WO2012120892A1 - 光走査装置及びレーザ加工装置 - Google Patents
光走査装置及びレーザ加工装置 Download PDFInfo
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- WO2012120892A1 WO2012120892A1 PCT/JP2012/001610 JP2012001610W WO2012120892A1 WO 2012120892 A1 WO2012120892 A1 WO 2012120892A1 JP 2012001610 W JP2012001610 W JP 2012001610W WO 2012120892 A1 WO2012120892 A1 WO 2012120892A1
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- workpiece
- laser beam
- laser
- scanning
- light
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/125—Details of the optical system between the polygonal mirror and the image plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
- G02B2207/117—Adjustment of the optical path length
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to an optical scanning apparatus that scans light such as a laser beam along a scanning line, and a laser processing apparatus including such an optical scanning apparatus.
- a technique for scanning a laser beam along a linear scanning line is widely used in laser printers, facsimiles, laser processing apparatuses, and the like.
- a thin film solar cell, a flexible solar cell or the like (hereinafter collectively referred to as “thin film solar cell” for convenience) is known as a solar cell for photovoltaic power generation.
- a laser processing apparatus is used which performs patterning processing with a laser beam on a work formed by forming a semiconductor such as a metal film or a silicon film on one surface of a substrate.
- the workpiece substrate includes a rectangular glass substrate having a predetermined length, a flexible substrate used in a roll-to-roll manufacturing method, and the like.
- a laser beam is scanned along a scanning line set on a workpiece, and a thin film layer is partially peeled along the scanning line, thereby forming a processing line.
- a thin film solar cell is constituted by the thin film layer left after the patterning process.
- a pulse laser is applied to a laser beam in view of ease of fine processing, an effect of suppressing thermal influence, and the like.
- the pulsed laser is formed so as to partially overlap the irradiated region of the laser oscillated at a certain timing with the irradiated region of the laser oscillated one pulse width before on the workpiece. Scanned, thereby ensuring the continuity of the processing line.
- a region where adjacent irradiation regions of two pulses of laser beams overlap is also referred to as “coverage allowance”.
- an optical scanning device that scans a laser beam is applied to a laser processing device, a laser printer, or the like.
- the optical scanning device angularly moves laser light emitted from a light source such as a laser oscillator by a deflector such as a polygon mirror or a galvanometer mirror, and irradiates a surface to be irradiated with a laser beam that is angularly moved.
- the deflector is generally driven at a constant speed, so that the laser beam is also angularly moved at a constant speed.
- Patent Document 1 discloses a single spherical mirror as an optical element provided in place of an f ⁇ lens in an optical scanning device for a laser printer or a facsimile.
- the laser beam from the deflector is reflected by the spherical mirror and condensed on the surface of the photoreceptor.
- the scanning speed of the laser beam can be corrected evenly in the direction in which the scanning line extends, and good distortion characteristics and good image surface flatness can be obtained over a wide angle of view on the condensing surface. It is planned to do.
- Patent Document 2 discloses a plurality of mirrors arranged so as to form a substantially paraboloid as an optical element provided in place of an f ⁇ lens in an optical scanning device for a laser processing apparatus.
- the laser beam from the deflector is reflected by the mirror and falls on the work.
- the mirror arranged in this way the laser beam is incident on the workpiece as perpendicularly as possible regardless of the rotation angle of the deflector.
- the optical path length from the deflection center to the workpiece can be made as constant as possible regardless of the rotation angle of the deflector, and the laser beam can be continuously focused on the workpiece during scanning.
- the present invention makes it easy to manufacture and increase the size of an optical scanning device that maintains a focused state while keeping the deflection operation at a constant speed, scans the laser at a constant speed, and scans light such as a laser beam.
- the purpose is to be.
- the optical scanning device reflects a light projecting unit that emits light while angularly moving the light at a constant speed, reflects the light emitted from the light projecting unit, and guides it to an arbitrary irradiated point on a predetermined scanning line.
- a light reflecting means for reflecting the light emitted from the light projecting means twice or more and guiding it to the arbitrary irradiated point, and reflecting the light.
- Each of the parts is composed of a plurality of reflecting surfaces, and the optical path length from the light projecting means to the irradiated point is substantially constant over all the irradiated points on the scanning line, and is emitted from the light projecting means.
- the scanning speed of the light on the scanning line is substantially constant.
- the light projecting means emits the light while angularly moving the light at a constant speed, so that the light deflection operation can be simplified.
- the optical path length from the light projecting means to the irradiated point is substantially constant over all the irradiated points on the scanning line, and the scanning speed of the scanning line of the light emitted from the light projecting means is substantially constant. Therefore, the laser beam can be moved at a constant speed while maintaining the in-focus state regardless of the light deflection angle.
- the light reflecting means has a plurality of reflecting portions, the light emitted from the light projecting means is reflected twice or more and guided to an arbitrary irradiated point, and each reflecting portion is composed of a plurality of reflecting surfaces. The above-described effects can be achieved while facilitating the manufacture and enlargement of the reflecting means.
- the at least one of the reflection surfaces may be a flat surface. According to the said structure, a light reflection means can be manufactured still more easily.
- the light projecting means may have a rotating polygon mirror that rotates at a constant speed. According to the said structure, it can implement
- the rotary polygon mirror may have seven or more reflecting surfaces. According to the above configuration, light can be emitted while being angularly moved at a constant speed, and the above-described operation can be realized.
- the scanning line may be a straight line.
- the light projecting means may emit a pulse laser. You may further provide the cylindrical lens which makes a pulse laser flat.
- the laser processing apparatus includes the optical scanning device as described above, and forms a processing line with a laser beam on a thin film layer formed on the workpiece.
- a feeding device that feeds the workpiece in one direction at a constant feeding speed, a workpiece position holding mechanism that supports the workpiece at an accurate position by a machining unit that forms a machining line on the workpiece with the laser beam, the optical scanning device, and A control device for controlling the feeding device, wherein the optical scanning device irradiates a workpiece to be fed by the feeding device with a laser beam in a direction crossing the feeding direction, and the control device is the feeding device. While feeding the workpiece at the feeding speed or detecting and feeding the workpiece feeding speed, the optical scanning device scans one laser beam in a direction crossing the workpiece feeding direction.
- the workpiece feeding speed and the laser beam scanning speed may be relatively controlled so that the machining line is perpendicular to the feeding direction of the workpiece fed at a predetermined feeding speed.
- a laser beam is scanned from the optical scanning device while feeding and supporting the workpiece at an accurate position, and a processing line perpendicular to the workpiece feeding direction is formed in the thin film layer. Can do. For this reason, patterning can be performed on the thin film layer of the workpiece by passing the processing line at a high speed once, and processing can be performed efficiently. Further, by using a method of detecting the speed of the workpiece, performing feedback control, and adjusting the scanning timing of the laser beam, it is possible to cope with a continuously flowing workpiece such as a roll-to-roll manufacturing method. Therefore, the production efficiency can be improved by further shortening the tact time in the production process of the solar cell.
- the constant-speed feeding device may have a twist correction function for adjusting the relative angle in the plane direction between the workpiece to be sent in one direction and the laser beam.
- the laser beam may be a flat beam that is long in the scanning direction.
- the processing line can be processed at a high speed by scanning one flat beam at a high speed, and the production efficiency can be improved by further shortening the tact time.
- the workpiece is obtained by forming a thin film on a glass substrate, the laser beam is a transmitted laser beam, and the transmitted laser beam is irradiated from the anti-thin film layer direction of the glass substrate to form a processing line in the thin film layer.
- You may comprise as follows.
- a micro-explosion effect can be generated in the thin film layer on the side opposite to the irradiation side of the optical scanning device, and a processing line can be formed with low output and increased processing efficiency.
- the workpiece position holding mechanism may include a workpiece support mechanism provided below the workpiece to be fed with the thin film layer as an upper surface, and a non-contact workpiece pressing mechanism provided above the workpiece.
- a removal film suction means may be provided in the direction of the thin film layer of the workpiece.
- the film removed by the laser beam is sucked by the suction means, so that the film removed by the laser beam can be prevented from reattaching to the thin film layer.
- the in-focus state can be maintained and the laser can be scanned at a constant speed while the deflection operation is made at a constant speed. Furthermore, it is possible to easily manufacture and increase the size of an optical scanning device that scans light such as a laser beam.
- FIG. 1 is a perspective view schematically showing a laser processing apparatus according to an embodiment of the present invention. It is a conceptual diagram which shows the scanning direction of the laser beam in the laser processing apparatus shown in FIG. It is a conceptual diagram which shows schematic structure of the beam scanning unit shown in FIG. It is a conceptual diagram which shows the positional relationship of the deflection
- FIG. 1 It is a conceptual diagram which shows the covering allowance of the pulse laser irradiated from the beam scanning unit shown in FIG. It is a side view which shows typically the process part of the laser processing apparatus shown in FIG. It is a partial side view which expands and shows typically the processing part shown in FIG. It is a partial side view which shows the effect
- the laser processing apparatus 1 is used for patterning when manufacturing a thin film solar cell
- the workpiece 5 is an intermediate product of the thin film solar cell in which the thin film layer 6 is formed on the substrate 7. The case where it is is illustrated.
- FIG. 1 is a perspective view schematically showing a laser processing apparatus 1 according to an embodiment of the present invention.
- the laser processing apparatus 1 includes a feeding device 3, a laser beam unit 30, and a control device 60.
- the feeding device 3 supports the workpiece 5 in a horizontal posture with the thin film layer 6 facing upward, and feeds the workpiece 5 at a constant speed in a feeding direction Y that is one horizontal direction.
- the longitudinal direction of the workpiece 5 is directed parallel to the feed direction Y, and the width direction of the workpiece 5 is oriented in a horizontal direction orthogonal to the feed direction Y.
- the feeding device 3 includes a workpiece gripping portion 12 that corrects the posture of the workpiece 5 about the Z axis in the vertical direction. By the operation of the workpiece gripping part 12, the relative angle in the plane direction between the width direction of the workpiece 5 and the scanning line of the laser beam 50 can be adjusted, and the consistency between the longitudinal direction of the workpiece 5 and the feeding direction Y can be ensured.
- the laser beam unit 30 includes a laser oscillator 31 and a beam scanning unit 32.
- the laser oscillator 31 sequentially oscillates a pulse laser at a constant frequency on the order of kilohertz to megahertz, and sequentially emits the generated pulse laser to the beam scanning unit 32.
- the beam scanning unit 32 irradiates the workpiece 5 while deflecting the laser beam 50 from the laser oscillator 31. As a result, the laser beam 50 is scanned in the direction intersecting the feed direction Y on the workpiece 5.
- the laser beam 50 incident on the workpiece 5 passes through the substrate 7 and is focused on the thin film layer 6.
- the beam scanning unit 32 is disposed below the feeding device 3, and the laser beam 50 passes upward through the beam irradiation port 34 of the beam scanning unit 32. , And enters the work 5 from below.
- the thin film layer 6 is peeled off along the scanning line of the laser beam 50, and a linear groove (hereinafter referred to as “processing line 52”) is formed in the thin film layer 6.
- the scanning line of the laser beam 50 extends linearly in the width direction of the workpiece 5, and the processing line 52 is also formed to extend in the width direction of the workpiece 5.
- One workpiece 5 is formed with a plurality of processing lines arranged at intervals in the longitudinal direction of the workpiece 5.
- a processing unit 33 is provided in the vicinity of the position where the beam scanning unit 32 is installed in the feed direction Y, and the workpiece position holding mechanism 20 is provided in the processing unit 33.
- the workpiece position holding mechanism 20 supports the workpiece 5 at an accurate position. More specifically, the workpiece position holding mechanism 20 moves the workpiece 5 in the vertical direction while allowing the workpiece 5 to move in the feeding direction Y at least in the vicinity of the position where the beam scanning unit 32 is installed in the feeding direction Y. To be restrained. Thereby, it is possible to prevent the focal point of the laser beam 50 from shifting from the desired position in the vertical direction (generally coincides with the optical path direction of the laser beam 50).
- the control device 60 controls the feeding device 3, the laser beam unit 30, the workpiece gripping portion 12, and the workpiece position holding mechanism 20.
- the control device 60 controls the laser oscillator 31 so that the pulse laser is oscillated at a constant frequency while forming one processing line.
- the control device 60 controls the beam scanning unit 32 so that the laser beam 50 is scanned at a constant speed while forming one processing line.
- the laser machining apparatus 1 may form the machining line 52 while feeding the workpiece 5, or may stop feeding the workpiece 5 while the machining line 52 is being formed.
- the control device 60 continuously feeds the workpiece 5 in the feed direction Y at a constant speed or at an unequal speed while forming the required number of machining lines 52.
- the feeding device 3 is controlled so as to continue.
- the scanning direction of the laser beam 50 when forming the machining line 52 while feeding the workpiece 5 at a constant speed will be briefly annotated.
- the scanning line of the laser beam 50 is required to extend linearly in parallel with the width direction of the work 5 when viewed from the work 5 being sent in the feed direction Y.
- the beam scanning unit 32 does not move in the feed direction Y, the workpiece 5 translates at a constant speed in the feed direction Y, and the laser beam 50 is attempted to be scanned at a constant speed as described later.
- the scanning line of the laser beam 50 extends linearly in a horizontal direction inclined both in the longitudinal direction of the workpiece 5 and in the width direction of the workpiece 5 when viewed from the ground where the beam scanning unit 32 is installed. Is required.
- ground scanning direction XG when it is clarified that the scanning direction of the laser beam 50 is viewed from the ground, it is referred to as “ground scanning direction XG” and is viewed from the workpiece 5 being sent in the feeding direction Y.
- relative scanning direction XW When it is clarified that there is, it is referred to as “relative scanning direction XW”.
- ground scanning speed VXG When it is clarified that the scanning speed of the laser beam 50 is viewed from the ground, “ground scanning speed VXG”, and when it is clarified that the scanning speed is viewed from the work 5 being sent in the feed direction Y Is referred to as “relative scanning speed VXW”.
- the relative scanning direction XW corresponds to the width direction of the workpiece 5.
- the relative scanning speed VXW corresponds to the combined speed of the ground scanning speed VXG in the horizontal plane and the feed speed VY of the workpiece 5.
- the relative scanning direction XW is orthogonal to the feed direction Y.
- an angle formed by the relative scanning direction XW and the ground scanning direction XG in a horizontal plane is defined as an inclination angle ⁇ .
- the feed speed VY is divided by the ground scanning speed VXG
- the polygon mirror continuously rotates in one direction, thereby scanning the laser beam 50.
- a processing line 52 is formed and emitted from the certain ridge.
- the laser beam 50 forms the start point of the one processing line 52 and the laser beam 50 emitted from the next ridge portion forms the end point of the one processing line 52.
- the viewpoint is set on the workpiece 5 for the purpose of generalizing the scanning direction of the laser beam 50 regardless of how the workpiece 5 is fed. That is, in the following description, “scanning direction X” is the relative scanning direction XW unless otherwise specified, and “scanning line” is the scanning line in the relative scanning direction XW unless otherwise specified, and “scanning speed VX”. Is the relative scanning speed VXW unless otherwise specified.
- the above formula cannot be used as it is, but it is possible to derive the inclination angle and the ground scanning speed that change with time with the feed speed according to the time. Therefore, if the inclination angle and the ground scanning speed derived according to the time are used, the description based on the workpiece can be replaced with the description based on the ground.
- the processing line is formed by stopping the feeding of the workpiece 5, the relative scanning direction coincides with the ground scanning direction, and the relative scanning speed coincides with the ground scanning speed.
- the beam scanning unit 32 described below can be suitably applied to the laser processing apparatus 1 that performs patterning processing of a thin-film solar cell regardless of how the workpiece 5 is fed. Note that the beam scanning unit 32 described below can be used for patterning processing other than the thin film solar cell, and can also be used for laser scanning other than patterning processing.
- FIG. 3 is a conceptual diagram showing the configuration of the beam scanning unit 32.
- the beam scanning unit 32 is an optical element or an optical unit that constitutes an optical system that scans the laser beam 50, and sequentially from the beam oscillator 31 along the optical path of the laser beam 50, a lens 61 and a prism 62.
- the beam scanning unit 32 includes a housing 69 that houses the optical element and a part of the optical unit.
- FIG. 3 illustrates a case where the housing 69 accommodates the second folding mirror 64, the light projecting unit 65, the light reflecting unit 66, and the cylindrical lens 67, but this is only an example, and the lens 61 and the prism 62 are included.
- the first folding mirror 63 may be housed in the housing 69, and the cylindrical lens 68 may be disposed outside the housing 70.
- the beam irradiation port 34 described above is provided on the upper surface of the housing 69.
- the laser beam 50 is emitted upward from the inside of the housing 69 through the beam irradiation port 34.
- the lens 61 is an optical element that enables the laser beam 50 generated by the laser oscillator 31 to be focused.
- the prism 62, the first folding mirror 62 and the second folding mirror 63 guide the laser beam 50 that has passed through the lens 61 to the polygon mirror 65.
- these elements 62 to 64 constitute an optical unit that bends the optical path so as to secure an optical path length necessary for focusing the laser beam 50 with the work 5 on the upstream side of the optical path from the polygon mirror 65.
- These elements 62 to 64 can be omitted as appropriate, and other prisms or mirrors may be appropriately added between the lens 61 and the polygon mirror 65.
- the light projecting unit 65 radiates the laser beam 50 incident from the second folding mirror 64 so that the laser beam 50 is angularly moved at a constant speed.
- the light reflecting unit 66 reflects the light emitted from the light projecting unit 65 and guides it to an arbitrary irradiated point on the scanning line. By the operation of the light projecting unit 65, the irradiated point sequentially moves in the scanning direction X along the scanning line on the workpiece 5.
- the optical path length from the light projecting unit 65 to the irradiated point is substantially constant over all the irradiated points. Further, the scanning speed VX on the scanning line of the laser beam 50 emitted from the light projecting unit 65 is substantially constant.
- the light projecting unit 65 and the light reflecting unit 66 configured to realize this will be described.
- the light projecting unit 65 includes a polygon mirror (rotating polygon mirror) 70 and a deflection actuator 75.
- the polygon mirror 70 is a deflector provided rotatably in the housing 69, and the rotation axis of the polygon mirror 70 is directed in a horizontal direction orthogonal to the scanning direction X.
- the deflection actuator 75 is, for example, an electric motor, and rotationally drives the polygon mirror 70 in one direction at a constant speed. As a result, the laser beam 50 from the polygon mirror 70 is angularly moved at a constant speed.
- the operations of the deflection actuator 75 and the polygon mirror 70 and the deflection action of the laser beam 50 caused thereby are controlled by the control device 60 (see FIG. 1).
- the polygon mirror 70 is formed in the shape of a regular polygonal column as a whole, and has a plurality of reflecting surfaces provided on each side surface thereof.
- the laser beam 50 is incident on the side of the rotating polygon mirror 70 and is reflected at a reflection angle corresponding to the rotation angle position of the polygon mirror 70 at that time.
- the polygon mirror 70 rotates 360 / N [deg] after the laser beam 50 is reflected from the ridge portion of the polygon mirror 70 to the next ridge portion (N: number of reflection surfaces of the polygon mirror).
- the laser beam 50 reflected by the polygon mirror 70 is angled around the reflection point (ie, the deflection center) on the polygon mirror 70 by twice the rotation angle of the polygon mirror 70 (ie, 720 / N [deg]).
- the position of the deflection center slightly moves depending on the rotation angle of the polygon mirror 70, the movement of the deflection center corresponding to the rotation angle of the polygon mirror 70 is ignored in the following description.
- the entire movement range of the deflection center in a strict sense is referred to as “deflection center”.
- the laser beam 50 is reflected from a certain ridge portion of the polygon mirror 70 until it is reflected by the next ridge portion (that is, the laser beam 50 is sandwiched between the two ridge portions). While passing through the reflecting surface, the laser beam 50 is scanned along one scanning line on the workpiece 5.
- the irradiation point of the laser beam reflected by the certain ridge is the start point of the scanning line
- the irradiation point of the laser beam 50 reflected by the next ridge is the end point of the scanning line.
- the beam scanning unit 32 does not include means for changing the focal length of the laser beam 50 according to the rotation angle of the polygon mirror 70 (although the optical scanning apparatus according to the present invention includes such means. Not disturb). If the light reflecting portion 66 does not exist, the focal point of the laser beam 50 draws an arc-shaped locus.
- the locus center is the deflection center, and the radius of the locus is the optical path length from the deflection center to the focal point.
- the scanning line extends linearly in the scanning direction X, unlike the arc-shaped trajectory.
- the distance from the arbitrary irradiated point on the scanning line to the focal point changes according to the position of the irradiated point (that is, the deflection angle of the laser beam 50 or the rotation angle of the polygon mirror 70). Therefore, the optical path length from the polygon mirror 70 to an arbitrary irradiated point on the scanning line is not constant over the entire irradiated point, and changes according to the position of the irradiated point. Further, if the laser beam 50 is angularly moved at a constant speed, the scanning speed of the laser beam 50 on the scanning line is not constant.
- the light reflecting portion 66 reflects the laser beam 50 from the light projecting portion 65 at least twice and then guides it to the work 5 in order to solve this problem.
- the light reflecting unit 66 is configured so that the optical path length from the light projecting unit 65 to an arbitrary irradiated point on the scanning line on the workpiece 5 is substantially constant over all irradiated points, and the laser beam 50 is angular at a constant speed.
- a plurality of reflecting portions are provided so that the scanning speed of the laser beam 50 is substantially constant even when the laser beam is moving.
- the light reflecting unit 66 includes a primary reflecting unit 71 that reflects the laser beam 50 from the light projecting unit 65 (polygon mirror 70) and a secondary reflection that further reflects the laser beam 50 from the primary reflecting unit 71. And the laser beam 50 from the light projecting unit 65 (polygon mirror 70) is reflected twice.
- the beam scanning unit 32 according to the present embodiment constitutes the primary reflection unit 71 between the polygon mirror 70 and the cylindrical lens 67 as an optical element constituting an optical system that scans the laser beam 50.
- a primary mirror 73 and a secondary mirror 74 constituting the secondary reflector 72 are provided.
- the light reflecting portion 66 is constituted by the primary mirror 73 and the secondary mirror 74 and is fixed in the housing 69. However, the light reflecting portion 66 may have three or more reflecting portions.
- the light reflecting portion 66 reflects the laser beam twice and the laser beam 50 enters the work 5 from below. Therefore, the laser beam 50 from the second folding mirror 63 enters the polygon mirror 70 substantially downward.
- the polygon mirror 70 reflects the incident laser beam 50 substantially upward.
- the primary mirror 73 is disposed above the polygon mirror 70 and reflects the laser beam 50 from the polygon mirror 70 substantially downward.
- the secondary mirror 74 is disposed below the primary mirror 73 and reflects the laser beam 50 from the primary mirror 73 generally upward.
- FIG. 4 is a conceptual diagram showing a positional relationship among the deflection center C, the primary reflection unit 71, the secondary reflection unit 72, and the scanning line 52.
- the laser beam 50 moves on the workpiece 5 in the scanning direction X along one scanning line 52 while the laser beam 50 passes through one reflecting surface of the polygon mirror 70. If the primary mirror 73 and the secondary mirror 74 do not exist, the focal point of the laser beam 50 draws an arc VA (hereinafter referred to as “virtual arc VA”) centered on the deflection center C.
- the radius R of the virtual arc VA is the optical path length from the deflection center C to the focal point.
- the primary mirror 73 and the secondary mirror 74 are rearranged so that the optical path from the deflection center C to the focal point is bent so that the virtual arc VA extends linearly on the workpiece 5 in the scanning direction X (width direction of the workpiece 5). To do.
- the length of the virtual arc VA is required to be equal to the length of the scanning line 52.
- the length of the scanning line 52 corresponds to the length LXW of the processing line 52 in the width direction of the workpiece 5.
- LXW line length LXW.
- the central angle of the virtual arc VA (that is, the angular movement range of the laser beam 50) is 720 / N [deg].
- the circumference ratio is ⁇ and the radius of the virtual arc VA is R
- the length of the virtual arc VA is 2 ⁇ R / ⁇ 360 ⁇ (N / 720) ⁇ , which is equal to the line length LXW.
- the line length LXW cannot be longer than the diameter of the virtual arc VA. From the above, the inequality (1) can be derived.
- the polygon mirror 70 according to the present embodiment is required to have seven or more reflecting surfaces (N is an integer).
- the number N of reflecting surfaces is preferably an even number. If the number is even, the light reflecting portion 66 (more specifically, the primary reflecting portion 71 and the secondary reflecting portion 72 in this embodiment) can be easily arranged with the vertical axis of FIG. 4 as the axis of symmetry. . Further, when the number N of reflection surfaces is increased, the rotation angle of the polygon mirror 70 corresponding to one scanning line and the virtual arc VA are reduced, and it is difficult to increase the line length LXW. Therefore, it is preferable that the polygon mirror 70 has eight reflecting surfaces. FIG.
- the number of reflecting surfaces of the polygon mirror 70 is 8, and the deflection range for passing one reflecting surface is 90 degrees.
- the number of reflection surfaces of the polygon mirror 70 does not necessarily need to be 7 or more.
- the number of reflection surfaces of the polygon mirror 70 is appropriately 6 or less. It is also possible.
- a specific methodology for rearranging the virtual arc VA so as to coincide with the scanning line 52 will be described.
- a plurality of virtual divided arcs DVA1, DVA2,... are obtained by dividing the virtual arc VA at equal intervals.
- a plurality of virtual strings VC1, VC2,... Corresponding to the plurality of virtual divided arcs DVA1, DVA2,.
- the virtual strings VC1, VC2,... are rearranged so that the virtual strings VC1, VC2,.
- the scanning line 52 is formed by the plurality of virtual strings VC1 ′, VC2 ′,.
- the two ends of the virtual divided arcs DVA1, DVA2,... are rearranged on the scanning line 52, and the virtual divided arcs DVA1, DVA2,. ) Is rearranged downstream of the scanning line 52 in the optical axis direction.
- the focal point tends to move along the virtual divided arcs DVA1 ′, DVA2 ′,.
- the virtual divided arcs DVA1 ′, DVA2 ′,... After the rearrangement are successively continued in the scanning direction X in the same manner as the virtual strings VC1 ′, VC2 ′,.
- the optical path length from the deflection center C of the polygon mirror 70 to an arbitrary irradiated point on the scanning line 52 is substantially constant over all focal points. If the laser beam 50 is angularly moved at a constant speed, the focal point tends to move at a constant speed along the virtual divided arcs DVA1 ′, DVA2 ′,. Since the virtual divided arcs DVA1 ′, DVA2 ′,... Are well approximated to the corresponding virtual strings VC1 ′, VC2 ′,. Approximate.
- the light reflection unit 66 reflects the primary reflection unit 71 that reflects the laser beam from the light projecting unit 65 and the secondary reflection unit that further reflects the laser beam 50 from the primary reflection unit 71. 72, the laser beam 50 from the light projecting unit 65 is reflected at least twice, and the focal point of the laser beam 50 emitted from the light projecting unit 65 is deflected when it is not assumed that the light reflecting unit 66 does not exist.
- the light reflecting section 66 reflects the laser beam 50 (at least) twice to divide the virtual arc VA, thereby obtaining a plurality of virtual divided arcs DVA1, DVA2, and so on.
- the laser beam 50 can be moved in the scanning direction X at the constant speed as much as possible while simplifying the operation of the polygon mirror 70 and continuing to focus the laser beam 50 on the work 5 as much as possible. For this reason, it is possible to simultaneously improve the operation reliability of the beam scanning unit 32, improve the processing efficiency, and suppress the processing unevenness. Further, it is not necessary to use special means for changing the focal length of the laser beam 50 in accordance with the rotation angle of the polygon mirror 70.
- the number of divisions can be determined as appropriate according to the error allowed for the beam scanning unit 32 and the laser processing apparatus. For example, as shown in FIG. 4, when the number of reflecting surfaces N of the polygon mirror 70 is 8, and the number of divisions is 8 (the center angle of the virtual divided arc is 11.25 degrees), the virtual divided arc and the virtual chord Error (length base) is 1.98%.
- the error is 0.63%, and the division number is 36 (virtual division). If the arc has a central angle of 2.5 degrees), the error is 0.10%.
- the sector formed by the virtual divided arcs DVA1, DVA2, ... corresponding to the virtual strings VC1, VC2,.
- two folds are formed in a fan shape.
- the first (first) fold corresponds to one of the plurality of reflecting surfaces 77 constituting the primary reflecting portion 71
- the second (second) fold constitutes the secondary reflecting portion 72. This corresponds to one of the plurality of reflecting surfaces 78.
- a plurality of virtual strings VC1, VC2,... Cannot be rearranged along a straight line unless the sector is bent twice or more.
- the light reflecting portion 66 has a plurality of reflecting portions (in this embodiment, two types of reflecting portions, a primary reflecting portion 71 and a secondary reflecting portion 72).
- the reflecting surface 77 of the primary reflecting portion 71 corresponding to a certain virtual divided arc DVA1, DVA2,... Overlaps with the reflecting surface 77 of the primary reflecting portion 71 corresponding to the virtual divided arc DVA1, DVA2,. It is preferable not to be.
- the second fold line that is, the reflecting surface 78 constituting the secondary reflecting portion 72
- the second fold line is arranged in a direction perpendicular to the scanning lines 52 and the virtual strings VC1 ′, VC2 ′,. Can be arranged.
- the laser beam 50 reflected by the secondary reflecting portion 72 can be incident on the workpiece 5 substantially vertically. For this reason, processing efficiency improves and processing nonuniformity can be suppressed.
- the ends of the first fan-shaped folds adjacent to each other that is, the ends of two adjacent reflecting surfaces among the plurality of reflecting surfaces 77 constituting the primary reflecting portion 71) are continuous. preferable. Then, the whole primary reflection part 71 can be formed as small as possible.
- the second fold is not continuous with the adjacent fold. That is, two adjacent reflecting surfaces among the plurality of reflecting surfaces 78 constituting the secondary reflecting portion 72 are not continuous. However, as the number of divisions of the virtual divided arcs DVA1, DVA2,... Increases, the end of the second fold approaches the end of the adjacent fold.
- the virtual strings VC1, VC2,..., which are straight lines, are rearranged along a straight line extending in the scanning direction X, so that both the two folds can be straight lines. That is, the reflecting surface 77 of the primary reflecting portion 71 corresponding to a certain virtual string and the reflecting surface 78 constituting the secondary reflecting portion 72 are both flat. In particular, in the secondary reflection unit 72, the reflection surface 78 corresponding to a certain virtual string is arranged away from the reflection surface 78 corresponding to the adjacent virtual string.
- the secondary mirror 74 may have any structure as long as the reflection surface 78 of the secondary reflection portion 72 can be disposed as described above.
- the light reflecting portion 66 includes a plurality of secondary mirrors 74A arranged apart from each other, and a plurality of reflecting surfaces obtained by fan-shaped bending on the mirror body 76A of each secondary mirror 74A. 78 are provided individually.
- a single mirror main body 76B may be provided with a plurality of reflecting surfaces 78 at necessary positions and integrated.
- each reflection part 71 and 72 is comprised from the some reflective surface 78 arranged in a row, the light reflection part 66 is contrasted with the case where a light reflection part is implement
- the light reflecting portion 66 can be more easily manufactured. However, not all of the reflecting surfaces need to be flat.
- FIG. 6 is a partial cross-sectional view of the polygon mirror 70.
- the laser beam 50 is folded back and forth multiple times within the housing 69, but each element 64, 70, 73, 74 is required to be arranged so as not to interfere with the optical path. Therefore, as shown in FIG. 6, a 45-degree prism 81 is provided on the side of the polygon mirror 70.
- the 45 degree prism 81 emits the incident laser beam 50 in a direction parallel to the incident direction, and the outgoing optical path is separated from the incident optical path in the axial direction of the rotation shaft 82 of the polygon mirror 70 (in FIG. 3, the direction orthogonal to the plane of the drawing). Can do.
- the laser beam 50 emitted from the polygon mirror 70 can be guided to the primary reflecting portion 71 without interfering with the second folding mirror 64. Moreover, it is not necessary to arrange the optical path on a plane inclined with respect to the paper surface of FIG. 3, and the installation work of the optical element is simplified. This 45 degree prism may be applied to the primary reflection part 71 and the secondary reflection part 72.
- the beam scanning unit 32 includes the cylindrical lens 67 as described above.
- the cylindrical lens 67 flattens the laser beam 50 reflected by the secondary reflection unit 72.
- FIG. 7 is a conceptual diagram illustrating the formation of a processing line using a flattened pulse laser.
- the laser oscillator 31 according to the present embodiment generates a pulse laser.
- the pulse laser has a small-diameter circular shape, and the pulse laser 51 that has passed through the cylindrical lens 67 is elongated in the scanning direction, shortened in the direction perpendicular to the scanning direction, and flattened in an elliptical shape.
- the irradiation region of each flat pulse laser 51 partially overlaps the irradiation region of the pulse laser 51 oscillated one pulse width before.
- the beam scanning unit 32 can make the scanning speed VX of the laser beam 50 substantially constant, it is possible to suppress variation in the size of the covering margin 59.
- the scanning speed can be increased accordingly, which is beneficial.
- the pulse laser 51 is considered in consideration of the longitudinal dimension of the flat pulse laser 51 and the feed speed VY of the workpiece 5. Irradiation may be performed with a step that slightly protrudes in the feed direction Y from the front end side.
- the beam scanning unit according to the embodiment of the present invention has been described so far, but the above configuration can be changed as appropriate.
- the light projecting unit is not limited to a polygon mirror, and other deflectors such as a galvano mirror may be applied.
- the light reflecting part may have three or more reflecting parts.
- FIG. 8 is a side view schematically showing the processing portion 33 shown in FIG.
- FIG. 9 is a partial side view schematically showing the processing portion 33 shown in FIG. 8 in an enlarged manner.
- FIG. 10 is a partial side view schematically showing the action of laser beam irradiation in the processing section 33 shown in FIG.
- the workpiece position holding mechanism 20 includes a workpiece support mechanism 21 that is disposed below the workpiece 5 together with the beam scanning unit 32, and a workpiece pressing mechanism 22 that is disposed above the workpiece 5.
- the beam scanning unit 32 and the workpiece support mechanism 21 are provided at the lower portion of the processing portion 33, and the workpiece pressing mechanism 22 is provided at the upper portion of the processing portion 33.
- the work support mechanism 21 for example, a roller, a free bearing, a non-contact air adsorption unit (such as an attracting mechanism that attracts the work 5 from below) by air or the like is used.
- the non-contact air adsorption unit 23 is applied to the work support mechanism 21, and the work 5 is in a state where a gap is formed between the work 5 and the non-contact air adsorption unit 23 as shown in FIG. Then, it is adsorbed downward by the non-contact air adsorbing unit 23. Thereby, it can suppress that the vertical position (level) of the workpiece
- the workpiece 5 is sent in such a posture that the surface of the thin film layer 6 is a surface (that is, an upper surface) opposite to the beam irradiation port 34 with respect to the workpiece 5. For this reason, the laser beam 50 from the beam irradiation port 34 passes through the substrate 7 upward and is irradiated so as to be focused on the thin film layer 6.
- the laser beam 50 is focused on the thin film layer 6 so that the thin film layer 6 can be removed and the processing line 52 can be formed. Since the laser beam 50 irradiates the workpiece 5 from the side opposite to the thin film layer 6, the peeled thin film 10 (see also FIG. 10), the vaporized material 11 (see also FIG. 10), the optical system (the beam scanning unit 32, etc.) A substrate 7 exists between the two. Therefore, the optical system can be protected from the thin film 10 and the transpiration material 11 peeled off by the substrate 7.
- an air blower 24 that presses the work 5 in a non-contact manner from above or a pressing roller is used.
- an air blower 24 is applied to the workpiece pressing mechanism 22.
- the processing section 33 is provided with a suction duct 25 for sucking the peeled thin film 10 and the transpiration material 11.
- the suction duct 25 is provided on the opposite side of the beam scanning unit 32 with respect to the workpiece 5, that is, above the workpiece 5 and above the processing portion 33.
- the suction duct 25 is provided integrally with the air blower 24 applied to the workpiece pressing mechanism 22. Thereby, the air from the air blower 24 is easily sucked by the suction duct 25. Therefore, after the peeled thin film 10 is blown off by the air blower 24, the thin film 10 can be more reliably sucked by the suction duct 25. At this time, the transpiration material 11 can also be sucked more reliably. Thereby, it can suppress that the thin film 10 and the transpiration
- the workpiece 5 is a film-forming glass in which a thin film layer 6 is formed on a substrate 7, and a laser beam 50 is irradiated from the anti-thin film layer side to the workpiece 5 to be sent with the thin film layer 6 on the upper surface.
- a micro explosion effect is produced between the substrate 7 and the thin film layer 6.
- the processing line 52 is formed in the thin film layer 6 at a low output, and the processing efficiency is increased. That is, a portion to be vaporized and peeled off is generated between the thin film layer 6 and the substrate 7 by the laser beam 50, and as shown in FIG. 10, a micro-explosion effect is generated in the vaporized portion to form the thin film layer 6 By peeling off, the thin film layer 6 can be efficiently patterned at a high speed with low output.
- the processing can be continuously performed at high speed.
- High-speed continuous processing is possible not only for processing the workpiece 5 for each substrate but also for continuous workpieces produced by the roll-to-roll manufacturing method for flexible solar cells.
- FIGS. 11A to 11G are side sectional views showing a procedure for manufacturing a solar cell by the laser processing apparatus shown in FIG. A typical manufacturing procedure of the thin-film solar cell 40 by the laser processing apparatus 1 having the above configuration will be described.
- the transparent electrode layer 6A is formed on the substrate 7 shown in FIG. 11A as shown in FIG. 11B.
- a processing line 52A for the transparent electrode layer 6A is formed.
- the processing line 52A is formed by scanning the laser beam 50 at a constant speed in the scanning direction X while feeding the workpiece 5 at a constant speed in the feed direction Y. As shown in FIG.
- the photoelectric conversion layer 6B is formed on the workpiece 5 in which the formation of the processing line 52A is completed on the transparent electrode layer 6A in this way.
- a processing line 52B is formed in the photoelectric conversion layer 6B, similarly to the processing of the processing line 52 by the laser processing apparatus 1. Since this processing line 52B has a focal length by the laser processing apparatus 1 that matches the photoelectric conversion layer 6B, the photoelectric conversion layer 6B is peeled off so that a predetermined processing line 52B is formed in the photoelectric conversion layer 6B. It is.
- the back surface electrode layer 6C is formed into a film.
- the processing line 52C is formed by the laser processing apparatus 1 for the back electrode layer by the same processing method as the formation of the processing lines 52A and 52B. In this way, a modularized solar cell 40 is produced.
- the work 5 is fed in the transport direction (Y direction) and intersects the transport direction. Since the processing lines 52, 53, and 54 can be formed at high speed in the X direction, the processing lines 52, 53, and 54 can be continuously patterned without stopping the conveyance of the workpiece 5.
- the tact time for forming the processing lines 52A to 52C on the workpiece 5 can be greatly shortened, and the productivity of solar cells and the like can be greatly improved.
- the cost reduction of the solar cell 40 can be achieved, and the utilization of the solar cell can be promoted.
- the solar cell 40 capable of obtaining high power generation efficiency by improving the power generation area is provided. It becomes possible to produce it stably.
- a plurality of beams due to spectroscopy, distribution, and mounting of a plurality of oscillators are not used, it is possible to reduce the cost of the laser processing apparatus 1 that can manufacture the solar cell 40 with stable processing quality.
- the workpiece 5 is continuously fed in the feed direction Y at a constant speed.
- the workpiece 5 may be fed intermittently at regular intervals according to processing conditions and the like.
- the above-described embodiment shows an example, and various modifications can be made without departing from the gist of the present invention, and the present invention is not limited to the above-described embodiment.
- the present invention makes it possible to maintain the in-focus state while keeping the deflection operation at a constant speed and to scan the laser at a constant speed, and to easily manufacture and increase the size of an optical scanning device that scans light such as a laser beam.
- the present invention can be applied to various types of optical scanning, and is particularly useful when used for manufacturing thin film solar cells such as thin film solar cells and flexible solar cells.
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Abstract
Description
図1は、本発明の一実施形態に係るレーザ加工装置1を模式的に示す斜視図である。図1に示すように、レーザ加工装置1は、送り装置3、レーザビームユニット30及び制御装置60を備えている。
次に、上記レーザ加工装置1に適用されたビーム走査ユニット32の構成及び作用について説明する。なお、以降の説明では、レーザビーム50の走査方向をワーク5の送り方と関係なく一般化する目的で、視点をワーク5におくこととする。すなわち、以降の説明では、「走査方向X」は、特段断らない限り相対走査方向XWであり、「走査線」は、特段断らない限り相対走査方向XWにおける走査線であり、「走査速度VX」は、特段断らない限り相対走査速度VXWである。上記式(sinφ=VY/VXG、VXW=VXG×cosφ、tanφ=LY/LXW)を用いれば、以降のワーク基準での説明を、ワーク5を一定の送り速度VYで連続的に送りながら加工ライン52を形成する場合における地面基準での説明に換えることができる。
図8は、図1に示す加工部33を模式的に示す側面図である。図9は、図8に示す加工部33を拡大して模式的に示す部分側面図である。図10は、図8に示す加工部33におけるレーザビームの照射の作用を模式的に示す部分側面図である。
3 送り装置
5 ワーク
30 レーザビームユニット
31 レーザ発振器
32 ビーム走査ユニット
50 レーザビーム
51 パルスレーザ
52 走査線
52A~C 加工ライン
60 制御装置
65 投光部
66 光反射部
67 シリンドリカルレンズ
68 偏向アクチュエータ
69 筐体
70 ポリゴンミラー
71 一次反射部
72 二次反射部
73 一次ミラー
74 二次ミラー
C 偏向中心
VA 仮想円弧
DVA1,DVA2,… 仮想分割円弧
VC1,VC2,… 仮想弦
VC1´,VC2´,… 配置転換後の仮想弦
DVA1´,DVA2´,… 配置転換後の仮想分割円弧
Claims (14)
- 光を等速で角移動させながら放射する投光手段と、
前記投光手段から放射された光を反射して所定の走査線上の任意の被照射点に導くための光反射手段と、を備え、
前記光反射手段は複数の反射部を有して前記投光手段から放射された光を2度以上反射して前記任意の被照射点に導き、前記反射部の各々が複数の反射面から構成され、
前記投光手段から前記被照射点までの光路長が前記走査線上の全ての被照射点にわたって略一定であり、且つ、前記投光手段から放射された光の前記走査線上での走査速度が略一定である、光走査装置。 - 前記反射面の少なくとも一つが平面である、請求項1に記載の光走査装置。
- 前記投光手段が等速で回転する回転多面鏡を有する、請求項1に記載の光走査装置。
- 前記回転多面鏡が7以上の反射面を有する、請求項3に記載の光走査装置。
- 前記走査線が直線である、請求項1に記載の光走査装置。
- 前記投光手段がパルスレーザを放射する、請求項1に記載の光走査装置。
- パルスレーザを扁平にするシリンドリカルレンズを更に備える、請求項6に記載の光走査装置。
- 請求項1乃至7のいずれか1項に記載の光走査装置を備え、ワークに形成された薄膜層にレーザビームで加工ラインを形成するレーザ加工装置。
- 前記ワークを所定の送り速度で一方向に送る定速送り装置と、
前記レーザビームでワークに加工ラインを形成する加工部で該ワークを正確な位置に支持するワーク位置保持機構と、
前記光走査装置及び前記定速送り装置を制御する制御装置と、を備え、
前記光走査装置が、前記定速送り装置で送るワークに対して送り方向と交差する方向にレーザビームを照射し、
前記制御装置が、前記定速送り装置でワークを所定速度で送りながら、又はワークの送り速度を検出して送りながら、前記光走査装置からワークの送り方向と交差する方向に1本のレーザビームを走査し、この1本のレーザビームの加工ラインが、所定の送り速度で送るワークの送り方向に対して直角となるようにワークの送り速度とレーザビームの走査速度とを相対的に制御する、請求項8に記載のレーザ加工装置。 - 前記定速送り装置は、一方向に送るワークとレーザビームとの平面方向相対角度を調整する捻り補正機能を具備している、請求項9に記載のレーザ加工装置。
- 前記レーザビームは、走査方向に長い扁平ビームである、請求項9に記載のレーザ加工装置。
- 前記ワークは、ガラス基板に薄膜を成膜したものであり、前記レーザビームは透過レーザビームであり、
前記透過レーザビームをガラス基板の反薄膜層方向から照射して薄膜層に加工ラインを形成するように構成した、請求項9に記載のレーザ加工装置。 - 前記ワーク位置保持機構は、前記薄膜層を上面にして送るワークの下方に設けたワーク支持機構と、ワークの上方に設けた非接触のワーク押付機構とを有している、請求項9に記載のレーザ加工装置。
- 前記ワークの薄膜層の方向に除去膜吸引手段を設けた、請求項9に記載のレーザ加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020137022778A KR101494564B1 (ko) | 2011-03-08 | 2012-03-08 | 광 주사 장치 및 레이저 가공 장치 |
US14/004,037 US9604309B2 (en) | 2011-03-08 | 2012-03-08 | Optical scanning device and laser machining device having pluralities of flat reflective surfaces corresponding to divided virtual arcs |
EP12754585.3A EP2684636B1 (en) | 2011-03-08 | 2012-03-08 | Laser machining device with an optical scanning device |
JP2013503398A JP5401629B2 (ja) | 2011-03-08 | 2012-03-08 | 光走査装置及びレーザ加工装置 |
CN201280011088.6A CN103384580B (zh) | 2011-03-08 | 2012-03-08 | 光扫描装置及激光加工装置 |
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JP2014098871A (ja) * | 2012-11-16 | 2014-05-29 | Kawasaki Heavy Ind Ltd | 光走査装置 |
WO2020004178A1 (ja) * | 2018-06-25 | 2020-01-02 | 川崎重工業株式会社 | 導光装置及びレーザ加工装置 |
WO2020004177A1 (ja) * | 2018-06-25 | 2020-01-02 | 川崎重工業株式会社 | 導光装置及びレーザ加工装置 |
JP2020003518A (ja) * | 2018-06-25 | 2020-01-09 | 川崎重工業株式会社 | 導光装置及びレーザ加工装置 |
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RU2754523C1 (ru) * | 2018-06-25 | 2021-09-02 | Кавасаки Дзюкогио Кабусики Кайся | Световодное устройство и устройство лазерной обработки |
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JP7136602B2 (ja) | 2018-06-25 | 2022-09-13 | 川崎重工業株式会社 | 導光装置及びレーザ加工装置 |
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EP2684636A4 (en) | 2015-08-26 |
CN103384580B (zh) | 2015-04-08 |
KR101494564B1 (ko) | 2015-02-17 |
JP5401629B2 (ja) | 2014-01-29 |
US20140036331A1 (en) | 2014-02-06 |
EP2684636B1 (en) | 2017-12-13 |
TW201250292A (en) | 2012-12-16 |
KR20130130813A (ko) | 2013-12-02 |
EP2684636A1 (en) | 2014-01-15 |
CN103384580A (zh) | 2013-11-06 |
US9604309B2 (en) | 2017-03-28 |
TWI453461B (zh) | 2014-09-21 |
JPWO2012120892A1 (ja) | 2014-07-17 |
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