WO2012141171A1 - 切削工具およびその製造方法 - Google Patents
切削工具およびその製造方法 Download PDFInfo
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- WO2012141171A1 WO2012141171A1 PCT/JP2012/059778 JP2012059778W WO2012141171A1 WO 2012141171 A1 WO2012141171 A1 WO 2012141171A1 JP 2012059778 W JP2012059778 W JP 2012059778W WO 2012141171 A1 WO2012141171 A1 WO 2012141171A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
- B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/141—Specially shaped plate-like cutting inserts, i.e. length greater or equal to width, width greater than or equal to thickness
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- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- Y10T407/00—Cutters, for shaping
- Y10T407/26—Cutters, for shaping comprising cutting edge bonded to tool shank
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Definitions
- the present invention relates to a cutting tool used for cutting iron-based materials, liquid crystal light guide plate dies, Fresnel lens dies, or the like, or directly cutting hard and brittle materials such as quartz and optical components. .
- sintered diamond is used as a countermeasure against the above-mentioned cleavage cracks and uneven wear.
- Sintered diamond is obtained by sintering diamond particles using a metal binder such as cobalt, and the metal binder exists between the diamond particles.
- the metal binder part is softer than the diamond particles, it wears out in a short time.
- the diameter of diamond particles is usually 0.5 to 25 ⁇ m, which is larger than the radius of curvature of the cutting edge of 0.1 ⁇ m or less, which is required for ultra-precision machining. As a result, uneven wear similar to that of single crystals occurs, resulting in large fine patterns. It cannot be processed into an area.
- polycrystalline diamond obtained by a CVD method as polycrystalline diamond that does not contain a metal binder.
- this polycrystalline diamond usually has a particle size of 1 ⁇ m or more and a short wear life due to a small interparticle bonding force.
- Finer nanocrystalline diamond (UNCD) with finer particles can be synthesized by pulsed vacuum arc plasma deposition (Non-Patent Document 1), but it contains a lot of hydrogenated amorphous carbon. Therefore, the wear resistance is low.
- a cubic boron nitride (cBN) tool having a hardness next to diamond is known as a tool having a material other than diamond at the cutting edge.
- cBN tools There are several types of cBN tools. For rough machining at low cost, a tool obtained by sintering cBN with a binder can be found in Patent Document 3, for example. However, since precise processing cannot be performed in the presence of a binder, an example using a cBN sintered body without a binder can be found in Patent Document 4 or Non-Patent Document 2. However, since these particles have a large particle size of cBN of 50 to 500 nm, it has been difficult to use them for ultra-precision machining at the optical component level.
- the inventors made a prototype of a groove or V-bite by polishing using the same fine cBN, but since the hardness increased from that of a normal cBN material, fine chipping occurred during polishing, and sufficient precision as a precision tool was obtained. I could't.
- Patent Document 8 describes a method for producing a diamond tool, a cubic boron nitride tool, and the like by entering a focused ion beam (FIB) from a flank and exiting from a rake face.
- FIB focused ion beam
- the present inventors are a conventional polycrystalline diamond that does not contain single crystal diamond or metal binder, or a polycrystalline body that is substantially composed only of high-pressure phase boron nitride, the radius of curvature of the cutting edge tip of the cutting tool and R1, the average particle size of the sintered particles of the high-pressure phase hard particles of the cutting tool and D 50, when the maximum particle diameter is Dmax, the radius of curvature R1, the average particle diameter D 50 It was also found that a cutting tool for ultraprecision machining can obtain stable machining for a long period of time by using a polycrystal having a maximum grain size Dmax satisfying the following relationship. D 50 ⁇ 1.2 ⁇ R1 Dmax ⁇ 2.0 ⁇ R1
- FIG. 10 is a diagram showing the relationship between the radius of curvature R, the average particle diameter D 50 , and the maximum particle diameter Dmax.
- the inventors of the present invention have a cutting tool whose cutting edge is a surface formed by a focused ion beam, and the flank from the flank A near the rake face and the rake face adjacent to the flank A.
- the flank A is processed with a focused ion beam directed from the flank side toward the rake face.
- the present invention is a cutting tool for ultraprecision machining as described below.
- a non-diamond carbon material and / or boron nitride as a starting material which is selected from the group consisting of boron, carbon, and nitrogen directly without adding a sintering aid or a catalyst under ultra high pressure and high temperature.
- the average particle diameter of the sintered particles constituting the polycrystal is 1.2 ⁇ R2 or less, and the maximum particle diameter is The cutting tool according to (1), wherein the cutting tool is 2 ⁇ R2 or less.
- the average particle size of the sintered particles constituting the polycrystalline body is 1.2 ⁇ R3 or less, and the maximum particle size is 2 The cutting tool according to (1) or (2), wherein the cutting tool is not more than R3.
- the curvature radius R1 of the cutting edge tip of the cutting tool is 50 nm or less, the average particle size of the sintered particles constituting the polycrystal is 60 nm or less, and the maximum particle size is 100 nm or less.
- the radius of curvature R2 of the angle between the rake face and the flank face of the cutting tool is 50 nm or less, the average particle size of the sintered particles constituting the polycrystal is 60 nm or less, and the maximum particle size is 100 nm or less.
- the radius of curvature R3 between the two flank faces of the cutting tool is 50 nm or less
- the average particle size of the sintered particles constituting the polycrystal is 60 nm or less
- the maximum particle size is 100 nm or less.
- the cutting edge of the cutting tool is a surface formed by a focused ion beam, the flank A on the side near the rake face, and the flank on the side far from the rake face adjacent to the rake face A
- the average grain size of the polycrystalline body with respect to the curvature radius R1 of the tip of the cutting tool, the curvature radius R2 of the corner sandwiched between the rake face and the flank, and the curvature radius R3 of the corner sandwiched between the two flank faces The cutting tool according to any one of (1) to (10) above, wherein the diameter is 0.01 ⁇ R1 or more, 0.01 ⁇ R2 or more, and 0.01 ⁇ R3 or more.
- the polycrystalline body is made of a non-diamond carbon material as a starting material, and converted and sintered directly to diamond at a very high pressure and high temperature without adding a sintering aid or a catalyst.
- the cutting tool according to any one of (1) to (11) above, wherein the cutting tool is polycrystalline diamond.
- the polycrystal is substantially converted and sintered to high-pressure phase boron nitride using low-pressure phase boron nitride as a starting material at high pressure and high temperature without adding a sintering aid or a catalyst.
- a non-diamond carbon material and / or boron nitride as a starting material is selected from the group consisting of boron, carbon, and nitrogen directly without adding a sintering aid or catalyst under ultrahigh pressure and high temperature
- a manufacturing method of a cutting tool using a polycrystalline body that has been converted and sintered to high-pressure phase hard particles composed of more than one kind of elements Cutting the polycrystalline body into chips with a laser; Bonding the polycrystalline chip to the shank; Polishing the polycrystalline chip to create a rake face and a flank face;
- a method for manufacturing a cutting tool comprising a step of processing a rake face and a flank face with a focused ion beam.
- (16) 1 selected from the group consisting of boron, carbon, and nitrogen, directly starting from a non-diamond carbon material and / or boron nitride, without adding a sintering aid or catalyst under ultrahigh pressure and temperature
- a manufacturing method of a cutting tool using a polycrystalline body that has been converted and sintered to high-pressure phase hard particles composed of more than one kind of elements Cutting the polycrystalline body into chips with a laser; Bonding the polycrystalline chip to the shank; Polishing the polycrystalline chip to create a rake face and a flank face; Forming a mask on the polycrystalline chip; A process of creating a rake face and a flank face by dry etching;
- a method for manufacturing a cutting tool comprising a step of machining a rake face and a flank face with a focused ion beam.
- the cutting tool for ultra-precision machining of the present invention conventional single-crystal diamond, ultra-precise tool using a cBN sintered body, cutting using a diamond sintered body containing a metal binder and vapor-phase synthetic diamond are used. Compared to tools, stable machining can be obtained with high accuracy over a long period of time.
- FIG. 1 It is a figure which shows a mode that a tool is processed with a focused ion beam so that a beam may face from the rake face (Y) side to the flank face (X) side. It is a figure which shows a mode that a tool is processed with a focused ion beam so that a beam may face from a flank (X) side to a rake face (Y) side. It is a figure which shows the V bite which is one aspect
- (A) is the top view which looked at the cutting tool from the scoop surface side
- (b) is the side view which looked at the tool from the right side
- (c) is the front view which looked at the tool from the front end surface.
- the radius of curvature R and the average particle diameter D 50 and is a diagram showing a relationship between the maximum particle diameter Dmax. It is a figure which shows the measurement site
- the cutting tool according to the present invention is made of a non-diamond carbon material and / or boron nitride as a starting material, and consists of boron, carbon, and nitrogen directly under a high pressure and high temperature without adding a sintering aid or a catalyst.
- a polycrystalline body that has been converted and sintered into high-pressure hard particles composed of one or more elements selected from the group is used as a cutting edge.
- the average particle size of the sintered particles constituting the polycrystalline body is 1.2 ⁇ R1 or less, and the maximum particle size is 2 ⁇ R1 or less.
- the high-pressure phase hard particles composed of one or more elements selected from the group consisting of boron, carbon, and nitrogen described herein are diamond, cubic boron nitride, and / or wurtzite boron nitride, or diamond structure. It is BC 2 N that it has.
- the polycrystalline body is converted directly to diamond using a non-diamond type carbon material as a starting material and without the addition of a sintering aid or a catalyst under ultrahigh pressure and high temperature.
- Sintered polycrystalline diamond consisting essentially of diamond, or the polycrystalline body starts with low-pressure phase boron nitride and does not contain any sintering aid or catalyst under ultra-high pressure and high temperature
- the polycrystalline boron nitride is substantially composed only of the high-pressure phase boron nitride, which is directly converted and sintered into the high-pressure phase boron nitride.
- the high-pressure phase boron nitride is preferably cubic boron nitride and / or wurtzite boron nitride.
- High-pressure phase hard particles composed of one or more elements selected from the group consisting of boron, carbon, and nitrogen directly under the ultra-high pressure and high temperature without addition of a sintering aid or a catalyst, such as BC 2 N having a structure
- a cutting tool provided with a polycrystalline body that has been converted and sintered into a cutting edge can be produced in the same manner, and the same effect can be obtained.
- the material for the cutting tool of the present invention which is substantially a diamond single-phase (purity 99% or more) diamond polycrystal that does not contain a metal binder such as cobalt, is made of raw material graphite (graphite), glassy carbon, amorphous carbon.
- the non-diamond type carbon such as can be obtained by converting it directly into diamond without any catalyst or solvent under high pressure and high temperature (temperature 1800 to 2600 ° C., pressure 12 to 25 GPa) and simultaneously sintering it.
- the diamond tool made of polycrystalline diamond thus obtained does not experience uneven wear as seen in a diamond tool using a single crystal.
- Non-Patent Document 3 SEI Technical Review 165 (2004) 68
- Patent Document 9 Japanese Unexamined Patent Publication No. 2007-22888
- Patent Document 10 Japanese Patent No. 4275896
- the non-patent document 3 has abnormally grown grains of about 10 times the average grain size. It is found that the wear of the large particle portion is extremely advanced because of the existence of the coarse diamond converted from the added coarse raw material. In this case, there is a problem that the intended processing cannot be obtained, for example, a scratch is formed on the work material. In particular, if there are particles that greatly exceed the radius of curvature of the target cutting edge, the shape of the cutting edge changes during long-term cutting, and the performance cannot withstand ultraprecision machining.
- the average particle diameter D 50 and the maximum particle size Dmax of sintered particles can be solved by controlling in accordance with the curvature radius R1 of the cutting edge. That is, it is to use a polycrystalline diamond that satisfies D 50 ⁇ 1.2 ⁇ R1 and Dmax ⁇ 2 ⁇ R1 with respect to the curvature radius R1 of the cutting edge of the cutting tool. In addition, it is preferable to use a polycrystal having D 50 ⁇ 1.2 ⁇ R2 and Dmax ⁇ 2 ⁇ R2 with respect to the radius of curvature R2 of the angle between the rake face and the flank face of the cutting tool.
- a polycrystalline body having D 50 ⁇ 1.2 ⁇ R3 and Dmax ⁇ 2 ⁇ R3 with respect to the radius of curvature R3 between the two flank faces of the cutting tool.
- the radius of curvature of the cutting edge of the cutting tool, the angle between the rake face and the flank face, and the angle between the two flank faces are all 50 nm or less, and D 50 ⁇ 60 nm and Dmax ⁇ 100 nm. Desirable for precision machining.
- FIG. 11 shows which part of the tool each of R1, R2 and R3 in the present invention. As shown in FIG.
- R3 The radius of curvature of the corner sandwiched between the first flank B (1XB) between the flank A (1XA) and the second flank (2X). Further, when the flank is divided into the first flank and the second flank, the radius of curvature of the corner sandwiched between the first flank close to the rake face is R3.
- R2 is the radius of curvature of the corner sandwiched between the rake face (Y) and the flank face (X) (first flank face A (1XA in FIG. 11)).
- R1 refers to the radius of curvature of the cutting edge at the tip of the tool.
- polycrystalline diamond is characterized by stronger bonding between particles than in diamond particles. If the cutting edge part of the tool is a single diamond particle, the chipping will occur due to the occurrence of cleavage in the particle. A high tool can be obtained.
- the average particle diameter of the polycrystalline diamond is D 50 ⁇ 0.01 ⁇ R1 and D 50 ⁇ 0.01 ⁇ R2 and D 50 ⁇ 0.01 ⁇ R3 with respect to the curvature radii R1, R2 and R3 of the cutting edge. It is desirable. If the particle size is smaller than this, it is difficult to synthesize polycrystalline diamond that maintains sp3 bonds, and since it actually contains sp2 bonds, it is understood that the wear resistance and fracture resistance are reduced. It was.
- the inventors of the present invention produced a cutting tool for ultra-precise machining that has not been conventionally performed by the following processing.
- the previous roughened surface is used as the second flank (2X), and the first flank (1X) is formed by finish polishing. I was processing.
- high-precision machining is performed from the rake face (Y) to the flank face (X) side (see FIG. 2). ).
- the radius of curvature R2 between the rake face (Y) and the flank face (X) and the radius of curvature R1 of the tip of the cutting edge are slightly rounded. Therefore, finally, the focused ion beam is processed with high accuracy from the escape side (X) to the rake face (Y) (FIG. 3).
- the first FIB-processed surface is the flank B (1XB)
- the last FIB-processed surface is the flank A (1XA).
- the distance (L) between the boundary between the flank A (1XA) and the rake face (Y) and the boundary with the flank B (1XB) is 3 ⁇ m or less.
- the corner R3 sandwiched between the two flank surfaces is rounded, and a highly accurate tool cannot be obtained.
- the polycrystalline diamond used in the cutting tool of the present invention may have conductivity.
- the rough machining of the flank described above can be used not only for conventional polishing but also for less expensive electric discharge machining.
- ultra-precision machining it has been difficult to determine contact between the tool and the work material, but by providing conductivity, accurate contact can be determined by an electrical sensor.
- boron, phosphorus, hydrogen, or the like can be doped.
- a conductive film such as metal may be coated on the surface.
- the present inventors have found that when polishing is performed by machining a rake face or a flank face, fine cracks and the like are generated in the polycrystalline diamond due to the polishing, thereby reducing the strength of the tool. For this reason, after roughing the rake face and flank surface by polishing, a tool with good fracture resistance can be made by adding a process to make the rake face and flank face by dry etching such as reactive ion etching. all right. When dry etching is not performed, it is desirable to increase the amount of processing with a focused ion beam and to cut polycrystalline diamond from the polished surface by at least 5 ⁇ m or more.
- the material for the cutting tool of the present invention which is substantially a single phase of boron nitride (purity 99% or more) and does not contain a metal binder such as cobalt, is a low-pressure phase boron nitride (hexagonal).
- Crystal boron nitride can be obtained by converting it directly into high-pressure phase boron nitride without any catalyst or solvent under high pressure and high temperature (temperature: 1100-2600 ° C., pressure: 12-25 GPa) and simultaneously sintering it. I can do it.
- the high-pressure phase boron nitride described here refers to cubic boron nitride (cBN) and compressed hexagonal boron nitride (wurtzite boron nitride, wBN).
- the boron nitride tool comprising the high-pressure phase boron nitride polycrystal obtained in this way has a small particle size and does not cause chipping or uneven wear.
- Non-Patent Document 4 Machine and Tools March 2010, page 80
- the average particle diameter D 50 and the maximum particle size Dmax of sintered particles can be solved by controlling in accordance with the curvature radius R1 of the cutting edge. That is, it is to use a polycrystal having D 50 ⁇ 1.2 ⁇ R1 and Dmax ⁇ 2 ⁇ R1 with respect to the curvature radius R1 of the tip of the cutting tool. In addition, it is preferable to use a polycrystal having D 50 ⁇ 1.2 ⁇ R 2 or less and D max ⁇ 2 ⁇ R 2 or less with respect to the radius of curvature R2 of the angle between the rake face and the flank face of the cutting tool.
- the cutting tool tip, the angle between the rake face and the flank face, and the radius of curvature of the angle between the two flank faces are all 50 nm or less, and d ⁇ 60 nm and D ⁇ 100 nm. Desirable for processing.
- R1, R2, and R3 in the cutting tool provided with boron nitride in the cutting edge of the present invention are the same as those described in the cutting tool provided with diamond in the cutting edge, as shown in FIG.
- the high-pressure phase boron nitride polycrystal of the present invention is characterized in that the bonds within and between the boron nitride particles are equally strong. If the cutting edge portion of the tool is a single boron nitride particle, defects will occur due to the occurrence of cleaving in the particle. Since the defect stops at the particle interface, a tool with high fracture resistance can be obtained.
- the average particle diameter D 50 of the boron nitride sintered particles constituting the high-pressure phase boron nitride polycrystal is D 50 ⁇ 0.01 ⁇ R1 and D 50 ⁇ 0.01 ⁇ with respect to the radii of curvature R1, R2, and R3.
- R2 and D 50 ⁇ 0.01 ⁇ R3 are desirable. Synthesis of a high-pressure phase boron nitride polycrystal having a particle size smaller than this and maintaining sp3 bonds is practically difficult, and since it actually contains sp2 bonds, wear resistance and fracture resistance are reduced. I knew it would come.
- the cutting tool of the present invention can be manufactured by the above-described processing method described with reference to FIGS.
- the boron nitride polycrystal used in the tool of the present invention may have conductivity. Thereby, contact with a tool and a work material can be correctly determined with an electric sensor.
- a conductive material such as metal can be thinly deposited on the surface.
- the boron nitride cutting tool of the present invention is substantially converted and sintered to high-pressure phase boron nitride directly under high pressure and high temperature without adding a sintering aid or catalyst, starting from low-pressure phase boron nitride. It can be obtained by processing polycrystalline boron nitride consisting only of high-pressure phase boron nitride. Examples of the processing method include the following two processing methods.
- ⁇ Processing method A> A method of sequentially performing the following steps: (1) a step of cutting polycrystalline boron nitride into a chip shape with a laser; (2) a step of bonding the boron nitride tip to a shank; and (3) a rake face by polishing the boron nitride tip.
- Step of creating flank (4) Step of machining the boundary between rake face and flank with focused ion beam ⁇ Machining method B> A method of sequentially performing the following steps: (1) A step of cutting boron nitride into a chip with a laser (2) A step of bonding the boron nitride tip to a shank (3) A rake face and a flank face are made by polishing the boron nitride chip. Step (4) Step of forming a mask on the boron nitride chip (5) Step of creating a rake face or flank by dry etching (6) Step of processing a boundary portion between the rake face and the flank with a focused ion beam
- the BC 2 N polycrystal having substantially no BC 2 N single phase (purity 99% or more) that does not contain a metal binder such as cobalt, which is the material of the cutting tool of the present invention, is a low-pressure phase BC 2 N ( Non-diamond type BC 2 N such as graphite-like BC 2 N) under high pressure and high temperature (temperature 1800-2600 ° C, pressure 12-25 GPa), directly without high-pressure catalyst and solvent, BC 2 N (diamond structure) And can be obtained by sintering at the same time.
- the BC 2 N tool composed of polycrystalline BC 2 N obtained in this way does not experience uneven wear as seen in a BC 2 N tool using a single crystal.
- graphite-like BC 2 N may be synthesized by nitriding boric acid and carbonizing sucrose in carbonized molten urea, or by mixing BCl 3 gas and acetonitrile at a molar ratio of 1: 1.
- a graphite-like BC 2 N film may be deposited on carbon introduced into a reaction tube and heated by high-frequency induction heating.
- the cutting tool of the present invention can be obtained by controlling the average particle diameter D 50 and the maximum particle diameter D max of the sintered particles according to the curvature radius R1 of the cutting edge. That is, a polycrystalline body having D 50 ⁇ 1.2 ⁇ R1 and Dmax ⁇ 2 ⁇ R1 with respect to the curvature radius R1 of the cutting edge tip of the cutting tool is used. In addition, it is preferable to use a polycrystal having D 50 ⁇ 1.2 ⁇ R 2 or less and D max ⁇ 2 ⁇ R 2 or less with respect to the radius of curvature R2 of the angle between the rake face and the flank face of the cutting tool.
- the cutting edge of the cutting tool, the angle between the rake face and the flank face, and the curvature radius of the angle between the two flank faces are all 50 nm or less, and d ⁇ 60 nm and D ⁇ 100 nm for ultra-precision machining. Desirable above.
- R1, R2, and R3 in the cutting tool provided with BC 2 N polycrystal on the cutting edge of the present invention are the same as those described in the cutting tool provided with diamond at the cutting edge, and are shown in FIG. Street.
- a cutting tool for ultra-precise machining that has never existed before is produced by processing the diamond in the same manner as the cutting tool equipped with the cutting edge. it can. That is, the cutting tool of the present invention can be manufactured by the above-described processing method described with reference to FIGS.
- the BC 2 N polycrystal used in the tool of the present invention may have conductivity. Thereby, contact with a tool and a work material can be correctly determined with an electric sensor.
- a conductive material such as metal can be thinly deposited on the surface.
- a graphite fired body was used as the raw material non-diamond carbon. Further, the low-pressure phase (hexagonal) boron nitride particles and the high-pressure phase boron nitride polycrystal of the raw material In the present invention, the graphite particles in the raw material graphite fired body, the diamond sintered particles in the diamond polycrystal, the low-pressure phase (hexagonal) The average particle size (D 50 ) and the maximum particle size (Dmax) of the boron nitride particles and the boron nitride sintered particles in the high-pressure phase boron nitride polycrystal are photographed with a scanning electron microscope at a magnification of 100,000 to 500,000 times.
- the sample surface is finish-polished or CP-processed, and the particle size distribution of crystal grains constituting the sintered body is measured based on a photographed image obtained by photographing the sample with a scanning electron microscope.
- image analysis software for example, ScionImage, manufactured by Scion Corporation
- the extracted particles are binarized to calculate the area (S) of each particle.
- the data analysis software The particle size distribution obtained above (e.g., OriginLab Corp. Origin, Parametric Technology Corporation Mathchad etc.) treated by calculating D 50 particle size, the maximum particle diameter Dmax.
- JSM-7600F manufactured by JEOL was used as a scanning electron microscope.
- Example 1 Graphite having a particle size of 0.1 to 10 ⁇ m and a purity of 99.9% or more was put in a Mo capsule and treated with a belt type high pressure generator at 10 GPa at 2100 ° C. for 30 minutes to form polycrystalline diamond. The particle size of this sample was observed with an electron microscope. Table 1 shows the average particle diameter and the maximum particle diameter.
- a flank A (1XA) was formed on both sides of the V byte with an ion current of 500 pA or less.
- Edge radius of curvature R1, radius of curvature R2 between the rake face (Y) and flank (1XA), boundary between rake face (Y) of flank A (1XA) and flank B (1XB) Table 1 shows the distance L to the boundary.
- the tool was installed in an ultra-precision nano-machining machine, and grooving was performed on the work material mainly composed of WC-Co-Ni.
- the feed rate was 10 mm / min, the depth of cut was 300 ⁇ m, and the cutting length was 1000 mm.
- the cutting results are summarized in Table 1.
- Example 2 A V-bite was produced in the same manner as in Example 1 except that nanopolycrystalline diamond having a smaller particle diameter than that in Example 1 was used.
- Example 3 A V bite was produced in the same manner as in Example 1 except that conductive nanopolycrystalline diamond doped with boron was used.
- Table 1 shows an example using single crystal diamond, an example using polycrystalline diamond having different particle diameters, and an example using different tool processing methods.
- Example 4 Graphite having a particle size of 0.1 to 10 ⁇ m and a purity of 99.9% or more was put in a Mo capsule and treated with a belt type high pressure generator at 10 GPa at 2100 ° C. for 30 minutes to form polycrystalline diamond. The particle size of this sample was observed with an electron microscope. The average particle size was 30 nm and the maximum particle size was 90 nm. This was roughly processed by laser cutting and polishing to form a chip shape, and the shank was brazed. Next, the rake face (Y) and the second flank face (2X) of the grooving tool as shown in FIG. 9 were formed by rough polishing.
- a tool was placed on the stage so that the beam was directed from the rake face (Y) side to the flank face (X) side, and introduced into the focused ion beam apparatus.
- a relief surface B (1XB) was formed on the side surfaces L and R of the grooving tool at an ion current of 1000 pA or less, and finally a flank B (1XB) of the tip surface T of the grooving tool was formed.
- Table 2 shows the curvature radius R3R of the corner sandwiched between the two clearance surfaces of the side surface R and the tip surface T, and the curvature radius R3L of the corner sandwiched between the two clearance surfaces of the side surface L and the tip surface T.
- flank A (1XA) is formed on the side surfaces L and R of the grooving tool at an ion current of 500 pA or less, and finally the flank A (1XA) of the tip surface T of the grooving tool is formed. Completed the part-time job.
- Edge radius of curvature R1R made by side surface R and tip surface T, edge radius of curvature R1L made by side surface L and tip surface T, radius of curvature R2R sandwiched between rake face and side surface R, side surface L, clearance surface of tip surface T , R2L, R2T, and distances LR, LL, LT from the rake face at the end of the flank A are shown in Table 2.
- the tool was installed in an ultra-precision nano-machining machine, and grooving was performed on the work material mainly composed of WC-Co-Ni.
- the feed rate was 10 mm / min
- the depth of cut was 200 ⁇ m
- the cutting length was 1000 mm.
- Example 5 A hexagonal boron nitride having a particle size of 0.1 to 10 ⁇ m and a purity of 99.9% or more is placed in a Mo capsule and treated with a belt type high pressure generator at 13 GPa and 1650 ° C. for 30 minutes. Crystals were formed. The crystal structure was determined by X-ray diffraction, and the particle size of the sample was observed with an electron microscope. Table 3 shows the average particle size and the maximum particle size.
- a flank A (1XA) was formed on both sides of the V byte with an ion current of 500 pA or less.
- Edge radius of curvature R1, radius of curvature R2 between the rake face (Y) and flank (1XA), boundary between rake face (Y) of flank A (1XA) and flank B (1XB) Table 3 shows the distance L to the boundary of
- the tool was installed in an ultra-precision nano-machining machine, and grooving was performed on stainless steel (SUS304).
- the feed rate was 2 m / min
- the cutting depth was 5 ⁇ m
- the cutting length was 300 mm.
- the cutting results are summarized in Table 3.
- Example 6 A V-bite was produced in the same manner as in Example 5 except that the high-pressure phase boron nitride contained not only cubic crystals but also some wurtzite types and small particle diameters.
- Example 7 A V bite was produced in the same manner as in Example 5 except that the particle size was different from that in Example 5.
- Table 3 shows an example using single crystal diamond, an example using polycrystalline diamond, an example using high-pressure phase boron nitride having different particle diameters, and an example using different tool processing methods.
- Example 8 A hexagonal boron nitride having a particle size of 0.1 to 10 ⁇ m and a purity of 99.9% or more is placed in a Mo capsule and treated with a belt-type high pressure generator at 12 GPa and 1650 ° C. for 30 minutes. Formed. The particle size of this sample was observed with an electron microscope. The average particle size was 30 nm and the maximum particle size was 90 nm. This was roughly processed by laser cutting and polishing to form a chip shape, and the shank was brazed. Next, the rake face (Y) and the second flank face (2X) of the grooving tool as shown in FIG. 9 were formed by rough polishing.
- a tool was placed on the stage so that the beam was directed from the rake face (Y) side to the flank face (X) side, and introduced into the focused ion beam apparatus.
- a flank B (1XB) was formed on the side surfaces L and R of the grooving tool at an ion current of 1000 pA or less, and finally a flank B (1XB) of the tip surface T of the grooving tool was formed.
- Table 4 shows the radius of curvature R3R of the corner sandwiched between the two flank surfaces of the side surface R and the tip surface T, and the radius of curvature R3L of the corner sandwiched between the two flank surfaces of the side surface L and the tip surface T.
- the tool was taken out, and the tool was placed on the stage so that the beam was directed from the escape side (1XB) to the rake face (Y) side as shown in FIG. 6 and introduced into the focused ion beam apparatus.
- the flank A (1XA) is formed on the side surfaces L and R of the grooving tool at an ion current of 500 pA or less, and finally the flank A (1XA) of the tip surface T of the grooving tool is formed. Completed the part-time job.
- Edge radius of curvature R1R made by side surface R and tip surface T, edge radius of curvature R1L made by side surface L and tip surface T, radius of curvature R2R sandwiched between rake face and side surface R, side surface L, clearance surface of tip surface T , R2L, R2T, and distances LR, LL, LT from the rake face at the end of the flank A are shown in Table 4.
- the tool was installed in an ultra-precision nano-machining machine, and grooving was performed on stainless steel (SUS304).
- the feed rate was 2 m / min
- the cutting depth was 5 ⁇ m
- the cutting length was 300 mm.
- Example 9 BCl 3 gas and acetonitrile were introduced into the reaction tube at a molar ratio of 1: 1, and a graphite-like BC 2 N film was deposited on carbon heated to 1800 ° C. by high frequency induction heating. Next, this is pulverized to a particle size of 0.1 to 10 ⁇ m and placed in a Mo capsule and treated with a belt type high pressure generator at 25 GPa and 2200 ° C. for 30 minutes to form diamond-like polycrystalline BC 2 N. did. The particle size of this sample was observed with an electron microscope. Table 5 shows the average particle diameter and the maximum particle diameter.
- a flank A (1XA) was formed on both sides of the V byte with an ion current of 500 pA or less.
- Edge radius of curvature R1, radius of curvature R2 between the rake face (Y) and flank (1XA), boundary between rake face (Y) of flank A (1XA) and flank B (1XB) Table 5 shows the distance L to the boundary of
- the tool was installed in an ultra-precision nano-machining machine, and grooving was performed on the work material mainly composed of WC-Co-Ni.
- the feed rate was 10 mm / min, the depth of cut was 300 ⁇ m, and the cutting length was 1000 mm.
- the cutting results are summarized in Table 5.
- Example 10 A V bite was produced in the same manner as in Example 9 except that nanopolycrystalline BC 2 N having a smaller particle size than that in Example 9 was used.
- Example 11 A V-byte was prepared in the same manner as in Example 1 except that boron-doped conductive nanopolycrystalline BC 2 N was used.
- the cutting tool of the present invention has excellent chipping resistance and wear resistance, and has a sharp cutting edge shape that does not suffer from processing damage such as micro cracks and distortions due to polishing processing. It can be performed at a distance, and can be suitably applied to ultra-precise machining with hard materials that have been difficult to machine.
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Abstract
Description
より粒子の細かい超ナノ微結晶ダイヤモンド(UNCD)がパルス真空アークプラズマ蒸着法などで合成できるが(非特許文献1)、これには水素化アモルファスカーボンも多数含まれており、通常のダイヤモンドと比べて耐摩耗性は低いものとなっている。
cBN工具にはいくつか種類があるが、安価に粗い加工を行う場合はバインダーでcBNを焼結した工具が、例えば特許文献3などに見られる。ただしバインダーがある場合は精密な加工ができないため、バインダーのないcBN焼結体を用いる例が特許文献4、あるいは非特許文献2に見られる。しかし、これらもcBNの粒子径が50~500nmと大きいため、光学部品レベルの超精密加工に用いるのは困難であった。
本発明者らが同様の微粒cBNを用いてグルーブやVバイトを研磨によって試作したが、通常のcBN素材より硬度が増したため研磨中に微細な欠けが発生し、精密工具として充分な精度が得られなかった。
本発明は上記の事情に鑑みてなされたもので、高精度の切削加工を実現する工具を提供するものである。
D50 ≦1.2×R1
Dmax ≦2.0×R1
図10は曲率半径Rと平均粒径D50、及び最大粒径Dmaxの関係を示す図である。
(1)非ダイヤモンド型炭素物質および/または窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に、ホウ素、炭素、および窒素からなる群より選ばれる1種類以上の元素からなる高圧相硬質粒子に変換焼結された多結晶体を切刃とした切削工具であって、
前記切削工具の刃先先端の曲率半径R1に対して、前記多結晶体を構成する焼結粒子の平均粒径が1.2×R1以下、最大粒径が2×R1以下であることを特徴とする切削工具。
(2)前記切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2に対して、前記多結晶体を構成する焼結粒子の平均粒径が1.2×R2以下、最大粒径が2×R2以下であることを特徴とする上記(1)に記載の切削工具。
(3)前記切削工具の2つの逃げ面で挟まれる角の曲率半径R3に対して、前記多結晶体を構成する焼結粒子の平均粒径が1.2×R3以下、最大粒径が2×R3以下であることを特徴とする上記(1)又は(2)に記載の切削工具。
(4)前記切削工具の刃先先端の曲率半径R1が50nm以下で、前記多結晶体を構成する焼結粒子の平均粒径が60nm以下、最大粒径が100nm以下であることを特徴とする上記(1)~(3)のいずれかに記載の切削工具。
(5)前記切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2が50nm以下で、前記多結晶体を構成する焼結粒子の平均粒径が60nm以下、最大粒径が100nm以下であることを特徴とする上記(2)~(4)のいずれかに記載の切削工具。
(6)前記切削工具の2つの逃げ面で挟まれる角の曲率半径R3が50nm以下で、前記多結晶体を構成する焼結粒子の平均粒径が60nm以下、最大粒径が100nm以下であることを特徴とする上記(3)~(5)のいずれかに記載の切削工具。
(7)前記切削工具の刃先が集束イオンビームにより形成された面であり、逃げ面がすくい面に近い側の逃げ面Aと、該逃げ面Aに隣接する、すくい面から遠い側の逃げ面Bとからなることを特徴とする上記(1)~(6)のいずれかに記載の切削工具。
(8)前記逃げ面Aのすくい面との境界と、逃げ面Bとの境界との間の距離が3μm以下であることを特徴とする上記(7)に記載の切削工具。
(9)前記逃げ面Bをすくい面側から逃げ側に向けた集束イオンビームで加工した後、前記逃げ面Aを逃げ側からすくい面側に向けた集束イオンビームで加工して得られたことを特徴とする上記(7)又は(8)に記載の切削工具。
(10)前記多結晶体が導電性を持つことを特徴とする上記(1)~(9)のいずれかに記載の切削工具。
(11)前記切削工具の先端の曲率半径R1、すくい面と逃げ面で挟まれる角の曲率半径R2、2つの逃げ面で挟まれる角の曲率半径R3に対して、前記多結晶体の平均粒径が0.01×R1以上かつ0.01×R2以上かつ0.01×R3以上であることを特徴とする上記(1)~(10)のいずれかに記載の切削工具。
(12)前記多結晶体が、非ダイヤモンド型炭素物質を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的にダイヤモンドに変換焼結された、実質的にダイヤモンドのみからなる多結晶ダイヤモンドであることを特徴とする上記(1)~(11)のいずれかに記載の切削工具。
(13)前記多結晶体が、低圧相窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に高圧相窒化ホウ素に変換焼結された、実質的に高圧相窒化ホウ素のみからなる多結晶窒化ホウ素であり、前記高圧相窒化ホウ素が立方晶窒化ホウ素および/またはウルツ鉱型窒化ホウ素であることを特徴とする上記(1)~(11)のいずれかに記載の切削工具。
(14)前記切削工具がVバイト、フライカット、マイクログルーブのいずれかであることを特徴とする上記(1)~(13)のいずれかに記載のダイヤモンド切削工具。
(15)非ダイヤモンド型炭素物質および/または窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に、ホウ素、炭素、および窒素からなる群より選ばれる1種類以上の元素からなる高圧相硬質粒子に変換焼結された多結晶体を切刃とした切削工具の製造方法であって、
前記多結晶体をレーザーでチップ状にカットする工程と、
前記多結晶体チップをシャンクに接合する工程と、
前記多結晶体チップを研磨することにより、すくい面と逃げ面を作る工程と、
すくい面と逃げ面を集束イオンビームにより加工する工程とを含むことを特徴とする切削工具の製造方法。
(16)非ダイヤモンド型炭素物質および/または窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に、ホウ素、炭素、および窒素からなる群より選ばれる1種類以上の元素からなる高圧相硬質粒子に変換焼結された多結晶体を切刃とした切削工具の製造方法であって、
前記多結晶体をレーザーでチップ状にカットする工程と、
前記多結晶体チップをシャンクに接合する工程と、
前記多結晶体チップを研磨することにより、すくい面と逃げ面を作る工程と、
前記多結晶体チップにマスクを形成する工程と、
ドライエッチングによりすくい面と逃げ面を作る工程と、
すくい面と逃げ面を集束イオンビームにより加工する工程とを含むことを特徴とする切削工具の製造方法。
本発明の切削工具の材料である、コバルト等の金属結合材を含まない実質的にダイヤモンド単相(純度99%以上)のダイヤモンド多結晶体は、原料の黒鉛(グラファイト)やグラッシーカーボン、アモルファスカーボンなどの非ダイヤモンド型炭素を超高圧高温下(温度1800~2600℃、圧力12~25GPa)で、触媒や溶媒なしに直接的にダイヤモンドに変換させ、同時に焼結させることによって得ることが出来る。このようにして得られた多結晶ダイヤモンドからなるダイヤモンド工具には単結晶を用いたダイヤモンド工具に見られるような偏磨耗は起こらない。
非特許文献3:SEIテクニカルレビュー165(2004)68
特許文献 9 :特開2007-22888号公報
特許文献10:特許4275896号公報
そこで、多結晶ダイヤモンドを構成するダイヤモンド焼結粒子の粒径分布を刃先の曲率半径に応じて制御することが必要であることがわかった。粒径分布を制御したダイヤモンド工具を作製すると、極端に磨耗する粒子は無くなり、長期間安定した目的の加工を得ることが出来た。
すなわち、切削工具の刃先先端の曲率半径R1に対して、D50≦1.2×R1、かつ、Dmax≦2×R1としたダイヤモンドの多結晶体を用いることである。
また、切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2に対して、D50≦1.2×R2、かつDmax≦2×R2とした多結晶体を用いることが好ましい。
また、切削工具の2つの逃げ面で挟まれる角の曲率半径R3に対して、D50≦1.2×R3かつDmax≦2×R3とした多結晶体を用いることが好ましい。
好ましくは、切削工具の刃先先端、すくい面と逃げ面で挟まれる角、および2つの逃げ面で挟まれる角の曲率半径は全て50nm以下で、D50≦60nm、Dmax≦100nmであることが超精密加工をする上で望ましい。
なお、本発明におけるR1、R2及びR3が工具のどの部分についてのものかについては図11に示した。図11に示すようにR3は、逃げ面が、第1逃げ面A(1XA)、第1逃げ面B(1XB)、第2逃げ面(2X)と3段に分かれている場合には、第1逃げ面A(1XA)と第2逃げ面(2X)の間の第1逃げ面B(1XB)同士に挟まれた角の曲率半径をいう。また、逃げ面が第1逃げ面、第2逃げ面と2段に分かれている場合には、すくい面に近い側の第1逃げ面同士に挟まれた角の曲率半径をR3とする。R2はすくい面(Y)と、逃げ面(X)(図11中では第1逃げ面A(1XA))とに挟まれた角の曲率半径をいう。R1は工具の先端の刃先の曲率半径をいう。
また多結晶ダイヤモンドの平均粒径は、刃先の曲率半径R1、R2、R3に対し、D50≧0.01×R1かつD50≧0.01×R2かつD50≧0.01×R3であることが望ましい。これ未満の粒径ではsp3結合を維持した多結晶ダイヤモンドの合成は実用上困難であり、実際にはsp2結合を含んでしまうため、耐磨耗性および耐欠損性が低下してくることが分かった。
まず、すくい面(Y)および逃げ面(X)を粗加工する(図1)。次の高精度の刃先を作製するための工程では、従来の方法では図4に示すように先の粗加工面を第2逃げ面(2X)とし、仕上研磨によって第1逃げ面(1X)を加工していた。それに対し、本発明ではまず2つの逃げ面で挟まれる角R3を鋭利にするために、集束イオンビームをすくい面(Y)から逃げ面(X)側に向けて高精度加工を行う(図2)。この加工によりすくい面(Y)と逃げ面(X)に挟まれた角の曲率半径R2および刃先先端の曲率半径R1はやや丸みを帯びた形状になる。そこで最後に集束イオンビームを逃げ側(X)からすくい面(Y)に向けて高精度加工を行う(図3)。ここで先のFIB加工した面は逃げ面B(1XB)、最後のFIB加工した面は逃げ面A(1XA)となる。以上の加工により、曲率半径R1,R2,R3全てが従来の加工法で得られなかった高精度の工具を得ることができる。なお、ここで述べるR3は特に2つの逃げ面B(1XB)で挟まれる角を意味する。
好ましくは、上記逃げ面A(1XA)のすくい面(Y)との境界と、逃げ面B(1XB)との境界との間の距離(L)は3μm以下であることが望ましい。3μmを超える距離となる場合、2つの逃げ面で挟まれる角R3などに丸みが生じ、高精度の工具を得ることができない。
非ダイヤモンド型炭素物質を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的にダイヤモンドに変換焼結する工程と
ダイヤモンドをレーザーでチップ状にカットする工程と、
ダイヤモンドチップをシャンクに接合する工程と、
ダイヤモンドチップを研磨することにより、すくい面と逃げ面を作る工程と、
ダイヤモンドチップにマスクを形成する工程と、
ドライエッチングによりすくい面や逃げ面を作る工程と、
すくい面と逃げ面の境界部を集束イオンビームにより加工する工程により、本発明の多結晶ダイヤモンド切削工具を得ることができる。
これらの超精密工具はVバイト、フライカット、マイクログルーブのいずれの種類に対しても適用可能である。
本発明の切削工具の材料である、コバルト等の金属結合材を含まない実質的に窒化ホウ素単相(純度99%以上)の高圧相窒化ホウ素多結晶体は、原料の低圧相窒化ホウ素(六方晶窒化ホウ素、hBN)を超高圧高温下(温度1100~2600℃、圧力12~25GPa)で、触媒や溶媒なしに直接的に高圧相窒化ホウ素に変換させ、同時に焼結させることによって得ることが出来る。ここで述べる高圧相窒化ホウ素とは、立方晶窒化ホウ素(cBN)および圧縮型六方晶窒化ホウ素(ウルツ鉱型窒化ホウ素、wBN)のことである。このようにして得られた高圧相窒化ホウ素多結晶体からなる窒化ホウ素工具は粒径が小さく、欠損や偏磨耗が起こらない。
非特許文献4:機械と工具2010年3月号80ページ
そこで、多結晶窒化ホウ素を構成する窒化ホウ素焼結粒子の粒径分布を刃先の曲率半径に応じて制御することが必要であることがわかった。粒径分布を制御した高圧相窒化ホウ素工具を作製すると、極端に磨耗する粒子は無くなり、長期間安定した目的の加工を得ることが出来た。
すなわち、切削工具の刃先先端の曲率半径R1に対して、D50≦1.2×R1、かつDmax≦2×R1とした多結晶体を用いることである。
また、切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2に対して、D50≦1.2×R2以下かつDmax≦2×R2以下とした多結晶体を用いることが好ましい。
また、切削工具の2つの逃げ面で挟まれる角の曲率半径R3に対して、D50≦1.2×R3かつDmax≦2×R3とした多結晶体を用いることが好ましい。
好ましくは、切削工具の刃先先端、すくい面と逃げ面で挟まれる角、および2つの逃げ面で挟まれる角の曲率半径は全て50nm以下で、d≦60nm、D≦100nmであることが超精密加工をする上で望ましい。
なお、本発明の、窒化ホウ素を切刃に備えた切削工具におけるR1、R2及びR3は、ダイヤモンドを切刃に備えた切削工具において説明したものと同じであり、図11に示す通りである。
また高圧相窒化ホウ素多結晶体を構成する窒化ホウ素焼結粒子の平均粒径D50は、曲率半径R1、R2、R3に対し、D50≧0.01×R1かつD50≧0.01×R2かつD50≧0.01×R3が望ましい。これ以下の粒径でsp3結合を維持した高圧相窒化ホウ素多結晶体の合成は実用上困難であり、実際にはsp2結合を含んでしまうため、耐磨耗性および耐欠損性が低下してくることが分かった。
これらの超精密工具はVバイト、フライカット、マイクログルーブのいずれの種類に対しても適用可能である。
加工方法としては例えば次の二つの加工方法を挙げることができる。
<加工方法A>
以下の各工程を順に行う方法
(1)多結晶窒化ホウ素をレーザーでチップ状にカットする工程
(2)窒化ホウ素チップをシャンクに接合する工程
(3)窒化ホウ素チップを研磨することによりすくい面と逃げ面とを作る工程
(4)すくい面と逃げ面の境界部を集束イオンビームにより加工する工程
<加工方法B>
以下の各工程を順に行う方法
(1)窒化ホウ素をレーザーでチップ状にカットする工程
(2)窒化ホウ素チップをシャンクに接合する工程
(3)窒化ホウ素チップを研磨によりすくい面と逃げ面を作る工程
(4)窒化ホウ素チップにマスクを形成する工程
(5)ドライエッチングによりすくい面や逃げ面を作る工程
(6)すくい面と逃げ面の境界部を集束イオンビームにより加工する工程
本発明の切削工具の材料である、コバルト等の金属結合材を含まない実質的にBC2N単相(純度99%以上)のBC2N多結晶体は、原料の低圧相BC2N(グラファイト状BC2N)などの非ダイヤモンド型BC2Nを超高圧高温下(温度1800~2600℃、圧力12~25GPa)で、触媒や溶媒なしに直接的に高圧相BC2N(ダイヤモンド構造)に変換させ、同時に焼結させることによって得ることが出来る。このようにして得られた多結晶BC2NからなるBC2N工具には単結晶を用いたBC2N工具に見られるような偏磨耗は起こらない。
なお、グラファイト状BC2Nはこの他に、ホウ酸の窒化と、サッカロースの炭化を溶融尿素中で炭化させるなどして合成しても良いし、BCl3ガスとアセトニトリルをモル比1:1で反応管に導入して、高周波誘導加熱により昇温したカーボン上にグラファイト状BC2N膜を蒸着しても良い。
また、切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2に対して、D50≦1.2×R2以下かつDmax≦2×R2以下とした多結晶体を用いることが好ましい。
また、切削工具の2つの逃げ面で挟まれる角の曲率半径R3に対して、D50≦1.2×R3かつDmax≦2×R3とした多結晶体を用いることが好ましい。
切削工具の刃先先端、すくい面と逃げ面で挟まれる角、および2つの逃げ面で挟まれる角の曲率半径は全て50nm以下で、d≦60nm、D≦100nmであることが超精密加工をする上で望ましい。
なお、本発明の、BC2N多結晶体を切刃に備えた切削工具におけるR1、R2及びR3は、ダイヤモンドを切刃に備えた切削工具において説明したものと同じであり、図11に示す通りである。
これらの超精密工具はVバイト、フライカット、マイクログルーブのいずれの種類に対しても適用可能である。
まず、測定・評価方法について説明する。
本発明の実施例では原料の非ダイヤモンド型炭素として黒鉛焼成体を用いた。また、原料の低圧相(六方晶)窒化ホウ素粒子及び高圧相窒化ホウ素多結晶体
本発明においては原料の黒鉛焼成体中のグラファイト粒子、ダイヤモンド多結晶体中のダイヤモンド焼結粒子、低圧相(六方晶)窒化ホウ素粒子、及び高圧相窒化ホウ素多結晶体中の窒化ホウ素焼結粒子の平均粒径(D50)及び最大粒径(Dmax)は走査型電子顕微鏡により倍率10~50万倍で写真撮影像を元にして画像解析を実施することで得た。
以下にその詳細方法を示す。
まず、試料表面を仕上げ研磨もしくはCP加工し、該試料を走査型電子顕微鏡で撮影した撮影像を元に焼結体を構成する結晶粒の粒径分布を測定する。具体的には、画像解析ソフト(例えば、Scion Corporation社製、ScionImage)を用いて、個々の粒子を抽出し、抽出した粒子を2値化処理して各粒子の面積(S)を算出する。そして、各粒子の粒径(D)を、同じ面積を有する円の直径(D=2√(S/π))として算出する。
次に、上記で得られた粒径分布をデータ解析ソフト(例えば、OriginLab社製Origin、Parametric Technology社製Mathchad等)によって処理し、D50粒径、最大粒径Dmaxを算出する。
以下に記載する実施例、比較例では走査型電子顕微鏡として日本電子製JSM-7600Fを用いた。
粒径0.1~10μm、純度99.9%以上のグラファイトをMo製カプセルに入れ、ベルト型高圧発生装置を用いて、10GPa、2100℃で30分間処理し、多結晶ダイヤモンドを形成した。この試料の粒径を電子顕微鏡により観察した。平均粒径と最大粒径は表1のようになった。
次に図5のようにすくい面(Y)側から逃げ面(X)側にビームが向くように工具をステージに設置し、集束イオンビーム装置に導入した。これにVバイトの両側に対してイオン電流1000pA以下で逃げ面B(1XB)を形成した。工具を傾けて2つの逃げ面に挟まれた角を観察した。曲率半径R3を表1に記載した。
以上の加工により、図7に示すような先端90度のVバイトが完成した。同様の方法で図8に示すような先端40度やそれ以下の先鋭Vバイトも加工することができる。
実施例1より粒径の小さいナノ多結晶ダイヤモンドを使用した以外は、実施例1と同様にしてVバイトを作製した。
ホウ素ドープした導電性ナノ多結晶ダイヤモンドを使用した以外は、実施例1と同様にしてVバイトを作製した。
比較例として、単結晶ダイヤモンドを用いた例、粒径の異なる多結晶ダイヤモンドを用いた例、工具加工法が異なる例を表1に記載した。
粒径0.1~10μm、純度99.9%以上のグラファイトをMo製カプセルに入れ、ベルト型高圧発生装置を用いて、10GPa、2100℃で30分間処理し、多結晶ダイヤモンドを形成した。この試料の粒径を電子顕微鏡により観察した。平均粒径は30nmと最大粒径90nmとなった。
これにレーザーカットおよび研磨によって粗加工してチップ形状を作り、シャンクにロウ付けを行った。次に粗研磨によって図9に示すような溝入れバイトのすくい面(Y)および第2逃げ面(2X)を形成した。
粒径0.1~10μm、純度99.9%以上の六方晶窒化ホウ素をMo製カプセルに入れ、ベルト型高圧発生装置を用いて、13GPa、1650℃で30分間処理し、高圧相窒化ホウ素多結晶体を形成した。結晶構造はX線回折により判定し、試料の粒径は電子顕微鏡により観察した。平均粒径と最大粒径は表3のようになった。
次に図5のようにすくい面(Y)側から逃げ面(X)側にビームが向くように工具をステージに設置し、集束イオンビーム装置に導入した。これにVバイトの両側に対してイオン電流1000pA以下で逃げ面B(1XB)を形成した。工具を傾けて2つの逃げ面に挟まれた角を観察した。曲率半径R3を表3に記載した。
以上の加工により、図7に示すような先端90度のVバイトが完成した。同様の方法で図8に示すような先端40度やそれ以下の先鋭Vバイトも加工することができる。
高圧相窒化ホウ素に立方晶だけでなく、一部ウルツ鉱型が含まれ、粒径が細かい点以外は実施例5と同様にしてVバイトを作製した。
実施例5と粒径が異なる以外は、実施例5と同様にしてVバイトを作製した。
比較例として、単結晶ダイヤモンドを用いた例、多結晶ダイヤモンドを用いた例、粒径の異なる高圧相窒化ホウ素を用いた例、工具加工法が異なる例を表3に記載した。
粒径0.1~10μm、純度99.9%以上の六方晶窒化ホウ素をMo製カプセルに入れ、ベルト型高圧発生装置を用いて、12GPa、1650℃で30分間処理し、高圧相窒化ホウ素を形成した。この試料の粒径を電子顕微鏡により観察した。平均粒径は30nmと最大粒径90nmとなった。
これにレーザーカットおよび研磨によって粗加工してチップ形状を作り、シャンクにロウ付けを行った。次に粗研磨によって図9に示すような溝入れバイトのすくい面(Y)および第2逃げ面(2X)を形成した。
BCl3ガスとアセトニトリルをモル比1:1で反応管に導入して、高周波誘導加熱により1800℃に昇温したカーボン上にグラファイト状BC2N膜を蒸着した。次にこれを粉砕して粒径0.1~10μmにしてMo製カプセルに入れ、ベルト型高圧発生装置を用いて、25GPa、2200℃で30分間処理し、ダイヤモンド状多結晶BC2Nを形成した。この試料の粒径を電子顕微鏡により観察した。平均粒径と最大粒径は表5のようになった。
次に図5のようにすくい面(Y)側から逃げ面(X)側にビームが向くように工具をステージに設置し、集束イオンビーム装置に導入した。これにVバイトの両側に対してイオン電流1000pA以下で逃げ面B(1XB)を形成した。工具を傾けて2つの逃げ面に挟まれた角を観察した。曲率半径R3を表5に記載した。
以上の加工により、図7に示すような先端90度のVバイトが完成した。同様の方法で図8に示すような先端40度やそれ以下の先鋭Vバイトも加工することができる。
実施例9より粒径の小さいナノ多結晶BC2Nを使用した以外は、実施例9と同様にしてVバイトを作製した。
ホウ素ドープした導電性ナノ多結晶BC2Nを使用した以外は、実施例1と同様にしてVバイトを作製した。
比較例として、単結晶ダイヤモンドを用いた例、粒径の異なる多結晶BC2Nを用いた例、工具加工法が異なる例を表5に記載した。
Y すくい面
1X 第1逃げ面
2X 第2逃げ面
1XA 第1逃げ面A
1XB 第1逃げ面B
F 集束イオンビームの向き
R 曲率半径
R1 刃先の曲率半径
R2 すくい面と逃げ面に挟まれた角の曲率半径
R3 2つの逃げ面に挟まれた角の曲率半径
D50 平均粒径
Dmax 最大粒径
L 第1逃げ面Aの幅
Claims (16)
- 非ダイヤモンド型炭素物質および/または窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に、ホウ素、炭素、および窒素からなる群より選ばれる1種類以上の元素からなる高圧相硬質粒子に変換焼結された多結晶体を切刃とした切削工具であって、
前記切削工具の刃先先端の曲率半径R1に対して、前記多結晶体を構成する焼結粒子の平均粒径が1.2×R1以下、最大粒径が2×R1以下であることを特徴とする切削工具。 - 前記切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2に対して、前記多結晶体を構成する焼結粒子の平均粒径が1.2×R2以下、最大粒径が2×R2以下であることを特徴とする請求項1に記載の切削工具。
- 前記切削工具の2つの逃げ面で挟まれる角の曲率半径R3に対して、前記多結晶体を構成する焼結粒子の平均粒径が1.2×R3以下、最大粒径が2×R3以下であることを特徴とする請求項1又は2に記載の切削工具。
- 前記切削工具の刃先先端の曲率半径R1が50nm以下で、前記多結晶体を構成する焼結粒子の平均粒径が60nm以下、最大粒径が100nm以下であることを特徴とする請求項1~3のいずれかに記載の切削工具。
- 前記切削工具のすくい面と逃げ面で挟まれる角の曲率半径R2が50nm以下で、前記多結晶体を構成する焼結粒子の平均粒径が60nm以下、最大粒径が100nm以下であることを特徴とする請求項2~4のいずれかに記載の切削工具。
- 前記切削工具の2つの逃げ面で挟まれる角の曲率半径R3が50nm以下で、前記多結晶体を構成する焼結粒子の平均粒径が60nm以下、最大粒径が100nm以下であることを特徴とする請求項3~5のいずれかに記載の切削工具。
- 前記切削工具の刃先が集束イオンビームにより形成された面であり、逃げ面がすくい面に近い側の逃げ面Aと、該逃げ面Aに隣接する、すくい面から遠い側の逃げ面Bとからなることを特徴とする請求項1~6のいずれかに記載の切削工具。
- 前記逃げ面Aのすくい面との境界と、逃げ面Bとの境界との間の距離が3μm以下であることを特徴とする請求項7に記載の切削工具。
- 前記逃げ面Bをすくい面側から逃げ側に向けた集束イオンビームで加工した後、前記逃げ面Aを逃げ側からすくい面側に向けた集束イオンビームで加工して得られたことを特徴とする請求項7又は8に記載の切削工具。
- 前記多結晶体が導電性を持つことを特徴とする請求項1~9のいずれかに記載の切削工具。
- 前記切削工具の先端の曲率半径R1、すくい面と逃げ面で挟まれる角の曲率半径R2、2つの逃げ面で挟まれる角の曲率半径R3に対して、前記多結晶体の平均粒径が0.01×R1以上かつ0.01×R2以上かつ0.01×R3以上であることを特徴とする請求項1~10のいずれかに記載の切削工具。
- 前記多結晶体が、非ダイヤモンド型炭素物質を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的にダイヤモンドに変換焼結された、実質的にダイヤモンドのみからなる多結晶ダイヤモンドであることを特徴とする請求項1~11のいずれかに記載の切削工具。
- 前記多結晶体が、低圧相窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に高圧相窒化ホウ素に変換焼結された、実質的に高圧相窒化ホウ素のみからなる多結晶窒化ホウ素であり、前記高圧相窒化ホウ素が立方晶窒化ホウ素および/またはウルツ鉱型窒化ホウ素であることを特徴とする請求項1~11のいずれかに記載の切削工具。
- 前記切削工具がVバイト、フライカット、マイクログルーブのいずれかであることを特徴とする請求項1~13のいずれかに記載のダイヤモンド切削工具。
- 非ダイヤモンド型炭素物質および/または窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に、ホウ素、炭素、および窒素からなる群より選ばれる1種類以上の元素からなる高圧相硬質粒子に変換焼結された多結晶体を切刃とした切削工具の製造方法であって、
前記多結晶体をレーザーでチップ状にカットする工程と、
前記多結晶体チップをシャンクに接合する工程と、
前記多結晶体チップを研磨することにより、すくい面と逃げ面を作る工程と、
すくい面と逃げ面を集束イオンビームにより加工する工程とを含むことを特徴とする切削工具の製造方法。 - 非ダイヤモンド型炭素物質および/または窒化ホウ素を出発物質として、超高圧高温下で焼結助剤や触媒の添加無しに直接的に、ホウ素、炭素、および窒素からなる群より選ばれる1種類以上の元素からなる高圧相硬質粒子に変換焼結された多結晶体を切刃とした切削工具の製造方法であって、
前記多結晶体をレーザーでチップ状にカットする工程と、
前記多結晶体チップをシャンクに接合する工程と、
前記多結晶体チップを研磨することにより、すくい面と逃げ面を作る工程と、
前記多結晶体チップにマスクを形成する工程と、
ドライエッチングによりすくい面と逃げ面を作る工程と、
すくい面と逃げ面を集束イオンビームにより加工する工程とを含むことを特徴とする切削工具の製造方法。
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