WO2012060048A1 - Drive device and equipment - Google Patents

Drive device and equipment Download PDF

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Publication number
WO2012060048A1
WO2012060048A1 PCT/JP2011/005225 JP2011005225W WO2012060048A1 WO 2012060048 A1 WO2012060048 A1 WO 2012060048A1 JP 2011005225 W JP2011005225 W JP 2011005225W WO 2012060048 A1 WO2012060048 A1 WO 2012060048A1
Authority
WO
WIPO (PCT)
Prior art keywords
rod
actuator
piezoelectric element
printed circuit
circuit board
Prior art date
Application number
PCT/JP2011/005225
Other languages
French (fr)
Japanese (ja)
Inventor
秦　良彰
Original Assignee
コニカミノルタオプト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタオプト株式会社 filed Critical コニカミノルタオプト株式会社
Publication of WO2012060048A1 publication Critical patent/WO2012060048A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
    • H02N2/0075—Electrical details, e.g. drive or control circuits or methods
    • H02N2/0085—Leads; Wiring arrangements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/021—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors using intermittent driving, e.g. step motors, piezoleg motors
    • H02N2/025—Inertial sliding motors

Definitions

  • the present invention relates to a drive device for driving an optical component or the like and an apparatus such as an optical apparatus provided with the drive device.
  • Patent Document 1 As a lens driving device such as an imaging unit mounted on a mobile phone having a camera or an information device, one using an actuator having an electromechanical conversion element is known. It is disclosed in Patent Document 1.
  • the driving device disclosed in Patent Document 1 includes an actuator and a fixed frame (actuator holder) having a holding portion that holds the actuator.
  • an actuator holder b having a holding portion b1 holding an actuator a
  • the projecting piece 110 provided on the housing 101 of the imaging unit 100 is inserted into the positioning hole b2 provided on the holder b, and is fixed to the housing 101 in that state.
  • the actuator holder b By fixing the actuator holder b to the housing 101 in this way, the actuator a is positioned and mounted on the housing 101 via the actuator holder b, and the impact applied to the housing 101 is applied to the actuator 101.
  • the holding part b1 of the holder b receives and the possibility that the actuator a is destroyed is reduced.
  • the actuator a includes an electromechanical conversion element a1, a rod a2, and a moving body a3 frictionally engaged with the rod a2.
  • a lens 103 is connected to the moving body a3
  • a printed circuit board 104 is disposed in the housing 101, and an imaging element 105 is mounted on the printed circuit board 104.
  • the actuator a and the actuator holder b are miniaturized in response to the miniaturization of the equipment, it becomes difficult to assemble the actuator a and the actuator holder b, and it is difficult to mount them on the equipment body.
  • the present invention has been made in view of the above-described circumstances, and the object thereof is to enable an actuator to be mounted in an apparatus main body without using an actuator holder, to reduce the size of the apparatus, and to reduce the size of the apparatus main body. It is an object to provide a drive device that can be easily mounted on a device and a device using the drive device.
  • the substrate that holds the actuator and is attached to the device main body of the device to which the actuator is mounted, and on which the electronic component is mounted A positioning portion is provided that is positioned with respect to the device main body when assembled to the main body. For this reason, the drive device and the device using the drive device according to the present invention can mount the actuator in the device main body without using the actuator holder, thereby reducing the size of the device and reducing the size of the device to the device main body. Mounting can be performed easily.
  • (A) is a top view of the principal part of the drive device in one Embodiment, (B) is a side view of (A), (C) is a front view of (A).
  • (A) is a top view of the principal part of a printed circuit board, (B) is a side view of (A).
  • (A) is a top view of the state which has arrange
  • B) is a side view of (A). is there.
  • (A) is the top view which has arrange
  • (A) is a top view of the state which has arrange
  • (B) is a side view of (A).
  • (A) is a top view of the state which has arrange
  • (B) is a side view of (A).
  • (A) is a top view of the state which has arrange
  • (B) is a side view of (A).
  • (A) is a top view of the state which removed the positioning member for piezoelectric elements, the positioning member for rods, and the rod temporary mounting member
  • (B) is a side view of (A).
  • (A) is a top view of the state which connected the electrode of the piezoelectric element, and the external electrode of the printed circuit board with the electroconductive adhesive
  • (B) is a side view of (A). It is a schematic explanatory drawing of the terminal of the mobile telephone as an apparatus provided with the drive device in one Embodiment.
  • (A) is a top view of the principal part of the drive device of other one Embodiment
  • (B) is a side view of (A).
  • (A) is a top view of the principal part of the drive device of further another embodiment
  • (B) is a side view of (A).
  • (A) is a top view of the principal part of the drive device of further another embodiment
  • (B) is a side view of (A).
  • It is a schematic explanatory drawing of the imaging unit provided with the drive device of embodiment of FIG. (A) is a top view of the principal part of the drive device in other one embodiment
  • (B) is a front view of (A).
  • FIG. 1 is a diagram illustrating a configuration of a driving device according to an embodiment.
  • 1A is a plan view of a main part of a driving device according to an embodiment
  • FIG. 1B is a side view of FIG. 1A
  • FIG. 1C is a front view of FIG. FIG.
  • the drive device 1 in this embodiment includes an actuator 2 and a printed circuit board 3 that holds the actuator 2.
  • the actuator 2 includes a piezoelectric element 21, which is an example of an electromechanical conversion element, a rod 22 connected to the piezoelectric element 21, and a moving body 23 engaged with the rod 22.
  • the piezoelectric element 21 is formed in a quadrangular prism shape by laminating a plurality of piezoelectric layers. Further, electrodes 21a and 21b of each piezoelectric layer are drawn out on a pair of left and right side surfaces in the figure, and a voltage is applied to these electrodes 21a and 21b from a power supply circuit (not shown). ing.
  • a plurality of piezoelectric layers made of a piezoelectric material are stacked via internal electrodes between these piezoelectric layers, and on the side surfaces facing each other along the stacking direction of the plurality of piezoelectric layers, A pair of external electrodes 21a and 21b are formed, respectively, and the pair of external electrodes 21a and 21b are sequentially and alternately connected to the plurality of internal electrodes.
  • the axial length L1 of the piezoelectric element 21 of this embodiment is about 1 mm to 2.0 mm.
  • the rod 22 is connected to one end of the piezoelectric element 21 in the axial direction, and is configured to vibrate in the axial direction by transmitting movement (displacement and impact) in the extending direction and contracting direction as the piezoelectric element 21 expands and contracts.
  • the left and right width of the rod 22 is set larger than that of the piezoelectric element 21.
  • the rod 22 of this embodiment has an axial length L2 of about 1.0 mm to 3.0 mm.
  • the moving body 23 is formed in a substantially rectangular tube shape by bending a metal spring steel plate. The moving body 23 thus formed is engaged with the outer periphery of the rod 22 with a predetermined frictional force so that the rod 22 is pushed into the cylinder.
  • the piezoelectric element 21 converts input electric energy into a mechanical expansion and contraction motion.
  • the rod (vibrating member) 22 reciprocates asymmetrically with a speed difference between the forward path and the return path in the axial direction according to the asymmetric expansion and contraction of the piezoelectric element 21, and the rod 22 moves only in the positive direction, for example, in the axial direction.
  • Pushing thrust is generated. That is, the film stretches slowly in the positive direction and contracts rapidly in the negative direction. That is, the contraction speed in the negative direction is larger than the expansion speed in the positive direction. Due to the asymmetric reciprocating motion of the rod 22, the moving body 23 frictionally engaged with the rod 22 moves along the axial direction, and electric energy is converted into the motion of the moving body 23.
  • the piezoelectric element 21 is asymmetric opposite to the asymmetric expansion and contraction motion.
  • the rod 22 reciprocates with a reverse speed difference between the forward path and the return path in the one direction due to the reverse asymmetric expansion / contraction movement, thereby causing the rod 22 to move in the axial direction.
  • a thrust is generated that pushes only in the negative direction. That is, it slowly expands in the negative direction and rapidly contracts in the positive direction. That is, the contraction speed in the positive direction is larger than the expansion speed in the negative direction.
  • the moving body 23 moves in the opposite direction to the above.
  • the driving voltage is a rectangular wave having a predetermined duty ratio.
  • a voltage that causes the piezoelectric element 21 to perform at different speeds during expansion and contraction a saw wave or a ramp wave is used.
  • the voltage level may be an asymmetric voltage waveform.
  • the printed circuit board 3 is mounted with electronic parts such as an image sensor. As shown in FIG. 2, the printed circuit board 3 positions the printed circuit board 3 with respect to a case 101 (see FIG. 10), which will be described later, and also positions a actuator 31 with respect to the printed circuit board 3. , 31b.
  • a circular first positioning hole 31a disposed on the left front side and a rectangular second positioning hole 31b disposed on the right side of the first positioning hole 31a. It consists of two. As described above, the first positioning hole 31a and the second positioning hole 31b have different shapes in plan view in order to distinguish each other.
  • the printed circuit board 3 in this embodiment includes a pair of external electrodes 32a and 32b and a power feeding pattern 33 extended from the external electrodes 32a and 32b on the left and right sides on the rear side.
  • the drive device 1 Next, a method for manufacturing the drive device 1 will be described with reference to FIGS.
  • the printed circuit board 3 is held via a gap forming member
  • the actuator 2 is assembled and held on the printed circuit board 3 by using a mounter (surface mounter) (not shown) for mounting the electronic component. This will be described in detail below.
  • the printed circuit board 3 is set on a table (not shown) of the mounter. At the time of the setting, the first positioning hole 31a and the second positioning hole 31b are put into positioning protrusions (not shown) provided on the table. Thereby, the printed circuit board 3 can be positioned with respect to the table.
  • an adhesive composed of a UV adhesive (ultraviolet curable adhesive) and a thermosetting adhesive is disposed on the front side of the printed circuit board 3 in the vicinity of the external electrodes 32a and 32b.
  • a gap forming member 41 is disposed thereon, and the gap forming member 41 is bonded by the adhesive force of the UV adhesive.
  • an adhesive composed of a UV adhesive and a thermosetting adhesive is disposed between the pair of external electrodes 32a and 32b on the rear side of the gap forming member 41, and the piezoelectric element 21 is mounted thereon.
  • the piezoelectric element mounting member 42 to be placed is disposed, and the piezoelectric element mounting member 42 is bonded by the adhesive force of the UV adhesive.
  • an adhesive made of a UV adhesive and a heat-degradable adhesive is disposed on the front side of the first positioning hole 31a and the second positioning hole 31b on the printed circuit board 3, and further, A rod temporary placement member 43 for placing the rod 22 is disposed, and the rod temporary placement member 43 is bonded by the adhesive force of the UV adhesive.
  • the gap forming member 41, the piezoelectric element mounting member 42, and the rod temporary mounting member 43 are formed of a rectangular column shape having the same thickness. In this embodiment, these are composed of a thickness of about 0.5 mm.
  • interval formation member 41, the piezoelectric element mounting member 42, and the rod temporary mounting member 43 is not specifically limited, It can comprise from a synthetic resin, a metal, etc.
  • an adhesive 44 made of a UV adhesive and a thermosetting adhesive is applied on the gap forming member 41.
  • three columnar rear piezoelectric element positioning members 45a, a left piezoelectric element positioning member 45b, and a right piezoelectric element positioning member 45c provided on the mounter are arranged on the piezoelectric element mounting member 42.
  • Two columnar left rod positioning members 46a and a right rod positioning member disposed on the printed circuit board 3 so as to be suspended and supported by a mounter so as to be surrounded from the rear side and the left and right sides.
  • the member 46b is disposed on the printed circuit board 3 so as to be suspended and supported by the mounters on the left and right sides with a gap between the gap forming member 41 and the temporary rod mounting member 43.
  • the distance between the left and right piezoelectric element positioning members 45b and 45c is set to be approximately the same as the width of the piezoelectric element 21, and the distance between the left and right rod positioning members 46a and 46b is set to be approximately the same as the width of the rod 22. Has been.
  • the piezoelectric element 21 is inserted between the left and right piezoelectric element positioning members 45 b and 45 c, and a part of the adhesive 44 on the piezoelectric element mounting member 42 and the gap forming member 41. And placed.
  • the piezoelectric element 21 placed on the adhesive 44 is disposed in parallel with the upper surface of the printed circuit board 3 by the piezoelectric element mounting member 42 and the gap forming member 41, and the surface tension of the adhesive 44. Then, while maintaining the parallel state, it moves forward (in the direction of the arrows in FIGS. 6A and 6B).
  • the rod 22 is placed between the two rod positioning members 46a and 46b so that the rod temporary placement member 43 and a part of the adhesive 44 on the gap forming member 41 are over Placed on.
  • the rod 22 is disposed in parallel with the upper surface of the printed circuit board 3 by the temporary rod mounting member 43 and the gap forming member 41, and the parallel state is maintained by the surface tension of the adhesive 44.
  • the rod 22 moves rearward (in the direction of the arrows in FIGS. 7A and 7B) so that the rear end surface of the rod 22 comes into contact with the front end surface of the piezoelectric element 21 and further comes into contact with the adhesive 44 in the rod 22.
  • the area is set to be larger than that of the piezoelectric element 21, so that the rod 22 presses the piezoelectric element 21 backward until the piezoelectric element 21 contacts the rear piezoelectric element positioning member 45 a by the surface tension of the adhesive 44. Move while.
  • the contact between the piezoelectric element 21 and the rear piezoelectric element positioning member 45a is not limited to the form accompanying the movement of the rod 22 due to the surface tension of the adhesive 44 as described above.
  • the rod 22 is moved from the front side.
  • the piezoelectric element 21 may be pressed against the back to contact the rear piezoelectric element positioning member 45a, and can be changed as appropriate.
  • the piezoelectric element 21 and the rod 22 are disposed on the printed circuit board 3 while being positioned with respect to the printed circuit board 3.
  • a gap 47 corresponding to the thickness of the gap forming member 41 is formed between the rod 22 and the printed board 3.
  • the printed circuit board 3 is removed from the mounter table. Then, the printed circuit boards 3 are arranged in a tray and heated to 100 ° C. to 150 ° C., and the thermosetting adhesive is cured. Thereby, the piezoelectric element 21 and the rod 22 can be held in a state of being firmly fixed to the printed circuit board 3 by the thermosetting adhesive.
  • thermosetting process since the adhesive force of the thermally deteriorated adhesive disposed between the rod temporary mounting member 43 and the printed board 3 is lost, the rod temporary mounting member as shown in FIG. 43 is removed.
  • the electrodes 21a and 21b of the piezoelectric element 21 and the external electrodes 32a and 32b of the printed circuit board 3 are connected to a connecting means such as a conductive adhesive 48, solder paste, or lead wire (this In the embodiment, the conductive adhesive 48 is connected so that current can be passed.
  • a connecting means such as a conductive adhesive 48, solder paste, or lead wire (this In the embodiment, the conductive adhesive 48 is connected so that current can be passed.
  • the moving body 23 is attached to the rod 22 as shown in FIG. Thereby, the drive device 1 is created.
  • the device includes an imaging unit 100 that is incorporated in a mobile phone terminal as an optical device having an optical member (optical element).
  • the imaging unit 100 includes a housing 101 that constitutes a part of the apparatus main body, and the above-described driving device 1 that includes the actuator 2 and the printed circuit board 3.
  • the image sensor 105 and the electronic components are mounted on the printed circuit board 3 of the driving device 1.
  • the imaging element 105 and the electronic component are set prior to the assembly of the actuator 2 when the printed circuit board 3 is set on the mounter table. Implemented by the above mounter.
  • the process of mounting the actuator 2 on the printed circuit board 3 can be included in the process of mounting the electronic components necessary for the imaging unit 100 on the printed circuit board 3 by the mounter. Therefore, the operation of assembling the actuator 2 to the printed circuit board 3 can be performed mechanically automatically, and can be easily performed in a short time.
  • the mounting of the imaging element 105 and the electronic component on the printed circuit board 3 is not limited to the form performed before the assembly of the actuator 2 as described above, and may be performed after the assembly of the actuator 2, for example.
  • the mounting of the image sensor 105 and the electronic component on the printed circuit board 3 may be performed separately by a mounter different from the mounter used for assembling the actuator 2.
  • the moving body 23 and the lens 104 are connected by a connecting means such as an adhesive 44, and a first positioning hole 31 a and a second positioning hole 31 b of the printed circuit board 3 are described later. It is inserted into each of the protruding pieces 102 a provided on the housing 101.
  • the printed circuit board 3 is positioned with respect to the casing 101 and disposed at a predetermined position via the first positioning hole 31a and the second positioning hole 31b, and the actuator 2 is connected to the casing. It is positioned with respect to 101 and disposed at a predetermined position.
  • the piezoelectric element 21 of the actuator 2 expands and contracts in the axial direction, and the rod 22 moves in the axial direction (X-- in FIG. Vibrates in the X direction).
  • the lens 104 can move along the optical axis direction (XX direction in the figure) by appropriately moving the moving body 23 in the axial direction according to the vibration of the rod 22 in the axial direction. .
  • the actuator 2 includes the piezoelectric element 21, the rod 22, and the moving body 23.
  • the actuator 2 is not limited to this configuration, and can be changed as appropriate.
  • a weight may be connected to the end opposite to the rod 22.
  • the piezoelectric element 21 is mounted on the substantially front half of the gap forming member 41 and the rod 22 is mounted on the substantially rear half of the gap forming member 41.
  • the position is not limited to that in this form, but can be changed as appropriate.
  • the drive device 1 may be configured to place the rod 22 on the gap forming member 41 so as to exceed 1/2 of the longitudinal length (width) of the gap forming member 41.
  • the driving device 1 may be configured such that the rod 22 is placed on the entire gap forming member 41 and the piezoelectric element 21 is not placed on the gap forming member 41 at all.
  • the piezoelectric element 21 becomes difficult to be disposed in parallel to the upper surface of the printed circuit board 3, so that the piezoelectric element 21 is attached to the gap forming member. Assembling is preferably performed so as to be placed on 41.
  • the printed circuit board 3 is directly attached to the housing 101.
  • a plate member 6 made of metal or the like shown by a one-dot chain line in FIG. 9) is further provided on the lower surface of the printed circuit board 3. It may be provided and the printed circuit board 3 may be reinforced.
  • the gap forming member 41 that forms the gap 47 between the rod 22 and the printed board 3 in the actuator 2 is provided. It can.
  • the printed circuit board 3 is provided with a relief part 34 (slit-like notch part) formed by cutting a predetermined length from the front end to the rear with a width wider than the rod 22.
  • the piezoelectric element 21 and the rod 22 are directly fixed to the printed circuit board 3 with an adhesive so that the rod 22 is disposed above the relief portion 34.
  • the driving device 1 may be configured such that the moving body 23 does not come into contact with the printed circuit board 3 by the escape portion 34 when the moving body 23 moves the rod 22.
  • the printed circuit board surface on which the image sensor 105 is mounted and the printed circuit board surface on which the actuator 2 is mounted are arranged so as to form a right angle.
  • the photographing unit 100 enables light from the lens 104 provided on the actuator 2 to enter the imaging element 105 perpendicularly.
  • a recess 107 is further provided in a part of the housing 101 corresponding to the escape portion 34 as shown in FIG.
  • the moving body 23 may not contact a part of the housing 101.
  • a positioning part is a positioning part below. May be inserted into a hole provided in the housing 101, and can be changed as appropriate. Further, the position, size, number, etc. of the positioning portions are not particularly limited. For example, as shown in FIG. 14, even if a hole 131 as a positioning portion is provided in the vicinity of the piezoelectric element 21 in the printed board 3. Good.
  • the imaging unit 100 is provided with one actuator 2, but is not limited to this configuration, and can be changed as appropriate.
  • a printed circuit board 300 includes a substrate body 301 and a fold forming portion 302 formed by bending a part of the substrate body 301 at a predetermined angle (right angle in this embodiment).
  • the actuator 2 is assembled to each of the substrate main body 301 and the bending formation portion 302, and the axial directions of the actuators 2 are different from each other.
  • the first lens is moved in the XX direction by one actuator 2.
  • the other actuator 2 can move the second lens in the YY direction orthogonal to the XX direction.
  • the apparatus provided with the drive device 1 of this embodiment was comprised by the imaging unit 100 incorporated in the terminal of a mobile telephone, for example, optical devices, such as a digital camera, or an optical fiber, light guide It can be used for an optical path adjusting device to a waveguide.
  • optical devices such as a digital camera, or an optical fiber, light guide It can be used for an optical path adjusting device to a waveguide.
  • the printed board 3 has been described as an example, but a rigid board may be used instead of the printed board 3 when bending is not necessary.
  • a drive device includes an electromechanical conversion element that expands and contracts in an axial direction, a rod that is connected to one end of the electromechanical conversion element and vibrates by expansion and contraction of the electromechanical conversion element, and engages the rod with a predetermined friction force And an actuator having a movable body movable in the axial direction of the rod, and a substrate attached to a device main body of a device to which the actuator is mounted, the substrate having an electronic component mounted thereon
  • the actuator is positioned and held on a board on which the electronic component is mounted, and the printed board has a positioning portion that is positioned with respect to the equipment body when the printed board is assembled to the equipment body.
  • an actuator can be automatically assembled to the substrate in a process of mounting electronic components necessary for the device on a substrate (for example, a printed circuit board) by a mounter (mounting machine). Assembling to the board becomes easy. Therefore, the assembly work may be performed by assembling the board on which the electronic component and the actuator are assembled to the equipment main body, and the work for assembling the actuator separately from the board as in the prior art can be eliminated. Even in the case of downsizing, the assembling work to the device main body becomes simple.
  • the substrate when the substrate is assembled to the device main body, the substrate can be positioned at a predetermined position with respect to the device main body by the positioning unit.
  • the actuator can be disposed at a predetermined position with respect to the substrate by performing an operation so that the actuator is assembled to the substrate with reference to the positioning portion. Therefore, the actuator can be disposed at a predetermined position of the apparatus main body by assembling the substrate to the apparatus main body with reference to the positioning portion.
  • the electronic device when the moving body moves between the rod and the substrate on which the electronic component is mounted, the electronic device is not brought into contact with the substrate on which the electronic component is mounted.
  • a gap forming member for forming a gap between the two is further provided, and the rod is held on the substrate on which the electronic component is mounted via the gap forming member.
  • the rod and the substrate are arranged so that the rod is placed on the gap forming member placed on the substrate so as not to contact the substrate when the moving body moves. Can be easily formed between the two.
  • the board on which the electronic component is mounted is a printed board.
  • a driving device in which the substrate is a printed circuit board is provided.
  • a device includes any one of the above-described driving devices.
  • an actuator can be automatically assembled to the substrate in a process of mounting electronic components necessary for the device on a substrate (for example, a printed circuit board) by a mounter.
  • a substrate for example, a printed circuit board
  • the substrate when the substrate is assembled to the device main body, the substrate can be positioned at a predetermined position with respect to the device main body by the positioning unit.
  • a drive device can be provided.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Lens Barrels (AREA)

Abstract

In this drive device and equipment using the drive device, a substrate, which holds an actuator and is attached to the body of the equipment to which the actuator is to be fitted, has an electronic component mounted thereupon and is provided with a positioning part for positioning the substrate on the equipment body when attaching the device to the equipment body. For this reason, the drive device relating to the present invention and the equipment using the drive device enable the actuator to be fitted inside the equipment body without using an actuator holder, and enable the size of the equipment to be reduced and attachment to the equipment body to be facilitated.

Description

駆動装置および機器Drive device and equipment
　本発明は、光学部品等を駆動させる駆動装置およびその駆動装置を備えた光学機器等の機器に関する。 The present invention relates to a drive device for driving an optical component or the like and an apparatus such as an optical apparatus provided with the drive device.
　従来から、例えばカメラを有する携帯電話や情報機器に搭載される撮像ユニットなどのレンズ駆動装置として、電気機械変換素子を有するアクチュエータを用いたものが知られており、このような駆動装置は、例えば特許文献１に開示されている。この特許文献１に開示された駆動装置は、アクチュエータと、アクチュエータを保持した保持部を有する固定枠（アクチュエータ用ホルダー）とを備えたものである。 2. Description of the Related Art Conventionally, as a lens driving device such as an imaging unit mounted on a mobile phone having a camera or an information device, one using an actuator having an electromechanical conversion element is known. It is disclosed in Patent Document 1. The driving device disclosed in Patent Document 1 includes an actuator and a fixed frame (actuator holder) having a holding portion that holds the actuator.
　このような駆動装置が、例えば携帯電話等の端末機におけるレンズの駆動装置として用いられる場合、例えば図１６に示すように、アクチュエータａを保持した保持部ｂ1を有するアクチュエータ用ホルダーｂは、そのアクチュエータ用ホルダーｂに設けられた位置決め用孔ｂ２に、撮像ユニット１００の筐体１０１に設けられた突片１１０を入れるようにして、その状態で筐体１０１に固定される。このようにしてアクチュエータ用ホルダーｂを筐体１０１に固定することによって、アクチュエータ用ホルダーｂを介してアクチュエータａは、筐体１０１に位置決めして装着されるとともに、筐体１０１にかかる衝撃をアクチュエータ用ホルダーｂの保持部ｂ１が受けて、アクチュエータａが破壊するおそれが少なくなる。なお、図１６において、アクチュエータａは、電気機械変換素子ａ１と、ロッドａ２と、ロッドａ２に摩擦係合した移動体ａ３とを備えている。また、移動体ａ３には、レンズ１０３が連結されており、筐体１０１には、プリント基板１０４が配設されており、プリント基板１０４には、撮像素子１０５が実装されている。 When such a driving device is used as a lens driving device in a terminal such as a mobile phone, for example, as shown in FIG. 16, for example, an actuator holder b having a holding portion b1 holding an actuator a The projecting piece 110 provided on the housing 101 of the imaging unit 100 is inserted into the positioning hole b2 provided on the holder b, and is fixed to the housing 101 in that state. By fixing the actuator holder b to the housing 101 in this way, the actuator a is positioned and mounted on the housing 101 via the actuator holder b, and the impact applied to the housing 101 is applied to the actuator 101. The holding part b1 of the holder b receives and the possibility that the actuator a is destroyed is reduced. In FIG. 16, the actuator a includes an electromechanical conversion element a1, a rod a2, and a moving body a3 frictionally engaged with the rod a2. In addition, a lens 103 is connected to the moving body a3, a printed circuit board 104 is disposed in the housing 101, and an imaging element 105 is mounted on the printed circuit board 104.
　しかしながら、年々、機器の小型化の要請が強くなってきており、上述の特許文献１に開示されているような保持部ｂ１を有するアクチュエータ用ホルダーｂを筐体１０１内に配設することは、スペース的に困難になってきており、そのため、保持部ｂ１を有するアクチュエータ用ホルダーｂを用いたのでは、機器の小型化が図り難い。 However, the demand for downsizing of the device has been increasing year by year, and disposing the actuator holder b having the holding portion b1 as disclosed in the above-mentioned Patent Document 1 in the housing 101, Therefore, it is difficult to reduce the size of the device by using the actuator holder b having the holding portion b1.
　また、機器の小型化に対応してアクチュエータａおよびアクチュエータ用ホルダーｂを小型化すると、アクチュエータａとアクチュエータ用ホルダーｂとの組み付けが困難になるとともに、それらの機器本体への装着も困難になる。 Also, if the actuator a and the actuator holder b are miniaturized in response to the miniaturization of the equipment, it becomes difficult to assemble the actuator a and the actuator holder b, and it is difficult to mount them on the equipment body.
特開２００７－１７４８８２号公報JP 2007-174882 A
　本発明は、上述の事情に鑑みて為された発明であり、その目的は、アクチュエータ用ホルダーを用いることなくアクチュエータを機器本体内に装着することができ、機器の小型化を図るとともに、機器本体への装着を容易に行うことができる駆動装置およびその駆動装置を用いた機器を提供することである。 The present invention has been made in view of the above-described circumstances, and the object thereof is to enable an actuator to be mounted in an apparatus main body without using an actuator holder, to reduce the size of the apparatus, and to reduce the size of the apparatus main body. It is an object to provide a drive device that can be easily mounted on a device and a device using the drive device.
　本発明にかかる駆動装置および該駆動装置を用いた機器では、アクチュエータを保持するとともに該アクチュエータが装着される機器の機器本体に付設される基板であって電子部品を実装した該基板は、前記機器本体に組み付けられる際に、前記機器本体に対して位置決めされる位置決め部を備えている。このため、本発明にかかる駆動装置および該駆動装置を用いた機器は、アクチュエータ用ホルダーを用いることなくアクチュエータを機器本体内に装着することができ、機器の小型化を図るとともに、機器本体への装着を容易に行うことができる。 In the drive device and the device using the drive device according to the present invention, the substrate that holds the actuator and is attached to the device main body of the device to which the actuator is mounted, and on which the electronic component is mounted, A positioning portion is provided that is positioned with respect to the device main body when assembled to the main body. For this reason, the drive device and the device using the drive device according to the present invention can mount the actuator in the device main body without using the actuator holder, thereby reducing the size of the device and reducing the size of the device to the device main body. Mounting can be performed easily.
　上記並びにその他の本発明の目的、特徴および利点は、以下の詳細な記載と添付図面から明らかになるであろう。 The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.
（Ａ）は、一実施形態における駆動装置の要部の平面図であり、（Ｂ）は、（Ａ）の側面図であり、（Ｃ）は、（Ａ）の正面図である。(A) is a top view of the principal part of the drive device in one Embodiment, (B) is a side view of (A), (C) is a front view of (A). （Ａ）は、プリント基板の要部の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the principal part of a printed circuit board, (B) is a side view of (A). （Ａ）は、図２のプリント基板に、間隙形成部材、圧電素子載置部材およびロッド仮載置部材を配設した状態の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the state which has arrange | positioned the gap formation member, the piezoelectric element mounting member, and the rod temporary mounting member on the printed circuit board of FIG. 2, (B) is a side view of (A). is there. （Ａ）は、プリント基板における間隙形成部材上に、接着剤を配設した平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is the top view which has arrange | positioned the adhesive agent on the gap | interval formation member in a printed circuit board, (B) is a side view of (A). （Ａ）は、プリント基板上に、圧電素子用位置決め部材およびロッド用位置決め部材を配設した状態の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the state which has arrange | positioned the positioning member for piezoelectric elements and the positioning member for rods on the printed circuit board, (B) is a side view of (A). （Ａ）は、プリント基板における圧電素子載置部材および間隙形成部材の接着剤上に圧電素子を配設した状態の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the state which has arrange | positioned the piezoelectric element on the adhesive agent of the piezoelectric element mounting member and gap | interval formation member in a printed circuit board, (B) is a side view of (A). （Ａ）は、プリント基板におけるロッド仮載置部材および間隙形成部材の接着剤上にロッドを配設した状態の平面図、であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the state which has arrange | positioned the rod on the adhesive agent of the rod temporary mounting member and gap | interval formation member in a printed circuit board, (B) is a side view of (A). （Ａ）は、圧電素子用位置決め部材、ロッド用位置決め部材、および、ロッド仮載置部材を除去した状態の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the state which removed the positioning member for piezoelectric elements, the positioning member for rods, and the rod temporary mounting member, (B) is a side view of (A). （Ａ）は、圧電素子の電極とプリント基板の外部電極とを導電性接着剤で接続した状態の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the state which connected the electrode of the piezoelectric element, and the external electrode of the printed circuit board with the electroconductive adhesive, (B) is a side view of (A). 一実施形態における駆動装置を備えた機器としての携帯電話の端末機の概略説明図である。It is a schematic explanatory drawing of the terminal of the mobile telephone as an apparatus provided with the drive device in one Embodiment. （Ａ）は、他の一実施形態の駆動装置の要部の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the principal part of the drive device of other one Embodiment, (B) is a side view of (A). （Ａ）は、さらに他の一実施形態の駆動装置の要部の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the principal part of the drive device of further another embodiment, (B) is a side view of (A). （Ａ）は、さらに他の一実施形態の駆動装置の要部の平面図であり、（Ｂ）は、（Ａ）の側面図である。(A) is a top view of the principal part of the drive device of further another embodiment, (B) is a side view of (A). 図１３の実施形態の駆動装置を備えた撮像ユニットの概略説明図である。It is a schematic explanatory drawing of the imaging unit provided with the drive device of embodiment of FIG. （Ａ）は、さらに他の一実施形態における駆動装置の要部の平面図であり、（Ｂ）は、（Ａ）の正面図である。(A) is a top view of the principal part of the drive device in other one embodiment, and (B) is a front view of (A). 従来例の駆動装置を備えた撮像ユニットの概略説明図である。It is a schematic explanatory drawing of the imaging unit provided with the drive device of the prior art example.
　以下、本発明にかかる実施の一形態を図面に基づいて説明する。なお、各図において同一の符号を付した構成は、同一の構成であることを示し、適宜、その説明を省略する。また、本明細書において、総称する場合には添え字を省略した参照符号で示し、個別の構成を指す場合には添え字を付した参照符号で示す。 Hereinafter, an embodiment according to the present invention will be described with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted suitably. Further, in this specification, when referring generically, it is indicated by a reference symbol without a suffix, and when referring to an individual configuration, it is indicated by a reference symbol with a suffix.
　図１は、一実施形態における駆動装置の構成を示す図である。図１（Ａ）は、一実施形態における駆動装置の要部の平面図であり、図１（Ｂ）は、（Ａ）の側面図であり、図１（Ｃ）は、（Ａ）の正面図である。 FIG. 1 is a diagram illustrating a configuration of a driving device according to an embodiment. 1A is a plan view of a main part of a driving device according to an embodiment, FIG. 1B is a side view of FIG. 1A, and FIG. 1C is a front view of FIG. FIG.
　本実施形態における駆動装置１は、アクチュエータ２と、アクチュエータ２を保持したプリント基板３とを備えている。アクチュエータ２は、電気機械変換素子の一例である圧電素子２１と、その圧電素子２１に連結されたロッド２２と、そのロッド２２と係合した移動体２３とを備えている。 The drive device 1 in this embodiment includes an actuator 2 and a printed circuit board 3 that holds the actuator 2. The actuator 2 includes a piezoelectric element 21, which is an example of an electromechanical conversion element, a rod 22 connected to the piezoelectric element 21, and a moving body 23 engaged with the rod 22.
　圧電素子２１は、複数の圧電層が積層されて四角柱状に形成されている。また、図の左右の一対の側面に各圧電層の電極２１ａと電極２１ｂとが引出されて構成されており、これらの電極２１ａ、２１ｂに図略の電源回路から電圧が印加されるようになっている。より具体的には、例えば、圧電材料から成る複数の圧電層が、これら各圧電層間に内部電極を介して積層されており、複数の圧電層の積層方向に沿った互いに対向する側面には、一対の外部電極２１ａ、２１ｂがそれぞれ形成されており、この一対の外部電極２１ａ、２１ｂは、前記複数の内部電極と順次交互に接続されている。なお、この実施形態の圧電素子２１の軸方向の長さＬ１は、１ｍｍ～２．０ｍｍ程度のものとされている。 The piezoelectric element 21 is formed in a quadrangular prism shape by laminating a plurality of piezoelectric layers. Further, electrodes 21a and 21b of each piezoelectric layer are drawn out on a pair of left and right side surfaces in the figure, and a voltage is applied to these electrodes 21a and 21b from a power supply circuit (not shown). ing. More specifically, for example, a plurality of piezoelectric layers made of a piezoelectric material are stacked via internal electrodes between these piezoelectric layers, and on the side surfaces facing each other along the stacking direction of the plurality of piezoelectric layers, A pair of external electrodes 21a and 21b are formed, respectively, and the pair of external electrodes 21a and 21b are sequentially and alternately connected to the plurality of internal electrodes. Note that the axial length L1 of the piezoelectric element 21 of this embodiment is about 1 mm to 2.0 mm.
　ロッド２２は、圧電素子２１の軸方向の一端に連結され、上記圧電素子２１の伸縮に伴いその伸び方向と縮み方向の動き（変位および衝撃）が伝達されて上記軸方向に振動するように構成されている。なお、この実施形態では、ロッド２２の左右の幅が、圧電素子２１のそれよりも大きく設定されている。また、この実施形態のロッド２２は、その軸方向の長さＬ２が１．０ｍｍ～３．０ｍｍ程度のものとされている。 The rod 22 is connected to one end of the piezoelectric element 21 in the axial direction, and is configured to vibrate in the axial direction by transmitting movement (displacement and impact) in the extending direction and contracting direction as the piezoelectric element 21 expands and contracts. Has been. In this embodiment, the left and right width of the rod 22 is set larger than that of the piezoelectric element 21. Further, the rod 22 of this embodiment has an axial length L2 of about 1.0 mm to 3.0 mm.
　移動体２３は、この実施形態では、金属製のバネ用鋼板を折り曲げ成形して略四角筒状に形成されている。そして、このように形成された移動体２３は、筒内にロッド２２が押し入れられるようにしてロッド２２の外周に所定の摩擦力で係合している。 In this embodiment, the moving body 23 is formed in a substantially rectangular tube shape by bending a metal spring steel plate. The moving body 23 thus formed is engaged with the outer periphery of the rod 22 with a predetermined frictional force so that the rod 22 is pushed into the cylinder.
　このように構成されたアクチュエータ２は、圧電素子２１に矩形波の駆動電圧を与えることで圧電素子２１の変位が略三角波状に現われ、その矩形波のデューティ比を変えることで、電圧上昇時と下降時とで傾きが異なる略三角波が発生することを利用することにより駆動が行なわれる。より具体的には、このような構成のアクチュエータ２では、外部の図略の電源回路から一対の電極２１ａ、２１ｂを介して例えばデューティを０．７程度（［ハイレベルの時間］：［ローレベルの時間］＝７：３）の矩形波の駆動電圧が印加されると、圧電素子２１が積層方向に非対称に伸縮する。このように圧電素子２１は、入力の電気エネルギーを機械的な伸縮運動に変換するものである。そして、この圧電素子２１の非対称な伸縮に従いロッド（振動部材）２２がその軸方向における往路と復路とで速度差のある非対称な往復動を行い、ロッド２２には軸方向における例えば正方向のみに押し進める推力が生じる。すなわち、正方向には、ゆっくり伸張するとともに、負方向には、急速に収縮する。つまり、負方向の収縮速度は、正方向の伸張速度より大きい。このロッド２２の非対称な往復運動により、このロッド２２と摩擦係合する移動体２３は、前記軸方向に沿って移動し、電気エネルギーが移動体２３の運動に変換される。一方、前記駆動信号のデューティを０．３程度（［ハイレベルの時間］：［ローレベルの時間］＝３：７）とすることによって、圧電素子２１が前記非対称な伸縮運動とは逆の非対称な伸縮振動を行い、この逆の非対称な伸縮運動によって、ロッド２２は、前記一方向における往路と復路とで逆の速度差のある非対称な往復動を行い、これによってロッド２２には前記軸方向における負方向のみに押し進める推力が生じる。すなわち、負方向には、ゆっくり伸張するとともに、正方向には、急速に収縮する。つまり、正方向の収縮速度は、負方向の伸張速度より大きい。これによって移動体２３は、上記とは逆方向に移動する。なお、上述の例では、駆動電圧は、所定のデューティ比の矩形波であったが、圧電素子２１に伸長時と縮小時とで異なる速度で行わせる電圧として、のこぎり波やランプ波のような電圧レベルの時間変化が非対称な電圧波形であってもよい。 In the actuator 2 configured in this manner, by applying a rectangular wave driving voltage to the piezoelectric element 21, the displacement of the piezoelectric element 21 appears in a substantially triangular wave shape, and by changing the duty ratio of the rectangular wave, Driving is performed by utilizing the fact that a substantially triangular wave having a different slope from that at the time of descending is generated. More specifically, in the actuator 2 having such a configuration, for example, a duty is set to about 0.7 ([high level time]: [low level] from an external power supply circuit (not shown) through the pair of electrodes 21a and 21b). Time] = 7: 3) is applied, the piezoelectric element 21 expands and contracts asymmetrically in the stacking direction. As described above, the piezoelectric element 21 converts input electric energy into a mechanical expansion and contraction motion. Then, the rod (vibrating member) 22 reciprocates asymmetrically with a speed difference between the forward path and the return path in the axial direction according to the asymmetric expansion and contraction of the piezoelectric element 21, and the rod 22 moves only in the positive direction, for example, in the axial direction. Pushing thrust is generated. That is, the film stretches slowly in the positive direction and contracts rapidly in the negative direction. That is, the contraction speed in the negative direction is larger than the expansion speed in the positive direction. Due to the asymmetric reciprocating motion of the rod 22, the moving body 23 frictionally engaged with the rod 22 moves along the axial direction, and electric energy is converted into the motion of the moving body 23. On the other hand, by setting the duty of the drive signal to about 0.3 ([high level time]: [low level time] = 3: 7), the piezoelectric element 21 is asymmetric opposite to the asymmetric expansion and contraction motion. Thus, the rod 22 reciprocates with a reverse speed difference between the forward path and the return path in the one direction due to the reverse asymmetric expansion / contraction movement, thereby causing the rod 22 to move in the axial direction. A thrust is generated that pushes only in the negative direction. That is, it slowly expands in the negative direction and rapidly contracts in the positive direction. That is, the contraction speed in the positive direction is larger than the expansion speed in the negative direction. Thereby, the moving body 23 moves in the opposite direction to the above. In the above example, the driving voltage is a rectangular wave having a predetermined duty ratio. However, as a voltage that causes the piezoelectric element 21 to perform at different speeds during expansion and contraction, a saw wave or a ramp wave is used. The voltage level may be an asymmetric voltage waveform.
　プリント基板３は、例えば撮像素子等の電子部品が実装されるものである。このプリント基板３は、図２に示すように後述の筐体１０１（図１０参照）に対してプリント基板３を位置決めするとともに、当該プリント基板３に対してアクチュエータ２を位置決めするための位置決め部３１ａ、３１ｂを備えている。 The printed circuit board 3 is mounted with electronic parts such as an image sensor. As shown in FIG. 2, the printed circuit board 3 positions the printed circuit board 3 with respect to a case 101 (see FIG. 10), which will be described later, and also positions a actuator 31 with respect to the printed circuit board 3. , 31b.
　この実施形態では、左前方側に配設された円形状の第１位置決め用孔３１ａと、第１位置決め用孔３１ａの右側方側に配設された四角形状の第２位置決め用孔３１ｂとの２つから構成されている。このように第１位置決め用孔３１ａと第２位置決め用孔３１ｂとは、互いを区別するために、平面視にてその形状が互いに異なっている。 In this embodiment, a circular first positioning hole 31a disposed on the left front side and a rectangular second positioning hole 31b disposed on the right side of the first positioning hole 31a. It consists of two. As described above, the first positioning hole 31a and the second positioning hole 31b have different shapes in plan view in order to distinguish each other.
　また、この実施形態におけるプリント基板３は、その後方側の左右両側それぞれに、一対の外部電極３２ａ、３２ｂと、外部電極３２ａ、３２ｂから延ばされた給電パターン３３とを備えている。 In addition, the printed circuit board 3 in this embodiment includes a pair of external electrodes 32a and 32b and a power feeding pattern 33 extended from the external electrodes 32a and 32b on the left and right sides on the rear side.
　次に、この駆動装置１の製造方法について、図３～図９に基づいて説明する。ここでは、間隙形成部材を介してプリント基板３に保持されている例を説明する。この実施形態では、アクチュエータ２は、上記電子部品を実装する図示しないマウンター（表面実装機）を用いることによって、プリント基板３に組み付けて保持される。以下、詳しく説明する。 Next, a method for manufacturing the drive device 1 will be described with reference to FIGS. Here, an example in which the printed circuit board 3 is held via a gap forming member will be described. In this embodiment, the actuator 2 is assembled and held on the printed circuit board 3 by using a mounter (surface mounter) (not shown) for mounting the electronic component. This will be described in detail below.
　まず、プリント基板３が、マウンターが有するテーブル（図示せず）にセットされる。そのセットに際して、第１位置決め用孔３１ａおよび第２位置決め用孔３１ｂは、テーブルに設けられた位置決め用突起（図示せず）に入れられる。これにより、テーブルに対してプリント基板３が位置決めされ得る。 First, the printed circuit board 3 is set on a table (not shown) of the mounter. At the time of the setting, the first positioning hole 31a and the second positioning hole 31b are put into positioning protrusions (not shown) provided on the table. Thereby, the printed circuit board 3 can be positioned with respect to the table.
　次に、図３に示すように、プリント基板３上における外部電極３２ａ、３２ｂ近傍の前方側に、ＵＶ接着剤（紫外線硬化型接着剤）と熱硬化型接着剤とからなる接着剤が配設されるとともに、その上に間隙形成部材４１が配設され、ＵＶ接着剤の接着力によって間隙形成部材４１が接着される。 Next, as shown in FIG. 3, an adhesive composed of a UV adhesive (ultraviolet curable adhesive) and a thermosetting adhesive is disposed on the front side of the printed circuit board 3 in the vicinity of the external electrodes 32a and 32b. At the same time, a gap forming member 41 is disposed thereon, and the gap forming member 41 is bonded by the adhesive force of the UV adhesive.
　また、間隙形成部材４１の後方側における一対の外部電極３２ａ、３２ｂ間に、ＵＶ接着剤と熱硬化型接着剤とからなる接着剤が配設されるとともに、その上に、圧電素子２１を載置する圧電素子載置部材４２が配設され、ＵＶ接着剤の接着力によって圧電素子載置部材４２が接着される。 Further, an adhesive composed of a UV adhesive and a thermosetting adhesive is disposed between the pair of external electrodes 32a and 32b on the rear side of the gap forming member 41, and the piezoelectric element 21 is mounted thereon. The piezoelectric element mounting member 42 to be placed is disposed, and the piezoelectric element mounting member 42 is bonded by the adhesive force of the UV adhesive.
　さらに、プリント基板３上における第１位置決め用孔３１ａおよび第２位置決め用孔３１ｂの前方側に、ＵＶ接着剤と熱劣化型接着剤とからなる接着剤が配設されるとともに、その上に、ロッド２２を載置するロッド仮載置部材４３が配設され、ＵＶ接着剤の接着力によってロッド仮載置部材４３が接着される。 Furthermore, an adhesive made of a UV adhesive and a heat-degradable adhesive is disposed on the front side of the first positioning hole 31a and the second positioning hole 31b on the printed circuit board 3, and further, A rod temporary placement member 43 for placing the rod 22 is disposed, and the rod temporary placement member 43 is bonded by the adhesive force of the UV adhesive.
　これらの間隙形成部材４１、圧電素子載置部材４２およびロッド仮載置部材４３は、本実施形態では、同じ厚さの四角柱状のものから構成されている。この実施形態では、これらは、厚さが０．５ｍｍ程度のものから構成されている。なお、これらの間隙形成部材４１、圧電素子載置部材４２およびロッド仮載置部材４３の材質は、特に限定されず、合成樹脂、金属等から構成することができる。 In the present embodiment, the gap forming member 41, the piezoelectric element mounting member 42, and the rod temporary mounting member 43 are formed of a rectangular column shape having the same thickness. In this embodiment, these are composed of a thickness of about 0.5 mm. In addition, the material of these gap | interval formation member 41, the piezoelectric element mounting member 42, and the rod temporary mounting member 43 is not specifically limited, It can comprise from a synthetic resin, a metal, etc.
　次に、図４に示すように間隙形成部材４１の上に、ＵＶ接着剤と熱硬化型接着剤とからなる接着剤４４が塗布される。 Next, as shown in FIG. 4, an adhesive 44 made of a UV adhesive and a thermosetting adhesive is applied on the gap forming member 41.
　そして、図５に示すように、マウンターに設けられた３つの柱状の後圧電素子用位置決め部材４５ａ、左圧電素子用位置決め部材４５ｂおよび右圧電素子用位置決め部材４５ｃが、圧電素子載置部材４２の後方側と左右両側とから囲むようにマウンターで吊り下げ支持するようにしてプリント基板３上に配設されるとともに、マウンターに設けられた２つの柱状の左ロッド用位置決め部材４６ａと右ロッド用位置決め部材４６ｂとが、間隙形成部材４１とロッド仮載置部材４３との間に、互いに間隙をあけて左右両側それぞれにマウンターで吊り下げ支持するようにしてプリント基板３上に配設される。 Then, as shown in FIG. 5, three columnar rear piezoelectric element positioning members 45a, a left piezoelectric element positioning member 45b, and a right piezoelectric element positioning member 45c provided on the mounter are arranged on the piezoelectric element mounting member 42. Two columnar left rod positioning members 46a and a right rod positioning member disposed on the printed circuit board 3 so as to be suspended and supported by a mounter so as to be surrounded from the rear side and the left and right sides. The member 46b is disposed on the printed circuit board 3 so as to be suspended and supported by the mounters on the left and right sides with a gap between the gap forming member 41 and the temporary rod mounting member 43.
　上記左右の圧電素子用位置決め部材４５ｂ、４５ｃ同士の距離は、圧電素子２１の幅とほほ同じに設定され、上記左右のロッド用位置決め部材４６ａ、４６ｂ同士の距離は、ロッド２２の幅とほほ同じに設定されている。 The distance between the left and right piezoelectric element positioning members 45b and 45c is set to be approximately the same as the width of the piezoelectric element 21, and the distance between the left and right rod positioning members 46a and 46b is set to be approximately the same as the width of the rod 22. Has been.
　その後、図６に示すように、圧電素子２１が、左右の圧電素子用位置決め部材４５ｂ、４５ｃ間に入れられるようにして圧電素子載置部材４２と間隙形成部材４１上の接着剤４４の一部とに載置される。これにより、接着剤４４上に載った圧電素子２１は、圧電素子載置部材４２と間隙形成部材４１とでプリント基板３の上面に対して平行に配設されるとともに、接着剤４４の表面張力でその平行状態を維持しながら前方側（図６（Ａ）、（Ｂ）の矢印の方向）に移動する。 Thereafter, as shown in FIG. 6, the piezoelectric element 21 is inserted between the left and right piezoelectric element positioning members 45 b and 45 c, and a part of the adhesive 44 on the piezoelectric element mounting member 42 and the gap forming member 41. And placed. As a result, the piezoelectric element 21 placed on the adhesive 44 is disposed in parallel with the upper surface of the printed circuit board 3 by the piezoelectric element mounting member 42 and the gap forming member 41, and the surface tension of the adhesive 44. Then, while maintaining the parallel state, it moves forward (in the direction of the arrows in FIGS. 6A and 6B).
　次に、図７に示すようにロッド２２が、２つのロッド用位置決め部材４６ａ、４６ｂ間に入れられるようにしてロッド仮載置部材４３と間隙形成部材４１上の接着剤４４の一部の上に載置される。これにより、ロッド２２は、ロッド仮載置部材４３と間隙形成部材４１とでプリント基板３の上面に対して平行に配設されるとともに、接着剤４４の表面張力でその平行状態を維持しながら後方側（図７（Ａ）、（Ｂ）の矢印の方向）に移動してロッド２２の後端面が圧電素子２１の前端面に当接するとともに、さらに、ロッド２２における接着剤４４との当接面積が圧電素子２１のそれよりも大きく設定されており、これにより、接着剤４４の表面張力で圧電素子２１が後圧電素子用位置決め部材４５ａに当接するまでロッド２２は圧電素子２１を後方に押圧しながら移動する。 Next, as shown in FIG. 7, the rod 22 is placed between the two rod positioning members 46a and 46b so that the rod temporary placement member 43 and a part of the adhesive 44 on the gap forming member 41 are over Placed on. As a result, the rod 22 is disposed in parallel with the upper surface of the printed circuit board 3 by the temporary rod mounting member 43 and the gap forming member 41, and the parallel state is maintained by the surface tension of the adhesive 44. The rod 22 moves rearward (in the direction of the arrows in FIGS. 7A and 7B) so that the rear end surface of the rod 22 comes into contact with the front end surface of the piezoelectric element 21 and further comes into contact with the adhesive 44 in the rod 22. The area is set to be larger than that of the piezoelectric element 21, so that the rod 22 presses the piezoelectric element 21 backward until the piezoelectric element 21 contacts the rear piezoelectric element positioning member 45 a by the surface tension of the adhesive 44. Move while.
　ロッド２２の後端面が圧電素子２１に前端面に当接する場合に、後端面と前端面との間に接着剤が毛細管現象により入る。組立装置にロッド２２を圧電素子２１側に押し付けるような機能を有する機構がさらに付けられてもよい。 When the rear end surface of the rod 22 comes into contact with the front end surface of the piezoelectric element 21, an adhesive enters between the rear end surface and the front end surface by a capillary phenomenon. A mechanism having a function of pressing the rod 22 toward the piezoelectric element 21 may be further added to the assembling apparatus.
　なお、圧電素子２１と後圧電素子用位置決め部材４５ａとの当接は、上記のように接着剤４４の表面張力によるロッド２２の移動に伴う形態のものに限らず、例えばロッド２２を前方側から後方に押圧して圧電素子２１を後圧電素子用位置決め部材４５ａに当接させるようにしてもよく、適宜に変更することができる。 The contact between the piezoelectric element 21 and the rear piezoelectric element positioning member 45a is not limited to the form accompanying the movement of the rod 22 due to the surface tension of the adhesive 44 as described above. For example, the rod 22 is moved from the front side. The piezoelectric element 21 may be pressed against the back to contact the rear piezoelectric element positioning member 45a, and can be changed as appropriate.
　この状態で、圧電素子２１およびロッド２２は、プリント基板３に対して位置決めされた状態で、プリント基板３上に配設される。また、この状態で、ロッド２２とプリント基板３との間に、間隙形成部材４１の厚さ分の間隙４７が形成される。 In this state, the piezoelectric element 21 and the rod 22 are disposed on the printed circuit board 3 while being positioned with respect to the printed circuit board 3. In this state, a gap 47 corresponding to the thickness of the gap forming member 41 is formed between the rod 22 and the printed board 3.
　次に、プリント基板３が、マウンターのテーブルから外される。そして、プリント基板３が、トレーに並べられて、１００°Ｃ～１５０°Ｃに加熱され、上記熱硬化型接着剤が硬化する。これにより、圧電素子２１およびロッド２２は、上記熱硬化型接着剤によってプリント基板３に強固に固定した状態に保持され得る。 Next, the printed circuit board 3 is removed from the mounter table. Then, the printed circuit boards 3 are arranged in a tray and heated to 100 ° C. to 150 ° C., and the thermosetting adhesive is cured. Thereby, the piezoelectric element 21 and the rod 22 can be held in a state of being firmly fixed to the printed circuit board 3 by the thermosetting adhesive.
　また、この熱硬化過程で、ロッド仮載置部材４３とプリント基板３との間に配設された上記熱劣化型接着剤の接着力がなくなるので、図８に示すようにロッド仮載置部材４３が除去される。 Further, in this thermosetting process, since the adhesive force of the thermally deteriorated adhesive disposed between the rod temporary mounting member 43 and the printed board 3 is lost, the rod temporary mounting member as shown in FIG. 43 is removed.
　次に、図９に示すように、圧電素子２１の電極２１ａ、２１ｂとプリント基板３の外部電極３２ａ、３２ｂとが、導電性接着剤４８、半田ペースト、或いは、リード線等の接続手段（この実施形態では導電性接着剤４８で接続）によって通電可能に接続される。 Next, as shown in FIG. 9, the electrodes 21a and 21b of the piezoelectric element 21 and the external electrodes 32a and 32b of the printed circuit board 3 are connected to a connecting means such as a conductive adhesive 48, solder paste, or lead wire (this In the embodiment, the conductive adhesive 48 is connected so that current can be passed.
　そして、図１に示すように移動体２３が、ロッド２２に装着される。これにより、駆動装置１が作成される。 Then, the moving body 23 is attached to the rod 22 as shown in FIG. Thereby, the drive device 1 is created.
　次に、この駆動装置１を備えた機器について、図１０に基づいて説明する。 Next, a device provided with the driving device 1 will be described with reference to FIG.
　この実施形態では、機器は、光学部材（光学素子）を有する光学機器としての携帯電話の端末機に組み込まれる撮像ユニット１００を備えている。撮像ユニット１００は、機器本体の一部を構成する筐体１０１と、アクチュエータ２およびプリント基板３を備えた上述の駆動装置１とを備えている。 In this embodiment, the device includes an imaging unit 100 that is incorporated in a mobile phone terminal as an optical device having an optical member (optical element). The imaging unit 100 includes a housing 101 that constitutes a part of the apparatus main body, and the above-described driving device 1 that includes the actuator 2 and the printed circuit board 3.
　筐体１０１内には、光学部材を構成するレンズ１０４および撮像素子１０５と、図示しない駆動回路や制御部等の電子部品が配設されている。 In the housing 101, a lens 104 and an image sensor 105 that constitute an optical member, and electronic components such as a drive circuit and a control unit (not shown) are arranged.
　撮像素子１０５および電子部品は、駆動装置１のプリント基板３に実装されている。撮像素子１０５および電子部品は、この実施形態では、上述したようにマウンターによってプリント基板３にアクチュエータ２を組み付ける際に、プリント基板３がマウンターのテーブルにセットされたとき、アクチュエータ２の組み付けに先立って上記マウンターで実装されている。 The image sensor 105 and the electronic components are mounted on the printed circuit board 3 of the driving device 1. In this embodiment, when the actuator 2 is assembled to the printed circuit board 3 by the mounter as described above, the imaging element 105 and the electronic component are set prior to the assembly of the actuator 2 when the printed circuit board 3 is set on the mounter table. Implemented by the above mounter.
　したがって、本実施形態では、撮像ユニット１００に必要な電子部品をマウンターによってプリント基板３に実装する工程に、アクチュエータ２をプリント基板３に組み付ける作業を含めることができる。よって、アクチュエータ２をプリント基板３に組み付ける作業を機械的に自動で行なうことができ、容易に短時間でおこなうことができる。 Therefore, in this embodiment, the process of mounting the actuator 2 on the printed circuit board 3 can be included in the process of mounting the electronic components necessary for the imaging unit 100 on the printed circuit board 3 by the mounter. Therefore, the operation of assembling the actuator 2 to the printed circuit board 3 can be performed mechanically automatically, and can be easily performed in a short time.
　なお、撮像素子１０５や電子部品のプリント基板３への実装は、上述のようにアクチュエータ２の組み付けに先立って行なう形態のものに限らず、例えばアクチュエータ２の組み付け後に行ってもよい。また、撮像素子１０５や電子部品のプリント基板３への実装は、アクチュエータ２の組み付けに用いたマウンターとは別のマウンターで別途に実装されてもよい。 Note that the mounting of the imaging element 105 and the electronic component on the printed circuit board 3 is not limited to the form performed before the assembly of the actuator 2 as described above, and may be performed after the assembly of the actuator 2, for example. In addition, the mounting of the image sensor 105 and the electronic component on the printed circuit board 3 may be performed separately by a mounter different from the mounter used for assembling the actuator 2.
　駆動装置１は、移動体２３とレンズ１０４とが、接着剤４４等の連結手段によって連結されているとともに、プリント基板３の第１位置決め用孔３１ａと第２位置決め用孔３１ｂとが、後述の筐体１０１に設けられた突片１０２ａそれぞれに嵌挿される。 In the driving device 1, the moving body 23 and the lens 104 are connected by a connecting means such as an adhesive 44, and a first positioning hole 31 a and a second positioning hole 31 b of the printed circuit board 3 are described later. It is inserted into each of the protruding pieces 102 a provided on the housing 101.
　これにより、第１位置決め用孔３１ａと第２位置決め用孔３１ｂとを介して、プリント基板３が、筐体１０１に対して位置決めされて所定位置に配設されるとともに、アクチュエータ２が、筐体１０１に対して位置決めされて所定位置に配設される。 Thus, the printed circuit board 3 is positioned with respect to the casing 101 and disposed at a predetermined position via the first positioning hole 31a and the second positioning hole 31b, and the actuator 2 is connected to the casing. It is positioned with respect to 101 and disposed at a predetermined position.
　そして、この状態で、アクチュエータ２の圧電素子２１に電圧が印加されると、圧電素子２１が軸方向に伸縮し、その伸縮に伴う変位および衝撃によってロッド２２が上記軸方向（図１０のＸ―Ｘ方向）に振動する。そして、そのロッド２２の軸方向への振動に応じて移動体２３が適宜軸方向に移動することによって、レンズ１０４は、光軸方向（図のＸ－Ｘ方向）に沿って移動することができる。 In this state, when a voltage is applied to the piezoelectric element 21 of the actuator 2, the piezoelectric element 21 expands and contracts in the axial direction, and the rod 22 moves in the axial direction (X-- in FIG. Vibrates in the X direction). The lens 104 can move along the optical axis direction (XX direction in the figure) by appropriately moving the moving body 23 in the axial direction according to the vibration of the rod 22 in the axial direction. .
　なお、上記実施形態では、アクチュエータ２は、圧電素子２１とロッド２２と移動体２３とから構成されているが、この形態のものに限らず、適宜に変更することができ、例えば圧電素子２１におけるロッド２２と反対側の端部に錘を連結したものであってもよい。 In the above embodiment, the actuator 2 includes the piezoelectric element 21, the rod 22, and the moving body 23. However, the actuator 2 is not limited to this configuration, and can be changed as appropriate. A weight may be connected to the end opposite to the rod 22.
　また、上記実施形態では、間隙形成部材４１におけるほぼ前側の半分に圧電素子２１が、間隙形成部材４１におけるほぼ後側の半分にロッド２２が、それぞれ載せられたが、間隙形成部材４１の配設位置は、この形態のものに限らず、適宜に変更することができる。 In the above-described embodiment, the piezoelectric element 21 is mounted on the substantially front half of the gap forming member 41 and the rod 22 is mounted on the substantially rear half of the gap forming member 41. The position is not limited to that in this form, but can be changed as appropriate.
　例えば、図１１に示すように、駆動装置１は、間隙形成部材４１における前後長さ（幅）の１／２を超えるようにロッド２２を間隙形成部材４１に載せるように構成されてもよい。また、図１２に示すように、駆動装置１は、間隙形成部材４１の全部にロッド２２を載せるようにして圧電素子２１を間隙形成部材４１に全く載せないように構成されてもよい。ただし、圧電素子２１を間隙形成部材４１に全く載せないで組み付けを行う場合には、圧電素子２１がプリント基板３の上面に対して平行に配設され難くなるので、圧電素子２１を間隙形成部材４１に載せるようにして組み付けを行うことが好ましい。 For example, as shown in FIG. 11, the drive device 1 may be configured to place the rod 22 on the gap forming member 41 so as to exceed 1/2 of the longitudinal length (width) of the gap forming member 41. As shown in FIG. 12, the driving device 1 may be configured such that the rod 22 is placed on the entire gap forming member 41 and the piezoelectric element 21 is not placed on the gap forming member 41 at all. However, when the assembly is performed without placing the piezoelectric element 21 on the gap forming member 41 at all, the piezoelectric element 21 becomes difficult to be disposed in parallel to the upper surface of the printed circuit board 3, so that the piezoelectric element 21 is attached to the gap forming member. Assembling is preferably performed so as to be placed on 41.
　また、上記実施形態では、プリント基板３は、直接筐体１０１に取り付けられたが、例えば、プリント基板３の下面に、金属製等の板部材６（図９中に一点鎖線で示す）がさらに設けられ、プリント基板３が補強されてもよい。 In the above embodiment, the printed circuit board 3 is directly attached to the housing 101. For example, a plate member 6 made of metal or the like (shown by a one-dot chain line in FIG. 9) is further provided on the lower surface of the printed circuit board 3. It may be provided and the printed circuit board 3 may be reinforced.
　また、上記実施形態では、アクチュエータ２におけるロッド２２とプリント基板３との間に間隙４７を形成する間隙形成部材４１が設けられているが、この形態のものに限らず、適宜に変更することができる。例えば、図１３に示すように、プリント基板３に、ロッド２２よりも広い幅で前端から後方に所定の長さでカットすることによって形成した逃がし部３４（スリット状の切り欠き部）を設け、逃がし部３４の上方側にロッド２２を配設するようにして、圧電素子２１とロッド２２とが、直接プリント基板３に接着剤によって固定される。このように、駆動装置１は、移動体２３がロッド２２を移動する際に逃がし部３４によって移動体２３がプリント基板３に当接することのないものにしてもよい。 Further, in the above embodiment, the gap forming member 41 that forms the gap 47 between the rod 22 and the printed board 3 in the actuator 2 is provided. it can. For example, as shown in FIG. 13, the printed circuit board 3 is provided with a relief part 34 (slit-like notch part) formed by cutting a predetermined length from the front end to the rear with a width wider than the rod 22. The piezoelectric element 21 and the rod 22 are directly fixed to the printed circuit board 3 with an adhesive so that the rod 22 is disposed above the relief portion 34. As described above, the driving device 1 may be configured such that the moving body 23 does not come into contact with the printed circuit board 3 by the escape portion 34 when the moving body 23 moves the rod 22.
　なお、上記実施形態では、図１０に示すように、撮像素子１０５の搭載されたプリント基板面とアクチュエータ２の搭載されたプリント基板面とが、直角を成すように配設されることによって、この撮影ユニット１００は、アクチュエータ２上に備えられたレンズ１０４からの光を撮像素子１０５に垂直に入射させるようにすることを可能にしている。 In the above-described embodiment, as shown in FIG. 10, the printed circuit board surface on which the image sensor 105 is mounted and the printed circuit board surface on which the actuator 2 is mounted are arranged so as to form a right angle. The photographing unit 100 enables light from the lens 104 provided on the actuator 2 to enter the imaging element 105 perpendicularly.
　また、上記のようにプリント基板３に逃がし部３４を設けた場合において、図１４に示すように上記逃がし部３４に対応する筐体１０１の一部にも、凹部１０７がさらに設けられ、筐体１０１に取り付けられた場合に、移動体２３がロッド２２を移動する際に、移動体２３が、筐体１０１の一部に当接しないようにしてもよい。 Further, when the escape portion 34 is provided in the printed circuit board 3 as described above, a recess 107 is further provided in a part of the housing 101 corresponding to the escape portion 34 as shown in FIG. When attached to 101, when the moving body 23 moves the rod 22, the moving body 23 may not contact a part of the housing 101.
　また、上記実施形態では、位置決め部は、第１位置決め用孔３１ａと第２位置決め用孔３１ｂとから構成されているが、この形態のものに限らず、位置決め部は、例えば、位置決め部を下方に突出する突片から構成され、筐体１０１に設けた孔に嵌め入れるようにしてもよく、適宜に変更することができる。また、位置決め部の位置、大きさ、数等についても特に限定されず、例えば、図１４に示すように、位置決め部としての孔１３１が、プリント基板３における圧電素子２１の近傍に設けられてもよい。 Moreover, in the said embodiment, although the positioning part is comprised from the 1st positioning hole 31a and the 2nd positioning hole 31b, it is not restricted to the thing of this form, For example, a positioning part is a positioning part below. May be inserted into a hole provided in the housing 101, and can be changed as appropriate. Further, the position, size, number, etc. of the positioning portions are not particularly limited. For example, as shown in FIG. 14, even if a hole 131 as a positioning portion is provided in the vicinity of the piezoelectric element 21 in the printed board 3. Good.
　また、上記実施形態では、撮像ユニット１００は、１つのアクチュエータ２を備えたものとされているが、この形態のものに限らず、適宜に変更することができる。 In the above embodiment, the imaging unit 100 is provided with one actuator 2, but is not limited to this configuration, and can be changed as appropriate.
　例えば、図１５に示すように、プリント基板３００が、基板本体３０１と、基板本体３０１の一部を所定の角度（この実施形態では直角）に折り曲げ形成した折り曲げ形成部３０２とから構成され、それらの基板本体３０１と折り曲げ形成部３０２とにそれぞれ、アクチュエータ２が組み付けられ、これらアクチュエータ２は、互いの軸方向が異なるものとされる。 For example, as shown in FIG. 15, a printed circuit board 300 includes a substrate body 301 and a fold forming portion 302 formed by bending a part of the substrate body 301 at a predetermined angle (right angle in this embodiment). The actuator 2 is assembled to each of the substrate main body 301 and the bending formation portion 302, and the axial directions of the actuators 2 are different from each other.
　これにより、例えば、撮像ユニット１００に設けられた第１および第２のレンズ（図示せず）と各アクチュエータ２とをそれぞれ連結すれば、一方のアクチュエータ２で第１レンズをＸ―Ｘ方向に、他方のアクチュエータ２で第２レンズを、Ｘ―Ｘ方向と直交するＹ－Ｙ方向に移動させることが可能になる。 Thereby, for example, if the first and second lenses (not shown) provided in the imaging unit 100 and each actuator 2 are respectively connected, the first lens is moved in the XX direction by one actuator 2. The other actuator 2 can move the second lens in the YY direction orthogonal to the XX direction.
　また、上記実施形態では、本実施形態の駆動装置１を備えた機器は、携帯電話の端末機内に組み込まれる撮像ユニット１００で構成されたが、例えばディジタルカメラ等の光学機器、あるいは、光ファイバー、光導波路への光路調節装置に用いることができる。 Moreover, in the said embodiment, although the apparatus provided with the drive device 1 of this embodiment was comprised by the imaging unit 100 incorporated in the terminal of a mobile telephone, for example, optical devices, such as a digital camera, or an optical fiber, light guide It can be used for an optical path adjusting device to a waveguide.
　なお、以上の説明において、プリント基板３を例に挙げて説明したが、折り曲げが必要ではない場合には、プリント基板３の代わりにリジッドな基板であってもよい。 In the above description, the printed board 3 has been described as an example, but a rigid board may be used instead of the printed board 3 when bending is not necessary.
　本明細書は、上記のように様々な態様の技術を開示しているが、そのうち主な技術を以下に纏める。 This specification discloses various modes of technology as described above, and the main technologies are summarized below.
　一態様にかかる駆動装置は、軸方向に伸縮する電気機械変換素子とその電気機械変換素子の一端に接続され前記電気機械変換素子の伸縮により振動するロッドとそのロッドに所定の摩擦力で係合し前記ロッドの軸方向に移動可能な移動体とを備えたアクチュエータと、前記アクチュエータが装着される機器の機器本体に付設される基板であって、電子部品を実装された基板と、を有する駆動装置であって、前記アクチュエータは、前記電子部品を実装された基板に位置決めされて保持され、前記プリント基板は、前記機器本体に組み付けられる際に、前記機器本体に対して位置決めされる位置決め部を備えている。 A drive device according to one aspect includes an electromechanical conversion element that expands and contracts in an axial direction, a rod that is connected to one end of the electromechanical conversion element and vibrates by expansion and contraction of the electromechanical conversion element, and engages the rod with a predetermined friction force And an actuator having a movable body movable in the axial direction of the rod, and a substrate attached to a device main body of a device to which the actuator is mounted, the substrate having an electronic component mounted thereon In the apparatus, the actuator is positioned and held on a board on which the electronic component is mounted, and the printed board has a positioning portion that is positioned with respect to the equipment body when the printed board is assembled to the equipment body. I have.
　このような構成の駆動装置では、例えば機器に必要な電子部品を基板（例えばプリント基板）にマウンター（実装機）によって実装する工程でアクチュエータを前記基板に自動組み付けすることが可能となり、アクチュエータの前記基板への組み付けが容易となる。したがって、組み立て作業は、電子部品およびアクチュエータを組み付けた前記基板を機器本体に組み付ければよく、従来のように基板とは別途にアクチュエータを機器本体に組み付ける作業を不要にすることができ、アクチュエータを小型化した場合でも、機器本体への組み付け作業は、簡単なものとなる。 In the driving device having such a configuration, for example, an actuator can be automatically assembled to the substrate in a process of mounting electronic components necessary for the device on a substrate (for example, a printed circuit board) by a mounter (mounting machine). Assembling to the board becomes easy. Therefore, the assembly work may be performed by assembling the board on which the electronic component and the actuator are assembled to the equipment main body, and the work for assembling the actuator separately from the board as in the prior art can be eliminated. Even in the case of downsizing, the assembling work to the device main body becomes simple.
　また、基板を機器本体に組み付ける際には、前記基板は、位置決め部によって機器本体に対して所定の位置に位置決めされ得る。 Further, when the substrate is assembled to the device main body, the substrate can be positioned at a predetermined position with respect to the device main body by the positioning unit.
　また、この位置決め部を基準にしてアクチュエータを基板に組み付けるように作業を行うことによって、アクチュエータは、基板に対して所定の位置に配設され得る。したがって、位置決め部を基準にして基板を機器本体に組み付けることによって、アクチュエータを機器本体の所定の位置に配設することができる。 Further, the actuator can be disposed at a predetermined position with respect to the substrate by performing an operation so that the actuator is assembled to the substrate with reference to the positioning portion. Therefore, the actuator can be disposed at a predetermined position of the apparatus main body by assembling the substrate to the apparatus main body with reference to the positioning portion.
　また、他の一態様では、上述の駆動装置において、前記ロッドと前記電子部品を実装された基板との間に、前記移動体が移動するに際して前記電子部品を実装された基板と接触しないように両者間に間隙を形成するための間隙形成部材がさらに設けられ、前記ロッドは、前記間隙形成部材を介して前記電子部品を実装された基板に保持されている。 According to another aspect, in the above-described driving device, when the moving body moves between the rod and the substrate on which the electronic component is mounted, the electronic device is not brought into contact with the substrate on which the electronic component is mounted. A gap forming member for forming a gap between the two is further provided, and the rod is held on the substrate on which the electronic component is mounted via the gap forming member.
　このような構成の駆動装置では、基板上に置いた間隙形成部材にロッドを載置するように配設することによって、移動体が移動するに際して基板に接触しないようにする間隙が、ロッドと基板との間に簡単に形成することができる。 In the driving device having such a configuration, the rod and the substrate are arranged so that the rod is placed on the gap forming member placed on the substrate so as not to contact the substrate when the moving body moves. Can be easily formed between the two.
　また、他の一態様では、これら上述の駆動装置において、好ましくは、前記電子部品を実装された基板は、プリント基板である。このような構成では、前記基板がプリント基板である駆動装置が提供される。 In another aspect, in the above-described driving device, preferably, the board on which the electronic component is mounted is a printed board. With such a configuration, a driving device in which the substrate is a printed circuit board is provided.
　また、他の一態様にかかる機器は、これら上述のいずれかの駆動装置を備えている。 Further, a device according to another aspect includes any one of the above-described driving devices.
　このような構成の駆動装置では、例えば機器に必要な電子部品を基板（例えばプリント基板）にマウンターによって実装する工程でアクチュエータを前記基板に自動組み付けすることが可能となり、また、組み立て作業は、基板を機器本体に組み付ければよく、従来のように基板とは別途にアクチュエータを機器本体に組み付ける作業を不要にすることができ、アクチュエータの機器本体への組み付けが簡素化され得る。 In the driving device having such a configuration, for example, an actuator can be automatically assembled to the substrate in a process of mounting electronic components necessary for the device on a substrate (for example, a printed circuit board) by a mounter. Can be assembled to the apparatus main body, and the work of assembling the actuator to the apparatus main body separately from the substrate as in the prior art can be made unnecessary, and the assembly of the actuator to the apparatus main body can be simplified.
　また、基板を機器本体に組み付ける際には、前記基板は、位置決め部によって機器本体に対して所定の位置に位置決めされ得る。 Further, when the substrate is assembled to the device main body, the substrate can be positioned at a predetermined position with respect to the device main body by the positioning unit.
　この出願は、２０１０年１１月４日に出願された日本国特許出願特願２０１０－２４７０９５を基礎とするものであり、その内容は、本願に含まれるものである。 This application is based on Japanese Patent Application No. 2010-247095 filed on Nov. 4, 2010, the contents of which are included in the present application.
　本発明を表現するために、上述において図面を参照しながら実施形態を通して本発明を適切且つ十分に説明したが、当業者であれば上述の実施形態を変更および／または改良することは容易に為し得ることであると認識すべきである。したがって、当業者が実施する変更形態または改良形態が、請求の範囲に記載された請求項の権利範囲を離脱するレベルのものでない限り、当該変更形態または当該改良形態は、当該請求項の権利範囲に包括されると解釈される。 In order to express the present invention, the present invention has been properly and fully described through the embodiments with reference to the drawings. However, those skilled in the art can easily change and / or improve the above-described embodiments. It should be recognized that this is possible. Therefore, unless the modifications or improvements implemented by those skilled in the art are at a level that departs from the scope of the claims recited in the claims, the modifications or improvements are not covered by the claims. It is interpreted that it is included in
　本発明によれば、駆動装置を提供することができる。 According to the present invention, a drive device can be provided.

Claims (4)

  1. 　軸方向に伸縮する電気機械変換素子とその電気機械変換素子の一端に接続され前記電気機械変換素子の伸縮により振動するロッドとそのロッドに所定の摩擦力で係合し前記ロッドの軸方向に移動可能な移動体とを備えたアクチュエータと、
    　前記アクチュエータが装着される機器の機器本体に付設される、電子部品を実装された基板と、を有する駆動装置であって、
    　前記アクチュエータは、前記電子部品を実装された基板に位置決めされて保持され、
    　前記電子部品を実装された基板は、前記機器本体に組み付けられる際に、前記機器本体に対して位置決めされる位置決め部を備えていること
    　を特徴とする駆動装置。     An electromechanical transducer that expands and contracts in the axial direction, a rod that is connected to one end of the electromechanical transducer and vibrates by the expansion and contraction of the electromechanical transducer, and engages the rod with a predetermined frictional force and moves in the axial direction of the rod An actuator with a movable body,
    A driving device having a board mounted with electronic components attached to a device main body of a device to which the actuator is mounted,
    The actuator is positioned and held on a substrate on which the electronic component is mounted,
    The driving device according to claim 1, wherein the board on which the electronic component is mounted includes a positioning portion that is positioned with respect to the device main body when the substrate is assembled to the device main body.
  2. 　前記ロッドと前記電子部品を実装された基板との間に、前記移動体が移動するに際して前記電子部品を実装された基板と接触しないように両者間に間隙を形成するための間隙形成部材がさらに設けられ、
    　前記ロッドは、前記間隙形成部材を介して前記電子部品を実装された基板に保持されていること
    　を特徴とする請求項１に記載の駆動装置。     A gap forming member for forming a gap between the rod and the board on which the electronic component is mounted so as not to come into contact with the board on which the electronic component is mounted when the movable body moves. Provided,
    The drive device according to claim 1, wherein the rod is held on a substrate on which the electronic component is mounted via the gap forming member.
  3. 　前記電子部品を実装された基板は、プリント基板であること
    　を特徴とする請求項１または請求項２に記載の駆動装置。     The drive device according to claim 1, wherein the board on which the electronic component is mounted is a printed board.
  4. 　請求項１ないし請求項３のいずれか１項に記載の駆動装置を備えていることを特徴とする機器。 A device comprising the drive device according to any one of claims 1 to 3.
PCT/JP2011/005225 2010-11-04 2011-09-15 Drive device and equipment WO2012060048A1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2014185297A1 (en) * 2013-05-16 2014-11-20 コニカミノルタ株式会社 Drive device and imaging device

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Publication number Priority date Publication date Assignee Title
JP2008245467A (en) * 2007-03-28 2008-10-09 Fujinon Corp Drive device
JP2008306841A (en) * 2007-06-07 2008-12-18 Konica Minolta Opto Inc Driving device and driving device unit
JP2009246563A (en) * 2008-03-28 2009-10-22 Citizen Finetech Miyota Co Ltd Method for manufacturing piezoelectric vibrator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245467A (en) * 2007-03-28 2008-10-09 Fujinon Corp Drive device
JP2008306841A (en) * 2007-06-07 2008-12-18 Konica Minolta Opto Inc Driving device and driving device unit
JP2009246563A (en) * 2008-03-28 2009-10-22 Citizen Finetech Miyota Co Ltd Method for manufacturing piezoelectric vibrator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014185297A1 (en) * 2013-05-16 2014-11-20 コニカミノルタ株式会社 Drive device and imaging device

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