WO2012091316A3 - Appareil de traitement au laser - Google Patents

Appareil de traitement au laser Download PDF

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Publication number
WO2012091316A3
WO2012091316A3 PCT/KR2011/009451 KR2011009451W WO2012091316A3 WO 2012091316 A3 WO2012091316 A3 WO 2012091316A3 KR 2011009451 W KR2011009451 W KR 2011009451W WO 2012091316 A3 WO2012091316 A3 WO 2012091316A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
processing apparatus
laser processing
optical unit
laser
Prior art date
Application number
PCT/KR2011/009451
Other languages
English (en)
Korean (ko)
Other versions
WO2012091316A2 (fr
Inventor
유병소
Original Assignee
(주)큐엠씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)큐엠씨 filed Critical (주)큐엠씨
Publication of WO2012091316A2 publication Critical patent/WO2012091316A2/fr
Publication of WO2012091316A3 publication Critical patent/WO2012091316A3/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un appareil de traitement au laser comprenant : une source de faisceau laser permettant de produire un faisceau laser ; et une unité optique permettant d'introduire le faisceau laser à l'intérieur d'un objet. L'unité optique comprend : un module de mise en forme de faisceau conçu pour corriger l'angle de divergence du faisceau laser ; un réseau de diffraction destiné à diffracter le faisceau laser ; et une lentille de focalisation conçue pour former un point lumineux en focalisant le faisceau laser à l'intérieur de l'objet.
PCT/KR2011/009451 2010-12-28 2011-12-08 Appareil de traitement au laser WO2012091316A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100136368A KR101298019B1 (ko) 2010-12-28 2010-12-28 레이저 가공 장치
KR10-2010-0136368 2010-12-28

Publications (2)

Publication Number Publication Date
WO2012091316A2 WO2012091316A2 (fr) 2012-07-05
WO2012091316A3 true WO2012091316A3 (fr) 2012-09-07

Family

ID=46383620

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/009451 WO2012091316A2 (fr) 2010-12-28 2011-12-08 Appareil de traitement au laser

Country Status (3)

Country Link
KR (1) KR101298019B1 (fr)
TW (1) TWI466748B (fr)
WO (1) WO2012091316A2 (fr)

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WO2014079478A1 (fr) 2012-11-20 2014-05-30 Light In Light Srl Traitement par laser à grande vitesse de matériaux transparents
EP2754524B1 (fr) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Procédé et dispositif destinés au traitement basé sur laser de substrats plats, galette ou élément en verre, utilisant un faisceau laser en ligne
EP2781296B1 (fr) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser
US9291825B2 (en) * 2013-03-22 2016-03-22 Applied Materials Israel, Ltd. Calibratable beam shaping system and method
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
CN103846547A (zh) * 2014-02-12 2014-06-11 苏州兰叶光电科技有限公司 多光束整形激光加工***
EP3166895B1 (fr) 2014-07-08 2021-11-24 Corning Incorporated Procédés et appareils pour traitement au laser de matériaux
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的***和方法
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
JP2017530867A (ja) 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
EP3169635B1 (fr) 2014-07-14 2022-11-23 Corning Incorporated Procédé et système pour former des perforations
DE102014213775B4 (de) * 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
CN104148802B (zh) * 2014-08-04 2017-01-25 北京万恒镭特机电设备有限公司 光束形成装置及其形成方法
TWI576186B (zh) * 2014-08-20 2017-04-01 Lever focusing module for laser processing
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP2018507154A (ja) 2015-01-12 2018-03-15 コーニング インコーポレイテッド マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
WO2016154284A1 (fr) 2015-03-24 2016-09-29 Corning Incorporated Découpe au laser de compositions de verre d'affichage
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
JP7082042B2 (ja) 2015-07-10 2022-06-07 コーニング インコーポレイテッド 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
JP6632467B2 (ja) * 2016-05-18 2020-01-22 株式会社ディスコ レーザー加工装置及びレーザー加工方法
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106425112B (zh) * 2016-11-02 2018-11-06 国神光电科技（上海）有限公司 一种激光划片的方法及***
KR102582652B1 (ko) * 2016-12-21 2023-09-25 삼성디스플레이 주식회사 레이저 결정화 장치
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
KR102636043B1 (ko) 2019-01-21 2024-02-14 삼성디스플레이 주식회사 레이저 에칭 장치와 그것을 이용한 레이저 에칭 방법
JP7499628B2 (ja) * 2020-07-07 2024-06-14 住友重機械工業株式会社 ビーム整形光学装置及び真円度調整方法
CN112914433A (zh) * 2021-04-23 2021-06-08 常州纵慧芯光半导体科技有限公司 一种激光设备及扫地机器人
CN113459678B (zh) * 2021-07-28 2022-06-07 杭州爱新凯科技有限公司 一种激光3d打印机边缘光斑面积补偿方法
CN114152194B (zh) * 2021-11-16 2022-10-04 华中科技大学 一种基于反射光栅的微位移测量装置及方法
CN114309923A (zh) * 2021-12-17 2022-04-12 深圳市大族数控科技股份有限公司 光束间距调节模组及加工设备
KR102654348B1 (ko) * 2022-04-07 2024-04-04 (주)이오테크닉스 홈 형성 장치 및 홈 형성 방법

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JP2002113711A (ja) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びそれに用いるレーザ加工装置
KR20040110434A (ko) * 2003-06-19 2004-12-31 엘지전자 주식회사 블레이즈 회절격자를 갖는 광 픽업 장치
JP2005014050A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd レーザ加工装置
KR100984726B1 (ko) * 2010-04-28 2010-10-01 유병소 레이저를 이용한 대상물 가공 방법, 대상물 가공 장치, 및 대상물 가공 시스템

Also Published As

Publication number Publication date
TW201228762A (en) 2012-07-16
TWI466748B (zh) 2015-01-01
KR101298019B1 (ko) 2013-08-26
KR20120074508A (ko) 2012-07-06
WO2012091316A2 (fr) 2012-07-05

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