WO2012018595A3 - Process for the fabrication of highly electrically- conductive polymer foams with controlled compression set suitable for use in emi shielding applications - Google Patents

Process for the fabrication of highly electrically- conductive polymer foams with controlled compression set suitable for use in emi shielding applications Download PDF

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Publication number
WO2012018595A3
WO2012018595A3 PCT/US2011/045243 US2011045243W WO2012018595A3 WO 2012018595 A3 WO2012018595 A3 WO 2012018595A3 US 2011045243 W US2011045243 W US 2011045243W WO 2012018595 A3 WO2012018595 A3 WO 2012018595A3
Authority
WO
WIPO (PCT)
Prior art keywords
fabrication
conductive polymer
compression set
core member
emi shielding
Prior art date
Application number
PCT/US2011/045243
Other languages
French (fr)
Other versions
WO2012018595A2 (en
Inventor
Shalini Kandoor
Bambore Lokeshwarappa Santhosh Kumar
Sreejith Valiavalappil
Bukkinakere Kapanipathaiya Chandrasekhar
Original Assignee
Laird Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies, Inc. filed Critical Laird Technologies, Inc.
Priority to CN201180036649.3A priority Critical patent/CN103026807B/en
Publication of WO2012018595A2 publication Critical patent/WO2012018595A2/en
Publication of WO2012018595A3 publication Critical patent/WO2012018595A3/en
Priority to US13/750,138 priority patent/US20130133942A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Abstract

Disclosed herein are example embodiments of electromagnetic interference (EMI) shields and method of making EMI shields. In an exemplary embodiment, a method generally includes coating at least part of a core member with metallic material, and coating at least part of the metallic material with a polymer to thereby inhibit separation of the metallic material from the core member. An example EMI shield generally includes a core member, a metallic coating covering at least part of the core member, and a polymeric coating covering at least part of the metallic coating to inhibit separation of the metallic coating from the core member.
PCT/US2011/045243 2010-07-26 2011-07-25 Process for the fabrication of highly electrically- conductive polymer foams with controlled compression set suitable for use in emi shielding applications WO2012018595A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201180036649.3A CN103026807B (en) 2010-07-26 2011-07-25 Be applicable to the shielding manufacture process with the high connductivity foam of polymers of controlled compressive deformation of EMI
US13/750,138 US20130133942A1 (en) 2010-07-26 2013-01-25 Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in emi shielding applications

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN2125CH2010 2010-07-26
IN2125/CHE/2010 2010-07-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/750,138 Continuation-In-Part US20130133942A1 (en) 2010-07-26 2013-01-25 Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in emi shielding applications

Publications (2)

Publication Number Publication Date
WO2012018595A2 WO2012018595A2 (en) 2012-02-09
WO2012018595A3 true WO2012018595A3 (en) 2012-05-18

Family

ID=45559982

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/045243 WO2012018595A2 (en) 2010-07-26 2011-07-25 Process for the fabrication of highly electrically- conductive polymer foams with controlled compression set suitable for use in emi shielding applications

Country Status (3)

Country Link
CN (1) CN103026807B (en)
TW (1) TW201213111A (en)
WO (1) WO2012018595A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130251977A1 (en) * 2012-03-20 2013-09-26 Joinset Co., Ltd. Conductive polymer foam elastic member
US9179537B2 (en) 2012-12-13 2015-11-03 Apple Inc. Methods for forming metallized dielectric structures
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
FR3051140B1 (en) * 2016-05-11 2018-06-08 Marie-Anne Cloarec Au Nom Et Pour Le Compte De La Societe Box Populi S.A.S. (Societe En Formation) ELECTROMAGNETIC ANTI-WAVE MULTILAYER MATERIAL, AND CONTAINING ISOLATED WITH ELECTROMAGNETIC WAVES USING THE MATERIAL
TWI823853B (en) 2017-06-13 2023-12-01 夏滉 Use of a sensitizer for preparing a medicament
CN107326347B (en) * 2017-07-04 2019-09-20 西北工业大学 Hard PMI foam integrated waveguide surface chemical plating copper method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040055770A1 (en) * 2001-03-19 2004-03-25 Babb Samuel M. EMI shield that adheres to and conforms with printed circuit board surfaces
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US20070190316A1 (en) * 2006-02-15 2007-08-16 Laminex Group Pty Limited EMI shielding laminate and method of making same
US20100140565A1 (en) * 2008-12-10 2010-06-10 Cheil Industries Inc. EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040055770A1 (en) * 2001-03-19 2004-03-25 Babb Samuel M. EMI shield that adheres to and conforms with printed circuit board surfaces
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US20070190316A1 (en) * 2006-02-15 2007-08-16 Laminex Group Pty Limited EMI shielding laminate and method of making same
US20100140565A1 (en) * 2008-12-10 2010-06-10 Cheil Industries Inc. EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same

Also Published As

Publication number Publication date
WO2012018595A2 (en) 2012-02-09
CN103026807A (en) 2013-04-03
CN103026807B (en) 2016-01-20
TW201213111A (en) 2012-04-01

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