TWI695402B - Chip fuse and method for producing the same - Google Patents
Chip fuse and method for producing the same Download PDFInfo
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Abstract
本發明提供一種改良為能夠平衡良好地釋放熔斷時所產生的衝擊或蒸氣的片式熔斷器及其製造方法。該片式熔斷器由熔斷器主體及一對金屬罩所形成,所述熔斷器主體具有一對上側及下側陶瓷基板、熔絲支持體、熔絲,所述一對上側及下側陶瓷基板呈上下相對配置;所述熔絲支持體被夾持於陶瓷基板之間,並在中央具有上下方向貫通孔;所述熔絲經過貫通孔載架於熔絲支持體的兩端之間,所述金屬罩嵌合於熔斷器主體的兩端;上側陶瓷基板與熔絲支持體及下側陶瓷基板與熔絲支持體,分別相對的面彼此被黏接並封閉貫通孔,同時在黏接面的一部分上形成有非黏接部。 The present invention provides a chip fuse that is improved to release impact or steam generated during fusing in a well-balanced manner and a method for manufacturing the same. The chip fuse is formed by a fuse body and a pair of metal covers. The fuse body has a pair of upper and lower ceramic substrates, a fuse support, and fuses. The pair of upper and lower ceramic substrates It is arranged upside down; the fuse support is sandwiched between ceramic substrates and has a through hole in the vertical direction in the center; the fuse is passed between the two ends of the fuse support through the through hole carrier, so The metal cover is fitted on both ends of the fuse body; the upper ceramic substrate and the fuse support and the lower ceramic substrate and the fuse support, respectively, the opposite surfaces are adhered to each other and the through holes are closed, and at the same time A non-adhesive part is formed on a part of.
Description
本發明涉及一種小型的片式熔斷器,其中涉及用於與一般家庭用額定電流及電壓同等的電源裝置中的在主體內架設熔絲的片式熔斷器及其製造方法。 The present invention relates to a small-sized chip fuse, and relates to a chip fuse used for erecting a fuse in a main body in a power supply device having the same rated current and voltage as a general household, and a manufacturing method thereof.
作為在適用於電源裝置的變壓器的一次側的保護電路中所使用的熔斷器(一次側熔斷器),一般使用安裝於熔斷器支架上的管熔斷器。但是,最近根據電源裝置的小型化且輕量化等市場要求,使用直接對配線基板進行表面安裝熔斷器的方式。因此,大多使用在陶瓷製等的箱形狀殼體中,在兩電極間拉伸架設線狀、帶狀等的熔斷器元件而成的正方形片式熔斷器,而不是使用了玻璃製的圓筒狀殼體的管熔斷器。作為箱形狀殼體的現有技術例,在日本專利公開2012-174443號公報所示的內容中,已知一種由陶瓷製熔絲支持體、熔絲、筒狀陶瓷製殼體及金屬罩形成的片式熔斷器,其中,所述陶瓷製熔絲支持體在中央設置有貫通孔,所述熔絲跨越貫通孔並呈直線狀架設於熔絲支持體的相對的兩端,所述筒狀陶瓷製殼體插嵌於作為帶有熔絲的熔絲支持體的熔斷 器結合體,所述金屬罩使從熔絲支持體的兩端突出的熔絲處於導通狀態並設置於殼體的筒狀體兩端。 As the fuse (primary fuse) used in the protection circuit on the primary side of a transformer suitable for a power supply device, a tube fuse mounted on a fuse holder is generally used. However, recently, in accordance with market requirements such as miniaturization and weight reduction of power supply devices, a method of directly surface-mounting a fuse on a wiring board is used. Therefore, instead of using a cylinder made of glass, a square-shaped fuse formed by stretching a fuse element such as a wire or a ribbon in a box-shaped case made of ceramic or the like is stretched between the two electrodes. Fuse in the shape of a shell. As a prior art example of a box-shaped case, in Japanese Patent Publication No. 2012-174443, a fuse holder made of ceramic, a fuse, a cylindrical case made of ceramic, and a metal cover are known A chip fuse, wherein the ceramic fuse support is provided with a through hole in the center, the fuse spans the through hole and is linearly erected at opposite ends of the fuse support, and the cylindrical ceramic The housing is inserted into the fuse as a fuse support with fuses In the combined body, the metal cover puts the fuses protruding from both ends of the fuse holder into a conducting state and is provided at both ends of the cylindrical body of the housing.
專利文獻 Patent Literature
專利文獻1:日本專利公開2012-174443號公報 Patent Document 1: Japanese Patent Publication No. 2012-174443
但是,上述現有的片式熔斷器中,由於將由熔絲和熔絲支持體構成的熔斷器結合體插嵌在筒狀的陶瓷製殼體內從而構成熔斷器,因此熔斷器沒有在進行電流遮斷動作時對所產生的衝擊的釋放場所,而有可能會發生殼體破損或變形。此外,由於沒有在熔斷時對產生的熔斷器元件蒸發物(蒸氣)等的釋放場所,而在熔斷後在殼體內還殘留有蒸氣,因此,存在無法確保熔斷的熔斷器端子之間或者熔絲的熔斷端之間的絕緣電阻這樣的缺陷。 However, in the above-mentioned conventional chip fuse, since a fuse combination composed of a fuse and a fuse support is inserted into a cylindrical ceramic case to form a fuse, the fuse is not interrupting current. The place where the impact generated during operation is released may damage or deform the case. In addition, since there is no place to release evaporative substances (steam) and the like of the fuse element generated at the time of fusing, and vapor remains in the case after fusing, there are fuse terminals or fuses between which fuse cannot be ensured The insulation resistance between the fuse ends is such a defect.
本發明是為瞭解決這種以往的缺點而完成的,其目的在於,提供一種改良為能夠平衡良好地釋放熔斷時所產生的衝擊或蒸氣的片式熔斷器及其製造方法。 The present invention has been made to solve such conventional shortcomings, and an object of the present invention is to provide a chip fuse that can be improved to release impact or steam generated during fusing in a balanced manner and a method for manufacturing the same.
根據本發明,作為解決上述技術問題的手段,提供了一種片式熔斷器,其具備熔斷器主體及一對金屬罩,所述熔斷器主體具有呈上下相對配置的一對上側及下側陶瓷基板、被夾持於所述上側及下側陶瓷基板之間且在中央具有上下方向貫通孔的熔絲支持體,以及經過貫通孔載架於所述熔絲支持體的兩端之間的熔絲,所述一對金屬罩在與從所述熔絲支持體的兩端突出的所述熔絲導通狀態下嵌合於所述熔斷器主體的兩端,所述上 側陶瓷基板與熔絲支持體以及所述下側陶瓷基板與熔絲支持體,分別相對的面彼此被黏接並封閉所述貫通孔,同時在黏接面的一部分上形成有非黏接部。 According to the present invention, as a means for solving the above-mentioned technical problem, there is provided a chip fuse including a fuse body and a pair of metal covers, the fuse body having a pair of upper and lower ceramic substrates arranged vertically opposite each other , A fuse holder sandwiched between the upper and lower ceramic substrates and having a through hole in the vertical direction at the center, and a fuse supported between the two ends of the fuse holder through the through hole carrier , The pair of metal covers are fitted to both ends of the fuse body in a conducting state with the fuses protruding from both ends of the fuse holder, the upper The side ceramic substrate and the fuse support, and the lower ceramic substrate and the fuse support, respectively, the opposite surfaces are adhered to each other and close the through-hole, and at the same time, a non-adhesive portion is formed on a part of the adhesive surface .
在某一實施方式中,非黏接部也可以形成於貫通孔的長度方向兩側。 In one embodiment, the non-adhesion portion may be formed on both sides of the through hole in the longitudinal direction.
也可以是,熔絲支援體由在上下方向上層疊的上側熔絲支持分割體和下側熔絲支持分割體所構成,貫通孔在上下方向上貫通上側熔絲支持分割體和下側熔絲支持分割體,熔絲在熔絲支持體的長度方向上經過貫通孔並被載架。此外,非黏接部也可以分別形成於上側陶瓷基板與上側熔絲支持分割體之間、上側熔絲支持分割體與下側熔絲支持分割體之間,以及下側熔絲支持分割體與下側陶瓷基板之間。 The fuse support may be composed of an upper fuse support division body and a lower fuse support division body stacked in the up-down direction, and a through hole penetrates the upper fuse support division body and the lower fuse in the up-down direction The split body is supported, and the fuse passes through the through hole in the longitudinal direction of the fuse support and is carried by the carrier. In addition, the non-adhesive portions may be formed between the upper ceramic substrate and the upper fuse support division body, between the upper fuse support division body and the lower fuse support division body, and the lower fuse support division body and Between the lower ceramic substrates.
作為其他方式,也可以是熔絲支援體具有單體結構,使熔絲經過熔絲支持體的貫通孔,以傾斜狀態載架於熔絲支持體的兩端中上面的一端與下面的另一端之間。 As another method, the fuse support may have a single structure, and the fuse may be passed through the through hole of the fuse support, and may be mounted on the upper end and the lower end of the two ends of the fuse support in an inclined state. between.
此外根據本發明,提供一種片式熔斷器的製造方法,其是上述片式熔斷器的製造方法,在中央具有上下方向貫通孔的熔絲支持體的兩端之間,經過所述貫通孔來載架熔絲,將載架有熔絲的熔絲支持體夾持在上下相對的一對陶瓷基板之間,在將所述一對陶瓷基板和熔絲支持體在相對的面之間黏接的同時,在黏接面的一部分上形成非黏接部,從而形成熔斷器主體,在該熔斷器主體的兩端,在與所述熔絲導通的狀態下嵌合金屬罩。 In addition, according to the present invention, there is provided a method for manufacturing a chip fuse, which is a method for manufacturing the above-mentioned chip fuse, which passes through the through hole between the two ends of the fuse support having a through hole in the vertical direction at the center Carrier fuse, which holds a fuse carrier with a fuse carrier between a pair of ceramic substrates facing up and down, and bonds the pair of ceramic substrates and the fuse support between opposing surfaces At the same time, a non-adhesive portion is formed on a part of the adhesive surface to form a fuse body, and a metal cover is fitted to the both ends of the fuse body in a state of conduction with the fuse.
在某一實施方式中,也可以將非黏接部形成於貫通孔的長度方向兩側。 In one embodiment, the non-adhesive portions may be formed on both sides of the through hole in the longitudinal direction.
也可以是熔斷絲支援體由在上下方向層疊的上側熔絲支持分割體和下側熔絲支持分割體所構成,貫通孔在上下方向上貫通上側熔絲支持分割體和下側熔絲支持分割體,在上側熔絲支持分割體與下側熔絲支持分割體之間,在熔絲支持體的長度方向上使熔絲經過貫通孔並載架。此外,也可以使非黏接部分別形成於上側陶瓷基板與上側熔絲支持分割體之間、上側熔絲支持分割體與下側熔絲支持分割體之間,以及下側熔絲支持分割體與下側陶瓷基板之間。 The fuse support body may be composed of an upper fuse support division body and a lower fuse support division body stacked in the up-down direction, and a through hole vertically penetrates the upper fuse support division body and the lower fuse support division body Between the upper fuse support division body and the lower fuse support division body, the fuse passes through the through hole in the longitudinal direction of the fuse support body and is carried. In addition, non-adhesive portions may be formed between the upper ceramic substrate and the upper fuse support division body, between the upper fuse support division body and the lower fuse support division body, and the lower fuse support division body, respectively With the lower ceramic substrate.
作為其他方式,也可以是熔絲支援體具有單體結構,使熔絲經過熔絲支援體的貫通孔,傾斜載架於熔絲支持體的相對的兩端中上面一端與下面的另一端之間。 As another method, the fuse support may have a single structure, and the fuse may pass through the through hole of the fuse support, and the inclined carrier may be placed between the upper end and the lower end of the opposite ends of the fuse support. between.
此外根據本發明,提供一種片式熔斷器的製造方法,其是上述片式熔斷器的製造方法,其特徵在於,將在中央具有上下方向貫通孔的上側熔絲支持分割體和上側陶瓷基板,以及在中央具有上下方向貫通孔的下側熔絲支持分割體和下側陶瓷基板在分別相對的面之間黏接,同時,在黏接面的一部分上形成非黏接部,在下側熔絲支持分割體的兩端之間經過所述貫通孔並載架熔絲,將載架有熔絲的下側熔絲支持分割體與上側熔絲支持分割體以上下相對配置,在相對的面之間黏接,同時,在黏接面的一部分上形成非黏接部,從而形成熔斷器主體,在該熔斷器主體的兩端,在與所述熔絲導通的狀態下嵌合金屬罩。 Furthermore, according to the present invention, there is provided a method for manufacturing a chip fuse, which is a method for manufacturing the above chip fuse, characterized in that an upper fuse having a through hole in the vertical direction at the center supports a divided body and an upper ceramic substrate, And the lower fuse supporting split body and the lower ceramic substrate having through holes in the center in the vertical direction are adhered between the respectively opposed surfaces, and at the same time, a non-adhesive portion is formed on a part of the adhesion surface to fuse on the lower side The two ends of the support split body pass through the through-hole and carry the fuse, and the lower fuse support split body carrying the fuse and the upper fuse support split body are arranged up and down relative to each other, on the opposite surface At the same time, at the same time, a non-adhesive portion is formed on a part of the bonding surface to form a fuse body, and a metal cover is fitted to the both ends of the fuse body in a state of conducting with the fuse.
在某一實施方式中,也可以將各非黏接部形成於貫通孔的長度方向兩側。 In one embodiment, each non-adhesive portion may be formed on both sides of the through hole in the longitudinal direction.
根據本發明,將具有一對上側及下側陶瓷基板、熔絲支持體,以及設置在熔絲支持體上的熔絲的熔斷器主體作為主要結構要素,在上側陶瓷基板與熔絲支持體之間及下側陶瓷基板與熔絲支持體之間,使分別相對的面之間黏接從而密封貫通孔,同時在黏接面的一部分上形成非黏接部,因此在熔斷器熔斷時產生的衝擊及蒸氣從片式熔斷器的內部通過非黏接部向外部釋放。因此能夠避免片式熔斷器的變形和破損。此外,由於蒸氣不滯留在片式熔斷器內,因此能夠確保熔斷的熔斷器端子之間或者熔絲的熔斷端之間的絕緣電阻,也能夠得到使片式熔斷器性能提高的效果。 According to the present invention, a fuse body having a pair of upper and lower ceramic substrates, a fuse support, and a fuse provided on the fuse support is the main structural element. Between the lower ceramic substrate and the fuse support, the opposing surfaces are adhered to seal the through-hole, and a non-adhesive portion is formed on a part of the adhesive surface. Impact and steam are released from the inside of the chip fuse to the outside through the non-adhesive part. Therefore, the deformation and damage of the chip fuse can be avoided. In addition, since the vapor does not stay in the chip fuse, the insulation resistance between the blown fuse terminals or the fuse ends can be ensured, and the effect of improving the performance of the chip fuse can also be obtained.
本發明實現一種不會發生熔斷時的熔斷器破損,並確保熔斷後的熔斷器端子之間或者熔絲的熔斷端之間的絕緣電阻的熔斷器,對在使用了家庭用等較高電壓、電流的配電盤等中使用的電子電路的各要素進行保護,更加確保對於火災的安全。 The present invention realizes a fuse that does not break the fuse when it fuse and ensures the insulation resistance between the fuse terminals after fusing or between the fuse ends of the fuse. Each element of the electronic circuit used in the current distribution board is protected to further ensure the safety of fire.
1、31:上側陶瓷基板 1.31: Upper side ceramic substrate
2、6、20、33、40:黏結劑 2, 6, 20, 33, 40: adhesive
3:上側熔絲支持分割體 3: The upper fuse supports the split body
4:上側熔斷器支持分割體 4: The upper fuse supports split body
5、32:下側陶瓷基板 5.32: Lower ceramic substrate
7:下側熔絲支持分割體 7: The lower fuse supports the split body
8:下側熔斷器支持分割體 8: Lower fuse supports split body
9、36:熔絲 9, 36: Fuse
10、14:片材 10, 14: sheet
11、15:狹縫 11, 15: slit
12:標記 12: Mark
16、37:貫通孔 16, 37: through hole
17、38、39:熔絲保持溝槽 17, 38, 39: fuse holding groove
18:寬度方向端面 18: Width end face
21、41:中間部件 21, 41: middle part
22、42:熔斷器主體 22, 42: fuse body
23:金屬罩 23: Metal cover
24:焊膏 24: solder paste
25、43:片式熔斷器 25, 43: chip fuse
26、27、28、44、45:非黏接部 26, 27, 28, 44, 45: Non-adhesive part
35:熔絲支持體 35: Fuse support
36a、36b:熔絲端部 36a, 36b: end of fuse
第1圖是表示本發明第一實施方式的片式熔斷器的熔斷器主體的分解立體圖。 Fig. 1 is an exploded perspective view showing the fuse body of the chip fuse according to the first embodiment of the present invention.
第2圖是說明在第一實施方式的製造方法中從材料片材切出陶瓷基板的工序的示意立體圖。 FIG. 2 is a schematic perspective view illustrating a step of cutting out a ceramic substrate from a material sheet in the manufacturing method of the first embodiment.
第3圖是說明在上述實施方式的製造方法中從材料片材切出熔絲支援分割體的工序的示意立體圖。 Fig. 3 is a schematic perspective view illustrating a step of cutting out the fuse support division body from the material sheet in the manufacturing method of the above embodiment.
第4圖是表示在上述實施方式的製造方法中將上側熔斷器支持分割體與下側熔斷器支持分割體呈上下相對配置,並在兩個熔斷器支援分割體之間配置熔絲及黏結劑的狀態的分解立體圖。 4 is a diagram showing that the upper fuse support split body and the lower fuse support split body are arranged up and down in the manufacturing method of the above embodiment, and the fuse and the adhesive are arranged between the two fuse support split bodies Exploded perspective view of the state.
第5圖是表示在上述實施方式的製造方法中在下側熔斷器支援分割體上配置黏結劑及熔絲的狀態的立體圖。 Fig. 5 is a perspective view showing a state in which a binder and a fuse are arranged on the lower fuse support division body in the manufacturing method of the above embodiment.
第6圖是表示在上述實施方式的製造方法中將下側熔斷器支持分割體與上側熔斷器支持分割體重疊並黏接的狀態的立體圖。 Fig. 6 is a perspective view showing a state in which the lower fuse support divided body and the upper fuse support divided body are overlapped and bonded in the manufacturing method of the above embodiment.
第7圖是經過至第6圖為止的工序而製作出的熔斷器主體的立體圖。 FIG. 7 is a perspective view of the fuse body manufactured through the steps up to FIG. 6.
第8圖是表示第7圖所示的熔斷器主體的兩端嵌合金屬罩時的狀態的立體圖。 FIG. 8 is a perspective view showing a state where metal covers are fitted at both ends of the fuse body shown in FIG. 7.
第9圖是在上述實施方式中與熔斷器主體的兩端嵌合的金屬罩的立體圖。 Fig. 9 is a perspective view of metal covers fitted to both ends of the fuse body in the above-described embodiment.
第10圖是表示上述實施方式中的片式熔斷器的完成狀態的立體圖。 Fig. 10 is a perspective view showing a completed state of the chip fuse in the above embodiment.
第11圖是上述實施方式的片式熔斷器的長度方向截面圖。 FIG. 11 is a longitudinal cross-sectional view of the chip fuse of the above embodiment.
第12圖是將上述實施方式的片式熔斷器分解並通過與第11圖相同的截面來表示的分解截面圖。 FIG. 12 is an exploded cross-sectional view showing the chip fuse of the above embodiment exploded and shown by the same cross-section as FIG. 11.
第13圖是表示本發明第二實施方式的片式熔斷器的熔斷器主體的分解立體圖。 Fig. 13 is an exploded perspective view showing the fuse body of the chip fuse according to the second embodiment of the present invention.
第14圖是第13圖的配置中將熔絲配置在熔絲支援體上的狀態的立體圖。 FIG. 14 is a perspective view of a state where fuses are arranged on a fuse support in the arrangement of FIG. 13.
第15圖是表示在上述第二實施方式的製造方法中將配置有熔絲的熔絲支持體黏接在下側陶瓷基板的上面的狀態的立體圖。 Fig. 15 is a perspective view showing a state in which a fuse support having fuses arranged on the upper surface of the lower ceramic substrate is adhered in the manufacturing method of the second embodiment.
第16圖是表示在上述實施方式的製造方法中將上側陶瓷基板與熔絲支持體重疊並黏接的狀態的立體圖。 FIG. 16 is a perspective view showing a state where the upper ceramic substrate and the fuse support are overlapped and bonded in the manufacturing method of the above embodiment.
第17圖是經過至第16圖為止的工序而製作出的熔斷器主體的立體圖。 FIG. 17 is a perspective view of the fuse body produced through the steps up to FIG. 16.
第18圖是表示將金屬罩嵌合在第17圖所示的熔斷器主體的兩端時的狀態的立體圖。 FIG. 18 is a perspective view showing a state when a metal cover is fitted to both ends of the fuse body shown in FIG. 17.
第19圖是表示上述實施方式中的片式熔斷器的完成狀態的立體圖。 Fig. 19 is a perspective view showing a completed state of the chip fuse in the above embodiment.
第20圖是上述實施方式的片式熔斷器的長度方向截面圖。 Fig. 20 is a longitudinal cross-sectional view of the chip fuse of the above embodiment.
第21圖是將上述實施方式的片式熔斷器分解並通過與第20圖相同的截面表示的分解截面圖。 FIG. 21 is an exploded cross-sectional view showing the chip fuse of the above embodiment exploded and shown by the same cross-section as FIG. 20.
第1圖是將本發明第一實施方式的片式熔斷器的主體部分(作為熔斷器主體)分解表示的立體圖。該熔斷器主體為具有配置於最上部的上側陶瓷基板1、通過黏結劑與該上側陶瓷基板1的下面黏接的上側熔絲支援分割體3、配置於熔斷器主體的最下部的下側陶瓷基板5、通過黏結劑6與該下側陶瓷基板5的上面黏接的下側熔絲支援分割體7的四層結構。之後通過黏結劑20黏接上側熔絲支持分割體3與下側熔絲支持分割體7,從而構成一個熔絲支持體。此外通過用黏結劑2相互黏接的上側陶瓷基板1和上側熔絲支持分割體3構成上側熔斷器支持分割體4,通過用黏結劑6相互黏接的下側陶瓷基板5和下側熔絲支持分割體7構成下側熔斷器支持分割體8。在上側熔斷器支持分割體4和下側熔
斷器支持分割體8之間,也就是上側熔絲支持分割體3和下側熔絲支持分割體7之間夾裝有熔絲9。
Fig. 1 is an exploded perspective view showing the main body part (as a fuse body) of the chip fuse according to the first embodiment of the present invention. The fuse body is provided with an upper
上側陶瓷基板1及下側陶瓷基板5具有薄的平板結構,從比這些陶瓷基板1、5更大面積的陶瓷製片材中被切出。第2圖是對從成為原材料的陶瓷製片材10中切出陶瓷基板1、5的工序進行說明的立體圖。第2圖中的(a)表示在片材10上設有狹縫11的狀態。由狹縫11所劃分成的各區間為一個陶瓷基板1、5的大小。在片材10上設置有狹縫11的狀態下對各區間實施標記( )等工序的操作,如第2圖中的(b)所示,可以設置標記12等。將進行了這樣的加工的片材10沿狹縫11分割,得到陶瓷基板1、5。
The upper
上側熔絲支援分割體3及下側熔絲支援分割體7具有薄的平板結構,從比這些熔絲支持分割體3、7更大面積的片材例如氧化鋁陶瓷製的片材切出。第3圖是對從作為原材料的片材14中切出熔絲支援分割體3、7的工序進行說明的立體圖。第3圖中的(a)表示在片材14上設有狹縫15的狀態。通過狹縫劃分成的各區間為一個熔絲支持分割體3、7的大小。對設置了該狹縫15的片材14實施壓力加工等操作,在各區間形成貫通孔16。對形成有貫通孔16的各區間進一步實施加工操作,如第3圖中的(b)所示,通過切割()在各貫通孔16的長度方向兩端形成熔絲保持溝槽17。將進行了這樣的加工的片材14沿狹縫15進行分割,得到熔絲支援分割體3、7。另外,熔絲保持溝槽17在上側熔絲支持分割體3上經過其下面的寬度方向端面18而形成,在下側熔絲支持分割體7上,經過其上面的寬度方向端面18而形成。
The upper fuse support split
熔絲9由絲線狀或細棒狀的金屬材料構成,例如對軟銅線或鐵鎳合金線鍍銀而製作。熔絲9與電氣儀器或設備的電路內連接,設定熔斷電流值,使得在規定的電流值下熔斷。
The
作為適用於黏接各陶瓷基板1、5與各熔絲支持分割體3、7的黏結劑2、6,例如可使用環氧樹脂黏結劑。黏結劑2、6例如如第1圖所示,與具有貫通孔16的上側熔絲支持分割體3的上面形狀一致,形成為一對字狀的薄板或薄膜。字形狀的一對的臂部的長度也形成為,即使將一對字狀的黏結劑以字形狀的開口相對的方式,配置在上側熔絲支持分割體3的上面兩端部,也比上面的長度方向尺寸更短。由此,在將上側陶瓷基板1與上側熔絲支持分割體3重疊黏接的情況下,在該黏接面上,在相對的一對黏結劑2的字形狀的臂部的前端之間形成非黏接部26。同樣地,在下側熔絲支持分割體7的下面兩端部,使一對字狀的黏結劑6以字形狀的開口相對的方式配置,若將下側熔絲支持分割體7與下側陶瓷基板5重疊並黏接,則在該黏接面上形成非黏接部28。在本實施方式中,黏結劑2、6形成為字狀,但黏結劑2、6的形狀及尺寸可以進行各種改變。因此,根據黏結劑的形狀及尺寸的選擇方法,也存在非黏接部在一處或三處上形成的情況。
As the
第4圖是表示將通過黏結劑2黏接上側陶瓷基板1與上側熔絲支持分割體3而得到的上側熔斷器支持分割體4,以及通過黏結劑6黏接下側陶瓷基板5與下側熔絲支持分割體7而得到的下側熔斷器支持分割體8呈上下相對配置,並在兩個熔斷器支持分割體4、8之間配置熔絲9及一對字狀的黏結劑20的狀態的立體圖。黏結劑20與上述的黏結劑2、6同樣。根據第4圖的狀態,在下側熔斷器支援分割體8的下側熔絲支持分割體7的上面兩端部及熔絲保持溝槽
17上,以字形狀的開口相對的方式配置一對黏結劑20,在該黏結劑20固化前,將熔絲9以其兩端從熔絲保持溝槽17向外方延伸的狀態,架設於熔絲保持溝槽17之間。該狀態示於第5圖。進一步地,在黏結劑2固化前,將配置有熔絲9的下側熔斷器支持分割體8的上方重疊並黏接同一形狀的上側熔斷器支持分割體4,形成本實施方式的熔斷器主體的中間部件21。此時,與上述同樣地,在上側熔斷器支持分割體4的上側熔絲支持分割體3與下側熔斷器支持分割體8的熔絲支持分割體7之間的黏接面形成有非黏接部27。另外,通過這樣將上側熔絲支持分割體3與下側熔絲支持分割體7黏接,形成載架有熔絲9的熔絲支持體。
FIG. 4 shows the upper fuse supporting divided
如前所述,非黏接部26、28、27在部件1和部件3、部件7和部件5、部件3和部件7的各個之間的黏接面上形成於貫通孔26的長度方向兩側,但通過部件各組重疊黏接,使其作為整體而緊固,熔絲支持分割體3及7的貫通孔16形成內部空間,在常態也就是遮斷前保持密封。
As described above, the
中間部件21示於第6圖。在該中間部件21的狀態下,熔絲9的端部還從兩端面突出。切斷去除該突出部分,得到第7圖所示的熔斷器主體22。
The
第8圖是表示在第7圖的熔斷器主體22的兩端嵌合金屬罩23之前的狀態的立體圖。在第8圖中,在熔斷器主體22的兩端部,具有第9圖所示結構的例如在銅-鋅合金上實施了鍍錫-銅的金屬罩23通過焊膏24在與熔絲9導通的狀態下進行嵌合。由此,完成第10圖所示那樣的片式熔斷器25。
FIG. 8 is a perspective view showing a state before the
第11圖是本實施方式的片式熔斷器25的長度方向截面圖,第12圖是將該片式熔斷器25分解並以與第11圖同樣的截面來表示。如這些圖所示,本實施方式的片式熔斷器25為四層結構。進一步地,通過在該四層間的黏接面
上局部地形成非黏接部26、27、28,在熔斷器主體22的長度方向兩側面上使非黏接部形成為三層。
FIG. 11 is a longitudinal cross-sectional view of the
由於具有上述結構,在本實施方式中,超載電流流過片式熔斷器25而熔絲9熔斷時所產生的衝擊(壓力)或蒸氣不僅通過貫通孔16的容量而被緩衝,而且從側面的非黏接部26、27、28得以釋放,因此能夠安全地進行電流遮斷。也就是,在本實施方式中,並沒有發生現有片式熔斷器所出現的片式熔斷器主體破損、變形。此外通過使熔斷時所產生的蒸氣釋放至片式熔斷器25的外部,使得熔斷後的熔斷器端子之間或者熔絲的熔斷端之間的絕緣電阻變得極高。另外,對於通過非黏接部26、27、28釋放蒸氣,可以通過對黏結劑2、6、20的形狀及尺寸進行各種改變來進行調整。
Due to the above structure, in this embodiment, the impact (pressure) or steam generated when the overload current flows through the
本實施方式是使陶瓷基板和熔絲支持體黏接而成的熔斷器支持分割體成對並上下配置,在這些一對熔斷器支持分割體之間夾持熔絲使其合體做成熔斷器主體,然後在熔斷器主體的兩端蓋上金屬罩,從而能夠改善熔斷器的電流遮斷特性與遮斷後的熔斷器端子之間或者熔絲的熔斷端之間的絕緣電阻。 In this embodiment, a fuse support divided body formed by bonding a ceramic substrate and a fuse support is paired and arranged up and down, and a fuse is sandwiched between these pair of fuse support divided bodies to make a combined fuse. The main body is then covered with metal covers at both ends of the fuse body, so that the current interruption characteristic of the fuse and the insulation resistance between the fuse terminal after interruption or the fuse end of the fuse can be improved.
在上述製造方法中,在將上側陶瓷基板1和上側熔絲支持分割體3黏接做成上側熔斷器支持分割體4,並將下側陶瓷基板5和下側熔絲支持分割體7黏接做成下側熔斷器支持分割體8之後,在兩個熔斷器支持分割體4、8之間夾裝有熔絲9,但是也可以在上側熔絲支援分割體3與下側熔絲支持分割體7之間夾裝了熔絲9之後,將上側熔絲支持分割體3及下側熔絲支持分割體7分別與上側陶瓷基板1及下側陶瓷基板5黏接。
In the above-described manufacturing method, the upper
第13圖是將本發明的第二實施方式的片式熔斷器的熔斷器主體分解表示的立體圖。該熔斷器主體形成為具有配置於最上部的上側陶瓷基板31、配置於最下部的下側陶瓷基板32以及通過黏結劑33在該下側陶瓷基板32的上面黏接的熔絲支援體35的三層結構。在熔絲支持體35與上側陶瓷基板31之間夾裝熔絲36。
Fig. 13 is an exploded perspective view showing the fuse body of the chip fuse according to the second embodiment of the present invention. The fuse body is formed to have an upper
關於上側陶瓷基板31及下側陶瓷基板32具有薄的平板結構這一點,以及這些陶瓷基板31、32如第2圖所示對比它們更大面積的陶瓷製片材實施各種加工後而切出這一點,與第一實施方式相同。關於熔絲支持體35的製作也與第一實施方式相同,形成有貫通孔37。在本實施方式中,熔絲保持溝槽形成在熔絲支持體35的上面及下面,形成於熔絲支持體35的上面的是熔絲保持溝槽38,形成於下面的是熔絲保持溝槽39。此外,關於熔絲36的結構、材質、特性等及黏結劑33、40的材質等也與第一實施方式相同。進一步地,黏結劑33、40形成為規定的形狀,因此關於在上側陶瓷基板31、熔絲支持體35、下側陶瓷基板32間的各黏接面上局部地形成非黏接部44、45這一點與第一實施方式相同。進而,此外非黏接部44、45分別形成在部件31與部件35、部件35與部件32之間的黏接面上貫通孔37的長度方向兩側,通過部件各組重疊黏接,使其作為全體而緊固,貫通孔37形成內部空間,在常態也就是遮斷前保持密封這一點也與第一實施方式相同。
Regarding the fact that the upper
第14圖是表示從第13圖的狀態將熔絲36配置在熔絲支援體35上的狀態的立體圖。熔絲36***熔絲支持體35的貫通孔37,一側的熔絲端部36a被配置在熔絲保持溝槽38內,該熔絲保持溝槽38形成於熔絲支持體35的上面的
長度方向一端部,另一側的熔絲端部36b被配置在熔絲保持溝槽39內,該熔絲保持溝槽39形成於熔絲支持體35的下面的長度方向另一端部。
FIG. 14 is a perspective view showing a state where the
第15圖是表示如第14圖所示那樣將配置了熔絲36的熔絲支持體35通過黏結劑33黏接在下側陶瓷基板32的上面的狀態的立體圖。通過該下側陶瓷基板32與熔絲支持體35的黏接,熔絲36的端部36b被固定在熔絲支持體35的下面側。
FIG. 15 is a perspective view showing a state where the
第16圖是表示在熔絲支援體35的上面配置黏結劑40並在固化前重疊黏接上側陶瓷基板31的狀態的立體圖,其為本實施方式的熔斷器主體的中間部件41。在該中間部件41的狀態下,熔絲36的端部36a、36b還從兩端面突出。切斷去除該突出部分,得到第17圖所示的熔斷器主體42。
FIG. 16 is a perspective view showing a state where the adhesive 40 is placed on the upper surface of the
第18圖是表示在第17圖的熔斷器主體42的兩端嵌合金屬罩23之前的狀態的立體圖。在第18圖中,熔斷器主體42的兩端部,與第一實施方式同樣地,具有第9圖所示的結構的例如錫-銀-銅合金製的金屬罩23通過焊膏24在與熔絲9導通的狀態下進行嵌合。由此,完成第19圖所示那樣的片式熔斷器43。
FIG. 18 is a perspective view showing a state before the
第20圖是本實施方式的片式熔斷器43的長度方向截面圖,第21圖是將該片式熔斷器43分解並以與第20圖相同的截面來表示。如這些圖所示,本實施方式的片式熔斷器43為三層結構。進一步地,通過在該三層間的黏接面上局部地形成非黏接部26,從而在熔斷器主體42的長度方向兩側面上形成兩層非黏接部26。
FIG. 20 is a longitudinal cross-sectional view of the
由於具有上述結構,在本實施方式中,超載電流流過片式熔斷器43而熔絲36熔斷時所產生的衝擊(壓力)或蒸氣不僅通過貫通孔37的容量而被緩衝,而且從側面的非黏接部44、45得以釋放,因此能夠安全地進行電流遮
斷。即,在本實施方式中,並沒有發生現有片式熔斷器所出現的片式熔斷器主體破損、變形。此外通過使熔斷時所產生的蒸氣釋放至片式熔斷器43的外部,遮斷後的熔斷器端子之間或者熔絲的熔斷端之間的絕緣電阻變得極高。另外,通過非黏接部44、45釋放蒸氣,能夠通過對黏結劑33、40的形狀及尺寸進行各種改變而進行調整。
Due to the above structure, in this embodiment, the impact (pressure) or vapor generated when the overload current flows through the
另外在上述第一實施方式及第二實施方式中,在製作熔斷器主體的階段中,在上側陶瓷基板和熔絲支持體之間及下側陶瓷基板和熔絲支持體之間,分別將相對的面之間進行黏接並密封貫通孔,同時,在黏接面的一部分上形成非黏接部,並且作為常態將使內部的貫通孔為保持密封的結構。但是在其他方式中,在製作熔斷器主體的階段中,也可以在上側陶瓷基板和熔絲支援體之間及下側陶瓷基板和熔絲支持體之間形成釋放遮斷時所產生的衝擊及蒸氣的排氣孔。 In addition, in the first and second embodiments described above, in the stage of manufacturing the fuse body, between the upper ceramic substrate and the fuse support and between the lower ceramic substrate and the fuse support, Adhere and seal the through holes between the surfaces, and at the same time, form a non-adhesive part on a part of the adhesive surface, and as a normal state, the internal through holes will be kept sealed. However, in other methods, in the stage of manufacturing the fuse body, an impact and a shock generated when the interruption is released may be formed between the upper ceramic substrate and the fuse support and between the lower ceramic substrate and the fuse support. Vapor vents.
實施方式 Implementation
實施例Examples
製作本發明第一實施方式的四層結構的片式熔斷器。由陶瓷製片材製作上側及下側陶瓷基板,以及上側及下側熔絲支援分割體,使用在軟銅線上鍍銀而做成的熔絲、環氧樹脂黏結劑及在銅-鋅合金上實施鍍錫-銅而得到的金屬罩以及焊膏,得到電阻值0.011Ω的片式熔斷器No.1~No.10。對得到的各片式熔斷器進行100V(相位角60°)、100A交流電的通電,使其熔斷,從而進行了電流遮斷實驗。電阻的實測值及遮斷時間示於表1。接著,對熔斷的片式熔斷器以500V進行1分鐘的通電,使用數位萬用表(菊水電子工業公司製造)測定了熔斷器端子之間的殘留電阻值。結果示於表1。另外在表1中,殘留電阻 值的欄“O.L.”(Over Load;超載)表示殘留電阻值超過了萬用表的可測定範圍(1200MΩ)。 A four-layer chip fuse according to the first embodiment of the present invention is produced. Production of upper and lower ceramic substrates and upper and lower fuse support divisions from ceramic sheets, using fuses made of silver plating on soft copper wires, epoxy resin adhesives, and implementation on copper-zinc alloys The metal cover and the solder paste obtained by tin-copper plating obtained chip fuses No. 1 to No. 10 with a resistance value of 0.011Ω. Each piece of fuse obtained was energized with 100V (phase angle 60°) and 100A alternating current to fuse it, and a current interruption experiment was conducted. The measured value of resistance and the interruption time are shown in Table 1. Next, the blown chip fuse was energized at 500 V for 1 minute, and the residual resistance value between the fuse terminals was measured using a digital multimeter (manufactured by Kikusui Electronics Industry Co., Ltd.). The results are shown in Table 1. Also in Table 1, the residual resistance The value column "O.L." (Over Load; Overload) indicates that the residual resistance value exceeds the measurable range of the multimeter (1200 MΩ).
在日本國的電氣用品安全法(Electrical Appliance and Material Safety Law)的規定中,規定短路遮斷性能試驗後的殘留電阻值為200kΩ以上。根據表1可知,片式熔斷器No.1~No.10的全部片式熔斷器的殘留電阻值都滿足上述日本國電氣用品安全法的基準。此外在全部片式熔斷器中,由於遮斷動作時產生的衝擊(壓力)或蒸氣從側面的非黏接部釋放,因此在片式熔斷器的側面出現了微小寬度的三層間隙,但熔斷器主體沒有破損。 In the provisions of the Electrical Appliance and Material Safety Law of Japan, the residual resistance value after the short-circuit breaking performance test is specified to be 200 kΩ or more. It can be seen from Table 1 that the residual resistance values of all the chip fuses No. 1 to No. 10 meet the standards of the above-mentioned Japan Electrical Appliances Safety Law. In addition, in all chip fuses, due to the impact (pressure) or steam generated during the interruption operation is released from the non-adhesive part on the side, a small three-layer gap appears on the side of the chip fuse, but the fuse The main body of the device is not damaged.
比較例 Comparative example
製作日本專利公開2012-174443號公報所公開的現有技術的片式熔斷器。與上述實施例相同地,製作設置有中央貫通孔及熔絲保持溝槽的熔絲支持體,與實施例相同地在支持體的熔絲保持溝槽上塗布環氧樹脂黏接劑,與實施例相同地將熔絲跨過貫通孔並呈直線狀地架設於熔絲的相對的兩端,從而得到熔斷器結合體。將該熔斷器結合體插嵌在角筒狀的氧化鋁陶瓷製殼體內, 並在其兩端與上述實施例相同地通過焊膏固定金屬罩,從而得到電阻值為0.011Ω的片式熔斷器No.1~No.5。對得到的各片式熔斷器,與實施例相同地進行電流遮斷實驗,測量出遮斷後的殘留電阻值。將結果示於表2中。 The prior art chip fuse disclosed in Japanese Patent Publication No. 2012-174443 is produced. As in the above embodiment, a fuse support provided with a central through hole and a fuse holding groove was produced, and an epoxy resin adhesive was coated on the fuse holding groove of the support in the same manner as in the embodiment. In the same manner, the fuse is spanned through the through hole and linearly erected at opposite ends of the fuse, thereby obtaining a fuse combination. Insert the fuse combination in a rectangular tube-shaped alumina ceramic casing, And at both ends thereof, the metal cover was fixed with solder paste in the same manner as in the above embodiment, thereby obtaining chip fuses No. 1 to No. 5 having a resistance value of 0.011Ω. For each of the obtained chip fuses, a current interruption experiment was conducted in the same manner as in the example, and the residual resistance value after interruption was measured. The results are shown in Table 2.
根據表2,比較例的片式熔斷器No.1~No.5的殘留電阻值全部低於實施例的片式熔斷器。此外滿足電氣用品安全法的基準的僅為片式熔斷器No.1,在片式熔斷器No.2~No.5中,存在超出基準值的殘留電阻。此外在全部片式熔斷器中,在表面確認到遮斷動作時所產生的衝擊(壓力)或蒸氣導致的燒焦。 According to Table 2, the residual resistance values of the chip fuses No. 1 to No. 5 of the comparative examples are all lower than those of the chip fuses of the examples. In addition, only the chip fuse No. 1 satisfies the standards of the Electrical Appliances Safety Law. In the chip fuse Nos. 2 to 5, there is a residual resistance that exceeds the reference value. In addition, in all chip fuses, impact (pressure) or steam scorching caused by the blocking operation was confirmed on the surface.
1:上側陶瓷基板 1: Upper side ceramic substrate
2、6、20:黏結劑 2, 6, 20: Adhesive
3:上側熔絲支持分割體 3: The upper fuse supports the split body
4:上側熔斷器支持分割體 4: The upper fuse supports split body
5:下側陶瓷基板 5: Lower ceramic substrate
7:下側熔絲支持分割體 7: The lower fuse supports the split body
8:下側熔斷器支持分割體 8: Lower fuse supports split body
9:熔絲 9: Fuse
16:貫通孔 16: through hole
17:熔絲保持溝槽 17: fuse holding groove
Claims (9)
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Citations (6)
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US20050057337A1 (en) * | 2003-08-25 | 2005-03-17 | Ludger Richter | Tubular fuse component with end caps with a hermetically sealing plastic sealing body insert |
TW201112300A (en) * | 2009-06-26 | 2011-04-01 | Cooper Technologies Co | Subminiature fuse with surface mount end caps and improved connectivity |
CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
WO2013166788A1 (en) * | 2012-05-10 | 2013-11-14 | 苏州晶讯科技股份有限公司 | Surface-mounted fuse |
US20140266564A1 (en) * | 2013-03-14 | 2014-09-18 | Littelfuse, Inc. | Laminated electrical fuse |
JP2015092497A (en) * | 2015-01-05 | 2015-05-14 | 釜屋電機株式会社 | Chip fuse, and manufacturing method of the same |
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2015
- 2015-05-19 TW TW104115960A patent/TWI695402B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20050057337A1 (en) * | 2003-08-25 | 2005-03-17 | Ludger Richter | Tubular fuse component with end caps with a hermetically sealing plastic sealing body insert |
TW201112300A (en) * | 2009-06-26 | 2011-04-01 | Cooper Technologies Co | Subminiature fuse with surface mount end caps and improved connectivity |
CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
WO2013166788A1 (en) * | 2012-05-10 | 2013-11-14 | 苏州晶讯科技股份有限公司 | Surface-mounted fuse |
US20140266564A1 (en) * | 2013-03-14 | 2014-09-18 | Littelfuse, Inc. | Laminated electrical fuse |
JP2015092497A (en) * | 2015-01-05 | 2015-05-14 | 釜屋電機株式会社 | Chip fuse, and manufacturing method of the same |
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