WO2012070894A3 - 로터리 타겟의 타겟 분리방법 - Google Patents

로터리 타겟의 타겟 분리방법 Download PDF

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Publication number
WO2012070894A3
WO2012070894A3 PCT/KR2011/009032 KR2011009032W WO2012070894A3 WO 2012070894 A3 WO2012070894 A3 WO 2012070894A3 KR 2011009032 W KR2011009032 W KR 2011009032W WO 2012070894 A3 WO2012070894 A3 WO 2012070894A3
Authority
WO
WIPO (PCT)
Prior art keywords
indium
target
rotary
rotary target
backing tube
Prior art date
Application number
PCT/KR2011/009032
Other languages
English (en)
French (fr)
Other versions
WO2012070894A2 (ko
WO2012070894A4 (ko
Inventor
알 심슨웨인
한순석
Original Assignee
플란제 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 플란제 에스이 filed Critical 플란제 에스이
Priority to JP2013540897A priority Critical patent/JP5826857B2/ja
Priority to CN201180065921.0A priority patent/CN103339290B/zh
Publication of WO2012070894A2 publication Critical patent/WO2012070894A2/ko
Publication of WO2012070894A3 publication Critical patent/WO2012070894A3/ko
Publication of WO2012070894A4 publication Critical patent/WO2012070894A4/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

본 발명에 따른 로터리 타겟의 타겟 분리방법은 인듐과 메디아 파우더로 이루어진 접합제에 의해 백킹튜브의 외주면에 타켓이 접착 고정된 로터리 타겟의 사용 후 백킹튜브로부터 타겟을 분리하는 방법에 있어서, (a) 인듐의 융점온도 이상으로 로터리 타겟의 가열을 통해 인듐의 일부를 용융시켜 제거하는 단계; (b) 단계(a) 과정의 일부 인듐이 용융 제거된 상태의 로터리 타겟을 염산용액에 일정시간 담가두어 인듐과 메디아 파우더를 부식시키는 단계; (c) 단계(b) 과정의 염산용액을 통해 인듐과 메디아 파우더를 부식시킨 상태의 로터리 타겟을 인듐의 융점온도 이상으로 가열하여 나머지의 인듐을 용융 제거하는 단계; 및 (d) 단계(c) 과정의 가열을 통해 인듐을 용융 제거한 다음 백킹튜브의 외주면으로부터 타겟을 일측으로 밀어 분리하는 단계를 포함한 구성으로 이루어진다. 본 발명은 제품의 생산단가를 줄일 수 있다.
PCT/KR2011/009032 2010-11-24 2011-11-24 로터리 타겟의 타겟 분리방법 WO2012070894A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013540897A JP5826857B2 (ja) 2010-11-24 2011-11-24 回転式ターゲットの分離方法
CN201180065921.0A CN103339290B (zh) 2010-11-24 2011-11-24 用于分离旋转靶的靶的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100117466A KR101266202B1 (ko) 2010-11-24 2010-11-24 로터리 타겟의 타겟 분리방법
KR10-2010-0117466 2010-11-24

Publications (3)

Publication Number Publication Date
WO2012070894A2 WO2012070894A2 (ko) 2012-05-31
WO2012070894A3 true WO2012070894A3 (ko) 2012-09-27
WO2012070894A4 WO2012070894A4 (ko) 2012-11-15

Family

ID=46146324

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/009032 WO2012070894A2 (ko) 2010-11-24 2011-11-24 로터리 타겟의 타겟 분리방법

Country Status (5)

Country Link
JP (1) JP5826857B2 (ko)
KR (1) KR101266202B1 (ko)
CN (1) CN103339290B (ko)
TW (1) TWI557250B (ko)
WO (1) WO2012070894A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619561B (zh) * 2016-07-28 2018-04-01 Rotating target
KR102039499B1 (ko) * 2017-02-23 2019-11-04 (주)코아엔지니어링 스퍼터링용 로터리 타겟 어셈블리의 분리장치
CN109161862A (zh) * 2018-11-01 2019-01-08 广西晶联光电材料有限责任公司 一种平面和旋转靶材解绑定的装置及方法
CN113005308A (zh) * 2021-02-24 2021-06-22 合肥江丰电子材料有限公司 一种提炼金属铟的方法
CN113249691A (zh) * 2021-04-19 2021-08-13 先导薄膜材料（广东）有限公司 一种旋转靶材退绑方法及夹具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0860351A (ja) * 1994-08-23 1996-03-05 Mitsui Mining & Smelting Co Ltd 回転カソード用スパッタリングターゲットの製造方法
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
KR19990066295A (ko) * 1998-01-23 1999-08-16 윤영세 스퍼터링 장치의 재생방법
JP2000239837A (ja) * 1999-02-15 2000-09-05 Sony Corp 固相拡散接合されたスパッタリングターゲット組立体の分離方法
JP2008133538A (ja) * 2006-10-27 2008-06-12 Mitsubishi Materials Corp ターゲット廃材とインジウムの分離回収方法。
JP2008184640A (ja) * 2007-01-29 2008-08-14 Tosoh Corp 円筒形スパッタリングターゲット及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3829367B2 (ja) * 1996-08-02 2006-10-04 東ソー株式会社 スパッタリングターゲット
JP2000079465A (ja) * 1998-09-04 2000-03-21 Sony Corp はんだ回収装置用の円筒ブラシ装置とはんだ回収装置
JP4961672B2 (ja) * 2004-03-05 2012-06-27 東ソー株式会社 円筒形スパッタリングターゲット並びにセラミックス焼結体及びその製造方法
CN101122008A (zh) * 2006-08-10 2008-02-13 中华映管股份有限公司 等离子体溅射靶材装置及其制造方法
TW200925171A (en) * 2007-08-10 2009-06-16 Tosoh Corp Unsaturated carboxylic acid-grafted polyolefin and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0860351A (ja) * 1994-08-23 1996-03-05 Mitsui Mining & Smelting Co Ltd 回転カソード用スパッタリングターゲットの製造方法
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
KR19990066295A (ko) * 1998-01-23 1999-08-16 윤영세 스퍼터링 장치의 재생방법
JP2000239837A (ja) * 1999-02-15 2000-09-05 Sony Corp 固相拡散接合されたスパッタリングターゲット組立体の分離方法
JP2008133538A (ja) * 2006-10-27 2008-06-12 Mitsubishi Materials Corp ターゲット廃材とインジウムの分離回収方法。
JP2008184640A (ja) * 2007-01-29 2008-08-14 Tosoh Corp 円筒形スパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
CN103339290A (zh) 2013-10-02
JP2013544971A (ja) 2013-12-19
KR101266202B1 (ko) 2013-05-21
JP5826857B2 (ja) 2015-12-02
KR20120055980A (ko) 2012-06-01
TWI557250B (zh) 2016-11-11
TW201229278A (en) 2012-07-16
CN103339290B (zh) 2015-09-02
WO2012070894A2 (ko) 2012-05-31
WO2012070894A4 (ko) 2012-11-15

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