WO2013146955A1 - ハニカム構造体 - Google Patents
ハニカム構造体 Download PDFInfo
- Publication number
- WO2013146955A1 WO2013146955A1 PCT/JP2013/059145 JP2013059145W WO2013146955A1 WO 2013146955 A1 WO2013146955 A1 WO 2013146955A1 JP 2013059145 W JP2013059145 W JP 2013059145W WO 2013146955 A1 WO2013146955 A1 WO 2013146955A1
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- WO
- WIPO (PCT)
- Prior art keywords
- honeycomb structure
- slit
- electrode
- slits
- present
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/50—Catalysts, in general, characterised by their form or physical properties characterised by their shape or configuration
- B01J35/56—Foraminous structures having flow-through passages or channels, e.g. grids or three-dimensional monoliths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/86—Catalytic processes
- B01D53/8678—Removing components of undefined structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
- F01N3/021—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
- F01N3/022—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters characterised by specially adapted filtering structure, e.g. honeycomb, mesh or fibrous
- F01N3/0222—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters characterised by specially adapted filtering structure, e.g. honeycomb, mesh or fibrous the structure being monolithic, e.g. honeycombs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/08—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
- F01N3/10—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
- F01N3/18—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control
- F01N3/20—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion ; Methods of operation or control of catalytic converters
- F01N3/2006—Periodically heating or cooling catalytic reactors, e.g. at cold starting or overheating
- F01N3/2013—Periodically heating or cooling catalytic reactors, e.g. at cold starting or overheating using electric or magnetic heating means
- F01N3/2026—Periodically heating or cooling catalytic reactors, e.g. at cold starting or overheating using electric or magnetic heating means directly electrifying the catalyst substrate, i.e. heating the electrically conductive catalyst substrate by joule effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/08—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
- F01N3/10—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
- F01N3/24—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by constructional aspects of converting apparatus
- F01N3/28—Construction of catalytic reactors
- F01N3/2803—Construction of catalytic reactors characterised by structure, by material or by manufacturing of catalyst support
- F01N3/2825—Ceramics
- F01N3/2828—Ceramic multi-channel monoliths, e.g. honeycombs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2255/00—Catalysts
- B01D2255/80—Type of catalytic reaction
- B01D2255/806—Electrocatalytic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2255/00—Catalysts
- B01D2255/90—Physical characteristics of catalysts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/30—Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
- B01J35/33—Electric or magnetic properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2240/00—Combination or association of two or more different exhaust treating devices, or of at least one such device with an auxiliary device, not covered by indexing codes F01N2230/00 or F01N2250/00, one of the devices being
- F01N2240/16—Combination or association of two or more different exhaust treating devices, or of at least one such device with an auxiliary device, not covered by indexing codes F01N2230/00 or F01N2250/00, one of the devices being an electric heater, i.e. a resistance heater
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2260/00—Exhaust treating devices having provisions not otherwise provided for
- F01N2260/10—Exhaust treating devices having provisions not otherwise provided for for avoiding stress caused by expansions or contractions due to temperature variations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2330/00—Structure of catalyst support or particle filter
- F01N2330/06—Ceramic, e.g. monoliths
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
- F01N3/021—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
- F01N3/023—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles
- F01N3/027—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
Definitions
- the present invention relates to a honeycomb structure. More specifically, the present invention relates to a honeycomb structure that functions as a catalyst carrier and also functions as a heater by applying a voltage, can suppress a temperature distribution unevenness when a voltage is applied, and has excellent thermal shock resistance.
- the power source used for the electrical system of the vehicle is commonly used, and a power source having a high voltage of, for example, 200V is used.
- a power source having a high voltage of, for example, 200V is used.
- the metal heater has a low electric resistance, when such a high voltage power source is used, there is a problem that an excessive current flows and the power supply circuit may be damaged.
- a slit which is a resistance adjusting mechanism is provided in the heater to prevent excessive current from flowing and to generate heat well by energization.
- the slit is formed so that current does not flow (linearly) between the pair of electrodes at the shortest distance.
- the present invention has been made in view of the above-described problems, and is a catalyst carrier and also functions as a heater by applying a voltage, and can suppress a deviation in temperature distribution when a voltage is applied.
- An object is to provide a honeycomb structure excellent in thermal shock resistance.
- the present invention provides the following honeycomb structure.
- a cylindrical honeycomb structure having a porous partition wall that partitions and forms a plurality of cells extending from one end face to the other end face that serves as a fluid flow path, and an outer peripheral wall located at the outermost periphery;
- a pair of electrode portions disposed on a side surface of the honeycomb structure portion, wherein the honeycomb structure portion has an electrical resistivity of 1 to 200 ⁇ cm, and each of the pair of electrode portions is a cell of the honeycomb structure portion.
- the cross section formed in a strip shape extending in the extending direction and orthogonal to the extending direction of the cells one of the electrode portions in the pair of electrode portions is in contact with the other electrode portion in the pair of electrode portions.
- One or more slits opened on the side surface are formed in the honeycomb structure portion on the opposite side across the center of the structure portion, and at least one of the slits extends in the cell extending direction.
- a honeycomb structure is formed so as not to intersect the straight line connecting the respective central portions of the pair of electrode portions.
- honeycomb structure part Two or more of the slits are formed in the honeycomb structure part, and 50% or more of the two or more slits in the cross section perpendicular to the cell extending direction, the pair of electrode parts
- honeycomb structure according to [1] wherein the honeycomb structure is formed so as not to intersect with a straight line connecting the central portions of each other.
- honeycomb structure portion All of the slits formed in the honeycomb structure portion are formed so as not to intersect a straight line connecting the center portions of the pair of electrode portions in a cross section orthogonal to the cell extending direction.
- the honeycomb structure of the present invention has a honeycomb structure having an electric resistivity of 1 to 200 ⁇ cm. Therefore, even when a current is supplied using a high voltage power source, an excessive current does not flow, and the honeycomb structure can be suitably used as a heater. it can.
- each of the pair of electrode portions is formed in a strip shape extending in the cell extending direction of the honeycomb structure portion.
- one electrode portion of the pair of electrode portions is centered on the honeycomb structure portion with respect to the other electrode portion of the pair of electrode portions. It is arrange
- the honeycomb structure of the present invention one or more slits that open to the side surface are formed in the honeycomb structure portion.
- the honeycomb structure of the present invention is formed such that at least one slit does not intersect with a straight line connecting the center portions of the pair of electrode portions in a cross section perpendicular to the cell extending direction.
- the honeycomb structure of the present invention has excellent thermal shock resistance because the slits are formed in the honeycomb structure portion.
- the honeycomb structure of the present invention is formed such that at least one slit does not intersect with a straight line connecting the center portions of the pair of electrode portions in a cross section perpendicular to the cell extending direction. Therefore, the mechanical strength is also excellent.
- FIG. 1 is a perspective view schematically showing an embodiment of a honeycomb structure of the present invention.
- 1 is a schematic diagram showing a cross section orthogonal to a cell extending direction of an embodiment of a honeycomb structure of the present invention.
- 1 is a schematic diagram showing a cross section parallel to a cell extending direction of an embodiment of a honeycomb structure of the present invention.
- FIG. 1 is a schematic diagram showing a cross section orthogonal to a cell extending direction of an embodiment of a honeycomb structure of the present invention. It is a perspective view which shows typically other embodiment of the honeycomb structure of this invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- Fig. 3 is a perspective view schematically showing a honeycomb structure in which both end portions of each of a pair of electrode portions are not in contact with the end portions of the honeycomb structure portion.
- FIG. 3 is a perspective view schematically showing a honeycomb structure in which both end portions of each of a pair of electrode portions are not in contact with the end portions of the honeycomb structure portion.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- 1 is a perspective view schematically showing a honeycomb structure of Example 1.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- honeycomb structure One embodiment of the honeycomb structure of the present invention includes a tubular honeycomb structure portion 4 and a pair of electrode portions 21 as shown in FIGS.
- the tubular honeycomb structure 4 includes a porous partition wall 1 that partitions and forms a plurality of cells 2 that extend from one end surface 11 to the other end surface 12 serving as a fluid flow path, and an outer peripheral wall 3 positioned at the outermost periphery. It is what has.
- the pair of electrode portions 21 are disposed on the side surface 5 of the honeycomb structure portion 4.
- the electrical resistivity of the honeycomb structure portion 4 is 1 to 200 ⁇ cm.
- each of the pair of electrode portions 21 and 21 is formed in a strip shape extending in the extending direction of the cells 2 of the honeycomb structure portion 4.
- one electrode portion 21 is opposite to the other electrode portion 21 across the center O of the honeycomb structure portion 4 in a cross section orthogonal to the extending direction of the cells 2. It is arranged on the side.
- One electrode portion 21 is one electrode portion 21 (in the pair of electrode portions 21, 21) in the pair of electrode portions 21, 21, and the other electrode portion 21 is in the pair of electrode portions 21, 21. This is the other electrode portion 21 (in the pair of electrode portions 21 and 21).
- one electrode portion 21 in the pair of electrode portions 21, 21 is one electrode portion 21, and the remaining one electrode portion 21 in the pair of electrode portions 21, 21 is the other electrode portion 21. It is.
- one or more slits 6 opening in the side surface 5 are formed in the honeycomb structure portion 4.
- the honeycomb structure 100 of the present embodiment has a structure in which at least one slit 6 “connects the central portions C and C of the pair of electrode portions 21 and 21 to each other in a cross section perpendicular to the extending direction of the cells 2. It is formed so as not to intersect the “straight line (center line) L”.
- FIG. 1 is a perspective view schematically showing one embodiment of a honeycomb structure of the present invention. Fig.
- FIG. 2 is a schematic diagram showing a cross section perpendicular to the cell extending direction of one embodiment of the honeycomb structure of the present invention.
- FIG. 3 is a schematic view showing a cross section parallel to the cell extending direction of one embodiment of the honeycomb structure of the present invention.
- the side surface 5 of the honeycomb structure portion 4 is the surface of the outer peripheral wall 3 of the honeycomb structure portion 4.
- the “slit 6 opening in the side surface 5 (of the honeycomb structure part 4)” is a slit opening in the surface of the outer peripheral wall 3 of the honeycomb structure part 4.
- the slit opens to the outer periphery of the honeycomb structure portion means that a hole is opened in the surface of the outer peripheral wall by the opening portion of the slit.
- the slit may open to the side surface and also to the end surface.
- each of the pair of electrode portions 21 and 21 is formed in a strip shape extending in the extending direction of the cells 2 of the honeycomb structure portion 4.
- one electrode portion 21 in the pair of electrode portions 21 and 21 is the other electrode portion in the pair of electrode portions 21 and 21. 21 is disposed on the opposite side across the center O of the honeycomb structure portion 4.
- the honeycomb structure 100 of the present embodiment can suppress the uneven temperature distribution when a voltage is applied. Furthermore, in the honeycomb structure 100 of the present embodiment, one or more slits 6 that open to the side surface 5 are formed in the honeycomb structure portion 4. In the honeycomb structure 100 of the present embodiment, at least one slit 6 connects the central portions C and C of the pair of electrode portions 21 and 21 in a cross section orthogonal to the extending direction of the cells 2. It is formed so as not to intersect the straight line (center line) L. As described above, since the honeycomb structure of the present embodiment has the slits 6 formed in the honeycomb structure portion 4, it is possible to suppress the uneven temperature distribution when a voltage is applied and to have excellent thermal shock resistance. It is a thing.
- At least one slit 6 connects the center portions C and C of the pair of electrode portions 21 and 21 in a cross section orthogonal to the extending direction of the cells 2. It is formed so as not to intersect the straight line. Therefore, in particular, it is possible to suppress an uneven temperature distribution when a voltage is applied.
- at least one slit 6 is formed so as not to intersect a straight line connecting the central portions C and C of the pair of electrode portions 21 and 21 in a cross section perpendicular to the extending direction of the cell 2. Therefore, the honeycomb structure 100 is excellent in mechanical strength.
- one electrode portion 21 in the pair of electrode portions 21, 21 has a honeycomb structure portion relative to the other electrode portion 21 in the pair of electrode portions 21, 21.
- the meaning of “disposed on the opposite side across the center O of 4” is as follows. That is, as shown in FIG. 4, first, in the cross section orthogonal to the extending direction of the cells 2, “the central portion C of one electrode portion 21 (the central point in the“ circumferential direction of the honeycomb structure portion 4 ”) and the honeycomb A line segment connecting with the center O of the structure part 4 is defined as a line segment L1.
- FIG. 4 is a schematic view showing a cross section perpendicular to the cell extending direction of one embodiment of the honeycomb structure of the present invention. In FIG. 4, the partition walls and the slits are omitted.
- the slit formed so as not to intersect the straight line L connecting the center portions C and C of the pair of electrode portions 21 and 21. 6 may be referred to as a “non-intersecting slit”.
- the honeycomb structure 100 is formed so as to intersect with the straight line L connecting the center portions C and C of the pair of electrode portions 21 and 21.
- the slit 6 may be referred to as a “cross slit”.
- the honeycomb structure 100 of the present embodiment it is preferable that two or more slits 6 are formed in the honeycomb structure portion 4, and 50% or more of the slits 6 in the two or more slits 6 are non-intersecting slits. . Further, it is more preferable that all of the slits 6 formed in the honeycomb structure portion 4 are non-intersecting slits. When the non-intersecting slit is 50% or more of the entire slit 6, it is possible to prevent the mechanical strength of the honeycomb structure 100 from being lowered (the honeycomb structure 100 of the present embodiment has excellent mechanical strength). Become).
- the mechanical strength of the honeycomb structure 100 may be reduced due to an increase in the number of intersecting slits. If the non-intersecting slit is less than 50% of the entire slit 6, the number of intersecting slits increases, so that the current flow between the pair of electrodes 21 and 21 is greatly hindered by the slit and uniform heat generation is inhibited. , Non-uniform heat generation may occur.
- the depth of the slit 6 may be referred to as a radius in the “cross section perpendicular to the cell 2 extending direction” of the honeycomb structure portion 4 (hereinafter, referred to as “the radius of the honeycomb structure portion”). 1) to 80%.
- the depth of the slit 6 is more preferably 1 to 60% of the radius of the honeycomb structure part, and particularly preferably 1 to 30%. If the depth of the slit 6 is smaller than 1% of the radius of the honeycomb structure portion, the effect of reducing the thermal shock resistance of the honeycomb structure 100 may be lowered.
- the depth of the slit 6 is the distance from the “opening in the side surface 5” of the slit 6 to the deepest position of the slit 6.
- the depth of the slit 6 may be different depending on the slit, or all may be the same.
- the width of the slit 6 is the length of the outer periphery in the “cross section perpendicular to the cell 2 extending direction” of the honeycomb structure portion 4 (hereinafter referred to as “the outer periphery length of the honeycomb structure portion”). In some cases) is preferably 0.1 to 5%.
- the width of the slit 6 is more preferably 0.1 to 3%, and particularly preferably 0.1 to 1% of the outer peripheral length of the honeycomb structure portion. If the width of the slit 6 is smaller than 0.1% of the outer peripheral length of the honeycomb structure portion, the effect of reducing the thermal shock resistance of the honeycomb structure 100 may be lowered.
- the width of the slit 6 is the length of the slit 6 in the “circumferential direction of the honeycomb structure portion 4”.
- the “circumferential direction of the honeycomb structure part 4” is a direction along the outer periphery of the “cross section perpendicular to the extending direction of the cells 2” of the honeycomb structure part 4.
- the width of the slit 6 means the width of one slit.
- the widths of the slits 6 may differ depending on the slits, or may all be the same.
- the length of the slit 6 in the “cell extending direction” is preferably the same as the length of the honeycomb structure portion in the “cell extending direction”. That is, it is preferable that the slit 6 is formed between both end faces of the honeycomb structure part (over the entire length). It is also a preferred aspect that the length of the slit 6 in the “cell extending direction” is 5 to 70% of the length of the honeycomb structure portion in the “cell extending direction”. In terms of thermal shock resistance, it is better to extend over the entire length, but it is preferable in terms of strength if a portion that is not partially formed remains. When it does not extend over the entire length, one end of the slit is preferably located on the honeycomb end face.
- the slit may be formed only on one end face side of the honeycomb structure part (see FIG. 10), or may be formed on both end face sides of the honeycomb structure part (see FIG. 11). ).
- the total length of the slits in the “cell extending direction” is 5 to 70% of the length of the honeycomb structure portion in the “cell extending direction”. It is preferable that Further, when the slit is formed only on one end face side of the honeycomb structure portion, when using the honeycomb structure, the end face side on which the slit is formed is used in a direction in which the thermal shock is more greatly applied. It is preferable.
- the lengths of the slits 6 may differ depending on the slits, or may all be the same.
- the slit formation pattern (including the number of slits), the depth of the slits, the width of the slits, and the length of the slits may be line symmetric with the center line L as the axis of symmetry. preferable.
- the number of slits 6 is preferably 1-20, more preferably 1-15, and particularly preferably 1-10. If the number of the slits 6 exceeds 20, the mechanical strength of the honeycomb structure 100 may be lowered. In the honeycomb structure 100 shown in FIG. 1, six slits 6 are formed.
- the slit 6 is formed so as to extend between both end faces of the honeycomb structure portion 4.
- the slit 6 “the position of the opening in the side surface 5 of the honeycomb structure 4 (the opening of the slit 6) is closest to the electrode portion 21” is referred to as the “shortest distance slit” 6a. I will call it.
- the distance D between the electrode portion 21 and the “shortest distance slit” 6a is preferably 0.1 to 30 mm, more preferably 0.5 to 20 mm, and particularly preferably 1 to 10 mm. If the distance D between the electrode portion 21 and the “shortest distance slit” 6a is shorter than 0.1 mm, the flow of current may be hindered, and uniform heat generation may be difficult.
- the distance D between the electrode portion 21 and the “shortest distance slit” 6a exceeds 30 mm, the effect of reducing the thermal shock resistance of the honeycomb structure 100 may be lowered.
- the distance D between the electrode portion 21 and the “shortest distance slit” 6a is, as shown in FIG. 2, the distance from the end of the electrode portion 21 in the circumferential direction of the honeycomb structure 100 to the “shortest distance slit” 6a. Distance.
- the honeycomb structure 100 includes two regions (region A and region B) on the side surface 5 of the honeycomb structure portion 4 where the “electrode portion 21 is not disposed”. ), Three slits 6 are formed.
- the distance between the facing slits is longer than the depth of the slits.
- the distance between the opposing slits is the distance between the slit 6 formed in the region A and the slit 6 formed in the region B.
- the slit angles of the six slits are all 90 °.
- the “slit angle” is defined as follows. As shown in FIG. 2, the intersection point between the slit 6 and the outer periphery of the honeycomb structure portion 4 is a point P in the cross section orthogonal to the cell extending direction of the honeycomb structure 100 of the present embodiment. A half line (or line segment) extending from the point P toward the outside of the outer periphery of the honeycomb structure portion 4 and parallel to the center line L is defined as a half line HL.
- the center line L is “a straight line connecting the central portions of the pair of electrodes” as described above.
- an angle that is not large (an angle of 180 ° or less) among the angles formed by the slit 6 and the half line HL is defined as a “slit angle SA”.
- the smaller angle means “the smaller angle or the same angle when the angle is the same”.
- a half line is a straight line which has an end on one side and extends infinitely on the other side.
- the half line HL extends toward the outside of the outer periphery of the honeycomb structure part 4” means that the half line HL extends in a direction that does not pass through the cross section of the honeycomb structure part 4.
- the material of the partition walls 1 and the outer peripheral wall 3 is preferably a silicon-silicon carbide composite material or silicon carbide as a main component, and the silicon-silicon carbide composite material or the carbonized carbide. More preferably, it is silicon.
- the material of the partition wall 1 and the outer peripheral wall 3 is mainly composed of silicon carbide particles and silicon
- the partition wall 1 and the outer peripheral wall 3 are made of silicon carbide particles and silicon (total mass) as a whole. It means containing 90 mass% or more.
- the electrical resistivity of the honeycomb structure portion can be set to 1 to 200 ⁇ cm.
- the silicon-silicon carbide composite material contains silicon carbide particles as an aggregate and silicon as a binder for bonding the silicon carbide particles, and a plurality of silicon carbide particles are interposed between the silicon carbide particles. It is preferable to be bonded by silicon so as to form pores. Silicon carbide is obtained by sintering silicon carbide.
- the electrical resistivity of the honeycomb structure part is a value at 400 ° C.
- a pair of electrode portions 21 and 21 are disposed on the side surface 5 of the honeycomb structure portion 4.
- the honeycomb structure 100 of the present embodiment generates heat when a voltage is applied between the pair of electrode portions 21 and 21.
- the applied voltage is preferably 12 to 900V, and more preferably 64 to 600V.
- each of the pair of electrode portions 21 and 21 is formed in a “strip shape” extending in the extending direction of the cells 2 of the honeycomb structure portion 4. And in the cross section orthogonal to the extending direction of the cell 2, one electrode portion 21 in the pair of electrode portions 21, 21 is formed of the honeycomb structure portion 4 with respect to the other electrode portion 21 in the pair of electrode portions 21, 21. It is arranged on the opposite side across the center portion O. Therefore, when a voltage is applied between the pair of electrode portions 21 and 21, it is possible to suppress the bias of the current flowing in the honeycomb structure portion 4, thereby suppressing the bias of heat generation in the honeycomb structure portion 4. it can. Further, as shown in FIG.
- the honeycomb structure 100 of the present embodiment is 0.5 times the center angle ⁇ of each of the electrode portions 21 and 21 in a cross section orthogonal to the extending direction of the cells 2 (
- the angle ⁇ which is 0.5 times the central angle ⁇ is preferably 15 to 65 °.
- fever in the honeycomb structure part 4 can be suppressed more effectively.
- the shape of the electrode portion 21 that “0.5 times the central angle ⁇ of the electrode portion 21 is 15 to 65 ° and extends in the cell extending direction” is one mode of “strip shape”. is there. Further, as shown in FIG.
- the “center angle ⁇ of the electrode portion 21” is defined by two lines connecting the both ends of the electrode portion 21 and the center O of the honeycomb structure portion 4 in a cross section orthogonal to the cell extending direction. An angle formed by a line segment.
- the central angle ⁇ of the electrode portion 21” is the “electrode portion 21”, “the line segment connecting one end portion of the electrode portion 21 and the center O” and “the other portion of the electrode portion 21 in the orthogonal cross section”. This is the inner angle of the portion of the center O in the shape (fan shape, etc.) formed by the “line segment connecting the end and the center O”.
- orthogonal cross section refers to “a cross section perpendicular to the cell extending direction of the honeycomb structure”.
- the upper limit value of “angle ⁇ which is 0.5 times the central angle ⁇ ” of the electrode portions 21 and 21 is more preferably 60 °, and particularly preferably 55 °.
- the lower limit value of “angle ⁇ which is 0.5 times the central angle ⁇ ” of the electrode portions 21 and 21 is more preferably 20 °, and particularly preferably 30 °.
- the “angle ⁇ that is 0.5 times the central angle ⁇ ” of the one electrode portion 21 is 0.8 to 0.8 with respect to the “angle ⁇ that is 0.5 times the central angle ⁇ ” of the other electrode portion 21.
- the size is preferably 1.2 times, and more preferably 1.0 times the size (the same size).
- the thickness of the electrode portion 21 is preferably 0.01 to 5 mm, and more preferably 0.01 to 3 mm. By setting it within such a range, heat can be generated uniformly. If the thickness of the electrode part 21 is less than 0.01 mm, the electrical resistance may increase and heat may not be generated uniformly. If it is thicker than 5 mm, it may be damaged during canning.
- the electrode portion 21 is preferably composed mainly of silicon carbide particles and silicon, and more preferably formed from silicon carbide particles and silicon as raw materials other than impurities that are usually contained.
- “mainly composed of silicon carbide particles and silicon” means that the total mass of the silicon carbide particles and silicon is 90% by mass or more of the mass of the entire electrode portion.
- the component of the electrode part 21 and the component of the honeycomb structure part 4 are the same component or a close component (the material of the honeycomb structure part is silicon carbide). If there is). Therefore, the thermal expansion coefficients of the electrode part 21 and the honeycomb structure part 4 are the same value or close values.
- the bonding strength between the electrode portion 21 and the honeycomb structure portion 4 is also increased. Therefore, even when thermal stress is applied to the honeycomb structure, it is possible to prevent the electrode portion 21 from being peeled off from the honeycomb structure portion 4 and the joint portion between the electrode portion 21 and the honeycomb structure portion 4 being damaged.
- the honeycomb structure 100 of the present embodiment has a pair of electrode portions 21 and 21 extending in the cell extending direction of the honeycomb structure portion 4 and “between both ends (both ends It is formed in a belt-like shape extending between the surfaces 11 and 12).
- the pair of electrode portions 21 and 21 are disposed so as to extend between both ends of the honeycomb structure portion 4, so that when a voltage is applied between the pair of electrode portions 21 and 21, the honeycomb structure
- the bias of the current flowing through the portion 4 can be more effectively suppressed. And thereby, the bias
- the electrode portion 21 is formed (arranged) between both end portions of the honeycomb structure portion 4
- one end portion of the electrode portion 21 is one end portion of the honeycomb structure portion 4. It means that the other end portion of the electrode portion 21 is in contact with the other end portion (the other end surface) of the honeycomb structure portion 4 in contact with the end portion (one end surface).
- both end portions in the “direction in which the cells 2 of the honeycomb structure portion 4 extend” of the electrode portion 21 are not in contact with both end portions (both end surfaces 11 and 12) of the honeycomb structure portion 4.
- the state (not reached) is also a preferred embodiment.
- one end portion of the electrode portion 21 is in contact with (reaches) one end portion (one end face 11) of the honeycomb structure portion 4, and the other end portion of the electrode portion 21 is the other end portion of the honeycomb structure portion 4.
- a state in which the end portion (the other end surface 12) is not in contact with (not reached) is also a preferable mode.
- each of the pair of electrode portions 21 and 21 has at least one end portion in contact with the end portion (end surface) of the honeycomb structure portion 4 from the viewpoint of “improving the thermal shock resistance of the honeycomb structure”. It is preferable that the structure is not reached. From the above, when emphasizing the viewpoint of “more effectively suppressing the bias of heat generation by effectively suppressing the bias of current in the honeycomb structure portion 4”, the pair of electrode portions 21, It is preferable that 21 is formed so as to extend between both end portions of the honeycomb structure portion 4.
- At least one end portion of each of the pair of electrode portions 21 and 21 is an end portion (end face) of the honeycomb structure portion 4. It is preferable not to touch (reach).
- the electrode portion 21 has a shape in which a planar rectangular member is curved along the outer periphery of a cylindrical shape. It has become.
- the shape when the curved electrode portion 21 is transformed into a flat member that is not curved is referred to as a “planar shape” of the electrode portion 21.
- the “planar shape” of the electrode portion 21 shown in FIGS. 1 to 3 is a rectangle.
- the outer peripheral shape of the electrode part means “the outer peripheral shape in the planar shape of the electrode part”.
- the outer peripheral shape of the band-shaped electrode portion 21 may be rectangular, but the outer peripheral shape of the band-shaped electrode portion 21 is rectangular.
- the corner may have a curved shape.
- the outer peripheral shape of the strip-shaped electrode part 21 may be a shape in which rectangular corners are chamfered linearly.
- FIG. 13 shows an example of the honeycomb structure 190 in which both end portions of each of the pair of electrode portions 21 and 21 are not in contact with (being reached) the end portion (end face) of the honeycomb structure portion 4.
- the outer peripheral shape of the band-shaped electrode portion 21 is a shape “rectangular corners are formed in a curved shape”.
- the electrical resistivity of the electrode portion 21 is preferably 0.1 to 100 ⁇ cm, and more preferably 0.1 to 50 ⁇ cm. By setting the electrical resistivity of the electrode portion 21 in such a range, the pair of electrode portions 21 and 21 effectively serve as electrodes in the pipe through which the high-temperature exhaust gas flows.
- the electrical resistivity of the electrode part 21 is smaller than 0.1 ⁇ cm, the temperature of the honeycomb structure part near both ends of the electrode part 21 may easily rise in a cross section orthogonal to the cell extending direction. If the electrical resistivity of the electrode portion 21 is larger than 100 ⁇ cm, it may be difficult to play a role as an electrode because current hardly flows.
- the electrical resistivity of the electrode part is a value at 400 ° C.
- the electrode part 21 preferably has a porosity of 30 to 60%, more preferably 30 to 55%.
- a porosity of the electrode portion 21 is in such a range, a suitable electrical resistivity can be obtained. If the porosity of the electrode portion 21 is lower than 30%, it may be deformed during manufacturing. If the porosity of the electrode portion 21 is higher than 60%, the electrical resistivity may be too high.
- the porosity is a value measured with a mercury porosimeter.
- the electrode part 21 preferably has an average pore diameter of 5 to 45 ⁇ m, more preferably 7 to 40 ⁇ m.
- the average pore diameter of the electrode part 21 is in such a range, a suitable electrical resistivity can be obtained. If the average pore diameter of the electrode portion 21 is smaller than 5 ⁇ m, the electrical resistivity may be too high. When the average pore diameter of the electrode portion 21 is larger than 45 ⁇ m, the strength of the electrode portion 21 is weakened and may be easily damaged.
- the average pore diameter is a value measured with a mercury porosimeter.
- the average particle diameter of the silicon carbide particles contained in the electrode part 21 is preferably 10 to 60 ⁇ m, and more preferably 20 to 60 ⁇ m. .
- the electrical resistivity of the electrode portion 21 can be controlled in the range of 0.1 to 100 ⁇ cm.
- the average pore diameter of the silicon carbide particles contained in the electrode part 21 is smaller than 10 ⁇ m, the electrical resistivity of the electrode part 21 may become too large.
- the average pore diameter of the silicon carbide particles contained in the electrode portion 21 is larger than 60 ⁇ m, the strength of the electrode portion 21 is weakened and may be easily damaged.
- the average particle diameter of the silicon carbide particles contained in the electrode part 21 is a value measured by a laser diffraction method.
- the ratio of the mass of silicon contained in the electrode portion 21 to the “total mass of silicon carbide particles and silicon” contained in the electrode portion 21 is preferably 20 to 40% by mass, and preferably 25 to 35%. More preferably, it is mass%.
- the electrical resistivity of electrode portion 21 is 0.1 to 100 ⁇ cm. Can range. If the ratio of the mass of silicon to the total mass of silicon carbide particles and silicon contained in the electrode portion 21 is less than 20% by mass, the electrical resistivity may be too large, and is greater than 40% by mass. And it may become easy to change at the time of manufacture.
- the partition wall thickness is 50 to 200 ⁇ m, and preferably 70 to 130 ⁇ m.
- the partition wall thickness is 50 to 200 ⁇ m, and preferably 70 to 130 ⁇ m.
- the honeycomb structure 100 of the present embodiment preferably has a cell density of 40 to 150 cells / cm 2 , and more preferably 70 to 100 cells / cm 2 .
- the purification performance of the catalyst can be enhanced while reducing the pressure loss when the exhaust gas is flowed.
- the cell density is lower than 40 cells / cm 2 , the catalyst supporting area may be reduced.
- the cell density is higher than 150 cells / cm 2 , when the honeycomb structure 100 is used as a catalyst carrier and a catalyst is supported, the pressure loss when the exhaust gas flows may increase.
- the average particle diameter of the silicon carbide particles (aggregate) constituting the honeycomb structure portion 4 is preferably 3 to 50 ⁇ m, and more preferably 3 to 40 ⁇ m.
- the electrical resistivity at 400 ° C. of the honeycomb structure part 4 can be 1 to 200 ⁇ cm.
- the electrical resistivity of the honeycomb structure portion 4 may be increased.
- the electrical resistivity of the honeycomb structure portion 4 may be reduced.
- the extrusion forming die may be clogged with the forming raw material when the honeycomb formed body is extruded.
- the average particle diameter of the silicon carbide particles is a value measured by a laser diffraction method.
- the electrical resistivity of the honeycomb structure portion 4 is 1 to 200 ⁇ cm, and preferably 10 to 100 ⁇ cm.
- the electrical resistivity is less than 1 ⁇ cm, for example, when the honeycomb structure 100 is energized by a high-voltage power supply of 200 V or higher (the voltage is not limited to 200 V), an excessive current may flow.
- the electrical resistivity is greater than 200 ⁇ cm, for example, when the honeycomb structure 100 is energized by a high-voltage power supply of 200 V or higher (the voltage is not limited to 200 V), current does not flow easily and heat may not be sufficiently generated. is there.
- the electrical resistivity of the honeycomb structure part is a value measured by a four-terminal method.
- the electrical resistivity of the electrode portion 21 is preferably lower than the electrical resistivity of the honeycomb structure portion 4, and the electrical resistivity of the electrode portion 21 is preferably honeycomb structure.
- the electrical resistivity of the part 4 is more preferably 20% or less, particularly preferably 1 to 10%.
- the “mass of silicon carbide particles as an aggregate” contained in the honeycomb structure portion 4 when the material of the honeycomb structure portion 4 is a silicon-silicon carbide composite material, the “mass of silicon carbide particles as an aggregate” contained in the honeycomb structure portion 4;
- the ratio of “mass of silicon as a binder” contained in the honeycomb structure portion 4 to the total of “mass of silicon as a binder” contained in the honeycomb structure portion 4 is 10 to 40% by mass. It is preferably 15 to 35% by mass. If it is lower than 10% by mass, the strength of the honeycomb structure may be lowered. If it is higher than 40% by mass, the shape may not be maintained during firing.
- the porosity of the partition walls 1 of the honeycomb structure part 4 is preferably 35 to 60%, and more preferably 35 to 45%. If the porosity is less than 35%, deformation during firing may increase. When the porosity exceeds 60%, the strength of the honeycomb structure may be lowered.
- the porosity is a value measured with a mercury porosimeter.
- the average pore diameter of the partition walls 1 of the honeycomb structure part 4 is preferably 2 to 15 ⁇ m, and more preferably 4 to 8 ⁇ m. If the average pore diameter is smaller than 2 ⁇ m, the electrical resistivity may be too large. If the average pore diameter is larger than 15 ⁇ m, the electrical resistivity may be too small.
- the average pore diameter is a value measured with a mercury porosimeter.
- the thickness of the outer peripheral wall 3 constituting the outermost periphery of the honeycomb structure 100 of the present embodiment is preferably 0.1 to 2 mm. If it is thinner than 0.1 mm, the strength of the honeycomb structure 100 may be lowered. If it is thicker than 2 mm, the area of the partition wall supporting the catalyst may be small.
- the shape of the cell 2 in a cross section perpendicular to the extending direction of the cell 2 is a quadrangle, a hexagon, an octagon, or a combination thereof. Among these, a square and a hexagon are preferable.
- the shape of the honeycomb structure of the present embodiment is not particularly limited.
- the bottom surface is a cylindrical shape (cylindrical shape), the bottom surface is an oval shape, and the bottom surface is a polygon (square, A pentagon, hexagon, heptagon, octagon, etc.) can be used.
- the honeycomb structure has a bottom surface area of preferably 2000 to 20000 mm 2 , more preferably 4000 to 10000 mm 2 .
- the length of the honeycomb structure in the central axis direction is preferably 50 to 200 mm, and more preferably 75 to 150 mm.
- the isostatic strength of the honeycomb structure 100 of the present embodiment is preferably 1 MPa or more, and more preferably 3 MPa or more.
- the isostatic strength is preferably as large as possible. However, considering the material, structure, etc. of the honeycomb structure 100, the upper limit is about 6 MPa. When the isostatic strength is less than 1 MPa, the honeycomb structure may be easily damaged when used as a catalyst carrier or the like. Isostatic strength is a value measured by applying hydrostatic pressure in water.
- the honeycomb structure 100 of the present embodiment preferably supports a catalyst and is used as a catalyst body.
- the honeycomb structure 110 of the present embodiment has a filler 7 filled in at least one slit 6, and the filler 7 fills at least a part of the space of the slit 6. It is what is done.
- two or more slits 6 are formed in the honeycomb structure portion 4 and 50% or more of the two or more slits 6 are filled with the filler.
- all of “two or more slits 6” formed in the honeycomb structure portion 4 are filled with a filler.
- the filler 7 is preferably filled in the entire “space of the slit 6”. In the honeycomb structure 110 shown in FIG. 5, six slits 6 are formed.
- FIG. 5 is a perspective view schematically showing another embodiment of the honeycomb structure of the present invention. “At least partially filled” may be “part” in the depth direction of the slit, “part” in the length direction of the slit, or a combination thereof.
- Filler 7 preferably contains 50% by mass or more of silicon carbide when the main component of the honeycomb structure portion is silicon carbide or a silicon-silicon carbide composite material. Thereby, the thermal expansion coefficient of the filler 7 can be made a value close to the thermal expansion coefficient of the honeycomb structure part, and the thermal shock resistance of the honeycomb structure can be improved.
- examples of other components contained in the filler 7 include a binder, a surfactant, a pore former, and water.
- the filler 7 may contain 50% by mass or more of silica, alumina or the like. In this case, examples of other components contained in the filler 7 include a surfactant, an organic binder, a foamed resin, and water.
- the Young's modulus of the filler 7 is preferably 0.001 to 20 GPa, more preferably 0.005 to 15 GPa, and 0.01 to 10 GPa. Particularly preferred. If it is lower than 0.001 GPa, the mechanical strength of the honeycomb structure 110 may be lowered. If it is higher than 20 GPa, the thermal shock resistance of the honeycomb structure 110 may be lowered.
- the porosity of the filler 7 is preferably 40 to 80%, more preferably 43 to 70%, and particularly preferably 45 to 65%. If it is lower than 40%, the mechanical strength of the honeycomb structure 110 may be lowered. If it is higher than 80%, the thermal shock resistance of the honeycomb structure 110 may be lowered.
- the electrical resistivity of the filler 7 is preferably 100 to 100,000%, more preferably 200 to 100,000%, more preferably 300% of the electrical resistivity of the honeycomb structure 4. Particularly preferred is from ⁇ 100,000%. If it is lower than 100%, current easily flows through the filler 7, so that it may be difficult to flow current uniformly through the honeycomb structure. There is no particular problem even if the electrical resistivity of the filler 7 is too high.
- the filler 7 may be an insulator. In practice, the upper limit of the electrical resistivity of the filler 7 is about 100,000% of the electrical resistivity of the honeycomb structure portion 4.
- a plurality of kinds of fillers may be used in combination. For example, it can be properly used depending on the part in one slit, or can be used properly depending on the slit when there are a plurality of slits.
- the honeycomb structure 120 of the present embodiment opposes the depth of the slit 6 in the other embodiment (honeycomb structure 110 (FIG. 5)) of the honeycomb structure of the present invention.
- the distance between the slits is shorter.
- the thermal shock resistance is improved, but it becomes difficult to generate uniform heat due to the difficulty of current flow. Therefore, it is preferable to appropriately determine the depth of the slit in consideration of these balances.
- the filler 6 is filled in the slit 6, but the filler 7 may not be filled in the slit 6.
- FIG. 6 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 130 of the present embodiment has a cross section perpendicular to the cell extending direction in the other embodiment of the honeycomb structure of the present invention (honeycomb structure 110 (FIG. 5)).
- the cell has a hexagonal shape.
- the “cell shape” in the cross section orthogonal to the cell extending direction may be simply referred to as “cell shape”. If the cell shape is a hexagon, there is an advantage that the stress from the outer periphery is dispersed.
- the filler 6 is filled in the slit 6, but the filler 7 may not be filled in the slit 6.
- FIG. 7 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- FIG. 8 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 150 of the present embodiment is the same as that of the honeycomb structure of the present invention (honeycomb structure 130 (FIG. 7)). It is a deeper one. Specifically, in the honeycomb structure 150 of the present embodiment, among the three slits formed in each of the region A and the region B, the depth of the slit located at the center is deeper. . In the honeycomb structure 150 of the present embodiment, the filler 6 is filled in the slit 6, but the filler 7 may not be filled in the slit 6.
- FIG. 9 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 160 of the present embodiment is the same as that of the honeycomb structure of the present invention (honeycomb structure 130 (FIG. 7)).
- the length of the “extending direction” is shortened.
- the honeycomb structure 160 of the present embodiment is formed such that the slit 6 opens at the side surface 5 and one end face of the honeycomb structure portion 4 and does not open at the other end face. .
- This can also be said to be a structure in which the slit 6 is formed only at one end of the honeycomb structure 4.
- FIG. 10 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 170 of the present embodiment is the same as that of the honeycomb structure of the present invention (honeycomb structure 160 (FIG. 10)).
- Short slits 6 are formed at both ends of the honeycomb structure.
- the filler 6 is filled in the slit 6, but the filler 7 may not be filled in the slit 6.
- FIG. 11 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 180 of the present embodiment is not formed with six slits extending in the “cell extending direction” in the honeycomb structure 130 shown in FIG. One slit parallel to the end face is formed.
- the slit 6 opens in the side surface of the honeycomb structure portion 4, does not open in the end surface of the honeycomb structure portion 4, and is formed in parallel to the end surface of the honeycomb structure 4. .
- the filler 6 is filled in the slit 6, but the filler 7 may not be filled in the slit 6.
- FIG. 12 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 200 of the present embodiment is close to the electrode portion 21 in the six slits extending in the “cell extending direction” in the honeycomb structure 140 shown in FIG. 8.
- Four slits are formed at positions covered by the electrode portion 21.
- the filler 6 is filled in the slit 6, but the filler 7 may not be filled in the slit 6.
- FIG. 14 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 220 of the present embodiment is obtained by forming a slit 22 in the electrode portion 21 in the honeycomb structure 140 shown in FIG. 8. Further, in addition to the six slits extending in the “cell extending direction” of the honeycomb structure 140 shown in FIG. 8, the honeycomb structure 220 communicates with the slits 22 formed in the electrode portion 21. Two more slits are formed in the honeycomb structure 4. Thus, by forming slits not only in the honeycomb structure part 4 but also in the highly rigid electrode part 21, the thermal shock resistance can be further improved.
- the slit formed in the honeycomb structure portion 4 so as to communicate with the slit 22 formed in the electrode portion 21 connects the central portions of the pair of electrode portions 21 and 21 in a cross section orthogonal to the cell extending direction. It is formed so as to overlap the straight line (center line).
- the honeycomb structure of the present invention may have a slit formed so as to overlap the straight line (center line) like the honeycomb structure 220 of the present embodiment.
- the slit formed so as not to intersect with the straight line (center line) improves the thermal shock resistance of the honeycomb structure 220 without significantly hindering the flow of current flowing between the pair of electrode portions 21 and 21. .
- FIG. 16 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the honeycomb structure 230 of the present embodiment is electrically connected between the portions of the electrode part 21 divided into two portions by the formation of the slit 22 in the honeycomb structure 220 shown in FIG. 16. Therefore, a terminal 23 for connecting the parts is provided. That is, the terminal 23 is disposed across the part of the electrode part 21 divided into two parts by forming the slit 22.
- the material of the terminal 23 is preferably the same as the material of the electrode portion 21.
- the filler 6 is filled in the slit 6 and the slit 22, but the filler 7 may not be filled in the slit 6 and / or the slit 22.
- FIG. 17 is a perspective view schematically showing still another embodiment of the honeycomb structure of the present invention.
- the method for manufacturing a honeycomb structure according to the present embodiment is a method for manufacturing a honeycomb structure in which a slit is not filled with a filler.
- a honeycomb formed body is manufactured by the following method.
- a metal silicon powder (metal silicon), a binder, a surfactant, a pore former, water, and the like are added to silicon carbide powder (silicon carbide) to produce a forming raw material.
- the mass of the metal silicon is 10 to 40% by mass with respect to the total of the mass of the silicon carbide powder and the mass of the metal silicon.
- the average particle diameter of the silicon carbide particles in the silicon carbide powder is preferably 3 to 50 ⁇ m, and more preferably 3 to 40 ⁇ m.
- the average particle diameter of metal silicon (metal silicon powder) is preferably 2 to 35 ⁇ m.
- the average particle diameter of silicon carbide particles and metal silicon is a value measured by a laser diffraction method.
- the silicon carbide particles are silicon carbide fine particles constituting the silicon carbide powder
- the metal silicon particles are metal silicon fine particles constituting the metal silicon powder.
- This is a composition of a forming raw material when the material of the honeycomb structure part is a silicon-silicon carbide composite material. When the material of the honeycomb structure part is silicon carbide, no metallic silicon is added.
- binder examples include methyl cellulose, hydroxypropyl methyl cellulose, hydroxypropoxyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, and polyvinyl alcohol. Among these, it is preferable to use methyl cellulose and hydroxypropoxyl cellulose in combination.
- the content of the binder is preferably 2.0 to 10.0 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- the water content is preferably 20 to 60 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- ethylene glycol, dextrin, fatty acid soap, polyalcohol or the like can be used as the surfactant. These may be used individually by 1 type and may be used in combination of 2 or more type.
- the content of the surfactant is preferably 0.1 to 2.0 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- the pore former is not particularly limited as long as it becomes pores after firing, and examples thereof include graphite, starch, foamed resin, water absorbent resin, silica gel and the like.
- the pore former content is preferably 0.5 to 10.0 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- the average particle size of the pore former is preferably 10 to 30 ⁇ m. If it is smaller than 10 ⁇ m, pores may not be formed sufficiently. If it is larger than 30 ⁇ m, the die may be clogged during molding.
- the average particle diameter of the pore former is a value measured by a laser diffraction method. When the pore former is a water absorbent resin, the average particle diameter of the pore former is the average particle diameter after water absorption.
- the forming raw material is kneaded to form a clay.
- molding raw material and forming a clay For example, the method of using a kneader, a vacuum clay kneader, etc. can be mentioned.
- the kneaded clay is extruded to produce a honeycomb formed body.
- a die having a desired overall shape, cell shape, partition wall thickness, cell density and the like.
- a cemented carbide which does not easily wear is preferable.
- the honeycomb formed body has a structure having partition walls that form a plurality of cells that serve as fluid flow paths and an outer peripheral wall that is positioned on the outermost periphery.
- the partition wall thickness, cell density, outer peripheral wall thickness and the like of the honeycomb formed body can be appropriately determined in accordance with the structure of the honeycomb structure of the present invention to be manufactured in consideration of shrinkage during drying and firing.
- the honeycomb formed body after drying may be referred to as “honeycomb dry body”.
- the drying method is not particularly limited, and examples thereof include an electromagnetic heating method such as microwave heating drying and high-frequency dielectric heating drying, and an external heating method such as hot air drying and superheated steam drying.
- the entire molded body can be dried quickly and uniformly without cracks, and after drying a certain amount of moisture with an electromagnetic heating method, the remaining moisture is dried with an external heating method. It is preferable to make it.
- drying conditions it is preferable to remove water of 30 to 99% by mass with respect to the amount of moisture before drying by an electromagnetic heating method, and then to make the moisture to 3% by mass or less by an external heating method.
- the electromagnetic heating method dielectric heating drying is preferable, and as the external heating method, hot air drying is preferable.
- honeycomb formed body honeycomb dried body
- the cutting method is not particularly limited, and examples thereof include a method using a circular saw cutting machine.
- an electrode part forming raw material for forming the electrode part is prepared.
- the electrode part forming raw material is preferably formed by adding a predetermined additive to silicon carbide powder and silicon powder and kneading.
- metal silicon powder metal silicon
- a binder a surfactant, a pore former, water and the like
- silicon carbide powder silicon carbide
- the mass of the metal silicon is preferably 20 to 40 parts by mass.
- the average particle diameter of the silicon carbide particles in the silicon carbide powder is preferably 10 to 60 ⁇ m.
- the average particle diameter of the metal silicon powder (metal silicon) is preferably 2 to 20 ⁇ m. If it is smaller than 2 ⁇ m, the electrical resistivity may be too small. If it is larger than 20 ⁇ m, the electrical resistivity may be too large.
- the average particle diameter of silicon carbide particles and metal silicon is a value measured by a laser diffraction method.
- the silicon carbide particles are silicon carbide fine particles constituting the silicon carbide powder, and the metal silicon particles are metal silicon fine particles constituting the metal silicon powder.
- binder examples include methyl cellulose, hydroxypropyl methyl cellulose, hydroxypropoxyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, and polyvinyl alcohol. Among these, it is preferable to use methyl cellulose and hydroxypropoxyl cellulose in combination.
- the binder content is preferably 0.1 to 5.0 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- the water content is preferably 15 to 60 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- ethylene glycol, dextrin, fatty acid soap, polyalcohol or the like can be used as the surfactant. These may be used individually by 1 type and may be used in combination of 2 or more type.
- the content of the surfactant is preferably 0.1 to 2.0 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- the pore former is not particularly limited as long as it becomes pores after firing, and examples thereof include graphite, starch, foamed resin, water absorbent resin, silica gel and the like.
- the pore former content is preferably 0.1 to 5.0 parts by mass when the total mass of the silicon carbide powder and the metal silicon powder is 100 parts by mass.
- the average particle size of the pore former is preferably 10 to 30 ⁇ m. If it is smaller than 10 ⁇ m, pores may not be formed sufficiently. When it is larger than 30 ⁇ m, air holes are easily formed, and the strength may be lowered.
- the average particle diameter of the pore former is a value measured by a laser diffraction method.
- the mixture obtained by mixing silicon carbide powder (silicon carbide), metal silicon (metal silicon powder), binder, surfactant, pore former, water, etc. is kneaded to form a paste-like electrode part It is preferable to use it as a raw material.
- the method of kneading is not particularly limited, and for example, a vertical stirrer can be used.
- the method for applying the electrode part forming raw material to the side surface of the honeycomb dried body is not particularly limited, and for example, a printing method can be used.
- the electrode part forming raw material is preferably applied to the side surface of the honeycomb dried body so as to have the shape of the electrode part in the honeycomb structure of the present invention.
- the thickness of an electrode part can be made into desired thickness by adjusting the thickness when apply
- the electrode part can be formed simply by applying the electrode part forming raw material to the side surface of the honeycomb dried body, and drying and firing, the electrode part can be formed very easily.
- the electrode part forming raw material applied to the side surface of the honeycomb dried body it is preferable to dry the electrode part forming raw material applied to the side surface of the honeycomb dried body to produce a “honeycomb dried body with electrode part raw material”.
- the drying conditions are preferably 50 to 100 ° C.
- the slit is preferably formed using a router or the like.
- the slit is formed so as to open on the side surface of the dried honeycomb body with electrode part raw material.
- at least one slit is formed so as not to intersect a straight line connecting the center portions of the pair of electrode portions in a cross section orthogonal to the cell extending direction.
- the same slit as the preferred embodiment of the slit formed in the honeycomb structure of the present invention is preferable.
- the slits may be formed after firing the dried honeycomb body with electrode part raw material.
- the electrode part forming raw material may be applied to the dried honeycomb body after forming the slits in the dried honeycomb body.
- Pre-baking is preferably performed at 400 to 500 ° C. for 0.5 to 20 hours in an air atmosphere.
- firing main firing
- oxygenation treatment at 1200 to 1350 ° C. for 1 to 10 hours after firing to improve durability.
- the method of temporary baking and baking is not particularly limited, and baking can be performed using an electric furnace, a gas furnace, or the like.
- the method for manufacturing a honeycomb structure according to the present embodiment is a method for manufacturing a honeycomb structure in which a slit is filled with a filler (having a filler). For example, a method for producing a honeycomb structure as shown in any of FIGS.
- the manufacturing method of the honeycomb structure of the present embodiment it is preferable to first prepare the “honeycomb dried body with electrode part raw material” in the same manner as in the embodiment of the manufacturing method of the honeycomb structure of the present invention. .
- the electrode part raw material in the case where the same material as the electrode part is used as the filler, after preparing the “honeycomb dry body with electrode part raw material”, the electrode part raw material, as in the above-described embodiment of the method for manufacturing a honeycomb structure of the present invention It is preferable to form slits in the dried honeycomb body. And it is preferable to prepare the raw material for fillers.
- the raw material for the filler is preferably the same composition as that of the electrode part forming raw material.
- the drying conditions are preferably 50 to 100 ° C.
- a honeycomb structure such as the honeycomb structure shown in any of FIGS.
- the firing conditions are preferably the same as the preferred firing conditions in the embodiment of the method for manufacturing the honeycomb structure of the present invention.
- the filler When a material that requires heat treatment at a temperature lower than the firing temperature of the electrode part is used as the filler, after preparing the “honeycomb dried body with electrode part raw material”, temporary firing and main firing are performed, It is preferable to obtain an “attached honeycomb fired body”. And after that, it is preferable to form slits in the honeycomb fired body with electrode portions.
- Each condition of the pre-firing, the main firing, and the slit formation is preferably the same as in the embodiment of the method for manufacturing the honeycomb structure of the present invention. Then, it is preferable to obtain a honeycomb structure by filling the honeycomb fired body with electrode portions in which slits are formed with a raw material for filler, drying, and heat-treating.
- the raw material for filler When filling the raw material for filler into the slit, it is preferable to use a spatula or the like.
- a raw material for fillers it is preferable to contain inorganic particles and an inorganic adhesive. It is preferable that the raw material for filler further contains an organic binder, a surfactant, a foamed resin, water and the like.
- the inorganic particles include plate-like particles, spherical particles, massive particles, fibrous particles, and acicular particles.
- examples of the material of the inorganic particles include silicon carbide, mica, talc, boron nitride, and glass flakes.
- the inorganic particles may be a mixture of a plurality of types of inorganic particles.
- the inorganic particles preferably contain at least 50% by mass or more of silicon carbide particles.
- the inorganic adhesive include colloidal silica (SiO 2 sol), colloidal alumina (alumina sol), various oxide sols, ethyl silicate, water glass, silica polymer, and aluminum phosphate.
- Example 1 Silicon carbide (SiC) powder and metal silicon (Si) powder are mixed at a mass ratio of 80:20 to produce a silicon carbide-metal silicon mixture. Then, hydroxypropylmethylcellulose as a binder and a water-absorbing resin as a pore former are added to the silicon carbide-metal silicon mixture, and water is added to form a forming raw material. The forming raw material is kneaded with a vacuum kneader, and cylindrical. The dredged soil was made. The content of the binder was 7 parts by mass when the total of silicon carbide (SiC) powder and metal silicon (Si) powder was 100 parts by mass.
- the content of the pore former was 3 parts by mass when the total of the silicon carbide (SiC) powder and the metal silicon (Si) powder was 100 parts by mass.
- the water content was 42 parts by mass when the total of silicon carbide (SiC) powder and metal silicon (Si) powder was 100 parts by mass.
- the average particle size of the silicon carbide powder was 20 ⁇ m, and the average particle size of the metal silicon powder was 6 ⁇ m.
- the average particle diameter of the pore former was 20 ⁇ m.
- the average particle diameters of silicon carbide, metal silicon and pore former are values measured by a laser diffraction method.
- the obtained columnar kneaded material was molded using an extrusion molding machine to obtain a honeycomb molded body.
- the obtained honeycomb formed body was dried by high-frequency dielectric heating and then dried at 120 ° C. for 2 hours using a hot air dryer, and both end surfaces were cut by a predetermined amount.
- silicon carbide (SiC) powder and metal silicon (Si) powder are mixed at a mass ratio of 60:40, and hydroxypropylmethylcellulose as a binder, glycerin as a humectant, and a surfactant as a dispersant are added thereto.
- water was added and mixed.
- the mixture was kneaded to obtain an electrode part forming raw material.
- the content of the binder was 0.5 parts by mass when the total of silicon carbide (SiC) powder and metal silicon (Si) powder was 100 parts by mass.
- the content of glycerin was 10 parts by mass when the total of silicon carbide (SiC) powder and metal silicon (Si) powder was 100 parts by mass.
- the content of the surfactant was 0.3 parts by mass when the total of the silicon carbide (SiC) powder and the metal silicon (Si) powder was 100 parts by mass.
- the water content was 42 parts by mass when the total of silicon carbide (SiC) powder and metal silicon (Si) powder was 100 parts by mass.
- the average particle diameter of the silicon carbide powder was 52 ⁇ m, and the average particle diameter of the metal silicon powder was 6 ⁇ m.
- the average particle diameter of silicon carbide and metal silicon is a value measured by a laser diffraction method. The kneading was performed with a vertical stirrer.
- the electrode part forming raw material has a thickness of 0.15 mm on the side surface of the dried honeycomb formed body, and “0.5 times the central angle in a cross section orthogonal to the cell extending direction is 50 °” Then, it was applied in a strip shape so as to extend between both end portions (between both end surfaces) of the honeycomb formed body.
- the electrode part forming raw material was applied to two sides of the dried honeycomb formed body. And, in the cross section orthogonal to the cell extending direction, one of the portions coated with the two electrode part forming raw materials is arranged on the opposite side across the center of the honeycomb formed body with respect to the other. did.
- the electrode part forming raw material applied to the honeycomb formed body was dried to obtain a dried honeycomb body with electrode part raw material.
- the drying conditions were 70 ° C.
- the slit was formed using a luter.
- the dried honeycomb body with electrode part raw material having slits was degreased, fired, and further oxidized to obtain a honeycomb structure.
- the degreasing conditions were 550 ° C. for 3 hours.
- the firing conditions were 1450 ° C. and 2 hours in an argon atmosphere.
- the conditions for the oxidation treatment were 1300 ° C. and 1 hour.
- the obtained honeycomb structure was formed with four slits 6 in total, two on each of the two side surfaces 5 where the electrode portion 21 was not provided. It was.
- the slit depth was 3 mm.
- the slit width was 1 mm.
- the slit angle was 120 °.
- the distance D between the electrode portion 21 and the “shortest distance slit” 6a was 1 mm.
- the slit and the “straight line connecting the center portions of the pair of electrode portions” (center line) did not intersect.
- the cell shape in a cross section perpendicular to the cell extending direction was a hexagon.
- FIG. 15 is a perspective view schematically showing the honeycomb structure 210 of Example 1.
- FIG. 15 is a perspective view schematically showing the honeycomb structure 210 of Example 1.
- the average pore diameter (pore diameter) of the partition walls of the obtained honeycomb structure was 8.6 ⁇ m, and the porosity was 45%.
- the average pore diameter and porosity are values measured with a mercury porosimeter.
- the honeycomb structure had a partition wall thickness of 90 ⁇ m and a cell density of 90 cells / cm 2 .
- the bottom surface of the honeycomb structure was a circle having a diameter (outer diameter) of 93 mm, and the length of the honeycomb structure in the cell extending direction was 100 mm.
- 0.5 times the central angle in the cross section perpendicular to the cell extending direction of the two electrode portions of the honeycomb structure was 50 °.
- the thickness of the two electrode portions was 1.5 mm.
- the electrical resistivity of the electrode part was 1.3 ⁇ cm
- the electrical resistivity of the honeycomb structure part was 100 ⁇ cm
- the cell shape in the cross section orthogonal to the cell extending direction of the honeycomb structure was a hexagon.
- honeycomb structure was subjected to “thermal shock resistance test” and “maximum temperature measurement during energization” by the following methods. The results are shown in Table 1.
- the electrical resistivity of the honeycomb structure part and the electrode part was measured by the following method.
- a test piece of 10 mm ⁇ 10 mm ⁇ 50 mm was made of the same material as the measurement object. That is, when measuring the electrical resistivity of the honeycomb structure, a test piece was made of the same material as the honeycomb structure, and when measuring the electrical resistivity of the electrode, the test piece was made of the same material as the electrode. .
- a silver paste was applied to the entire surface of both ends of the test piece, and wiring was performed so that current could be supplied.
- a voltage application current measuring device was connected to the test piece.
- a thermocouple was installed at the center of the test piece.
- a voltage was applied to the test piece, and the change with time of the test piece temperature at the time of voltage application was confirmed with a recorder. More specifically, a voltage of 100 to 200 V is applied, a current value and a voltage value are measured in a state where the test piece temperature is 400 ° C., and an electric resistivity is obtained from the obtained current value and voltage value and the test piece size. Was calculated.
- Thermal shock resistance test Conducted heating / cooling test of honeycomb structure using ⁇ propane gas burner tester equipped with metal case housing honeycomb structure and propane gas burner capable of supplying heating gas into the metal case '' did.
- the heated gas was a combustion gas generated by burning propane gas with a gas burner (propane gas burner).
- the thermal shock resistance was evaluated by confirming whether the honeycomb structure was cracked by the heating and cooling test.
- the obtained honeycomb structure was housed (canned) in a metal case of a propane gas burner testing machine.
- gas (combustion gas) heated by a propane gas burner was supplied into the metal case so that it passed through the honeycomb structure.
- the temperature condition of the heated gas flowing into the metal case was as follows.
- the temperature was raised to a specified temperature in 5 minutes, held at the specified temperature for 10 minutes, then cooled to 100 ° C. in 5 minutes, and held at 100 ° C. for 10 minutes.
- temperature raising and cooling operation Such a series of operations of raising temperature, cooling and holding is referred to as “temperature raising and cooling operation”. Thereafter, cracks in the honeycomb structure were confirmed. Then, the above “temperature increase and cooling operation” was repeated while increasing the designated temperature from 825 ° C. by 25 ° C. The designated temperature was set in 10 steps from 825 ° C to 25 ° C. That is, the “temperature increase and cooling operation” was performed until the specified temperature reached 1050 ° C.
- the honeycomb structure that does not crack until the specified temperature exceeds 900 ° C. passes the thermal shock resistance test. That is, if a crack does not occur at a specified temperature of 900 ° C., even if a crack occurs at a higher specified temperature, it is acceptable.
- the column of “Thermal shock resistance test” indicates a specified temperature when a crack occurs in the honeycomb structure in the thermal shock resistance test.
- the highest temperature among the measured temperatures is set as the maximum temperature.
- the position where the end part (circumferential end part) of the electrode part is in contact or the position where the center point in the circumferential direction of the electrode part is in contact is the position where the most current flows. This is the highest temperature part. In this way, the heat generation bias of the honeycomb structure is evaluated. And if the maximum temperature of the said honeycomb structure is 200 degrees C or less, it can be said that the deviation of the temperature distribution in a honeycomb structure is suppressed, and is a pass.
- Example 2 to 10 Comparative Examples 1 and 2
- Example 2 to 10 A honeycomb structure was manufactured in the same manner as in Example 1 except that the conditions were changed as shown in Table 1.
- the “thermal shock resistance test” and the “maximum temperature measurement during energization” were performed. The results are shown in Table 1.
- Example 11 to 15 A “honeycomb dried body with electrode part raw material having slits” was produced in the same manner as in Example 1 except that the distance D between the electrode part 21 and the “shortest distance slit” 6a was 10 mm. Then, the filler raw material was filled into the “honeycomb dry body with electrode part raw material in which slits were formed” using a spatula to obtain “honeycomb dry body with filler raw material”. Thereafter, the “honeycomb dried body with filler material” was dried at 70 ° C., degreased and fired in the same manner as in Example 1, and the honeycomb structure in which the Young's modulus and porosity of the filler were the values shown in Table 1. Got the body. The raw material for the filler has the same composition as the electrode part forming raw material. In the same manner as in Example 1, the “thermal shock resistance test” and the “maximum temperature measurement during energization” were performed. The results are shown in Table 1.
- Filler Young's modulus is a value measured by a bending resonance method in accordance with JIS R1602.
- the test piece used for the measurement was produced by the following method. First, the bulk body was produced using the raw material which forms a filler. And what cut out this bulk body into the magnitude
- the filler porosity is a value measured with a mercury porosimeter.
- honeycomb structure with slits is excellent in thermal shock resistance and the maximum temperature when energized is low.
- honeycomb structure of the present invention can be suitably used as a catalyst carrier for an exhaust gas purifying device that purifies exhaust gas from automobiles.
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Abstract
Description
本発明のハニカム構造体の一の実施形態は、図1~図3に示すように、筒状のハニカム構造部4と、一対の電極部21とを備えるものである。筒状のハニカム構造部4は、流体の流路となる一方の端面11から他方の端面12まで延びる複数のセル2を区画形成する多孔質の隔壁1と、最外周に位置する外周壁3とを有するものである。一対の電極部21は、ハニカム構造部4の側面5に配設されたものである。本実施形態のハニカム構造体100は、ハニカム構造部4の電気抵抗率が、1~200Ωcmである。そして、本実施形態のハニカム構造体100は、一対の電極部21,21のそれぞれが、ハニカム構造部4のセル2の延びる方向に延びる帯状に形成されたものである。そして、本実施形態のハニカム構造体100は、セル2の延びる方向に直交する断面において、一方の電極部21が、他方の電極部21に対して、ハニカム構造部4の中心Oを挟んで反対側に配設されたものである。一方の電極部21は、一対の電極部21,21における(一対の電極部21,21の中の)一方の電極部21であり、他方の電極部21は、一対の電極部21,21における(一対の電極部21,21の中の)他方の電極部21である。換言すると、一対の電極部21,21の中の片方の電極部21が一方の電極部21であり、一対の電極部21,21の中の残りの片方の電極部21が他方の電極部21である。そして、本実施形態のハニカム構造体100は、ハニカム構造部4に、側面5に開口するスリット6が1本以上形成されたものである。そして、本実施形態のハニカム構造体100は、少なくとも1本のスリット6が、セル2の延びる方向に直交する断面において、「一対の電極部21,21のそれぞれの中央部C,C同士を結んだ直線(中心線)L」と交差しないように形成されている。図1は、本発明のハニカム構造体の一の実施形態を模式的に示す斜視図である。図2は、本発明のハニカム構造体の一の実施形態の、セルの延びる方向に直交する断面を示す模式図である。図3は、本発明のハニカム構造体の一の実施形態の、セルの延びる方向に平行な断面を示す模式図である。
次に、本発明のハニカム構造体の製造方法の一の実施形態について説明する。本実施形態のハニカム構造体の製造方法は、スリットに充填材が充填されていないハニカム構造体の製造方法である。
炭化珪素(SiC)粉末と金属珪素(Si)粉末とを80:20の質量割合で混合して、炭化珪素-金属珪素混合物を作製する。そして、炭化珪素-金属珪素混合物に、バインダとしてヒドロキシプロピルメチルセルロース、造孔材として吸水性樹脂を添加すると共に、水を添加して成形原料とし、成形原料を真空土練機により混練し、円柱状の坏土を作製した。バインダの含有量は炭化珪素(SiC)粉末と金属珪素(Si)粉末の合計を100質量部としたときに7質量部であった。造孔材の含有量は炭化珪素(SiC)粉末と金属珪素(Si)粉末の合計を100質量部としたときに3質量部であった。水の含有量は炭化珪素(SiC)粉末と金属珪素(Si)粉末の合計を100質量部としたときに42質量部であった。炭化珪素粉末の平均粒子径は20μmであり、金属珪素粉末の平均粒子径は6μmであった。また、造孔材の平均粒子径は、20μmであった。炭化珪素、金属珪素及び造孔材の平均粒子径は、レーザー回折法で測定した値である。
「ハニカム構造体を収納する金属ケースと、当該金属ケース内に加熱ガスを供給することができるプロパンガスバーナーと、を備えたプロパンガスバーナー試験機」を用いてハニカム構造体の加熱冷却試験を実施した。上記加熱ガスは、ガスバーナー(プロパンガスバーナー)でプロパンガスを燃焼させることにより発生する燃焼ガスとした。そして、上記加熱冷却試験によって、ハニカム構造体にクラックが発生するか否かを確認することにより、耐熱衝撃性を評価した。具体的には、まず、プロパンガスバーナー試験機の金属ケースに、得られたハニカム構造体を収納(キャニング)した。そして、金属ケース内に、プロパンガスバーナーにより加熱されたガス(燃焼ガス)を供給し、ハニカム構造体内を通過するようにした。金属ケースに流入する加熱ガスの温度条件(入口ガス温度条件)を以下のようにした。まず、5分で指定温度まで昇温し、指定温度で10分間保持し、その後、5分で100℃まで冷却し、100℃で10分間保持した。このような昇温、冷却、保持の一連の操作を「昇温、冷却操作」と称する。その後、ハニカム構造体のクラックを確認した。そして、指定温度を825℃から25℃ずつ上昇させながら上記「昇温、冷却操作」を繰り返した。指定温度は、825℃から25℃ずつ、10段階設定した。つまり、上記「昇温、冷却操作」は、指定温度が1050℃になるまで行った。指定温度が高くなると昇温峻度が大きくなり、中心部に対して外周部の昇温が遅れることにより、中心部と外周部の温度差が拡大し、発生応力が大きくなる。指定温度が900℃を超えるまでクラックが発生しないハニカム構造体は、耐熱衝撃性試験が合格である。つまり、指定温度900℃においてクラックが発生しなければ、更に高い指定温度においてクラックが発生しても合格であり、指定温度900℃以下でクラックが発生した場合に不合格となる。表1において、「耐熱衝撃性試験」の欄は、耐熱衝撃性試験において、ハニカム構造体にクラックが発生したときの指定温度を示している。
まず、ハニカム構造体に200Vの電圧を印加し、通電試験を行った。そして、その際のハニカム構造体の最高温度を測定した。具体的には、ハニカム構造体に200Vの電圧を印加したときの、ハニカム構造部の「セルの延びる方向に直交する断面における、電極部の端部(周方向の端部)が接する位置」の温度を測定する。そして、ハニカム構造体に200Vの電圧を印加したときの、ハニカム構造部の「セルの延びる方向に直交する断面における、電極部の周方向の中央点が接する位置」の温度を測定する。そして、測定した温度の中の最も高い温度を、最高温度とする。ハニカム構造部における、電極部の端部(周方向の端部)が接する位置か、電極部の周方向の中央点が接する位置のいずれかが、最も電流が流れる位置であり、ハニカム構造体において最も高い温度となる部分である。このようにして、ハニカム構造体の発熱偏りを評価する。そして、上記ハニカム構造体の最高温度が200℃以下であれば、ハニカム構造体における温度分布の偏りが抑制された状態であるということができ、合格である。
各条件を、表1に示すように変更した以外は、実施例1と同様にしてハニカム構造体を作製した。実施例1の場合と同様にして、「耐熱衝撃性試験」及び「通電時最高温度測定」を行った。結果を表1に示す。
電極部21と「最短距離スリット」6aとの距離Dを10mmにした以外は実施例1と同様にして、「スリットを形成した電極部原料付きハニカム乾燥体」を作製した。そして、「スリットを形成した電極部原料付きハニカム乾燥体」に充填材用原料を、箆(へら)を用いて充填し、「充填材用原料付きハニカム乾燥体」を得た。その後、「充填材用原料付きハニカム乾燥体」を70℃で乾燥し、実施例1と同様にして脱脂、焼成し、充填材のヤング率と気孔率とが表1に示す値であるハニカム構造体を得た。充填材用原料は、電極部形成原料と同じ組成とした。実施例1の場合と同様にして、「耐熱衝撃性試験」及び「通電時最高温度測定」を行った。結果を表1に示す。
Claims (7)
- 流体の流路となる一方の端面から他方の端面まで延びる複数のセルを区画形成する多孔質の隔壁と、最外周に位置する外周壁とを有する筒状のハニカム構造部と、前記ハニカム構造部の側面に配設された一対の電極部とを備え、
前記ハニカム構造部の電気抵抗率が、1~200Ωcmであり、
前記一対の電極部のそれぞれが、前記ハニカム構造部のセルの延びる方向に延びる帯状に形成され、
前記セルの延びる方向に直交する断面において、前記一対の電極部における一方の前記電極部が、前記一対の電極部における他方の前記電極部に対して、前記ハニカム構造部の中心を挟んで反対側に配設され、
前記ハニカム構造部に、側面に開口するスリットが1本以上形成され、
少なくとも1本の前記スリットが、前記セルの延びる方向に直交する断面において、前記一対の電極部のそれぞれの中央部同士を結んだ直線と交差しないように形成されているハニカム構造体。 - 前記ハニカム構造部に、前記スリットが2本以上形成され、
前記2本以上のスリットの中の50%以上のスリットが、前記セルの延びる方向に直交する断面において、前記一対の電極部のそれぞれの中央部同士を結んだ直線と交差しないように形成されている請求項1に記載のハニカム構造体。 - 前記ハニカム構造部に形成された前記スリットの全てが、前記セルの延びる方向に直交する断面において、前記一対の電極部のそれぞれの中央部同士を結んだ直線と交差しないように形成されている請求項2に記載のハニカム構造体。
- 少なくとも1本の前記スリットに充填される充填材を有し、
前記充填材が、前記スリットの空間の少なくとも一部に充填される請求項1~3のいずれかに記載のハニカム構造体。 - 前記ハニカム構造部に、前記スリットが2本以上形成され、
前記2本以上のスリットの中の50%以上のスリットに充填材が充填されている請求項4に記載のハニカム構造体。 - 前記ハニカム構造部に形成された2本以上の前記スリットの全てに充填材が充填されている請求項5に記載のハニカム構造体。
- 前記充填材が、前記スリットの空間の全部に充填される請求項4~6のいずれかに記載のハニカム構造体。
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014198446A (ja) * | 2013-03-29 | 2014-10-23 | 日本碍子株式会社 | ハニカム構造体及びその製造方法 |
WO2015053133A1 (ja) * | 2013-10-08 | 2015-04-16 | 日本碍子株式会社 | ハニカム構造体 |
EP2918341A1 (en) | 2014-03-13 | 2015-09-16 | NGK Insulators, Ltd. | Honeycomb structure |
WO2015151823A1 (ja) * | 2014-03-31 | 2015-10-08 | 日本碍子株式会社 | ハニカム構造体 |
JP2016087605A (ja) * | 2014-11-10 | 2016-05-23 | 日本碍子株式会社 | ハニカムフィルタ |
DE102018221558A1 (de) | 2017-12-15 | 2019-06-19 | Ngk Insulators, Ltd. | Wabenstruktur |
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DE102019203879A1 (de) | 2018-03-28 | 2019-10-10 | Ngk Insulators, Ltd. | Wabenstruktur |
US10655526B1 (en) | 2018-11-16 | 2020-05-19 | Ngk Insulators, Ltd. | Support for electric heating type catalyst and exhaust gas purifying device |
WO2022176321A1 (ja) * | 2021-02-16 | 2022-08-25 | 株式会社デンソー | 電極付きハニカム基材 |
JP2022143977A (ja) * | 2021-03-18 | 2022-10-03 | トヨタ自動車株式会社 | 電気加熱式触媒装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6126434B2 (ja) * | 2013-03-29 | 2017-05-10 | 日本碍子株式会社 | ハニカム構造体 |
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US11215096B2 (en) | 2019-08-21 | 2022-01-04 | Corning Incorporated | Systems and methods for uniformly heating a honeycomb body |
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JP2022137989A (ja) * | 2021-03-09 | 2022-09-22 | 日本碍子株式会社 | ハニカム構造体の製造方法及び装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03295184A (ja) * | 1990-04-12 | 1991-12-26 | Ngk Insulators Ltd | 抵抗調節型ヒーター及び触媒コンバーター |
JPH05144549A (ja) | 1991-11-21 | 1993-06-11 | Ngk Insulators Ltd | ヒーターユニツト |
JPH08218857A (ja) * | 1995-02-15 | 1996-08-27 | Honda Motor Co Ltd | 電気加熱式触媒 |
JPH0988566A (ja) * | 1995-09-21 | 1997-03-31 | Shimadzu Corp | 排ガス浄化装置 |
JPH09103684A (ja) * | 1995-10-13 | 1997-04-22 | Ngk Insulators Ltd | 並列発熱型ハニカムヒーター |
JPH10325314A (ja) * | 1998-05-25 | 1998-12-08 | Ngk Insulators Ltd | 抵抗調節型ヒーター及び触媒コンバーター |
JP2002273124A (ja) * | 2001-03-16 | 2002-09-24 | Ngk Insulators Ltd | 排ガス浄化用ハニカムフィルター |
JP4136319B2 (ja) | 2000-04-14 | 2008-08-20 | 日本碍子株式会社 | ハニカム構造体及びその製造方法 |
JP2010115896A (ja) * | 2008-11-14 | 2010-05-27 | Ngk Insulators Ltd | ハニカム構造体の製造方法 |
JP2010229976A (ja) * | 2009-03-30 | 2010-10-14 | Ngk Insulators Ltd | 通電発熱用ハニカム体及びその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69102808T3 (de) * | 1990-04-12 | 2000-11-16 | Ngk Insulators Ltd | Heizgerät und Katalysatoreinrichtung. |
CA2045726C (en) * | 1990-06-29 | 1997-09-09 | Takashi Harada | Resistance adjusting type heater, catalytic converter and method of controlling automotive exhaust emissions |
JP2898364B2 (ja) * | 1990-07-06 | 1999-05-31 | 日本碍子株式会社 | 電極一体型ハニカムヒーター及びその製造方法 |
US5288975A (en) | 1991-01-30 | 1994-02-22 | Ngk Insulators, Ltd. | Resistance adjusting type heater |
JP3001281B2 (ja) * | 1991-03-06 | 2000-01-24 | 日本碍子株式会社 | ハニカムモノリスヒータ |
JPH06254413A (ja) * | 1993-03-01 | 1994-09-13 | Ngk Insulators Ltd | 乱流穴を有するハニカム体 |
CA2119604C (en) * | 1993-07-29 | 1997-02-18 | Minoru Machida | Ceramic honeycomb structural body and catalyst comprising the same |
WO2004073969A2 (en) * | 2003-02-18 | 2004-09-02 | Corning Incorporated | Ceramic honeycomb body and process for manufacture |
JP5617764B2 (ja) * | 2010-09-27 | 2014-11-05 | 株式会社デンソー | ハニカム構造体及び電気加熱式触媒装置 |
JP6126434B2 (ja) * | 2013-03-29 | 2017-05-10 | 日本碍子株式会社 | ハニカム構造体 |
-
2013
- 2013-03-27 EP EP13767695.3A patent/EP2832446B1/en active Active
- 2013-03-27 JP JP2014507991A patent/JP5997259B2/ja active Active
- 2013-03-27 WO PCT/JP2013/059145 patent/WO2013146955A1/ja active Application Filing
- 2013-03-27 CN CN201380018510.5A patent/CN104245133B/zh active Active
-
2014
- 2014-09-25 US US14/496,738 patent/US9707515B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03295184A (ja) * | 1990-04-12 | 1991-12-26 | Ngk Insulators Ltd | 抵抗調節型ヒーター及び触媒コンバーター |
JP2931362B2 (ja) | 1990-04-12 | 1999-08-09 | 日本碍子株式会社 | 抵抗調節型ヒーター及び触媒コンバーター |
JPH05144549A (ja) | 1991-11-21 | 1993-06-11 | Ngk Insulators Ltd | ヒーターユニツト |
JPH08218857A (ja) * | 1995-02-15 | 1996-08-27 | Honda Motor Co Ltd | 電気加熱式触媒 |
JPH0988566A (ja) * | 1995-09-21 | 1997-03-31 | Shimadzu Corp | 排ガス浄化装置 |
JPH09103684A (ja) * | 1995-10-13 | 1997-04-22 | Ngk Insulators Ltd | 並列発熱型ハニカムヒーター |
JPH10325314A (ja) * | 1998-05-25 | 1998-12-08 | Ngk Insulators Ltd | 抵抗調節型ヒーター及び触媒コンバーター |
JP4136319B2 (ja) | 2000-04-14 | 2008-08-20 | 日本碍子株式会社 | ハニカム構造体及びその製造方法 |
JP2002273124A (ja) * | 2001-03-16 | 2002-09-24 | Ngk Insulators Ltd | 排ガス浄化用ハニカムフィルター |
JP2010115896A (ja) * | 2008-11-14 | 2010-05-27 | Ngk Insulators Ltd | ハニカム構造体の製造方法 |
JP2010229976A (ja) * | 2009-03-30 | 2010-10-14 | Ngk Insulators Ltd | 通電発熱用ハニカム体及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2832446A4 |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9359929B2 (en) | 2013-03-29 | 2016-06-07 | Ngk Insulators, Ltd. | Honeycomb structure and manufacturing method of the same |
EP2784048A3 (en) * | 2013-03-29 | 2015-03-11 | NGK Insulators, Ltd. | Honeycomb structure and manufacturing method of the same |
JP2014198446A (ja) * | 2013-03-29 | 2014-10-23 | 日本碍子株式会社 | ハニカム構造体及びその製造方法 |
US9885271B2 (en) | 2013-10-08 | 2018-02-06 | Ngk Insulators, Ltd. | Honeycomb structure |
WO2015053133A1 (ja) * | 2013-10-08 | 2015-04-16 | 日本碍子株式会社 | ハニカム構造体 |
EP3056274B1 (en) * | 2013-10-08 | 2020-02-12 | NGK Insulators, Ltd. | Honeycomb structure |
CN105705236A (zh) * | 2013-10-08 | 2016-06-22 | 日本碍子株式会社 | 蜂窝结构体 |
JPWO2015053133A1 (ja) * | 2013-10-08 | 2017-03-09 | 日本碍子株式会社 | ハニカム構造体 |
US9835063B2 (en) | 2014-03-13 | 2017-12-05 | Ngk Insulators, Ltd. | Honeycomb structure |
EP2918341A1 (en) | 2014-03-13 | 2015-09-16 | NGK Insulators, Ltd. | Honeycomb structure |
JP2015174011A (ja) * | 2014-03-13 | 2015-10-05 | 日本碍子株式会社 | ハニカム構造体 |
JPWO2015151823A1 (ja) * | 2014-03-31 | 2017-04-13 | 日本碍子株式会社 | ハニカム構造体 |
US9993813B2 (en) | 2014-03-31 | 2018-06-12 | Ngk Insulators, Ltd. | Honeycomb structure |
WO2015151823A1 (ja) * | 2014-03-31 | 2015-10-08 | 日本碍子株式会社 | ハニカム構造体 |
JP2016087605A (ja) * | 2014-11-10 | 2016-05-23 | 日本碍子株式会社 | ハニカムフィルタ |
DE102018221558A1 (de) | 2017-12-15 | 2019-06-19 | Ngk Insulators, Ltd. | Wabenstruktur |
DE102018221558B4 (de) | 2017-12-15 | 2021-07-08 | Ngk Insulators, Ltd. | Wabenstruktur |
US10681779B2 (en) | 2017-12-15 | 2020-06-09 | Ngk Insulators, Ltd. | Honeycomb structure |
DE102019203467A1 (de) | 2018-03-28 | 2019-10-02 | Ngk Insulators, Ltd. | Wabenstruktur |
US11420195B2 (en) | 2018-03-28 | 2022-08-23 | Ngk Insulators, Ltd. | Honeycomb structure |
DE102019203879B4 (de) | 2018-03-28 | 2024-06-27 | Ngk Insulators, Ltd. | Wabenstruktur |
DE102019203467B4 (de) | 2018-03-28 | 2024-05-29 | Ngk Insulators, Ltd. | Wabenstruktur |
DE102019203879A1 (de) | 2018-03-28 | 2019-10-10 | Ngk Insulators, Ltd. | Wabenstruktur |
US11396009B2 (en) | 2018-03-28 | 2022-07-26 | Ngk Insulators, Ltd. | Honeycomb structure |
DE102019203958A1 (de) | 2018-03-29 | 2019-10-02 | Ngk Insulators, Ltd. | Träger für einen elektrischen heizkatalysator |
US10450919B1 (en) | 2018-03-29 | 2019-10-22 | Ngk Insulators, Ltd. | Support for electric heating type catalyst |
DE102019203958B4 (de) | 2018-03-29 | 2023-02-16 | Ngk Insulators, Ltd. | Träger für elektrisch beheizten katalysator |
DE102019217589A1 (de) | 2018-11-16 | 2020-05-20 | Ngk Insulators, Ltd., | Träger für einen elektrisch beheizten katalysator und abgasreinigungsvorrichtung |
US10655526B1 (en) | 2018-11-16 | 2020-05-19 | Ngk Insulators, Ltd. | Support for electric heating type catalyst and exhaust gas purifying device |
WO2022176321A1 (ja) * | 2021-02-16 | 2022-08-25 | 株式会社デンソー | 電極付きハニカム基材 |
JP2022143977A (ja) * | 2021-03-18 | 2022-10-03 | トヨタ自動車株式会社 | 電気加熱式触媒装置 |
JP7389075B2 (ja) | 2021-03-18 | 2023-11-29 | トヨタ自動車株式会社 | 電気加熱式触媒装置 |
Also Published As
Publication number | Publication date |
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JP5997259B2 (ja) | 2016-09-28 |
EP2832446B1 (en) | 2017-03-15 |
CN104245133A (zh) | 2014-12-24 |
US20150030510A1 (en) | 2015-01-29 |
EP2832446A4 (en) | 2015-12-09 |
EP2832446A1 (en) | 2015-02-04 |
JPWO2013146955A1 (ja) | 2015-12-14 |
CN104245133B (zh) | 2016-08-24 |
US9707515B2 (en) | 2017-07-18 |
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