model structure is very simple, and due on pcb board 1 arrange the first tin platform 111 and the second tin platform 112 between and be formed with air discharge duct 110 respectively between adjacent two second tin platforms 112, so that the utility model and outer subsides pad carry out Reflow Soldering weld time, air between first, second tin platform 112 and outer subsides pad can be discharged by described air discharge duct in Reflow Soldering melting process, thus stop to occur floating high phenomenon, so that desirable welding effect and quality can be reached, be conducive to reducing production cost and improving the market competitiveness.
Certainly, the foregoing is only specific embodiment of the utility model, be not limit the utility model practical range, all equivalences done according to structure, feature and principle described in the utility model claim change or modify, and all should be included in the utility model claim.
Claims (7)
1. surface-adhered type electret capacitor microphone, it is characterized in that: it comprises: cooperatively interact the pcb board (1) installed, copper ring (2), cavity (3), backplane (4), pad (5), vibrating diaphragm (6), becket (7) and shell (8), described pcb board (1) is as the bearing part of whole microphone, this pcb board (1) is provided with the some Xi Tai (11) for welding, this Xi Tai (11) is contour, and be formed with air discharge duct (110) between adjacent two Xi Tai (11), this air discharge duct (110) extends to pcb board (1) edge.
2. surface-adhered type electret capacitor microphone according to claim 1, it is characterized in that: described Xi Tai (11) comprising: the first Xi Tai (111) and four the second Xi Tai (112) be symmetrically set outside the first Xi Tai (111) that are arranged at pcb board (1) center, wherein, described air discharge duct (110) is formed with respectively between the second Xi Tai (112) and between the second Xi Tai (112) and the first Xi Tai (111).
3. surface-adhered type electret capacitor microphone according to claim 2, is characterized in that: described first Xi Tai (111) is rounded.
4. surface-adhered type electret capacitor microphone according to claim 2, is characterized in that: described second Xi Tai (112) is in fan-shaped.
5. surface-adhered type electret capacitor microphone according to claim 1, it is characterized in that: described copper ring (2) and cavity (3) are installed on pcb board (1), and copper ring (2) is positioned at cavity (3) inner side; Described backplane (4) is arranged on copper ring (2), and flushes with cavity (3) port; Described pad (5) is arranged at backplane (4) with on cavity (3), and described vibrating diaphragm (6) is arranged on pad (5); Described becket (7) is arranged on vibrating diaphragm (6); Copper ring (2), cavity (3), backplane (4), pad (5), vibrating diaphragm (6), becket (7) are fixed on pcb board (1) by described shell (8).
6. surface-adhered type electret capacitor microphone according to claim 1, is characterized in that: described shell (8) is provided with the tone-entering hole (81) corresponding with the hole of becket (7); Described backplane (4) is provided with through hole (41).
7. surface-adhered type electret capacitor microphone according to claim 6, it is characterized in that: described shell (8) is provided with high temperature resistant dustproof cloth (82), this high temperature resistant dustproof cloth (82) is covered on described tone-entering hole (81).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520463707.6U CN204906711U (en) | 2015-07-01 | 2015-07-01 | Surface mounting formula electret capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520463707.6U CN204906711U (en) | 2015-07-01 | 2015-07-01 | Surface mounting formula electret capacitor microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204906711U true CN204906711U (en) | 2015-12-23 |
Family
ID=54928848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520463707.6U Expired - Fee Related CN204906711U (en) | 2015-07-01 | 2015-07-01 | Surface mounting formula electret capacitor microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204906711U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951958A (en) * | 2019-04-24 | 2019-06-28 | 深圳市众合智联科技有限公司 | Ultrathin surface-mount formula gas flow transducer |
| CN110662149A (en) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | MEMS microphone |
| CN112218219A (en) * | 2020-12-10 | 2021-01-12 | 山东新港电子科技有限公司 | Electret microphone suitable for high-temperature backflow |
-
2015
- 2015-07-01 CN CN201520463707.6U patent/CN204906711U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951958A (en) * | 2019-04-24 | 2019-06-28 | 深圳市众合智联科技有限公司 | Ultrathin surface-mount formula gas flow transducer |
| CN109951958B (en) * | 2019-04-24 | 2024-03-22 | 深圳市众合智联科技有限公司 | Ultrathin surface-mounted airflow sensor |
| CN110662149A (en) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | MEMS microphone |
| CN112218219A (en) * | 2020-12-10 | 2021-01-12 | 山东新港电子科技有限公司 | Electret microphone suitable for high-temperature backflow |
| CN112218219B (en) * | 2020-12-10 | 2021-02-26 | 山东新港电子科技有限公司 | Electret microphone suitable for high-temperature backflow |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20160701 |