WO2012057038A1 - Module électroluminescent et équipement d'éclairage - Google Patents

Module électroluminescent et équipement d'éclairage Download PDF

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Publication number
WO2012057038A1
WO2012057038A1 PCT/JP2011/074341 JP2011074341W WO2012057038A1 WO 2012057038 A1 WO2012057038 A1 WO 2012057038A1 JP 2011074341 W JP2011074341 W JP 2011074341W WO 2012057038 A1 WO2012057038 A1 WO 2012057038A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting module
substrate
alignment mark
light
Prior art date
Application number
PCT/JP2011/074341
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English (en)
Japanese (ja)
Inventor
友広 三瓶
絵梨果 竹中
Original Assignee
東芝ライテック株式会社
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Application filed by 東芝ライテック株式会社 filed Critical 東芝ライテック株式会社
Priority to JP2012540828A priority Critical patent/JPWO2012057038A1/ja
Priority to CN201190000701.5U priority patent/CN203481265U/zh
Publication of WO2012057038A1 publication Critical patent/WO2012057038A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • Embodiments of the present invention relate to a light emitting module in which a plurality of light emitting elements are mounted side by side on a substrate, and a lighting fixture incorporating the light emitting module.
  • light emitting modules in which a plurality of light emitting elements (for example, LEDs; light emitting diodes) are arranged and mounted on a substrate have been developed, and lighting fixtures incorporating this type of light emitting module are becoming popular.
  • LEDs for example, LEDs; light emitting diodes
  • the light emitting module has an alignment mark (also referred to as a fiducial mark) used in an inspection process for inspecting whether or not a plurality of light emitting elements are normally mounted at predetermined positions on the substrate.
  • the alignment mark is formed on the surface of the substrate separately from the power supply pattern for supplying power to the light emitting element outside the mounting area of the light emitting element.
  • the alignment mark is used, for example, to determine a positional deviation of a lens-shaped sealing member that seals a light emitting element, or an aggregate substrate in which a plurality of light emitting modules are assembled is divided into modules. It is used as a mark when doing.
  • the alignment mark is formed on the substrate surface together with the above-described power supply pattern in order to simplify the manufacturing process of the light emitting module.
  • a metal (for example, silver) layer having a high reflectance is plated on the surface so as to have a high reflectance. That is, when the alignment mark is formed at the same time as the power feeding pattern, both can be formed by a single electrolytic plating.
  • the area of the alignment mark is extremely small compared to the power feeding pattern. For this reason, if both are plated at the same time, the same amount of current flows through the alignment mark and the power feeding pattern, and the density of the current flowing through the alignment mark is higher than that of the power feeding pattern. As a result, the plating layer of the alignment mark is thicker than the plating layer of the power feeding pattern, and plating spots are generated.
  • the alignment mark when plating spots are generated on the alignment mark, there is a high possibility that the alignment mark is erroneously recognized when the pattern is recognized. If the alignment mark is misrecognized, the light emitting element may not be properly mounted, the sealing member may be displaced, and the shape of the substrate may become unstable. That is, in such a case, the quality of the light emitting module is deteriorated and the light emitting characteristics are deteriorated.
  • the light emitting module includes a power supply pattern formed on the surface of the substrate for supplying power to the light emitting element, and an alignment mark formed integrally with the power supply pattern.
  • a light emitting module includes a power supply pattern having a base layer formed on a substrate surface adjacent to a light emitting element and a surface layer laminated on the base layer, and a base layer separately from the power supply pattern. And an alignment mark formed as a part on the substrate surface.
  • FIG. 1 is an external perspective view showing an LED lamp according to an embodiment.
  • FIG. 2 is a cross-sectional view of the LED lamp of FIG. 1 cut along an axis.
  • FIG. 3 is a plan view of the light emitting module according to the first embodiment incorporated in the LED lamp of FIG. 1 as viewed from the light extraction side. 4 is a cross-sectional view of the light emitting module of FIG. 3 taken along line F4-F4.
  • FIG. 5 is a plan view showing a module substrate of the light emitting module of FIG.
  • FIG. 6 is a plan view showing a protective layer covering the module substrate of FIG. 7 is a plan view showing a state in which the protective layer of FIG. 6 is provided on the module substrate of FIG.
  • FIG. 1 is an external perspective view showing an LED lamp according to an embodiment.
  • FIG. 2 is a cross-sectional view of the LED lamp of FIG. 1 cut along an axis.
  • FIG. 3 is a plan view of the light emitting module according to the first embodiment
  • FIG. 8 is a partially enlarged view showing a modification of the alignment mark of the light emitting module of FIG.
  • FIG. 9 is a plan view of the light emitting module according to the second embodiment incorporated in the LED lamp of FIG. 1 as viewed from the light extraction side.
  • FIG. 10 is a cross-sectional view of the light emitting module of FIG. 9 taken along line F10-F10.
  • FIG. 11 is a plan view showing a module substrate of the light emitting module of FIG.
  • FIG. 12 is a plan view showing a protective layer covering the module substrate of FIG. 13 is a plan view showing a state in which the protective layer of FIG. 12 is provided on the module substrate of FIG.
  • FIG. 1 the external view of the LED lamp 100 is shown as an example of the lighting fixture incorporating the light emitting module which concerns on embodiment.
  • FIG. 2 is a sectional view of the LED lamp 100 of FIG. 1 cut along the axis.
  • the LED lamp 100 includes a main body 102, an insulating member 111, a base 115, a lighting device 121, the light emitting module 1, and a lighting cover 161.
  • the LED lamp 100 is attached, for example, in such a manner that the illumination cover 161 faces downward by screwing a base 115 into a socket (not shown) attached to the ceiling. That is, in FIGS. 1 and 2, the LED lamp 100 is illustrated in a state where the mounting state is reversed upside down.
  • the main body 102 is made of aluminum having a relatively high thermal conductivity.
  • a module fixing base 103 for attaching the light emitting module 1 is provided at the upper end of the main body 102 in the figure.
  • an annular cover mounting convex portion 104 is integrally projected from the upper end of the main body around the module fixing base 103.
  • a concave portion 105 that is recessed upward in the drawing is provided on the lower end side of the main body 102 in the drawing.
  • a through hole 106 extending in the axial direction is formed inside the main body 102. The upper end of the through hole 106 shown in the figure opens at the upper end surface of the main body 102, and the lower end of the through hole 106 shown in the figure opens at the bottom of the recess 105.
  • a groove portion 106 a formed so as to bend laterally along the back surface of the module fixing base 103 is provided continuously to the upper end of the through hole 6.
  • the main body 102 integrally has a plurality of heat radiating fins 107 on its outer periphery. As shown in FIG. 1, the plurality of radiating fins 107 are curved and extended so as to spread outward toward the upper end of the main body 102. The plurality of heat radiation fins 107 are provided to radiate heat generated from the light emitting module 1 to the outside of the LED lamp 100.
  • the insulating member 111 is formed in a bottomed cylindrical shape as shown in a cross section in FIG.
  • the insulating member 111 integrally has an annular insulating convex portion 112 that protrudes from the outer peripheral surface at an intermediate portion in the height direction.
  • the insulating member 111 is accommodated and disposed in the recess 105 so that the bottom wall 111 a contacts the bottom surface of the recess 105 and the insulating protrusion 112 is engaged with the edge of the opening of the recess 105. That is, the outer surface of the insulating member 111 is in close contact with the inner surface of the recess 105.
  • the lower portion of the insulating member 111 in the drawing protrudes from the lower end of the main body 102 in the drawing from the lower end of the drawing. In other words, only the upper portion of the insulating member 111 in the drawing from the insulating convex portion 112 is inserted into the concave portion 105 of the main body 102. Further, the bottom wall 111 a of the insulating member 111 is provided with a through hole 114 for communicating the illustrated lower end of the through hole 6 with the inside of the insulating member 111.
  • the base 115 has a structure in which a base body 117 and an eyelet terminal 118 are attached to a substantially disc-shaped base 116 formed of an insulating material.
  • the base 115 of the present embodiment is an E26 type base.
  • the base 115 is attached so as to cover the above-described lower portion of the insulating member 111 so that the base 116 closes the opening of the insulating member 111.
  • the base body 117 is formed with a spiral groove that is screwed into a power source socket (not shown).
  • the lighting device 121 is accommodated and disposed inside the insulating member 111 as shown in FIG.
  • the lighting device 121 is formed by mounting a circuit component 123 such as a transformer, a capacitor, and a transistor on a circuit board 122.
  • the lighting device 121 is electrically connected to the base 115.
  • the connecting member 124 for that purpose is illustrated in FIG.
  • the connection member 124 electrically connects the eyelet terminal 118 and the circuit board 122.
  • the lighting device 121 is electrically connected to the light emitting module 1 to be described later via an insulating coated electric wire (not shown) that passes through the through hole 6 (groove 106a).
  • the lighting device 121 supplies direct current to the light emitting module 1 via the base 115.
  • the illumination cover 161 is formed in a substantially hemispherical shape as shown in FIG.
  • the illumination cover 161 is made of a translucent synthetic resin. As shown in FIG. 2, the illumination cover 161 is fitted and attached to a cover mounting convex portion 104 protruding from the upper end in the figure of the main body 102 so as to cover the light emitting side of the light emitting module 1. That is, the light emitted from the light emitting module 1 is used as illumination light through the illumination cover 161.
  • the cover mounting convex portion 104 on the main body 102 side has L-shaped mounting grooves (not shown) at a plurality of locations along the circumferential direction.
  • a plurality of locking projections are provided at positions corresponding to the plurality of mounting grooves of the cover mounting projection 104, respectively.
  • the illumination cover 161 is attached to the main body 102 by hooking its locking projections to the respective mounting grooves of the cover mounting projections 104. As shown in FIGS. 1 and 2, a blindfold ring 162 is provided at the edge of the illumination cover 161 to conceal the mounting groove and the locking projection described above.
  • FIG. 3 shows a plan view of the light emitting module 1 viewed from the light extraction side (hereinafter referred to as the front side), and FIG. 4 shows a cross section of the light emitting module 1 taken along line F4-F4 in FIG.
  • FIG. 5 shows a plan view of the module substrate 3 of the light emitting module 1
  • FIG. 6 shows a protective layer 19 covering the surface of the module substrate 3
  • FIG. A plan view of the module substrate 3 covered with the protective layer 19 is shown.
  • the light emitting module 1 of the present embodiment includes a module substrate 3, a plurality of LED chips 11 (light emitting elements), a frame member 15, a sealing member 17, and a protective layer 19, as shown in FIGS.
  • the module substrate 3 of this embodiment has a structure in which an insulating layer 3b is laminated on the surface of a base plate 3a using aluminum having a relatively high thermal conductivity, as shown in a cross section in FIG.
  • the base plate 3a is made of aluminum or an aluminum alloy.
  • the insulating layer 3b is formed of a synthetic resin such as an epoxy resin. The insulating layer 3b is much thinner than the base plate 3a.
  • the module substrate 3 for example, a resin substrate made of at least one synthetic resin layer, a metal base substrate in which an insulating layer is laminated on a metal plate other than aluminum, a ceramic substrate, or the like can be used.
  • the substrate surface white.
  • the substrate material may be white
  • the insulating layer is a white material. May be formed.
  • the module substrate 3 has a substantially rectangular plate-like outer shape, and has a notch 4 at each of its four corners. That is, the module substrate 3 is fastened and fixed to the main body 102 by screwing screws (not shown) inserted through the four notches 4 into screw holes (not shown) of the module fixing base 103.
  • the back surface of the base plate 3a is brought into close contact with and pressed against the surface 103a of the module fixing base 103.
  • the heat of the LED chip 11 can be easily transmitted to the main body 102 via the base plate 3a, and the heat dissipation of the LED chip 11 can be enhanced.
  • a pair of power supply patterns 6, a reflective layer 8, and a pair of power supply pads 9 are provided on the surface of the insulating layer 3 b of the module substrate 3.
  • the reflective layer 8 functions to improve the light extraction capability by reflecting relatively high energy light emitted from the back side of the plurality of LED chips 11 mounted thereon in the utilization direction.
  • the reflective layer 8 is not an essential component in the present embodiment, and can be omitted.
  • the protective layer 19 has a plurality of holes that expose all of the reflective layer 8, a part of the pair of power supply patterns 6, and all of the pair of power supply pads 9, and has a shape that covers substantially the entire surface of the substrate.
  • a protective layer 19 is formed by screen printing, for example.
  • the reflective layer 8 occupies the central portion of the module substrate 3 and is provided in a square shape on the insulating layer 3 b, and the pair of power supply patterns 6 are disposed in the vicinity of the reflective layer 8, for example, 8 is disposed on both sides of the reflective layer 8 so as to sandwich the 8 from the left and right in the figure.
  • the pair of power feeding patterns 6 has a shape shown in FIG.
  • a pair of power supply pads 9 are provided on the surface of the insulating layer 3 b corresponding to the pair of power supply patterns 6.
  • the power supply pad 9 on the left side of the figure is connected to the power supply pattern 6 on the left side of the figure via a conductive member (not shown), and the power supply pad 9 on the right side of the figure is connected to a power supply pattern 6 on the right side of the figure (not shown). Connected through. Further, the two power supply pads 9 are connected to the circuit board 122 of the lighting device 121 via an insulation coated electric wire (not shown).
  • an insulation-coated electric wire (not shown) connecting the light emitting module 1 and the lighting device 121 extends from the two power supply pads 9 of the light emitting module 1, passes through the through hole 106 through the groove 106 a, and is a circuit board of the lighting device 121. 122.
  • the pair of power supply patterns 6, the reflective layer 8, and the pair of power supply pads 9 having the above shapes are patterned on the surface of the insulating layer 3 b of the module substrate 3 (hereinafter also referred to as a substrate surface).
  • All of these metal patterns 6, 8 and 9 are formed in a three-layer structure of a base layer A, an intermediate layer B, and a surface layer C.
  • the base layer A is thicker than the intermediate layer B and the surface layer C, and the intermediate layer B and the surface layer C are substantially the same thickness.
  • the base layer A is provided by removing unnecessary portions by etching after bonding Cu (copper) to the entire surface of the insulating layer 3b of the module substrate 3 and bonding them.
  • the intermediate layer B is provided by plating Ni (nickel) on the surface of the base layer A, for example, electrolytic plating.
  • the surface layer C is provided by plating Ag (silver) on the surface of the intermediate layer B, for example, electrolytic plating.
  • the surface layer C is made of Ag, the light reflectance of the power supply pattern 6, the reflective layer 8, and the power supply pad 9 is higher than the light reflectance of the surface of the insulating layer 3b.
  • the material for the surface layer C having a higher light reflectance than the insulating layer 3b include gold, nickel, and aluminum in addition to Ag.
  • the connectivity with the bonding wire described later can be improved.
  • the surface layer C can also be formed by electroless plating.
  • the plurality of LED chips 11 are arranged in a matrix on the surface of the reflective layer 8.
  • the LED chip 11 of this embodiment is a bare chip of an LED (light emitting diode).
  • a semiconductor wafer in which a nitride compound semiconductor (for example, a gallium nitride compound semiconductor) is formed on a semiconductor substrate such as sapphire is used as a dicing cutter. And cut into a substantially rectangular parallelepiped.
  • the LED chip 11 emits light by passing a forward current through a pn junction portion of the semiconductor. That is, the LED chip 11 directly converts electrical energy into light. Therefore, the LED chip 11 has an energy saving effect as compared with an incandescent bulb that incandescents the filament to a high temperature by energization and emits visible light by the thermal radiation.
  • the LED chip 11 of this embodiment is a single-sided electrode type chip having two element electrodes on its upper surface as shown in FIG. For each LED chip 11, an LED that emits blue light is used because the LED lamp 100 emits white light, for example.
  • each LED chip 11 is preferably reflected on the back surface of its semiconductor substrate by using a light-transmitting die bond material 12 such as a transparent silicone resin so that the LED chip 11 can be reflected immediately below.
  • Adhesive fixing is performed on the surface layer C of the layer 8.
  • the plurality of LED chips 11 are mounted on the surface of the reflective layer 8 so as to be aligned vertically and horizontally.
  • a plurality of LED chips 11 in each row (only one row is illustrated in FIG. 4) are connected to bonding wires 13 (13a) so as to connect a pair of power supply patterns 6 arranged on the left and right sides of the reflective layer 8 in the figure. 13b) are connected in series.
  • each chip row the element electrodes having different polarities of two LED chips 11 adjacent to each other in the extending direction of the row, that is, the element electrodes on the positive side of one LED chip 11 and the other LED chip 11
  • the element electrode on the negative electrode side is connected by a bonding wire 13 made of a fine wire made of Au.
  • the plurality of LED chips 11 included in each chip row are electrically connected in series.
  • the LED chips 11 at both ends of each row are connected to the power feeding pattern 6 via the end bonding wires 13a and 13b. Since these end bonding wires 13a and 13b are also Au fine metal wires, it is difficult for heat to be transmitted. For this reason, the heat of the LED chips 11 at both ends of each row is difficult to move (escape) to the power feeding pattern 6 through the end bonding wires 13a and 13b. Thereby, temperature distribution in each part of the reflective layer 8 can be made uniform, and the temperature difference of the some LED chip 11 mounted in the reflective layer 8 can be suppressed.
  • the LED chips 11 in each row are connected in parallel to the power feeding pattern 6 via the end bonding wires 13a and 13b, respectively. For this reason, even if any one of the LED chips 11 in the plurality of chip rows cannot emit light due to bonding failure or the like, the light emitting module 1 as a whole cannot emit light.
  • the light emitting module 1 includes a frame member 15 surrounding a sealing region for sealing the plurality of LED chips 11, and a sealing member 17 filled in a sealing region inside the frame member 15.
  • the frame member 15 is, for example, applied in a rectangular frame shape on the insulating layer 3 b in an uncured state with a synthetic resin, and is cured and fixed to the surface of the module substrate 3.
  • a white silicone resin mixed with a filler formed of an inorganic material as the synthetic resin, the reflectance of light can be increased.
  • the filler include titanium oxide and silica.
  • the frame member 15 has a size surrounding all the LED chips 11.
  • the frame member 15 surrounds the entire reflective layer 8 and a part of the power feeding pattern 6. That is, the size of the frame member 15 defines the size of the sealing region that fills the sealing member 17.
  • the frame member 15 has a size surrounding all the LED chips 11, all the bonding wires 13, and all the end bonding wires 13a and 13b.
  • the thickness of the frame member 15, that is, the protruding height of the frame member 15 from the substrate surface is set to a height at which all of these constituent elements 11, 13, 13 a and 13 b can be embedded by the sealing member 17. Yes.
  • the size of the sealing region filled with the sealing member 17 corresponds to the area inside the frame member 15 (hereinafter, this area is referred to as a sealing area).
  • the sealing member 17 is filled inside the frame member 15, and includes a pair of power supply patterns 6, a reflective layer 8, a plurality of LED chips 11, a plurality of bonding wires 13, and a plurality of end bonding wires 13 a and 13 b. Fill.
  • the sealing member 17 is made of, for example, a transparent silicone resin. Note that a predetermined amount of the sealing member 17 is injected into a sealing region inside the frame member 15 in an uncured state, and then heat-cured.
  • An appropriate amount of phosphor (not shown) is mixed in the sealing member 17.
  • the phosphor is excited by light emitted from the LED chip 11 and emits light having a color different from the color of light emitted from the LED chip 11.
  • a yellow phosphor that emits yellow light that is complementary to the blue light is used as the phosphor so that white light can be emitted.
  • the sealing member 17 in which the phosphors are mixed in this manner emits light from the phosphors, so that the entire sealing member 17 inside the frame member 15 functions as a light emitting unit of the light emitting module 1.
  • the sealing member 17 When the light emitting module 1 having the above structure is incorporated in the LED lamp 100 and energized via the lighting device 121, the plurality of LED chips 11 covered with the sealing member 17 emit blue light all at once, and the sealing member 17. The yellow phosphor mixed in is excited to emit yellow light. That is, the sealing member 17 functions as a planar light source that emits white light in which blue light and yellow light are mixed.
  • the reflective layer 8 functions as a heat spreader that diffuses the heat generated by the plurality of LED chips 11 and also functions as a reflecting mirror that reflects the light emitted from the LED chips 11 toward the module substrate 3.
  • the power feeding pattern 6 in the sealing region functions as a heat spreader and also as a reflecting mirror, like the reflecting layer 8.
  • heat from each LED chip 11 is radiated to the outside of the LED lamp 100 through the reflective layer 8, the module substrate 3, the module fixing base 103, the upper surface of the main body 102, and the heat radiation fins 107. Further, the light reflected by the reflective layer 8 and the light diffused by the sealing member 17 and reflected by the power feeding pattern 6 are passed through the illumination cover 161 together with main light directly emitted from the sealing member 17. Used as illumination light.
  • an alignment mark provided on the light emitting module 1 is detected by a CCD sensor of an inspection machine (not shown) to identify a mounting failure portion.
  • This alignment mark is also used in other processes. For this reason, in this embodiment, an alignment mark integral with the power feeding pattern 6 is provided on the surface of the module substrate 3.
  • the pair of power supply patterns 6 includes a pair of elongated electrodes disposed adjacent to each other along two opposing sides of the reflective layer 8 on which the plurality of LED chips 11 are mounted. It has a portion 6a. In other words, the two electrode portions 6 a of the pair of electrode patterns 6 are respectively provided at positions where the reflective layer 8 is sandwiched.
  • Each electrode portion 6a includes a bonding portion 6b and a plurality of protruding portions 6c along two sides of the reflective layer 8, respectively.
  • the bonding portion 6b connects the device electrodes of the chips at both ends of each chip row of the plurality of LED chips 11 via the end bonding wires 13a and 13b. For this reason, the bonding portion 6 b is elongated along the opposing sides of the reflective layer 8.
  • the plurality of protruding portions 6c are provided corresponding to the chip rows of the LED chips 11, and protrude outward from the first end 61 spaced from the reflective layer 8 of each bonding portion 6b.
  • the protruding length from the end 61 of each protruding portion 6c is designed to be narrower than the width of the bonding portion 6b.
  • the width of each protruding portion 6c is designed to be narrower than the width of the bonding portion 6b.
  • the plurality of protruding portions 6c are provided to protrude along the end side 61 at a constant pitch of, for example, about 0.5 mm.
  • the plurality of protruding portions 6c function as alignment marks.
  • the second end 62 adjacent to the reflective layer 8 of each bonding portion 6b is opposed to the straight side of the reflective layer 8 that is substantially parallel with a slight gap therebetween, and is linear.
  • the second end side 62 is not provided with a protrusion or recess corresponding to the alignment mark.
  • the alignment mark (the plurality of protruding portions 6c) protrudes from the bonding portion 6b and is formed integrally with the power feeding pattern 6, the surface layer C of the power feeding pattern 6 including the alignment mark is electrolyzed. In the case of forming by plating, plating spots do not occur, and erroneous recognition of alignment marks can be suppressed.
  • the protruding portion 6c functioning as an alignment mark is not separated from the power feeding pattern 6, the current density flowing in the electrolytic plating is made the same even though the protruding portion 6c is thinner than the bonding portion 6b. And plating spots can be prevented. Thereby, the alignment mark can be reliably detected, and the light emitting module 1 having high quality and good light emission characteristics can be manufactured.
  • the protruding portion 6c and the bonding portion 6b can be used even when a very large direct current is applied to the LED chip 11. No discharge is generated between the LED chip 11 and the LED chip 11 can be prevented from being damaged by this discharge.
  • the number of leads when plating a metal pattern including these portions 6b and 6c can be reduced. Specifically, according to the present embodiment, as shown in FIG. However, when the protruding portion 6c is separated from the bonding portion 6b and plated separately, the number of leads L is increased by two.
  • the distance between the alignment mark (the protruding portion 6c) and the edge of the module substrate 3 is compared with the case where both are separated. Can be taken longer, and creepage distance can be earned. In other words, the module substrate 3 can be reduced in size while ensuring a sufficient creepage distance, and the light emitting module 1 can be downsized.
  • the number, width, protruding length, pitch, size, shape, and the like of the plurality of protruding portions 6c can be variously changed.
  • the shape and size of the alignment mark can be arbitrarily changed.
  • FIG. 8 shows one modification of the alignment mark of the light emitting module 1 of the first embodiment described above.
  • symbol is attached
  • the alignment mark according to this modification is also provided on the first end 61 ′ spaced from the reflective layer 8 of the electrode portion 6 a ′ of the power feeding pattern 6.
  • a plurality of notches 6c ' are provided on the first end 61' instead of the plurality of protruding portions 6c.
  • the width of the electrode portion 6a ' is made larger than the width of the electrode portion 6a of the first embodiment.
  • the width W of the bonding portion 6b ′ between the bottom of the plurality of notches 6c ′ and the second end 62 that are recessed from the first end 61 ′ of the electrode portion 6a ′ is the first embodiment.
  • the width of the electrode portion 6a of the power supply pattern 6 is designed to be substantially the same as the width of the bonding portion 6b.
  • the light emitting module 20 according to the second embodiment will be described with reference to FIGS. 9 to 13.
  • components that function in the same manner as the light emitting module 1 of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.
  • FIG. 9 shows a plan view of the light emitting module 20 as viewed from the front side
  • FIG. 10 shows a cross-sectional view of the light emitting module 20 taken along line F10-F10 in FIG. 9, and
  • FIG. A plan view of the module substrate 3 of the light emitting module 20 is shown.
  • FIG. 12 shows a protective layer 19 covering the surface of the module substrate 3.
  • FIG. 13 shows a module in a state where the protective layer 19 is covered.
  • a plan view of the substrate 3 is shown.
  • the light emitting module 20 of this embodiment has two sets of alignment marks 16 and 18 that are separate from the power feeding pattern 6.
  • the pair of first alignment marks 16 are respectively disposed in the vicinity of the edges that are separated from the reflective layer 8 of the electrode portions 6 a of the pair of power supply patterns 6.
  • the pair of second alignment marks 18 are disposed further outside the first alignment marks 16.
  • each of the pair of first alignment marks 16 includes a straight portion extending substantially parallel to the electrode portion 6a and a plurality of branches provided at equal intervals along the longitudinal direction of the straight portion. And a line portion 16a. These straight portions and branch portions 16a are thinner than the electrode portion 6a.
  • the plurality of branch line portions 16 a are provided to correspond to the chip rows of the plurality of LED chips 11 mounted on the surface of the reflective layer 8 and orthogonal to the straight line portion.
  • Each of the pair of second alignment marks 18 also includes a straight line portion extending substantially parallel to the electrode portion 6a and a plurality of branch line portions 18a provided integrally with the straight line portion. These straight portions and branch line portions 18a are also thinner than the electrode portion 6a. The plurality of branch line portions 18a are also orthogonal to the straight line portions and provided corresponding to the chip rows.
  • the second alignment mark 18 has a plurality of branch line portions 18 a at equal intervals at the same pitch as the branch line portions 16 a of the first alignment mark 16.
  • the branch line portion 16a of the first alignment mark 16 and the branch line portion 18a of the second alignment mark 18 are shifted from each other by 1 ⁇ 2 pitch and are nested. For this reason, the branch line parts 16a and 18a are arrange
  • first and second alignment marks 16 and 18 are formed separately from the power feeding pattern 6, the degree of freedom in design such as the shape, size, and formation position is high. Therefore, for example, the first and second alignment marks 16 and 18 may be connected at one end thereof. However, it is desirable to form the first and second alignment marks 16 and 18 as close as possible to the reflective layer 8 in order to increase the creepage distance from the peripheral edge of the module substrate 3.
  • the first and second alignment marks 16 and 18 are formed as a part of the base layer A of the pair of power supply patterns 6, the reflective layer 8, and the pair of power supply pads 9.
  • the alignment marks 16 and 18 of this embodiment are formed together when patterning the base layer A of the metal patterns 6, 8 and 9 formed on the surface of the insulating layer 3 b of the module substrate 3. That is, unlike the other metal patterns 6, 8, 9, the first and second alignment marks 16, 18 do not have the intermediate layer B and the surface layer C.
  • a copper layer is formed on the surface of the module substrate 3, and etching is performed to form the base layer A of the power supply pattern 6, the base layer A of the reflective layer 8, the base layer A of the power supply pad 9, and the first alignment.
  • a mark 16 and a second alignment mark 18 are formed.
  • the intermediate layer B of the power supply pattern 6, the intermediate layer B of the reflective layer 8, and the intermediate layer B of the power supply pad 9 are formed by electrolytic plating.
  • the surface layer C of the power supply pattern 6, the surface layer C of the reflective layer 8, and the surface layer C of the power supply pad 9 are formed by electrolytic plating. That is, the first and second alignment marks 16, 18 do not have the intermediate layer B and the surface layer C, and are thinner than the other metal patterns 6, 8, 9.
  • the alignment marks 16 and 18 are formed only by the base layer A, it is possible to eliminate misrecognition of the alignment mark due to plating spots, and to obtain a light emitting module 20 having high quality and good light emitting characteristics. Can be manufactured. That is, according to the present embodiment, since the alignment marks 16 and 18 are not formed by plating in the first place, no plating spots are generated.
  • the two sets of alignment marks 16 and 18 are covered by a frame member 21 that defines a sealing region, as shown in FIG.
  • the frame member 21 is attached to the surface of the module substrate 3 so as to cover the two sets of alignment marks 16 and 18.
  • the alignment marks 16 and 18 may be formed in the sealing region. In this case, the alignment marks 16 and 18 are also sealed by the sealing member 17, and the occurrence of rust can be suppressed.
  • the alignment marks 16 and 18 are composed only of the copper base layer A, the reflectance of light is low, and when such alignment marks 16 and 18 are present in the sealing region, the corresponding amount is reduced. , Less light foot.
  • the frame member 21 includes a filler for whitening, the sulfur gas component in the air is more easily transmitted than the sealing member 17 that does not include the filler, and accordingly, deterioration of the alignment marks 16 and 18 is suppressed. be able to.
  • two sets of alignment marks 16 and 18 are formed on the module substrate 3.
  • the pitch of the branch line portions 16a is considered to be 0.5 mm because of the limit of etching accuracy.
  • the second alignment mark 18 is formed in addition to the first alignment mark 16 as in the second embodiment. It ’s fine.
  • the light emitting module having a relatively small number of LED chips 11 and the module substrate 3 of the light emitting module in which the number of LED chips 11 is doubled can be used as a common component. Storage and management can be facilitated, and the manufacturing cost of the light emitting module can be reduced accordingly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Un module électroluminescent selon un mode de réalisation de l'invention possède un diagramme d'alimentation formé sur une surface d'un substrat et alimentant un élément électroluminescent, et un repère d'alignement formant partie intégrante du diagramme d'alimentation.
PCT/JP2011/074341 2010-10-26 2011-10-21 Module électroluminescent et équipement d'éclairage WO2012057038A1 (fr)

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JP2012540828A JPWO2012057038A1 (ja) 2010-10-26 2011-10-21 発光モジュール、および照明器具
CN201190000701.5U CN203481265U (zh) 2010-10-26 2011-10-21 发光模块以及照明设备

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JP2014075516A (ja) * 2012-10-05 2014-04-24 Toshiba Lighting & Technology Corp 発光装置および照明装置
JP2014107327A (ja) * 2012-11-26 2014-06-09 Citizen Electronics Co Ltd Ｌｅｄ発光ユニット及びｌｅｄ発光装置
AT513747A4 (de) * 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP2014204029A (ja) * 2013-04-08 2014-10-27 立山科学工業株式会社 Ｌｅｄ実装用基板
AT514599B1 (de) * 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Verfahren zur Bestückung elektronischer Leiterplatten mit optischen Bauelementen
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CN109065526A (zh) * 2013-07-01 2018-12-21 晶元光电股份有限公司 发光二极管组件及制作方法
CN109830589B (zh) * 2019-01-29 2021-04-16 泉州三安半导体科技有限公司 一种led封装器件及其制造方法

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JP2016106441A (ja) * 2012-08-06 2016-06-16 シャープ株式会社 発光装置および発光装置の製造方法
US10224469B2 (en) 2012-08-06 2019-03-05 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing light emitting device
CN104521014A (zh) * 2012-08-06 2015-04-15 夏普株式会社 发光装置以及发光装置的制造方法
WO2014024627A1 (fr) 2012-08-06 2014-02-13 シャープ株式会社 Appareil électroluminescent et procédé de fabrication de celui-ci
JPWO2014024627A1 (ja) * 2012-08-06 2016-07-25 シャープ株式会社 発光装置および発光装置の製造方法
JP2014075516A (ja) * 2012-10-05 2014-04-24 Toshiba Lighting & Technology Corp 発光装置および照明装置
JP2014107327A (ja) * 2012-11-26 2014-06-09 Citizen Electronics Co Ltd Ｌｅｄ発光ユニット及びｌｅｄ発光装置
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AT513747A4 (de) * 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
US10991632B2 (en) 2013-02-28 2021-04-27 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Assembly process for circuit carrier and circuit carrier
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
AT513747B1 (de) * 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP2014204029A (ja) * 2013-04-08 2014-10-27 立山科学工業株式会社 Ｌｅｄ実装用基板
AT514599A4 (de) * 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Verfahren zur Bestückung elektronischer Leiterplatten mit optischen Bauelementen
AT514599B1 (de) * 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Verfahren zur Bestückung elektronischer Leiterplatten mit optischen Bauelementen
US9559267B2 (en) 2014-11-29 2017-01-31 Nichia Corporation Light-emitting device

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TW201230268A (en) 2012-07-16
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