Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
  • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
  • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
  • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/08—Devices involving relative movement between laser beam and workpiece
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/50—Working by transmitting the laser beam through or within the workpiece
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/09—Severing cooled glass by thermal shock
  • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
  • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
  • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/40—Semiconductor devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P40/00—Technologies relating to the processing of minerals
  • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
  • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

• the present technology relates generally to laser processing of materials, and more specifically, but not by way of limitation, to systems and methods that singulate materials.
• singulation is a material separation process that often involves the application of chemical processes and/or mechanical forces to materials, particularly brittle materials, such as strengthened glass.
• materials that are often processed to create products via singulation include, but are not limited to, amorphous solid materials, crystalline materials, semiconducting materials, a crystalline ceramics, polymers, resins, and so forth.
• the present technology may be directed to methods for material singulation.
• the methods may include: (a) applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and (b) applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material while substantially reducing the impartation of defects into the material.
• the present technology may be directed to laser devices for causing material singulation.
• laser devices may include: (a) a first laser device that generates laser output for modifying one or more material properties of a material when applied to at least a portion of the material; and (b) a second laser device that generates laser output that, when applied to the material exposed to the laser output of the first laser device, produces a singulated product while substantially reducing the impartation of defects into the product.
• the present technology may be directed to singulated products created by a process.
• the process may include: (a) providing a stock of material; (b) applying a first laser output to the stock material along a beam path, the first laser output causing a modification of a material property of the stock material along the beam path; and (c) applying a second laser output along the beam path to cause separation of the singulated material from the stock material, along the beam path in such a way that surfaces of the singulated material, created by the separation, are substantially free from defects.
• FIG. 1 is a schematic representation of an exemplary singulation system for use in accordance with the present disclosure.
• FIG. 2A is a perspective view of a material having a modification caused by application of a first laser output to the material.
• FIG. 2B is a side elevation view of the material showing the modification extending through the material, shown under microscopic evaluation.
• FIG. 3 is a side elevation view of a material showing varying modifications, each extending through a different depth within the material.
• FIG. 4A is a microscopic photograph of a side elevation view showing modification of the material.
• FIG. 4B is another microscopic photograph of the side elevation view of FIG. 4A, focused three millimeters into the material.
• FIG. 5 is a perspective view of the material singulated into two sections by application of a second laser output to the modification.
• FIG. 6 illustrates an exemplary computing system that may be used to implement embodiments according to the present technology.
• the present technology relates generally to laser processing of materials, and more specifically, but not by way of limitation, to systems and methods that singulate materials, particularly brittle materials, by applying two or more types of laser output to the material, wherein the resultant singulated product is substantially free from defects.
• Singulation allows for the separation of the material into individual products, or the milling of features into the material.
• Common singulation processes often involve numerous processing steps that are conducted slowly and iteratively in an attempt to avoid introducing defects such as micro-cracks or chips into the final product.
• Even with multi-step processes, current processes have low yield rates as any application of mechanical forces to the material can easily impart defects into the material.
• the present technology may include synchronous exposure of a material to two or more different types of laser beam output where each type of laser beam output induces a different physical mechanism of change to the material. The combination of these exposures creates a product with a clean, defect-free shape.
• a product with a clean, defect-free shape may also be referred to as a product having surfaces that are "substantially smooth.”
• materials that are often processed to create products via singulation include, but are not limited to, amorphous solid materials, crystalline materials, semiconducting materials, a crystalline ceramics, polymers, resins, and so forth.
• a sheet of strengthened glass may be subjected to two or more types of laser beam output to transform the sheet of strengthened glass into one or more touchscreen substrates that can be utilized to create touchscreen devices.
• strengthened glass may include glass that has been improved by high temperature exposure or by chemical treatment, such as Gorilla Glass from Corning or Dragontrail from Asahi.
• the sheet of strengthened glass may be especially thin— approximately 0.5 mm or thinner— which may impose increased susceptibility to defect impartation during conventional singulation methods.
• the first laser output may induce a modification into the material and the second laser output may cause separation of the material at the modification.
• This two step process may create a singulated product having edge surfaces (as well as an overall product) that are substantially free from defects such as cracks or other surface irregularities/variations. That is, the present technology creates singulated products that have smoother singulated edges, more uniform planar surfaces, lower surface roughness, and greater mechanical strength relative to singulated products created via mechanical processes.
• the present technology may be utilized to create singulated products with greatly varying geometrical configurations. Additionally, the systems and methods provided herein may be utilized to fabricate features into products with fine precision. Examples of features may include, but are not limited to slits, apertures, grooves, notches, etching, and so forth.
• a first laser beam may induce a discrete change to the molecular structure of the material along a beam path (also known as a tool path).
• the modification may comprise any of: a separation of molecular bonds in the material lattice, a geometrical reorientation of molecular constituents, and/or spatial movement of molecular species - just to name a few.
• Modifications may manifest macroscopically as a perturbation to a refractive index, an optical absorption, a variation in mechanical stress relative to the rest of the material, or a change in the physical density of the material.
• the second laser beam may follow the same path as the first laser beam and create a heating effect along the path that produces complete separation between sections of the substrate (along the modification) along the path traced by the laser beams.
• the two laser beams may be imaged onto the substrate with very little time delay. That is, there may be very little time delay between the delivery of the second beam after the delivery of the first beam (in some cases within a fraction of a second).
• the two laser beams may be imaged using a single motion control and beam delivery apparatus. The exposure of the substrate to the two laser beams may occur substantially simultaneously so as to function as one laser beam with respect to time, yet the net material modification (e.g., singulation) is produced by the combined effects of two discrete laser induced mechanisms.
• the present technology may utilize a short pulse laser to produce a first modification in the material and a long pulse or continuous wave laser to separate the material.
• the peak power associated with the short pulse laser may readily invoke any of the aformentioned molecular perturbations. It will be understood that these perturbation may be caused by rapid acceleration of electrons in response to application of the strong electric field of the short laser pulse to the material.
• the first modification may include any of a family of ionization effects, such as discontinuities in the lattice pattern (molecular level) of the material.
• the second laser may generate a laser beam with a relatively high average power and low peak power.
• the laser beam may generate heat in the material through optical absorption. Localized heating within the second laser beam exposure area may selectively heat the modification created by the first laser beam and cause the material to separate along the lattice pattern discontinuity (e.g., the modification). Other causes for separation may include propagation of an acoustic Shockwave (generated by the application of the laser beam of the second laser) through the area of material modification, and/or to severe thermal gradation of the area of material modification.
• FIG. 1 illustrates an exemplary singulation system (hereinafter "system 100") for use in practicing embodiments of the present technology.
• the system 100 may comprise a first laser device 105 and a second laser device 110 that are each selectively coupled with a beam delivery assembly 115.
• Each of the first and second laser devices will be discussed in greater detail infra.
• the first and second laser devices 105 and 110 are shown as being disposed within the same housing 120, although it will be understood that the first and second laser devices may be housed separately from one another, and optionally in separate systems (not shown).
• the beam delivery assembly 115 may be generally described as comprising optical and/or structural components that are utilized to focus and direct laser beams generated by the first and second laser devices 105 and 110.
• the construction and operation of beam delivery assemblies would be well known to one of ordinary skill in the art with the present disclosure before them. Therefore, a detailed discussion of the beam delivery assembly 115 will be omitted for the purpose of brevity.
• the system 100 may also include a platform 125 positioned below the first and second laser devices 105 and 110.
• the platform 125 may be utilized to support a material 130, also known as a stock material.
• the first laser device 105 may include any one of a number of different types of lasers that is adapted to generate a laser beam 135 that induces a primarily electronic energy excitation within the material 130. It will be understood that the first laser device 105 may generate a laser beam that comprise a wavelength of light selected from any of visible, near infrared, or ultraviolet.
• the first laser device 105 may utilize a laser pulse duration of less than or equal to about ten nanoseconds. In other embodiments, the first laser device 105 utilizes a laser pulse duration of less than or equal to about fifty picoseconds. In some embodiments, the first laser device 105 may utilize a laser pulse duration of less than or equal to about one picosecond.
• the laser pulse duration of the first laser device 105 may be selected based a desired electric field strength that is to be generated within the irradiated area (desired area of modification). The laser pulse duration and laser pulse strength may be varied based upon the physical properties of the material such as density and opacity.
• the first laser device 105 may selectively apply a laser beam to the material along a beam path 140, or according to a pattern. Selective adjustments of the beam delivery assembly 115 may cause electronic energy excitation to any depth of the material (see FIG. 3). Additionally, the amount of electronic energy excitation may be selectively adjusted by varying additional parameters of the first laser device 105 such as beam delivery speed and beam energy level.
• the electronic energy excitation of the material may cause a perturbation of molecules within the material along the beam path 140.
• perturbation of the material may include inducing a change in one or more physical properties of the material 130.
• a perturbation may include, for example, a separation of the molecular bonds in molecular lattice of the material (also known as creating a lattice pattern discontinuity), a localized volume of removed material (also known as a scribe), a geometrical reorientation of molecules of the material, and/or a change in material density along the beam path - just to name a few.
• FIGS. 2A and 2B illustrate a modification 145 that extends between a top surface 150 and a bottom surface 155 of the material 130, along the length of the beam path 140.
• FIG. 3 illustrates material modifications of varying length and depth within a material 300.
• a modification 305 may extend between a top surface 310 and a bottom surface 315 of the material 300 (similar to the modification 145 of FIGs. 2A and 2B).
• Modification 320 is shown as extending from the top surface 310 to a depth within the material 300.
• Modification 325 is shown as beginning at a distance below the top surface 310 and terminating at a predetermined distance above the bottom surface 315.
• Modification 330 is shown as extending upwardly from the bottom surface 315 of the material 300 and terminating within the material 300 at a predetermined distance from the top surface 310.
• These modifications are merely exemplary and illustrate that modifications may extend at any depth between the top surface 310 and the bottom surface 315 of the material 300.
• the width of the beam path 140 may be selectively adjusted by varying the optical configurations of the beam delivery assembly 115.
• the beam delivery assembly 115 may focus the output of the first laser device 105 to approximately 1 micrometer to 100 micrometers in width.
• the beam width may be selectively varied to vary the dimensions of the modification 305.
• Modifications to material properties of the material may be evidenced by inspection of the mechanical properties of the material. For example, a modification may induce a change in the refractive index (particularly for transparent or semi- transparent materials) of the material along the modification. Therefore, upon refractive inspection of the material, the modification may appear visually distinct from the unmodified material.
• FIGS. 4A and 4B illustrate microscopic photographs of refractive inspection of a modified material 400.
• the material 400 has been exposed to a first laser output that induced a modification 405 within the material 400.
• Inspection included application of light to the material.
• the modification 405 appears as a dark line that extends through the material 400. This darkening is due to the light traveling more slowly or with greater absorption through the modification 405 relative to the rest of the material 400 adjacent (on either side) the modification 405.
• FIG. 4B illustrates the same portion of the material 400 as FIG. 4A, with the exception that FIG. 4B is focused three millimeters into the material 400. Moreover, magnification and imaging of the material 400 is made possible because the material 400 is at least partially transparent and able to pass light therethrough.
• FIG. 5 illustrates separation (e.g., singulation) of modified material 500
• a modified material will be understood to include a material that has previously been subjected to a first laser output of a first laser device 105.
• the singulation of the modified material 500 may be caused by laser output of the second laser device 110 along the beam path 520. It is noteworthy to mention that the beam path 520 is shown as extending past the edges of the modified material 500 for illustrative purposes only.
• the laser output of the second laser device 110 may cause a heating of the modified material 500 along the beam path 520, which results in a separation or singulation of the modified material along the modification (represented by beam path 520).
• the separation of the modified material 500 by the second laser device 110 produces a singulated product that is substantially free from defects.
• an edge surface such as singulated edge surface 515 and corners 525 and 530 that are created during singulation are substantially free from defects such as cracking, chipping or misshaping. These defects may degrade mechanical integrity, fracture strength, and/or cosmetic value of the product.
• the second section 510 also includes a singulated edge surface that is substantially free from defects.
• the laser beam generated by the second laser device 110 may be of sufficient width to increase the temperature of the material directly adjacent to the modified material.
• the increase in temperature to adjacent material aids in preventing the development of defects along the beam path 520 during singulation.
• the second output of the second laser device 110 may generate an acoustic Shockwave that propagates through the modified material 500.
• This acoustic Shockwave may cause failure of the modified material along the beam path 520. It will be understood that a Shockwave may be generated by the output of an ultrafast laser device.
• the laser beam of the second laser device 110 may utilize laser pulse durations that are greater than or equal to about ten picoseconds. Other embodiments may include laser pulse durations of greater than or equal to about one microsecond.
• the second laser output may comprise a wavelength selected from a range of approximately 0.78 to three micrometers (i.e. the near infrared light spectrum), inclusive. In other embodiments, the second laser output may comprise a wavelength selected from a range of approximately three to fifty
• the second laser output comprises a wavelength selected from a range of approximately fifty to one thousand micrometers (i.e. the far infrared light spectrum), inclusive.
• the second laser device 110 includes a continuous wave laser device.
• the width of the beam of the second laser device 110 may be selectively adjusted based upon the width of the modification 145.
• the width of the beam may be selectively adjusted by varying the optical configuration of the beam delivery assembly 115.
• the beam delivery assembly 115 may focus the output of the second laser device 110 to approximately 10
• micrometers to 10 mm in width (based upon the width of the modification caused by the output of the first laser device, or approximately 1 to 100 micrometers).
• the system 100 may apply laser output from the first laser device 105 along the entire length of the beam path 140 of the material 130 before applying laser output from the second laser device 110 along the entire length of the beam path 140.
• laser outputs of both the first and second laser devices 105 and 110 occur substantially simultaneously. That is, the application of the output of the second laser device 110 may occur after the application of the output of the first laser device 105.
• a laser beam of the second laser device 110 may follow behind (at a predetermined distance) the laser beam of the first laser device 105, along the beam path 140.
• the system 100 may be utilized to produce finely-shaped products from a stock material.
• a sheet of strengthened glass may be processed to produce a plurality of touchscreen substrates according to the methods described above.
• the touchscreen substrates may have any desired geometrical configuration.
• fine details may be fabricated into the touchscreen substrates such as apertures or ports, utilizing the aforementioned processes.
• semiconductor substrates may be processed by the present technology.
• features such as through-silicon vias may be fabricated into the semiconductor substrate with the use of the present technology.
• the system may include a single laser generating and emitting device that can create a variety of laser output.
• the single laser generating and emitting device can produce both short and long pulse duration laser beams.
• the single laser generating and emitting device may also output laser beams that fall within any suitable wavelength.
• both the first and second laser devices 105 and 110 may utilize any one of a number of techniques for laser beam delivery (e.g., propagation toward, or within) a material.
• laser beam delivery techniques include linear and/or non-linear optical propagation, static and/or transient waveguiding effects, optical diffraction, refraction, reflection, filamentation, self -focusing, along with any other techniques/devices for placement of laser energy relative to any of a volume, a plane, a line, or a point that would be known to one of ordinary skill in the art with the present disclosure before them.
• the combined effects of the laser devices disclosed herein may be configured for use in a wide variety of micro-fabrication applications that include, but are not limited to, shaping precious gemstones, semiconductor wafer scribing or singulation, surgical cutting of hard tissue, and marking of indicia such as serial numbers or part numbers inside transparent devices - just to name a few.
• a stock of material 130 is placed upon the platform 125 of the system 100.
• executable instructions may be utilized to selectively vary the operational characteristics of the system 100 to singulate products from a stock material. These instructions may be executed by the processor of a computing system (not shown) such as computing system 600 described with reference to FIG. 6. The computing system may be particularly purposed to control the operation of the system 100 to singulate materials.
• the executable instructions may include laser parameters for the first laser device 105 that are selected based upon the physical properties of the material 130.
• the physical properties of the material 130 may be input by a user or input via data gather from one or more sensors (not shown).
• the beam delivery assembly 115 is selectively adjusted to focus the beam of the first laser device 105 to a particular depth and width relative to the material 130.
• the output of the first laser device 105 is applied along a beam path 140 according to a desired product profile. That is, the beam path 140 approximates an outline of the desired product profile (e.g., rectangular, circular, polygonal, irregular, and so forth).
• Application of the output of the first laser device 105 causes a modification 145 of the material properties of the material 130 along the beam path 140.
• the laser parameters for the second laser 110 are selectively adjusted, again, based upon the physical properties of the material and the modification 145 induced within the material 130.
• the configuration of the beam delivery apparatus 115 is selectively adjusted. For example, the width of the beam of the second laser device 110 is selected such that the beam of the second laser device 110 is directed at portions of the material adjacent to the modification 145, as well as the modification 145 itself.
• Application of the output of the second laser device 110 causes singulation or separation of the product (not shown) from the stock material 130 along at the modification 145 without imparting defects into the edge surfaces of the material 130 (or any other portion of the material 130).
• FIG. 6 illustrates an exemplary computing system 600 that may be used to implement an embodiment of the present technology.
• the system 600 of FIG. 6 may be implemented in the contexts of the likes of computing systems, networks, servers, or combinations thereof.
• the computing system 600 of FIG. 6 includes one or more processors 610 and main memory 620.
• Main memory 620 stores, in part, instructions and data for execution by processor 610.
• Main memory 620 may store the executable code when in operation.
• the system 600 of FIG. 6 further includes a mass storage device 630, portable storage medium drive(s) 640, output devices 650, user input devices 660, a graphics display 670, and peripheral devices 680.
• FIG. 6 The components shown in FIG. 6 are depicted as being connected via a single bus 690.
• the components may be connected through one or more data transport means.
• Processor unit 610 and main memory 620 may be connected via a local microprocessor bus, and the mass storage device 630, peripheral device(s) 680, portable storage device 640, and display system 670 may be connected via one or more input/output (I/O) buses.
• I/O input/output
• Mass storage device 630 which may be implemented with a magnetic disk drive or an optical disk drive, is a non-volatile storage device for storing data and instructions for use by processor unit 610. Mass storage device 630 may store the system software for implementing embodiments of the present technology for purposes of loading that software into main memory 620.
• Portable storage device 640 operates in conjunction with a portable nonvolatile storage medium, such as a floppy disk, compact disk, digital video disc, or USB storage device, to input and output data and code to and from the computer system 600 of FIG. 6.
• a portable nonvolatile storage medium such as a floppy disk, compact disk, digital video disc, or USB storage device
• the system software for implementing embodiments of the present technology may be stored on such a portable medium and input to the computer system 600 via the portable storage device 640.
• Input devices 660 provide a portion of a user interface.
• Input devices 660 may include an alphanumeric keypad, such as a keyboard, for inputting alpha-numeric and other information, or a pointing device, such as a mouse, a trackball, stylus, or cursor direction keys.
• the system 600 as shown in FIG. 6 includes output devices 650. Suitable output devices include speakers, printers, network interfaces, and monitors.
• Display system 670 may include a liquid crystal display (LCD) or other suitable display device.
• Display system 670 receives textual and graphical information, and processes the information for output to the display device.
• LCD liquid crystal display
• Peripherals 680 may include any type of computer support device to add additional functionality to the computer system.
• Peripheral device(s) 680 may include a modem or a router.
• the components provided in the computer system 600 of FIG. 6 are those typically found in computer systems that may be suitable for use with embodiments of the present technology and are intended to represent a broad category of such computer components that are well known in the art.
• the computer system 600 of FIG. 6 may be a personal computer, hand held computing system, telephone, mobile computing system, workstation, server, minicomputer, mainframe computer, or any other computing system.
• the computer may also include different bus configurations, networked platforms, multi-processor platforms, etc.
• Various operating systems may be used including Unix, Linux, Windows, Macintosh OS, Palm OS, Android, iPhone OS and other suitable operating systems.
• Computer-readable storage media refer to any medium or media that participate in providing instructions to a central processing unit (CPU), a processor, a microcontroller, or the like. Such media may take forms including, but not limited to, non-volatile and volatile media such as optical or magnetic disks and dynamic memory, respectively. Common forms of computer-readable storage media include a floppy disk, a flexible disk, a hard disk, magnetic tape, any other magnetic storage medium, a CD-ROM disk, digital video disk (DVD), any other optical storage medium, RAM, PROM, EPROM, a FLASHEPROM, any other memory chip or cartridge.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Mechanical Engineering (AREA)
• Plasma & Fusion (AREA)
• Chemical & Material Sciences (AREA)
• Toxicology (AREA)
• Health & Medical Sciences (AREA)
• Oil, Petroleum & Natural Gas (AREA)
• General Chemical & Material Sciences (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Thermal Sciences (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Laser Beam Processing (AREA)
• Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
• Dicing (AREA)

Priority Applications (6)

Applications Claiming Priority (1)

Publications (1)

Family

ID=47914709

Family Applications (1)

Country Status (6)

Cited By (39)

Families Citing this family (11)

Citations (2)

Family Cites Families (8)

• 2011
  • 2011-09-21 KR KR1020147007315A patent/KR20140075686A/ko not_active Application Discontinuation
  • 2011-09-21 WO PCT/US2011/052659 patent/WO2013043173A1/en active Application Filing
  • 2011-09-21 JP JP2014531770A patent/JP2014534939A/ja active Pending
  • 2011-09-21 CN CN201180073591.XA patent/CN104025251B/zh active Active
  • 2011-09-21 DE DE112011105635.4T patent/DE112011105635T5/de active Pending
• 2015
  • 2015-03-02 HK HK15102113.1A patent/HK1201638A1/xx not_active IP Right Cessation

Patent Citations (2)

Also Published As

Similar Documents

Legal Events