WO2012049838A1 - Method and apparatus for breaking up device - Google Patents

Method and apparatus for breaking up device Download PDF

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Publication number
WO2012049838A1
WO2012049838A1 PCT/JP2011/005697 JP2011005697W WO2012049838A1 WO 2012049838 A1 WO2012049838 A1 WO 2012049838A1 JP 2011005697 W JP2011005697 W JP 2011005697W WO 2012049838 A1 WO2012049838 A1 WO 2012049838A1
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Prior art keywords
support plate
metal support
base member
stopper
circuit board
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PCT/JP2011/005697
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French (fr)
Japanese (ja)
Inventor
洋 岩本
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パナソニック株式会社
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Publication of WO2012049838A1 publication Critical patent/WO2012049838A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/52—Recovery of material from discharge tubes or lamps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the technology disclosed herein relates to a device disassembly method and its disassembly device.
  • PDP plasma display devices using a plasma display panel
  • a general plasma display device includes a PDP unit in which a PDP and a metal support plate with a circuit board are bonded via a heat conductive adhesive sheet, a front frame that protects the PDP, and a back cover that protects the circuit board. And so on.
  • the PDP is composed of a front plate and a back plate arranged to face each other.
  • the front plate is constituted by a display electrode, a dielectric layer, a protective layer and the like formed on a front glass substrate.
  • the back plate is composed of an address electrode, a partition, a phosphor layer and the like formed on a back glass substrate.
  • the peripheral edges of the front plate and the back plate are sealed with a sealing material, and neon gas (Ne), xenon gas (Xe), etc. are not contained in the discharge space formed between the front plate and the back plate.
  • a discharge gas obtained by mixing an active gas is enclosed.
  • the metal support plate has a function as a chassis member for attaching a circuit board for driving the PDP and a function as a heat radiating plate for radiating heat generated in the PDP.
  • the circuit board is further removed from the metal support plate.
  • a screw fitted to the metal support plate and screwed to the stopper (boss) and the circuit board is manually removed using a screwdriver. Therefore, the man-hour for separating the metal support plate and the circuit board is increased.
  • a technique disclosed herein includes a base member, a fixing member joined to a surface of the base member, and a printed wiring board fixed to the base member via the fixing member.
  • a dismantling method that identifies a joint location where a fixing member is joined from the back surface of the base member, and at the identified joint location, the base member is cut out from the back surface of the base member, and the fixing member and the printed wiring are removed from the base member. This is a method of removing the composite of the substrate.
  • the technology disclosed herein includes a base member, a fixing member joined to the surface of the base member, and a printed wiring board fixed to the base member via the fixing member.
  • the circuit board and the metal support plate can be easily separated from the metal support plate to which the circuit board is attached.
  • FIG. 1 is an exploded perspective view of a plasma display device according to an embodiment.
  • FIG. 2 is a plan view of a metal support plate fitted with a stopper according to one embodiment.
  • FIG. 3 is an explanatory diagram of a metal support plate and a circuit board fixed through a stopper in one embodiment.
  • FIG. 4 is a flowchart illustrating disassembly of the plasma display device according to one embodiment.
  • FIG. 5A is a process diagram illustrating disassembly of the plasma display device according to one embodiment.
  • FIG. 5B is a process diagram illustrating disassembly of the plasma display device in one embodiment.
  • FIG. 5C is a process diagram illustrating disassembly of the plasma display device according to one embodiment.
  • the apparatus in one embodiment is a plasma display apparatus 1.
  • the plasma display device 1 includes a PDP 10, a front frame 2 that accommodates the PDP 10, a glass front cover 4 disposed in an opening of the front frame 2, a back plate 11 of the PDP 10, and a metal support plate 5.
  • the metal support plate 5 has both a chassis member for attaching the circuit board 8 and a heat radiating plate for radiating heat generated in the PDP 10.
  • the heat conductive adhesive sheet 7 is bonded to almost the entire surface of the back plate 11 and the metal support plate 5.
  • the circuit board 8 is fixed to a stopper 6 such as a fixing pin fitted to the metal support plate 5 with screws 12 as shown in FIGS. As shown in FIG. 2, when viewed from the PDP 10 side, the fitting portion 9 of the stopper 6 appears on the metal support plate 5 to which the stopper 6 is fitted.
  • a stopper 6 such as a fixing pin fitted to the metal support plate 5 with screws 12 as shown in FIGS.
  • FIG. 2 when viewed from the PDP 10 side, the fitting portion 9 of the stopper 6 appears on the metal support plate 5 to which the stopper 6 is fitted.
  • the metal support plate 5 is one of the base members that hold the PDP 10
  • the stopper 6 is one of the fixing members fixed to the surface of the base member
  • the circuit board 8 is connected to the base member via the fixing members.
  • the apparatus includes the base member, the fixing member fixed to the surface of the base member, and the printed wiring board fixed to the base member via the fixing member.
  • the metal support plate 5 to which the circuit board 8 is attached is separated from the PDP 10 (S2).
  • a method for separating the metal support plate 5 and the PDP 10 for example, there is a method in which the heat conductive adhesive sheet 7 is heated to weaken the adhesive force, or a method in which a physical force is applied to peel from the heat conductive adhesive sheet 7. is there.
  • the separated PDP 10 is disassembled for each member and recycled.
  • This fitting position is a joint location where the stopper 6 is joined.
  • the joint location where the stopper 6 is joined is specified from the back surface of the metal support plate 5.
  • the joint location where the fixing member is joined from the back surface of the base member is specified.
  • the stopper 6 is removed from the metal support plate 5, and the metal support plate 5 and the circuit board 8 are separated (S4). Specifically, the metal support plate 5 is cut out from the back surface of the metal support plate 5 at the joint location specified by (S3). By this cutting, the composite body of the stopper 6 and the circuit board 8 is removed from the metal support plate 5. The separated metal support plate 5 and circuit board 8 are disassembled for each member and recycled.
  • the disassembling device 50 is separated from the metal support plate 5 at the fitting position, and a position detection unit 20 that detects the fitting position of the stopper 6 fitted to the metal support plate 5. It has the removal part 40 which extrudes the stopper 6 in the direction and removes the stopper 6 from the metal support plate 5.
  • the fitting portion 9 of the stopper 6 is fitted at the fitting position of the stopper 6, and the detaching portion 40 pushes out the fitting portion 9 of the stopper 6.
  • the disassembly apparatus 50 automatically controls the position detection by the position detection unit 20 and the removal operation by the removal unit 40.
  • the position detection unit 20 may be one having a generally well-known optical system.
  • the removal unit 40 includes, for example, a processing device for processing the stopper 6 into a removable shape with a punch, a punch, a drill, a laser processing device, a water jet device or the like, or a cutting device for cutting around the fitting portion 9.
  • a generally well-known one may be used.
  • the metal support plate 5 is held by the holding unit 30 with the fitting portion 9 facing upward and installed in the position detection unit 20.
  • the fitting position of the stopper 6 fitted to the metal support plate 5 is detected by the position detector 20.
  • a fitting portion 9 of the stopper 6 is exposed at the fitting position of the stopper 6.
  • the detaching part 40 is arranged at the fitting position of the stopper 6.
  • the stopper 6 In the fitting position of the stopper 6, the stopper 6 is pushed out by pressing the fitting portion 9 of the stopper 6 in the direction separated from the metal support plate 5 by the detaching portion 40, and the stopper 6 is pushed out. Remove from. Then, the circuit board 8 and the metal support plate 5 are separated.
  • the metal support plate 5 and the circuit board 8 can be easily disassembled, disassembly efficiency can be improved.
  • the plasma display device 1 is used as the device, but the present invention can also be applied to other devices.
  • the present invention can be applied to a display device using a liquid crystal panel and a display device using organic electroluminescence.
  • the metal support plate with the circuit board can be easily separated into the circuit board and the metal support plate, which is useful for disassembling the apparatus.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

The present invention provides a method and apparatus for breaking up a device that comprises a base member, a fixation member which is bonded to the surface of the base member, and a printed wiring board which is affixed to the base member via the fixation member. The bonding position, at which the fixation member is bonded, is specified from the back surface of the base member. The base member is hollowed out from the back surface thereof at the specified bonding position, and the composite of the fixation member and the printed wiring board is removed from the base member.

Description

装置の解体方法およびその解体装置Device disassembly method and disassembly device
　ここに開示された技術は、装置の解体方法およびその解体装置に関する。 The technology disclosed herein relates to a device disassembly method and its disassembly device.
　近年、薄型・大型化に適した表示装置としてプラズマディスプレイパネル（以下、ＰＤＰという）を用いたプラズマディスプレイ装置が注目され大量に生産されている。 In recent years, plasma display devices using a plasma display panel (hereinafter referred to as PDP) are attracting attention and are being mass-produced as display devices suitable for thinning and upsizing.
　一般的なプラズマディスプレイ装置は、ＰＤＰと回路基板付きの金属支持板とが熱伝導性接着シートを介して接着されているＰＤＰユニットと、ＰＤＰを保護する前面枠と、回路基板を保護するバックカバーなどとから構成されている。 A general plasma display device includes a PDP unit in which a PDP and a metal support plate with a circuit board are bonded via a heat conductive adhesive sheet, a front frame that protects the PDP, and a back cover that protects the circuit board. And so on.
　ＰＤＰは互いに対向配置された前面板と背面板とから構成されている。前面板は、表示電極・誘電体層・保護層などを前面ガラス基板上に形成したものから構成されている。一方、背面板はアドレス電極・隔壁・蛍光体層などを背面ガラス基板上に形成したものから構成されている。そして、前面板と背面板の周端部は封着材によって封着され、前面板と背面板との間に形成された放電空間内にはネオンガス（Ｎｅ）およびキセノンガス（Ｘｅ）などの不活性ガスを混合してなる放電ガスが封入されている。金属支持板は、ＰＤＰを駆動させる回路基板を取り付けるためのシャーシ部材としての機能と、ＰＤＰで発生した熱を放熱させる放熱板としての機能を兼ね備えたものである。 The PDP is composed of a front plate and a back plate arranged to face each other. The front plate is constituted by a display electrode, a dielectric layer, a protective layer and the like formed on a front glass substrate. On the other hand, the back plate is composed of an address electrode, a partition, a phosphor layer and the like formed on a back glass substrate. The peripheral edges of the front plate and the back plate are sealed with a sealing material, and neon gas (Ne), xenon gas (Xe), etc. are not contained in the discharge space formed between the front plate and the back plate. A discharge gas obtained by mixing an active gas is enclosed. The metal support plate has a function as a chassis member for attaching a circuit board for driving the PDP and a function as a heat radiating plate for radiating heat generated in the PDP.
　ところで、プラズマディスプレイ装置の普及に伴って、使用済みの廃棄プラズマディスプレイ装置の台数が飛躍的に増加している。また、プラズマディスプレイ装置の生産量の増大に伴って、製造工程におけるＰＤＰユニットの不良品の絶対数も多くなっている。そこで、環境問題および省資源の観点から、使用済みの廃棄プラズマディスプレイ装置や製造工程で発生した不良品のＰＤＰユニットを解体して、部材の再利用や原材料として再生する技術に対する社会的なニーズが高まってきている。 By the way, with the spread of plasma display devices, the number of used waste plasma display devices has increased dramatically. Further, as the production amount of plasma display devices increases, the absolute number of defective PDP units in the manufacturing process also increases. Therefore, from the viewpoint of environmental problems and resource saving, there is a social need for technologies for dismantling used waste plasma display devices and defective PDP units generated in the manufacturing process and reusing them and recycling them as raw materials. It is increasing.
　プラズマディスプレイ装置を再利用できる形態に解体するためには、ＰＤＰと金属支持板と回路基板とを破損させずに分離することが必要である。そこで、従来からＰＤＰユニットを分離する方法がいろいろ提案されている。例えば、ＰＤＰユニットを加熱して熱伝導性接着シートの接着力を低下させてＰＤＰと金属支持板とを熱伝導性接着シートから分離する分離方法や、ＰＤＰと金属支持板とを機械的な手段で熱伝導性接着シートから剥がして分離する分離方法などが提案されている（例えば、特許文献１、２参照）。 In order to disassemble the plasma display device into a reusable form, it is necessary to separate the PDP, the metal support plate, and the circuit board without damaging them. Therefore, various methods for separating the PDP unit have been proposed. For example, a separation method for separating the PDP and the metal support plate from the heat conductive adhesive sheet by heating the PDP unit to reduce the adhesive force of the heat conductive adhesive sheet, or mechanical means for separating the PDP and the metal support plate And a separation method for separating and separating from the thermally conductive adhesive sheet is proposed (for example, see Patent Documents 1 and 2).
　しかしながら、従来のＰＤＰユニットの解体方法は、熱伝導性接着シートを加熱してＰＤＰと金属支持板とを熱伝導性接着シートから分離した後、さらに、回路基板を金属支持板から取り外している。回路基板を金属支持板から取り外す際は、金属支持板に嵌合され止め具（ボス）と回路基板とがビス止めされているビスを、ドライバーを用いて手作業によって外していた。したがって、金属支持板と回路基板とを分離する工数が増える。 However, in the conventional method for disassembling the PDP unit, after the heat conductive adhesive sheet is heated to separate the PDP and the metal support plate from the heat conductive adhesive sheet, the circuit board is further removed from the metal support plate. When removing the circuit board from the metal support plate, a screw fitted to the metal support plate and screwed to the stopper (boss) and the circuit board is manually removed using a screwdriver. Therefore, the man-hour for separating the metal support plate and the circuit board is increased.
　そこで、金属支持板と回路基板との分離については自動化して工数を減らすことも考えられるが、回路基板の上方からビスの位置を自動的に検出することは難しい。回路基板には背丈の高い部品や複雑な形状の部品や配線ケーブルなどが実装されているため、それらの部品に起因した陰が生じて検出精度を低下させるからである。 Therefore, it may be possible to reduce the man-hour by automating the separation of the metal support plate and the circuit board, but it is difficult to automatically detect the position of the screw from above the circuit board. This is because a tall component, a component having a complicated shape, a wiring cable, and the like are mounted on the circuit board, so that shadows caused by these components are generated and the detection accuracy is lowered.
特開２００２－５０２９４号公報Japanese Patent Laid-Open No. 2002-50294 特開２００３－１１２１５５号公報JP 2003-112155 A
　上記目的を達成するためにここに開示された技術は、ベース部材と、ベース部材の表面に接合された固定部材と、固定部材を介してベース部材に固定されたプリント配線基板とを備える装置の解体方法であって、ベース部材の裏面から固定部材が接合されている接合箇所を特定し、特定された接合箇所において、ベース部材の裏面からベース部材をくり抜き、ベース部材から、固定部材およびプリント配線基板の複合体を取り外す方法である。 In order to achieve the above object, a technique disclosed herein includes a base member, a fixing member joined to a surface of the base member, and a printed wiring board fixed to the base member via the fixing member. A dismantling method that identifies a joint location where a fixing member is joined from the back surface of the base member, and at the identified joint location, the base member is cut out from the back surface of the base member, and the fixing member and the printed wiring are removed from the base member. This is a method of removing the composite of the substrate.
　また、上記目的を達成するためにここに開示された技術は、ベース部材と、ベース部材の表面に接合された固定部材と、固定部材を介してベース部材に固定されたプリント配線基板とを備える装置を解体する解体装置であって、ベース部材の裏面から固定部材が接合されている接合箇所を特定し、特定された接合箇所において、ベース部材の裏面からベース部材をくり抜き、ベース部材から、固定部材およびプリント配線基板の複合体を取り外す構成である。 In order to achieve the above object, the technology disclosed herein includes a base member, a fixing member joined to the surface of the base member, and a printed wiring board fixed to the base member via the fixing member. A dismantling device for disassembling a device, where a joint location where a fixing member is joined is identified from the back surface of the base member, and the base member is cut out from the back surface of the base member at the identified joint location and fixed from the base member. It is the structure which removes the composite_body | complex of a member and a printed wiring board.
　ここに開示された技術によれば、回路基板が取り付けられている金属支持板から回路基板と金属支持板とを容易に分離することができる。 According to the technology disclosed herein, the circuit board and the metal support plate can be easily separated from the metal support plate to which the circuit board is attached.
図１は、一実施の形態におけるプラズマディスプレイ装置の分解斜視図である。FIG. 1 is an exploded perspective view of a plasma display device according to an embodiment. 図２は、一実施の形態における止め具が嵌合された金属支持板の平面図である。FIG. 2 is a plan view of a metal support plate fitted with a stopper according to one embodiment. 図３は、一実施の形態における止め具を介して固定された金属支持板と回路基板の説明図である。FIG. 3 is an explanatory diagram of a metal support plate and a circuit board fixed through a stopper in one embodiment. 図４は、一実施の形態におけるプラズマディスプレイ装置の解体を説明するフローチャートである。FIG. 4 is a flowchart illustrating disassembly of the plasma display device according to one embodiment. 図５Ａは、一実施の形態におけるプラズマディスプレイ装置の解体を説明する工程図である。FIG. 5A is a process diagram illustrating disassembly of the plasma display device according to one embodiment. 図５Ｂは、一実施の形態におけるプラズマディスプレイ装置の解体を説明する工程図である。FIG. 5B is a process diagram illustrating disassembly of the plasma display device in one embodiment. 図５Ｃは、一実施の形態におけるプラズマディスプレイ装置の解体を説明する工程図である。FIG. 5C is a process diagram illustrating disassembly of the plasma display device according to one embodiment.
　以下、一実施の形態について図面を参照しながら説明する。 Hereinafter, an embodiment will be described with reference to the drawings.
　図１において、一実施の形態における装置はプラズマディスプレイ装置１である。このプラズマディスプレイ装置１は、ＰＤＰ１０と、ＰＤＰ１０を収納する前面枠２と、前面枠２の開口部に配置されたガラス製の前面カバー４と、ＰＤＰ１０の背面板１１と金属支持板５とを接着するための熱伝導性接着シート７と、金属支持板５の表面に嵌合された止め具６にネジなどで固定された回路基板８と、回路基板８を保護するためのバックカバー３などを含む。 In FIG. 1, the apparatus in one embodiment is a plasma display apparatus 1. The plasma display device 1 includes a PDP 10, a front frame 2 that accommodates the PDP 10, a glass front cover 4 disposed in an opening of the front frame 2, a back plate 11 of the PDP 10, and a metal support plate 5. A heat conductive adhesive sheet 7 for fixing, a circuit board 8 fixed to a stopper 6 fitted to the surface of the metal support plate 5 with screws, a back cover 3 for protecting the circuit board 8, and the like. Including.
　金属支持板５は、回路基板８を取り付けるためのシャーシ部材と、ＰＤＰ１０で発生した熱を放熱させる放熱板とを兼ね備えている。熱伝導性接着シート７は背面板１１および金属支持板５のほぼ全面に接着されている。 The metal support plate 5 has both a chassis member for attaching the circuit board 8 and a heat radiating plate for radiating heat generated in the PDP 10. The heat conductive adhesive sheet 7 is bonded to almost the entire surface of the back plate 11 and the metal support plate 5.
　回路基板８は、図２、図３に示すように、金属支持板５に嵌合された固定ピンなどの止め具６にビス１２で固定されている。図２に示すように、ＰＤＰ１０側から見た場合に、止め具６が嵌合された金属支持板５には、止め具６の嵌合部９が表出する。 The circuit board 8 is fixed to a stopper 6 such as a fixing pin fitted to the metal support plate 5 with screws 12 as shown in FIGS. As shown in FIG. 2, when viewed from the PDP 10 side, the fitting portion 9 of the stopper 6 appears on the metal support plate 5 to which the stopper 6 is fitted.
　なお、金属支持板５はＰＤＰ１０を保持するベース部材の一つであり、止め具６はベース部材の表面に固定された固定部材の一つであり、回路基板８は固定部材を介してベース部材に固定されたプリント配線基板の一つである。 The metal support plate 5 is one of the base members that hold the PDP 10, the stopper 6 is one of the fixing members fixed to the surface of the base member, and the circuit board 8 is connected to the base member via the fixing members. One of the printed wiring boards fixed to the board.
　このように、一実施の形態における装置は、ベース部材と、このベース部材の表面に固定された固定部材と、この固定部材を介してベース部材に固定されたプリント配線基板とを備える。 As described above, the apparatus according to the embodiment includes the base member, the fixing member fixed to the surface of the base member, and the printed wiring board fixed to the base member via the fixing member.
　つぎに、上述したプラズマディスプレイ装置１の解体方法について説明する。 Next, a method for disassembling the above-described plasma display device 1 will be described.
　図４において、まず、プラズマディスプレイ装置１から前面枠２およびバックカバー３を分離する（Ｓ１）。 In FIG. 4, first, the front frame 2 and the back cover 3 are separated from the plasma display device 1 (S1).
　つぎに、回路基板８が取り付けられた金属支持板５とＰＤＰ１０とを分離する（Ｓ２）。金属支持板５とＰＤＰ１０とを分離する方法としては、例えば熱伝導性接着シート７を加熱して接着力を弱化させる方法、あるいは物理的な力を与えて熱伝導性接着シート７から剥す方法がある。分離されたＰＤＰ１０は部材ごとに解体されて再資源化される。 Next, the metal support plate 5 to which the circuit board 8 is attached is separated from the PDP 10 (S2). As a method for separating the metal support plate 5 and the PDP 10, for example, there is a method in which the heat conductive adhesive sheet 7 is heated to weaken the adhesive force, or a method in which a physical force is applied to peel from the heat conductive adhesive sheet 7. is there. The separated PDP 10 is disassembled for each member and recycled.
　つぎに、離された金属支持板５の嵌合部９の嵌合位置を検出する（Ｓ３）。この嵌合位置は、止め具６が接合されている接合箇所のことである。この嵌合位置の検出によって、止め具６を接合している接合箇所が金属支持板５の裏面から特定される。このように、（Ｓ３）において、ベース部材の裏面から固定部材が接合されている接合箇所を特定する。 Next, the fitting position of the fitting portion 9 of the separated metal support plate 5 is detected (S3). This fitting position is a joint location where the stopper 6 is joined. By detecting the fitting position, the joint location where the stopper 6 is joined is specified from the back surface of the metal support plate 5. Thus, in (S3), the joint location where the fixing member is joined from the back surface of the base member is specified.
　つぎに、止め具６を金属支持板５から取り外し、金属支持板５と回路基板８とを分離する（Ｓ４）。具体的には、（Ｓ３）によって特定された接合箇所において、金属支持板５の裏面から金属支持板５をくり抜く。このくり抜きによって、金属支持板５から、止め具６および回路基板８の複合体を取り外される。分離された金属支持板５および回路基板８は部材ごとに解体されて再資源化される。 Next, the stopper 6 is removed from the metal support plate 5, and the metal support plate 5 and the circuit board 8 are separated (S4). Specifically, the metal support plate 5 is cut out from the back surface of the metal support plate 5 at the joint location specified by (S3). By this cutting, the composite body of the stopper 6 and the circuit board 8 is removed from the metal support plate 5. The separated metal support plate 5 and circuit board 8 are disassembled for each member and recycled.
　つぎに、（Ｓ３）および（Ｓ４）で用いる回路基板８付きの金属支持板５を解体する解体装置５０および解体方法について詳細に説明する。 Next, the disassembling apparatus 50 and the disassembling method for disassembling the metal support plate 5 with the circuit board 8 used in (S3) and (S4) will be described in detail.
　図５Ａ～図５Ｂにおいて、解体装置５０は、金属支持板５に嵌合された止め具６の嵌合位置を検出する位置検出部２０と、この嵌合位置において金属支持板５から分離される方向に止め具６を押し出して、止め具６を金属支持板５から取り外す取り外し部４０を有する。止め具６の嵌合位置には、止め具６の嵌合部９が嵌合されており、取り外し部４０は止め具６の嵌合部９を押し出すものである。位置検出部２０による位置検出や取り外し部４０による取り外し動作は、解体装置５０が自動的に制御している。 5A to 5B, the disassembling device 50 is separated from the metal support plate 5 at the fitting position, and a position detection unit 20 that detects the fitting position of the stopper 6 fitted to the metal support plate 5. It has the removal part 40 which extrudes the stopper 6 in the direction and removes the stopper 6 from the metal support plate 5. The fitting portion 9 of the stopper 6 is fitted at the fitting position of the stopper 6, and the detaching portion 40 pushes out the fitting portion 9 of the stopper 6. The disassembly apparatus 50 automatically controls the position detection by the position detection unit 20 and the removal operation by the removal unit 40.
　位置検出部２０には、一般によく知られている光学系を有するものを用いればよい。取り外し部４０には、例えばポンチ・穴あけポンチ・穴あけドリル・レーザー加工装置・ウォータージェット装置などで止め具６を取り外し可能な形状に加工する加工装置あるいは嵌合部９の周囲を切断する切断加工装置など、一般によく知られているものを用いればよい。 The position detection unit 20 may be one having a generally well-known optical system. The removal unit 40 includes, for example, a processing device for processing the stopper 6 into a removable shape with a punch, a punch, a drill, a laser processing device, a water jet device or the like, or a cutting device for cutting around the fitting portion 9. A generally well-known one may be used.
　回路基板８付きの金属支持板５を解体するには、まず、嵌合部９を上にして金属支持板５を保持部３０で保持して位置検出部２０に設置する。 In order to disassemble the metal support plate 5 with the circuit board 8, first, the metal support plate 5 is held by the holding unit 30 with the fitting portion 9 facing upward and installed in the position detection unit 20.
　つぎに、位置検出部２０によって、金属支持板５に嵌合された止め具６の嵌合位置を検出させる。この止め具６の嵌合位置には止め具６の嵌合部９が表出している。そして、止め具６の嵌合位置を記憶部（図示せず）に記憶させた後、取り外し部４０を止め具６の嵌合位置に配置する。 Next, the fitting position of the stopper 6 fitted to the metal support plate 5 is detected by the position detector 20. A fitting portion 9 of the stopper 6 is exposed at the fitting position of the stopper 6. Then, after the fitting position of the stopper 6 is stored in a storage unit (not shown), the detaching part 40 is arranged at the fitting position of the stopper 6.
　止め具６の嵌合位置において、取り外し部４０によって金属支持板５から分離される方向に止め具６の嵌合部９を押圧させて止め具６を押し出させ、止め具６を金属支持板５から取り外す。そして、回路基板８と金属支持板５とを分離する。 In the fitting position of the stopper 6, the stopper 6 is pushed out by pressing the fitting portion 9 of the stopper 6 in the direction separated from the metal support plate 5 by the detaching portion 40, and the stopper 6 is pushed out. Remove from. Then, the circuit board 8 and the metal support plate 5 are separated.
　以上のように本実施形態によれば、金属支持板５と回路基板８とを容易に解体することができるため解体の効率化を図ることが可能となる。 As described above, according to the present embodiment, since the metal support plate 5 and the circuit board 8 can be easily disassembled, disassembly efficiency can be improved.
　なお、本実施の形態では、装置としてプラズマディスプレイ装置１を挙げたが、その他の装置にも適用できる。例えば、液晶パネルを用いたディスプレイ装置や有機エレクトロルミネッセンスを用いたディスプレイ装置にも適用できる。 In the present embodiment, the plasma display device 1 is used as the device, but the present invention can also be applied to other devices. For example, the present invention can be applied to a display device using a liquid crystal panel and a display device using organic electroluminescence.
　ここに開示された技術によれば、回路基板付きの金属支持板を容易に回路基板と金属支持板とに分離することができるため、装置の解体に有用である。 According to the technique disclosed herein, the metal support plate with the circuit board can be easily separated into the circuit board and the metal support plate, which is useful for disassembling the apparatus.
　１　　プラズマディスプレイ装置
　２　　前面枠
　３　　バックカバー
　４　　前面カバー
　５　　金属支持板
　６　　止め具
　７　　熱伝導性接着シート
　８　　回路基板
　９　　嵌合部
　１０　　ＰＤＰ
　１１　　背面板
　２０　　位置検出部
　３０　　保持部 DESCRIPTION OF SYMBOLS 1 Plasma display apparatus 2 Front frame 3 Back cover 4 Front cover 5 Metal support plate 6 Stopper 7 Thermal conductive adhesive sheet 8 Circuit board 9 Fitting part 10 PDP
11 Back plate 20 Position detection unit 30 Holding unit

Claims (4)

  1. ベース部材と、前記ベース部材の表面に接合された固定部材と、前記固定部材を介して前記ベース部材に固定されたプリント配線基板とを備える装置の解体方法であって、
    前記ベース部材の裏面から前記固定部材が接合されている接合箇所を特定し、
    特定された前記接合箇所において、前記ベース部材の裏面から前記ベース部材をくり抜き、
    前記ベース部材から、前記固定部材および前記プリント配線基板の複合体を取り外す
    装置の解体方法。     A disassembly method of an apparatus comprising: a base member; a fixing member joined to a surface of the base member; and a printed wiring board fixed to the base member via the fixing member,
    Identify the joint location where the fixing member is joined from the back surface of the base member,
    In the identified joint location, the base member is cut out from the back surface of the base member,
    A method for disassembling an apparatus for removing a complex of the fixing member and the printed wiring board from the base member.
  2. 前記ベース部材はディスプレイパネルを保持する金属支持板とし、
    前記固定部材は止め具とし、
    前記プリント配線基板は回路基板とし、
    前記金属支持板と、前記金属支持板の表面に接合された止め具と、前記止め具を介して前記金属支持板に固定された前記回路基板とを備える装置の解体方法であって、
    前記ディスプレイパネルと前記金属支持板とを分離した後、
    前記金属支持板に接合された前記止め具の前記接合箇所を特定し、
    特定された前記接合箇所において、前記金属支持板の裏面から前記金属支持板をくり抜き、
    前記金属支持板から、前記止め具および前記回路基板を取り外す
    請求項１に記載の装置の解体方法。     The base member is a metal support plate that holds a display panel;
    The fixing member is a stopper,
    The printed wiring board is a circuit board,
    A method for disassembling an apparatus comprising: the metal support plate; a stopper joined to a surface of the metal support plate; and the circuit board fixed to the metal support plate via the stopper.
    After separating the display panel and the metal support plate,
    Identify the joint location of the fastener joined to the metal support plate;
    In the identified joint location, the metal support plate is cut out from the back surface of the metal support plate,
    The method for disassembling an apparatus according to claim 1, wherein the stopper and the circuit board are removed from the metal support plate.
  3. ベース部材と、前記ベース部材の表面に接合された固定部材と、前記固定部材を介して前記ベース部材に固定されたプリント配線基板とを備える装置を解体する解体装置であって、
    前記ベース部材の裏面から前記固定部材が接合されている接合箇所を特定し、
    特定された前記接合箇所において、前記ベース部材の裏面から前記ベース部材をくり抜き、
    前記ベース部材から、前記固定部材および前記プリント配線基板の複合体を取り外す
    解体装置。     A dismantling device for disassembling a device comprising a base member, a fixing member joined to the surface of the base member, and a printed wiring board fixed to the base member via the fixing member,
    Identify the joint location where the fixing member is joined from the back surface of the base member,
    In the identified joint location, the base member is cut out from the back surface of the base member,
    A dismantling apparatus for removing a complex of the fixing member and the printed wiring board from the base member.
  4. 前記ベース部材はディスプレイパネルを保持する金属支持板とし、
    前記固定部材は止め具とし、
    前記プリント配線基板は回路基板とし、
    前記金属支持板と、前記金属支持板の表面に接合された止め具と、前記止め具を介して前記金属支持板に固定された前記回路基板とを備えるディスプレイ装置の解体装置であって、
    前記ディスプレイパネルと前記金属支持板とを分離した後、
    前記金属支持板に接合された前記止め具の前記接合箇所を特定し、
    特定された前記接合箇所において、前記金属支持板の裏面から前記金属支持板をくり抜き、
    前記金属支持板から、前記止め具および前記回路基板を取り外す
    請求項３に記載の解体装置。     The base member is a metal support plate that holds a display panel;
    The fixing member is a stopper,
    The printed wiring board is a circuit board,
    A dismantling device for a display device, comprising: the metal support plate; a stopper joined to a surface of the metal support plate; and the circuit board fixed to the metal support plate via the stopper.
    After separating the display panel and the metal support plate,
    Identify the joint location of the fastener joined to the metal support plate;
    In the identified joint location, the metal support plate is cut out from the back surface of the metal support plate,
    The dismantling apparatus according to claim 3, wherein the stopper and the circuit board are removed from the metal support plate.
PCT/JP2011/005697 2010-10-13 2011-10-12 Method and apparatus for breaking up device WO2012049838A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286759A (en) * 2005-03-31 2006-10-19 Matsushita Electric Ind Co Ltd Cabinet structure for product provided with printed board and method of removing the printed board
WO2009050875A1 (en) * 2007-10-15 2009-04-23 Panasonic Corporation Method and apparatus for disassembling display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286759A (en) * 2005-03-31 2006-10-19 Matsushita Electric Ind Co Ltd Cabinet structure for product provided with printed board and method of removing the printed board
WO2009050875A1 (en) * 2007-10-15 2009-04-23 Panasonic Corporation Method and apparatus for disassembling display device

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