WO2012033287A3 - Cmp pad conditioner and method for manufacturing the same - Google Patents
Cmp pad conditioner and method for manufacturing the same Download PDFInfo
- Publication number
- WO2012033287A3 WO2012033287A3 PCT/KR2011/005871 KR2011005871W WO2012033287A3 WO 2012033287 A3 WO2012033287 A3 WO 2012033287A3 KR 2011005871 W KR2011005871 W KR 2011005871W WO 2012033287 A3 WO2012033287 A3 WO 2012033287A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- protrusions
- pad conditioner
- manufacturing
- same
- cmp pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Provided is a chemical mechanical polishing (CMP) pad conditioner including: a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy, the plurality of protrusions being formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof; and a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several ㎛ are formed.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/822,275 US20130225052A1 (en) | 2010-09-10 | 2011-08-11 | "cmp pad conditioner and method for manufacturing the same" |
US14/876,605 US20160121454A1 (en) | 2010-09-10 | 2015-10-06 | Cmp pad conditioner and method for manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100088752A KR101161015B1 (en) | 2010-09-10 | 2010-09-10 | Cmp pad conditioner and its manufacturing method |
KR10-2010-0088752 | 2010-09-10 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/822,275 A-371-Of-International US20130225052A1 (en) | 2010-09-10 | 2011-08-11 | "cmp pad conditioner and method for manufacturing the same" |
US14/876,605 Division US20160121454A1 (en) | 2010-09-10 | 2015-10-06 | Cmp pad conditioner and method for manufacturing the same |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2012033287A2 WO2012033287A2 (en) | 2012-03-15 |
WO2012033287A3 true WO2012033287A3 (en) | 2012-05-03 |
WO2012033287A9 WO2012033287A9 (en) | 2012-06-28 |
Family
ID=45811034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/005871 WO2012033287A2 (en) | 2010-09-10 | 2011-08-11 | Cmp pad conditioner and method for manufacturing the same |
Country Status (3)
Country | Link |
---|---|
US (2) | US20130225052A1 (en) |
KR (1) | KR101161015B1 (en) |
WO (1) | WO2012033287A2 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9238207B2 (en) * | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
US9409280B2 (en) * | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
KR102168330B1 (en) * | 2012-05-04 | 2020-10-22 | 엔테그리스, 아이엔씨. | Cmp conditioner pads with superabrasive grit enhancement |
TWI546156B (en) * | 2013-04-08 | 2016-08-21 | Polishing pad dresser structure and its making method | |
US9604340B2 (en) * | 2013-12-13 | 2017-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Carrier head having abrasive structure on retainer ring |
CN106336813A (en) * | 2016-08-24 | 2017-01-18 | 安徽正田能源科技有限公司 | Silicon wafer scratch polishing agent and preparation method thereof |
KR102581481B1 (en) | 2016-10-18 | 2023-09-21 | 삼성전자주식회사 | Method of chemical mechanical polishing, method of manufacturing semiconductor device and apparatus of manufacturing semiconductor |
KR102608124B1 (en) * | 2017-08-04 | 2023-11-29 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Microreplicated polished surface with improved coplanarity |
US20200171619A1 (en) * | 2017-08-25 | 2020-06-04 | 3M Innovative Properties Company | Surface projection polishing pad |
KR102502899B1 (en) | 2017-12-28 | 2023-02-24 | 엔테그리스, 아이엔씨. | CMP Polishing Pad Conditioner |
US11331767B2 (en) * | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
KR102466715B1 (en) | 2020-10-13 | 2022-11-14 | 김영환 | Cmp pad conditioner and manufacturing method thereof |
CN116652825B (en) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | Diamond CMP polishing pad trimmer and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030036341A1 (en) * | 1999-10-12 | 2003-02-20 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
JP2006026769A (en) * | 2004-07-14 | 2006-02-02 | Noritake Super Abrasive:Kk | Cmp pad conditioner |
JP2006341332A (en) * | 2005-06-08 | 2006-12-21 | Allied Material Corp | Pad conditioner |
US20090090066A1 (en) * | 2007-10-09 | 2009-04-09 | Chia-Pei Chen | Grinding tool and manufacturing method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9703571D0 (en) * | 1997-02-20 | 1997-04-09 | De Beers Ind Diamond | Diamond-containing body |
JP3656475B2 (en) | 1999-09-01 | 2005-06-08 | 三菱マテリアル株式会社 | CMP conditioner |
US6821189B1 (en) * | 2000-10-13 | 2004-11-23 | 3M Innovative Properties Company | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
US20050025973A1 (en) * | 2003-07-25 | 2005-02-03 | Slutz David E. | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
KR101211138B1 (en) * | 2011-03-07 | 2012-12-11 | 이화다이아몬드공업 주식회사 | Conditioner for soft pad and method for producing the same |
KR102168330B1 (en) * | 2012-05-04 | 2020-10-22 | 엔테그리스, 아이엔씨. | Cmp conditioner pads with superabrasive grit enhancement |
-
2010
- 2010-09-10 KR KR20100088752A patent/KR101161015B1/en active IP Right Grant
-
2011
- 2011-08-11 WO PCT/KR2011/005871 patent/WO2012033287A2/en active Application Filing
- 2011-08-11 US US13/822,275 patent/US20130225052A1/en not_active Abandoned
-
2015
- 2015-10-06 US US14/876,605 patent/US20160121454A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030036341A1 (en) * | 1999-10-12 | 2003-02-20 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
JP2006026769A (en) * | 2004-07-14 | 2006-02-02 | Noritake Super Abrasive:Kk | Cmp pad conditioner |
JP2006341332A (en) * | 2005-06-08 | 2006-12-21 | Allied Material Corp | Pad conditioner |
US20090090066A1 (en) * | 2007-10-09 | 2009-04-09 | Chia-Pei Chen | Grinding tool and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
KR101161015B1 (en) | 2012-07-02 |
WO2012033287A2 (en) | 2012-03-15 |
US20160121454A1 (en) | 2016-05-05 |
WO2012033287A9 (en) | 2012-06-28 |
KR20120026709A (en) | 2012-03-20 |
US20130225052A1 (en) | 2013-08-29 |
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