WO2013047256A1 - 熱電変換素子とその製造方法、及び、放熱フィン - Google Patents
熱電変換素子とその製造方法、及び、放熱フィン Download PDFInfo
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- WO2013047256A1 WO2013047256A1 PCT/JP2012/073755 JP2012073755W WO2013047256A1 WO 2013047256 A1 WO2013047256 A1 WO 2013047256A1 JP 2012073755 W JP2012073755 W JP 2012073755W WO 2013047256 A1 WO2013047256 A1 WO 2013047256A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/20—Thermomagnetic devices using thermal change of the magnetic permeability, e.g. working above and below the Curie point
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66984—Devices using spin polarized carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
- H10N15/15—Thermoelectric active materials
Definitions
- the present invention relates to a thermoelectric conversion element, a manufacturing method thereof, and a heat radiation fin, and more particularly, to a thermoelectric conversion element utilizing a spin Seebeck effect and an inverse spin Hall effect.
- thermoelectric conversion elements In recent years, expectations for thermoelectric conversion elements have increased as efforts toward environmental and energy issues toward a sustainable society have become active. This is because heat is the most common energy source that can be obtained from various media such as body temperature, sunlight, engine, industrial waste heat. Therefore, thermoelectric conversion elements are expected to become more important in the future in applications such as increasing the efficiency of energy use in a low-carbon society and supplying power to ubiquitous terminals and sensors.
- thermoelectric conversion element an element that generates electric power using the Seebeck effect and an element that performs cooling and heating using the Peltier effect are known.
- a thermoelectric conversion element that generates electric power using the Seebeck effect is disclosed in, for example, Japanese Patent Application Laid-Open No. 2010-205883.
- the thermoelectric conversion element disclosed in this publication the thermoelectric conversion element is composed of a plurality of columnar portions and a connecting portion that connects them.
- the columnar part is joined to the high temperature side electrode, and the connecting part is joined to the low temperature side electrode.
- the joint surface where the columnar part is joined to the high temperature side electrode and the joint surface where the connecting part is joined to the low temperature side electrode are both flat.
- thermoelectric conversion element that performs cooling and heating using the Peltier effect is disclosed in, for example, Patent Document 2 (Japanese Patent Laid-Open No. 2007-93106).
- Patent Document 2 Japanese Patent Laid-Open No. 2007-93106.
- This publication discloses a heat conversion device using corrugated fins. Also in this heat conversion device, the bonding surface where the thermoelectric element and the electrode are bonded is a flat surface.
- thermoelectric conversion elements that generate electricity using the spin Seebeck effect and the inverse spin Hall effect may be able to achieve higher conversion efficiency than thermoelectric conversion elements that use the Seebeck effect. Yes.
- thermoelectric conversion elements using the spin Seebeck effect and the inverse spin Hall effect are disclosed in, for example, Patent Document 3 (Japanese Patent Laid-Open No. 2009-130070) and Non-Patent Documents 1 and 2.
- the thermoelectric conversion element described in Patent Document 3 is composed of a ferromagnetic metal film and a metal electrode formed by sputtering. According to this configuration, when a temperature gradient in a direction parallel to the in-plane direction of the ferromagnetic metal film is given, a spin current is induced in the direction along the temperature gradient by the spin Seebeck effect. This induced spin current can be taken out as a current by the reverse spin Hall effect at the metal electrode in contact with the ferromagnetic metal film. Thereby, temperature difference power generation that extracts electric power from heat becomes possible.
- thermoelectric conversion element is formed of a magnetic insulator and a metal electrode.
- thermoelectric conversion by a temperature gradient (in-plane temperature gradient) arrangement parallel to the magnetic insulator film surface is reported.
- thermoelectric conversion is demonstrated by a temperature gradient (surface temperature gradient) perpendicular to the surface of the magnetic insulator plate having a thickness of 1 mm.
- thermoelectric conversion elements using the spin Seebeck effect and the reverse spin Hall effect, it is desirable that the efficiency of thermoelectric conversion is high. If the efficiency of thermoelectric conversion is high, more electrical energy can be extracted from less heat energy.
- K. Uchida et al. "Spin Seebeck insulator", Nature Materials, vol.9, pp.894-897, (2010).
- K. Uchida et al. "Observation oflongitudinal spin-Seebeck effect in magnetic insulators”, Applied Physics Letters, 2010, vol.97, 172505 (2010).
- H. Adachi et al. "Gigantic enhancementof spin Seebeck effect by phonon drag", Applied Physics Letter 97, 252506 (2010)
- an object of the present invention is to increase the efficiency of thermoelectric conversion of a thermoelectric conversion element using the spin Seebeck effect and the inverse spin Hall effect.
- thermoelectric conversion element in one aspect of the present invention, includes a magnetic body having magnetization and an electromotive body formed of a material having spin-orbit interaction and bonded to the magnetic body.
- the magnetic body has a joint surface that joins the electromotive body.
- the joint surface has irregularities.
- the radiation fin is formed of a support structure, a magnetic body having magnetization bonded to the support structure, and a material having a spin orbit interaction, and the magnetic fin is bonded to the magnetic body. It has an electric body.
- the support structure includes a base portion joined to the object to be cooled and a plurality of fin members that are plate-like and joined to the base portion. The joint surface where the magnetic body and the support structure are joined and the joint surface where the magnetic body and the electromotive body are joined have irregularities.
- a method for manufacturing a thermoelectric conversion element includes a step of forming a substrate having an uneven surface, a step of forming a magnetic body having magnetization so as to cover the substrate, and a spin orbit interaction.
- thermoelectric conversion efficiency of the thermoelectric conversion element using the spin Seebeck effect and the inverse spin Hall effect can be increased.
- thermoelectric conversion element of the 1st Embodiment of this invention It is a perspective view which shows the structure of the thermoelectric conversion element of the 1st Embodiment of this invention. It is a perspective view which shows the example of the manufacturing method of the thermoelectric conversion element of the 1st Embodiment of this invention. It is a perspective view which shows the modification of the thermoelectric conversion element of 1st Embodiment. It is a perspective view which shows the other modification of the thermoelectric conversion element of 1st Embodiment. It is a figure explaining the suitable magnetization direction of the magnetic body of the thermoelectric conversion element of 1st Embodiment. It is a figure explaining the structure of the upper junction surface of the magnetic body of the thermoelectric conversion element of 1st Embodiment in detail.
- thermoelectric conversion element of the 2nd Embodiment It is a figure explaining the other structure of the upper joint surface of the magnetic body of the thermoelectric conversion element of 1st Embodiment. It is a perspective view which shows the structure of the thermoelectric conversion element of the 2nd Embodiment of this invention. It is a top view which shows the structure of the thermoelectric conversion element of 2nd Embodiment. It is sectional drawing which shows the structure in the AA cross section of FIG. 7B of the thermoelectric conversion element of 2nd Embodiment. It is a perspective view which shows the example of the structure of the thermoelectric conversion element by which the upper surface of the magnetic body was flat and the return electrode was formed in the said upper surface. It is a top view which shows the structure of the structure of the thermoelectric conversion element of FIG. 8A.
- thermoelectric conversion element of the 3rd Embodiment of this invention It is a perspective view which shows the structure of the thermoelectric conversion element of the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the A section of the thermoelectric conversion element of 3rd Embodiment. It is sectional drawing which shows the structure of the B section of the thermoelectric conversion element of 3rd Embodiment.
- FIG. 1 is a perspective view showing a configuration of a thermoelectric conversion element 10 according to the first embodiment of the present invention. Below, the structure of the thermoelectric conversion element 10 is demonstrated using an xyz rectangular coordinate system.
- the thermoelectric conversion element 10 includes a substrate 1, a magnetic body 2, and an electromotive body 3.
- the substrate 1 is a support structure that supports the magnetic body 2 and the electromotive body 3, and any material / structure can be used as long as it can support the magnetic body 2 and the electromotive body 3.
- materials such as Si, glass, alumina, sapphire, gadolinium gallium garnet (GGG), resin (for example, polyimide) can be used.
- the magnetic body 2 a material having (spontaneous) magnetization M is used. In the present embodiment, it is assumed that the magnetization M of the magnetic body 2 is directed in the + y direction.
- the magnetic body 2 is preferably a magnetic insulator because a material having a lower thermal conductivity has a higher thermoelectric conversion efficiency. Examples of such a material include oxide magnetic materials such as garnet ferrite (yttrium iron ferrite) and spinel ferrite.
- the magnetic body 2 a material obtained by partially replacing impurities of yttrium sites of garnet ferrite with Bi or the like may be used. It is considered that the energy level matching between the magnetic body 2 and the electromotive body 3 is improved by the impurity substitution of the yttrium site, so that the spin current at the interface between the magnetic body 2 and the electromotive body 3 is improved. There is a possibility that the extraction efficiency can be increased and the thermoelectric conversion efficiency can be improved.
- the electromotive body 3 is made of a material having a spin orbit interaction in order to extract a thermoelectromotive force using the inverse spin Hall effect.
- a material of the electromotive body 3 for example, Au, Pt, Pd having a relatively large spin orbit interaction, or an alloy having two or more of these metals is preferable.
- a material obtained by adding an impurity such as Fe, Cu, or Ir to the above metal or alloy may be used as the electromotive body 3.
- a sufficient reverse spin Hall effect can be obtained simply by doping a general metal film material such as Cu with Au, Pt, Pd, and Ir by about 0.5 to 10%.
- the thickness of the electromotive body 3 is set to at least 1/2 or more of the spin diffusion length ⁇ (depth at which the spin current of the magnetic layer 2 enters the electromotive body 3) of the material constituting the electromotive body 3 It is preferable to do this. More desirably, the thickness of the electromotive body 3 is most preferably set to a spin diffusion length ⁇ (within a range of ⁇ / 2 to 4 ⁇ . For example, the thickness of the electromotive body 3 When forming with Au, it is most preferably set to 50 nm or more and 400 nm or less, and when forming with Pt, it is most preferably set to 8 nm or more and 60 nm or less.
- the upper joint surface 4 where the magnetic body 2 and the electromotive body 3 are joined has irregularities
- the lower joint surface 5 where the substrate 1 and the magnetic body 2 are joined has irregularities.
- “having irregularities” does not mean irregularities that are inevitably formed by forming the substrate 1 and the magnetic body 2, but means that irregularities are actively formed by some method. is doing.
- the unevenness of the upper joint surface 4 and the unevenness of the lower joint surface 5 contribute to the improvement of thermoelectric conversion efficiency.
- thermoelectric conversion element 10 of the present embodiment When a temperature gradient is generated in the z-axis direction in the magnetic body 2 magnetized in the + y direction, an angular momentum flow (spin flow) is induced in the direction of the temperature gradient due to the spin Seebeck effect in the magnetic body 2.
- spin flow angular momentum flow
- the generation of the temperature gradient on the magnetic body 2 is performed by heating the substrate 1.
- the lower bonding surface 5 of the magnetic body 2 is positioned on the high temperature side
- the upper bonding surface 4 is positioned on the low temperature side.
- the spin current generated in the magnetic body 2 flows into the electromotive body 3 joined to the magnetic body 2, and due to the reverse spin Hall effect in the electromotive body 3, the direction of the temperature gradient and the direction of the magnetization M of the magnetic body 2.
- a current J is generated in a direction perpendicular to both. Since this current J causes a potential difference in the electromotive body 3, the potential difference can be taken out as a thermoelectromotive force. That is, the thermoelectric conversion element 10 generates a thermoelectromotive force from a temperature difference (temperature gradient) applied to the magnetic body 2.
- the unevenness of the upper joint surface 4 where the magnetic body 2 and the electromotive body 3 are joined contributes to the improvement of the thermoelectric conversion efficiency.
- the area of the upper bonding surface 4 is increased, and the efficiency of extracting the spin current to the electromotive body 3 is improved.
- the unevenness of the upper joint surface 4 increases the heat dissipation efficiency and increases the temperature difference between the upper joint surface 4 and the lower joint surface 5. This means that the temperature gradient of the magnetic body 2 is increased.
- the unevenness of the lower joint surface 5 where the substrate 1 and the magnetic body 2 are joined also contributes to the improvement of the thermoelectric conversion efficiency.
- the unevenness of the lower bonding surface 5 increases the heating efficiency of the magnetic body 2 and increases the temperature difference between the upper bonding surface 4 and the lower bonding surface 5. This means that the temperature gradient of the magnetic body 2 is increased.
- corrugation of the lower junction surface 5 also contributes to the improvement of the thermoelectric conversion efficiency.
- thermoelectric conversion element 10 of FIG. 1 both the upper bonding surface 4 and the lower bonding surface 5 have irregularities, but only one of the upper bonding surface 4 and the lower bonding surface 5 has irregularities. Also good. It will be obvious from the above description that thermoelectric conversion efficiency can be improved even when only one of the upper bonding surface 4 and the lower bonding surface 5 has irregularities.
- the magnetic body 2 may be formed as a bulk (or thick film), or may be formed as a thin film (for example, having a film thickness of 100 ⁇ m or less).
- the thermoelectric conversion efficiency depends on the temperature gradient of the magnetic body 2
- the temperature gradient is reduced, which may seem undesirable from the viewpoint of thermoelectric conversion efficiency. Absent.
- the inventors have actually confirmed that sufficient thermoelectric conversion efficiency can be obtained even if the magnetic body 2 is formed as a thin film by the so-called “phonon drag effect”.
- the “phonon drag effect” refers to a phenomenon in which the spin current generated in the magnetic material interacts non-locally with the entire phonon of the thermoelectric conversion element including the substrate (Applied Physics Letter 97, 252506 ( 2010) (see Non-Patent Document 3).
- FIG. 2 is a conceptual diagram showing an example of a manufacturing method of the thermoelectric conversion element 10 of FIG. 1, and shows a manufacturing process when the magnetic body 2 is formed as a thin film.
- a substrate member 8 and a template 9 to be processed into the substrate 1 are prepared.
- the substrate member 8 is formed of a material that can be plastically processed, and the template 9 has irregularities.
- the substrate member 8 is formed of a resin such as polyimide, for example.
- the substrate member 8 is patterned using the template 9, whereby the substrate 1 having unevenness is formed (step (1) in FIG. 2).
- the substrate 1 having irregularities is formed by pressing the template 9 against the substrate member 8 while the substrate member 8 is heated to a temperature at which plasticity occurs.
- the magnetic body 2 is formed so as to cover the substrate 1 (step (2) in FIG. 2).
- the magnetic body 2 is formed as a thin film.
- the lower bonding surface 5 between the substrate 1 and the magnetic body 2 is also formed to have the unevenness.
- irregularities are also formed on the surface of the magnetic body 2.
- the magnetic body 2 is formed by sputtering, organometallic decomposition method (MOD method), sol-gel method, aerosol deposition. It may be formed by any of the methods (AD method). Among these forming methods, it is desirable to form the magnetic body 2 using the AD method. This is because in the AD method, since the polycrystalline film is formed and densified by the collision energy of the fine particles, the film can be formed without selecting the material and structure of the substrate 1 as compared with other film forming methods. It is.
- the film thickness that can be formed by a film forming method such as sputtering or MOD is usually about 1 ⁇ m at maximum, but if the AD method is used, a thin film having a thickness of 10 ⁇ m or more can be formed at high speed.
- the electromotive body 3 is formed so as to cover the upper surface of the magnetic body 2 (step (3) in FIG. 2).
- the electromotive body 3 is formed by, for example, sputtering, vapor deposition, plating, or screen printing. Since the unevenness is formed on the surface of the magnetic body 2 in the previous step, the upper bonding surface 4 between the magnetic body 2 and the electromotive body 3 is also formed to have the unevenness.
- thermoelectric conversion element 10 as shown in FIG. 1 is manufactured.
- the manufacturing method of the thermoelectric conversion element 10 is not limited above.
- unevenness may be provided by anisotropic etching.
- FIG. 3 is a perspective view showing a configuration of a thermoelectric conversion element 10A according to a modification of the present embodiment.
- the thermoelectric conversion element 10 ⁇ / b> A has a configuration in which an electromotive body 6 is additionally inserted between the substrate 1 and the magnetic body 2.
- an electromotive body 6 is additionally inserted between the substrate 1 and the magnetic body 2.
- connects the magnetic body 2 and the upper junction surface 4 is called the upper electromotive body 3
- the body 6 is called the lower electromotive body 6.
- the lower electromotive body 6 is formed of a material having a spin orbit interaction in order to take out a thermoelectromotive force using the reverse spin Hall effect, and the same material as that of the upper electromotive body 3 is made of the lower electromotive force.
- the body 6 can also be used.
- a material obtained by adding an impurity such as Fe, Cu, or Ir to the above metal or alloy may be used as the lower electromotive body 6.
- the thickness of the lower electromotive body 6 is at least 1/2 of the spin diffusion length ⁇ of the material constituting the lower electromotive body 6 (the depth at which the spin current of the magnetic layer 2 penetrates into the lower electromotive body 6). It is preferable to set the above. More desirably, the thickness of the lower electromotive member 6 is most preferably set to a spin diffusion length ⁇ (within a range of ⁇ / 2 to 4 ⁇ . For example, the thickness of the lower electromotive member 6 is set to be lower electromotive force.
- the body 6 is formed of Au, it is most preferably set to 50 nm or more and 400 nm or less, and when it is formed of Pt, it is most preferably set to 8 nm or more and 60 nm or less.
- thermoelectric conversion element 10 ⁇ / b> A of FIG. 3 the upper joint surface 4 between the magnetic body 2 and the upper electromotive body 3 is provided with irregularities, and the lower joint surface 5 between the magnetic body 2 and the lower electromotive body 6. are also provided with irregularities, which improves the thermoelectric conversion efficiency.
- thermoelectric conversion efficiency can be further improved. For example, if the upper electromotive body 3 and the lower electromotive body 6 are electrically connected in series, a larger electromotive force can be obtained. Further, if the upper electromotive body 3 and the lower electromotive body 6 are electrically connected in parallel, a larger current can be obtained.
- thermoelectric conversion element 10A of FIG. 3 adds a step of forming a lower electromotive body 6 on the substrate 1 in the manufacturing method illustrated in FIG.
- the body 2 can be manufactured by forming it.
- FIG. 4 is a perspective view showing a configuration of a thermoelectric conversion element 10B according to another modification of the present embodiment.
- the thermoelectric conversion element 10 ⁇ / b> B has a configuration in which a buffer layer 7 is additionally inserted between the substrate 1 and the magnetic body 2.
- the buffer layer 7 is formed in order to improve the characteristics of the magnetic body 2 when the magnetic body 2 is formed as a thin film thereon.
- an oxide magnetic material such as garnet ferrite (yttrium iron ferrite) or spinel ferrite is used as the magnetic body 2
- the magnetic body 2 is preferably formed on a structure made of an oxide.
- the substrate 1 when a substrate made of a material that is not an oxide (for example, a resin substrate such as polyimide or a silicon substrate) is used as the substrate 1, the structure in which the substrate 1 and the magnetic body 2 are in direct contact as shown in FIG. If it is adopted, the characteristics of the magnetic body 2 will deteriorate.
- a non-oxide material is used as the substrate 1 and an oxide magnetic material is used as the magnetic body 2
- the characteristics of the magnetic body 2 are improved by using the oxide buffer layer 7, and the thermoelectric conversion efficiency is improved.
- the buffer layer 7 is formed of a silicon oxide film.
- the thermoelectric conversion element 10B of FIG. 4 adds the process of forming the buffer layer 7 on the board
- the uneven shape of the upper joint surface 4 and the lower joint surface 5 can be variously changed and is not limited to a specific shape.
- the shape of the upper joint surface 4 where the magnetic body 2 and the electromotive body 3 are in contact the extraction efficiency of the spin current into the electromotive body 3 is improved, and the thermoelectric conversion efficiency Can be improved.
- the direction of the magnetization M is directed to the + y direction, while the upper joint surface 4 has a unit surface in the x-axis direction that is perpendicular to the magnetization M.
- a plurality of gratings arranged side by side are included.
- Such a structure is suitable for improving the extraction efficiency of the spin current to the electromotive body 3 and improving the thermoelectric conversion efficiency.
- the unit plane is a non-plane obtained by translating a generatrix in a specific plane perpendicular to the magnetization M in the y-axis direction (a direction parallel to the magnetization M) by a specific distance. It is a unit structure to constitute. Since the unit surface is non-planar, the bus defining the unit surface is also non-linear.
- FIGS. 5A and 5B are diagrams showing the unit surface 11 and the bus bar 11a with respect to the upper joint surface 4 of the thermoelectric conversion element 10 of FIG.
- FIG. 5A is a cross-sectional view showing a cross-sectional structure in the xz plane of the thermoelectric conversion element 10 of FIG. 1
- FIG. 5B is a view from the thermoelectric conversion element 10 (to clearly show the structure of the magnetic body 2). It is a figure which shows the structure except the electromotive body 3.
- the bus bar 11a is parallel to the y-axis direction. It is a non-planar obtained by moving.
- the bus bar 11a is a non-straight line composed of line segments 12a and 13a in a plane parallel to the xz plane.
- the line segments 12a and 13a are connected to each other at the ends and are not on the same straight line.
- the rectangular planes 12 and 13 are planes obtained by translating the line segments 12a and 13a in the y-axis direction, respectively.
- the upper joint surfaces 4 of the thermoelectric conversion elements 10A and 10B in FIGS. 3 and 4 also have the same structure.
- the spin current Since the spin current locally flows in a direction perpendicular to the magnetization M (directed in the + y direction), the spin current efficiently flows into each unit surface 11 which is a non-plane parallel to the magnetization M.
- the unit surface 11 includes rectangular planes 12 and 13, the rectangular planes 12 and 13 are both parallel to the magnetization M, so that the spin current efficiently flows from the magnetic body 2 to the electromotive body 3. Therefore, the upper bonding surface 4 is configured to include a grating in which a plurality of unit surfaces 11 are arranged in the x-axis direction, thereby increasing the spin current flowing from the magnetic body 2 to the electromotive body 3, Thermoelectric conversion efficiency can be improved.
- the shape of the unit surface 11 which comprises the upper joint surface 4 can be changed variously.
- the unit surface 11 may be configured as a (smooth) curved surface obtained by making a generatrix that is a smooth curve parallel to the y-axis direction.
- the unit surface 11 may be configured as a semi-cylindrical curved surface. In this case, a semicircle in a plane perpendicular to the magnetization M is defined as a bus line.
- the lower joint surface 5 is not directly related to the extraction efficiency of the spin current from the magnetic body 2 to the electromotive body 3.
- the shape of the upper joint surface 4 depends on the shape of the lower joint surface 5. Therefore, in order to form the upper joint surface 4 in a shape including a grating in which a plurality of unit surfaces are arranged in the x-axis direction that is perpendicular to the magnetization M, the lower joint surface 5 has the same shape. It is preferable to have.
- the substrate 1 it is not necessary to provide the substrate 1 particularly when the magnetic body 2 is formed as a bulk (thick film).
- a temperature gradient is given to the magnetic body 2 by directly heating the lower surface of the magnetic body 2.
- thermoelectric conversion element 10C shows the structure of the thermoelectric conversion element 10C according to the second embodiment of the present invention.
- FIG. 7A is a perspective view of the thermoelectric conversion element 10C
- FIG. 7B is the thermoelectric conversion element 10C
- 7C is a cross-sectional view of the thermoelectric conversion element 10C in the AA cross section of FIG. 7B.
- the upper joint surface 4 of the magnetic body 2 is configured as a grating in which a plurality of unit surfaces 11 each consisting of rectangular planes 12 and 13 are arranged in the x-axis direction.
- an electromotive body formed on the upper joint surface 4 is formed as the folded electrode 23.
- An output terminal 21 is joined in the vicinity of one end of the folded electrode 23, and an output terminal 22 is formed in the vicinity of the other end.
- the output terminals 21 and 22 are used for taking out the generated current or voltage.
- the return electrode 23 is formed of a material having a spin orbit interaction in order to extract the thermoelectromotive force using the reverse spin Hall effect, similarly to the electromotive body 3 of the first embodiment.
- the folded electrode 23 is preferably, for example, Au, Pt, Pd having a relatively large spin orbit interaction, or an alloy having two or more of these metals.
- a material obtained by adding an impurity such as Fe, Cu, or Ir to the above metal or alloy may be used as the folded electrode 23.
- the thickness of the folded electrode 23 is preferably set to at least the spin diffusion length of the material constituting the folded electrode 23. Specifically, for example, the thickness of the folded electrode 23 is preferably set to 50 nm or more when the folded electrode 23 is formed of Au, and 10 nm or more when formed of Pt.
- the folded electrode 23 includes an electrode portion 23 a formed on the rectangular plane 12 and an electrode portion 23 b formed on the rectangular plane 13. It has.
- the pair of electrode portions 23a and 23b corresponding to each unit surface 11 are connected at the end in the ⁇ y direction, and the electrode portion 23b of each unit surface 11 and the electrode portion 23a adjacent to the unit surface 11 are + y Connected at the end of the direction.
- the folded electrode 23 is configured by alternately connecting the electrode portions 23 a formed on the rectangular plane 12 and the electrode portions 23 b formed on the rectangular plane 13 in series.
- thermoelectric conversion element 10C of the second embodiment operates as follows: For example, when the substrate 1 is heated, a temperature gradient is generated in the z-axis direction in the magnetic body 2 that is magnetized in the + y direction. The spin Seebeck effect in the magnetic body 2 induces an angular momentum flow (spin flow) in the direction of this temperature gradient.
- the spin current generated in the magnetic body 2 flows into the folded electrode 23 joined to the magnetic body 2, and both the direction of the temperature gradient and the direction of the magnetization M of the magnetic body 2 are caused by the reverse spin Hall effect in the folded electrode 23.
- a current J is generated in a direction perpendicular to. This current J causes a potential difference in the folded electrode 23.
- the magnetization M of the magnetic body 2 is formed on the electrode portion 23 a formed on the rectangular plane 12 and on the rectangular plane 13.
- the electrode portions 23b are directed in directions in which spin flows having different sizes flow from the magnetic body 2. More precisely, the direction of the magnetization M is obtained by projecting the unit vector in the direction of the magnetization M onto the rectangular plane 13 and the magnitude of the vector obtained by projecting the unit vector in the direction of the magnetization M onto the rectangular plane 12. The direction is such that it is smaller than the magnitude of the vector to be generated.
- the magnetization M When the magnetization M is directed in such a direction, different electromotive forces are generated between the electrode portion 23a formed on the rectangular plane 12 and the electrode portion 23b formed on the rectangular plane 13, An electromotive force can also be obtained for the entire folded electrode 23.
- the magnetization M is in the plane of the xz plane and is directed in a direction parallel to the rectangular plane 13. As described in detail below, a large electromotive force can be generated by directing the magnetization M in such a direction.
- the magnetization direction of the magnetic body 112 is the ⁇ x direction
- the top surface of the magnetic body 112 is flat
- the same plane as the folded electrode 23 is formed on the top surface.
- a folded electrode 113 having a shape is formed.
- the electromotive force is canceled at the portion of the folded electrode 113 where the current is directed in the + y direction and the portion where the current is directed in the ⁇ y direction, and is obtained from the output terminals 114 and 115.
- the entire electromotive force of the folded electrode 113 is substantially zero.
- the upper joint surface 4 of the magnetic body 2 is configured as a grating in which a plurality of unit surfaces 11 composed of rectangular planes 12 and 13 are arranged side by side in the x-axis direction.
- the magnetization M is in the plane of the xz plane and is directed in a direction parallel to the rectangular plane 13, the electromotive force is generated in the electrode portion 23 a formed on the rectangular plane 12.
- No electromotive force is generated (or only a small electromotive force is generated), and substantially only the electromotive force generated in the electrode portion 23b formed on the rectangular plane 13 contributes to the electromotive force generated in the entire folded electrode 23.
- each electrode part 23b is electrically connected in series by the electrode part 23a (which does not generate an electromotive force), a large electromotive force can be obtained as the entire folded electrode 23.
- the direction of the magnetization M is in the xz plane and does not have to coincide completely with the direction parallel to the rectangular plane 13. Even if the direction of the magnetization M is slightly deviated from the direction parallel to the rectangular plane 13, a sufficient electromotive force can be obtained.
- thermoelectric conversion element 10D shows the structure of the thermoelectric conversion element 10D according to the third embodiment of the present invention.
- FIG. 9A is a perspective view of the thermoelectric conversion element 10
- FIG. 9B is the configuration of the A part of FIG. 9A.
- FIG. 9C is a cross-sectional view showing a configuration of a portion B in FIG. 9A.
- the thermoelectric conversion element 10D is mounted as a radiation fin. That is, in the thermoelectric conversion element 10 ⁇ / b> D, a laminated body including the magnetic body 2 and the electromotive body 3 is formed on the surface of the fin body 31 (not the substrate 1). The magnetization of the magnetic body 2 is directed in the + y direction.
- the structure of the thermoelectric conversion element 10D of the third embodiment will be described in detail.
- the fin main body 31 includes a base portion 31a and a plurality of fin members 31b.
- the base 31a is a member that is thermally coupled to an object to be cooled (not shown).
- the plurality of fin members 31b are coupled to the base portion 31a.
- the fin members 31b have a plate-like shape, and are arranged side by side in the x-axis direction in a state in which the fin members 31b are parallel to the yz plane.
- the laminated body composed of the magnetic body 2 and the electromotive body 3 has at least a plane having a normal line parallel to the z-axis direction and a plane having a normal line parallel to the x-axis direction. Formed.
- thermoelectric conversion element 10D of the present embodiment operates as follows: When heat is transferred from the object to be cooled joined to the base 31a to the fin body 31, the magnetic body 2 and the electromotive body 3 from the fin body 31. As a result, a heat flow is generated in the magnetic body 2, and a temperature gradient is generated in the magnetic body 2. The spin Seebeck effect in the magnetic body 2 induces an angular momentum flow (spin flow) in the direction of this temperature gradient.
- the spin current generated in the magnetic body 2 flows into the electromotive body 3 joined to the magnetic body 2, and due to the reverse spin Hall effect in the electromotive body 3, the direction of the temperature gradient and the direction of the magnetization M of the magnetic body 2. Current is generated in a direction perpendicular to both. This current causes an electromotive force in the electromotive body 3. The current or electromotive force generated in the electromotive body 3 is taken out and used.
- thermoelectric conversion element 10D having such a structure, the joint surface where the magnetic body 2 and the electromotive body 3 are joined has irregularities, and the joint surface where the magnetic body 2 and the fin body 31 are joined also has irregularities. Therefore, the thermoelectric conversion efficiency can be improved. In addition, mounting the thermoelectric conversion element 10D as a radiating fin enables reuse of the heat of the member to be cooled, contributing to efficient use of energy.
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- Hall/Mr Elements (AREA)
Abstract
Description
図1は、本発明の第1の実施形態の熱電変換素子10の構成を示す斜視図である。以下では、xyz直交座標系を用いて熱電変換素子10の構成を説明する。
図7A~図7Cは、本発明の第2の実施形態の熱電変換素子10Cの構造を示しており、特に、図7Aは、熱電変換素子10Cの斜視図、図7Bは、熱電変換素子10Cの上面図、図7Cは、図7BのA-A断面における熱電変換素子10Cの断面図である。
図9A~図9Cは、本発明の第3の実施形態の熱電変換素子10Dの構造を示しており、図9Aは熱電変換素子10の斜視図であり、図9Bは図9AのA部の構成を示す断面図であり、図9Cは図9AのB部の構成を示す断面図である。第3の実施形態では、熱電変換素子10Dが放熱フィンとして実装されている。即ち、熱電変換素子10Dでは、磁性体2及び起電体3からなる積層体が、(基板1ではなく)フィン本体31の表面に形成されている。磁性体2の磁化は、+y方向に向けられている。以下、第3の実施形態の熱電変換素子10Dの構造を詳細に説明する。
Claims (12)
- 磁化を有する磁性体と、
スピン軌道相互作用を有する材料で形成され、前記磁性体と接合された第1起電体
とを備え、
前記磁性体は、前記第1起電体と接合する第1接合面を有しており、
前記第1接合面が凹凸を有している
熱電変換素子。 - 請求項1に記載の熱電変換素子であって、
更に、支持構造体を備えており、
前記磁性体が、更に、前記第1接合面と対向する第2接合面を有しており、
前記第2接合面は、前記支持構造体に、直接的に又は間接的に接合しており、
前記第2接合面が凹凸を有している
熱電変換素子。 - 請求項2に記載の熱電変換素子であって、
更に、前記支持構造体と前記磁性体との間に挿入されるバッファ層を備えており、
前記第2接合面は、前記バッファ層に接合される
熱電変換素子。 - 請求項3に記載の熱電変換素子であって、
前記バッファ層は、酸化物で形成されている
熱電変換素子。 - 請求項2に記載の熱電変換素子であって、
更に、前記支持構造体と前記磁性体との間に挿入され、スピン軌道相互作用を有する材料で形成された第2起電体を備えており、
前記第2接合面は、前記第2起電体に接合される
熱電変換素子。 - 請求項1乃至5のいずれかに記載の熱電変換素子であって、
前記磁性体の前記磁化が第1方向に向けられており、
前記第1接合面は、複数の単位面を前記第1方向に垂直な第2方向に並べて形成された形状を有しており、
前記単位面のそれぞれは、前記第1方向に垂直な平面内にある非直線の母線を前記第1方向に移動させて得られる非平面である
熱電変換素子。 - 請求項6に記載の熱電変換素子であって、
前記単位面は、
第1平面と、
前記第1平面の端に接合する端を有し、前記第1平面と同一平面上にない第2平面
とを含み、
前記第1平面と前記第2平面とが、いずれも、前記磁性体の前記磁化の方向と平行である
熱電変換素子。 - 請求項1に記載の熱電変換素子であって、
前記第1接合面は、複数の単位面を前記第1方向に垂直な第2方向に並べて形成された形状を有しており、
前記単位面のそれぞれは、
第1平面と、
前記第1平面の端に接合する端を有し、前記第1平面と同一平面上にない第2平面
とを含み、
前記第1起電体は、前記第1平面の上に形成された第1電極部分と、前記第2平面の上に形成された前記第2電極部分とが、交互に直列に接続されて構成されており、
前記磁性体の前記磁化の方向は、前記磁化の方向の単位ベクトルを前記第1平面に投射して得られるベクトルの大きさが、前記単位ベクトルを前記第2平面に投射して得られるベクトルの大きさよりも小さくなるような方向に向けられる
熱電変換素子。 - 請求項8に記載の熱電変換素子であって、
前記磁性体の前記磁化の方向は、前記第2平面に平行である
熱電変換素子。 - 支持構造体と、
前記支持構造体に接合された、磁化を有する磁性体と、
スピン軌道相互作用を有する材料で形成され、前記磁性体と接合された起電体
とを備え、
前記支持構造体は、
冷却対象に接合される基部と、
板状であり、且つ、前記基部に接合される複数のフィン部材
とを備え、
前記磁性体と前記支持構造体とが接合する接合面と、前記磁性体と前記起電体と接合する接合面とが凹凸を有している
放熱フィン。 - 凹凸を有する表面を有する基板を形成する工程と、
前記基板を被覆するように磁化を有する磁性体を形成する工程と、
スピン軌道相互作用を有する材料で形成され、前記磁性体と接合された起電体を、前記磁性体と前記起電体と接合する接合面が凹凸を有しているように形成する工程
とを備える
熱電変換素子の製造方法。 - 請求項11に記載の熱電変換素子の製造方法であって、
前記基板を形成する工程では、凹凸が形成されたテンプレートを塑性変形可能な状態の基板部材に押し付けることで凹凸を有する表面を有する前記基板が形成される
熱電変換素子の製造方法。
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JP2015222789A (ja) * | 2014-05-23 | 2015-12-10 | 株式会社デンソー | 熱電変換素子 |
KR20160135057A (ko) * | 2015-05-15 | 2016-11-24 | 한국과학기술원 | 열전변환 소자 및 그 제조방법 |
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WO2014041838A1 (ja) * | 2012-09-12 | 2014-03-20 | 日本電気株式会社 | 熱電変換素子及びその製造方法 |
KR102366934B1 (ko) * | 2015-07-22 | 2022-02-23 | 엘지전자 주식회사 | 열교환모듈 및 이를 포함하는 세탁물 처리장치 |
US20190058103A1 (en) | 2016-01-19 | 2019-02-21 | The Regents Of The University Of Michigan | Thermoelectric micro-module with high leg density for energy harvesting and cooling applications |
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