WO2012172921A1 - 積層コイル部品 - Google Patents
積層コイル部品 Download PDFInfo
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- WO2012172921A1 WO2012172921A1 PCT/JP2012/062758 JP2012062758W WO2012172921A1 WO 2012172921 A1 WO2012172921 A1 WO 2012172921A1 JP 2012062758 W JP2012062758 W JP 2012062758W WO 2012172921 A1 WO2012172921 A1 WO 2012172921A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
- H01F1/14708—Fe-Ni based alloys
- H01F1/14716—Fe-Ni based alloys in the form of sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/342—Oxides
- H01F1/344—Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3), e.g. magnetite Fe3O4
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F3/14—Constrictions; Gaps, e.g. air-gaps
Definitions
- the present invention relates to a multilayer coil component, and more particularly to a multilayer coil component such as a multilayer inductor having a magnetic body portion made of a ferrite material and a coil conductor mainly composed of Cu.
- This type of laminated coil component has a structure in which a conductor portion wound in a coil shape is embedded in a magnetic body portion, and the conductor portion and the magnetic body portion are usually formed by simultaneous firing.
- Patent Document 1 a laminated chip skeleton is formed by laminated ceramic sheets, a coil conductor is formed in the laminated chip by an internal conductor, and its start and end are connected to different external electrode terminals, respectively.
- a multilayer chip inductor wherein the ceramic sheet is a magnetic sheet and the doughnut-shaped non-magnetic region is included in the multilayer chip so as to include the internal conductor excluding the lead portion to the external electrode terminal.
- a multilayer chip inductor in which is formed has been proposed.
- Patent Document 1 after a magnetic sheet is produced, a nonmagnetic paste is applied on the magnetic sheet to form a nonmagnetic film having a predetermined pattern. Then, the magnetic paste, the internal conductor paste, In addition, a multilayer chip inductor is obtained by sequentially performing a plurality of printing processes using a non-magnetic paste.
- laminated coil components such as laminated inductors form a closed magnetic circuit
- magnetic saturation is likely to occur when a large current is passed through, and the inductance is reduced, making it impossible to obtain desired DC superposition characteristics.
- Patent Document 2 in a laminated coil component having a conductor pattern in which end portions are connected between magnetic layers and overlap and circulate in the laminating direction, the conductor pattern is in contact with the conductor patterns at both ends in the laminating direction and inside the conductor pattern.
- a laminated coil component including a layer of a material having a lower magnetic permeability than the magnetic layer.
- a layer made of a material having a lower magnetic permeability than the magnetic layer (for example, a Ni-Fe ferrite material having a low Ni content or a nonmagnetic material) is provided outside the conductor pattern. This prevents the magnetic flux from concentrating on the inner corner of the conductor pattern at the end and distributes the magnetic flux to the central part of the main magnetic path, thereby preventing the occurrence of magnetic saturation and improving the inductance. Yes.
- Patent Document 3 discloses a conductor for adjusting a sintering regulator for adjusting the sinterability of a magnetic layer in a laminated bead in which a magnetic layer and a conductor pattern are stacked and an impedance element is formed in the element body. Laminated beads mixed in paste have been proposed.
- the sintering adjusting agent is composed of SiO 2 covering silver powder, and SiO 2 is contained in an amount of 0.05 to 0.3 wt% in terms of silver weight.
- a conductor pattern mixed with an agent is printed on the magnetic layer to form a conductor pattern.
- Japanese Utility Model Publication No. 6-45307 (Claim 2, paragraph number [0024], FIG. 2, FIG. 7) Japanese Patent No. 2694757 (Claim 1, FIG. 1 etc.) JP 2006-237438 A (Claim 1, paragraph number [0007])
- Patent Document 1 requires a printing process using a plurality of pastes such as a magnetic paste and a non-magnetic paste, in addition to the internal conductor paste, and the manufacturing process is complicated and practical. Lack of sex. In addition, if the component system is different between the magnetic paste and the non-magnetic paste, residual stress is generated when fired simultaneously due to the difference in shrinkage behavior, and defects such as cracks may occur.
- Patent Document 2 a plurality of magnetic pastes having different compositions or a magnetic paste and a non-magnetic paste must be prepared and printed, and the manufacturing process is complicated as in Patent Document 1. It lacks practicality.
- An object of the present invention is to provide a laminated coil component having good direct current superposition characteristics.
- the present inventors have conducted intensive research using Cu for the conductor portion and Ni—Zn-based ferrite material for the magnetic portion. As a result, Cu and the magnetic portion were reduced in a reducing atmosphere in which Cu was not oxidized.
- Cu diffuses into the ferrite raw material in the vicinity of the conductor portion, whereby the CuO content in the region near the conductor portion (hereinafter referred to as “first region”) is increased. It increased, and it turned out that the sinterability of 1st area
- the inventors have found that the thermal shock resistance and DC superposition characteristics can be improved.
- the first region during firing is preferable. It is necessary to suppress the grain growth of crystal grains.
- the present inventors have made further studies to suppress the grain growth of the crystal grains in the first region at the time of firing, and as a result, the average crystal grain size of the first region is that of the second region.
- the average crystal grain size of the first region is that of the second region.
- the laminated coil component according to the present invention includes a magnetic body portion made of a ferrite material and a conductor portion wound in a coil shape, and the conductor
- the component element body includes a first region in the vicinity of the conductor portion, and a second region other than the first region.
- the average crystal grain size of the magnetic part in the first region is 0.85 or less in terms of grain size ratio with respect to the average crystal grain size of the magnetic part in the second region,
- the said conductor part has Cu as a main component, It is characterized by the above-mentioned.
- the Cu content is suppressed to 6 mol% or less (including 0 mol%) in terms of CuO, and the oxygen partial pressure is reduced to a Cu—Cu 2 O equilibrium oxygen partial pressure or less so that Cu is not oxidized.
- a laminated coil component having a particle size ratio of 0.85 or less can be easily obtained.
- the ferrite material has a Cu content of 6 mol% or less (including 0 mol%) in terms of CuO.
- the grain size ratio in the second region can be easily reduced to 0.85 or less without impairing grain growth in the second region. Therefore, it is possible to obtain a laminated coil component such as a laminated inductor having good thermal shock resistance and direct current superimposition characteristics while securing the properties.
- the content ratio of Cu in the second region with respect to the first region is converted to CuO and is 0.6 or less (including 0) in terms of weight ratio. It was found that the particle size ratio was 0.85 or less, and a difference in sinterability could be produced between the first region and the second region.
- the content ratio of Cu in the second region with respect to the first region is preferably 0.6 or less (including 0) in terms of weight ratio in terms of CuO. .
- the ferrite material contains a Mn component.
- the Sn component in the ferrite material, it is possible to further improve the direct current superposition characteristics.
- the ferrite material contains an Sn component.
- the component element is sintered in an atmosphere having an equilibrium oxygen partial pressure of Cu—Cu 2 O or less.
- the laminated coil component a laminated body having a magnetic body portion made of a ferrite material and a conductor portion wound in a coil shape, the conductor portion being embedded in the magnetic body portion to form a component body.
- the component body is divided into a first region in the vicinity of the conductor portion and a second region other than the first region, and the average crystal of the magnetic body portion in the first region
- the grain size is 0.85 or less in terms of grain size ratio with respect to the average crystal grain size of the magnetic part in the second region, and the conductor part is mainly composed of Cu.
- grain growth at the time of firing is suppressed in this region, the sinterability is lowered, and the magnetic permeability is also lowered in the first region compared with the second region.
- the first region in the vicinity of the conductor portion has a lower sinterability than the second region, and the first region has a lower sintered density, so that the internal stress can be reduced. Even if a thermal shock or external stress is applied due to a reflow process at the time of mounting, fluctuations in magnetic characteristics such as inductance can be suppressed. In addition, since the magnetic permeability is reduced in the first region, the DC superimposition characteristic is improved. As a result, the concentration of magnetic flux is greatly relaxed, and the saturation magnetic flux density can be improved.
- FIG. 1 is a perspective view showing an embodiment (first embodiment) of a laminated inductor as a laminated coil component according to the present invention.
- FIG. 2 is a cross-sectional view (transverse cross-sectional view) taken along line AA in FIG. It is a disassembled perspective view for demonstrating the manufacturing method of the said multilayer inductor. It is a cross-sectional view showing a second embodiment of the multilayer inductor. It is a figure which shows the crystal grain size and the measurement location of a composition in an Example. It is a figure which shows the relationship between the content amount of CuO, and a particle size ratio. It is a figure which shows the relationship between the content amount of CuO in a thermal shock test, and an inductance change rate. It is a figure which shows the relationship between the content molar amount of CuO and an inductance change rate in a direct current
- FIG. 1 is a perspective view showing an embodiment of a multilayer inductor as a multilayer coil component according to the present invention
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- the component body 1 has a magnetic body portion 2 and a coil conductor (conductor portion) 3, and the coil conductor 3 is embedded in the magnetic body portion 2.
- lead electrodes 4a and 4b are formed on both ends of the coil conductor 3
- external electrodes 5a and 5b made of Ag or the like are formed on both ends of the component body 1, and the external electrodes 5a and 5b and the lead electrodes are formed. 4a and 4b are electrically connected.
- the magnetic part 2 is formed of a ferrite material containing as a main component each component of Fe, Ni, Zn, and Cu
- the coil conductor 3 is a conductive material containing Cu as a main component. Is formed.
- the magnetic body portion 2 is divided into a first region 6 that is the vicinity of the coil conductor 3 and a second region 7 other than the first region 6.
- the average crystal grain size D1 of the first region 6 is 0.85 or less with respect to the average crystal grain size D2 of the second region 7.
- the second region 7 has a high sinterability by promoting grain growth during firing, and forms a high-density region having a high sintered density, while the first region 6 has the second The low density area
- the first region 6 has an average crystal grain size smaller than that of the second region 7, grain growth is suppressed during firing, the sinterability is inferior, and the sintering density is lowered. Therefore, even if a thermal shock or external stress is applied, the internal stress can be relaxed, and fluctuations in magnetic characteristics such as inductance can be suppressed.
- the magnetic permeability ⁇ is also reduced, the direct current superimposition characteristics are improved, and thereby the concentration of magnetic flux is greatly relaxed, and magnetic saturation is difficult. Become.
- the grain size ratio D1 / D2 between the average crystal grain size D1 of the first region 6 and the average crystal grain size D2 of the second region 7 exceeds 0.85, the grain size ratio D1 / D2 is 1 or less. Even if the first region 6 and the second region 7 do not have a sufficient difference in sinterability, and the particle size ratio D1 / D2 exceeds 1, the first region 6 is This is not preferable because the grain growth is promoted and the sinterability is improved as compared with the second region 7.
- the molar content of Cu in the magnetic part 2 is 6 mol% (including 0 mol%) or less in terms of CuO, and the oxygen partial pressure at which Cu does not oxidize is the Cu—Cu 2 O equilibrium oxygen partial pressure.
- the particle size ratio D1 / D2 can be easily controlled to 0.85 or less.
- the coil conductor 3 is mainly composed of Cu, it is necessary to perform simultaneous firing with the magnetic part 2 in a reducing atmosphere in which Cu is not oxidized.
- the coil conductor 3 contains Cu as a main component, it is necessary to co-fire with the magnetic body portion 2 in a reducing atmosphere in which Cu is not oxidized. In this case, the content of Cu is increased and CuO is increased. If the amount exceeds 6 mol%, the amount of Cu oxide deposited on the crystal grains becomes excessive, and therefore the grain growth of the crystal grains is suppressed even in the second region 7 and desired low-temperature firing is performed. I can't.
- the coil conductor 3 is formed in the firing process.
- the contained Cu diffuses into the first region 6.
- the content of Cu oxide around the coil conductor 3 increases after firing, and as a result, in the first region 6, the sinterability is reduced, grain growth is suppressed, and the average crystal grain size is reduced. , The sintered density decreases.
- the second region 7 is not affected by Cu diffusion, good sinterability can be maintained.
- the difference in grain size is caused by the difference in sinterability between the first region 6 and the second region 7, and the average crystal grain size D1 of the first region 6 is the average crystal grain size of the second region 7.
- the particle size ratio D1 / D2 can be made 0.85 or less.
- the CuO content x1 in the first region 6 is larger than the content x2 in the second region 7.
- the content weight of the 2nd field 7 to the 1st field 6 The weight ratio x2 / x1 can be controlled to be 0.6 or less, whereby a multilayer inductor having a particle size ratio D1 / D2 of 0.85 or less can be obtained.
- the Cu of the coil conductor 3 diffuses into the first region 6 that is the vicinity region in the firing process.
- the weight content of Cu oxide increases, and as a result, the sinterability decreases in the first region 6 in the magnetic body portion 2.
- the particle size ratio D1 / D2 0.85 or less.
- content of each component which forms main components other than Cu in a ferrite composition ie, content of Fe, Ni, and Zn
- Fe 2 O 3 , NiO, and ZnO are respectively included. In terms of conversion, it is preferably blended so that Fe 2 O 3 is 20 to 48 mol%, ZnO is 6 to 33 mol%, and NiO is the balance.
- a trivalent compound and a divalent compound are blended in equimolar amounts in the stoichiometric composition, but trivalent Fe 2 O 3 is added in a stoichiometric composition. If the amount of NiO, which is a divalent element compound, is excessively present compared to the stoichiometric composition, the reduction of Fe 2 O 3 is inhibited and generation of Fe 3 O 4 is prevented. Reduction resistance can be improved.
- Fe 3 O 4 when it can be expressed by Fe 2 O 3 ⁇ FeO, is a divalent Ni compounds NiO is sufficiently present in excess than the stoichiometric composition, with respect to Fe 2 O 3
- formation of divalent FeO similar to Ni is prevented, and as a result, Fe 2 O 3 is reduced to Fe 3 O 4. Therefore, the state of Fe 2 O 3 can be maintained, the reduction resistance can be improved, and desired insulation can be ensured.
- Mn is preferably converted to Mn 2 O 3 and contained in the range of 1 to 10 mol%.
- Mn 2 O 3 is preferentially reduced, so that sintering can be completed before Fe 2 O 3 is reduced, and the equilibrium oxygen of Cu—Cu 2 O Even if firing in an atmosphere having a partial pressure or less, it is possible to avoid a decrease in the specific resistance ⁇ of the ferrite material and to improve the insulation.
- Mn 2 O 3 becomes a reducing atmosphere at a higher oxygen partial pressure than Fe 2 O 3 . Therefore, at an oxygen partial pressure equal to or lower than the equilibrium oxygen partial pressure of Cu—Cu 2 O, Mn 2 O 3 becomes a strongly reducing atmosphere compared to Fe 2 O 3 , and therefore Mn 2 O 3 is preferentially reduced and burned. The result can be completed.
- Mn 2 O 3 is preferentially reduced as compared with Fe 2 O 3, it is possible to complete the baking process before the Fe 2 O 3 can be reduced to Fe 3 O 4, reduction resistance As a result, it is possible to ensure better insulation.
- Fe oxide, Zn oxide, Ni oxide, and Mn oxide and Cu oxide as required are prepared as a ferrite raw material. These ferrite raw materials are converted into Fe 2 O 3 , ZnO, NiO, Mn 2 O 3 , and CuO.
- Fe 2 O 3 20 to 48 mol%
- ZnO 6 to 33 mol%
- Mn 2 O 3 Weigh so that 1 to 10 mol%
- CuO 6 mol% or less
- NiO remainder.
- these weighed materials are put in a pot mill together with pure water and cobblestones such as PSZ (partially stabilized zirconia) balls, thoroughly mixed and pulverized in a wet manner, evaporated and dried, and then temporarily heated at a temperature of 800 to 900 ° C. for a predetermined time. Bake.
- pure water and cobblestones such as PSZ (partially stabilized zirconia) balls
- these calcined materials are again put into a pot mill together with an organic binder such as polyvinyl butyral, an organic solvent such as ethanol and toluene, and PSZ balls, and sufficiently mixed and pulverized to prepare a slurry.
- an organic binder such as polyvinyl butyral
- an organic solvent such as ethanol and toluene
- PSZ balls PSZ balls
- the slurry is formed into a sheet using a doctor blade method or the like, and magnetic sheets 8a to 8h having a predetermined film thickness are produced.
- via holes are formed at predetermined positions of the magnetic sheets 8b to 8g using a laser processing machine so that the magnetic sheets 8b to 8g can be electrically connected to each other among the magnetic sheets 8a to 8h.
- a conductive paste for coil conductors containing Cu as a main component is prepared. Then, screen printing is performed using the conductive paste, coil patterns 9a to 9f are formed on the magnetic sheets 8b to 8g, and via holes are filled with the conductive paste to produce via hole conductors 10a to 10e. .
- the coil patterns 9a and 9f formed on the magnetic sheet 8b and the magnetic sheet 8g are formed with lead portions 9a 'and 9f' so as to be electrically connected to the external electrodes.
- the magnetic sheets 8b to 8g on which the coil patterns 9a to 9f are formed are laminated, and these are sandwiched between the magnetic sheets 8a and 8h on which the coil pattern is not formed, and are bonded to each other.
- Crimp blocks in which 9a to 9f are connected via via-hole conductors 10a to 10e are produced. Thereafter, the pressure-bonding block is cut into a predetermined size to produce a laminated molded body.
- this laminated molded body was sufficiently degreased at a predetermined temperature in an atmosphere in which Cu in the coil pattern was not oxidized, and then the oxygen partial pressure was controlled by a mixed gas of N 2 —H 2 —H 2 O. It is supplied to a firing furnace and fired at 900 to 1050 ° C. for a predetermined time, whereby the component body 1 in which the coil conductor 3 is embedded in the magnetic body portion 2 is obtained. That is, the firing treatment is performed by setting the firing atmosphere to an oxygen partial pressure equal to or lower than the equilibrium oxygen partial pressure of Cu—Cu 2 O within the range of the firing temperature of 900 to 1050 ° C.
- Cu in the coil patterns 9a to 9f diffuses to the magnetic material sheets 8b to 8g side, so that the magnetic material part 2 has the first region 6 having a low sintered density and the first region 6a.
- the region other than the region 6 is divided into second regions 7 having good sinterability and high sintered density.
- the conductive paste for external electrodes containing conductive powder such as Ag powder, glass frit, varnish, and organic solvent is applied to both ends of the component body 1, dried, and then baked at 750 ° C.
- External electrodes 5a and 5b are formed, whereby a multilayer inductor is manufactured.
- the component body 1 is divided into the first region 6 in the vicinity of the coil conductor 3 and the second region 7 other than the first region 6.
- the average crystal grain size of the magnetic body part 2 in the second region 7 is 0.85 or less with respect to the average crystal grain size of the magnetic body part 2 in the second region 7, and the coil conductor 3 is mainly made of Cu.
- the first region 6 since the first region 6 has a lower sinterability than the second region 7 and the grain growth at the time of firing is suppressed, the first region 6 also has a reduced permeability.
- the first region 6 in the vicinity of the coil conductor 3 has a low sinterability and a low sintering density, so that internal stress can be relaxed, and thermal shock or Even when stress is applied from the outside, fluctuations in magnetic characteristics such as inductance can be suppressed. Further, since the magnetic permeability is reduced in the first region 6, the direct current superimposition characteristic is improved, and as a result, the concentration of magnetic flux is greatly relaxed, and the saturation magnetic flux density can be improved.
- the Cu content 6 mol% or less (including 0 mol%) in terms of CuO grain growth in the second region 7 even when firing in a reducing atmosphere in which Cu is not oxidized. It is possible to easily obtain a laminated coil component such as a laminated inductor having a good thermal shock resistance and a good DC superposition characteristic while ensuring a good insulating property without compromising the particle size. Is possible.
- the content ratio of Cu in the second region 7 with respect to the first region 6 is 0.6 or less (including 0) in terms of a weight ratio in terms of CuO, whereby the particle size ratio D1 / D2 is also 0.85 or less, and desired thermal shock resistance and direct current superposition characteristics can be obtained.
- the component body 1 is sintered in an atmosphere having an equilibrium oxygen partial pressure of Cu—Cu 2 O or less, so that it is simultaneously fired with the magnetic body portion 2 using the coil conductor 1 mainly composed of Cu.
- Cu can be sintered without being oxidized.
- the laminate has a good thermal shock resistance in which magnetic properties such as inductance are suppressed and a good DC superposition property.
- a coil component can be obtained.
- FIG. 4 is a cross-sectional view showing a second embodiment of the laminated coil component according to the present invention.
- a nonmagnetic material layer 11 is provided so as to cross the magnetic path, and the magnetism is opened. It is also preferable to use a path type, and by using the open magnetic path type in this way, it is possible to further improve the direct current superposition characteristics.
- the nonmagnetic layer 11 a material having similar shrinkage behavior during firing, for example, a Zn—Cu ferrite or a Zn ferrite in which Ni in the Ni—Zn—Cu ferrite is completely replaced with Zn is used. Can do.
- the magnetic body portion 2 is formed of a ferrite material containing Fe, Ni, Zn, and Cu as main components, but an appropriate amount of Sn component as a subcomponent (for example, In addition, it is also preferable to contain 1 to 3 parts by weight in terms of SnO 2 with respect to 100 parts by weight of the main component, which can further improve the DC superposition characteristics.
- the firing atmosphere is preferably fired in an atmosphere not exceeding the equilibrium oxygen partial pressure of Cu—Cu 2 O so that Cu as the coil conductor 3 is not oxidized as described above. If the concentration is too low, the specific resistance of the ferrite may decrease. From this viewpoint, it is preferably 1/100 or more of the equilibrium oxygen partial pressure of Cu—Cu 2 O.
- laminated coil component of the present invention has been described, it goes without saying that it can be applied to a laminated composite component such as a laminated LC component.
- Fe 2 O 3 , Mn 2 O 3 , ZnO, NiO and CuO were prepared as ferrite raw materials, and these ceramic raw materials were weighed so as to have the composition shown in Table 1. That is, Fe 2 O 3 : 46.5 mol%, Mn 2 O 3 : 2.5 mol%, ZnO: 30.0 mol%, CuO was varied from 0.0 to 8.0 mol%, and the remainder was adjusted with NiO. .
- the slurry was formed into a sheet shape so as to have a thickness of 25 ⁇ m, and this was punched into a size of 50 mm in length and 50 mm in width to produce a magnetic sheet.
- Cu paste containing Cu powder, varnish, and organic solvent is screen printed on the surface of the magnetic sheet, and the Cu paste Was filled in the via hole, thereby forming a coil pattern and a via hole conductor having a predetermined shape.
- Fe 2 O 3 46.5mol%, Mn 2 O 3: 2.5mol%, ZnO: 51.0mol% and so as to Fe 2 O 3, were weighed Mn 2 O 3 and ZnO, similar to the above method ⁇ After calcining in the procedure, slurry is formed, and then using the doctor blade method, the slurry is formed into a sheet shape so as to have a thickness of 25 ⁇ m, and this is punched into a size of 50 mm in length and 50 mm in width, and nonmagnetic A body sheet was prepared.
- the via hole was filled with Cu paste containing Cu powder, varnish, and organic solvent, thereby forming a via hole conductor.
- the magnetic sheet on which the coil pattern is formed, the nonmagnetic sheet, and the magnetic sheet on which the coil pattern is formed are sequentially laminated. These were sandwiched between magnetic sheets on which no coil patterns were formed, and were pressure-bonded at a temperature of 60 ° C. and a pressure of 100 MPa to produce a pressure-bonding block. And this crimping
- this laminated molded body was heated in a reducing atmosphere so that Cu was not oxidized, and sufficiently degreased. Thereafter, the ceramic laminate was put into a firing furnace in which the oxygen partial pressure was controlled to 1.8 ⁇ 10 ⁇ 1 Pa with a mixed gas of N 2 —H 2 —H 2 O, and 1-5 at a firing temperature of 950 ° C.
- the component bodies of sample numbers 1 to 9 having a nonmagnetic material layer in the substantially central portion and having a coil conductor embedded in the magnetic material portion were produced by maintaining the time and firing.
- the external dimensions of the sample were length L: 2.0 mm, width W: 1.2 mm, thickness T: 1.0 mm, and the number of turns of the coil was adjusted so that the inductance was about 1.0 ⁇ F.
- FIG. 5 is a cross-sectional view showing the locations where CuO content and average crystal grain size are measured.
- the component body 21 of each sample has a non-magnetic layer 22 formed at a substantially central portion and a magnetic body.
- a coil conductor 24 is embedded in the portion 23.
- each coil conductor 24 is set as a measurement position, and at this measurement position, The CuO content and average crystal grain size were determined.
- W ′ corresponding to the center line of the magnetic part 23 having a width W of 1.2 mm is 0.6 mm, and a substantially central part in the thickness direction (X in FIG. 5). And the content weight of CuO and the average crystal grain size at the measurement position were determined.
- the CuO content is determined by breaking 10 samples of sample numbers 1 to 9 and quantitatively analyzing the composition of each magnetic part 23 using the WDX method (wavelength dispersive X-ray analysis method). Then, the content (average value) of CuO in the magnetic part 23 in the first and second regions 25 and 26 was determined.
- WDX method wavelength dispersive X-ray analysis method
- the average crystal grain size of CuO was obtained by breaking the 10 samples, polishing the cross section, further performing chemical etching, and taking SEM photographs at the measurement points described above for each etched sample.
- the grain sizes in the first and second regions 25 and 26 are measured, and in accordance with the JIS standard (R1670), the average crystal grain size is calculated by converting to the equivalent circle diameter, and the average value of 10 data is obtained. It was.
- thermal shock test and a DC superimposition test were conducted, and the inductance before and after each test was measured to determine the rate of change, and the thermal shock resistance and DC superimposition characteristics were evaluated.
- the thermal shock test was repeated 2000 cycles at a predetermined heat cycle in the range of ⁇ 55 ° C. to + 125 ° C. for 50 samples, and the inductance L before and after the test was measured at a measurement frequency of 1 MHz.
- the inductance change rate was obtained.
- the DC superimposition test is based on the JIS standard (C2560-2) for 50 samples, and the inductance L when a DC current of 1A is superimposed on the sample is measured at a measurement frequency of 1 MHz, and the inductance change before and after the test The rate ⁇ L was determined.
- Table 2 shows the measurement results of the samples Nos. 1 to 9.
- Sample Nos. 8 and 9 have large inductance change rate ⁇ L of +20.7 to + 26.4% in the thermal shock test and large inductance change rate ⁇ L of ⁇ 45.5 to ⁇ 52.4% in the DC superposition test. It was found to be inferior in impact properties and direct current superposition characteristics. This is because the molar amount of CuO is as large as 7.0 to 8.0 mol%, so that a heterogeneous phase of CuO is generated in the crystal particles, and the sinterability is lowered. It seems to have been.
- Sample Nos. 1 to 7 have a CuO content of 6.0 mol% or less, a particle size ratio D1 / D2 of 0.85 or less, and a weight ratio x2 / x1 of 0.60 or less.
- the inductance change rate ⁇ L was 15% or less in absolute value
- the inductance change rate ⁇ L was 40% or less in absolute value, and good results were obtained.
- Sample numbers 2 to 6 with a CuO content of 1.0 to 5.0 mol% have a particle size ratio D1 / D2 of 0.6 or less, and the inductance change rate in the thermal shock test is 10% or less in absolute value. It was found that even better results were obtained.
- FIG. 6 is a graph showing the relationship between the molar content of CuO and the particle size ratio, with the horizontal axis indicating the molar content (mol%) and the vertical axis indicating the particle size ratio D1 / D2 ( ⁇ ).
- the particle size ratio D1 / D2 becomes 1.00, whereas the CuO content molar amount is 6.0 mol% or less. It can be seen that the particle size ratio D1 / D2 is 0.85 or less in the range.
- FIG. 7 is a graph showing the relationship between the molar content of CuO and the inductance change rate in the thermal shock test, where the horizontal axis indicates the molar content (mol%) and the vertical axis indicates the inductance change rate ⁇ L (%). .
- the inductance change rate ⁇ L becomes 20% or more, whereas the molar amount of CuO falls within the range of 6.0 mol% or less. It can be seen that the inductance change rate ⁇ L can be suppressed to 15% or less.
- FIG. 8 is a graph showing the relationship between the molar content of CuO and the inductance change rate in the DC superposition test, where the horizontal axis indicates the molar content (mol%) and the vertical axis indicates the inductance change rate ⁇ L (%). .
- the inductance change rate ⁇ L exceeds 45% in absolute value, whereas the molar amount of CuO is 6.0 mol% or less. It can be seen that the inductance change rate ⁇ L can be suppressed to 40% or less in absolute value within the range.
- SnO 2 was prepared as a subcomponent material. Then, Fe 2 O 3: 46.5mol% , Mn 2 O 3: 2.5mol%, ZnO: 30.0mol%, 1.0mol% of CuO, and NiO: were weighed so that 20.0 mol%, Further, SnO 2 was weighed so as to be 0.0 to 3.0 parts by weight with respect to 100 parts by weight of the main component.
- the CuO content weight and the average crystal grain size were measured, and a thermal shock test and a direct current superposition test were performed.
- Table 3 shows the measurement results of the samples Nos. 11 to 14.
- Multilayer coils such as multilayer inductors with good thermal shock resistance and direct current superposition without requiring a complicated process even when the coil conductor is used as a coil conductor and the coil conductor and magnetic part are fired simultaneously Parts can be realized.
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Abstract
Description
そして、これにより第2の領域7は、焼成時に粒成長が促進されて良好な焼結性を有し、焼結密度の高い高密度領域を形成する一方、第1の領域6は、第2の領域7に比べて焼結性に劣り、結晶粒子の粒成長が抑制された焼結密度の低い低密度領域を形成する。
〔磁性体シートの作製〕
フェライト素原料として、Fe2O3、Mn2O3、ZnO、NiO、及びCuOを用意し、表1のような組成となるように、これらセラミック素原料を秤量した。すなわち、Fe2O3:46.5mol%、Mn2O3:2.5mol%、ZnO:30.0mol%とし、CuOを0.0~8.0mol%と異ならせ、残部をNiOで調整した。
Fe2O3:46.5mol%、Mn2O3:2.5mol%、ZnO:51.0mol%となるようにFe2O3、Mn2O3及びZnOを秤量し、上述と同様の方法・手順で仮焼した後、スラリー化し、その後ドクターブレード法を使用し、厚さが25μmとなるようにスラリーをシート状に成形し、これを縦50mm、横50mmの大きさに打ち抜き、非磁性体シートを作製した。
非磁性体シートを略中央部に挟み込むような形態で、コイルパターンの形成された上記磁性体シート、上記非磁性体シート、及びコイルパターンの形成された上記磁性体シートを順次積層し、その後、これらをコイルパターンの形成されていない磁性体シートで挟持し、60℃の温度で100MPaの圧力で圧着し、圧着ブロックを作製した。そして、この圧着ブロックを所定のサイズに切断し、積層成形体を作製した。
試料番号1~9の各試料について、CuOの含有重量及び平均結晶粒径を測定した。
2 磁性体部
3 コイル導体(導体部)
6 第1の領域
7 第2の領域
21 部品素体
23 磁性体部
24 コイル導体(導体部)
25 第1の領域
26 第2の領域
Claims (6)
- フェライト材料からなる磁性体部と、コイル状に巻回された導体部とを有し、該導体部が前記磁性体部に埋設されて部品素体を形成する積層コイル部品において、
前記部品素体は、前記導体部近傍の第1の領域と、該第1の領域以外の第2の領域とに区分され、
前記第1の領域における前記磁性体部の平均結晶粒径は、前記第2の領域における前記磁性体部の平均結晶粒径に対し、粒径比で0.85以下であり、
かつ、前記導体部は、Cuを主成分としていることを特徴とする積層コイル部品。 - 前記フェライト材料は、Cuの含有量が、CuOに換算して6mol%以下(0mol%を含む。)であることを特徴とする請求項1記載の積層コイル部品。
- 前記第1の領域に対する前記第2の領域のCuの含有比率が、CuOに換算して重量比で0.6以下(0を含む。)であることを特徴とする請求項1又は請求項2記載の積層コイル部品。
- 前記フェライト材料は、Mn成分を含有していることを特徴とする請求項1乃至請求項3のいずれかに記載の積層コイル部品。
- 前記フェライト材料は、Sn成分を含有していることを特徴とする請求項1乃至請求項4のいずれかに記載の積層コイル部品。
- 前記部品素体は、Cu-Cu2Oの平衡酸素分圧以下の雰囲気で焼結されてなることを特徴とする請求項1乃至請求項5のいずれかに記載の積層コイル部品。
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CN201280029328.5A CN103597558B (zh) | 2011-06-15 | 2012-05-18 | 层叠线圈部件 |
EP12800256.5A EP2722857B1 (en) | 2011-06-15 | 2012-05-18 | Multilayer coil part |
KR1020137033080A KR101603827B1 (ko) | 2011-06-15 | 2012-05-18 | 적층 코일 부품 |
EP15162012.7A EP2911165B1 (en) | 2011-06-15 | 2012-05-18 | Laminated coil component |
JP2013520485A JP5991494B2 (ja) | 2011-06-15 | 2012-05-18 | 積層コイル部品 |
TW101119088A TWI503851B (zh) | 2011-06-15 | 2012-05-29 | Laminated coil parts |
US14/105,062 US9490060B2 (en) | 2011-06-15 | 2013-12-12 | Laminated coil component |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014165307A (ja) * | 2013-02-25 | 2014-09-08 | Murata Mfg Co Ltd | フェライト磁器組成物、及びセラミック電子部品 |
US20150302970A1 (en) * | 2014-04-17 | 2015-10-22 | Yen-Wei Hsu | Magnetic Core |
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Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6502627B2 (ja) * | 2014-07-29 | 2019-04-17 | 太陽誘電株式会社 | コイル部品及び電子機器 |
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US10147533B2 (en) * | 2015-05-27 | 2018-12-04 | Samsung Electro-Mechanics Co., Ltd. | Inductor |
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JP7021459B2 (ja) * | 2017-05-02 | 2022-02-17 | Tdk株式会社 | インダクタ素子 |
JP6891623B2 (ja) * | 2017-05-02 | 2021-06-18 | Tdk株式会社 | インダクタ素子 |
JP7037294B2 (ja) * | 2017-07-24 | 2022-03-16 | 太陽誘電株式会社 | コイル部品 |
KR102494352B1 (ko) | 2017-10-20 | 2023-02-03 | 삼성전기주식회사 | 코일 전자부품 |
KR102463333B1 (ko) * | 2017-10-24 | 2022-11-04 | 삼성전기주식회사 | 코일 전자 부품 |
CN115148476A (zh) * | 2017-12-23 | 2022-10-04 | 乾坤科技股份有限公司 | 耦合电感器及其制作方法 |
JP7056437B2 (ja) * | 2018-07-25 | 2022-04-19 | 株式会社村田製作所 | コイルアレイ部品 |
JP7238511B2 (ja) * | 2019-03-19 | 2023-03-14 | 株式会社プロテリアル | Ni系フェライトおよびそれを用いたコイル部品 |
JP7226094B2 (ja) * | 2019-05-23 | 2023-02-21 | 株式会社村田製作所 | コイル部品 |
JP7251395B2 (ja) * | 2019-08-05 | 2023-04-04 | 株式会社村田製作所 | 積層コイル部品 |
JP7099434B2 (ja) * | 2019-11-29 | 2022-07-12 | 株式会社村田製作所 | コイル部品 |
US11935678B2 (en) * | 2020-12-10 | 2024-03-19 | GLOBALFOUNDARIES Singapore Pte. Ltd. | Inductive devices and methods of fabricating inductive devices |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05175032A (ja) * | 1991-12-20 | 1993-07-13 | Tdk Corp | Ni−Cu−Zn系フェライト焼結体、それを用いた積層インダクタ、複合積層部品および磁心 |
JPH0645307U (ja) | 1992-11-20 | 1994-06-14 | 太陽誘電株式会社 | 積層チップインダクタ |
JP2694757B2 (ja) | 1989-03-30 | 1997-12-24 | 東光株式会社 | 積層インダクタ |
JP2003272912A (ja) * | 2002-03-15 | 2003-09-26 | Murata Mfg Co Ltd | 酸化物磁性材料、及びそれを用いた積層型電子部品 |
JP2005244183A (ja) * | 2004-01-30 | 2005-09-08 | Toko Inc | 積層型インダクタ及びその製造方法 |
JP2006237438A (ja) | 2005-02-28 | 2006-09-07 | Toko Inc | 積層型ビーズ及びその製造方法 |
JP2010278075A (ja) * | 2009-05-26 | 2010-12-09 | Murata Mfg Co Ltd | 磁性体セラミック、セラミック電子部品、及びセラミック電子部品の製造方法 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3798059A (en) * | 1970-04-20 | 1974-03-19 | Rca Corp | Thick film inductor with ferromagnetic core |
JPH06105646B2 (ja) * | 1986-10-20 | 1994-12-21 | 太陽誘電株式会社 | 積層型インダクタの製造方法 |
JP2832130B2 (ja) * | 1993-03-17 | 1998-12-02 | 太陽誘電株式会社 | セラミックグリーンシートの積層方法 |
JPH07201570A (ja) * | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | 厚膜積層インダクタ |
JP3621300B2 (ja) * | 1999-08-03 | 2005-02-16 | 太陽誘電株式会社 | 電源回路用積層インダクタ |
JP4436509B2 (ja) * | 1999-12-20 | 2010-03-24 | 京セラ株式会社 | 低損失フェライト材料及びこれを用いたフェライトコア |
JP3584439B2 (ja) * | 2000-02-08 | 2004-11-04 | ミネベア株式会社 | Mn−Znフェライトおよびその製造方法 |
JP2001244123A (ja) * | 2000-02-28 | 2001-09-07 | Kawatetsu Mining Co Ltd | 表面実装型平面磁気素子及びその製造方法 |
JP4683718B2 (ja) * | 2000-12-20 | 2011-05-18 | 京セラ株式会社 | フェライト材料及びこれを用いたフェライトコア |
JP3473601B2 (ja) | 2000-12-26 | 2003-12-08 | 株式会社デンソー | プリント基板およびその製造方法 |
JP4576727B2 (ja) * | 2001-02-23 | 2010-11-10 | 株式会社村田製作所 | 酸化物磁性体磁器組成物およびそれを用いたインダクタ部品 |
JP4302904B2 (ja) * | 2001-03-23 | 2009-07-29 | Tdk株式会社 | チョークコイル及び電源トランス |
US6855222B2 (en) * | 2002-06-19 | 2005-02-15 | Murata Manufacturing Co., Ltd. | Method for manufacturing laminated multilayer electronic components |
JP4475965B2 (ja) * | 2004-01-28 | 2010-06-09 | 京セラ株式会社 | コイル内蔵ガラスセラミック基板 |
JP5196704B2 (ja) * | 2004-03-12 | 2013-05-15 | 京セラ株式会社 | フェライト焼結体の製造方法 |
JP4552679B2 (ja) * | 2005-02-08 | 2010-09-29 | Tdk株式会社 | 酸化物磁性材料及び積層型インダクタ |
CN101341646B (zh) * | 2005-10-28 | 2011-06-08 | 日立金属株式会社 | Dc-dc转换器 |
CN101103420B (zh) * | 2005-12-29 | 2011-09-28 | 株式会社村田制作所 | 层叠线圈元件 |
JP4509186B2 (ja) * | 2006-01-31 | 2010-07-21 | 日立金属株式会社 | 積層部品及びこれを用いたモジュール |
EP2031609A4 (en) * | 2006-06-20 | 2012-08-22 | Murata Manufacturing Co | FELT COIL PART |
JP4914448B2 (ja) * | 2007-02-07 | 2012-04-11 | 日立金属株式会社 | 低損失フェライト及びこれを用いた電子部品 |
KR101421455B1 (ko) * | 2007-04-17 | 2014-07-22 | 히타치 긴조쿠 가부시키가이샤 | 저손실 페라이트 및 이것을 사용한 전자 부품 |
JP2009027033A (ja) * | 2007-07-20 | 2009-02-05 | Tdk Corp | 積層型複合電子部品 |
WO2009034824A1 (ja) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | 積層コイル部品およびその製造方法 |
EP2234126B1 (en) * | 2007-12-25 | 2019-09-04 | Hitachi Metals, Ltd. | Multilayer inductor and power converter comprising it |
KR100982639B1 (ko) * | 2008-03-11 | 2010-09-16 | (주)창성 | 연자성 금속분말이 충전된 시트를 이용한 적층형 파워인덕터 |
TW200941515A (en) * | 2008-03-17 | 2009-10-01 | Cyntec Co Ltd | Inductor and method for making thereof |
JPWO2009136661A1 (ja) * | 2008-05-09 | 2011-09-08 | 太陽誘電株式会社 | 積層インダクタおよびその製造方法 |
JP4692574B2 (ja) * | 2008-05-26 | 2011-06-01 | 株式会社村田製作所 | 電子部品及びその製造方法 |
CN106935360B (zh) * | 2008-07-15 | 2020-04-14 | 株式会社村田制作所 | 电子元器件 |
JP5325799B2 (ja) * | 2009-01-22 | 2013-10-23 | 日本碍子株式会社 | 小型インダクタ及び同小型インダクタの製造方法 |
KR101072784B1 (ko) * | 2009-05-01 | 2011-10-14 | (주)창성 | 자성시트를 이용한 적층형 인덕터 및 그 제조방법 |
TWI407462B (zh) * | 2009-05-15 | 2013-09-01 | Cyntec Co Ltd | 電感器及其製作方法 |
-
2012
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2694757B2 (ja) | 1989-03-30 | 1997-12-24 | 東光株式会社 | 積層インダクタ |
JPH05175032A (ja) * | 1991-12-20 | 1993-07-13 | Tdk Corp | Ni−Cu−Zn系フェライト焼結体、それを用いた積層インダクタ、複合積層部品および磁心 |
JPH0645307U (ja) | 1992-11-20 | 1994-06-14 | 太陽誘電株式会社 | 積層チップインダクタ |
JP2003272912A (ja) * | 2002-03-15 | 2003-09-26 | Murata Mfg Co Ltd | 酸化物磁性材料、及びそれを用いた積層型電子部品 |
JP2005244183A (ja) * | 2004-01-30 | 2005-09-08 | Toko Inc | 積層型インダクタ及びその製造方法 |
JP2006237438A (ja) | 2005-02-28 | 2006-09-07 | Toko Inc | 積層型ビーズ及びその製造方法 |
JP2010278075A (ja) * | 2009-05-26 | 2010-12-09 | Murata Mfg Co Ltd | 磁性体セラミック、セラミック電子部品、及びセラミック電子部品の製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014165307A (ja) * | 2013-02-25 | 2014-09-08 | Murata Mfg Co Ltd | フェライト磁器組成物、及びセラミック電子部品 |
US20150302970A1 (en) * | 2014-04-17 | 2015-10-22 | Yen-Wei Hsu | Magnetic Core |
JP2015214434A (ja) * | 2014-05-08 | 2015-12-03 | 株式会社村田製作所 | フェライト磁器、コイル装置およびフェライト磁器の作製方法 |
WO2016098628A1 (ja) * | 2014-12-17 | 2016-06-23 | 株式会社 村田製作所 | 積層セラミック電子部品およびその製造方法 |
JP2021027345A (ja) * | 2019-07-31 | 2021-02-22 | ウルト エレクトロニク アイソス ゲーエムベーハー ウント コンパニー カーゲー | 誘導性部品の製造方法、及び誘導性部品 |
JP7213207B2 (ja) | 2019-07-31 | 2023-01-26 | ウルト エレクトロニク アイソス ゲーエムベーハー ウント コンパニー カーゲー | 誘導性部品の製造方法、及び誘導性部品 |
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CN103597558B (zh) | 2017-05-03 |
CN103597558A (zh) | 2014-02-19 |
TWI503851B (zh) | 2015-10-11 |
US9741484B2 (en) | 2017-08-22 |
EP2911165A1 (en) | 2015-08-26 |
KR101603827B1 (ko) | 2016-03-16 |
US20170025217A1 (en) | 2017-01-26 |
JP2015043459A (ja) | 2015-03-05 |
EP2722857A4 (en) | 2015-07-08 |
US20140097927A1 (en) | 2014-04-10 |
KR20140007959A (ko) | 2014-01-20 |
EP2722857A1 (en) | 2014-04-23 |
TW201310474A (zh) | 2013-03-01 |
US9490060B2 (en) | 2016-11-08 |
JPWO2012172921A1 (ja) | 2015-02-23 |
EP2722857B1 (en) | 2017-09-27 |
JP5991494B2 (ja) | 2016-09-14 |
EP2911165B1 (en) | 2020-02-12 |
JP6222618B2 (ja) | 2017-11-01 |
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