CN103026807A - Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in EMI shielding applications - Google Patents
Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in EMI shielding applications Download PDFInfo
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- CN103026807A CN103026807A CN2011800366493A CN201180036649A CN103026807A CN 103026807 A CN103026807 A CN 103026807A CN 2011800366493 A CN2011800366493 A CN 2011800366493A CN 201180036649 A CN201180036649 A CN 201180036649A CN 103026807 A CN103026807 A CN 103026807A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
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Abstract
Disclosed herein are example embodiments of electromagnetic interference (EMI) shields and method of making EMI shields. In an exemplary embodiment, a method generally includes coating at least part of a core member with metallic material, and coating at least part of the metallic material with a polymer to thereby inhibit separation of the metallic material from the core member. An example EMI shield generally includes a core member, a metallic coating covering at least part of the core member, and a polymeric coating covering at least part of the metallic coating to inhibit separation of the metallic coating from the core member.
Description
The cross reference of related application
The application requires the priority of the Indian patent application 2125/CHE/2010 of submission on July 26th, 2010.Full content with above-mentioned application is herein incorporated by reference.
Technical field
Present invention relates in general to a kind of electromagnetic interference (EMI) shielding and correlation technique thereof.Specifically, the disclosure relates to the EMI shielding and makes the method for EMI screening arrangement, described EMI screening arrangement can comprise at least part of foam/core component that is coated with metal coating and polymer coating, wherein said polymer coating helps to suppress described metal coating and described foam/core component and is separated and good compression set values is provided in using the process of described EMI screening arrangement.
Background technology
This part provides the background information relevant with the disclosure, and described background information is prior art not necessarily.
Produce electromagnetic radiation in the electronic circuit that operates in device of electronic device.This radiation produces electromagnetic interference (EMI) or the radio frequency interference (RFI) of the operation that can disturb other electronic equipment in certain adjacent scope.In the situation that is not having fully shielding, EMI/RFI can cause the deteriorated of signal of interest or fully loss, causes that thus electronic installation lost efficacy or can not operate.The common scheme of improving the impact of EMI/RFI is to use the screening arrangement that can absorb and/or reflect the EMI energy.These screening arrangements typically are used for EMI/RFI is concentrated in its source, and the isolation miscellaneous equipment approaching with described EMI/RFI source.
When this uses, term " EMI " should be considered to generally include and refer to EMI emission and RFI launches, and term " electromagnetism " should be considered to generally include and refer to electromagnetism and radio frequency from external source and inside sources.Therefore, term shielding (when this uses) generally includes and refers to for example EMI shielding and RFI shielding, and described EMI shielding and RFI shielding are used for preventing that (or reducing at least) is with respect to the turnover of EMI and the RFI of the housing that electronic installation wherein is set.
Summary of the invention
This part provides general overview of the present disclosure, and is not that its four corner or institute are characteristic comprehensive open.
In this example embodiment that discloses the electromagnetic interference (EMI) screening arrangement and made the method for EMI screening arrangement.In the exemplary embodiment, method generally includes utilizes metal material to be coated to the small part core component, and utilizes at least part of described metal material of polymer-coated, suppresses thus described metal material and separates with described core component.Example EMI screening arrangement generally includes core component, is covered to the metal coating of the described core component of small part and is covered to the polymer coating that the described metal coating of small part is separated to suppress described metal coating and described core component.
Another illustrative embodiments provides a kind of method of making conductive foam.In this example, described method generally includes: utilize surfactant to come cleaning foam, and utilize dilute acid to come etching through the foam of cleaning.Described method also can comprise utilizes stannous chloride, palladium bichloride/palladium and silver nitrate or above-mentioned combination to process to activate through overetched foam.Described method also can comprise utilizes metal material to be coated to small part through the foam of overactivation, and utilizes at least part of described metal material of polymer-coated, suppresses thus described metal material and described foam is separated.The final conductive foam that forms can be used for the EMI shielding and uses or other application.
The other side of applicability can be apparent from the explanation that provides at this.Only for illustrative purpose, but not be intended to limit the scope of the present disclosure in the description of this summary and concrete example.
Description of drawings
Accompanying drawing described here only is used for the purpose of the selected execution mode of illustration but not example illustrates all possible enforcement, and is not to be intended to limit the scope of the present disclosure.
Fig. 1 is that example illustrates according to one or more aspects of the present disclosure, for the manufacture of the flow chart of the various steps of the illustrative methods of the electromagnetic interference (EMI) screening arrangement that comprises foam/core component, metal coating and polymer coating;
Fig. 2 is coated with metal and ethylene propylene diene rubber (ethylene propylene diene monomer(EPDM) according to one or more aspects of the present disclosure) the photo of exemplary polyurethane foam;
Fig. 3 is according to one or more aspects of the present disclosure, amplify scanning electron microscopy (SEM) microphoto of coated foam of a part of Fig. 2 of 50 times, and example illustrates the wall of the described foam that evenly is coated with metal and EPDM; And
Fig. 4 is according to one or more aspects of the present disclosure, amplifies the SEM microphoto of coated foam of a part of Fig. 2 of 100 times, and example illustrates way of example and single hole that metallic is wherein remained intact by described EPDM coating.
In whole accompanying drawings, corresponding Reference numeral represents corresponding parts.
Embodiment
It is abundant in order to carry out disclosing to those skilled in the art that example embodiment is provided, and gives full expression to scope.Setting forth a large amount of details, is in order to fully understand execution mode of the present disclosure such as concrete parts, device and method.Those of ordinary skill in the art obviously understands described detail and needn't all adopt, and described example embodiment also can multiple multi-form enforcement, and should not consist of the restriction to the scope of the present disclosure.In some example embodiment, be not described in detail known treatment, known device structure and known technology.
According to various aspects, the present inventor discloses the example embodiment of electromagnetic interference (EMI) screening arrangement, described electromagnetic interference (EMI) screening arrangement comprises for example EMI shielding gasket, the I/O liner, the profile liner, conductive foam, fabric bubble liner, other shielding device etc.The EMI screening arrangement can be widely used in application apparatus, device and electronic equipment, such as computer server, desktop computer, digital camera, inside and outside hard drive, liquid crystal display, Medical Devices, notebook, plasma display, printer, set-top box, communication housing cabinet, other electronic equipment, Other related equipment etc.The EMI screening arrangement can be used for electronics, for example help to suppress the leakage that the EMI of contact, breach, opening etc. in the structure member (for example door, wall etc.) by described electronics launches.
In some example embodiment, the EMI screening arrangement generally includes monolithic design, comprises the core component (such as the foam core member etc.) of at least part of covering metal coating and polymer coating.Described metal coating comprises one or more the metal particle layer at least part of surface that covers described core component, and provides conductivity (perhaps reducing resistivity) to described core component (and EMI screening arrangement).And described polymer coating has defined the layer of at least a portion that covers described metal coating, and help to be suppressed in the process of using described EMI screening arrangement the separating of (for example in the flexing cycle process, medium in the press cycles process) and described core component (such as the disengaging of metallic etc.).In some embodiments, described polymer coating also can cover or apply at least a portion of described core component.In use, described polymer coating helps to keep the globality (such as helping to suppress deteriorated etc.) of described metal coating, and therefore helps to keep the conductivity of described EMI screening arrangement.In alternative embodiment, described EMI screening arrangement comprises outer conductive textile layers (nylon anti-cracking cloth (NRS) fabric of nickel coating and/or copper for example, nickel plating polyester or taffeta fabric, nickel plating/copper mesh grid etc.), so that described EMI screening arrangement comprises fabric bubble liner.In this alternative embodiment, described fabric can wrap up described core component after coating step, and subsequently such as utilizing contact adhesive etc. to engage with described core component through applying.
In some example embodiment, institute's core component can be by the formation of foam such as for example porous polymeric foam (for example open celled foam, part open celled foam, closed-cell foam etc.).And described foam can comprise polyurethane foam (for example polyester form, polyether foam etc.), polyvinyl chloride foam, ethylene vinyl acetate foam, polypropylene foam, polyvinyl chloride foam, polystyrene foam, polymethacrylimide foam, polyethylene, EPDM foam, neoprene foams, rubbery foam etc.The foam core member of these example embodiment is for example based on the application of the described EMI screening arrangement that comprises described core component, can have the shape of any expectation and/or size (be 0.3 millimeter or thicker etc. such as depth of foam).In addition, described foam core member can comprise according to expectation and is incorporated in wherein the fire proofing that puts on.Illustrate, open celled foam can have typically corresponding with 30 holes of every linear inch to 80 holes of every linear inch hole.
In some example embodiment, described metal coating can comprise by suitable processing (for example via electroless plating system, utilize the dip-coating of macromolecule sticker, electric arc spraying, on-the-spot metallization etc.) be applied to the layer (such as one deck, multilayer etc.) of one or more metallics of described core component.For example, described metal coating can comprise the first layer metal particle of all surfaces of the described core component of basic covering, second layer metal particle (for example use the metallic identical with described ground floor, use the metallic different from described ground floor etc.) with all surfaces of the described first layer metal particle of basic covering.The described metallic that is used to form the layer of described metal coating can include but not limited to palladium, platinum, gold, aluminium, silver, copper, nickel, tin, alloy etc.In other example embodiment, described metal coating can cover the roughly all surfaces that is less than described core component, and perhaps described metal coating can cover the described surface of described core component fully.
In some example embodiment, described metallic can one deck or more multi-layered mode be applied to described core component (having defined described metal coating) so that described one deck or more multi-layeredly respectively have the expectation thickness (such as being coated with weight etc.) of (such as predetermined etc.).Described metal coating therefore have expectation thickness (for example less than about 1 micron, about 0.3 micron, about 0.1 micron or thicker etc.).In addition, the thickness of these metal levels can be associated with the conductivity (resistivity) of the expectation of described EMI screening arrangement (such as predetermined etc.) (such as the z axle resistivity of every square of about surface resistivity of 1 ohm (such as along the X-Y axle etc.) and/or about 1 ohm-cm (perhaps less)).Like this, can control/adjust the thickness of described metal coating (and the described metal level that forms described metal coating), control thus/adjust the conductivity of described EMI screening arrangement.For example, the EMI screening arrangement can be produced the metal coating of metal level with desired amt, and thickness that have expectation that form by the expectation metal, so that final EMI screening arrangement shows the expectation conductivity of (and substantially predetermined).
In some example embodiment, described polymer coating can be formed by ethylene-propylene copolymer, such as such as ethylene propylene monomer (EPM), ethylene propylene diene rubber (EPDM), above-mentioned combination etc.In in these example embodiment some, described polymer coating can cover roughly whole described metal coatings.In in these example embodiment other, described polymer coating can cover and be less than roughly whole described metal coatings, and perhaps described polymer coating can cover described metal coating fully.In some embodiments, described polymer coating also can directly cover, applies or contact the described core component of at least a portion.In various illustrative embodiments, described polymer coating can comprise a kind of or more kinds of in EPM, EPDM, urethanes, vinyl, acrylonitrile-butadiene rubber, acrylic acid and/or the siloxanes.
The example embodiment of described EMI screening arrangement of the present disclosure can represent good conductivity (and resistivity).For example, some example embodiment of described EMI screening arrangement can show approximately 0.1 ohm every square surface resistivity (such as along X-Y axle etc.) or lower, and/or about 0.03 ohm-cm or lower z axle resistivity.The example embodiment of described EMI screening arrangement also can provide the shield effectiveness of height, for example greater than about 50 decibels (from about 100 KHz to about 5 gigahertzs).The example embodiment of described EMI screening arrangement can further show low compression deformation, such as about 20 percent or lower (such as about ten Percent or lower etc.).In addition, the example embodiment of described EMI screening arrangement can have at least to about 85 degrees centigrade operating temperature.Therefore, the example embodiment of described EMI screening arrangement can provide EMI to shield necessary effective conductivity in single parts product, and low-down closing force.
In addition, illustrative embodiments also provides the method for making conductive foam.In a this illustrative embodiments, method generally includes utilizes the surfactant cleaning foam, and utilizes dilute acid to carrying out etching through cleaning foam.Described method comprises that also the processing by utilizing stannous chloride, palladium oxide/acid chloride and silver nitrate or above-mentioned combination activates through etched foam.Described method can further comprise utilizes metal material to be coated to small part through the foam of overactivation, and utilizes at least part of described metal material of polymer-coated, suppresses thus described metal material and separates with described foam.The conductive foam that forms can be used for the EMI shielding and uses.But also can be used for other application (other conductive foam disclosed herein also is like this) except the EMI shielding according to the described conductive foam of the method manufacturing.
Referring now to accompanying drawing example embodiment is described in more detail.
Fig. 1 example illustrates the exemplary method 100 for the manufacture of the EMI screening arrangement that comprises one or more aspects of the present disclosure.In this example embodiment, the described EMI screening arrangement that forms according to method 100 generally includes the foam core member.Therefore, method 100 shown in the example generally includes for the preparation of the various pretreatment operation on the surface of described foam (such as operation 102,104,106 etc.), in order to accept the metal coating (suppress simultaneously described metal coating is follow-up to be peeled off from described foam) of copper and mickel particle.Described method comprises subsequently for the lip-deep operation that described metal coating is applied to described foam core member (such as operation 108 etc.) (so that described foam can conduct electricity), and be used for ethylene-propylene copolymer (such as ethylene propylene monomer (EPM), ethylene propylene diene rubber (EPDM) etc.) coating is applied to operation on the described metal coating (such as operation 110 etc.) (to be suppressed at the process of using described EMI screening arrangement, described copper and mickel particle separates with described foam core member).The described coating of EPM/EPDM also is convenient to improve the compressive deformation of described foam through applying.
As shown in Figure 1, illustrated method 100 is included in the preparation on the described surface that utilizes described metal coating and described ethylene-propylene copolymer coating to cover described foam core member, to described foam core member regulate (such as the cleaning etc.) operation 102.Described Adjustment operation 102 generally includes and utilizes cleaning solution to clean described foam core member, and utilizes subsequently the water flushing through the foam core member of cleaning.Described cleaning solution is set to remove pollutant (such as dirt, fragment, grease etc.) from described foam core member, but also can be used for charge transfer to described foam core member (such as negative electrical charge etc.), this is convenient to the acceptance at the metallic of the lip-deep described metal coating of described foam core member.Described flushing water is configured to remove residual cleaning solution from described foam core member after using described cleaning solution.Part as Adjustment operation 102, cleaning is also washed described foam core member and can be comprised via any suitable processing described foam core member is applied cleaning solution and/or flushing water, described suitable processing comprises such as Continuous Flow, injection, shower (described core component is immersed in a large amount of cleaning solutions), above-mentioned combination etc., so that the roughly all surfaces of described foam core member (such as the outer surface that exposes etc.) the described cleaning solution of contact and/or flushing water.
As example, the cleaning solution that is applicable to use in Adjustment operation 102 can comprise aqueous tenside solution.Described surfactant can comprise any suitable surfactant, such as anion surfactant, cationic surfactant, nonionic surface active agent, above-mentioned combination etc.And described surfactant can be present in the described cleaning solution, and concentration is between such as about 0.1 percent by volume and about 8 percents by volume etc.Described cleaning solution can be applied to the long time of described core component expection (such as between about 3 minutes and about 30 minutes etc.) in that the temperature between such as about 15 degrees centigrade and 85 degrees centigrade etc. is lower.
In the scope of the present disclosure, be used for to comprise such as deionized water, distilled water, running water etc. from the flushing water of the residual cleaning solution of described foam core member removal.Be applied under the temperature that described flushing water can be between such as about 10 degrees centigrade and about 50 degrees centigrade etc. through long time of the foam core member expection of cleaning (between such as about 1 minute and about 30 minutes etc.).
Illustrated method 100 also comprises the operation 104 that utilizes acid solution to come the described foam core member of etching, so that the rough surface of described foam core member (such as cut etc.), and be convenient on the described surface of described foam core member generally flatly deposit and adhesiving metal layer.Described acid solution can be included in any suitable acid solution in the scope of the present disclosure, comprises for example hydrochloric acid (HCI) solution, sulfuric acid (H
2SO
4) solution, and composition etc.Can use the described acid solution of any debita spissitudo, comprise such as having the acid solution of about 2 percents by volume to the concentration that waits between about 35 percents by volume.Be applied to the long time of described foam core member expection (such as between about 2 minutes to about 60 minutes etc.) under the temperature that described acid solution can wait between such as about 10 degrees centigrade to about 60 degrees centigrade.In addition, described acid solution can be applied to described foam core member via any suitable processing, such as Continuous Flow, injection, shower, and above-mentioned combination etc., so that the roughly all surfaces of described foam core member contacts with described acid solution.Utilize as required subsequently water to wash described foam core member, remove residual acid solution with auxiliary described foam core member after process etching operation 104.
In other example embodiment, method can comprise the operation that utilizes alkaline solution to come the etching core component, described alkaline solution such as NaOH (NaOH) solution, potassium hydroxide (KOH) solution, and above-mentioned combination etc., the concentration that has between about 0.25 percent by volume and about 40 percents by volume etc.In these example embodiment, alkaline solution can be applied to the long time of described core component expection (such as between about 1 minute to about 60 minutes etc.) under the temperature between about 10 degrees centigrade and about 100 degrees centigrade.
Illustrated method 100 also can comprise neutralization operation, and described neutralization operation comprises neutralization solution is applied to described foam core member through etching operation 104.Described neutralization solution helps neutralization to remain in through any acid solution (perhaps alkaline solution) on the described foam core member of etching operation 104.Can use any suitable neutralization solution in the scope of the present disclosure, when using the acid etching operation, described neutralization solution comprises that (perhaps alternatively when using the alkali etching operation, described neutralization solution comprises hydrochloric acid (HCl) solution, sulfuric acid solution (H to such as NaOH (NaOH) solution, potassium hydroxide (KOH) solution and above-mentioned combination etc.
2SO
4) etc.).And can use the neutralization solution of any debita spissitudo, for example have about 2 percents by volume to the neutralization solution of acid (alkali) concentration between about 28 percents by volume.In addition, under the temperature that described neutralization solution can be between such as about 10 degrees centigrade and about 60 degrees centigrade etc., via so that any suitable processing of the roughly all surfaces of described foam core member and the contacted mode of described neutralization solution (such as Continuous Flow, injection, shower, and above-mentioned combination etc.), be applied to the long time of described foam core member expection (such as between about 1 minute and about 30 minutes etc.).Can utilize water to wash described foam core member as required subsequently, to help removing any residual neutralization solution from the described foam core member through described neutralization operation.
Continuation is with reference to Fig. 1, and illustrated method 100 also comprises the operation 106 of the described foam core member of activation to receive described metal coating.This operation 106 comprises to described foam core member and applies sensitized solution and activated solution (separately or associating).Described sensitized solution is for the preparation of the described foam core member that contacts with activated solution.For example described sensitized solution can comprise the material that engages and help subsequently the follow-up adhesion of described activated solution with described foam core member.Described activated solution is set up catalytic site (such as via operation of described sensitized solution etc.) at described foam core member subsequently, and this helps the metallic of described metal coating is remained on the described foam core member.
The example sensitized solution that is used for activation act 106 can comprise the solution of salt, solvent and water.Described salt (engaging with described core component) can comprise for example stannous chloride (SnCl
2), butter of tin (SnCl
4), and above-mentioned combination etc.And described solvent can comprise such as such as the acid of the alcohol of ethanol, all example hydrochloric acids (HCl), and above-mentioned combination etc.Described salt in the described sensitized solution be for example about 8 the gram/litre to 250 the gram/litre between volumetric concentration; And the described solvent in the described sensitized solution is the concentration of about 30 percents by volume of about 2 percent by volume values for example.Be applied to the long time of described foam core member expection (between such as about 3 minutes to about 45 minutes etc.) under the temperature that described sensitized solution can wait between such as about 10 degrees centigrade to about 45 degrees centigrade.In addition, described sensitized solution can be via so that the contacted any suitable processing of the roughly all surfaces of described foam core member and described sensitized solution and be applied to described foam core member, and described processing comprises such as Continuous Flow, injection, shower, and above-mentioned combination etc.
The example activated solution that is applicable to described activation act 106 can comprise the solution of metal, solvent and water (wherein dissolving metal is in described solvent).Described metal can comprise any suitable metal (such as gold, silver, palladium, platinum, and above-mentioned combination etc.) or metallic compound (chlorauride (AuCl for example
2), silver nitrate (AgNO
3), palladium chloride (PdCl
2), platinous chloride (PtCl
2), and above-mentioned combination etc.).And described solvent can comprise for example such as acetic acid (CH
3COOH) acid solution, hydrochloric acid (HCL) solution, sulfuric acid (H
2SO
4) solution, and above-mentioned combination etc.Described solvent in described activated solution (and dissolving metal) can be for example concentration between about 5 percents by volume and about 70 percents by volume.Additive as ammonium hydroxide also helps to reduce silver nitrate.Described activated solution can be via any so that contacted any suitable processing of the roughly all surfaces of described foam core member and described activated solution (such as Continuous Flow, injection, shower and above-mentioned combination etc.), is applied to the long time of described foam core member expection (such as between about 1 minute to about 60 minutes etc.) under the temperature between such as about 10 degrees centigrade and about 75 degrees centigrade etc.
Described exemplary method 100 also comprises and utilizes the metal coating have at least about 0.1 micron or thicker degree to cover (such as applying via electroless plating system, the dip-coating that utilizes the macromolecule sticker, electric arc spraying, on-the-spot metallization etc.) through the operation 108 of the foam core member of overactivation.In illustrated method 100, this metallization operations 108 comprises utilizes the copper and mickel particle to be coated with the described foam core member such as (such as electroless plating system), to form metal coating.For example, metallization operations 108 comprises that the copper that utilizes ground floor is coated with described foam core member, and utilizes subsequently the nickel of the second layer to be coated with the copper of described ground floor.Part as this metallization operations 108, can be after the copper that utilizes ground floor be coated with described foam core member, and before the nickel that utilizes the second layer is coated with described foam core member, described foam core member is carried out additional activation operation (such as activation act 106 etc.).Therefore, described foam core member is through twice activation act be coated with operation (as the part of the method 100 shown in the example and metallization operations 108) for twice.After metallization operations 108, can utilize anticorrodent further to process surface through the foam core member that is coated with, to help to improve the corrosion resistance of described metal coating.In other example embodiment, the foam core member can and repeatedly be coated with operation through activation act repeatedly, with preparation and utilize multi-layer phase to cover described foam core member with (perhaps different) metallic.
Continuation is with reference to figure 1, and described exemplary method also comprises and utilizes ethylene-propylene copolymer (for example, ethylene propylene monomer (EPM), ethylene propylene diene rubber (EPDM) coating cover the operation 110 of (such as applying etc.) the described metal coating on described foam core member.In this operation, the ethylene-propylene copolymer coating has defined the layer of (and usually on described foam core member) above the described metal coating, described layer in the process of using described EMI screening arrangement (such as in the flexing cycle process, medium in the press cycles process) be used for suppressing described metal coating (such as its metallic etc.) and separate (such as peeling off etc.) with described core component.For the coating procedure of EPM/EPDM, the EPM/EPDM of 1 to 10 percentage by weight is dissolved in the solvent such as toluene, oxolane, carrene etc. of 90 to 99 percents by volume.Ethylene-propylene copolymer solution can be via so that through the roughly all surfaces of the foam core member of washing and the contacted any suitable processing of polymer solution (such as Continuous Flow, injection, shower and above-mentioned combination etc.), is applied to the time (such as between about 1 minute to about 60 minutes etc.) of the pre-fixed length of described foam core member between such as about 10 degrees centigrade to about 75 degrees centigrade under the temperature of grade.
Notice that any aforesaid operations (such as operation 102,104,106,108,110 etc.) can carry out according to the mode of batch processing mode, continuously processing mode and above-mentioned combination.In addition, each of described operation as required can be according to any suitable order and/or is carried out simultaneously.In addition, method 100 can comprise than described step still less or more operation.For example, can be under specific circumstances, removal for the preparation of the surface of described foam core member to receive one or more the operations (perhaps part operation) of described metal coating, for example, when the foam with particular type forms described core component (for example when forming the described core component of described EMI screening arrangement with the quenching foam of polymers, etc.).
Fig. 2 to Fig. 4 example illustrates the illustrative embodiments of the EMI screening arrangement of making according to exemplary method 100.Described EMI screening arrangement generally includes the core component of the metal level that is coated with copper and mickel, and the metal level of described copper and mickel further is coated with ethylene propylene diene rubber (EPDM) layer, is separated to suppress described copper and mickel layer and described core component.More particularly, Fig. 2 is the photo that is coated with the exemplary polyurethane foam of the metal level of copper and mickel and EPDM.Fig. 3 is scanning electron microscopy (SEM) microphoto that amplifies the foam through applying of 50 times of a part of Fig. 2 that illustrate, and example illustrates the wall of the described foam that evenly is coated with metal and EPDM.Fig. 4 amplifies the SEM microphoto of the foam through applying of 100 times of a part of Fig. 2 that illustrate and example metallic to be shown wherein by way of example and the single hole of the intact preservation of described EPDM coating.
Lower tabulation 1 provides, obtain typical X-Y conductivity (surface resistivity of ohm-sq), Z conductivity (the z axle resistivity of ohm-cm), compressive deformation (70 ℃ of lower percentage of 22 hours) and shield effectiveness (negative decibel) for two samples of the different-thickness (5.08 millimeters and 5.33 millimeters) that comes the EMI shielding material shown in comfortable Fig. 2 to Fig. 4.
Table 1
Example
Only by way of example and be not purpose for restriction, with provide to for the manufacture of, produce or form the description of the illustrative methods of conductive polyurethane foam.
Example 1
In the first example, the conductive polyurethane foam can form through the following steps:
A, under 25 ℃, utilize 2% aqueous tenside solution to clean described polyurethane foam;
B, under 25 ℃, utilize the 5vol%(percent by volume) hydrochloric acid carry out 2 minutes surface treatment;
C, under 25 ℃, utilize 20g/l(gram/litre) stannous chloride (SnCl
2) solution and 35vol%HCL solution, carry out 45 minutes sensitization;
D, under 25 ℃, utilize 20g/l silver nitrate (AgNO
3) ammoniacal liquor of solution and 25vol%, carry out 45 minutes activation;
E, under 30 ℃, utilize the copper sulfide of 15g/l, the formaldehyde of 39ml (37 to 41 weight/volume percent (w/v%)), the NaOH (NaOH) (pH～12 are to 13) of the sodium potassium tartrate tetrahydrate of 37g/l (sodium potassium tartrate) and 11g/l carries out the electroless plating system of 30 minutes copper;
F, 80 ℃ under 85 ℃, utilize the nickel chloride of 4g/l, the ammoniacal liquor of 50 milliliters (ml) (25vol%)), the ammonium sulfate of 2g/l, the sodium hypophosphite of 10g/l, and the hydrazine of 60ml carries out the electroless plating system of 30 minutes nickel; And
G, under 30 ℃, the ethylene propylene monomer (EPM) of utilizing the toluene solution of 5vol% to carry out 2 minutes applies.
Between described step, utilize water to wash described foam.
Example 2
In the second example, conductive foam can form through the following steps:
A, under 25 ℃, utilize 2% aqueous tenside solution to clean described polyurethane foam;
B, under 25 ℃, utilize the hydrochloric acid of 5vol% to carry out 2 minutes surface treatment;
C, under 25 ℃, utilize the stannous chloride (SnCl of 20g/l
2) solution and 35vol%HCL solution, carry out 45 minutes sensitization;
D, under 25 ℃, utilize 20g/l silver nitrate (AgNO
3) ammoniacal liquor of solution and 25vol%, carry out 45 minutes activation;
E, under 30 ℃, utilize the copper sulfide of 18g/l, the formaldehyde of 50ml (37 to 41w/v%), the sodium potassium tartrate tetrahydrate of 45g/l and the NaOH of 13g/l (NaOH) (pH～12 are to 13) carry out the electroless plating system of 30 minutes copper;
F, 80 ℃ under 85 ℃, utilize the nickel chloride of 4g/l, the ammoniacal liquor of 50 milliliters (ml) (25vol%)), the ammonium sulfate of 2g/l, the sodium hypophosphite of 10g/l, and the hydrazine of 60ml carries out the electroless plating system of 30 minutes nickel; And
G, under 30 ℃, the ethylene propylene monomer (EPM) of utilizing the toluene solution of 5vol% to carry out 2 minutes applies.
Between described step, utilize water to wash described foam.
Term only is used for describing the purpose of particular example execution mode as used herein, and is not to be intended to limit.When this uses, unless context is clearly indicated, otherwise " one " of singulative and " described " also can comprise plural form.Term " comprises ", " comprising " and " having " be the meaning that comprises, and indicate thus the existence of described feature, integer, step, operation, element and/or assembly, and be not to get rid of the existence of further feature, integer, step, operation, element, parts and/or its set or additional.Unless the order that special instructions are carried out, method step described here, processing and operation can not be interpreted as must according to discuss or illustrative particular order is carried out.Should also be appreciated that and to adopt step additional or alternative.
When element or layer be called as " on other element or layer ", " with other element or layer engagement ", " being connected to other element or layer " or with other element or layer coupling " time; can make directly on described other element or layer; with described other element or layer engagement, is connected or is coupled, perhaps can exist between them element or layer.Relative is, when element be called as " directly on another element or layer ", " directly with another element or layer engagement ", " being connected directly to another element or layer ", " when directly being coupled with another element or layer, do not exist between them element or layer.Other word of be used for describing the relation between the element also should explain according to same way as (for example " and between " contrast " between direct ", " adjacent " contrast " direct neighbor " etc.).When this uses, term " and/or " comprise any and whole combinations that the associated listed items purpose is one or more.
Describe various elements, assembly, zone, layer and/or part although the term first, second, third, etc. can be used herein to, these elements, assembly, zone, layer and/or part are not subject to the restriction of these terms.These terms only are used for an element, assembly, zone, layer and/or part and other element, assembly, zone, layer and/or part are distinguished.When this uses, unless context is clearly indicated, otherwise be not hint ordering or order such as the term of " first ", " second " and other ordinal number term.Therefore, in the situation of the religious doctrine that does not depart from example embodiment, the first element discussed below, assembly, zone, layer and/or part also can be called the second element, assembly, zone, layer and/or part.
The space relative terms, such as " inside ", " outside ", " under ", " following ", " bottom ", " on ", " top " etc. can use at this, with the convenient relation of describing element shown in the accompanying drawing or feature and another element or feature.The space relative terms also comprises the different directions of equipment in using or operating except the direction that comprises the accompanying drawing indicating.For example, if the equipment in the accompanying drawing is reversed, then be described as element " below " or " under " of other element or feature then be oriented in thereupon described other element or feature " on ".Therefore, exemplary term " following " can comprise above and below orientation.Described equipment also can be in addition directed (90-degree rotation or other orientation) and as used herein the relative designator in space carry out respective explanations.
Disclosed herein for set parameter particular value and the particular range of value and be not precluded within one or more in this exemplary other useful value and the scopes of value of disclosing.And, suppose to be used for any two particular value definables of design parameter set forth herein applicable to the end points of the scope of the value of described set parameter.Be used for disclosing may be interpreted as and disclosing of the first value of set parameter and the second value: also can adopt any value between described the first value and the second value to come for described set parameter.Similarly be that open (this scope be interweave, overlapping or distinguish) of supposing to be used for two of value of parameter or more scopes comprised all possible combination of the scope of the claimable described value of end points that is used for utilizing disclosed scope.
The above description of execution mode is provided for illustration and description purpose.It is not to be intended to limit or to limit described open.Each element or the feature of particular implementation are not limited to described particular implementation usually, but interchangeable and can be used in selected execution mode when using, even do not specifically illustrate or describe.This modification should not be considered as having departed from the disclosure, and all this modifications are also included within the scope of the present disclosure.
Claims (23)
1. method for the manufacture of the electromagnetic interference (EMI) screening arrangement said method comprising the steps of:
Utilize at least a portion of metal material coating core member; And
Utilize at least a portion of the described metal material of polymer-coated, suppress thus described metal material and separate with described core component.
2. method according to claim 1, wherein, the step of utilizing metal material to apply at least a portion of described core component comprises at least a portion of utilizing the described core component of described metal material electroless plating system.
3. method according to claim 1 and 2, wherein, the step of utilizing metal material to apply at least a portion of described core component comprises utilizes described metal material to apply the whole of described core component.
4. according to each the described method in the aforementioned claim, wherein:
The step of utilizing metal material to apply at least a portion of described core component comprises utilizes described metal material that at least a portion of described core component is applied about 0.1 micron or thicker thickness; And/or
The step of utilizing metal material to apply at least a portion of described core component comprises utilizes described metal material to apply at least a portion of described core component with predetermined thickness, so that described EMI screening arrangement shows conductivity and the EMI effect of expectation; And/or
Utilize the step of at least a portion of the described metal material of described polymer-coated to comprise and utilize the whole of the described metal material of polymer-coated.
5. according to each the described method in the aforementioned claim, wherein, described core component comprises foam.
6. method according to claim 5, wherein, described foam comprises at least a in polyurethane foam, polyester form, polyether foam, polyvinyl chloride foam, ethylene vinyl acetate foam, polypropylene foam, polyvinyl chloride foam, polystyrene foam, polymethacrylimide foam, polyethylene, EPDM foam, neoprene foams and/or the rubbery foam.
7. according to each the described method in the aforementioned claim, wherein:
Described core component comprises at least a in polyurethane, polyester, polyethers, polyvinyl chloride, ethylene vinyl acetate, polypropylene, polyvinyl chloride, polystyrene, Polymethacrylimide, polyethylene, EPDM, neoprene and/or the rubber; And/or
Described core component has about 0.3 millimeter or thicker thickness; And/or
Described metal material comprises at least a in copper, gold, aluminium, silver, tin and the nickel; And/or
Described polymer comprises at least a in ethylene propylene monomer (EPM), ethylene propylene diene rubber (EPDM), urethanes, vinyl, acrylonitrile-butadiene rubber, acrylic acid and the siloxanes.
8. according to each the described method in the aforementioned claim, wherein, described EMI screening arrangement:
Have about 1 ohm-sq or lower surface resistivity; And/or
Has about 1 ohm-cm or lower Z axis resistivity; And/or
Have about 50 decibels or higher shield effectiveness; And/or
Be configured to turn round to about 85 degrees centigrade operating temperature at height; And/or
Have about 20% or lower compressive deformation.
9. according to each the described method in the aforementioned claim, wherein, described metal material comprises copper and mickel, and wherein, is utilizing before copper and mickel applies at least a portion of described core component, and described method further may further comprise the steps:
Utilize surfactant to clean described core component;
Utilize the dilute acid etching through the core component of cleaning; And
Process to activate through overetched core component by utilizing stannous chloride, palladium bichloride/palladium and silver nitrate or above-mentioned combination.
10. according to each the described method in the aforementioned claim, wherein, utilize at least a portion of the described core component of polymer-coated.
11. according to each the described method in the aforementioned claim, described method further is included at least a portion that a plurality of described coating steps wrap up described core component with the conductive fabric material afterwards, and the fabric foam spacer is provided thus.
12. EMI screening arrangement of making according to each the described method in the aforementioned claim.
13. an electromagnetic interference (EMI) screening arrangement, described electromagnetic interference shielding device comprises:
Core component;
Cover the metal coating of at least a portion of described core component; And
Cover the polymer coating that at least a portion of described metal coating is separated with described core component to suppress described metal coating.
14. EMI screening arrangement according to claim 13, wherein:
Described metal coating covers the whole of described core component; And/or
Described metal coating has about 0.1 micron or thicker thickness; And/or
Described metal coating has the predetermined thickness corresponding with the conductivity of the expectation of described EMI screening arrangement; And/or
Described polymer coating covers the whole of described metal coating; And/or
At least a portion of described core component is coated with polymer.
15. according to claim 13 or 14 described EMI screening arrangements, wherein, described core component comprises foam.
16. EMI screening arrangement according to claim 15, wherein, described core component comprises at least a in polyurethane foam, polyester form, polyether foam, polyvinyl chloride foam, ethylene vinyl acetate foam, polypropylene foam, polyvinyl chloride foam, polystyrene foam, polymethacrylimide foam, polyethylene, EPDM foam, neoprene foams and/or the rubbery foam.
17. according to claim 13,14,15 or 16 described EMI screening arrangements, wherein, described core component comprises at least a in polyurethane, polyester, polyethers, polyvinyl chloride, ethylene vinyl acetate, polypropylene, polyvinyl chloride, polystyrene, Polymethacrylimide, polyethylene, EPDM, neoprene and/or the rubber.
18. according to claim 13,14,15,16 or 17 described EMI screening arrangements, wherein:
Described metal coating is by at least a formation the in copper, gold, aluminium, silver, tin and the nickel; And/or
Described polymer coating is by at least a formation the in ethylene propylene monomer (EPM), ethylene propylene diene rubber (EPDM), urethanes, vinyl, acrylonitrile-butadiene rubber, acrylic acid and/or the siloxanes; And/or
Described metal coating comprises at least one deck copper particle and/or at least one deck nickel particles.
19. according to claim 13,14,15,16,17 or 18 described EMI screening arrangements, wherein, described EMI screening arrangement:
Have about 1 ohm-sq or lower surface resistivity; And/or
Has about 1 ohm-cm or lower Z axis resistivity; And/or
Have about 50 decibels or higher shield effectiveness; And/or
Be configured to turn round to about 85 degrees centigrade operating temperature at height; And/or
Have about 20% or lower compressive deformation.
20. according to claim 13,14,15,16,17,18 or 19 described EMI screening arrangements, described EMI screening arrangement further comprises outer conductive textile layers.
21. an electromagnetic interference (EMI) screening arrangement, described electromagnetic interference shielding device comprises:
Be coated with the foam core member such as the such activator of silver or palladium;
Comprise copper and mickel and cover the metal coating of at least a portion of described foam core member; And
Polymer coating, described polymer coating comprises ethylene-propylene copolymer, and covers at least a portion of described metal coating, separates with described foam core member to suppress described metal coating;
Wherein, described metal coating has about 0.1 micron or thicker thickness;
Wherein, described EMI screening arrangement has about 1 ohm-sq or lower surface resistivity and/or about 1 ohm-cm or lower Z axis resistivity; And
Wherein, described EMI screening arrangement has about 20% or lower compressive deformation.
22. the method for the manufacture of conductive foam said method comprising the steps of:
Utilize the surfactant cleaning foam;
Utilize the dilute acid etching through the foam of cleaning; And
Process to activate through overetched foam by utilizing stannous chloride, palladium bichloride/palladium and silver nitrate or its combination;
Utilize the metal material coating through at least a portion of the foam of overactivation; And
Utilize at least a portion of the described metal material of polymer-coated, separate with described foam to suppress thus described metal material.
23. method according to claim 22, wherein:
Described foam comprises at least a in polyurethane foam, polyester form, polyether foam, polyvinyl chloride foam, ethylene vinyl acetate foam, polypropylene foam, polyvinyl chloride foam, polystyrene foam, polymethacrylimide foam, polyethylene, EPDM foam, neoprene foams and/or the rubbery foam; And
Described polymer comprises at least a in ethylene propylene monomer (EPM), ethylene propylene diene rubber (EPDM), urethanes, vinyl, acrylonitrile-butadiene rubber, acrylic acid and the siloxanes; And
Described metal material comprises at least a in copper, gold, aluminium, silver, tin and the nickel.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN2125CH2010 | 2010-07-26 | ||
| IN2125/CHE/2010 | 2010-07-26 | ||
| PCT/US2011/045243 WO2012018595A2 (en) | 2010-07-26 | 2011-07-25 | Process for the fabrication of highly electrically- conductive polymer foams with controlled compression set suitable for use in emi shielding applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103026807A true CN103026807A (en) | 2013-04-03 |
| CN103026807B CN103026807B (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180036649.3A Expired - Fee Related CN103026807B (en) | 2010-07-26 | 2011-07-25 | Be applicable to the shielding manufacture process with the high connductivity foam of polymers of controlled compressive deformation of EMI |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103026807B (en) |
| TW (1) | TW201213111A (en) |
| WO (1) | WO2012018595A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107326347A (en) * | 2017-07-04 | 2017-11-07 | 西北工业大学 | Hard PMI foam integrated waveguide surface chemical plating copper methods |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130251977A1 (en) * | 2012-03-20 | 2013-09-26 | Joinset Co., Ltd. | Conductive polymer foam elastic member |
| US9179537B2 (en) | 2012-12-13 | 2015-11-03 | Apple Inc. | Methods for forming metallized dielectric structures |
| US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| FR3051140B1 (en) * | 2016-05-11 | 2018-06-08 | Marie-Anne Cloarec Au Nom Et Pour Le Compte De La Societe Box Populi S.A.S. (Societe En Formation) | ELECTROMAGNETIC ANTI-WAVE MULTILAYER MATERIAL, AND CONTAINING ISOLATED WITH ELECTROMAGNETIC WAVES USING THE MATERIAL |
| US10905724B2 (en) | 2017-06-13 | 2021-02-02 | Houn Simon Hsia | Compositions and methods for enhancing hyperthermia therapy |
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| US20040055770A1 (en) * | 2001-03-19 | 2004-03-25 | Babb Samuel M. | EMI shield that adheres to and conforms with printed circuit board surfaces |
| US6818291B2 (en) * | 2002-08-17 | 2004-11-16 | 3M Innovative Properties Company | Durable transparent EMI shielding film |
| CN101747653A (en) * | 2008-12-10 | 2010-06-23 | 第一毛织株式会社 | EMI/RFI shielding resin polymer composite material and molding product produced |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NZ553043A (en) * | 2006-02-15 | 2008-08-29 | Laminex Group Pty Ltd | Electromagnetic interference shielding laminate and method of making same |
-
2011
- 2011-07-25 CN CN201180036649.3A patent/CN103026807B/en not_active Expired - Fee Related
- 2011-07-25 WO PCT/US2011/045243 patent/WO2012018595A2/en active Application Filing
- 2011-07-26 TW TW100126329A patent/TW201213111A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040055770A1 (en) * | 2001-03-19 | 2004-03-25 | Babb Samuel M. | EMI shield that adheres to and conforms with printed circuit board surfaces |
| US6818291B2 (en) * | 2002-08-17 | 2004-11-16 | 3M Innovative Properties Company | Durable transparent EMI shielding film |
| CN101747653A (en) * | 2008-12-10 | 2010-06-23 | 第一毛织株式会社 | EMI/RFI shielding resin polymer composite material and molding product produced |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107326347A (en) * | 2017-07-04 | 2017-11-07 | 西北工业大学 | Hard PMI foam integrated waveguide surface chemical plating copper methods |
| CN107326347B (en) * | 2017-07-04 | 2019-09-20 | 西北工业大学 | Hard PMI foam integrated waveguide surface chemical plating copper method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201213111A (en) | 2012-04-01 |
| WO2012018595A2 (en) | 2012-02-09 |
| CN103026807B (en) | 2016-01-20 |
| WO2012018595A3 (en) | 2012-05-18 |
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