WO2012169864A2 - Capteur tactile - Google Patents

Capteur tactile Download PDF

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Publication number
WO2012169864A2
WO2012169864A2 PCT/KR2012/004604 KR2012004604W WO2012169864A2 WO 2012169864 A2 WO2012169864 A2 WO 2012169864A2 KR 2012004604 W KR2012004604 W KR 2012004604W WO 2012169864 A2 WO2012169864 A2 WO 2012169864A2
Authority
WO
WIPO (PCT)
Prior art keywords
electrode pattern
window decoration
conductive
pattern
touch panel
Prior art date
Application number
PCT/KR2012/004604
Other languages
English (en)
Korean (ko)
Other versions
WO2012169864A3 (fr
Inventor
남동식
박철
Original Assignee
(주)삼원에스티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110056010A external-priority patent/KR101174710B1/ko
Priority claimed from KR1020110056040A external-priority patent/KR101175684B1/ko
Priority claimed from KR1020110099797A external-priority patent/KR101329606B1/ko
Application filed by (주)삼원에스티 filed Critical (주)삼원에스티
Publication of WO2012169864A2 publication Critical patent/WO2012169864A2/fr
Publication of WO2012169864A3 publication Critical patent/WO2012169864A3/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • the present invention relates to a touch panel sensor, and more particularly, to a touch panel sensor for detecting a contact position of an object.
  • FIG. 1 is a perspective view illustrating a conventional capacitive touch panel sensor.
  • the conventional touch panel sensor 1 is bonded to the lower insulating sheet 10 and the upper insulating sheet 20 at predetermined intervals.
  • the lower ITO electrode 30 and the upper ITO electrode 40 are arranged perpendicular to each other.
  • a metal wire 48 extends from the end of the upper ITO electrode 40 to the lower portion of the upper insulating sheet 20.
  • the lower ITO electrode 20 is also electrically connected to the circuit board 50 by a separate metal wire 38.
  • the metal wires 38 and 48 are shiny with metallic luster and may not be visually seen from the upper part of the transparent upper insulating sheet 20 because light does not pass through. Accordingly, in order to prevent the metal wires 38 and 48 and the circuit board 50 from being visible, a non-transmissive window decoration 65 is formed on the bottom of the reinforcing substrate 60 using transparent glass or reinforced plastic, and the reinforcing substrate is formed. 60 is disposed on the upper insulating sheet 20.
  • the thickness of the touch panel sensor 1 is increased by the reinforcing substrate 60, which may reduce the transparency and clarity of the touch panel sensor 1, and reduce the sensitivity of the touch panel sensor.
  • the thickness of the touch panel sensor 1 itself may be increased.
  • the defect occurrence rate may increase during the adhesion process, and may reduce the light transmittance or clarity as a whole.
  • the present invention provides a touch panel sensor that can facilitate the electrical connection structure between a transparent electrode pattern or an opaque electrode pattern and an external device.
  • the present invention provides a touch panel sensor for forming an electrode pattern and a window decoration on the same surface.
  • the present invention provides a touch panel sensor that can be expected to reduce the number of laminated layers of the touch panel sensor, such as the improvement of optical characteristics, reduced defect rate, weight reduction, cost reduction.
  • the present invention provides a touch panel sensor having an electrode pattern structure and a window decoration structure having excellent electrical characteristics.
  • the touch panel sensor for detecting the contact position of the object to be delivered to the external device, the electrode pattern formed on the bottom surface of the insulating substrate, the bottom surface of the insulating substrate of the electrode pattern A window decoration formed to partially cover the end portion and including a conductive material, and a wire member formed on an upper portion of the window decoration to electrically connect each electrode pattern and an external device, the wire member correspondingly up and down;
  • the signal can be exclusively exchanged with the end of the corresponding electrode pattern.
  • a transparent or opaque electrode pattern applied to an insulating substrate is used to detect a contact position of an object, which may be formed in a capacitive method or a resistive film method.
  • the ITO transparent electrode pattern is formed to a thickness of about 0.1 ⁇ m, while the window decoration is formed to a thickness of about 2 ⁇ 3 ⁇ m, it was difficult to form the ITO electrode pattern together on the substrate on which the window decoration is formed.
  • An ITO transparent electrode pattern and window decoration are formed on a separate substrate or on a separate surface.
  • the ITO electrode pattern may be frequently broken or cut off at the boundary of the window decoration.
  • the electrode pattern is first formed on the bottom surface of the insulating substrate, and the window decoration is formed on the bottom surface of the same insulating substrate. Then, again, the wire member is provided on the window decoration.
  • the wire member and the electrode pattern mutually exclusively send and receive signals, specifically looking at one method, first, by using a window decoration having a relatively high resistance but conductive, window decoration is all electrode patterns Since it has a relatively high resistance rather than electrically connecting the wires, it is possible to exclusively connect the terminals of the wire members and the electrode pattern ends corresponding or matched up and down.
  • window decoration is all electrode patterns Since it has a relatively high resistance rather than electrically connecting the wires, it is possible to exclusively connect the terminals of the wire members and the electrode pattern ends corresponding or matched up and down.
  • the term relative is used based on the resistance value generated by the window decoration. This will be described later in more detail.
  • the window decoration is provided with a through area for partially exposing an end portion of the electrode pattern and filled in the through area.
  • a colored conductive layer may be provided that is electrically connected to an end portion of the electrode pattern exposed to the through area while blocking light in the through area.
  • the colored conductive layer may be formed using a conductive material having a relatively lower resistivity than window decoration.
  • the window decoration is made of a component similar to the colored conductive layer and has conductivity, but the window decoration has a higher resistance than the colored conductive layer, and thus does not affect exclusive communication between the wire member and the electrode pattern through the colored conductive layer. You can do that.
  • the colored conductive layer is significantly different from the colored conductive layer disclosed in Patent No. 10-1013037. Specifically, since the colored conductive layer in the patent contains more conductive material than the non-conductive ink for matching the color to match the color of the window decoration, it is difficult to match the color, but in the present invention, the conductive material of the colored conductive layer It is possible to match colors more easily by lowering the specific gravity and increasing the specific gravity of the non-conductive ink. Instead, the colored conductive layer has a large resistance difference from the window decoration, so that electrical connection between the wire member and the electrode pattern is relatively possible.
  • Exclusive in this specification means that the corresponding terminals or electrodes exchange signals between each other, and even if there is some noise, it will be said to include transmitting and receiving (communicate) the signal so that the overall signal transmission.
  • the decor insulation layer is formed between the window decoration and the wire member for electrical separation from the wire member.
  • the decor insulating layer may be formed of an insulating material made of non-conductive ink according to the color implemented in the window decoration, or may be provided by laminating a separate insulating or reflective film or applying an insulating paint.
  • the wire member may be a metal line pattern formed on the window decoration, and they may be manufactured by silk screen, gravure printing, or the like using an existing silver paste, or alternatively, a process through metal deposition and etching. It can be formed by various methods such as nano imprinting and inkjet printing.
  • the wire member may not be directly formed on the window decoration, and may be used to indirectly connect necessary electrical terminals by using a flexible circuit board.
  • the touch panel sensor of the present invention can improve the conductive structure of the touch panel sensor through the use of the window decoration area, and it is possible to form an electrode pattern directly on the bottom surface of the tempered glass substrate or the transparent resin substrate.
  • the window decoration and the electrode pattern may be formed on the same surface, and electrical connection between the electrode pattern and the window decoration may be realized.
  • the transparent electrode pattern may be formed using materials such as ITO, AZO, IZO, and CNT in the central area where the display is located, but the electrode pattern may be formed using a fine metal pattern having a width of 0 to 30 ⁇ m.
  • the touch panel sensor of the present invention can be expected to reduce the number of laminated layers of the touch panel sensor, such as optical characteristics, reduced defect rate, weight reduction, cost reduction.
  • the touch panel sensor of the present invention can provide an electrode pattern structure and a window decoration structure having excellent electrical characteristics.
  • FIG. 1 is an exploded perspective view illustrating a conventional capacitive touch panel sensor.
  • FIG. 2 is an exploded perspective view of a touch panel sensor according to an exemplary embodiment of the present invention.
  • FIG. 3 is a partially exploded perspective view illustrating a connection relationship between an electrode pattern and a wire member in the touch panel sensor of FIG. 2.
  • FIG. 4 is a cross-sectional view illustrating the formation of the connection relationship of FIG. 3.
  • FIG. 5 is a partially exploded perspective view illustrating a connection relationship between an electrode pattern and a wire member in a touch panel sensor according to another exemplary embodiment of the present invention.
  • FIG. 6 is an exploded cross-sectional view illustrating the formation of the connection relationship of FIG. 5.
  • FIG. 7 is a bottom view illustrating a touch panel sensor according to another exemplary embodiment of the present invention.
  • FIG. 8 is a partially enlarged perspective view illustrating the transparent connection pattern of FIG. 7.
  • FIG. 9 is an exploded perspective view for explaining a top sheet structure of a touch panel sensor according to another embodiment of the present invention.
  • FIG. 10 is a bottom perspective view illustrating a connection relationship between the electrode pattern and the wire member of FIG. 9.
  • FIG. 11 is a cross-sectional view illustrating the formation of a connection relationship between the electrode pattern and the wire member of FIG. 9.
  • FIG. 13 is an exploded perspective view illustrating a top sheet structure of a touch panel sensor according to another exemplary embodiment of the present disclosure.
  • FIG. 14 is a cross-sectional view illustrating the formation of a connection relationship between the electrode pattern and the wire member of FIG. 13.
  • 15 is a bottom view illustrating a touch panel sensor according to another embodiment of the present invention.
  • FIG. 16 is a partially enlarged perspective view illustrating the electrode connection structure of FIG. 15.
  • FIG. 17 is a cross-sectional view illustrating the electrode connection structure of FIG. 15.
  • FIG. 18 is a partially exploded perspective view of a touch panel sensor according to another embodiment of the present invention.
  • 19 to 26 are views for explaining a manufacturing method of the upper sheet of the touch panel sensor according to another embodiment according to the present invention.
  • 27 to 32 are views for explaining a manufacturing method of the upper sheet of the touch panel sensor according to another embodiment according to the present invention.
  • FIG. 2 is an exploded perspective view of a touch panel sensor according to an embodiment of the present invention
  • FIG. 3 is an exploded perspective view for explaining the upper sheet structure of FIG. 2
  • FIG. 4 is a connection relationship between the electrode pattern and the wire member of FIG. 3. It is sectional drawing for demonstrating formation.
  • the touch panel sensor 100 includes an upper sheet 110, a lower sheet 130, and an optical adhesive layer 150.
  • the upper sheet 110 includes an upper insulating substrate 111 and an upper electrode pattern 112, and the lower sheet 130 includes a lower insulating substrate 131 and a lower transparent electrode pattern 132.
  • the upper insulating substrate 111 is a material having a high surface strength and may be manufactured using a glass material or other plastic material that transmits light such as glass material and has excellent surface strength, and likewise, the upper electrode in the lower sheet 130
  • the lower insulating substrate 131 on which the lower transparent electrode pattern 132 interacting with the pattern 112 is disposed may also be made of the same material as the upper insulating substrate 111.
  • the upper insulating substrate may be formed using a plastic film.
  • the plastic film when used as the insulating substrate, the insulating substrate may be provided as a plate-like film or a roll-type film, and the electrode pattern may be formed on the insulating substrate by a method such as gravure printing or film laminating.
  • the upper insulating substrate 111 may be made of plastic such as polyethylene, polypropylene, acryl, and polyethylene terephthalate (PET) through which light passes, such as glass or glass. It can be manufactured, and is not limited to the material of the insulating substrate.
  • the upper electrode pattern 112 is indium tin oxide (ITO) or indium zinc oxide (IZO), al-doped tin oxide (ATO), al-doped zinc oxide (AZO), and carbon nanotube (CNT) having both transparency and conductivity. ) And the like. Since the upper electrode pattern 112 is formed of a transparent conductive material from the outside, it is not visible from the outside, and the organic light emitting diode and liquid crystal display device disposed under the touch panel sensor. ) And an image of a display such as a plasma display panel can be exposed.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • ATO al-doped tin oxide
  • AZO al-doped zinc oxide
  • CNT carbon nanotube
  • the upper electrode pattern 112 may use an opaque conductive material.
  • an opaque conductive material such as gold, silver, aluminum, alloys thereof, and the like having a resistance coefficient smaller than that of ITO and IZO can be used.
  • an opaque conductive material when an opaque conductive material is used as the material of the electrode pattern, it should be provided thin enough to expose the image of the display. Specifically, when the width of the electrode pattern formed of a metal material is greater than 0 and 30 ⁇ m or less, it may not be visually confirmed. Recently, it is possible to thin the thickness of the pattern to several nm through nanoimprinting fixing or the like.
  • the upper sheet is provided with a central region C in which the upper electrode pattern 112 and the transparent window are formed, and the window decoration region D is formed in the peripheral region around the central region.
  • An upper electrode pattern 112 and a lower transparent electrode pattern 132 are formed on the bottom surface of the upper insulating substrate 111 and the upper surface of the lower insulating substrate 131 so as to interact with each other and sense the approach of the object. .
  • An optical adhesive layer may be provided between the upper sheet 110 and the lower sheet 130 to bond the two sheets to each other.
  • the optical adhesive layer 150 may be provided in the form of an OCA film, and may be provided in a state covered with a protective film. As will be described later, if the position of the object can be detected only by the electrode pattern of the bottom of the upper sheet 110, it is possible to provide only the protective film or the protective layer on the bottom of the upper sheet without the adhesive bond layer or the lower sheet.
  • the optical adhesive layer 150 may be made of a non-conductive material, and the upper electrode pattern 112 and the lower transparent electrode pattern 132 may be physically bonded and electrically separated by the optical adhesive layer 150.
  • the optical adhesive layer 150 is bonded to the upper sheet 110 and the lower sheet 130 by using an optical adhesive film or an optically clear adhesive (OCA) film, and the light is transmitted well, and is excellent optically.
  • OCA optically clear adhesive
  • An upper electrode pattern 112 may be formed on the insulating substrate 111, and a window decoration 120 may be provided thereon.
  • the window decoration 120 may provide, for example, a mixture of carbon powder and non-conductive black ink at about 20:80 to express in black, and has a thickness of about 2 to 3 ⁇ m by various methods such as silk screen and gravure printing. It can be formed as.
  • the above window decoration may be provided by mixing a conductive material such as carbon powder and a non-conductive ink such as black ink, and may adjust the overall resistance by using a composition between the conductive material and the non-conductive ink.
  • a decor insulating layer formed of 100% nonconductive black ink may be formed over the window decoration.
  • the decor insulating layer may include a through hole formed corresponding to the end position of the electrode pattern, and the through hole may be formed at a position adjusted so that the end of the electrode pattern and the wire member end coincide with each other.
  • the through hole may be provided in the form of a hole or a groove at the position.
  • such a decoration insulating layer is omitted, and even in this case, the wire member and the upper electrode pattern 112 disposed with the window decoration therebetween correspond to the upper electrode pattern vertically corresponding to the conductive window decoration. You can send and receive signals exclusively with the end of the.
  • the window decoration 120 may mix carbon or the like to implement black, but in some cases, non-conductive inks of different colors may be mixed to implement other colors other than black.
  • Various conductive materials such as ATO, ITO, PEDOT, metal powder, carbon fiber, nanosilver and the like may be used.
  • the window decoration 120 may be provided in various ways in addition to mixing the conductive material and the non-conductive ink. For example, it may be formed using a high resistance thin film formed of a material having a high resistance coefficient, and the material having a high resistance coefficient may be formed of an oxide such as black chromium oxide in a thin film form, and may be formed of a conductive polymer or conductive material such as polyaniline or phthalocyanine. Some organic substances may be formed in a thin film form.
  • the upper electrode pattern 112 may be connected to the flexible circuit board 160 through a wire pattern 170 formed on the bottom surface of the window decoration 120.
  • the window decoration 120 corresponds to a peripheral area and functions to visually block the wire pattern 170 formed of silver paste or the like.
  • the window decoration 120 has a relatively high resistance, and based on FIG. 4, the wire pattern 170 disposed at the center of the window decoration ( 120 is interposed therebetween and can be exclusively communicated between the electrode pattern 112b and the wire pattern 170 spaced apart by about 2 to 3 ⁇ m, but other electrode patterns (200 ⁇ m or more separated from the periphery) Normal communication with 112a, 112c is not possible.
  • the ratio of the carbon powder or ink mentioned in the present embodiment may mean weight%.
  • the specific resistance of the conductive paint may be about 1 billion times higher than that of aluminum. If the high-resistance conductive ink is used in an area of about 1 mm x 1 mm and a thickness of about 4 ⁇ m, the resistance in the vertical direction is about 40 ⁇ , which is lower than that of the actual ITO transparent electrode.
  • the resistance in the lateral direction is about 2.5M ⁇ , which is 60,000 times than the vertical resistance of about 40 ⁇ The above resistance value comes out.
  • the wire patterns 170 and the electrode patterns vertically adjacent to each other are formed. While the resistance between the 112b is measured about 10 to 1000 ⁇ , the resistance between the laterally adjacent wire pattern 170 and the peripheral electrode patterns 112a and 112c may be measured between about 10M ⁇ to 100M ⁇ or more than 100M ⁇ . .
  • the wire pattern 170 and the upper electrode pattern 112 may be electrically connected to each other through the conductive window decoration 120.
  • the upper electrode pattern is formed in a single line shape, but in some cases, a plurality of straight lines, curved lines, and wave-shaped lines are formed in parallel to each other to form a group, and among the ends of the grouped parallel lines.
  • One may be provided in electrical connection.
  • FIG. 5 is a partially exploded perspective view illustrating a connection relationship between an electrode pattern and a wire member in a touch panel sensor according to another exemplary embodiment of the present disclosure
  • FIG. 6 is an exploded cross-sectional view illustrating the formation of the connection relationship of FIG. 5.
  • the upper sheet 210 of the touch panel sensor includes an upper insulating substrate 211 and an upper electrode pattern 212.
  • a deco insulating layer 225 formed of 100% non-conductive black ink is further formed on the window decoration 220, so that an electrical signal transmitted to the wire pattern 270 to the window decoration 220 which is provided as conductive is formed. Deco insulating layer 225 can prevent the transfer.
  • the decor insulating layer 225 may include a through hole 227 formed corresponding to the end position of the upper electrode pattern 212, and the through hole 227 may be an end portion of the upper electrode pattern 212. And the end portion of the wire pattern 270 may be formed at a position adjusted to coincide with each other up and down.
  • the through hole 227 may be provided in the form of a hole or a groove at the position.
  • a separate through hole 227 is provided in the deco insulation layer 225 disposed between the window decoration 220 and the wire pattern 270 so that the wire pattern 270 and the upper portion corresponding to each other up and down are provided.
  • the upper electrode pattern 212 and the wire pattern 270 disposed substantially up and down may only sandwich the window decoration 220. In this state, the upper electrode pattern 212 and the wire pattern 270 corresponding to each other up and down in this state are able to exchange signals exclusively with each other as in the previous embodiment.
  • FIG. 7 is a bottom view illustrating a touch panel sensor according to another exemplary embodiment of the present invention
  • FIG. 8 is a partially enlarged perspective view illustrating the transparent connection pattern of FIG. 7.
  • the optical adhesive layer is not shown in FIGS. 7 and 8, and as described above, the transparent coating layer may be formed using an optical adhesive layer, a UV transparent hardener, or the like.
  • the touch panel sensor according to the present embodiment includes an insulating substrate 310, a first transparent electrode pattern 320 and a second transparent electrode pattern 330 formed on the insulating substrate 310.
  • the insulating pattern 340 is interposed between the first transparent electrode pattern 320 and the second transparent electrode pattern 330.
  • the insulating substrate 310 may be formed of a synthetic resin film such as transparent PET, PC, PE, or tempered glass substrate.
  • the first transparent electrode pattern 320 and the second transparent electrode pattern 330 are formed on the bottom surface of the insulating substrate 310.
  • the first transparent electrode pattern 320 may be formed using a transparent conductive material, and is provided by a series of line patterns arranged side by side in a horizontal or vertical direction on the insulating substrate 310.
  • the line pattern for the first transparent electrode pattern 320 includes an extension part 322 and a bridge part 324 provided in a line along one direction.
  • the expansion part 322 and the bridge part 324 are formed alternately and arranged in a line, it may be formed by the same or different transparent conductive material.
  • the extension 322 is formed relatively or significantly wider than the bridge 324, and the bridge 324 is formed between the extensions 322 to electrically connect the series of extensions 322. There is a number.
  • the shape of the extension part 322 and the bridge part 324 may be formed as a continuous rectangle as a motif, as shown, the shape may be a variety of shapes, such as rhombus, circle or oval.
  • the extension part 322 and the bridge part 324 may be formed on the same material and the same surface together with the transparent connection part 336 for the second transparent electrode pattern 330, and are spaced apart from each other with a minimum width. It can be chosen to be in harmony.
  • the second transparent electrode pattern 330 is formed to form a stacked structure with the first transparent electrode pattern 320.
  • the second transparent electrode pattern 330 may be formed above or below the first transparent electrode pattern 320, and is formed to be electrically separated from the first transparent electrode pattern 320.
  • an insulating pattern 340 may be formed between the first transparent electrode pattern 320 and the second transparent electrode pattern 330.
  • the insulating pattern 340 may be generally formed using a material such as SiO 2 , Si 3 N 4, or TiO 2 forming an insulating thin film.
  • the second transparent electrode pattern 330 includes a transparent connector 336. As illustrated in FIG. 8, the transparent connector 336 may be formed at the same time as the first transparent electrode pattern 320.
  • the transparent connection part 336 may also be formed of a transparent conductive material having a width of about 0.1 mm to 0.2 mm, and the expansion part 322 and the bridge part after etching the ITO layer formed on the insulating substrate 310 through a photolithography process. 324 can be formed together.
  • the second transparent electrode pattern 330 may further include a low resistance line 334 in addition to the transparent connection portion 336.
  • the low resistance line 334 may be formed on the insulating pattern 340, and is formed to electrically connect the entire series of transparent connectors 336 while passing through the surfaces of the plurality of transparent connectors 336.
  • the low resistance line 334 is formed using a metal material such as gold, silver, aluminum, chromium, etc., and has a lower resistance than the transparent electrode pattern.
  • the low resistance line may be formed simultaneously with the wire pattern 370 to be described later.
  • These metal patterns may be formed by forming a metal thin film layer in a single layer or a multilayer on the insulating substrate 310 on which the electrode patterns 320 and 330 are formed, and by etching according to a predetermined low resistance line 334 and a wire pattern 370.
  • a predetermined low resistance line 334 and a wire pattern 370 There is a number.
  • the low resistance line is provided as an upper surface of the second transparent electrode pattern, but in some cases, may be provided on at least one side of the upper surface or the bottom surface of the electrode pattern.
  • the low resistance line 334 is not transparent and may optically block the display, but may be formed to have a width of about 30 ⁇ m or less, preferably 3 ⁇ m or less, and the fine pattern of the width may not be visible to the naked eye. .
  • the metal various materials such as aluminum, copper, gold, silver, nickel, and chromium may be used.
  • ⁇ significantly lower for aluminum resistivity ( ⁇ ) is approximately 2.82 * 10- 6 ⁇ cm. If it is assumed that such an aluminum low resistance line 334 is formed with a width of about 1 ⁇ m, a height of 0.1 ⁇ m, and a length of about 10 cm, then the resistance can be calculated as follows.
  • the resistance of the ITO electrode pattern can be calculated. Since the sheet resistance of ITO is basically 2 to 300 ⁇ / square and is currently technically 150 ⁇ / square, the resistance of the ITO electrode pattern can be calculated as follows.
  • the line of aluminum has a significantly lower resistance than the ITO pattern of the same length. Similar example, since the case of chromium (Cr), the specific resistance is approximately 1.27 * 10- 5 ⁇ cm, from about 12.7k ⁇ under conditions, such as aluminum, it can be seen that significantly less than the ITO electrode patterns.
  • Cr chromium
  • both ends of the first transparent electrode pattern 320 may be formed to partially overlap the window decoration 350, the wire pattern 370 through the through hole 357 of the decor insulating layer 355 in the overlapped portion ) Is electrically connected.
  • the low resistance line 334 formed on the second transparent electrode pattern 330 may be directly connected to the wire pattern 370 without distinction, and the connection between the low resistance line 334 and the wire pattern 370 may be smoothly performed.
  • the transparent connection pattern 380 may be formed using conductive or nonconductive transparent ink.
  • the wire pattern 370 constituting the wire member is formed on the decor insulation layer 355, but in some cases it is not directly formed on the decor insulation layer 355, but indirectly through a flexible circuit board. Can be formed.
  • An end portion of the wire pattern 370 may be provided with a connection portion 374 having a relatively large area, and through the connection portion 374, the wire pattern 370 may be connected to another flexible circuit board or other electrical circuit for connection with an external device. It can be connected to the connection terminal.
  • Two electrode patterns may be formed on the bottom surface of one tempered glass substrate using the first and second transparent electrode patterns 320 and 330, and there is no need to overlap separate electrode sheets.
  • all of the electrode patterns may be formed on one surface, and a blocking layer coated with a grounded sheet or a conductive material may be further formed on the bottom surface.
  • an insulating layer 355 having a through hole 357 formed on the window decoration 350 is provided, and the electrode pattern 320 and the wire pattern 370 are vertically aligned at the position of the through hole 357. You can do it.
  • the electrode pattern 320 and the wire pattern 370 are not directly in contact with each other, only the terminals that are vertically connected to each other through the conductive window decoration 350 may be connected exclusively.
  • the through hole 357 may be provided in the form of a closed hole or a groove having one side open at the position.
  • the decoration layer 355 is further provided on the window decoration 350 in the present embodiment, it is also possible to omit the decoration layer as in the previous embodiment.
  • FIG. 9 is an exploded perspective view illustrating a top sheet structure of a touch panel sensor according to another exemplary embodiment of the present invention.
  • FIG. 10 is a bottom perspective view illustrating a connection relationship between an electrode pattern and a wire member of FIG. 9.
  • 11 is a cross-sectional view for explaining the formation of a connection relationship between the electrode pattern and the wire member of FIG. 9.
  • the touch panel sensor of the present embodiment may include an upper sheet 410, a lower sheet, and an optical adhesive layer.
  • the upper sheet 410 is different from the previous embodiment. It will be described with reference to, the description of the other components can refer to the previous embodiment.
  • the upper sheet 410 includes an upper insulating substrate 411 and an upper electrode pattern 412. 9, an upper electrode pattern 412 is formed on an insulating substrate 411, and a window decoration 420 may be provided on the upper substrate.
  • the window decoration 420 may be provided by various methods described above.
  • the window decoration 420 may be provided as a first conductive paint in which carbon powder and non-conductive black ink are mixed at about 8:92 to express black. It may be formed to a thickness of 2 ⁇ 3 ⁇ m.
  • the window decoration and the colored conductive layer may be mixed with carbon to realize black, but in some cases, non-conductive inks of different colors may be mixed for implementing other colors than black, and carbon may be used as the conductive material.
  • ATO Various conductive materials such as ITO, PEDOT, metal powder, carbon fiber, nanosilver and the like may be used.
  • a through area 422 may be formed in the window decoration 420 corresponding to the end of the electrode pattern 412.
  • the through area 422 may be formed through an etching process after forming the window decoration 420, but may be formed at a time in a printing process such as gravure printing, silk screen, inkjet, or pad printing.
  • An end portion of the upper electrode pattern 412 and an end portion of the wire member may be formed to be adjusted up and down through the through region 422, and the colored conductive layer 440 may be formed to correspond to the position of the through region 422. Can be formed.
  • the colored conductive layer 440 may use a second conductive paint obtained by mixing carbon powder such as window decoration and non-conductive black ink at about 20:80.
  • the through region 422 of the present embodiment may be provided in one open groove, for example, a U-shaped groove shape instead of a hole shape, and the through region 422 'having a U-shaped groove shape is shown in FIG. See 12.
  • both the first and second conductive paints have a higher ratio of the nonconductive black ink than the carbon powder, they can be recognized as the same color in appearance. However, since the resistance coefficient of the second conductive paint is relatively small, only the terminals disposed above and below the wire pattern 470 and the upper electrode pattern 412 can normally communicate with each other.
  • the first conductive paint for the window decoration 420 and the second conductive paint for the colored conductive layer 440 are provided by mixing the conductive material and the non-conductive ink, but the composition ratio of the conductive material mixed with the first conductive paint When the ratio is smaller than the composition ratio of the conductive material mixed in the second conductive paint, exclusive signal transmission may be performed between the wire pattern 470 and the upper electrode pattern 412 corresponding to each other up and down.
  • the upper electrode pattern 412 may be connected to the flexible circuit board through the wire pattern 470 formed on the bottom surface of the window decoration 420.
  • the window decoration 420 corresponds to a peripheral area and functions to visually block the wire pattern 470 on which silver paste or the like is formed.
  • the conductive material composition ratio of the second conductive paint is preferably larger than the conductive material composition ratio of the first conductive paint, and is preferably maintained at about 25% or less while keeping the ratio of the conductive material smaller than that of the non-conductive ink.
  • the composition ratio of the conductive material in the first conductive paint is preferably mixed at about 10% or less while being smaller than the composition ratio of the conductive material of the second conductive paint.
  • the specific resistance of the conductive paint may be about 1 billion times higher than that of aluminum. If the high-resistance conductive ink is used in an area of about 1 mm x 1 mm and a thickness of about 4 ⁇ m, the resistance in the vertical direction is about 40 ⁇ , which is lower than that of the actual ITO transparent electrode.
  • the resistance in the lateral direction is about 2.5M ⁇ , which is 60,000 times than the vertical resistance of about 40 ⁇ The above resistance value comes out.
  • the resistance between the wire pattern and the electrode pattern is about 10 to 1000 ⁇ .
  • the resistance between the laterally adjacent electrodes can be measured between 10 M ⁇ and 100 M ⁇ or more than 100 M ⁇ .
  • the composition of the conductive material is about 10% or less in the window decoration around the colored conductive layer, the lateral resistance due to the window decoration is almost 100,000 to 1 million times compared to the vertical resistance of the colored conductive layer. The difference can be more than this.
  • the window decoration 420 is conductive, including a conductive material
  • the composition of the carbon powder is significantly smaller than that of the non-conductive black ink, which substantially affects the communication between the wire pattern 470 and the electrode pattern 412. can not do it.
  • the window decoration 420 is formed to a thickness of about 2 to 3 ⁇ m, and the colored conductive layer 440 is also formed to a thickness of several micrometers, exclusive communication through the colored conductive layer 440 is possible. At this time, it can be said that other electrode patterns are separated by 200 ⁇ m or more through the window decoration 420.
  • FIG. 13 is an exploded perspective view illustrating a top sheet structure of a touch panel sensor according to another exemplary embodiment of the present invention
  • FIG. 14 is a cross-sectional view illustrating a connection relationship between the electrode pattern and the wire member of FIG. 13.
  • the touch panel sensor of the present embodiment may include an upper sheet 510, a lower sheet, and an optical adhesive layer.
  • the upper sheet 510 is different from the previous embodiment.
  • the decor insulation layer 525 will be described in detail, and other components can be referred to the foregoing embodiment.
  • the upper sheet 510 includes an upper insulating substrate 511 and an upper electrode pattern 512, and the upper electrode pattern 512 has indium tin oxide (ITO) or indium zinc oxide (IZO), which are both light-transmitting and conductive, It may be prepared using ATO (Al-doped Tin Oxide), AZO (Al-doped Zinc Oxide), carbon nanotubes (CNT) and the like. In some cases, the upper electrode pattern 512 may use an opaque conductive material.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • the upper electrode pattern 512 may use an opaque conductive material.
  • An upper electrode pattern 512 is formed on the insulating substrate 511, and a window decoration 520 and a decor insulating layer 525 may be sequentially provided on the insulating substrate 511.
  • the window decoration 520 may be provided as a first conductive paint in which carbon powder and non-conductive black ink are mixed at about 8:92 in order to be expressed in black.
  • the window decoration 520 may be provided in various ways such as silk screen and gravure printing. It may be formed to a thickness of ⁇ 3 ⁇ m.
  • a decoration layer 525 formed of 100% non-conductive black ink may be formed on the window decoration 520.
  • a first through region 522 may be formed in the window decoration 520 corresponding to an end of the upper electrode pattern 512, and a second through region 527 may be formed in the decor insulating layer 525 thereon. Can be.
  • the first and second through regions 522 and 527 may be formed at one time through an etching process after forming the window decoration 520 and the insulating layer 525, but may include gravure printing, silk screen, ink jet, pad printing, or the like. It may be formed at one time in the printing process.
  • the first and second through regions 522 and 527 may be formed at positions adjusted so that the end of the upper electrode pattern 512 and the end of the wire member are vertically aligned with each other.
  • the colored conductive layer 540 may be formed through 527.
  • the colored conductive layer 540 may use a second conductive paint in which carbon powder such as window decoration and non-conductive black ink are mixed at about 20:80.
  • the colored conductive layer 540 of the present embodiment is significantly different from the colored conductive layer disclosed in Korean Patent No. 10-1013037. Specifically, since the colored conductive layer in the patent contains more conductive material than the non-conductive ink for matching the color to match the color of the window decoration, it is difficult to match the color, but in the present invention, the conductive material of the colored conductive layer By lowering the specific gravity and increasing the specific gravity of the non-conductive ink, it is easier to match colors. Instead, the colored conductive layer 540 has a large resistance difference from the window decoration 520, so that the electrical connection between the wire member and the electrode pattern is relatively possible.
  • both the first and second conductive paints can be recognized as the same color in appearance.
  • the resistance coefficient of the second conductive paint is relatively small, only the terminals disposed above and below the wire pattern 570 and the electrode pattern 512 may normally communicate normally.
  • the upper electrode pattern 512 may be connected to the flexible circuit board through a wire pattern 570 formed on the bottom surface of the window decoration 520.
  • the window decoration 520 corresponds to a peripheral area and functions to visually block the wire pattern 570 on which silver paste or the like is formed.
  • the conductive material composition ratio of the second conductive paint is preferably larger than the conductive material composition ratio of the first conductive paint, and is preferably maintained at about 25% or less while keeping the ratio of the conductive material smaller than that of the non-conductive ink.
  • the composition ratio of the conductive material in the first conductive paint is preferably mixed at about 10% or less while being smaller than the composition ratio of the conductive material of the second conductive paint.
  • the specific resistance of the conductive paint may be about 1 billion times higher than that of aluminum. If the high-resistance conductive ink is used in an area of about 1 mm x 1 mm and a thickness of about 4 ⁇ m, the resistance in the vertical direction is about 40 ⁇ , which is lower than that of the actual ITO transparent electrode.
  • the resistance in the lateral direction is about 2.5M ⁇ , which is 60,000 times than the vertical resistance of about 40 ⁇ The above resistance value comes out.
  • the resistance between the wire pattern and the electrode pattern is measured about 10 to 1000 ⁇ , and the colored conductive layer
  • the resistance between the laterally adjacent electrodes can be measured between 10M ⁇ and 100M ⁇ or more than 100M ⁇ .
  • the composition of the conductive material is about 10% or less in the window decoration around the colored conductive layer, the lateral resistance due to the window decoration is almost 100,000 to 1 million times compared to the vertical resistance of the colored conductive layer. The difference can be more than this.
  • the window decoration 520 is conductive, including a conductive material
  • the composition of the carbon powder is significantly smaller than that of the non-conductive black ink, which substantially affects the communication between the wire pattern 570 and the electrode pattern 512. can not do it.
  • the window decoration 520 is formed to a thickness of about 2 to 3 ⁇ m, and the colored conductive layer 540 is also formed to a thickness of several micrometers, exclusive communication through the colored conductive layer 540 is possible. At this time, it can be said that other electrode patterns are separated by 200 ⁇ m or more through the window decoration 520.
  • the wire pattern 570 and the electrode pattern 512 may be electrically connected through the colored conductive layer 540.
  • the decor insulating layer 525 is formed on the upper surface of the window decoration 520, it is possible to prevent the signal of the electrode pattern is energized with each other outside the designated position by the wire pattern 570.
  • FIG. 15 is a bottom view illustrating a touch panel sensor according to another exemplary embodiment of the present invention
  • FIG. 16 is a partially enlarged perspective view illustrating the electrode connection structure of FIG. 15,
  • FIG. 17 is an electrode connection structure of FIG. 15. It is sectional drawing for demonstrating.
  • the optical adhesive layer, the protective layer, and the film are not shown.
  • the transparent coating layer may be formed using an optical adhesive layer, a UV transparent hardener, or the like.
  • the touch panel sensor according to the present embodiment may include an insulating substrate 810, a first transparent electrode pattern 820 and a second transparent electrode pattern 830 formed on the insulating substrate 810.
  • the insulating pattern 835 is interposed between the first transparent electrode pattern 820 and the second transparent electrode pattern 830.
  • the insulating substrate 810 may be formed of a synthetic resin film such as transparent PET, PC, PE, or tempered glass substrate.
  • the first transparent electrode pattern 820 and the second transparent electrode pattern 830 are formed on the bottom surface of the insulating substrate 810.
  • the first transparent electrode pattern 820 may be formed using a transparent conductive material, and is provided by a series of line patterns arranged side by side in the horizontal or vertical direction on the insulating substrate 810.
  • the line pattern for the first transparent electrode pattern 820 includes an extension part 822 and a bridge part 824 provided in a line along one direction.
  • the extension part 822 and the bridge part 824 are alternately formed and arranged in a row, and may be formed of the same or different transparent conductive materials.
  • the extension 822 is formed relatively or significantly wider than the bridge portion 824, and the bridge portion 824 is formed between the extension portions 822 to electrically connect the series of extension portions 822. There is a number.
  • the shape of the extension part 822 and the bridge part 824 may be formed as a continuous rectangle as a motif, as shown, the shape may be a variety of shapes, such as rhombus, circle or oval.
  • the extension part 822 and the bridge part 824 may be formed on the same material and the same surface together with the transparent connection part 836 for the second transparent electrode pattern 830, and may be spaced apart from each other with a minimum width. It can be chosen to be in harmony.
  • the second transparent electrode pattern 830 is formed to form a stacked structure with the first transparent electrode pattern 820.
  • the second transparent electrode pattern 830 may be formed above or below the first transparent electrode pattern 820 and is electrically separated from the first transparent electrode pattern 820.
  • an insulating pattern 835 may be formed between the first transparent electrode pattern 820 and the second transparent electrode pattern 830.
  • the insulating pattern 835 may be generally formed using a material such as SiO 2, Si 3 N 4, or TiO 2 forming an insulating thin film.
  • the second transparent electrode pattern 830 includes a transparent connector 836. As illustrated in FIG. 6, the transparent connector 836 may be formed at the same time as the first transparent electrode pattern 820.
  • the transparent connection part 836 may also be formed of a transparent conductive material having a width of about 0.1 mm to 0.2 mm. After the ITO layer formed on the insulating substrate 810 is etched through a photolithography process, the expansion part 822 and the bridge part 824 can be formed together.
  • the second transparent electrode pattern 830 may further include a low resistance line 834 in addition to the transparent connector 836.
  • the low resistance line 834 may be formed on the insulating pattern 835, and may be formed to electrically connect the entire series of transparent connectors 836 while passing through the surfaces of the plurality of transparent connectors 836.
  • the low resistance line 834 may be formed using a metal material such as gold, silver, aluminum, or chromium, and may be simultaneously formed with the wire pattern 870 to be described later.
  • These metal patterns may be formed by forming a metal thin film layer in a single layer or a multi-layer on the insulating substrate 810 on which the electrode patterns 820 and 830 are formed, and by etching according to a predetermined low resistance line 834 and wire pattern 870. There is a number. In this case, after deposition or sputtering, it may be formed through a patterning process such as nanoimprinting, or may be simply formed through a process such as inkjet printing.
  • the low resistance line 834 may not be transparent and may optically block the display, but may be formed to a width of about 30 ⁇ m or less, preferably 3 ⁇ m or less, and the fine pattern of the width may be invisible to the naked eye. .
  • the metal various materials such as aluminum, copper, gold, silver, nickel, and chromium may be used.
  • ⁇ significantly lower for aluminum resistivity ( ⁇ ) is approximately 2.82 * 10- 6 ⁇ cm. If it is assumed that such an aluminum low resistance line 834 is formed with a width of about 1 ⁇ m, a height of 0.1 ⁇ m, and a length of about 10 cm, then the resistance can be calculated as follows.
  • the resistance of the ITO electrode pattern can be calculated. Since the sheet resistance of ITO is basically 2 to 300 ⁇ / square and is currently technically 150 ⁇ / square, the resistance of the ITO electrode pattern can be calculated as follows.
  • the line of aluminum has a significantly lower resistance than the ITO pattern of the same length. Similar example, since the case of chromium (Cr), the specific resistance is approximately 1.27 * 10- 5 ⁇ cm, from about 12.7k ⁇ under conditions, such as aluminum, it can be seen that significantly less than the ITO electrode patterns.
  • Cr chromium
  • both ends of the first transparent electrode pattern 820 may be formed to partially overlap the window decoration 850, and the second through region 882 and the first through portion of the decor insulation layer 880 may overlap at the overlapped portion.
  • the regions are formed to coincide with each other up and down.
  • the second through region is formed in a circular shape, and the first through region corresponding to the colored conductive layer 840 is formed in a quadrangle larger than the second through region 882.
  • a decoration layer 880 is formed in the first through area of the window decoration 850 and includes a second through area 882 over the window decoration 850 and the coloring conductive layer 840. This can be formed.
  • the window decoration 850 may be provided as a first conductive paint in which carbon powder and non-conductive black ink are mixed at about 10:90 to express in black, and may be about 2 to 3 ⁇ m by various methods such as silk screen and gravure printing. It may be formed to a thickness of.
  • a deco insulating layer 880 formed of 100% nonconductive black ink may be formed on the window decoration 850.
  • the colored conductive layer 840 may use a second conductive paint in which carbon powder such as window decoration and non-conductive black ink are mixed at about 20:80, but the same conductive material and the same ink are not necessarily used.
  • the wire pattern 870 and the first transparent electrode pattern 820 are electrically connected through the colored conductive layer 840.
  • the low resistance line 834 formed on the second transparent electrode pattern 830 may be directly connected to the wire pattern 870 without distinction, and the connection between the low resistance line 834 and the wire pattern 870 may be smoothly performed.
  • the transparent connection pattern 890 may be formed using conductive or nonconductive transparent ink.
  • the colored conductive layer 840 is formed.
  • the second transparent connection pattern 830 and an external device can be connected to each other.
  • the wire pattern 870 constituting the wire member is formed on the window decoration 850, but in some cases it is not formed directly on the window decoration 850, but indirectly formed through a flexible circuit board, etc. Can be.
  • connection 874 having a relatively large area, and through the connection 874, the wire pattern 870 may be connected to another flexible circuit board or other electrical circuit for connection with an external device. It can be connected to the connection terminal.
  • Two electrode patterns may be formed on the bottom of one tempered glass substrate using the first and second transparent electrode patterns 820 and 830, and there is no need to overlap separate electrode sheets.
  • all of the electrode patterns may be formed on one surface, and a blocking layer coated with a grounded sheet or a conductive material may be further formed on the bottom surface.
  • an insulating layer 880 having a second through region 882 is formed on the window decoration 850, and the colored conductive layer 840 is disposed at positions of the first through region and the second through region 882.
  • the electrode patterns 820 and 830 and the wire pattern 870 may be matched with each other. Although the electrode pattern 820 and the wire pattern 870 are not directly in contact with each other, only the terminals that are vertically connected to each other through the colored conductive layer 840 may be connected exclusively.
  • FIG. 19 is a partially exploded perspective view of a touch panel sensor according to another exemplary embodiment of the present invention, and the electrode patterns of the foregoing embodiments are provided in a single line shape, but in this embodiment, they may be provided in a grouped parallel line shape. Can be. Description of other components of the touch panel sensor according to the present embodiment may refer to the foregoing embodiment, and in this embodiment, the electrode pattern part provided in a grouped parallel line shape that is different from the previous embodiment will be focused. Explain.
  • the upper sheet 910 of the touch panel sensor includes an upper insulating substrate 911 and a plurality of upper transparent electrode patterns 912 disposed at uniform intervals.
  • the upper and lower ends of the plurality of (eg, three) upper transparent electrode patterns 912 are connected to form one electrode group 924. In some cases, it may be electrically connected to at least one point either at the top or the bottom, or in the middle.
  • the upper transparent electrode patterns 912 adjacent to each other may be grouped to induce a change in capacitance that is further activated.
  • Each electrode group 924 is partially exposed through the through area 922 of the window decoration 920, and the colored conductive layer 940 is disposed in the through area 922.
  • the colored conductive layer 940 exposed through the through region 922 may be electrically connected to a terminal of an external flexible circuit board through a wire member that may be disposed along the bottom of the window decoration.
  • the electrode layer 612 for the upper electrode pattern is transparent to the entire upper surface of the upper insulating substrate 610 by using a transparent material such as ITO or IZO. Form over.
  • the electrode layer 612 is patterned to form an upper electrode pattern having a desired pattern.
  • the upper electrode pattern includes a first transparent electrode pattern 620 and a second transparent electrode pattern 630.
  • the first transparent electrode pattern 620 may be provided by a series of line patterns arranged side by side in the horizontal or vertical direction on the upper insulating substrate 610.
  • the first transparent electrode pattern 620 The line pattern for) includes an extension 622 and a bridge 624 provided in a line along the transverse direction.
  • the extension part 622 and the bridge part 624 may be alternately formed and arranged in a line.
  • the extension 622 is formed relatively or significantly wider than the bridge portion 624, and the bridge portion 624 is formed between the extension portions 622 to electrically connect the series of extension portions 622. There is a number.
  • the extension part 622 may be formed of a continuous diamond as a motif, but the shape of the extension part 622 may be various shapes such as a rhombus, a circle, or an oval.
  • the second transparent electrode pattern 630 is formed on the upper insulating substrate 610 like the first transparent electrode pattern 620 and is electrically separated from the first transparent electrode pattern 620.
  • the second transparent electrode pattern 630 includes a transparent connection part 636 disposed between the extension parts 622 of the first transparent electrode pattern 620.
  • the first transparent electrode pattern 620 and the second transparent electrode pattern 630 may be formed together with the electrode layer 612 formed on the insulating substrate 610 through a photolithography process.
  • an insulating layer 614 is formed on the entire bottom surface of the upper insulating substrate 610 on which the first transparent electrode pattern 620 and the second transparent electrode pattern 630 are formed.
  • the insulating layer 614 may be formed using a material such as SiO 2 , Si 3 N 4, or TiO 2 .
  • the extension parts 622 of the first transparent electrode pattern 620 are electrically connected to each other by the bridge part 624, but the transparent connection part 636 of the second transparent electrode pattern 630 is provided.
  • the transparent connecting portions 636 disposed vertically between the extension portions 622 should be electrically connected to each other.
  • a first exposure hole 615 may be formed through the photolithography process in which each of the transparent connectors 636 may be partially exposed.
  • the second exposure in order to electrically connect with the wire pattern 670 that is later placed on the window decoration 650 corresponding to the portion of the first and second transparent electrode patterns 620 and 630 disposed on the edge of the insulating substrate.
  • the ball 616 may be formed.
  • the wire pattern 670 is processed in white, but this is to distinguish it from window decoration, but does not mean an empty space.
  • connection line 617 is formed on the insulating layer 614 as a whole, and the metal layer 617 is patterned as shown in FIG. 24 through a photolithography process to connect the connection lines. 634 is formed.
  • the connection line since the connection line may be visible from the outside, it is preferable that the width thereof is 30 ⁇ m or less so as not to be visible, and in fact, it is formed to about 3 ⁇ m so as not to be visible at all.
  • a separate connection terminal may be formed together at the second exposed hole position, but it is preferable that the connection line 634 may be exposed from the outside. Therefore, the colored conductive layer is directly laid on the second exposed hole.
  • connection line 634 may electrically connect the transparent connecting portions 636 adjacent to each other exposed by the first exposure hole 616 of the insulating layer 614.
  • a through area 652 is formed corresponding to the position of the second exposed hole 616.
  • the end of the electrode pattern is exposed to the through area.
  • the colored conductive layer 640 described above may be formed in the through region 652.
  • a wire pattern 670 is formed over the colored conductive layer 640, as shown in FIG.
  • the colors of the colored conductive layer 640 and the window decoration 650 are slightly different from each other in the drawing, this is a selection for distinguishing the colored conductive layer and the window decoration from the drawing. It is provided in a similar color.
  • the through areas 652 are formed in the window decoration 650 and the colored conductive layer 640 is filled in such a manner that the ends of the first and second transparent electrode patterns 620 and 630 are colored.
  • the window decoration may have a relatively high resistance to enable exclusive communication between the wire pattern 670 and the ends of the first and second transparent electrode patterns disposed vertically with the window decoration 620 interposed therebetween. have.
  • the window decoration is conductive, it is not necessary to form an insulating layer between the window decoration and the wire member for electrical separation from the wire member. desirable.
  • the upper electrode pattern includes a first transparent electrode pattern 720 and a second transparent electrode pattern 730.
  • the line pattern for the first transparent electrode pattern 720 includes an extension part 722 and a bridge part 724 provided in a line along the horizontal direction.
  • the extension part 722 and the bridge part 724 may be alternately formed and arranged in a row.
  • the bridge portion 724 may be formed between the extension portions 722 to electrically connect the series of extension portions 722.
  • the second transparent electrode pattern 730 is formed on the upper insulating substrate 710 similarly to the first transparent electrode pattern 720, and is electrically separated from the first transparent electrode pattern 720.
  • the second transparent electrode pattern 730 includes a transparent connection part 736 disposed between the extension parts 722 of the first transparent electrode pattern 720.
  • an insulating layer 714 is formed on the entire bottom surface of the upper insulating substrate 710 on which the first transparent electrode pattern 720 and the second transparent electrode pattern 730 are formed.
  • the insulating layer 714 may be formed using a material such as SiO 2 , Si 3 N 4, or TiO 2 .
  • the extension parts 722 of the first transparent electrode pattern 720 are electrically connected to each other by the bridge part 724, but the transparent connection part 736 of the second transparent electrode pattern 730 is provided.
  • the vertically spaced transparent connectors 736 are to be electrically connected to each other.
  • a first exposure hole 715 may be formed through the photolithography process in which each of the transparent connectors 736 may be partially exposed.
  • the second exposure in order to electrically connect with the wire pattern 770 which is later placed on the window decoration 750 corresponding to the portion of the first and second transparent electrode patterns 720 and 730 disposed on the edge of the insulating substrate.
  • the ball 716 can be formed.
  • connection line 734 the low resistance transparent electrode layer 717 may have a sheet resistance smaller than that of the first and second transparent electrode patterns by using transparent ITO or IZO having a relatively lower resistance coefficient than the first and second transparent electrode patterns.
  • the connection line 734 formed by patterning the low resistance transparent electrode layer 717 may easily connect the adjacent transparent connection portions 736 to each other. For example, if the sheet resistance of the first and second transparent electrode patterns is about 150 ohms, the sheet resistance of the low resistance transparent electrode layer may be approximately 10 ohms.
  • the low-resistance transparent electrode layer is made of a transparent material, unlike the connection line 634 using the metal, the low resistance transparent electrode layer is not visible from the outside.
  • connection line 734 a separate connection terminal may be formed together at the position of the second exposed hole 716, but is not formed in this embodiment.
  • the colored conductive layer is placed directly on the second exposed hole.
  • connection line 734 may electrically connect adjacent transparent connectors 736 exposed to the first exposure hole 716 of the insulating layer 714 to each other.
  • the through area 752 is formed corresponding to the position of the second exposure hole 716.
  • the end of the electrode pattern is exposed to the through area.
  • the colored conductive layer 740 described above can be formed in the through region 752.
  • a wire pattern 770 is formed over the colored conductive layer 740, as shown in FIG.
  • the through areas 752 are formed in the window decoration 750, and the colored conductive layer 740 is filled with the edges of the first and second transparent electrode patterns 720 and 730.
  • the decoration may have a relatively high resistance to enable exclusive communication between the wire patterns 770 and the ends of the first and second transparent electrode patterns disposed vertically with the window decoration 720 interposed therebetween. .
  • an insulating layer may be formed between the window decoration and the wire member for electrical separation from the wire member.
  • the touch panel sensor according to the present invention can be widely applied to a display for the purpose of detecting a contact position of an object.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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Abstract

La présente invention se rapporte à un capteur tactile adapté pour détecter un point de contact d'un objet et pour transmettre la position de contact détectée à un dispositif externe. Le capteur tactile selon l'invention comprend : un substrat isolant ; des motifs d'électrodes formés sur la surface inférieure du substrat isolant ; un décor en forme de fenêtre, qui est formé de sorte à couvrir partiellement les extrémités des motifs d'électrodes au niveau de la surface inférieure du substrat isolant, et qui contient des matériaux conducteurs ; et un élément formant fil, qui est formé sur la partie supérieure du décor en forme de fenêtre de sorte à connecter électriquement chaque motif d'électrode au dispositif externe. L'élément formant fil peut simplement transmettre des signaux aux extrémités de motifs d'électrodes verticalement correspondants, et simplement recevoir des signaux en provenance des extrémités de motifs d'électrodes verticalement correspondants. Pour ce faire, l'élément formant fil utilise le fait que la résistance créée par les extrémités des motifs d'électrodes verticalement correspondants est inférieure à la résistance créée par les extrémités d'autres motifs d'électrodes voisins.
PCT/KR2012/004604 2011-06-10 2012-06-11 Capteur tactile WO2012169864A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020110056010A KR101174710B1 (ko) 2011-06-10 2011-06-10 터치패널센서
KR10-2011-0056040 2011-06-10
KR1020110056040A KR101175684B1 (ko) 2011-06-10 2011-06-10 터치패널센서
KR10-2011-0056010 2011-06-10
KR10-2011-0099797 2011-09-30
KR1020110099797A KR101329606B1 (ko) 2011-09-30 2011-09-30 터치패널센서

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WO2012169864A3 WO2012169864A3 (fr) 2013-04-11

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014189204A1 (fr) * 2013-05-23 2014-11-27 동우화인켐 주식회사 Placage de motif transparent d'électrode et panneau d'écran tactile le comportant
WO2015093643A1 (fr) * 2013-12-18 2015-06-25 (주)삼원에스티 Capteur d'écran tactile
US20150199049A1 (en) * 2014-01-13 2015-07-16 Lg Innotek Co., Ltd. Touch window and touch device including the same
TWI559186B (zh) * 2013-12-13 2016-11-21 Ｌｇ化學股份有限公司 觸控感測器及顯示裝置

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