WO2013000420A1 - 一种利用弹簧夹子的晶圆夹持装置 - Google Patents

一种利用弹簧夹子的晶圆夹持装置 Download PDF

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Publication number
WO2013000420A1
WO2013000420A1 PCT/CN2012/077747 CN2012077747W WO2013000420A1 WO 2013000420 A1 WO2013000420 A1 WO 2013000420A1 CN 2012077747 W CN2012077747 W CN 2012077747W WO 2013000420 A1 WO2013000420 A1 WO 2013000420A1
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WIPO (PCT)
Prior art keywords
wafer
tray
edge
slider
spring
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PCT/CN2012/077747
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English (en)
French (fr)
Inventor
杨开明
朱煜
李鑫
汪劲松
尹文生
胡金春
张鸣
徐登峰
穆海华
崔乐卿
余东东
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清华大学
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Application filed by 清华大学 filed Critical 清华大学
Publication of WO2013000420A1 publication Critical patent/WO2013000420A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the invention relates to a wafer clamping device, which is mainly used in a semiconductor wafer processing equipment and belongs to the field of ultra-precision processing. Background technique
  • the wafer transfer device of the patent US2006/0182561A1 is shown in Figs. 10(a) and 10(b).
  • the wafer tray 20 has circular grooves 24, 21a, 22a, 24a, 24b which are circular steps.
  • the bottom surface of the wafer is in contact with the surfaces of the steps 24a, 24b, and 24a, 24b support the wafer.
  • the edge of the wafer is in contact with the side faces of the step 21a and the step 22a, and the movement of the wafer in the horizontal direction is restricted.
  • the device can be used for the transfer of wafers in the semiconductor industry, but this structure has certain disadvantages: 1.
  • the size of the circular groove 24, the steps 21a, 22a, 24a, 24b for fixing the wafer has been fixed, so the device is subjected to
  • the size of the wafer is limited by the size of the wafer. 2
  • the sides of the steps 21a, 22a collide with the edge of the wafer in a rigid contact, which easily breaks the wafer. 3
  • the wafer cannot fall on the steps 24a, 24b, and the wafer will fall off during the transfer.
  • the patent US6276731B1 wafer transfer device is shown in FIG.
  • the wafer carrying area is 2, and a stepped circular groove is formed at the carrying area 2, which is a step 3 and a step 4, respectively.
  • the inner diameter of the step 3 is slightly larger than the wafer, and the height is equal to the thickness of the wafer.
  • the inner diameter of the step 4 is larger than the diameter of the wafer, and the height is equal to the thickness of the wafer.
  • the side of the step is brought into contact with the outer edge of the wafer to limit its horizontal movement for a fixed purpose.
  • the outer edge of the wafer is in contact with the side of the step 3 below the circular groove, and the design has the advantage that even if the wafer is not aligned, it is not aligned (Fig. 1 ib ), the side of the step 4 can also be used to limit its movement, ensuring that the wafer does not slip during transport.
  • this structure has some shortcomings: 1 In the high-speed transmission process, the side of the wafer collides with the rigid side of the step to collide, which is easy to damage the wafer; 2 The size of the step 3 and the step 4 is fixed, so the device is subjected to the wafer diameter. Due to size limitations, only fixed-size wafers can be transferred.
  • the invention designs a wafer clamping device using a spring clip, the purpose of which is to allow the end effector to have a certain positioning error when grasping the wafer, and to reduce the collision degree on the edge of the wafer during the transmission, and avoid The wafer is damaged due to the collision of the tray with the edge of the wafer, and the device is not limited by the diameter of the wafer.
  • a wafer clamping device using a spring clip characterized in that: a sheet V-shaped tray 101 is mounted, and two wafer clips 108 and two convex support blocks 106 are mounted on the top end and the end of the tray, and both ends of the tray end Each has two threaded holes, and the positions of the two wafer clips 108 at the end of the tray can be adjusted in different threaded holes depending on the diameter of the wafer.
  • the upper surface of the raised support block 106 is planar to support the wafer.
  • the wafer clip 108 is composed of a bracket 102, a link 104, a spring 105, and a slider 103.
  • the bracket 102 is cylindrical, is threadedly connected to the sheet V-tray 101, and is rotatable by a certain angle.
  • the slider 103 is provided with a through hole, and can be linearly moved along the connecting rod 104.
  • the side has a sloped portion and a vertical portion. The wafer falls along the inclined portion, and finally the edge thereof is in contact with the vertical portion, so that the wafer 109 is placed on the four sliders.
  • the end of the connecting rod 104 is fixedly connected to the bracket, and the other end supports the slider.
  • the spring 105 is sleeved on the connecting rod 104, one end is fixed to the bracket 102, and the other end is fixed to the slider 103. When the slider 103 moves, the spring 105 is deformed, and a certain pressure is generated on the edge of the wafer 109 through the slider 103 to make the crystal
  • the circle 109 is fixed.
  • the present invention adopts the above technical solution.
  • the wafer 109 is allowed to fall within the range of the inclined portion 103a of the slider 103, so that the end effector is allowed to exist when the wafer 109 is grasped.
  • a certain positioning error The use of elastic elements increases the flexibility of the device and avoids breakage caused by collisions at the edge of the wafer 109 during transport.
  • the position of the end wafer clip can be adjusted so that the device is not limited by the size of the transport wafer diameter.
  • Figure 1 is a top plan view of the wafer transfer apparatus of the patent.
  • Figure 2 is a side view of the wafer transfer apparatus shown in Figure 1.
  • Figure 3 (a) is a partially enlarged plan view of the wafer clip.
  • Figure 3 (b) is a partially enlarged front elevational view of the wafer clip.
  • Figure 4 is a diagram showing the state of instantaneous contact with the edge of the wafer when the wafer is grabbed.
  • Figure 5 is a diagram showing the state of the wafer in the process of transmission.
  • Figure 6 (a) is a plot of wafer clip size versus wafer diameter size.
  • Figure 6 (b) is a plot of wafer clip size versus wafer diameter size.
  • Figure 7 is a perspective view of the wafer clip that can be rotated.
  • Figure 8 is a wafer center diagram through the wafer center.
  • Figure 9 is a diagram of the slider height dimension requirement.
  • Figure 10 is a structural diagram of a wafer transfer apparatus of US2006/0182561A1.
  • Figure 11 is a structural view of a wafer transfer apparatus of the patent US6276731B1.
  • FIG. 1 is a plan view of a wafer chucking apparatus 100 in the present invention.
  • 2 is a side view of the wafer clamping device 100 of FIG. 1.
  • the sheet tray 101 in the wafer holding device 100 has an approximate V shape, and may be Y-shaped or U-shaped.
  • a partial enlarged view of the wafer clip is shown in Figures 3a and 3b.
  • the bracket 102 has a cylindrical shape and is screwed to the tray 101.
  • the wafer clip at the front end of the tray 101 is fixed in position.
  • the slider 103 has a ramp shape at 103a, a bottom portion at the bottom portion 103b for contacting the edge of the wafer 109, and 103c is a through hole for linearly moving the slider 103 along the link 104.
  • the connecting rod 104 has a cylindrical shape, one end of which is fixedly connected to the bracket 102, and the other end supports the slider 103 for linear movement.
  • the spring 105 is sleeved on the connecting rod 104, and one end is fixedly connected to the bracket, and the other end is fixedly connected to the slider 103.
  • Each of the top ends of the tray 101 has a raised support member 106 located adjacent to the wafer clip and adjacent the wafer clip to the inside of the tray 101; there is a projection 106 on each side of the end of the tray 101.
  • 106 is cylindrical, and the top surface 106a is flat and chamfered circumferentially, and may be screwed to the tray 101 or bonded. When the wafer 109 is supported, the top surface 106a contacts the bottom surface of the wafer 109 to support the wafer.
  • the wafer 109 is first brought into contact with the sliders 103a of the four wafer clips.
  • the wafer 109 will move downward under the force of gravity. Since the 103a is inclined, the force component of the gravity of the wafer 109 causes the slider 103 to move linearly along the link 104 toward the holder while compressing the spring 105.
  • the slider 103 moves a certain distance along the link 104, and the wafer 109 falls between the four sliders.
  • the slider surface 103b and the wafer 109 The edge contact limits the horizontal movement of the wafer 109, and the bottom surface of the wafer is in contact with the top surface 106a of the four raised supports 106 and is supported by the four raised members 106.
  • the wafer 109 is sandwiched between the four wafer clips, and the wafer 109 is fixed by a certain clamping force on the wafer 109 due to the deformation of the spring 105.
  • the length of the link 104, the length of the spring 105, and the position of the end wafer clip should be adjusted according to the diameter of the wafer 109 so that the wafer 109 can fall while sliding the wafer 109.
  • the inclined portion 103a of the block 103 is in the range. As shown in Fig. 6 (a) and Fig. 6 (b), assuming that the diameter of the wafer 109 is D, D1 ⁇ D ⁇ D2 should be made. If D ⁇ D1, the edge of the wafer cannot be subjected to pressure, and thus the horizontal movement of the wafer 109 cannot be restricted. If D > D2, the wafer 109 cannot fall between the four clips, and the wafer 109 will be detached during the transfer.
  • the holder 102 of the wafer clip can be rotated a certain angle.
  • the deformation amount of the spring 105 in each clip should be equal, that is, the amount of movement of the slider 103 should be equal, so the angle of the bracket 102 should be adjusted so that the axis of each clip passes through the wafer 109. center.
  • Figure 8 the deformation amount of the spring 105 in each clip should be equal, that is, the amount of movement of the slider 103 should be equal, so the angle of the bracket 102 should be adjusted so that the axis of each clip passes through the wafer 109. center.
  • the distance between the bottom of the slope 103a and the upper surface of the tray 101 is L1
  • the distance between the bottom of the surface 103b and the upper surface of the tray 101 is L2
  • the wafer 109 is supported by the projections 106, the upper surface of the wafer 109
  • the distance from the upper surface of the tray 101 is H1
  • the distance between the lower surface of the wafer 109 and the upper surface of the tray 101 is H2, and the following relationship should be satisfied between the sizes, that is, L1>H1, L2 ⁇ H2 o
  • the slider 103 is fixedly coupled to the spring 105 so that the length of the spring 105 or the stiffness of the spring 105 can be varied.
  • the number of thrusts of the wafer clip fixed wafer 109 is changed to avoid damage to the wafer due to excessive pressure.
  • the wafer 109 when the wafer 109 is lifted, the wafer 109 can be placed within the inclined portion 103a of the slider 103, so that the end effector is allowed when the wafer 109 is grasped. There is a certain positioning error.
  • the use of elastic elements increases the flexibility of the device and avoids wafer breakage caused by collision of the wafer with the edge of the wafer 109 during transport.
  • the position of the two wafer clips at the end can be adjusted so that the device is not limited by the size of the transport wafer diameter.

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  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种利用弹簧夹子的晶圆夹持装置，该装置包括托盘（101）、晶圆夹子（108）和凸起支撑块（106）。晶圆夹子（108）包括支架（102）、连杆（104）、弹簧（105）及滑块（103）。当抓取晶圆（109）时，晶圆（109）边缘与滑块（103）的倾斜部分接触，其重力分力使滑块（103）沿连杆（104）向支架（102）方向移动，并使弹簧压缩，晶圆（109）夹在晶圆夹子（108）中间。晶圆底面与四个凸起支撑块（106）的上表面接触，由凸起支撑块（106）支撑。晶圆边缘与滑块侧面接触，弹簧的变形对晶圆边缘产生一定的压力，夹紧晶圆使晶圆固定。通过改变托盘末端晶圆夹子的位置，可以实现不同直径尺寸晶圆的传输。利用弹簧增加了***的柔性，避免了传输过程中托盘与晶圆边缘刚性接触所引起的晶圆破损。在抓取晶圆时，使晶圆落在滑块的倾斜部分范围内即可满足要求，因此允许末端执行器存在一定的定位误差。

Description

一种利用弹簧夹子的晶圆夹持装置
技术领域
本发明涉及晶圆夹持装置， 主要应用于半导体晶圆加工设备中， 属于超精密加工领域。 背景技术
在半导体制造过程中， 如晶圆的清洗、 抛光等， 在片盒-片盒、 片盒 -腔室之间存在对晶 圆进行的大量传输，因此设计出一种安说全有效的晶圆传输装置是半导体行业研究的热点之一。
专利 US2006/0182561A1的晶圆传输装置如图 10 (a)、 图 10 (b)所示。 晶圆托盘 20具有圆 槽 24， 21a, 22a, 24a, 24b为圆形台阶。 当托盘抓取并传输晶圆时， 晶圆底面与台阶 24a、 24b的表面接触， 24a、 24b对晶圆起到支撑的作用。 晶圆的边缘与台阶 21a、 台阶 22a的侧 面接触， 限制了晶圆水平方向的移动。 该装置可以用书于半导体行业中晶圆的传输， 但这种结 构存在一定的不足： ①用于固定晶圆的圆槽 24、 台阶 21a、 22a, 24a, 24b的尺寸已经固定， 因此该装置受到晶圆直径尺寸的限制， 只能传输尺寸固定的晶圆。 ②高速传输过程中， 台阶 21a, 22a的侧面与晶圆边缘刚性接触发生碰撞， 容易使晶圆破损。 ③在抓取晶圆时， 如果机 械手末端执行器存在定位误差，晶圆不能落在台阶 24a、 24b上，在传输过程中将使晶圆脱落。
专利 US6276731B1晶圆传输装置如图 11所示。 晶圆承载区为 2， 在承载区 2处加工出具 有台阶的圆槽， 分别为台阶 3、 台阶 4。 台阶 3的内径比晶圆稍大， 高度与晶圆厚度相等， 台 阶 4内径比晶圆直径大， 高度与晶圆厚度相等。 利用台阶的侧面与晶圆的外边缘接触限制其 水平运动， 达到固定的目的。 与专利 US2006/0182561A1不同的是， 在该结构中， 晶圆外边缘 是与圆槽下方的台阶 3的侧面接触，这样设计的好处是，即使抓取晶圆时没有对准 (如图 l ib)， 也可以利用台阶 4的侧面限制其运动， 保证了在传输时晶圆不会滑落。 但该结构存在一些不 足： ①是在高速传输过程中， 晶圆侧面与台阶侧面刚性接触发生碰撞， 容易使晶圆破损； ② 台阶 3、 台阶 4的尺寸已经固定， 因此该装置受到晶圆直径尺寸的限制， 只能传输尺寸固定 的晶圆。
发明内容
本发明设计了一种利用弹簧夹子的晶圆夹持装置， 目的在于允许末端执行器在抓取晶圆 时存在一定的定位误差， 并且在传输过程中减小对晶圆边缘的碰撞程度， 避免了由于托盘对 晶圆边缘的碰撞引起的晶圆破损， 同时该装置不受晶圆直径尺寸的限制。
本发明的技术方案如下：
一种利用弹簧夹子的晶圆夹持装置， 其特征在于： 含有一个薄片 V型托盘 101， 托盘顶 端和末端各安装有两个晶圆夹子 108和两个凸起支撑块 106， 托盘末端两侧各有两个螺纹孔， 托盘末端的两个晶圆夹子 108位置可以根据晶圆直径尺寸的不同安装在不同螺纹孔中进行调 整。 凸起支撑块 106上表面为平面， 用以支撑晶圆。 晶圆夹子 108由支架 102、 连杆 104、 弹 簧 105以及滑块 103组成， 支架 102为圆柱形， 与薄片 V型托盘 101为螺纹连接， 并且可以 旋转一定的角度。 滑块 103开有通孔， 可沿连杆 104作直线移动， 侧面有倾斜部分与垂直部 分， 晶圆沿倾斜部分下落， 最终其边缘与垂直部分接触， 使晶圆 109架在四个滑块之间固定。 连杆 104—端与支架固定连接， 另一端支撑滑块。弹簧 105套在连杆 104上， 一端与支架 102 固定， 另一端与滑块 103固定， 当滑块 103移动时， 弹簧 105产生变形， 通过滑块 103对晶 圆 109边缘产生一定压力， 使晶圆 109固定。
本发明采用了以上的技术方案， 当托起晶圆 109时， 只要使晶圆 109落在滑块 103的倾 斜部分 103a范围内即可， 因此在抓取晶圆 109时， 允许末端执行器存在一定的定位误差。采 用弹性元件增加了装置的柔性， 避免了传输过程中对晶圆 109边缘的碰撞引起的破损。 末端 晶圆夹子的位置可以调整， 因此该装置不受传输晶圆直径尺寸的限制。
附图说明
图 1是该专利晶圆传输装置的俯视图。
图 2是图 1所示的晶圆传输装置的侧视图。
图 3 (a)是晶圆夹子局部放大俯视图。
图 3 (b)是晶圆夹子局部放大主视图。
图 4是抓取晶圆时与晶圆边缘瞬时接触状态图。
图 5是传输过程中晶圆固定状态图。
图 6 (a)是晶圆夹子尺寸与晶圆直径尺寸关系图。
图 6 (b)是晶圆夹子尺寸与晶圆直径尺寸关系图。
图 7是晶圆夹子可以旋转一定角度图。
图 8是晶圆夹子轴线通过晶圆中心图。
图 9是滑块高度尺寸要求图。
图 10是专利 US2006/0182561A1的晶圆传输装置结构图。
图 11是专利 US6276731B1的晶圆传输装置结构图。
图中：
101-薄片 V型托盘； 102-支架； 103-滑块； 104-连杆； 105-弹簧； 106-凸起支撑块； 107- 螺纹孔； 108-晶圆夹子； 109-晶圆。
具体实施方式
下面结合附图对本发明实施方式作进一步详细描述。
图 1是该发明中晶圆夹持装置 100的俯视图。图 2是图 1中晶圆夹持装置 100的侧视图。 晶圆夹持装置 100中的薄片托盘 101为近似的 V形， 也可以为 Y形或 U形。 托盘 101前 端处两侧、 末端处两侧各有一个用于夹持晶圆 109的夹子， 晶圆夹子由支架 102、 滑快 103、 连杆 104、 弹簧 105组成。 晶圆夹子局部放大图如图 3a、 3b所示。 支架 102为圆柱状， 与托 盘 101为螺纹连接， 托盘 101前端的晶圆夹子位置固定， 托盘 101末端两侧分别有 2-3个螺 纹孔 107， 根据传输晶圆 109尺寸的不同， 托盘 101末端的两个晶圆夹子可以安放在不同的 螺纹孔 107中以调整位置。 滑块 103的 103a处为斜坡状， 底部 103b处为垂直平面， 用于与 晶圆 109边缘接触， 103c为通孔， 使滑块 103能够沿连杆 104作直线运动。 连杆 104为圆柱 状， 其一端与支架 102固定连接， 另一端支撑滑块 103使其作直线运动。 弹簧 105套在连杆 104上， 一端与支架固定连接， 另一端与滑块 103固定连接。
托盘 101顶端两侧各有一个凸起支撑件 106， 其位置靠近晶圆夹子， 并且相对晶圆夹子 靠近托盘 101的内侧； 在托盘 101末端两侧各有一个凸起 106。 106为圆柱状， 顶面 106a为 平面且圆周进行倒角， 与托盘 101为螺纹连接也可以为粘接。 当支撑晶圆 109时， 顶面 106a 与晶圆 109底面接触以支撑晶圆。
首先当晶圆 109被托盘 101托起时， 如图 4所示， 晶圆 109首先与四个晶圆夹子中的滑 块 103a处接触。 在重力作用下晶圆 109将向下运动， 由于 103a处为倾斜状， 因此晶圆 109 重力的分力使滑块 103沿连杆 104向支架方向直线移动， 同时压縮弹簧 105。
如图 5所示， 当晶圆 109继续向下运动时， 滑块 103沿连杆 104移动了一定距离， 晶圆 109落在四个滑块之间，此时滑块面 103b与晶圆 109边缘接触，限制了晶圆 109的水平运动， 晶圆底面与四个凸起支撑 106的顶面 106a接触， 由四个凸起件 106支撑。 在这样的结构中， 晶圆 109被夹在四个晶圆夹子中间， 由于弹簧 105的变形对晶圆 109产生一定的夹持力， 可 以使晶圆 109固定。
在传输晶圆 109之前， 应根据晶圆 109的直径尺寸对连杆 104长度、 弹簧 105长度以及 末端晶圆夹子的位置进行调整， 使得在抓取晶圆 109时， 晶圆 109能够落在滑块 103的倾斜 部分 103a范围内。如图 6 (a)、图 6 (b)所示，假设晶圆 109直径为 D，应使 D1〈D〈D2。若 D〈D1， 则晶圆边缘不能受到压力作用， 进而不能限制晶圆 109的水平运动。 若 D〉D2， 则晶圆 109不 能落在四个夹子之间， 在传输过程中将使晶圆 109脱落。
如图 7所示， 晶圆夹子的支架 102可以旋转一定角度。 为使晶圆 109受力均匀， 每个夹 子中弹簧 105的变形量应相等， 即滑块 103的移动量应相等， 所以应调整支架 102的角度， 使每个夹子的轴线通过晶圆 109的中心。 如图 8所示。
当晶圆 109下落到凸起支撑件 106表面时，其底面与 106a接触，由四个凸起件 106支撑。 若限制其水平面内的运动， 应使 103a与其边缘接触。 如图 9所示， 设斜坡 103a底部与托盘 101上表面的距离为 Ll， 面 103b的底部与托盘 101上表面距离为 L2， 当晶圆 109被凸起 106 支撑时， 晶圆 109的上表面与托盘 101上表面的距离为 Hl， 晶圆 109的下表面与托盘 101上 表面的距离为 H2， 各尺寸之间应满足以下关系， 即 L1〉H1， L2<H2 o
滑块 103与弹簧 105为固定连接， 因此可以通过改变弹簧 105长度或弹簧 105的刚度系 数来改变晶圆夹子固定晶圆 109的推力， 避免压力过大使晶圆破损。
本发明由于采用了以上的技术方案， 当托起晶圆 109时， 只要使晶圆 109落在滑块 103 的倾斜部分 103a范围内即可，因此在抓取晶圆 109时，允许末端执行器存在一定的定位误差。 采用弹性元件增加了装置的柔性， 避免了传输过程中托盘对晶圆 109边缘的碰撞引起的晶圆 的破损。 末端的两个晶圆夹子位置可以调整， 因此该装置不受传输晶圆直径尺寸的限制。

Claims

权 利 要 求 书
1. 一种利用弹簧夹子的晶圆夹持装置， 其特征在于： 含有一个薄片 V型托盘 （101 )， 托 盘顶端和末端各安装有两个晶圆夹子（108)和两个凸起支撑块（106)， 托盘末端两侧各有两 个螺纹孔， 托盘末端的两个晶圆夹子（108)位置根据晶圆直径尺寸的不同安装在不同螺纹孔 中进行调整； 凸起支撑块（106)上表面为平面，用以支撑晶圆；晶圆夹子（108)由支架（102)、 连杆（104)、弹簧（105)以及滑块（103)组成，支架（102)为圆柱形， 与薄片 V型托盘（101 ) 为螺纹连接， 并且可以旋转一定的角度； 滑块（103) 开有通孔， 沿连杆 （104)作直线移动， 侧面有倾斜部分与垂直部分， 晶圆沿倾斜部分下落， 最终其边缘与垂直部分接触， 使晶圆架 在四个滑块之间固定； 连杆 （104) —端与支架固定连接， 另一端支撑滑块； 弹簧 （105 ) 套 在连杆 （104) 上， 一端与支架 （102 ) 固定， 另一端与滑块 （103) 固定， 当滑块 （103) 移 动时， 弹簧 （105) 产生变形， 通过滑块 （103) 对晶圆边缘产生一定压力， 使晶圆固定。
PCT/CN2012/077747 2011-06-28 2012-06-28 一种利用弹簧夹子的晶圆夹持装置 WO2013000420A1 (zh)

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