WO2013073397A1 - 絶縁ワニス及びこれを用いた絶縁電線 - Google Patents
絶縁ワニス及びこれを用いた絶縁電線 Download PDFInfo
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- WO2013073397A1 WO2013073397A1 PCT/JP2012/078606 JP2012078606W WO2013073397A1 WO 2013073397 A1 WO2013073397 A1 WO 2013073397A1 JP 2012078606 W JP2012078606 W JP 2012078606W WO 2013073397 A1 WO2013073397 A1 WO 2013073397A1
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- varnish
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- insulating varnish
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/065—Insulating conductors with lacquers or enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
- Y10T428/2967—Synthetic resin or polymer
- Y10T428/2969—Polyamide, polyimide or polyester
Definitions
- the present invention relates to an insulating varnish used for insulating coating of electric wires, and more particularly to an insulating varnish excellent in applicability to flat electric wires.
- An insulated wire having an insulating coating on the conductor surface is generally manufactured as follows. That is, after applying the insulating varnish to the surface of the conductor (core wire), adjusting the coating amount on the surface of the conductor (core wire) with a coating die and smoothing the coated insulating varnish surface, then applying the varnish through a baking furnace By baking, an insulating film is formed on the conductor surface. The series of operations (insulation varnish application, application amount adjustment, and baking) is repeated a plurality of times until the insulating coating reaches a predetermined thickness.
- the coating die has an opening, and the coating amount is adjusted by removing the excess insulating varnish by passing the core wire coated with the insulating varnish through the opening.
- the coating amount is adjusted by removing the excess insulating varnish by passing the core wire coated with the insulating varnish through the opening.
- the electrical insulation of the insulated wire is determined by the location where the insulating coating is thin, so that the insulation may be insufficient. Therefore, it is important to make the film thickness uniform.
- Patent Document 1 generally, the shape of the opening when viewed in plan is substantially similar to the cross-sectional shape of the conductor. .
- a conductor (core wire) of an insulated wire a conductor (round wire) having a substantially circular cross section has been conventionally used.
- the space factor is high, and various devices can be miniaturized.
- a conductor (flat conductor) wire having a substantially rectangular cross section a flat rectangular cross section
- the uniformity of the coating is important for this reason, but it is difficult to make the film thickness uniform compared to the round wire.
- dye which has the opening part 3 similar to the core wire 1 is used like FIG. It will be.
- the insulating varnish is formed at the corner of the flat conductor due to the surface tension of the insulating varnish after passing through the die and before being cured.
- an insulating coating having a so-called cross-section dog bone shape in which the corners 2′a of the coating 2 ′ are swollen is formed.
- the coating die having a shape different from the shape of the conductor, specifically, facing the surface of the conductor at the opening of the coating die when the conductor passes therethrough. It has been proposed to use a coating die that is formed so that a portion with respect to the center of the straight portion of the conductor is recessed from a portion with respect to the end portion of the straight portion of the conductor.
- a dogbone-shaped film may be formed by changing the type of varnish, and another solution is desired in terms of versatility.
- the present invention has been made in view of such circumstances, and the object thereof is not to solve by a die, but an insulating coating having a shape corresponding to the shape of the opening of the die, that is, a uniform coating.
- An object of the present invention is to provide an insulating varnish that can easily form an insulating coating having a thickness.
- the insulating varnish of the present invention is an insulating varnish that, after being applied to the conductor surface, removes the applied excess insulating varnish by passing through a die, and then drying and baking to form an insulating film on the conductor surface.
- the viscosity at 30 ° C. is 10 Pa ⁇ s or more. Viscosity here means the viscosity measured with a B-type viscometer.
- the insulating varnish of the present invention preferably contains no filler and is preferably a polyimide precursor solution.
- the insulated wire of the present invention is an insulated wire having an insulating coating obtained by baking after applying the insulating varnish of the present invention on a conductor. It is particularly suitable when the conductor is a rectangular conductor having a rectangular cross section.
- the insulated wire according to a preferred embodiment of the present invention is a rectangular conductor having a rectangular cross section, and the average thickness of 16 points in each cross section (16 points) of 30 cross sections with an interval of 50 cm in the wire longitudinal direction of the insulating coating.
- the insulating varnish of the present invention has a very high viscosity as compared with the conventional insulating varnish, it can be baked and solidified while maintaining the shape when passing through the die. Therefore, by using the insulating varnish of the present invention, it is possible to reduce the variation in the film thickness of the insulating coating, so even if it is applied to a rectangular conductor that is easily affected by surface tension, it corresponds to the shape of the die opening. Insulating film with high uniformity of film thickness can be formed.
- the insulated varnish for insulated wires of the present invention is applied to the conductor surface, and then the applied excess insulating varnish is removed by passing through a die, and then dried or baked to form an insulating film on the conductor surface.
- It is a varnish having a viscosity of 10 Pa ⁇ s or higher at 30 ° C.
- the type of insulating varnish that is, the type of resin serving as a film constituent, and the specific composition are not particularly limited. Viscosity here refers to the viscosity measured with a B-type viscometer.
- a varnish with a high viscosity of 10 Pa ⁇ s or more can prevent drastic reduction in viscosity even when the viscosity is reduced due to a large shearing force when passing through the die. Therefore, it is possible to bake and solidify while maintaining the coating state that is similar to the cross-sectional shape of the conductor formed by passing the die, thus suppressing variations in film thickness, especially the level of variation with respect to film thickness. Insulating film having a uniform average film thickness can be obtained. Furthermore, in the case of a high viscosity varnish, the internal pressure applied to the conductor at the time of application becomes high, and the center becomes difficult to shake. Also from this point, it becomes easy to improve the uniformity of the thickness of the insulating coating.
- the solid additive such as filler
- the solid addition such as filler that reduces the relative proportion of the resin component Thickening by increasing the content of the product is not preferred. Thickening by increasing the molecular weight of the resin component is desirable.
- the type of resin of the coating component is not particularly limited, but the content of the resin component is increased from the viewpoint of the properties of the resulting insulating coating. Furthermore, it is preferable to increase the viscosity by increasing the molecular weight of the resin.
- the resin (insulating coating component) contained in the varnish may be either a dry-solidified type or a bake-cured type, and specifically, a resin conventionally used in the field of insulating varnish, for example, polyamideimide
- the varnish include resin, polyimide resin, polyesterimide resin, polyamide resin, polyethersulfone resin, polyetheretherketone resin, and polysulfone resin.
- a polyimide resin varnish having excellent heat resistance, chemical resistance, and the like will be described below as a representative.
- the polyimide resin is usually synthesized by subjecting diamine and tetracarboxylic dianhydride to a ring-opening polyaddition-dehydration cyclization reaction.
- the polyimide resin varnish forms a polyimide resin film by dehydrating and ring-closing by heat curing, and the varnish used for coating is a polyimide precursor solution called polyamic acid.
- Polyimide precursors are generally polycondensed at 0 to 100 ° C. in a polar organic solvent under anhydrous conditions using tetracarboxylic acid or its anhydride as an acid component and a diamine compound as an amine component. Is synthesized.
- tetracarboxylic acid or anhydride thereof examples include pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, benzene-1,2,3,4-tetracarboxylic Acid dianhydride, naphthalene-2,3,6,7-tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenyltetracarboxylic dianhydride, 2,2 ′′, 3,3 ′′- p-terphenyltetracarboxylic dianhydride, 2,2-bis (2,3-dicarboxyphenyl) -propane dianhydride, bis (2,3-dicarboxyphenyl) ether dianhydride, bis (2, 3-dicarboxyphenyl) methane dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride, bis (2,3
- Aromatic tetracarboxylic dianhydrides such as phenanthrene-1,2,7,8-tetracarboxylic dianhydride; cycloaliphatic acids such as cyclopentane-1,2,3,4-tetracarboxylic dianhydride
- Anhydrides heterocyclic derivatives such as pyrazine-2,3,5,6-tetracarboxylic dianhydride and the like. These acid components can be used alone or in combination of two or more.
- diamine compound examples include 2,2-di (p-aminophenyl) -6,6′-bisbenzoxazole, m-phenylenediamine, 4,4′-diaminodiphenylpropane, 2,2-bis [4 -(4-aminophenoxy) phenyl] propane, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ether, benzidine, 4,4 "-diamino-p-terphenyl, p-bis (2-methyl- Aromatic diamines such as 4-aminopentyl) benzene, 1,5-diaminonaphthalene, 2,4-diaminotoluene, m-xylene-2,5-diamine, m-xylylenediamine; piperazine, methylenediamine, ethylenediamine, tetra And aliphatic diamines such as methylene diamine, etc
- solvent examples include polar organic solvents such as N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, tetramethylurea, hexaethylphosphoric triamide, and ⁇ -butyrolactone. Can be mentioned.
- ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone
- esters such as methyl acetate, ethyl acetate, butyl acetate, and diethyl oxalate
- diethyl ether ethylene glycol dimethyl ether, diethylene glycol Ethers such as monomethyl ether, diethylene glycol dimethyl ether and tetrahydrofuran
- halogenated hydrocarbons such as dichloromethane and chlorobenzene
- hydrocarbons such as hexane, heptane, benzene, toluene and xylene
- phenols such as cresol and chlorophenol
- tertiary amines can be used alone or in combination of two or more.
- the amount of the solvent used is an amount sufficient to uniformly dissolve or disperse at least each component such as
- the reaction between the tetracarboxylic dianhydride and the diamine compound is carried out in the solvent as described above.
- the reaction between the two is performed by mixing. In order to proceed quickly, it becomes a high viscosity solution in the initial stage. Thereafter, when the heating temperature rises, an imide ring-closing reaction occurs, the molecular chain is cleaved by water generated by the reaction, and the viscosity decreases.
- the polyimide precursor solution obtained as described above usually contains a high molecular weight polyimide precursor having a weight average molecular weight of 30,000 to 90,000.
- the insulating varnish of the present invention obtained as described above is usually used as a varnish having a resin solid content of about 10 to 50%.
- the amount of the diluted solvent may be adjusted, or a resin solution obtained by including the solvent used at the time of synthesis may be used.
- the solvent at the time of synthesis usually becomes the solvent as it is.
- the insulating varnish of the present invention may further contain various additives such as pigments, dyes, inorganic or organic fillers, lubricants, adhesion improvers, etc., if necessary. From the viewpoint of the properties of the insulating film obtained, it is preferable that these additives are not added. In particular, the high viscosity which is a requirement of the present invention is preferably achieved by increasing the molecular weight of the insulating coating resin.
- the insulating varnish of this invention is not limited to a polyimide resin varnish, If it is a viscosity of 10 Pa.s or more, Preferably it is a resin solution which does not contain additives, such as a filler. As long as the viscosity is 10 Pa ⁇ s or more, an insulating varnish using another film-constituting resin may be used.
- the insulated wire of the present invention has an insulating coating formed using the insulating varnish of the present invention.
- the core wire used as the conductor is a metal wire such as a copper wire, an aluminum wire, an aluminum alloy wire, a nickel-plated copper wire, or a silver-plated copper wire.
- the shape of the core wire is not particularly limited, but it is particularly useful for a conductor in which an insulating varnish easily flows after passing through a die and a film having a uniform thickness cannot be easily formed, for example, a rectangular conductor having a rectangular cross section.
- the insulating varnish of the present invention has a high viscosity, even if the viscosity is lowered when passing through the die, it can maintain a viscosity that is not dripping, so it can hold a coating film having a shape similar to that of the die, and is heat-cured. Thus, an insulating coating with high thickness uniformity can be formed.
- the baking temperature and time of the insulating varnish may be appropriately selected depending on the type of the film forming resin as the main component.
- the thickness of the insulating coating is preferably 1 to 100 ⁇ m, more preferably 10 to 50 ⁇ m from the viewpoint of protecting the conductor.
- an insulated wire having a variation ratio of the film thickness represented by the following formula in the wire longitudinal direction 1500 cm of the insulating coating of 20% or less can be obtained.
- ⁇ represents a standard deviation.
- Variation ratio (%) (4 ⁇ / average film thickness) ⁇ 100
- the insulating film formed with the insulating varnish of the present invention may be formed directly on the conductor, or a base layer may first be formed on the conductor surface, and an insulating film such as polyimide resin may be formed thereon.
- the underlayer include insulating films formed by applying and baking various conventionally known insulating varnishes such as polyurethane, polyester, polyesterimide, polyesteramideimide, polyamideimide, and polyimide.
- an overcoat layer may be provided on the upper layer of the insulating coating formed using the insulating varnish of the present invention.
- a surface lubrication layer for imparting lubricity to the outer surface of an insulated wire, the stress generated by the friction between the wires during coil winding and compression processing to increase the space factor, and by this stress This is preferable because damage to the insulating coating can be reduced.
- the resin constituting the topcoat layer may be any resin having lubricity, for example, paraffins such as liquid paraffin and solid paraffin, various waxes, polyethylene, fluororesin, silicone resin and other lubricants with a binder resin. There may be mentioned a bound one.
- an amidoimide resin imparted with lubricity by adding paraffin or wax is used.
- Viscosity (Pa ⁇ s) It measured at 30 degreeC using the B-type viscosity meter (RB80L of TOKI company, rotor No.M4, rotation speed 6rpm).
- Insulation varnish No. 1-6 1-6 using a saddle-type coating equipment, after immersing a 1.7 mm x 3.4 mm rectangular conductor, pass through a die having an opening similar to the conductor at a speed of 3.5 m / min And passed through a baking furnace and baked at 350 ° C. for 1 minute to form an insulating film.
- Application of this insulating varnish, passing through a die, and baking were repeated 8 times to produce an insulated wire having a polyimide resin coating as an insulating coating.
- the average film thickness and the deviation were calculated
- Table 1 shows the viscosity of each insulating varnish and the average film thickness, deviation (4 ⁇ ), and variation ratio of the obtained insulating coating.
- FIG. 5 shows the relationship between varnish viscosity and variation
- FIG. 6 shows the relationship between varnish viscosity and variation ratio.
- varnish No. 1 and 2 correspond to those having a viscosity comparable to that of a conventional polyimide resin varnish.
- the insulating varnish of the present invention has a high viscosity, it will not be damaged even when a high shearing force is applied as in the case of passing through a die, and it will be baked and solidified while holding the coating film in the shape after passing through the die. Can do. Therefore, it is useful for forming an insulating film of a flat electric wire, which is generally considered difficult to uniformly adjust the film thickness by adjusting the coating amount by passing through a die.
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Abstract
Description
バラツキ割合(%)=(4σ/平均膜厚)×100
具体的には、20~30℃程度で保持しながら、まず、溶剤中にジアミン化合物を所定全量溶解し、次いで、徐々にテトラカルボン酸二無水物を添加しながら、反応を進めていくことにより合成することが好ましい。
導体として用いられる芯線は、銅線、アルミニウム線、アルミ合金線、ニッケルめっき銅線、銀メッキ銅線などの金属線が用いられる。芯線の形状は特に限定しないが、ダイス通過後、絶縁ワニスが流れやすく、均一厚みの被膜を形成することが容易でなかった導体、例えば、断面長方形の平角導体などに特に有用である。
バラツキ割合(%)=(4σ/平均膜厚)×100
下地層としては、たとえばポリウレタン系、ポリエステル系、ポリエステルイミド系、ポリエステルアミドイミド系、ポリアミドイミド系、ポリイミド系等、従来公知の種々の絶縁ワニスの塗布、焼付けにより形成される絶縁膜が挙げられる。
はじめに、本実施例で行なった評価方法について説明する。
(1)粘度(Pa・s)
B型粘度計(TOKI社のRB80L、ロータNo.M4、回転数6rpm)を用いて、30℃で測定した。
得られた絶縁電線の断面について、図4の丸数字で示した、16点の膜厚を測定する。50cm間隔で、N=30の断面について、膜厚を測定し、16点×30=480点について、測定した膜厚の平均値を求めた。また、測定値の偏差4σ(σは標準偏差)を求めた。平均膜厚が同程度であっても、偏差(4σ)の値が大きいものは、バラツキが大きいことを意味する。
(2)で得られた平均膜厚、偏差を用いて、平均膜厚に対するバラツキ割合を下記式により求めた。
バラツキ割合=(4σ/平均膜厚)×100%
バラツキ割合20%以上のものは、膜厚の均一性が低く、いわゆるドッグボーン形状の被膜が形成されやすいといえる。
モレキュラーシーブにより脱水したN-メチルピロリドン(NMP)773.6g中に、4,4'-ビス[(4-アミノフェノキシ)フェニル]プロパン(BAPP)70.1g及び4,4'-ジアミノジフェニルエーテル(ODA)57.0gを溶解し(30℃)、完全に溶解させた後、80℃を超えないように保持しながら、ピロメリット酸無水物(PMDA)99.3gを徐々に添加した。目的の粘度に到達した時点で冷却することにより、所定の粘度を有するポリイミド前駆体溶液を得た。得られたポリイミド前駆体溶液は、ポリイミド樹脂(不揮発分)21%に該当する。
各絶縁ワニスの粘度及び得られた絶縁被膜の平均膜厚、偏差(4σ)、バラツキ割合を表1に示す。また、ワニス粘度とバラツキの関係を図5、ワニス粘度とバラツキ割合の関係を図6に示す。尚、ワニスNo.1,2が、従来のポリイミド樹脂ワニスと同程度の粘度を有するものに該当する。
従って、ワニス粘度を10Pa・s以上とした本発明の絶縁ワニスを用いることにより、厚み均一性の高い絶縁被膜を達成することができる。換言すると、平角電線で問題とされている、絶縁被膜のいわゆるドッグボーン形状を防止できる。
2、2’ 絶縁被膜
3 開口部
Claims (6)
- 導体表面に塗布した後、ダイスの通過により、塗布された余分な絶縁ワニスが除去され、次いで、乾燥、焼き付けすることにより、導体表面に絶縁被膜を形成する絶縁ワニスであって、30℃における粘度が10Pa・s以上である絶縁ワニス。
- フィラーが含有されていない請求項1に記載の絶縁ワニス。
- ポリイミド前駆体溶液である請求項2に記載の絶縁ワニス。
- 導体上に、請求項1~3のいずれか1項に記載の絶縁ワニスを塗布後、焼付により得られる絶縁被膜を有する絶縁電線。
- 前記導体は、断面長方形の平角導体である請求項4に記載の絶縁電線。
- 前記絶縁被膜の電線長手方向50cm間隔で30個の断面について、各断面での16点の膜厚の平均(16点×30面=480点の平均膜厚)に対して、下記式で表わされるバラツキ割合が20%以下である、請求項5に記載の絶縁電線。
バラツキ割合(%)=(4σ/平均膜厚)×100
(式中、σは、標準偏差を示す)
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