WO2013051809A2 - Z-pin patch and method for manufacturing or coupling a composite laminated structure using same - Google Patents

Z-pin patch and method for manufacturing or coupling a composite laminated structure using same Download PDF

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Publication number
WO2013051809A2
WO2013051809A2 PCT/KR2012/007722 KR2012007722W WO2013051809A2 WO 2013051809 A2 WO2013051809 A2 WO 2013051809A2 KR 2012007722 W KR2012007722 W KR 2012007722W WO 2013051809 A2 WO2013051809 A2 WO 2013051809A2
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WO
WIPO (PCT)
Prior art keywords
pinning
composite laminate
patch
laminate structure
pin
Prior art date
Application number
PCT/KR2012/007722
Other languages
French (fr)
Korean (ko)
Other versions
WO2013051809A3 (en
Inventor
최익현
임철호
심은섭
Original Assignee
한국항공우주연구원
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Application filed by 한국항공우주연구원 filed Critical 한국항공우주연구원
Priority to US14/349,756 priority Critical patent/US20140250665A1/en
Priority claimed from KR1020120106463A external-priority patent/KR101394408B1/en
Publication of WO2013051809A2 publication Critical patent/WO2013051809A2/en
Publication of WO2013051809A3 publication Critical patent/WO2013051809A3/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/562—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using extra joining elements, i.e. which are not integral with the parts to be joined
    • B29C65/564—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using extra joining elements, i.e. which are not integral with the parts to be joined hidden in the joint, e.g. dowels or Z-pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/301—Three-dimensional joints, i.e. the joined area being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/52—Joining tubular articles, bars or profiled elements
    • B29C66/524—Joining profiled elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/52—Joining tubular articles, bars or profiled elements
    • B29C66/524—Joining profiled elements
    • B29C66/5244—Joining profiled elements for forming fork-shaped connections, e.g. for making window frames or Y-shaped pieces
    • B29C66/52441—Joining profiled elements for forming fork-shaped connections, e.g. for making window frames or Y-shaped pieces with two right angles, e.g. for making T-shaped pieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/532—Joining single elements to the wall of tubular articles, hollow articles or bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/81455—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps being a fluid inflatable bag or bladder, a diaphragm or a vacuum bag for applying isostatic pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/10—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres
    • B29C70/16—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length
    • B29C70/24—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length oriented in at least three directions forming a three dimensional structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7214—Fibre-reinforced materials characterised by the length of the fibres
    • B29C66/72141—Fibres of continuous length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof

Definitions

  • the present invention relates to a Z-pinning patch and a method for manufacturing or bonding a composite laminate using the same, by pinning in the thickness direction of the composite laminate to reinforce the interlayer performance of the composite laminate or to connect a plurality of laminates.
  • Fiber-reinforced composites which are widely used in lightweight structures such as aerospace and transportation structural members, are manufactured by laminating unidirectional or woven prepregs and applying heat and pressure. Since the laminated laminated composite structure is not a separate reinforcing material in the thickness direction, the interlayer separation phenomenon is easily separated between the layers due to external impact. Since this delamination lowers the strength of the structure, methods for preventing this have been studied by researchers in the related field. In other words, many studies have been conducted on methods such as stitching, Z-pinning, textiles, toughened matrix, etc. to reinforce the weak delamination properties of the composite laminate structure. come.
  • Z-pinning technology is a relatively recent research field.
  • a brief description of the known research on Z-pinning is as follows.
  • the initial concept of the Z-pinning method can be found in US Patent 4,808,461 (February 28, 1989, hereinafter Prior Art 1).
  • the core concept of the prior art 1 is to put a pin in a polyvinyl foam in the thickness direction, attach a thin stainless steel plate on the upper side and a release material film on the lower side so as to laminate the laminate during molding Positioning and forming the upper portion of the composite material is to collapse the preform by the high temperature and high pressure during the molding process is to be pinned into the laminate (see Figure 1).
  • the remnant of the deformed and compressed preform is removed, and the pins protruding by the thickness are removed by physical force, so that the interlayer separation performance is enhanced because the pins remain embedded in the stacking thickness direction.
  • the prior art 1 is characterized by such a method and the above 'reinforced structure', but until now, the report of the practical success of this concept is not known yet.
  • US Patent No. 5,186,776 discloses a series of operations in which a pin is molded directly from a bundle of composite reinforcing fibers, and ultrasonic wave is applied to the formed pin to insert it into the composite laminate structure.
  • a mechanical device and a method thereof are disclosed, and
  • US Patent No. 5,589,015 uses an ultrasonic vibration device in a compressible 'foam structure' in which pins are pre-loaded.
  • the prior art 3 is known to be commercially available and utilized to connect the rear fuselage duct structure of the F / A-18 E / F. Subsequently, US Patent Registration Nos. 5,667,859 (1997), 5,800,672 (1998), 5,919,413 (1999), 6,190,602 (2001), 6,291,049 (2001), and 6,405,417 (2002) with respect to Z-pinning. ), 6,436, 507 (2002), and the concept of using an early concept of a 'reinforced structure' or a 'form structure' is continuously maintained.
  • FIG. 1 is an exemplary view showing a general composite molding method. Apply the release material 112 on the mold 111 for composite molding, put the composite prepreg stack 121, and lay the bleeder 113 to absorb the release material 112 and the resin again, After covering the whole with the film bag 115 to which the adapter 116 which applies a vacuum is attached, it seals with the sealant 117 at the edge.
  • the cork dam 114 may not be used depending on the characteristics of the molding method for molding the composite laminate structure 121.
  • Figure 2 is an exemplary view of a conventional Z-pinning method, showing the concept of the prior art 1.
  • the pin 231 is embedded in the compressible foam 232 and the stainless steel plate on the upper side and the release film on the lower side are attached to the reinforcing structure 230 as shown in FIG. As the foam 232 collapses, the pins 231 are driven into the composite stack structure 221.
  • FIG. 3 is another exemplary view of a conventional Z-pinning method, which is for the case of forming a composite laminate structure having a constant thickness using the conventional Z-pinning method.
  • a composite laminated structure having a constant thickness by the conventional Z-pinning method it is difficult because the stainless plate on the 'reinforced structure 330' interferes with deformation.
  • a 'foam structure' without a stainless plate is used, a 'foam structure (similar to 330 and 230') having a constant length of the pin 331 is used. It is difficult to satisfy all of the molding conditions in the part 323.
  • the length of the pin 331 is matched to the thick portion 322, in the case of the thin portion 323, the length of the pin 331 is long so that the molding pressure does not act on the composite laminate structure 323.
  • the basic requirements 7-8 atm or 20 atm of pressure depending on the material need to be applied to the composite laminate to remove bubbles and release excess resin in the molding stage). You will not be satisfied.
  • the length of the pin 331 is matched to the thin portion 323, in the case of the thick portion 322, the length of the pin 331 is short, so that only a part of the pin is stuck in the thickness direction of the laminated structure. The effect of the pinning method is not sufficiently exerted.
  • the thickness of the 'foam structure 330' should be changed to match the thickness of the laminate structure, which is a compressible foam 332. Due to the nature of the structure, processing may not be easy.
  • the conventional prior arts have a characteristic that pins are pre-embedded in a foam in order to pin the composite laminated structure, and the pins are driven into the composite laminated structure while the foam is compressed and collapsed by external vibration load or molding pressure.
  • the so-called 'form structure' ('reinforcement structure' can also be seen as a form of 'form structure') is used as a medium, and this 'form structure' is a feature of the technology.
  • the compression collapsed foam must be artificially removed after pinning, and the protruding portion of the pin must be forcibly broken to remove material waste. And process inefficiency is inevitable.
  • some scratches may occur at the location where the pin is broken, and the pin has a problem of adversely affecting the strength of the pin and the surrounding structure during the breaking of the pin.
  • the method of pinning the composite laminate structure using the foam structure or the reinforcement structure in this way because the depth of pin pins vary depending on the height when the height of the composite laminate structure is not constant, according to the prior art
  • the uneven height of the laminated composite structure has a big problem that the interlayer stiffness is uneven depending on the location.
  • the conventional method of Z-pinning a composite laminate structure having a non-uniform height also has a problem in that the configuration of the equipment is complicated and the process is very difficult to apply.
  • Figure 4 is a filed by the applicant "reinforced the performance of the composite laminated structure, the composite laminated structure manufacturing method, apparatus and method for manufacturing the device" (Korea Patent Registration No. 0932302, 2009.12.08, hereinafter prior art 4).
  • prior art 4 referring to FIG. 4, the composite stack structure 421 is placed before or after molding, and is inserted into the composite stack structure 421 in a plurality of holes 453 formed in the vertical direction.
  • a lower guide 450 having a pin 451;
  • An upper guide 440 mounted on the lower guide 450 and having a guide pin 441 formed to be movable in a vertical direction at a position corresponding to the pin 451; It comprises a, it discloses a technique for allowing the pin to be inserted into the composite laminated structure by pressing the pin while the upper guide is moved toward the lower guide.
  • Prior art 4 improves the process by simplifying the form rather than using the complex foam structures used in the prior arts 1 to 3 above, which allows Z-pinning to be achieved as a fairly simple structure, and also allows for repetitive reuse. Making it possible to further improve process efficiency.
  • prior art 4 is also required to use the upper and lower jig, there is a need for improvement to further reduce the number of parts used in the process and to simplify the process.
  • the present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to realize the Z-pinning of the composite structure using a simple structure as simple as possible to process efficiency and productivity
  • the present invention provides a method of manufacturing or bonding a Z-pinning patch and a composite laminate structure using the same.
  • the Z-pinning patch of the present invention for achieving the above object is a Z-pinning patch used for Z-pinning for reinforcing delamination performance of the composite laminate structure 21 or for contact connection between a plurality of laminated members ( 30) a base plate 31 formed in a plate shape; A plurality of pins 32 having one side fixed to the base plate 31; Characterized in that comprises a.
  • the Z-pinning patch 30 is placed on the composite laminate structure 21 of the pin 32 side before or after molding, during the molding or bonding process of the composite laminate structure 21
  • the pin 32 is inserted into the composite laminate structure 21 is characterized in that Z-pinning.
  • the pin 32 is characterized in that it is formed to protrude in the vertical direction or the inclined direction with respect to the base plate (31).
  • the pin 32 is characterized in that the angle which is projected with respect to the base plate 31 between the plurality of the pin 32 is formed equal.
  • the Z-pinning patch 30 is inserted into the opening to the lower guide 42 and the opening of the lower guide 42 formed with an opening formed to pass through the Z-pinning patch 30 into the opening. It is characterized in that it is guided by the patch guide 40 comprising an upper guide 41 provided to be inserted into the composite laminate structure 21.
  • the pin 32 is characterized in that the lower end portion 32a is formed in a pointed shape. At this time, it is more preferable that the pin 32 has a concave-convex shape 32b formed on the surface of the pin. Furthermore, chemically corroding the surface of the fin can further improve the adhesion properties.
  • the method for producing a composite laminate structure using the Z-pinning patch of the present invention in the method for producing a composite laminate structure using the Z-pinning patch as described above, a1) the composite laminate before or after molding Placing the structure 21; a2) placing the Z-pinning patch 30 on the composite laminate structure 21 before or after molding so as to contact the other side of the pin 32; a3) pressing force toward the base plate 31 to insert the pin 32 into the composite laminate structure 21; Characterized in that comprises a.
  • the method for producing a composite laminate structure using the Z-pinning patch of the present invention in the method for producing a composite laminate structure using the Z-pinning patch as described above, b1) the composite laminate before or after molding Placing the structure 21; b2) the Z-pinning patch 30 is raised so that the other side of the pin 32 contacts the composite laminate structure 21 before or after molding; b3) covering the Z-pinning patch 30 with the patch guide 40 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42; b4) pressing force toward the upper guide 41 to insert the pin 32 into the composite laminate structure 21; Characterized in that comprises a.
  • the bonding method of the composite laminate structure using the Z-pinning patch of the present invention in the bonding method of the composite laminate structure using the Z-pinning patch as described above, c1) the lower composite laminate structure member 21b and the upper Placing the composite laminated structural member 21t sequentially from below; c2) placing the Z-pinning patch 30 on the upper composite laminated structural member 21t so that the other side of the pin 32 is in contact; c3) pressing force toward the base plate 31 to insert the pin 32 into the laminated composite structural members 21b and 21t; Characterized in that comprises a.
  • the bonding method of the composite laminate structure using the Z-pinning patch of the present invention in the bonding method of the composite laminate structure using the Z-pinning patch as described above, d1) the lower composite laminate structure member 21b and the upper portion Placing the composite laminated structural member 21t sequentially from below; d2) placing the Z-pinning patch 30 on the upper composite laminate structural member 21t so that the other side of the pin 32 contacts; d3) covering the Z-pinning patch 30 with the patch guide 40 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42; d4) pressing force toward the upper guide 41 to insert the pin 32 into the laminated composite structural members 21b and 21t; Characterized in that comprises a.
  • the composite laminated structural members (21b) (21t) is characterized in that the bonded state through the first bonding process including bonding, compression or thermal bonding.
  • the present invention can be easily applied even in the case of a composite laminate structure having a constant thickness, and also has a great effect to achieve high quality pinch even in a composite laminate structure having a constant thickness.
  • the present invention performs Z-pinning using a patch having a plurality of pins vertically formed on a thin plate. Since the patch needs to be manufactured and supplied in advance, the manufacturing process of the actual composite laminate structure itself is extremely simplified. It has a great effect. Specifically, parts of the conventional foam structure, reinforcement structure, various fixtures, etc. are not required at all, so that the number of parts and the number of processes can be significantly reduced. Of course, as compared to the conventional manufacturing cost can be lowered and the production efficiency can be increased, the economic effect is also excellent.
  • 5 and 6 show one embodiment of the Z-pinning patch of the present invention.
  • 7 and 8 are one embodiment of a method of manufacturing a composite laminate structure using the Z-pinning patch of the present invention.
  • 9 and 10 are another embodiment of a method for producing a composite laminate structure using the Z-pinning patch of the present invention.
  • 11 is another embodiment of a method of making a composite laminate structure using the Z-pinning patch of the present invention.
  • 13 and 14 illustrate composite laminate structures joined by a method of joining composite laminate structures using Z-pinning patches of the present invention.
  • Figure 15 illustrates a pin shape of the present invention.
  • Mold 12 (release material) film
  • the Z-pinning patch 30 of the present invention is used for Z-pinning for enhancing the interlayer separation performance of the composite laminated structure 21 or for contact connection between a plurality of laminated members, and its structure is shown in FIGS. 5 and 6. It is very simple as shown in. That is, the Z-pinning patch 30 of the present invention, the base plate 31 formed in a plate shape; A plurality of pins 32 having one side fixed to the base plate 31; It has an extremely simple structure, including.
  • the Z-pinning patch 30 formed as described above is mounted on the composite laminate structure 21 in a state where the pin 32 is before or after forming, and forming or bonding the composite laminate structure 21. In the process, the pin 32 is inserted into the composite stack 21 to be Z-pinned.
  • the Z-pinning patch 30 since the plurality of pins 32 are densely provided on the base plate 31, the Z-pinning patch 30 is formed by the pins 32. It can stand on its own and therefore does not need a separate guide device or means for supporting. That is, the Z-pinning patch 30 of the present invention does not require any other components (that is, a separate guide device or a means for supporting, etc.) other than the Z-pinning patch 30 itself. Minimize the number of parts required for the peening process. In addition, as these separate parts are reduced, processes such as assembly or placement thereof are naturally eliminated, thus minimizing the number of processes.
  • the Z-pinning patch 30 of the present invention may be supplied as a state in which manufacturing is completed before the composite molding process. That is, in the field performing the composite molding process, the Z-pinning patch 30 is ordered to the outside in a desired specification in advance, and the Z-pinning patch 30 separately supplied from the outside is supplied to the site, and then, when the molding process is performed. Simply put it on the desired part and mold it. That is, in the present invention, since the Z-pinning patch 30 is supplied in a pre-fabricated state, a process that is substantially added for Z-pinning in the existing molding process merely requires the Z-pinning patch 30. The only thing that needs to be put on the site is that the Z-pinning process can be dramatically simplified.
  • the number of parts and the number of processes in the Z-pinning process can be minimized so that it can not be reduced further. Maximum resources can be saved, maximizing production costs and increasing production efficiency.
  • the pin 32 may be formed to protrude in a vertical direction with respect to the base plate 31 as shown in Figs. 5 and 6, which is the most basic form do.
  • the pin 32 may be used in FIG. 11 to reinforce the bonding force more effectively according to the direction or magnitude of load to be received when the composite laminate structure 21 (which can be expected in advance) is finally disposed and used.
  • the base plate 31 may be formed to protrude in an inclined direction.
  • FIG. 12 shows an embodiment of the Z-pinning patch 30 in which the pins 32 protrude obliquely in one direction with respect to the base plate 31 as shown in FIG. 11.
  • the pins 32 have the same protruding angle with respect to the base plate 31 between the plurality of pins 32, that is, the plurality of the pins 32. They show the form in which all are formed side by side. For example, when the angles of the pins 32 are different from each other, such as staggered angles, the bonding strength after the coupling may be increased, but the insertion may be difficult in practice. In the prepreg forming the composite laminate structure 21, there are a large number of thin reinforcing fibers, and if the directions of the pins 32 are crossed, it is difficult to physically insert even if the resin is soft due to high temperature during molding. And, even when inserted, the reinforcing fibers are likely to be damaged. Therefore, it is preferable that the angle of the pins 32 is formed to be equal to the angle that protrudes with respect to the base plate (31).
  • the pin 32 is most preferably formed to have the same height as the thickness of the state after the molding or bonding of the composite laminate structure 21.
  • the height of the pin 32 is higher than the thickness of the composite laminate structure 21 in a state after forming or joining, the other end of the pin 32 protrudes out of the composite laminate structure 21 after forming or joining. It's not good.
  • the thickness of the pin 32 is most preferably formed such that the height of the pin 32 is equal to the thickness of the composite laminate structure 21 in a state after molding or bonding.
  • the pin 32 is formed at the other side, that is, the lower end portion 32a has a pointed shape as shown in FIG. 15 so that the pin 32 is advantageously inserted into the composite laminate structure 21.
  • the Z-pinning process is performed in the forming step, the composite laminate structure 21 is softened by high temperature. Z-pinning itself is not a big problem.
  • the Z-pinning patch 30 of the present invention is not only used in the molding process, but may also be used for joining various members of the composite structure after the molding is completed (as will be described in detail below). In this case, a process of adding heat or pressure to the composite structure may be necessary for reshaping the composite structure, and it is most preferable that the other side is pointed to more advantageously insert the pin 32.
  • the fin 32 has a concave-convex shape 32b formed on the surface of the fin as shown in FIG. 15. Since the unevenness 32b is formed, it is possible to further improve the anti-separation force of the pin by external load after molding. Furthermore, chemically corroding the surface of the fin can further improve the adhesion properties.
  • 7 and 8 illustrate one embodiment of a method of making a composite laminate structure using the Z-pinning patch of the present invention. 7 and 8 will be described in more detail with respect to the manufacturing method of the Z-pinning patch 30 and the composite laminate structure of the present invention as follows.
  • the composite molding method using the Z-pinning patch 30 of the present invention is basically similar to the general composite molding method. That is, as in the general composite molding method of FIG. 1, the release member 12 is applied on the mold 11 for forming the composite, the composite prepreg laminate 21 is placed, and the release member 12 and the resin are absorbed again. After covering the whole with a film bag 15 attached with an adapter 16 for applying a vacuum, a bleeder 13 is placed, and then sealed at the edge with a sealant 17. Also, the cork dam 14 may not be used depending on the characteristics of the molding method for molding the composite laminate structure 21.
  • the state before molding refers to a state in which prepregs are laminated
  • the state after molding refers to a state in which molding is completed by applying molding pressure to the laminated prepregs. That is, in the present invention, the pin may be inserted at the same time as the prepreg is laminated, and the pin may be pinned to the laminated prepreg first, followed by a general composite molding process to complete the composite laminate structure. Even the composite laminate structure in which the molding is completed may be inserted into the pin during the remolding process, or the pin may be inserted to join a plurality of composite laminate structures in a pre-molded or post-molded state. (The last case will be described later in more detail with reference to FIG. 13.)
  • the composite laminate structure 21 is first disposed before or after molding.
  • the Z-pinning patch 30 is placed so that the other side of the pin 32 is in contact with the composite laminate structure 21 before or after molding.
  • the Z-pinning patch 30 is disposed between the composite laminate structure 21 and the release film 12 on the composite laminate structure 21.
  • the Z-pinning patch 30 is pressed by the pressing force toward the base plate 31, and finally the pin 32 is inserted into the composite laminate 21.
  • Z-pinning using the Z-pinning patch 30 of the present invention is completed.
  • the viscosity of the resin inside the prepreg is actually lowered due to the high temperature applied in the molding process, and since the pressure is added to the Z-pinning patch 30 by high pressure, the Z-pinning patch
  • the pins 32 of 30 can be easily inserted into the composite laminate structure 21.
  • the pin 32 is completely inserted into the composite laminate structure 21 while the base plate 31 remains exposed to the outside of the composite laminate structure 21.
  • the appearance problem of is actually a negligible issue as a factor of less importance that is rarely considered in the field where such composite laminate structures are used.
  • the base plate 31 remains on the outer side of the composite laminate structure 21, the portion is protected from the outside, it may be possible to obtain additional effects to further reinforce the portion.
  • the patch guide 40 for guiding and guiding the insertion path of the Z-pinning patch 30 is further used.
  • the patch guide 40 includes a lower guide 42 having an opening formed therethrough for allowing the Z-pinning patch 30 to pass therethrough, and the lower guide 42. It includes an upper guide 41 which is provided on one side of the opening to be inserted into the opening.
  • the opening formed in the lower guide 42 may be formed in a through shape if the lower guide 42 completely surrounds the Z-pinning patch 30, or the lower guide 42 may be formed in the lower guide 42.
  • the upper guide 41 is provided on one side of the lower guide 42 and is formed to be movable up and down (as shown in FIGS. 9 and 10).
  • This coupling form of the upper guide 41 and the lower guide 42 can be easily implemented in a very simple form, such as to make the engaging portion is a sliding coupling, detailed description thereof will be omitted.
  • the upper 41 guide and the lower guide 42 may be coated with a release material on the surface to facilitate separation of the composite structure and the like after molding.
  • the manufacturing method at the time of using the said patch guide 40 is as follows. Initially, one embodiment of a conventional method of forming a composite laminate structure or a method of manufacturing a composite laminate structure of the present invention as shown in FIGS. 7 and 8 (ie, without the patch guide 40) ), The composite laminate structure 21 is first placed before or after molding, and then the other side of the pin 32 is in contact with the composite laminate structure 21 before or after molding. The Z-pinning patch 30 is raised to make it.
  • the patch guide 40 is covered by the Z-pinning patch 30 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42.
  • the Z-pinning patch 30 is pressed by the force applied to the upper guide 41 side, and finally the pin 32 is inserted into the composite laminate structure 21, whereby the Z- Z-pinning using the pinning patch 30 and the patch guide 40 is completed.
  • the patch guide 40 may be removed after removal of the Z-pinning, and it is natural that the patch guide 40 may be reused.
  • the reason why the patch guide 40 is to be used in this way is as follows.
  • the area of the site (hereinafter referred to as the binding site) to increase the bonding force is considerably narrow, the base plate (because the area of the base plate 31 is formed to be the same as the area of the binding site) 31)
  • the area becomes narrower, which reduces the number of the pins 32 significantly.
  • the number of these pins 32 may also be so small that they may stand on their own, but there is some possibility that they may fall down when a pressing force is applied.
  • the patch guide 40 is used to exclude this possibility.
  • the patch guide 40, the binding site is very narrow and the Z-pinning patch 30 itself is also used to prevent the collapse when the bonding area is very small, if the binding site is large enough Figure 7 and It may not be used as in the example of FIG.
  • the bonding site is sufficiently wide, as shown in the example of FIG. 11, when the Z-pinning patch 30 is formed in all the inclined directions of the pins 32, pressing force is applied. Since the Z-pinning patch 30 is more likely to fall when pulled out, it would be desirable to use the properly designed patch guide 40 in this case. 11, that is, when the Z-pinning patch 30 has all the inclined directions of the pins 32 formed to one side, the patch guide 40 has the upper guide 41 at the lower guide.
  • the direction to be inserted and moved to 42 is designed to be formed to be the same as the inclined direction of the pins 32.
  • various forms of the patch guide 40 are disclosed in FIGS. 9 to 11, but the present invention is not limited thereto, and the area or shape of the coupling site and the inclined direction of the pin 32 are not limited thereto.
  • the shape of the patch guide 40 may be changed in various ways according to various factors that can be considered by the designer or the intention of the designer.
  • FIG. 13 shows an example of a composite laminate structure bonded by a method of joining a composite laminate structure using the Z-pinning patch of the present invention.
  • the method of joining a composite laminate structure using the Z-pinning patch of the present invention differs only in that a plurality of composite laminate structural members are initially stacked, and the Z-pinning patch 30 is bonded to each other. Pressing and inserting in to complete the Z-pinning is the same as the manufacturing method described above.
  • the lower composite laminated structural member 21b and the upper composite laminated structural member 21t are sequentially disposed from below, and the upper composite laminated structure is next.
  • the Z-pinning patch 30 is placed on the member 21t so that the other side of the pin 32 is in contact, and finally, a pressing force is applied to the base plate 31 to stack the composite material having the pin 32 stacked thereon.
  • the patch guide 40 is used, first, the lower composite laminated structural member 21b and the upper composite laminated structural member 21t are sequentially disposed from below, and then the upper composite laminated structural member 21t. The same as above until the Z-pinning patch 30 is raised so that the other side of the pin 32 contacts, and then the Z-pinning patch 30 is inserted into the opening of the lower guide 42.
  • the patch guide 40 is covered with the Z-pinning patch 30, and finally a pressing force is applied to the upper guide 41 side, the composite laminated structural members 21b having the pins 32 laminated ( 21t), the bonding process of the composite laminate structure using the Z-pinning patch of the present invention (using the patch guide 40 further) is completed.
  • the composite laminated structural members 21b and 21t (that is, the upper composite laminated structural members 21t and the lower composite laminated structural members 21b that are laminated) are previously bonded, pressed or thermally bonded. If the combined state through the primary bonding process including a may further improve the bonding effect. Of course, if the primary coupling state as described above, when the coupling using the Z-pinning patch 30 is also less likely to be separated from each other in position can increase the process efficiency and minimize the failure rate.
  • FIG. 14 simultaneously applies the Z-pinning patch 30 to the top and bottom to enhance the coupling effect between the two members.
  • two Z-pinning patches 30 in which the pins 32 are inclined are applied to the upper and lower sides, respectively, such that the upper Z-pinning patch 30 and the lower Z-pinning patch 30 are applied to each other.
  • Each of the pins 32 is to be formed to cross each other, in this way, the upper and lower pins 32 by changing the direction thereof can further enhance the coupling effect between the two members.
  • the fabrication method is not significantly different from the previous descriptions, such as by applying an appropriate load to the prepreg laminated during the molding process (for example, by applying a high frequency vibration load) to the lower Z-pinning patch 30 to an appropriate depth. Inserted, the upper Z-pinning patch can be made by applying the molding method described above.
  • the present invention performs Z-pinning using a patch having a plurality of pins vertically formed on a thin plate. Since the patch needs to be manufactured and supplied in advance, the manufacturing process of the actual composite laminate structure itself is extremely simplified. It has a great effect. Specifically, parts of the conventional foam structure, reinforcement structure, various fixtures, etc. are not required at all, so that the number of parts and the number of processes can be significantly reduced. Of course, as compared to the conventional manufacturing cost can be lowered and the production efficiency can be increased, the economic effect is also excellent.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Textile Engineering (AREA)
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  • Composite Materials (AREA)
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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The objective of the present invention is to provide a Z-pin patch and a method for manufacturing or coupling a composite laminated structure using same. According to the present invention, the Z-pinning of a composite structure may be achieved using a maximally simplified structure to improve process efficiency and productivity. The Z-pin patch according to the present invention may be a Z-pin patch (30) which is used for Z-pinning for reinforcing the interlayer performance of a composite laminated structure or for contacting and connecting a plurality of laminated members together. The Z-pin patch includes: a base plate (31) having a plate shape; and a plurality of pins (32) fixed to one side of the base plate (31).

Description

Ｚ-피닝 패치 및 이를 이용한 복합재 적층 구조물의 제조 또는 결합 방법Ｚ-Peening Patch and Manufacturing or Bonding Method of Composite Laminated Structures Using the Same
본 발명은 복합재 적층 구조물의 두께 방향으로 핀을 박아 복합재 적층 구조물의 층간성능을 보강하거나 다수의 적층 부재를 접촉 연결하는, Z-피닝 패치 및 이를 이용한 복합재 적층 구조물의 제조 또는 결합 방법에 관한 것이다.The present invention relates to a Z-pinning patch and a method for manufacturing or bonding a composite laminate using the same, by pinning in the thickness direction of the composite laminate to reinforce the interlayer performance of the composite laminate or to connect a plurality of laminates.
항공우주 및 수송기구 구조부재 등의 경량화 구조물에 많이 사용되고 있는 섬유강화 복합재료는 대부분 일방향 또는 직조된 프리프레그(prepreg)를 적층하고 열과 압력을 가하는 성형과정을 거침으로써 제작된다. 이렇게 적층 성형된 복합재 적층 구조물은 두께 방향으로는 별도의 강화재가 없기 때문에 외부의 충격 등에 의하여 쉽게 층과 층 사이가 분리되는 층간분리 현상이 발생된다. 이 층간분리는 구조물의 강도를 떨어뜨리기 때문에 이를 방지하기 위한 방법이 관련분야의 연구자들에 의하여 많이 연구되어 왔다. 즉, 복합재 적층 구조물의 취약한 층간분리 특성을 보강하기 위하여 스티칭(Stitching), Z-피닝(Z-Pinning), 텍스타일(Textile), 고인성 수지(Toughened Matrix) 등의 방법에 대한 많은 연구들이 수행되어 왔다.Fiber-reinforced composites, which are widely used in lightweight structures such as aerospace and transportation structural members, are manufactured by laminating unidirectional or woven prepregs and applying heat and pressure. Since the laminated laminated composite structure is not a separate reinforcing material in the thickness direction, the interlayer separation phenomenon is easily separated between the layers due to external impact. Since this delamination lowers the strength of the structure, methods for preventing this have been studied by researchers in the related field. In other words, many studies have been conducted on methods such as stitching, Z-pinning, textiles, toughened matrix, etc. to reinforce the weak delamination properties of the composite laminate structure. come.
복합재 적층 구조물의 층간강성을 높이거나 두 복합재 적층 구조 부재간의 연결을 위한 연구들 중 Z-피닝(Z-pinning) 기술에 대한 연구는 비교적 최근에 시작된 연구 분야이다. Z-피닝에 대하여 알려진 종래의 연구내용을 간략히 살펴보면 다음과 같다.Among the studies for increasing the interlaminar stiffness of the composite laminate structure or connecting the two composite laminate members, Z-pinning technology is a relatively recent research field. A brief description of the known research on Z-pinning is as follows.
Z-피닝 방법의 최초 개념은 미국특허등록 제4,808,461호(1989. 2. 28, 이하 선행기술1)에서 볼 수 있다. 상기 선행기술1의 핵심 개념은, 폴리비닐 계열의 폼에 핀을 두께 방향으로 박아놓고, 상부에는 얇은 스테인레스판을 부착하고 하부에는 이형재 필름을 부착한 소위 '강화 구조'라는 것을 성형 시 적층하기 위한 복합재의 상부에 위치하고 성형함으로써 성형과정에서 고온 고압에 의하여 프리폼이 붕괴되면서 핀이 적층판 내부로 박히게 하는 것이다(도 1 참조). 성형이 완료되면 붕괴되어 압축된 프리폼의 잔재를 제거하고 그 두께만큼 돌출된 핀들을 물리력으로 부러뜨려 제거하면 적층 구조물 내부에는 적층 두께 방향으로 핀들이 박혀 남아있기 때문에 층간분리 성능이 강화된다. 상기 선행기술1은 이러한 방법과 위의 '강화 구조'를 특징으로 하고 있으나, 현재까지 이 개념의 실용화가 실제 성공하였다는 보고는 아직 알려져 있지 않다. The initial concept of the Z-pinning method can be found in US Patent 4,808,461 (February 28, 1989, hereinafter Prior Art 1). The core concept of the prior art 1 is to put a pin in a polyvinyl foam in the thickness direction, attach a thin stainless steel plate on the upper side and a release material film on the lower side so as to laminate the laminate during molding Positioning and forming the upper portion of the composite material is to collapse the preform by the high temperature and high pressure during the molding process is to be pinned into the laminate (see Figure 1). When the molding is completed, the remnant of the deformed and compressed preform is removed, and the pins protruding by the thickness are removed by physical force, so that the interlayer separation performance is enhanced because the pins remain embedded in the stacking thickness direction. The prior art 1 is characterized by such a method and the above 'reinforced structure', but until now, the report of the practical success of this concept is not known yet.
이후 미국특허등록 제5,186,776호(1993. 2. 16, 이하 선행기술2)에는 핀을 복합재료 강화섬유 다발로부터 바로 성형하고, 성형된 핀에 초음파 진동을 부가하여 복합재 적층 구조물에 삽입하는 일련의 작동을 할 수 있는 기계장치 및 그 방법이 개시되어 있으며, 미국특허등록 제5,589,015호(1996. 12. 31, 이하 선행기술3)에는 핀을 미리 박아놓은 압축 가능한 '폼 구조'에 초음파 진동장치를 사용하여 진동을 부가하면서 압축함으로써 핀을 성형 전 또는 성형 후 상태의 복합재 적층 구조물에 박는 방법 및 시스템이 개시되어 있다. 상기 선행기술3은 실제 상용화되어 F/A-18 E/F의 후방동체 덕트구조물 연결부에 활용되었다고 알려져 있다. 이후 Z-피닝과 관련하여 미국특허등록 제5,667,859호(1997), 제5,800,672호(1998), 제5,919,413호(1999), 제6,190,602호(2001), 제6,291,049호(2001), 제6,405,417호(2002), 제6,436,507호(2002) 등이 있는데, 초기의 개념인 '강화 구조' 또는 '폼 구조'를 사용하는 개념이 지속적으로 유지되고 있다.US Patent No. 5,186,776 (February 16, 1993, hereinafter 2) discloses a series of operations in which a pin is molded directly from a bundle of composite reinforcing fibers, and ultrasonic wave is applied to the formed pin to insert it into the composite laminate structure. A mechanical device and a method thereof are disclosed, and US Patent No. 5,589,015 (Dec. 31, 1996, hereinafter 3) uses an ultrasonic vibration device in a compressible 'foam structure' in which pins are pre-loaded. There is disclosed a method and system for embedding a pin into a composite laminate structure in a pre- or post-molded state by compressing while adding vibration. The prior art 3 is known to be commercially available and utilized to connect the rear fuselage duct structure of the F / A-18 E / F. Subsequently, US Patent Registration Nos. 5,667,859 (1997), 5,800,672 (1998), 5,919,413 (1999), 6,190,602 (2001), 6,291,049 (2001), and 6,405,417 (2002) with respect to Z-pinning. ), 6,436, 507 (2002), and the concept of using an early concept of a 'reinforced structure' or a 'form structure' is continuously maintained.
도 1은 일반적인 복합재 성형 방법을 보여주는 예시도이다. 복합재 성형을 위한 몰드(111) 위에 이형재(112)를 적용하고, 복합재 프리프레그 적층물(121)을 올려놓고, 다시 이형재(112) 및 레진을 흡수하는 블리더(bleeder)(113)를 깔고, 진공을 부여하는 어댑터(116)가 부착된 필름백(115)으로 전체를 덮은 후, 가장자리에는 실런트(117)로 밀폐한다. 복합재 적층 구조물(121)을 성형하는 성형법의 특징에 따라 코르크 댐(114)을 사용하지 않는 경우도 있다.1 is an exemplary view showing a general composite molding method. Apply the release material 112 on the mold 111 for composite molding, put the composite prepreg stack 121, and lay the bleeder 113 to absorb the release material 112 and the resin again, After covering the whole with the film bag 115 to which the adapter 116 which applies a vacuum is attached, it seals with the sealant 117 at the edge. The cork dam 114 may not be used depending on the characteristics of the molding method for molding the composite laminate structure 121.
도 2는 종래의 Z-피닝 방법에 대한 한 예시도로서, 상기 선행기술1의 개념을 보여주고 있다. 핀(231)이 압축가능한 폼(232)에 박혀 있고, 상부에는 스테인레스 판 및 하부에는 이형재 필름이 부착된 '강화 구조(230)'를 도 2와 같이 배치하고 성형을 하면 성형 압력과 성형온도에 의하여 폼(232)이 붕괴되면서 핀(231)이 복합재 적층 구조물(221) 내부로 박히게 되는 것이다.Figure 2 is an exemplary view of a conventional Z-pinning method, showing the concept of the prior art 1. When the pin 231 is embedded in the compressible foam 232 and the stainless steel plate on the upper side and the release film on the lower side are attached to the reinforcing structure 230 as shown in FIG. As the foam 232 collapses, the pins 231 are driven into the composite stack structure 221.
도 3은 종래의 Z-피닝 방법에 대한 또 다른 예시도로서, 종래의 Z-피닝 방법을 사용하여 두께가 일정하지 않은 복합재 적층 구조물을 성형하는 경우에 대한 것이다. 두께가 일정하지 않은 복합재 적층 구조물을 종래의 Z-피닝 방법으로 성형하는 경우에 '강화 구조(330)' 상부의 스테인레스 판이 변형을 방해하기 때문에 곤란하다. 비록 스테인레스 판을 부착하지 않은 '폼 구조'를 사용한다고 하더라도 핀(331)의 길이가 일정한 '폼 구조(330, 230과 유사)'를 사용하면, 복합재 두께가 두꺼운 부분(322)과 두께가 얇은 부분(323)에 있어서 성형조건을 모두 만족시키기 곤란하다. 즉, 핀(331)의 길이를 두꺼운 부분(322)에 맞추면, 얇은 부분(323)의 경우에는 핀(331)의 길이가 길어 성형 압력이 복합재 적층 구조물(323)에 작용하지 않게 되어 복합재 성형의 기본적인 요구조건(성형 단계에서 복합재 적층 구조물 내부에서 발생하는 기포를 제거하고 여분의 레진을 방출하기 위하여 복합재 적층 구조물에 7~8기압 또는 재료에 따라 20기압 정도의 고압이 작용될 필요가 있음)을 만족하지 못하게 된다. 또한 핀(331)의 길이를 얇은 부분(323)에 맞추면, 두꺼운 부분(322)의 경우에는 핀(331)의 길이가 짧아 적층 구조물의 두께 방향으로 일부에만 핀이 박히는 현상이 발생하게 되어 Z-피닝 방법의 효과를 충분히 발휘하지 못하게 된다. 따라서 종래의 Z-피닝 방법으로 두께가 일정하지 않은 복합재 적층 구조물을 성형하기 위해서는 '폼 구조(330)'의 두께를 적층 구조물의 두께에 맞도록 변화시켜 제작하여야 하는데, 이는 압축가능한 폼(332) 구조의 특성상 가공이 용이하지 않을 수 있다.3 is another exemplary view of a conventional Z-pinning method, which is for the case of forming a composite laminate structure having a constant thickness using the conventional Z-pinning method. In the case of forming a composite laminated structure having a constant thickness by the conventional Z-pinning method, it is difficult because the stainless plate on the 'reinforced structure 330' interferes with deformation. Even though a 'foam structure' without a stainless plate is used, a 'foam structure (similar to 330 and 230') having a constant length of the pin 331 is used. It is difficult to satisfy all of the molding conditions in the part 323. That is, when the length of the pin 331 is matched to the thick portion 322, in the case of the thin portion 323, the length of the pin 331 is long so that the molding pressure does not act on the composite laminate structure 323. The basic requirements (7-8 atm or 20 atm of pressure depending on the material need to be applied to the composite laminate to remove bubbles and release excess resin in the molding stage). You will not be satisfied. In addition, when the length of the pin 331 is matched to the thin portion 323, in the case of the thick portion 322, the length of the pin 331 is short, so that only a part of the pin is stuck in the thickness direction of the laminated structure. The effect of the pinning method is not sufficiently exerted. Therefore, in order to mold a composite laminate structure having a non-uniform thickness by a conventional Z-pinning method, the thickness of the 'foam structure 330' should be changed to match the thickness of the laminate structure, which is a compressible foam 332. Due to the nature of the structure, processing may not be easy.
이와 같이 종래의 선행기술들은 공통적으로, 복합재 적층 구조물에 핀을 박기 위하여 폼에 핀이 미리 박혀있고, 외부의 진동 하중이나 성형 압력에 의하여 폼이 압축 붕괴되면서 핀이 복합재 적층 구조물 안으로 박히는 특성을 갖는, 소위 '폼 구조('강화 구조'도 '폼 구조'의 일종으로 볼 수 있음)'를 매개체로 활용하고 있으며, 이 '폼 구조'를 그 기술의 특징으로 하고 있다. 그런데, 이러한 종래의 기술을 이용하여 '폼 구조'를 사용하는 경우에는 핀을 박고 나서 압축 붕괴된 폼을 인위적으로 제거하여야 하고, 핀의 돌출된 부분도 강제로 파단하여 제거하여야 하기 때문에 소재의 낭비 및 공정상의 비효율이 불가피하다. 또한 핀이 파단되어 제거된 위치에는 일부 흠집이 발생할 수도 있고, 핀의 파단 과정에서 핀과 주변 구조물의 강도에 악영향을 주게 되는 문제점이 있다.As described above, the conventional prior arts have a characteristic that pins are pre-embedded in a foam in order to pin the composite laminated structure, and the pins are driven into the composite laminated structure while the foam is compressed and collapsed by external vibration load or molding pressure. The so-called 'form structure' ('reinforcement structure' can also be seen as a form of 'form structure') is used as a medium, and this 'form structure' is a feature of the technology. However, in the case of using the 'foam structure' using the conventional technique, the compression collapsed foam must be artificially removed after pinning, and the protruding portion of the pin must be forcibly broken to remove material waste. And process inefficiency is inevitable. In addition, some scratches may occur at the location where the pin is broken, and the pin has a problem of adversely affecting the strength of the pin and the surrounding structure during the breaking of the pin.
뿐만 아니라, 이와 같이 폼 구조 또는 강화 구조를 사용하여 복합재 적층 구조물에 핀을 박는 방법은, 복합재 적층 구조물의 높이가 일정하지 않은 경우에 높이에 따라 핀이 박히는 깊이가 달라지므로, 상기 선행기술에 의하여 제작된 높이가 고르지 않은 복합재 적층 구조물은 위치에 따라 층간 강성이 고르지 않게 된다는 큰 문제점이 있었다. 또는, 높이가 일정하지 않은 복합재 적층 구조물에 Z-피닝하는 종래의 방법은 장비의 구성이 복잡하고 과정이 매우 난해하여 적용하기 매우 어려운 문제점 또한 있었다.In addition, the method of pinning the composite laminate structure using the foam structure or the reinforcement structure in this way, because the depth of pin pins vary depending on the height when the height of the composite laminate structure is not constant, according to the prior art The uneven height of the laminated composite structure has a big problem that the interlayer stiffness is uneven depending on the location. Alternatively, the conventional method of Z-pinning a composite laminate structure having a non-uniform height also has a problem in that the configuration of the equipment is complicated and the process is very difficult to apply.
도 4는 본 출원인에 의하여 출원된 "핀을 박아 성능을 보강한 복합재 적층 구조물, 상기 복합재적층 구조물 제조 방법, 장치 및 상기 장치 제작 방법"(한국특허등록 제0932302호, 2009.12.08, 이하 선행기술4)이다. 선행기술4에서는, 도 4를 참조하면, 성형 전 또는 성형 후 상태의 복합재 적층 구조물(421) 위에 올려지며, 수직 방향으로 형성된 다수 개의 구멍(453) 내에 각각 상기 복합재 적층 구조물(421) 내로 삽입될 핀(451)이 구비되는 하부 가이드(450); 상기 하부 가이드(450) 위에 올려지며, 상기 핀(451)과 대응하는 위치에 수직 방향으로 이동 가능하게 형성되는 가이드핀(441)이 구비되는 상부 가이드(440); 를 포함하여 이루어져, 상부 가이드가 하부 가이드 쪽으로 이동하면서 가이드 핀이 핀을 눌러 복합재 적층 구조물로 핀이 삽입되도록 하는 기술을 개시하고 있다. 선행기술4는 앞서의 선행기술1 내지 3에서 사용되던 복잡한 폼 구조의 형태를 사용하지 않고 보다 단순화시킴으로써 공정을 개선한 것으로, 상당히 간단한 구조로서 Z-피닝이 이루어질 수 있도록 하고, 또한 반복적인 재사용이 가능하도록 하여 공정 효율을 보다 개선시키고 있다. 그러나 선행기술 4 역시 상/하부 치구를 사용해야 하도록 되어 있어, 공정에 사용되는 부품 수를 더욱 줄이고 공정을 단순화하는 개선의 필요성이 있다.Figure 4 is a filed by the applicant "reinforced the performance of the composite laminated structure, the composite laminated structure manufacturing method, apparatus and method for manufacturing the device" (Korea Patent Registration No. 0932302, 2009.12.08, hereinafter prior art 4). In prior art 4, referring to FIG. 4, the composite stack structure 421 is placed before or after molding, and is inserted into the composite stack structure 421 in a plurality of holes 453 formed in the vertical direction. A lower guide 450 having a pin 451; An upper guide 440 mounted on the lower guide 450 and having a guide pin 441 formed to be movable in a vertical direction at a position corresponding to the pin 451; It comprises a, it discloses a technique for allowing the pin to be inserted into the composite laminated structure by pressing the pin while the upper guide is moved toward the lower guide. Prior art 4 improves the process by simplifying the form rather than using the complex foam structures used in the prior arts 1 to 3 above, which allows Z-pinning to be achieved as a fairly simple structure, and also allows for repetitive reuse. Making it possible to further improve process efficiency. However, prior art 4 is also required to use the upper and lower jig, there is a need for improvement to further reduce the number of parts used in the process and to simplify the process.
[선행기술문헌][Preceding technical literature]
[특허문헌][Patent Documents]
1. 미국특허등록 제4,808,461호(1989.02.28)1. U.S. Patent No. 4,808,461 (1989.02.28)
2. 미국특허등록 제5,186,776호(1993.02.16)2. U.S. Patent No. 5,186,776 (1993.02.16)
3. 미국특허등록 제5,589,015호(1996.12.31)3. U.S. Patent No. 5,589,015 (December 31, 1996)
4. 미국특허등록 제5,667,859호(1997)4. US Patent No. 5,667,859 (1997)
5. 미국특허등록 제5,800,672호(1998)5. US Patent Registration No. 5,800,672 (1998)
6. 미국특허등록 제5,919,413호(1999)6. U.S. Patent No. 5,919,413 (1999)
7. 미국특허등록 제6,190,602호(2001)7. US Patent Registration No. 6,190,602 (2001)
8. 미국특허등록 제6,291,049호(2001)8. US Patent Registration No. 6,291,049 (2001)
9. 미국특허등록 제6,405,417호(2002)9. US Patent Registration No. 6,405,417 (2002)
10. 미국특허등록 제6,436,507호(2002)10. US Patent No. 6,436,507 (2002)
11. 한국특허등록 제0932302호(2009.12.08)11.Korea Patent Registration No. 0932302 (2009.12.08)
따라서, 본 발명은 상기한 바와 같은 종래 기술의 문제점을 해결하기 위하여 안출된 것으로, 본 발명의 목적은 최대한 단순화된 간단한 구조를 이용하여 복잡재 구조물의 Z-피닝을 실현할 수 있도록 하여 공정 효율 및 생산성 등을 개선하는, Z-피닝 패치 및 이를 이용한 복합재 적층 구조물의 제조 또는 결합 방법을 제공함에 있다.Accordingly, the present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to realize the Z-pinning of the composite structure using a simple structure as simple as possible to process efficiency and productivity The present invention provides a method of manufacturing or bonding a Z-pinning patch and a composite laminate structure using the same.
상기한 바와 같은 목적을 달성하기 위한 본 발명의 Z-피닝 패치는, 복합재 적층 구조물(21)의 층간분리 성능 보강 또는 다수의 적층 부재 간의 접촉 연결을 위한 Z-피닝에 사용되는 Z-피닝 패치(30)로서, 판상으로 형성되는 기저판(31); 상기 기저판(31)에 일측이 고정되는 다수 개의 핀(32); 을 포함하여 이루어지는 것을 특징으로 한다.The Z-pinning patch of the present invention for achieving the above object is a Z-pinning patch used for Z-pinning for reinforcing delamination performance of the composite laminate structure 21 or for contact connection between a plurality of laminated members ( 30) a base plate 31 formed in a plate shape; A plurality of pins 32 having one side fixed to the base plate 31; Characterized in that comprises a.
이 때, 상기 Z-피닝 패치(30)는 상기 핀(32) 측이 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 올려지며, 상기 복합재 적층 구조물(21)의 성형 또는 결합 공정 시 상기 핀(32)이 상기 복합재 적층 구조물(21)로 삽입되어 Z-피닝되는 것을 특징으로 한다.At this time, the Z-pinning patch 30 is placed on the composite laminate structure 21 of the pin 32 side before or after molding, during the molding or bonding process of the composite laminate structure 21 The pin 32 is inserted into the composite laminate structure 21 is characterized in that Z-pinning.
또한, 상기 핀(32)은 상기 기저판(31)에 대하여 수직 방향 또는 경사진 방향으로 돌출되는 형태로 형성되는 것을 특징으로 한다.In addition, the pin 32 is characterized in that it is formed to protrude in the vertical direction or the inclined direction with respect to the base plate (31).
또한, 상기 핀(32)은 다수 개의 상기 핀(32)들 간에 상기 기저판(31)에 대하여 돌출되는 각도가 동일하게 형성되는 것을 특징으로 한다.In addition, the pin 32 is characterized in that the angle which is projected with respect to the base plate 31 between the plurality of the pin 32 is formed equal.
또한, 상기 Z-피닝 패치(30)는 상기 Z-피닝 패치(30)가 통과 가능하도록 형성되는 개방부가 형성된 하부 가이드(42) 및 상기 하부 가이드(42)의 개방부의 일측에 상기 개방부로 삽입 이동이 가능하도록 구비되는 상부 가이드(41)를 포함하여 이루어지는 패치 가이드(40)에 의하여 안내되어 상기 복합재 적층 구조물(21)로 삽입되는 것을 특징으로 한다.In addition, the Z-pinning patch 30 is inserted into the opening to the lower guide 42 and the opening of the lower guide 42 formed with an opening formed to pass through the Z-pinning patch 30 into the opening. It is characterized in that it is guided by the patch guide 40 comprising an upper guide 41 provided to be inserted into the composite laminate structure 21.
또한, 상기 핀(32)은 하단부(32a)가 뾰족한 형상으로 형성되는 것을 특징으로 한다. 이 때, 상기 핀(32)은 핀의 표면에 요철(32b) 형상이 형성된 것이 더욱 바람직하다. 더 나아가 핀의 표면을 화학적으로 부식 처리하면 접착 특성을 더욱 향상시킬 수 있다.In addition, the pin 32 is characterized in that the lower end portion 32a is formed in a pointed shape. At this time, it is more preferable that the pin 32 has a concave-convex shape 32b formed on the surface of the pin. Furthermore, chemically corroding the surface of the fin can further improve the adhesion properties.
또한, 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법은, 상술한 바와 같은 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법에 있어서, a1) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21)이 배치되는 단계; a2) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계; a3) 상기 기저판(31) 측으로 누르는 힘이 가해져 상기 핀(32)이 상기 복합재 적층 구조물(21) 내로 삽입되는 단계; 를 포함하여 이루어지는 것을 특징으로 한다.In addition, the method for producing a composite laminate structure using the Z-pinning patch of the present invention, in the method for producing a composite laminate structure using the Z-pinning patch as described above, a1) the composite laminate before or after molding Placing the structure 21; a2) placing the Z-pinning patch 30 on the composite laminate structure 21 before or after molding so as to contact the other side of the pin 32; a3) pressing force toward the base plate 31 to insert the pin 32 into the composite laminate structure 21; Characterized in that comprises a.
또는, 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법은, 상술한 바와 같은 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법에 있어서, b1) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21)이 배치되는 단계; b2) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계; b3) 상기 하부 가이드(42)의 개방부 내로 상기 Z-피닝 패치(30)가 삽입되도록 상기 패치 가이드(40)가 상기 Z-피닝 패치(30)에 씌워지는 단계; b4) 상기 상부 가이드(41) 측으로 누르는 힘이 가해져 상기 핀(32)이 상기 복합재 적층 구조물(21) 내로 삽입되는 단계; 를 포함하여 이루어지는 것을 특징으로 한다.Alternatively, the method for producing a composite laminate structure using the Z-pinning patch of the present invention, in the method for producing a composite laminate structure using the Z-pinning patch as described above, b1) the composite laminate before or after molding Placing the structure 21; b2) the Z-pinning patch 30 is raised so that the other side of the pin 32 contacts the composite laminate structure 21 before or after molding; b3) covering the Z-pinning patch 30 with the patch guide 40 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42; b4) pressing force toward the upper guide 41 to insert the pin 32 into the composite laminate structure 21; Characterized in that comprises a.
또한, 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법은, 상술한 바와 같은 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법에 있어서, c1) 하부 복합재 적층 구조 부재(21b) 및 상부 복합재 적층 구조 부재(21t)가 아래에서부터 순차적으로 배치되는 단계; c2) 상기 상부 복합재 적층 구조 부재(21t) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계; c3) 상기 기저판(31) 측으로 누르는 힘이 가해져 상기 핀(32)이 적층된 상기 복합재 적층 구조 부재들(21b)(21t) 내로 삽입되는 단계; 를 포함하여 이루어지는 것을 특징으로 한다.In addition, the bonding method of the composite laminate structure using the Z-pinning patch of the present invention, in the bonding method of the composite laminate structure using the Z-pinning patch as described above, c1) the lower composite laminate structure member 21b and the upper Placing the composite laminated structural member 21t sequentially from below; c2) placing the Z-pinning patch 30 on the upper composite laminated structural member 21t so that the other side of the pin 32 is in contact; c3) pressing force toward the base plate 31 to insert the pin 32 into the laminated composite structural members 21b and 21t; Characterized in that comprises a.
또는, 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법은, 상술한 바와 같은 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법에 있어서, d1) 하부 복합재 적층 구조 부재(21b) 및 상부 복합재 적층 구조 부재(21t)가 아래에서부터 순차적으로 배치되는 단계; d2) 상기 상부 복합재 적층 구조 부재(21t) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계; d3) 상기 하부 가이드(42)의 개방부 내로 상기 Z-피닝 패치(30)가 삽입되도록 상기 패치 가이드(40)가 상기 Z-피닝 패치(30)에 씌워지는 단계; d4) 상기 상부 가이드(41) 측으로 누르는 힘이 가해져 상기 핀(32)이 적층된 상기 복합재 적층 구조 부재들(21b)(21t) 내로 삽입되는 단계; 를 포함하여 이루어지는 것을 특징으로 한다.Alternatively, the bonding method of the composite laminate structure using the Z-pinning patch of the present invention, in the bonding method of the composite laminate structure using the Z-pinning patch as described above, d1) the lower composite laminate structure member 21b and the upper portion Placing the composite laminated structural member 21t sequentially from below; d2) placing the Z-pinning patch 30 on the upper composite laminate structural member 21t so that the other side of the pin 32 contacts; d3) covering the Z-pinning patch 30 with the patch guide 40 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42; d4) pressing force toward the upper guide 41 to insert the pin 32 into the laminated composite structural members 21b and 21t; Characterized in that comprises a.
이 때, 상기 복합재 적층 구조 부재들(21b)(21t)은 접착, 압착 또는 열부착을 포함하는 1차 결합 가공을 거쳐 결합된 상태인 것을 특징으로 한다.At this time, the composite laminated structural members (21b) (21t) is characterized in that the bonded state through the first bonding process including bonding, compression or thermal bonding.
본 발명은 취약한 층간분리 성능을 갖는 복합재 적층 구조물의 제작에 있어서, 기본적으로는 복합재 적층 구조물의 두께 방향으로 핀을 박는 Z-피닝 방법을 적용함으로써 층간분리 성능의 보강 효과가 있으며, 또한 두 복합재 적층 구조 부재 간을 연결하는 효과도 있다.In the present invention, in the fabrication of a composite laminate structure having a weak delamination performance, basically by applying a Z-pinning method that pins in the thickness direction of the composite laminate structure, there is a reinforcing effect of the delamination performance, and also laminated two composites It also has the effect of connecting between structural members.
더불어 본 발명은 두께가 일정하지 않은 복합재 적층 구조물의 경우에도 용이하게 적용할 수 있으며, 또한 두께가 일정하지 않은 복합재 적층 구조물에도 고품질의 핀 박음이 이루어질 수 있도록 하는 큰 효과가 있다.In addition, the present invention can be easily applied even in the case of a composite laminate structure having a constant thickness, and also has a great effect to achieve high quality pinch even in a composite laminate structure having a constant thickness.
또한 본 발명에 의하면, 적층 구조물에 가해지는 외부 하중에 의한 핀의 이탈이 발생할 수 있는 경우에도 그 이탈이 쉽지 않도록, 핀의 표면을 요철 형상으로 가공하여 삽입함으로써 더욱 체결력을 향상시키는 효과가 있다. 더 나아가 핀의 표면을 화학적으로 부식 처리하면 접착 특성을 더욱 향상시킬 수 있다.In addition, according to the present invention, even if the separation of the pin by the external load applied to the laminated structure may occur so that the separation is not easy, there is an effect of improving the tightening force by further processing by inserting the surface of the pin into the concave-convex shape. Furthermore, chemically corroding the surface of the fin can further improve the adhesion properties.
무엇보다도 본 발명에 의하면, 종래의 Z-피닝 방법에서는 일회성 '폼 구조('강화 구조' 개념 포함)'를 사용함으로써 재료의 낭비가 불가피하고, 두께가 일정하지 않은 복합재 적층 구조물의 경우에는 적용하기 곤란하였던 문제점을 완전히 극복하는 효과가 있다. 즉, 본 발명은 얇은 판에 다수 개의 핀이 수직 형성되어 있는 형태의 패치를 사용하여 Z-피닝을 수행하는데, 이러한 패치는 미리 제작되어 공급되면 되기 때문에 실제 복합재 적층 구조물 자체의 제작 공정이 극히 단순화되는 큰 효과가 있다. 구체적으로 말하자면, 종래의 폼 구조, 강화 구조, 각종 치구 등의 부품이 전혀 필요하지 않게 되어 부품 수 및 공정 수를 훨씬 줄일 수 있는 효과가 있는 것이다. 물론 이에 따라 종래에 비하여 제작 원가를 낮추고 생산 효율을 높일 수 있어, 경제적 효과 또한 뛰어나다.First of all, according to the present invention, in the conventional Z-pinning method, the use of a one-time 'foam structure (including the' reinforced structure 'concept)' is inevitable, and the waste material is inevitable, and the thickness is not applied. There is an effect to completely overcome the problem was difficult. That is, the present invention performs Z-pinning using a patch having a plurality of pins vertically formed on a thin plate. Since the patch needs to be manufactured and supplied in advance, the manufacturing process of the actual composite laminate structure itself is extremely simplified. It has a great effect. Specifically, parts of the conventional foam structure, reinforcement structure, various fixtures, etc. are not required at all, so that the number of parts and the number of processes can be significantly reduced. Of course, as compared to the conventional manufacturing cost can be lowered and the production efficiency can be increased, the economic effect is also excellent.
도 1은 일반적인 복합재 성형 방법 예시.1 illustrates a typical composite molding method.
도 2는 종래의 Z-피닝 방법 예시.2 illustrates a conventional Z-pinning method.
도 3은 종래의 Z-피닝 방법 다른 예시.3 illustrates another conventional Z-pinning method.
도 4는 종래의 Z-피닝 방법 또다른 예시.4 is another illustration of a conventional Z-pinning method.
도 5 및 도 6은 본 발명의 Z-피닝 패치의 한 실시예.5 and 6 show one embodiment of the Z-pinning patch of the present invention.
도 7 및 도 8은 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법의 한 실시예.7 and 8 are one embodiment of a method of manufacturing a composite laminate structure using the Z-pinning patch of the present invention.
도 9 및 도 10은 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법의 다른 실시예.9 and 10 are another embodiment of a method for producing a composite laminate structure using the Z-pinning patch of the present invention.
도 11은 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법의 또다른 실시예.11 is another embodiment of a method of making a composite laminate structure using the Z-pinning patch of the present invention.
도 12는 본 발명의 Z-피닝 패치의 다른 실시예.12 is another embodiment of a Z-pinning patch of the present invention.
도 13 및 도 14는 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법에 의하여 결합된 복합재 적층 구조물의 예시.13 and 14 illustrate composite laminate structures joined by a method of joining composite laminate structures using Z-pinning patches of the present invention.
도 15는 본 발명의 핀 형상 예시.Figure 15 illustrates a pin shape of the present invention.
**부호의 설명**** Description of the sign **
11: 몰드 12: (이형재) 필름11: Mold 12: (release material) film
13: 블리더 14: 코르크 댐13: Bleeder 14: Cork Dam
15: 필름백 16: 어댑터15: Filmback 16: Adapter
17: 실런트17: sealant
21: 복합재 적층 구조물21: Composite Laminated Structures
21t: 상부 복합재 적층 구조 부재21t: upper composite laminate structural member
21b: 하부 복합재 적층 구조 부재21b: Bottom Composite Laminated Structural Member
30: (본 발명의) Z-피닝 패치30: Z-pinning patch (of the present invention)
31: 기저판 32: 핀31: base plate 32: pin
32a: 하단부 32b: 요철32a: lower end 32b: irregularities
40: 패치 가이드40: patch guide
41: 상부 가이드 42: 하부 가이드41: upper guide 42: lower guide
이하, 상기한 바와 같은 구성을 가지는 본 발명에 의한 Z-피닝 패치 및 이를 이용한 복합재 적층 구조물의 제조 또는 결합 방법을 첨부된 도면을 참고하여 상세하게 설명한다.Hereinafter, a method of manufacturing or bonding a Z-pinning patch and a composite laminate structure using the same according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.
도 5 및 도 6은 본 발명의 Z-피닝 패치의 전형적인 한 형태를 도시한 것이다. 본 발명의 Z-피닝 패치(30)는 복합재 적층 구조물(21)의 층간분리 성능 보강 또는 다수의 적층 부재 간의 접촉 연결을 위한 Z-피닝에 사용되는 것으로서, 그 자체의 구조는 도 5 및 도 6에 도시되어 있는 바와 같이 매우 단순하다. 즉 본 발명의 Z-피닝 패치(30)는, 판상으로 형성되는 기저판(31); 상기 기저판(31)에 일측이 고정되는 다수 개의 핀(32); 을 포함하여 이루어지는 극히 단순한 구조를 가진다. 이와 같이 형성되는 상기 Z-피닝 패치(30)는, 상기 핀(32) 측이 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 올려지며, 상기 복합재 적층 구조물(21)의 성형 또는 결합 공정 시 상기 핀(32)이 상기 복합재 적층 구조물(21)로 삽입되어 Z-피닝되게 된다.5 and 6 show one typical form of the Z-pinning patch of the present invention. The Z-pinning patch 30 of the present invention is used for Z-pinning for enhancing the interlayer separation performance of the composite laminated structure 21 or for contact connection between a plurality of laminated members, and its structure is shown in FIGS. 5 and 6. It is very simple as shown in. That is, the Z-pinning patch 30 of the present invention, the base plate 31 formed in a plate shape; A plurality of pins 32 having one side fixed to the base plate 31; It has an extremely simple structure, including. The Z-pinning patch 30 formed as described above is mounted on the composite laminate structure 21 in a state where the pin 32 is before or after forming, and forming or bonding the composite laminate structure 21. In the process, the pin 32 is inserted into the composite stack 21 to be Z-pinned.
여기에서, 상기 Z-피닝 패치(30)에서는 상기 핀(32)들 다수 개가 상기 기저판(31) 상에 빽빽하게 구비되어 있기 때문에, 상기 핀(32)들에 의하여 상기 Z-피닝 패치(30)는 스스로 안정적이게 서 있을 수 있으며, 따라서 별도의 안내 장치나 지지하기 위한 수단 등이 굳이 필요하지 않다. 즉 본 발명의 Z-피닝 패치(30)는, 상기 Z-피닝 패치(30) 자신 이외의 별도의 부품(즉 별도의 안내 장치나 지지하기 위한 수단 등)을 전혀 필요로 하지 않음으로써, Z-피닝 공정에 필요한 부품 수를 최소화한다. 또한 이러한 별도의 부품이 줄어든 만큼 이를 조립하거나 배치하는 등의 공정들이 자연히 삭제되며, 따라서 공정 수 또한 최소화된다.In the Z-pinning patch 30, since the plurality of pins 32 are densely provided on the base plate 31, the Z-pinning patch 30 is formed by the pins 32. It can stand on its own and therefore does not need a separate guide device or means for supporting. That is, the Z-pinning patch 30 of the present invention does not require any other components (that is, a separate guide device or a means for supporting, etc.) other than the Z-pinning patch 30 itself. Minimize the number of parts required for the peening process. In addition, as these separate parts are reduced, processes such as assembly or placement thereof are naturally eliminated, thus minimizing the number of processes.
공정 수와 관련하여 보다 구체적으로 설명하자면 다음과 같다. 본 발명의 Z-피닝 패치(30)는, 복합재 성형 공정 이전에 미리 제작이 완료되어 있는 상태로서 공급될 수 있다. 즉, 복합재 성형 공정을 수행하는 현장에서는, 미리 원하는 사양으로 Z-피닝 패치(30)를 외부에 주문하여 두고, 외부에서 별도 제작된 상기 Z-피닝 패치(30)를 공급받아 성형 공정 시 단순히 이를 원하는 부위에 올려놓고 성형하기만 하면 된다. 즉, 본 발명에서는 상기 Z-피닝 패치(30)가 미리 제작된 상태로 공급되기 때문에, 기존의 성형 공정에서 Z-피닝을 위해 실질적으로 추가되는 공정은 단지 상기 Z-피닝 패치(30)를 원하는 부위 위에 올려놓는 것밖에 없어, Z-피닝 공정을 비약적으로 단순화시킬 수 있게 되는 것이다.More specifically with respect to the process number is as follows. The Z-pinning patch 30 of the present invention may be supplied as a state in which manufacturing is completed before the composite molding process. That is, in the field performing the composite molding process, the Z-pinning patch 30 is ordered to the outside in a desired specification in advance, and the Z-pinning patch 30 separately supplied from the outside is supplied to the site, and then, when the molding process is performed. Simply put it on the desired part and mold it. That is, in the present invention, since the Z-pinning patch 30 is supplied in a pre-fabricated state, a process that is substantially added for Z-pinning in the existing molding process merely requires the Z-pinning patch 30. The only thing that needs to be put on the site is that the Z-pinning process can be dramatically simplified.
이와 같이 본 발명의 Z-피닝 패치(30)를 이용하면, Z-피닝 공정에 있어서의 부품 수 및 공정 수를 그 이상 축소할 수 없을 만큼 최소화시킬 수 있으며, 이에 따라 시간, 인력, 비용 등의 자원을 최대로 절약할 수 있어, 제작 비용 절감 및 생산 효율 증대가 극대화된다.As described above, using the Z-pinning patch 30 of the present invention, the number of parts and the number of processes in the Z-pinning process can be minimized so that it can not be reduced further. Maximum resources can be saved, maximizing production costs and increasing production efficiency.
상기 Z-피닝 패치(30)의 형상에 대하여 좀더 구체적으로 상세히 기술하자면 다음과 같다. 상기 Z-피닝 패치(30)에서, 상기 핀(32)은 도 5 및 도 6에 도시된 바와 같이 상기 기저판(31)에 대하여 수직 방향으로 돌출되는 형태로 형성될 수 있으며, 이것이 가장 기본적인 형태가 된다. 물론 상기 핀(32)은, (미리 예상될 수 있는) 상기 복합재 적층 구조물(21)이 최종적으로 배치되어 사용될 때 받게 될 하중의 방향이나 크기 등에 따라, 보다 효과적으로 결합력을 보강할 수 있도록 도 11에서 보이는 형태와 같이 상기 기저판(31)에 대하여 경사진 방향으로 돌출되는 형태로 형성될 수도 있다. 도 12는 도 11에서와 같이 상기 기저판(31)에 대하여 상기 핀(32)이 한쪽 방향으로 경사지게 돌출된 형태로 된 상기 Z-피닝 패치(30)의 한 실시예를 도시하고 있다.The shape of the Z-pinning patch 30 will be described in more detail as follows. In the Z-pinning patch 30, the pin 32 may be formed to protrude in a vertical direction with respect to the base plate 31 as shown in Figs. 5 and 6, which is the most basic form do. Of course, the pin 32 may be used in FIG. 11 to reinforce the bonding force more effectively according to the direction or magnitude of load to be received when the composite laminate structure 21 (which can be expected in advance) is finally disposed and used. As shown in the figure, the base plate 31 may be formed to protrude in an inclined direction. FIG. 12 shows an embodiment of the Z-pinning patch 30 in which the pins 32 protrude obliquely in one direction with respect to the base plate 31 as shown in FIG. 11.
도 5, 6, 11, 12 등의 예시에서는 상기 핀(32)이, 다수 개의 상기 핀(32)들 간에 상기 기저판(31)에 대하여 돌출되는 각도가 동일하도록, 즉 다수 개의 상기 핀(32)들이 모두 나란하도록 형성되는 형태를 도시하고 있다. 예를 들어 상기 핀(32)의 각도가 엇갈려 있는 등과 같이 서로 다르게 형성되게 할 경우, 결합 후의 결합 강도가 높아질 수는 있겠으나 실제로는 삽입이 지나치게 어려워질 수 있다. 상기 복합재 적층 구조물(21)을 형성하는 프리프레그 내에는 많은 수의 가느다란 보강섬유들이 있어, 상기 핀(32)들의 방향이 엇갈려 있으면 성형 시 고온으로 인하여 수지가 연성을 갖는다 하더라도 물리적으로 삽입이 곤란하며, 삽입이 되더라도 이러한 보강섬유가 훼손될 가능성이 높다. 따라서 상기 핀(32)들의 각도는 상기 기저판(31)에 대하여 돌출되는 각도가 동일하게 형성되는 것이 바람직한 것이다.5, 6, 11, 12, etc., the pins 32 have the same protruding angle with respect to the base plate 31 between the plurality of pins 32, that is, the plurality of the pins 32. They show the form in which all are formed side by side. For example, when the angles of the pins 32 are different from each other, such as staggered angles, the bonding strength after the coupling may be increased, but the insertion may be difficult in practice. In the prepreg forming the composite laminate structure 21, there are a large number of thin reinforcing fibers, and if the directions of the pins 32 are crossed, it is difficult to physically insert even if the resin is soft due to high temperature during molding. And, even when inserted, the reinforcing fibers are likely to be damaged. Therefore, it is preferable that the angle of the pins 32 is formed to be equal to the angle that protrudes with respect to the base plate (31).
더불어, 상기 핀(32)은 상기 복합재 적층 구조물(21)의 성형 또는 결합 후 상태의 두께와 동일한 높이를 가지도록 형성되는 것이 가장 바람직하다. 상기 핀(32)의 높이가 성형 또는 결합 후 상태의 상기 복합재 적층 구조물(21)의 두께보다 높을 경우, 성형 또는 결합 후에 상기 핀(32)의 타측 끝단이 상기 복합재 적층 구조물(21) 밖으로 튀어나오게 되어 좋지 않다. 또는 상기 핀(32)의 높이가 성형 또는 결합 후 상태의 상기 복합재 적층 구조물(21)의 두께보다 낮을 경우, 밖으로 튀어나오는 부분이 전혀 없다는 장점은 있으나 결합력이 다소 낮아질 수 있다. 따라서 상기 핀(32) 두께는 상술한 바와 같이 상기 핀(32)의 높이가 성형 또는 결합 후 상태의 상기 복합재 적층 구조물(21)의 두께와 동일하게 형성되는 것이 가장 바람직하다.In addition, the pin 32 is most preferably formed to have the same height as the thickness of the state after the molding or bonding of the composite laminate structure 21. When the height of the pin 32 is higher than the thickness of the composite laminate structure 21 in a state after forming or joining, the other end of the pin 32 protrudes out of the composite laminate structure 21 after forming or joining. It's not good. Alternatively, when the height of the pin 32 is lower than the thickness of the composite laminate structure 21 in the molded or bonded state, there is an advantage that there is no protruding portion at all, but the bonding force may be somewhat lowered. Therefore, as described above, the thickness of the pin 32 is most preferably formed such that the height of the pin 32 is equal to the thickness of the composite laminate structure 21 in a state after molding or bonding.
또한, 당연하게도 상기 핀(32)은 상기 복합재 적층 구조물(21)로의 삽입이 유리하도록 타측, 즉 하단부(32a)가 도 15에 도시된 바와 같이 뾰족한 형상으로 형성되는 것이 바람직하다. 이하 보다 상세히 설명하겠지만, 성형 단계에서 Z-피닝 공정을 수행할 때에는 상기 복합재 적층 구조물(21)이 고온에 의하여 연화되어 있는 상태인 바, 상기 핀(32)의 끝단이 다소 뭉툭하게 형성된다 해도 실질적으로 Z-피닝을 하는 것 자체는 크게 문제되지 않는다. 그러나 본 발명의 Z-피닝 패치(30)는 단지 성형 과정에서만 사용되는 것이 아니고, (이하 보다 상세히 설명하겠지만) 성형이 완료된 후의 복합재 구조물로 된 여러 부재들을 결합하기 위한 용도로도 사용될 수 있는 바, 이 경우에는 복합재 구조물의 재성형을 위하여 복합재 구조물에 열이나 압력을 부가하는 과정이 필요할 수 있으며, 상기 핀(32)의 삽입을 보다 유리하게 하기 위해서 타측이 뾰족하게 되는 것이 가장 바람직한 것이다.In addition, it is preferable that the pin 32 is formed at the other side, that is, the lower end portion 32a has a pointed shape as shown in FIG. 15 so that the pin 32 is advantageously inserted into the composite laminate structure 21. As will be described in more detail below, when the Z-pinning process is performed in the forming step, the composite laminate structure 21 is softened by high temperature. Z-pinning itself is not a big problem. However, the Z-pinning patch 30 of the present invention is not only used in the molding process, but may also be used for joining various members of the composite structure after the molding is completed (as will be described in detail below). In this case, a process of adding heat or pressure to the composite structure may be necessary for reshaping the composite structure, and it is most preferable that the other side is pointed to more advantageously insert the pin 32.
또한, 상기 핀(32)은 역시 도 15에 도시된 바와 같이 핀의 표면에 요철(32b) 형상이 형성된 것이 더욱 바람직하다. 상기 요철(32b)이 형성됨으로써 성형 후 외부 하중에 의한 핀의 이탈 방지력을 더욱 향상시킬 수 있다. 더 나아가 핀의 표면을 화학적으로 부식 처리하면 접착 특성을 더욱 향상시킬 수 있다.In addition, it is more preferable that the fin 32 has a concave-convex shape 32b formed on the surface of the fin as shown in FIG. 15. Since the unevenness 32b is formed, it is possible to further improve the anti-separation force of the pin by external load after molding. Furthermore, chemically corroding the surface of the fin can further improve the adhesion properties.
도 7 및 도 8은 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법의 한 실시예를 도시하고 있다. 도 7 및 도 8을 통해 본 발명의 Z-피닝 패치(30) 및 그에 의한 복합재 적층 구조물의 제조 방법에 대하여 보다 상세히 설명하면 다음과 같다.7 and 8 illustrate one embodiment of a method of making a composite laminate structure using the Z-pinning patch of the present invention. 7 and 8 will be described in more detail with respect to the manufacturing method of the Z-pinning patch 30 and the composite laminate structure of the present invention as follows.
먼저 본 발명의 Z-피닝 패치(30)를 사용하는 복합재 성형 방법도, 기본적으로는 일반적인 복합재 성형 방법과 유사하다. 즉 도 1의 일반적인 복합재 성형 방법에서와 같이, 복합재 성형을 위한 몰드(11) 위에 이형재(12)를 적용하고, 복합재 프리프레그 적층물(21)을 올려놓고, 다시 이형재(12) 및 레진을 흡수하는 블리더(bleeder)(13)를 깔고, 진공을 부여하는 어댑터(16)가 부착된 필름백(15)으로 전체를 덮은 후, 가장자리에는 실런트(17)로 밀폐한다. 역시 복합재 적층 구조물(21)을 성형하는 성형법의 특징에 따라 코르크 댐(14)을 사용하지 않는 경우도 있다. 본 명세서에서, 성형 전 상태란 프리프레그가 적층되어 있는 상태를 말하며, 성형 후 상태란 적층된 프리프레그에 성형 압력을 가하여 성형이 완료된 상태를 말한다. 즉, 본 발명은, 프리프레그가 적층된 상태에서 성형과 동시에 핀을 삽입할 수도 있고, 적층된 프리프레그에 먼저 핀을 박은 후 일반적인 복합재 성형과정을 수행하여 복합재 적층구조물을 완성할 수도 있고, 이미 성형이 완료된 복합재 적층 구조물에 대해서도 재성형 과정에서 핀을 삽입할 수도 있으며, 성형 전 또는 성형 후 상태의 다수 개의 복합재 적층 구조물을 결합하기 위하여 핀을 삽입할 수도 있다. (마지막 경우에 대해서는 이후의 도 13의 설명에서 보다 상세히 설명한다.)First, the composite molding method using the Z-pinning patch 30 of the present invention is basically similar to the general composite molding method. That is, as in the general composite molding method of FIG. 1, the release member 12 is applied on the mold 11 for forming the composite, the composite prepreg laminate 21 is placed, and the release member 12 and the resin are absorbed again. After covering the whole with a film bag 15 attached with an adapter 16 for applying a vacuum, a bleeder 13 is placed, and then sealed at the edge with a sealant 17. Also, the cork dam 14 may not be used depending on the characteristics of the molding method for molding the composite laminate structure 21. In the present specification, the state before molding refers to a state in which prepregs are laminated, and the state after molding refers to a state in which molding is completed by applying molding pressure to the laminated prepregs. That is, in the present invention, the pin may be inserted at the same time as the prepreg is laminated, and the pin may be pinned to the laminated prepreg first, followed by a general composite molding process to complete the composite laminate structure. Even the composite laminate structure in which the molding is completed may be inserted into the pin during the remolding process, or the pin may be inserted to join a plurality of composite laminate structures in a pre-molded or post-molded state. (The last case will be described later in more detail with reference to FIG. 13.)
본 발명에서는, 도 7에 보이는 바와 같이, 일단 기존의 일반적인 복합재 적층 구조물의 성형 방법의 최초 단계에서와 마찬가지로, 먼저 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21)이 배치된다. 다음으로는, 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려진다. 도면을 참조하여 보다 상세하게 설명하자면, 상기 복합재 적층 구조물(21) 및 상기 복합재 적층 구조물(21) 상부의 상기 이형재 필름(12) 사이에 상기 Z-피닝 패치(30)가 배치되는 것이다.In the present invention, as shown in FIG. 7, once as in the first stage of the existing method of forming a conventional composite laminate structure, the composite laminate structure 21 is first disposed before or after molding. Next, the Z-pinning patch 30 is placed so that the other side of the pin 32 is in contact with the composite laminate structure 21 before or after molding. Referring to the drawings in detail, the Z-pinning patch 30 is disposed between the composite laminate structure 21 and the release film 12 on the composite laminate structure 21.
다음으로 도 8에 보이는 바와 같이, 상기 기저판(31) 측으로 누르는 힘이 가해짐으로써 상기 Z-피닝 패치(30)가 눌려져, 최종적으로 상기 핀(32)이 상기 복합재 적층 구조물(21) 내로 삽입됨으로써, 본 발명의 Z-피닝 패치(30)를 이용한 Z-피닝이 완료되게 된다. 도 8의 단계에서, 실제로는 성형 과정에서 가해지는 고온의 의하여 프리프레그 내부의 수지의 점성이 저하되며, 또한 고압에 의하여 상기 Z-피닝 패치(30)에 압력이 부가되므로, 상기 Z-피닝 패치(30)의 상기 핀(32)이 용이하게 상기 복합재 적층 구조물(21)로 삽입될 수 있다.Next, as shown in FIG. 8, the Z-pinning patch 30 is pressed by the pressing force toward the base plate 31, and finally the pin 32 is inserted into the composite laminate 21. , Z-pinning using the Z-pinning patch 30 of the present invention is completed. In the step of Fig. 8, the viscosity of the resin inside the prepreg is actually lowered due to the high temperature applied in the molding process, and since the pressure is added to the Z-pinning patch 30 by high pressure, the Z-pinning patch The pins 32 of 30 can be easily inserted into the composite laminate structure 21.
이 때, 도 2 내지 도 4와 같은 종래의 Z-피닝 기술에 의하면 Z-피닝 이후 최종 제작된 복합재 적층 구조물에서 (핀은 복합재 적층 구조물 내로 완전히 삽입되므로) 겉으로 노출되어 보이는 별도 부재가 보이지 않겠으나, 본 발명의 경우 상기 핀(32)은 완전히 상기 복합재 적층 구조물(21) 내로 삽입되는 반면 상기 기저판(31)은 상기 복합재 적층 구조물(21)의 겉으로 노출되어 남아 있게 된다. 이는 최종 제작된 복합재 적층 구조물의 중량을 미미하게 증대시키고 외관을 약간 나쁘게 하기는 하나, 실질적으로 상기 기저판(31)이 충분히 얇게 만들어진다면 중량 증가 영향은 거의 무시할 수 있는 수준으로 떨어지며, 이러한 복합재 적층 구조물의 외관 문제는 실제 이러한 복합재 적층 구조물이 사용되는 분야에서 거의 고려되지 않을 만큼 중요성이 떨어지는 요소로서 실질적으로 무시할 수 있는 문제이다. 뿐만 아니라, 상기 기저판(31)이 상기 복합재 적층 구조물(21)의 외측에 남아 있음으로써, 해당 부위가 외부로부터 보호되는 효과를 가져, 오히려 해당 부분을 좀더 보강해 주는 부가적인 효과를 얻을 수도 있다.At this time, according to the conventional Z-pinning technique as shown in Figures 2 to 4 in the final composite laminate structure produced after Z-pinning (since the pins are fully inserted into the composite laminate structure) will not see a separate member that appears to be exposed In the present invention, the pin 32 is completely inserted into the composite laminate structure 21 while the base plate 31 remains exposed to the outside of the composite laminate structure 21. This slightly increases the weight of the final composite laminate and slightly deteriorates the appearance, but substantially the effect of weight gain falls to a negligible level if the base plate 31 is made sufficiently thin. The appearance problem of is actually a negligible issue as a factor of less importance that is rarely considered in the field where such composite laminate structures are used. In addition, since the base plate 31 remains on the outer side of the composite laminate structure 21, the portion is protected from the outside, it may be possible to obtain additional effects to further reinforce the portion.
도 9 및 도 10은 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법의 다른 실시예를 도시하고 있다. 여기에서는, 상기 Z-피닝 패치(30)의 삽입 경로를 유도하여 안내하는 패치 가이드(40)를 더 사용하고 있다. 상기 패치 가이드(40)는, 도 9 및 도 10에 도시되어 있는 바와 같이, 상기 Z-피닝 패치(30)가 통과 가능하도록 형성되는 개방부가 형성된 하부 가이드(42) 및 상기 하부 가이드(42)의 개방부의 일측에 상기 개방부로 삽입 이동이 가능하도록 구비되는 상부 가이드(41)를 포함하여 이루어진다. 상기 하부 가이드(42)에 형성된 개방부는, 상기 하부 가이드(42)가 상기 Z-피닝 패치(30)를 완전히 둘러싸는 형태일 경우라면 통공 형태로 형성되면 되며, 또는 상기 하부 가이드(42)가 상기 Z-피닝 패치(30)를 완전히 둘러싸지 않고 일부만 둘러싸는 형태일 경우라면 적절하게 상기 Z-피닝 패치(30)가 통과할 수 있는 정도로 개방되어 있는 형태이기만 하면 된다. 또한, 상기 상부 가이드(41)는 상기 하부 가이드(42)의 일측에 구비되어, (도 9 및 도 10에 도시된 바와 같이) 상하로 이동 가능하게 형성된다. 상기 상부 가이드(41) 및 상기 하부 가이드(42)의 이러한 결합 형태는, 결합 부분이 슬라이딩 결합이 되도록 하는 등과 같은 매우 간단한 형태로 용이하게 구현할 수 있으므로 상세한 설명은 생략한다. 도 9 및 도 10에서 따로 도시되지는 않았으나, 상기 상부(41) 가이드 및 상기 하부 가이드(42)는 성형 후 복합재 구조물 등과의 분리를 용이하게 하기 위하여 표면에 이형재가 도포될 수 있다.9 and 10 illustrate another embodiment of a method of making a composite laminate structure using the Z-pinning patch of the present invention. Here, the patch guide 40 for guiding and guiding the insertion path of the Z-pinning patch 30 is further used. As shown in FIGS. 9 and 10, the patch guide 40 includes a lower guide 42 having an opening formed therethrough for allowing the Z-pinning patch 30 to pass therethrough, and the lower guide 42. It includes an upper guide 41 which is provided on one side of the opening to be inserted into the opening. The opening formed in the lower guide 42 may be formed in a through shape if the lower guide 42 completely surrounds the Z-pinning patch 30, or the lower guide 42 may be formed in the lower guide 42. In the case where the Z-pinning patch 30 is not completely enclosed but partially enclosed, it is only necessary that the Z-pinning patch 30 is open enough to pass therethrough. In addition, the upper guide 41 is provided on one side of the lower guide 42 and is formed to be movable up and down (as shown in FIGS. 9 and 10). This coupling form of the upper guide 41 and the lower guide 42 can be easily implemented in a very simple form, such as to make the engaging portion is a sliding coupling, detailed description thereof will be omitted. Although not shown separately in FIGS. 9 and 10, the upper 41 guide and the lower guide 42 may be coated with a release material on the surface to facilitate separation of the composite structure and the like after molding.
이와 같이 상기 패치 가이드(40)를 사용할 경우의 제조 방법은 다음과 같다. 먼저 최초에는, 기존의 일반적인 복합재 적층 구조물의 성형 방법이나 도 7 및 도 8에 도시된 바와 같은 본 발명의 복합재 적층 구조물의 제조 방법의 한 실시예(즉 상기 패치 가이드(40)가 없이 제조하는 방법)에서와 같이, 먼저 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21)이 배치되고, 다음으로 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려진다.Thus, the manufacturing method at the time of using the said patch guide 40 is as follows. Initially, one embodiment of a conventional method of forming a composite laminate structure or a method of manufacturing a composite laminate structure of the present invention as shown in FIGS. 7 and 8 (ie, without the patch guide 40) ), The composite laminate structure 21 is first placed before or after molding, and then the other side of the pin 32 is in contact with the composite laminate structure 21 before or after molding. The Z-pinning patch 30 is raised to make it.
다음으로, 도 9에 보이는 바와 같이, 상기 하부 가이드(42)의 개방부 내로 상기 Z-피닝 패치(30)가 삽입되도록 상기 패치 가이드(40)가 상기 Z-피닝 패치(30)에 씌워지며, 마지막으로 상기 상부 가이드(41) 측으로 누르는 힘이 가해짐으로써 상기 Z-피닝 패치(30)가 눌려져, 최종적으로 상기 핀(32)이 상기 복합재 적층 구조물(21) 내로 삽입됨으로써, 본 발명의 Z-피닝 패치(30) 및 패치 가이드(40)를 이용한 Z-피닝이 완료되게 된다. 상기 패치 가이드(40)는, Z-피닝이 완료된 이후에 들어내어 제거하면 되며, 얼마든지 재사용이 가능함은 당연하다.Next, as shown in FIG. 9, the patch guide 40 is covered by the Z-pinning patch 30 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42. Finally, the Z-pinning patch 30 is pressed by the force applied to the upper guide 41 side, and finally the pin 32 is inserted into the composite laminate structure 21, whereby the Z- Z-pinning using the pinning patch 30 and the patch guide 40 is completed. The patch guide 40 may be removed after removal of the Z-pinning, and it is natural that the patch guide 40 may be reused.
이와 같이 상기 패치 가이드(40)가 사용되는 것이 필요한 이유는 다음과 같다. 본 발명의 Z-피닝 패치를 이용한 제조 방법에서, 앞서 설명한 바와 같이 상기 Z-피닝 패치(30)는 물론 상기 핀(32)들이 다수 배치되어 있는 그 자체의 형태로 인하여 그 자체로 스스로 서 있는 형태를 안정적으로 유지할 수 있다. 그런데, 만일 결합력을 증대시키고 싶은 부위(이하 결합 부위라 칭함)의 면적이 상당히 좁은 경우라면, (상기 기저판(31)의 면적은 이 결합 부위의 면적과 동일하게 형성되는 것이 당연하므로) 상기 기저판(31) 면적이 좁아지고 이에 따라 상기 핀(32)들의 개수가 상당히 줄어들게 된다. 상기 결합 부위의 면적이 매우 많이 좁다면, 이 핀(32)들의 개수 또한 너무 줄어들어서 그 자체로 스스로 서 있을 수는 있다 하더라도 누르는 힘이 가해졌을 때 자칫하면 쓰러질 수 있는 가능성이 일부 있다. 상기 패치 가이드(40)는 바로 이러한 가능성을 배제하기 위하여 사용되는 것이다.The reason why the patch guide 40 is to be used in this way is as follows. In the manufacturing method using the Z-pinning patch of the present invention, as described above, not only the Z-pinning patch 30 but also its own shape due to its own shape in which a plurality of pins 32 are arranged. Can be kept stable. By the way, if the area of the site (hereinafter referred to as the binding site) to increase the bonding force is considerably narrow, the base plate (because the area of the base plate 31 is formed to be the same as the area of the binding site) 31) The area becomes narrower, which reduces the number of the pins 32 significantly. If the area of the joining site is very narrow, the number of these pins 32 may also be so small that they may stand on their own, but there is some possibility that they may fall down when a pressing force is applied. The patch guide 40 is used to exclude this possibility.
즉 상기 패치 가이드(40)는, 결합 부위가 매우 좁아 상기 Z-피닝 패치(30) 자체도 그 면적이 매우 작아짐으로써 결합 시 쓰러지는 것을 막기 위하여 사용되는 것으로, 결합 부위가 충분히 넓은 경우라면 도 7 및 도 8의 예시에서와 같이 사용하지 않아도 무방하다. 또는, 결합 부위가 충분히 넓은 경우라 하더라도, 도 11의 예시에서와 같이 상기 Z-피닝 패치(30)가 상기 핀(32)들의 경사진 방향이 모두 한 쪽으로 형성되어 있는 경우라면, 누르는 힘이 가해졌을 때 상기 Z-피닝 패치(30)가 쓰러질 가능성이 다소 높은 바, 이럴 때라면 적절하게 설계된 상기 패치 가이드(40)가 사용되는 것이 바람직할 것이다. 도 11의 예시 즉 상기 Z-피닝 패치(30)가 상기 핀(32)들의 경사진 방향이 모두 한 쪽으로 형성되어 있는 경우에는, 상기 패치 가이드(40)는 상기 상부 가이드(41)가 상기 하부 가이드(42)로 삽입 이동되는 방향이 상기 핀(32)들의 경사진 방향과 동일하게 형성되도록 설계된다. 이와 같이 상기 패치 가이드(40)의 여러 형태가 도 9 내지 도 11에 다양하게 개시되었으나, 물론 이로써 본 발명이 한정되는 것은 아니며, 상기 결합 부위의 면적이나 형태, 상기 핀(32)의 경사진 방향 등 설계자가 고려할 수 있는 여러 요인이나 설계자의 의도 등에 따라, 상기 패치 가이드(40)의 형태는 다양하게 변경될 수 있음은 당연하다.That is, the patch guide 40, the binding site is very narrow and the Z-pinning patch 30 itself is also used to prevent the collapse when the bonding area is very small, if the binding site is large enough Figure 7 and It may not be used as in the example of FIG. Alternatively, even when the bonding site is sufficiently wide, as shown in the example of FIG. 11, when the Z-pinning patch 30 is formed in all the inclined directions of the pins 32, pressing force is applied. Since the Z-pinning patch 30 is more likely to fall when pulled out, it would be desirable to use the properly designed patch guide 40 in this case. 11, that is, when the Z-pinning patch 30 has all the inclined directions of the pins 32 formed to one side, the patch guide 40 has the upper guide 41 at the lower guide. The direction to be inserted and moved to 42 is designed to be formed to be the same as the inclined direction of the pins 32. As described above, various forms of the patch guide 40 are disclosed in FIGS. 9 to 11, but the present invention is not limited thereto, and the area or shape of the coupling site and the inclined direction of the pin 32 are not limited thereto. The shape of the patch guide 40 may be changed in various ways according to various factors that can be considered by the designer or the intention of the designer.
도 13은 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법에 의하여 결합된 복합재 적층 구조물의 예시를 도시하고 있다. 기본적으로 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 방법은, 단지 최초에 여러 개의 복합재 적층 구조 부재들을 적층하여 놓는다는 점만이 상이할 뿐, 상기 Z-피닝 패치(30)를 결합 부위에 눌러 삽입하여 Z-피닝을 완료하는 과정은 상술한 제조 방법과 동일하다.FIG. 13 shows an example of a composite laminate structure bonded by a method of joining a composite laminate structure using the Z-pinning patch of the present invention. Basically, the method of joining a composite laminate structure using the Z-pinning patch of the present invention differs only in that a plurality of composite laminate structural members are initially stacked, and the Z-pinning patch 30 is bonded to each other. Pressing and inserting in to complete the Z-pinning is the same as the manufacturing method described above.
즉 구체적으로 설명하자면, 도 13과 같이 여러 부재들을 결합하기 위해서, 먼저 하부 복합재 적층 구조 부재(21b) 및 상부 복합재 적층 구조 부재(21t)가 아래에서부터 순차적으로 배치되고, 다음으로 상기 상부 복합재 적층 구조 부재(21t) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지며, 마지막으로 상기 기저판(31) 측으로 누르는 힘이 가해져 상기 핀(32)이 적층된 상기 복합재 적층 구조 부재들(21b)(21t) 내로 삽입됨으로써, 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 공정이 완료된다.Specifically, in order to combine the various members as shown in FIG. 13, first, the lower composite laminated structural member 21b and the upper composite laminated structural member 21t are sequentially disposed from below, and the upper composite laminated structure is next. The Z-pinning patch 30 is placed on the member 21t so that the other side of the pin 32 is in contact, and finally, a pressing force is applied to the base plate 31 to stack the composite material having the pin 32 stacked thereon. By inserting into the structural members 21b and 21t, the joining process of the composite laminate structure using the Z-pinning patch of the present invention is completed.
만일 상기 패치 가이드(40)가 사용되는 경우라면, 먼저 하부 복합재 적층 구조 부재(21b) 및 상부 복합재 적층 구조 부재(21t)가 아래에서부터 순차적으로 배치되고, 다음으로 상기 상부 복합재 적층 구조 부재(21t) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계까지는 위와 동일하며, 이후 상기 하부 가이드(42)의 개방부 내로 상기 Z-피닝 패치(30)가 삽입되도록 상기 패치 가이드(40)가 상기 Z-피닝 패치(30)에 씌워지고, 마지막으로 상기 상부 가이드(41) 측으로 누르는 힘이 가해져 상기 핀(32)이 적층된 상기 복합재 적층 구조 부재들(21b)(21t) 내로 삽입됨으로써, (상기 패치 가이드(40)를 더 이용한) 본 발명의 Z-피닝 패치를 이용한 복합재 적층 구조물의 결합 공정이 완료된다.If the patch guide 40 is used, first, the lower composite laminated structural member 21b and the upper composite laminated structural member 21t are sequentially disposed from below, and then the upper composite laminated structural member 21t. The same as above until the Z-pinning patch 30 is raised so that the other side of the pin 32 contacts, and then the Z-pinning patch 30 is inserted into the opening of the lower guide 42. The patch guide 40 is covered with the Z-pinning patch 30, and finally a pressing force is applied to the upper guide 41 side, the composite laminated structural members 21b having the pins 32 laminated ( 21t), the bonding process of the composite laminate structure using the Z-pinning patch of the present invention (using the patch guide 40 further) is completed.
이 때, 상기 복합재 적층 구조 부재들(21b)(21t)(즉 적층되어 있는 상기 상부 복합재 적층 구조 부재(21t) 및 상기 하부 복합재 적층 구조 부재(21b)들)은, 미리 접착, 압착 또는 열부착을 포함하는 1차 결합 가공을 거쳐 결합된 상태이면 더욱 결합 효과가 좋아질 수 있다. 물론 이와 같이 1차 결합된 상태라면 상기 Z-피닝 패치(30)를 이용한 결합 시 부재들이 서로 정위치에서 이탈할 염려 또한 훨씬 줄어들기 때문에 공정 효율을 높이고 불량률을 최소화할 수 있다.At this time, the composite laminated structural members 21b and 21t (that is, the upper composite laminated structural members 21t and the lower composite laminated structural members 21b that are laminated) are previously bonded, pressed or thermally bonded. If the combined state through the primary bonding process including a may further improve the bonding effect. Of course, if the primary coupling state as described above, when the coupling using the Z-pinning patch 30 is also less likely to be separated from each other in position can increase the process efficiency and minimize the failure rate.
도 14는 두 부재간의 결합 효과를 높이기 위하여 상기 Z-피닝 패치(30)를 상부와 하부에 동시에 적용한 것이다. 도 14의 예시에서는 상기 핀(32)이 경사지게 형성되는 상기 Z-피닝 패치(30) 2개를 상하에 각각 적용하여, 상부의 Z-피닝 패치(30)와 하부의 Z-피닝 패치(30)의 각각의 핀(32)들이 서로 엇갈리는 형태로 형성되도록 하고 있는데, 이와 같이 상부와 하부의 핀(32)들이 그 방향을 달리함으로써 두 부재간의 결합 효과를 더욱 높일 수 있다. 제작 방법은 앞의 설명들과 크게 다르지 않은데, 성형 전 과정에서 적층된 프리프레그에 적절한 하중을 부가하는 방법 등(예, 고주파 진동하중)으로 하부의 Z-피닝 패치(30)를 적절한 깊이까지 먼저 삽입하고, 상부의 Z-피닝 패치는 앞에서 설명된 성형 방법을 적용하여 제작할 수 있다.FIG. 14 simultaneously applies the Z-pinning patch 30 to the top and bottom to enhance the coupling effect between the two members. In the example of FIG. 14, two Z-pinning patches 30 in which the pins 32 are inclined are applied to the upper and lower sides, respectively, such that the upper Z-pinning patch 30 and the lower Z-pinning patch 30 are applied to each other. Each of the pins 32 is to be formed to cross each other, in this way, the upper and lower pins 32 by changing the direction thereof can further enhance the coupling effect between the two members. The fabrication method is not significantly different from the previous descriptions, such as by applying an appropriate load to the prepreg laminated during the molding process (for example, by applying a high frequency vibration load) to the lower Z-pinning patch 30 to an appropriate depth. Inserted, the upper Z-pinning patch can be made by applying the molding method described above.
종래에는 복합재 적층 구조 부재들을 결합하기 위해서 금속재 리벳이나 볼트 등을 사용하여야 했던 바, 이러한 리벳, 볼트 등의 별도 부품이 필요하고, 또한 이를 사용하여 조립하는 공정이 필요하였다. 그러나 본 발명에 의하면, 이러한 별도 부품들을 필요로 하지 않으며 따라서 별도의 조립 공정 또한 필요하지 않아, 결합 공정에 있어서도 시간, 비용, 인력 등의 자원 절약 및 생산성 향상 효과를 얻을 수 있다. 또한, 종래에 사용되던 결합 부품인 리벳, 볼트 등에 비하여 본 발명의 Z-피닝 패치(30)는 훨씬 가볍기 때문에 경량화 측면에서도 훨씬 유리하다.Conventionally, metal rivets or bolts have to be used to join the composite laminated structural members, and thus, separate parts such as rivets and bolts are required, and a process of assembling using the same is required. However, according to the present invention, such separate parts are not required, and thus, a separate assembly process is not required, so that a resource saving effect such as time, cost, manpower, and the like can be obtained in the joining process. In addition, since the z-pinning patch 30 of the present invention is much lighter than rivets, bolts, and the like, which are conventionally used coupling parts, it is much advantageous in terms of weight reduction.
본 발명은 상기한 실시예에 한정되지 아니하며, 적용범위가 다양함은 물론이고, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이다.The present invention is not limited to the above-described embodiments, and the scope of application of the present invention is not limited to those of ordinary skill in the art to which the present invention pertains without departing from the gist of the present invention as claimed in the claims. Of course, various modifications can be made.
본 발명에 의하면, 종래의 Z-피닝 방법에서는 일회성 '폼 구조('강화 구조' 개념 포함)'를 사용함으로써 재료의 낭비가 불가피하고, 두께가 일정하지 않은 복합재 적층 구조물의 경우에는 적용하기 곤란하였던 문제점을 완전히 극복하는 효과가 있다. 즉, 본 발명은 얇은 판에 다수 개의 핀이 수직 형성되어 있는 형태의 패치를 사용하여 Z-피닝을 수행하는데, 이러한 패치는 미리 제작되어 공급되면 되기 때문에 실제 복합재 적층 구조물 자체의 제작 공정이 극히 단순화되는 큰 효과가 있다. 구체적으로 말하자면, 종래의 폼 구조, 강화 구조, 각종 치구 등의 부품이 전혀 필요하지 않게 되어 부품 수 및 공정 수를 훨씬 줄일 수 있는 효과가 있는 것이다. 물론 이에 따라 종래에 비하여 제작 원가를 낮추고 생산 효율을 높일 수 있어, 경제적 효과 또한 뛰어나다.According to the present invention, in the conventional Z-pinning method, the use of a one-time 'foam structure (including the' reinforced structure 'concept)' is inevitable, and in the case of a composite laminate structure having a constant thickness, it is difficult to apply. It is effective to completely overcome the problem. That is, the present invention performs Z-pinning using a patch having a plurality of pins vertically formed on a thin plate. Since the patch needs to be manufactured and supplied in advance, the manufacturing process of the actual composite laminate structure itself is extremely simplified. It has a great effect. Specifically, parts of the conventional foam structure, reinforcement structure, various fixtures, etc. are not required at all, so that the number of parts and the number of processes can be significantly reduced. Of course, as compared to the conventional manufacturing cost can be lowered and the production efficiency can be increased, the economic effect is also excellent.

Claims (8)

  1. 복합재 적층 구조물(21)의 층간분리 성능 보강 또는 다수의 적층 부재 간의 접촉 연결을 위한 Z-피닝에 사용되는 Z-피닝 패치(30)로서,Z-pinning patches 30 used in Z-pinning for enhancing interlayer separation of composite laminate structures 21 or for contact connections between multiple laminated members,
    판상으로 형성되는 기저판(31); 상기 기저판(31)에 일측이 고정되어 수직 방향 또는 경사진 방향으로 돌출되는 형태로 형성된 다수 개의 핀(32); 을 포함하여 이루어지는 것을 특징으로 하는 Z-피닝 패치.A base plate 31 formed in a plate shape; A plurality of pins 32 having one side fixed to the base plate 31 to protrude in a vertical direction or an inclined direction; Z-pinning patch, characterized in that comprises a.
  2. 제 1항에 있어서, 상기 Z-피닝 패치(30)는The method of claim 1, wherein the Z-pinning patch 30
    상기 핀(32) 측이 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 올려지며, 상기 복합재 적층 구조물(21)의 성형 또는 결합 공정 시 상기 핀(32)이 상기 복합재 적층 구조물(21)로 삽입되어 Z-피닝되는 것을 특징으로 하는 Z-피닝 패치.The pin 32 is placed on the composite laminate structure 21 before or after molding, and the pin 32 is formed on the composite laminate structure 21 during the forming or bonding process of the composite laminate structure 21. Z-pinning patch, characterized in that inserted into Z).
  3. 제 1항에 있어서, 상기 Z-피닝 패치(30)는The method of claim 1, wherein the Z-pinning patch 30
    상기 Z-피닝 패치(30)가 통과 가능하도록 형성되는 개방부가 형성된 하부 가이드(42) 및 상기 하부 가이드(42)의 개방부의 일측에 상기 개방부로 삽입 이동이 가능하도록 구비되는 상부 가이드(41)를 포함하여 이루어지는 패치 가이드(40)에 의하여 안내되어 상기 복합재 적층 구조물(21)로 삽입되는 것을 특징으로 하는 Z-피닝 패치.A lower guide 42 having an opening formed to pass through the Z-pinning patch 30 and an upper guide 41 provided at one side of the opening of the lower guide 42 to be inserted into the opening; Z-pinning patch, characterized in that it is guided by a patch guide (40) comprising the inserted into the composite laminate structure (21).
  4. 제 1항에 있어서, 상기 핀(32)은The method of claim 1, wherein the pin 32
    하단부(32a)가 뾰족한 형상으로 형성되는 것을 특징으로 하는 복합재 적층 구조물의 제조 장치.Apparatus for producing a composite laminate structure, characterized in that the lower end (32a) is formed in a pointed shape.
  5. 제 4항에 있어서, 상기 핀(32)은5. The pin of claim 4 wherein the pin 32 is
    핀의 표면에 요철(32b) 형상이 형성된 것을 특징으로 하는 복합재 적층 구조물의 제조 장치.Apparatus for producing a composite laminate structure, characterized in that the concave-convex (32b) shape is formed on the surface of the pin.
  6. 제 4항에 있어서, 상기 핀(32)은5. The pin of claim 4 wherein the pin 32 is
    핀의 표면을 화학적으로 부식 처리한 것을 특징으로 하는 복합재 적층 구조물의 제조 장치.An apparatus for producing a composite laminate structure, wherein the surface of the fin is chemically corroded.
  7. 제 1항 내지 제 2항 중 선택되는 어느 한 항에 의한 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법에 있어서,In the method for producing a composite laminate structure using a Z-pinning patch according to any one of claims 1 to 2,
    a1) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21)이 배치되는 단계;a1) disposing the composite laminate structure 21 before or after molding;
    a2) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계;a2) placing the Z-pinning patch 30 on the composite laminate structure 21 before or after molding so as to contact the other side of the pin 32;
    a3) 상기 기저판(31) 측으로 누르는 힘이 가해져 상기 핀(32)이 상기 복합재 적층 구조물(21) 내로 삽입되는 단계;a3) pressing force toward the base plate 31 to insert the pin 32 into the composite laminate structure 21;
    를 포함하여 이루어지는 것을 특징으로 하는 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법.Method for producing a composite laminate structure using a Z-pinning patch, characterized in that comprises a.
  8. 제 3항에 의한 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법에 있어서,In the method for producing a composite laminate structure using a Z-pinning patch according to claim 3,
    b1) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21)이 배치되는 단계;b1) disposing the composite laminate structure 21 before or after molding;
    b2) 성형 전 또는 성형 후 상태의 상기 복합재 적층 구조물(21) 위에 상기 핀(32)의 타측이 접촉하도록 상기 Z-피닝 패치(30)가 올려지는 단계;b2) the Z-pinning patch 30 is raised so that the other side of the pin 32 contacts the composite laminate structure 21 before or after molding;
    b3) 상기 하부 가이드(42)의 개방부 내로 상기 Z-피닝 패치(30)가 삽입되도록 상기 패치 가이드(40)가 상기 Z-피닝 패치(30)에 씌워지는 단계;b3) covering the Z-pinning patch 30 with the patch guide 40 so that the Z-pinning patch 30 is inserted into the opening of the lower guide 42;
    b4) 상기 상부 가이드(41) 측으로 누르는 힘이 가해져 상기 핀(32)이 상기 복합재 적층 구조물(21) 내로 삽입되는 단계;b4) pressing force toward the upper guide 41 to insert the pin 32 into the composite laminate structure 21;
    를 포함하여 이루어지는 것을 특징으로 하는 Z-피닝 패치를 이용한 복합재 적층 구조물의 제조 방법.Method for producing a composite laminate structure using a Z-pinning patch, characterized in that comprises a.
PCT/KR2012/007722 2011-10-07 2012-09-25 Z-pin patch and method for manufacturing or coupling a composite laminated structure using same WO2013051809A2 (en)

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CN103925267A (en) * 2014-03-19 2014-07-16 刘龙权 Composite material and metal connection structure and forming method thereof
CN111531913A (en) * 2020-03-26 2020-08-14 吉林大学 Z-pin based on bionic interlocking, composite material and preparation method thereof
CN114727882A (en) * 2019-09-25 2022-07-08 自由形态纤维有限公司 Nonwoven microlattice fabric and reinforced composite or hybrid composite thereof

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KR20000046426A (en) * 1998-12-31 2000-07-25 추호석 Bolt hole reinforced molding method of composite-material laminated plate
KR100932302B1 (en) * 2007-09-17 2009-12-16 한국항공우주연구원 Composite laminated structure reinforced with performance by pinning, composite manufacturing method, device and manufacturing method of the composite laminated structure
WO2010120628A1 (en) * 2009-04-15 2010-10-21 Alzeta Corporation High temperature fiber composite burner surface

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CN111531913A (en) * 2020-03-26 2020-08-14 吉林大学 Z-pin based on bionic interlocking, composite material and preparation method thereof

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