WO2012034812A3 - Strahlungsemittierendes bauelement - Google Patents

Strahlungsemittierendes bauelement Download PDF

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Publication number
WO2012034812A3
WO2012034812A3 PCT/EP2011/064154 EP2011064154W WO2012034812A3 WO 2012034812 A3 WO2012034812 A3 WO 2012034812A3 EP 2011064154 W EP2011064154 W EP 2011064154W WO 2012034812 A3 WO2012034812 A3 WO 2012034812A3
Authority
WO
WIPO (PCT)
Prior art keywords
emitting component
radiation emitting
radiation
component
semiconductor body
Prior art date
Application number
PCT/EP2011/064154
Other languages
English (en)
French (fr)
Other versions
WO2012034812A2 (de
Inventor
Jörg Erich SORG
Rüdiger Müller
Raimund Schwarz
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to JP2013528580A priority Critical patent/JP5689177B2/ja
Priority to CN201180044252.9A priority patent/CN103098246B/zh
Priority to DE112011103074.6T priority patent/DE112011103074B4/de
Priority to US13/823,677 priority patent/US8937330B2/en
Publication of WO2012034812A2 publication Critical patent/WO2012034812A2/de
Publication of WO2012034812A3 publication Critical patent/WO2012034812A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Es wird ein strahlungsemittierendes Bauelement mit einem Halbleiterkörper (1), der im Betrieb elektromagnetische Strahlung von einer Strahlungsaustrittsfläche (2) aussendet, angegeben. Der Halbleiterkörper ist in einem Bauelementgehäuse (5) mit einer Ausnehmung (4) angeordnet. Weiterhin umfasst das Bauelement ein optisches Element (8), das mit einer Fügeschicht (9) mechanisch stabil mit dem Bauelementgehäuse (5) verbunden ist, wobei die Fügeschicht (9) ein Elastizitätsmodul kleiner oder gleich 30 MPA aufweist.
PCT/EP2011/064154 2010-09-14 2011-08-17 Strahlungsemittierendes bauelement WO2012034812A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013528580A JP5689177B2 (ja) 2010-09-14 2011-08-17 ビーム放射デバイス
CN201180044252.9A CN103098246B (zh) 2010-09-14 2011-08-17 发射辐射的器件
DE112011103074.6T DE112011103074B4 (de) 2010-09-14 2011-08-17 Strahlungsemittierendes Bauelement
US13/823,677 US8937330B2 (en) 2010-09-14 2011-08-17 Radiation-emitting component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010045316A DE102010045316A1 (de) 2010-09-14 2010-09-14 Strahlungsemittierendes Bauelement
DE102010045316.1 2010-09-14

Publications (2)

Publication Number Publication Date
WO2012034812A2 WO2012034812A2 (de) 2012-03-22
WO2012034812A3 true WO2012034812A3 (de) 2012-06-21

Family

ID=44645667

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/064154 WO2012034812A2 (de) 2010-09-14 2011-08-17 Strahlungsemittierendes bauelement

Country Status (5)

Country Link
US (1) US8937330B2 (de)
JP (1) JP5689177B2 (de)
CN (1) CN103098246B (de)
DE (2) DE102010045316A1 (de)
WO (1) WO2012034812A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2565324C2 (ru) * 2012-06-11 2015-10-20 Александр Петрович Потемкин Оптическое согласующее устройство
DE102017102465A1 (de) 2017-02-08 2018-08-09 HELLA GmbH & Co. KGaA Optisches Linsensystem mit wenigstens zwei stoffschlüssig miteinander verbundenen Linsen
CN116107119B (zh) * 2023-04-12 2023-06-16 永林电子股份有限公司 一种显示模组用led发光器件及显示模组

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1657758A2 (de) * 2004-11-15 2006-05-17 LumiLeds Lighting U.S., LLC Leuchtdiode mit gegossener Linse und Herstellungsverfahren
US20070045646A1 (en) * 2005-09-01 2007-03-01 Low Tek B Surface mount optoelectronic component with lens
DE102006037737A1 (de) * 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optische Vorrichtung, optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
US20070205425A1 (en) * 2005-09-08 2007-09-06 Mitsunori Harada Semiconductor light-emitting device
US20080023711A1 (en) * 2006-07-31 2008-01-31 Eric Tarsa Light emitting diode package with optical element
US20080044934A1 (en) * 2006-08-21 2008-02-21 Loh Ban P Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19918370B4 (de) 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit Linse
US6723816B2 (en) 2001-11-02 2004-04-20 Bausch & Lomb Incorporated High refractive index aromatic-based siloxane difunctional macromonomers
JP2004146554A (ja) 2002-10-24 2004-05-20 Asahi Rubber:Kk 半導体光学素子部品のはんだ付け方法及び半導体光学素子部品
JP2004359756A (ja) 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2006140281A (ja) * 2004-11-11 2006-06-01 Stanley Electric Co Ltd パワーｌｅｄ及びその製造方法
JP3955065B2 (ja) * 2005-01-18 2007-08-08 シャープ株式会社 光結合器
DE102005036520A1 (de) 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
US7416906B2 (en) * 2005-05-18 2008-08-26 Asahi Rubber Inc. Soldering method for semiconductor optical device, and semiconductor optical device
DE102006020529A1 (de) 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP4483771B2 (ja) 2005-11-21 2010-06-16 パナソニック電工株式会社 発光装置およびその製造方法
US8772772B2 (en) 2006-05-18 2014-07-08 Intermolecular, Inc. System and method for increasing productivity of combinatorial screening
EP3422425B1 (de) * 2006-04-24 2022-02-23 CreeLED, Inc. Seitlich emittierende oberflächenmontierte weisse led
JP2007311445A (ja) * 2006-05-17 2007-11-29 Stanley Electric Co Ltd 半導体発光装置及びその製造方法
JP2009203475A (ja) * 2008-02-28 2009-09-10 Mitsubishi Chemicals Corp 封止樹脂及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1657758A2 (de) * 2004-11-15 2006-05-17 LumiLeds Lighting U.S., LLC Leuchtdiode mit gegossener Linse und Herstellungsverfahren
US20070045646A1 (en) * 2005-09-01 2007-03-01 Low Tek B Surface mount optoelectronic component with lens
US20070205425A1 (en) * 2005-09-08 2007-09-06 Mitsunori Harada Semiconductor light-emitting device
DE102006037737A1 (de) * 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optische Vorrichtung, optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
US20080023711A1 (en) * 2006-07-31 2008-01-31 Eric Tarsa Light emitting diode package with optical element
US20080044934A1 (en) * 2006-08-21 2008-02-21 Loh Ban P Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KUNZ J; STUDER M: "Determining the modulus of elasticity in compression via Shore-A hardness", KUNSTSTOFFE INTERNATIONAL 2006 CARL HANSER VERLAG GERMANY, vol. 96, no. 6, 2006 - 2006, pages 92 - 94, XP002662663 *

Also Published As

Publication number Publication date
JP5689177B2 (ja) 2015-03-25
US20130248908A1 (en) 2013-09-26
DE112011103074B4 (de) 2019-02-07
DE102010045316A1 (de) 2012-03-15
CN103098246A (zh) 2013-05-08
CN103098246B (zh) 2015-11-25
WO2012034812A2 (de) 2012-03-22
JP2013541202A (ja) 2013-11-07
US8937330B2 (en) 2015-01-20
DE112011103074A5 (de) 2013-06-20

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