WO2013108398A1 - Electronic component placement stage, positioning device, and step processing device - Google Patents

Electronic component placement stage, positioning device, and step processing device Download PDF

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Publication number
WO2013108398A1
WO2013108398A1 PCT/JP2012/051236 JP2012051236W WO2013108398A1 WO 2013108398 A1 WO2013108398 A1 WO 2013108398A1 JP 2012051236 W JP2012051236 W JP 2012051236W WO 2013108398 A1 WO2013108398 A1 WO 2013108398A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
leaf spring
shaft
mounting table
spring
Prior art date
Application number
PCT/JP2012/051236
Other languages
French (fr)
Japanese (ja)
Inventor
淳 大城戸
Original Assignee
上野精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式会社 filed Critical 上野精機株式会社
Priority to JP2013548646A priority Critical patent/JP5561750B2/en
Priority to PCT/JP2012/051236 priority patent/WO2013108398A1/en
Publication of WO2013108398A1 publication Critical patent/WO2013108398A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to an electronic component placement stage that is a stage for performing process processing on an electronic component, a positioning device including the electronic component placement stage, and a process processing device.
  • Electronic parts are parts used in electrical products and include semiconductor elements.
  • semiconductor elements include transistors and integrated circuits
  • electronic components include resistors and capacitors.
  • This electronic component is generally transported while being held by a holding means on the transport path.
  • Various process processing devices that perform process processing are lined up on the conveyance path, and the holding means descends to the stage included in each, and the electronic component is detached from the stage. When the process processing is completed, the electronic component is removed from the stage. Pick up and transport to next process.
  • Examples of the process include pre-processes such as dicing, mounting, bonding, and sealing, and post-process processes such as device electrical property measurement, classification, marking, appearance inspection, and packing. Further, the positioning process for each process is included in the process.
  • the stage on which the electronic component provided in each process processing apparatus has a mounting table.
  • the mounting table can be moved up and down, and an effort has been made to make the clearance zero while finely adjusting the positional relationship between the holding means and the mounting table in consideration of aging degradation or the like (for example, Patent Document 1). reference.).
  • the electronic component is pressed against the mounting table to realize a state where the electronic component and the mounting table are securely in contact with each other. That is, the holding means is lowered by a certain amount even after the electronic component has just touched the mounting table.
  • the method of pressing the electronic component against the mounting table can surely make the clearance zero, but this method cannot use a mounting table with high rigidity such as resin or metal. This is because the reaction force of pressing against the mounting table reaches the electronic component and may damage the electronic component. Therefore, at present, rubber mounting tables are frequently used. This is because, when the mounting table is made of rubber, the pressure when the electronic component comes into contact with the mounting table is absorbed by the elastic deformation of the mounting table, and the possibility of damage to the electronic component can be reduced.
  • the rubber mounting table is crushed and deformed due to the contact pressure when the electronic component is placed, the electronic component has a restoring force to correct the crushed deformation or the crushed deformation. May cause misalignment.
  • the positional shift caused by the rubber mounting table is not so large as the positional shift caused by detaching the electronic component in a state where the clearance between the electronic component and the mounting table is not zero.
  • An object of the present invention is to provide an electronic component placement stage that does not cause a positional shift when the electronic component is placed, a positioning device including the electronic component placement stage, and a process processing device.
  • the electronic component mounting stage according to the present invention is an electronic component mounting stage on which an electronic component is mounted, and the electronic component mounting table and the mounting table described above are attached to the electronic component mounting table. And a pressure absorbing part that can sink so as to absorb the contact pressure.
  • the pressure absorbing portion may be a leaf spring having a fixed edge
  • the mounting table may be attached to a central region of the front surface
  • the flat portion of the leaf spring may be bent by the contact pressure
  • a shaft attached to the back surface of the leaf spring and extending below the leaf spring; and a spring supporting the shaft; the spring in a state where the electronic component is not in contact with the mounting table. You may make it urge
  • a shaft attached to the back surface of the leaf spring and extending below the leaf spring, and a shaft support portion for preventing the shaft from falling by sandwiching a lower peripheral surface of the shaft. Good.
  • a regulating part that regulates the bending of the leaf spring to the thickness of one piece of the electronic component may be further provided.
  • the restricting portion is attached to the back surface of the leaf spring and extends below the leaf spring, a contact surface provided on the shaft and extending so as to intersect the shaft axis, and the contact surface. And a regulating surface positioned below at a distance corresponding to the thickness of one piece of the electronic component, and the contact surface and the regulating surface of the shaft that descends in accordance with the sinking of the leaf spring And the bending of the leaf spring may be restricted to the thickness of one piece of the electronic component.
  • the plate spring deflection detection unit may be further provided.
  • the deflection detecting unit is blocked by surface contact between a spring supporting the flat surface of the leaf spring and a surface of the leaf spring supported by the spring so that the initial tension of the leaf spring approaches zero.
  • a pipe communicating with the opening generating a pressure in the pipe, and detecting a pressure change in the pipe to detect the bending of the leaf spring.
  • It further comprises a suction part that sucks the electronic component onto the mounting table, and the suction part extends from the opening to the lower side of the plate spring through the plate spring from the opening provided on the upper surface of the mounting table. You may make it have a pipe which transmits a negative pressure to the said opening.
  • a plurality of slits may be formed in the leaf spring, and the slits may be arranged concentrically from the center of the leaf spring toward the outside.
  • a non-circular hole is formed on the flat surface of the leaf spring, and a non-circular foot having a size and a shape that matches the non-circular hole protrudes from the bottom surface of the mounting table.
  • the mounting table may be attached so as not to rotate with respect to the leaf spring.
  • the electronic component positioning device may include a moving mechanism for moving the electronic component mounting stage, and may change the position of the electronic component mounted on the mounting table.
  • the electronic component process processing apparatus may include the electronic component mounting stage, and may perform a process on the electronic component mounted on the mounting table.
  • the present invention it is possible to deliver the electronic component to the process processing apparatus while reliably reducing the clearance between the electronic component and the mounting table to zero. That is, considering the damage to the electronic component, the electronic component is dropped from the holding means even though there is a gap between the electronic component and the mounting table. There is no worry of it occurring. Further, in order to make the clearance zero, there is no fear that the electronic component is pressed against the mounting table and the electronic component is damaged.
  • FIG. 1 is a perspective view showing an appearance of the electronic component placement stage 1.
  • the electronic component placement stage 1 is mounted on a process processing apparatus as a process processing stage for the electronic component D.
  • the process processing apparatus of this embodiment is a positioning apparatus.
  • the positioning device corrects the posture of the electronic component D appropriately.
  • the electronic component mounting stage 1 has a mounting table 3 for electronic components D on a gantry 2 as shown in FIG.
  • the mounting table 3 of the present embodiment is made of rubber, but various types such as metal and resin can be applied.
  • the mounting table 3 has a shape in which a cone is superimposed on a thin cylindrical surface. A flat surface is formed at the tip of the cone, and the electronic component D lands on this flat surface.
  • the gantry 2 that accommodates the mounting table 2 is connected to one end of a rotating shaft and is further mounted on an XY moving mechanism (not shown).
  • the gantry 2 is moved in the ⁇ direction, the X axis direction, and the Y axis direction by the rotation axis and the XY movement mechanism in a state where the electronic component D is mounted on the mounting table 3, and the electronic component D is positioned by this movement. .
  • the gantry 2 has a shape in which a single upper lid 2c is placed on pillars 2b erected at four corners of a thick rectangular base 2a, and the space between the base 2a and the upper lid 2c is hollow. .
  • the front surface of the upper lid 2c is a stage surface 2d that performs a process on the electronic component D.
  • the gantry 2 is installed such that the holding means 100 (see FIG. 3 and the like) that conveys the electronic component D and the upper lid 2c face each other.
  • the upper lid 2c is provided with a through hole 2e for opening the front surface and the back surface.
  • the mounting table 3 protrudes from the inside of the gantry 2 through the through hole 2e to the stage surface 2d.
  • FIG. 2 is a perspective view in which the gantry 2 is removed and the leaf spring 4 accommodated in the gantry 2 is exposed.
  • a plate spring 4 supported inside the gantry 2 is attached to the mounting table 3.
  • the mounting table 3 is fixed to the leaf spring 4 via a raising table 5 loosely fitted in a through hole 2e formed in the upper lid 2c.
  • the leaf spring 4 is a thin rectangular plate, and the central area 4d is supported in a floating manner by sandwiching the four corners between the support 2b and the upper lid 2c.
  • the mounting table 3 is fixed to the floating central region.
  • the leaf spring 4 has flexibility and functions as a pressure absorbing portion that absorbs much of the pressure when the electronic component D lands on the mounting table 3 and is further pushed. That is, the central area to which the mounting table 3 is attached sinks downward to absorb the contact pressure when the electronic component D contacts the mounting table 3. Therefore, the leaf spring 4 is thinned, and a large number of slits 4e are formed in order to reduce the rigidity.
  • the slits 4e are arranged concentrically from the center of the leaf spring 4 toward the outside, and the sinking center of the leaf spring 4 is shifted from the spreading center of the leaf spring 4, or the center region of the leaf spring 4 is
  • the center region of the leaf spring 4 contributes to the accurate sinking without being inclined and sinking, and the positional deviation of the electronic component D is prevented.
  • the substantially concentric circle includes a plurality of polygons that have no common point and have the same center in addition to the concentric circle.
  • the raising table 5 is configured so that the flat surface of the mounting table 3 continues to protrude from the gantry 2 even if the plate spring 4 sinks due to bending. That is, the combined height of the mounting table 3 and the raising table 5 is adjusted to be slightly higher than the combined height of the thickness of the upper lid 2 c of the gantry 2 and the amount of sinking of the leaf spring 4.
  • the through-hole 2e and the raising base 5 have a sufficient clearance so as not to come into contact with each other, and can move relative to each other even if dust enters the gap.
  • FIG. 3 is a cross-sectional view of the electronic component placement stage 1 and shows the inside of the gantry 2.
  • the shaft 6 is fixed to the back surface of the leaf spring 4 via a block 6 e and extends toward the base 2 a of the gantry 2.
  • the back surface is the surface opposite to the mounting table 3.
  • the thickness of the leaf spring 4 and the gap existing at the lower end portion of the shaft 6 are exaggerated for easy understanding.
  • the shaft 6 includes, for example, a resin cylindrical body and a pin body 6a inserted into an end surface of the cylindrical body on the base 2a side.
  • the pin body 6 a has a rod shape having a common axis with the shaft 6. In other words, the pin body 6 a protrudes from the end surface of the shaft 6.
  • the outer shape of the shaft 6 has a silhouette in which the diameter on the base 2a side of the gantry 2 is narrowed from the middle to the tip.
  • the starting point of this diaphragm is the step 6b.
  • the pin body 6a corresponds to a portion that is narrowed once
  • the end surface around the pin body 6a corresponds to the step portion 6b.
  • the length from the fixed end to the leaf spring 4 to the step portion 6 b is set to be shorter than the length of the column 2 b of the gantry 2 by the thickness of one electronic component D.
  • the tip of the pin body 6a on the protruding side is inserted into a recess 7 formed in the base 2a of the gantry 2.
  • the recess 7 is formed on an extension line of the shaft 6.
  • the clearance between the pin body 6a and the recess 7 is sufficiently narrower than the insertion depth of the pin body 6a.
  • the diameter of the recess 7 is set to be sufficiently smaller than the diameter of the step portion 6b of the shaft 6, and the periphery of the recess 7 exists immediately below the region of the step portion 6b.
  • the shaft 6 is lifted by a spring 8 disposed below.
  • the spring 8 has one end fixed to the shaft 6 and the other end fixed to the base 2 a of the gantry 2.
  • This spring 8 is a compression spring stored so as to extend.
  • the spring constant of the spring 8 is such that when the leaf spring 4 is not subjected to external force due to the placement of the electronic component D, the shaft 6 is lifted and the initial tension of the leaf spring 4 approaches zero or zero. It is set to keep flat.
  • a common pipe 6 c is formed on the shaft 6, the raising base 5, and the mounting base 3.
  • the pipe 6 c is formed along the axis of the shaft 6 from the suction hole 3 a provided on the flat surface of the mounting table 3.
  • a lead terminal 6 d that leads to the pipe 6 c is attached.
  • the lead terminal 6d is connected to a negative pressure generator (not shown) through a conducting tube.
  • the pipe 6c is closed by a pin body 6a from the middle.
  • the lead terminal 6d is attached above the insertion end of the pin body 6a.
  • an opening 2f is formed in the upper lid 2c of the gantry 2 on the surface facing the leaf spring 4.
  • the opening 2f is provided closer to the center of the upper lid 2c than the column 2b. In other words, the opening 2f faces a region where the spring body 4 is bent.
  • a pipe 2g is formed in the upper lid 2c, and one end of the pipe 2g is an opening 2f.
  • a lead terminal 2h leading to the pipe 2g is attached to the side surface of the upper lid 2c, and the lead terminal 2h is connected to a pressure generator (not shown) for generating pressure in the pipe 2g via a conducting tube. The other end of the pipe 2g is stopped inside the upper lid.
  • FIGS. 4 and 5 are cross-sectional views showing the displacement of the pressure absorbing portion.
  • FIG. 6 is an enlarged cross-sectional view of the vicinity of the opening 2f formed in the upper lid 2c.
  • FIG. 7 is an enlarged cross-sectional view of the lower end portion of the shaft 6.
  • the leaf spring 4 is kept flat. This is because the spring 8 lifts the shaft 6 to prevent the plate spring 4 from sinking due to the shaft 6 hanging down. In other words, the movement of the leaf spring 4 attempting to bend due to the weight of the shaft 6 is offset by the pushing back operation by the spring 8 via the shaft 6.
  • the leaf spring 4 has flexibility and low rigidity so as to absorb much of the contact pressure when the electronic component D lands on the mounting table 3, and has a small spring constant. Also, the central region 4d is easy to sink. Therefore, the spring 8 and the shaft 6 support the plate spring 4 from below so that the plate spring 4 does not exceed the elastic limit due to its own weight.
  • FIG. 4 shows the moment when the clearance between the electronic component D and the mounting table 3 becomes zero.
  • the lead terminal 6d and the pipe 6c serve as a suction portion that sucks the electronic component D placed on the placement table 3. That is, the negative pressure generated by the negative pressure generator is transmitted to the suction hole 3a formed on the flat surface of the mounting table 3 through the extraction terminal 6d and the pipe 6c, and the electronic component D is sucked to the mounting table 3.
  • the posture of the electronic component D with respect to the mounting table 3 is maintained, and the positional displacement of the electronic component D during the process is prevented.
  • the holding unit 100 it is ideal to stop the descent of the holding means 100 immediately after the clearance between the electronic component D and the mounting table 3 becomes zero.
  • the holding unit 100 due to the control accuracy of the holding unit 100, it is necessary to prevent a gap from being generated between the electronic component D and the mounting table 3 while the holding unit 100 is stopped. Therefore, the holding unit 100 is further lowered slightly. The slight descent is a degree that ensures the landing of the electronic component D on the mounting table 3.
  • FIG. 5 shows a state in which the holding means 100 is further lowered and a contact pressure is generated.
  • the leaf spring 4 bends to absorb this contact pressure, and the central region 4d sinks as the holding means 100 is lowered. Therefore, the reaction force of the contact pressure does not reach the electronic component D and the mounting table 3.
  • the lead terminal 6d, the pipe 2g, the opening 2f, the shaft 6, and the spring 8 serve as a detection unit that detects the bending of the leaf spring 4. This detection unit is used for detecting the landing of the electronic component D.
  • the spring 8 raises the shaft 6 so that the initial tension of the leaf spring 4 approaches zero so that the extension of the leaf spring 4 is kept flat in a state where the electronic component D is not placed. ing. Further, since the leaf spring 4 is sandwiched between the support column 2b of the gantry 2 and the bottom surface of the upper lid 2c, if the leaf spring 4 is kept flat, the upper lid 2c and the leaf spring 4 face each other in the opening area of the opening 2f. It will come into contact.
  • the opening 2f is blocked by the leaf spring 4 because the leaf spring 4 is not bent immediately before and immediately after the landing of the electronic component D.
  • the leaf spring 4 sinks and there is a gap between the leaf spring 4 and the opening 2f. C is generated. Accordingly, the pressure in the pipe 2g changes before and after the bending of the leaf spring 4, and by capturing this change, the bending of the leaf spring 4 is detected, and thus the landing of the electronic component D is detected.
  • a piezoelectric element or an optical sensor that detects the bending of the leaf spring 4, an optical sensor that detects the position of the electronic component D, or the like may be provided as the detection unit.
  • the spring 8 does not necessarily have a spring constant that makes the initial tension of the leaf spring 4 approach zero. In this case, it is sufficient for the spring 8 to support the plate spring 4 from below so that the plate spring 4 does not exceed the elastic limit due to its own weight, and a spring constant of that level may be set.
  • step portion 6b provided on the shaft 6 and the peripheral edge of the recess 7 formed in the base 2a are a subsidence restricting portion for restricting the bending of the leaf spring 4 to the thickness of one electronic component D. Become. This is because the length of the shaft 6 from the fixed end to the plate spring 4 to the step portion 6b is a length obtained by subtracting the thickness of one piece of the electronic component D from the length of the support 2b.
  • the step portion 6b and the periphery of the recess 7 are only the thickness D1 of one electronic component D. Separate.
  • the holding means 100 descends and the leaf spring 4 sinks due to the landing of the electronic component D
  • the stepped portion 6b is caught on the periphery of the recess 7 as shown in FIG. Therefore, the leaf spring 4 can sink only for the thickness of one electronic component D, and further sinking is restricted.
  • the holding unit 100 when the holding unit 100 holds two electronic components D in an overlapping manner, the holding unit 100 cannot reach the specified lowering amount by the sinking restricting portion, and the torque exceeding the specified level. Will receive. Therefore, the subsidence restricting portion can detect the overlapping of the electronic components D in combination with the mechanism for detecting the torque of the holding means 100.
  • the lower end peripheral surface of the shaft 6, that is, the peripheral surface of the pin body 6a in the present embodiment, and the recess 7 formed in the base 2a serve as a support portion that prevents the shaft 6 from falling. Since the pin body 6a is inserted into the recess 7 and the clearance between the pin body 6a and the recess 7 is narrow, the pin body 6a hits the inner peripheral wall of the recess 7 even if the shaft 6 tries to fall down so as to swing on the pin body 6a side. Because. For this reason, it is possible to prevent the fall of the shaft 6 from causing the leaf spring 4 to be wrinkled and the shape of the leaf spring 4 from being destroyed.
  • the electronic component mounting stage 1 on which the electronic component D is mounted and the mounting table 3 of the electronic component D are provided with the pressure absorbing portion.
  • the pressure absorbing part can sink so as to absorb the contact pressure of the electronic component D against the mounting table 3.
  • the pressure absorbing portion is a leaf spring 4 with a fixed edge
  • the mounting table 3 is attached to the center region 4d of the front surface
  • the flat portion of the leaf spring 4 is bent by the contact pressure. Yes.
  • the mounting table 3 is made of rubber, the contact pressure is absorbed by the leaf spring 4 side. Therefore, the possibility of the mounting table 3 being crushed by the contact pressure is low, and the electronic component D is misaligned due to the distortion of the rubber mounting table 3 or the restoring force for correcting the distortion. Can be avoided. Furthermore, since the deformation of the rubber mounting table 3 or the friction can be suppressed in addition to this, the life of the rubber mounting table 3 can be extended. In addition, since there is less concern about damage to the electronic component D, the mounting table 3 can be replaced with one having high rigidity such as resin or metal.
  • a shaft 6 extending downward is attached to the back surface of the leaf spring 4, and includes a spring 8 that supports the shaft 6.
  • the spring 8 is in a state where the electronic component D is not in contact with the mounting table 3. The sag of the leaf spring 4 was urged so as to push back.
  • the shaft 6 is attached to the back surface of the leaf spring 4 and extends below the leaf spring 4. And this shaft 6 is pinched
  • the pin body 6a is inserted into the other end surface of the shaft 6, and the pin body 6a is inserted into the recess 7 formed in the base 2a.
  • the recess 7 has a sufficiently narrow clearance with the pin body 6a as a shaft support portion.
  • the restricting portion can be configured by the shaft 6, a stepped portion 6 b provided on the shaft 6, and a peripheral edge of the concave portion 7 provided on the base 2 a.
  • the step portion 6 b is a contact surface provided on the shaft 6 and extending so as to intersect the axis of the shaft 6.
  • the peripheral edge of the recess 7 is a regulating surface located below the contact surface by a distance corresponding to the thickness of one electronic component D.
  • the erroneous delivery can be detected by the occurrence of abnormal torque of the holding means 100.
  • the measures for preventing the shaft 6 from falling are not taken or when the measures for preventing the shaft 6 from falling are taken by other methods, it is not necessary to reduce the diameter of the shaft 6 on the base 2a side.
  • the front end surface on the 2a side can be the contact surface.
  • the restriction portion may be configured by a notch provided on the peripheral surface of the shaft 6 and a rod-like member that has entered into the notch.
  • the notch is enlarged in the axial direction of the shaft 6 by the thickness of one electronic component D rather than the diameter of the rod-shaped member.
  • the rod-like member is fixed at a fixed position so as to contact the floor surface of the notch.
  • the ceiling surface of the notch serves as the abutment surface
  • the upper surface of the bar-like member serves as the regulation surface.
  • the deflection detection unit is a spring 8, an opening 2f provided in the upper lid 2c, and a pipe 2g drilled in the upper lid 2c.
  • the spring 8 supports the flat surface of the leaf spring 4 so that the initial tension of the leaf spring 4 approaches zero.
  • the opening 2 f is closed by surface contact with the surface of the leaf spring 4 supported by the spring 8.
  • the pipe 2g communicates with the opening 2f.
  • the amount by which the electronic device D is pushed by the holding means 100 can be adjusted according to the deflection detection unit, and the adjustment work is facilitated.
  • a pressure higher than the pressure of the environment where the electronic component D is installed or a negative pressure may be generated. That is, any method may be used as long as air leakage from the opening 2f and air suction can be detected.
  • FIG. 8 shows a leaf spring 4 when the electronic component mounting stage 1 is mounted on a positioning device.
  • process processing may be performed while maintaining the holding of the electronic component D by the holding unit 100.
  • the electronic component mounting stage 1 is mounted on the positioning device, it is necessary to prevent the mounting table 3 from sliding with respect to the leaf spring 4 due to the ⁇ rotation.
  • a square hole 4 c is formed in the plane of the leaf spring 4, and the size and shape of the square hole 4 c are formed on the bottom surface of the raising base 5 in the mounting table 3. It is only necessary to mount the mounting table 3 to the leaf spring 4 in a non-rotatable manner by projecting the combined rectangular feet and inserting the feet into the square holes 4c.
  • the square hole 4c and the rectangular foot are merely examples, and any hole and foot having a shape that restricts rotation may be used. That is, if it is a non-circular hole and a leg
  • the non-circular shape means a shape in which a plurality of types of distances from the center to the end are clearly present, and includes an ellipse or a polygon such as a hexagon whose minor axis and major axis are clearly different.
  • the leaf spring 4 is taken as an example of the pressure absorbing portion.
  • a ball spline may be provided as the pressure absorbing portion
  • a shaft and a linear bush may be provided as the pressure absorbing portion.
  • FIG. 9 shows an example in which a ball spline is provided as a pressure absorber.
  • the mounting table 3 is connected to the spline shaft 10 via a joint 11.
  • the spline shaft 10 extends below the mounting table 3 toward the base 2 a of the gantry 2.
  • the spline shaft 10 has a groove formed along the shaft on the surface.
  • a through hole 12 through which the spline shaft 10 passes is formed in the upper lid 2c, and a sleeve main body 13 is attached to the inside of the through hole 12.
  • a ball (not shown) is rotatably mounted inside the sleeve body 13, and the ball is fitted in the groove of the spline shaft 13.
  • the spline shaft 13 is supported by a spring 8 stored so as to extend.
  • FIG. 10 shows an example in which a shaft and a linear bush are provided as a pressure absorbing portion.
  • the mounting table 3 is connected to two shafts 20 via joints.
  • the shaft 20 has a cylindrical shape with a smooth surface.
  • two through holes 22 through which the two shafts 20 pass are formed in the upper lid, and linear bushes 23 are attached to the insides of the through holes 22, respectively.
  • a ball (not shown) is rotatably mounted inside the linear bush 23, and this ball contacts the surface of the shaft 20.
  • the two shafts 20 are respectively supported by springs 8 that are stored so as to extend.
  • the leaf spring 4 when the leaf spring 4 is employed as the pressure absorbing portion, the following merits occur. That is, it is easy to achieve downsizing of the electronic component placement stage 1. For example, when the leaf spring 4 is employed, the size of the electronic component placement stage 1 can be easily accommodated in a range of about L30 ⁇ W30 ⁇ H20 (mm).
  • This suction part is composed of an suction hole 3a which is an opening provided on the upper surface of the mounting table 3, and a pipe 6c which extends downward from the suction hole 3a through the leaf spring 4 and transmits negative pressure to the opening.
  • the pressure absorbing portion is the leaf spring 4
  • the pressure absorbing portion is the leaf spring 4
  • the cost increases accordingly.
  • the shaft 6 attached to the leaf spring 4 since the shaft 6 attached to the leaf spring 4 only supports the leaf spring 4, there is no difficulty in pipe processing.
  • Processes for electronic parts D include pre-process and post-process, each assembly process such as dicing, mounting, bonding, sealing, etc., device electrical property measurement, classification, marking, visual inspection, packaging, etc.
  • the process processing apparatus of this embodiment is a positioning apparatus.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is an electronic component placement stage having the clearance between an electronic component and a placement base reliably maintained at zero, having no risk of damage to the electronic component, and having no risk of positional displacement when the electronic component is placed thereon. The electronic component placement stage (1) whereon the electronic component (D) is placed and the placement base (3) for the electronic component (D) are configured so as to comprise a pressure absorbing section. The pressure absorbing section is configured so as to be capable of sinking such that the contact pressure on the placement base (3) for the electronic component (D) is absorbed. For example, this pressure absorbing section is a plate spring (4) having a fixed edge, the placement base (3) is attached to the center area (4d) of the front surface thereof, and the flat surface section of the plate spring (4) is configured so as to bend under contact pressure.

Description

電子部品載置ステージ、位置決め装置、及び工程処理装置Electronic component placement stage, positioning device, and process processing device
　本発明は、電子部品に対する工程処理を施すステージとなる電子部品載置ステージ、これを備えた位置決め装置、及び工程処理装置に関する。 The present invention relates to an electronic component placement stage that is a stage for performing process processing on an electronic component, a positioning device including the electronic component placement stage, and a process processing device.
　電子部品は、電気製品に使用される部品であり、半導体素子が含まれる。半導体素子としては、トランジスタや集積回路が挙げられ、電子部品としては、抵抗やコンデンサ等が挙げられる。この電子部品は、一般的に、搬送経路上を保持手段に保持されつつ搬送される。搬送経路上には、工程処理を施す各種の工程処理装置が並んでおり、保持手段は、それぞれが備えるステージに下降し、電子部品をステージに離脱させ、工程処理が終了するとステージから電子部品をピックアップして、次の工程処理へ搬送する。工程処理としては、ダイシング、マウンティング、ボンディング、及びシーリング等の前工程の処理、デバイスの電気特性測定、分類、マーキング、外観検査、梱包等の後工程の処理が挙げられる。また、これら各工程処理のための位置決め処理も工程処理に含まれる。 Electronic parts are parts used in electrical products and include semiconductor elements. Examples of semiconductor elements include transistors and integrated circuits, and examples of electronic components include resistors and capacitors. This electronic component is generally transported while being held by a holding means on the transport path. Various process processing devices that perform process processing are lined up on the conveyance path, and the holding means descends to the stage included in each, and the electronic component is detached from the stage. When the process processing is completed, the electronic component is removed from the stage. Pick up and transport to next process. Examples of the process include pre-processes such as dicing, mounting, bonding, and sealing, and post-process processes such as device electrical property measurement, classification, marking, appearance inspection, and packing. Further, the positioning process for each process is included in the process.
　各工程処理装置が備える電子部品を載置するステージは載置台を有する。工程処理を電子部品に対して施すためには、電子部品の精度の高い位置決めが必要であるので、電子部品と載置台とのクリアランスが零となるまで、保持手段を下降させることが理想である。 The stage on which the electronic component provided in each process processing apparatus has a mounting table. In order to perform the process on the electronic component, it is necessary to position the electronic component with high accuracy. Therefore, it is ideal to lower the holding means until the clearance between the electronic component and the mounting table becomes zero. .
　そこで、従来は、載置台を昇降可能にし、保持手段と載置台との位置関係に関して経年劣化等を加味して微調整しながら、クリアランスが零となるように努めていた（例えば、特許文献１参照。）。保持手段と載置台との位置関係は、例えば、載置台の摩耗や保持手段の個体差によって変わるためである。 Therefore, conventionally, the mounting table can be moved up and down, and an effort has been made to make the clearance zero while finely adjusting the positional relationship between the holding means and the mounting table in consideration of aging degradation or the like (for example, Patent Document 1). reference.). This is because the positional relationship between the holding means and the mounting table varies depending on, for example, wear of the mounting table or individual differences of the holding means.
　しかしながら、電子部品と載置台とのクリアランスがちょうど零になるように、保持手段が下降するように調整することは、機械精度の都合上、大変な労力を要する。一方で、電子部品と載置台との間に隙間が生じたまま、保持手段から電子部品を離脱させると、載置台に着地するまでの空気の流れにより電子部品の位置ズレが生じてしまいかねない。位置ズレは、歩留まりの悪化につながるため、この位置ズレ発生を阻止することは優先課題となる。 However, adjusting the holding means to be lowered so that the clearance between the electronic component and the mounting table is exactly zero requires a great amount of work for the convenience of machine accuracy. On the other hand, if the electronic component is detached from the holding means with a gap between the electronic component and the mounting table, the electronic component may be misaligned due to the air flow until landing on the mounting table. . Since the positional deviation leads to a deterioration in yield, it is a priority to prevent the positional deviation from occurring.
　そこで、従来は、電子部品を載置台に押し付け、電子部品と載置台とが確実に当接している状態を実現していた。すなわち、電子部品が載置台にちょうど触れた後も、一定量だけ保持手段を下降させていた。 Therefore, conventionally, the electronic component is pressed against the mounting table to realize a state where the electronic component and the mounting table are securely in contact with each other. That is, the holding means is lowered by a certain amount even after the electronic component has just touched the mounting table.
特開２０１１－０１４５８３号公報JP 2011-014583 A
　電子部品を載置台に押し付ける方法は、確実にクリアランスを零にすることができるが、この方法では、樹脂製や金属製のような剛性の高い載置台は使用できない。載置台に対する押し付けの反力が電子部品に及び、電子部品にダメージを与えるおそれがあるためである。そこで、現在は、ゴム製の載置台が多用されている。ゴム製の載置台であれば、電子部品が載置台に当接したときの圧力は、載置台の弾性変形によって吸収され、電子部品に対するダメージの可能性を低減させることができるからである。 The method of pressing the electronic component against the mounting table can surely make the clearance zero, but this method cannot use a mounting table with high rigidity such as resin or metal. This is because the reaction force of pressing against the mounting table reaches the electronic component and may damage the electronic component. Therefore, at present, rubber mounting tables are frequently used. This is because, when the mounting table is made of rubber, the pressure when the electronic component comes into contact with the mounting table is absorbed by the elastic deformation of the mounting table, and the possibility of damage to the electronic component can be reduced.
　但し、ゴム製の載置台は、電子部品が載置される際の当接圧力を受けて潰れ変形するので、電子部品には、その潰れ変形や又は其の潰れ変形を修正しようとする復元力によって位置ズレが発生してしまう可能性がある。電子部品と載置台とのクリアランスが零でない状態で、電子部品を離脱させることにより生じる位置ズレよりは、ゴム製の載置台に起因する位置ズレはそう大きくはない。 However, since the rubber mounting table is crushed and deformed due to the contact pressure when the electronic component is placed, the electronic component has a restoring force to correct the crushed deformation or the crushed deformation. May cause misalignment. The positional shift caused by the rubber mounting table is not so large as the positional shift caused by detaching the electronic component in a state where the clearance between the electronic component and the mounting table is not zero.
　しかしながら、電子部品の微細化がより進展しつつある昨今、載置台が弾性変形することに起因する位置ズレも電子部品の歩留まりを悪化させることが予想され、その対策を講じる必要が見込まれる。 However, with the recent progress in miniaturization of electronic components, it is expected that the positional deviation caused by the elastic deformation of the mounting table will also deteriorate the yield of the electronic components, and it is necessary to take countermeasures.
　本発明は、上記のような問題点を解決するために提案されたもので、電子部品と載置台との間のクリアランスを確実に零にしつつ、電子部品へダメージを与えてしまう心配がなく、そして、電子部品を載置したときに位置ズレが発生してしまう心配のない電子部品載置ステージ、これを備えた位置決め装置、及び工程処理装置を提供することを目的とする。 The present invention has been proposed in order to solve the above-described problems, while ensuring that the clearance between the electronic component and the mounting table is zero, there is no fear of damaging the electronic component, An object of the present invention is to provide an electronic component placement stage that does not cause a positional shift when the electronic component is placed, a positioning device including the electronic component placement stage, and a process processing device.
　本発明に係る電子部品載置ステージは、電子部品が載置される電子部品載置ステージであって、前記電子部品の載置台と、前記載置台が取り付けられ、前記電子部品の当該載置台への当接圧力を吸収するように沈み込み可能な圧力吸収部と、を備えること、を特徴とする。 The electronic component mounting stage according to the present invention is an electronic component mounting stage on which an electronic component is mounted, and the electronic component mounting table and the mounting table described above are attached to the electronic component mounting table. And a pressure absorbing part that can sink so as to absorb the contact pressure.
　前記圧力吸収部は、縁が固定された板バネであり、前記載置台がおもて面の中央領域に取り付けられ、板バネの平面部分が前記当接圧力によって撓むようにしてもよい。 The pressure absorbing portion may be a leaf spring having a fixed edge, the mounting table may be attached to a central region of the front surface, and the flat portion of the leaf spring may be bent by the contact pressure.
　前記板バネの裏面に取り付けられ、前記板バネの下方に延びるシャフトと、前記シャフトを支持するスプリングと、を更に備え、前記スプリングは、前記電子部品が前記載置台に当接していない状態での前記板バネの沈み込みを押し戻すように付勢するようにしてもよい。 A shaft attached to the back surface of the leaf spring and extending below the leaf spring; and a spring supporting the shaft; the spring in a state where the electronic component is not in contact with the mounting table. You may make it urge | bias so that depression of the said leaf | plate spring may be pushed back.
　前記板バネの裏面に取り付けられ、前記板バネの下方に延びるシャフトと、前記シャフトの下端周面を挟持することで、前記シャフトの倒れを阻止するシャフト支持部と、を更に備えるようにしてもよい。 A shaft attached to the back surface of the leaf spring and extending below the leaf spring, and a shaft support portion for preventing the shaft from falling by sandwiching a lower peripheral surface of the shaft. Good.
　前記板バネの撓みを前記電子部品の一枚の厚みに規制する規制部をさらに備えるようにしてもよい。前記規制部は、前記板バネの裏面に取り付けられ、前記板バネの下方に延びるシャフトと、前記シャフトに設けられ、当該シャフトの軸と交差するように拡がる当接面と、前記当接面よりも前記電子部品の一枚の厚みに相当する距離だけ離れた下方に位置する規制面と、を備え、前記板バネの沈み込みに合わせて降りてきた前記シャフトの前記当設面と前記規制面とが接触し、前記板バネの撓みを前記電子部品の一枚の厚みに規制するようにしてもよい。 A regulating part that regulates the bending of the leaf spring to the thickness of one piece of the electronic component may be further provided. The restricting portion is attached to the back surface of the leaf spring and extends below the leaf spring, a contact surface provided on the shaft and extending so as to intersect the shaft axis, and the contact surface. And a regulating surface positioned below at a distance corresponding to the thickness of one piece of the electronic component, and the contact surface and the regulating surface of the shaft that descends in accordance with the sinking of the leaf spring And the bending of the leaf spring may be restricted to the thickness of one piece of the electronic component.
　前記板バネの撓み検出部を更に備えるようにしてもよい。前記撓み検出部は、前記板バネの初期張力を零に近づけるように、前記板バネの平面を支持するスプリングと、前記スプリングによって支持された前記板バネの表面で面接触することで塞がれた開口と、前記開口に連通するパイプと、を備え、前記パイプ内に圧力を発生させ、前記パイプ内の圧力変化を検出することにより、前記板バネの撓みが検出されるようにしてもよい。 The plate spring deflection detection unit may be further provided. The deflection detecting unit is blocked by surface contact between a spring supporting the flat surface of the leaf spring and a surface of the leaf spring supported by the spring so that the initial tension of the leaf spring approaches zero. And a pipe communicating with the opening, generating a pressure in the pipe, and detecting a pressure change in the pipe to detect the bending of the leaf spring. .
　前記電子部品を前記載置台へ吸い付ける吸着部を更に備え、前記吸着部は、前記載置台の上面に設けられた開口と、前記開口から前記板バネを通って当該板バネの下方へ延び、負圧を前記開口へ伝達するパイプを有するようにしてもよい。 It further comprises a suction part that sucks the electronic component onto the mounting table, and the suction part extends from the opening to the lower side of the plate spring through the plate spring from the opening provided on the upper surface of the mounting table. You may make it have a pipe which transmits a negative pressure to the said opening.
　前記板バネには、複数のスリットが穿設され、前記スリットは、板バネの中心から外側に向かって同心円状に配列されているようにしてもよい。 A plurality of slits may be formed in the leaf spring, and the slits may be arranged concentrically from the center of the leaf spring toward the outside.
　前記板バネの平面には、非円形穴が形成され、前記載置台の底面には、前記非円形穴と大きさ及び形状を合わせた非円形足が突出し、前記非円形足を前記非円形穴に挿入することで、前記載置台が前記板バネに対して回転不能に取り付けられるようにしてもよい。 A non-circular hole is formed on the flat surface of the leaf spring, and a non-circular foot having a size and a shape that matches the non-circular hole protrudes from the bottom surface of the mounting table. The mounting table may be attached so as not to rotate with respect to the leaf spring.
　電子部品の位置決め装置は、この電子部品載置ステージを移動させる移動機構を備え、前記載置台に載置された前記電子部品の位置を変更するようにしてもよい。また、電子部品の工程処理装置は、この電子部品載置ステージを備え、前記載置台に載置された前記電子部品に対して工程処理を施すようにしてもよい。 The electronic component positioning device may include a moving mechanism for moving the electronic component mounting stage, and may change the position of the electronic component mounted on the mounting table. Moreover, the electronic component process processing apparatus may include the electronic component mounting stage, and may perform a process on the electronic component mounted on the mounting table.
　本発明によれば、電子部品と載置台との間のクリアランスを確実に零にしつつ、電子部品の工程処理装置への受け渡しが可能となる。すなわち、電子部品へのダメージを考慮するあまり、電子部品と載置台とに隙間が存在するにもかかわらず、保持手段から電子部品を落下させてしまい、電子部品を載置したときに位置ズレが発生してしまう心配はない。また、クリアランスを零にするために、電子部品を載置台に押し付け、電子部品へダメージを与えてしまう心配がなくなる。 According to the present invention, it is possible to deliver the electronic component to the process processing apparatus while reliably reducing the clearance between the electronic component and the mounting table to zero. That is, considering the damage to the electronic component, the electronic component is dropped from the holding means even though there is a gap between the electronic component and the mounting table. There is no worry of it occurring. Further, in order to make the clearance zero, there is no fear that the electronic component is pressed against the mounting table and the electronic component is damaged.
本実施形態に係る電子部品載置ステージの外観を示す斜視図である。It is a perspective view which shows the external appearance of the electronic component mounting stage which concerns on this embodiment. 電子部品の載置台及び衝撃吸収部の外観を示す斜視図である。It is a perspective view which shows the external appearance of the mounting base of an electronic component, and an impact absorption part. 電子部品載置ステージの断面図である。It is sectional drawing of an electronic component mounting stage. 圧力吸収部の変位を示し、電子部品の着地の瞬間を示す断面図である。It is sectional drawing which shows the displacement of a pressure absorption part and shows the instant of landing of an electronic component. 圧力吸収部の変位を示し、電子部品を押し込んだ状態を示す各断面図である。It is each sectional drawing which shows the displacement of a pressure absorption part, and shows the state which pushed in the electronic component. 上蓋に穿設された開口の付近を拡大した断面図である。It is sectional drawing to which the vicinity of the opening pierced by the upper cover was expanded. シャフトの下端部の拡大断面図である。It is an expanded sectional view of the lower end part of a shaft. 電子部品載置ステージを位置決め装置に搭載する場合の板バネの平面図である。It is a top view of the leaf | plate spring in the case of mounting an electronic component mounting stage in a positioning device. ボールスプラインを圧力吸収部として備える例を示す断面図である。It is sectional drawing which shows the example provided with a ball spline as a pressure absorption part. シャフトとリニアブッシュを圧力吸収部として備える例を示す断面図である。It is sectional drawing which shows the example provided with a shaft and a linear bush as a pressure absorption part.
　以下、本発明に係る電子部品載置ステージ、位置決め装置、及び工程処理装置の実施形態について図面を参照しつつ詳細に説明する。 Hereinafter, embodiments of an electronic component placement stage, a positioning device, and a process processing device according to the present invention will be described in detail with reference to the drawings.
　（構成）
　図１は、電子部品載置ステージ１の外観を示す斜視図である。電子部品載置ステージ１は、電子部品Ｄに対して工程処理のステージとして、工程処理装置に搭載される。本実施形態の工程処理装置は位置決め装置である。位置決め装置は、電子部品Ｄの姿勢を適正に補正する。 (Constitution)
FIG. 1 is a perspective view showing an appearance of the electronic component placement stage 1. The electronic component placement stage 1 is mounted on a process processing apparatus as a process processing stage for the electronic component D. The process processing apparatus of this embodiment is a positioning apparatus. The positioning device corrects the posture of the electronic component D appropriately.
　電子部品載置ステージ１は、図１に示すように、架台２に電子部品Ｄの載置台３を有する。本実施形態の載置台３は、ゴム製であるが、金属製や樹脂製等の各種が適用可能である。この載置台３は、薄い円柱表面に円錐が重ねられた形状を有している。円錐先端には平坦面が形成され、この平坦面に電子部品Ｄが着地する。 The electronic component mounting stage 1 has a mounting table 3 for electronic components D on a gantry 2 as shown in FIG. The mounting table 3 of the present embodiment is made of rubber, but various types such as metal and resin can be applied. The mounting table 3 has a shape in which a cone is superimposed on a thin cylindrical surface. A flat surface is formed at the tip of the cone, and the electronic component D lands on this flat surface.
　載置台２を収容する架台２は、回転軸の一端と接続され、更に図示しないＸＹ移動機構に搭載されている。架台２は、載置台３に電子部品Ｄを載置させた状態で回転軸及びＸＹ移動機構によってθ方向、Ｘ軸方向、及びＹ軸方向に移動され、この移動により電子部品Ｄは位置決めされる。 The gantry 2 that accommodates the mounting table 2 is connected to one end of a rotating shaft and is further mounted on an XY moving mechanism (not shown). The gantry 2 is moved in the θ direction, the X axis direction, and the Y axis direction by the rotation axis and the XY movement mechanism in a state where the electronic component D is mounted on the mounting table 3, and the electronic component D is positioned by this movement. .
　架台２は、厚みのある矩形のベース２ａの４隅に立設された支柱２ｂに一枚の上蓋２ｃが載せられた形状を有し、ベース２ａと上蓋２ｃとの間は中空となっている。上蓋２ｃのおもて面が電子部品Ｄに工程処理を施すステージ面２ｄとなっている。架台２は、電子部品Ｄを搬送してくる保持手段１００（図３等参照）と上蓋２ｃとが向かい合うように設置される。上蓋２ｃにはおもて面と裏面とを開通させる貫通孔２ｅが設けられている。載置台３は、架台２の内部から貫通孔２ｅをくぐってステージ面２ｄへ突出している。 The gantry 2 has a shape in which a single upper lid 2c is placed on pillars 2b erected at four corners of a thick rectangular base 2a, and the space between the base 2a and the upper lid 2c is hollow. . The front surface of the upper lid 2c is a stage surface 2d that performs a process on the electronic component D. The gantry 2 is installed such that the holding means 100 (see FIG. 3 and the like) that conveys the electronic component D and the upper lid 2c face each other. The upper lid 2c is provided with a through hole 2e for opening the front surface and the back surface. The mounting table 3 protrudes from the inside of the gantry 2 through the through hole 2e to the stage surface 2d.
　図２は、架台２を取り払い、架台２の内部に収容された板バネ４を露出させた斜視図である。図１及び図２に示すように、載置台３には、架台２の内部に支持された板バネ４が取り付けられている。詳細には、載置台３は、上蓋２ｃに形成されている貫通孔２ｅ内に遊嵌した嵩上げ台５を介して板バネ４に固定されている。 FIG. 2 is a perspective view in which the gantry 2 is removed and the leaf spring 4 accommodated in the gantry 2 is exposed. As shown in FIGS. 1 and 2, a plate spring 4 supported inside the gantry 2 is attached to the mounting table 3. Specifically, the mounting table 3 is fixed to the leaf spring 4 via a raising table 5 loosely fitted in a through hole 2e formed in the upper lid 2c.
　板バネ４は、薄い矩形板であり、４隅が支柱２ｂと上蓋２ｃとの間に挟まれることにより、中央領域４ｄが浮動支持されている。載置台３は、この浮動支持された中央領域に固定されている。この板バネ４は、可撓性を有し、電子部品Ｄが載置台３に着地し、また更に押し込まれるときの圧力の多くを吸収する圧力吸収部として機能する。すなわち、載置台３が取り付けられた中央領域が下方へ沈み込むことで、載置台３に電子部品Ｄが当接したときの当接圧力を吸収する。そのため、板バネ４は薄くしてあり、また剛性を下げるために多数のスリット４ｅが穿設されている。 The leaf spring 4 is a thin rectangular plate, and the central area 4d is supported in a floating manner by sandwiching the four corners between the support 2b and the upper lid 2c. The mounting table 3 is fixed to the floating central region. The leaf spring 4 has flexibility and functions as a pressure absorbing portion that absorbs much of the pressure when the electronic component D lands on the mounting table 3 and is further pushed. That is, the central area to which the mounting table 3 is attached sinks downward to absorb the contact pressure when the electronic component D contacts the mounting table 3. Therefore, the leaf spring 4 is thinned, and a large number of slits 4e are formed in order to reduce the rigidity.
　このスリット４ｅは、板バネ４の中心から外側に向かって略同心円状に並べて配置されており、板バネ４の沈み込み中心が板バネ４の拡がり中心からずれたり、板バネ４の中心領域が傾いて沈み込んだりすることなく、板バネ４の中心領域が精度よく沈み込むことに寄与しており、電子部品Ｄの位置ズレを防止している。尚、略同心円には、同心円の他、共通点がなく中心を同じくする複数の多角形が含まれる。 The slits 4e are arranged concentrically from the center of the leaf spring 4 toward the outside, and the sinking center of the leaf spring 4 is shifted from the spreading center of the leaf spring 4, or the center region of the leaf spring 4 is The center region of the leaf spring 4 contributes to the accurate sinking without being inclined and sinking, and the positional deviation of the electronic component D is prevented. In addition, the substantially concentric circle includes a plurality of polygons that have no common point and have the same center in addition to the concentric circle.
　この嵩上げ台５は、板バネ４が撓みにより沈み込んでも、載置台３の平坦面が架台２から突出し続けるようにしている。すなわち、載置台３と嵩上げ台５とを合わせた高さは、架台２の上蓋２ｃが有する厚みと板バネ４の沈み込み量とを合わせた高さよりも若干程度高く調整されている。尚、貫通孔２ｅと嵩上げ台５とは、接触しないように十分なクリアランスを有しており、万一埃が隙間に入り込んでも相対移動可能となっている。 The raising table 5 is configured so that the flat surface of the mounting table 3 continues to protrude from the gantry 2 even if the plate spring 4 sinks due to bending. That is, the combined height of the mounting table 3 and the raising table 5 is adjusted to be slightly higher than the combined height of the thickness of the upper lid 2 c of the gantry 2 and the amount of sinking of the leaf spring 4. The through-hole 2e and the raising base 5 have a sufficient clearance so as not to come into contact with each other, and can move relative to each other even if dust enters the gap.
　図３は、電子部品載置ステージ１の断面図であり、架台２の内部を表している。図３に示すように、板バネ４の裏面には、ブロック６ｅを介してシャフト６が固定され、架台２のベース２ａに向かって伸びている。裏面は、載置台３とは反対の面である。図３等において、板バネ４の厚みやシャフト６の下端部分に存在する隙間等は、理解しやすく誇張して示されている。 FIG. 3 is a cross-sectional view of the electronic component placement stage 1 and shows the inside of the gantry 2. As shown in FIG. 3, the shaft 6 is fixed to the back surface of the leaf spring 4 via a block 6 e and extends toward the base 2 a of the gantry 2. The back surface is the surface opposite to the mounting table 3. In FIG. 3 and the like, the thickness of the leaf spring 4 and the gap existing at the lower end portion of the shaft 6 are exaggerated for easy understanding.
　シャフト６は、例えば樹脂製の円柱体と、該円柱体のベース２ａ側の端面に挿入されたピン体６ａとを含み構成される。ピン体６ａは、シャフト６と共通軸を有する棒形状を有する。言い換えると、シャフト６の端面からピン体６ａが突出している。 The shaft 6 includes, for example, a resin cylindrical body and a pin body 6a inserted into an end surface of the cylindrical body on the base 2a side. The pin body 6 a has a rod shape having a common axis with the shaft 6. In other words, the pin body 6 a protrudes from the end surface of the shaft 6.
　このシャフト６をピン体６ａを含めて一体的に捉えると、その外形は、架台２のベース２ａ側の径が途中から先端まで一回り絞られたシルエットを有する。この絞りの起点は段部６ｂとなっている。すなわち、ピン体６ａが一回り絞られた部分に相当し、ピン体６ａ周りの端面が段部６ｂに相当する。シャフト６に関し、板バネ４との固定端から段部６ｂまでの長さは、架台２の支柱２ｂの長さよりも電子部品Ｄの一枚の厚さだけ短く設定されている。 When the shaft 6 including the pin body 6a is integrally captured, the outer shape of the shaft 6 has a silhouette in which the diameter on the base 2a side of the gantry 2 is narrowed from the middle to the tip. The starting point of this diaphragm is the step 6b. In other words, the pin body 6a corresponds to a portion that is narrowed once, and the end surface around the pin body 6a corresponds to the step portion 6b. Regarding the shaft 6, the length from the fixed end to the leaf spring 4 to the step portion 6 b is set to be shorter than the length of the column 2 b of the gantry 2 by the thickness of one electronic component D.
　ピン体６ａの突出側の先端は、架台２のベース２ａに穿設された凹部７に挿入されている。凹部７は、シャフト６の延長線上に穿設されている。ピン体６ａと凹部７とのクリアランスは、ピン体６ａの挿入深さに比して十分に狭くなっている。また、凹部７の径は、シャフト６の段部６ｂの径と比べて十分に小さくなるように設定されており、段部６ｂの領域の直下には、凹部７の周縁が存在することなる。 The tip of the pin body 6a on the protruding side is inserted into a recess 7 formed in the base 2a of the gantry 2. The recess 7 is formed on an extension line of the shaft 6. The clearance between the pin body 6a and the recess 7 is sufficiently narrower than the insertion depth of the pin body 6a. Further, the diameter of the recess 7 is set to be sufficiently smaller than the diameter of the step portion 6b of the shaft 6, and the periphery of the recess 7 exists immediately below the region of the step portion 6b.
　このシャフト６は、下方に配置されたスプリング８によって持ち上げられている。スプリング８は、一端がシャフト６に固定され、他端が架台２のベース２ａに固定されている。このスプリング８は、伸びるように蓄勢された圧縮バネである。スプリング８のバネ定数は、板バネ４が電子部品Ｄの載置による外力を受けていない状態において、シャフト６を持ち上げ、板バネ４の初期張力を零又は零に限りなく近づけ、板バネ４が平坦を保つように設定されている。 The shaft 6 is lifted by a spring 8 disposed below. The spring 8 has one end fixed to the shaft 6 and the other end fixed to the base 2 a of the gantry 2. This spring 8 is a compression spring stored so as to extend. The spring constant of the spring 8 is such that when the leaf spring 4 is not subjected to external force due to the placement of the electronic component D, the shaft 6 is lifted and the initial tension of the leaf spring 4 approaches zero or zero. It is set to keep flat.
　更に、シャフト６、嵩上げ台５、及び載置台３には、共通のパイプ６ｃが形成されている。パイプ６ｃは、載置台３の平坦面に設けられた吸着孔３ａからシャフト６の軸に沿って形成されている。シャフト６の途中には、このパイプ６ｃに通じる引出端子６ｄが取り付けられている。引出端子６ｄは、図示しない負圧発生装置に導通管を介して接続されている。尚、このパイプ６ｃは、途中からピン体６ａによって塞がれている。引出端子６ｄは、ピン体６ａの挿入端よりも上方に取り付けられている。 Furthermore, a common pipe 6 c is formed on the shaft 6, the raising base 5, and the mounting base 3. The pipe 6 c is formed along the axis of the shaft 6 from the suction hole 3 a provided on the flat surface of the mounting table 3. In the middle of the shaft 6, a lead terminal 6 d that leads to the pipe 6 c is attached. The lead terminal 6d is connected to a negative pressure generator (not shown) through a conducting tube. The pipe 6c is closed by a pin body 6a from the middle. The lead terminal 6d is attached above the insertion end of the pin body 6a.
　また、架台２の上蓋２ｃには、板バネ４と向かい合う面に開口２ｆが形成されている。開口２ｆは、支柱２ｂよりも上蓋２ｃの中心寄りに設けられている。言い換えると、開口２ｆは、バネ体４の撓みが発生する領域を臨んでいる。更に、上蓋２ｃには、内部にパイプ２ｇが穿設されており、パイプ２ｇの一端が開口２ｆとなっている。上蓋２ｃの側面には、このパイプ２ｇに通じる引出端子２ｈが取り付けられており、引出端子２ｈは、パイプ２ｇ内に圧力を発生させる図示しない圧力発生装置に導通管を介して接続されている。尚、パイプ２ｇの他端は上蓋の内部で止まっている。 Also, an opening 2f is formed in the upper lid 2c of the gantry 2 on the surface facing the leaf spring 4. The opening 2f is provided closer to the center of the upper lid 2c than the column 2b. In other words, the opening 2f faces a region where the spring body 4 is bent. Furthermore, a pipe 2g is formed in the upper lid 2c, and one end of the pipe 2g is an opening 2f. A lead terminal 2h leading to the pipe 2g is attached to the side surface of the upper lid 2c, and the lead terminal 2h is connected to a pressure generator (not shown) for generating pressure in the pipe 2g via a conducting tube. The other end of the pipe 2g is stopped inside the upper lid.
　（作用）
　この電子部品載置ステージ１の作用を図４乃至７を参照しつつ説明する。図４及び５は、圧力吸収部の変位を示す断面図である。図６は、上蓋２ｃに穿設された開口２ｆの付近を拡大した断面図である。図７は、シャフト６の下端部の拡大断面図である。 (Function)
The operation of the electronic component mounting stage 1 will be described with reference to FIGS. 4 and 5 are cross-sectional views showing the displacement of the pressure absorbing portion. FIG. 6 is an enlarged cross-sectional view of the vicinity of the opening 2f formed in the upper lid 2c. FIG. 7 is an enlarged cross-sectional view of the lower end portion of the shaft 6.
　まず、電子部品Ｄの着地前においては、板バネ４は平坦を保っている。スプリング８がシャフト６を持ち上げることにより、シャフト６が垂れ下がることによる板バネ４の沈み込みを防止しているからである。換言すると、シャフト６の重量により板バネ４が撓もうとする動きは、シャフト６を介したスプリング８による押し戻し動作によって相殺されている。 First, before landing of the electronic component D, the leaf spring 4 is kept flat. This is because the spring 8 lifts the shaft 6 to prevent the plate spring 4 from sinking due to the shaft 6 hanging down. In other words, the movement of the leaf spring 4 attempting to bend due to the weight of the shaft 6 is offset by the pushing back operation by the spring 8 via the shaft 6.
　板バネ４は、電子部品Ｄが載置台３に着地した際の当接圧力の多くを吸収すべく、可撓性且つ低い剛性を有しており、バネ定数は小さく、板バネ４の自重によっても中央領域４ｄが沈み込み易くなっている。そのため、スプリング８及びシャフト６は、板バネ４が自重によって弾性限界を超えないように、板バネ４を下方から支持している。 The leaf spring 4 has flexibility and low rigidity so as to absorb much of the contact pressure when the electronic component D lands on the mounting table 3, and has a small spring constant. Also, the central region 4d is easy to sink. Therefore, the spring 8 and the shaft 6 support the plate spring 4 from below so that the plate spring 4 does not exceed the elastic limit due to its own weight.
　図４は、電子部品Ｄと載置台３とのクリアランスが零となった瞬間を示している。このとき、引出端子６ｄ及びパイプ６ｃは、載置台３に載置された電子部品Ｄを吸着する吸着部となる。すなわち、負圧発生装置で発生させた負圧を引出端子６ｄ及びパイプ６ｃを介して載置台３の平坦面に形成された吸着孔３ａに伝達し、電子部品Ｄが載置台３に吸着されることで、載置台３に対する電子部品Ｄの姿勢は維持され、工程処理中の電子部品Ｄの位置ズレが防止される。 FIG. 4 shows the moment when the clearance between the electronic component D and the mounting table 3 becomes zero. At this time, the lead terminal 6d and the pipe 6c serve as a suction portion that sucks the electronic component D placed on the placement table 3. That is, the negative pressure generated by the negative pressure generator is transmitted to the suction hole 3a formed on the flat surface of the mounting table 3 through the extraction terminal 6d and the pipe 6c, and the electronic component D is sucked to the mounting table 3. As a result, the posture of the electronic component D with respect to the mounting table 3 is maintained, and the positional displacement of the electronic component D during the process is prevented.
　ここで、電子部品Ｄと載置台３とのクリアランスが零となった直後に保持手段１００の下降を停止させることが理想である。しかし、保持手段１００の制御精度の都合上、保持手段１００を停止させた状態で電子部品Ｄと載置台３との間に隙間が生じてしまうことを防ぐ必要がある。そのため、保持手段１００は、更に若干程度下降する。若干程度の下降とは、電子部品Ｄの載置台３への着地が確実となる程度である。 Here, it is ideal to stop the descent of the holding means 100 immediately after the clearance between the electronic component D and the mounting table 3 becomes zero. However, due to the control accuracy of the holding unit 100, it is necessary to prevent a gap from being generated between the electronic component D and the mounting table 3 while the holding unit 100 is stopped. Therefore, the holding unit 100 is further lowered slightly. The slight descent is a degree that ensures the landing of the electronic component D on the mounting table 3.
　図５は、保持手段１００が更に下降して当接圧力が発生した状態を示す。保持手段１００が更に若干程度下降すると、板バネ４は、この当接圧力を吸収するように撓んで、保持手段１００の下降に合わせて中央領域４ｄが沈み込む。従って、電子部品Ｄや載置台３には、当接圧力の反力が及ばない。 FIG. 5 shows a state in which the holding means 100 is further lowered and a contact pressure is generated. When the holding means 100 is further lowered to a certain extent, the leaf spring 4 bends to absorb this contact pressure, and the central region 4d sinks as the holding means 100 is lowered. Therefore, the reaction force of the contact pressure does not reach the electronic component D and the mounting table 3.
　このとき、引出端子６ｄ、パイプ２ｇ、開口２ｆ、シャフト６、及びスプリング８は、板バネ４の撓みを検出する検出部となる。この検出部は、電子部品Ｄの着地検出に利用される。 At this time, the lead terminal 6d, the pipe 2g, the opening 2f, the shaft 6, and the spring 8 serve as a detection unit that detects the bending of the leaf spring 4. This detection unit is used for detecting the landing of the electronic component D.
　具体的には、スプリング８は、シャフト６を持ち上げることで、電子部品Ｄが載置されていない状態で、板バネ４の延びが平坦を保つように、板バネ４の初期張力を零に近づけている。また、板バネ４は、架台２の支柱２ｂと上蓋２ｃの底面とにより挟まれているから、板バネ４が平坦を保つと、上蓋２ｃと板バネ４とが開口２ｆの穿設領域において面接触することとなる。 Specifically, the spring 8 raises the shaft 6 so that the initial tension of the leaf spring 4 approaches zero so that the extension of the leaf spring 4 is kept flat in a state where the electronic component D is not placed. ing. Further, since the leaf spring 4 is sandwiched between the support column 2b of the gantry 2 and the bottom surface of the upper lid 2c, if the leaf spring 4 is kept flat, the upper lid 2c and the leaf spring 4 face each other in the opening area of the opening 2f. It will come into contact.
　そのため、図６の（ａ）に示すように、電子部品Ｄの着地直前及び直後においては、板バネ４が撓んでいないために、開口２ｆは、板バネ４によって塞がれている。一方、図６の（ｂ）に示すように、電子部品Ｄの着地を確実にすべく更に電子部品Ｄが押し込まれると、板バネ４は沈み込み、板バネ４と開口２ｆとの間に隙間Ｃが生じる。従って、パイプ２ｇ内の圧力は板バネ４の撓み前後で変化し、この変化を捕捉することで、板バネ４の撓みは検出され、以て電子部品Ｄの着地は検出される。 Therefore, as shown in FIG. 6A, the opening 2f is blocked by the leaf spring 4 because the leaf spring 4 is not bent immediately before and immediately after the landing of the electronic component D. On the other hand, as shown in FIG. 6B, when the electronic component D is further pushed in to ensure the landing of the electronic component D, the leaf spring 4 sinks and there is a gap between the leaf spring 4 and the opening 2f. C is generated. Accordingly, the pressure in the pipe 2g changes before and after the bending of the leaf spring 4, and by capturing this change, the bending of the leaf spring 4 is detected, and thus the landing of the electronic component D is detected.
　尚、この電子部品Ｄの着地を検出することができるものであれば、各種の検出機構を採用することができる。例えば、板バネ４の撓みを検出する圧電素子や光センサ、電子部品Ｄの位置を検出する光センサ等を検出部として設けるようにしてもよい。 It should be noted that various detection mechanisms can be employed as long as the landing of the electronic component D can be detected. For example, a piezoelectric element or an optical sensor that detects the bending of the leaf spring 4, an optical sensor that detects the position of the electronic component D, or the like may be provided as the detection unit.
　本実施形態の撓み検出方法を用いない場合には、スプリング８は、板バネ４の初期張力を零に近づけるバネ定数を必ずしも有する必要はない。この場合、スプリング８は、板バネ４が自重によって弾性限界を超えないように板バネ４を下方から支持すれば十分であり、その程度のバネ定数が設定されていればよい。 When the deflection detection method of the present embodiment is not used, the spring 8 does not necessarily have a spring constant that makes the initial tension of the leaf spring 4 approach zero. In this case, it is sufficient for the spring 8 to support the plate spring 4 from below so that the plate spring 4 does not exceed the elastic limit due to its own weight, and a spring constant of that level may be set.
　また、シャフト６に設けられた段部６ｂとベース２ａに穿設された凹部７の周縁とは、板バネ４の撓みを電子部品Ｄの一枚の厚さ分に規制する沈み込み規制部となる。シャフト６に関し、板バネ４との固定端から段部６ｂまでの長さは、支柱２ｂの長さから電子部品Ｄの一枚の厚さを差し引いた長さとなっているためである。 Further, the step portion 6b provided on the shaft 6 and the peripheral edge of the recess 7 formed in the base 2a are a subsidence restricting portion for restricting the bending of the leaf spring 4 to the thickness of one electronic component D. Become. This is because the length of the shaft 6 from the fixed end to the plate spring 4 to the step portion 6b is a length obtained by subtracting the thickness of one piece of the electronic component D from the length of the support 2b.
　すなわち、図７の（ａ）に示すように、電子部品Ｄが載置台３に載置されていない状態では、段部６ｂと凹部７の周縁とは、電子部品Ｄの一枚の厚みＤ１だけ離間する。一方、保持手段１００が下降して、電子部品Ｄの着地によって板バネ４が沈み込むと、図７の（ｂ）に示すように、段部６ｂが凹部７の周縁に引っ掛かる。そのため、板バネ４は、電子部品Ｄの一枚の厚さ分しか沈み込むことができず、それ以上の沈み込みは規制される。 That is, as shown in FIG. 7A, when the electronic component D is not mounted on the mounting table 3, the step portion 6b and the periphery of the recess 7 are only the thickness D1 of one electronic component D. Separate. On the other hand, when the holding means 100 descends and the leaf spring 4 sinks due to the landing of the electronic component D, the stepped portion 6b is caught on the periphery of the recess 7 as shown in FIG. Therefore, the leaf spring 4 can sink only for the thickness of one electronic component D, and further sinking is restricted.
　例えば、保持手段１００が２枚の電子部品Ｄを重ねて保持してしまっている場合、保持手段１００は、この沈み込み規制部によって規定の下降量に達することができずに、規定以上のトルクを受けることとなる。従って、沈み込み規制部は、保持手段１００のトルクを検出する機構と相まって、電子部品Ｄの重なりを検出することができる。 For example, when the holding unit 100 holds two electronic components D in an overlapping manner, the holding unit 100 cannot reach the specified lowering amount by the sinking restricting portion, and the torque exceeding the specified level. Will receive. Therefore, the subsidence restricting portion can detect the overlapping of the electronic components D in combination with the mechanism for detecting the torque of the holding means 100.
　また、シャフト６の下端周面、即ち本実施形態におけるピン体６ａの周面と、ベース２ａに穿設された凹部７とは、シャフト６の倒れを阻止する支持部となる。ピン体６ａは凹部７に挿入され、ピン体６ａと凹部７とのクリアランスは狭いため、シャフト６がピン体６ａ側を振るように倒れ込もうとしても、ピン体６ａが凹部７の内周壁に当たるからである。そのため、シャフト６の転倒が板バネ４にシワを生じさせ、また板バネ４の形を崩してしまうことは防止される。 Also, the lower end peripheral surface of the shaft 6, that is, the peripheral surface of the pin body 6a in the present embodiment, and the recess 7 formed in the base 2a serve as a support portion that prevents the shaft 6 from falling. Since the pin body 6a is inserted into the recess 7 and the clearance between the pin body 6a and the recess 7 is narrow, the pin body 6a hits the inner peripheral wall of the recess 7 even if the shaft 6 tries to fall down so as to swing on the pin body 6a side. Because. For this reason, it is possible to prevent the fall of the shaft 6 from causing the leaf spring 4 to be wrinkled and the shape of the leaf spring 4 from being destroyed.
　（効果）
　以上のように、電子部品Ｄが載置される電子部品載置ステージ１、電子部品Ｄの載置台３に圧力吸収部を備えるようにした。圧力吸収部は、電子部品Ｄの当該載置台３への当接圧力を吸収するように沈み込み可能となっている。例えば、この圧力吸収部は、縁が固定された板バネ４であり、載置台３がおもて面の中央領域４ｄに取り付けられ、板バネ４の平面部分が当接圧力によって撓むようになっている。 (effect)
As described above, the electronic component mounting stage 1 on which the electronic component D is mounted and the mounting table 3 of the electronic component D are provided with the pressure absorbing portion. The pressure absorbing part can sink so as to absorb the contact pressure of the electronic component D against the mounting table 3. For example, the pressure absorbing portion is a leaf spring 4 with a fixed edge, the mounting table 3 is attached to the center region 4d of the front surface, and the flat portion of the leaf spring 4 is bent by the contact pressure. Yes.
　これにより、電子部品Ｄと載置台３との間のクリアランスを確実に零にしつつ、電子部品Ｄの工程処理装置への受け渡しが可能となる。すなわち、電子部品Ｄへのダメージを考慮するあまり、電子部品Ｄと載置台３とに隙間が存在するにもかかわらず、保持手段１００から電子部品Ｄを落下させてしまい、電子部品Ｄを載置したときに位置ズレが発生してしまう心配はない。また、クリアランスを零にするために、電子部品Ｄを載置台３に押し付け、電子部品Ｄへダメージを与えてしまう心配がなくなる。 This makes it possible to deliver the electronic component D to the process processing apparatus while reliably reducing the clearance between the electronic component D and the mounting table 3 to zero. That is, considering the damage to the electronic component D, the electronic component D is dropped from the holding means 100 even though there is a gap between the electronic component D and the mounting table 3, and the electronic component D is mounted. There is no worry of misalignment. Further, in order to make the clearance zero, there is no fear that the electronic component D is pressed against the mounting table 3 and the electronic component D is damaged.
　さらに、載置台３をゴム製とした場合であっても、当接圧力は板バネ４側で吸収される。そのため、当接圧力による載置台３の潰れの可能性は低くなり、ゴム製の載置台３の歪み又はその歪みを修正しようとする復元力によって電子部品Ｄの位置ズレが発生してしまう事態を回避できる。更には、ゴム製の載置台３の変形若しくはこれに加えて摩擦を抑えることができることから、ゴム製の載置台３の寿命を延ばすことができる。また、電子部品Ｄに対するダメージの心配が少なくなったことから、載置台３を樹脂や金属等の剛性が高いものに代替えすることも可能となる。 Furthermore, even if the mounting table 3 is made of rubber, the contact pressure is absorbed by the leaf spring 4 side. Therefore, the possibility of the mounting table 3 being crushed by the contact pressure is low, and the electronic component D is misaligned due to the distortion of the rubber mounting table 3 or the restoring force for correcting the distortion. Can be avoided. Furthermore, since the deformation of the rubber mounting table 3 or the friction can be suppressed in addition to this, the life of the rubber mounting table 3 can be extended. In addition, since there is less concern about damage to the electronic component D, the mounting table 3 can be replaced with one having high rigidity such as resin or metal.
　また、板バネ４の裏面に下方へ延びるシャフト６が取り付けられているが、このシャフト６を支持するスプリング８を備え、このスプリング８は、電子部品Ｄが載置台３に当接していない状態での板バネ４の沈み込みを押し戻すように付勢するようにした。 Further, a shaft 6 extending downward is attached to the back surface of the leaf spring 4, and includes a spring 8 that supports the shaft 6. The spring 8 is in a state where the electronic component D is not in contact with the mounting table 3. The sag of the leaf spring 4 was urged so as to push back.
　これにより、板バネ４のバネ定数を小さくすることができ、当接圧力の吸収能力が高まる。従って、電子部品Ｄへダメージを付与してしまうおそれをより確実に防止できる。尚、板バネ４の沈み込みを押し戻すことができれば、その他の各種の構成も適用可能である。例えば、シャフト６を設けず、板バネ４の中央領域をスプリング８で直接支持するようにしてもよい。また、本実施形態の歪み検出方法を採用しない場合には、板バネ４が弾性限界を超えなければ良く、初期張力を零に近づける必要はない。 This makes it possible to reduce the spring constant of the leaf spring 4 and increase the ability to absorb contact pressure. Accordingly, it is possible to more reliably prevent the possibility of damaging the electronic component D. Various other configurations can be applied as long as the subsidence of the leaf spring 4 can be pushed back. For example, the central region of the leaf spring 4 may be directly supported by the spring 8 without providing the shaft 6. Further, when the strain detection method of the present embodiment is not adopted, it is sufficient that the leaf spring 4 does not exceed the elastic limit, and it is not necessary to bring the initial tension close to zero.
　また、シャフト６は、板バネ４の裏面に取り付けられて板バネ４の下方に延びる。そして、このシャフト６は、シャフト６の傾きを阻止するシャフト支持部によって下端周面が挟持される。本実施形態では、ピン体６ａをシャフト６の他端面に差し込んでおき、このピン体６ａをベース２ａに穿設した凹部７に挿入する。この凹部７は、シャフト支持部として、ピン体６ａとのクリアランスを十分に狭くしてある。 The shaft 6 is attached to the back surface of the leaf spring 4 and extends below the leaf spring 4. And this shaft 6 is pinched | interposed at a lower end peripheral surface by the shaft support part which prevents the inclination of the shaft 6. In the present embodiment, the pin body 6a is inserted into the other end surface of the shaft 6, and the pin body 6a is inserted into the recess 7 formed in the base 2a. The recess 7 has a sufficiently narrow clearance with the pin body 6a as a shaft support portion.
　これにより、板バネ４に取り付けられているシャフト６の傾きを防止でき、シャフト６の傾きに伴う板バネ４のシワや歪みの発生を防止できる。従って、板バネ４の損傷は防がれ、板バネ４の稼働信頼性の向上や長寿命化を達成できる。尚、板バネ４の沈み込みを電子部品Ｄの一枚の厚みに規制する規制部を採用しない場合には、シャフト６にピン体６ａを挿入する必要はない。すなわち、シャフト６のベース２ａ側の径を一回り小さくする必要はなく、またシャフト６の本体を直に凹部７に挿入し、倒れを阻止するようにしてもよい。 Thereby, the inclination of the shaft 6 attached to the leaf spring 4 can be prevented, and the occurrence of wrinkles and distortion of the leaf spring 4 accompanying the inclination of the shaft 6 can be prevented. Accordingly, the leaf spring 4 is prevented from being damaged, and the operation reliability of the leaf spring 4 can be improved and the life can be extended. In addition, when not using the control part which controls the sinking of the leaf | plate spring 4 to the thickness of one piece of electronic component D, it is not necessary to insert the pin body 6a in the shaft 6. FIG. That is, it is not necessary to make the diameter of the shaft 6 on the base 2a side slightly smaller, and the main body of the shaft 6 may be directly inserted into the recess 7 to prevent falling.
　また、板バネ４の撓みは規制部によって電子部品Ｄの一枚の厚みに規制されるようにした。規制部は、シャフト６と、シャフト６に設けられた段部６ｂと、ベース２ａに設けられた凹部７の周縁とにより構成することができる。段部６ｂは、シャフト６に設けられ、当該シャフト６の軸と交差するように拡がる当接面である。また、凹部７の周縁は、当接面よりも電子部品Ｄの一枚の厚みに相当する距離だけ離れた下方に位置する規制面である。板バネ４の沈み込みに合わせて降りてきたシャフト６の当設面と規制面とが接触し、板バネ４の撓みが電子部品Ｄの一枚の厚みに規制される。 Also, the bending of the leaf spring 4 is regulated by the thickness of one electronic component D by the regulating part. The restricting portion can be configured by the shaft 6, a stepped portion 6 b provided on the shaft 6, and a peripheral edge of the concave portion 7 provided on the base 2 a. The step portion 6 b is a contact surface provided on the shaft 6 and extending so as to intersect the axis of the shaft 6. Further, the peripheral edge of the recess 7 is a regulating surface located below the contact surface by a distance corresponding to the thickness of one electronic component D. The contact surface of the shaft 6 that has come down in accordance with the sinking of the leaf spring 4 comes into contact with the restricting surface, and the bending of the leaf spring 4 is restricted to the thickness of one electronic component D.
　これにより、電子部品Ｄを複数枚重ねて工程処理装置へ誤送したとしても、保持手段１００の異常トルクの発生により、その誤送を検知できる。尚、シャフト６の転倒防止策を採らないか、他の方法でシャフト６の転倒防止策を講じる場合には、シャフト６のベース２ａ側の径を一回り小さくする必要はなく、シャフト６のベース２ａ側の先端面を当設面とすることができる。 Thereby, even if a plurality of electronic components D are stacked and erroneously sent to the process processing apparatus, the erroneous delivery can be detected by the occurrence of abnormal torque of the holding means 100. In addition, when the measures for preventing the shaft 6 from falling are not taken or when the measures for preventing the shaft 6 from falling are taken by other methods, it is not necessary to reduce the diameter of the shaft 6 on the base 2a side. The front end surface on the 2a side can be the contact surface.
　また、シャフト６の周面に設けた切り欠きと、この切り欠き内に突入した棒状部材とで、当該規制部を構成するようにしてもよい。切り欠きは、棒状部材の径よりも一枚の電子部品Ｄの厚み分だけシャフト６の軸方向に拡大させておく。電子部品Ｄが載置されていない状態において、棒状部材は、切り欠きの床面に当接するように定位置で固定しておく。この場合、切り欠きの天井面が当設面となり、棒状部材の上側表面が規制面となる。 Further, the restriction portion may be configured by a notch provided on the peripheral surface of the shaft 6 and a rod-like member that has entered into the notch. The notch is enlarged in the axial direction of the shaft 6 by the thickness of one electronic component D rather than the diameter of the rod-shaped member. In a state where the electronic component D is not placed, the rod-like member is fixed at a fixed position so as to contact the floor surface of the notch. In this case, the ceiling surface of the notch serves as the abutment surface, and the upper surface of the bar-like member serves as the regulation surface.
　また、板バネ４の撓み検出部を更に備えるようにした。この撓み検出部は、本実施形態では、スプリング８と、上蓋２ｃに設けられた開口２ｆと、上蓋２ｃに穿設されたパイプ２ｇである。スプリング８は、板バネ４の初期張力を零に近づけるように、板バネ４の平面を支持する。開口２ｆは、スプリング８によって支持された板バネ４の表面で面接触することで塞がれる。パイプ２ｇは、開口２ｆに連通する。このパイプ２ｇ内に圧力を発生させ、板バネ４が撓んだことで開口２ｆの塞がりが解除されると、その際にパイプ２ｇ内の圧力が変化する。この圧力変化を検出することにより、板バネ４の撓みは検出されることとなる。 In addition, a bending detection part of the leaf spring 4 is further provided. In this embodiment, the deflection detection unit is a spring 8, an opening 2f provided in the upper lid 2c, and a pipe 2g drilled in the upper lid 2c. The spring 8 supports the flat surface of the leaf spring 4 so that the initial tension of the leaf spring 4 approaches zero. The opening 2 f is closed by surface contact with the surface of the leaf spring 4 supported by the spring 8. The pipe 2g communicates with the opening 2f. When pressure is generated in the pipe 2g and the opening of the opening 2f is released by the bending of the leaf spring 4, the pressure in the pipe 2g changes at that time. By detecting this change in pressure, the bending of the leaf spring 4 is detected.
　これにより、電子部品Ｄが載置台３に載置されたことを容易に検出することができる。また、保持手段１００による電子部品Ｄの押し込み量も撓み検出部に従って調整でき、調整作業が容易となる。尚、パイプ２ｇ内には、電子部品Ｄが設置される環境の圧力以上を付与するものであっても、負圧を発生させるものであっても何れでもよい。すなわち、開口２ｆからの空気漏れや空気吸入を検出できれば、何れでもよい。 Thereby, it is possible to easily detect that the electronic component D is mounted on the mounting table 3. In addition, the amount by which the electronic device D is pushed by the holding means 100 can be adjusted according to the deflection detection unit, and the adjustment work is facilitated. In the pipe 2g, either a pressure higher than the pressure of the environment where the electronic component D is installed or a negative pressure may be generated. That is, any method may be used as long as air leakage from the opening 2f and air suction can be detected.
　尚、板バネ４の撓みを検出することができる方法であれば、他の手法も採用可能である。例えば、板バネ４への圧電素子の貼り付けや、板バネ４のへこみ部分を検出する音波センサや光センサの設置が可能である。 It should be noted that other methods can be adopted as long as the bending of the leaf spring 4 can be detected. For example, it is possible to attach a piezoelectric element to the leaf spring 4 and to install a sound wave sensor or an optical sensor that detects a recessed portion of the leaf spring 4.
　（その他の実施形態）
　この電子部品載置ステージ１を位置決め装置に搭載する場合の板バネ４を図８に示す。電子部品Ｄを載置台３に載置した場合、保持手段１００による電子部品Ｄの保持を維持しつつ、工程処理を施す場合がある。このケースにおいて、電子部品載置ステージ１を位置決め装置に搭載した場合には、θ回転によって載置台３が板バネ４に対して滑ってしまうことを防止する必要がある。 (Other embodiments)
FIG. 8 shows a leaf spring 4 when the electronic component mounting stage 1 is mounted on a positioning device. When the electronic component D is mounted on the mounting table 3, process processing may be performed while maintaining the holding of the electronic component D by the holding unit 100. In this case, when the electronic component mounting stage 1 is mounted on the positioning device, it is necessary to prevent the mounting table 3 from sliding with respect to the leaf spring 4 due to the θ rotation.
　そこで、図８に示すように、板バネ４の平面には、角穴４ｃを形成しておき、載置台３のうち、嵩上げ台５の底面の部分に、角穴４ｃと大きさ及び形状を合わせた矩形の足を突設しておき、足を角穴４ｃに挿入することで、載置台３を板バネ４に対して回転不能に取り付けるようにすればよい。 Therefore, as shown in FIG. 8, a square hole 4 c is formed in the plane of the leaf spring 4, and the size and shape of the square hole 4 c are formed on the bottom surface of the raising base 5 in the mounting table 3. It is only necessary to mount the mounting table 3 to the leaf spring 4 in a non-rotatable manner by projecting the combined rectangular feet and inserting the feet into the square holes 4c.
　角穴４ｃや矩形の足は、一例であり、回転を規制する形状の穴及び足ならば何れでもよい。すなわち、非円形の穴及び足であれば、回転を規制する手段と成り得る。非円形とは、中心から端までの距離が明らかに複数種類存在する形状を意味し、短径と長径とが明らかに異なる楕円や六角形等の多角形が含まれる。 The square hole 4c and the rectangular foot are merely examples, and any hole and foot having a shape that restricts rotation may be used. That is, if it is a non-circular hole and a leg | foot, it can become a means which controls rotation. The non-circular shape means a shape in which a plurality of types of distances from the center to the end are clearly present, and includes an ellipse or a polygon such as a hexagon whose minor axis and major axis are clearly different.
　また、本実施形態では、圧力吸収部として板バネ４を例に挙げたが、その他、ボールスプラインを圧力吸収部として備え、またシャフトとリニアブッシュを圧力吸収部として備えるようにしてもよい。 In the present embodiment, the leaf spring 4 is taken as an example of the pressure absorbing portion. However, a ball spline may be provided as the pressure absorbing portion, and a shaft and a linear bush may be provided as the pressure absorbing portion.
　図９は、ボールスプラインを圧力吸収部として備える例を示している。この例において、載置台３は、継手１１を介してスプライン軸１０に接続されている。スプライン軸１０は、載置台３の下方へ架台２のベース２ａに向かって延びている。このスプライン軸１０には、表面に軸に沿った溝が穿設されている。また、上蓋２ｃには、スプライン軸１０が通る貫通孔１２が穿設されており、貫通孔１２の内側には、スリーブ本体１３が取り付けられている。スリーブ本体１３の内部には、図示しないボールが回転可能に取り付けられており、このボールは、スプライン軸１３の溝に嵌っている。スプライン軸１３は、伸びるように蓄勢されたスプリング８で支持されている。 FIG. 9 shows an example in which a ball spline is provided as a pressure absorber. In this example, the mounting table 3 is connected to the spline shaft 10 via a joint 11. The spline shaft 10 extends below the mounting table 3 toward the base 2 a of the gantry 2. The spline shaft 10 has a groove formed along the shaft on the surface. A through hole 12 through which the spline shaft 10 passes is formed in the upper lid 2c, and a sleeve main body 13 is attached to the inside of the through hole 12. A ball (not shown) is rotatably mounted inside the sleeve body 13, and the ball is fitted in the groove of the spline shaft 13. The spline shaft 13 is supported by a spring 8 stored so as to extend.
　また、図１０は、シャフトとリニアブッシュを圧力吸収部として備える例を示している。この例において、載置台３は、継手を介して２本のシャフト２０に接続されている。シャフト２０は、表面が滑らかな円筒形状を有している。また、上蓋には、２本のシャフト２０が通る２本の貫通孔２２が穿設されており、貫通孔２２の内側には、それぞれリニアブッシュ２３が取り付けられている。リニアブッシュ２３の内部には、図示しないボールが回転可能に取り付けられており、このボールは、シャフト２０の表面に当接する。２本のシャフト２０は、伸びるように蓄勢されたスプリング８にそれぞれ支持されている。 FIG. 10 shows an example in which a shaft and a linear bush are provided as a pressure absorbing portion. In this example, the mounting table 3 is connected to two shafts 20 via joints. The shaft 20 has a cylindrical shape with a smooth surface. In addition, two through holes 22 through which the two shafts 20 pass are formed in the upper lid, and linear bushes 23 are attached to the insides of the through holes 22, respectively. A ball (not shown) is rotatably mounted inside the linear bush 23, and this ball contacts the surface of the shaft 20. The two shafts 20 are respectively supported by springs 8 that are stored so as to extend.
　これらの例において、載置台３に電子部品Ｄが着地し、更に電子部品Ｄが押し込まれると、スプリング８の付勢力に反してスプライン軸１０又はシャフト２０が沈み込む。このスプリング軸１０又はシャフト２０の沈み込みにより、電子部品Ｄの当接圧力が吸収される。 In these examples, when the electronic component D lands on the mounting table 3 and further pushed, the spline shaft 10 or the shaft 20 sinks against the urging force of the spring 8. The contact pressure of the electronic component D is absorbed by the sinking of the spring shaft 10 or the shaft 20.
　尚、圧力吸収部として板バネ４を採用する場合には以下のようなメリットが発生する。すなわち、電子部品載置ステージ１の小型化を達成し易くなる。例えば、板バネ４を採用する場合には、電子部品載置ステージ１の大きさを、Ｌ３０×Ｗ３０×Ｈ２０（ｍｍ）程度の範囲に容易に収めることができる。 In addition, when the leaf spring 4 is employed as the pressure absorbing portion, the following merits occur. That is, it is easy to achieve downsizing of the electronic component placement stage 1. For example, when the leaf spring 4 is employed, the size of the electronic component placement stage 1 can be easily accommodated in a range of about L30 × W30 × H20 (mm).
　また、ボールスプラインと比べ安価に製造が可能である。更に、リニアブッシュを採用する場合には、シャフト２０の回転を防止すべく、複数本のシャフト２０を備える必要がある。その点において、板バネ４を採用する場合には、可動機構の質量を低減できる。 Also, it can be manufactured at a lower cost than ball splines. Further, when a linear bush is employed, it is necessary to provide a plurality of shafts 20 in order to prevent the shaft 20 from rotating. In that respect, when the leaf spring 4 is employed, the mass of the movable mechanism can be reduced.
　また、ボールスプラインやリニアブッシュを採用する場合には、スプライン軸１０、シャフト２０、スリーブ本体１３、及びリニアブッシュ２３の合間にゴミ等が入り込むおそれがあり、摺動不良を回避する策が必要となる。一方、板バネ４の場合には、摺動機構がないため、ゴミ等が入り込む余地がない。すなわち、上蓋２ｃに設けた貫通孔２ｅと嵩上げ台５とは、摺動関係にないため、これらの隙間は十分に拡げることができる。 In addition, when a ball spline or a linear bush is employed, dust or the like may enter between the spline shaft 10, the shaft 20, the sleeve body 13, and the linear bush 23, and a measure for avoiding a sliding failure is necessary. Become. On the other hand, in the case of the leaf spring 4, since there is no sliding mechanism, there is no room for dust or the like to enter. That is, since the through hole 2e provided in the upper lid 2c and the raising base 5 are not in a sliding relationship, these gaps can be sufficiently widened.
　また、電子部品Ｄを載置台３へ吸い付ける吸着部を容易に設置可能となる。この吸着部は、載置台３の上面に設けられた開口である吸着孔３ａと、吸着孔３ａから板バネ４を通って下方へ延び、負圧を開口へ伝達するパイプ６ｃとで構成される。本態様は、圧力吸収部を板バネ４としたことから、コストの低減等により可能となったものである。すなわち、ボールスプラインのような既製品にパイプ加工処理を施すと、その分だけコストが嵩んでしまう。一方、板バネ４に取り付けるシャフト６は、板バネ４を支持しているだけなので、パイプ加工処理に困難性がない。 In addition, it is possible to easily install a suction portion that sucks the electronic component D onto the mounting table 3. This suction part is composed of an suction hole 3a which is an opening provided on the upper surface of the mounting table 3, and a pipe 6c which extends downward from the suction hole 3a through the leaf spring 4 and transmits negative pressure to the opening. . In this aspect, since the pressure absorbing portion is the leaf spring 4, it is possible due to cost reduction or the like. That is, when pipe processing is applied to an off-the-shelf product such as a ball spline, the cost increases accordingly. On the other hand, since the shaft 6 attached to the leaf spring 4 only supports the leaf spring 4, there is no difficulty in pipe processing.
　以上、本発明に係る実施形態を説明したが、この実施形態は例として提示したものであって、発明の範囲を逸脱しない範囲で、その他の様々な形態で実施されることが可能であり、種々の省略や置き換え、変更を行うことができる。この実施形態やその変形は、発明の範囲や要旨に含まれると同様に、請求の範囲に記載された発明とその均等の範囲に含まれるものである。 As mentioned above, although embodiment which concerns on this invention was described, this embodiment was shown as an example, Comprising: It is possible to implement with other various forms in the range which does not deviate from the scope of the invention, Various omissions, replacements, and changes can be made. This embodiment and its modifications are included in the scope of the invention and the gist thereof, and are also included in the invention described in the claims and the equivalent scope thereof.
　例えば、本実施形態は、電子部品載置ステージ１を位置決め装置に搭載する例を示したものであるが、その他の工程処理を行う各種の工程処理装置についても適用が可能である。電子部品Ｄに対する工程処理としては、前工程及び後工程の各処理を含み、ダイシング、マウンティング、ボンディング、シーリング等の各組立工程、デバイスの電気特性測定、分類、マーキング、外観検査、梱包等の各工程処理、及びそれら工程処理のための位置決め処理が挙げられる。本実施形態の工程処理装置は位置決め装置である。 For example, although the present embodiment shows an example in which the electronic component placement stage 1 is mounted on a positioning device, the present embodiment can also be applied to various process processing apparatuses that perform other process processes. Processes for electronic parts D include pre-process and post-process, each assembly process such as dicing, mounting, bonding, sealing, etc., device electrical property measurement, classification, marking, visual inspection, packaging, etc. The process process and the positioning process for these process processes are mentioned. The process processing apparatus of this embodiment is a positioning apparatus.
１　電子部品載置ステージ
２　架台
２ａ　ベース
２ｂ　支柱
２ｃ　上蓋
２ｄ　ステージ面
２ｅ　貫通孔
２ｆ　開口
２ｇ　パイプ
２ｈ　引出端子
３　載置台
３ａ　吸着孔
４　板バネ
４ａ　隅
４ｂ　中央領域
４ｃ　角穴
４ｄ　中央領域
４ｅ　スリット
５　嵩上げ台
６　シャフト
６ａ　ピン体
６ｂ　段部
６ｃ　パイプ
６ｄ　引出端子
６ｅ　ブロック
７　凹部
８　スプリング
１０　スプライン軸
１１　継手
１２　貫通孔
１３　スリーブ本体
２０　シャフト
２１　継手
２２　貫通孔
２３　リニアブッシュ
１００　保持手段
Ｄ　電子部品 DESCRIPTION OF SYMBOLS 1 Electronic component mounting stage 2 Base 2a Base 2b Support | pillar 2c Upper lid 2d Stage surface 2e Through- hole 2f Opening 2g Pipe 2h Lead-out terminal 3 Mounting base 3a Adsorption hole 4 Leaf spring 4a Corner 4b Central area 4c Square hole 4d Central area 4e Slit 5 Raising platform 6 Shaft 6a Pin body 6b Step 6c Pipe 6d Lead terminal 6e Block 7 Recess 8 Spring 10 Spline shaft 11 Joint 12 Through hole 13 Sleeve body 20 Shaft 21 Joint 22 Through hole 23 Linear bush 100 Holding means D Electronic component

Claims (13)

  1. 　電子部品が載置される電子部品載置ステージであって、
    　前記電子部品の載置台と、
    　前記載置台が取り付けられ、前記電子部品の当該載置台への当接圧力を吸収するように沈み込み可能な圧力吸収部と、
    　を備えること、
    　を特徴とする電子部品載置ステージ。     An electronic component placement stage on which electronic components are placed,
    A mounting table for the electronic component;
    A pressure absorbing portion to which the mounting table is attached and capable of sinking so as to absorb the contact pressure of the electronic component to the mounting table;
    Providing
    An electronic component mounting stage characterized by
  2. 　前記圧力吸収部は、
    　縁が固定された板バネであり、前記載置台がおもて面の中央領域に取り付けられ、
    　板バネの平面部分が前記当接圧力によって撓むこと、
    　を特徴とする請求項１記載の電子部品載置ステージ。     The pressure absorbing part is
    It is a leaf spring with a fixed edge, and the mounting table is attached to the center area of the front surface,
    The flat portion of the leaf spring is bent by the contact pressure;
    The electronic component mounting stage according to claim 1.
  3. 　前記板バネの裏面に取り付けられ、前記板バネの下方に延びるシャフトと、
    　前記シャフトを支持するスプリングと、
    　を更に備え、
    　前記スプリングは、
    　前記電子部品が前記載置台に当接していない状態での前記板バネの沈み込みを押し戻すように付勢すること、
    　を特徴とする請求項２記載の電子部品載置ステージ。     A shaft attached to the back surface of the leaf spring and extending below the leaf spring;
    A spring supporting the shaft;
    Further comprising
    The spring is
    Urging to push back the subsidence of the leaf spring in a state where the electronic component is not in contact with the mounting table,
    The electronic component mounting stage according to claim 2, wherein:
  4. 　前記板バネの裏面に取り付けられ、前記板バネの下方に延びるシャフトと、
    　前記シャフトの下端周面を挟持することで、前記シャフトの倒れを阻止するシャフト支持部と、
    　を更に備えること、
    　を特徴とする請求項２記載の電子部品載置ステージ。     A shaft attached to the back surface of the leaf spring and extending below the leaf spring;
    A shaft support portion that prevents the shaft from falling by sandwiching the lower peripheral surface of the shaft;
    Further comprising,
    The electronic component mounting stage according to claim 2, wherein:
  5. 　前記板バネの撓みを前記電子部品の一枚の厚みに規制する規制部をさらに備えること、
    　を特徴とする請求項２乃至４の何れかに記載の電子部品載置ステージ。     Further comprising a restricting portion for restricting the bending of the leaf spring to the thickness of one piece of the electronic component;
    The electronic component mounting stage according to claim 2, wherein the electronic component mounting stage is characterized in that:
  6. 　前記規制部は、
    　前記板バネの裏面に取り付けられ、前記板バネの下方に延びるシャフトと、
    　前記シャフトに設けられ、当該シャフトの軸と交差するように拡がる当接面と、
    　前記当接面よりも前記電子部品の一枚の厚みに相当する距離だけ離れた下方に位置する規制面と、
    　を備え、
    　前記板バネの沈み込みに合わせて降りてきた前記シャフトの前記当設面と前記規制面とが接触し、前記板バネの撓みを前記電子部品の一枚の厚みに規制すること、
    　を特徴とする請求項５記載の電子部品載置ステージ。     The regulating part is
    A shaft attached to the back surface of the leaf spring and extending below the leaf spring;
    A contact surface provided on the shaft and extending so as to intersect the axis of the shaft;
    A regulating surface positioned below the contact surface by a distance corresponding to the thickness of one piece of the electronic component;
    With
    The contact surface of the shaft that has come down in accordance with the subsidence of the leaf spring and the regulating surface are in contact with each other, and the deflection of the leaf spring is restricted to the thickness of one piece of the electronic component;
    The electronic component placing stage according to claim 5.
  7. 　前記板バネの撓み検出部を更に備えること、
    　を特徴とする請求項２乃至６の何れかに記載の電子部品載置ステージ。     Further comprising a deflection detection part of the leaf spring,
    The electronic component mounting stage according to any one of claims 2 to 6,
  8. 　前記撓み検出部は、
    　前記板バネの初期張力を零に近づけるように、前記板バネの平面を支持するスプリングと、
    　前記スプリングによって支持された前記板バネの表面で面接触することで塞がれた開口と、
    　前記開口に連通するパイプと、
    　を備え、前記パイプ内に圧力を発生させ、前記パイプ内の圧力変化を検出することにより、前記板バネの撓みが検出されること、
    　を特徴とする請求項７記載の電子部品載置ステージ。     The deflection detector is
    A spring that supports the flat surface of the leaf spring so that the initial tension of the leaf spring approaches zero;
    An opening blocked by surface contact with the surface of the leaf spring supported by the spring;
    A pipe communicating with the opening;
    The pressure of the leaf spring is detected by generating a pressure in the pipe and detecting a pressure change in the pipe.
    The electronic component mounting stage according to claim 7.
  9. 　前記電子部品を前記載置台へ吸い付ける吸着部を更に備え、
    　前記吸着部は、
    　前記載置台の上面に設けられた開口と、
    　前記開口から前記板バネを通って当該板バネの下方へ延び、負圧を前記開口へ伝達するパイプを有すること、
    　を特徴とする請求項２乃至８の何れかに記載の電子部品載置ステージ。     Further comprising a suction part for sucking the electronic component to the mounting table,
    The adsorption part is
    An opening provided on the upper surface of the mounting table;
    A pipe extending from the opening through the leaf spring to the lower side of the leaf spring and transmitting negative pressure to the opening;
    The electronic component mounting stage according to claim 2, wherein the electronic component mounting stage is characterized in that:
  10. 　前記板バネには、複数のスリットが穿設され、
    　前記スリットは、板バネの中心から外側に向かって略同心円状に配列されていること、
    　を特徴とする請求項２乃至１０の何れかに記載の電子部品載置ステージ。     The leaf spring is provided with a plurality of slits,
    The slits are arranged substantially concentrically from the center of the leaf spring toward the outside;
    The electronic component mounting stage according to claim 2, wherein the electronic component mounting stage is characterized in that:
  11. 　前記板バネの平面には、非円形穴が形成され、
    　前記載置台の底面には、前記非円形穴と大きさ及び形状を合わせた非円形足が突出し、
    　前記非円形足を前記非円形穴に挿入することで、前記載置台が前記板バネに対して回転不能に取り付けられること、
    　を特徴とする請求項２乃至１１の何れかに記載の電子部品載置ステージ。     A non-circular hole is formed in the plane of the leaf spring,
    A non-circular foot that matches the size and shape of the non-circular hole protrudes from the bottom of the mounting table,
    By inserting the non-circular foot into the non-circular hole, the mounting table is attached non-rotatably to the leaf spring,
    The electronic component mounting stage according to claim 2, wherein the electronic component mounting stage is characterized in that:
  12. 　請求項１乃至１１の何れかに記載の電子部品載置ステージを移動させる移動機構を備え、
    　前記載置台に載置された前記電子部品の位置を変更すること、
    　を特徴とする電子部品の位置決め装置。     A moving mechanism for moving the electronic component mounting stage according to any one of claims 1 to 11,
    Changing the position of the electronic component placed on the mounting table,
    An electronic component positioning device.
  13. 　請求項１乃至１１の何れかに記載の電子部品載置ステージを備え、
    　前記載置台に載置された前記電子部品に対して工程処理を施すこと、
    　を特徴とする電子部品の工程処理装置。     The electronic component mounting stage according to claim 1,
    Applying a process to the electronic component placed on the mounting table,
    An electronic component process processing apparatus characterized by the above.
PCT/JP2012/051236 2012-01-20 2012-01-20 Electronic component placement stage, positioning device, and step processing device WO2013108398A1 (en)

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