WO2013166788A1

WO2013166788A1 - Surface-mounted fuse

Info

Publication number: WO2013166788A1
Application number: PCT/CN2012/079485
Authority: WO
Inventors: 田伟; 龚建; 仇利民; 杨兆国
Original assignee: 苏州晶讯科技股份有限公司
Priority date: 2012-05-10
Filing date: 2012-08-01
Publication date: 2013-11-14
Also published as: CN102664127B; CN102664127A

Abstract

A surface-mounted fuse comprises a fusing chip (1). The fusing chip mainly consists of terminal electrodes (2), a ceramic substrate (3), a fusing body layer (4), and an arc extinction glass layer (5). The fusing body layer is located on an upper surface of the ceramic substrate. The two terminal electrodes are located on two sides of the fusing body layer respectively, and are electrically connected to the fusing body layer. The arc extinction glass layer covers the fusing body layer and the regions, close to the arc extinction glass layer, of the terminal electrodes. The surface-mounted fuse further comprises a fuse body (7) having a round through hole (6) in the middle. The fusing chip is located in the round through hole of the fuse body. Two metal covers (8) are located at two ends of the fuse body respectively, and cover the round through hole to form an enclosed chamber. The terminal electrodes are electrically connected to the metal covers through solder lugs (9). The surface-mounted can endure high temperature, has high strength, and can wrap a fuse wire and the arc extinction glass therein. The overall strength, the breaking capability, and the resistance to cold and hot shocks of the fuse are improved, and mass production is convenient.

Description

表面贴装熔断器技术领域 Surface mount fuses

[0001] 本发明涉及熔断器技术领域，具体涉及一种高电压，高可靠性表面贴装熔断器。背景技术 [0001] The present invention relates to the field of fuse technologies, and in particular, to a high voltage, high reliability surface mount fuse. Background technique

[0002] 表面贴装熔断器主要应用于印刷电路板和其它电路的过流保护，其原理在于当电路发生故障或异常时，熔断器金属熔体自身熔断切断电流实现保护电路。 [0002] Surface mount fuses are mainly used for overcurrent protection of printed circuit boards and other circuits. The principle is that when the circuit malfunctions or is abnormal, the fuse metal melt itself fuses and cuts off the current to realize the protection circuit.

[0003] 现有的表面贴装熔断器及其制作有：独石工艺制作的熔断器、片阻工艺制作的熔断器和在绝缘体内穿金属丝的熔断器。独石工艺制作的方法是在陶瓷生坯基板上通过厚膜印刷一层或多层熔体，经过横向和纵向切割形成单个元件的生坯，再经过共烧、封端及电镀得到，其优点是其玻璃陶瓷具有较强的灭弧能力，因此能达到较大的分断能力，缺点是它的制作周期较长，熔断体与生坯共烧时存在相互渗透风险而导致一致性不佳；片阻工艺是一个很成熟的工艺，其基本工艺是首先提供具有正反面的绝缘基片，基片上有横向和纵向的切槽，从而将基片分割成多个矩形单元，随后在基片上的各单元上分别形成表电极、背电极和熔体以及覆盖熔体的保护层，将基片沿纵向切槽分割为多条基片，在各条基片的两侧端面上形成端头内电极，最后将各条基片按横向切槽分割成多个矩形单元从而得到所需要的芯片，其优点是工艺制造流程简单，制作周期短，能大批量生产，其缺点是不能应用在高电压、高可靠性环境中；在绝缘体内穿金属丝的熔断器最常见的是将熔丝传人陶瓷体内空腔后再与端电极相联，其优点是该熔断器分断能力较大，且一致性也较好，缺点是熔丝细小易断，穿丝工艺复杂，效率低下，很难进行大批量的制作，且熔丝形状可设计受限。 [0003] Existing surface mount fuses and their fabrication include: a fuse fabricated by a monolithic process, a fuse fabricated by a chip resistance process, and a fuse through which a wire is wound in an insulator. The monolithic process is produced by printing one or more layers of melt on a ceramic green substrate through a thick film, and cutting the green body of a single component through transverse and longitudinal cutting, and then co-firing, capping and electroplating, the advantages thereof. The glass ceramic has strong arc-extinguishing ability, so it can achieve a large breaking capacity. The disadvantage is that its production cycle is long, and there is a risk of mutual penetration when the fuse-link and the green body are co-fired, resulting in poor consistency; The resistive process is a very mature process. The basic process is to first provide an insulating substrate having front and back sides. The substrate has lateral and longitudinal slits to divide the substrate into a plurality of rectangular cells, and then on the substrate. Forming a surface electrode, a back electrode and a melt, and a protective layer covering the melt, respectively, the substrate is divided into a plurality of substrates along the longitudinal slit, and the end internal electrodes are formed on both end faces of each of the substrates. Finally, each substrate is divided into a plurality of rectangular units by lateral slitting to obtain a desired chip, which has the advantages of simple process flow, short production cycle, and large batch size. The disadvantage is that it cannot be used in high voltage and high reliability environments. The fuse that wears wire in the insulator is most commonly used to transfer the fuse to the cavity inside the ceramic body and then to the terminal electrode. The fuse has a large breaking capacity and good consistency. The disadvantages are that the fuse is small and easy to break, the threading process is complicated, the efficiency is low, it is difficult to carry out mass production, and the fuse shape can be limited in design.

发明内容 Summary of the invention

[0004] 本发明目的是提供一种表面贴装熔断器，此表面贴装熔断器具有耐高温、高强度，能很好地将熔丝与灭弧玻璃包裹在内，大大的提高熔断器的整体强度和分断能力以及耐冷热冲击能力，且便于大批量生产。 [0004] An object of the present invention is to provide a surface mount fuse having high temperature resistance and high strength, which can well wrap a fuse and an arc extinguishing glass, and greatly improve the fuse. Overall strength and breaking capacity as well as resistance to thermal shock, and easy to mass production.

[0005] 为达到上述目的，本发明采用的技术方案是： [0005] In order to achieve the above object, the technical solution adopted by the present invention is:

一种表面贴装熔断器，包括熔断芯片，此熔断芯片主要由两个端电极、陶瓷基片、熔体层和灭弧玻璃层组成，所述熔体层位于陶瓷基片上表面，两个所述端电极分别位于熔体层两侧并与所述熔体层电连接，所述灭弧玻璃层覆盖于所述熔体层和端电极中靠熔体层的区域，还包括一中间具有圆形通孔的熔断本体，所述熔断芯片位于此熔断本体的圆形通孔内，两个金属盖分别位于所述熔断本体两端并覆盖其圆形通孔从而形成密闭腔，所述端电极通过焊片与所述金属盖电连接。 A surface mount fuse comprising a fuse chip, the fuse chip mainly comprising two end electrodes, a ceramic substrate, a melt layer and an arc extinguishing glass layer, the melt layer being located on the upper surface of the ceramic substrate, the two The end electrodes are respectively located on both sides of the melt layer and electrically connected to the melt layer, and the arc extinguishing glass layer covers the melt layer and the region of the end electrode in the melt layer, and further includes a circle in the middle a fuse body of the through hole, the fuse chip is located in the circular through hole of the fuse body, and two metal covers are respectively located at two ends of the fuse body and cover the circular through hole thereof to form a closed cavity, the terminal electrode Through the soldering piece The metal cover is electrically connected.

[0006] 上述技术方案中进一步改进的技术方案如下： [0006] The technical solution further improved in the above technical solution is as follows:

1、上述方案中，所述圆形通孔内熔断芯片和熔断本体之间填充有缓冲层，此缓冲层为二氧化硅改性的硅胶，其中二氧化硅含量 20%~60%。 1. In the above solution, a buffer layer is filled between the fuse chip and the fuse body in the circular via hole, and the buffer layer is silica-modified silica gel, wherein the silicon dioxide content is 20% to 60%.

[0007] 2、上述方案中，所述熔断本体材料为氧化锆和氧化铝的复合陶瓷，其中氧化锆含量 5%~20%。 [0007] 2. In the above solution, the fuse body material is a composite ceramic of zirconia and alumina, wherein the zirconia content is 5% to 20%.

[0008] 3、上述方案中，所述陶瓷基片材料为镁橄榄石陶瓷。 [0008] 3. In the above solution, the ceramic substrate material is forsterite ceramic.

[0009] 4、上述方案中，所述陶瓷基片和熔体层之间设置有玻璃釉层。 [0009] 4. In the above solution, a glass glaze layer is disposed between the ceramic substrate and the melt layer.

[0010] 5、上述方案中，所述端电极由表电极、背电极和侧电极组成，此表电极位于所述熔体层一侧，所述端电极中靠熔体层的区域为此表电极中的部分区域，所述背电极位于所述陶瓷基片下表面，所述侧电极电连接所述表电极和背电极；所述表电极中未被所述灭弧玻璃层覆盖的区域通过所述焊片与所述金属盖电连接。 [0010] 5. In the above solution, the terminal electrode is composed of a surface electrode, a back electrode and a side electrode, the surface electrode is located on one side of the melt layer, and the region of the end electrode in the melt layer is a partial region of the electrode, the back electrode is located on a lower surface of the ceramic substrate, the side electrode is electrically connected to the surface electrode and the back electrode; and a region of the surface electrode not covered by the arc extinguishing glass layer passes The solder tab is electrically connected to the metal cover.

[0011] 6、上述方案中，所述金属盖与熔断本体侧面之间设置有金属层。 [0011] 6. In the above aspect, a metal layer is disposed between the metal cover and the side surface of the fuse body.

[0012] 7、上述方案中，一保护层覆盖于所述灭弧玻璃层和端电极表面，此保护层为矿物改性的双酚类树脂，矿物含量 40%~50%。 [0012] 7. In the above solution, a protective layer covers the surface of the arc extinguishing glass layer and the terminal electrode, and the protective layer is a mineral modified bisphenol resin with a mineral content of 40% to 50%.

[0013] 由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果： [0013] Due to the above technical solutions, the present invention has the following advantages and effects compared with the prior art:

1、本发明提供的表面贴装熔断器，与独石工艺制作的熔断器相比，其同样具备较大的分断能力，并且制作周期短；本发明是在制备有高软化点的致密的绝缘玻璃釉层的陶瓷基片上，通过厚膜印刷、分步烧结工艺制作熔丝层，因此不存在类似于独石工艺的熔丝与基材共烧时相互渗透问题，进而不存在因熔丝渗透而导致的芯片一致性不佳问题。 1. The surface mount fuse provided by the invention has the same large breaking capacity and short manufacturing cycle as compared with the fuse made by the monolith process; the invention is to prepare dense insulation with high softening point. On the ceramic substrate of the glass glaze layer, the fuse layer is formed by thick film printing and step-by-step sintering process, so there is no mutual penetration problem when the fuse and the substrate are co-fired similarly to the monolithic process, and there is no penetration due to the fuse. The resulting chip consistency is not good.

[0014] 2、本发明提供的表面贴装熔断器，与片阻工艺制作的熔断器相比，其同样能进行大批量生产，另外其熔断器本体材料具有耐高温、高强度，因此能很好地将熔丝与灭弧玻璃包裹在内，大大的提高熔断器的整体强度和分断能力以及耐冷热冲击能力。此工艺制作的熔断器能应用在高电压、高可靠性环境中。 [0014] 2. The surface mount fuse provided by the present invention can also be mass-produced compared with the fuse fabricated by the chip resistance process, and the fuse body material has high temperature resistance and high strength, so The fuse and the arc extinguishing glass are well wrapped, which greatly improves the overall strength and breaking capacity of the fuse and the resistance to thermal shock. The fuses produced by this process can be used in high voltage, high reliability environments.

[0015] 3、本发明提供的表面贴装熔断器，与在绝缘体内穿金属丝的熔断器相比，其分断能力也较大，且一致性也较好，并且其工艺简单，效率高，能大批量生产，焊接可靠性也较好，特别是熔丝形状可任意设计。 [0015] 3. The surface mount fuse provided by the invention has larger breaking capacity and better consistency than the fuse wearing the wire in the insulator, and the process is simple and the efficiency is high. It can be mass-produced, and the welding reliability is also good, especially the shape of the fuse can be arbitrarily designed.

[0016] 4. 本发明提供的表面贴装熔断器，其陶瓷基片上制作的致密的玻璃釉，具备高的软化点，低的导热系数，因此高软化点的致密玻璃釉层可避免熔丝烧结过程中相互渗透问题，另外玻璃釉其低的导热系数也克服了陶瓷基片导热系数大的问题。 [0017] 5. 本发明提供的表面贴装熔断器，其陶瓷本体为氧化锆和氧化铝的复合陶瓷，其耐高温、高强度等特性，为熔断器提供了高强度的外壳，克服了片阻工艺制作的熔断器无高强度外壳而导致分断能力不高的问题。 [0016] 4. The surface mount fuse provided by the invention has a dense glass glaze formed on the ceramic substrate, has a high softening point and a low thermal conductivity, so the dense glass glaze layer with high softening point can avoid the fuse The problem of mutual penetration during sintering, and the low thermal conductivity of the glass glaze also overcomes the problem of large thermal conductivity of the ceramic substrate. [0017] 5. The surface mount fuse provided by the invention has a ceramic body which is a composite ceramic of zirconia and alumina, which has high temperature resistance and high strength, and provides a high-strength outer casing for the fuse, and overcomes the sheet. The fuses made by the resistance process have no high-strength outer casing and cause a problem of low breaking capacity.

[0018] 6.本发明提供的表面贴装熔断器，其陶瓷基板为镁橄榄石陶瓷，其较低的导热系数，以及较高的强度等特性，能够降低熔断器热散失问题，从而降低电路能耗等问题。 [0018] 6. The surface mount fuse provided by the present invention, the ceramic substrate is forsterite ceramic, its low thermal conductivity, and high strength, etc., can reduce the heat dissipation problem of the fuse, thereby reducing the circuit Energy consumption and other issues.

[0019] 7.本发明提供的表面贴装熔断器，其结构特点为芯片与陶瓷本体之间空隙填充有缓冲层，由于缓冲层中添加有二氧化硅，也使得缓冲层具有熄灭电弧能力，缓冲层中的硅胶成分，能够在熔断器失效时，将熔断器破坏过程中的能量吸收。 [0019] 7. The surface mount fuse provided by the present invention has the structural feature that the gap between the chip and the ceramic body is filled with a buffer layer, and the buffer layer has the ability to extinguish the arc due to the addition of silicon dioxide in the buffer layer. The silica gel component of the buffer layer absorbs energy during the destruction of the fuse when the fuse fails.

附图说明 DRAWINGS

[0020] 图 1为本发明熔断本体结构示意图； 1 is a schematic structural view of a fuse body of the present invention;

图 2为本发明具有金属层的熔断本体结构示意图； 2 is a schematic view showing the structure of a fuse body having a metal layer according to the present invention;

图 3为本发明陶瓷基片结构示意图； 3 is a schematic structural view of a ceramic substrate of the present invention;

图 4为本发明具有玻璃釉层的陶瓷基片结构示意图； 4 is a schematic structural view of a ceramic substrate having a glass glaze layer according to the present invention;

图 5为本发明具有背电极的陶瓷基片结构示意图； Figure 5 is a schematic view showing the structure of a ceramic substrate having a back electrode according to the present invention;

图 6-8为本发明表面贴装熔断器制造流程示意图； 6-8 is a schematic view showing a manufacturing process of a surface mount fuse according to the present invention;

图 9为附图 6的俯视结构示意图； Figure 9 is a top plan view of Figure 6;

图 10为附图 7的俯视结构示意图； Figure 10 is a top plan view of Figure 7;

图 11为附图 8的俯视结构示意图； Figure 11 is a top plan view of Figure 8;

图 12为本发明表面贴装熔断器局部剖视结构示意图； Figure 12 is a partial cross-sectional structural view of the surface mount fuse of the present invention;

图 13为本发明表面贴装熔断器局部剖视结构示意图。 Figure 13 is a partial cross-sectional structural view of a surface mount fuse of the present invention.

以上附图中： 1、熔断芯片； 2、端电极； 3、陶瓷基片； 4、熔体层； 5、灭弧玻璃层； 6、圆形通孔； 7、熔断本体； 8、金属盖； 9、焊片； 10、缓冲层； 11、玻璃釉层； 12、表电极； 13、背电极； 14、侧电极； 15、保护层； 16、金属层。 In the above drawings: 1, fuse chip; 2, terminal electrode; 3, ceramic substrate; 4, melt layer; 5, arc extinguishing glass layer; 6, circular through hole; 7, fuse body; 9, soldering piece; 10, buffer layer; 11, glass glaze layer; 12, surface electrode; 13, back electrode; 14, side electrode; 15, protective layer; 16, metal layer.

具体实施方式 detailed description

[0021] 下面结合实施例对本发明作进一步描述： [0021] The present invention will be further described below in conjunction with the embodiments:

实施例：一种表面贴装熔断器，如附图 1-13所示，包括熔断芯片 1，此熔断芯片 1主要由两个端电极 2、陶瓷基片 3、熔体层 4、灭弧玻璃层 5和保护层 15组成，所述熔体层 4位于陶瓷基片 3上表面，两个所述端电极 2分别位于熔体层 4两侧并与所述熔体层 4电连接，所述灭弧玻璃层 5覆盖于所述熔体层 4和端电极 2中靠熔体层的区域，还包括一中间具有圆形通孔 6的熔断本体 7，所述熔断芯片 1位于此熔断本体 7的圆形通孔 6内，两个金属盖 8分别位于所述熔断本体 7两端并覆盖其圆形通孔 6从而形成密闭腔，所述端电极 2通过焊片 9与所述金属盖 8电连接。 Embodiment: A surface mount fuse, as shown in FIGS. 1-13, includes a fuse chip 1, which is mainly composed of two terminal electrodes 2, a ceramic substrate 3, a melt layer 4, and an arc extinguishing glass. The layer 5 and the protective layer 15 are formed, the melt layer 4 is located on the upper surface of the ceramic substrate 3, and the two end electrodes 2 are respectively located on both sides of the melt layer 4 and electrically connected to the melt layer 4, The arc extinguishing glass layer 5 covers the melt layer 4 and the region of the end electrode 2 which is located on the melt layer, and further includes a fuse body 7 having a circular through hole 6 therebetween, and the fuse chip 1 is located at the fuse body 7 Inside the circular through hole 6, the two metal covers 8 respectively Located at both ends of the fuse body 7 and covering its circular through hole 6 to form a closed cavity, the terminal electrode 2 is electrically connected to the metal cover 8 through a soldering piece 9.

[0022] 一保护层 15覆盖于所述灭弧玻璃层 5和端电极 2表面，此保护层 15为矿物改性的双酚类树脂，矿物含量 40%~50%。 [0022] A protective layer 15 covers the surface of the arc extinguishing glass layer 5 and the terminal electrode 2, and the protective layer 15 is a mineral-modified bisphenol resin having a mineral content of 40% to 50%.

[0023] 上述圆形通孔 6内熔断芯片 1和熔断本体 7之间填充有缓冲层 10，此缓冲层 10为二氧化硅改性的硅胶，其中二氧化硅含量 20%~60%。 [0023] The buffer chip 10 is filled between the fuse chip 1 and the fuse body 7 in the circular through hole 6, and the buffer layer 10 is a silica-modified silica gel in which the silica content is 20% to 60%.

[0024] 上述熔断本体 7材料为氧化锆和氧化铝的复合陶瓷，其中氧化锆含量 5%~20%。 [0024] The material of the fuse body 7 is a composite ceramic of zirconia and alumina, wherein the zirconia content is 5% to 20%.

[0025] 上述陶瓷基片 3材料为镁橄榄石陶瓷基板。 [0025] The material of the above ceramic substrate 3 is a forsterite ceramic substrate.

[0026] 上述陶瓷基片 3和熔体层 4之间设置有玻璃釉层 11。 A glass glaze layer 11 is disposed between the ceramic substrate 3 and the melt layer 4.

[0027] 上述端电极 2由表电极 12、背电极 13和侧电极 14组成，此表电极 12位于所述熔体层 4一侧，所述端电极 2中靠熔体层的区域为此表电极 12中的部分区域，所述背电极 13位于所述陶瓷基片 3下表面，所述侧电极 14 电连接所述表电极 12和背电极 13 ; 所述侧电极 [0027] The above-mentioned terminal electrode 2 is composed of a surface electrode 12, a back electrode 13 and a side electrode 14, which is located on the side of the melt layer 4, and the region of the end electrode 2 which is on the melt layer is a partial region of the electrode 12, the back electrode 13 is located on a lower surface of the ceramic substrate 3, and the side electrode 14 is electrically connected to the surface electrode 12 and the back electrode 13;

14通过所述焊片 9与所述金属盖 8电连接。 14 is electrically connected to the metal cover 8 through the soldering piece 9.

[0028] 上述金属盖 8与熔断本体 7侧面之间设置有金属层 16。 [0028] A metal layer 16 is disposed between the metal cover 8 and the side surface of the fuse body 7.

[0029] 本实施例上述内容进一步阐述如下。 [0029] The foregoing content of the embodiment is further explained as follows.

[0030] 1. 熔断本体选择：如附图 1所示，选择中空陶瓷的熔断本体 7，其内孔形状为圆形，其材料必须满足高度绝缘性和良好的绝热性能，并且能承受 -65 °C到 125 °C数千次的冷热冲击。可以选择是氧化铝陶瓷或氧化铝和氧化锆复合陶瓷。 [0030] 1. Fusing body selection: As shown in FIG. 1, the hollow ceramic fusing body 7 is selected, the inner hole shape is circular, and the material must satisfy high insulation and good thermal insulation performance, and can withstand -65 Thousands of cycles of thermal shock from °C to 125 °C. A choice may be alumina ceramic or alumina and zirconia composite ceramics.

[0031] 2. 熔断器本体端头金属层制作，如附图 2所示，在熔断本体 7端头和内孔上制作金属层 16。 [0031] 2. The metal layer of the fuse body end is fabricated. As shown in FIG. 2, a metal layer 16 is formed on the end of the fuse body 7 and the inner hole.

[0032] 3. 熔断芯片 1的陶瓷基片选择，如附图 3所示，芯片的陶瓷基片 3，其为正面带有纵横方向刻痕的氧化铝陶瓷，如果需考虑导热方面，须在陶瓷基片表面制作玻璃釉层 11。 [0032] 3. The ceramic substrate of the fuse chip 1 is selected, as shown in FIG. 3, the ceramic substrate 3 of the chip, which is an alumina ceramic with a longitudinal and lateral direction mark on the front side, if heat conduction is required, A glass glaze layer 11 is formed on the surface of the ceramic substrate.

[0033] 4. 玻璃釉制作，采用厚膜印刷工艺在陶瓷基板上制作玻璃釉层 11，其软化点大于金属熔丝的烧制温度，且具有良好的隔热性能，其烧成后的厚度 0.01~0.1mm。常用的玻璃釉层 11材料为 Si02 · B203系或是 Si02 · B203 · Pb203系玻璃。 [0033] 4. Glass glaze production, using a thick film printing process to make a glass glaze layer 11 on a ceramic substrate, the softening point is greater than the firing temperature of the metal fuse, and has good thermal insulation properties, the thickness after firing 0.01~0.1mm. The commonly used glass glaze layer 11 material is Si02 · B203 series or Si02 · B203 · Pb203 series glass.

[0034] 5. 背电极制作，采用厚膜印刷工艺在陶瓷基板上制作背电极 13。 [0034] 5. Back electrode fabrication, the back electrode 13 is fabricated on a ceramic substrate using a thick film printing process.

[0035] 6. 熔丝和表电极制作，如附图 6 所示，可采用丝网印刷、喷墨打印、微刻印、移印等方法在陶瓷基板或玻璃釉上制作熔体层 4 和表电极 12。若表电极太薄，可通过厚膜印刷工艺加厚。 [0035] 6. Fuse and surface electrode fabrication, as shown in FIG. 6, the melt layer 4 and the surface can be formed on the ceramic substrate or the glass glaze by screen printing, inkjet printing, micro-imprinting, pad printing, and the like. Electrode 12. If the surface electrode is too thin, it can be thickened by a thick film printing process.

[0036] 7. 灭弧层制作，如附图 7所示，在熔体层 4和部分表电极 12上制作灭弧玻璃层 5。为了能多吸收熔丝熔断时产生的金属蒸汽，灭弧层设计成多孔结构，例如，选择软化点 350 V -650 V之间的灭弧玻璃，制作成孔隙直径在 0.001mm~0.1mm 之间，厚度在 0.05mm~0.5mm之间的灭弧玻璃层 5。 7. Arc-quenching layer fabrication, as shown in FIG. 7, an arc-quenching glass layer 5 is formed on the melt layer 4 and a portion of the surface electrode 12. In order to absorb more metal vapor generated when the fuse is blown, the arc extinguishing layer is designed to have a porous structure. For example, an arc extinguishing glass with a softening point of between 350 V and 650 V is selected to have a pore diameter of between 0.001 mm and 0.1 mm. , an arc extinguishing glass layer 5 having a thickness of between 0.05 mm and 0.5 mm.

[0037] 8. 保护层制作，如附图 8所示，在灭弧玻璃层 5和部分表电极 12上制作保护层 15。 8. Protective Layer Fabrication, as shown in FIG. 8, a protective layer 15 is formed on the arc extinguishing glass layer 5 and a portion of the surface electrode 12.

[0038] 9. 侧面导电层制作，如附图 8所示，在陶瓷基片侧面制作侧电极 14。 9. Fabrication of the side conductive layer, as shown in FIG. 8, the side electrode 14 is formed on the side of the ceramic substrate.

[0039] 10. 熔断器组装，如附图所示，将芯片组装到熔断器本体陶瓷内孔中，再通过真空焊接工艺，使用焊片 9将两个金属盖 8焊接在内孔中组装有熔体的熔断器本体陶瓷端头上。经电镀后，成为成品。为了提高产品可靠性，可以考虑向芯片和熔断器本体陶瓷内孔空隙中填充添加物。 [0039] 10. Fuse assembly, as shown in the drawing, the chip is assembled into the ceramic inner hole of the fuse body, and then the two metal covers 8 are welded into the inner hole by the soldering process by the vacuum welding process. The fuse body of the melt is on the ceramic tip. After electroplating, it becomes a finished product. In order to improve the reliability of the product, it is conceivable to fill the gaps in the ceramic inner hole of the chip and the fuse body.

[0040] 上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。 The above embodiments are merely illustrative of the technical concept and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the present invention and to implement the present invention. Equivalent variations or modifications made in accordance with the spirit of the invention are intended to be included within the scope of the invention.

Claims

权利要求书 Claim

1. 一种表面贴装熔断器，包括熔断芯片（1 )，此熔断芯片（1 ) 主要由两个端电极（2)、陶瓷基片（3)、熔体层（4)、灭弧玻璃层（5 ) 和保护层（15 ) 组成，所述熔体层（4) 位于陶瓷基片（3) 上表面，两个所述端电极（2) 分别位于熔体层（4) 两侧并与所述熔体层A surface mount fuse comprising a fuse chip (1), the fuse chip (1) mainly comprising two terminal electrodes (2), a ceramic substrate (3), a melt layer (4), an arc extinguishing glass The layer (5) and the protective layer (15) are composed, the melt layer (4) is located on the upper surface of the ceramic substrate (3), and the two end electrodes (2) are respectively located on both sides of the melt layer (4) and With the melt layer

(4) 电连接，所述灭弧玻璃层（5 ) 覆盖于所述熔体层（4) 和端电极（2 ) 中靠熔体层的区域，其特征在于：还包括一中间具有圆形通孔（6) 的熔断本体（7)，所述熔断芯片（1 ) 位于此熔断本体（7 ) 的圆形通孔（6) 内，两个金属盖（8) 分别位于所述熔断本体（7) 两端并覆盖其圆形通孔（6) 从而形成密闭腔，所述端电极（2) 通过焊片（9) 与所述金属盖（8) 电连接。 (4) an electrical connection, the arc extinguishing glass layer (5) covering a region of the melt layer (4) and the end electrode (2) by the melt layer, characterized in that: further comprising a middle circular shape a fuse body (7) of the through hole (6), the fuse chip (1) is located in the circular through hole (6) of the fuse body (7), and the two metal covers (8) are respectively located on the fuse body ( 7) Both ends cover the circular through hole (6) to form a closed cavity, and the terminal electrode (2) is electrically connected to the metal cover (8) through a soldering piece (9).

2. 根据权利要求 1 所述的表面贴装熔断器，其特征在于：所述圆形通孔（6) 内熔断芯片 ( 1 ) 和熔断本体（7) 之间填充有缓冲层（10)，此缓冲层（10) 为二氧化硅改性的硅胶，其中二氧化硅含量 20%〜60%。 2. The surface mount fuse according to claim 1, wherein: a buffer layer (10) is filled between the fuse chip (1) and the fuse body (7) in the circular through hole (6), The buffer layer (10) is a silica-modified silica gel having a silica content of 20% to 60%.

3. 根据权利要求 1所述的表面贴装熔断器，其特征在于：一保护层（15) 覆盖于所述灭弧玻璃层（5)和端电极（2)表面，此保护层（15)为矿物改性的双酚类树脂，矿物含量 40%〜50%。 3. The surface mount fuse according to claim 1, wherein: a protective layer (15) covers the surface of the arc extinguishing glass layer (5) and the terminal electrode (2), and the protective layer (15) It is a mineral-modified bisphenol resin with a mineral content of 40% to 50%.

4. 根据权利要求 1 所述的表面贴装熔断器，其特征在于：所述熔断本体（7) 材料为氧化锆和氧化铝的复合陶瓷，其中氧化锆含量 5%〜20%。 The surface mount fuse according to claim 1, wherein the material of the fuse body (7) is a composite ceramic of zirconia and alumina, wherein the zirconia content is 5% to 20%.

5. 根据权利要求 1 所述的表面贴装熔断器，其特征在于：所述陶瓷基片（3) 材料为镁橄榄石陶瓷基板。 The surface mount fuse according to claim 1, wherein the ceramic substrate (3) is a magnesium olivine ceramic substrate.

6. 根据权利要求 1所述的表面贴装熔断器，其特征在于：所述陶瓷基片（3)和熔体层（4) 之间设置有玻璃釉层（11 )。 The surface mount fuse according to claim 1, wherein a glass glaze layer (11) is disposed between the ceramic substrate (3) and the melt layer (4).

7. 根据权利要求 1所述的表面贴装熔断器，其特征在于：所述端电极（2) 由表电极（12)、背电极（13) 和侧电极（14) 组成，此表电极（12) 位于所述熔体层（4) 一侧，所述端电极（2) 中靠熔体层的区域为此表电极（12) 中的部分区域，所述背电极（13) 位于所述陶瓷基片（3 ) 下表面，所述侧电极（14) 电连接所述表电极（12) 和背电极（13 ); 所述侧电极（14) 通过所述焊片（9) 与所述金属盖（8) 电连接。 7. The surface mount fuse according to claim 1, wherein: said terminal electrode (2) is composed of a surface electrode (12), a back electrode (13) and a side electrode (14), the surface electrode ( 12) on the side of the melt layer (4), the region of the end electrode (2) by the melt layer is a partial region in the watch electrode (12), and the back electrode (13) is located at a lower surface of the ceramic substrate (3), the side electrode (14) electrically connecting the surface electrode (12) and the back electrode (13); the side electrode (14) is passed through the soldering piece (9) The metal cover (8) is electrically connected.

8. 根据权利要求 1所述的表面贴装熔断器，其特征在于：所述金属盖（8)与熔断本体（7) 侧面之间设置有金属层（16)。 The surface mount fuse according to claim 1, wherein a metal layer (16) is disposed between the metal cover (8) and the side surface of the fuse body (7).