CN108714978B - Crystal silicon edge cutting and grinding integrated machine - Google Patents
Crystal silicon edge cutting and grinding integrated machine Download PDFInfo
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- CN108714978B CN108714978B CN201810728772.5A CN201810728772A CN108714978B CN 108714978 B CN108714978 B CN 108714978B CN 201810728772 A CN201810728772 A CN 201810728772A CN 108714978 B CN108714978 B CN 108714978B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 143
- 238000000227 grinding Methods 0.000 title claims abstract description 101
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 53
- 239000010703 silicon Substances 0.000 title claims abstract description 53
- 239000013078 crystal Substances 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- 238000005498 polishing Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 230000007704 transition Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 8
- -1 angle Chemical compound 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a crystal silicon edge cutting and grinding integrated machine, which belongs to the technical field of crystal silicon processing equipment, and sequentially comprises an edge cutting mechanism and a grinding surface polishing mechanism along the transmission direction of crystal silicon, wherein the edge cutting mechanism comprises a cutting machine head, the cutting machine head is surrounded by a cutting wire to form a cutting channel for the crystal silicon to pass through and cut the crystal silicon edge angle, the grinding surface polishing mechanism comprises a grinding head, the grinding head is surrounded by a grinding component to form a grinding channel for the crystal silicon to pass through and grind the crystal silicon surface, and the cutting channel and the grinding channel are arranged in parallel.
Description
Technical Field
The invention belongs to the technical field of crystal silicon processing equipment, and particularly relates to a crystal silicon cutting, chamfering and grinding all-in-one machine.
Background
Photovoltaic power generation is one of the most important clean energy sources at present, and has great development potential. The key factors for restricting the development of the photovoltaic industry are low photoelectric conversion efficiency on one hand and high cost on the other hand. Photovoltaic silicon wafers are the basic material for producing solar cells and modules, and the purity of the polysilicon used to produce photovoltaic silicon wafers must be above 6N-grade, otherwise the performance of photovoltaic cells will be greatly negatively affected. The actual production of the crystalline silicon involves the working procedures of preparation, ingot casting, trimming skin, cutting, grinding, polishing, chamfering, slicing, battery piece, assembly and the like. The surface grinding, polishing and chamfering are to polish the single crystal and polycrystalline silicon square rods with different specifications after square cutting into an arc or angle or surface integrally, the square rods are polished into standard specifications to be sliced, in the prior art, the edge angle of the bar is directly ground by a grinding machine, the time consumption is long, and the efficiency is low.
Disclosure of Invention
Aiming at various defects in the prior art, in order to solve the problems, a novel crystal silicon cutting, chamfering and grinding all-in-one machine is provided.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the crystal silicon cutting, chamfering and grinding all-in-one machine sequentially comprises a chamfering cutting mechanism and a grinding surface polishing mechanism along the transmission direction of crystal silicon;
the chamfering and cutting mechanism comprises a cutting machine head, the cutting machine head is surrounded by a cutting wire to form a cutting channel for the crystal silicon to pass through and cut the edges and corners of the crystal silicon, the longitudinal section of the cutting wire is a polygon with at least 3 edges, the grinding surface polishing mechanism comprises a grinding head, the grinding head is surrounded by a grinding component to form a grinding channel for the crystal silicon to pass through and grind the surface of the crystal silicon, and the cutting channel and the grinding channel are arranged in parallel.
Further, the cutting machine head comprises a base, a left cutting assembly and a right cutting assembly, the structures of the left cutting assembly and the right cutting assembly are the same, and the left cutting assembly and the right cutting assembly are arranged at intervals by taking the central axis of the base as a symmetrical axis so as to form a cutting channel for crystal silicon to pass through.
Further, left side cutting assembly includes first braced frame, cutting motor, cutting wheel and transition wheel, the bottom of first braced frame passes through guiding assembly and links to each other with the base, cutting motor's output is connected with the cutting wheel, and cutting wheel, transition wheel and first braced frame rotatable coupling, the transition wheel sets up to a plurality of, and cutting wire walks around cutting wheel, transition wheel in proper order and forms closed polygon.
Further, be equipped with the fluting along the length direction of cutting passageway on the first braced frame, fluting department is equipped with take-up pulley, connecting seat and tensioning cylinder, the tensioning cylinder is fixed in on the first braced frame, the shaft of take-up pulley passes through bearing and connecting seat rotatable coupling, the connecting seat is in the fluting, and its piston end with the tensioning cylinder is connected, and cutting wire walks around cutting pulley, take-up pulley and transition wheel in proper order and forms closed polygon.
Further, remove arris cutting mechanism still includes first frame, material loading subassembly, goes up unloading subassembly and first slip table that feeds, material loading subassembly, go up unloading subassembly and cutting aircraft nose all are located inside the first frame, and material loading subassembly, go up the unloading subassembly and be located the both sides of cutting aircraft nose respectively, first slip table that feeds is located first frame top for the crystalline silicon of centre gripping drives crystalline silicon and removes along cutting passageway, the base links firmly with first frame.
Further, grinding surface polishing mechanism still includes workstation, second frame, second feed slip table and unloading subassembly, the second frame is located the top of workstation and both links firmly, the grinding head is located inside the second frame, the second feeds the slip table and is located the second frame top for centre gripping crystalline silicon and drive crystalline silicon and remove along the grinding passageway, go up unloading subassembly and be located the both sides of grinding head respectively, and go up unloading subassembly and be located between cutting aircraft nose, the grinding head.
Further, go up unloading subassembly and material loading subassembly's structure the same, material loading subassembly includes bottom plate, first clamping component, second clamping component and carries the material subassembly, it is located between first clamping component, the second clamping component to carry the material subassembly, and first clamping component and second clamping component can slide relatively.
Further, first clamping component is including pushing up tight cylinder, first splint and slide, first splint are connected with the output of pushing up tight cylinder, the bottom plate is equipped with first slide rail, slide on the first slide rail and be equipped with the slide that links firmly with first splint, second clamping component includes the second splint that sets up relatively with first splint.
Further, the grinding head at least comprises 2 grinding components which are arranged right opposite to each other, the grinding components comprise a second supporting frame, an action component and a lifting component, the action component comprises a rotating motor, a main shaft and a grinding wheel, the main shaft penetrates through the second supporting frame, one end of the main shaft is connected with the output end of the rotating motor, the other end of the main shaft is connected with the grinding wheel which is right opposite to a grinding channel, and a support which is rotatably connected with the main shaft is arranged on the periphery of the main shaft.
Further, the lifting assembly is arranged along the vertical direction and comprises a lifting fixed end and a lifting movable end which are in driving connection, wherein the lifting fixed end is fixedly connected with the second support frame, and the lifting movable end penetrates through the second support frame and is fixedly connected with the top of the support.
The beneficial effects of the invention are as follows:
the crystal silicon is subjected to rapid chamfering processing in advance through the chamfering cutting mechanism, then the precise grinding is performed by the grinding surface polishing mechanism according to the requirement, the two are operated in parallel and synchronously, the time consumption of the whole grinding and chamfering processing process is effectively reduced, the production efficiency is effectively improved, the processing quality is ensured, meanwhile, 2 unilateral wire meshes are formed in the chamfering cutting machine, and two edges and angles can be cut off at one time rapidly, and the chamfering cutting machine is reliable and efficient.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a structure of a chamfering cutting mechanism without a feeding assembly;
FIG. 3 is a side view of a cutting head;
FIG. 4 is a schematic diagram of a single-sided wire mesh;
FIG. 5 is a schematic view of the structure of the abrasive surface polishing mechanism;
FIG. 6 is a schematic structural view of a loading assembly;
FIG. 7 is a schematic view of the internal structure of the feeding assembly;
fig. 8 is a schematic structural view of a grinding assembly.
In the accompanying drawings: the device comprises a 1-chamfering cutting mechanism, a 2-grinding surface polishing mechanism, a 3-cutting machine head, a 4-grinding head, a 5-feeding component, a 6-first feeding sliding table, a 7-second feeding sliding table, an 8-grinding channel, a 9-cutting wire, a 10-cutting channel, a 11-first frame, a 12-workbench, a 13-second frame, a 14-feeding and discharging component and a 15-grinding component;
the base, 302-left cutting assembly, 303-right cutting assembly, 304-first support frame, 305-cutting motor, 306-cutting wheel, 307-transition wheel, 308-slotting, 309-tensioning wheel;
the device comprises a bottom plate, a 502-loading assembly, a 503-first clamping plate, a 504-jacking cylinder, a 505-sliding seat, a 506-first sliding rail, a 507-second clamping plate, a 508-second sliding rail, a 509-material support, a 510-adjusting seat and a 511-adjusting electric cylinder;
1501-second support frame, 1502-rotating motor, 1503-spindle, 1504-grinding wheel, 1505-support, 1506-lift fixed end, 1507-lift movable end, 1508-fixed seat, 1509-feed motor, 1510-feed ball screw.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings, and based on the embodiments in the present application, other similar embodiments obtained by those skilled in the art without making creative efforts should fall within the scope of protection of the present application. In addition, directional words such as "upper", "lower", "left", "right", and the like, as used in the following embodiments are merely directions with reference to the drawings, and thus, the directional words used are intended to illustrate, not to limit, the invention.
Embodiment one:
referring to fig. 1, the crystal silicon chamfering and grinding all-in-one machine sequentially comprises a chamfering cutting mechanism 1 and a grinding surface polishing mechanism 2 along the transmission direction of crystal silicon, wherein the chamfering cutting mechanism 1 cuts the edges of the crystal silicon, and the grinding surface polishing mechanism 2 grinds the edges of the crystal silicon. That is, the crystal silicon is cut and chamfered in advance by the chamfering and cutting mechanism 1, so that the purpose of reducing the grinding allowance of a subsequent grinding machine is achieved, and the production efficiency is improved.
Referring to fig. 1-2, the chamfering cutting mechanism 1 includes a first frame 11, a feeding component 5, a cutting head 3, a loading and unloading component 14 and a first feeding sliding table 6, where the feeding component 5, the loading and unloading component 14 and the cutting head 3 are all located inside the first frame 11, and the feeding component 5 and the loading and unloading component 14 are located on two sides of the cutting head 3 respectively, and the first feeding sliding table 6 is located above the first frame 11. Specifically, the feeding component 5 is used for realizing the feeding of the crystalline silicon, the first feeding sliding table 6 is used for clamping the crystalline silicon and driving the crystalline silicon to move along the cutting channel 10 to complete cutting, and the cut crystalline silicon is conveyed to the grinding surface polishing mechanism 2 through the feeding and discharging component 14.
Referring to fig. 2-4, the cutting head 3 includes a base 301, a left cutting assembly 302 and a right cutting assembly 303, the left cutting assembly 302 and the right cutting assembly 303 have the same structure, and are disposed at intervals with a central axis of the base 301 as a symmetry axis, and the base 301 is fixedly connected with the first frame 11. Taking the left cutting assembly 302 as an example, the left cutting assembly 302 includes a first supporting frame 304, a cutting motor 305, a cutting wheel 306 and a transition wheel 307, specifically, an output end of the cutting motor 305 is connected with the cutting wheel 306 to drive the cutting wheel 306 to rotate, the cutting motor 305, the cutting wheel 306 and the transition wheel 307 are all located on the first supporting frame 304, the cutting wheel 306, the transition wheel 307 and the first supporting frame 304 are rotatably connected, the transition wheel 307 is provided in plurality, the cutting wire 9 sequentially bypasses the cutting wheel 306 and the transition wheel 307 to form a cutting channel 10 for passing through and cutting edges and corners of the crystal silicon, and a longitudinal section of the cutting wire 9 is a closed polygon with at least 3 sides, that is, under the connection action of the cutting wire 9, the cutting wheel 306 rotates to drive the transition wheel 307 and the cutting wire 9 to rotate, so as to cut the crystal silicon located in the cutting channel 10. Meanwhile, the cutting wires 9 on the left cutting assembly 302 or the right cutting assembly 303 form a single-side wire net, meanwhile, the single-side wire nets on the left cutting assembly 302 and the right cutting assembly 303 are oppositely arranged, two edges and corners can be cut at one time, the cutting efficiency is high, and after the cutting is finished, the crystal silicon is rotated by 90 degrees, and the other pair of edges and corners can be cut.
In addition, the bottom of the first supporting frame 304 is connected to the base 301 through a guiding assembly (not shown in the drawing) so as to realize stepless adjustment of the spacing between the left cutting assembly 302 and the right cutting assembly 303, that is, stepless adjustment of the spacing between 2 single-side wire meshes. Preferably, the guiding assembly comprises a driving element and a guiding seat, wherein the guiding seat is perpendicular to the first supporting frame 304, the bottom of the guiding seat is fixedly connected with the base 301, and the top of the guiding seat is slidably connected with the bottom of the first supporting frame 304. In order to ensure the tightness of the cutting wire 9, the first support frame 304 is provided with a slot 308 along the length direction of the cutting channel 10, the slot 308 is provided with a tensioning wheel 309, a connecting seat and a tensioning cylinder, the tensioning cylinder is fixed on the first support frame 304, an axle of the tensioning wheel 309 is rotatably connected with the connecting seat through a bearing, the connecting seat is positioned in the slot 308 and is connected with a piston end of the tensioning cylinder, that is, the tensioning cylinder can drive the tensioning wheel 309 to move along the slot 308 so as to achieve the tensioning effect. The tensioning wheel 309, the cutting wheel 306 and the transition wheel 307 are located on one side of the first support frame 304 close to the cutting channel 10, and the cutting wire 9 sequentially passes around the cutting wheel 306, the tensioning wheel 309 and the transition wheel 307 to form a closed polygon. In this embodiment, the number of transition wheels 307 is 2, and the 2 transition wheels 307 are located on the same horizontal line, the cutting wheel 306 and the tensioning wheel 309 are located on another horizontal line, and the cutting wire 9 sequentially bypasses the cutting wheel 306, the tensioning wheel 309 and the 2 transition wheels 307 to form a closed quadrilateral.
Embodiment two:
referring to fig. 5, the grinding surface polishing mechanism 2 includes a working table 12, a second frame 13, a grinding head 4, a second feeding sliding table 7 and a discharging component, specifically, the second frame 13 is located above the working table 12 and fixedly connected with the working table, the grinding head 4, the feeding and discharging component 14 and the discharging component are located inside the second frame 13 and are connected with the working table 12, the second feeding sliding table 7 is located above the second frame 13, the feeding and discharging component 14 and the discharging component are located on two sides of the grinding head 4 respectively, and the feeding and discharging component 14 is located between the cutting head 3 and the grinding head 4. That is, the cut crystal silicon is conveyed to the upper and lower components 14 through the first feeding sliding table 6, the second feeding sliding table 7 clamps the crystal silicon and drives the crystal silicon to move along the grinding channel 8 to finish grinding, and the ground crystal silicon is output through the lower component. Here, the first feeding slipway 6 and the second feeding slipway 7 are both conventionally related in the art, and the fixed chuck and the movable chuck are connected below both, and the movable chuck has a rotation function.
Referring to fig. 6-7, the loading and unloading assembly 14 has the same structure as the loading assembly 5, the loading assembly 5 includes a bottom plate 501, a first clamping assembly, a second clamping assembly, and a loading assembly 502, the loading assembly 502 is located between the first clamping assembly and the second clamping assembly, and the first clamping assembly and the second clamping assembly can slide relatively, that is, the first clamping assembly and/or the second clamping assembly have a sliding function, and the sliding direction is perpendicular to the direction of the grinding channel 8. Meanwhile, a conveying and feeding sliding table is arranged below the bottom plate 501 and used for driving the feeding and discharging assembly 14 to move, and the moving direction is perpendicular to the direction of the grinding channel 8. In this embodiment, the first clamping assembly includes a tightening cylinder 504, a first clamping plate 503 and a sliding seat 505, where the first clamping plate 503 is connected with an output end of the tightening cylinder 504, the bottom plate 501 is provided with a first sliding rail 506, and the sliding seat 505 fixedly connected with the first clamping plate 503 is slidably provided on the first sliding rail 506. That is, the tightening cylinder 504 can push the first clamping plate 503 to slide along the first sliding rail 506 to approach or separate from the loading assembly 502, and the direction of the first sliding rail 506 is perpendicular to the direction of the grinding channel 8. The second clamping assembly comprises a second clamping plate 507 which is arranged opposite to the first clamping plate 503, meanwhile, the second clamping plate 507 is connected with the bottom plate 501 through a second clamping plate bracket, a second sliding rail 508 is arranged on the second clamping plate bracket, the second clamping plate 507 is slidably connected with the second sliding rail 508, so that the second clamping plate 507 is arranged opposite to the first clamping plate 503, and the arrangement direction of the second sliding rail 508 is perpendicular to the arrangement direction of the first sliding rail 506. The material carrying component 502 comprises a material support 509, an adjusting seat 510 and an adjusting electric cylinder 511, wherein the adjusting electric cylinder 511 is fixedly connected to the bottom plate 501, the material support 509 is fixedly arranged at the output end of the adjusting electric cylinder 511 through the adjusting seat 510, and the adjusting electric cylinder 511 is arranged along the vertical direction, that is, the adjusting electric cylinder 511 can drive the material support 509 to generate displacement in the vertical direction.
Specifically, the first feeding sliding table 6 places the silicon on the surface of the material support 509, the pushing cylinder 504 pushes the first clamping plate 503 to be close to the second clamping plate 507, the first clamping plate 503 and the second clamping plate 507 directly clamp the silicon, then the feeding and discharging component 14 drives the silicon to move to the position which is positioned on the same straight line with the grinding channel 8, and the second feeding sliding table 7 works and clamps the silicon to be conveyed to the grinding head 4.
Referring to fig. 8, the grinding head 4 includes at least 2 grinding modules 15, the at least 2 grinding modules 15 are opposite to each other and are arranged at intervals to form a grinding channel 8 for passing the crystal silicon and grinding the surface of the crystal silicon, and the cutting channel 10 is arranged parallel to the grinding channel 8. The grinding assembly 15 comprises a second supporting frame 1501, an action assembly and a lifting assembly, the action assembly comprises a rotating motor 1502, a main shaft 1503 and a grinding wheel 1504, the main shaft 1503 penetrates through the second supporting frame 1501, one end of the main shaft 1503 is connected with the output end of the rotating motor 1502, the other end of the main shaft is connected with the grinding wheel 1504 which is opposite to the grinding channel 8, a support 1505 which is rotatably connected with the main shaft 1503 is arranged on the periphery of the main shaft 1503, and meanwhile, a brush is arranged on the periphery of the grinding wheel 1504. That is, the rotating motor 1502 can rotate the grinding wheel 1504 and the brush to perform the grinding operation, and the opposite 2 grinding units 15 can simultaneously work to perform the two-side grinding. In this embodiment, the grinding units 15 are provided in total of 4 and divided into 2 groups. The lifting assembly is arranged along the vertical direction and comprises a lifting fixed end 1506 and a lifting movable end 1507 which are in driving connection, the lifting fixed end 1506 is fixedly connected with the second support frame 1501, the lifting movable end 1507 penetrates through the second support frame 1501 and is fixedly connected with the top of the support 1505, that is, the lifting assembly can drive the action assembly to generate displacement in the vertical direction, and meanwhile, limiting blocks are arranged at the top and the bottom of the second support frame 1501 to limit the limiting position of the vertical movement. In this embodiment, the lifting fixed end 1506 is a servo motor, and the lifting moving end 1507 is a ball screw. Furthermore, a fixed base 1508 is connected below the second support frame 1501, the fixed base 1508 is fixedly connected with a nut of a feed ball screw 1510, and the feed ball screw 1510 is driven by a feed motor 1509 to adjust the spacing between 2 oppositely disposed grinding assemblies 15 in the same group, and the feed motor 1509 is fixedly connected with the table 12.
The foregoing detailed description of the invention has been presented for purposes of illustration and description, but is not intended to limit the scope of the invention, i.e., the invention is not limited to the details shown and described.
Claims (7)
1. The crystal silicon edge cutting and grinding and pouring integrated machine is characterized by sequentially comprising an edge cutting mechanism (1) and a grinding surface polishing mechanism (2) along the transmission direction of crystal silicon;
the chamfering cutting mechanism (1) comprises a cutting machine head (3), a first frame (11), a feeding component (5), a feeding component (14) and a first feeding sliding table (6), wherein the cutting machine head (3) is surrounded by a cutting wire (9) to form a cutting channel (10) for the passage of crystal silicon and cutting the edges and corners of the crystal silicon, the longitudinal section of the cutting wire (9) is at least polygonal with 3 sides, the cutting machine head (3) comprises a base (301), a left cutting component (302) and a right cutting component (303), the left cutting component (302) and the right cutting component (303) have the same structure, the central axes of the base (301) are used as symmetrical axes to form a cutting channel (10) for the passage of crystal silicon, the feeding component (5), the feeding component (14) and the cutting machine head (3) are all positioned in the first frame (11), the feeding component (5) and the feeding component (14) are respectively positioned on two sides of the cutting machine head (3), and the first sliding table (6) is positioned above the first frame (11) and drives the crystal silicon to move along the first frame (301) to clamp the crystal silicon (11);
grinding face polishing mechanism (2) are including grinding head (4), workstation (12), second frame (13), second feed slip table (7) and unloading subassembly, grinding head (4) are enclosed into by grinding subassembly and are supplied crystalline silicon to pass through and grind grinding passageway (8) on crystalline silicon surface, cutting passageway (10) and grinding passageway (8) parallel arrangement, second frame (13) are located the top of workstation (12) and both link firmly, grinding head (4) are located inside second frame (13), second feed slip table (7) are located second frame (13) top for centre gripping crystalline silicon and drive crystalline silicon and remove along grinding passageway (8), go up unloading subassembly (14) and unloading subassembly and are located the both sides of grinding head (4) respectively, and go up unloading subassembly (14) and be located between cutting head (3), grinding head (4).
2. The crystal silicon chamfering and grinding all-in-one machine according to claim 1, wherein the left cutting assembly (302) comprises a first supporting frame (304), a cutting motor (305), a cutting wheel (306) and a transition wheel (307), the bottom of the first supporting frame (304) is connected with the base (301) through a guiding assembly, the output end of the cutting motor (305) is connected with the cutting wheel (306), the cutting wheel (306) and the transition wheel (307) are rotatably connected with the first supporting frame (304), the transition wheel (307) is arranged in a plurality, and the cutting wire (9) sequentially bypasses the cutting wheel (306) and the transition wheel (307) to form a closed polygon.
3. The crystal silicon chamfering and grinding all-in-one machine according to claim 2, wherein a slot (308) is formed in the first support frame (304) along the length direction of the cutting channel (10), a tensioning wheel (309), a connecting seat and a tensioning cylinder are arranged at the slot (308), the tensioning cylinder is fixed on the first support frame (304), an axle of the tensioning wheel (309) is rotatably connected with the connecting seat through a bearing, the connecting seat is arranged in the slot (308) and is connected with a piston end of the tensioning cylinder, and a cutting wire (9) sequentially bypasses the cutting wheel (306), the tensioning wheel (309) and the transition wheel (307) to form a closed polygon.
4. The crystal silicon chamfering and grinding all-in-one machine according to claim 1, wherein the feeding and discharging assembly (14) and the feeding assembly (5) are identical in structure, the feeding assembly (5) comprises a bottom plate (501), a first clamping assembly, a second clamping assembly and a material carrying assembly (502), the material carrying assembly (502) is located between the first clamping assembly and the second clamping assembly, and the first clamping assembly and the second clamping assembly can slide relatively.
5. The crystal silicon chamfering and grinding all-in-one machine according to claim 4, wherein the first clamping assembly comprises a jacking cylinder (504), a first clamping plate (503) and a sliding seat (505), the first clamping plate (503) is connected with the output end of the jacking cylinder (504), the bottom plate (501) is provided with a first sliding rail (506), the sliding seat (505) fixedly connected with the first clamping plate (503) is slidably arranged on the first sliding rail (506), and the second clamping assembly comprises a second clamping plate (507) oppositely arranged with the first clamping plate (503).
6. The crystal silicon chamfering and chamfering integrated machine according to claim 1, wherein the grinding head (4) at least comprises 2 grinding components (15) which are arranged opposite to each other, the grinding components (15) comprise a second supporting frame (1501), an action component and a lifting component, the action component comprises a rotating motor (1502), a main shaft (1503) and a grinding wheel (1504), the main shaft (1503) penetrates through the second supporting frame (1501), one end of the main shaft is connected with the output end of the rotating motor (1502), the other end of the main shaft is connected with the grinding wheel (1504) which is opposite to the grinding channel (8), and a support (1505) which is rotatably connected with the main shaft (1503) is arranged on the periphery of the main shaft.
7. The integrated silicon chamfering and grinding machine according to claim 6, wherein the lifting assembly is arranged along a vertical direction and comprises a lifting fixed end (1506) and a lifting movable end (1507) which are in driving connection, the lifting fixed end (1506) is fixedly connected with the second supporting frame (1501), and the lifting movable end (1507) penetrates through the second supporting frame (1501) and is fixedly connected with the top of the support (1505).
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| CN109333290B (en) * | 2018-12-03 | 2023-09-01 | 乐山新天源太阳能科技有限公司 | Square crystal rod grinding and pouring integrated machine |
| CN110154256B (en) * | 2019-07-03 | 2024-05-31 | 青岛高测科技股份有限公司 | Cutting, edge cutting, grinding and polishing integrated machine |
| CN110744429B (en) * | 2019-11-08 | 2020-11-06 | 江苏卓燃工程咨询有限公司 | Automatic processing device for jewelry |
| CN114589825A (en) * | 2022-03-10 | 2022-06-07 | 大连连城数控机器股份有限公司 | Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method |
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