WO2013083528A3 - Semiconductor luminaire - Google Patents

Semiconductor luminaire Download PDF

Info

Publication number
WO2013083528A3
WO2013083528A3 PCT/EP2012/074273 EP2012074273W WO2013083528A3 WO 2013083528 A3 WO2013083528 A3 WO 2013083528A3 EP 2012074273 W EP2012074273 W EP 2012074273W WO 2013083528 A3 WO2013083528 A3 WO 2013083528A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor luminaire
light
emitting diode
carrier substrate
diode chips
Prior art date
Application number
PCT/EP2012/074273
Other languages
German (de)
French (fr)
Other versions
WO2013083528A2 (en
Inventor
Axel Kaltenbacher
Dirk Becker
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2013083528A2 publication Critical patent/WO2013083528A2/en
Publication of WO2013083528A3 publication Critical patent/WO2013083528A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

In at least one embodiment of the semiconductor luminaire (1), said semiconductor luminaire comprises at least one carrier substrate (4) with a mounting side (40). A plurality of light‑emitting diode chips (2) is fitted on the mounting side (40). The semiconductor luminaire (1) contains electrical contact devices (3), which are located at least indirectly on the carrier substrate (4), and electrical contact is made with said contact devices via the light‑emitting diode chips (2). The carrier substrate (4) is transmissive to radiation produced during operation by the light‑emitting diode chips (2).
PCT/EP2012/074273 2011-12-07 2012-12-03 Semiconductor luminaire WO2013083528A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011087886A DE102011087886A1 (en) 2011-12-07 2011-12-07 SEMICONDUCTOR LIGHT
DE102011087886.6 2011-12-07

Publications (2)

Publication Number Publication Date
WO2013083528A2 WO2013083528A2 (en) 2013-06-13
WO2013083528A3 true WO2013083528A3 (en) 2013-08-01

Family

ID=47429769

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/074273 WO2013083528A2 (en) 2011-12-07 2012-12-03 Semiconductor luminaire

Country Status (2)

Country Link
DE (1) DE102011087886A1 (en)
WO (1) WO2013083528A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035532A (en) * 2013-08-09 2015-02-19 シチズン電子株式会社 Led aggregation plate and light-emitting device using the same
DE102014110470A1 (en) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh lighting module
DE102015101143A1 (en) 2015-01-27 2016-07-28 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for its production
DE102015102699A1 (en) 2015-02-25 2016-08-25 Osram Opto Semiconductors Gmbh Process for the production of optoelectronic semiconductor components and optoelectronic semiconductor component
DE102015107586B4 (en) 2015-05-13 2023-10-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing optoelectronic components and surface-mountable optoelectronic component
DE102015107588B4 (en) 2015-05-13 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Process for producing optoelectronic components and surface-mountable optoelectronic component
DE102015109852A1 (en) 2015-06-19 2016-12-22 Osram Opto Semiconductors Gmbh Light-emitting diode and method for producing a light-emitting diode
FR3063129B1 (en) * 2017-02-17 2019-04-12 Valeo Vision LIGHT MODULE WITH REDUCED DIMENSIONS
DE102017107226A1 (en) 2017-04-04 2018-10-04 Osram Opto Semiconductors Gmbh Method for producing a plurality of radiation-emitting semiconductor components and radiation-emitting semiconductor component
DE102017130764B4 (en) * 2017-12-20 2024-01-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Device with semiconductor chips on a primary carrier and method for producing such a device
DE102019219016A1 (en) * 2019-12-05 2021-06-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
JPH11186590A (en) * 1997-12-25 1999-07-09 Rohm Co Ltd Chip-type led
EP1119058A1 (en) * 1999-07-29 2001-07-25 Citizen Electronics Co., Ltd. Light-emitting diode
US6310364B1 (en) * 1998-08-03 2001-10-30 Toyoda Gosei Co., Ltd. Light-emitting apparatus
US20070263384A1 (en) * 2006-05-15 2007-11-15 Epistar Corporation Light-mixing type light-emitting apparatus
JP2007335731A (en) * 2006-06-16 2007-12-27 Sony Corp Light emitting diode mounting board, light emitting diode backlight, light emitting diode illuminator, light emitting diode display, and electronic device
EP2159780A2 (en) * 2008-08-29 2010-03-03 Oki Data Corporation Display device
WO2010074288A1 (en) * 2008-12-28 2010-07-01 有限会社Ｍｔｅｃ Light emitting diode module driven with high voltage
WO2011039691A1 (en) * 2009-09-30 2011-04-07 Koninklijke Philips Electronics N.V. Light output sticker

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
CN100576588C (en) * 2005-05-25 2009-12-30 皇家飞利浦电子股份有限公司 The illuminator that has light-emitting diode
TWI319504B (en) * 2005-06-28 2010-01-11 Chi Mei Optoelectronics Corp Planar light source device and fabricating method thereof and liquid crystal display with the same
TW200849160A (en) * 2007-04-03 2008-12-16 Koninkl Philips Electronics Nv Light output device
TW200941761A (en) * 2008-03-27 2009-10-01 Liung Feng Ind Co Ltd Packaging process of a light emitting component
TW201115779A (en) * 2009-10-26 2011-05-01 Gio Optoelectronics Corp Light emitting apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
JPH11186590A (en) * 1997-12-25 1999-07-09 Rohm Co Ltd Chip-type led
US6310364B1 (en) * 1998-08-03 2001-10-30 Toyoda Gosei Co., Ltd. Light-emitting apparatus
EP1119058A1 (en) * 1999-07-29 2001-07-25 Citizen Electronics Co., Ltd. Light-emitting diode
US20070263384A1 (en) * 2006-05-15 2007-11-15 Epistar Corporation Light-mixing type light-emitting apparatus
JP2007335731A (en) * 2006-06-16 2007-12-27 Sony Corp Light emitting diode mounting board, light emitting diode backlight, light emitting diode illuminator, light emitting diode display, and electronic device
EP2159780A2 (en) * 2008-08-29 2010-03-03 Oki Data Corporation Display device
WO2010074288A1 (en) * 2008-12-28 2010-07-01 有限会社Ｍｔｅｃ Light emitting diode module driven with high voltage
WO2011039691A1 (en) * 2009-09-30 2011-04-07 Koninklijke Philips Electronics N.V. Light output sticker

Also Published As

Publication number Publication date
DE102011087886A1 (en) 2013-06-13
WO2013083528A2 (en) 2013-06-13

Similar Documents

Publication Publication Date Title
WO2013083528A3 (en) Semiconductor luminaire
WO2013016646A3 (en) System for lighting apparatus utilizing light active sheet material with integrated light emitting diode, window with lighting apparatus, conveyance with lighting apparatus, and method of providing lighting apparatus
WO2013148573A8 (en) Ceramic-based light emitting diode (led) devices, components and methods
MX340348B (en) Micro light emitting diode.
MX2015008468A (en) Systems and methods for a light emitting diode chip.
WO2012106110A3 (en) Reflective mounting substrates for flip-chip mounted horizontal leds
TW201130176A (en) Package system
GB2515874A9 (en) Light emitting diode package and method for manufacturing same
WO2014039833A3 (en) Integrated led based illumination device
TW200739964A (en) Light emitting device
WO2012067723A3 (en) Board assemblies, light emitting device assemblies, and methods of making the same
WO2013036561A3 (en) Broad -area lighting systems and methods of its fabrication
WO2011141846A3 (en) Lighting module
EP2515353A3 (en) Light emitting diode package and lighting device with the same
WO2012108627A3 (en) Light emitting diode having photonic crystal structure and method of fabricating the same
WO2013019534A3 (en) Light emitting die (led) lamps, heat sinks and related methods
WO2013017364A3 (en) Optoelectronic assembly and method for producing an optoelectronic assembly
EP2787798A3 (en) Lighting device
WO2011112544A3 (en) Light emitting diode wafer-level package with self-aligning features
WO2012128458A3 (en) Led module and lighting assembly
WO2009002129A3 (en) Semiconductor light emitting device and method of manufacturing the same
ITMI20121618A1 (en) LED LAMP.
WO2012112666A3 (en) Light emitting semiconductor device having multi-level substrate
WO2011118934A3 (en) Light emitting diode device and lighting device using the same
WO2012017304A3 (en) White led device and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12805984

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 12805984

Country of ref document: EP

Kind code of ref document: A2